Manufacturing method and device for casting pattern capable of being applied to precise circuit

Abstract

The invention relates to a manufacturing method and device of a casting pattern capable of being applied to a precise circuit. The device comprises a casting mold core and a heating device, the casting mold core is composed of a mold plate and a pressure body, a pattern cavity of a needed pattern is formed in the mold plate, a casting material is laid on the pattern cavity, and the pressure of the pressure body is transmitted to the casting material. The heating device is used for heating the template, so that the casting material on the template is partially or completely melted and fills the pattern cavity under the action of pressure, and the casting pattern on the template is obtained after cooling and solidification. The novel plane casting process provided by the invention is a near-net forming process capable of replacing etching, electroforming, powder metallurgy and other processes, and can be used for manufacturing casting patterns of metal, glass, ceramic and other materials, such as parts, templates and the like. The precise circuit board is manufactured by curing the insulating material on the circuit pattern obtained through casting, the manufacturing precision of the circuit board can be improved, pollution generated in the production process can be avoided, and the manufacturing cost can be greatly reduced.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of precision micro-machining, and particularly relates to a method for manufacturing a precision casting pattern by a casting process, and more particularly to a method for manufacturing a casting pattern applicable to a precision circuit and a device thereof. BACKGROUND

[0002] The history of human development and utilization of copper has been more than 12000 years, and the history of ancient people starting to use copper, arsenic, tin, lead and other materials to cast bronze wares has been more than 8000 years. The ancestors who mastered the bronze casting and smelting technology waved bronze weapons to implement the dimensional reduction attack on the stone tool tribes, and also cast exquisite bronze ritual wares and coins. Today, people mainly use the excellent electrical conductivity and thermal conductivity of copper in the field of power electronic circuits. Comparing the ancient copper coins with the circuits on the existing circuit board, it will be found that they are both made of copper materials, and the pattern of the copper coins cast by the ancients is not less accurate than the general copper circuit pattern!

[0003] The circuit of the existing circuit board is mainly realized by using copper foil obtained by electrolysis process and insulating substrate to form a copper-clad plate by pressing, and then processing the conductive pattern by processes such as plate making, etching, drilling, chemical plating and electroplating. From the manufacture of electrolytic copper foil to the pressing into a copper-clad plate, and then to the manufacture of a circuit board by a printed circuit board (PCB) production process, there are a large number of production processes and intermediate process materials that produce pollution and waste in the whole manufacturing process. According to statistics, 90% of the manufacturing cost of the existing circuit board is wasted in these processes!

[0004] Modern electronic technology mainly develops in the direction of high function and miniaturization, and puts forward more and more extreme demands on the manufacturing precision of circuits. However, it is difficult for the general circuit board production process mainly based on isotropic chemical etching to realize the precision below 4 mil (100 μm), and only a few use ultra-thin copper foil to realize the precision of 2 mil (50 μm). To realize higher precision, it is necessary to change the technical path of circuit board manufacturing. Therefore, various new circuit board technologies are being developed in the industry, such as high-density interconnection (HDI) boards made by semi-additive process (SAP) or modified semi-additive process (mSAP) and the like. However, they are also mainly based on the process of electroplating + etching. For example, the circuit made by processes such as physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemistry or sputtering in semiconductor processes to form a copper film on the substrate, and then etching, electroplating, chemical mechanical polishing (CMP) and the like, such as IC packaging substrate, through silicon via (TSV) interlayer and the like. These wet circuit processes mainly based on electroplating + etching all have problems such as pollution, high process difficulty and high cost.

[0005] The circuit can also be made by using conductive copper paste or conductive silver paste, which is printed on the substrate by printing or dispensing, etc. Although it also needs to be heated and baked, the purpose is to remove the solvent in the paste and solidify the resin in the paste, and the conductive path is achieved by the interlaced lapping of the metal particles in the paste. The conductive ability of the circuit formed by the conductive paste is weak, and it can only be applied to some small current electronic technology fields such as solar panels, small and medium power LED chips, etc., and the cost is also relatively high.

[0006] Another way to make a circuit is low-temperature co-fired ceramic (LTCC) and high-temperature co-fired ceramic (HTCC): by mixing metal powder with glass or ceramic powder to form conductive paste printed on green ceramic sheet, and then sent into the sintering furnace for sintering, the metal powder particles form a conductive path by sintering, the glass or ceramic plays a bonding role, and the ceramic sheet plays a supporting role. The metal particles in it have not been completely melted, but only through the contact points between the metal particles to form a sintering neck to realize the electrical connection. It can be seen from the fact that low-temperature co-fired ceramic is still in the stage of writing mobile phone filter and antenna-in-package (AiP) level fly head small characters that it is still a dream to write an article on the surface of the circuit board at present. But it also gives us inspiration: the circuit can be made of metal materials!

[0007] Looking at the current status of the casting process, it is not very feasible to cast a circuit pattern at this stage. The casting process generally melts the casting material into a casting liquid, pours it into a pre-made casting core, cools it down, and then processes it through subsequent processes to get the desired casting parts, which determines that it mainly makes larger and thicker mechanical parts. Although modern casting technology has developed to a very high level, it is still difficult to cast a large plane casting with a thickness of less than a millimeter. The circuit on the existing circuit board is obtained by processing the copper foil, and the thickness of the copper foil on the substrate is generally 17-70 μm, and a few of 10 μm or less thin copper type and 100 μm or more thick copper type. With the existing casting technology, it is very difficult to achieve such a copper thickness requirement for the circuit board, because the rough skin to be removed on the metal casting is much thicker than the thickness of the copper foil! SUMMARY

[0008] The purpose of the embodiment of the present application is to provide a casting pattern making method and device applicable to precision circuits, which can make casting patterns with large area, thin thickness and high precision by using the developed new plane casting process and equipment.

[0009] The technical scheme of the embodiment of the present application is as follows:

[0010] An apparatus for making a cast pattern applicable to a precision circuit, comprising a cast core and a heating device, the cast core is composed of a mold plate and a pressure body, the mold plate is formed with a pattern cavity corresponding to a desired pattern, a cast material is applied to the pattern cavity, the pressure body is placed on the cast material and exerts pressure on it, and the heating device heats the mold plate. The pressure body comprises an intermediate body and a pressure generator, the intermediate body is placed on the cast material, and the pressure generator is placed on the intermediate body, the pressure generated by the pressure generator is transmitted to the cast material through the intermediate body. The intermediate body comprises a pressure conducting layer and a thermal insulation layer, the pressure conducting layer is placed on the cast material, the thermal insulation layer is placed on the pressure conducting layer, and the pressure generator is placed on the thermal insulation layer, and the thermal insulation layer forms a thermal isolation between the pressure conducting layer and the pressure generator.

[0011] A method for making a cast pattern applicable to a precision circuit,

[0012] Step 1: forming a pattern cavity corresponding to a desired pattern on a mold plate;

[0013] Step 2: applying a cast material to the pattern cavity;

[0014] Step 3: placing a pressure body on the cast material and exerting pressure on it, and forming a cast core with the mold plate;

[0015] Step 4: heating the cast core on a heating device, after the cast material is partially or completely melted into a cast liquid, flowing and filling the pattern cavity under the pressure of the pressure body, cooling the cast core after the flow ends, removing the pressure body after the cast liquid solidifies, and obtaining a cast pattern on the mold plate.

[0016] Step 5: covering the cast pattern with a solidifiable material, solidifying the solidifiable material on the cast pattern through a solidification process, and obtaining a cast pattern inlay panel with the cast pattern wrapped by the solidified material.

[0017] Step 6: selecting a metal material with a lower melting point than the cast material as the solidifiable material, and obtaining a metal pattern cast pattern inlay panel with the cast pattern wrapped by the solidified metal material after solidification.

[0018] Step 7: selecting a solidifiable insulating material as the solidifiable material, and obtaining an insulating pattern cast pattern inlay panel with the cast pattern wrapped by the solidified insulating material after solidification, and when the cast pattern is a circuit pattern, obtaining a circuit board with an insulating substrate wrapping the circuit pattern.

[0019] Some beneficial effects of the embodiments of the present application are as follows:

[0020] 1. The device for realizing a cast pattern applicable to a precision circuit provided by the embodiments of the present application can melt most of the metal and non-metal materials by generating an ultra-high heating temperature through heating the template, and can also have the advantages of efficiency and cost by concentrating the heating working area in the template area. The novel planar casting process provided by the embodiments of the present application is a near-net-shape process for manufacturing planar or curved cast patterns, which can be widely applied to the manufacturing of precision patterns and parts of various metals, glass, ceramics and other materials.

[0021] 2. The manufacturing method of the cast pattern and the inlay plate provided by some embodiments of the present application can manufacture parts, models, cavities / shells, false teeth and implants, micro-fluidic chips, money, logos, signs, printing masters, mold templates, stamping templates and other products.

[0022] The effects of the precision circuit manufactured by some embodiments of the present application are described below taking copper as an example.

[0023] 3. The manufacturing of the precision circuit board by using the insulating cast pattern inlay plate provided by some embodiments of the present application can solve the problem of improving the precision of the circuit, and can also avoid the pollution problem generated in the traditional circuit board production process because it mainly relies on the production process based on physical methods. In addition, through the production process mainly based on the addition process, many intermediate links and materials in the traditional circuit board process are simplified and cancelled, which can greatly reduce the manufacturing cost of the circuit board.

[0024] 4. The content of impurities and defects in the copper circuit conductor obtained by the novel planar casting process of some embodiments of the present application is much less than that in the electrolytic copper foil mainly used in the existing circuit board, and the crystal structure of the copper conductor obtained by crystallizing and solidifying the molten copper under pressure is more perfect, which makes it superior to the electrolytic copper foil in terms of electrical conductivity, flexibility, shear resistance and other aspects. The copper circuit obtained by shaping the pattern cavity on the template according to the required pattern is a regular geometric pattern, which is beneficial to eliminate the stray loss and crosstalk generated by irregular circuit patterns in work, and is more beneficial to realize the precise distributed parameter design of the circuit. Different widths and thicknesses of circuit patterns can be obtained by different shapes and depths of the cavity formed by the pattern cavity on the template, and the cavity of the widened and thickened high-power area is used to form a wider and thicker copper circuit, and a larger cavity is directly formed to form a larger copper block as a heat sink, which can greatly improve the current carrying capacity and heat dissipation level of the circuit board.

[0025] 5、Some embodiments of the present application can not only make single-layer circuit boards, but also replace existing circuit board interconnection elements such as electroplated through holes (VIA), through silicon vias (TSV), and through glass vias (TGV) with copper bumps, copper pillars, and hollow copper pillars in the circuit patterns formed by the holes / pits in the cavities in the pattern cavities corresponding to the required circuit patterns, as interconnection elements between layers of circuit boards. After aligning and stacking multiple single-layer circuit boards, thermal compression bonding or other methods can be used to achieve electrical connection between circuits in different layers of circuit boards and solidified connection of insulating substrates, and a high-density interconnected multilayer circuit board can be made.

[0026] 6、Some embodiments of the present application can also use high-temperature-resistant insulating materials such as glass and ceramic to make circuit pattern substrates. The resulting combination of circuit patterns and substrates is a mosaic structure similar to the cloisonné process in traditional porcelain making, in which the circuit substrate wraps the circuit pattern from multiple sides. This structure of the circuit board allows the upper limit of its operating temperature to approach the glass transition temperature of the high-temperature-resistant substrate or the melting temperature of the metal conductor, so that the circuit board provided by some embodiments of the present application can be used in high-temperature and high-pressure environments, high-altitude and polar climates, underground drilling, and outer space.

[0027] 7、The existing mold template processing technology can be used to make high-precision pattern cavities on the template, and the filling ability of liquid copper into the pattern cavities on the template only needs to overcome its weak surface tension. Therefore, the main way to improve circuit precision is to improve the precision of the pattern cavities formed on the template. With the improvement of the precision of the pattern cavities formed on the template, some embodiments of the present application can quickly break through the existing limit of 100-50 μm for the precision of ordinary circuit boards, and will soon evolve to a precision of 50-10 μm, and is expected to impact a precision of 10-1 μm. A circuit precision of 10-1 μm will be able to meet the requirements of existing chip-level packaging technology, which provides a new technical path for chip-level packaging technology that can only rely on wafer-level processes. Some embodiments of the present application are expected to be gradually applied to technical fields such as high-density interconnection boards, micro-electro-mechanical systems (MEMS), power device packaging, IC packaging substrates, 2.5D / 3D packaging of chiplets, etc.

[0028] 8、The new planar casting process used in the embodiment of the present application picks up the casting skin that needs to be removed in the traditional casting process, and works on the casting process of the casting skin. Precise patterns can be obtained. In the field of precise micro-processing technology, it can make precise patterns and parts of metal, glass, ceramic and other materials, and the manufacturing precision can reach microns, which can provide help for micro-electro-mechanical systems, precision instruments and other industries. In the field of electronic technology, it can bring breakthroughs to the circuit board industry at the micron scale, and there is no physical law to limit it to the nanometer scale, and there is more gold in the nanometer scale: nano-imprinting + chip…

[0029] The embodiment of the present application has the advantages of simple principle, high manufacturing precision, easy implementation, and wide application range of products. It is not only suitable for the field of precise micro-processing technology, but also suitable for the field of precise electronic technology, and can be widely applied in the fields of consumer electronics, industrial equipment, robots, vehicle-mounted, aviation, aerospace, military industry and the like. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the provided drawings.

[0031] Figure 1 The structure diagram of the device for realizing the casting pattern applicable to the precise circuit of the present application.

[0032] Figure 1a The structure diagram of the device for not adding a semi-hardening layer on the template in the present application Figure 1

[0033] Figure 1b The three-dimensional structure diagram of the pattern cavity with a plurality of cavities formed on the template of the present application.

[0034] Figure 1c The schematic diagram of laying the casting material in a pattern laying mode in the present application.

[0035] Figure 1d The structure diagram of the casting core placed on the heating device in the present application.

[0036] Figure 1e The enlarged view of the state of the pressure transmission layer deforming to force the casting material to fill the pattern cavity in the present application.

[0037] Figure 1f The schematic diagram of the solidifiable material covering the casting pattern solidifying on the heating platform in the present application. ​

[0038] Figure 1g Enlarged view of the structure of the cast pattern tile of the present application.

[0039] Figure 2a Schematic view of the application showing the application of the casting material using the template application method.

[0040] Figure 2b Schematic view of the application showing the cast material solid sheet with the cast pattern of the present application.

[0041] Figure 2c Schematic view of the application showing the cast material solid sheet covered with the solidifiable material being cured on the platform.

[0042] Figure 2d Schematic view of the application showing the cast material solid sheet with the solidified solidifiable material on the cast pattern.

[0043] Figure 2e Schematic view of the application showing the insulating cast pattern tile of the present application.

[0044] Figure 3 Schematic view of the application showing the cast material being applied using liquid metal.

[0045] Figure 4 Schematic view of the application showing the cast material being applied using metal sheets.

[0046] Figure 5a Schematic view of the application showing the step of forming the pattern cavity on the template.

[0047] Figure 5b Schematic view of the application showing the step of making the release layer on the template and the pattern cavity.

[0048] Figure 5c Schematic view of the application showing the step of applying the casting material using the template application method.

[0049] Figure 5d Schematic view of the application showing the step of applying the intermediate on the casting material.

[0050] Figure 5e Schematic view of the application showing the step of applying the pressure generator on the intermediate.

[0051] Figure 5f Schematic view of the application showing the step of heating the cast pattern on the heating device.

[0052] Figure 5g Schematic view of the application showing the cast material solid sheet with the cast pattern on the cast material solid sheet.

[0053] Figure 5h Schematic view of the application showing the step of curing the cast material solid sheet covered with the solidifiable material.

[0054] Figure 5i Schematic diagram of the step of obtaining a transition plate after curing of the curable material of the present application.

[0055] Figure 5j Schematic diagram of the step of obtaining an insulating cast patterned panel of the present application.

[0056] Figure 6 Schematic diagram of the combination of the device and the sealed heating furnace of the present application.

[0057] Figure 7a Schematic diagram of the structure of the patterned cavity with cavities of different shapes and depths on the template of the present application.

[0058] Figure 7b Schematic diagram of the cast patterned panel with cast patterns of different shapes and thicknesses of the present application.

[0059] Figure 8a Schematic diagram of the two single-layer circuit boards to be stacked and laminated of the present application. Figure 7b Schematic diagram of the side view when used as a single-layer circuit board.

[0060] Figure 8b Schematic diagram of the two single-layer circuit boards to be stacked and laminated of the present application.

[0061] Figure 8c Schematic diagram of the double-layer circuit board of the present application.

[0062] Figure 8d Schematic diagram of the two double-layer circuit boards to be stacked and laminated and the intermediate connecting plate of the present application.

[0063] Figure 8e Schematic diagram of the four-layer circuit board of the present application.

[0064] Figure 9a Schematic diagram of the template of the patterned cavity of the gear pattern of the present application.

[0065] Figure 9b Schematic diagram of the gear patterned panel of the present application.

[0066] Figure 9c Schematic diagram of the finished gear part of the present application.

[0067] Reference signs:

[0068] Casting core 1; template 11; semi-hardened layer 111; pressure body 12; intermediate body 121; pressure conducting layer 1211; heat insulation layer 1212; pressure generator 122; desired pattern 13; pattern cavity 14; straight line groove 141; curved groove 142; circular pit 143; annular pit 144; polygonal pool body 145; casting material 15; casting material in pattern cavity 151; multi-laid casting material 152; release layer 16; pressure conducting layer deformation area 17; casting pattern 18; metal straight line segment 181; metal curved line segment 182; metal column 183; hollow metal column 184; polygonal metal block 185; weldable layer 186; insulating adhesive layer 187; solidified connecting layer 188; solidifiable material 19; solidified material 191; solidified material in deformation area 192; casting pattern inlay 193; heating device 2; platform with heating function 20; casting material solid sheet 21; transition plate 22; insulating casting pattern inlay 23; liquid metal 24; metal plate 25; single-layer circuit board 26; double-layer circuit board 27; intermediate connecting plate 28; four-layer circuit board 29; sealed heating furnace 3; furnace body 31; heater 32; temperature sensor 33; vacuum pipe 34; protective gas inlet 35; gear pattern inlay 40; gear part 41. DETAILED DESCRIPTION

[0069] Other advantages and benefits of the embodiments of the present application will become apparent to those skilled in the art upon reading the following detailed description in conjunction with the accompanying drawings. The present application can be carried out in other specific ways than those herein set forth without departing from the spirit and essential characteristics of the embodiments of the present application. Embodiments of the present application each have different structures from each other, but have substantially the same functions. The structure and the function of some components can be combined with other components.

[0070] Please refer to the drawings. It is to be understood that the drawings are only schematic and show only those components of the application that are necessary to appreciate the application, and therefore should not be considered as limiting the scope of the application. The accompanying drawings incorporated in and forming a part of the specification illustrate several aspects of the present application. It is to be understood that the drawings are solely for the purpose of illustration of the preferred embodiments of the present application, and are not intended for use in the determination of the scope of the present application, which is limited solely by the claims.

[0071] From the background art: the wet process of the circuit is to first change the copper material into copper ions / atoms, then form a copper foil / film through electroplating / deposition, and then obtain the circuit through etching process; the conductive paste is to realize the conduction of the circuit by the staggered lapping of copper / silver powder particles; the high / low temperature co-fired ceramic is to realize the electrical connection by forming a sintering neck between the metal powder particles through the sintering process. Among the above main methods of realizing the circuit from the copper material, there is still no way to directly realize the circuit from the copper material. Starting from the first principle, the circuit is a pattern made of metal, and the most direct method from metal to pattern is casting. We can learn from the ancient method: directly cast the circuit pattern from the copper material, and then solidify the insulating material thereon, so as to obtain the circuit board!

[0072] How to cast the metal and other materials into a cast pattern with a thickness of only a few tens of microns, and the area is also large like a drawing board (the size of the circuit board)? This must break through the key points of the casting process of melting the casting material and filling the pattern cavity in the mold, and directly break through the processes unrelated to our purpose in the traditional casting process, so as to develop a casting technology that can make large-area ultra-thin cast patterns. Such large-area ultra-thin cast patterns are not widely used in traditional mechanical fields, but they can be very useful in precision micro-machining technology, and they can make extremely precise circuit patterns in the field of electronic technology.

[0073] The embodiments of the present application provide a method for manufacturing a cast pattern applicable to a precision circuit and a device thereof, which is manufactured by a new type of planar casting process to have a large area, thin thickness and high precision. Further, a cast pattern inlay board wrapped with a solidified material is obtained by covering the obtained cast pattern with a solidifiable material and solidifying the solidifiable material by a solidification process. Further, the solidifiable material is selected as a metal material with a lower melting point than the cast material, and a metal type cast pattern inlay board is obtained after solidification. Further, the solidifiable material is selected as a solidifiable insulating material, and an insulating type cast pattern inlay board is obtained after solidification. When the cast pattern is a circuit pattern, a circuit board is obtained.

[0074] By using the new type of planar casting process, some embodiments of the present application provide a method for manufacturing a cast pattern and a device thereof, which can be widely applied to the manufacturing of patterns and parts of various precision metals, glasses, ceramics and other materials. Further, the cast pattern inlay board provided by some embodiments of the present application can be used to manufacture printing plates and other products. Further, the insulating type cast pattern inlay board provided by some embodiments of the present application can be used to manufacture precision circuit boards, which can solve the problem of improving circuit precision, avoid pollution, and greatly reduce costs.

[0075] The principle provided by the embodiment of the present application is to melt part or all of the casting material into casting liquid, and to force the casting material containing the casting liquid to flow and fill the pattern cavity by using pressure. The key points are: the thickness of the required casting pattern is controlled by adjusting the amount of the casting material applied; the pressure applied on the casting material is set, and the size of the pressure is determined according to the degree of overcoming the droplet aggregation effect of the casting liquid caused by the surface tension of the casting liquid, so as to achieve sufficient filling of the casting material containing the casting liquid to the pattern cavity.

[0076] The present application will be described in detail below with reference to the embodiments and the accompanying drawings.

[0077] Embodiment one

[0078] The present embodiment provides a device and a manufacturing method for realizing a casting pattern applicable to a precision circuit.

[0079] As shown in the figure, the device comprises a casting core 1, a heating device 2. Figure 1 The casting core 1 is composed of a mold plate 11 and a pressure body 12.

[0080] The mold plate 11 is composed of a hard plate material, and the material is selected from high-temperature-resistant materials such as, but not limited to, carbon plate, graphite plate, silicon plate, quartz plate, ceramic plate, glass plate, and high-temperature-resistant metal plate. The mold plate 11 can be composed of one or more layers of materials with the same or different materials, and the selection criteria of the mold plate 11 is that the melting point and the glass transition temperature of the material are both greater than the melting point of the casting material to be applied.

[0081] A semi-hardened layer 111 can be added on the mold plate 11 for bearing the pattern cavity 14. The material of the semi-hardened layer 111 includes, but is not limited to, carbonizable paper, carbonizable ink layer, carbonizable organic film layer, graphite material layer, casting sand layer, carbon slurry semi-hardened layer, glass or ceramic slurry semi-hardened layer, and green ceramic sheet. The semi-hardened layer can reduce the difficulty of manufacturing the pattern cavity on the mold plate. When heated, the substances in the semi-hardened layer that are easy to evaporate and decompose are volatilized, and the high-temperature-resistant substances remaining can continue to act as the support structure of the pattern cavity. When the material such as graphite plate is selected, the semi-hardened layer can not be used.

[0082]

[0083] ​The semi-hardened layer 111 is formed with a pattern cavity 14 corresponding to a desired pattern 13. The pattern cavity 14 can be formed by methods including but not limited to mechanical carving, laser carving, electric spark carving, photoetching, chemical etching, plasma etching, electron beam etching, printing of high-temperature-resistant ink, printing of high-temperature-resistant material, pasting of high-temperature-resistant pattern layer, and mechanical pressing of a template. The semi-hardened layer can also be directly printed with the casting material in powder or slurry form by printing methods including but not limited to flexographic printing, roll printing, printing plate printing, screen printing, stencil printing, spraying, and deposition, without forming a pattern cavity in advance. The pattern formed by the casting material printed on the semi-hardened layer constitutes the inverse structure of the pattern cavity. After the pressure body is assembled to form the casting core and heating is started, the pressure generated by the pressure body can press the pattern formed by the casting material into the semi-hardened layer. The space occupied by the casting material pressed into the semi-hardened layer corresponds to the formation of the pattern cavity. The casting material is applied in a manner corresponding to the pattern application method described below.

[0084] The casting material 15 is applied in a pattern application method, i.e., only the pattern cavity 14 is applied, and no casting material is applied to other positions on the semi-hardened layer. The volume of the casting material 15 applied is close to the volume of the pattern cavity 14. The casting material can be applied by methods including but not limited to stacking and filling the pattern cavity, grouting and filling the pattern cavity, and screen printing of the casting material to form a pattern.

[0085] The casting material 15 can be one or a combination of more than one of metal, semi-metal, alloy, non-metallic material that can be alloyed or reinforced with metal, glass, or ceramic powder, plate, or composition. The metal material can include but is not limited to copper, aluminum, nickel, tin, lead, bismuth, zinc, magnesium, titanium, gold, silver, and iron. The semi-metal material can include but is not limited to silicon and germanium. The alloy material can include but is not limited to metal alloy (such as copper-aluminum alloy), metal-semi-metal alloy (such as aluminum-silicon alloy), semi-metal alloy (such as silicon-germanium alloy), alloy of refractory and non-refractory metal (such as copper-tungsten alloy), and alloy of metal and non-metal (such as high-carbon steel). The non-metallic material that can be alloyed or reinforced with metal can include but is not limited to carbon, oxide, nitride, and carbide. The glass powder can include but is not limited to low-temperature glass powder. The ceramic powder can include but is not limited to low-temperature ceramic powder. The glass plate can include but is not limited to alkali-free glass plate and alkali-containing glass plate. The ceramic plate can include but is not limited to low-temperature ceramic plate. The glass or ceramic composition can include but is not limited to oxide, nitride, carbide, sulfide, boride, and halide.

[0086] The substance form of the casting material 15 can be one or a combination of slurry, powder, granule, block, plate, melt, such as but not limited to powder + melt, powder + plate.

[0087] The pressure body 12 is placed on the casting material 15 and forms the casting core 1 with the mold plate 11. The pressure body 12 is composed of an intermediate body 121 and a pressure generator 122, the intermediate body 121 contacts the casting material 15 at the bottom, and the pressure generator 122 is placed on the top of the intermediate body 121. The pressure generator 122 can set the pressure value generated and transmit the pressure to the casting material 15 through the intermediate body 121.

[0088] The intermediate body 121 includes a pressure conducting layer 1211 and a heat insulation layer 1212, the pressure conducting layer 1211 contacts the casting material 15 at the bottom, and the heat insulation layer 1212 is placed on the top of the pressure conducting layer 1211, the heat insulation layer 1212 contacts the pressure generator 122 at the top, and the heat insulation layer 1212 forms a thermal insulation between the pressure conducting layer 1211 and the pressure generator 122.

[0089] The pressure conducting layer 1211 can be composed of one or more than one layer of high-temperature-resistant material of the same or different materials, and the material selection range: hard plate such as but not limited to carbon plate, graphite plate, quartz plate, ceramic plate, glass plate, high-temperature-resistant metal plate; powder material such as but not limited to carbon powder, graphite powder, silicon powder, quartz powder, glass powder, ceramic powder, foundry sand; soft material such as but not limited to carbonizable paper, carbonizable organic film layer, graphite paper, carbon felt, graphite felt, quartz felt, ceramic felt, glass felt, green ceramic sheet, glass / ceramic semi-solid layer. The pressure conducting layer 1211 can select materials that do not react with and wet the casting liquid, such as graphite plate corresponding to copper material, or materials that can react with and wet the casting liquid but have been coated with a release layer, such as foundry sand coated with a release material, or materials that can react with and wet the casting liquid and form an integrated structure after solidification with the casting liquid, such as but not limited to green ceramic sheet, glass / ceramic powder, and glass / ceramic semi-solid layer. The surface of the pressure conducting layer 1211 contacting the casting material can be a flat surface, or a concave-convex surface with the mold plate forming a positive and negative mold shape of the casting pattern. In this embodiment, the pressure conducting layer 1211 selects a combination of powder material and hard plate, such as graphite powder + graphite plate.

[0090] The heat insulation layer 1212 is made of a material with a melting point higher than that of the casting material 15. The heat insulation layer 1212 can be made of one or more layers of the same or different materials. The materials can be selected from the following: powder materials, such as, but not limited to, carbon powder, graphite powder, silicon powder, quartz powder, glass powder, and ceramic powder; soft materials, such as, but not limited to, carbonizable paper, carbonizable organic film, graphite paper, carbon felt, graphite felt, quartz felt, ceramic felt, and glass felt; and heat insulation plates, such as, but not limited to, ceramic porous plate, high-temperature-resistant hollow plate, and high-temperature-resistant foamed plate. In this embodiment, the heat insulation layer is made of soft material, such as graphite felt.

[0091] The pressure generator 122 can be a counterweight, such as, but not limited to, a stone block, a graphite block, a ceramic block, a metal block, a screw rod adjusted pressure device, a hydraulic system, or a combination of pressure devices, such as, but not limited to, a combination of a counterweight and a screw rod adjusted pressure device. In this embodiment, the pressure generator is a counterweight made of multiple metal blocks with appropriate weights.

[0092] The heating device 2 heats the mold plate 11 in the casting core 1. The heating device 2 can be of any type, such as, but not limited to, a combustion type, a resistance type, an induction type, a microwave type, and an electrode type. The heating device 2 heats the mold plate 11, and the heat is conducted to the casting material 15 and melts it. At the same time, the heat is also conducted to the pressure conducting layer 1211, but only a small amount of heat is conducted to the pressure generator 122 through the heat insulation layer 1212. The main function of the heat insulation layer is to concentrate the heating area of the device to the mold plate area. Since the heat is mainly retained in the mold plate area, the heating efficiency is improved, and the heat resistance requirement of the pressure generator is reduced. In this embodiment, the heating device 2 is a resistance heating device.

[0093] The heating device 2 controls the heating temperature to achieve different heating effects on the casting material, which can be divided into full melting and partial melting heating methods, and the differences are as follows: the metal (including semi-metal) and alloy (including semi-metal alloy) select full melting heating method, and the heating temperature is higher than the melting point of the metal and alloy; the mixture of easy melting metal and difficult melting metal selects partial melting heating method, and the heating temperature is higher than the melting point of the easy melting metal but lower than the melting point of the difficult melting metal; the powder mixture of metal and non-metal adopts partial melting heating method, and the heating temperature is higher than the melting point of the metal but lower than the melting point of the non-metal; the composition of glass / ceramic selects full melting heating method, and the heating temperature is higher than the melting point of the composition as a eutectic compound in the melting state; the powder of glass adopts full melting heating method, and the heating temperature is higher than the melting point of the glass; the plate of glass can adopt full melting heating method, and the heating temperature is higher than the melting point of the glass; the plate of glass can also adopt partial melting heating method, and the heating temperature is lower than the melting point of the glass plate but higher than the glass transition temperature of the glass plate; the powder and plate of ceramic adopt partial melting heating method, and the heating temperature is higher than the melting point of the easy melting component in the ceramic material but lower than the melting point of the material for solid phase sintering in the ceramic material; when the casting material (non-ceramic material) to be laid is completed sintering and forming, partial melting heating method is selected, and the heating temperature is higher than the melting point of the material in the casting material which is converted into liquid phase but lower than the melting point of the material for solid phase sintering in the casting material.

[0094] According to the different heating methods, the setting method of the pressure value generated by the pressure generator 122: when the casting material to be laid needs to be fully or partially melted, the pressure should be greater than or close to the surface tension of the casting liquid formed by the material in the casting material which is converted into liquid phase; when the casting material to be laid is sintered and formed, such as the composition of the material converted into liquid phase in the casting material is less, the liquid phase material only flows in a small area, and most of the materials are sintered in solid phase, so the pressure can be less than the surface tension of the casting liquid formed by the liquid phase material. The value of the surface tension of the casting liquid can be inquired from the material manual, such as the surface tension of liquid copper is 1103 dynes / cm, and the surface tension of liquid aluminum is 857 dynes / cm, or the preferred pressure value is determined through multiple trial processes. In the embodiment, since full melting heating method is adopted, the pressure value generated by the pressure generator is set to be greater than the surface tension of the casting liquid.

[0095] The working process of the device for making casting pattern in the embodiment is shown in the following Figures 1a-1g

[0096] Figure 1a The device shown in the following Figure 1 ​The difference between the device in the first embodiment and the device in the second embodiment is that the template 11 in the second embodiment is not provided with a semi-hardened layer 111, and the pattern cavity 14 is directly formed on the template 11 by means including but not limited to mechanical carving and laser carving. Since there is no semi-hardened layer, a release layer 16 needs to be made on the upper surface of the template 11 and the inner surface of the pattern cavity 14. The material of the release layer 16 mainly includes but is not limited to graphite milk, diamond powder slurry and ceramic slurry. The selection of the release layer material can be consulted in the material manual according to the material of the casting material to be laid. When the template is made of a material that is difficult to react with and wet with the casting liquid formed by melting the casting material, such as graphite plate when copper or aluminum is selected as the casting material, the release layer can not be used. The release layer can be made by means including but not limited to spraying, brushing, dipping, deposition and plating.

[0097] As shown in Figure 1b , the template 11 is provided with the pattern cavity 14 with multiple cavities of the required pattern 13. The template 11 in this embodiment is made of graphite plate and no release layer is made.

[0098] As shown in Figure 1c , the casting material 15 is made of metal powder such as copper and aluminum. The laying method is pattern laying method, that is, the casting material 15 is laid only in the pattern cavity 14 and filled, and no casting material is laid on other parts of the template 11. The volume of the casting material 15 laid is close to the volume of the pattern cavity 14.

[0099] As shown in Figure 1d , the pressure body 12 is placed on the casting material 15 to form the casting core 1, and then the template 11 is placed on the heating device 2 to heat the template 11, and the heat is also transmitted to the casting material 15.

[0100] As shown in Figure 1e , during the heating process, as the powder-shaped casting material 15 gradually melts into casting liquid and shrinks in volume, the pressure-conducting layer 1211 made of soft or powder material is deformed locally under the action of pressure and is pressed into the pattern cavity 14. The pressure-conducting layer 1211 continues to force the molten casting liquid to fully fill the bottom of each cavity in the pattern cavity 14. After the flow of the casting liquid ends, the casting core 1 is cooled, the pressure body 12 is removed after the casting liquid solidifies, and the casting pattern 18 in the pattern cavity 14 on the template 11 is obtained.

[0101] As shown in Figure 1fAs shown, a curable material 19 is covered on the template 11 and the casting pattern 18, and then placed on a heating platform 20 for heating. The heating temperature of the platform 20 is higher than the melting point of the curable material 19 but lower than the melting point of the casting material 15. The curable material 19 melts on the template, then flows and covers the casting pattern 18. After cooling, the material solidifies on the casting pattern 18, forming a hard or soft plate with a certain strength and thickness. The physical form of the curable material 19 can be, but is not limited to, powder, granules, blocks, plates, liquids, or mixtures of powder and liquid. In this embodiment, the curable material is a powder material, and the curing process is a thermosetting method. In actual implementation, the curing method should be selected according to the characteristics of the curable material, including but not limited to thermosetting, light curing, chemical curing agent curing, and air drying curing.

[0102] like Figure 1g As shown, after the curing process, the curable material 19 is transformed into a cured material 191, forming a hard or soft plate with a certain strength and thickness. After separating it from the template 11, a cast pattern inlay plate 193 is obtained, in which the cured material 191 is inlaid with the cast pattern 18. Arrow 192 in the figure shows the cured material in the blank area above the cast pattern 18 in the pattern cavity 14, formed by the volume shrinkage of the molten casting material.

[0103] Furthermore, when the curable material is a metal material with a lower melting point than the casting material being laid, the lower melting point metal material melts first, flows and covers the obtained casting pattern, and then the melt of the lower melting point metal material is cooled and solidified to obtain a metal mold casting pattern inlay plate.

[0104] Furthermore, when a curable insulating material is selected as the curable material, the curable insulating material is first melted, cast, and then used to cover the resulting casting pattern before curing to obtain an insulating casting pattern inlay board. When the casting pattern is a circuit pattern, a circuit board can be obtained. The curable insulating material can be an organic material, including but not limited to phenolic (PF) resin, epoxy resin, bismaleimide (BMI) resin, polyimide (PI) resin, polytetrafluoroethylene (PTFE) resin, and β-triazine (BT) resin. It can also be an inorganic material, including but not limited to low-temperature glass and ceramic powders, or a mixture of organic and inorganic materials, including but not limited to mixtures of resin and glass fiber, and resin and quartz powder.

[0105] Preferably, the casting material is laid in a patterned manner, with the casting material only laid in the patterned cavity on the template, and the casting pattern is then made step by step. Since the multiple cavities of the patterned cavity can be disconnected from each other, the multiple molds in the corresponding casting pattern can also maintain an independent and separate state.

[0106] Preferably, in the device of the present embodiment with the added semi-hardened layer, the semi-hardened layer is selected from the group consisting of a semi-solidified layer of glass or ceramic material, a green ceramic sheet, and other materials that can be melted or sintered, the casting material is applied by a pattern application method including printing, and after the pressure body is pressed to form a casting core, the casting material is pressed into the semi-hardened layer by the pressure body and melted into a casting liquid. During the heating process, the volatile components in the semi-hardened layer material that can be melted or sintered volatilize, while the remaining material also melts or sinters and shrinks in the vertical direction. Because the viscosity of the remaining material is much greater than the surface tension of the casting liquid, it can squeeze the casting liquid to fill the pattern cavity under pressure. After the shrinkage is completed, the casting core is cooled, and after the casting liquid and the melted or sintered semi-hardened layer material solidify, the pressure body is removed. The casting pattern and the solidified semi-hardened layer material form a casting pattern inlay panel in which the casting pattern is inlaid in the solidified semi-hardened layer material. When the casting pattern is a circuit pattern, a circuit board can be directly obtained.

[0107] Preferably, in the device of the present embodiment without the added semi-hardened layer, the casting material is applied by a pattern application method, and then one or more than one pressure-conducting layer material that can be melted or sintered, such as a green ceramic sheet, a glass / ceramic semi-hardened layer, and a glass / ceramic powder, is pressed to form a multi-layer pressure-conducting layer, and then a thermal insulation layer and a pressure generator are added to form a casting core. Heating causes the casting material to melt into a casting liquid. During the heating process, the volatile components in the pressure-conducting layer material that can be melted or sintered volatilize, while the remaining components also melt or sinter and begin to shrink in the vertical direction. Because the viscosity of the remaining components is much greater than the surface tension of the casting liquid, it can squeeze and wrap the casting liquid to fill the pattern cavity under pressure. After the shrinkage is completed, the casting core is cooled, and after the metal liquid and the melted or sintered pressure-conducting layer material solidify, the other components of the pressure body are removed. The casting pattern and the solidified pressure-conducting layer material form a metal pattern inlay panel in which the casting pattern is inlaid in the solidified pressure-conducting layer material. When the casting pattern is a circuit pattern, the panel can be used as a circuit board.

[0108] Preferably, the mold plate is a glass / ceramic plate, and a pattern cavity of the desired pattern is formed on the mold plate. The casting material is selected from metal materials and applied by a pattern application method without a release layer. After the metal material on the mold plate melts into a metal liquid, the metal liquid fills the pattern cavity under the pressure of the pressure body. The metal pattern solidifies with the glass / ceramic plate, which can be directly used as a substrate for the metal pattern. A metal pattern inlay panel is obtained in which the metal pattern is inlaid in the glass / ceramic plate. When the metal pattern is a circuit pattern, a glass / ceramic substrate circuit board can be directly obtained.

[0109] The composition of the casting core provided by the embodiment is not unique, which includes: when the mold is coated with the casting material and covered with the pressure conducting layer, the structure is turned over, that is, the pressure conducting layer is below and the mold is above, the heat insulation layer is covered on the mold, and the pressure generator is added to form the reversed casting core, which can also achieve the effect of the embodiment. The reversed casting core is also applicable to the subsequent embodiments of the application.

[0110] The new planar casting process provided by the embodiment can not only realize planar casting patterns, but also realize curved surface or spherical surface casting patterns, such as high-temperature-resistant blades and high-temperature-resistant nozzles.

[0111] Embodiment two

[0112] The embodiment provides a manufacturing method of a casting pattern applicable to a precision circuit, which is different from the embodiment one in that the casting material is coated by using the mold.

[0113] The working process of the embodiment is as shown in Figures 2a-2e

[0114] As shown in Figure 2a , the mold 11 is formed with the pattern cavity 14 according to the method of the embodiment one, and the metal powder serving as the casting material 15 is coated on the pattern cavity 14 by using the mold coating method: the casting material 15 not only fills the pattern cavity 14, but also covers an area larger than the area occupied by the pattern cavity 14 on the mold 11, and the volume of the coated casting material 15 is larger than the volume of the pattern cavity 14. The coating method of the casting material 15 on the mold is to first pile up, then flatten, and then cover. The arrow 151 in the figure shows the casting material coated in the pattern cavity 14, and the arrow 152 shows the casting material coated on the mold 11. The pressure conducting layer 1211 in the intermediate layer 121 is made of hard plate material, and then the heat insulation layer 1212 and the pressure generator 122 are pressed, and the casting core 1 is formed and placed on the heating device 2, and the all-melting heating method is used to melt the casting material 15. After the casting material 15 is melted into casting liquid, it can not only fill the pattern cavity 14 under the action of pressure, but also form a thin layer of casting liquid on the pattern cavity 14. After the casting core is cooled and the casting liquid is solidified, the casting pattern 18 corresponding to the pattern cavity 14 on the mold 11 is formed, and the solid plate of the casting material in which the casting pattern 18 is embedded is obtained. The solid plate of the casting material and the mold 11 are separated, and the casting pattern 18 and the casting material solid thin plate 21 thereon are obtained, as shown in Figure 2b

[0115] As shown in Figure 2c ​​As shown, the side of the cast material solid sheet 21 with the cast pattern 18 is placed upward, and a sufficient amount of insulating type solidifiable material 19 is covered on the surface thereof, and then they are placed together on the platform 20 with heating function, the insulating type solidifiable material 19 is heated, melted, and then reflowed and covered on the cast pattern 18, and then cooled and solidified to form a hard or soft transition plate 22 with certain strength and thickness, as shown. Figure 2d As shown.

[0116] As shown, the cast material solid sheet 21 on the transition plate 22 is removed by means including but not limited to mechanical processing, chemical etching, etc., and then the insulating type cast pattern inlay plate 23 with the cast pattern 18 wrapped by the insulating type solidified material 191 is obtained. When the cast pattern 18 is a circuit pattern, the insulating type cast pattern inlay plate 23 can be used as a circuit board. Figure 2e Preferably, when the mold plate is a glass / ceramic plate, and the pattern cavity of the required pattern is formed on the glass / ceramic plate, the cast material is applied on the mold plate without coating a release layer, the cast material is melted into cast liquid, and then filled into the pattern cavity under pressure while forming a thin layer of cast liquid on the glass / ceramic plate, the cast liquid is solidified to be integrated with the glass / ceramic plate and form a cast material solid sheet on the mold plate, and then the cast material solid sheet is removed to obtain the insulating type cast pattern inlay plate with the cast pattern inlaid on the glass / ceramic plate. When the cast pattern here is a circuit pattern, the circuit board of the glass / ceramic substrate is obtained.

[0117] Example Three

[0118] The embodiment provides a method for manufacturing a cast pattern applicable to a precision circuit, which is different from the embodiments one and two in that the cast material applied on the mold plate is liquid metal, which is suitable for manufacturing cast patterns of fusible metal. The liquid metal includes: melted fusible metal such as but not limited to gallium, bismuth, tin, lead, aluminum, copper; melted fusible alloy such as but not limited to tin-lead alloy, aluminum-silicon alloy; slurry made of melted metal wrapping high-melting-point metal powder such as but not limited to liquid aluminum wrapping titanium, nickel, etc. powder for manufacturing intermediate alloy parts; slurry made of melted metal wrapping non-metal powder such as but not limited to liquid aluminum wrapping aluminum oxide powder for manufacturing strengthened alloy parts.

[0119] As shown, the cast material solid sheet 21 on the transition plate 22 is removed by means including but not limited to mechanical processing, chemical etching, etc., and then the insulating type cast pattern inlay plate 23 with the cast pattern 18 wrapped by the insulating type solidified material 191 is obtained. When the cast pattern 18 is a circuit pattern, the insulating type cast pattern inlay plate 23 can be used as a circuit board.

[0120] Figure 3 ​As shown, the casting material 15 to be laid is melted into liquid metal 24, then the mold plate 11 with the pattern cavity 14 corresponding to the desired pattern 13 is placed on the heating device 2 for heating, and then the liquid metal 24 is dripped onto the pattern cavity 14, the volume of the liquid metal 24 being greater than that of the pattern cavity 14, i.e. the mold plate laying method is adopted. Alternatively, the metal material can be directly heated and melted into liquid metal 24 on the mold plate 11, and the equipment for melting the liquid metal material outside the device can be omitted.

[0121] After the liquid metal 24 is laid on the mold plate 11, the components of the pressure body 12 are stacked and placed on the liquid metal 24, and the process is as follows: first, the pressure conducting layer 1211 made of hard plate material is pressed on the liquid metal 24, then the heat insulation layer 1212 is pressed, and then the pressure generator 122 with appropriate pressure is pressed, thereby forming the casting core 1. Under the condition of continuous heating, the liquid metal 24 flows into the pattern cavity 14 under the action of pressure and fills it, and the excess liquid metal forms a thin layer of liquid metal on the top of the pattern cavity 14. After the liquid metal 24 stops flowing, the casting core 1 is cooled to solidify the liquid metal 24, and then the integrated metal solid plate formed by the solidified liquid metal is separated from the mold plate 11, thereby obtaining the casting material solid thin plate 21 with the metal pattern (i.e. the casting pattern 18) formed by the pattern cavity 14 embedded in it.

[0122] Preferably, if an insulating type casting pattern embedded plate is needed, the method of Example 2 can be used to solidify the insulating material on the obtained casting material solid thin plate with the casting pattern, and then the insulating type casting pattern embedded plate is obtained in steps. When the casting pattern in the obtained insulating type casting pattern embedded plate is a circuit pattern, the plate can be used as a circuit board.

[0123] Example Four

[0124] This embodiment provides a method for manufacturing a casting pattern applicable to a precision circuit, which is different from Examples One to Three in that the casting material laid on the mold plate is a metal plate, which is suitable for manufacturing a high-precision casting pattern, and the material of the metal plate can be metal, semi-metal or alloy.

[0125] As Figure 4As shown, a metal plate 25 to be used as the casting material is placed on the mold plate 11 having the pattern cavity 14 corresponding to the desired pattern 13 formed therein, and the volume of the metal plate 25 is greater than that of the pattern cavity 14, i.e. the mold plate is used as the mold. Then, the pressure body 12 is pressed on the metal plate 25, i.e. the pressure conducting layer 1211, the heat insulation layer 1212 of the intermediate body 121 and the pressure generator 122 having a proper pressure are pressed on the metal plate 25, and the casting core 1 is formed. The casting core 1 is heated in the heating device 2 until the metal plate 25 is melted into a metal liquid and flows into the pattern cavity 14 under the pressure. The excess metal liquid forms a thin layer of metal liquid above the pattern cavity 14. After the metal liquid stops flowing, the casting core 1 is cooled until the metal liquid solidifies. The pressure body 12 is removed, and the solidified metal plate 25 is separated from the mold plate 11 to obtain the casting material solid thin plate 21 having the metal pattern (i.e. the casting pattern 18) formed by the pattern cavity 14 embedded therein.

[0126] Preferably, if the insulating casting pattern embedded plate is desired, the method of the second embodiment is used to obtain the insulating casting pattern embedded plate after the solidified insulating material is removed. If the casting pattern is a circuit pattern, a circuit board is obtained.

[0127] The third embodiment can also be used to obtain the casting pattern embedded plate by first laying a metal powder on the pattern cavity, and then pressing a metal plate, a metal block or a metal particle to be used as the casting material on the metal powder.

[0128] Embodiment Five

[0129] The fifth embodiment provides a method for manufacturing a casting pattern which can be applied to a precision circuit, and each step of the method is described in detail.

[0130] The method of the fifth embodiment is to form a pattern cavity corresponding to the desired pattern on a mold plate, lay a proper amount of casting material on the pattern cavity, set a pressure to be applied to the casting material, heat the casting material to partially or completely melt the casting material into a casting liquid, and then cool the casting material containing the casting liquid to obtain the desired casting pattern. The key principle of the fifth embodiment is to control the thickness of the desired casting pattern by adjusting the amount of the casting material laid, and to set a proper pressure to be applied to the casting material, the value of which is determined according to the degree of the liquid drop aggregation caused by the surface tension of the casting liquid, so as to achieve the sufficient filling of the casting material containing the casting liquid to the pattern cavity.

[0131] The specific manufacturing process of the fifth embodiment is shown in the following figure: Figures 5a-5j ​

[0132] like Figure 5a As shown, common processing methods such as mechanical engraving and laser engraving are used on the template 11 to form the corresponding pattern cavity 14 according to the required pattern 13. The template 11 is made of a hard plate with high temperature resistance, whose melting point and glass transition temperature are higher than the melting point of the casting material 15 to be laid. Its material needs to be determined according to the casting material 15 to be laid. For example, graphite plate can be selected for copper material, and cast iron plate or stainless steel plate can be selected for aluminum material. Specific material selection can be found in common material handbooks.

[0133] like Figure 5b As shown, a release material is applied to the upper surface of the template 11 and the inner surface of the pattern cavity 14 to form a release layer 16. When a graphite plate is used as the template, a release layer is not required for casting materials such as copper and aluminum.

[0134] like Figure 5c As shown, casting material 15 is laid onto template 11, which has formed patterned cavity 14. The casting material 15 is laid using a template method, that is, the volume of the cast material 15 laid is greater than the sum of the volumes of each cavity in the patterned cavity 14, and the covered area is greater than the area occupied by the patterned cavity 14 on template 11.

[0135] like Figure 5d As shown, a pressure-conducting layer 1211 and a heat-insulating layer 1212 constituting an intermediate 121 are added to the already laid casting material 15. The pressure-conducting layer 1211 can be made of a material with a melting point exceeding that of the casting material 15, such as graphite plates in rigid sheets, graphite powder in powder materials, or graphite felt in flexible materials. The heat-insulating layer 1212 is made of a material with a melting point exceeding that of the casting material 15, such as graphite powder in powder materials or graphite felt in flexible materials. When the pressure-conducting layer 1211 is made of rigid sheet material, the heat-insulating layer 1212 can also be made of a high-temperature resistant heat-insulating board, such as a porous ceramic board.

[0136] like Figure 5e As shown, a pressure generator 122 is placed on the intermediate body 121. The pressure generated by the pressure generator 122 is transmitted through the intermediate body 121 to the cast material 15, forming the casting core 1. The pressure generator 122 can be composed of a counterweight such as a ceramic block or a metal block, or it can be a screw pressure regulating device. The pressure value generated by the pressure generator 122 is determined by the degree to which the droplet aggregation caused by the surface tension of the casting liquid needs to be overcome. The appropriate pressure value can be determined through multiple manufacturing processes.

[0137] like Figure 5fAs shown, the assembled casting core 1 is placed on the heating device 2 for heating. The casting core 1 is heated to partially or completely melt the casting material 15 inside it into casting liquid, and under the pressure generated by the pressure generator 122, the casting liquid flows into the cavity 14 and fills it. After that, the remaining part of the partially or completely melted casting material can form a thin layer of casting material containing casting liquid on the top of the cavity 14. After the flow of the casting liquid containing casting material ends, the casting core 1 is cooled to completely solidify the casting liquid under pressure.

[0138] As shown, the template 11 is separated from the integrated casting material solid plate formed after the casting liquid containing casting material solidifies, to obtain the casting material solid thin plate 21 and the casting pattern 18 formed by the cavity 14 embedded on it. Then, the casting material solid plate is subjected to a shaping process, including but not limited to cleaning, polishing, chemical treatment, etc., to remove the defects on it, such as the excess material caused by the material falling off of the release layer and the pressure transmission layer during the casting process, and the oxide film on the surface of the casting pattern, for the next step. Figure 5g As shown, the casting material solid thin plate 21 with the casting pattern 18 on its surface is covered with a solidifiable material 19, and then placed on the platform 20 with heating function for heating and solidification. The melting temperature of the solidifiable material should be lower than the melting point of the casting material. The material and solidification process of the solidifiable material can be found in the general material manual according to the needs. When the solidifiable material is a metal material with a lower melting point than the casting material, a transition plate can be obtained, which is wrapped with the casting material solid thin plate and the casting pattern on it by the solidified metal material. When the solidifiable material is a solidifiable insulating material, a transition plate can be obtained, which is wrapped with the casting material solid thin plate and the casting pattern on it by the solidified insulating material. In this embodiment, the solidifiable material is an insulating type of thermosetting resin powder.

[0139] Figure 5h As shown, the insulating type of solidifiable material 19 is solidified by the solidification process to obtain a transition plate 22 wrapped with the casting material solid thin plate 21 with the casting pattern 18 by the solidified material 191.

[0140] As shown, the transition plate 22 is subjected to a shaping process, including but not limited to mechanical processing, laser processing, chemical treatment, etc., to remove the casting material solid thin plate 21 on it, and only leave the insulating substrate and the casting pattern 18, to obtain an insulating type of casting pattern embedded plate 23, in which the casting pattern 18 is wrapped by the insulating type of solidified material 191. When the casting pattern 18 is an electrical circuit pattern, the plate can be used as a circuit board. Figure 5i As shown, the transition plate 22 is subjected to a shaping process, including but not limited to mechanical processing, laser processing, chemical treatment, etc., to remove the casting material solid thin plate 21 on it, and only leave the insulating substrate and the casting pattern 18, to obtain an insulating type of casting pattern embedded plate 23, in which the casting pattern 18 is wrapped by the insulating type of solidified material 191. When the casting pattern 18 is an electrical circuit pattern, the plate can be used as a circuit board.

[0141] Figure 5j As shown, the transition plate 22 is subjected to a shaping process, including but not limited to mechanical processing, laser processing, chemical treatment, etc., to remove the casting material solid thin plate 21 on it, and only leave the insulating substrate and the casting pattern 18, to obtain an insulating type of casting pattern embedded plate 23, in which the casting pattern 18 is wrapped by the insulating type of solidified material 191. When the casting pattern 18 is an electrical circuit pattern, the plate can be used as a circuit board. Figure 5i As shown, the transition plate 22 is subjected to a shaping process, including but not limited to mechanical processing, laser processing, chemical treatment, etc., to remove the casting material solid thin plate 21 on it, and only leave the insulating substrate and the casting pattern 18, to obtain an insulating type of casting pattern embedded plate 23, in which the casting pattern 18 is wrapped by the insulating type of solidified material 191. When the casting pattern 18 is an electrical circuit pattern, the plate can be used as a circuit board.

[0142] ​​Example 6

[0143] The present example provides a method for making a casting pattern suitable for a precision circuit, which is different from examples 1 to 5 in that the heating device is a sealed heating furnace, the heating process of the casting core is performed in the sealed heating furnace, and vacuumizing, temperature control, atmosphere protection and other operations are performed to protect the casting material applied from chemical reactions including oxidation reactions at high temperatures, so that the casting pattern obtained can maintain the original appearance of the material as much as possible, and the difficulty of later processing is reduced.

[0144] As shown in Figure 6 , the sealed heating furnace 3 is composed of a furnace body 31, a heater 32, a temperature sensor 33 of a temperature control system, a vacuumizing pipe 34 and a protective gas inlet 35. The casting core 1 is placed on the heater 32 in the furnace body 31 of the sealed heating furnace 3, and then the sealed heating furnace 3 is closed to perform the heating process. According to the melting point of the casting material applied on the template, the furnace temperature to be reached is determined by consulting a common material manual, the vacuum degree is determined according to the degree of oxidation reactions to be prevented for the material, and the composition of the protective gas is determined according to the activity of the material at high temperatures. If copper material is to be cast, the furnace temperature should be reached to heat the copper material on the template to above the melting point of copper, i.e. 1183°C, and the suitable furnace temperature can also be determined through multiple trial processes. In order to prevent oxidation of the copper material, the vacuum degree of 0.01 MPa or higher is achieved in the ideal case, and nitrogen gas, argon gas and other gases can be used for atmosphere protection during the entire process, and no protective gas is needed when a precision pattern is not required.

[0145] In the present example, a resistance heating furnace is used to perform the heating work, and in actual implementation, other heating furnaces including but not limited to combustion type, induction type, microwave type, electrode type and the like can also be used for heating.

[0146] Example 7

[0147] The present example provides a method for making a casting pattern suitable for a precision circuit, which is different from examples 1 to 6 in that the casting pattern can not only be made into a casting pattern with the same thickness of each part, but also into a casting pattern with different thicknesses of each part. By forming a pattern cavity with cavities of different depths and shapes on the template, and using a metal material to make a casting pattern, a casting pattern with different thicknesses and shapes of metal material can be obtained.

[0148] The making process of the present example is shown in Figures 7a-7b .

[0149] As shown in Figure 7a , the sealed heating furnace 3 is composed of a furnace body 31, a heater 32, a temperature sensor 33 of a temperature control system, a vacuumizing pipe 34 and a protective gas inlet 35. The casting core 1 is placed on the heater 32 in the furnace body 31 of the sealed heating furnace 3, and then the sealed heating furnace 3 is closed to perform the heating process. According to the melting point of the casting material applied on the template, the furnace temperature to be reached is determined by consulting a common material manual, the vacuum degree is determined according to the degree of oxidation reactions to be prevented for the material, and the composition of the protective gas is determined according to the activity of the material at high temperatures. If copper material is to be cast, the furnace temperature should be reached to heat the copper material on the template to above the melting point of copper, i.e. 1183°C, and the suitable furnace temperature can also be determined through multiple trial processes. In order to prevent oxidation of the copper material, the vacuum degree of 0.01 MPa or higher is achieved in the ideal case, and nitrogen gas, argon gas and other gases can be used for atmosphere protection during the entire process, and no protective gas is needed when a precision pattern is not required.As shown, the template 11 has cavities of different depths and shapes forming the patterned cavities 14, including straight grooves 141, curved grooves 142, circular pits 143, annular pits 144, and polygonal pools 145. In the above cavities, the grooves have a depth of hi, the pools have a depth of h2, and the pits have a depth of h3, and satisfy hi < h2 < h3. The volume of the metal material applied on the template is greater than the volume of the patterned cavities, i.e., the template is applied in a template application mode. The other steps are performed according to Example 5, and finally the insulating cast patterned inlay plate 23 as shown in Figure 7b can be used as a circuit board.

[0150] The Figure 7b is compared with Figure 7a : the substrate of the cast patterned inlay plate 23 formed by the cured material 191 of the insulating type (such as a circuit board with an insulating substrate wrapped by a similar cloisonné process inlay structure of a circuit pattern on multiple surfaces), the metal straight segments 181 (such as copper circuits) corresponding to the straight grooves 141, the metal curved segments 182 (such as copper circuits) corresponding to the curved grooves 142, the metal columns 183 (such as solid vias for circuit implementation of the upper and lower surfaces of the circuit board) corresponding to the circular pits 143, the hollow metal columns 184 (such as hollow vias for the pins of the surface-mounted components of the circuit board) corresponding to the annular pits 144, and the polygonal metal blocks 185 (such as copper heat sinks) corresponding to the polygonal pools 145. In Figure 7b , the thickness of the metal segments is H1, the thickness of the metal blocks is H2, and the thickness of the metal columns is H3, because Figure 7a , the depths of the cavities in the patterned cavities are hi < h2 < h3, and the cast patterned inlay plate 23 as shown in Figure 7b is obtained.

[0151] Preferably, the patterned cavities on the template include cavities of the same or different depths, and the cross-sectional shapes of the cavities include but are not limited to triangles, rectangles, trapezoids, semicircles, curved edges, and steps, and the cavities include at least one or a combination of more than one of the shapes of grooves, slots, circular pits, annular pits, tapered pits, stepped pits, triangular pools, flat or curved pool shapes. The cavities correspond to cast patterns of the same or different thicknesses, and the cast patterns include at least one or a combination of more than one of the shapes of straight segments, curved segments, convex points, columns, hollow columns, tapered columns, stepped columns, circular blocks, triangular blocks, straight or curved polygonal blocks.

[0152] Preferably, in the cavity of the patterned cavity, the groove, slot, etc. with a depth of 0.1-100 μm corresponds to the formation of the conductive line segment and pattern in the circuit pattern, the pit, annular pit, polygonal pool body, etc. with a depth of 100-1600 μm corresponds to the formation of the conductive column, hollow conductive column, conductive block, heat sink, etc. in the circuit pattern, the slot, polygonal pool body, etc. with a depth of 1600-3200 μm corresponds to the formation of the large current circuit or heat sink, etc. in the circuit pattern, and the slot body, etc. with a depth of 3200 μm or more corresponds to the formation of the conductive row, heat sink, support truss, etc.

[0153] Embodiment Eight

[0154] The present embodiment provides a method for manufacturing a cast pattern suitable for precision circuits, which is different from the embodiments one to seven in that the insulating cast pattern inlay board obtained through the previous embodiments can only realize a single-layer circuit board, and the present embodiment can realize a multi-layer circuit board.

[0155] The following takes the circuit board formed by the insulating cast pattern inlay board of copper material as an example, and uses the copper column, copper via, copper bump, etc. on the single-layer circuit board which can be used for electrical connection between the board layers of multiple circuit boards to illustrate the manufacturing process of the two-layer and more multi-layer circuit boards, as shown in Figures 8a-8e

[0156] As shown in Figure 8a As shown in Figure 7b The side view of the insulating cast pattern inlay board 23 as shown in the single-layer circuit board is shown in the figure, and its name is changed to single-layer circuit board 26 in the present embodiment for clear concept expression. The arrow 181 in the figure indicates the copper circuit on the surface layer of the single-layer circuit board 26, the arrow 183 indicates the through copper column penetrating through the substrate of the single-layer circuit board 26 and exposing the upper and lower metal surfaces, and the arrow 184 indicates the through hollow copper column.

[0157] As shown in Figure 8b As shown in

[0158] As shown in Figure 8c The two stacked single-layer circuit boards 26 in Figure 8b are connected by the solderable layer 186 and the insulating adhesive layer 187 between the board layers through hot-press bonding or other methods to form a new solidified connection layer 188, and then the two single-layer circuit boards 26 are combined into a double-layer circuit board 27.

[0159] As​Figure 8d As shown, the exposed metal surfaces of the copper pillars on the connecting surfaces of the two double-layer circuit boards 27 form the solderable layer 186, and the other parts of the connecting surfaces form the insulating adhesive layer 187. A middle connecting board 28 for connection is made in the same way as the single-layer circuit board 26, and the positions where the upper and lower double-layer circuit boards are to be electrically connected are provided with corresponding copper pillars and other elements, and the substrate is formed by the solidifiable insulating material. The upper and lower metal surfaces of the copper pillars and other elements for electrical connection on the middle connecting board 28 are formed with the solderable layer 186, and the remaining parts of the upper and lower surfaces are formed with the insulating adhesive layer 187.

[0160] As shown, Figure 8e The two double-layer circuit boards 27, on which the solderable layer 186 and the insulating adhesive layer 187 have been formed, are aligned and stacked together through the middle connecting board 28, and then solidified and connected by hot-press bonding or the like. The two double-layer circuit boards 27 and the middle connecting board 28 are connected together by the newly solidified connecting layer 188, forming a four-layer circuit board 29. The middle connecting board 28 here plays the role of connecting the two double-layer circuit boards.

[0161] Preferably, the double-layer and four-layer circuit boards provided by the method of the present embodiment can be used to make more layers of circuit boards by repeating and combining the above steps.

[0162] The method of making multi-layer circuit boards provided by the present embodiment not only can replace the traditional production processes of circuit boards such as deposition, sputtering, etching, drilling, chemical plating, and electroplating, but also can avoid pollution during production and greatly reduce the production cost of circuit boards. The method is suitable for making precision circuit boards, high-density interconnection boards, power device packaging substrates, IC packaging substrates, and other circuit board substrates.

[0163] Embodiment Nine

[0164] The present embodiment provides a method for making a casting pattern, which is different from embodiments one to eight in that the casting pattern can be used not only to make a conductive pattern of a circuit type, but also to make shapes of various mechanical parts, patterns of various templates, and other casting patterns.

[0165] The following will take the processing of a gear part as an example to illustrate the manufacturing process of a mechanical part, as shown in Figures 9a-9c

[0166] As shown, Figure 9a A pattern cavity 14 with a cavity of a gear pattern is formed on the template 11, and then the same manufacturing process of embodiment two is used to obtain a gear pattern inlay board 40 as shown in Figure 9b Figure 9c ​​The gear part 41 corresponding to the casting pattern shown can be made by selecting a proper solidifiable material and solidifying to form a panel, then removing the casting pattern defects by a shaping process (such as grinding, polishing, etc.), and then removing the solidified material to form the panel. The panel removal method is as follows: the solidifiable material is selected to be a metal material with a lower melting point than the casting material, and the solidified metal material is melted by heating to obtain the gear part; the solidifiable material is selected to be a material that is easily dissolved in some solution, such as casting wax, and then the solidified material is dissolved in a solvent such as gasoline to obtain the gear part; the solidifiable material is selected to be a material that is evaporated by thermal decomposition when heated to a certain temperature, such as cellulose, and then the solidified material is pyrolyzed at a temperature exceeding 300 degrees to obtain the gear part.

[0167] The method provided by the embodiment can replace the silicon-based micro-machining, LIGA (lithography-electroforming-injection), micro-electroforming, and other electroforming technologies to make precise patterns and parts, and can be applied to the fields of precision instruments and micro-electro-mechanical systems. The processing efficiency is higher, the cycle time of the processing flow from the material to the part forming is counted in minutes, and most types of metal and non-metal materials can be processed, and there is no limitation of material variety that electroforming technology can only use copper, nickel, iron, and a few alloys.

[0168] The casting pattern making method provided by the embodiment can also be extended to making various casting patterns, and is suitable for making patterns on other types of objects, such as but not limited to parts, models, cavities / shells, dentures and implants, medical implants, micro-fluidic chips, and tokens, as well as logos, signs, printing masters, mold templates, and embossing templates.

[0169] Embodiment Ten

[0170] The embodiment provides a casting pattern making method, which is different from the embodiments one to nine in that the casting material applied on the template is a mixture of a fusible metal and a refractory metal.

[0171] The refractory metal is relatively difficult to process and form because it is not easy to form an alloy with the fusible metal. Generally, a powder metallurgy process of powder forming + sintering is used to make alloy parts containing refractory metals. After sintering, the powder-formed parts cannot be completely dense, which affects their strength, and the dimensional change of the parts after sintering makes it difficult to improve their manufacturing precision. In the embodiment, the metal liquid of the fusible metal after melting is used to wrap the refractory metal particles, and then the desired part pattern cavity on the template is filled under pressure, and a near-net-shaped dense and accurate micro-alloy part is obtained after cooling, with a processing precision of microns.

[0172] The embodiment is described by using a mixture of copper powder and tungsten powder for processing and forming, and the manufacturing process is as follows:

[0173] The copper powder and tungsten powder of similar particle size are mixed in a mass ratio of 1:1. The specific particle size and mass ratio of the powder can be determined by multiple trial productions according to requirements. The mixed powder is laid on a template having a pattern cavity formed according to the required part pattern on the template in the casting core by a template laying method. The powder is heated to above 1500°C by appropriately adjusting the heating temperature, so that the copper powder is fully melted and the fluidity of the liquid copper is improved. Then, a pressure of more than 10 times the surface tension of the liquid copper is applied, so that the liquid copper wrapped with tungsten powder particles flows into the pattern cavity by viscous flow and is fully filled. After the liquid copper and the wrapped tungsten powder stop flowing, the casting core is cooled. After the liquid copper solidifies, a metal solid thin plate with the required casting pattern is obtained. Then, the casting pattern transition plate can be obtained by the steps of Example Nine. After the metal solid thin plate and the inlay material substrate are removed, the dense and near-net-shaped metal part of the WCu50 alloy corresponding to the casting pattern is obtained.

[0174] The present embodiment can also be applied to the production of casting patterns and parts of other refractory metals, such as alloys including but not limited to molybdenum, zirconium, and fusible metals including but not limited to aluminum, copper, and other alloys that are more difficult to form, such as titanium alloys. The present embodiment can also be applied to the production of casting patterns and parts of composite materials made of metal and non-metal materials, such as mixtures including but not limited to carbon, oxides, carbides, and nitrides, such as aluminum and aluminum oxide to produce reinforced aluminum alloy parts.

[0175] The casting pattern production method provided by the present embodiment is a near-net-shaping process, which can replace the powder metallurgy process and the powder injection molding (PIM) process using metal / resin powder slurry injection molding + sintering to produce micro-patterns and parts, and can greatly improve the precision and strength of the products.

[0176] The present embodiment can be widely applied to the near-net-shaping of patterns and parts of metals, semimetals, alloys, single-crystal alloys, amorphous alloys, high-entropy alloys, and other materials.

[0177] Example Eleven

[0178] The present embodiment provides a casting pattern production method, which is different from Examples One to Ten in that the casting material laid on the template is a glass / ceramic powder, plate, or composition.

[0179] Advanced electronic functional glass and ceramic materials play an increasingly important role in the technical field of advanced packaging, micro-electro-mechanical system, etc., but its manufacturing method still mainly relies on wafer level process. The method for manufacturing glass and ceramic material casting pattern and part by using new type of planar casting process provided in the embodiment can provide a new technical path for the manufacturing process of advanced electronic functional glass and ceramic materials.

[0180] The embodiment takes the example of manufacturing silicate glass casting pattern or part by using silicate glass composition powder, and the manufacturing process is as follows:

[0181] The powder of silicate (such as silicon oxide SiO2), alkali metal oxide (such as sodium oxide such as Na2O, potassium oxide such as K2O), alkaline earth metal oxide (such as calcium oxide CaO, magnesium oxide MgO), other metal oxide (such as aluminum oxide Al2O3) is combined according to the raw material ratio of the required glass, and then mixed thoroughly. Then the obtained glass composition powder is laid on the pattern cavity of the required pattern on the mold plate in the mold laying mode. Then the pressure transmission layer and the heat insulation layer of the intermediate body are pressed on the glass composition powder in turn, and then the pressure generator is pressed on the intermediate body to form a casting core, and then placed on the heating device for heating. The glass composition powder melts and dissolves at high temperature to form a glass eutectic body, and generates viscous flow under the action of pressure to fill the pattern cavity. After the pattern cavity is filled, a thin layer of glass eutectic body is formed on it. After the glass eutectic body flow ends, the casting core is cooled, and the glass eutectic body is converted into glass after solidification, to obtain a glass solid plate material integrated with the glass pattern (i.e. casting pattern) and the glass solid thin layer on the pattern cavity corresponding to the glass pattern. After the plate material is separated from the mold plate, the obtained glass solid plate material with glass pattern can be used as a glass pattern plate. The obtained glass pattern plate is first made into a transition plate with an inlaid plate material by using the method of embodiment nine, and then the glass solid thin layer and the inlaid material substrate thereon are removed, to obtain the required glass part.

[0182] Preferably, the obtained glass pattern plate can also be used as the mold plate described in embodiments one and two. When the newly formed pattern cavity corresponding to the glass pattern on the glass pattern plate is a circuit pattern, metal material is laid on the pattern cavity, and then the circuit board of the glass substrate can be directly manufactured by using the steps in embodiments one and two.

[0183] The embodiment can also be applied to the casting of other types of glass / ceramic materials, such as those made of oxides, nitrides, carbides, sulfides, borides, halides, etc. The embodiment can also be applied to the direct preparation of casting patterns and parts using glass / ceramic powders. The embodiment can also use existing glass / ceramic plates as the casting material to be laid, and by controlling the heating temperature to make the glass / ceramic plates in a partially molten state and under the action of pressure to fill the pattern cavity, and then cooled and solidified and subsequent processing, to obtain the casting patterns and parts of glass / ceramic materials.

[0184] The method for preparing the casting patterns and parts of glass and ceramic materials provided by the embodiment has the advantages of high precision, simple process, low cost, and no pollution. In combination with the circuit pattern casting process provided by the previous embodiment, circuit carrier boards and parts of glass or ceramic materials can be prepared, which are expected to be applied in the fields of high-density interconnection boards, IC packaging substrates, TSV interlayers, and micro-electro-mechanical systems.

[0185] The method for preparing patterns and parts of metal, glass, and ceramic materials using the new planar casting process provided by the embodiment can realize the low-cost production of advanced electronic functional glass and ceramic materials.

[0186] The implementation of the method for preparing the casting patterns of precise circuits provided by the embodiment can include, but is not limited to, the implementation described in the embodiment.

[0187] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical idea disclosed by the embodiments of the present application should be covered by the claims of the present application.

Claims

1. An apparatus for realizing a casting pattern applicable to precision circuits, characterized in that: The device includes a casting core and a heating device. The casting core consists of a template and a pressure body. A pattern cavity corresponding to the desired pattern is formed on the template. Casting material is applied to the pattern cavity. The pressure body is placed on the casting material and applies pressure to it. The heating device heats the template.

2. The apparatus for realizing a casting pattern applicable to precision circuits according to claim 1, characterized in that: The pressure body includes an intermediate body and a pressure generator. The intermediate body is placed on the casting material, and the pressure generator is placed on the intermediate body. The pressure generated by the pressure generator is transmitted to the casting material through the intermediate body.

3. The apparatus for realizing a casting pattern applicable to precision circuits according to claim 2, characterized in that: The intermediate includes a pressure-conducting layer and a heat-insulating layer. The pressure-conducting layer is placed on the casting material, the heat-insulating layer is placed on the pressure-conducting layer, and the pressure generator is placed on the heat-insulating layer. The heat-insulating layer forms a thermal barrier between the pressure generator and the pressure-conducting layer.

4. The apparatus for realizing a casting pattern applicable to precision circuits according to claim 3, characterized in that: Each of the aforementioned template, pressure-conducting layer, and heat insulation layer is composed of one or more layers of high-temperature resistant materials. The template is made of rigid sheet materials, including but not limited to carbon plates, graphite plates, silicon plates, quartz plates, ceramic plates, glass plates, and high-temperature resistant metal plates. The pressure-conducting layer is made of rigid sheet materials, powder materials, or soft materials. Rigid sheet materials include, but are not limited to, carbon plates, graphite plates, silicon plates, quartz plates, ceramic plates, glass plates, and high-temperature resistant metal plates. Powder materials include, but are not limited to, carbon powder, graphite powder, silicon powder, quartz powder, glass powder, ceramic powder, and casting sand. Soft materials include, for example, […]. Including but not limited to carbonizable paper, carbonizable organic film layer, graphite paper, carbon felt, graphite felt, quartz felt, ceramic felt, glass felt, green ceramic sheet, and glass / ceramic semi-cured layer; the heat insulation layer is selected from powder materials, soft materials and heat insulation boards, such as including but not limited to carbon powder, graphite powder, silicon powder, quartz powder, glass powder, ceramic powder, and casting sand; soft materials include but are not limited to carbonizable paper, carbonizable organic film layer, graphite paper, carbon felt, graphite felt, quartz felt, ceramic felt, and glass felt; heat insulation boards include but are not limited to ceramic porous board, high-temperature resistant hollow board, and high-temperature resistant foam board.

5. The apparatus for realizing a casting pattern applicable to precision circuits according to claim 1, characterized in that: A semi-cured layer is added to the template to support the pattern cavity. The material of the semi-cured layer includes, but is not limited to, carbonizable paper, carbonizable ink layer, carbonizable organic film layer, graphite material layer, casting sand layer, carbon paste semi-cured layer, glass or ceramic paste semi-cured layer, and green ceramic sheet.

6. The apparatus for realizing a casting pattern applicable to precision circuits according to claim 1, characterized in that: The heating device is a sealed heating furnace. The casting core is placed inside the sealed heating furnace. The sealed heating furnace includes a furnace body, a heater, a temperature sensor, a vacuum tube, and a protective gas inlet. The casting core is placed on the heater inside the sealed heating furnace. The heater heats the casting material on the inner template of the casting core. The temperature sensor controls the heating temperature. Vacuuming and filling with protective gas protect the casting material from chemical reactions at high temperatures.

7. A method for fabricating a casting pattern applicable to precision circuits, characterized in that: Step 1: Form the pattern cavity corresponding to the required pattern on the template; Step 2: Apply casting material to the cavity of the pattern; Step 3: The pressure body is placed on the casting material and applies pressure to it, forming a casting core with the template; Step 4: The casting core is placed on a heating device and heated. After the casting material is partially or completely melted into casting liquid, it flows under the pressure of the pressure body and fills the pattern cavity. After the flow ends, the casting core is cooled. After the casting liquid solidifies, the pressure body is removed to obtain the casting pattern on the template.

8. The method for manufacturing a casting pattern applicable to precision circuits according to claim 7, characterized in that: A curable material is applied to the casting pattern, and the curable material is cured onto the casting pattern through a curing process to obtain a casting pattern inlay plate in which the casting pattern is wrapped by the cured material.

9. A method for fabricating a casting pattern applicable to precision circuits according to claim 8, characterized in that: The curable material is selected from curable insulating materials to obtain an insulating type cast pattern inlay plate in which the cast pattern is wrapped by the cured insulating material.

10. A method for fabricating a casting pattern applicable to precision circuits according to claim 7, characterized in that: The casting material on the pattern cavity adopts a pattern laying mode, that is, the casting material is only laid inside the pattern cavity. The pressure transmission layer is selected as powder or soft material and pressed on the casting material. Then, the heat insulation layer and pressure generator are pressed on to form a casting core. After that, it is placed on the heating device for heating. As the casting material gradually melts into casting liquid and undergoes volume shrinkage, the material of the pressure transmission layer also undergoes local deformation under the pressure generated by the pressure generator and is squeezed into the pattern cavity, forcing the casting material containing casting liquid to fill the bottom of the pattern cavity. After its flow ends, the casting core is cooled. After the casting liquid solidifies, the pressure body is removed to obtain the casting pattern inside the pattern cavity on the template.

11. The method for manufacturing a casting pattern applicable to precision circuits according to claim 7, characterized in that: The casting material on the pattern cavity is laid using a template method, meaning the volume of the cast material is greater than the volume of the pattern cavity, and the area covered by the casting material on the template is greater than the area occupied by the pattern cavity. A rigid plate is used as the pressure-conducting layer, which is pressed onto the casting material. After the heat insulation layer and pressure generator are pressed on top to form the casting core, it is placed on the heating device for heating. As the casting material gradually melts into casting liquid, under the pressure generated by the pressure generator, the pressure-conducting layer forces the casting material containing casting liquid not only to flow into and fill the pattern cavity, but also to form a thin layer of casting material containing casting liquid on the surface of the pattern cavity. After cooling the casting core until the casting liquid solidifies, a casting pattern and an integrated solid thin plate of casting material on top of it are obtained on the template. The solid thin plate of casting material is removed to obtain the casting pattern.

12. The method for manufacturing a casting pattern applicable to precision circuits according to claim 7, characterized in that: The casting material is one or more of the following: metals, semi-metals, alloys, and non-metallic materials that can be alloyed or strengthened with metals; or it may be powder, sheet, or composition of glass or ceramic materials. The metal materials include, but are not limited to, copper, aluminum, nickel, tin, lead, bismuth, zinc, magnesium, titanium, gold, silver, and iron. The semi-metallic materials include, but are not limited to, silicon and germanium. The alloy materials include, but are not limited to, metal alloys, metal-semi-metal alloys, semi-metal alloys, alloys of fusible and refractory metals, and alloys of metals and non-metals. The non-metallic materials that can be alloyed or strengthened with metals include, but are not limited to, carbon and oxygen. The glass material powder includes, but is not limited to, low-temperature glass powder; the ceramic material powder includes, but is not limited to, low-temperature ceramic powder; the glass material sheet includes, but is not limited to, alkali-free glass sheet and alkali-containing glass sheet; the ceramic material sheet includes, but is not limited to, low-temperature ceramic sheet; the composition of the glass or ceramic material includes, but is not limited to, oxides, nitrides, carbides, sulfides, borides, and halides; the casting material is in the form of slurry, powder, granules, blocks, sheet, or melt, or a combination of one or more of these, including but not limited to combinations of powder and melt, and combinations of powder and sheet.

13. A method for manufacturing a casting pattern applicable to precision circuits according to claim 7, characterized in that: The aforementioned pattern cavity comprises cavities of the same or different depths; the cross-sectional shape of the cavity includes, but is not limited to, triangles, rectangles, trapezoids, semicircles, curved shapes, and stepped shapes; the cavity includes, but is not limited to, one or more combinations of the shapes of straight grooves, curved grooves, circular pits, annular pits, conical pits, stepped pits, triangular pools, and straight or curved polygonal pools; the cavity corresponds to forming a mold in the casting pattern with the same or different thicknesses, and the mold includes, but is not limited to, one or more combinations of the shapes of straight segments, curved segments, protrusions, pillars, hollow pillars, conical pillars, stepped pillars, circular blocks, triangular blocks, and straight or curved polygonal blocks.

14. The method for manufacturing a casting pattern applicable to precision circuits according to claim 9, characterized in that: The insulated type cast pattern in the insulated pattern inlay plate is a circuit pattern, and the plate is a circuit board. The casting pattern in the insulated pattern includes, but is not limited to, metal bumps, metal pillars, hollow metal pillars, and metal blocks as connecting elements between different circuit boards.

15. A method for manufacturing a casting pattern applicable to precision circuits according to claim 7, characterized in that: The aforementioned graphic cavity includes, but is not limited to, the shape of parts, models, cavities / shells, dentures and implants, microfluidic chips, coins, logos, and patterns on signs, printing plates, mold templates, and embossing templates.

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