Transparent heat dissipation router

Abstract

The embodiment of the invention discloses a transparent heat dissipation router. According to one specific embodiment, the device comprises a shell, a heat dissipation system and a router mainboard, the shell comprises a transparent cover shell and a bottom shell, the transparent cover shell is embedded into the top of the bottom shell, the transparent cover shell and the bottom shell form a placement space, the side surface of the bottom shell is provided with an antenna array and a functional interface group, and antennas in the antenna array are symmetrically distributed; the heat dissipation system and the router mainboard are both located in the placement space, and the heat dissipation plate is located above the router mainboard; the heat dissipation system comprises a first heat dissipation hole, a second heat dissipation hole and a heat dissipation plate, the first heat dissipation hole is formed in the side face of the bottom shell, and the second heat dissipation hole is formed in the bottom face of the bottom shell; the heat dissipation plate comprises a heat radiation surface and a heat conduction surface, the heat radiation surface is provided with heat dissipation fins, the heat dissipation fins are covered with a heat radiation coating, the heat dissipation fins are arranged towards the transparent housing, and the heat conduction surface is located above the router mainboard. According to the embodiment, the heat dissipation efficiency of the router can be improved.

Description

Technical Field

[0001] The embodiments disclosed herein relate to the field of heat dissipation technology for electronic components, specifically to transparent heat dissipation routers. Background Technology

[0002] With the widespread adoption of consumer electronics and the continuous improvement of users' aesthetic standards, modern home environments are placing increasingly higher demands on the aesthetics of electronic devices. Transparent design, which can intuitively showcase the intricate layout of internal components and the orderly structural aesthetics of products, has become an important design direction for high-end consumer electronics products to highlight their technological sophistication, craftsmanship, and unique personality.

[0003] However, in practice, it has been found that when applying transparent aesthetic design to high-performance network devices such as routers, simply placing the metal heat dissipation module inside the traditional router within a transparent material will expose the rough metal heat sink and messy wiring of the traditional heat dissipation structure, affecting visual aesthetics. At the same time, the transparent material has lower thermal conductivity than the plastic or metal casing of the traditional router, which will lead to a decrease in heat dissipation efficiency and thus a higher router temperature. Higher temperatures can cause device performance to slow down, network connection to be unstable, and even frequent network disconnections and restarts, resulting in technical problems that lead to a poor user experience.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background of the inventive concept, and therefore may contain information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The summary portion of this disclosure is intended to provide a brief overview of the concepts, which will be described in detail in the detailed description portion. This summary portion is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.

[0006] Some embodiments of this disclosure propose transparent heat dissipation routers to address one or more of the technical problems mentioned in the background section above.

[0007] Some embodiments of this disclosure provide a transparent heat dissipation router, the device comprising: a housing, a heat dissipation system, and a router motherboard; the housing includes a transparent cover and a bottom shell, the transparent cover being embedded in the top of the bottom shell, the transparent cover and the bottom shell forming a placement space, the side of the bottom shell being provided with an antenna array and a functional interface group, the antennas in the antenna array being symmetrically distributed; the heat dissipation system and the router motherboard are both located within the placement space, the heat sink being located above the router motherboard; the heat dissipation system includes a first heat dissipation hole, a second heat dissipation hole, and a heat sink, the first heat dissipation hole being disposed on the side of the bottom shell, the second heat dissipation hole being disposed on the bottom surface of the bottom shell; the heat sink includes a heat radiation surface and a heat conduction surface, the heat radiation surface being provided with heat dissipation fins, the heat dissipation fins being covered with a heat radiation coating, the heat dissipation fins being disposed facing the transparent cover, and the heat conduction surface being located above the router motherboard.

[0008] Optionally, the bottom shell is made of aluminum, and an antenna array is provided on the side of the bottom shell, wherein each antenna in the antenna array is symmetrically distributed.

[0009] Optionally, the above-mentioned thermal radiation coating is a nano-carbon coating.

[0010] Optionally, a sealing structure is provided at the connection between the transparent cover and the bottom shell.

[0011] Optionally, the router motherboard is equipped with an indicator light, and the bottom shell is equipped with an indicator hole at the position corresponding to the indicator light, and the indicator light is adapted to the indicator hole.

[0012] Optionally, a heat-conducting layer is provided between the aforementioned heat-conducting surface and the aforementioned router motherboard.

[0013] Optionally, the bottom surface of the aforementioned base shell is provided with an anti-slip pad.

[0014] Optionally, the side of the bottom shell with the indicator hole is covered with a thermochromic coating, the thermochromic coating comprising a base layer, a temperature-responsive layer and a protective layer stacked sequentially; the base layer is attached to the outer surface of the bottom shell; the temperature-responsive layer is made of a thermochromic material and covers the outer surface of the base layer; the temperature-responsive layer has a first optical state and a second optical state; when the temperature reaches a first temperature threshold, the temperature-responsive layer switches from the first optical state to the second optical state, and when the temperature is below the second temperature threshold, it reversibly returns from the second optical state to the first optical state; the protective layer covers the outer surface of the temperature-responsive layer.

[0015] The above-described embodiments of this disclosure have the following beneficial effects: the transparent heat dissipation routers of some embodiments of this disclosure can improve the heat dissipation efficiency of the router and enhance the user experience. Specifically, the reason for the low heat dissipation efficiency and user experience is that when applying transparent aesthetic design to high-performance network devices such as routers, if the metal heat dissipation module inside the traditional router is simply placed inside a transparent material, the transparent material will expose the rough metal heat sink and messy wiring of the traditional heat dissipation structure, affecting the visual aesthetics. At the same time, the transparent material has a lower thermal conductivity than the plastic or metal casing of the traditional router, which will lead to a decrease in heat dissipation efficiency and thus a higher router temperature. A higher temperature will lead to a decrease in device performance, unstable network connection, or even frequent network disconnections and restarts, resulting in a low user experience. Based on this, some embodiments of this disclosure provide a transparent heat dissipation router. The device includes: a housing, a heat dissipation system, and a router motherboard. The housing includes a transparent cover and a bottom shell. The transparent cover is embedded in the top of the bottom shell, and the transparent cover and the bottom shell together form a placement space. An antenna array and a functional interface group are provided on the side of the bottom shell, and the antennas in the antenna array are symmetrically distributed. The heat dissipation system and the router motherboard are both located within the placement space, and the heat sink is located above the router motherboard. The heat dissipation system includes a first heat dissipation hole, a second heat dissipation hole, and a heat sink. The first heat dissipation hole is located on the side of the bottom shell, and the second heat dissipation hole is located on the bottom surface of the bottom shell. The heat sink includes a heat radiation surface and a heat conduction surface. The heat radiation surface is provided with heat dissipation fins, which are covered with a heat radiation coating. The heat dissipation fins face the transparent cover, and the heat conduction surface is located above the router motherboard. This device, through the arrangement of the first and second heat dissipation holes, forms a multi-channel heat dissipation path, effectively enhancing the air convection effect. By aligning the heat-radiating surface of the heat sink with the transparent casing, and leveraging the high-radiation properties of the nano-carbon coating, heat can be rapidly transferred to the external environment. The heat-conducting surface of the heat sink is tightly fitted to the router's motherboard, forming a highly efficient heat conduction channel. This three-dimensional heat dissipation architecture not only solves the problem of mismatched heat conduction performance between the transparent casing and traditional heat dissipation structures, but also increases the heat dissipation area through the heat sink fins, further enhancing heat dissipation efficiency in conjunction with the high-radiation properties of the heat-radiating coating. Simultaneously, the heat sink can also conceal messy wiring, making the router's internal components neater and improving its aesthetics. Attached Figure Description

[0016] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and elements are not necessarily drawn to scale.

[0017] Figure 1This is a schematic diagram of the structure of a transparent heat dissipation router according to some embodiments of the present disclosure from one perspective; Figure 2 This is a structural schematic diagram of a transparent heat dissipation router according to some embodiments of the present disclosure from another perspective; Figure 3 These are physical images of products used for internal testing according to some embodiments of this disclosure. Detailed Implementation

[0018] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0019] It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.

[0020] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.

[0021] It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0022] The names of messages or information exchanged between multiple devices in the embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of such messages or information.

[0023] This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] Figure 1 This is a structural schematic diagram of a transparent heat dissipation router according to some embodiments of the present disclosure. Figure 1 It includes a bottom shell 1, a heat sink 2, a first heat dissipation hole 3, an antenna array 4, a functional interface group 5, and an indicator hole 6.

[0025] Figure 2 This is a structural schematic diagram of a transparent heat dissipation router according to some embodiments of the present disclosure from another perspective. Figure 2 It includes a second heat dissipation hole 7, a support rod 8, and a fixing platform 9.

[0026] In some embodiments, the transparent heat dissipation router includes: a housing, a heat dissipation system, and a router motherboard. The housing may include a transparent cover and a bottom shell 1. The transparent cover may be a flat panel made of transparent material, serving as the top cover of the transparent heat dissipation router. It allows the user to view the internal structure of the router, facilitating understanding of its operation, and also facilitates heat dissipation. For example, the transparent cover can be transparent glass with high light transmittance, allowing users to clearly see the router's internal components, adding a sense of technology and aesthetics, while also providing heat dissipation. Specifically, refer to... Figure 3 , Figure 3 This is a physical diagram of an internal product for testing according to some embodiments of this disclosure. The bottom shell 1 can be a bottom support structure made of metal or high-strength plastic, providing stable support and protection for the internal components of the router. The transparent cover can be embedded in the top of the bottom shell 1 and can be fixed by adhesive, making the connection between the transparent cover and the bottom shell 1 more secure. The router motherboard can be a substrate for electronic components, integrating a central processing unit (CPU), memory, wireless module, and other electronic components. The memory can be random access memory (RAM) for temporarily storing data required for router operation, ensuring that the router can quickly process and transmit network signals. The wireless module can be a WiFi module for realizing wireless network connection and data transmission functions. The transparent cover and the bottom shell 1 form a placement space, which can accommodate the heat dissipation system and the router motherboard. The side of the bottom shell 1 is provided with an antenna array 4 and a functional interface group 5, and the antennas in the antenna array 4 can be symmetrically distributed. For example, the antenna array can include four antennas, located on two opposite sides of the bottom shell 1, with two antennas on each side. This layout helps improve signal reception and transmission efficiency, ensuring the router provides a stable network connection in all directions. Simultaneously, the symmetrical antenna design enhances the router's aesthetics, making it more compatible with modern home décor. The aforementioned functional interface group 5 may include, but is not limited to, a power interface, a network cable interface, and a USB interface. The power interface can connect to an external power source, providing a stable power supply to the router and ensuring its long-term stable operation. The network cable interface can be used to connect to a broadband network, enabling data transmission and sharing, meeting users' needs for high-speed internet access. The USB interface provides users with more expansion capabilities; for example, the USB interface can connect devices such as printers, enabling fast data transmission and sharing, improving user convenience.

[0027] In some embodiments, the heat dissipation system may include a first heat dissipation hole 3, a second heat dissipation hole 7, and a heat sink 2. Both the first heat dissipation hole 3 and the second heat dissipation hole 7 can be through holes formed on the bottom shell 1 to facilitate air convection. Their shape and size can be designed according to actual heat dissipation requirements to ensure sufficient airflow, and are not specifically limited herein. The first heat dissipation hole 3 can be located on two opposite sides of the bottom shell 1, and the second heat dissipation hole 7 can be located on the bottom surface of the bottom shell 1, which can promote air convection and improve heat dissipation efficiency. The heat sink 2 can be a heat dissipation component capable of conducting heat. For example, the heat sink can be a one-piece molded aluminum heat sink with good thermal conductivity, capable of quickly conducting the heat generated by the router motherboard away. The heat sink 2 may include a heat radiation surface and a heat conduction surface. The heat radiation surface is the side of the heat sink 2 facing the transparent cover, and the heat radiation surface is provided with heat dissipation fins to increase the heat dissipation area and improve heat dissipation efficiency. The heat conduction surface is the side of the heat sink 2 facing the router motherboard, which can conduct heat from the router motherboard to the heat radiation surface via the heat conduction surface. The aforementioned heat sink 2 can be located above the router motherboard. The heat conduction surface can contact all the chips on the router motherboard via thermally conductive silicone pads, transferring heat generated by the router motherboard to the heat radiation surface. The heat dissipation fins on the heat radiation surface are covered with a heat radiation coating, which dissipates heat into the surrounding environment through thermal radiation, further enhancing the heat dissipation effect. All the chips on the router motherboard include, but are not limited to, the main control chip, power amplifier chip, and network processor chip. These chips generate a large amount of heat during operation; if this heat cannot be dissipated in time, it will affect the router's performance and stability. The heat can be conducted away by the aforementioned heat sink 2. The heat radiation coating can be made of a material with high emissivity, such as a ceramic coating, which can dissipate heat in the form of thermal radiation, improving heat dissipation efficiency. The heat dissipation fins are positioned facing the transparent casing, allowing heat to be dissipated more directly through the transparent casing. Simultaneously, the high light transmittance of the transparent casing further facilitates heat dissipation.

[0028] Optionally, the bottom shell 1 can be made of aluminum. The bottom shell 1 can be formed in one piece using die-cast aluminum alloy. This material is not only high-strength and lightweight, reducing the overall weight of the router, but also has excellent heat dissipation performance, facilitating the rapid dissipation of heat from inside the router. After oxidation treatment, a dense oxide film can be formed on the surface of the aluminum alloy material. This oxide film not only enhances the corrosion resistance of the bottom shell 1 but also improves its appearance, making the transparent heat dissipation router more aesthetically pleasing and durable.

[0029] Optionally, the aforementioned thermal radiation coating can be a nano-carbon coating. Nano-carbon coatings possess excellent thermal radiation performance, forming a highly efficient thermal radiation network that allows heat to dissipate more quickly from the heat dissipation fins to the surrounding environment. Simultaneously, the nano-carbon coating also exhibits good chemical stability and wear resistance, maintaining its thermal radiation performance over a long period and resisting degradation due to environmental factors, thus enabling the aforementioned transparent heat dissipation router to operate stably for extended periods.

[0030] Optionally, a sealing structure may be provided at the connection between the transparent cover and the bottom shell 1. The sealing structure may be a silicone sealing ring provided at the connection edge between the transparent cover and the bottom shell 1. The silicone sealing ring has good elasticity and sealing performance, which can effectively prevent external impurities such as dust from entering the router and protect the internal components from corrosion. At the same time, it can further enhance the stability of the connection and reduce the possibility of the transparent cover loosening or falling off.

[0031] Optionally, the router motherboard is equipped with indicator lights, which can be light-emitting electronic components, such as LEDs, that can convey the operating status to the user through flashing or constant illumination. These indicator lights include, but are not limited to, power indicator lights, network status indicator lights, and fault indicator lights. Specifically, the power indicator light can be constantly lit to indicate power on and off to indicate power off; the network status indicator light can flash to indicate normal operation; and the fault indicator light can be constantly lit to indicate a fault and off to indicate no fault. The bottom casing 1 has indicator holes 6 at the positions corresponding to the indicator lights. These indicator holes 6 can be holes formed on the bottom casing 1, their shape and size adapted to the indicator lights, allowing the light from the indicator lights to clearly pass through. The area around the indicator holes 6 can be smoothed to prevent scratching the user's fingers and improve safety during use.

[0032] Optionally, a thermally conductive layer may be provided between the aforementioned heat conduction surface and the router motherboard. This thermally conductive layer may be applied only to each chip on the router motherboard. Since chips generate a significant amount of heat, the thermally conductive layer can improve heat transfer efficiency and enhance heat dissipation. The thermally conductive layer can be thermal grease, which has excellent thermal conductivity and filling properties, capable of filling the tiny gaps between the heat conduction surface and the chips, reducing thermal resistance, improving heat conduction efficiency, and enhancing heat dissipation.

[0033] Optionally, the bottom surface of the aforementioned bottom shell 1 may be provided with an anti-slip pad. The anti-slip pad may be made of materials such as rubber or silicone, which have a good coefficient of friction and elasticity, thereby increasing the friction between the aforementioned transparent heat dissipation router and the placement surface, reducing the possibility of slipping or tipping over due to accidental contact during use, and improving the safety of use.

[0034] Optionally, the side of the bottom shell 1 with the indicator hole 6 can be covered with a thermochromic coating. This thermochromic coating can be a coating that changes color with temperature, providing the user with information about temperature changes through color variations. The thermochromic coating comprises a base layer, a temperature-responsive layer, and a protective layer stacked sequentially. The base layer can be a coating applied to the outer surface of the bottom shell 1, such as colorless epoxy resin, providing a stable adhesion base for the temperature-responsive layer, ensuring it does not easily peel off, and without affecting the observation of its color change. The temperature-responsive layer can cover the outer surface of the base layer. The temperature-responsive layer can be made of a thermochromic material, such as thermochromic ink. When the temperature changes, the thermochromic ink undergoes a reversible color change, thus visually reflecting the router's operating temperature status. The aforementioned protective layer covers the outer surface of the temperature-responsive layer. This protective layer can be a colorless polyurethane varnish, which neither affects the observation of the color change of the temperature-responsive layer nor prevents scratches, wear, or physical damage. It also isolates the temperature-responsive layer from air, moisture, sweat, detergents, and other substances, preventing them from penetrating and causing it to malfunction or discolor. The temperature-responsive layer can have a first optical state and a second optical state. The first optical state represents the color state of the temperature-responsive layer before discoloration. The second optical state represents the color state of the temperature-responsive layer after discoloration. The temperature-responsive layer can transition from the first optical state to the second optical state when the temperature reaches a first temperature threshold, and can reversibly revert from the second optical state to the first optical state when the temperature falls below the second temperature threshold. The first temperature threshold represents the minimum value of the color-changing temperature range of the temperature-responsive layer. The second temperature threshold represents the maximum value of the color-changing temperature range of the temperature-responsive layer. For example, the aforementioned temperature-responsive layer can utilize a microencapsulated crystal violet lactone system, with bisphenol A as the color developer and cetyl alcohol as the solvent. The color-changing temperature range is approximately 43°C to 47°C. The temperature-responsive layer can exhibit a blue color when the temperature is below 43°C, and its first optical state is blue. When the temperature is greater than or equal to 43°C, as the temperature continues to rise, the color of the temperature-responsive layer can gradually change from blue to colorless, and its second optical state is colorless. When the temperature of the bottom shell 1 is below 43°C, the thermochromic coating is blue. When the temperature of the bottom shell 1 is greater than or equal to 43°C but less than 47°C, the thermochromic coating changes from blue to colorless. When the temperature of the bottom shell 1 is greater than 47°C, the thermochromic coating becomes colorless. When the temperature drops and falls below 47°C, the thermochromic coating can change from colorless back to blue. This thermochromic coating not only adds a unique visual effect to the aforementioned transparent heat dissipation router but also provides users with an intuitive way to monitor temperature.Users do not need additional temperature measuring tools; they can simply observe the color change of the thermochromic coating to understand the router's operating temperature status.

[0035] In addressing the aforementioned technical issues through the adoption of technical solutions, the intended application scenario for this solution—modern home settings where transparent heat-dissipating routers are frequently placed—often presents the following challenges: Users typically place these routers on solid wood desktops in studies or on TV cabinets in living rooms, hoping they will blend seamlessly with the home environment and enhance overall aesthetics. However, during extended periods of operation, the bottom of the router contacts the surface, hindering airflow and preventing the efficient expulsion of hot air. This reduces the router's performance and stability. Furthermore, on smooth surfaces (such as a lacquered solid wood desktop or glass), the router is prone to displacement due to slight vibrations, posing a risk of falling and damage. When the router needs repair, it must be stored without impact. Considering the following requirements for this application scenario: adaptability to high-temperature environments, adaptability to smooth surfaces, and ease of storage, we have decided to adopt the following solution: Optionally, the bottom surface of the aforementioned base shell 1 may also be provided with a raising structure. This raising structure can be a structural component capable of raising the entire transparent heat-dissipating router, increasing the distance between the transparent heat-dissipating router and the placement plane, reducing the contact between the transparent heat-dissipating router and the placement plane, and improving the heat dissipation capacity of the bottom surface of the aforementioned base shell 1. The aforementioned placement plane can be a supporting surface capable of placing the transparent heat-dissipating router. The raising structure may include a support rod 8 and a fixing platform 9. The support rod 8 can be a vertical rod-shaped component. The fixing platform 9 can be a protrusion structure provided on the bottom surface of the aforementioned base shell 1. One end of the support rod 8 may be provided with a boss, which can be a cylindrical protrusion and is vertically positioned relative to the support rod 8. The fixing platform 9 may be provided with a cylindrical groove, and the boss fits into the groove of the fixing platform 9. The support rod 8 can rotate around the groove via the boss. The other end of the aforementioned support rod 8 can be equipped with an anti-slip structure, which can be a silicone anti-slip pad. This increases the friction between the support rod 8 and the placement surface, reducing the risk of the router falling due to displacement during use. The number of the aforementioned fixing platforms 9 can be at least three, and the number of the aforementioned support rods 8 can be the same as the number of the aforementioned fixing platforms 9. Setting at least three support rods and fixing platforms ensures the stability of the transparent heat-dissipating router during placement. For example, four support rods and fixing platforms can be set, located at the four top corners of the bottom surface of the base shell 1. This distribution ensures stable placement of the router without compromising overall heat dissipation due to excessive structural complexity. The aforementioned fixing platform 9 can be equipped with a limiting structure, which can be a baffle. The limiting structure can have a first magnetic attraction component, and the aforementioned support rod 8 can have a second magnetic attraction component. Both the first and second magnetic attraction components can be magnets, and their magnetic poles are opposite, allowing them to attract each other. The aforementioned boss is configured to rotate within the groove of the aforementioned fixing platform 9, allowing the aforementioned support rod 8 to move between an unfolded position and a retracted position. The aforementioned support rod 8 can be parallel to the bottom surface of the aforementioned base shell 1; in this position, the support rod 8 is in the retracted position, occupying no extra space and facilitating the storage and transport of the router. The aforementioned support rod 8 can rotate around the groove of the aforementioned fixing platform 9. When the aforementioned support rod 8 contacts the aforementioned limiting structure, the aforementioned first magnetic suction member and the aforementioned second magnetic suction member contact each other, and the aforementioned limiting structure restricts the aforementioned support rod 8 from further rotation; in this position, the support rod 8 is in the unfolded position. In the unfolded position, a preset angle is provided between the aforementioned support rod 8 and the bottom surface of the aforementioned base shell 1. The aforementioned first magnetic suction member and the aforementioned second magnetic suction member can magnetically fix the position of the aforementioned support rod 8. The anti-slip structure of the aforementioned support rod 8 contacts the placement surface, providing stable support, anti-slip properties, and shock absorption, effectively increasing the height of the aforementioned transparent heat dissipation router.The aforementioned preset angle can be 90°, which can maximize the distance between the router and the placement surface, reduce the contact between the transparent heat dissipation router and the placement surface, and improve the heat dissipation performance of the transparent heat dissipation router.

[0036] The above-described technical solution, as an inventive point of this disclosure, solves the technical problem of: "In modern home settings where transparent heat-dissipating routers are frequently placed, users typically place them on solid wood desktops in studies or TV cabinets in living rooms, hoping the router will blend seamlessly with the home environment and enhance overall aesthetics. However, when the router operates for extended periods, its bottom contacts the surface, hindering airflow and causing poor heat dissipation, thus reducing the router's performance and stability. Furthermore, on relatively smooth surfaces (such as solid wood desktops with a smooth lacquer finish or glass surfaces), the router is prone to displacement due to slight vibrations, posing a risk of falling and breaking. When the router needs repair, it must be stored safely without any impact." Factors leading to lower router performance and stability often include: In modern home settings where transparent heat-dissipating routers are frequently placed, users typically place them on solid wood desktops in studies or TV cabinets in living rooms, hoping the router will blend seamlessly with the home environment and enhance overall aesthetics. However, when a router operates for extended periods, its bottom contacts the surface it's placed on, hindering airflow and preventing the proper expulsion of hot air. This reduces the router's performance and stability. Furthermore, on smooth surfaces (such as a smooth-painted wooden tabletop or glass), the router is prone to displacement due to slight vibrations, posing a risk of falling and breaking. When the router needs repair, it must be stored safely without impact. Addressing these issues improves the router's performance and stability. To achieve this, the transparent heat-dissipating router disclosed herein incorporates a heightening structure on the bottom surface of the base shell 1, positioning the support rod in its extended position. This increases the distance between the router and the surface, reducing contact and improving airflow through the ventilation holes at the bottom. The anti-slip structure of the support rod enhances friction between it and the contact surface, reducing the risk of the router falling due to external vibrations during use. Simultaneously, the magnetic design between the support rod and the mounting base ensures the support rod remains securely attached to the bottom surface of the base shell when stored, minimizing the possibility of damage from shaking during transport or movement. When it is needed for use, the user only needs to push the support rod to the limiting structure, and the first magnetic component and the second magnetic component will automatically attach and fix it, achieving rapid deployment without complicated operations.

[0037] In addressing the aforementioned technical issues through the adoption of technical solutions, and considering the application scenario of this technical solution—modern home holiday scenarios—the following technical problems often arise: During modern home holidays, when users host home theaters to play 4K high-definition movies or engage in multiplayer online games, the requirements for network bandwidth and stability are extremely high. However, under prolonged high load operation, passive cooling through ventilation holes alone is insufficient to meet these demands, easily leading to performance degradation, network lag, or disconnections due to poor heat dissipation, resulting in a poor user experience. Considering the following requirements for this application scenario: adaptability to high-temperature environments, we decided to adopt the following solution: Optionally, the aforementioned transparent heat dissipation router may further include a cooling fan. This cooling fan can be a fan used to increase airflow, allowing hot air to exchange with cool air more quickly, thereby reducing the internal temperature of the router. The cooling fan includes a motor, fan blades, and a protective housing. The motor can be a DC brushless motor, characterized by high efficiency, low noise, and long lifespan, providing stable and powerful power to the fan blades. The fan blades can be plastic blades, lightweight, and capable of rotating rapidly under the drive of the motor, accelerating airflow. The protective housing can be a shell made of plastic or metal. The motor and fan blades can both be located inside the protective housing. The protective housing reduces the entry of debris or dust into the cooling fan, lowering the risk of damage to the motor and fan blades, and also reducing the risk of injury from accidental contact with the rotating fan blades by family members. The output shaft of the motor can be embedded in the rotating shaft of the fan blades. The output shaft can be a cylindrical shaft, and the rotating shaft can be a hole-shaft structure located at the rotation center of the fan blades. By embedding the output shaft into the rotating shaft, the motor drives the fan blades to rotate. The protective shell may have insert holes, which can be through-hole structures. The cross-sectional shape of the insert holes is consistent with the cross-sectional shape of the support rod 8, allowing the support rod 8 to pass through. The number of insert holes is consistent with the number of support rods 8 and their positions correspond, allowing the support rod 8 to pass through the cooling fan, placing the cooling fan on the bottom surface of the bottom shell 1 to increase the airflow velocity on the bottom surface of the bottom shell 1 and enhance the heat dissipation effect. The inner wall of the insert holes may have anti-slip pads, which can be sheet-like structures made of rubber or silicone. The anti-slip pads can adhere to the inner wall of the insert holes, increasing the friction between the support rod 8 and the insert holes and preventing the cooling fan from shifting due to vibration during use. The insert holes also have fixing grooves, which can be grooves of the same size and shape as the fixing platform 9, allowing the fixing platform 9 to be embedded in the fixing grooves. This allows one side of the protective shell to contact the bottom surface of the bottom shell 1, increasing the heat dissipation effect inside the transparent heat dissipation router. The protective shell may have a power interface on its side, and the bottom shell 1 may have a power supply interface on its side. Both the power interface and the power supply interface can be USB interfaces. The power interface and the power supply interface can be electrically connected by a cable with USB plugs at both ends. The cooling fan can be powered through the power supply interface.

[0038] The above-described technical solution, as an inventive point of this disclosure, solves the technical problem of "when users host home theaters to play 4K high-definition movies or play multiplayer online games during holidays in modern homes, the requirements for network bandwidth and stability are extremely high. However, under long-term high-load operation, routers cannot meet the demand through passive cooling via ventilation holes alone, which easily leads to performance degradation due to poor heat dissipation, resulting in network lag or disconnections and a poor user experience." Factors leading to a poor user experience often include the following: When users host home theaters to play 4K high-definition movies or play multiplayer online games during holidays in modern homes, the requirements for network bandwidth and stability are extremely high. However, under long-term high-load operation, routers cannot meet the demand through passive cooling via ventilation holes alone, which easily leads to performance degradation due to poor heat dissipation, resulting in network lag or disconnections and a poor user experience. Solving these factors can improve the user experience. To achieve this effect, the transparent heat dissipation router disclosed herein adds a cooling fan to the heightened structure. The fan blades are driven by a motor to rotate rapidly, which enhances the router's heat dissipation effect. By using the cooling fan for active heat dissipation, the shortcomings of insufficient natural ventilation are compensated for, effectively reducing the risk of router overheating. This ensures that the router can maintain stable performance under long-term high-load operation, avoids network lag or disconnection problems caused by excessive temperature, and improves the user experience.

[0039] In addressing the aforementioned technical problems through the adoption of technical solutions, and considering the application scenario of this technical solution—the high humidity environment of coastal areas—the following technical issues often arise: In the high humidity environment of coastal areas, the large temperature difference between the router and the environment causes water vapor to form on the router's outer surface or inside, leading to moisture damage, short circuits, or even damage to electronic components, often resulting in a shorter router lifespan and poor performance stability. Considering the following requirements for this application scenario: adaptability to high humidity environments, we decided to adopt the following solution: Optionally, the router motherboard may include a control circuit and a decondensation indicator light. The inner surface of the transparent housing may be covered with a heating film. This inner surface may be the side of the transparent housing facing the heat sink 2. The heating film may be a transparent conductive film, for example, an indium tin oxide film, which not only has high transparency but also good conductivity and heating performance. A decondensation button is also provided on the side of the bottom shell 1. This decondensation button may be a push-button or touch-sensitive control switch; when the user presses or touches the decondensation button, the heating film can be activated. The decondensation button, the heating film, and the decondensation indicator light are all communicatively connected to the control circuit. The control circuit may be a circuit module for monitoring router humidity and controlling the decondensation function. The decondensation function may involve heating the transparent housing with the heating film to remove water vapor adhering to the surface of the transparent housing. The decondensation indicator light may be an LED indicator. The surface of the heating film may be covered with a transparent insulating layer. The aforementioned transparent insulating layer can be made of a material with good insulation and transparency, such as a PET film, which can prevent the heating film from direct contact with the external environment and prevent the risk of electric shock due to accidental contact. The surface of the aforementioned desiccant button can be provided with anti-slip textures. These anti-slip textures include, but are not limited to, raised dots, grooves, and ripples, which can increase the friction between the user's fingers and the desiccant button. The aforementioned control circuit includes a control chip and a humidity sensor. The humidity sensor can be located inside the aforementioned transparent heat dissipation router and can detect the humidity value inside the transparent heat dissipation router. The control chip is configured to perform the following steps: The first step involves controlling the heating film to perform a heating operation in response to the humidity value exceeding a preset humidity value. In practice, the heating film can be controlled to perform a heating operation in response to the humidity value exceeding a preset humidity value. The preset humidity value can be a pre-set critical value used to characterize the generation of water mist inside the router. For example, the preset humidity value can be set to 70%RH (relative humidity). The heating operation can be the operation of heating the transparent cover with the heating film at a preset power and a preset duration. The preset power can be a pre-set power for the heating film during operation, for example, the preset power can be 10W, ensuring that water mist is effectively removed without wasting energy or causing localized overheating due to excessive power. The preset duration can be a time value set according to the ambient humidity and heating effect, for example, the preset duration can be set to 5 minutes, allowing the heating film sufficient time to remove water mist from the transparent cover without causing overheating inside the router due to excessive time.

[0040] The second step involves controlling the heating film to perform a heating operation in response to pressing the decondensation button. In practice, the heating film can be controlled to perform a heating operation in response to pressing the decondensation button. When the humidity value is less than or equal to the preset humidity value, and there is still water vapor on the transparent cover, the heating operation can be manually started by pressing the decondensation button to heat the transparent cover and remove the water vapor. Specifically, due to large temperature differences at night or significant differences in indoor and outdoor humidity, even if the humidity value inside the router does not reach the preset humidity value, water vapor may still form on the surface of the transparent cover due to condensation. In this case, the user can manually press the decondensation button to remove the water vapor.

[0041] Thirdly, in response to the heating film performing the heating operation, the control chip controls the decondensation indicator light to emit an indicator light. In practice, when the heating film is performing the heating operation, the control chip can control the decondensation indicator light to emit an indicator light to remind the user that the heating film is currently in working condition. Even if there is still water vapor on the transparent cover, it may be due to insufficient heating time, and there is no need to press the decondensation button. The indicator light can be a specific color of light, for example, orange or red, for easy visual identification by the user.

[0042] Fourth, in response to the heating film stopping its heating operation, the decondensation indicator light is turned off. In practice, when the heating film stops heating, the control chip can control the decondensation indicator light to turn off, indicating to the user that the heating film has stopped working. If there is still water vapor on the transparent cover, the heating operation can be restarted by pressing the decondensation button.

[0043] The above-described technical solution, as another inventive point of this disclosure, solves the technical problem of "in the high humidity environment of coastal areas, the large temperature difference between the router and the environment causes water vapor to form on the outer surface or inside of the router, resulting in moisture absorption, short circuits, or even damage to electronic components, often leading to a short service life and poor performance stability of the router." The factors leading to a short service life and poor performance stability of the router are often as follows: In the high humidity environment of coastal areas, the large temperature difference between the router and the environment causes water vapor to form on the outer surface or inside of the router, resulting in moisture absorption, short circuits, or even damage to electronic components, often leading to a short service life and poor performance stability of the router. Solving these factors can extend the service life of the router and improve its performance stability. To achieve this effect, the transparent heat dissipation router of this disclosure, by setting a control circuit and a dew indicator light on the router motherboard, combined with a heating film on the inner surface of the transparent casing, can monitor the internal humidity of the router in real time. When the humidity level exceeds the preset value or the user manually triggers the decondensation button, the heating film heats the transparent casing, effectively removing water vapor from its surface. This prevents electronic components from short-circuiting or being damaged due to moisture, extending the router's lifespan in humid coastal environments and maintaining performance stability. Simultaneously, the decondensation indicator light visually displays the heating status, allowing users to stay informed about the device's operation.

[0044] The above-described embodiments of this disclosure have the following beneficial effects: the transparent heat dissipation routers of some embodiments of this disclosure can improve the heat dissipation efficiency of the router and enhance the user experience. Specifically, the reason for the low heat dissipation efficiency and user experience is that when applying transparent aesthetic design to high-performance network devices such as routers, if the metal heat dissipation module inside the traditional router is simply placed inside a transparent material, the transparent material will expose the rough metal heat sink and messy wiring of the traditional heat dissipation structure, affecting the visual aesthetics. At the same time, the transparent material has a lower thermal conductivity than the plastic or metal casing of the traditional router, which will lead to a decrease in heat dissipation efficiency and thus a higher router temperature. A higher temperature will lead to a decrease in device performance, unstable network connection, or even frequent network disconnections and restarts, resulting in a low user experience. Based on this, some embodiments of this disclosure provide a transparent heat dissipation router. The device includes: a housing, a heat dissipation system, and a router motherboard. The housing includes a transparent cover and a bottom shell. The transparent cover is embedded in the top of the bottom shell, and the transparent cover and the bottom shell together form a placement space. An antenna array and a functional interface group are provided on the side of the bottom shell, and the antennas in the antenna array are symmetrically distributed. The heat dissipation system and the router motherboard are both located within the placement space, and the heat sink is located above the router motherboard. The heat dissipation system includes a first heat dissipation hole, a second heat dissipation hole, and a heat sink. The first heat dissipation hole is located on the side of the bottom shell, and the second heat dissipation hole is located on the bottom surface of the bottom shell. The heat sink includes a heat radiation surface and a heat conduction surface. The heat radiation surface is provided with heat dissipation fins, which are covered with a heat radiation coating. The heat dissipation fins face the transparent cover, and the heat conduction surface is located above the router motherboard. This device, through the arrangement of the first and second heat dissipation holes, forms a multi-channel heat dissipation path, effectively enhancing the air convection effect. By aligning the heat-radiating surface of the heat sink with the transparent casing, and leveraging the high-radiation properties of the nano-carbon coating, heat can be rapidly transferred to the external environment. The heat-conducting surface of the heat sink is tightly fitted to the router's motherboard, forming a highly efficient heat conduction channel. This three-dimensional heat dissipation architecture not only solves the problem of mismatched heat conduction performance between the transparent casing and traditional heat dissipation structures, but also increases the heat dissipation area through the heat sink fins, further enhancing heat dissipation efficiency in conjunction with the high-radiation properties of the heat-radiating coating. Simultaneously, the heat sink can also conceal messy wiring, making the router's internal components neater and improving its aesthetics.

[0045] The above description is merely a selection of preferred embodiments of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in the embodiments of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in the embodiments of this disclosure.

Claims

1. A transparent heat dissipation router, characterized in that, The transparent heat dissipation router includes a casing, a heat dissipation system, and a router motherboard; The outer shell includes a transparent cover and a bottom shell. The transparent cover is embedded in the top of the bottom shell, and the transparent cover and the bottom shell form a placement space. The side of the bottom shell is provided with an antenna array and a functional interface group. The antennas in the antenna array are symmetrically distributed. The heat dissipation system and the router motherboard are both located within the placement space, and the heat sink is located above the router motherboard; The heat dissipation system includes a first heat dissipation hole, a second heat dissipation hole, and a heat dissipation plate. The first heat dissipation hole is disposed on the side of the bottom shell, and the second heat dissipation hole is disposed on the bottom surface of the bottom shell. The heat sink includes a heat radiation surface and a heat conduction surface. The heat radiation surface is provided with heat dissipation fins, which are covered with a heat radiation coating. The heat dissipation fins are positioned facing the transparent cover, and the heat conduction surface is located above the router motherboard.

2. The transparent heat dissipation router according to claim 1, characterized in that, The bottom shell is made of aluminum.

3. The transparent heat dissipation router according to claim 1, characterized in that, The thermal radiation coating is a nano-carbon coating.

4. The transparent heat dissipation router according to claim 1, characterized in that, The connection between the transparent cover and the bottom shell is provided with a sealing structure.

5. The transparent heat dissipation router according to claim 1, characterized in that, The router motherboard is equipped with an indicator light, and the bottom shell is equipped with an indicator hole at the position corresponding to the indicator light. The indicator light is adapted to the indicator hole.

6. The transparent heat dissipation router according to claim 1, characterized in that, A heat-conducting layer is provided between the heat-conducting surface and the router motherboard.

7. The transparent heat dissipation router according to claim 1, characterized in that, The bottom surface of the base shell is provided with an anti-slip pad.

8. The transparent heat dissipation router according to claim 5, characterized in that, The side of the bottom shell with the indicator hole is covered with a thermochromic coating, which includes a base layer, a temperature-responsive layer and a protective layer stacked in sequence. The base layer is attached to the outer surface of the bottom shell; The temperature-responsive layer is made of thermochromic material and covers the outer surface of the base layer. The temperature-responsive layer has a first optical state and a second optical state. When the temperature reaches a first temperature threshold, the temperature-responsive layer switches from the first optical state to the second optical state, and when the temperature is lower than the second temperature threshold, it reversibly recovers from the second optical state to the first optical state. The protective layer covers the outer surface of the temperature-responsive layer.

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