Substrate transfer apparatus and substrate transfer method

Abstract

The invention provides a substrate conveying apparatus and a substrate conveying method. In the substrate conveying method, a first conveying body and a second conveying body are used to convey the substrate, the first conveying body and the second conveying body are respectively floated from the bottom of a substrate conveying area through magnetic force, support the substrate and move in the transverse direction, and the substrate conveying method comprises the following steps: a conveying step of conveying the substrate through the first conveying body and the second conveying body, conveying the substrate to a predetermined first reference position for the substrate in a module by the first conveying body; a receiving step in which the substrate at a first reference position for the substrate is received by the second conveyance body; and a detection step of moving the second transport body to a predetermined first reference position for the transport body, transporting the substrate to a detection unit, and detecting a positional deviation in plan view between the position of the substrate and a predetermined second reference position for the substrate in the detection unit.

Description

[0001] This application is a divisional application of an application with the application date of October 11, 2022, the application number of 202211241254.3, and the invention name of "Substrate conveying device and substrate conveying method". TECHNICAL FIELD

[0002] The present application relates to a substrate conveying device and a substrate conveying method. BACKGROUND

[0003] In a manufacturing process of a semiconductor device, a semiconductor wafer (hereinafter referred to as a wafer) as a substrate is conveyed and processed within an apparatus. With regard to the conveyance of the wafer, it is disclosed in Patent Literature 1 that the conveyance is performed using a conveyance mechanism that is floated from the bottom of an apparatus by a magnetic force. In addition, it is disclosed in Patent Literature 2 that a storage state of a wheel for moving a wafer stage provided in an exposure apparatus on the ground is controlled by a remote control apparatus (teach box).

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Publication No. 2021-86987

[0007] Patent Literature 2: Japanese Patent Application Publication No. 2018-146983 SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] The present disclosure provides a technology for easily grasping and utilizing a positional relationship in a plan view of a conveyance body that conveys a substrate and a module.

[0010] SOLUTION TO PROBLEM

[0011] The substrate conveying method of the present disclosure conveys a substrate using a first conveyance body and a second conveyance body that are each floated from the bottom of a substrate conveying region by a magnetic force and support the substrate and move in a lateral direction, and includes the following steps:

[0012] a conveyance step of conveying the substrate to a predetermined first reference position for the substrate in a module by the first conveyance body;

[0013] an acceptance step of accepting the substrate at the first reference position for the substrate by the second conveyance body; and

[0014] The detecting step detects a position deviation between a position of the substrate and a second reference position for the substrate in the detection section.

[0015] The substrate conveying method of the present disclosure uses a conveyance body that is floated from a bottom of a substrate conveying region by a magnetic force and supports the substrate and moves in a lateral direction, and includes the following steps:

[0016] The preparing step prepares a substrate disposed at a first reference position for the substrate that is predetermined in a module;

[0017] The accepting step accepts the substrate at the first reference position for the substrate by the conveyance body; and

[0018] The detecting step detects a position deviation between a position of the substrate and a second reference position for the substrate in the detection section,

[0019] The substrate conveying region is a region in a vacuum conveying module that can form a vacuum atmosphere,

[0020] The module is a processing module that can form a vacuum atmosphere for processing the substrate inside and is connected to the vacuum conveying module,

[0021] The preparing step, the accepting step, and the detecting step are performed in a state in which the vacuum atmosphere is formed in the vacuum conveying module and the processing module,

[0022] The substrate conveying region is changed from an atmospheric atmosphere to a vacuum atmosphere in a state in which the processing module is set to the vacuum atmosphere,

[0023] Subsequently, in a state in which the processing module and the substrate conveying region are the vacuum atmosphere, the preparing step, the accepting step, the detecting step, and a step of acquiring first data for positioning the conveyance body at the first reference position for the conveyance body before the accepting step are performed.

[0024] The substrate conveying method of the present disclosure uses a conveyance body that is floated from a bottom of a substrate conveying region by a magnetic force and supports the substrate and moves in a lateral direction, and includes the following steps:

[0025] The preparing step prepares a substrate disposed at a first reference position for the substrate that is predetermined in a module;

[0026] an accepting step of accepting the substrate at the first reference position for the substrate by the conveyance body; and

[0027] a detecting step of moving the conveyance body to a predetermined first reference position for the conveyance body to convey the substrate to a detection section, detecting a planar positional deviation between a position of the substrate and a predetermined second reference position for the substrate in the detection section,

[0028] the substrate conveyance region is a region in a vacuum conveyance module capable of forming a vacuum atmosphere,

[0029] the module is a processing module capable of forming a vacuum atmosphere for processing the substrate inside and connected to the vacuum conveyance module,

[0030] the preparing step, the accepting step, and the detecting step are performed in a state where the vacuum atmosphere is formed in the vacuum conveyance module and the processing module,

[0031] the preparing step includes a step of acquiring second data for positioning the conveyance body at a second reference position for the conveyance body for conveying the substrate to the first reference position for the substrate in a state where the substrate conveyance region and the processing module are in an atmospheric atmosphere before the preparing step is performed.

[0032] The substrate conveyance apparatus of the present disclosure includes:

[0033] a conveyance body that is floated from a bottom of a substrate conveyance region by a magnetic force and supports and moves a substrate in a lateral direction;

[0034] a module that conveys the substrate to the substrate conveyance region by the conveyance body; and

[0035] a control section that outputs a control signal to perform a preparing step of preparing a substrate disposed at a predetermined first reference position for the substrate in a module, an accepting step of accepting the substrate at the first reference position for the substrate by the conveyance body, and a detecting step of moving the conveyance body to a predetermined first reference position for the conveyance body to convey the substrate to a detection section, detecting a planar positional deviation between a position of the substrate and a predetermined second reference position for the substrate in the detection section,

[0036] wherein the substrate conveyance region is a region in a vacuum conveyance module capable of forming a vacuum atmosphere,

[0037] the module is a processing module capable of forming a vacuum atmosphere for processing the substrate inside and connected to the vacuum conveyance module,

[0038] the preparation step, the accepting step, and the detecting step are performed in a state where the vacuum atmosphere is established in the vacuum transfer module and in the processing module,

[0039] the substrate transfer region is changed from the atmospheric air atmosphere to the vacuum atmosphere in a state where the processing module is set to the vacuum atmosphere,

[0040] Next, the control section outputs a control signal to perform the preparation step, the accepting step, the detecting step, and a step of acquiring first data for positioning the carrier at a first reference position for the carrier before the accepting step in a state where the processing module and the substrate transfer region are in the vacuum atmosphere.

[0041] The substrate transfer apparatus of the present disclosure includes:

[0042] a carrier that is floated from a bottom of a substrate transfer region by a magnetic force and supports and moves a substrate in a lateral direction;

[0043] a module that performs transfer of the substrate to the substrate transfer region by the carrier; and

[0044] a control section that outputs a control signal to perform a preparation step of preparing a substrate at a first reference position for the substrate that is predetermined to be arranged in a module, an accepting step of accepting the substrate at the first reference position for the substrate by the carrier, and a detecting step of moving the carrier to a first reference position for the carrier that is predetermined to transfer the substrate to a detecting section and detecting a position deviation in plan view between a position of the substrate and a second reference position for the substrate that is predetermined in the detecting section,

[0045] wherein the substrate transfer region is a region in a vacuum transfer module that can form a vacuum atmosphere,

[0046] the module is a processing module that can form a vacuum atmosphere for processing the substrate inside and is connected to the vacuum transfer module,

[0047] the preparation step, the accepting step, and the detecting step are performed in a state where the vacuum atmosphere is established in the vacuum transfer module and in the processing module,

[0048] the control section outputs a control signal to perform a step of acquiring second data for positioning the carrier at a second reference position for the carrier that is used to transfer the substrate to the first reference position for the substrate in a state where the substrate transfer region and the processing module are in the atmospheric air atmosphere before the preparation step.

[0049] Effects of the Invention

[0050] According to the present disclosure, the positional relationship between the substrate carrying body carrying a substrate and the module in plan view can be easily grasped and utilized. BRIEF DESCRIPTION OF DRAWINGS

[0051] Figure 1 is a plan view of a substrate processing apparatus to which a substrate carrying apparatus according to one embodiment of the present disclosure is applied.

[0052] Figure 2 is a longitudinal sectional side view of the substrate processing apparatus.

[0053] Figure 3 is a perspective view of a substrate carrying body and a bottom portion of a housing provided in the substrate processing apparatus.

[0054] Figure 4 are plan views respectively showing the substrate carrying body, a substrate, and a placement table on which the substrate is placed.

[0055] Figure 5 is a flowchart showing each process for teaching the substrate carrying body for the processing module 5.

[0056] Figure 6 is an explanatory diagram showing the acquisition of positional data on a first reference position for the substrate carrying body in step S1.

[0057] Figure 7 is an explanatory diagram showing the carrying of a wafer W to a first reference position for a substrate of the processing module 5 by the substrate carrying body 41 as a first substrate carrying body in step S2.

[0058] Figure 8 is an explanatory diagram showing the carrying-out of the wafer W from the processing module 5 by the substrate carrying body 42 in step S3.

[0059] Figure 9 is an explanatory diagram showing the movement of the substrate carrying body 42 to the first reference position for the substrate carrying body, the detection of the amount of deviation of the wafer W from a second reference position for a substrate, and the teaching in step S4.

[0060] Figure 10 is a plan view of the substrate processing apparatus for explaining the teaching of the substrate carrying body.

[0061] Figure 11 is a plan view of the substrate carrying body for explaining the position correction of the substrate carrying body by the teaching.

[0062] Figure 12 is a plan view for explaining a modification of the teaching. DETAILED DESCRIPTION

[0063] In Figure 1 A substrate processing apparatus 1 including a substrate transfer device as one embodiment of the present disclosure is shown. The substrate processing apparatus 1 is provided in an atmospheric atmosphere, and has a load module 2, an alignment module 20, load interlock modules 3A, 3B, a vacuum transfer module 4, and six processing modules 5 in each of which a wafer W as a circular substrate is processed under a vacuum atmosphere.

[0064] The load module 2 is a module called an EFEM (Equipment Front End Module), and performs loading and unloading of wafers W with respect to a transfer container C called a FOUP (Front Open Unified Pod) in which the wafers W are stored. The wafers W unloaded from the transfer container C are taken into the substrate processing apparatus 1. The load module 2 is horizontally long, and the inside thereof is set to an atmospheric atmosphere and a normal pressure atmosphere. Hereinafter, the length direction of the load module 2 is set as an X direction, and a direction orthogonal to the X direction is set as a Y direction. The X direction and the Y direction are each a horizontal direction. Further, one side and the other side of the X direction are respectively denoted as an +X side and an -X side, and one side and the other side of the Y direction are respectively denoted as an +Y side and an -Y side.

[0065] On the -Y side of the load module 2, three container placement portions 21 for placing each of the transfer containers C are arranged in the X direction. Further, a transfer mechanism 22 is provided in the load module 2. The transfer mechanism 22 is not a structure that performs magnetic levitation as the transfer bodies 41, 42 described later. The transfer mechanism 22 is constituted by, for example, a multi-joint arm that is liftable and movable in the X direction, and has an end effector 23 that supports the back surface of the wafer W. The wafer W is transferred between the transfer containers C on the container placement portions 21, the load interlock modules 3A, 3B, and the alignment module 20 by the transfer mechanism 22.

[0066] The alignment module 20 is connected to the -X side of the load module 2. The alignment module 20 optically detects the orientation and the center position of the wafer W. When the transfer mechanism 22 receives the wafer W from the alignment module 20, the operation of the transfer mechanism 22 is controlled by a control section 10 described later so that the center position of the wafer W is positioned at a predetermined position on the end effector 23 in a state where the wafer W becomes a predetermined orientation.

[0067] The load interlock modules 3A, 3B are provided on the +Y side of the load module 2, and are separated from each other in the X direction. Further, the load interlock modules 3A, 3B are shown as longitudinal cross-sectional side views in FIGS. 2A and 2B. Figure 2The load interlock module 3A, which constitutes the inspection section, will be described. The load interlock module 3A has a housing 30. A gas supply mechanism and an exhaust mechanism are provided so as to be capable of supplying and exhausting N2(gas) to and from the inside of the housing 30, which is capable of being switched between a normal pressure atmosphere of N2gas and a vacuum atmosphere.

[0068] A stage 31, which is circular in plan view, is provided in the housing 30, and a wafer W is horizontally placed on the upper surface of the stage 31. Three lift pins 32, which are capable of being protruded and retracted with respect to the upper surface of the stage 31 by being lifted and lowered in the vertical direction, are provided in the stage 31. The wafer W can be transferred between the stage 31, the above-described transfer mechanism 22, and the above-described transfer bodies 41 and 42 provided in the vacuum transfer module 4 via the lift pins 32.

[0069] A camera 33 is provided above the stage 31 and on the top of the housing 30. The field of view of the camera 33 faces downward, and is capable of acquiring image data of the above-described transfer bodies 41 and 42 moving on the stage 31 and the wafer W supported by the support bodies 47 of the transfer bodies 41 and 42 in plan view. The image data is transmitted to the control section 10 and used for teaching of the transfer bodies 41 and 42, the details of which will be described later. The load interlock module 3B is not provided with the camera 33 and is otherwise configured in the same manner as the load interlock module 3A. A gate valve G1 is provided between each of the housings 30 of the load interlock modules 3A and 3B and the load module 2, so that the atmosphere in the load module 2 can be separated from the atmosphere in the housings 30.

[0070] The vacuum transfer module 4 is connected to the load interlock modules 3A and 3B on the +Y side. The vacuum transfer module 4 has a housing 40. The inside of the housing 40 is a substrate transfer region, and the inside of the housing 40 is made into a vacuum atmosphere by exhausting the inside of the housing 40 by an exhaust mechanism not shown. Transfer bodies 41 and 42 for transferring wafers W are provided in the housing 40, which will be described in detail later. A gate valve G2 is provided between each of the housings 30 of the load interlock modules 3A and 3B and the housing 40 of the vacuum transfer module 4, so that the atmosphere in the housings 30 can be separated from the atmosphere in the housing 40.

[0071] The above-described six processing modules 5 will be described. Each of the processing modules 5 has a processing container 50, and the inside of the processing container 50 is made into a vacuum atmosphere by an exhaust mechanism not shown. A stage 31 is provided in the processing container 50 in the same manner as in the load interlock modules 3A and 3B, and has lift pins 32 for placing a wafer W. Furthermore, the stage 31 in the processing module 5 has a flow path through which a fluid, which has been temperature-adjusted by a cooling unit, for example, flows, and a heater as a temperature adjustment section, so as to adjust the temperature of the placed wafer W to a desired temperature to perform processing.

[0072] In addition, the processing container 50 is provided with a gas supply portion, such as a gas shower head, not shown, to supply a processing gas into the processing container 50 set to a vacuum atmosphere. The wafer W placed on the placement table 31 and subjected to temperature adjustment is exposed to the processing gas, whereby a processing corresponding to the processing gas is performed. As the processing, for example, an etching processing, a film forming processing, or an annealing processing, or the like is performed. Further, a plasma forming mechanism can be provided to perform the processing by plasma-izing the processing gas.

[0073] In this example, three processing modules 5 are connected to the vacuum transfer module 4 on the -X side and the +X side, respectively. Further, the three processing modules 5 on the -X side and the three processing modules 5 on the +X side are arranged in the Y direction, respectively. A gate valve G3 is provided between the processing container 50 of each processing module 5 and the housing 40 of the vacuum transfer module 4, whereby the atmosphere inside the housing 40 and the atmosphere inside the processing container 50 can be separated.

[0074] During the operation of the substrate processing apparatus 1, the gate valves Gl and G2 and G3 in the above description are closed to separate the atmospheres between the modules, except for the cases where the carriers 41 and 42 are required to access the modules in order to transfer the wafer W between the modules and in order to perform teaching as described later. Thus, the pressure change inside the housing 30 of the load lock modules 3A and 3B is performed in the state where the gate valves Gl and G2 are closed. Further, the processing in each processing module 5 is performed in the state where the gate valve G3 is closed to divide the processing container 50 from the vacuum transfer module 4.

[0075] In addition, the load lock modules 3A and 3B, the vacuum transfer module 4, and the six processing modules 5 each of which can form a vacuum atmosphere inside by exhausting can be configured to perform the exhausting independently of each other. By performing the exhausting for each module as such, it is possible to perform the use as described later in the state where the processing container 50 of the processing module 5 is a vacuum atmosphere and the housing 40 of the vacuum transfer module 4 is an atmospheric atmosphere.

[0076] Next, the vacuum transfer module 4 will be described in further detail with reference to a perspective view of Figure 3 The carrier 41 as the first carrier and the carrier 42 as the second carrier provided inside the housing 40 forming the substrate transfer region move in the lateral direction while floating from the floor 49 (i.e., the bottom of the substrate transfer region) inside the housing 40 by magnetic force to transfer the wafer W. By moving while floating as such, dust is prevented, whereby the inside of the vacuum transfer module 4 and the inside of the processing module 5 are kept clean, and the occurrence of processing abnormalities due to attachment of foreign matter to the wafer W is suppressed. As shown in FIG. 2, the carrier 41 is provided with a plurality of magnets 43, and the carrier 42 is provided with a plurality of magnets 44. The magnets 43 and 44 are arranged in the Y direction, respectively, and are arranged in the X direction, respectively. The magnets 43 and 44 are arranged in the X direction so as to be opposed to each other in the X direction. The magnets 43 and 44 are arranged in the Y direction so as to be opposed to each other in the Y direction. Figure 3As schematically shown, a plurality of coils 43 are embedded in the floor 49 in a dispersed manner in the lateral direction. Also, the floor 49 is configured to individually supply electric power from the electric power supply section 44 to each of the coils 43, and the coils 43 generate a magnetic field around the same with a strength corresponding to the supplied electric power. That is, each of the coils 43 functions as an electromagnet.

[0077] The movement of the conveyance bodies 41, 42 by the above-described magnetic field is individually controlled. The conveyance bodies 41, 42 are similarly configured, and a representative description will be given of the conveyance body 41. Figure 3 The conveyance body 41 is provided with a moving body 46 that includes, for example, a magnet 45 as a permanent magnet in the inside thereof. The magnet 45 is repelled from the coil 43 after energization by magnetic force, and the conveyance body 41 is floated from the floor 49. The magnetic field on the floor 49 is controlled by switching the coil 43 to which electric power is supplied and adjusting the amount of electric power supplied, and thus the conveyance body 41 can be moved in the X direction and the Y direction, the orientation thereof can be changed, the conveyance body 41 can be stopped, and the height at which the conveyance body 41 is floated from the floor 49 can be changed while the conveyance body 41 is kept floating. In addition, the movement in the X direction and the Y direction here includes both the movement in the X direction and the Y direction respectively and the movement in the X direction and the Y direction simultaneously.

[0078] A support body 47 for horizontally supporting the wafer W from below is provided to the side of the moving body 46. The support body 47 can be positioned on each of the placement stages 31 of the load lock modules 3A, 3B and the processing module 5 by the movement of the moving body 46 described above. Thus, the wafer W can be exchanged between the placement stage 31 and the support body 47 by the lift pins 32 of the placement stage 31. In the present example, the support body 47 is configured in a forked shape so as not to interfere with the lift pins 32 when the exchange is performed.

[0079] A description will be given of the conveyance path of the wafer W in the substrate processing apparatus 1. The wafer W taken in from the conveyance container C to the load module 2 is conveyed in the order of the alignment module 20 → the load module 2 → the load lock module 3A → the vacuum conveyance module 4. Also, the wafer W is conveyed in the order of the vacuum conveyance module 4 → the load lock module 3B → the load module 2 → the conveyance container C after being processed by the processing module 5. A more detailed description will be given of the conveyance between the vacuum conveyance module 4 and the processing module 5. The apparatus structure can be one in which the wafer W is conveyed only to one of the six processing modules 5 to be processed, or the apparatus structure can be one in which the wafer W is sequentially conveyed to a plurality of the six processing modules 5 to be processed. The conveyance between the vacuum conveyance module 4, the processing module 5, and the load lock modules 3A, 3B can be performed using any of the conveyance bodies 41, 42.

[0080] The teaching (motion teaching) of the conveyance bodies 41, 42 is performed for the conveyance and processing of the wafer W. The teaching will be described below. As described above, the handover of the wafer W is performed between the stages 31 of each module accessed by the conveyance bodies 41, 42 and the supports 47 of the conveyance bodies 41, 42. In more detail, the wafer W is delivered to the stage 31 by the conveyance bodies 41, 42 via the lift pins 32, and the wafer W is received from the stage 31 by the conveyance bodies 41, 42 via the lift pins 32. Described in outline, the teaching of the conveyance bodies 41, 42 refers to the operation of determining the positions of the conveyance bodies 41, 42 at the time of performing the handover of the wafer W as such.

[0081] The teaching will be described in more detail with reference to a plan view of the conveyance bodies 41, 42. Figure 4 In the drawing, the center position of the wafer W is indicated as a center point Ol. In addition, a prescribed position on the support 47 of the conveyance body 41, 42 is indicated as a support center point 02. This support center point 02 is a point that coincides with the center point Ol of the wafer W when viewed in plan in the case where the wafer W is normally placed on the support 47. Furthermore, the center of the upper surface of the stage 31 is set as a stage center point 03.

[0082] By the teaching, the positions of the conveyance bodies 41, 42 at the time of performing the handover are determined in such a manner that each support center point 02 of the conveyance bodies 41, 42 coincides with the stage center point 03 of the stage 31 when viewed in plan. By determining the positions in this way, the wafer W is placed on the stage 31 in such a manner that the center point Ol coincides with the stage center point 03 when viewed in plan, and the wafer W is received by the support 47 in such a manner that the center point Ol coincides with the support center point 02. Thus, when an XY coordinate system composed of an X axis and a Y axis that run along the X direction and the Y direction, respectively, is set in the processing module 5 and the vacuum conveyance module 4, the teaching of the conveyance bodies 41, 42 corresponds to the operation of determining the coordinate positions of the support center points 02 of the conveyance bodies 41, 42 in the XY coordinate system. The teaching is performed for each module accessed by the conveyance bodies 41, 42 in order to place the wafer W in such a manner that the center point Ol of the wafer W coincides with the stage center point 03 of the stage 31 of all the processing modules 5, and processing is appropriately performed.

[0083] Furthermore, as described above, the conveyance bodies 41, 42 are identically configured to each other. However, between the conveyance bodies 41, 42, there are inevitable shape errors in manufacture and characteristic differences in the magnets 45. Assuming that the same magnetic field is formed below the conveyance bodies 41, 42, it is conceivable that even if the shape errors are small, the positions of the support center points 02 of the conveyance bodies 41, 42 deviate from each other due to the characteristic differences in the magnets 45. That is, it is conceivable that since the conveyance bodies 41, 42 have a structure of magnetic levitation, individual differences tend to occur between the conveyance bodies 41, 42, and therefore the conveyance bodies 41, 42 are respectively taught.

[0084] In addition, for Figure 1 , Figure 3 The control unit 10 shown will be described below. This control unit 10 is configured as a computer and includes a program and a memory 11. The program is programmed into a set of steps to output control signals to each part of the substrate processing apparatus 1 to control the operation of each part, thereby performing the aforementioned wafer W transfer and processing, and the automatic teaching described later. The program is stored in the control unit 10, for example, on a storage medium such as a hard disk, optical disc, DVD, or memory card.

[0085] In memory 11, data (let's call it position data) specifying the location for the aforementioned handover is stored for each module accessed by each transport body 41, 42. That is, when the transport bodies 41, 42 hand over the wafer W to the module, the operation of the transport bodies 41, 42 is controlled (i.e., the magnetic field on the base plate 49 is controlled) to move the transport bodies 41, 42 to the position corresponding to the position data for that module. Therefore, the teaching regarding the transport bodies 41, 42 describes determining the position for handing over the wafer W to the module, and more specifically, acquiring position data where the support center point O2 and the placement center point O3 coincide in a top view, and storing it in memory 11. Since... Figure 3 As described above, the positions of the conveyors 41 and 42 are changed by the change of the magnetic field on the base plate 49, and thus, for example, data such as which coil 43 is supplied with how much power is used as position data.

[0086] In this substrate processing apparatus 1, after an operator teaches one of the transport bodies 41 and 42, the teaching of the other transport body can be performed automatically. Because the teaching is performed automatically in this way, it can be performed while the substrate processing apparatus 1 is running, i.e., while maintaining a vacuum atmosphere within the housing 40 of the vacuum transport module 4 and the processing containers 50 of each processing module 5. The object of the automatic teaching can be either the transport body 41 or 42. Hereinafter, we will assume that the teaching of the transport body 42 is performed automatically, referring to... Figure 5 Flowcharts (showing steps S1-S4 below) and Figures 6 to 10 The process is illustrated using a top view. For ease of explanation, the processing module located closest to the +Y side among the three processing modules 5 on the +X side is referred to as processing module 5A.

[0087] First, the inside of the housing 40 of the vacuum transfer module 4 and the inside of the processing container 50 of each processing module 5 are opened to the outside of the apparatus to be set to an atmospheric atmosphere, and the substrate processing apparatus 1 is set to a non-operation state. In this state, the operator manually teaches the transfer body 41. That is, with respect to the transfer body 41, the aforementioned positional data (second data) with respect to each module of the processing modules 5 and the load interlock modules 3A, 3B is acquired and stored in the memory 11.

[0088] In addition, the operator previously teaches the transfer mechanism 22 of the load module 2 by an arbitrary method to cause the transfer mechanism 22 to appropriately hand over the wafer W with respect to each module and the transfer container C that is accessed. Also, it is previously set that the provisional positional data is stored in the memory 11 of the control section 10 as the state of the positional data of the transfer body 42 with respect to each module. That is, the transfer body 42 is set to a state in which it can move to the provisional position at the time of performing the handover of the wafer W. Further, in the image data acquired by the camera 33 of the load interlock module 3A, the position of the placement center point O3 of the placement table 31 is previously determined.

[0089] Next, the inside of the housing 40 of the vacuum transfer module 4 and the inside of the processing container 50 of each processing module 5 are respectively evacuated to be set to a vacuum atmosphere, and the substrate processing apparatus 1 is operated. Thereafter, at an arbitrary timing, the transfer body 42 is caused to move to the provisional position at which the handover of the wafer W with respect to the load interlock module 3A is performed, based on the provisional positional data stored with respect to the load interlock module 3A. Thus, the support body 47 of the transfer body 42 is positioned on the placement table 31 of the load interlock module 3A, and the image data at the time of viewing from above of the support body 47 is acquired by the camera 33.

[0090] The detection of the support body 47 in the image data, the determination of the support center point O2, and the calculation of each offset amount in the X direction and the Y direction of the support center point O2 and the placement center point O3 of the placement table 31 are sequentially performed by the control section 10. Also, the positional data with respect to the load interlock module 3A in the memory 11 is updated in such a manner that each offset in the X direction and the Y direction is corrected (that is, from the provisional positional data to the official positional data). That is, the position at which the transfer body 42 hands over the wafer W to the load interlock module 3A is corrected in such a manner that the support center point O2 and the placement center point O3 coincide with each other at the time of viewing from above, and the teaching of the transfer body 42 with respect to the load interlock module 3A is completed (step S1). Figure 6 , step S1). Further, this step S1 corresponds to a first decision process of deciding the first reference position for the transfer body, and the position at which the support center point O2 and the placement center point O3 coincide with each other is the first reference position for the transfer body. Also, the positional data updated by this step S1 is the first data.

[0091] Next, the transport container C is transported to either of the load interlocks 3A and 3B via the load module 2. In this example, the transport is made to the load interlock 3A. As already described, the teaching of the transport mechanism 22 is complete, and therefore the transport is made in such a manner that the center point Ol of the wafer W coincides with the placement center point O3 of the load interlock 3A. The transport body 41 receives the wafer W transported as such, and transports the wafer W to the process module 5A. Since the teaching of the transport body 41 is complete, it moves to a position (second reference position for the transport body) at which the support center point O2 coincides with the placement center point O3 of the process module 5A in plan view.

[0092] The lift pins 32 of the placement table 31 of the process module 5A are raised, and the wafer W is supported by the lift pins 32 in place of being supported by the transport body 41 (step S2). As already described, since the teaching of the transport body 41 is complete, and the transport body 41 receives the wafer W with the center point Ol coinciding with the placement center point O3 via the load interlock 3A, the center point Ol of the wafer W supported by the lift pins 32 coincides with the placement center point O3 of the placement table 31 in plan view Figure 7 ). The position of the wafer W at this time is the first reference position for the substrate.

[0093] The transport body 41 retreats from the process module 5A, and then moves the transport body 42 to a tentative position at which the wafer W is to be handed over to the process module 5A in accordance with the tentative position data stored with respect to the process module 5A, the support body 47 of the transport body 42 being located below the wafer W. Also, the lift pins 32 are lowered, and the wafer W becomes a state of being supported by the support body 47 in place of the lift pins 32 Figure 8 , step S3).

[0094] After that, the transport body 42 supporting the wafer W moves to a position at which the handover to the load interlock 3A is made. Specifically, since the teaching with respect to the load interlock 3A is complete in step Sl, the transport body 42 is located at a position at which the support center point O2 coincides with the placement center point O3 of the placement table 31 in plan view (first reference position for the transport body) Figure 9 ). Also, the image data of the wafer W supported by the support body 47 in plan view is acquired by the photographing by the camera 33.

[0095] The center point O1 of the wafer W in the image data is calculated by the control section 10, for example, the respective amounts of deviation of the center point O1 in the X direction and the Y direction with respect to the placement center point O3 of the placement table 31 are calculated. When the position of the wafer W in which the center point O1 coincides with the placement center point O3 in plan view is set as a second reference position for the substrate, the wafer W coincides with the second reference position in the case where it is assumed that the teaching for the handling body 42 with respect to the processing module 5A is completed. Therefore, the calculation of the amounts of deviation of the center point O1 of the wafer W with respect to the placement center point O3 using the image data is the calculation of the amounts of deviation between the wafer W of the second reference position which is determined in advance and the wafer W of the actual position.

[0096] The amount of deviation calculated from the image data as described above (set as the amount of deviation of the wafer W) corresponds to the amount of deviation of the support center point O2 of the handling body 42 in plan view at the time of execution of step S3 with respect to the center point O1 of the wafer W. As described above, in the processing module 5A, the center point O1 of the wafer W coincides with the placement center point O3, and therefore the amount of deviation of the wafer W corresponds to the amount of deviation of the support center point O2 of the handling body 42 in plan view with respect to the placement center point O3. When the amount of deviation of the placement center point O3 and the support center point O2 is set as the amount of deviation of the handover position, the amount of deviation of the handover position is calculated by the control section 10.

[0097] The calculation of the amount of deviation of the handover position will be described below with reference to a specific example. Figure 11 Figure 11 is a plan view of the handling body 42 at the time of acceptance of the wafer W from the processing module 5A in step S3 and the handling body 42 at the time of acquisition of the image data by the load interlock module 3A in step S4. As shown in Figure 11 , the amount of deviation of the wafer W obtained from the image data (the amount of deviation of the center point O1 of the wafer W with respect to the placement center point O3 of the load interlock module 3A) is L1 in the -X direction and L2 in the -Y direction.

[0098] According to the positional relationship of the load interlock module 3A and the processing module 5A with respect to the vacuum transfer module 4, the orientation of the handling body 42 differs by 90° at the time of acceptance of the wafer W and at the time of imaging of the wafer W. According to the difference in the orientation of the handling body 42 and the amount of deviation of the wafer W obtained on the basis of the image data described above, the support center point O2 of the handling body 42 deviates by L2 in the -X direction and by L1 in the +Y direction with respect to the placement center point O3 (= the center point O1 of the wafer W) at the time of acceptance of the wafer W from the processing module 5A. The value of L2 in the -X direction and L1 in the +Y direction is calculated as the amount of deviation of the handover position.

[0099] ​The position data regarding the processing module 5A is updated in such a manner as to eliminate the offset amount of the handover position. That is, the teaching for the processing module 5A is completed by changing the tentative position data to the formal position data based on the offset amount of the wafer W (step S4). Specifically, for example, in the case where the offset amount of the handover position is L2 in the -X direction and Ll in the +Y direction as shown in FIG. 6, the position data is updated so that the support center point O2 of the carrier 42 at the time of handover is offset by L2 in the +X direction and by Ll in the -Y direction, thereby coinciding with the placement center point O3 of the processing module 5A. Figure 10

[0100] After that, the steps S2 to S4 are also performed for the other processing modules 5, the load interlock module 3B, and the like, which are accessed by the carrier 42 other than the 5A, to sequentially teach the modules. Further, depending on the module to be taught, the relationship between the orientation of the carrier 42 at the time of acceptance of the wafer W in the step S3 and at the time of imaging in the step S4 is sometimes different from that explained in the case of the processing module 5A in Figure 11 In this case, the calculation of the offset amount of the handover position in the step S4 is performed on a different basis in consideration of the relationship of the orientation, to perform the teaching.

[0101] When the steps S2 to S4 are performed for all the modules accessed by the carrier 42 and the position data is updated, the teaching of the carrier 42 is completed. After this teaching completion, the center point Ol of the wafer W in plan view coincides with the placement center point O3 of each module at the time of handover of the wafer W between the modules by the carrier 42. In Figure 10 The state where the wafer W is handed over like this for the processing module 5A is shown in FIG. 7.

[0102] Further, the above-described steps S2 and S3 respectively correspond to a carrying process and an acceptance process. The processes until the calculation of the offset amount of the handover position in the step S4 respectively correspond to a detection process, and the update of the position data thereafter respectively corresponds to a correction process. In addition, the offset amount of the wafer W and the offset amount of the handover position acquired in the step S4 respectively are data indicating the positional relationship in plan view between the first reference position for the substrate at the time of performing the acceptance process and the second carrier.

[0103] ​As already described, teaching of the carriers 41, 42 is required respectively, but according to the substrate processing apparatus 1, teaching of one of the carriers 41, 42 is automatically performed, so that the number of workers required for teaching by the workers and the time can be suppressed. Further, the structure of the substrate processing apparatus 1 can be appropriately changed, and the number of modules connected to the vacuum transfer module can also be appropriately increased or decreased. Although teaching is performed for each module accessed by the carriers 41, 42, the workers only perform manual work teaching for one of the carriers 41, 42, so that even if the number of modules is large, the burden on the workers can be suppressed.

[0104] Further, although it is described that the wafer W supported on the lift pin 32 of the module in step S2 is not placed on the placement table 31, but is received by the carrier 42 through step S3, the lift pin 32 can be lowered to temporarily place the wafer W on the placement table 31. That is, in step S3, the wafer W processed in the processing module 5 can be received by being placed on the placement table 31. That is, processing of the wafer W can be performed during steps S1 to S4 are performed. In addition, with respect to steps S1 to S4, the wafer W used as a substrate for manufacturing a semiconductor device is not limited, and a wafer dummy or the like having the same shape as the wafer W in plan view and not intended for manufacturing a semiconductor device can be used to be implemented.

[0105] In addition, with respect to the teaching for the processing module 5A, it is described that steps S1 to S4 are sequentially performed, but teaching of the carrier 42 for the load interlock module 3A in step S1 can be performed during a period before the carrier 42 receives the wafer W from the processing module 5A in step S3. Therefore, step S2 can be performed before step S1.

[0106] Further, as described above, it is preferable that all of steps S1 to S4 are automatically performed. However, for example, with respect to the teaching of the carrier 42 for the load interlock module 3A in step S1, the teaching can be performed by the workers by manual work at the same time as the teaching of the carrier 41 when the teaching of the carrier 41 is performed. Even if step S1 is performed by manual work like this, the number of modules that become the object of the teaching by manual work is only increased by one, so that the burden on the workers can be sufficiently suppressed.

[0107] The teaching performed when the substrate processing apparatus 1 starts operation is described, but the same teaching is performed at the time of maintenance after the substrate processing apparatus 1 is operated. Hereinafter, the flow of each work including the teaching is described by taking a case where the carrier 42 is replaced during operation of the apparatus as an example of the maintenance.

[0108] First, in a state where the gate valves G2, G3 are closed, evacuation is stopped in the housing 40 of the vacuum transfer module 4, and the pressure in the housing 40 is returned to the atmospheric pressure from the vacuum pressure (hereinafter, referred to as the transfer vacuum pressure) set in advance for the transfer of the wafer W. The operator detaches a part of the partition wall constituting the housing 40, and accesses the inside of the housing 40 from the outside of the apparatus to replace the transfer body 42. After that, the inside of the housing 40 is evacuated and set to the transfer vacuum pressure again. As described above, since there is an individual difference between the transfer bodies, it is necessary to teach the newly used transfer body 42, and after that, the steps S1 to S4 are performed as in the start of the operation of the apparatus described above to perform the teaching.

[0109] The processing modules 5 are not stopped from operating and opened to the atmospheric air in the processing containers 50 due to the replacement of the transfer body 42 described above and the execution of the steps S1 to S4, and the processing modules 5 are operated during the period from the release of the transfer vacuum pressure to the return to the transfer vacuum pressure. The operation of the processing modules 5 specifically means that the temperature of the mounting table 31 in the processing container 50 is maintained at the same temperature as that at the time of the processing of the wafer W, or the processing container 50 is kept at the vacuum pressure. By operating the processing modules 5 like this to maintain the processing environment of the wafer W in the processing container 50, it is possible to rapidly transfer the wafer W to the processing modules 5 after the vacuum transfer module 4 is returned to the transfer vacuum pressure, and to start the processing again. Further, it can be that, at the time of the release of the transfer vacuum pressure, if the wafer W is being processed in the processing container 50, the processing is continued, and the wafer W that has been processed completely after the return to the transfer vacuum pressure is taken out of the processing container 50.

[0110] Since the teaching of the transfer body 42 to the processing modules 5 can be performed without opening the processing containers 50 to the atmospheric air, the operation of the processing modules 5 can not be stopped when the steps S1 to S4 are performed as above. Thus, even if the replacement frequency of the transfer bodies 41, 42 is high, it is possible to prevent the time during which the processing cannot be performed in the processing modules 5 from becoming long. In addition, the number of the processing modules 5 provided to the substrate processing apparatus 1 can be appropriately increased or decreased, and in the case where the number of the processing modules 5 is large, it is possible to perform the operation without stopping the operation of the processing modules 5 as described above, which is particularly effective in ensuring the productivity of the apparatus.

[0111] Hereinafter, a modification of each of the steps S1 to S4 described above will be described, but the transfer body to be taught is set to the transfer body 42 as in the example described above unless otherwise specifically described. The teaching of the transfer body 42 to the processing modules 5 is performed in the same manner as in the example described above, but the processing modules 5 are not stopped from operating and opened to the atmospheric air in the processing containers 50 due to the replacement of the transfer body 42 described above and the execution of the steps S1 to S4, and the processing modules 5 are operated during the period from the release of the transfer vacuum pressure to the return to the transfer vacuum pressure. Figure 6A modification of the above-described step S1 (teaching of the carrier 42 with respect to the load lock module 3A) will be described. The step S1 is not limited to the use of the camera 33. As a specific example, the use of a sensor wafer can be cited. The sensor wafer is a device provided with a substrate main body having the same shape as the wafer W in plan view and a camera disposed in a manner capable of capturing the upper side in the substrate main body. Also, for example, image data acquired by the camera is transmitted to the control section 10 in a wireless or wired manner.

[0112] The above-described sensor wafer is carried from the carrying container C to the load lock module 3A by the carrying mechanism 22 and placed on the placement table 31 of the load lock module 3A. Further, the carrying mechanism 22 that carried the sensor wafer is set to be taught, and a prescribed point (set to be O4) in the image data acquired by the sensor wafer placed on the placement table 31 as such is a position directly above the placement center point O3 of the placement table 31.

[0113] After the sensor wafer is carried into the load lock module 3A as such, as Figure 6 described above, the carrier 42 is moved to the handover position using the provisional position data. Thereafter, the support body 47 of the carrier 42 is imaged by the sensor wafer to acquire image data. The deviation between the support center point O2 and the above-described point O4 determined from the position of the support body 47 in the image data is detected by the control section 10, and the position data is updated in a manner to eliminate the deviation, whereby the step S1 is completed.

[0114] Further, it is assumed that the sensor wafer is carried to the processing module 5 and taught in the same manner as in the case of teaching with respect to the load lock module 3A. In this case, the sensor wafer can become unable to perform normal operation due to the influence of the magnetic field while passing through the vacuum carrying module 4. Also, in the substrate processing apparatus 1, teaching is performed in a state in which the processing module 5 is operating, for example, as described above, but since the sensor wafer is carried into the processing module 5 that is in operation, the sensor wafer can be exposed to the gas in the processing module. In this case, there is a risk that the constituent members of the sensor wafer are corroded. Thus, it is effective to teach the processing module 5 by the method described so far.

[0115] The other embodiment of the step S1 will be described. The gate valve G1 is opened, and the worker in the load module 2 in the atmospheric air visually checks the inside of the load interlock module 3A through the opening of the gate valve G1. The teaching can be performed by confirming the position of the support body 47 of the carrier 42 in the load interlock module 3A in this state. Further, when the carrier 42 enters the load interlock module 3A, the inside of the vacuum transfer module 4 communicates with the inside of the load interlock module 3A, and therefore, the inside of the vacuum transfer module 4 and the inside of the load interlock module 3A are set to the atmospheric air in advance to enable the above visual check.

[0116] Further, as another example, the teaching of the step S1 can be performed by providing a plurality of distance sensors to the side wall of the housing 30 of the load interlock module 3A. As the distance sensors, for example, there are included a sensor that detects the distance in the X direction and a sensor that detects the distance in the Y direction with respect to the support body 47 of the carrier 42 that moves to the handoff position according to the provisional position data. The control section 10 calculates the position of the support center point O2 from the detection results of the respective distance sensors thus provided, and calculates the respective amounts of deviation of the support center point O2 and the placement center point O3 in the X direction and the Y direction in the plan view, to perform the teaching.

[0117] Further, in the case where the step S1 is performed using the distance sensors instead of the camera 33 as described above, the step S4 can be performed using the distance sensors instead of the camera 33. Specifically, for example, in the step S4, the distances with respect to the wafer W are detected using the respective distance sensors. Also, the control section 10 calculates the position of the center point O1 of the wafer W from the detection results, and calculates the above-described amounts of deviation of the wafer W and the amounts of deviation of the handoff positions from the center point O1 to perform the teaching. Further, by performing the steps S1 and S4 using the same detection devices (camera 33, distance sensors) provided in the same module as described above, it is not necessary to additionally prepare the detection devices for performing the steps S1 and S4, respectively, and therefore, it is preferable.

[0118] As a detection unit equipped with the aforementioned camera 33 and distance sensor for performing steps S1 and S4, any location accessible to the transport bodies 41 and 42 is acceptable. Therefore, the loading interlock module 3B can be configured as the detection unit. In the case of a substrate processing apparatus configured by connecting the alignment module 20 and the connection module to the vacuum transport module 4, these modules can be configured as detection units. In the case of a device structure with multiple vacuum transport modules 4, the aforementioned connection module is a module that connects the vacuum transport modules 4 to each other, and the connection module has a housing with an internal vacuum atmosphere and a mounting stage disposed within the housing. Unlike the vacuum transport module 4, no magnetic field is formed at the bottom of this housing. A fixed pin is provided on the mounting stage of the connection module, and the wafer W is transferred between two vacuum transport modules 4 by the lifting and lowering action of the transport bodies 41 and 42.

[0119] Furthermore, a portion of the vacuum transport module 4 can be designated as a detection unit by installing a camera 33 and a distance sensor in the vacuum transport module 4. In this case, a specific point in this area can be treated similarly to the loading center point O3 of the aforementioned loading interlock module 3A. That is, in step S1, the support center point O2 of the transport body 42 is taught to coincide with this specific point, and in step S4, the transport body 42 is moved to coincide with this specific point to detect the deviation of the wafer W. However, when the vacuum transport module 4 is designated as a detection unit in this way, it is preferable to configure the camera 33 in a way that shields the magnetic field to prevent malfunctions of the camera 33, etc., due to the influence of the magnetic field. Considering this, in terms of simplifying the device structure, it is preferable to install cameras 33, etc., as detection units in the aforementioned modules where no magnetic field is formed on the bottom, which simplifies the device structure.

[0120] In addition, Figure 8 In step S3, the untaught transporter 42 is brought into the module to receive the wafer W according to provisional position data. For example, in the vacuum transport module 4, a camera 52 is placed near each taught module as a detection device to acquire image data, and the position of the transporter 42 upon entry is adjusted based on this image data. That is, the path of the transporter 42 to the module is changed according to the image data. By adjusting the position in this way, a device structure can be designed to more reliably avoid interference with the gate valves G2 and G3 that constitute the module entrance. A distance sensor can be used as a detection device instead of the camera 52, and interference can be avoided similarly by detecting the position of the transporter 42 before entering the module. Furthermore, photoelectric sensors such as fiber optic sensors and area sensors can be used as detection devices.

[0121] Next, useFigure 12 A modification of step S4 described in Figure 10 will be described. Also in Figure 12 , the support center point of the end effector 23 of the conveyance mechanism 22 is also shown as 02 as with the support center points of the conveyance bodies 42, 43. Step S4 is started, and the conveyance body 42 conveys the wafer W from the processing module 5A to the load interlock module 3A, and places the wafer W on the placement table 31. At this time, the placement center point 03 of the placement table 31 is offset from the center point 01 of the wafer W (upper portion). The conveyance mechanism 22 of the load module 2 receives the wafer W. Since the conveyance mechanism 22 has been taught, the support center point 02 of the conveyance mechanism 22 is on the placement center point 03 at the time of receiving the wafer W. Therefore, the center point 01 of the wafer W is offset from the support center point 02 of the conveyance mechanism 22 by the same amount as the offset between the placement center point 03 of the load interlock module 3A and the center point 01 of the wafer W when viewed from above. Figure 12 The conveyance mechanism 22 of the load module 2 receives the wafer W. Since the conveyance mechanism 22 has been taught, the support center point 02 of the conveyance mechanism 22 is on the placement center point 03 at the time of receiving the wafer W. Therefore, the center point 01 of the wafer W is offset from the support center point 02 of the conveyance mechanism 22 by the same amount as the offset between the placement center point 03 of the load interlock module 3A and the center point 01 of the wafer W when viewed from above.

[0122] Also, the wafer W is conveyed in a manner that the support center point 02 of the conveyance mechanism 22 coincides with the placement center point 03 of the placement table 31 of the alignment module 20 (lower portion), and the wafer W is placed on the placement table 31. Since the wafer W is conveyed like this, the center point 01 of the wafer W is offset from the placement center point 03 when viewed from above by the same amount as the offset between the support center point 02 of the conveyance mechanism 22 and the center point 01 of the wafer W described in Figure 12 Figure 10 The conveyance mechanism 22 of the load module 2 receives the wafer W. Since the conveyance mechanism 22 has been taught, the support center point 02 of the conveyance mechanism 22 is on the placement center point 03 at the time of receiving the wafer W. Therefore, the center point 01 of the wafer W is offset from the support center point 02 of the conveyance mechanism 22 by the same amount as the offset between the placement center point 03 of the load interlock module 3A and the center point 01 of the wafer W when viewed from above.

[0123] The structure of the alignment module 20 will be described. During the period in which the placement table 31 formed in a manner having a smaller diameter than the diameter of the wafer W rotates one revolution around the vertical axis together with the wafer W, light is irradiated from the light projecting section provided on one of the upper and lower sides of the peripheral edge portion of the wafer W to the light receiving section provided on the other of the upper and lower sides of the peripheral edge portion. The light receiving section receives light that has passed behind the side of the wafer W. The control section 10 detects the position of the center point 01 of the wafer W based on the light receiving state, and calculates the amount of offset between the center point 01 and the placement center point 03 of the alignment module 20. Thus, the calculation of the amount of offset of the handoff position and the teaching described above can be performed.

[0124] Thus, in the example of the Figure 12 , the alignment module 20 is a detection section whose position is different from the first reference position for the conveyance body (position within the load interlock module 3A) that is predetermined in advance in a manner that the conveyance body 42 receives and conveys the wafer W. In a manner that the offset between the conveyance body 42 moved to the first reference position for the conveyance body and the wafer W is stored, the wafer W is handed off to other members (in Figure 12 ​In the case of the conveyance mechanism 22) in the example, teaching can be performed by detecting the position of the wafer W with the detection section based on the conveyance destination of the other member. However, if the position of the wafer W can deviate when the conveyance body 42 is handed over to the other member, it is preferable to set the position in the detection section as the first reference position for the conveyance body, and perform teaching by detecting the position of the wafer W at the reference position.

[0125] In addition, by Figure 10 It is described in, for example, JP 2006- 1 1 1 1 1 A, JP 2006- 1 1 1 12 A, and JP 2006- 1 1 1 13 A that the amount of deviation of the wafer W is calculated in step S4 of the substrate processing apparatus 1, for example, based on image data, the amount of deviation of the handover position is calculated, and teaching is performed using the amount of deviation of the handover position. It is also possible to provide a device structure in which this teaching is not performed. For example, the control section 10 is configured to have a display section for displaying the amount of deviation of the wafer W and / or the amount of deviation of the handover position. Furthermore, steps S1 to S4 are executed as maintenance of the substrate processing apparatus 1. However, in step S4, teaching (i.e., update of the position data of the memory 1 1 ) is not performed, and the amount of deviation of the wafer W and / or the amount of deviation of the handover position that is acquired is displayed on the display section. In the case where the operator sees this display and determines that the amount of deviation is large, the operator can perform, for example, any arbitrary treatment such as inspection by releasing the formation of the vacuum atmosphere of the vacuum conveyance module 4 and the processing module 5. Even in the case where the structure is provided such that teaching is not performed as described above, the amount of deviation of the wafer W and the amount of deviation of the handover position can be easily acquired, and thus the burden on the operator when the operator grasps the state of the apparatus can be reduced, and thus this is preferable.

[0126] Furthermore, the conveyance bodies 41, 42 are described in a manner that hand over with respect to each module (both receiving the wafer W from the module and sending the wafer W to the module). However, it is also possible to provide a use in which only one of the conveyance bodies 41, 42 sends the wafer W to one module, and only the other receives the wafer W, and how the conveyance bodies 41, 42 are used to convey the wafer W in the vacuum conveyance module 4 is arbitrary. Thus, the position of the conveyance bodies 41, 42 determined by step S4 can be used as a position that only performs receiving with respect to the module or only performs sending. Even if used as a position that only performs receiving or only performs sending as described above, since this position is a position that can perform both receiving and sending with respect to the module, both the handover position, i.e., the receiving position and the sending position are determined in step S4.

[0127] In the vacuum transfer module 4, as for the transfer bodies, it is not limited to only two transfer bodies 41, 42, and more transfer bodies can be provided. Even if the number of transfer bodies is three or more as such, after the operator performs teaching by manual operation on one transfer body, the other transfer bodies can be automatically taught. For further explanation, teaching of the module can be performed by performing the operations of steps S1, S3, S4 on the other transfer bodies (i.e., the plurality of second transfer bodies) respectively. Further, as for step S2 (transfer of the wafer W to the first reference position for the substrate) performed by the first transfer body, a transfer body on which teaching of the module has been completed at the point in time when the step S2 is performed can be used. That is, a transfer body on which teaching has been performed by manual operation can be used, and if there is a transfer body on which automatic teaching has been completed among the above-mentioned other transfer bodies, that transfer body can be used. That is, in the present example, a transfer body that is a second transfer body sometimes functions as a first transfer body.

[0128] Further, as for the module to be taught, it is not limited to the processing module 5, the load interlock modules 3A, 3B, and can be, for example, the above-mentioned connection module. Also, in the substrate processing apparatus 1, the transfer bodies 41, 42 move within the housing 40 in a vacuum atmosphere, but can be an apparatus structure in which the transfer bodies 41, 42 move within the housing 40 in an atmospheric atmosphere. In the case where the housing 40 is an atmospheric atmosphere as such, the atmosphere within the processing module 5 connected to the housing 40 and from which the wafer W is delivered by the transfer bodies 41, 42 can be, for example, an atmospheric atmosphere. In addition, the substrate transferred in the present technology is not limited to a circular substrate, and can be a rectangular substrate.

[0129] It should be understood that the embodiments disclosed herein are illustrative in all respects, rather than restrictive. The above-described embodiments can be omitted, replaced, changed, and / or combined in various ways without departing from the scope of the appended claims and the spirit thereof.

[0130] Explanation of Reference Numerals

[0131] W: wafer; 3A: load interlock module; 4: vacuum transfer module; 40: housing; 41, 42: transfer body; 5: processing module.

Claims

1. A substrate transport method, comprising using a transport body to transport a substrate, the transport body being lifted from the bottom of a substrate transport area by magnetic force and supporting the substrate and moving laterally, the substrate transport method comprising the following steps: The preparation process involves preparing a substrate for a predetermined reference position within the module. The receiving process involves receiving the substrate at a first reference position for the substrate via the conveyor. as well as In the inspection process, the conveyor is moved to a predetermined first reference position for the conveyor to transport the substrate to the inspection unit, and the top-view position deviation between the position of the substrate and the predetermined second reference position for the substrate in the inspection unit is detected. The substrate transport area is a region within a vacuum transport module capable of creating a vacuum atmosphere. The module is a processing module that is capable of creating a vacuum atmosphere internally for processing the substrate and is connected to the vacuum conveying module. The preparation process, the receiving process, and the inspection process are performed under a vacuum atmosphere within the vacuum transfer module and the processing module. With the processing module set to a vacuum atmosphere, the substrate transport area is changed from an atmospheric atmosphere to a vacuum atmosphere. Next, in a vacuum atmosphere within the processing module and the substrate transport area, the preparation process, the receiving process, the inspection process, and the process of acquiring first data for positioning the transport body at a first reference position before performing the receiving process are carried out.

2. The substrate conveying method according to claim 1, characterized in that, It also includes a calibration process in which the position of the conveyor relative to the module for the transfer of the substrate is corrected based on the positional deviation.

3. The substrate conveying method according to claim 2, characterized in that, There are multiple conveying bodies, and the receiving process, the detection process, and the calibration process are performed on each of the conveying bodies.

4. The substrate conveying method according to any one of claims 1 to 3, characterized in that, The first reference position for the conveyor is the position within the detection unit.

5. The substrate conveying method according to any one of claims 1 to 3, characterized in that, Before the receiving process, a process is performed to obtain first data for positioning the conveyor at a first reference position for the conveyor.

6. The substrate conveying method according to claim 5, characterized in that, The process of acquiring the first data is the process of detecting the position of the conveyor by the detection unit and acquiring the first data based on the detection result of the position.

7. The substrate conveying method according to any one of claims 1 to 3, characterized in that, The receiving process includes the following steps: The position of the conveyor is detected using a detection device; and Based on the detection results of the position of the conveyor, the path of the conveyor to the module is changed.

8. A substrate transport method, comprising using a transport body to transport a substrate, the transport body being lifted from the bottom of a substrate transport area by magnetic force and supporting the substrate and moving laterally, the substrate transport method comprising the following steps: The preparation process involves preparing a substrate for a predetermined reference position within the module. The receiving process involves receiving the substrate at a first reference position for the substrate via the conveyor. as well as In the inspection process, the conveyor is moved to a predetermined first reference position for the conveyor to transport the substrate to the inspection unit, and the top-view position deviation between the position of the substrate and the predetermined second reference position for the substrate in the inspection unit is detected. The substrate transport area is a region within a vacuum transport module capable of creating a vacuum atmosphere. The module is a processing module that is capable of creating a vacuum atmosphere internally for processing the substrate and is connected to the vacuum conveying module. The preparation process, the receiving process, and the inspection process are performed under a vacuum atmosphere within the vacuum transfer module and the processing module. Prior to the preparation process, a process of acquiring second data is included, which is used to position the conveyor at a second reference position for conveying the substrate to a first reference position for conveying the substrate in an atmospheric state in the substrate conveying area and the processing module.

9. A substrate conveying device, comprising: A conveyor body that is lifted from the bottom of the substrate conveying area by magnetic force, supports the substrate, and moves laterally; The module, which uses the conveyor to transport the substrate to the substrate transport area; as well as The control unit outputs control signals to perform the following steps: preparation step, preparing a substrate at a predetermined reference position for a substrate in the module; The receiving step involves receiving the substrate at a first reference position for the substrate via the conveyor. The detection step involves moving the conveyor to a predetermined first reference position for the conveyor to transport the substrate to the detection unit, and detecting the top-view position deviation between the position of the substrate and a predetermined second reference position for the substrate in the detection unit. The substrate transport area is a region within a vacuum transport module capable of creating a vacuum atmosphere. The module is a processing module that is capable of creating a vacuum atmosphere internally for processing the substrate and is connected to the vacuum conveying module. The preparation step, the receiving step, and the detection step are performed under a vacuum atmosphere within the vacuum transfer module and the processing module. With the processing module set to a vacuum atmosphere, the substrate transport area is changed from an atmospheric atmosphere to a vacuum atmosphere. Next, the control unit outputs a control signal to perform the preparation step, the acceptance step, the detection step, and the step of acquiring first data for positioning the conveyor at a first reference position before performing the acceptance step, under a vacuum atmosphere in the processing module and the substrate conveying area.

10. A substrate conveying device, comprising: A conveyor body that is lifted from the bottom of the substrate conveying area by magnetic force, supports the substrate, and moves laterally; The module, which uses the conveyor to transport the substrate to the substrate transport area; as well as The control unit outputs control signals to perform the following steps: preparation step, preparing a substrate at a predetermined reference position for a substrate in the module; The receiving step involves receiving the substrate at a first reference position for the substrate via the conveyor. The detection step involves moving the conveyor to a predetermined first reference position for the conveyor to transport the substrate to the detection unit, and detecting the top-view position deviation between the position of the substrate and a predetermined second reference position for the substrate in the detection unit. The substrate transport area is a region within a vacuum transport module capable of creating a vacuum atmosphere. The module is a processing module that is capable of creating a vacuum atmosphere internally for processing the substrate and is connected to the vacuum conveying module. The preparation step, the receiving step, and the detection step are performed under a vacuum atmosphere within the vacuum transfer module and the processing module. The control unit outputs a control signal to perform a step of acquiring second data before the preparation step. The second data is used to position the conveyor at a second reference position for conveying the substrate to a first reference position for conveying the substrate to the substrate when the substrate conveying area and the processing module are in an atmospheric state.

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