Liquid cooling heat dissipation system based on double-circulation dynamic switching and control method

Abstract

The invention relates to a liquid cooling heat dissipation system based on double-circulation dynamic switching and a control method, and belongs to the technical field of data center heat dissipation. The liquid cooling heat dissipation system comprises a server cabinet, an indoor CDU and an outdoor heat dissipation unit; the outdoor composite heat dissipation unit comprises a multi-channel condenser; the multi-channel condenser is provided with a plurality of independent flow channels, and the independent flow channels are opened or closed according to different temperatures. According to the invention, through innovative pipeline architecture and thermal path design, collaborative optimization of heat dissipation efficiency and space utilization rate of the high-density data cabinet is realized. The system adopts a graded tandem type heat transfer mode, chip-level high-heat-flux heat dissipation and cabinet-level low-grade waste heat recovery are integrated into the same circulating system, meanwhile, the heat dissipation requirements of different seasons and external temperatures are met through dynamic flow path switching of an outdoor module, the energy efficiency is remarkably improved, and equipment redundancy is reduced.

Description

Technical Field

[0001] This invention relates to the field of data center heat dissipation technology, and discloses a liquid cooling heat dissipation system and control method based on dual-cycle dynamic switching. Targeting the heat dissipation needs of high-power-density server racks in compact computer rooms, the system achieves precise heat dissipation at the chip level through intelligent coordinated control of liquid cooling and air cooling, while supporting higher-density server deployment and meeting the dual requirements of modular data centers for space efficiency and heat dissipation stability. Background Technology

[0002] As data center power density continues to rise, advanced heat dissipation technology has become crucial for ensuring stable operation. Currently, single-phase direct liquid cooling technology for high heat flux density chips and backplane heat exchanger technology for handling waste heat within the server rack are two mainstream and efficient solutions in the industry.

[0003] Chip-level liquid cooling systems can precisely and efficiently remove high-grade heat (typically in the 60-80°C range) generated by chips, while air-cooled backplane heat exchangers effectively absorb low-grade heat (typically in the 30-40°C range) exhausted from the server rack. Combining these two technologies to handle different levels and grades of heat is a recognized advanced heat dissipation strategy in the industry, representing a significant improvement in heat dissipation efficiency compared to traditional data center air conditioning solutions.

[0004] In mainstream engineering practice, to ensure system stability and controllability, chip cold plate circulation and rack backplane circulation are typically designed as two functionally independent and physically separated subsystems. This separated architecture aims to maximize modularity and independent controllability. Each thermal management loop can be independently optimized and deployed for its specific operating temperature range without interference, thus ensuring extremely high operational safety, stability, and reliability for the entire system. This architecture is a mature and effective deployment model in many data center scenarios.

[0005] To adapt to different seasonal environmental conditions, data center cooling systems often require both mechanical cooling (such as vapor compression refrigeration cycles) and natural cooling modes. In traditional solutions, these two functional modes usually correspond to independent, dedicated outdoor cooling devices (such as chiller units and dry coolers). While this ensures design simplicity, it also further increases the equipment's footprint and investment costs.

[0006] Meanwhile, as data centers evolve towards higher deployment density, extreme energy efficiency, and deeper intelligent operation and maintenance, the industry has begun to focus on and explore new system forms that differ from traditional discrete architectures. Against this backdrop, an innovative technical concept has been proposed: could the two originally independent liquid cooling circuits be integrated and coupled through a redesign of the system topology to explore a new, highly integrated thermal management model?

[0007] To address the aforementioned issues, this invention proposes a novel coupled heat dissipation system based on heat grade classification. By reconstructing the refrigerant flow path topology, the chip cold plate and the cabinet backplane circulation loop are integrated into a single-loop architecture, and a dynamic thermal regulation mechanism is introduced. This achieves efficient recovery of low-grade waste heat and intensive deployment of outdoor equipment while ensuring chip temperature control accuracy. Summary of the Invention

[0008] In view of the above problems, this invention provides a liquid cooling system and control method based on dual-cycle dynamic switching. Through innovative piping architecture and thermal path design, this invention achieves synergistic optimization of heat dissipation efficiency and space utilization in high-density data cabinets. The system adopts a hierarchical series heat transfer mode, integrating chip-level high heat flux density heat dissipation and cabinet-level low-grade waste heat recovery into the same circulation system. Simultaneously, by dynamically switching the flow path of the outdoor module, it adapts to the heat dissipation requirements of different seasons and ambient temperatures, significantly improving energy efficiency and reducing equipment redundancy.

[0009] The present invention provides a liquid cooling heat dissipation system based on dual-cycle dynamic switching, including server rack 101, indoor CDU 201 and outdoor heat dissipation unit 301; The indoor server rack 101 includes a server cooling module and a rack back panel 103; The indoor CDU 201 includes a first heat exchanger 202 and a CDU storage tank 203; the first heat exchanger 202 includes a hot side and a cold side; the CDU storage tank 203 is connected to the hot side of the first heat exchanger 202; The outdoor composite heat dissipation unit 301 includes a multi-channel condenser 303, a second heat exchanger 305, a refrigerator 308, and an outdoor liquid storage tank 309; the second heat exchanger 305 includes a hot side and a cold side; the outdoor liquid storage tank 309 is located on the hot side of the second heat exchanger 305. The server cooling module 104 is connected to the hot side of the first heat exchanger 202 and forms a loop through the CDU storage tank 203; The cabinet back panel 103 is connected to the cold side of the first heat exchanger 202, forming a loop through the outdoor heat dissipation unit 301; The two-phase outlet end of the cabinet back panel 103 can be switched to be connected to the multi-channel condenser 303 or the second heat exchanger 305; The hot side outlet A316 of the multi-channel condenser 303 is connected to the cold side of the first heat exchanger 202; The multi-channel condenser 303 has multiple independent flow channels, which can be opened or closed according to different temperatures.

[0010] Optionally, two independent flow channels are provided. The first flow channel is used in winter mode (low-temperature natural cooling mode, for example, the computer room temperature is set to 26°C, the outdoor air temperature is below 15°C, and the actual computer room temperature is below 20°C) as a dry cooler. The second flow channel is used in summer mode (high-temperature mechanical cooling mode, for example, the computer room temperature is set to 26°C, the outdoor air temperature is above 25°C, or the chip temperature is above 80°C) as a condenser inside the refrigerator. The first flow channel is connected to the hot side of the second heat exchanger 305. The second flow channel is connected to the cold side of the second heat exchanger 305.

[0011] Optionally, the refrigeration unit 308 is located in the second flow channel.

[0012] Optionally, the first heat exchanger 202 includes a first heat exchanger cold side inlet 206, a first heat exchanger cold side outlet 207, a first heat exchanger hot side inlet 208, and a first heat exchanger hot side outlet 209; the first heat exchanger cold side inlet 206 is connected to the outdoor liquid storage tank 309; the first heat exchanger cold side outlet 207 is connected to the inlet 107 of the cabinet back panel 103; the first heat exchanger hot side inlet 208 is connected to the liquid collection pipe 102; and the first heat exchanger hot side outlet 209 is connected to the CDU liquid storage tank 203.

[0013] Optionally, the multi-channel condenser 303 includes a multi-channel condenser hot-side inlet A311, a multi-channel condenser hot-side outlet A312, a multi-channel condenser hot-side inlet B313, and a multi-channel condenser hot-side outlet B314; the multi-channel condenser hot-side inlet A311 and the multi-channel condenser hot-side outlet A312 are located in a first flow channel; the multi-channel condenser hot-side inlet B313 and the multi-channel condenser hot-side outlet B314 are located in a second flow channel.

[0014] Optionally, a first three-way valve 302 is provided at one end of the multi-channel condenser 303 that is connected to the back panel outlet 108; a second three-way valve 304 is provided at one end of the hot side outlet A312 of the multi-channel condenser; the connection between the two phase outlet ends of the cabinet back panel 103 and the multi-channel condenser 303 or the second heat exchanger 305 is switched through the first three-way valve 302 and the second three-way valve 304.

[0015] Optionally, an outdoor circulation pump 310 is provided between the cold side inlet 206 of the first heat exchanger and the outlet of the outdoor liquid storage tank 309.

[0016] Optionally, the cabinet back panel 103 can be a porous flow channel network with an integrated corrugated fin array on the outside, and a fan 106 is set on the outer layer of the corrugated fin array.

[0017] Optionally, the server cooling module includes multiple server cooling modules 104; the server cooling module 104 includes a chip cold plate 111, a high-power chip 112, an inlet pipe 113, a quick connector 114, and an outlet pipe 115.

[0018] In another aspect, the present invention discloses a control method for a liquid cooling system based on dual-cycle dynamic switching, used to control the operation of the aforementioned liquid cooling system based on dual-cycle dynamic switching, the specific steps of which are as follows: When the temperature is high or the server power is high (for example, the computer room temperature is set to 26°C, the outdoor air temperature exceeds 25°C, or the chip temperature exceeds 80°C), the chiller 308 starts, and the two-phase outlet end 108 of the rack back panel 103 is connected to the hot side inlet 315 of the second heat exchanger 305. The refrigerant does not enter the multi-channel condenser 303. At this time, the multi-channel condenser 303 is used as the condenser inside the chiller 308. When the temperature is low or the server power is low (for example, the computer room temperature is set to 26°C, the outdoor air temperature is below 15°C, and the actual temperature of the computer room is below 20°C), the chiller 308 is turned off, and the two-phase outlet end 108 of the rack back panel 103 is connected to the hot side inlet A311 of the multi-channel condenser 303. The refrigerant enters the multi-channel condenser 303, and at this time the multi-channel condenser 303 is used as a dry cooler.

[0019] Compared with the prior art, the present invention has at least the following beneficial effects: 1. Significantly improved space utilization: By connecting the CDU internal plate heat exchanger with the cabinet back panel in series and reusing the multi-channel flow of the outdoor multi-channel condenser, the separately set chip cold plate heat dissipation unit and the cabinet back panel cooling unit are integrated into a single outdoor unit, reducing the outdoor equipment footprint by more than 40%, which is especially suitable for small and medium-sized data center scenarios with limited space.

[0020] 2. Dynamic energy saving: In summer, it adopts an enhanced heat dissipation mode that is indirectly coupled with a vapor compression cycle and a plate heat exchanger. In winter, it switches to a passive heat dissipation mode dominated by natural cold source. Compared with the traditional single cooling mode system, the overall energy efficiency is improved by 25-30% throughout the year.

[0021] 3. Graded protection for heat dissipation safety: Through the physical isolation design of cold plate circulation and backplane circulation, the chip heat dissipation circuit adopts an independent closed circulation, completely eliminating the risk of impurity intrusion; prioritizing the stability of chip temperature (≤65℃), while allowing elastic fluctuation of backplane exhaust temperature (≤35℃), taking into account both the protection of critical equipment and the flexibility of overall temperature control.

[0022] 4. Enhanced Dynamic Load Adaptability: Based on the latent heat transfer characteristics of the two-phase cold plate, it exhibits excellent adaptability to significant fluctuations in chip power, achieving precise temperature control with a chip surface temperature fluctuation range of ≤±1℃. Multi-parameter coordinated control of the variable frequency pump unit, adjustable fan, and vapor compression cycle automatically adjusts cooling output within a 10-100% load range, improving partial load energy efficiency by over 40% compared to fixed frequency systems, making it particularly suitable for the fluctuating heat load characteristics of data centers.

[0023] 5. Adaptable to Diverse Scenarios: This invention's system is suitable for data center rooms of different sizes, especially for those with only a few server racks, where its advantages are even more pronounced. Due to its compact structure, small outdoor equipment footprint, and convenient installation and deployment, it can quickly adapt to the needs of different sites and scales, exhibiting strong flexibility and adaptability, thus meeting the current diversified development trend of data center construction.

[0024] 6. Reduced construction and operation costs: The reduced number of outdoor devices lowers initial investment costs; the independent loop architecture allows for single-loop maintenance without affecting the operation of other equipment in the data center, significantly improving operation and maintenance efficiency. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the liquid cooling heat dissipation system based on dual-cycle dynamic switching according to the present invention; Figure 2 This is a schematic diagram of Embodiment 1 of the server cooling module of the present invention; Figure 3 This is a schematic diagram of embodiment 2 of the server cooling module of the present invention.

[0026] Figure label: 101. Server rack; 102. Cooling manifold; 103. Rack back panel; 104. Server cooling module; 105. Cooling manifold; 106. Back panel fan; 107. Back panel inlet; 108. Back panel outlet; 111. Chip cooling plate; 112. Chip; 113, Inlet pipe; 114, Quick connector; 115, Outlet pipe; 116, Connecting pipe; 201, Indoor CDU; 202, First heat exchanger; 203, CDU storage tank; 204, Indoor circulation pump; 205, Connecting pipe; 206, Cold side inlet of the first heat exchanger; 207, Cold side outlet of the first heat exchanger; 208, Hot side inlet of the first heat exchanger; 209, Hot side outlet of the first heat exchanger; 301, Outdoor composite heat dissipation unit; 302, First three-way valve; 303, Multi-channel condenser; 304, Second three-way valve; 3 05. Second heat exchanger; 306. Compressor; 307. Electronic expansion valve; 308. Refrigeration unit; 309. Outdoor liquid storage tank; 310. Outdoor circulation pump; 311. Multi-channel condenser hot side inlet A; 312. Multi-channel condenser hot side outlet A; 313. Multi-channel condenser hot side inlet B; 314. Multi-channel condenser hot side outlet B; 315. Second heat exchanger hot side inlet; 316. Second heat exchanger hot side outlet; 317. Second heat exchanger cold side inlet; 318. Second heat exchanger cold side outlet; 319. Multi-channel condenser fan. Detailed Implementation

[0027] To better understand the above-described objectives, features, and advantages of the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments of the present invention and the features thereof can be combined with each other. Furthermore, the present invention can be implemented in other ways different from those described herein; therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0028] A specific embodiment of the present invention, such as Figure 1-3 A liquid cooling heat dissipation system based on dual-cycle dynamic switching is disclosed, including server rack 101, indoor CDU 201 and outdoor composite heat dissipation unit 301; Furthermore, a server cooling module, a distribution pipe 105, and a collection pipe 102 are provided in the indoor server rack 101; the distribution pipe 105 and the collection pipe 102 are respectively connected to both ends of the server cooling module; the server cooling module includes multiple server cooling modules 104; the server cooling module 104 includes a chip cold plate 111, a chip 112, an inlet pipe 113, a quick connector 114, and an outlet pipe 115.

[0029] Preferably, chip 112 is a high-power chip.

[0030] Furthermore, multiple chips 112 can be installed within the server, with a chip cold plate 111 mounted on the surface of each chip 112. The cold plate has branched flow channels inside to ensure that the refrigerant absorbs heat evenly. The chip cold plate 111 is tightly bonded to the chip 112 through a highly thermally conductive material, and heat is quickly transferred to the refrigerant in the flow channels through the metal wall. Multiple chip cold plates 111 can be connected in series or in parallel.

[0031] Furthermore, a rack backplate 103 is provided on one side of the indoor server rack 101. A porous flow channel network is provided inside the rack backplate 103, and a corrugated fin array is integrated on the outside. A backplate fan 106 is provided on the outer layer of the corrugated fin array. The backplate fan 106 drives hot air to flow over the fin surface, and the heat penetrates the metal and is transferred to the refrigerant inside the backplate 103.

[0032] The fin structure of the present invention can significantly expand the air contact area. When the back panel fan 106 drives the hot air in the computer room to flow through the fin gap of the rack back panel 103, the refrigerant in the flow channel of the rack back panel 103 absorbs the heat of the hot air in the server rack 101 through phase change, and the cooled air re-enters the computer room for circulation.

[0033] The chip cooling plate 111 of the present invention directly provides point-to-point heat dissipation for chips with high heat flux density, while the cabinet backplate 103 handles the dispersed residual heat from other low-power heat-generating devices and ambient heat leakage in the cabinet. The two have a clear division of labor and form a graded heat dissipation system, which not only avoids the problem of uneven distribution of cooling in traditional solutions, but also ensures the temperature stability of key components through heat priority division.

[0034] Furthermore, the indoor CDU201, serving as the core hub connecting the indoor and outdoor environments, includes a first heat exchanger 202 and a CDU storage tank 203. The first heat exchanger 202 comprises a cold side and a hot side. The first heat exchanger 202 includes a first heat exchanger cold-side inlet 206, a first heat exchanger cold-side outlet 207, a first heat exchanger hot-side inlet 208, and a first heat exchanger hot-side outlet 209. The first heat exchanger 202 achieves heat coupling between the chip cold plate circulation and the rack backplane circulation. The hot-side inlet 208 of the first heat exchanger 202 connects to the liquid collection pipe 102 of the cold plate 112 circuit, receiving the gas-liquid mixture refrigerant from the outlet of the chip cold plate 111 and condensing it into a liquid state. The cold-side outlet 207 of the first heat exchanger 202 is connected in series with the inlet 107 of the rack backplane 103 via a pipeline, transporting the refrigerant after absorbing heat from the chip 112 to the rack backplane 103, further absorbing waste heat from the air inside the server rack 101. The hot-side outlet 209 of the first heat exchanger is connected to the inlet of the CDU storage tank 203. The outlet of the CDU storage tank 203 is connected to the distribution pipe 105 through the connecting pipe 205. An indoor circulation pump 204 is installed on the connecting pipe 205. The cold-side inlet 206 of the first heat exchanger is connected to the outlet of the storage tank 309. An outdoor circulation pump 310 is installed between the cold-side inlet 206 of the first heat exchanger and the outlet of the storage tank 309.

[0035] Preferably, the first heat exchanger 202 adopts counter-current flow, and the high-temperature refrigerant at the hot side outlet 209 of the first heat exchanger 202 and the low-temperature refrigerant at the cold side inlet 206 form a high-efficiency heat exchange, thereby improving the overall heat transfer efficiency.

[0036] In the above-mentioned implementation process, the closed loop of the chip cold plate circulation ensures the purity of the refrigerant and prevents impurities from entering the precision chip heat dissipation components; the loop of the cabinet back panel circulation is connected in series with the cold side of the first heat exchanger 202, integrating the heat dissipation requirements of the two systems into the same outdoor unit, which significantly reduces the number of outdoor units that are repeatedly configured in the traditional solution.

[0037] Furthermore, the outdoor composite heat dissipation unit 301 includes a first three-way valve 302, a multi-channel condenser 303, a second three-way valve 304, a second heat exchanger 305, a compressor 306, an electronic expansion valve 307, a refrigerator 308, a liquid receiver 309, an outdoor circulation pump 310, a multi-channel condenser hot-side inlet A311, a multi-channel condenser hot-side outlet A312, a multi-channel condenser hot-side inlet B313, a multi-channel condenser hot-side outlet B314, a second heat exchanger hot-side inlet 315, a second heat exchanger hot-side outlet 316, a second heat exchanger cold-side inlet 317, a second heat exchanger cold-side outlet 318, and a multi-channel condenser fan 319; the second heat exchanger 305 includes a cold side and a hot side.

[0038] Furthermore, the outdoor composite heat dissipation unit 301 achieves seasonal adaptive operation through a multi-channel condenser 303 and a valve group switching mechanism. The multi-channel condenser 303 has multiple independent flow channels inside.

[0039] For example, taking a multi-channel condenser 303 with two independent flow channels, the first flow channel (from the hot-side inlet A311 to the hot-side outlet A312) is used as a dry cooler in winter mode; the second flow channel (from the hot-side inlet B313 to the hot-side outlet B314) is used in summer mode and is integrated into the refrigerator 308 as a condenser, sharing the same fin assembly and multi-channel condenser fan 319 externally to save space. The refrigerator 308, the second flow channel from the hot-side inlet B313 to the hot-side outlet B314, and the cold side of the second heat exchanger 305 form a loop. A compressor 306 is installed on the second flow channel from the hot-side inlet B313 to the hot-side outlet B314; the cold-side inlet 317 and the hot-side outlet B314 of the second heat exchanger 305 are connected, and an electronic expansion valve 307 is installed between them.

[0040] Furthermore, the first three-way valve 302 is located at one end of the multi-channel condenser 303 where the hot-side inlet A311 of the multi-channel condenser connects to the back panel outlet 108; the second three-way valve 304 is located at one end of the multi-channel condenser hot-side outlet A312; the first three-way valve 302 and the second three-way valve 304 are connected by a pipeline; the first three-way valve 302 and the second three-way valve 304 automatically switch the refrigerant flow direction according to the ambient temperature: in summer mode, the refrigerant at the back panel outlet 108 of the cabinet back panel 103 flows directly from the first three-way valve 302 into the second three-way valve 304 (without entering the multi-channel condenser). The refrigerant flows from the condenser 303 to the hot-side inlet 315 of the second heat exchanger 305. At this time, the chiller 308 starts and exchanges heat with the refrigerant supplied by the chiller 308 on the cold side of the second heat exchanger 305. In winter mode, the chiller 308 is turned off, and the refrigerant from the outlet 108 of the cabinet back panel 103 flows directly through the first three-way valve 302 and enters the first flow channel formed by the hot-side inlet A311 to the hot-side outlet A312 of the multi-channel condenser 303 (entering the multi-channel condenser 303), and dissipates heat through the ambient air.

[0041] The dual-flow channel of this invention allows the same equipment to support both mechanical refrigeration and natural cooling simultaneously. Outdoors, only a single unit is needed to complete the functions of two traditional units, reducing the floor space by more than 40%. The indirect heat exchange mechanism between the first and second heat exchangers transfers heat through the metal wall, completely isolating the working fluids of the cold plate circulation, back plate circulation, and vapor compression circulation, thus eliminating the risk of cross-contamination.

[0042] The system's dynamic adaptive adjustment function is achieved through multi-component collaborative control. The speeds of power components such as the indoor circulation pump 204 for chip cold plate circulation, the backplate fan 106 for backplate circulation, and the compressor 306 can be dynamically adjusted according to the indoor temperature. The saturation temperature characteristics of the chip cold plate enable it to maintain a stable contact surface temperature even when chip power fluctuates. For example, when chip power increases by 30%, the refrigerant vaporization ratio increases, but the saturation temperature only rises by 0.5-1℃. Combined with the pump speed's second-level response, the system can regain thermal equilibrium within one minute. In the above implementation process, the inherent stability of phase change heat transfer is combined with the dynamic adjustment of external control, which avoids the problem of sudden temperature rise in traditional single-phase liquid cooling solutions and reduces energy waste caused by over-design.

[0043] The system's deployment and operation emphasize modularity and scalability. During installation, the cold plate is quickly mounted to different server chip models via standardized interfaces, and the backplane heat exchanger is bolted to the rack's rear door for easy maintenance and replacement. Outdoor units are connected to indoor units via prefabricated piping, reducing on-site welding and debugging time. Furthermore, during operation and maintenance, a sensor network monitors key parameters in real time; for example, it automatically triggers warnings when the cold plate temperature is uneven and indicates cleaning cycles when dust accumulates on the multi-channel condenser fins, ensuring long-term, efficient system operation. In this process, the modular design not only reduces initial construction costs but also allows the system to flexibly expand with the room size by increasing the number of racks without modifying the outdoor cooling system, significantly improving the return on investment.

[0044] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A liquid cooling heat dissipation system based on dual-cycle dynamic switching, characterized in that, Includes server racks, indoor CDUs, and outdoor cooling units; Indoor server racks include server cooling modules and rack back panels; The indoor CDU includes a first heat exchanger and a CDU storage tank; the first heat exchanger includes a hot side and a cold side; the CDU storage tank is connected to the hot side of the first heat exchanger; The outdoor composite heat dissipation unit includes a multi-channel condenser, a second heat exchanger, a chiller, and a liquid storage tank; the second heat exchanger includes a hot side and a cold side; the liquid storage tank is located on the hot side of the second heat exchanger; The server cooling module is connected to the hot side of the first heat exchanger, forming a loop through the CDU storage tank; The back panel of the cabinet is connected to the cold side of the first heat exchanger, forming a loop through the outdoor heat dissipation unit; The two-phase outlets on the back panel of the cabinet can be switched to connect to a multi-channel condenser or a second heat exchanger; The outlet of the multi-channel condenser is connected to the cold side of the first heat exchanger; The multi-channel condenser is equipped with multiple independent flow channels, which can be opened or closed according to different temperatures.

2. The liquid cooling heat dissipation system according to claim 1, characterized in that, Two independent flow channels are provided. The first flow channel is used in winter mode and serves as a dry cooler. The second flow channel is used in summer mode and serves as a condenser on the refrigeration unit side. The first flow channel is connected to the hot side of the second heat exchanger. The second flow channel is connected to the cold side of the second heat exchanger.

3. The liquid cooling heat dissipation system according to claim 2, characterized in that, The refrigeration unit is located in the second flow channel.

4. The liquid cooling heat dissipation system according to claim 1, characterized in that, The first heat exchanger includes a cold-side inlet, a cold-side outlet, a hot-side inlet, and a hot-side outlet; the cold-side inlet of the first heat exchanger is connected to a liquid storage tank; the cold-side outlet of the first heat exchanger is connected to the liquid phase inlet of the cabinet back panel; the hot-side inlet of the first heat exchanger is connected to a liquid collection pipe; and the hot-side outlet of the first heat exchanger is connected to the CDU liquid storage tank.

5. The liquid cooling heat dissipation system according to claim 2, characterized in that, The multi-channel condenser includes a multi-channel condenser hot-side inlet A, a multi-channel condenser hot-side outlet A, a multi-channel condenser hot-side inlet B, and a multi-channel condenser hot-side outlet B; The hot-side inlet A and hot-side outlet A of the multi-channel condenser are located in the first flow channel; The hot-side inlet B and hot-side outlet B of the multi-channel condenser are located in the second flow channel.

6. The liquid cooling heat dissipation system according to claim 5, characterized in that, A first three-way valve is installed at one end of the multi-channel condenser connected to the back panel outlet; a second three-way valve is installed at one end of the hot side outlet A of the multi-channel condenser; the connection between the two phase outlet ends of the cabinet back panel and the multi-channel condenser or the second heat exchanger is switched through the first three-way valve and the second three-way valve.

7. The liquid cooling heat dissipation system according to claim 1, characterized in that, An outdoor circulation pump is installed between the cold-side inlet of the first heat exchanger and the outlet of the outdoor storage tank.

8. The liquid cooling heat dissipation system according to claim 1, characterized in that, The cabinet back panel features a perforated flow channel network and an integrated corrugated fin array on the outside, with a fan positioned on the outer layer of the corrugated fin array.

9. The liquid cooling heat dissipation system according to claim 1, characterized in that, The server cooling module includes multiple server cooling modules; each server cooling module includes a chip cold plate, a high-power chip, an inlet pipe, a quick connector, and an outlet pipe.

10. A control method for a liquid cooling heat dissipation system based on dual-cycle dynamic switching, characterized in that, The specific steps for controlling the operation of the liquid cooling system based on dual-cycle dynamic switching as described in any one of claims 1-9 are as follows: When the temperature is high or the server power is high, the chiller starts up, and the two-phase outlet end of the rack back panel is connected to the hot side inlet of the second heat exchanger. The refrigerant does not enter the multi-channel condenser. At this time, the multi-channel condenser is used as the condenser inside the chiller. When the temperature is low or the server power is low, the chiller is turned off, and the two-phase outlet end of the rack back panel is connected to the hot side inlet A of the multi-channel condenser. The refrigerant enters the multi-channel condenser, which is then used as a dry cooler.

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