Boiling heat transfer enhanced cooling plate with complementary low guide holes and porous bodies and cooler

Abstract

The invention discloses a boiling heat transfer enhanced cooling plate with complementary low guide holes and porous bodies and a cooler. The cooling plate comprises a plate body and a porous body; a plurality of low guide holes are formed in one side, close to the heat transfer surface, in the plate body in parallel, and each low guide hole is filled with a material with the heat conductivity coefficient lower than that of the plate body in a sealed mode; a plurality of porous bodies are arranged on the heat transfer surface of the plate body, the plurality of porous bodies and the plurality of low guide holes are arranged in a one-to-one correspondence manner, and each porous body corresponds to at least partial length of the corresponding low guide hole. According to the embodiment of the invention, regional temperature distribution can be formed on the heat transfer surface, in combination with regional distribution of the porous body, nucleation points are increased under the condition of medium and low heat flux to realize boiling heat transfer enhancement, and the heat transfer efficiency is improved by conveying liquid among the surfaces of different temperature zones under the condition of high heat flux. Particularly, liquid is supplied from liquid stored in the porous body to the smooth surface of the high-heat-conductivity material area, so that the appearance of critical heat flux density points is delayed, boiling heat transfer is enhanced, and higher heat transfer efficiency is achieved.

Description

Technical Field

[0001] This application relates to the field of microdevice heat dissipation technology, and in particular to a boiling heat transfer enhanced cooling plate and cooler with complementary low-perforation and porous body. Background Technology

[0002] During the operation of various electronic and power components, heat generation is one of the key factors affecting their performance, lifespan, and reliability. With the continuous increase in device power density and integration, efficient heat dissipation has become a core requirement for ensuring stable system operation. The heat dissipation problem is particularly prominent under high heat flux density conditions, especially in power semiconductors, data center servers, electric vehicle drive systems, new energy power converters, and high-power communication equipment. Effective thermal management can not only prevent device overheating failure but also significantly improve overall energy efficiency and power cycle life.

[0003] The core challenges in heat dissipation for electronic / power components can be attributed to the extreme heat flux density caused by soaring device power density, and the bottlenecks encountered by traditional heat dissipation methods in terms of materials, interfaces, and structures. These are mainly manifested in: extreme heat flux density, reaching 500-1000 W / cm² or even higher in some chip areas, with heat accumulating vertically and being difficult to dissipate; material and interface thermal resistance, with poor thermal conductivity of the substrate material itself and high thermal resistance at the interfaces, and multiple layers of material between the chip and the cooler, each interface being a thermal bottleneck; and structural limitations and reliability, with miniaturization of packaging and space constraints preventing the use of traditional air cooling and large coolers, and high heat flux and temperature fluctuations causing mismatched material expansion, leading to warping and delamination.

[0004] Boiling heat transfer, as a highly efficient phase-change heat transfer method, can achieve extremely high heat flux transport per unit area, helping to improve energy utilization efficiency and reduce energy consumption. Simultaneously, the lower wall temperature helps mitigate structural damage caused by thermal stress, thereby extending lifespan and reducing costs. Therefore, boiling heat transfer technology has significant application prospects in the field of electronic cooling. By increasing the critical heat flux (CHF) and heat transfer coefficient of the boiling process, the heat dissipation capacity of the cooling system can be significantly enhanced, thus adapting to higher power operating conditions while reducing the temperature gradient at the thermal interface. Furthermore, combined with advanced surface structure design, functional thermally conductive materials, and microchannel technologies, boiling heat transfer solutions are developing towards integration, miniaturization, and systematization to meet the higher heat dissipation performance requirements of future electronic components under complex industrial environments and extreme thermal loads.

[0005] However, during boiling heat transfer, when the heat flux density exceeds the critical heat flux density, the heat transfer mechanism transforms from nucleation boiling to film boiling. The heat transfer surface is covered by a gas film, leading to deteriorated heat transfer and a sharp rise in temperature, which may even burn out the heat transfer equipment. Therefore, there is an urgent need for a cooler that can increase the critical heat flux density and has higher heat transfer efficiency to meet the rapidly growing heat dissipation requirements of electronic components. Summary of the Invention

[0006] To address at least one of the problems mentioned in the background art, embodiments of this application provide a boiling heat transfer enhanced cooling plate and cooler that complements low-permeability and porous bodies. By cooling and dissipating heat from electronic / electrical components through boiling heat transfer, regional temperature distributions can be formed on the heat transfer surface. Combined with the regional distribution of porous bodies, nucleation points are increased under medium-to-low heat flux density conditions to enhance boiling heat transfer. Under high heat flux density conditions, liquid is transported between surfaces of different temperature zones, particularly from liquid stored in low-temperature porous bodies to the smooth surface of high-thermal-conductivity material regions at high temperatures. This delays the appearance of the critical heat flux density point, enhances the boiling heat transfer effect, effectively increases the critical heat flux density, and allows for sufficient heat exchange with the outside environment, resulting in higher heat transfer efficiency.

[0007] To achieve the above objectives, the first aspect of this application provides a boiling heat transfer enhanced cooling plate that combines low-perforation and porous bodies, including a plate body and a porous body. Multiple low-temperature guide holes are uniformly opened inside the plate near the heat transfer surface. The multiple low-temperature guide holes are distributed along a plane parallel to the heat transfer surface and are arranged in parallel with each other. Each low-temperature guide hole is sealed and filled with a material with a thermal conductivity lower than that of the plate. The heat transfer surface of the plate is provided with a plurality of porous bodies, which are made of porous material. The plurality of porous bodies are arranged in a one-to-one correspondence with a plurality of low-conductivity holes, and each porous body corresponds to at least a portion of the length of the corresponding low-conductivity hole.

[0008] In one feasible implementation, the ratio between the distance between the center of the low-profile orifice and the heat transfer surface and the thickness of the plate is in the range of 1:4≤K. h <1:2.

[0009] In one feasible implementation, the cross-sectional shape of the low-profile guide hole includes a circle or a rectangle; The ratio between the equivalent diameter of the low-profile via and the thickness of the plate is in the range of 0.4:2.0≤K. t ≤0.3:0.9; The center distance between adjacent low-profile guide holes is in the range of 0.9 ≤ A ≤ 10 mm.

[0010] In one feasible implementation, the filling material within the low-profile orifice includes air or polytetrafluoroethylene; The porous material includes metal foam or metal sintered body; The plate is made of copper.

[0011] In one feasible implementation, the low-profile via is prepared by wire cutting, and the porous body is bonded to the surface of the plate.

[0012] In one feasible implementation, additional low-profile vias and additional porous bodies are also included; Multiple additional low-conducting holes are uniformly formed within the distribution plane where the low-conducting holes are located. The multiple additional low-conducting holes are arranged in parallel to each other, and the additional low-conducting holes intersect and connect with the low-conducting holes. Each additional low-conducting hole is sealed and filled with a material whose thermal conductivity is lower than that of the plate. The heat transfer surface of the plate is also provided with a plurality of additional porous bodies, which are made of porous material. The plurality of additional porous bodies are arranged one-to-one with a plurality of additional low-conductivity holes, and the additional porous bodies intersect and connect with the porous bodies. Each additional porous body corresponds to at least a portion of the length of the corresponding additional low-conductivity hole.

[0013] The second aspect of this application provides a boiling heat transfer enhanced cooler that is complementary to low-perforation and porous bodies, including the aforementioned boiling heat transfer enhanced cooling plate that is complementary to low-perforation and porous bodies, and also includes a side plate and a packaging base plate. The heat-receiving surface of the cooling plate is used to house the heat source. The heat transfer surface, side plate, and encapsulation base plate of the cooling plate form a flow channel space for the coolant to flow. Along the length direction, the first end of one side plate is provided with a liquid inlet, and the second end of the other side plate is provided with a liquid outlet. The first end and the second end are the two ends of the length direction of the cooling plate.

[0014] In one feasible implementation, the cooler is used to dissipate heat from multiple power semiconductor modules. Thermal grease is filled between the power semiconductor modules and the heated surfaces of the cooling plate. A partition is provided between adjacent power semiconductor modules on the heat transfer surfaces of the cooling plate. The partition connects the heat transfer surfaces and the inner surfaces of the packaging base plate respectively and divides the flow channel space into interconnected meandering channels.

[0015] The third aspect of this application provides another low-perforation and porous body complementary boiling heat transfer enhanced cooler, including the above-mentioned low-perforation and porous body complementary boiling heat transfer enhanced cooling plate, and further including a cooling cavity for circulating coolant. The heated surface of the cooling plate is used to house the heat source, and both the heat source and the cooling plate are located inside the cooling cavity.

[0016] In one feasible implementation, the cooler is used to dissipate heat from at least one power semiconductor module, wherein cooling plates are provided on both opposite heat flow sides of the power semiconductor module, and thermal grease is filled between the cooling plates and the power semiconductor module.

[0017] The boiling heat transfer enhanced cooling plate with complementary low-permeability holes and porous bodies provided in this application includes a plate body and a porous body. Multiple low-permeability holes are uniformly formed inside the plate body near the heat transfer surface. These holes are sealed and filled with a material whose thermal conductivity is lower than that of the plate body, forming a cooling plate with non-uniform thermal conductivity. Porous bodies are formed on the surface of the plate body away from the heat source heat flow, corresponding to the low-permeability holes (i.e., the region of the heat transfer surface with a relatively low temperature), forming a porous cooling plate with non-uniform thermal conductivity.

[0018] After the cooling plate comes into contact with the heat source, due to the different thermally conductive materials distributed inside the cooling plate, the heat transfer surface will form an alternating pattern of high and low temperatures. The high thermal conductivity material area (plate material area) exhibits a higher surface temperature and more active boiling behavior due to its superior heat transfer capacity, while the low thermal conductivity area (low porosity area) relies on lateral heat transfer, resulting in a lower temperature and weaker boiling. When the temperature reaches the critical point, the boiling intensity reverses: bubbles merge to form large bubble clusters covering the high thermal conductivity material area of ​​the heat transfer surface, and the high thermal conductivity area dries up first, while the nucleation boiling region formed by the low thermal conductivity area and the porous body remains moist and continues to generate bubbles. Irregular bubble movement promotes the diffusion of liquid phase from the nucleation boiling region to the high thermal conductivity region, triggering intermittent and intense boiling phenomena. In this way, by enhancing interface renewal, the critical heat flux density and heat transfer efficiency are effectively improved, thus increasing the heat exchange efficiency of the cooling plate.

[0019] Porous materials have the characteristics of increasing boiling nucleation points and water absorption / retention capacity. Utilizing the water absorption effect of porous materials, even if large bubbles form and completely cover the high thermal conductivity material region, the nucleation boiling region still has sufficient liquid retention capacity. This avoids the cooling failure caused by the formation of large bubbles on the heat transfer surface without porous materials, where the entire heat transfer surface is easily covered, and the coolant on the surface of the low thermal conductivity region may be completely pushed away during the formation of large bubbles.

[0020] The boiling heat transfer enhanced cooling plate with complementary low-permeability and porous structure provided in this application exhibits uneven boiling on its heat transfer surface after contact with a heat source. Under medium-low heat flux density conditions (below 50% of the critical heat flux density), the area with the porous structure adheres preferentially boils; under high heat flux density conditions (above 50% of the critical heat flux density), a certain amount of liquid is retained within the porous structure, which can be transported to the adjacent high-temperature metal surface without the porous structure. Both of these effects enhance heat transfer under different heat flux density conditions of boiling heat transfer. Therefore, the alternating distribution of thermal conductivity caused by the spaced porous structure and the low permeability complement each other, further enhancing the boiling heat transfer capability. Compared with traditional cooling plates made of pure high thermal conductivity materials, the heat transfer efficiency of this application embodiment is significantly improved.

[0021] The boiling heat transfer enhanced cooler with low-perforation and porous body complementarity provided in this application embodiment includes the above-mentioned boiling heat transfer enhanced cooling plate with low-perforation and porous body complementarity, and forms a flow channel type or immersion type cooler, which has the same beneficial effects.

[0022] This application embodiment prepares a plate with alternating thermal conductivity distribution, and combines this with the bonding of porous bodies in low thermal conductivity regions to prepare a non-uniform thermal conductivity porous cooling plate and cooler. This enables the heat transfer surface to form a regional temperature distribution. Combined with the regional distribution of the porous bodies, it increases nucleation points under medium and low heat flux density conditions to enhance boiling heat transfer. Under high heat flux density conditions, it realizes the transport of liquid between surfaces in different temperature zones, especially the supply of liquid stored in the low-temperature porous bodies to the smooth surface of the high-temperature high thermal conductivity material region. This delays the appearance of the critical heat flux density point, enhances the boiling heat transfer effect, effectively increases the critical heat flux density, and allows for sufficient heat exchange with the outside environment, resulting in higher heat transfer efficiency. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the structure of a boiling heat transfer enhancement cooling plate that complements low-perforation and porous bodies, provided in an embodiment of this application. Figure 2 A front view of a boiling heat transfer enhanced cooling plate with complementary low-perforation and porous body provided in an embodiment of this application; Figure 3 A schematic diagram of a boiling heat transfer enhanced cooler that combines low-perforation and porous body structures, provided for an embodiment of this application; Figure 4 A front view of a low-profile and porous body complementary boiling heat transfer enhanced cooler provided in an embodiment of this application; Figure 5 A schematic diagram of the cooling plate portion of a boiling heat transfer enhancement cooler that combines low-perforation and porous bodies in an embodiment of this application. Figure 6 A front view of the cooling plate portion of a low-profile and porous body complementary boiling heat transfer enhanced cooler provided in an embodiment of this application; Figure 7 A schematic diagram of the first angle structure of another low-profile and porous body complementary boiling heat transfer enhanced cooler provided in an embodiment of this application; Figure 8A second-angle structural schematic diagram of another low-profile and porous body complementary boiling heat transfer enhanced cooler provided in an embodiment of this application.

[0025] Explanation of reference numerals in the attached figures: 100 - Cooling plate; 110 - Plate body; 111 - Low-profile guide hole; 112 - Heat transfer surface; 113 - Heated surface; 120-porous body; 200 - Cooler; 201 - Flow channel space; 211-Side panel; 212-Encapsulation base plate; 213-Partition; 221 - Cooling cavity; 300-Power Semiconductor Module; 310 - Thermal grease. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. It is worth noting that the embodiments described in the accompanying drawings are only some embodiments of this application, and not all embodiments. That is, the embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0027] The following will combine Figures 1-2 The boiling heat transfer enhancement cooling plate with complementary low-perforation and porous body provided in the embodiments of this application will be described.

[0028] This application provides a boiling heat transfer enhanced cooling plate 100 with complementary low-perforation and porous body structures, such as... Figure 1 and Figure 2 As shown, it includes a plate 110 and a porous body 120.

[0029] Multiple low-level guide holes 111 are evenly provided inside the plate 110 on the side near the heat transfer surface 112. The multiple low-level guide holes 111 are distributed along a plane parallel to the heat transfer surface 112 and are arranged in parallel with each other. Each low-level guide hole 111 is sealed and filled with a material with a thermal conductivity lower than that of the plate 110.

[0030] Multiple porous bodies 120 are provided on the heat transfer surface 112 of the plate 110. The porous bodies 120 are made of porous material. The multiple porous bodies 120 are arranged in a one-to-one correspondence with multiple low-conductivity holes 111. Each porous body 120 corresponds to at least a portion of the length of the corresponding low-conductivity hole 111.

[0031] The side of the plate 110 closest to the heat source (heat-generating component) is the heated surface 113, and the side furthest from the heat source and closest to the cold source (coolant) is the heat transfer surface 112.

[0032] The low-level guide hole 111 can be a through hole penetrating the plate 110. The material inside the low-level guide hole 111 can be liquid, gas, or solid. When the material inside the low-level guide hole 111 is gas or liquid, plugs can be installed at both ends of the low-level guide hole 111. Furthermore, it is understood that the area of ​​the heated surface 113 is usually larger than the area of ​​the heat flow surface of the heat source, and the plugs are located in the edge region of the heated surface 113, so the installation of the plugs has virtually no impact on the overall heat transfer effect.

[0033] The porous body 120 can be rectangular or trapezoidal strips. One side of the porous body 120 is bonded to the heat transfer surface 112, and the width of this bonded side is equal to the maximum dimension (such as diameter or width) of the low-level guide hole 111 in the corresponding direction. The distribution position of the porous body 120 can correspond only to the position of the heat source on the heat transfer surface 112. For example, if the heat source is centrally located on the heat transfer surface 112, the porous body 120 is located in the middle part of the corresponding low-level guide hole 111 along its length. Alternatively, the distribution position of the porous body 120 can correspond to the entire length of the low-level guide hole 111, in which case the position of the heat source is relatively freely distributed.

[0034] The boiling heat transfer enhanced cooling plate 100 with complementary low-permeability and porous body provided in this application embodiment includes a plate body 110 and a porous body 120. Multiple low-permeability holes 111 are uniformly formed inside the plate body 110 near the heat transfer surface 112. The low-permeability holes 111 are sealed and filled with a material whose thermal conductivity is lower than that of the plate body 110, forming a cooling plate with non-uniform thermal conductivity. The porous body 120 is provided on the surface of the plate body 110 away from the heat source, corresponding to the low-permeability holes 111, i.e., the relatively low temperature region of the heat transfer surface 112, forming a porous cooling plate with non-uniform thermal conductivity.

[0035] After the cooling plate 100 comes into contact with the heat source, due to the different thermally conductive materials distributed inside the cooling plate 100, the heat transfer surface 112 will form an alternating pattern of high and low temperatures. The high thermal conductivity material area (plate material area) exhibits a higher surface temperature and more active boiling behavior due to its superior heat transfer capacity, while the low thermal conductivity area (low porosity area) relies on lateral heat transfer, resulting in a lower temperature and weaker boiling. When the temperature reaches the critical point, the boiling intensity reverses: bubbles merge to form large bubble groups that cover the high thermal conductivity material area of ​​the heat transfer surface 112. The high thermal conductivity area dries up first, while the nucleation boiling region formed by the low thermal conductivity area and the porous body 120 remains moist and continues to generate bubbles. Irregular bubble movement causes the liquid phase in the nucleation boiling region to diffuse towards the high thermal conductivity area, triggering intermittent and intense boiling phenomena. In this way, by strengthening interface renewal, the critical heat flux density and heat transfer efficiency are effectively improved, thereby increasing the heat exchange efficiency of the cooling plate 100.

[0036] The porous body 120 material has the characteristics of increasing boiling nucleation points and water absorption / retention capacity. Utilizing the water absorption effect of the porous body 120, even if large bubbles form and completely cover the high thermal conductivity material region, the nucleation boiling region still has sufficient liquid retention capacity. This avoids the cooling failure caused by the formation of large bubbles on the heat transfer surface 112 due to the absence of the porous body 120, where the entire heat transfer surface 112 is easily covered, and the coolant on the surface of the low thermal conductivity region may be completely pushed away during the formation of large bubbles.

[0037] The boiling heat transfer enhanced cooling plate 100 with complementary low-permeability and porous structure provided in this application embodiment exhibits uneven boiling on its heat transfer surface 112 after contacting a heat source. Under medium-low heat flux density conditions (below 50% of the critical heat flux density), the region with the porous structure 120 attached preferentially boils; under high heat flux density conditions (above 50% of the critical heat flux density), a certain amount of liquid is retained within the porous structure 120, which can be transported to the adjacent high-temperature metal surface without the porous structure 120 attached. Both of these effects enhance heat transfer under different heat flux density conditions of boiling heat transfer. Therefore, the alternating thermal conductivity distribution caused by the spaced-apart porous structure 120 and the low-permeability 111 complements each other, further enhancing the boiling heat transfer capability. Compared with the conventional cooling plate 100 made of pure high thermal conductivity material, the heat transfer efficiency of this application embodiment is significantly improved.

[0038] This application embodiment prepares a plate 110 with alternating thermal conductivity distribution, and combines it with a porous body 120 bonded in a low thermal conductivity region to prepare a non-uniform thermal conductivity porous cooling plate 100. This enables the heat transfer surface to form a regional temperature distribution. Combined with the regional distribution of the porous body 120, it increases nucleation points under medium and low heat flux density conditions to enhance boiling heat transfer. Under high heat flux density conditions, it realizes the transport of liquid between surfaces of different temperature zones, especially the supply of liquid stored in the low-temperature porous body 120 to the smooth surface of the high-temperature high thermal conductivity material region. This delays the appearance of the critical heat flux density point, enhances the boiling heat transfer effect, effectively increases the critical heat flux density, and allows for sufficient heat exchange with the outside environment, resulting in higher heat transfer efficiency.

[0039] In one feasible implementation, the ratio between the distance between the center of the low-profile orifice 111 and the heat transfer surface 112 and the thickness of the plate 110 is in the range of 1:4≤K. h <1:2.

[0040] In this way, the low-profile guide hole 111 can be set close to the heat transfer surface 112 according to actual needs, which makes it easier to form a more obvious high and low temperature alternating distribution pattern on the heat transfer surface 112 and enhance the heat transfer effect.

[0041] In one possible implementation, the cross-sectional shape of the low-profile via 111 includes a circle or a rectangle.

[0042] The ratio between the equivalent diameter of the low-profile guide hole 111 and the thickness of the plate 110 is in the range of 0.4:2.0≤K. t ≤0.3:0.9.

[0043] The center distance between adjacent low guide holes 111 is 0.9≤A≤10mm.

[0044] In this way, the area and density of the high and low temperature distribution can be adjusted according to the heat flux density of the heat source, thereby adapting to cooling requirements. It is understood that compared to heat sources with lower heat flux densities (such as water as the cooling medium and below 50 W / cm² at atmospheric pressure), heat sources with higher heat flux densities (such as exceeding 50 W / cm², or even as high as 500-1000 W / cm²) require smaller apertures and denser distribution of the low-temperature guide holes 111. In this embodiment, the plate 110 has a thickness of 0.9 mm, the diameter of the low-temperature guide holes 111 is 0.3 mm, the bonding side width of the porous body 120 is 0.3 mm, and the center-to-center distance between adjacent low-temperature guide holes 111 is 1.1 mm.

[0045] In one feasible implementation, the filling material within the low-profile orifice 111 includes air or polytetrafluoroethylene.

[0046] Porous materials include metal foams or sintered metal bodies.

[0047] The material of plate 110 includes copper.

[0048] The thermal conductivity of air is 0.026 W / (m·K), that of polytetrafluoroethylene is 0.3 W / (m·K), and that of copper is 385 W / (m·K). By utilizing the large difference in thermal conductivity between air or polytetrafluoroethylene and copper, the temperature difference in the high and low temperature distribution pattern can be further increased.

[0049] Metal foams or sintered metal bodies have good boiling nucleation points and water absorption / storage properties, so that even if large bubbles form and completely cover the nucleation boiling region, the nucleation boiling region still has sufficient liquid retention capacity.

[0050] In one feasible implementation, the low-profile via 111 is prepared by wire cutting, and the porous body 120 is bonded to the surface of the plate 110.

[0051] This allows for the fabrication of low-profile guide holes 111 with different cross-sectional shapes and sizes via wire cutting, and the bonding of porous bodies 120 of different sizes and lengths to meet different cooling requirements.

[0052] In one possible implementation, the cooling plate 100 further includes additional low-profile guide holes (not shown) and additional porous bodies (not shown).

[0053] Multiple additional low-conducting holes are uniformly opened in the distribution plane where the low-conducting hole 111 is located. The multiple additional low-conducting holes are arranged in parallel to each other, and the additional low-conducting holes intersect and connect with the low-conducting hole 111. Each additional low-conducting hole is sealed and filled with a material with a thermal conductivity lower than that of the plate.

[0054] The heat transfer surface 112 of the plate 110 is also provided with a plurality of additional porous bodies. The additional porous bodies are made of porous material. The plurality of additional porous bodies are provided in a one-to-one correspondence with a plurality of additional low-conductivity holes. The additional porous bodies intersect and connect with the porous body 120. Each additional porous body corresponds to at least a portion of the length of the corresponding additional low-conductivity hole 111.

[0055] The low-level guide hole 111 and the additional low-level guide hole can intersect perpendicularly, thereby forming a crisscross structure inside the plate. The corresponding porous body 120 and the additional porous body also form a crisscross arrangement. In some embodiments, the low-level guide hole 111 and the additional low-level guide hole, and the porous body 120 and the additional porous body can also be arranged to intersect non-perpendicularly.

[0056] In this way, the surface of the high thermal conductivity material region can be further divided by adding porous bodies to form a grid structure, which avoids large bubbles forming a large area coverage in the corresponding area, enhances the boiling heat transfer effect, and improves heat exchange efficiency.

[0057] The following will combine Figures 3-6 An embodiment of this application will be described to illustrate a boiling heat transfer enhanced cooler 200 that combines low-permeability and porous body.

[0058] A second aspect of this application provides a boiling heat transfer enhanced cooler 200 that combines low-permeability and porous body structures, such as... Figures 3-4 As shown, the cooling plate 100, which includes the aforementioned low-profile and porous body complementary boiling heat transfer enhancement cooling plate, also includes a side plate 211 and an encapsulation base plate 212.

[0059] The heat-receiving surface 113 of the cooling plate 100 is used to house a heat source. The heat transfer surface 112 of the cooling plate 100, the side plate 211, and the encapsulation base plate 212 form a flow channel space 201 for the flow of coolant. Along the length direction, the first end of one side plate 211 is provided with a liquid inlet, and the second end of the other side plate 211 is provided with a liquid outlet. The first end and the second end are the two ends in the length direction of the cooler 200.

[0060] The side plate 211 can be welded between the cooling plate 100 and the encapsulation base plate 212; the side plate 211 can also be integrally connected to the cooling plate 100 or the encapsulation base plate 212; the side plate 211 can also be divided into an upper side plate and a lower side plate, with the upper side plate integrally connected to the cooling plate 100 and the lower side plate integrally connected to the encapsulation base plate 212. In short, it is preferable to facilitate the fabrication and the provision of inlet and outlet ports. The inlet and outlet ports can be connected to a coolant source and a drive pump can be installed on the connecting pipeline. This part is prior art and will not be elaborated further.

[0061] The boiling heat transfer enhanced cooler 200 provided in this application embodiment, which is a complementary low-perforation and porous body, includes the boiling heat transfer enhanced cooler plate 100 described above. By improving the structure of the interior of the cooler plate 100 and the heat transfer surface 112 and forming a flow channel cooler 200, heat dissipation and cooling are performed on the heat source located above the flow channel space 201 and on the heat receiving surface 113, and it has the same beneficial effects as the cooler plate 100.

[0062] In one feasible implementation, such as Figures 3-6 As shown, the cooler 200 is used to dissipate heat from multiple power semiconductor modules 300. Thermal grease 310 is filled between the power semiconductor module 300 and the heat-receiving surface 113 of the cooling plate 100. A partition 213 is provided between the heat transfer surface 112 of the cooling plate 100 and adjacent power semiconductor modules 300. The partition 213 is connected between the heat transfer surface 112 and the inner surface of the packaging base plate 212, and divides the flow channel space 201 into a connected meandering channel.

[0063] Among them, the power semiconductor module 300 is a semiconductor integrated module used in high voltage and high current scenarios, which may include IGBT modules, MOSFET modules, SiC modules, etc.

[0064] The meandering channel can increase the flow length of the coolant, increase the contact time between the coolant and the heat transfer surface 112, and improve the heat exchange effect.

[0065] The following will combine Figures 7-8 Another type of boiling heat transfer enhanced cooler 200 with complementary low-permeability and porous body provided in the embodiments of this application will be described.

[0066] This application provides another type of cooler 200 with complementary low-permeability and porous body, such as... Figure 7 and Figure 8 As shown, the cooling plate 100, which includes the aforementioned low-profile and porous body complementary boiling heat transfer enhancement cooling plate, also includes a cooling cavity 221 for circulating coolant.

[0067] The heating surface 113 of the cooling plate 100 is used to house the heat source, and both the heat source and the cooling plate 100 are located inside the cooling cavity 221.

[0068] Currently, immersion liquid cooling technology based on insulating working fluids involves directly immersing heat-generating electronic / electrical components in a highly insulating, low-boiling-point liquid working fluid. The phase change boiling process occurring on the device surface of the working fluid efficiently removes heat. Due to the excellent dielectric properties of the working fluid, it achieves extreme heat dissipation while ensuring the electrical safety of the circuit and avoiding the risk of short circuits.

[0069] Currently, the core research direction of this technology is to optimize the physical properties of the working fluid (such as thermal conductivity and specific heat capacity), design and construct micro-nano structures on the surface of components to enhance bubble nucleation and decomposition, and explore new environmentally friendly and highly stable insulating working fluids, aiming to continuously improve the critical heat flux density and heat transfer efficiency of the system, thereby meeting the needs of future high power density devices.

[0070] The boiling heat transfer enhanced cooler 200 with low-perforation and porous body complementation provided in this application embodiment includes the boiling heat transfer enhanced cooling plate 100 with low-perforation and porous body complementation. By improving the structure of the interior of the cooling plate 100 and the heat transfer surface 112 and forming an immersion cooler 200, heat dissipation and cooling are performed on the heat source located in the cooling cavity 221 and on the heat receiving surface 113, which has the same beneficial effect as the cooling plate 100.

[0071] in, Figure 7 and Figure 8 Only a portion of the cooling chamber 221 is shown. In practice, the cooling chamber 221 can be designed similarly to a pipe, with both the heat source and the cooling plate 100 located inside. An inlet and an outlet are respectively located at both ends of the cooling chamber 221, and a flow channel space 201 is formed inside the cooling chamber 221. This part can be referenced from the structure of existing technologies.

[0072] In one feasible implementation, such as Figure 7 and Figure 8 As shown, the cooler 200 is used to dissipate heat from at least one power semiconductor module 300. Cooling plates 100 are provided on both opposite heat flow sides of the power semiconductor module 300, and thermal grease 310 is filled between the cooling plates 100 and the power semiconductor module 300.

[0073] The power semiconductor module 300 can be fixed in the cooling cavity 221 on its side. Cooling plates 100 are provided on the upper and lower surfaces of the power semiconductor module 300 to cool it through heat dissipation from both sides, thereby further improving the heat exchange effect.

[0074] It should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" in the description of this application should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0075] The terms “upper,” “lower,” “front,” “back,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0076] The term "multiple" means two or more, unless otherwise specified precisely.

[0077] The terms “first,” “second,” “third,” “fourth,” etc., (if applicable) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can include implementations in sequences other than those illustrated or described herein.

[0078] The terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A cooling plate with complementary low-permeability and porous structure for enhanced boiling heat transfer, characterized in that, Includes plate-like structures and porous structures; Multiple low-temperature guide holes are uniformly opened inside the plate near the heat transfer surface. The multiple low-temperature guide holes are distributed along a plane parallel to the heat transfer surface and are arranged in parallel with each other. Each low-temperature guide hole is sealed and filled with a material with a thermal conductivity lower than that of the plate. The heat transfer surface of the plate is provided with a plurality of porous bodies, which are made of porous material. The plurality of porous bodies are arranged in a one-to-one correspondence with a plurality of low-conductivity holes, and each porous body corresponds to at least a portion of the length of the corresponding low-conductivity hole.

2. The boiling heat transfer enhanced cooling plate with complementary low-perforation and porous body according to claim 1, characterized in that, The ratio between the distance between the center of the low-conducting hole and the heat transfer surface and the thickness of the plate body is in the range of 1:4≤K h <1:

2.

3. The boiling heat transfer enhanced cooling plate with complementary low-perforation and porous body as described in claim 1, characterized in that, The cross-sectional shape of the low-profile guide hole includes a circle or a rectangle; The ratio between the equivalent diameter of the low-profile via and the thickness of the plate is in the range of 0.4:2.0≤K. t ≤0.3:0.9; The center distance between adjacent low-profile guide holes is in the range of 0.9 ≤ A ≤ 10 mm.

4. The boiling heat transfer enhanced cooling plate with complementary low-perforation and porous body according to claim 1, characterized in that, The filling material in the low-profile orifice includes air or polytetrafluoroethylene; The porous material includes metal foam or metal sintered body; The plate is made of copper.

5. The boiling heat transfer enhanced cooling plate with complementary low-permeability and porous body according to any one of claims 1-4, characterized in that, The low-profile guide hole is prepared by wire cutting, and the porous body is attached to the surface of the plate.

6. The boiling heat transfer enhanced cooling plate with complementary low-permeability and porous body according to any one of claims 1-4, characterized in that, It also includes additional low-profile guide holes and additional porous bodies; Multiple additional low-conducting holes are uniformly formed within the distribution plane where the low-conducting holes are located. The multiple additional low-conducting holes are arranged in parallel to each other, and the additional low-conducting holes intersect and connect with the low-conducting holes. Each additional low-conducting hole is sealed and filled with a material whose thermal conductivity is lower than that of the plate. The heat transfer surface of the plate is also provided with a plurality of additional porous bodies, which are made of porous material. The plurality of additional porous bodies are arranged one-to-one with a plurality of additional low-conductivity holes, and the additional porous bodies intersect and connect with the porous bodies. Each additional porous body corresponds to at least a portion of the length of the corresponding additional low-conductivity hole.

7. A boil-up heat transfer enhanced cooler that combines low-permeability and porous body, characterized in that, The cooling plate with low borehole and porous body complementarity as described in any one of claims 1-6, further includes a side plate and a packaging base plate. The heat-receiving surface of the cooling plate is used to house the heat source. The heat transfer surface, side plate, and encapsulation base plate of the cooling plate form a flow channel space for the coolant to flow. Along the length direction, the first end of one side plate is provided with a liquid inlet, and the second end of the other side plate is provided with a liquid outlet. The first end and the second end are the two ends of the length direction of the cooling plate.

8. The low-permeability and porous body complementary boiling heat transfer enhanced cooler according to claim 7, characterized in that, The cooler is used to dissipate heat from multiple power semiconductor modules. Thermal grease is filled between the power semiconductor modules and the heated surfaces of the cooling plate. The heat transfer surfaces of the cooling plate are separated from adjacent power semiconductor modules. The separated surfaces are connected to the inner surfaces of the packaging base plate and divide the flow channel space into interconnected meandering channels.

9. A boil-up heat transfer enhanced cooler that combines low-permeability and porous body, characterized in that, The cooling plate, which is a complementary boiling heat transfer enhancement cooling plate with low bore and porous body as described in any one of claims 1-6, further includes a cooling cavity for circulating coolant. The heated surface of the cooling plate is used to house the heat source, and both the heat source and the cooling plate are located inside the cooling cavity.

10. The low-profile and porous body complementary boiling heat transfer enhanced cooler according to claim 9, characterized in that, The cooler is used to dissipate heat from at least one power semiconductor module. Cooling plates are provided on both opposite heat flow sides of the power semiconductor module, and thermal grease is filled between the cooling plates and the power semiconductor module.

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