Vapor chamber and preparation method thereof

Abstract

The invention provides a vapor chamber and a preparation method thereof. The vapor chamber comprises a lower cover, an upper cover, a capillary structure and a liquid working medium, the capillary structure comprises a plate body, the plate body is defined to be divided into a first area, a second area and a third area, and two opposite side surfaces of the plate body are a first surface and a second surface; the third area comprises a plurality of first protruding structures which protrude in the thickness direction of the plate body and are arranged at intervals and a plurality of first through holes which penetrate through the plate body and are arranged at intervals. The capillary force of the third area in the vapor chamber is good, the water storage capacity is high, backflow of a liquid working medium can be rapidly achieved, the evaporation capacity of the liquid working medium can be reduced, and the effect that steam entrains the liquid working medium to a condensation area is reduced.

Description

Technical Field

[0001] This invention relates to the field of temperature riser technology, and more particularly to a temperature riser and its preparation method. Background Technology

[0002] With the rapid development of electronic components and integrated circuits, electronic components generate a large amount of heat during operation. For example, computer CPUs and semiconductor lasers generate a significant amount of heat during operation. The reliability of electronic devices is extremely sensitive to temperature. When the temperature of electronic components reaches 70-80℃, the reliability of the electronic device decreases by 5% for every 1℃ increase. Therefore, heat dissipation has become a key issue in the miniaturization of electronic devices. To ensure that electronic components operate at normal temperatures, heat sinks are typically installed on them for heat dissipation. Additionally, a vapor chamber with good thermal conductivity is placed between the heat sink and the electronic components. The vapor chamber's function is to distribute the heat from the heated electronic components evenly before it is dissipated through the heat sink.

[0003] The vapor chamber mainly includes a lower cover, an upper cover, a capillary structure fixed to the lower cover and located inside the upper and lower covers, and a liquid working fluid contained in the upper and lower covers. Among them, the capillary structure is the main structure, and the capillary force and permeability of the capillary structure directly affect the heat dissipation performance of the vapor chamber. In related technologies, the capillary structure of a vapor chamber mainly includes an evaporation region near the heat source, a condensation region away from the heat source, and a transition region between the evaporation and condensation regions for liquid recirculation. The capillary structure is formed by interlacing metal wires, which creates an angle between the wires and the lower cover, thus generating capillary force. Although the capillary structure formed by interlacing metal wires can generate capillary force, it is still relatively weak. Furthermore, the transition region in the capillary structure has gaps and pores, which increases the evaporation rate of the liquid working medium in the transition region. This improves the effect of steam carrying liquid to the condensation region, but the water storage capacity is weak, and it cannot achieve a better recirculation effect. Summary of the Invention

[0004] To address the shortcomings of the aforementioned related technologies, this invention proposes a novel heat spreader and its preparation method. This addresses the problem that in related technologies, the capillary structure of the heat spreader is formed by interlacing metal wires, resulting in relatively weak capillary force in the transition region of the capillary structure. This leads to an increase in the evaporation of the liquid working fluid, improving the effect of steam carrying liquid to the condensation zone. Additionally, it reduces the water storage capacity of the third region, making it impossible to achieve a better reflux effect.

[0005] To solve the above-mentioned technical problems, in a first aspect, the present invention provides a heat spreader for dissipating heat from a heat source, comprising a lower cover, an upper cover fixed to the lower cover and forming a receiving space together with the lower cover, a capillary structure fixed in the receiving space, and a liquid working fluid contained in the receiving space. The capillary structure includes a plate, and the region of the plate near the heat source is defined as a first region, the region of the plate away from the heat source is defined as a second region, and the region of the plate between the first region and the second region is defined as a third region. The plate has two opposite sides along its thickness direction, namely a first surface and a second surface, with the first surface facing the lower cover and the second surface facing the upper cover; the third region includes a plurality of first protruding structures that protrude along the thickness direction of the plate and are spaced apart from each other, and a plurality of first through holes that penetrate the plate and are spaced apart, and the third region is used for the reflux of the liquid working fluid.

[0006] Preferably, two adjacent first protrusions protrude in the same direction, and the first protrusions protrude from the first surface and are fixed to the lower cover.

[0007] Preferably, two adjacent first protrusions protrude in opposite directions.

[0008] Preferably, the first protruding structure is a first protrusion formed by stamping.

[0009] Preferably, the first protruding structure is a first rib formed by stamping.

[0010] Preferably, two adjacent first protrusion structures are a stamped first protrusion assembly and a stamped first rib extending along a first direction, respectively. Each first protrusion assembly includes a plurality of first protrusions spaced apart along the first direction. The first protrusion protrudes from one of the first surface and the second surface, and the first rib protrudes from the other surface of the first surface and the second surface.

[0011] Preferably, the first region includes a plurality of second protruding structures that protrude along the thickness direction of the plate and are spaced apart from each other, and a plurality of second through holes that penetrate the plate and are spaced apart.

[0012] Preferably, two adjacent second protruding structures protrude in the same direction, and the second protruding structures protrude from the first surface and are fixed to the lower cover.

[0013] Preferably, two adjacent second protrusions protrude in opposite directions.

[0014] Preferably, the second protruding structure is a second protrusion formed by stamping.

[0015] Preferably, two adjacent second protrusion structures are a stamped second protrusion assembly and a stamped second rib extending along the first direction, respectively. Each second protrusion assembly includes a plurality of second protrusions spaced apart along the first direction. The second protrusions protrude from the first surface, the second ribs protrude from the second surface, and the second protrusions are fixed to the lower cover.

[0016] Preferably, two adjacent first protruding structures protrude in opposite directions; the first protruding structure is a stamped first rib, the first rib extends in a first direction, and the first rib protruding from the first surface is fixed to the lower cover; The two adjacent second protruding structures are a stamped second protrusion assembly and a stamped second rib extending along the first direction, respectively. Each second protrusion assembly includes a plurality of second protrusions spaced apart along the first direction. The second protrusions protrude from the first surface, the second ribs protrude from the second surface, and the second protrusions are fixed to the lower cover. Each second rib is connected to its adjacent first rib as a whole.

[0017] Preferably, the second region includes a plurality of third protruding structures that protrude along the thickness direction of the plate and are spaced apart from each other, and a plurality of third through holes that penetrate the plate and are spaced apart.

[0018] Preferably, two adjacent third protrusions protrude in the same direction, and the third protrusions protrude from the first surface and are fixed to the lower cover.

[0019] Preferably, two adjacent third protrusions protrude in opposite directions.

[0020] Preferably, the third protrusion is a third protrusion formed by stamping.

[0021] Preferably, the first region is covered with a first film on the side near the top cover, and the first film has a plurality of first perforations extending through it.

[0022] Preferably, the second region is covered with a second film on the side near the top cover; the second film has a plurality of second perforations extending through it.

[0023] Preferably, the third region is covered with a third film on the side near the top cover, and the third film has a plurality of third perforations extending through it.

[0024] Preferably, the first region is covered with a first film on the side near the top cover, and the first film has a plurality of first perforations therethrough; the second region is covered with a second film on the side near the top cover, and the second film has a plurality of second perforations therethrough; the third region is covered with a third film on the side near the top cover, and the third film has a plurality of third perforations therethrough; the porosity of the first film and the porosity of the second film are both greater than or equal to the porosity of the third film; or, The first region is covered with a first film on the side near the top cover, and the first film has a plurality of first perforations therethrough; the third region is covered with a third film on the side near the top cover, and the third film has a plurality of third perforations therethrough; the porosity of the first film is greater than or equal to the porosity of the third film; or, The second region is covered with a second film on the side near the top cover, and the second film has a plurality of second perforations through it; the third region is covered with a third film on the side near the top cover, and the third film has a plurality of third perforations through it; the porosity of the second film is greater than or equal to the porosity of the third film.

[0025] Preferably, the distance between the first surface and the second surface along the thickness direction of the plate is 0.005~0.025mm.

[0026] Preferably, two adjacent first protrusions protrude in opposite directions; along the thickness direction of the plate, the distance between the ends of two adjacent first protrusions that are far apart from each other is 0.03~0.6mm.

[0027] Preferably, the first through hole is disposed within the first protruding structure.

[0028] Preferably, the first through hole is located outside the first protruding structure.

[0029] Preferably, the first region includes a plurality of second protruding structures that protrude along the thickness direction of the plate and are spaced apart from each other, and a plurality of second through holes that penetrate the plate and are spaced apart; the diameter of the second through holes is 0.01~0.08mm.

[0030] Preferably, the first region includes a plurality of second protruding structures that protrude along the thickness direction of the plate and are spaced apart from each other, and a plurality of second through holes that penetrate the plate and are spaced apart; the distance between two adjacent second through holes is 0.1~0.3mm.

[0031] Secondly, the present invention provides a method for preparing a heat spreader, the heat spreader being used to dissipate heat from a preset heat source, the method for preparing the heat spreader comprising the following steps: Obtain a plate having a first surface and a second surface that are relatively arranged; the plate has a plurality of preset first regions, a plurality of second regions, and a third region located between adjacent first regions and second regions; The plate is stamped so that all the first regions, all the second regions and all the third regions have a protruding structure that protrudes along the thickness direction of the plate. The plate is perforated such that all the first regions, all the second regions, and all the third regions have through holes therethrough. The outer surface of the plate is roughened to form a rough surface on at least a portion of the outer surface of the plate. The plate is subjected to a hydrophilic treatment to make its surface hydrophilic. The plate is cut into the desired shape to obtain a capillary structure; each capillary structure has an integrally formed first region, a second region, and a third region; Assemble the upper cover, lower cover, and capillary structure so that the first region is close to the preset heat source; A liquid working fluid is injected into the containment space formed by the upper cover and the lower cover to obtain the temperature equalization plate.

[0032] Compared with related technologies, the capillary structure of the present invention, by setting a plurality of first protruding structures that protrude along the thickness direction of the plate and are spaced apart from each other in the third region of the plate and a plurality of first through holes that penetrate the plate and are spaced apart, and by using the third region for the reflux of liquid working fluid, is equivalent to creating a 3D capillary structure on the plate. This not only enhances the capillary force in the third region and has a strong water storage capacity, enabling it to improve the rapid reflux of liquid working fluid, but also reduces the evaporation of liquid working fluid and reduces the effect of vapor carrying liquid working fluid to the condensation zone. Attached Figure Description

[0033] The present invention will now be described in detail with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and more readily understood through the detailed description following the accompanying drawings. In the drawings: Figure 1 This is a cross-sectional view of a module portion of a heat spreader provided in an embodiment of the present invention; Figure 2 Partial cross-sectional views of the heat spreader plate provided in the embodiments of the present invention using different welding methods, wherein (a) is a through-hole welding view and (b) is a surface welding view; Figure 3This is a front view of the first type of capillary structure in the heat spreader provided in an embodiment of the present invention; Figure 4 This is a left view of the first type of capillary structure in the heat spreader provided in an embodiment of the present invention; Figure 5 This is a partial front view of the first region of the first type of capillary structure in the heat spreader provided in an embodiment of the present invention; Figure 6 This is a partial bottom view of the third region of the first type of capillary structure in the heat spreader provided in an embodiment of the present invention; Figure 7 A partial cross-sectional view of the heat spreader plate provided in an embodiment of the present invention, which employs a second type of capillary structure; Figure 8 This is a front view of the heat spreader and the second type of capillary structure provided in an embodiment of the present invention; Figure 9 for Figure 8 Enlarged view of part A of the structure; Figure 10 This is a right view of the heat spreader and the second type of capillary structure provided in an embodiment of the present invention; Figure 11 The left view of the heat spreader and the third type of capillary structure provided in the embodiment of the present invention; Figure 12 A partial cross-sectional view of the heat spreader provided in this embodiment of the invention, which employs a fourth type of capillary structure; Figure 13 A front view of the heat spreader with a fourth type of capillary structure provided in an embodiment of the present invention; Figure 14 for Figure 13 Enlarged view of part B of the structure; Figure 15 The left view of the heat spreader provided in this embodiment of the invention, which adopts a fourth type of capillary structure; Figure 16 A partial cross-sectional view of the heat spreader provided in this embodiment of the invention, which employs the fifth type of capillary structure; Figure 17 A perspective view of the heat spreader with the fifth type of capillary structure provided in the embodiments of the present invention; Figure 18 for Figure 17 Enlarged view of the C part structure; Figure 19 Examples of different configurations of the first region in the heat spreader provided in the embodiments of the present invention are shown in (c), which is an example of the first region being configured with all protrusions and covered with a first film, and (b) which is an example of the first region being configured with protrusions and ribs and covered with a first film.

[0034] Among them, 100 is a heat spreader; 1 is a lower cover; 10 is a receiving space; 2 is an upper cover; 21 is a protrusion; 3 is a welded part; 4 is a capillary structure; 41 is a plate body; 411 is a first region; 4111 is a second protruding structure; 41111 is a second protrusion; 41112 is a second rib; 4112 is a second through hole; 4113 is a first film; 412 is a second region; 4121 is a third protruding structure; 41211 is a third protrusion; 4122 is a third through hole; 413 is a third region; 4131 is a first protruding structure; 41311 is a first protrusion; 41312 is a first rib; 4132 is a first through hole; 414 is a first surface; and 415 is a second surface. Detailed Implementation

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0036] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] Example 1 This invention provides a heat spreader 100, combined with... Figures 1 to 6 As shown, it includes a lower cover 1, an upper cover 2 that is fixed to the lower cover 1 and together with the lower cover 1 forms a receiving space 10, a capillary structure 4 that is fixed to the receiving space 10, and a liquid working fluid that is received in the receiving space 10.

[0039] The heat spreader 100 is used to dissipate heat from the heat source, which is the electronic component that generates heat.

[0040] The upper cover 2 is provided with a protruding part 21 on the side near the lower cover 1, which abuts against the protruding structure protruding from the second surface 415 and is away from the first surface 414.

[0041] like Figure 2 As shown, the protrusion 21 is formed by extending from the side of the upper cover 2 near the lower cover 1 or by being stamped from the side of the upper cover 2 away from the lower cover 1 toward the lower cover 1. In this embodiment, the protrusion 21 includes a plurality of spaced protrusions, which allows the heat spreader 100 to have more receiving space 10 to receive the liquid working fluid.

[0042] like Figure 2 As shown, the upper cover 2 is fixed to the lower cover 1 by welding. The welding position is the welding part 3, which has two welding methods: one is through-hole welding, such as... Figure 2 As shown in (a), another type is surface welding, such as Figure 2 As shown in (b) of the diagram.

[0043] The capillary structure 4 includes a plate 41. The region of the plate 41 near the heat source is defined as the first region 411, the region of the plate 41 away from the heat source is defined as the second region 412, and the region of the plate 41 between the first region 411 and the second region 412 is defined as the third region 413. The two opposite sides of the plate 41 along its thickness direction are the first surface 414 and the second surface 415, respectively.

[0044] The material of plate 41 is SUS316L (316L stainless steel) or C1020 (oxygen-free copper or tough copper). Of course, depending on the actual needs, plate 41 can also be made of non-metallic materials.

[0045] The first region 411 can be called the hot zone or evaporation zone, which has the functions of evaporation and liquid working fluid reflux; the second region 412 can be called the cold zone or condensation zone, which has the functions of condensation and liquid working fluid reflux; the third region 413 can be called the cold-hot transition zone or transition zone, which has the function of liquid working fluid reflux.

[0046] The third region 413 includes a plurality of first protruding structures 4131 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of first through holes 4132 that penetrate the plate 41 and are spaced apart. The third region 413 is used for the reflux of liquid working fluid.

[0047] Two adjacent first protrusions 4131 protrude in opposite directions; the first protrusion 4131 is a first protrusion 41311 formed by stamping.

[0048] The first protrusion 41311 protruding from the first surface 414 is fixed to the lower cover 1.

[0049] In related technologies, the diameter of the metal wires used in the capillary structure 4 is generally 0.022mm, 0.025mm, 0.03mm, etc., which results in an overall thickness of generally 0.04~0.8mm. For example... Figure 6 As shown, in order to reduce the thickness of its capillary structure 4, this embodiment limits the distance H1 between the first surface 414 and the second surface 415 along the thickness direction of the plate 41 to 0.005~0.025mm, preferably 0.01mm, and along the thickness direction of the plate 41, the distance H2 between the ends of two adjacent first protrusions 4131 that are far apart from each other is 0.03~0.6mm, that is, the distance between the ends of two adjacent first protrusions 41311 that are far apart from each other.

[0050] The distances by which two adjacent first protruding structures 4131 protrude from the plate 41 are all the same. Of course, depending on the actual needs, the distances by which two adjacent first protruding structures 4131 protrude from the plate 41 can also be different.

[0051] The spacing between two adjacent first protruding structures 4131 in one group is the same as the spacing between two adjacent first protruding structures 4131 in another group. Of course, depending on the actual needs, the spacing between two adjacent first protruding structures 4131 in one group can also be different from the spacing between two adjacent first protruding structures 4131 in another group.

[0052] like Figure 3 As shown, the multiple first protruding structures 4131 can be arranged in a rectangular, hexagonal, or rhomboid pattern, etc. Of course, depending on actual needs, the spacing between the multiple first protruding structures 4131 arranged along the first direction and / or the spacing between the multiple first protruding structures 4131 arranged along the second direction can also be designed to increase or decrease in a gradient manner. The first direction is... Figure 3 , Figure 8 , Figure 13 , Figure 17 The X-axis is in the middle, and the second direction is... Figure 3 , Figure 8 , Figure 13 , Figure 17 The Y-axis in the equation.

[0053] In this embodiment, the first through hole 4132 is disposed within the first protruding structure 4131. Of course, depending on actual needs, the first through hole 4132 can also be disposed outside the first protruding structure 4131.

[0054] The first region 411 includes a plurality of second protruding structures 4111 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of second through holes 4112 that penetrate the plate 41 and are spaced apart.

[0055] Two adjacent second protrusions 4111 protrude in opposite directions; the second protrusions 4111 are second protrusions 41111 formed by stamping.

[0056] The second protrusion 41111 protruding from the first surface 414 is fixed to the lower cover 1.

[0057] like Figure 5 As shown, the diameter R of the second through hole 4112 is 0.01~0.08mm. Since the liquid working fluid in the capillary structure 4 evaporates and overflows through the second through hole 4112, if the diameter of the second through hole 4112 is too small, the steam cannot diffuse in time, reducing the steam pressure in the heat spreader 100 and preventing the steam from quickly reaching the condensation zone for condensation and reflux. If the diameter of the second through hole 4112 is too large, the capillary structure 4 will shrink, resulting in a decrease in the liquid storage capacity of the capillary structure 4, thereby affecting the ultimate power of the capillary structure 4. It will also cause a decrease in the pressure-bearing capacity of the capillary structure 4, making the capillary structure 4 unable to withstand the pressure transmitted to the capillary by the receiving space 10 of the upper cover 2 and the lower cover 1 after vacuuming, damaging the capillary microstructure and affecting the capillary force and liquid storage capacity, etc.

[0058] like Figure 5 As shown, the distance L between two adjacent second through holes 4112 is 0.1~0.3mm. If the distance between two adjacent second through holes 4112 is too small, the requirements for mold precision and material strength are higher, and the molding is more difficult; if the distance between two adjacent second through holes 4112 is too large, the area ratio of the second through holes 4112 is reduced, the amount of steam overflow channel is reduced, the steam pressure in the heat spreader 100 is reduced, and the steam cannot quickly reach the condensation zone for condensation and reflux.

[0059] In this embodiment, the second through hole 4112 is disposed within the second protruding structure 4111. Of course, depending on actual needs, the second through hole 4112 can also be disposed outside the second protruding structure 4111.

[0060] The second region 412 includes a plurality of third protruding structures 4121 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of third through holes 4122 that penetrate the plate 41 and are spaced apart.

[0061] Two adjacent third protrusions 4121 protrude in opposite directions; the third protrusion 4121 is a third protrusion 41211 formed by stamping.

[0062] The third protrusion 41211, which protrudes from the first surface 414, is fixed to the lower cover 1.

[0063] The spacing between two adjacent third protrusions 4121 is smaller than the spacing between two adjacent second protrusions 4111. This design allows the 3D structure of the second region 412 to be more dense, enhancing the capillary force in the region and enabling the liquid working fluid to condense and reflux rapidly.

[0064] In this embodiment, the third through hole 4122 is disposed within the third protruding structure 4121. Of course, depending on actual needs, the third through hole 4122 can also be disposed outside the third protruding structure 4121.

[0065] The structures of the second protruding structure 4111, the third protruding structure 4121, and the fourth protruding structure are basically the same, such as the height of the protrusion, the width of the protrusion, the number of protruding structures, the spacing, and the arrangement. The structures of the first through hole 4132, the second through hole 4112, and the third through hole 4122 are basically the same, such as the diameter of the through hole and the spacing between adjacent through holes. Examples will not be given here.

[0066] Compared with related technologies, the capillary structure 4 of the present invention provides a plurality of first protruding structures 4131 that protrude along the thickness direction of the plate 41 and are spaced apart, and a plurality of first through holes 4132 that penetrate the plate 41 and are spaced apart, in the third region 413 of the plate 41. The third region 413 is used for the reflux of liquid working fluid, which is equivalent to creating a 3D capillary structure on the plate 41. This not only enhances the capillary force of the third region 413, but also has a strong water storage capacity, enabling it to improve the rapid reflux of liquid working fluid. At the same time, it can also reduce the evaporation of liquid working fluid and reduce the efficiency of steam carrying liquid working fluid to the condensation zone. Moreover, the stamping process is simpler than the method of interlacing metal wires.

[0067] In this embodiment, the capillary structure 4 also has a plurality of second protruding structures 4111 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of second through holes 4112 that penetrate the plate 41 and are spaced apart. The second protruding structures 4111 are formed by a stamping process, which is equivalent to stamping a 3D capillary structure on the plate 41. This not only makes the diameter of the second through holes 4112 smaller, but also takes into account the capillary force and permeability of the capillary structure 4. In addition, the setting position of the second through holes 4112 can be selected to ensure that there is only liquid reflux in the non-heat input area, thereby reducing the problem of slowed liquid return speed and reduced liquid return volume caused by liquid working fluid evaporation.

[0068] In this embodiment, the structure of the second region 412, in conjunction with the structures of the first region 411 and the second region 412, allows for the design of different flow channels according to different needs, such as different thicknesses and special structures, which can enhance the adaptability of the capillary structure 4. At the same time, it can also enable different regions to have different functions and design the capillary reflux speed according to needs.

[0069] Example 2 In this embodiment, as Figures 7 to 10 As shown, the first region 411 includes a plurality of second protruding structures 4111 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of second through holes 4112 that penetrate the plate 41 and are spaced apart.

[0070] Two adjacent second protrusions 4111 protrude in opposite directions; the second protrusions 4111 are second protrusions 41111 formed by stamping.

[0071] The second region 412 includes a plurality of third protruding structures 4121 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of third through holes 4122 that penetrate the plate 41 and are spaced apart.

[0072] Two adjacent third protrusions 4121 protrude in opposite directions; the third protrusion 4121 is a third protrusion 41211 formed by stamping.

[0073] The third region 413 includes a plurality of first protruding structures 4131 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of first through holes 4132 that penetrate the plate 41 and are spaced apart.

[0074] The two adjacent first protrusions 4131 protrude in opposite directions.

[0075] Unlike Embodiment 1, the first protruding structure 4131 is a stamped first rib 41312, which extends along a first direction and protrudes from the first surface 414 and is fixed to the lower cover 1.

[0076] By modifying the first protruding structure 4131 into a rib structure, this design can improve the reflux effect of the liquid working fluid, resulting in less evaporation. In addition, when the protruding structure is set as a rib, the distance from which the rib protrudes from its corresponding surface is greater than the distance from which the protrusion protrudes from its corresponding surface. Although this design will increase the thickness of the capillary structure 4, it can increase the storage capacity of the liquid working fluid, resulting in a higher maximum flow rate.

[0077] Figure 9 for Figure 8 Enlarged view of part A of the structure, from Figure 9The diagram clearly shows the protruding structure between the first region 411 and the third region 413. The protruding structure of the second region 412 is basically the same as that of the first region 411, and will not be shown in a separate diagram here.

[0078] Since this embodiment only changes the protrusion shape of the first protrusion structure 4131, it can also achieve the technical effect achieved by the capillary structure 4 in embodiment one, and will not be described in detail here.

[0079] like Figure 11 As shown, according to actual needs, the third region 413 can also be configured as follows: two adjacent first protrusion structures 4131 are respectively a first protrusion assembly formed by stamping and a first rib 41312 formed by stamping and extending along the first direction. Each first protrusion assembly includes a plurality of first protrusions 41311 arranged at intervals along the first direction; the first protrusions 41311 protrude from the first surface 414, and the first rib 41312 protrudes from the second surface 415. Of course, it can also be configured as follows: the first protrusions 41311 protrude from the second surface 415, and the first rib 41312 protrude from the first surface 414.

[0080] Example 3 In this embodiment, as Figures 12 to 15 As shown, the first region 411 includes a plurality of second protruding structures 4111 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of second through holes 4112 that penetrate the plate 41 and are spaced apart.

[0081] The second region 412 includes a plurality of third protruding structures 4121 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of third through holes 4122 that penetrate the plate 41 and are spaced apart.

[0082] The third region 413 includes a plurality of first protruding structures 4131 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of first through holes 4132 that penetrate the plate 41 and are spaced apart.

[0083] Unlike Embodiment 1, two adjacent first protruding structures 4131 protrude in opposite directions. The first protruding structure 4131 is a stamped first rib 41312. The first rib 41312 extends in the first direction and protrudes from the first surface 414 and is fixed to the lower cover 1.

[0084] The two adjacent second protruding structures 4111 are respectively a stamped second protrusion assembly and a stamped second rib 41112 extending along the first direction. Each second protrusion assembly includes a plurality of second protrusions 41111 arranged at intervals along the first direction. The second protrusions 41111 protrude from the first surface 414, and the second rib 41112 protrudes from the second surface 415. The second protrusions 41111 are fixed to the lower cover 1. Each second rib 41112 is connected to its adjacent first rib 41312 as a whole.

[0085] Two adjacent third protrusions 4121 protrude in the same direction. The third protrusion 4121 protrudes from the first surface 414 and is fixed to the lower cover 1. The third protrusion 4121 is a third protrusion 41211 formed by stamping.

[0086] In this embodiment, the second protruding structure 4111 protruding from the second surface 415 is set as the second rib 41112, and each second rib 41112 is connected to its adjacent first rib 41312 as a whole. This design can improve the reflux effect of the liquid working fluid and reduce its evaporation.

[0087] The distance from the rib protruding from its corresponding surface is greater than the distance from the convex point protruding from its corresponding surface. Although this design will increase the thickness of the capillary structure 44, it can increase the storage capacity of the liquid working fluid and make its maximum flow rate higher.

[0088] Figure 14 for Figure 13 Enlarged view of part B of the structure, from Figure 14 The diagram clearly shows the protruding structure between the first region 411 and the third region 413. The protruding structure in the second region 412 that protrudes from the first surface 414 is basically the same as the protruding structure in the first region 411 that protrudes from the first surface 414, and will not be shown in a separate diagram here.

[0089] Since the capillary structure 4 in this embodiment only changes the protruding shape of the first protruding structure 4131, the second protruding structure 4111 and the third protruding structure 4121, it can also achieve the technical effect achieved by the capillary structure 4 in embodiment one, and will not be elaborated here.

[0090] Of course, depending on actual needs, the second region 412 can also be set as follows: two adjacent third protrusion structures 4121 protrude in opposite directions; the third protrusion structure 4121 is a third protrusion 41211 formed by stamping.

[0091] Example 4 In this embodiment, as Figures 16 to 18As shown, the first region 411 includes a plurality of second protruding structures 4111 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of second through holes 4112 that penetrate the plate 41 and are spaced apart.

[0092] The second region 412 includes a plurality of third protruding structures 4121 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of third through holes 4122 that penetrate the plate 41 and are spaced apart.

[0093] The third region 413 includes a plurality of first protruding structures 4131 that protrude along the thickness direction of the plate 41 and are spaced apart from each other, and a plurality of first through holes 4132 that penetrate the plate 41 and are spaced apart.

[0094] Unlike Embodiment 1, two adjacent first protrusions 4131 protrude in the same direction. The first protrusions 4131 protrude from the first surface 414 and are fixed to the lower cover 1. The first protrusions 4131 are first protrusions 41311 formed by stamping.

[0095] Two adjacent second protruding structures 4111 protrude in the same direction. The second protruding structure 4111 protrudes from the first surface 414 and is fixed to the lower cover 1. The second protruding structure 4111 is a second protrusion 41111 formed by stamping.

[0096] Two adjacent third protrusions 4121 protrude in the same direction. The third protrusion 4121 protrudes from the first surface 414 and is fixed to the lower cover 1. The third protrusion 4121 is a third protrusion 41211 formed by stamping.

[0097] Figure 18 for Figure 17 Enlarged view of part C of the structure, from Figure 18 The diagram clearly shows the protruding structure between the second region 412 and the third region 413. The protruding structure of the first region 411 is basically the same as that of the third region 413, and will not be shown in a separate diagram here.

[0098] Since the capillary structure 4 in this embodiment only reduces the first protrusion 4131, the second protrusion 4111 and the third protrusion 4121 protruding from the second surface 415, but still has a 3D three-dimensional structure formed by stamping, it can also achieve the technical effect achieved by the capillary structure 4 in embodiment one, which will not be elaborated here.

[0099] The above embodiments one to four only illustrate some implementation methods of the plate body 41 structure of the heat spreader 100 in this invention. It can also be implemented in a variety of combinations, such as in the third region 413: the first protruding structure 4131 is set as a rib protruding only from the first surface 414, or as a rib protruding from the first surface 414 and a protruding point protruding from the second surface 415; in conjunction with the first region 411: the second protruding structure 4111 is set as a rib protruding only from the first surface 414, or as a rib protruding from the first surface 414 and the second surface 415, or as a rib protruding from the first surface 414 and a protruding point protruding from the second surface 415; and in conjunction with the second region 412: the third protruding structure 4121 is set as a protruding point protruding only from the first surface 414, or as a protruding point protruding from the first surface 414 and the second surface 415.

[0100] Example 5 Unlike Example 1, as Figure 19 As shown, the first region 411 is covered with a first film 4113 on the side near the upper cover 2, and the first film 4113 has a plurality of first perforations through it.

[0101] The second region 412 is covered with a second film on the side near the top cover 2; the second film has a plurality of second perforations extending through it.

[0102] The third region 413 is covered with a third film on the side near the top cover 2, and the third film has a plurality of third perforations through it.

[0103] The porosity of the first film 4113 and the porosity of the second film are both greater than or equal to the porosity of the third film.

[0104] Of course, depending on actual needs, the film can also be set in only one or two of the first region 411, the second region 412 and the third region 413.

[0105] Since the capillary structure 4 in this embodiment only adds a thin film to any one or more of the first region 411, the second region 412 and the third region 413, and sets corresponding perforations on the thin film, it can also achieve the technical effect achieved by the capillary structure 4 in embodiment 1, and will not be elaborated here.

[0106] Example 6 This embodiment provides a method for preparing a heat spreader, which is used to dissipate heat from a preset heat source, and includes the following steps: S1. Obtain a plate having a first surface and a second surface that are arranged opposite to each other; the plate has a plurality of preset first regions, a plurality of second regions, and a third region located between adjacent first regions and second regions.

[0107] S2. The plate is stamped so that all the first regions, all the second regions and all the third regions have a protruding structure that protrudes along the thickness direction of the plate.

[0108] The protruding structures are the first protruding structure, the second protruding structure, and the third protruding structure in the above embodiments.

[0109] The raised structures are all precision stamped.

[0110] S3. Make holes in the plate so that all the first regions, all the second regions and all the third regions have through holes therethrough.

[0111] The through hole refers to the first through hole, the second through hole, and the third through hole in the above embodiments.

[0112] Through holes can be formed by one of the following methods: laser drilling, etching, or precision punching.

[0113] If etching is used to create holes, a rough surface can be etched around the holes and on the inner walls of the holes to enhance vaporization and boiling heat transfer in the corresponding areas. Other methods to increase roughness include sandblasting, chemical etching, mechanical polishing, or using abrasive rolling wheels during the rolling of the raw material of the plate. The ultimate goal is to increase the hydrophilicity of the plate.

[0114] S4. The outer surface of the plate is roughened to form a rough surface on at least a portion of the outer surface of the plate.

[0115] The outer surface includes at least a portion of the first surface and / or at least a portion of the second surface.

[0116] Roughness treatment methods include: rolling with an abrasive rolling wheel after obtaining the plate; and / or, etching when making holes in the plate; and / or, sandblasting, chemical etching or mechanical polishing when hydrophilic treatment of the plate.

[0117] S5. Perform hydrophilic treatment on the plate to make the surface of the plate hydrophilic.

[0118] Before hydrophilic treatment, the sheet material needs to be rolled up to facilitate the process. Hydrophilic treatment can be performed after the sheet material is obtained, after stamping, or after drilling.

[0119] The hydrophilic treatment method can be any one of the following: high-temperature atmosphere immersion, laser texturing, chemical deposition, hydrophilic treatment of aluminum film, micro-etching, or graphene or carbon nanotube coating. The high-temperature atmosphere in the high-temperature immersion method includes, but is not limited to, an oxygen-containing environment; the immersion uses a special aqueous solution, including but not limited to water; and the laser texturing method includes femtosecond lasers, etc.

[0120] S6. Cut the plate into the desired shape to obtain a capillary structure; each capillary structure has an integrally formed first region, a second region, and a third region.

[0121] S7. Assemble the upper cover, lower cover, and capillary structure so that the first region is close to the preset heat source.

[0122] S8. Inject liquid working fluid into the containment space formed by the upper cover and the lower cover to obtain the temperature equalization plate.

[0123] Of course, if it is necessary to add a film to any one or more of the first region, the second region, and the third region, the step of obtaining the film is also included, such that the film covers one or more of the first region, the second region, and the third region when assembling the upper cover, the lower cover, and the capillary structure.

[0124] The method for preparing the heat spreader in this embodiment is used to prepare the heat spreader in the above embodiment. Therefore, it can also achieve the technical effect achieved by the heat spreader in the above embodiment. It will not be elaborated here. Moreover, compared with the capillary structure formed by interlacing metal wires in related technologies, the process is simpler and the preparation efficiency is higher.

[0125] It should be noted that the various embodiments described above with reference to the accompanying drawings are merely illustrative of the present invention and not intended to limit its scope. Those skilled in the art should understand that any modifications or equivalent substitutions made to the present invention without departing from its spirit and scope should be included within the scope of the present invention. Furthermore, unless the context otherwise requires, words appearing in the singular include those in the plural, and vice versa. Additionally, unless specifically stated otherwise, all or part of any embodiment may be used in conjunction with all or part of any other embodiment.

Claims

1. A vapor chamber for dissipating heat from a heat source, comprising a lower cover, an upper cover fixed to the lower cover and cooperated with the lower cover to form a receiving space, a capillary structure received in the receiving space, and a liquid working medium received in the receiving space; characterized in that, the capillary structure comprises a plate body, a region of the plate body near the heat source is defined as a first region, a region of the plate body far from the heat source is defined as a second region, and a region of the plate body between the first region and the second region is defined as a third region; opposite sides of the plate body along a thickness direction of the plate body are respectively a first surface and a second surface, the first surface faces the lower cover, and the second surface faces the upper cover; the third region comprises a plurality of first protruding structures protruding along the thickness direction of the plate body and spaced from each other, and a plurality of first through holes penetrating through the plate body and spaced from each other, and the third region is used for backflow of the liquid working medium. Adjacent two first protruding structures protrude in the same direction, and the first protruding structures protrude from the first surface and are fixed to the lower cover. Adjacent two first protruding structures protrude in opposite directions.

2. The vapor chamber of claim 1, wherein, The first protruding structures are first protruding points formed by stamping.

3. The vapor chamber of claim 1, wherein, The first protruding structures are first ribs formed by stamping.

4. The vapor chamber of claim 1 or 2, wherein Adjacent two first protruding structures are respectively a first protruding point assembly formed by stamping and a first rib formed by stamping and extending in a first direction, each first protruding point assembly comprises a plurality of first protruding points arranged in the first direction, the first protruding points protrude from one of the first surface and the second surface, and the first rib protrudes from the other one of the first surface and the second surface.

5. The vapor chamber of claim 1 or 2, wherein The first region comprises a plurality of second protruding structures protruding along the thickness direction of the plate body and spaced from each other, and a plurality of second through holes penetrating through the plate body and spaced from each other.

6. The vapor chamber of claim 1, wherein, Adjacent two second protruding structures protrude in the same direction, and the second protruding structures protrude from the first surface and are fixed to the lower cover.

7. The vapor chamber of claim 1, wherein, Adjacent two second protruding structures protrude in opposite directions.

8. The vapor chamber of claim 7, wherein, The second protruding structures are second protruding points formed by stamping.

9. The vapor chamber of claim 7, wherein, Adjacent two second protruding structures are respectively a second protruding point assembly formed by stamping and a second rib formed by stamping and extending in a first direction, each second protruding point assembly comprises a plurality of second protruding points arranged in the first direction, the second protruding points protrude from the first surface, the second rib protrudes from the second surface, and the second protruding points are fixed to the lower cover.

10. The uniform heat spreader of claim 8 or 9, wherein, Adjacent two first protruding structures protrude in opposite directions, the first protruding structures are first ribs formed by stamping, the first ribs extend in a first direction, and the first ribs protruding from the first surface are fixed to the lower cover.

11. The vapor chamber of claim 7, wherein, ​ 12. The vapor chamber of claim 7, wherein, ​ Two adjacent second convex structures are a second bump assembly formed by stamping and a second rib formed by stamping and extending along the first direction, each of the second bump assembly comprising a plurality of second bumps arranged at intervals along the first direction, the second bumps protruding from the first surface, the second rib protruding from the second surface, and the second bumps being fixed to the lower cover, and each of the second rib being connected integrally with the first rib adjacent thereto.

13. The vapor chamber of claim 1, wherein, The second region comprises a plurality of third convex structures protruding along the thickness direction of the plate body and spaced apart from each other, and a plurality of third through holes penetrating through the plate body and arranged at intervals.

14. The vapor chamber of claim 13, wherein, Two adjacent third convex structures protrude in the same direction, and the third convex structures protrude from the first surface and are fixed to the lower cover.

15. The vapor chamber of claim 13, wherein, Two adjacent third convex structures protrude in opposite directions.

16. The uniform heat spreader of claim 14 or 15, wherein, The third convex structure is a third bump formed by stamping.

17. The vapor chamber of claim 1, wherein, The first region near the side of the upper cover is covered with a first film, and the first film is provided with a plurality of first perforations.

18. The vapor chamber of claim 1, wherein, The second region near the side of the upper cover is covered with a second film, and the second film is provided with a plurality of second perforations.

19. The vapor chamber of claim 1, wherein, The third region near the side of the upper cover is covered with a third film, and the third film is provided with a plurality of third perforations.

20. The vapor chamber of claim 1, wherein, The first region near the side of the upper cover is covered with a first film, and the first film is provided with a plurality of first perforations; the second region near the side of the upper cover is covered with a second film, and the second film is provided with a plurality of second perforations; the third region near the side of the upper cover is covered with a third film, and the third film is provided with a plurality of third perforations; the open area ratio of the first film and the open area ratio of the second film are greater than or equal to the open area ratio of the third film; or, The first region near the side of the upper cover is covered with a first film, and the first film is provided with a plurality of first perforations; the third region near the side of the upper cover is covered with a third film, and the third film is provided with a plurality of third perforations; the open area ratio of the first film is greater than or equal to the open area ratio of the third film; or, The second region near the side of the upper cover is covered with a second film, and the second film is provided with a plurality of second perforations; the third region near the side of the upper cover is covered with a third film, and the third film is provided with a plurality of third perforations; the open area ratio of the second film is greater than or equal to the open area ratio of the third film.

21. The vapor chamber of claim 1, wherein, The distance between the first surface and the second surface along the thickness direction of the plate body is 0.005-0.025 mm.

22. The vapor chamber of claim 1, wherein, Two adjacent first convex structures protrude in opposite directions, and the distance between the end portions of two adjacent first convex structures away from each other along the thickness direction of the plate body is 0.03-0.6 mm.

23. The vapor chamber of claim 1, wherein, The first through hole is arranged in the first convex structure.

24. The vapor chamber of claim 1, wherein, The first through hole is arranged outside the first convex structure.

25. The vapor chamber of claim 1, wherein, The first area comprises a plurality of second protruding structures protruding along the thickness direction of the plate body and spaced from each other, and a plurality of second through holes penetrating through the plate body and arranged at intervals; the diameter of the second through holes is 0.01-0.08 mm.

26. The vapor chamber of claim 1, wherein, The first area comprises a plurality of second protruding structures protruding along the thickness direction of the plate body and spaced from each other, and a plurality of second through holes penetrating through the plate body and arranged at intervals; the pitch between two adjacent second through holes is 0.1-0.3 mm.

27. A method of manufacturing a vapor chamber for dissipating heat from a predetermined heat generating source, the method comprising the steps of: The preparation method of the uniform temperature plate comprises the following steps: ​ obtaining a plate body with oppositely arranged first and second surfaces; the plate body has a plurality of first areas, a plurality of second areas, and a third area between adjacent first and second areas; stamping the plate body so that all the first areas, all the second areas, and all the third areas have protruding structures protruding along the thickness direction of the plate body; punching the plate body so that all the first areas, all the second areas, and all the third areas have through holes penetrating therethrough; increasing the roughness of the outer surface of the plate body so that at least part of the outer surface of the plate body forms a rough surface; hydrophilic treatment of the plate body to make the surface of the plate body hydrophilic; cutting the plate body into the required shape to obtain a capillary structure; each capillary structure has one first area, one second area, and one third area integrally formed; assembling the upper cover, the lower cover, and the capillary structure so that the first area is close to the preset heat source; injecting a liquid working medium into the accommodation space formed by the upper cover and the lower cover to obtain the uniform temperature plate.

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