Packaging module of integrated inductance element

Abstract

The invention discloses a packaging module of an integrated inductance element. The present application claims a package module comprising a conductive coil mounted on a substrate. The encapsulation module is encapsulated with a magnetic molding compound that covers the conductive coil. The conductive coil is a coil without a magnetic core, and a magnetic core is not arranged in the coil. The package module may also include an integrated circuit ("IC") chip disposed therein.

Description

TECHNICAL FIELD

[0001] The present disclosure relates generally to electrical devices, and more particularly, but not exclusively, to a package module. BACKGROUND

[0002] Power converters or power regulators are widely used in various electronic and / or electrical applications. A power converter or power regulator typically includes at least one power switch (e.g., a semiconductor switching device or a semiconductor transistor device). In operation, the power converter or power regulator provides a stable power (e.g., a stable voltage and / or current) to a load by controlling the operating state of the at least one power switch. An electric inductive energy storage device (e.g., an inductor or a transformer) is typically cooperated with the at least one power switch to perform power conversion. For example, a typical switching mode power converter known in the art controls the power switch to perform on and off switching to convert input power to output power for supplying to a load. For example, when the power switch is on, the switching mode power converter transfers energy from an input power source to the inductive energy storage device (e.g., a current will flow through the inductive energy storage device, and the current can gradually increase). When the power switch is off, energy will be released from the inductive energy storage device to the load (e.g., the current flowing through the inductive energy storage device can gradually decrease).

[0003] As the integration of electrical / electronic devices continues to increase, there is an increasing demand for power handling capability and smaller size of power devices or power management devices (e.g., power converters or power regulators). High power density power devices or power management devices have become a trend, which makes it a challenge to design or develop smaller size components in these devices. SUMMARY

[0004] It is an object of the present disclosure to provide a package module comprising: a substrate having a first surface and a second surface opposite to the first surface, wherein the second surface has a plurality of pins. A conductive coil directly mounted on the first surface of the substrate and having coil terminals integrally formed with the conductive coil, the coil terminals configured to be substantially coplanar with each other and directly attached to corresponding pads on the first surface of the substrate; a magnetic molding compound extending upwardly from the first surface of the substrate to encapsulate the package module including the conductive coil; and an Integrated Circuit (IC) chip disposed in the package module and configured to cooperate with the conductive coil. BRIEF DESCRIPTION OF DRAWINGS

[0005] For a better understanding of the present application, embodiments thereof will now be described in relation to the following drawings, by way of example only. The drawings are not necessarily to scale and the embodiments are not to be construed as limiting.

[0006] FIG. 1 A block diagram of a power management device 100 is illustratively shown in accordance with one embodiment of the present disclosure.

[0007] FIG. 2A A top view of a package module 10 for power conversion is illustratively shown in accordance with one embodiment of the present disclosure.

[0008] FIG. 2B A cross-sectional view of the package module 10 taken along the section line A-A' in a top view of the package module 10 is illustratively shown in accordance with one embodiment of the present disclosure. FIG. 2A

[0009] FIG. 2C A top view of a package module 20 for power conversion is illustratively shown in accordance with one embodiment of the present disclosure.

[0010] FIG. 2D A cross-sectional view of the package module 20 taken along the section line A-A' in a top view of the package module 20 is illustratively shown in accordance with one embodiment of the present disclosure. FIG. 2C

[0011] FIG. 2E A cross-sectional view of the package module 20 taken along the section line A-A' in a top view of the package module 20 is illustratively shown in accordance with one embodiment of the present disclosure. FIG. 2F FIG. 2C

[0012] FIG. 2G A waveform diagram of a plot of relative permeability μr versus switching frequency of the MMC 14 is illustratively shown in accordance with one embodiment of the present disclosure.

[0013] FIG. 3A A top view of a package module 30 for power conversion is illustratively shown in accordance with one embodiment of the present disclosure.

[0014] FIG. 3B A cross-sectional view of the package module 30 taken along the section line A-A' in a top view of the package module 30 is illustratively shown in accordance with one embodiment of the present disclosure. FIG. 3A

[0015] FIG. 3C A top view of a package module 40 for power conversion is illustratively shown in accordance with one embodiment of the present disclosure.

[0016] FIG. 3D A cross-sectional view of the package module 40 taken along the section line A-A' in a top view of the package module 40 is illustratively shown in accordance with one embodiment of the present disclosure. FIG. 3C

[0017] FIG. 4A ​​​​​​A top view of a package module 50 for power conversion according to one embodiment of the disclosure is schematically illustrated.

[0018] FIG. 4B A cross-sectional view of the package module 50 taken along the section line A-A' in the top view of FIG. 4A

[0019] FIG. 3A A cross-sectional view of the package module 50 taken along the section line A-A' in the top view of FIG. 3B

[0020] FIG. 4A A top view of a package module 60 for power conversion according to one embodiment of the disclosure is schematically illustrated.

[0021] FIG. 4B A cross-sectional view of the package module 60 taken along the section line A-A' in the top view of FIG. 4A

[0022] FIG. 4B A cross-sectional view of the package module 60 taken along the section line A-A' in the top view of FIG. 4C

[0023] FIG. 4A A perspective top view of a package module 70 for power conversion according to one embodiment of the disclosure is schematically illustrated.

[0024] FIG. 5A A cross-sectional view of the package module 70 taken along the section line A-A' in the perspective top view of FIG. 5B

[0025] FIG. 5A A perspective top view of a package module 80 for power conversion according to one embodiment of the disclosure is schematically illustrated.

[0026] FIG. 5C A cross-sectional view of the package module 80 taken along the section line A-A' in the perspective top view of FIG. 5A

[0027] FIG. 3A A three-dimensional perspective view of a package module 81 for power conversion according to an alternative embodiment of the disclosure is schematically illustrated.

[0028] FIG. 3B A three-dimensional perspective view of a package module 81 for power conversion according to an alternative embodiment of the disclosure is schematically illustrated. FIG. 5A ​​​​​​The perspective side view of the encapsulation module 81 when viewed from the right side of the three-dimensional perspective view (as shown by arrow 802).

[0029] FIG. 5B A perspective top view of a package module 81 for power conversion according to an embodiment of the present disclosure is shown schematically.

[0030] FIG. 5C A schematic three-dimensional perspective view of a package module 82 for power conversion according to an embodiment of the present disclosure is shown.

[0031] FIG. 5B An enlarged top view of a conductive coil 13 according to an embodiment of the present disclosure is shown schematically.

[0032] FIG. 5C and FIG. 2A to FIG. 4C Enlarged perspective side views of a conductive coil 13 according to one embodiment of the present disclosure are shown schematically.

[0033] FIG. 6A and FIG. 6B Enlarged perspective side views of a conductive coil 13 according to one embodiment of the present disclosure are shown schematically.

[0034] FIG. 6A A perspective top view of a packaged module 82 for power conversion according to an embodiment of the present disclosure is shown schematically.

[0035] FIG. 6A A perspective top view of a packaged module 90 for power conversion according to an embodiment of the present disclosure is shown schematically.

[0036] FIG. 5A The illustration schematically shows an embodiment of the present disclosure along... FIG. 5B The cross-sectional view of the package module 90 taken by section line A-A' in the perspective top view.

[0037] FIG. 6A A perspective top view of a packaged module 91 for power conversion according to an embodiment of the present disclosure is shown schematically.

[0038] FIG. 6B The illustration schematically shows an embodiment of the present disclosure along... FIG. 5A The cross-sectional view of the package module 91 taken by section line A-A' in the perspective top view.

[0039] FIG. 5B The illustration schematically shows a perspective top view of a packaged module 92 for power conversion according to an embodiment of the present disclosure.

[0040] FIG. 7A The illustration schematically shows an embodiment of the present disclosure along...FIG. 7B The cross-sectional view of the package module 92 taken by section line A-A' in the perspective top view.

[0041] FIG. 7A The illustration schematically shows a perspective top view of a packaged module 94 for power conversion according to an embodiment of the present disclosure.

[0042] FIG. 3A The illustration schematically shows an embodiment of the present disclosure along... FIG. 3B The cross-sectional view of the package module 94 taken by section line A-A' in the perspective top view.

[0043] FIG. 7A The illustration schematically shows a perspective top view of a packaged module 96 for power conversion according to an embodiment of the present disclosure.

[0044] FIG. 7B The illustration schematically shows an embodiment of the present disclosure along... FIG. 7C The cross-sectional view of the packaged module 96 taken by section line A-A' in the perspective top view.

[0045] FIG. 7C A simulated waveform diagram showing the relationship between the power conversion efficiency of a packaged module and the operating current of the packaged module (e.g., the load current provided at the output of the packaged module) according to an embodiment of the present disclosure is shown.

[0046] FIG. 7D A process flow diagram of a method 900 for manufacturing a power conversion package module according to an embodiment of the present disclosure is shown.

[0047] FIG. 7C A process flow diagram of a method 1000 for manufacturing a power conversion package module according to an alternative embodiment of the present disclosure is shown.

[0048] The same reference numerals in different schematic diagrams indicate the same or similar parts or features. Detailed Implementation

[0049] Specific embodiments of the present invention will now be described in detail. It should be noted that the embodiments described herein are for illustrative purposes only and are not intended to limit the invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be apparent to those skilled in the art that these specific details are not necessary to practice the invention. In other embodiments, well-known circuits, materials, or methods have not been specifically described in order to avoid obscuring the invention.

[0050] In the specification and claims of this invention, the use of terms such as "left," "right," "inner," "outer," "upper," "lower," "above," and "below" is merely for descriptive convenience and does not indicate a necessary or permanent relative position of components / structures. Those skilled in the art should understand that such terms can be used interchangeably where appropriate, for example, so that embodiments of the invention can still operate in orientations different from those described in this specification. In the context of this invention, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element, or there may be an intermediate layer / element between them. Furthermore, the terms "coupled" and "connected" mean a direct or indirect electrical or non-electrical connection. "One / this / that" is not used to specifically refer to the singular but may encompass the plural form. Phrases such as "an embodiment," "an example," "an example," and "example" appearing throughout the specification do not necessarily refer to the same embodiment or example. Those skilled in the art should understand that the various specific features, structures, parameters, steps, etc., disclosed in one or more embodiments of this invention can be combined in any suitable manner. The term “and / or” as used herein includes any and all combinations of one or more of the related listed items.

[0051] When a field-effect transistor (FET) or a bipolar junction transistor (BJT) is used as an embodiment of a transistor, the terms "gate," "drain," and "source" encompass "base," "collector," and "emitter," respectively, and vice versa. Those skilled in the art will understand that the meanings of the above terms are not necessarily limiting, but merely illustrative examples.

[0052] Furthermore, if the present invention uses terms such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination should be considered non-existent and not within the scope of protection claimed by the present invention.

[0053] For ease of explanation, this disclosure may use specific semiconductor devices as examples, but this is not limiting. Those skilled in the art will understand that the structures and principles taught in this disclosure are also applicable to other semiconductor devices. The following will refer to… FIG. 7E Various embodiments are discussed. The detailed descriptions given herein in conjunction with the accompanying drawings are for illustrative purposes only and should not be construed as limiting.

[0054] FIG. 7A A block diagram of a power management device 100 according to an embodiment of the present disclosure is shown as an example. The power management device 100 can be used to supply power from a power source to a load. The power management device 100 may have an input terminal IN for receiving input power from the power source and an output terminal OUT for providing output power. The power source may include a power source such as a battery / battery pack, or other circuitry that can be used to supply power to external circuitry. FIG. 7B In the example, the power supply provides power in the form of an input voltage VIN, which can be a DC voltage. However, this is not a limitation, and power supplies that can provide input power to the power management device 100 in other forms are also applicable.

[0055] In one embodiment, the power management device 100 may include a power switching unit 110. The power switching unit 110 may be adapted to respond to a control signal (e.g., FIG. 7C to FIG. 7E The control signal CTRL shown in the example is used to regulate the energy or power transmitted from the input IN to the output OUT (or to the load). In one embodiment, the power switching unit 110 may include at least one power switch, such as a power transistor device, which can be controlled to turn on and off. In one embodiment, the power switching unit 110 may further include a driver 160 for driving at least one power switch in the power switching unit 110.

[0056] According to an exemplary embodiment, the power switching unit 110 may be configured to operate based on a control signal (e.g., FIG. 7C The control signal CTRL shown controls the switching between energy storage and energy release in the inductive energy storage device 120, thereby controlling the input power (e.g., FIG. 7D The input voltage (in the form of VIN and / or IN) is converted into output power (e.g., FIG. 7C to FIG. 7EThe output voltage VOUT and / or Io can be regulated in the form of regulating the output voltage VOUT and / or Io. During the energy storage process, energy can be transferred to and stored in the inductive energy storage device 120 (e.g., current will flow through the inductive energy storage device 120, and the current will gradually increase). During the energy release process, energy can be released from the inductive energy storage device 120 and transferred out (e.g., the current flowing through the inductive energy storage device 120 will gradually decrease). Generally, the power switching unit 110 is coupled with the inductive energy storage device 120, the time period during which energy is transferred from the input IN to the inductive energy storage device 120 for energy storage can be referred to as the on-time Ton (which can also be considered as the on-time of the power switching unit 110, or the on-time of the power management device 100), and the time period during which energy is transferred from the inductive energy storage device 120 to the output OUT for energy release can be referred to as the off-time Toff (which can also be considered as the off-time of the power switching unit 110, or the off-time of the power management device 100). The sum of the on-time Ton and the off-time Toff experienced by the inductive energy storage device 120 each time the energy storage and energy release switching is completed can be referred to as a working cycle or switching cycle Top of the power management device 100, and the ratio of the on-time Ton to the sum of the on-time Ton and the off-time Toff in each working cycle Top can be referred to as the on-duty of the power switching unit 110 or the duty of the power management device 100. The control signal (e.g., the control signal CTRL shown in FIG. 1) can be used to control the power switching unit 110 to implement the switching of the energy storage and energy release of the inductive energy storage device 120, and can be used to adjust the on-time Ton and / or the off-time Toff, the duty, or the switching cycle Top (or the switching frequency Fop = 1 / Top). In this way, the energy or power transferred to the power switching unit 110 can adjust the output power of the output OUT in each switching cycle. For example, the output power can be adjusted in the form of adjusting the output voltage VOUT and / or the output current Io. FIG. 7C The output voltage VOUT and / or Io can be regulated in the form of regulating the output voltage VOUT and / or Io. During the energy storage process, energy can be transferred to and stored in the inductive energy storage device 120 (e.g., current will flow through the inductive energy storage device 120, and the current will gradually increase). During the energy release process, energy can be released from the inductive energy storage device 120 and transferred out (e.g., the current flowing through the inductive energy storage device 120 will gradually decrease). Generally, the power switching unit 110 is coupled with the inductive energy storage device 120, the time period during which energy is transferred from the input IN to the inductive energy storage device 120 for energy storage can be referred to as the on-time Ton (which can also be considered as the on-time of the power switching unit 110, or the on-time of the power management device 100), and the time period during which energy is transferred from the inductive energy storage device 120 to the output OUT for energy release can be referred to as the off-time Toff (which can also be considered as the off-time of the power switching unit 110, or the off-time of the power management device 100). The sum of the on-time Ton and the off-time Toff experienced by the inductive energy storage device 120 each time the energy storage and energy release switching is completed can be referred to as a working cycle or switching cycle Top of the power management device 100, and the ratio of the on-time Ton to the sum of the on-time Ton and the off-time Toff in each working cycle Top can be referred to as the on-duty of the power switching unit 110 or the duty of the power management device 100. The control signal (e.g., the control signal CTRL shown in FIG. 1) can be used to control the power switching unit 110 to implement the switching of the energy storage and energy release of the inductive energy storage device 120, and can be used to adjust the on-time Ton and / or the off-time Toff, the duty, or the switching cycle Top (or the switching frequency Fop = 1 / Top). In this way, the energy or power transferred to the power switching unit 110 can adjust the output power of the output OUT in each switching cycle. For example, the output power can be adjusted in the form of adjusting the output voltage VOUT and / or the output current Io.

[0057] According to exemplary embodiments, the power switching unit 110 can be configured to work with the inductive energy storage device 120 to implement the power conversion topology 130. The power conversion topology 130 can include any isolated or non-isolated synchronous or non-synchronous power conversion topology, including but not limited to DC-DC power conversion topology, AC-DC power conversion topology, DC-AC power conversion topology, etc. In one example, the power conversion topology 130 can include a synchronous non-isolated DC-DC power conversion topology, for example, a DC-DC buck power conversion topology, a DC-DC boost power conversion topology, a DC-DC buck-boost power conversion topology.

[0058] In one embodiment, the power management device 100 can further include a control unit 140 to provide control signals for controlling the power switching unit 110. In one embodiment, the control unit 140 can be adapted to provide control signals to the power switching unit 110 based on information indicative of the input voltage VIN and / or information indicative of the output voltage VOUT and / or information indicative of the output current lo, etc.

[0059] In one embodiment, a capacitive energy storage unit 150 can be coupled to the output OUT. The capacitive energy storage unit 150 can include, for example, one or more capacitors, and can be used as an output filter to smooth the output voltage VOUT at the output OUT. Those skilled in the art will appreciate that the power management device 100 can include other active and / or passive elements, which are not described herein for brevity.

[0060] Conventionally, passive elements (e.g., inductive energy storage device 120, among others) are provided in the form of discrete devices that occupy a large physical volume or space that cannot be mounted on a substrate or circuit board of an application system in which the power management device 100 can be used. For example, conventional inductors are provided in the form of a separate packaged discrete device that is formed by providing a magnetic core (e.g., a ferrite core) on a substrate (substrate of the packaged discrete inductor), and providing a conductive winding around the magnetic core, and then molding the magnetic core and the corresponding winding within a conventional molding compound (e.g., plastic, epoxy, etc.) to form the packaged discrete inductive / magnetic device. The packaged discrete inductive / magnetic device has electrical leads extending from the substrate thereof so that the packaged discrete inductor / magnetic device can be mounted to another substrate or circuit board of a larger system (e.g., a power converter). Examples of such packaged discrete inductive / magnetic devices are disclosed in U.S. Patent No. 5,787,569, entitled "Package for Power Magnetic Devices and Method of Manufacturing the Same," to Lotfi et al. ("Lotfi"), issued August 4, 1998, and U.S. Patent No. 7,462,317, entitled "Method of Manufacturing a Magnetic Device Package," to Lotfi et al. ("Lotfi"), issued December 9, 2008.

[0061] Furthermore, such a separate packaged discrete inductive / magnetic device, when used in a power management device (e.g., a power converter), can need to be packaged together with other components (e.g., power switching devices, capacitors, resistors, etc.) as a power converter module, which is typically packaged using a conventional molding compound (e.g., plastic, epoxy, etc.), which can greatly limit the minimum physical size of the power converter module.

[0062] To improve the integration density and / or power density of the power management device 100 and / or the application system including the device, in one embodiment, the power switching unit 110 and the inductive energy storage device 120 may be integrated into a single package module, which may be packaged using a magnetic molding compound (MMC) instead of conventional molding compounds (e.g., plastics, epoxy compounds, etc.). Compared to conventional power converter modules that use separately packaged discrete inductors / magnetic devices to implement the inductive energy storage device 120 and / or use separately packaged discrete inductors / magnetic devices and other components packaged with conventional molding compounds, the package modules according to various embodiments of this disclosure can have smaller size or physical dimensions and occupy less space when mounted on a circuit board. In one embodiment, the power switching unit 110 may be implemented and fabricated in an integrated circuit (IC) chip. In one embodiment, the control unit 140 may be fabricated and / or integrated with the power switching unit 110 on the same IC chip. In another embodiment, the control unit 140 may be fabricated and / or integrated with the power switching unit 110 on a different IC chip. In another embodiment, the control unit 140 may be provided by other circuitry of the application system that includes the power management device 100. For example, a microcontroller in the application system may be configured to implement the functions of the control unit 140.

[0063] FIG. 7D A top view of the encapsulation module 10 according to an embodiment of the present disclosure is shown schematically. FIG. 7D The encapsulation module 10 according to an embodiment of the present invention is schematically shown along... FIG. 7A A cross-sectional view taken by section line A-A' in the top view. FIG. 7B Top view and FIG. 7C to FIG. 7E The cross-sectional view in the diagram can be viewed as being shown in a three-dimensional coordinate system with mutually perpendicular x-axis, y-axis, and z-axis. It can be understood that the schematic cross-sectional view can be viewed as being observed / cut from a cutting plane parallel to the xz plane defined by the x-axis and z-axis. In this disclosure, "transverse" can refer to a direction parallel to the x-axis, while "longitudinal" can refer to a direction parallel to the z-axis in the cross-sectional view. Length can refer to a dimension measured along a direction parallel to the x-axis, width can refer to a dimension measured along a direction parallel to the y-axis, and height, depth, and / or thickness can refer to dimensions measured along a direction parallel to the z-axis. In other words, the x-axis direction refers to the length direction of the package module 10, the y-axis direction refers to the width direction of the package module 10, and the z-axis direction refers to the height direction of the package module 10. This can be combined with... FIG. 7E and FIG. 7E To describe and understand encapsulated module 10.

[0064] The package module 10 can include a substrate 11, a power switching unit 12, and a conductive coil 13. The conductive coil 13 can be mounted on the substrate 11. The power switching unit 12 can also be provided in the package module 10. In one embodiment, the power switching unit 12 and the conductive coil 13 can be mounted on the substrate 11 such that the power switching unit 12 and the conductive coil 13 can cooperate or collaborate with each other. For example, the power switching unit 12 can be coupled to the conductive coil 13. Other circuit components, such as a capacitive energy storage device 15 (e.g., a capacitor), a resistive device 16 (e.g., a resistor), and / or other elements 17, etc., can also be mounted on the substrate 11. A magnetic molding compound 14 (MMC) can be used to package the package module 10, e.g., to encapsulate or wrap the components mounted on the substrate 11, including but not limited to the power switching unit 12 and / or the conductive coil 13. In one embodiment, the package module 10 for power conversion can be configured to implement the power management device 100 or at least the power conversion topology 130 of the power management device 100.

[0065] The power switching unit 12 can be an implementation of the power switching unit 110 as described above with reference to the examples of FIG. 7F For example, the power switching unit 12 can be a semiconductor chip or an integrated circuit chip that integrates an integrated circuit for performing the functions of the power switching unit 110. With reference to the example shown in FIG. 7F The power switching unit 12 can have conductive pads 121 formed at a top surface 12T (e.g., also referred to as an active surface) thereof to electrically lead out terminals of the integrated circuit formed inside the power switching unit 12, such that the power switching unit 12 can be directly attached to the substrate 11, e.g., to a first surface 11U of the substrate 11 with the top surface 12T flipped down to face the first surface 11U of the substrate 11. In one embodiment, each conductive pad 121 can be connected with a conductive pillar / bump 123 that can be attached to the substrate 11 and connected to a corresponding pad (e.g., see pad 112) formed on the first surface 11U through a conductive die attach material 124 (e.g., solder paste). The top surface 12T (e.g., active surface) of the power switching unit 12 can refer to the surface on which the conductive pads 121 and / or the conductive pillars / bumps 123 are formed or attached. The back surface 12B of the power switching unit 12 is opposite to the top surface 12T. Thus, the power switching unit 12 can be referred to as a flip-chip semiconductor chip in this embodiment, with the top surface 12T adapted to be attached to the substrate 11. A bottom fill material 122 can be used to fill the cavities between the conductive pillars / bumps 123 and between the top surface 12T of the power switching unit 12 and the first surface 11U of the substrate 11. The bottom fill material 122 electrically isolates the conductive pads 121 and / or the conductive pillars / bumps 123 from the MMC 14.

[0066] The electrically conductive coil 13 can be made of an electrically conductive material, such as a metal, a metal composite, or an alloy, etc. For example, in one embodiment, the electrically conductive coil 13 can be made of copper, aluminum, nickel, or the like, or an alloy thereof. The electrically conductive coil 13 can be formed in various shapes, such that the electrically conductive coil 13 can be adapted to serve as one or more windings of an inductive energy storage device.

[0067] In one embodiment, as shown in the example of FIG. 7G and FIG. 7H , the electrically conductive coil 13 can be in a spiral shape, and can serve as one or more multi-turn windings of an inductive energy storage device. Although FIG. 7I and FIG. 7F show one multi-turn winding with its turns of wire wound along the x-axis direction (i.e., along the length direction of the package module), it should be understood that this is merely exemplary and not limiting. Those skilled in the art can readily understand that when talking about turns of wire wound along a particular direction (e.g., the x-axis direction in FIG. 7J and FIG. 7K ), the turns of wire are formed by winding / coiling the coil wire turn by turn around or about the particular direction, e.g., the turns of wire are unwound turn by turn along the particular direction. In some embodiments, the electrically conductive coil 13 can form a flat wire multi-turn winding by winding / coiling flat coil wire. In some other embodiments, the electrically conductive coil 13 can form a round wire multi-turn winding by winding / coiling round coil wire. In some other alternative examples, the electrically conductive coil 13 can form more turns according to actual application needs, and each winding can have single-turn or multi-turn wire winding, and the turns of wire do not have to be wound along the x-axis direction. The turns of each winding can be wound along other directions without departing from the spirit of the present disclosure.

[0068] In the examples of FIG. 7F and FIG. 7L , although the main body of the electrically conductive coil 13 (as shown by the dashed box 13S, substantially including the turns of each winding) is shown to be spaced apart from the substrate 11 in the vertical direction, it can be understood that in other embodiments, the main body of the electrically conductive coil 13 can also not be spaced apart from the substrate 11 in the vertical direction. For example, in some alternative embodiments, the main body of the electrically conductive coil 13 can be directly disposed on the substrate 11, and the bottom of the main body is substantially in contact with the substrate 11. Those skilled in the art should understand that the present disclosure cannot exhaust all variations, which can be obtained by studying the description and drawings of the present disclosure, and these variations do not depart from the spirit and scope of the present disclosure.

[0069] The electrically conductive coil 13 can have coil terminals (e.g., a first coil terminal 131 and a second coil terminal 132 for each winding) that are integrally formed with the electrically conductive coil 13. According to one embodiment, the coil terminals can be adapted to be directly attached to the substrate 11, such that the electrically conductive coil 13 can be directly mounted on the substrate 11, and the inductive energy storage device can be coupled to the substrate 11. The term "integrally formed" essentially means that the coil terminals are implemented as an integral part of the electrically conductive coil 13, as the main body 13S, without the need for connection by additional means (e.g., soldering, brazing, etc.). From the perspective of being "adapted to be directly attached to the substrate 11", the coil terminals are configured to be substantially coplanar with each other, such that when the electrically conductive coil 13 is placed on the substrate 11, they can fall on the first surface 11U of the substrate 11 substantially simultaneously, without a significant vertical difference with respect to the first surface 11U. For example, the coil terminals are substantially coplanar with each other, with a misfit tolerance within a predetermined range (e.g., ±5%), so that the coil terminals can be reliably connected to the substrate 11 by an electrically conductive attachment material (e.g., solder paste). In certain embodiments, each coil terminal can be integrally connected with a certain turn of the electrically conductive coil 13 by a bent portion of the coil wire, depending on the predetermined direction in which the electrically conductive coil 13 is wound. The design of the electrically conductive coil 13 according to the exemplary embodiments of the present disclosure makes it easier to implement mass production, and improves the mounting yield and efficiency of mounting the electrically conductive coil 13 onto the substrate 11 using Surface Mount Technology (SMT), and reduces the complexity and cost of manufacturing and production, which has been a long-desired problem to be solved, as it is practically a serious challenge for a person of ordinary skill in the art to successfully and efficiently mount the electrically conductive coil 13 to meet the requirements of mass production, considering that the package module has a very small and limited size (e.g., in one embodiment, the size of the package module is no more than 2mm*3mm*1.5mm, to support a working current of up to 4A~6A), and the electrically conductive coil 13 accordingly should have a comparable small size (e.g., small enough to be accommodated in the package module) and be wound by very thin coil wires (e.g., in one embodiment, the wire diameter of the round coil wire is no more than 0.3mm, or in one embodiment, the wire thickness of the flat coil wire ranges from 0.03mm to 0.3mm), which are fragile and difficult to pick, place and connect (e.g., solder) during the mounting process. The embodiments of the present disclosure advantageously overcome these challenging challenges, and the electrically conductive coil 13 is less likely to fall off during the reflow soldering process.

[0070] The conductive coil 13, except for the coil terminals, can be conformally coated with a thin insulating layer 136. At least a portion (e.g., a bottom surface) of the coil terminals (e.g., the first coil terminal 131 and the second coil terminal 132 in the present embodiment) is not covered by the thin insulating layer 136. That is, the thin insulating layer 136 covering the conductive coil 13 is stripped at least at a portion (e.g., at a bottom surface) of the coil terminals (e.g., the first coil terminal 131 and the second coil terminal 132 in the present embodiment) so that the conductive coil 13 is suitable for direct attachment to the substrate 11, and the coil terminals are configured for providing electrical connections / couplings. For example, the coil terminals (e.g., the first coil terminal 131 and the second coil terminal 132 in the present embodiment) can be attached to respective pads (e.g., see the pads 112) on the first surface 11U of the substrate 11 by a conductive attachment material 133 (e.g., solder paste). Those skilled in the art can understand that the pads 112 can be formed on the first surface 11U of the substrate 11 according to actual design and connection requirements. For the sake of brevity, the thin insulating layer 136 will not be specifically shown in the drawings of the remaining examples or embodiments provided in the present disclosure, unless the thin insulating layer 136 can need to be described in certain embodiments.

[0071] The MMC 14 can provide a relatively high magnetic permeability (e.g., 20-50) and a relatively low core loss density. Those skilled in the art know that the magnetic permeability μ of a material is defined as the ratio of the magnetic induction density B (i.e., magnetic flux density) produced by a magnetizing field inside the material to the magnetic field strength H of the magnetizing field, i.e., μ = B / H, which helps to measure the resistance of the material to the magnetizing field, or the degree to which the magnetizing field penetrates the material. The relative magnetic permeability of a particular medium or material, often denoted by the symbol μr, is the ratio of the magnetic permeability of the particular medium or material to the permeability of free space μ0 (also known as the magnetic permeability in classical vacuum), i.e., μr= μ / μ0, where μ0≈4π×10 -7 H / m. Thus, the relative magnetic permeability of the MMC 14 is a dimensionless quantity defined as the ratio of the magnetic permeability of the MMC 14 to the permeability of free space μ0. In some embodiments, reference is made to FIG. 7A FIG. 6 shows a waveform diagram illustrating a relationship between the relative magnetic permeability μr of the MMC 14 and the switching frequency (e.g., the switching frequency of a packaged module) according to embodiments of the present disclosure, the relative magnetic permeability of the MMC 14 is substantially in the range of 20 to 25 to support packaged modules according to various embodiments of the present disclosure, which can be configured to operate at a switching frequency up to 100 MHz. In some embodiments, the MMC 14 with a relative magnetic permeability substantially between 20 to 25 can support the formation of an integrated inductive energy storage device including the MMC 14 and a conductive coil 13 with an inductance up to 2 μΗ.

[0072] In some embodiments, the MMC 14 extends upward from the first surface 11U of the substrate 11 and fills any space or volume not occupied by the components mounted on the substrate 11 up to the highest component of the components mounted on the substrate 11. The MMC 14 in one embodiment can include coated magnetic metal particles 142 dispersed in a non-magnetic material 141. In one embodiment, the non-magnetic material 141 can include a mixture including a resin (or epoxy), a hardener, and a catalyst, etc., but not including silica, meaning that the non-magnetic material 141 is free of silica. Each coated magnetic metal particle 142 can include a magnetic metal particle 143 and an insulating coating 144 surrounding or encasing the magnetic metal particle 143. That is, each magnetic metal particle 143 is coated and encapsulated inside the insulating coating 144, thereby being isolated from the non-magnetic material 141 by the insulating coating 144. The insulating coating 144 can include a layer of polymer, such as silane coupling agents. The insulating coating 144 can advantageously help to enhance the uniformity of dispersion of the coated magnetic metal particles 142 within the non-magnetic material 141 and to increase the resistivity of the MMC 14. In one embodiment, each magnetic metal particle 143 can include at least 60% iron. In one embodiment, the coated magnetic metal particles 142 can have non-uniform sizes and / or can have non-uniform / unequal (i.e., various) shapes to reduce viscosity and to increase magnetic permeability. The MMC 14 can have much higher thermal conductivity than conventional molding compounds (e.g., plastic, epoxy, etc.) because the coated magnetic metal particles 142 have higher thermal conductivity than conventional molding compound particles, which can greatly enhance the thermal conductivity of the MMC 14.

[0073] According to example embodiments, the electrically conductive coil 13 and the MMC 14 can form an integrated inductive energy storage device, which can be used as the inductive energy storage device 12 as referenced above with respect to FIG. 1. FIG. 7BThe inductive energy storage device 120 is described in the example. Through the interaction of the MMC 14 with the conductive coil 13, various embodiments of this disclosure can eliminate the need for conventional molding compounds (e.g., plastics, epoxy compounds, etc.) and the magnetic cores of conventionally separately packaged discrete inductors / magnetic devices, which occupy a large portion of the volume of conventional power converter modules. Therefore, according to various embodiments of this disclosure, on the one hand, due to the high permeability and other various properties of the MMC 14, and on the other hand, due to the design of the conductive coil 13, it is not necessary to include a magnetic core (e.g., a ferrite core) in the conductive coil 13. This can advantageously help reduce the physical size of the integrated inductive energy storage device without reducing its energy storage capacity / performance. In other words, the conductive coil 13 according to various embodiments of this disclosure can be referred to as coreless (or iron-free). An integrated inductive energy storage device according to various embodiments of this disclosure, including the MMC 14 interacting with the conductive coil 13, can be referred to as coreless (or iron-free). On the other hand, when the conductive coil 13 is integrated into a package module, the placement of the conductive coil 13 can be more flexible. For example, in FIG. 7F to FIG. 7J and FIG. 7L In the example, the conductive coil 13 and the corresponding power switching unit 12 are shown placed side-by-side on the substrate 11 and laterally spaced apart from each other. The size of the package module 10 is reduced compared to conventional power converter modules, at least because an integrated inductive energy storage device is used instead of a conventional separately packaged discrete inductor / magnetic device. Furthermore, the MMC 14 can advantageously enhance inductance and reduce the direct current resistance (DCR) of the inductive energy storage device. On the other hand, since the MMC 14 replaces the conventional molding compound for encapsulating the package module 10, this means that more space is saved in the package module 10 for the inductive energy storage device (i.e., the inductive energy storage device can occupy a larger proportion of the total volume of the package module 10). Therefore, a more complex structure can be used to reduce power losses caused by the inductive energy storage device, thereby improving the power conversion efficiency of the package module 10. For example, a power management device 100 can be packaged in the package module 10. On the other hand, since the thermal conductivity of MMC 14 is much higher than that of traditional molding compounds (such as plastics, epoxy compounds, etc.), it can enhance the thermal diffusion or heat dissipation of the internal components of the package module 10 (including but not limited to the power switch unit 12 and the conductive coil 13), thereby giving the package module 10 using MMC 14 packaging better heat dissipation performance.

[0074] Those skilled in the art should understand that, although in FIG. 7E and FIG. 7L The example shows one power switch unit 12 and one corresponding conductive coil 13, but more power switch units 12 and corresponding conductive coils 13 can be formed in the package module 10.

[0075] The substrate 11 can include a plurality of conductive wiring structures 111. Some of the conductive wiring structures 111 can be used to provide interconnections or electrical couplings between the power switching unit 12 and the corresponding conductive coil 13, such that the power switching unit 12 can control, in operation, the switching of energy storage and energy release in the inductive energy storage device including the corresponding conductive coil 13 and the MMC 14. During energy storage, energy can be transferred to and stored in the inductive energy storage device (e.g., current will flow through the inductive energy storage device and the current can gradually increase). During energy release, energy can be released and transferred out of the inductive energy storage device (e.g., the current flowing through the inductive energy storage device can gradually decrease). Some other conductive wiring structures 111 can be used to provide electrical couplings and / or electrical connections to enable electrical couplings and / or electrical connections and / or signal communications between elements inside the packaging module 10 (e.g., the power switching unit 12, the conductive coil 13, the capacitive energy storage device 15, the resistive device 16, or other elements 17, etc.) and / or between elements inside the packaging module 10 and other external circuits or elements outside the packaging module 10. The substrate 11 can have a single substrate layer, or alternatively, a plurality of substrate layers. The second surface 11D of the substrate 11 opposite to the first surface 11U can be configured as the pin side of the substrate 11, which has a plurality of pins (indicated by solid black bars in the cross-sectional view; see, e.g., the pins 113) that connect nodes of the packaging module 10 to components outside the packaging module 10. In the present embodiment, the pins can be pads or other means for electrically connecting the nodes and the components. FIG. 2A to FIG. 6B

[0076] FIG. 7A to FIG. 7L A top view of a packaging module 20 for power conversion according to an embodiment of the present application is shown. FIG. 8A A cross-sectional view of the packaging module 20 taken along the cross-sectional line A-A’ in the top view of FIG. 8B A cross-sectional view of the packaging module 20 taken along the cross-sectional line A-A’ in the top view of FIG. 8A FIG. 3A Much of the description made above for the packaging module 10 applies to the packaging module 20 in the example. One of the differences is that, in the packaging module 20, the conductive coil 13 can have a bridge shape formed to extend along a predetermined direction (e.g., in the direction of the arrow 13D in the cross-sectional view of FIG. 20A) and to extend across the MMC 14. The bridge shape of the conductive coil 13 can be formed by a plurality of conductive coil segments 13S (e.g., see the conductive coil segments 13S in the cross-sectional view of FIG. 20A) that are electrically coupled to each other and that are arranged in a bridge shape. The bridge shape of the conductive coil 13 can be formed by a plurality of conductive coil segments 13S (e.g., see the conductive coil segments 13S in the cross-sectional view of FIG. 20A) that are electrically coupled to each other and that are arranged in a bridge shape. FIG. 3B FIG. 8A Much of the description made above for the packaging module 10 applies to the packaging module 20 in the example. One of the differences is that, in the packaging module 20, the conductive coil 13 can have a bridge shape formed to extend along a predetermined direction (e.g., in the direction of the arrow 13D in the cross-sectional view of FIG. 20A) and to extend across the MMC 14. The bridge shape of the conductive coil 13 can be formed by a plurality of conductive coil segments 13S (e.g., see the conductive coil segments 13S in the cross-sectional view of FIG. 20A) that are electrically coupled to each other and that are arranged in a bridge shape. The bridge shape of the conductive coil 13 can be formed by a plurality of conductive coil segments 13S (e.g., see the conductive coil segments 13S in the cross-sectional view of FIG. 20A) that are electrically coupled to each other and that are arranged in a bridge shape. FIG. 8B FIG. 8C ​​​​In the example, the single-turn winding in the form of a conductive sheet wound along the y-axis direction is advantageous for further reducing the physical size and manufacturing cost of the packaged power module 20. It is readily understood that the conductive coil 13 forming the single-turn winding is not limited to a bridge shape, but can also be other suitable shapes, such as approximately rectangular, approximately semi-elliptical, etc., wound along a predetermined direction. For example, FIG. 8D The diagram shows a conductive coil 13 comprising a single-turn winding, the winding being in the form of a conductive sheet, along a predetermined direction (e.g., in...). FIG. 8C In the example, the wrapping is along the y-axis, and the shape is basically rectangular. For another example, FIG. 8E As shown, the conductive coil 13 includes a single-turn winding, which is in the form of a conductive sheet, along a predetermined direction (e.g., in...). FIG. 8F In the example, the coil is wound along the y-axis and is approximately semi-elliptical in shape. On the other hand, the conductive coil 13 in the form of a single turn or a single-turn winding can have a lower DCR and is advantageous for supporting higher currents or higher power that the package module 20 can handle. The bottom surface of the body 13S of the conductive coil 13 and the bottom surface of the coil terminals (e.g., the first coil terminal 131 and the second coil terminal 132) are substantially flat, making it easier to mount the conductive coil 13 on the substrate 11.

[0077] FIG. 8E A top view schematically illustrates a packaged module 30 for power conversion according to an embodiment of the present disclosure. FIG. 8G The illustration schematically shows the path along the embodiment of this disclosure. FIG. 8H The top view shows a cross-sectional view of the packaged module 30 taken along section line A-A'. Those skilled in the art will understand that the above references... FIG. 8G and FIG. 8H The description of the encapsulation module 10 is mostly applicable to FIG. 8I and FIG. 8JThe package module 30 in the example. One of the differences is that in the package module 30, the conductive coil 13 can be placed like a bridge across the corresponding power switch unit 12. In the package module 30, the conductive coil 13 and the corresponding power switch unit 12 can be considered to be arranged in a vertical stack along the z-axis direction, but vertically spaced from each other. In one embodiment, the conductive coil 13 in the package module 30 can have legs, for example, can include a first leg 134 and a second leg 135 to connect the number of turns of winding to the coil terminals, for example, a first coil terminal 131 and a second coil terminal 132, respectively. The legs such as the first leg 134 and the second leg 135 are integrally formed with the coil terminals and the winding turns of the conductive coil 13. In some embodiments, each coil terminal can be integrally connected with the coil terminal of the conductive coil 13 by a curved portion of the coil wire. The legs such as the first leg 134 and the second leg 135 can also help support and vertically lift the main body 13S of the conductive coil 13 to form a vertical space 13_V between the main body 13S of the conductive coil 13 and the substrate 11, so that the corresponding power switch unit 12 can be placed in the vertical space 13_V. The package module 30 can advantageously further reduce the physical size, have higher package volume utilization efficiency, and higher integration density and / or power density.

[0078] FIG. 8I A top view of a package module 40 for power conversion according to an embodiment of the present disclosure is shown. FIG. 8J A cross-sectional view of the package module 40 taken along the section line A-A’ in the top view of FIG. 7F to FIG. 7L is schematically shown. Those skilled in the art will appreciate that much of the description made above with respect to FIG. 7C to FIG. 7E and FIG. 7F to FIG. 7L the package module 30 applies to the package module 40 in the example. FIG. 8K and FIG. 7F to FIG. 7L One of the differences can be that in the package module 40, the conductive coil 13 can have a bridge shape, formed as a single-turn winding, placed like an overpass above the corresponding power switch unit 12, which is advantageous for further reducing the physical size of the package power module 40.

[0079] FIG. 8K A top view of a package module 50 for power conversion according to an embodiment of the present disclosure is schematically shown. FIG. 9 A cross-sectional view of the package module 50 taken along the section line A-A’ in the top view of FIG. 8A is schematically shown. Those skilled in the art will appreciate that much of the description made above with respect to FIG. 8B and FIG. 2A to FIG. 8B the package module 30 applies to the package module 50 in the example. FIG. 2A to FIG. 8J and FIG. 10The package module 50 in the example. One of the differences is that in the package module 50, the conductive coil 13 can be in a spiral shape, wound multiple turns along the z-axis direction (i.e., along the direction of the height of the package module), forming one or more windings of an inductive energy storage device, such as the inductive energy storage device 120 of the power management device 100. Although FIG. 2A to FIG. 8J and ​ only one winding is shown in the example, it should be understood that more windings can be formed according to the actual application requirements. In one embodiment, the conductive coil 13 and the corresponding power switching unit 12 can still be arranged in a vertical stack along the z-axis dimension in the package module 50. In one embodiment, for example, the conductive coil 13 in the package module 50 can span over the corresponding power switching unit 12 like a cloverleaf, and can have a first leg 134 and a second leg 135 to connect the number of turns of the winding to the first coil terminal 131 and the second coil terminal 132, respectively. The first leg 134 and the second leg 135 can also help create a vertical space 13_V between the conductive coil 13 and the substrate 11, so that the corresponding power switching unit 12 can be placed in the vertical space 13_V.

[0080] ​ A cross-sectional view of the package module 50 taken along the section line A-A’ in the top view of ​ is schematically shown according to an alternative embodiment of the present disclosure. In the alternative embodiment, for example, the power switching unit 12 can be disposed within the hollow space 13_M in the package module 50 surrounded by the winding turns of the conductive coil 13. That is, the conductive coil 13 in this embodiment can be placed around the corresponding power switching unit 12, e.g., the winding turns of the conductive coil 13 surround the corresponding power switching unit 12. This can further help improve the package volume utilization efficiency, thereby further reducing the physical size of the package module 50 while improving the integration density and / or power density.

[0081] ​ A top view of a package module 60 for power conversion according to an embodiment of the present disclosure is schematically shown. ​ A cross-sectional view of the package module 60 taken along the section line A-A’ in the top view of ​ is schematically shown according to an embodiment of the present disclosure. ​ A cross-sectional view of the package module 60 taken along the section line A-A’ in the top view of ​ is schematically shown according to an alternative embodiment of the present disclosure. It should be understood by those skilled in the art that most of the descriptions made above with respect to the package module 30 apply to the package module 60 as well. ​ and ​ ​ , ​ and ​ ​The example shows encapsulated module 60. One difference might be that, as... ​ As shown in the example, a non-magnetic protective layer 41 can be formed to at least shield the back surface 12B of the power switch unit 12 in the package module 60, which is opposite to the top surface 12T of the power switch unit 12. Optionally, the non-magnetic protective layer 41 can be conformally formed on the substrate 11 and cover the components mounted on the substrate 11, such as... ​ As shown in the example.

[0082] When each package module according to the various embodiments of this disclosure is in operation (e.g., when used in an application system), current flows through the conductive coil 13, and the inductive energy storage device including the conductive coil 13 and the MMC 14 generates a certain amount of heat, which may affect the chip junction temperature or operating chip temperature of the power switching unit 12. For example, the heat generated by the inductive energy storage device may cause the chip junction temperature of the power switching unit 12 to rise undesirably, resulting in a degraded electrical performance of the power switching unit 12.

[0083] On one hand, the non-magnetic protective layer 41 provides thermal isolation between the power switching unit 12 and the inductive energy storage device. On the other hand, the non-magnetic protective layer 41 can act as a buffer layer, providing thermal-mechanical compliance between the MMC 14 and the components molded therein to mitigate stress during environmental life testing (e.g., temperature cycling, thermal shock, etc.), thereby improving the thermal-mechanical reliability of the packaged power module according to various examples of this disclosure. In one embodiment, the non-magnetic protective layer 41 may include a polymer layer comprising a polymer composition having high toughness and low thermal conductivity, and at least help reduce the impact of heat generated by the inductive energy storage device on the power switching unit 12. On the other hand, the MMC 14 contains magnetic metal particles 143, which may damage the semiconductor chip (e.g., silicon chip) of the power switching unit 12, and the non-magnetic protective layer 41 can help protect the power switching unit 12 from potential damage from the magnetic metal particles 143 in the MMC 14.

[0084] Those skilled in the art will understand that the non-magnetic protective layer 41 can be applied as described in this disclosure according to various examples (e.g., references). ​ Other embodiments described (the examples described)

[0085] ​ A perspective top view of a package module 70 for power conversion according to an embodiment of the present disclosure is shown schematically. ​ The diagram schematically illustrates the following according to an embodiment of the present disclosure.​ a cross-sectional view of the package module 70 taken along the section line A-A’ in the perspective top view. In ​ the perspective top view, the top surface of the conductive coating 51 is not shown so that the relevant features of the package module 70 can be observed. Those skilled in the art will appreciate that the above description of the package module 60 applies, in large part, to the package module 70 in the example. ​ and ​ The description of the package module 60 applies, in large part, to the package module 70 in the example. ​ and ​ The package module 70 can further include a conductive coating 51 that covers and shields the outer surface of the MMC 14, in contrast to the package module 60 shown in the examples. ​ and ​ The conductive coating 51 can be formed of a metal or a metal alloy, such as copper, nickel, etc. The conductive coating 51 can help reduce electromagnetic interference (EMI) of the package module 70 and enhance the heat dissipation and corrosion resistance of the package module 70.

[0086] Those skilled in the art will appreciate that the conductive coating 51 can be applied to other embodiments as described in the disclosure according to various examples.

[0087] ​ A perspective top view of a package module 80 for power conversion according to embodiments of the disclosure is schematically shown. ​ A cross-sectional view of the package module 80 taken along the section line A-A’ in the perspective top view is schematically shown. Those skilled in the art will appreciate that the above description of the package module 30 applies, in large part, to the package module 80 in the example. ​ and ​ The description of the package module 30 applies, in large part, to the package module 80 in the example. ​ and ​ The package module 80 can further include a conductive coating 51 that covers and shields the outer surface of the MMC 14, in contrast to the package module 30 shown in the examples. ​ The conductive coating 51 can be formed of a metal or a metal alloy, such as copper, nickel, etc. The conductive coating 51 can help reduce electromagnetic interference (EMI) of the package module 80 and enhance the heat dissipation and corrosion resistance of the package module 80.The package module 70 in the example. One of the differences can be that the power switch unit 12 can be embedded in the substrate 11 in the package module 80. In addition, the structures for supporting the power switch unit 12 to be attached to the substrate 11, such as the conductive pillars / bumps 123, the underfill material 122, and the conductive die attach material 124, can be omitted. By embedding the power switch unit 12 in the substrate 11, more space can be saved to form the MMC 14 and the conductive coil 13 (thereby for forming the inductive energy storage device) and / or for placing other components of the power management device (such as the capacitive energy storage device 15, the resistive device 16, or other elements 17, etc.). With such a configuration, the package module 80 can further improve the package volume utilization efficiency, further reduce the physical size, improve the integration density and / or the power density. In addition, it also provides more flexibility for designing the conductive coil 13, such as providing more flexibility for the placement or mounting position of the conductive coil 13, the winding direction of the turns, and / or the shape of the wound turns, etc.

[0088] For example, ​ A three-dimensional perspective view of a package module 81 for power conversion according to an alternative embodiment of the present disclosure is schematically shown. In the example, ​ In the three-dimensional perspective view, other components are not shown in detail except for the conductive coil 13 embedded in the MMC 14 so as not to obscure the relevant features of the embodiment, but these components can be understood with reference to and in conjunction with the above-described figures of the embodiments. ​ A perspective side view of the package module 81 according to an embodiment of the present disclosure is schematically shown when viewed from the right side (as indicated by the arrow 802) in the three-dimensional perspective view. ​ A perspective side view of the package module 81 according to an embodiment of the present disclosure is schematically shown when viewed from the right side (as indicated by the arrow 802) in the three-dimensional perspective view. ​ A perspective top view of the package module 81 for power conversion according to an embodiment of the present disclosure is schematically shown.

[0089] Those skilled in the art will appreciate that most of the description made above ​ and ​ to the package module 80 applies to the package module 81 in the example of ​ One of the differences in one aspect can be that the conductive coil 13 in the package module 81 is exemplarily shown to include a multi-turn winding having turns of wire wound along the y-axis direction (i.e., along the width direction of the package module 81). The space or volume 801 enclosed by the coil of the conductive coil 13 (with reference to ​ and ​) filled with the MMC 14. The MMC 14 also wraps the electrically conductive coil 13 and any other components mounted to the substrate 11, as described in the above examples. By winding the number of turns of the electrically conductive coil 13 along the y-axis direction (i.e., along the width direction of the packaging module 81) or the x-axis direction (i.e., along the length direction of the packaging module 81), the packaging module 81 can be conveniently packaged together with the MMC 14 by, for example, a transfer molding process. It should be understood that in ​ the example, the size of the space or volume 801 is related to the size of the electrically conductive coil 13, which is one of the factors affecting the inductance of the inductive energy storage device. Embedding the power switching unit 12 in the substrate 11 and winding the number of turns of the electrically conductive coil 13 along the y-axis direction (i.e., along the width direction of the packaging module) can advantageously increase the size of the space or volume 801 or the size of the electrically conductive coil 13 under the condition of limited size of the packaging module, thereby helping to further increase the inductance of the inductive energy storage device and improve the performance of the packaging module under the condition of limited size.

[0090] Referring to ​ and ​ , in some embodiments, the main body 13S of the electrically conductive coil 13 can not be vertically spaced apart from the first surface 11U of the substrate 11. The bottom surface of the main body 13S of the electrically conductive coil 13 can be substantially flat, which can facilitate mounting the electrically conductive coil 13 to the substrate 11, for example, by directly disposing the main body 13S on the first surface 11U of the substrate 11. The coil terminals are substantially coplanar with each other. Each coil terminal (e.g., the first coil terminal 131 and the second coil terminal 132 of each winding) is integrally formed as part of the flat portion of the turns of the electrically conductive coil 13. For this case, the legs such as the first leg 134 and the second leg 135 can be omitted. This will further advantageously reduce the size of the packaging module 81, particularly in the z-axis direction (i.e., height). This will also improve the mounting yield and efficiency of mounting the electrically conductive coil 13 to the substrate 11 using, for example, the Surface Mount Technology (SMT), and further reduce the complexity and cost of manufacturing and production, which has been a long-standing problem that needs to be solved, as the successful and efficient mounting of the electrically conductive coil 13 to meet the requirements of mass production has been a serious challenge in practice, as can be fully understood by those skilled in the art, which has been stated above and need not be repeated.

[0091] The conductive coil 13 is directly mounted on the substrate 11, and coil terminals (e.g., the first coil terminal 131 and the second coil terminal 132) are directly connected to corresponding pads (e.g., the pad 112) on the first surface 11U of the substrate 11, for example, through a conductive adhesive material 133 (e.g., solder paste). A thin insulating layer 136 covering the conductive coil 13 is stripped at least at portions (e.g., at the bottom surface) of the coil terminals (e.g., the first coil terminal 131 and the second coil terminal 132 in the present embodiment), so that the conductive coil 13 is suitable for being directly attached to the substrate 11, and each coil terminal has an exposed area not covered by the thin insulating layer 136 and is configured for providing electrical connection / coupling, which can be referred to ​ for better understanding. The exposed area of each coil terminal can be extended from the terminal edge P0 of each coil terminal, flexibly controlling the range from a minimum position P1 to a maximum position P2 falling on the flat portion integrally formed with each coil terminal. The minimum position P1 is designed according to the size of the corresponding pad (e.g., see the pad 112) to which each coil terminal is to be attached, so that the exposed area of each coil terminal is not less than the corresponding pad. By way of example, the minimum position P1 in an embodiment is substantially located at a distance of 1 / 3 of the length LP from the terminal edge P0 on the flat portion. The maximum position P2 is located at a distance of the length LP from the terminal edge P0 on the flat portion, i.e., the position before the flat portion is about to be bent to be rolled up. In this way, it is beneficial to effectively control and prevent solder leakage during the mounting process, which leads to device damage or short circuit.

[0092] In some other embodiments, the main body 13S of the conductive coil 13 can be vertically spaced apart from the first surface 11U of the substrate 11, similar to the examples shown in ​ and ​ . In the example shown in ​ , the conductive coil 13 is formed as a flat wire multi-turn winding. However, the conductive coil 13 can also be formed as a round wire multi-turn winding.

[0093] Referring to ​ , in this example, the conductive coil 13 is mounted on the first surface 11U of the substrate 11, and the MMC 14 is molded to form the package module 81. On the second surface 11D or the pin side of the substrate 11, the package module 81 can include an input pin IN and a switch pin SW disposed at the first peripheral side of the package module 81. An output pin OUT (e.g., the output pin OUT shown in ​The two output pins shown are located on a second peripheral side opposite to the first peripheral side of the package module 81. The package module 81 may also include a bootstrap pin (BST), an enable pin (EN), a feedback pin (FB), a signal ground pin (AGND), a softstart pin (SS), and a power good pin (PG) located on a third peripheral side of the package module 81. The package module 81 may also include an internal power output pin (VCC) and multiple (e.g., five) power ground pins (PGND) located on a fourth peripheral side opposite to the third peripheral side of the package module 81. The input pin (IN) can be configured to receive an input voltage (VIN). The switch pin (SW) can be electrically connected to the power switch unit 12 and the conductive coil 13. The two output pins (OUT) are connected together internally in the package module 81 and can be configured to provide an output voltage (VOUT). The bootstrap pin (BST) can be configured with a capacitor connected between the switch pin (SW) and the bootstrap pin (BST) to form a floating power supply for, for example, a driver inside the package module 81. The enable pin EN can be configured to enable or disable package module 81. The feedback pin FB can be configured, for example, to set the output voltage VOUT when connected to a tap of an external resistor divider connected between the output pin OUT and the power ground pin PGND. In the PCB layout, the signal ground pin AGND is electrically connected to the power ground pin PGND. The soft-start pin SS can be used to set the soft-start time of package module 81 to avoid startup inrush current. The PG pin is an open-drain output that can be configured to provide fault protection information (e.g., undervoltage protection, overcurrent protection, overtemperature protection, or overvoltage condition). Multiple (e.g., five) power ground pins PGND are electrically connected together internally in package module 81 and can be configured as a reference ground for the output voltage VOUT.

[0094] For example, ​ A schematic three-dimensional perspective view of a packaged module 82 for power conversion according to an alternative embodiment of this disclosure is shown. ​ In the three-dimensional perspective view, apart from the conductive coil 13 embedded in the MMC 14, other components are not shown in detail so as not to obscure the relevant features of the embodiment, but these components can be understood by referring to and in conjunction with the accompanying drawings of the embodiments already described above. ​ An enlarged top view of a conductive coil 13 according to one embodiment is shown schematically. ​ and ​ The illustrations respectively depict the situation according to an embodiment of the present invention when... ​a perspective view of the left side (as indicated by arrow 803) and an enlarged perspective side view of the electrically conductive coil 13 as viewed from the side opposite the left side.

[0095] ​ and ​ schematically illustrate, respectively, the electrically conductive coil 13 as viewed from the left side of a three-dimensional perspective view of the power conversion module 80 according to an alternative embodiment of the present disclosure. ​ an enlarged perspective side view of the electrically conductive coil 13 as viewed from the side opposite the left side of a three-dimensional perspective view of the power conversion module 80. ​ schematically illustrates a perspective top view of the power conversion module 82 for use in power conversion according to an embodiment of the present disclosure.

[0096] Those skilled in the art will appreciate that the above description of the power conversion module 80 applies, mutatis mutandis, to the power conversion module 82 in the example. ​ and ​ Most of the description made above with respect to the power conversion module 80 applies, mutatis mutandis, to the power conversion module 82 in the example. ​ One of the differences can be that the electrically conductive coil 13 in the power conversion module 82 is exemplarily shown as comprising a multi-turn winding, the turns of which are wound along the z-axis direction, i.e. along the height direction of the power conversion module 82. The space or volume 804 (refer to Fig. 8) enclosed by the turns of the electrically conductive coil 13 is filled with the MMC 14. The MMC 14 also wraps the electrically conductive coil 13 and any other components mounted to the substrate 11, as described in the above example. By winding the turns of the electrically conductive coil 13 along the z-axis direction, i.e. along the height direction of the power conversion module 82, the power conversion module 82 can be conveniently encapsulated with the MMC 14 by, for example, a compression molding process. ​ With reference to Fig. 8, in some embodiments, the main body 13S of the electrically conductive coil 13 can not be vertically spaced apart from the first surface 11U of the substrate 11. The bottom side of the main body 13S of the electrically conductive coil 13 can be disposed substantially directly on the first surface 11U of the substrate 11. The starting winding (or bottom winding) 13B of the electrically conductive coil 13, i.e. the winding that falls on the first surface 11U of the substrate 11, is substantially planar, i.e. has a good flatness when the starting winding 13B is wound, to facilitate the mounting of the electrically conductive coil 13 to the substrate 11. The coil terminals are substantially coplanar with each other. Each coil terminal (e.g. the first coil terminal 131 and the second coil terminal 132 of each winding) is integrally formed as part of the turns of the electrically conductive coil 13 and extends outwardly from the turns to outside the main body 13S in the x-y plane (the width and length plane of the power conversion module 82). In some embodiments, one or more coil terminals (e.g. the second coil terminal 132) can be bent vertically downward to reach substantially the same plane as the rest of the coil terminals to enhance their coplanarity, which can be referred to with reference to Fig. 8.

[0097] ​ ​ ​​An exemplary enlarged side view better understanding of which is shown in which the second coil terminal 132 is bent vertically downward to reach substantially the same plane as the first coil terminal 131. For this case, the legs such as the first leg 134 and the second leg 135 can be omitted. Advantageously, this will further reduce the size of the package module 82, particularly in the z-axis (i.e. height) dimension. This will also improve the mounting yield and efficiency of mounting the conductive coil 13 onto the substrate 11 using, for example, Surface Mount Technology (SMT), and further reduce the complexity and cost of manufacturing and production, which has been a long-desired problem to be solved as it has been a serious challenge in practice for the ordinary skilled person in the art to successfully and efficiently mount the conductive coil 13 to meet the requirements of mass production, as has been set out above and will not be repeated here.

[0098] In some embodiments, the top side turns 13T (referring to the turns disposed on the top of the conductive coil 13) of the conductive coil 13 are also substantially planar, i.e. the top side turns 13T are wound to have good flatness, which can further facilitate mounting of the conductive coil 13 onto the substrate 11, particularly so that the conductive coil 13 can be more easily picked up.

[0099] The conductive coil 13 is mounted directly onto the substrate 11, and the coil terminals (e.g. the first coil terminal 131 and the second coil terminal 132) are directly connected to the respective pads on the first surface 11U of the substrate 11, e.g. via the conductive attachment material 133 (e.g. solder paste). The thin insulating layer 136 covering the conductive coil 13 is stripped at least at the portion (e.g. the bottom surface) of the coil terminals (e.g. the first coil terminal 131 and the second coil terminal 132 in the present embodiment), so that the conductive coil 13 can be adapted to be directly connected to the substrate 11, and each coil terminal has an exposed area not covered by the thin insulating layer 136 and is configured to provide electrical connection / coupling, which can be referred to ​ For better understanding, the stripped portion or exposed area is shown in light grey, and the conductive coil 13 of the remaining unstripped portion (e.g. substantially comprising the main body 13S) is shown in dark grey.

[0100] In some embodiments, the main body 13S of the conductive coil 13 can comprise a coil wound in multiple layers as seen from a plan view perpendicular to the coil winding direction. For example, in the example of ​ When viewed from an x-y plan view perpendicular to the z-axis direction of the coil winding direction, the coil is wound in two layers, an inner layer 13S1 and an outer layer 13S2. When referring to ​It can be more obvious and easier to understand when the enlarged top view of the conductive coil 13 is exemplarily shown in the examples. However, it can be fully understood by those skilled in the art that this is merely exemplary and is not intended to be limiting. In alternative examples, the number of turns of the coil can be wound into more than two layers according to actual design and application requirements. Each of the multiple layers can include a plurality of or a set of turns wound in a predetermined direction, for example ​ the z-axis direction (i.e., the direction along the height of the package module 82) in the examples. With the conductive coil 13 (e.g., 13S1, 13S2) wound in multiple layers, the inductance of the inductive energy storage device can be advantageously further increased, improving the performance of the package module in a limited size.

[0101] In some embodiments, the multiple layers (e.g., the inner layer 13S1 and the outer layer 13S2) are formed by winding / coiling a single coil wire, the winding / coiling starting from one end of the coil wire, the number of turns of the winding extending upward to form the inner layer 13S1 and then extending downward to form the outer layer 13S2, as shown in the examples of ​ and ​ In some alternative embodiments, the multiple layers (e.g., the inner layer 13S1 and the outer layer 13S2) are formed by winding / coiling a single coil wire, the winding / coiling starting from both ends of the coil wire at the same time, the number of turns of the winding extending upward from one end to form the inner layer 13S1 and the number of turns of the winding extending downward from the other end to form the outer layer 13S2, as shown in the examples of ​ and ​

[0102] In some alternative embodiments, each of the multiple layers can be wound / coiled from a single coil wire and then connected to each other, for example, each two adjacent layers of the multiple layers of the conductive coil 13 can be connected to each other by a connection structure 13C (see the exemplary illustration of ​

[0103] In other embodiments, the main body 13S of the conductive coil 13 can be vertically spaced apart from the first surface 11U of the substrate 11, similar to the examples shown in ​ and ​ In the examples of ​ the conductive coil 13 is formed as a round wire multi-turn winding. However, the conductive coil 13 can also be formed as a flat wire multi-turn winding.

[0104] Reference is now made to ​ The description of the package module 81 made with reference to ​ applies to the example package module 82 in ​ and therefore will not be repeated here.

[0105] ​​Those skilled in the art will understand that, for other embodiments of the present invention, such as those described in the references to [reference needed], will provide further clarification. ​ In the described embodiment, the power switch unit 12 can also be embedded in the substrate 11, similar to the reference numeral. ​ As described in the example shown.

[0106] ​ A perspective top view of a packaged module 90 for power conversion according to an embodiment of the present invention is shown schematically. ​ The illustration shows the edge according to an embodiment of the present invention. ​ The cross-sectional view of the packaged module 90 taken by section line A-A' in the perspective top view. Those skilled in the art will understand that the above references... ​ and ​ The description of package module 30 is mostly applicable to ​ and ​ The example shows a package module 90. In this example, the substrate 11 is exemplarily shown as comprising multiple substrate layers, such as four substrate layers 115 to 118. One difference from package module 30 is that, in package module 90, an inductive energy storage device, including a conductive coil 13 and an MMC 14 encapsulating the conductive coil 13, can be embedded in the substrate 11. For example, the conductive coil 13 and the MMC 14 can be formed in a second substrate layer 116 and a third substrate layer 117 sandwiched between a first substrate layer 115 and a fourth substrate layer 118. By embedding the inductive energy storage device including the conductive coil 13 and the MMC 14 in the substrate 11, package module 90 can further improve package volume utilization efficiency, further reduce physical size, and simultaneously increase integration density and / or power density.

[0107] ​ A perspective top view of a packaged module 91 for power conversion according to an embodiment of the present disclosure is shown schematically. ​ The illustration shows the edge according to an embodiment of the present invention. ​ The image shows a cross-sectional view of the package module 91 taken along section line A-A' in the perspective top view. Those skilled in the art will understand that the package module 91 can be considered an alternative embodiment of an inductive energy storage device including a conductive coil 13 and an MMC 14 embedded in the substrate 11; this example can be considered a variant of the package module 90. One difference from the package module 90 is that the conductive coil 13 in the package module 91 can be formed around the MMC 14. That is, the conductive coil 13 can be wound around the MMC 14 several times. In this example, the turns of the conductive coil 13 can be continuously wound on the MMC 14, thereby interconnecting with each other.

[0108] ​A perspective top view of a packaging module 92 for power conversion is illustratively shown in accordance with an embodiment of the present disclosure. ​ A cross-sectional view of the packaging module 92 taken along section line A-A’ in the perspective top view of ​ A cross-sectional view of the packaging module 92 taken along section line A-A’ in the perspective top view of Those skilled in the art will appreciate that the packaging module 92 can be considered an alternative embodiment that includes an inductive energy storage device comprising an electrically conductive coil 13 and an MMC 14 embedded in the substrate 11, for example, this example can be considered a variant of the packaging module 91. One of the differences compared to the packaging module 91 is that the electrically conductive coil 13 in the packaging module 92 can be wound in discontinuous turns on the MMC 14. In this example, the turns of the electrically conductive coil 13 can be connected together by coil connections 138.

[0109] ​ A perspective top view of a packaging module 94 for power conversion is illustratively shown in accordance with an embodiment of the present disclosure. ​ A cross-sectional view of the packaging module 94 taken along section line A-A’ in the perspective top view of ​ A cross-sectional view of the packaging module 94 taken along section line A-A’ in the perspective top view of Those skilled in the art will appreciate that the packaging module 94 can be considered an alternative embodiment that includes an inductive energy storage device comprising an electrically conductive coil 13 and an MMC 14 embedded in the substrate 11, for example, this example can be considered a variant of the packaging module 92. One of the differences compared to the packaging module 92 is that the discontinuously wound turns of the electrically conductive coil 13 in the packaging module 94 can be connected together by connection structures 139 similar to the electrically conductive routing structures 111 formed in the substrate 11. For example, in the example shown in ​ the connection structures 139 formed in the first substrate layer 115 are shown to connect the turns of the electrically conductive coil 13 together.

[0110] ​ A perspective top view of a packaging module 96 for power conversion is illustratively shown in accordance with an embodiment of the present disclosure. ​ A cross-sectional view of the packaging module 96 taken along section line A-A’ in the perspective top view of ​ A cross-sectional view of the packaging module 96 taken along section line A-A’ in the perspective top view of Those skilled in the art will appreciate that the packaging module 96 can be considered an alternative embodiment that both the power switching unit 12 and the inductive energy storage device comprising an electrically conductive coil 13 and an MMC 14 are embedded in the substrate 11, for example, this example can be considered a variant of the packaging module 92. One of the differences compared to the packaging module 92 is that the power switching unit 12 can also be embedded in the substrate 11 in the packaging module 96. For example, in the example shown in ​ the power switching unit 12 is shown embedded in the second substrate layer 116 of the substrate 11.

[0111] Compared to conventional power converter modules having substantially the same functionality and / or given specifications, the packaging modules according to various embodiments of the present disclosure can result in a reduction of 10% to 50% in the physical size and / or footprint of the packaging modules. This can result in an increase in the power conversion efficiency and current density of the packaging modules. On the other hand, the packaging power modules according to various embodiments of the present disclosure can be less expensive than conventional power conversion modules.

[0112] For example, the packaging modules according to various embodiments of the present disclosure can support a working current (e.g., a load current provided at the output OUT of the packaging module) of 1A to 4A, with a physical size of width x length substantially in the range of 2mm*2mm to 2mm*3mm, and a height substantially in the range of 1.0mm to 1.5mm, or a physical size of width x length substantially in the range of 2mm*2mm to 2mm*2.2mm, and a height substantially in the range of 1.0mm to 1.2mm, which is substantially smaller in size compared to conventional power converter modules supporting the same working current range. As can be appreciated by one of ordinary skill in the art, the design of the physical size of these packaging modules is critical, and any reduction in size of 0.1mm is a result of the inventive effort of the embodiments of the present disclosure. For example, referring to ​ The described packaging module 82 can be configured to support a working current of 1A to 4A, with the conductive coil 13 being wound with round coil wire having a wire diameter of no more than 0.3mm, and wound into a generally cylindrical winding having a cylindrical diameter of no more than 1.6mm. The power conversion efficiency peak of the power conversion packaging module according to various embodiments of the present disclosure supporting a working current of 1A to 4A can be higher than 88% or even higher than 90%. According to various embodiments of the present disclosure, the integrated inductive energy storage device includes the MMC 14 and the conductive coil 13 integrated in the packaging module to support a working current of 1A to 4A, with an inductance of up to 2pH, which is advantageous for substantially reducing the DCR of the integrated inductive energy storage device, which is advantageous for low current (e.g., lower than 4A) applications.

[0113] For another example, the packaging modules according to various embodiments of the present disclosure can support a working current (e.g., a load current provided at the output OUT of the packaging module) of 4A to 10A, with a physical size of width x length substantially in the range of 2mm*3mm to 3mm*4mm, and a height substantially in the range of 1.0mm to 2mm, or a physical size of width x length substantially in the range of 2mm*3mm to 2mm*4mm, and a height substantially in the range of 1.0mm to 1.5mm, which is substantially smaller in size compared to conventional power converter modules supporting the same working current range. For example, referring to ​The described packaging module 81 can be configured to support operating currents in the range of 4A to 10A, where the electrically conductive coil 13 can be wound with flat coil wire having a wire thickness in the range of 0.03mm to 0.3mm and wound into a substantially cuboid shaped winding having a height in the range of substantially 0.85mm to 1.85mm. For another example, with reference to ​ The described packaging module 82 can be configured to support operating currents in the range of 4A to 10A, where the electrically conductive coil 13 can be wound with circular coil wire having a wire diameter of no more than 0.4mm and wound into a substantially cylindrical shaped winding having a cylinder diameter in the range of 1.6mm to 2.6mm, or the electrically conductive coil 13 can be wound with circular coil wire having a wire diameter of substantially 0.23mm ± 0.05mm and wound into a substantially cylindrical shaped winding having a cylinder diameter in the range of 1.6mm to 1.8mm. Packaging modules for power conversion according to various embodiments of the present disclosure, supporting operating currents in the range of 4A to 10A, can have power conversion efficiency peaks higher than 88% or even higher than 90%. Integrated inductive energy storage devices, comprising an MMC 14 and an electrically conductive coil 13 integrated in a packaging module according to various embodiments of the present disclosure, supporting operating currents in the range of 4A to 10A, can have inductance values up to 1μΗ, which is advantageous for achieving a good balance between inductance value and DCR specification, which is particularly advantageous for medium current (e.g. 4A to 10A) applications.

[0114] For another example, packaging modules according to various embodiments of the present disclosure can support operating currents (e.g. load currents provided at the packaging module output OUT) in the range of 6A to 20A, having physical dimensions of width x length in the range of substantially 2mm*3mm to 5mm*6mm and height in the range of substantially 1.2mm to 3mm, or width x length in the range of substantially 2mm*3mm to 4mm*4mm and height in the range of substantially 1.2mm to 2.5mm, which is a significant size reduction compared to conventional power converter modules supporting the same operating current range. Power conversion packaging modules according to various embodiments of the present disclosure, supporting operating currents in the range of 6A to 20A, can have power conversion efficiency peaks higher than 85% or even higher. Integrated inductive energy storage devices, comprising an MMC 14 and an electrically conductive coil 13 integrated in a packaging module according to various embodiments of the present disclosure, supporting operating currents up to 20A, can have inductance values up to 1μΗ, which is advantageous for achieving a good balance between inductance value and DCR specification, which is particularly advantageous for relatively high current (e.g. 6A to 20A) applications.

[0115] For example, ​A waveform graph showing the curve of the power conversion efficiency (PCE) of a packaged module versus the operating current (e.g., the load current provided at the output of the packaged module) is shown. The present embodiment is directed to ​ The packaged module of the illustrated example was tested or simulated with example parameters of VIN = 3.3 V and VOUT = 1 V. From ​ It can be seen that the power conversion efficiency of the packaged module peaks above 88% and can reach above 90%.

[0116] ​ A process flow diagram showing a method 900 for manufacturing a packaged module for power conversion is shown, according to embodiments of the present disclosure.

[0117] In step 901, a substrate panel suitable for large-scale or batch production of an array of packaged modules according to various examples of the present disclosure can be prepared and provided. The substrate panel can be suitable for singulation in subsequent manufacturing steps to form the substrate (e.g., substrate 11 according to various embodiments as described above) of each individual packaged module of the array of packaged modules to be manufactured. Various structures (e.g., conductive wiring structures 111) and / or components (e.g., power switching units 12 and / or inductive energy storage devices) suitable for individual packaged modules can be pre-formed or embedded in the substrate panel. For example, for embodiments in which the power switching units 12 are embedded in the substrate 11, an array of power switching units 12 and corresponding conductive wiring structures 111 can be pre-embedded in the substrate panel provided in step 901. For another example, for embodiments in which the inductive energy storage devices are embedded in the substrate 11, an array of conductive coils 13 (e.g., of the structure shown in the example of FIG. 1 1) each encapsulating an MMC 14 and corresponding conductive wiring structures 111 can be pre-embedded in the substrate panel provided in step 901. ​ and ​ the example of FIG. 1 1) each encapsulating an MMC 14 and corresponding conductive wiring structures 111 can be pre-embedded in the substrate panel provided in step 901.

[0118] In step 902, an array of semiconductor chips is attached to the substrate. At least one power switching unit 12 can be fabricated within each semiconductor chip of the array of semiconductor chips. For example, each semiconductor chip with a power switching unit 12 can be attached to the substrate panel by a conductive chip-attachment material 124, where conductive pads 121 and / or conductive pillars / bumps 123 are formed at the top surface of the semiconductor chip and the top surface faces down towards the substrate panel. Those of ordinary skill in the art will appreciate that for embodiments in which the power switching units 12 are embedded in the substrate 11, the chip mounting in step 902 can be omitted.

[0119] In step 903, other components of each single package module to be manufactured (e.g., passive components including but not limited to capacitive energy storage devices 15, resistive devices 16, or other elements 17, etc.) can be attached to the substrate panel.

[0120] In step 904, underfill material 122 can be used to fill the cavity between the power switching unit 12 and the substrate panel to provide insulation and / or to provide thermo-mechanical compliance. In one example, for embodiments that also include the non-magnetic protective layer 41 for each single package module to be manufactured, a conformal coating process for applying or depositing the non-magnetic protective layer 41 on the components mounted on the substrate panel can be optionally performed in step 904.

[0121] In step 905, electrically conductive coils 13 corresponding to each semiconductor chip in which at least one power switching unit 12 is manufactured can be attached to the substrate panel. The placement of the electrically conductive coils 13 can be as flexibly designed as described with reference to ​ the example described above. It will be appreciated by those of ordinary skill in the art that for embodiments in which the inductive energy storage devices are embedded in the substrate 11, the attachment of the electrically conductive coils 13 in step 905 can be omitted.

[0122] In step 906, a magnetic powder processing process of the magnetic metal particles 143 can be performed. In this process, the magnetic metal particles 143 are processed such that the insulating coating layer 144 coats and encapsulates each of the magnetic metal particles 143 to form coated magnetic metal particles 142.

[0123] In step 907, the ingredients of the MMC 14 can be mixed to form a mixture of magnetic material. The ingredients can include the non-magnetic material 141 and the coated magnetic metal particles 142. In this process, the coated magnetic metal particles 142 can be dispersed throughout the non-magnetic material 141, and the mixture of magnetic material can be in a fluid state.

[0124] In step 908, a drying process can be performed to dry the mixture of magnetic material.

[0125] In steps 909 and 910, the dried mixture of magnetic material can be pulverized and granulated to form a granulated magnetic molding compound MMC 14 that is compatible with a molding process such as a transfer molding process or a compression molding process.

[0126] In step 911, a molding process can be performed to use the granulated magnetic molding compound MMC 14 to encapsulate the substrate panel with the components attached thereon.

[0127] In step 912, a demolding process is performed after the molding process.

[0128] In step 913, a post-curing process can be performed after the demolding process.

[0129] In step 914, a marking process can be performed on the molded substrate panel.

[0130] In step 915, singulation of the module having components mounted and / or embedded thereon can be performed according to the markings made in step 914, and singulated packaging modules according to various embodiments described, such as with reference to ​ FIG. 15 illustrates a singulated packaging module according to various embodiments described.

[0131] ​ A process flow diagram of a method 1000 for manufacturing a packaging module for power conversion according to alternative embodiments of the present disclosure is shown.

[0132] Steps 1001 to 1005 can correspond to steps 901 to 905, respectively, that is, the description of steps 901 to 905 applies to steps 1001 to 1005, respectively, and thus will not be repeated here.

[0133] Steps 1006 and 1007 can correspond to steps 906 and 907, respectively. That is, the description of steps 906 to 907 applies to steps 1006 to 1007, respectively, and will not be described in detail here.

[0134] In step 1008, a vacuum extraction process can be performed to eliminate air bubbles in the magnetic material fluid mixture obtained in step 1007.

[0135] In step 1009, a gel casting process can be performed to fill or infuse the magnetic material mixture in a fluid state, such that the magnetic molding compound MMC 14 fills in the packaging module according to various embodiments of the present disclosure.

[0136] In steps 1010 and 1011, a vacuum extraction process and a shaking process are performed to eliminate air bubbles in the magnetic molding compound 14 and to obtain a smooth top surface.

[0137] In steps 1012 and 1013, a curing process and a demolding process can be performed.

[0138] In step 1014, a marking process can be performed on the molded substrate panel.

[0139] In step 1015, singulation of the substrate panel having components mounted and / or embedded thereon can be performed according to the markings made in step 1014, and singulated packaging modules according to various embodiments described, such as with reference to ​ FIG. 15 illustrates a singulated packaging module according to various embodiments described.

[0140] The methods for manufacturing power conversion package modules according to various embodiments of this disclosure can be implemented without requiring special equipment different from the equipment used to manufacture conventional power conversion modules, thereby saving significant effort and cost in process and assembly verification.

[0141] The advantages of the various embodiments of this disclosure are not limited to those described above. These and other advantages of the various embodiments of this disclosure will become more apparent after reading the complete detailed description and studying the various drawings.

[0142] In summary, it should be understood that specific embodiments of this disclosure have been described for illustrative purposes, but various modifications can be made without departing from the present technology. Many elements of one embodiment can be combined with other embodiments to supplement or replace elements of other embodiments.

Claims

1. A packaging module, comprising: A substrate having a first surface and a second surface opposite to the first surface, wherein the second surface has a plurality of pins; A conductive coil is disposed on the substrate, and the conductive coil is coreless; Magnetic molding compound, covering the conductive coil; and An integrated circuit (IC) chip is located in this package module.

2. The packaging module according to claim 1, wherein, The conductive coil is coupled to at least one of the plurality of pins.

3. The packaging module according to claim 1, wherein, The IC chip is coupled to at least one of the plurality of pins.

4. The packaging module according to claim 1, wherein, The conductive coil has coil terminals configured to be substantially coplanar with each other, and the coil terminals are directly attached to corresponding pads on the first surface of the substrate.

5. The packaging module according to claim 1, wherein, The conductive coil is conformally coated with a thin insulating layer, and the conductive coil has coil terminals, each of which has an exposed area not covered by the thin insulating layer.

6. The packaging module according to claim 1, wherein, The conductive coil is configured to have a multi-turn winding wound in a helical shape along a predetermined direction.

7. The packaging module according to claim 1, wherein, The conductive coil is configured as a single-turn winding in the form of a conductive sheet, which is wound in a bridge shape, generally rectangular or generally semi-elliptical along a predetermined direction.

8. The packaging module according to claim 1, wherein, The magnetic molding compound has a relative permeability in the range of 20 to 50.

9. The packaging module according to claim 1, wherein, The magnetic molding compound comprises coated magnetic metal particles dispersed in a non-magnetic material.

10. The packaging module according to claim 9, wherein, Each of the aforementioned coated magnetic metal particles includes a magnetic metal particle and an insulating coating layer that conformally coats the magnetic metal particle.

11. The packaging module according to claim 1, wherein, The conductive coil includes a body comprising winding turns wound along the height direction of the packaging module.

12. The packaging module according to claim 11, wherein, The bottom-side windings of the conductive coil located on the first surface of the substrate are substantially coplanar.

13. The packaging module according to claim 11, wherein, The top-side windings of the conductive coil, arranged on top of the conductive coil, are substantially coplanar.

14. The packaging module according to claim 11, wherein, The conductive coil has coil terminals, each of which is integrally formed as part of a winding turn of the conductive coil, and the coil terminals extend from the winding turn beyond the body in a plane formed by the width and length of the encapsulation module.

15. The packaging module according to claim 1, wherein, When viewed from a plane perpendicular to the height of the package module, the conductive coil comprises multiple layers of winding turns.

16. The packaging module according to claim 15, wherein, The multilayers are formed by winding or coiling a single coil wire, starting from the end of the coil wire, with the wound turns extending upward to form an inner layer and then downward to form an outer layer.

17. The packaging module according to claim 15, wherein, The multilayers are formed by winding or coiling a single coil wire, starting from both ends of the coil wire. The winding turns extend upward from one end to form the inner layer, and the winding turns extend downward from the other end to form the outer layer.

18. The packaging module according to claim 15, wherein, Each of the multiple layers can be formed by winding or coiling a single coil wire, and then connecting them to each other.

19. The packaging module according to claim 18, wherein, Each pair of adjacent layers in the multilayer structure of the conductive coil is interconnected by a connection structure.

20. The packaging module of claim 1, wherein one or more of the coil terminals are bent vertically downward to achieve substantially coplanarity with the remaining coil terminals.

21. The packaging module according to claim 11, wherein, The magnetic molding compound is filled within the space or volume surrounded by the winding turns of the conductive coil.

22. The packaging module according to claim 1, wherein, The packaged module is configured to support operating current in the range of 1A to 4A, and its physical dimensions are in the range of 2mm*2mm to 2mm*3mm (width x length) and 1.0mm to 1.5mm (height).

23. The packaging module according to claim 1, wherein, The packaged module is configured to support operating current in the range of 1A to 4A, and its physical dimensions are in the range of 2mm*2mm to 2mm*2.2mm (width x length) and 1.0mm to 1.2mm (height).

24. The packaging module of claim 11, wherein the packaging module is configured to support an operating current in the range of 1A to 4A, and wherein the conductive coil is wound with a circular coil wire with a wire diameter of no more than 0.3mm.

25. The encapsulation module of claim 24, wherein the conductive coil is a winding wound into a basic cylindrical shape with a diameter not greater than 1.6 mm.

26. The packaging module according to claim 1, wherein, The packaged module is configured to support operating current in the range of 1A to 4A and has a peak power conversion efficiency of 88% to 90% or higher than 90%.

27. The packaging module according to claim 1, wherein, The packaged module is configured to support operating current in the range of 4A to 10A, and its physical dimensions are in the range of 2mm*3mm to 3mm*4mm (width x length) and 1.0mm to 2mm (height).

28. The packaging module according to claim 1, wherein, The packaged module is configured to support operating current in the range of 4A to 10A, and its physical dimensions are in the range of 2mm*3mm to 2mm*4mm (width x length) and 1.0mm to 1.5mm (height).

29. The packaging module of claim 11, wherein the packaging module is configured to support an operating current in the range of 4A to 10A, and wherein the conductive coil is wound with a circular coil wire with a wire diameter of no more than 0.4mm.

30. The packaging module of claim 29, wherein the conductive coil is a winding wound into a generally cylindrical shape with a diameter in the range of 1.6 mm to 2.6 mm.

31. The packaging module according to claim 11, wherein, The encapsulation module is configured to support operating current in the range of 4A to 10A, and the conductive coil is wound with a circular coil wire with a wire diameter of 0.23mm ± 0.05mm, and the conductive coil is wound into a substantially cylindrical shape with a cylinder diameter ranging from 1.6mm to 1.8mm.

32. The packaging module according to claim 1, wherein, The packaged module is configured to support operating current in the range of 4A to 10A and has a peak power conversion efficiency of 88% to 90% or higher than 90%.

33. The packaging module according to claim 1, wherein the conductive coil comprises a winding turn wound along the width or length direction of the packaging module.

34. The packaging module of claim 33, wherein the body of the conductive coil comprising the winding turns has a substantially flat bottom side.

35. The packaging module according to claim 33, wherein, Each of the coil terminals is integrally formed as part of the flat portion of the winding turns of the conductive coil.

36. The packaging module according to claim 35, wherein, The conductive coil is conformally coated with a thin insulating layer, wherein each coil terminal has an exposed area not covered by the thin insulating layer, and the exposed area of ​​each coil terminal extends from the end edge of each coil terminal to a position ranging from a minimum position to a maximum position on the flat portion integrally formed with each coil terminal.

37. The packaging module according to claim 33, wherein, The space or volume surrounded by the winding turns of the conductive coil is filled with the magnetic molding compound.

38. The packaging module of claim 33, wherein the packaging module is configured to support an operating current in the range of 4A to 10A, and wherein the conductive coil is wound with flat coil wire with a wire thickness in the range of 0.03mm to 0.3mm.

39. The packaging module of claim 38, wherein the conductive coil is wound into a substantially cuboid shape with a height in the range of 0.85 mm to 1.85 mm.

40. The packaging module according to claim 1, wherein the IC chip is embedded in the substrate.

41. The packaging module of claim 1, wherein the plurality of pins includes an input pin and a switch pin disposed on a first peripheral side of the packaging module, wherein the input pin is configured to receive an input voltage, and the switch pin is electrically coupled to the IC chip and the conductive coil.

42. The packaging module according to claim 41, wherein, The plurality of pins also includes output pins disposed on a second peripheral side of the package module opposite to the first peripheral side.

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