Cooking utensil

Abstract

The present invention relates to a cooking apparatus in which a central inner region in which a working coil pattern is not formed is formed inside a burner, and a dummy via hole or a dummy pattern electrically separated from the working coil pattern is arranged in the central inner region, and therefore, the working coil pattern is electrically separated from the working coil pattern. The possibility of damage to the working coil pattern and the possibility of eddy current loss due to heat concentration in the working coil pattern may be minimized, and thermal deformation of the coil circuit board module due to heat generation in the central inner region may be effectively prevented.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a cooking appliance, and more particularly, to a cooking appliance in which a central inner region in which a working coil pattern is not formed is defined inside a burner, and a dummy via or a dummy pattern is formed in the central inner region in a state of being electrically insulated from the working coil pattern, thereby minimizing the possibility of damage to the working coil pattern and the possibility of eddy current loss due to heat concentration on the working coil pattern, and effectively preventing thermal deformation of a coil circuit board module due to heat in the central inner region. BACKGROUND

[0002] A cooking appliance is one of home appliances for cooking food, and is installed in a kitchen space to cook food according to a user's intention. Such a cooking appliance can be classified in various ways based on a heat source used, a form, and a type of fuel used.

[0003] When the cooking appliance is classified based on a kind of food cooked, the cooking appliance can be classified into an open type cooking appliance and a closed type cooking appliance based on a form of a space in which food is placed. The closed type cooking appliance can include an oven and a microwave oven, and the open type cooking appliance can include a cooktop and a hopper.

[0004] The cooktop, which is an open type cooking appliance, can be configured to heat a cooking target accommodated in a cooking vessel using at least one burner.

[0005] The cooktop can be provided in a form of having a burner using electric power, or can be provided in a form of having a burner using gas.

[0006] In addition, the cooktop can be implemented alone. The cooking appliance can be implemented in a form of an oven range including an oven below the cooktop.

[0007] An example of the cooktop having a burner using electric power is an induction heating cooking appliance.

[0008] The induction heating cooking appliance is a cooking appliance that performs a cooking function in an induction heating manner. In the induction heating cooking appliance, when high-frequency electric power is applied to a working coil, a magnetic field can be generated around the working coil.

[0009] Under the generated magnetic field, eddy current is generated in a cooking vessel made of a magnetic material, and food cooking can be performed by the cooking vessel serving as a resistor that resists the eddy current and generates heat.

[0010] Such an induction heating cooking appliance does not require the combustion of gas, and thus does not generate combustion exhaust gas. In addition, the induction heating cooking appliance generates heat immediately in the container itself, thereby minimizing the transfer process via heat radiation or conduction, and thus heating food at a high speed.

[0011] In the existing induction heating type cooktop, a working coil is formed by twisting a plurality of litz wires, and a single burner is formed by forming a multi-layer structure by winding the working coil in a spiral shape a plurality of times.

[0012] At this point, a coil frame for maintaining and supporting the wound shape of the working coil must be provided in each burner.

[0013] Accordingly, the vertical size of a single burner, which is the sum of the vertical size of the working coil wound in a multi-layer structure and the vertical size of the coil frame, accounts for a significantly larger percentage of the entire vertical size of the cooktop.

[0014] Due to the limitations in the size of the single burner constituting the cooktop, the conventional cooktop has no choice but to have limitations in increasing the output of the single burner.

[0015] In addition, when configuring a cooktop having a plurality of burners, the existing cooktop has a very limited space for installing other components or parts, and thus, the total number of burners that can be provided in the cooktop is very limited.

[0016] As an alternative to the litz wire type working coil, a technology related to a cooktop has been developed in which a burner is formed by forming a working coil in a spiral multi-layer pattern on a printed circuit board (Prior Art Document 001, Design and Optimization of Small Inductors on Extra-Thin PCB for Flexible Cooking Surfaces / IEEE Transactions on Industry Applications, Vol. 53, No. 1, January / February 2017).

[0017] The cooktop disclosed in Prior Art Document 001 can be configured such that a burner is formed by forming a working coil pattern wound in a single layer or a multi-layer spiral shape on a single printed circuit board.

[0018] The cooktop disclosed in Prior Art Document 001 as described above can have the following advantages: the working coil patterns constituting the burners are integrally formed on a single printed circuit board, so that the vertical size of the cooktop can be significantly reduced compared to a conventional cooktop, thereby improving vertical space utilization, and the number of burners can be significantly increased compared to a conventional cooktop, thereby improving horizontal space utilization. SUMMARY

[0019] TECHNICAL PROBLEM

[0020] The cooktop disclosed in the prior art document 001 has a problem in that the working coil pattern constituting the individual burner is spirally wound so that the heat generation of the individual pattern is concentrated on the central inner region of the working coil, and thus the highest temperature distribution occurs in the central inner region.

[0021] Therefore, the cooktop disclosed in the prior art document 001 has a problem in that the working coil pattern formed in the central inner region of the burner is likely to be damaged due to such temperature deviation.

[0022] In addition, the cooktop disclosed in the prior art document 001 has a problem in that the eddy current loss of the working coil pattern formed in the central inner region of the burner can be large due to such heat generation concentration.

[0023] Further, the cooktop disclosed in the prior art document 001 has a problem in that when a region in which the working coil pattern is not formed is generated in the central inner region of the burner, the generated region is only filled with an insulating material (prepreg) containing glass fibers, and thus, in the central inner region, thermal deformation is easily generated due to the heat generation of the working coil pattern.

[0024] In addition, the cooktop disclosed in the prior art document 001 has a problem in that since the working coil pattern is not formed in the central inner region of the burner, the central inner region is only filled with an electrically insulating material (prepreg), so that the manufacturing cost increases.

[0025] The present disclosure aims to solve the problems of the prior art. Therefore, the first object of the present disclosure is to provide a cooking appliance in which a central inner region in which a working coil pattern is not formed is defined inside the burner, thereby minimizing the possibility of damage to the working coil pattern and the possibility of eddy current loss due to heat generation concentration of the working coil pattern.

[0026] In addition, the second object of the present disclosure is to provide a cooking appliance in which a dummy via or a dummy pattern is formed in the central inner region in which the working coil pattern is not formed to be electrically insulated from the working coil pattern, thereby effectively preventing thermal deformation of the coil circuit board module due to heat generation in the central inner region.

[0027] Furthermore, a third objective of this disclosure is to provide a cooking appliance in which a dummy through-hole or dummy pattern is formed in the central internal region where no working coil pattern is formed, to electrically insulate it from the working coil pattern, thereby increasing the rigidity of the central internal region of the burner and reducing the proportion of insulating material, thereby reducing manufacturing costs.

[0028] The purposes of this disclosure are not limited to those described above. Other purposes and advantages not mentioned in this disclosure may be understood based on the following description and may be more clearly understood based on embodiments according to this disclosure. Furthermore, it will be readily understood that the purposes and advantages of this disclosure can be achieved using the means or combinations thereof shown in the claims.

[0029] Technical solution

[0030] The cooking appliance according to this disclosure includes: a top plate on which a container is placed; and a heater configured to receive electricity to generate a magnetic field to heat the container, wherein the heater includes a coil circuit board module including a working coil pattern for generating the magnetic field, wherein the coil circuit board module further includes a dummy via or dummy pattern formed therein, wherein the dummy via or dummy pattern may be electrically insulated from the working coil pattern.

[0031] Furthermore, the coil circuit board module may also include a sensing coil pattern for sensing whether the container is placed, wherein each of the dummy via and the dummy pattern may be positioned electrically insulated from the sensing coil pattern.

[0032] Furthermore, a central interior region can be defined horizontally inside the working coil pattern, wherein the dummy via and the dummy pattern can be positioned within the central interior region when viewed from the top plate.

[0033] Furthermore, the working coil pattern can be spirally wound to form multiple turns, wherein the inter-turn region can be defined between the turns constituting the working coil pattern and arranged adjacent to each other in the horizontal direction, wherein, when viewed from the top plate, the dummy via and the dummy pattern can be arranged in the inter-turn region.

[0034] Furthermore, the working coil pattern may include multiple working coil patterns, wherein the inter-coil region may be defined between horizontally adjacent working coil patterns among the multiple working coil patterns, wherein, when viewed from the top plate, the dummy via and the dummy pattern may be disposed within the inter-coil region.

[0035] Furthermore, the dummy vias may include multiple dummy vias, wherein, when viewed from the top plate, the multiple dummy vias may be arranged in a grid shape.

[0036] Furthermore, the grid shape can be a quadrilateral grid shape or a hexagonal grid shape.

[0037] Furthermore, each of the plurality of dummy vias may include: a top pad formed in the upper surface of the coil circuit board module; and a bottom pad electrically connected to the top pad and formed in the lower end surface of the coil circuit board module, wherein the horizontal spacing between the centers of a pair of adjacent vias in the plurality of dummy vias may be greater than each of the outer diameter of the top pad and the outer diameter of the bottom pad.

[0038] Furthermore, the dummy via can extend along a through hole that extends vertically from the upper surface of the coil circuit board module through the coil circuit board module to the lower surface of the coil circuit board module.

[0039] Furthermore, the dummy via may include: a top pad formed in the upper surface of the coil circuit board module; a bottom pad formed in the lower surface of the coil circuit board module; and an inner conductor that electrically connects the top pad and the bottom pad to each other and extends along the via.

[0040] Furthermore, the dummy via can be formed in a hollow state from the top pad to the bottom pad.

[0041] Furthermore, the dummy via can be formed from the top pad to the bottom pad in a solid state.

[0042] Furthermore, the dummy via can be formed with at least one of the top pad or the bottom pad closing the via.

[0043] Furthermore, the dummy pattern may extend in a direction parallel to the winding direction of the working coil pattern or in a direction intersecting the winding direction of the working coil pattern.

[0044] Furthermore, the dummy pattern may include multiple dummy patterns, wherein the multiple dummy patterns may be arranged to be spaced apart from each other.

[0045] Furthermore, the coil circuit board module may include multiple working coil patterns arranged in a multi-layered structure, and the multiple layered structures may be integrally formed with each other.

[0046] Furthermore, the dummy pattern may include multiple dummy patterns, wherein at least some of the multiple dummy patterns may be disposed on the upper or lower surface of the coil circuit board module.

[0047] In addition, the coil circuit board module may include multiple working coil patterns arranged in a multi-layered structure along the vertical direction, wherein other dummy patterns among the multiple dummy patterns may be set in the inner layer of the multiple layered structure.

[0048] Furthermore, both the dummy via and the dummy pattern can be set in the coil circuit board module, wherein one end or the other end of the dummy pattern can be connected to the dummy via.

[0049] The household appliance according to this disclosure includes: a top plate that contacts an object; and a coil circuit board module disposed below the top plate and including a working coil pattern for heating the object, wherein the coil circuit board module further includes a dummy metal portion electrically insulated from the working coil pattern.

[0050] Beneficial effects

[0051] According to this disclosure, by defining a central internal region inside the burner where no working coil pattern is formed, the possibility of damage to the working coil pattern and the possibility of eddy current losses due to heat concentration in the working coil pattern are minimized.

[0052] Furthermore, according to this disclosure, a dummy via or dummy pattern is formed in the central internal region where the working coil pattern is not formed, so as to electrically insulate it from the working coil pattern. This improves the heat dissipation effect in the vertical direction through the dummy via and the heat dissipation effect in the front-back or left-right direction through the dummy pattern, thereby effectively preventing thermal deformation of the coil circuit board module due to heat generation in the central internal region.

[0053] Furthermore, according to this disclosure, a dummy via or dummy pattern is formed in the central internal region where no working coil pattern is formed, so as to electrically insulate it from the working coil pattern, thereby enhancing vertical rigidity due to the dummy via and enhancing front-to-back or left-to-right rigidity due to the dummy pattern, thereby increasing the rigidity of the central internal region of the burner.

[0054] Furthermore, according to this disclosure, by setting both dummy vias and dummy patterns in the central internal region where no working coil is formed, the heat dissipation effect in the front-back, left-right, and vertical directions can be improved, and the rigidity in the front-back, left-right, and vertical directions can be enhanced. However, this should be interpreted as meaning that the heat dissipation improvement effect and rigidity enhancement effect on the central internal region are not limited to specific directions, and can be relatively greater in specific directions than in other directions.

[0055] In addition, according to this disclosure, a dummy via or dummy pattern is formed in the central internal region where the working coil pattern is not formed, so as to electrically insulate it from the working coil pattern, thereby reducing the proportion of insulating material and thus reducing manufacturing costs.

[0056] In addition to the effects described above, the specific effects of this disclosure will be explained along with the specific matters for implementing this disclosure. Attached Figure Description

[0057] Figure 1 This is a front perspective view of a cooking appliance according to an embodiment of the present disclosure.

[0058] Figure 2 yes Figure 1 The top view of the cooking appliance shown indicates that the display line is connected.

[0059] Figure 3 yes Figure 1 A three-dimensional view of the cooking utensils shown.

[0060] Figure 4 yes Figure 1 An exploded perspective view of the stovetop of the cooking appliance shown.

[0061] Figure 5 yes Figure 4 The top view of the stovetop shown is a three-dimensional view of the structure below the top plate.

[0062] Figure 6 It is used for explanation Figure 4 A schematic cross-sectional view of the multilayer structure of the first coil circuit board module shown.

[0063] Figure 7 It constitutes Figure 4 The diagram shows a top view of the first layer of the multilayer structure of the first coil circuit board module. Figure 8 yes Figure 7 A magnified view of a portion of the image.

[0064] Figure 9 It constitutes Figure 4 The top view of the second layer of the multilayer structure of the first coil circuit board module shown.

[0065] Figure 10 yes Figure 7 The enlarged view shows the patterns formed in each of the first to twelfth layers.

[0066] Figure 11 It constitutes Figure 4 The top view of the third to seventh layers of the multilayer structure of the first coil circuit board module shown.

[0067] Figure 12 It constitutes Figure 4 The top view of the eighth to twelfth layers of the multilayer structure of the first coil circuit board module shown.

[0068] Figure 13 (a) is shown Figure 11 A top view of a portion of the first type of pattern shown. Figure 13 (b) is shown Figure 12 A top view of a portion of the second type of pattern shown.

[0069] Figure 14 (a) is Figure 13 A magnified view of (a). Figure 14 (b) is Figure 13 A magnified view of (b).

[0070] Figure 15 It is shown Figure 4 The diagram shows a schematic cross-sectional view of a structure in which the first type of patterns constituting the third to seventh layers and the second type of patterns constituting the eighth to twelfth layers are connected to each other via working coil vias.

[0071] Figure 16 (a) is Figure 13 A magnified view of (a). Figure 16 (b) is Figure 13 The enlarged view of (b) is a partial enlarged view of the common terminal of the first type pattern and the common terminal of the second type pattern, respectively.

[0072] Figure 17 yes Figure 7 The image shows a partial enlarged view and illustrates the location of the dummy via according to this disclosure.

[0073] Figure 18 and Figure 19 It is a top view showing a state in which multiple dummy through holes are formed in the central region inside the working coil pattern that constitutes an independent burner, based on the first type of pattern.

[0074] Figure 20 This illustrates a first embodiment according to the present disclosure. Figure 18 and Figure 19 The enlarged view shows a partial view of an example of a shape with multiple dummy vias arranged in the central internal region.

[0075] Figure 21 This is a schematic cross-sectional view of the first coil circuit board module, schematically showing an example of the shape of a plurality of dummy vias according to a first embodiment of the present disclosure.

[0076] Figure 22 This illustrates a second embodiment according to the present disclosure. Figure 18 and Figure 19 The top view shown is of a state in which multiple dummy patterns are formed based on the first type of pattern in the central internal region.

[0077] Figure 23 This illustrates a second embodiment according to the present disclosure. Figure 18 and Figure 19 A partial enlarged view of an example of a shape with multiple dummy patterns arranged in the central internal region.

[0078] Figure 24 This is a schematic cross-sectional view of a first coil circuit board module according to a second embodiment of the present disclosure, schematically showing an example of a configuration in which multiple dummy patterns are provided in a multilayer structure.

[0079] Figure 25 and Figure 26 This illustrates a third embodiment according to the present disclosure. Figure 18 and Figure 19 The top view and cross-sectional schematic diagram show the configuration of multiple dummy vias and multiple dummy patterns forming together in the internal central region. Detailed Implementation

[0080] The above-described objects, features, and advantages will now be described in detail with reference to the accompanying drawings, so that those skilled in the art to which this disclosure pertains can readily implement the technical concepts of this disclosure. In describing this disclosure, detailed descriptions of well-known technologies related to this disclosure will be omitted where it is determined that such detailed descriptions may unnecessarily obscure the main points of this disclosure. Hereinafter, preferred embodiments according to this disclosure will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

[0081] Although terms such as "first," "second," etc., are used to describe various components, these components are not limited by these terms. Such terms are only used to distinguish one component from another, and a first component can also be a second component unless explicitly stated otherwise.

[0082] Throughout this document, unless otherwise stated, each part may be singular or plural.

[0083] In the following text, the first component being disposed "on top (or below) the second component" may mean that the first component can be configured to contact the top (or bottom) surface of the second component, and that the third component can be inserted between the second component and the first component disposed "on top (or below)" the second component.

[0084] Furthermore, when the first component is described as "connected" or "linked" to the second component, the components can be directly connected or linked to each other, but the third component can be "inserted" between the components, or the components can be "connected" or "linked" to each other via the third component.

[0085] As used herein, the singular forms “an” and “a” are intended to include the plural forms as well, unless the context clearly indicates otherwise. In this application, terms such as “composed of” or “comprising” should not be construed as necessarily including all of the various components or operations described herein, but should be construed as potentially excluding some of these components or operations, or potentially further including additional components or operations.

[0086] As used herein, the singular forms “an” and “a” are intended to include the plural forms as well, unless the context clearly indicates otherwise. In this application, terms such as “composed of” or “comprising” should not be construed as necessarily including all of the various components or operations described herein, but should be construed as potentially excluding some of these components or operations, or potentially further including additional components or operations.

[0087] Throughout this document, unless otherwise stated, “A and / or B” means A, B, or A and B, and “C to D” means above C and below D, unless otherwise stated.

[0088] [Overall structure of cooking utensils]

[0089] In this disclosure, an embodiment of using a coil circuit board module in a cooking appliance 1 will be described below.

[0090] However, in another implementation, the coil circuit board module can be applied to other devices that require induction heating.

[0091] For example, a coil circuit board module can be mounted on a washing machine to heat the water tank, drum, or washing tub inside the washing machine or to heat the washing water. In another example, the coil circuit board module can be mounted on a water purifier and used to heat a hot water pipe or tank. In yet another example, the coil circuit board module can be mounted on a dryer or garment care equipment to heat the air used for drying clothes, or the coil circuit board module can be mounted on an electrical port or rice cooker to heat liquids or food therein.

[0092] Figure 1 This is a perspective view showing a cooking appliance 1 according to an embodiment of the present disclosure. Figure 2 It shows the composition Figure 1 A top view of the stovetop 20 of the cooking appliance 1 shown.

[0093] Reference Figure 1and Figure 2 According to embodiments of the present disclosure, the cooking appliance 1 may include a cooktop 20 and an oven 10 disposed below the cooktop 20.

[0094] The cooking appliance 1 according to embodiments of the present disclosure can be an oven / stove type, wherein the cooktop 20 is disposed in the upper region and the oven 10 is disposed in the lower region. However, the present disclosure is not limited thereto, and the cooking appliance 1 according to embodiments of the present disclosure can be implemented as a cooking appliance 1 that only includes the cooktop 20. Hereinafter, the case in which the cooking appliance 1 is implemented as an oven / stove type will be described by way of example.

[0095] According to the embodiments of this disclosure, the cooking appliance 1 is an oven-to-cooktop type, thereby providing both the function of an oven as a closed cooking device and the function of a cooktop as an open cooking device.

[0096] The cooking chamber can be formed inside the oven 10, which serves as a closed cooking device. When the interior of the cooking chamber of the oven 10 is heated, the food contained therein can be cooked.

[0097] Therefore, although not shown, oven 10 may be equipped with a heater for heating the interior of the cooking chamber. The heater may be a heating device that uses gas fuel or electricity.

[0098] The door 11 for selectively opening and closing the cooking chamber may be pivotally mounted at the oven 10 of the cooking appliance 1.

[0099] For example, the door 11 can be installed in the oven 10 in the form of a pull-down opening and closing mechanism that rotates vertically around the lower end to open and close the cooking chamber.

[0100] The control panel 30 for operating the oven 10 and the cooktop 20 can be located on top of the front surface of the cooking appliance 1.

[0101] Since the control panel 30 is located on the front surface of the cooking appliance 1, the control panel 30 can constitute part of the exterior of the front surface of the cooking appliance 1.

[0102] The control panel 30 may be equipped with multiple switches for controlling the operation of the cooking appliance 1 and a display 31 for displaying the operating status of the cooking appliance 1.

[0103] Furthermore, as shown in the figure, the control panel 30 of the cooking appliance 1 may also include multiple knobs 32. That is, multiple knobs 32 for adjusting the operation of the cooking appliance 1 may be included together with the display 31 in the control panel 30 located on the top of the front surface of the cooking appliance 1.

[0104] Each knob 32 can be configured to rotate. The knob 32 can be configured to control one of the oven 10 and the cooktop 20, or it can be configured to control both the oven 10 and the cooktop 20.

[0105] By operating the knob as described above, you can select one of a variety of preset cooking modes, or you can select the heating temperature or heating step.

[0106] Furthermore, the control panel 30 of the cooking appliance 1 according to this embodiment may further include a knob ring 33. The knob ring 33 may be disposed radially outside the knob 32. For example, the knob ring 33 may be configured as a ring surrounding the knob 32, while being located radially outside the knob 32.

[0107] The knob ring 33 can be used to support the knob 32 and can also be used to improve the appearance quality of the cooking appliance 1 by modifying the appearance around the knob 32.

[0108] In addition, the knob ring 33 in this embodiment can be used as a timer setting switch and also serves to display the timer time and fire intensity.

[0109] The knob ring 33 is configured to rotate independently of the knob 32, and the timer time can be set by rotating the knob ring 33 as described above.

[0110] As described above, the cooktop 20 can be positioned on top of the oven 10.

[0111] The cooktop 20 can function as a food heating or food container, which can be placed on the upper surface of the cooktop 20 or used to heat a target.

[0112] For this purpose, the cooktop 20 may include a top plate 21, which forms the upper surface of the cooktop 20, and a food container is placed on the top plate or a heating target is in contact with the top plate 21.

[0113] Additionally, a heater for heating a container holding food or a heater for heating a target being heated can be installed on the inner side of the cooktop 20 and below the top plate 21.

[0114] The heater can be configured to include at least one burner. For example, the burner constituting the heater can be provided in the form of a working coil for converting supplied electricity into magnetic force or a heating coil for converting supplied electricity into heat energy.

[0115] The cooktop surface 20 of the cooking appliance 1 according to the embodiments of this disclosure can be operated by induction heating.

[0116] For this purpose, the burner of the cooktop 20 can be configured to include a working coil. The burner including the working coil can operate under the high-frequency current generated and supplied to it by the inverter to generate a strong magnetic field.

[0117] The magnetic field generated in a burner, which includes a working coil, can induce eddy currents in a container containing metal parts. As these eddy currents flow through the container, they generate heat, thus heating the container. When the container is heated, the food contained within it can be heated.

[0118] However, the working coil used in traditional induction heating cooktops is usually formed by twisting multiple conductive wires together to form a cable and then winding the cable into a spiral shape.

[0119] However, as will be described later, the working coil of the cooktop 20 constituting the cooking appliance 1 according to an embodiment of the present disclosure may be composed of a plurality of patterns stacked on a printed circuit board, each pattern being formed in a spiral shape.

[0120] As described above, the working coil of the cooking appliance 1 according to this disclosure may have a structure in which a pattern is stacked on a printed circuit board, and thus may be referred to as a working coil pattern.

[0121] Detailed configuration of the heater containing the working coil pattern will be provided later. Figure 2 Please provide an explanation.

[0122] [Overall configuration of the cooktop]

[0123] The following is for reference Figures 2 to 4 The configuration of the cooktop surface 20 constituting the cooking appliance 1 according to the embodiments of the present disclosure will be described.

[0124] Figure 2 This is a top view of the stove surface 20 with the display line L connected. Figure 3 It is a perspective view of the stove surface 20 disclosed herein. Figure 4 yes Figure 3 An exploded perspective view of the stove surface 20 shown. Figure 5 yes Figure 3 The top view of the stovetop shown is a three-dimensional view of the structure below the top plate.

[0125] First, refer to Figures 2 to 5 Similar to the oven 10 described above, the cooktop 20 according to this embodiment may include a control panel 22.

[0126] As shown in the figure, the control panel 22 of the cooktop 20 can be set on the top plate 21, and can be set closer to the front edge of the top plate 21 for the convenience of the user.

[0127] The control panel 22 can be equipped with various switches for controlling the operation of the cooktop 20 and a display panel 221 for displaying the operating status of the cooktop 20.

[0128] As described below, when the sensing coil pattern 2514 detects that the container is placed on the upper surface 21a of the top plate 21, an icon corresponding to the container can be displayed on the display panel 221 of the control panel 22 provided on the cooktop 20. As an example, the icon can be set with a size and shape corresponding to the size and shape of the container, and can be set at a position on the display panel 221 corresponding to the position of the cooking appliance 1.

[0129] Users can press the displayed icon to select the container shown by the icon, and can perform operations to control the cooking utensil 1 associated with the selected container.

[0130] For example, a user can press an icon to select the container to be operated on, and then select the desired heating temperature for the selected container.

[0131] When the container heating is started via the control panel 22 as described above, such as Figure 2 As shown, the start of heating of the container can be displayed on the top plate 21 using the display line L.

[0132] like Figure 2 As shown, multiple display lines L can be installed on the top plate 21 of the stove surface 20.

[0133] The display line L, in the form of an luminescent area, displays information related to the container's position, heating status, temperature, etc., on the top plate 21, thus visually conveying this information to the user.

[0134] Figure 2 An embodiment with a total of seven display lines L is shown. For convenience, these display lines L can be referred to sequentially from the left side of the top plate 21 as the first display line to the seventh display line L1, L2, L3, L4, L5, L6, L7. This disclosure is not limited thereto. However, for convenience, an example in which a total of seven display lines L are provided will be described.

[0135] As shown in the figure, each display line L can be a light-emitting area whose width in the left-right direction is much smaller than its length in the front-back direction.

[0136] The display line L can be implemented using a light source module 23, which is located below the top plate 21 and on the plate support 26 described later, so that each display line L can be formed as a light-emitting area.

[0137] The light source module 23 may include a plurality of light source elements 231 for generating visible light and a light source circuit board 232 for mounting the plurality of light source elements 231.

[0138] Multiple light source elements 231 can be configured to irradiate visible light toward the lower surface of the top plate 21. The incident visible light passes through the light-transmitting holes of the through plate support 26, the light-transmitting slit holes H_sl formed in each coil circuit board module constituting the heater 25, and the gaps formed between adjacent coil circuit board modules to irradiate the lower surface of the top plate 21, as described later.

[0139] The light source module 23 can be configured to include a plurality of light source elements 231 that receive power to generate visible light and a light source circuit board 232 on which the plurality of light source elements 231 are mounted.

[0140] The light source element 231 can be any device capable of receiving power and generating a predetermined visible light, and its application is not limited; for example, it can be an LED element. However, in the following description, this disclosure will be based on an embodiment in which an LED element is used as the light source element 231. This disclosure is not limited thereto.

[0141] As shown in the figure, each light source circuit board 232 can extend linearly in the front-back direction in a manner corresponding to each linearly extending display line L, and a plurality of light source elements 231 can be disposed on each light source circuit board 232 and arranged linearly to be spaced apart from each other in the front-back direction with equal or uneven spacing.

[0142] Furthermore, as described above, each of the plurality of light source modules 23 can be configured to independently illuminate each of the first to seventh display lines L1, L2, L3, L4, L5, L6, and L7 with visible light. The plurality of light source modules 23 can be sequentially referred to as the first light source module to the seventh light source module 23a, 23b, 23c, 23d, 23e, 23f, and 23g, starting from the left side of the top plate 21.

[0143] The first to seventh light source modules 23a, 23b, 23c, 23d, 23e, 23f and 23g can be arranged in a way that is spaced apart from each other in the left and right directions, corresponding to the first to seventh display lines L1, L2, L3, L4, L5, L6 and L7.

[0144] As will be described later, the spacing between adjacent display lines L and the spacing between adjacent light source modules 23 can be equal to or slightly greater than the width in the left-right direction of the working coil pattern 2512 constituting the heater 25.

[0145] As shown in the figure, the cooktop surface 20 of the cooking appliance 1 according to the embodiments of the present disclosure may include a bottom shell 24, which constitutes the front surface, rear surface, two opposing side surfaces and lower surface of the cooktop surface 20.

[0146] The bottom shell 24 can be formed with its upper surface being entirely open, and the top plate 21 can be connected to the upper surface of its opening.

[0147] like Figure 4 As shown, a fastening bracket 211 for connecting the bottom shell 24 to the top plate can be provided at a position on the lower surface of the top plate 21 corresponding to the position of the upper end of the bottom shell 24.

[0148] When the top plate 21 is connected to the upper end of the bottom shell 24, the interior space can be defined as being surrounded by the top plate 21 and the bottom shell 24 and can accommodate multiple internal components that constitute the cooktop 20.

[0149] In addition, multiple mounting brackets 241 can be integrally installed with the base shell 24, or they can be installed separately from the base shell 24.

[0150] The mounting bracket 241 can be installed in the interior space of the cooktop 20 and can protrude upward from the lower surface of the mounting bracket 241 toward the electronic / electrical components.

[0151] Mounting bracket 241 can support multiple electronic / electrical components 28 that constitute the cooktop surface 20, and is positioned below it to prevent sagging of components such as main circuit board module 281, SMPS circuit board module 282, inverter circuit board module 283, resonant circuit board module 284, EMI filter module 285, etc., and supports these components.

[0152] In addition, such as Figure 4 As shown, an air inlet 242 and an exhaust 243 are formed vertically through the lower surface 24a of the bottom shell 24 to allow airflow for cooling various electronic / electrical components constituting the cooktop 20.

[0153] The cooktop surface 20 of the cooking appliance 1 according to an embodiment of the present disclosure may further include a heater 25, the heater 25 including a working coil for heating a container in an induction heating manner, and as described above, the working coil may include a plurality of working coil patterns 2512 stacked on a printed circuit board, each pattern being formed in a spiral manner.

[0154] Considering the fact that multiple working coil patterns 2512 are stacked in multiple multi-layer structures to form a burner, the printed circuit board formed by stacking the working coil patterns 2512 can be referred to as a coil circuit board module.

[0155] Furthermore, as described later, the plurality of working coil patterns 2512, plurality of sensing coil patterns 2514, plurality of lead patterns 2513, etc., constituting the coil circuit board module can be formed in a manner similar to the general scheme for manufacturing patterns on printed circuit boards. Therefore, with this in mind, the component referred to as a pattern below can be referred to by various terms such as conductive part, metal part, copper part, thin film part, printed part, etc. In addition, similar to the plurality of working coil patterns 2512, plurality of sensing coil patterns 2514, and plurality of lead patterns 2513, the dummy patterns provided in the coil circuit board module can be referred to as dummy conductive part, dummy metal part, dummy copper part, dummy thin film part, dummy printed part, etc.

[0156] Furthermore, similar to conventional multilayer printed circuit boards, the coil circuit board module of this disclosure may include working coil vias H_v1, sensing coil vias H_v2, and temperature sensor vias H_v3 for electrically connecting patterns disposed in different layers to each other, as well as a plurality of dummy vias not electrically connected to other patterns. Similar to related technologies, vias can be formed in the through-holes formed in the coil circuit board module by physical, chemical deposition, or coating, and therefore can be referred to by various terms, such as conductive coatings or conductive depositions.

[0157] To facilitate manufacturing and improve efficiency, multiple coil circuit board modules that constitute the heater 25 can be configured.

[0158] Figure 4 and Figure 5 An embodiment of a cooktop 20 including a heater 25 comprising a total of three coil circuit board modules is shown. However, the present disclosure will be described below based on an embodiment with three coil circuit board modules arranged as shown in the figures. The present disclosure is not limited thereto.

[0159] The three coil circuit board modules 251, 252 and 253 are referred to as the first coil circuit board module 251, the second coil circuit board module 252 and the third coil circuit board module 253, respectively, starting from the left.

[0160] Each of the coil circuit board modules 251, 252 and 253 may include a plurality of burners 2511 for heating the container.

[0161] Figure 5An embodiment is shown in which eight burners 2511 can be disposed in each of the first coil circuit board module 251 and the third coil circuit board module 253, and six burners 2511 can be disposed in the second coil circuit board module 252. As will be described later, the number of burners 2511 can vary depending on the size and output of the cooktop 20. Hereinafter, this disclosure will be described based on an example in which each of the first coil circuit board module 251 and the third coil circuit board module 253 has eight burners 2511 and the second coil circuit board module 252 has six burners.

[0162] In addition, although Figure 5 The individual burners 2511 are shown to be identical in shape and size, but this is merely an example. Similarly, the shape and size of the burners 2511 can be configured to vary depending on the size and output of the cooktop surface 20.

[0163] In each of the coil circuit board modules 251, 252 and 253, the working coil patterns 2512 constituting each of the plurality of burners 2511 can be stacked in multiple layers.

[0164] Additionally, in each of the coil circuit board modules 251, 252, and 253, a sensing coil pattern 2514 may be stacked on the upper surface 21a of the top plate 21 as a means of detecting whether the container is placed in a specific location.

[0165] Additionally, a temperature sensor 2515 for sensing the temperature of each corresponding area of ​​the top plate 21 can be provided in each of the coil circuit board modules 251, 252, and 253.

[0166] In this regard, as described later, the working coil pattern 2512, the sensing coil pattern 2514, and the temperature sensor 2515 can be integrated into each of the coil circuit board modules 251, 252, and 253. Therefore, compared to the prior art, the vertical length of the heater 25 of the cooktop 20 according to this disclosure is significantly reduced, allowing for a reduction in the vertical dimensions of the cooktop 20, thereby significantly improving space utilization and significantly simplifying the manufacturing process of the cooktop 20.

[0167] Each of the working coil pattern 2512 and the sensing coil pattern 2514 can extend in a spiral shape. The working coil pattern 2512 can be stacked in the vertical direction. The sensing coil pattern 2514 can be stacked in the vertical direction.

[0168] In this regard, as described below, each of the first to third coil circuit board modules 251, 252, and 253 can be configured such that the working coil pattern 2512 is stacked in 10 to 12 layers in the vertical direction and the sensing coil pattern 2514 is stacked in two layers in the vertical direction. Therefore, each of the coil circuit board modules 251, 252, and 253 can include a multilayer structure with 12 to 14 layers.

[0169] Furthermore, due to the characteristics of the layer stacking process of printed circuit boards, the vertical thickness of each layer is relatively small. Therefore, the number of layers in each of the coil circuit board modules 251, 252, and 253 can exceed 14 layers. That is, the number of layers in the coil circuit board modules 251, 252, and 253 is determined according to specific design conditions, but there is no particular limitation on the number of layers in the coil circuit board modules 251, 252, and 253.

[0170] In a cross-sectional view perpendicular to the direction of current travel, a working coil pattern 2512 with a spiral shape should be formed, with the copper pattern extending in both vertical and horizontal directions. Therefore, a working coil pattern 2512 with four or more layers can be applied. That is, each of the coil circuit board modules 251, 252, and 253 can have at least four layers of copper pattern.

[0171] Each sensing coil pattern can be located inside the area occupied by the working coil pattern 2512 constituting a single burner 2511, or it can be located in the area between a pair of adjacent working coil patterns 2512.

[0172] In this embodiment, considering the efficiency and accuracy of container detection, as described later, a pair of sensing coil patterns 2514 can be disposed inside the area occupied by each working coil pattern 2512, and a pair of sensing coil patterns 2514 can be disposed in the area between adjacent pairs of working coil patterns 2512.

[0173] Each temperature sensor 2515 used to sense the temperature of the top plate 21 can be positioned at a location corresponding to the center of each sensing coil pattern 2514.

[0174] Details regarding the working coil pattern 2512, sensing coil pattern 2514, and temperature sensor 2515 constituting the first to third coil circuit board modules 251, 252, and 253 will be provided later. Figure 6 Please provide an explanation.

[0175] The cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure may further include a plate support 26.

[0176] The internal components located inside the cooktop 20 can be mounted on the plate support 26 used to support the internal components.

[0177] More specifically, such as Figure 4 As shown, the first coil circuit board modules to the third coil circuit board modules 251, 252, and 253, as well as the ferrite core module 27, can be mounted on the upper surface of the plate support 26. Therefore, the plate support 26 functions as a coil base conventionally mounted with the working coil and the ferrite core.

[0178] In addition, such as Figure 4 As shown, several electronic / electrical components 28 constituting the cooktop 20 can be installed below the plate support 26.

[0179] Electronic / electrical components 28 may include a main circuit board module 281, an SMPS circuit board module (switching mode power supply device) 282, an inverter circuit board module 283, a resonant circuit board module 284, an EMI filter module 285, a fan module 286, a light source module 23, etc.

[0180] These electronic / electrical components 28 can be disposed in the space formed below the plate support 26 and between the lower surface 24a of the bottom shell 24 and the plate support 26.

[0181] As an example, in order to effectively accommodate these electronic / electrical components 28, the plate support 26 may have an inverted box shape, such that it is fully open to the lower surface of the bottom shell 24.

[0182] Therefore, the main circuit board module 281, the SMPS circuit board module (switching mode power supply device) 282, the inverter circuit board module 283, the resonant circuit board module 284, the EMI filter module 285, the air supply fan module 286, and the light source module 23 can be stacked with the board support 26 in the receiving space formed inside the board support 26.

[0183] As described above, the first to third coil circuit board modules 251, 252, and 253 are mounted on the upper surface of the board support 26, and the electronic / electrical components 28 are mounted on the lower surface of the board support 26 and located inside the board support 26. Therefore, the wiring structure between the electronic / electrical components 28 and the wiring structure between the electronic / electrical components 28 and the first to third coil circuit board modules 251, 252, and 253 can be significantly simplified and simplified.

[0184] In particular, in the conventional cooktop 20, almost all components need to be disassembled in the reverse order of the assembly process in order to repair the inverter circuit board, which is the main cause of malfunctions and defects.

[0185] Conversely, in the cooktop 20 of the cooking appliance 1 according to the present disclosure, when only the bottom shell 24 is removed while the cooktop is inverted with the bottom shell 24 facing upwards, the user can easily access electronic / electrical components 28 such as the inverter circuit board module 283, thereby easily repairing or replacing any faulty electronic / electrical components 28.

[0186] In this regard, the assembly process of the cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure will be briefly described.

[0187] First, multiple ferrite core modules 27 can be assembled onto the upper surface 261 of the plate support 26.

[0188] The ferrite core module 27 according to embodiments of this disclosure can be configured in a modular manner by connecting multiple ferrite cores to each other. This is designed with reference to the possibility of cracking defects or magnetic field loss when using ferrite cores formed as a single body with a relatively large volume.

[0189] As described above, multiple ferrite cores are modularized to form a ferrite core module 27, which can be mounted on a plate support 26, thereby reducing the number of parts and simplifying the assembly process.

[0190] As an example, the ferrite core module 27 can be manufactured by insert injection. As described above, the ferrite core module 27 is manufactured by insert injection, which eliminates the need for separate fixtures used in the prior art when assembling the cooktop 20 to fix the ferrite core unit.

[0191] Furthermore, as described above, the ferrite cores are modularized to form multiple ferrite core modules 27. Therefore, even if some ferrite cores are damaged, the damaged cores can be repaired by simply replacing the damaged ones.

[0192] Once the mounting of multiple ferrite core modules 27 on the upper surface 261 of the plate support 26 is completed, the first coil circuit board module to the third coil circuit board modules 251, 252 and 253 can be placed on top of the ferrite core module 27.

[0193] Next, with the first to third coil circuit board modules 251, 252 and 253 already placed on it, the board support 26 can be flipped over and the electronic / electrical components 28 can be assembled.

[0194] As described above, multiple electronic / electrical components 28 can be mounted and assembled on the lower surface of the plate support 26. In this respect, these electronic / electrical components 28 can be mounted and assembled on the plate support 26 while in an inverted state.

[0195] The cooktop surface 20 of the cooking appliance 1 according to the embodiments of the present disclosure may further include a heat insulation member 291 disposed between the first coil circuit board module to the third coil circuit board module 251, 252 and 253 and the top plate 21 and on the top of the first coil circuit board module to the third coil circuit board module 251, 252 and 253.

[0196] The heat insulation element 291 is disposed on the upper surface 21a of the top plate 21 and is used to minimize the transfer of heat generated from the container heated by the working coil pattern 2512 to the working coil pattern 2512.

[0197] To perform this thermal insulation function, the thermal insulation element 291 can be provided in the form of a pad covering the entirety of the first coil circuit board module to the third coil circuit board modules 251, 252 and 253.

[0198] In this embodiment, the heat insulation element 291 can be divided into multiple pads.

[0199] More specifically, each of the heat insulation components 291 can be divided into multiple pads, the width of each pad in the left-right direction corresponding to the width of the burner 2511 in the left-right direction formed in each of the first to third coil circuit board modules 251, 252 and 253.

[0200] As described above, the heat insulation element 291 is divided into multiple heat insulation elements 291, such that a predetermined gap can be formed between adjacent heat insulation elements 291. Therefore, visible light generated from the light source module 23 can pass through the predetermined gap and illuminate the lower surface of the top plate 21, so that the display line L can be displayed on the top plate 21.

[0201] The heat insulation element 291 may also be used to electrically insulate the working coil pattern 2512 or sensing coil pattern 2514 formed in the first coil circuit board module to the third coil circuit board module 251, 252 and 253 from the top plate 21.

[0202] In this respect, the thermal insulation element 291 can be made of a material that has both thermal insulation and electrical insulation properties.

[0203] In one example, although not shown, to further enhance the electrical insulation performance of the insulation member 291, an electrical insulator may be added between the insulation member 291 and the top plate 21, and disposed on the top of the insulation member 291. As an example, the electrical insulator may be a mica sheet with a thickness less than the vertical thickness of the insulation member 291.

[0204] [Detailed configuration of the coil circuit board module]

[0205] The following is for reference Figures 6 to 15The detailed configuration of each coil circuit board module constituting the cooktop surface 20 of the cooking appliance 1 according to the present disclosure will be described.

[0206] As described above, the cooktop surface of the embodiments of this disclosure may include a first coil circuit board module to a third coil circuit board module 251, 252 and 253.

[0207] In this respect, apart from the number of working coil patterns 2512 and sensing coil patterns 2514 constituting the burner 2511, the first coil circuit board modules to the third coil circuit board modules 251, 252 and 253 can be configured in a substantially similar manner to each other.

[0208] Therefore, the following description will be based on the first coil circuit board module 251. Unless otherwise stated, the description set forth below can be applied in substantially the same manner to the second coil circuit board module 252 and the third coil circuit board module 253.

[0209] First, as described above, the first coil circuit board module 251 can be formed by stacking the working coil pattern 2512 into multiple layers to constitute each of the plurality of burners 2511.

[0210] like Figure 6 As shown, for example, the first coil circuit board module 251 may include working coil patterns 2512 vertically arranged in a multilayer structure of 10 layers, sensing coil patterns 2514 vertically arranged in a multilayer structure of 2 layers, and each electrically insulating material disposed between adjacent working coil patterns 2512 and sensing coil patterns 2514 to electrically insulate adjacent coil patterns from each other. The electrically insulating material may be formed by curing a prepreg composed of a thermosetting resin typically used to form printed circuit boards and glass fiber. In one example, the applicable thermosetting resin is preferably an epoxy resin, specifically FR-4.

[0211] The electrical insulating material, including the prepreg as described above, can be disposed between the layers of the working coil pattern 2512 having a multilayer structure to insulate the coil patterns of the layers from each other, and can be disposed between the sensing coil patterns 2514 to insulate the sensing coil patterns 2514 from each other. Furthermore, the electrical insulating material can fill areas where patterns such as the working coil pattern 2512, sensing coil pattern 2514, and lead coil pattern 2513 are not present, and thus can be used to form a layered structure of a single layer.

[0212] Therefore, based on the working coil pattern 2512 and the sensing coil pattern 2514, the first coil circuit board module 251 can have a multi-layer structure with a total of 12 layers along the vertical direction, from the first layer 251a constituting the uppermost layer to the twelfth layer 251l constituting the lowermost layer.

[0213] Additionally, coatings (not shown) can be deposited on the top and bottom layers of the first coil circuit board module 251. The coatings serve as electrical insulation layers and also prevent the interior of the cooktop 20 from being easily visible through the top plate 21 made of transparent material. For this purpose, the coating can be applied in a black color.

[0214] In one example, the dummy via H_vd, described later, can be formed after the coating is formed. That is, the conductive material constituting the dummy via H_vd can be exposed to the outside and is visible through the top plate 21. Alternatively, the dummy pattern 2519, described later, can be shielded by the coating or formed in an intermediate layer between the top and bottom layers, so it can be exposed to the outside without being exposed through the top plate 21.

[0215] However, this disclosure is not limited thereto. After forming the dummy via H_vd or dummy pattern 2519, a coating formation process can be performed. Therefore, the dummy via H_vd or dummy pattern 2519 may not be exposed to the outside.

[0216] Furthermore, in the components of the first coil circuit board module 251, the high-power terminal pattern 2516 that requires electrical contact and therefore needs to be exposed to the outside may not be coated.

[0217] In this respect, the first sensing coil pattern 2514a constituting the sensing coil pattern 2514 can be disposed at the first layer 251a of the first coil circuit board module 251 having a 12-layer structure.

[0218] In addition, lead pattern 2513 may be provided at the first layer 251a to electrically connect the first sensing coil pattern 2514a to the signal processor 2518 described later, or to electrically connect the working coil pattern 2512 provided at each of the third to twelfth layers 251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k and 251l to the high-power terminal pattern 2516 to which high-frequency power has been applied.

[0219] In this respect, lead pattern 2513 may include a first lead pattern 2513a for electrically connecting the working coil pattern 2512 disposed at each of the third to twelfth layers 251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k and 251l to the high-power terminal pattern 2516 and a second lead pattern 2513b for electrically connecting the first sensing coil pattern 2514a to the signal processor 2518.

[0220] In addition, although Figure 6 Not shown, but may be further added on the first layer 251a: a temperature sensor 2515 for sensing the temperature of the top plate 21, a high-power terminal pattern 2516 for supplying high-frequency power from the inverter circuit board module 283, a signal processor 2518 for processing the output signal of the sensing coil pattern 2514 and the output signal of the temperature sensor 2515, and a third lead pattern 2513c for electrically connecting the temperature sensor 2515 and the signal processor 2518 to each other.

[0221] The second sensing coil pattern 2514b constituting the sensing coil pattern 2514 and the second lead pattern 2513b electrically connecting the second sensing coil pattern 2514b to the signal processor 2518 can be disposed at the second layer 251b of the first coil circuit board module 251.

[0222] In other words, in order to improve the sensing efficiency and effect of the container, the sensing coil pattern 2514 may include a first sensing coil pattern 2514a disposed on the first layer 251a and a second sensing coil pattern 2514b disposed on the second layer 251b.

[0223] In this respect, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be configured to be connected in series with each other via sensing coil vias H_v2 extending through the first layer 251a and the second layer 251b, thereby serving as a single sensing coil pattern 2514, as described below.

[0224] The second sensing coil pattern 2514b constituting the sensing coil pattern 2514 can be disposed on the second layer 251b of the first coil circuit board module 251.

[0225] As described below, the working coil pattern 2512 disposed in the cooktop surface 20 of the cooking appliance 1 according to an embodiment of the present disclosure may include a first type pattern 2512a and a second type pattern 2512b, wherein the travel direction or winding direction of each pattern strand 2512a-1 and 2512b-1 is opposite to each other, so that the magnetic field can act uniformly on the container.

[0226] like Figure 6As shown, for example, the working coil pattern 2512 of the first type pattern 2512a can be formed at each of the third to seventh layers 251c, 251d, 251e, 251f and 251g. In this respect, in the first type pattern 2512a, the direction of travel or winding of the individual pattern strands 2512a-1 is a first direction.

[0227] Furthermore, in one example, the working coil pattern 2512 of the second type pattern 2512b can be formed at each of the eighth to twelfth layers 251h, 251i, 251j, 251k, and 251l. In this respect, in the second type pattern 2512b, the direction of travel or winding of the individual pattern strands 2512b-1 is the second direction.

[0228] In this regard, as shown in the figure, the first lead pattern 2513a formed in the first layer 251a, the first type pattern 2512a provided in each of the third to seventh layers 251c, 251d, 251e, 251f and 251g, and the second type pattern 2512b provided in each of the eighth to twelfth layers 251h, 251i, 251j, 251k and 251l can be configured to be interconnected with each other via working coil vias H_v1 that extend continuously through the first layer 251a to the twelfth layer 251l.

[0229] Thus, multiple first-type patterns 2512a and multiple second-type patterns 2512b constituting a particular burner among the multiple burners described below can be connected in series with each other via the working coil via H_v1.

[0230] In one example, although not shown, an electrical insulating material may be additionally formed on top of the first layer 251a and below the twelfth layer 251l.

[0231] Figure 6 The multi-layer structure of the first coil circuit board module 251 shown is merely an example.

[0232] In other words, the multilayer structure can be modified so that the second sensing coil pattern 2514b is set as a layer other than the second layer 251b at the sixth layer 251f or the seventh layer 251g, which is used as an intermediate layer, or at the twelfth layer 251l, which is used as the bottom layer.

[0233] In addition, although Figure 6The first type pattern 2512a is shown to be arranged continuously from the third layer 251c to the seventh layer 251g and the second type pattern 2512b is arranged continuously from the eighth layer 251h to the twelfth layer 251l, but the present disclosure is not limited thereto, and the first type pattern 2512a and the second type pattern 2512b can be arranged alternately and repeatedly perpendicular to each other.

[0234] It should be understood that such variations naturally fall within the scope of this disclosure. However, in the following text, it will be based on... Figure 6 The multilayer structure of the first coil circuit board module 251 shown is described. However, this disclosure is not limited thereto.

[0235] In the first coil circuit board module 251 with a multi-layer structure, the shape of the working coil pattern 2512 used as the second type pattern 2512b can be printed on a copper film in a mask manner. Unnecessary parts can be removed by etching process to form the pattern, and an electrical insulating material can be coated on the formed pattern to form the twelfth layer 251l used as the bottom layer.

[0236] In this embodiment, the thickness of the applied copper film can be in the range of 0.13 mm to 0.15 mm, preferably 0.14 mm.

[0237] Therefore, when no additional surface treatment is performed in the layer formation process, the vertical thickness of individual patterns formed by patterning copper thin films can be in the range of 0.13 mm to 0.15 mm.

[0238] In addition, the thickness of the electrical insulation material applied in this embodiment can be in the range of 0.09 mm to 0.11 mm, preferably 0.1 mm.

[0239] As described above, a twelfth layer 251l, which is the lowest layer, is formed. Then, the same process as that used to form the twelfth layer 251l is repeated on it, thereby constructing a structure as follows: Figure 6 The multi-layered structure shown.

[0240] Therefore, when the formation of the first coil circuit board module 251 with a total of 12 layers is completed, the thickness of the first coil circuit board module 251 in the vertical direction can be in the range of 2.7 mm to 3.3 mm, preferably 3 mm.

[0241] The manufacturing method for forming the multilayer printed circuit board of the first coil circuit board module 251 having the above-described shape and structure can employ means known in the art, therefore a detailed description of the manufacturing method is omitted below.

[0242] Figure 7 and Figure 8Plan views of the first layer 251a and the second layer 251b of the first coil circuit board module 251 with a multi-layer structure are shown respectively.

[0243] In this embodiment, based on the state in which the first coil circuit board module 251 is disposed in the stove surface 20, the first coil circuit board module 251 can be constructed into a rectangular shape with a width in the front-to-back direction greater than the width in the left-to-right direction.

[0244] Accordingly, each of the first layer 251a, which is the topmost layer, and the second layer 251b, which is the second topmost layer, can be constructed as a rectangular shape with a width in the front-back direction greater than its width in the left-right direction.

[0245] As described above, a first sensing coil pattern 2514a constituting one of the sensing coil patterns 2514 arranged in two layers can be disposed in the first layer 251a. A second sensing coil pattern 2514b constituting the other layer of the sensing coil patterns 2514 arranged in two layers can be disposed in the second layer 251b.

[0246] In this respect, as shown in the figure, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be wound in a shape different from the shape in which the working coil pattern 2512 is wound.

[0247] That is, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be wound in a circular spiral shape. As an example, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be configured to have 18 turns, and its outer diameter can be in the range of 32 mm to 34 mm, preferably 33 mm. Furthermore, the width of the individual pattern strands constituting each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be in the range of 0.27 mm to 0.33 mm, preferably 0.3 mm.

[0248] As will be described later, the working coil pattern 2512 is wound into a quadrilateral spiral shape.

[0249] Furthermore, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b is positioned to partially overlap with the working coil pattern 2512 in the vertical direction.

[0250] Therefore, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may malfunction or experience sensing errors due to overlapping areas.

[0251] As described above, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b is wound in a circular spiral shape, such that interference between each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b and the working coil pattern 2512 wound in a quadrilateral spiral shape can be minimized. Therefore, the possibility of failure and detection error in each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be minimized.

[0252] Each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be wound such that its winding starting point is not located at the center of the circular spiral. That is, a first central inner region can be formed in the central region of the circular spiral shape without each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b forming therein.

[0253] Temperature sensor 2515 may be mounted in the central interior region of each first sensing coil pattern 2514a, as described below. In order to distinguish the central interior region of the first sensing coil pattern 2514a from the central interior region formed inward by the working coil pattern 2512, which will be described later, the central interior region of the first sensing coil pattern 2514a is referred to hereinafter as the first central interior region.

[0254] Detailed configuration of the temperature sensor 2515 will be provided later. Figure 9 Please provide an explanation.

[0255] In this embodiment, multiple first sensing coil patterns 2514a and multiple second sensing coil patterns 2514b can be provided.

[0256] More specifically, each of some of the plurality of first sensing coil patterns 2514a may be entirely disposed within a region of a particular burner, while each of the other first sensing coil patterns 2514a may be disposed across a pair of adjacent burners 2511. Similarly, each of some of the plurality of second sensing coil patterns 2514b may be entirely disposed within a region of a particular burner, while each of the other second sensing coil patterns 2514b may be disposed across a pair of adjacent burners 2511.

[0257] For example, in such Figure 7 In the illustrated embodiment, when the first coil circuit board module 251 includes a total of eight burners 2511, a total of 28 first sensing coil patterns 2514a and a total of 28 second sensing coil patterns 2514b can be provided.

[0258] However, this is merely an example, and the number of first sensing coil patterns 2514a can be adjusted to vary depending on the size of the individual burner 2511 and the size of the first coil circuit board module 251. However, the following description will be based on an embodiment with 28 first sensing coil patterns 2514a and 28 second sensing coil patterns 2514b arranged in the first coil circuit board module 251. This disclosure is not limited thereto.

[0259] The first sensing coil pattern 2514a, located at different positions, can be configured to have substantially the same number of turns, and similarly, the second sensing coil pattern 2514b, located at different positions, can be configured to have the same number of turns.

[0260] The sensing coil via H_v2 can be formed at the start or end of the first sensing coil pattern 2514a, and the sensing coil via H_v2 can be connected to the end or start of the second sensing coil pattern 2514b. Therefore, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be connected in series to form a single sensing coil pattern 2514.

[0261] The start or end point of the via H_v2 not connected to the sensing coil can be electrically connected to the signal processor 2518 disposed in the first layer 251a via the second lead pattern 2513b formed in the first layer 251a or the second layer 251b, such as Figure 7 and Figure 8 As shown.

[0262] In one example, the temperature sensor 2515, described later, can be electrically connected to the signal processor 2518 via a third lead pattern 2513c. Figure 8 As shown, the third lead pattern 2513c can be formed in the second layer 251b.

[0263] like Figure 7 As shown, when a total of 28 sensing coil patterns 2514 are provided, four signal processors 2518 can be provided as an example. In this case, one pair of signal processors 2518 can be disposed in the central region of the rear edge of the first layer 251a and adjacent to each other, while another pair of signal processors 2518 can be disposed in the central region of the front edge of the first layer 251a and adjacent to each other.

[0264] For example, in such Figure 7In the illustrated embodiment, a group of six sensing coil patterns 2514 arranged on the left side of a plurality of sensing coil patterns 2514 arranged in the region between the center line in the front-rear direction and the front edge of the first layer 251a, and six temperature sensors 2515 respectively arranged in the six sensing coil patterns 2514, can be assigned to the left signal processor 2518 of a pair of signal processors 2518 disposed at the front edge of the first layer 251a. Similarly, a group of six sensing coil patterns 2514 arranged on the right side of a plurality of sensing coil patterns 2514 arranged in the region between the center line in the front-rear direction and the front edge of the first layer 251a, and six temperature sensors 2515 respectively arranged in the six sensing coil patterns 2514, can be assigned to the right signal processor 2518 of a pair of signal processors 2518 disposed at the front edge of the first layer 251a.

[0265] A set of sensing coil patterns 2514 and temperature sensors 2515 can be distributed to a pair of signal processors 2518 located at the rear edge of the first layer 251a in the same manner as described above.

[0266] As described above, the two pairs of signal processors 2518 are spaced apart from each other at the maximum distance along the front-back direction, so that the structure of each of the second lead pattern 2513b that connects the respective sensing coil pattern 2514 to the signal processor 2518 and the third lead pattern 2513c that connects the respective temperature sensor 2515 to the signal processor 2518 can be simplified and its length can be minimized.

[0267] Furthermore, low-power terminals (not shown) for signal transmission / reception and substrate connectors (not shown) mounted on the low-power terminals can be mounted together at each of the front and rear edges of the first layer 251a and arranged adjacent to each signal processor 2518, and can transmit electrical signals output to the signal processor 2518 to the aforementioned main circuit board module 281.

[0268] In one example, as described below, a first lead pattern 2513a for transmitting high-frequency power to each of the first type pattern 2512a and the second type pattern 2512b constituting the working coil pattern 2512 may be disposed in the first layer 251a.

[0269] As shown in the figure, each first lead pattern 2513a can be constructed as a series of patterned strands.

[0270] Therefore, the first lead pattern 2513a is divided into multiple pattern strands so that power loss that may occur due to the skin effect when high-frequency power is applied to it can be minimized.

[0271] In one example, considering power efficiency, multiple patterned strands can be connected to each other at one end and the other end of the first lead pattern 2513a to form a common lead terminal 2513a1.

[0272] A common lead terminal 2513a1 formed at one end of the first lead pattern 2513a can be connected to a high-power terminal pattern 2516 formed at each of the front and rear edges of the first layer 251a.

[0273] In one example, the first lead pattern 2513a may be disposed inside the first layer 251a and may extend from one end thereto toward the common lead terminal 2513a1 formed at the other end thereto.

[0274] In one example, in this embodiment, high-frequency power can be supplied to a pair of working coil patterns 2512 arranged adjacent to each other via three high-power terminal patterns 2516 and three first lead patterns 2513a.

[0275] That is, when high-frequency power is supplied to each working coil pattern 2512 via a pair of high-power terminal patterns 2516 and a pair of first lead patterns 2513a, the two pairs of high-power terminal patterns 2516 and the two pairs of first lead patterns 2513a should be assigned to a pair of working coil patterns 2512.

[0276] According to this disclosure, high-frequency power is supplied to a pair of working coil patterns 2512 via three high-power terminal patterns 2516 and three first lead patterns 2513a arranged adjacent to each other, so that the number of high-power terminal patterns 2516 and the number of first lead patterns 2513a can be minimized, and accordingly, the circuit configuration can be simplified.

[0277] Reference Figure 8 To describe this in more detail.

[0278] Figure 8 yes Figure 7 A magnified view of a portion of the image shows the data based on... Figure 7 The diagram shows a detailed configuration of a high-power terminal pattern 2516 and a first lead pattern 2513a that are arranged adjacent to each other and located on the left rear side, supplying power to a pair of working coil patterns 2512.

[0279] Based on the state shown in the diagram, the leftmost high-power terminal pattern 2516 is referred to as the first high-power terminal pattern 2516a, the middle high-power terminal pattern 2516 is referred to as the second high-power terminal pattern 2516b, and the rightmost high-power terminal pattern 2516 is referred to as the third high-power terminal pattern 2516c.

[0280] In addition, the first lead pattern 2513a connected to the first high-power terminal pattern 2516a is referred to as the first-1 lead pattern 2513a-1, the first lead pattern 2513a connected to the second high-power terminal pattern 2516b is referred to as the first-2 lead pattern 2513a-2, and the first lead pattern 2513a connected to the third high-power terminal pattern 2516c is referred to as the first-3 lead pattern 2513a-3.

[0281] As shown in the figure, the first high-power terminal pattern 2516a can be electrically connected via the first-1 lead pattern 2513a-1 to the external common terminal of a working coil pattern 2512 located behind another working coil pattern 2512 in a pair of working coil patterns 2512.

[0282] Hereinafter, the external common terminals of the working coil pattern 2512 will be referred to as the second common terminals 2512a-3 and 2512b-3, and the internal common terminals of the working coil pattern 2512 will be referred to as the first common terminals 2512a-2 and 2512b-2.

[0283] As described below, the first common terminals 2512a-2 and 2512b-2 may include the first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b. The first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b may be connected in series with each other via the working coil via H_v1. As described below, the first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b may be formed at a position where they vertically overlap each other.

[0284] Similarly, the second common terminals 2512a-3 and 2512b-3 may include the second common terminal 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b. The second common terminals 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b may be connected in series with each other via the working coil via H_v1. As described later, the second common terminals 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b may be formed at a position where they vertically overlap each other.

[0285] In this respect, the common lead terminal 2513a1 formed at the other end of the first lead pattern 2513a-1 can be formed at a position that vertically overlaps with the second common terminals 2512a-3 and 2512b-3 of the working coil pattern 2512 provided on the rear side, and can be connected in series with the second common terminals 2512a-3 and 2512b-3 of the working coil pattern 2512 via the working coil via H_v1.

[0286] As shown in the figure, the second high-power terminal pattern 2516b can be electrically connected via the first-second lead pattern 2513a-2 to the second common terminal 2512a-3 and 2512b-3 of a pair of working coil patterns 2512 arranged in front of the other working coil pattern 2512.

[0287] In this respect, the common lead terminal 2513a1 formed at the other end of the first-second lead pattern 2513a-2 can be formed at a position that vertically overlaps with the second common terminal 2512a-3, 2512b-3 of a working coil pattern 2512 located in front of another working coil pattern 2512, and can be connected in series with the second common terminal 2512a-3, 2512b-3 of the working coil pattern 2512 via the working coil via H_v1.

[0288] In addition, the third high-power terminal pattern 2516c can be electrically connected to the first common terminals 2512a-2 and 2512b-2 of a pair of working coil patterns 2512 via the first-third lead pattern 2513a-3.

[0289] That is, as shown in the figure, the first-third lead pattern 2513a-3 may have a common lead terminal 2513a1 formed at its other end. The common lead terminal 2513a1 may be additionally provided at the intermediate position between one end and the other end of the first-third lead pattern 2513a-3.

[0290] The common lead terminal 2513a1 formed at the other end of the first-3 lead pattern 2513a-3 can be electrically connected via the working coil via H_v1 to the first common terminal 2512a-2 and 2512b-2 of a working coil pattern 2512 located in front of the other working coil pattern 2512.

[0291] Furthermore, the common lead terminal 2513a1 formed at the middle position of the first-third lead pattern 2513a-3 can be electrically connected via the working coil via H_v1 to the first common terminal 2512a-2 and 2512b-2 of a working coil pattern 2512 located behind the other working coil pattern 2512.

[0292] In other words, the first-third lead pattern 2513a-3 can be configured as a common lead pattern capable of supplying power to both of the pair of working coil patterns 2512.

[0293] Therefore, the pair of working coil patterns 2512 can be controlled to operate as follows: when only the rear working coil pattern 2512 is working, power is supplied to the first high-power terminal pattern 2516a and the third high-power terminal pattern 2516c, and power supply to the second high-power terminal pattern 2516b is cut off; when only the front working coil pattern 2512 is working, power is supplied to the second high-power terminal pattern 2516b and the third high-power terminal pattern 2516c, and power supply to the first high-power terminal pattern 2516a is cut off; or, when both of the pair of working coil patterns 2512 are working simultaneously, power is supplied to all the first high-power terminal patterns to the third high-power terminal pattern 2516c.

[0294] In one example, based on Figure 7 and Figure 8 As shown, multiple edge notches 2517 can be formed at each of the front and rear edges of the first layer 251a.

[0295] The edge notch 2517 provides a connection space into which a connector (not shown) can be fitted to supply high-frequency power to the high-power terminal pattern 2516.

[0296] As shown in the figure, the high-power terminal patterns 2516 can be arranged separately, while the edge notches 2517 are inserted between their adjacent high-power terminal patterns, so that the connector can be connected to the high-power terminal patterns 2516 while the connector is assembled into the edge notches 2517.

[0297] As described above, the edge notch 2517 provides space to which the connector, described later, can be joined. Therefore, considering its function and shape, the edge notch 2517 can be referred to as a connector connection portion, edge portion, cutout, opening, etc. To reduce manufacturing costs through component sharing, connectors with the same shape and structure can be assembled into the edge notch 2517. For this purpose, the edge notch 2517 can be formed to have the same shape and the same dimensions.

[0298] In one example, such as Figure 9As shown, the edge notch 2517 can extend through the first layer 251a to the twelfth layer 251l of the first coil circuit board module 251.

[0299] Furthermore, the threaded hole H_sc can be formed to extend through the first coil circuit board module 251. The threaded hole H_sc can be formed in the same manner as the edge notch 2517 to extend through the first layer 251a to the twelfth layer 251l.

[0300] Fastening devices such as bolts (not shown) can pass through threaded holes H_sc and be connected to the aforementioned plate support 26. Therefore, the first coil circuit board module 251 can be securely fastened to the aforementioned plate support 26.

[0301] As an example, the threaded hole H_sc can be set in each of the four corners so as not to interfere with the pattern that constitutes the first coil circuit board module 251.

[0302] Furthermore, a grounding terminal for grounding the first coil circuit board module 251 can be formed in the first layer 251a and around the threaded hole H_sc.

[0303] The first coil circuit board module 251 may have a light-transmitting slit hole H_sl formed therein to extend through the first layer 251a to the twelfth layer 251l.

[0304] The aforementioned light source module 23 can be positioned below the light-transmitting slit H_sl. Visible light generated by the light source module 23 can pass through the light-transmitting slit H_sl and illuminate the lower surface of the top plate 21. Therefore, the linearly extending display line L can be displayed in the top plate 21.

[0305] In order to achieve a linearly extended display line L, the light-transmitting slit hole H_sl can be extended linearly in a shape corresponding to the shape of the display line L.

[0306] However, as Figure 7 As shown, in order to prevent the rigidity of the first coil circuit board module 251 from decreasing sharply, the light-transmitting slit hole H_sl can be divided into multiple segmented holes, and the segmented light-transmitting slit holes H_sl can be arranged linearly.

[0307] Alternatively, a connecting part can be provided between the divided light-transmitting slit holes H_sl to connect the divided light-transmitting slit holes H_sl to each other.

[0308] The light-transmitting slit hole H_sl can be formed during the stamping process of the corresponding part after the entire stacking process of the circuit board module is completed.

[0309] Alternatively, in order to project visible light generated from the light source module 23, the two coil circuit board modules can be arranged spaced apart from each other, thereby forming a predetermined gap between the two coil circuit board modules that are completely isolated from each other. Therefore, the separate stamping process or separate slit hole process on the coil circuit board modules can be omitted.

[0310] In the following text, reference will be made to Figure 10 Describe the relative arrangement of the sensing coil pattern 2514 and the arrangement and arrangement structure of the temperature sensor 2515.

[0311] Figure 10 This is a partially enlarged top view of the first coil circuit board module 251 shown in the diagram. Figure 11 In this embodiment, for the purpose of describing and understanding their relative positions, the sensing coil pattern 2514 and the working coil pattern 2512 are shown together. However, in this embodiment, since the sensing coil pattern 2514 and the working coil pattern 2512 are actually disposed on different layers, both the sensing coil pattern 2514 and the working coil pattern 2512 may not be observed at the same time.

[0312] As described above, the individual sensing coil patterns 2514 wound in a circular spiral shape can be configured to partially overlap with the working coil pattern 2512 wound in a quadrilateral spiral shape along the vertical direction.

[0313] In this respect, each of some of the multiple sensing coil patterns 2514 may be completely disposed inside a single burner 2511 consisting of working coil patterns 2512, while each of the other multiple sensing coil patterns 2514 may be disposed across a pair of adjacent burners 2511.

[0314] Figure 10 (a) shows the state in which the sensing coil pattern 2514 is entirely disposed inside the working coil pattern 2512. Figure 10 (b) shows the state in which the sensing coil pattern 2514 is set across a pair of adjacent working coil patterns 2512.

[0315] First, as described later, the working coil pattern 2512 formed by stacking multiple first-type patterns 2512a and multiple second-type patterns 2512b can be wound multiple times to have a quadrilateral spiral shape.

[0316] For example, each of the first type pattern 2512a and the second type pattern 2512b constituting the working coil pattern 2512 can be wound a total of nine times. That is, the working coil pattern 2512 can be wound with nine turns. In this respect, each individual turn of the first type pattern 2512a and the second type pattern 2512b can be defined as meaning that the coil is wound in a spiral manner once. That is, nine turns can represent the state that each of the first type pattern 2512a and the second type pattern 2512b is spirally wound nine times or wound nine times.

[0317] In addition, for example, six to five patterned strands 2512a-1 and 2512b-1 can be bundled together to form a coiled bundle.

[0318] In this respect, as shown in the figure, the spacing between adjacent turns in each of the first type pattern 2512a and the second type pattern 2512b can be kept substantially constant. However, the horizontal spacing between the third and fourth turns can be much larger than the horizontal spacing between adjacent turns in the other turns.

[0319] The area corresponding to the relatively large horizontal spacing can form the internal gap D1.

[0320] Alternatively, it can be like Figure 10 As shown in (b), based on the setting state of the first coil circuit board module 251, an external gap D2, which is the same as the internal gap D1, is formed between a pair of working coil patterns 2512 that are arranged adjacent to each other in the front-back direction.

[0321] The internal gap D1 and the external gap D2 can be formed to have the same size. For example, the internal gap D1 and the external gap D2 can each range from 3.8 mm to 4.2 mm, preferably 4 mm.

[0322] As shown in the figure, the sensing coil pattern 2514 can be configured such that its center point is located in each of the inner gap D1 and the outer gap D2.

[0323] Preferably, when the center point of the sensing coil pattern 2514 is located at, for example Figure 10 When in the internal gap D1 shown in (a), the center point of the sensing coil pattern 2514 can roughly coincide with the middle position of the area between the third and fourth turns.

[0324] Furthermore, preferably, when the center point of the sensing coil pattern 2514 is located at, for example Figure 10 When in the external gap D2 shown in (b), the center point of the sensing coil pattern 2514 can roughly coincide with the middle position of the area between the pair of working coil patterns 2512 arranged adjacent to it.

[0325] Furthermore, as described above, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b has an area where no pattern is formed. Therefore, the first central inner region 2514c can be formed inside the sensing coil pattern 2514.

[0326] As shown in the figure, the first central inner region 2514c of the sensing coil pattern 2514 can be disc-shaped, and the diameter of the disc-shaped inner region can be equal to or slightly smaller than the size of each of the inner gap D1 and the outer gap D2.

[0327] The combination of the inner gap D1 and outer gap D2 of the working coil pattern 2512 and the first central inner region 2514c of the sensing coil pattern 2514 provides a space in which the temperature sensor 2515 can be installed.

[0328] As shown in the figure, a temperature sensor 2515 for sensing the temperature of the top plate 21 can be installed in the first layer 251a and the first central inner region 2514c of each sensing coil pattern 2514. In this respect, the dimensions of each of the inner gap D1 and the outer gap D2, as well as the diameter of the sensing coil pattern 2514, can be larger than the dimensions of the temperature sensor 2515, that is, larger than its longitudinal width.

[0329] Therefore, when viewed from the top plate 21, individual temperature sensors 2515 can be disposed in the first layer 251a and the first central internal region 2514c, as surrounded by each sensing coil pattern 2514.

[0330] In addition, the temperature sensor 2515 can be positioned at a location that does not vertically overlap with the sensing coil pattern 2514 and is located in the first central inner region 2514c, so that there is no interference between the temperature sensor 2515 and the sensing coil pattern 2514.

[0331] In one example, the temperature sensor 2515 can be implemented as a surface mount device (SMD) type sensor in chip form, which is relatively small, easy to mount in the first layer 251a, and has excellent sensing capabilities.

[0332] The SMD type temperature sensor 2515 may include, for example, a sensor body, a thermistor disposed in the sensor body, and a pair of electrodes exposed on the upper surface of the first coil circuit board module 251.

[0333] Temperature sensor 2515 can be mounted on the upper surface of the first coil circuit board module 251. That is, temperature sensor 2515 can be attached and fixed to the upper surface of the first coil circuit board module 251.

[0334] More specifically, a pair of conductive sensor pads (not shown) for attaching the temperature sensor 2515 can be disposed in the first coil circuit board module 251, and a pair of electrodes of the temperature sensor 2515 can be attached to the pair of sensor pads respectively.

[0335] In this respect, the pair of electrodes of the temperature sensor 2515 can be electrically connected and attached to the corresponding pair of sensor pads using various physical and chemical methods such as welding, brazing and adhesives.

[0336] However, when the SMD type temperature sensor 2515 is mounted and attached to the upper surface of the first coil circuit board module 251, the SMD type temperature sensor 2515 is highly likely to be affected by the heat generated from the working coil pattern 2512.

[0337] In order to minimize the impact of heat generated from the working coil pattern 2512 on the SMD type temperature sensor, the SMD type temperature sensor needs to be positioned as far away from the working coil pattern 2512 as possible along the horizontal direction.

[0338] The location where the heat generation of the SMD type temperature sensor can be minimized can be selected from the area where the first central inner region 2514c of the sensing coil pattern 2514 overlaps with the inner gap D1 and the area where the first central inner region 2514c of the sensing coil pattern 2514 overlaps with the outer gap D2.

[0339] Although Figure 10 The illustration shows a temperature sensor 2515 positioned where its center point roughly coincides with the center point of the first central inner region 2514c of the sensing coil pattern 2514, but this is merely an example. The effect of heat generated by the operating coil pattern 2512 on the temperature sensor 2515 can be minimized simply by positioning the temperature sensor 2515 at any location in either the region where the first central inner region 2514c of the sensing coil pattern 2514 overlaps with the inner gap D1 or the region where the first central inner region 2514c of the sensing coil pattern 2514 overlaps with the outer gap D2.

[0340] Furthermore, the temperature sensor 2515 can be disposed in each of the regions where the first central inner region 2514c of the sensing coil pattern 2514 and the inner gap D1 overlap, and in each of the regions where the first central inner region 2514c of the sensing coil pattern 2514 and the outer gap D2 overlap, thereby effectively ensuring the space provided for the third lead pattern 2513c for electrically connecting the temperature sensor 2515 to the signal processor 2518 and the temperature sensor via H_v3 for connecting the temperature sensor 2515 and the third lead pattern 2513c to each other.

[0341] In this respect, as described above, the SMD type temperature sensor 2515 may have a first electrode and a second electrode constituting a pair of electrodes formed at opposite ends in its longitudinal direction. The first layer 251a may include a pair of sensor pads respectively soldered to the first electrode and the second electrode.

[0342] As shown in the figure, in this embodiment, the first electrode and the second electrode, which are respectively disposed at opposite ends of the temperature sensor 2515, are arranged in a direction that is parallel to the extension direction of the working coil pattern 2512 disposed adjacent to the temperature sensor 2515, or may intersect with the extension direction of the working coil pattern 2512.

[0343] That is, such as Figure 10 As shown in (a), when the temperature sensor 2515 is disposed in the region of the first gap D1, the individual pattern strands 2512a-1 and 2512b-1 of the working coil pattern 2512 disposed adjacent to one side of the temperature sensor 2515 can extend in the front-back direction. Therefore, the direction in which the first electrode and the second electrode of the temperature sensor 2515 disposed in the region of the first gap D1 are arranged spaced apart from each other can be the front-back direction or the left-right direction intersecting the front-back direction.

[0344] In addition, such as Figure 10 As shown in (b), when the temperature sensor 2515 is disposed in the region of the second gap D2, the individual pattern strands 2512a-1 and 2512b-1 of the working coil pattern 2512 disposed adjacent to opposite sides of the temperature sensor 2515 can extend in the left-right direction. Therefore, the direction in which the first electrode and the second electrode of the temperature sensor 2515 disposed in the region of the second gap D2 are arranged spaced apart from each other can be the left-right direction or a front-back direction intersecting the left-right direction.

[0345] In this regard, a pair of sensor pads corresponding to the first and second electrodes of the temperature sensor 2515 disposed in the region of the first gap D1 can be arranged in the same direction as the first and second electrodes. Similarly, a pair of sensor pads corresponding to the first and second electrodes of the temperature sensor 2515 disposed in the region of the second gap D2 can be arranged in the same direction as the first and second electrodes.

[0346] Therefore, the third lead pattern 2513c used to transmit the electrical signal generated from the temperature sensor 2515 to the signal processor 2518 can extend toward the signal processor 2518 without interfering with the working coil pattern 2512, or in a state where interference with the working coil pattern 2512 is minimized.

[0347] More specifically, the portion of the third lead pattern 2513c that overlaps with and extends across the sensing coil pattern 2514 may be disposed in one of the third to seventh layers 251c, 251d, 251e, 251f and 251g in which the first type pattern 2512a is formed, or may be disposed in one of the eighth to twelfth layers 251h, 251i, 251j, 251k and 251l in which the second type pattern 2512b is formed.

[0348] For example, in this embodiment, such as Figure 13 As shown, the third lead pattern 2513b can be disposed in one of the eighth to twelfth layers 251h, 251i, 251j, 251k and 251l where the second type pattern 2512b is formed, and the third lead pattern 2513c formed in one of the eighth to twelfth layers 251h, 251i, 251j, 251k and 251l can be disposed in each of the first gap D1 and the second gap D2, and extends parallel to the pattern strand 2512b-1 of the second type pattern 2512b.

[0349] Therefore, the third lead pattern 2513c can be extended to effectively bypass the working coil pattern 2512.

[0350] like Figure 9 and Figure 10 As shown, the remaining portion of the third lead pattern 2513c can be disposed in the first layer 251a or the second layer 251b, wherein the third lead pattern 2513c will not interfere with the working coil pattern 2512.

[0351] In the following text, reference will be made to Figures 11 to 16 The detailed configuration of each of the first type pattern 2512a and the second type pattern 2512b constituting the working coil pattern 2512 is described.

[0352] Figure 11 The structure of the third layer 251c of the first coil circuit board module 251, which has a multi-layer structure, is shown in a top view.

[0353] Unless otherwise specified, the configuration of the third layer 251c of the first coil circuit board module 251 described below can be applied in the same way to each of the fourth to seventh layers 251d, 251e, 251f and 251g.

[0354] refer to Figure 11 The first type pattern 2512a, which constitutes the eight working coil patterns 2512 of the eight burners 2511, can be arranged in the third layer 251c of the first coil circuit board module 251.

[0355] As shown in the figure, a first type pattern 2512a can be assigned to a burner 2511. The first type patterns 2512a can have the same size, so that each burner 2511 can have the same size.

[0356] In this respect, for example, eight burners 2511 can be arranged in a grid shape, and correspondingly, the first type pattern 2512a can be arranged in a grid shape.

[0357] Therefore, the first type pattern 2512a is arranged in a grid shape, and each of the first type pattern 2512a can be configured to be wound in a quadrilateral spiral shape, so that the heating area can be evenly arranged inside the third layer 251c.

[0358] In one example, when multiple first type patterns 2512a are arranged in a grid shape as described above, the first type patterns 2512a can be arranged symmetrically.

[0359] That is, multiple first-type patterns 2512a can be arranged symmetrically around the light-transmitting slit hole H_sl, which serves as the center line in the left-right direction of the third layer 251c.

[0360] Additionally, multiple first-type patterns 2512a can be arranged in a symmetrical shape around the front and rear center lines of the third layer 251c. Based on the illustrated embodiment, the front and rear center lines of the third layer 251c can be defined as virtual horizontal lines, around which a total of eight burners 2511 are divided into four front burners 2511 and four rear burners 2511 in the front-rear direction.

[0361] Since multiple first type patterns 2512a are arranged symmetrically to each other, the length of the first lead pattern 2513c used to supply high-frequency power to the individual third layer 251c can be minimized, and the structure of the first lead pattern 2513a can be simplified.

[0362] Figure 12 The structure of the eighth layer 251h of the first coil circuit board module 251 with a multi-layer structure is shown in a top view.

[0363] Unless otherwise specified, the configuration of the eighth layer 251h of the first coil circuit board module 251 described below can be applied in the same way to each of the ninth to twelfth layers 251i, 251j, 251k and 251l.

[0364] like Figure 12 As shown, a second type pattern 2512b, which constitutes eight working coil patterns 2512 of eight burners 2511 respectively, can be arranged in the eighth layer 251h of the first coil circuit board module 251.

[0365] As shown in the figure, a second type pattern 2512b can be assigned to a burner 2511. The second type pattern 2512b can have the same size, so that each burner 2511 can have the same size.

[0366] In this respect, similar to the first type pattern 2512a, the second type pattern 2512b can be arranged in a grid shape.

[0367] In addition, similar to the first type pattern 2512a as described above, a plurality of second type patterns 2512b can be arranged symmetrically around each other around the light-transmitting slit hole H_sl, and a plurality of second type patterns 2512b can be arranged symmetrically around each other around the center line of the front-back direction of the eighth layer 251h.

[0368] Figure 13 A first type pattern 2512a and a second type pattern constituting the same burner 2511 are shown.

[0369] Figure 13 The first type pattern 2512a and the second type pattern 2512b shown can be arranged in a multi-layer structure along the vertical direction as described above to form the same burner 2511.

[0370] like Figure 13 As shown, each of the first type pattern 2512a and the second type pattern 2512b constituting the working coil pattern 2512 can be wound in a quadrilateral spiral shape and extend from the first common terminals 2512a-2 and 2512b-2, which are internal common terminals, toward the second common terminals 2512a-3 and 2512b-3, which are external common terminals.

[0371] For example, each of the first type pattern 2512a and the second type pattern 2512b can be wound with a total of nine windings while extending from the first common terminals 2512a-2 and 2512b-2 to the second common terminals 2512a-3 and 2512b-3. That is, each of the first type pattern 2512a and the second type pattern 2512b can be wound into nine turns.

[0372] As shown in the figure, the first common terminals 2512a-2 and 2512b-2 can be formed at a position offset outward from the center of the burner 2511. That is, an area in the center of the burner 2511 where the first type pattern 2512a and the second type pattern 2512b are not formed can be formed. This is to prevent overheating that may occur when heat generated from the individual pattern strands 2512a-1 and 2512b-1 is concentrated in the center of the burner 2511. Although not shown, a means for preventing overheating in the central region of the burner 2511 can be additionally provided in the form of a through-hole in the central region of the burner 2511.

[0373] In addition, as described above, while the spacing between adjacent turns constituting each of the first type pattern 2512a and the second type pattern 2512b remains approximately constant, an internal gap D1 for setting the temperature sensor 2515 can be formed between the third and fourth turns.

[0374] For example, the first type pattern 2512a may have six pattern strands 2512a-1 bound together to form a turn, and the second type pattern 2512b may have five pattern strands 2512b-1 bound together to form a turn.

[0375] The widths of the individual pattern strands 2512a-1 and 2512b-1 constituting each of the first type pattern 2512a and the second type pattern 2512b can be equal to each other and can be in the range of 0.27 mm to 0.33 mm, preferably 0.3 mm.

[0376] In this respect, in the first type of pattern 2512a, a total of six individual pattern strands 2512a-1 constitute one turn. However, using only six individual pattern strands 2512a-1, the first type of pattern 2512a does not extend from the first turn to the ninth turn.

[0377] Similarly, in the second type pattern 2512b, a total of five individual pattern strands 2512b-1 constitute one turn. However, using only five individual pattern strands 2512b-1, the second type pattern 2512b does not extend from the first turn to the ninth turn.

[0378] That is, when the first type of pattern 2512a extends from the first turn to the ninth turn, one turn is completed, and then in the next turn, one of the six individual pattern strands 2512a-1 can terminate, and a new individual pattern strand 2512a-1 can be extended. In this way, each of the multiple pattern strands 2512a-1 can be extended separately.

[0379] Similarly, when the second type pattern 2512b extends from the first turn to the ninth turn, one turn is completed, and then in the next turn, one of the five individual pattern strands 2512b-1 can terminate, and a new individual pattern strand 2512b-1 can be extended. In this way, each of the multiple pattern strands 2512b-1 can be extended separately.

[0380] As described above, the first type of pattern 2512a can be composed of multiple separately extending individual pattern strands 2512a-1. The second type of pattern 2512b can be composed of multiple separately extending individual pattern strands 2512b-1. Therefore, the lines can be bundled together in a manner similar to that of Litz wire applied to conventional cooktops.

[0381] In this regard, such as Figure 14 As shown, the start and end points of the individual pattern strands 2512a-1 arranged to form the first type pattern 2512a of the new turn and the start and end points of the individual pattern strands 2512b-1 arranged to form the second type pattern 2512b of the new turn can be connected in series with each other via the working coil via H_v1.

[0382] In this respect, each of the working coil vias H_v1 in which the start and end points of each pattern strand 2512a-1 of the first type pattern 2512a are respectively connected to the start and end points of each pattern strand 2512b-1 of the second type pattern 2512b can be connected as follows: Figure 16 The entire structure extends from the third layer 251c to the twelfth layer 251l, connecting the individual pattern strands 2512a-1 and 2512b-1 arranged in all layers together.

[0383] However, as Figure 14 As shown, the extension directions of the pattern strands 2512a-1 constituting the first type pattern 2512a and the extension directions of the pattern strands 2512b-1 constituting the second type pattern 2512b can be opposite to each other.

[0384] For example, each pattern strand 2512a-1 constituting the first type pattern 2512a may extend along the first direction W1, while each pattern strand 2512b-1 constituting the second type pattern 2512b may extend along the second direction W2, which is opposite to the first direction W1.

[0385] For example, as shown in the figure, the first direction W1 can be clockwise, and the second direction W2 can be counterclockwise.

[0386] Therefore, when high-frequency power is supplied via the same working coil via H_v1, currents with opposite flow directions can flow through the individual pattern strands 2512a-1 of the first type pattern 2512a and the individual pattern strands 2512b-1 of the second type pattern 2512b, which are simultaneously electrically connected to the same working coil via H_v1, and thus a magnetic field can be generated in the opposite direction to the first type pattern 2512a and the second type pattern 2512b.

[0387] As described above, magnetic fields in opposite directions are generated from the first type pattern 2512a and the second type pattern 2512b, such that a magnetic field dispersion effect can be generated similar to that of a conventional Litz line configured in a twisted shape.

[0388] Therefore, the magnetic field generated from the first type pattern 2512a and the second type pattern 2512b is uniformly transmitted to the container without being concentrated in a specific part of the container, thereby improving the heating efficiency and heating effect of the container.

[0389] In one example, such as Figure 16 As shown, multiple working coil vias H_v1 can be formed in each of the first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b to minimize losses caused by resistance.

[0390] Each of the plurality of working coil vias H_v1 may be configured to extend through the first layer 251a to the twelfth layer 251l in order to be electrically connected to the first lead pattern 2513a formed in the first layer 251a.

[0391] Since the common working coil via H_v1 is formed to extend through all layers, heat generated from the individual working coil pattern 2512 can be effectively dissipated from the first coil circuit board module 251 through the working coil via H_v1. That is, the working coil via H_v1 can be used as a ventilation hole to prevent the first coil circuit board module 251 from overheating.

[0392] Despite Figure 17 Not shown, but similar to the first common terminals 2512a-2 and 2512b-2, a plurality of working coil vias H_v1 may be formed in each of the second common terminals 2512a-3 of the first type pattern 2512a and the second common terminals 2512b-3 of the second type pattern 2512b, so as to extend through the first layer 251a to the twelfth layer 251l.

[0393] [Detailed structure of dummy vias and dummy patterns]

[0394] In the following text, reference will be made to Figures 17 to 26The detailed configuration of the dummy via H_vd and dummy pattern 2519 in the first coil circuit board module 251 according to this disclosure is described.

[0395] first, Figures 17 to 21 The configuration in which a dummy via H_vd is formed in a first coil circuit board module 251 according to a first embodiment of the present disclosure is shown.

[0396] Reference Figure 17 and Figure 18 A central internal region 2511a can be formed inside the working coil pattern 2512 constituting the first coil circuit board module 251, wherein the pattern strands 2512a-1 and 2512b-1 constituting the working coil pattern 2512 are not formed.

[0397] To distinguish the central inner region of the working coil pattern 2512 from the first central inner region 2514c of the sensing coil pattern 2514, the central inner region of the working coil pattern 2512 will be referred to as the second central inner region 2511a in the following text.

[0398] As described above, when high-frequency power is applied to the working coil pattern 2512 to heat the container, each of the pattern strands 2512a-1 and 2512b-1 acts as a resistor, thereby generating a large amount of heat from it.

[0399] In particular, when the working coil pattern 2512 is wound into a spiral shape as in this embodiment, the temperature distribution of the second central internal region 2511a, where heat is concentrated from the multiple pattern strands 2512a-1 and 2512b-1, is likely to be the highest, and therefore, the possibility of eddy current loss of the working coil pattern 2512 is high.

[0400] To prevent overheating and eddy current loss of the first coil circuit board module 251 due to heat concentration, the first coil circuit board module 251 constituting the stove surface 20 of the cooking appliance 1 according to the first embodiment of the present disclosure may be configured to have a second central internal region 2511a, in which no patterned strands 2512a-1 and 2512b-1 are formed.

[0401] However, since patterned strands 2512a-1 and 2512b-1 are not formed in the second central inner region 2511a inside the working coil pattern 2512, areas appear that are filled only with electrical insulating material made of prepreg (specifically, FR-4) as described above.

[0402] In particular, when the working coil pattern 2512 has a total of 10 layers arranged in a vertical direction to form the independent burner 2511 in the embodiment, it is possible to form an area filled only with electrical insulating material, rather than forming the working coil pattern 2512 on the entirety of each of the 10 layers.

[0403] In this case, such as Figure 17 and Figure 18 As shown, when the sensing coil pattern 2514 or lead pattern 2513 formed in the layer where the working coil pattern 2512 is not formed (i.e., the first layer 251a and the second layer 251b based on the embodiment) is configured to partially overlap with the second central internal region 2511a, the second central internal region 2511a can be divided into an overlapping region 2511a-1 where the patterns overlap each other in the vertical direction and a non-overlapping region 2511a-2 where the patterns do not overlap each other in the vertical direction.

[0404] In addition, similarly to the second central internal region 2511a, the inter-turn region 2511b formed between turns of the working coil patterns 2512 arranged adjacent to each other can be divided into overlapping region 2511b-1 and non-overlapping region 2511b-2, and the inter-coil region 2511c formed between the working coil patterns 2512 constituting different burners 2511 can be divided into overlapping region 2511c-1 and non-overlapping region 2511c-2.

[0405] When the first coil circuit board module 251 extends from the first layer 251a to the twelfth layer 251l, that is, from the upper end surface 251t to the lower end surface 251v of the first coil circuit board module 251, each of these non-overlapping regions 2511a-2, 2511b-2 and 2511c-2 may be made of only electrically insulating material and have no pattern.

[0406] Therefore, when the first coil circuit board module 251 extends from the upper surface 251t to the lower surface 251v, the non-overlapping region has a multi-layered structure, where all layers are made solely of electrically insulating material and are unpatterned. Consequently, rigidity is significantly reduced in the non-overlapping region, making the non-overlapping region 2511a-2 of the second central internal region 2511a highly susceptible to thermal deformation due to the heat generated by the working coil pattern 2512. Furthermore, the non-overlapping region 2511a-2 is only filled with prepreg, thus increasing manufacturing costs.

[0407] To minimize thermal deformation caused by reduced rigidity of the first coil circuit board module 251 and to reduce increased manufacturing costs, such as Figure 17 and Figure 18As shown, at least one via H_vd, electrically insulated from other patterns such as the working coil pattern 2512 and the sensing coil pattern 2514, can be provided in each of the non-overlapping regions 2511a-2, 2511b-2 and 2511c-2.

[0408] As described above, at least one via H_vd provided in each of the non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 can be referred to as a dummy via H_vd because it is formed in a state of electrical insulation from other patterns and does not serve the purpose of power supply or signal transmission. Hereinafter, the vias provided in each of the non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 will be referred to as dummy vias H_vd.

[0409] Since the dummy via H_vd is located in the non-overlapping area 2511a-2 of the first coil circuit board module 251, the dummy via H_vd is configured to not contact or overlap with other patterns including the working coil pattern 2512, the sensing coil pattern 2514 and the lead pattern 2513 in the vertical direction.

[0410] Therefore, when viewed from the top plate 21, the dummy via H_vd can be set to belong entirely to each of the non-overlapping regions 2511a-2 of the second central internal region 2511a, the non-overlapping regions 2511c-2 of the inter-coil region 2511c, and the non-overlapping regions 2511b-2 of the inter-turn region 2511b.

[0411] In addition, such as Figure 17 As shown, the dummy via H_vd is configured so that it does not contact or overlap with other patterns, including the working coil pattern 2512, in the vertical direction. Therefore, the shapes and sizes of the non-overlapping regions 2511a-2 of the second central inner region 2511a, the non-overlapping regions 2511c-2 of the inter-coil region 2511c, and the non-overlapping regions 2511b-2 of the inter-turn region 2511b can differ from or be irregular depending on their positions. Thus, as shown, the shapes of the dummy vias H_vd arranged in the non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 can differ from or be irregular depending on their positions.

[0412] In this respect, irregularity means that the location and / or number of dummy vias H_vd can be arranged and / or distributed in a point-asymmetric or line-asymmetric shape around the center point of a single working coil pattern 2512 or a straight line extending through its center point. This is because the shape or arrangement of the working coil pattern 2512 is asymmetric to the shape or arrangement of the sensing coil pattern 2514, and each of the individual working coil pattern 2512 and the individual sensing coil pattern 2514 has a terminal or end, and the lead pattern 2513 passes through the area between adjacent working coil patterns 2512 and the area between adjacent sensing coil patterns 2514. Therefore, the arrangement of dummy vias H_vd can also be asymmetric.

[0413] Furthermore, by setting the dummy via H_vd to not contact conductors such as the working coil pattern 2512 and the sensing coil pattern 2514, the heat dissipation performance of the first coil circuit board module 251 can be improved without interfering with the conductivity of the working coil pattern 2512 and the sensing coil pattern 2514.

[0414] As described above, the cooktop of this disclosure includes a working coil via H_v1 for supplying power to a working coil pattern 2512 having a multi-layer structure, a sensing coil via H_v2 for transmitting the output signal of a sensing coil pattern 2514, and a temperature sensor via H_v3 for transmitting the output signal of a temperature sensor 2515.

[0415] The dummy via H_vd can be configured to have the same shape and size as each of the working coil via H_v1, the sensing coil via H_v2, and the temperature sensor via H_v3.

[0416] Therefore, the dummy via H_vd can accept the same processing steps as those used to form the working coil via H_v1, the sensing coil via H_v2, and the temperature sensor via H_v3, without changing the settings of the manufacturing equipment used to form these functional vias, and without altering the manufacturing equipment itself. Thus, the increase in manufacturing cost and time for additionally forming the dummy via H_vd can be minimized.

[0417] However, this is merely an example, and the dummy via H_vd can be configured to have a shape and size different from that of each functional via as described above. This is obviously within the scope of this disclosure. The present disclosure is described below based on an embodiment where the dummy via H_vd is configured to have the same shape and size as the respective functional vias. However, the present disclosure is not limited thereto.

[0418] Figure 19 and Figure 20An embodiment is shown in which multiple dummy vias H_vd are provided in a non-overlapping region 2511a-2 of a second central inner region 2511a constituting a specific burner 2511.

[0419] Unless otherwise specified, the following configuration of the dummy via H_vd can be applied equally to each of the non-overlapping regions 2511b-2 of the inter-turn region 2511b and the non-overlapping region 2511c-2 of the inter-coil region 2511c.

[0420] like Figure 19 As shown, when viewed from the top plate 21, multiple dummy vias H_vd can be arranged in a grid shape and set in the non-overlapping region 2511a-2 of the second central inner region 2511a.

[0421] exist Figure 19 In the second central inner region 2511a, the portion without a dummy via H_vd and near the left and right edges is the overlapping region 2511a-1, and in particular, it overlaps with the sensing coil pattern 2514 in the vertical direction.

[0422] In this embodiment, when the working coil pattern 2512 is wound into a rectangular spiral shape, a second central inner region 2511a having a generally rectangular shape can be defined inside the working coil pattern 2512.

[0423] Considering the shape of the second central inner region 2511a, each dummy via H_vd can be arranged linearly in a direction parallel to the extension direction of the working coil pattern 2512. Therefore, multiple dummy vias H_vd can be arranged in a grid shape and disposed in the second central inner region 2511a.

[0424] Furthermore, since the dummy vias H_vd are arranged in a grid shape as described above, the spacing between adjacent dummy vias H_vd can be kept approximately uniform, and multiple dummy vias H_vd can be uniformly arranged as a whole in the non-overlapping regions 2511a-2 of the second central internal region 2511a.

[0425] Regarding this, multiple dummy vias H_vd can be configured as follows: Figure 20 As shown in (a), it is arranged in a rectangular shape, or it can be as follows: Figure 20 As shown in (b), it is arranged in a hexagonal grid shape.

[0426] As described above, multiple dummy vias H_vd are arranged in a quadrilateral or hexagonal grid pattern, so that the horizontal spacing G_vd between the centers of adjacent dummy vias H_vd can be kept approximately equal to each other.

[0427] More specifically, such as Figure 20 As shown in (a), when multiple dummy vias H_vd are arranged in a quadrilateral grid, the front-to-back and left-to-right spacing between the centers of adjacent dummy vias H_vd can be kept equal, while the diagonal spacing between them can be greater than either the front-to-back or left-to-right spacing. Therefore, multiple dummy vias H_vd can be arranged in a fairly dense manner.

[0428] Therefore, it can be considered that the arrangement of the dummy vias H_vd in a quadrilateral grid is suitable for areas where the rigidity of the first coil circuit board module 251 should be enhanced to a larger area or areas where the maximum heat generation is expected to occur, such as the central area of ​​the working coil pattern 2512.

[0429] In addition, such as Figure 20 As shown in (b), when multiple dummy vias H_vd are arranged in a hexagonal grid, the front-to-back spacing, left-to-right spacing, and diagonal spacing between the centers of adjacent dummy vias H_vd can be approximately equal. Therefore, multiple dummy vias H_vd can be arranged at a relatively lower density than when they are arranged in a quadrilateral grid.

[0430] Therefore, the arrangement of dummy vias in a hexagonal grid pattern can be considered suitable for areas of the first coil circuit board module 251 where rigidity is relatively insufficient, or for areas where a large amount of heat is not expected to be generated, such as the area near the working coil pattern 2512 in the horizontal direction.

[0431] When multiple dummy vias H_vd are arranged in a grid as described above, the horizontal spacing between the centers of adjacent dummy vias H_vd needs to be greater than the outer diameter of the top pad H_vd2 constituting the dummy via H_vd and the outer diameter of the bottom pad H_vd3 constituting the dummy via H_vd, respectively.

[0432] This is to prevent damage to adjacent dummy vias that may occur when the process of processing each dummy via H_vd interferes with its adjacent dummy via H_vd.

[0433] Furthermore, this was designed with in mind the possibility that the rigidity of the first coil circuit board module 251 might be significantly reduced when multiple dummy vias H_vd are arranged too close together.

[0434] Figure 21 It shows Figure 20 The vertical cross-sectional shape of the dummy via H_vd is shown.

[0435] Similar to the functional vias described above, an exemplary dummy via H_vd may include a top pad H_vd2 formed on the upper surface 251t of the first coil circuit board module 251, a bottom pad H_vd3 formed on the lower surface 251v of the first coil circuit board module 251, and an internal conductor H_vd4 that electrically connects the top pad H_vd2 and the bottom pad H_vd3 to each other and extends along the through hole H_vd1 of the first coil circuit board module 251.

[0436] Similar to the functional via VH, the top pad H_vd2 and bottom pad H_vd3 of the dummy via H_vd can be formed into disks, and the upper and lower ends of the internal conductor H_vd4 can be integrally connected to the top pad H_vd2 and the bottom pad H_vd3, thereby forming the internal conductor H_vd4 into a cylindrical shape.

[0437] In addition, similar to the functional via VH, each of the top pad H_vd2, bottom pad H_vd3, and internal conductor H_vd4 constituting the dummy via H_vd can be formed by chemically and physically depositing conductive metal materials to form a thin film.

[0438] Therefore, since the dummy via H_vd, made of a metallic material with a strength greater than that of an electrical insulating material made of prepreg, is provided in the second central inner region 2511a in a manner that extends in the vertical direction, the dummy via H_vd can be used as a skeleton for enhancing the vertical rigidity of the first coil circuit board module 251.

[0439] Therefore, the strength of the non-overlapping region 2511a-2 of the second central internal region 2511a can be significantly improved, and thermal deformation caused by the heating of the working coil pattern 2512 can be effectively prevented.

[0440] Furthermore, since the dummy via H_vd is made of a metallic material with a thermal conductivity higher than that of the electrical insulating material, the dummy via H_vd can be used as a heat sink to absorb and transfer heat generated from the working coil pattern 2512.

[0441] Therefore, the heat generated from the working coil pattern 2512 can be effectively conducted to the low-temperature side, and overheating of the second central internal region 2511a can be effectively suppressed.

[0442] like Figure 21 As shown in (a), the dummy via H_vd can be set in the form of a through hole, wherein the through hole H_vd1 is formed radially inside the inner conductor H_vd4 and extends from the upper end surface 251t of the first coil circuit board module 251 to the lower end surface 251v, and is open and hollow overall.

[0443] As described above, the upper space on the top of the upper surface 251t of the first coil circuit board module 251 and the lower space below the lower surface 251v of the first coil circuit board module 251 can be connected to each other through a fully open through hole H_vd1.

[0444] That is, the through hole H_vd1, which is a virtual through hole H_vd, can be used as a vent hole to connect the upper space on the top of the upper surface 251t of the first coil circuit board module 251 and the lower space below the lower surface 251v of the first coil circuit board module 251.

[0445] Therefore, through the through-hole H_vd1 used as a vent, the high-temperature air generated in the upper space of the second central internal region 2511a can be exhausted to its lower space, and the relatively low-temperature air present in the lower space can be effectively introduced into the upper region. Thus, overheating of the first coil circuit board module 251 is additionally prevented.

[0446] like Figure 21 As shown in (b) and (c), the dummy via H_vd can be set in the form of a blind via, wherein the through hole H_vd1 formed on the radially inner side of the inner conductor H_vd4 is at least partially blocked.

[0447] Figure 21 (b) shows an embodiment in which the top pad H_vd2 becomes a blind hole with the through hole H_vd1 closed. Figure 21 (c) shows an embodiment in which the through hole H_vd1 is completely filled with a conductor, thus forming a blind hole in a solid state.

[0448] When a dummy via H_vd is formed in a blind hole as in the embodiment, the through hole H_vd1 is partially or completely blocked and therefore cannot be used as a vent.

[0449] However, since the via H_vd1 is at least partially filled with conductor, the rigidity and thermal conductivity of the dummy via H_vd can be expected to be similar to those of... Figure 21 The effect can be increased compared to the through hole shown in (a).

[0450] Although Figure 21 As not shown in the diagram, but as described below, the dummy via H_vd can be set up as a buried via that is completely embedded in the first coil circuit board module 251.

[0451] Figures 22 to 24 The arrangement of forming a dummy pattern 2519 in the first coil circuit board module 251 according to the second embodiment of the present disclosure is shown.

[0452] Similar to the dummy via H_vd described above, at least one pattern 2519 may be formed in each of the non-overlapping regions 2511a-2, 2511b-2 and 2511c-2 in a state of electrical insulation from other patterns such as the working coil pattern 2512 and the sensing coil pattern 2514, in order to minimize thermal deformation due to reduced rigidity of the first coil circuit board module 251 and reduce increased manufacturing costs.

[0453] As described above, at least one pattern 2519 disposed in each of the non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 is formed in a state of electrical isolation from the other patterns and does not serve the purpose of power supply or signal transmission. Therefore, at least one pattern 2519 can be referred to as a dummy pattern 2519. In the following text, at least one pattern disposed in each of the non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 will be referred to as a dummy pattern 2519.

[0454] Since the dummy pattern 2519 is located in the non-overlapping area 2511a-2 of the first coil circuit board module 251, the dummy pattern 2519 can be configured to not contact or overlap with other patterns including the working coil pattern 2512 in the vertical direction.

[0455] Therefore, when viewed from the top plate 21, the dummy pattern 2519 can be set to belong entirely to each of the non-overlapping regions 2511a-2 of the second central inner region 2511a, the non-overlapping regions 2511c-2 of the inter-coil region 2511c, and the non-overlapping regions 2511b-2 of the inter-turn region 2511b.

[0456] Furthermore, the dummy pattern 2519, like the dummy via H_vd described above, is configured not to contact or overlap with other patterns, including the working coil pattern 2512, in the vertical direction. Therefore, the shapes and sizes of the non-overlapping regions 2511a-2 of the second central inner region 2511a, the non-overlapping regions 2511c-2 of the inter-coil region 2511c, and the non-overlapping regions 2511b-2 of the inter-turn region 2511b can differ from or be irregular based on their positions. Thus, the shapes of the dummy pattern 2519 arranged in the non-overlapping regions 2511a-2 of the second central inner region 2511a, the non-overlapping regions 2511c-2 of the inter-coil region 2511c, and the non-overlapping regions 2511b-2 of the inter-turn region 2511b can differ from or be irregular based on their positions.

[0457] As described above, according to this disclosure, each of the working coil pattern 2512 and the sensing coil pattern 2514 is arranged in a multilayer structure.

[0458] The dummy pattern 2519 can be configured to have the same dimensions as each of the working coil pattern 2512 and the sensing coil pattern 2514.

[0459] Therefore, the dummy pattern 2519 can undergo the same processing as the functional patterns used to form such as the working coil pattern 2512 and the sensing coil pattern 2514, without changing the settings of the manufacturing equipment used to form such functional patterns and without changing the manufacturing equipment. Thus, the increase in manufacturing cost and time for additionally forming the dummy pattern 2519 can be minimized.

[0460] However, this is merely an example, and the dummy pattern 2519 may be configured to have dimensions different from those of the functional patterns described above, and this will naturally fall within the scope of this disclosure. Hereinafter, this disclosure will be described based on embodiments in which the dummy pattern 2519 is configured to have dimensions identical to those of each functional pattern. However, this disclosure is not limited thereto.

[0461] Figure 22 and Figure 23 An embodiment is shown in which multiple dummy patterns 2519 are provided in a non-overlapping region 2511a-2 of a second central inner region 2511a forming a working coil pattern 2512 of a particular burner 2511.

[0462] The following description of the configuration of dummy pattern 2519, unless otherwise specified, can be equally applied to each of the non-overlapping regions 2511b-2 of the inter-turn region 2511b and the non-overlapping region 2511c-2 of the inter-coil region 2511c.

[0463] like Figure 22 As shown, when viewed from the top plate 21, each of the plurality of dummy patterns 2519 can extend in the non-overlapping region 2511a-2 of the second central inner region 2511a in a direction parallel to or intersecting the winding direction of the working coil pattern 2512. Therefore, the plurality of dummy patterns 2519 can serve as a skeleton for reinforcing the rigidity of the first coil circuit board module 251 in the left-right direction.

[0464] In one embodiment, when the working coil pattern 2512 is wound in a rectangular spiral shape, a second central inner region 2511a having a generally rectangular shape may be formed inside the working coil pattern 2512.

[0465] Considering the shape of the second central internal region 2511a, each dummy pattern 2519 can extend linearly along the front-back direction or the left-right direction, as well as along a direction parallel to or intersecting the extension direction of the working coil pattern 2512.

[0466] In this regard, such as Figure 23 As shown in (a), multiple dummy patterns 2519 can extend linearly in the left-right direction and parallel to each other, and can be arranged to be spaced apart from each other. Figure 23 As shown in (b), multiple dummy patterns 2519 can extend linearly along the diagonal direction and in a parallel manner to each other, and can be arranged to be spaced apart from each other. Figure 23 As shown in (c), a plurality of dummy patterns 2519 can extend linearly along the front-back direction and the left-right direction, and can be arranged to be spaced apart from each other in each of the front-back direction and the left-right direction, such that the plurality of dummy patterns 2519 can intersect each other.

[0467] like Figure 23 As shown in (c), the arrangement of the dummy patterns 2519 intersecting each other can be considered suitable for areas where the rigidity of the first coil circuit board module 251 should be enhanced to a larger area or areas where the maximum heat is expected to be generated, such as the central area of ​​the working coil pattern 2512.

[0468] In addition, such as Figure 23 The arrangement of the dummy pattern 2519 shown in (a) and (b) can be considered suitable for areas where the rigidity of the first coil circuit board module 251 is not relatively insufficient or where a large amount of heat is not expected to be generated, such as the area close to the working coil pattern 2512 in the horizontal direction.

[0469] although Figure 23 Images (a) and (b) show a configuration in which the individual dummy patterns 2519 extend parallel to each other and are arranged spaced apart from one another, but this disclosure is not limited thereto. In another example, the individual dummy patterns 2519 may be connected to each other to form a single pattern. That is, the dummy patterns 2519 can be constructed into a continuous pattern by connecting the adjacent ends of the dummy patterns 2519 that are arranged adjacent to each other. It should be understood that such modified examples naturally fall within the scope of this disclosure.

[0470] As described above, according to this disclosure, the working coil pattern 2512 consists of multiple vertically arranged layers.

[0471] Accordingly, the dummy pattern 2519 according to the second embodiment of this disclosure can have the following characteristics: Figure 24 The multi-layered structure shown.

[0472] Figure 24(a) shows a configuration in which a dummy pattern 2519 is formed only in the first layer 251a of the upper end surface 251t of the first coil circuit board module 251 which comprises a total of 12 layers and the twelfth layer 251l of the lower end surface 251v of the first coil circuit board module 251 according to this embodiment.

[0473] As described above, the configuration of forming a dummy pattern 2519 only in the twelfth layer 251l constituting the lower end surface 251v of the first coil circuit board module 251 can be considered suitable for areas where the rigidity of the first coil circuit board module 251 is not relatively insufficient, or areas that are close to the working coil pattern 2512 in the horizontal direction, such as areas where a large amount of heat is not expected to be generated.

[0474] Furthermore, when the number of layers of the working coil pattern 2512 is less than 5 layers less than in this embodiment, the first coil circuit board module 251 can be deformed so that a dummy pattern 2519 is formed only in one of the upper surface 251t and the lower surface 251v, especially in the first layer 251a which is greatly affected by the temperature of the container and the top plate 21.

[0475] In addition, such as Figure 24 As shown in (b), in addition to the first layer 251a and the twelfth layer 251l, a dummy pattern 2519 may also be provided in the sixth layer 251f and the seventh layer 251g, which are inner layers.

[0476] and Figure 24 Compared to implementation method (b), Figure 24 The implementation of (b) can be considered suitable for areas of the first coil circuit board module 251 where rigidity is relatively insufficient or where heat generation is expected to be high.

[0477] In addition, such as Figure 24 As shown in (c), the dummy pattern 2519 can be set in all of the first layer 251a to the twelfth layer 251l.

[0478] and Figure 24 Compared to implementations (a) and (b), Figure 24 The embodiment shown in (c) can be considered suitable for areas where the rigidity of the first coil circuit board module 251 should be greatly enhanced or where the expected heat generation is very high.

[0479] In such Figure 24In the illustrated embodiment, the corresponding dummy patterns 2519 disposed in the respective layers are positioned to overlap each other in the vertical direction. However, this disclosure is not limited thereto. Alternatively, the respective dummy patterns 2519 disposed in each layer may be positioned so as not to overlap each other in the vertical direction, or may be positioned such that the overlapping area can be very small. It should be understood that such modifications naturally fall within the scope of this disclosure.

[0480] Figure 25 and Figure 26 The arrangement of forming a dummy via H_vd and a dummy pattern 2519 together in a first coil circuit board module 251 according to a third embodiment of the present disclosure is shown.

[0481] In the first embodiment described above, only a dummy via H_vd is provided in the second central internal region 2511a of the first coil circuit board module 251. In the second embodiment, only a dummy pattern 2519 is provided in the second central internal region 2511a of the first coil circuit board module 251. However, in this embodiment, the dummy via H_vd and the dummy pattern 2519 can be provided together in the second central internal region 2511a of the first coil circuit board module 251.

[0482] That is, the above embodiment has been described based on the first coil circuit board module 251 with a total of 12 layers. However, when the first coil circuit board module 251 has a multilayer structure with more than 12 layers, the rigidity of the second central internal region 2511a may not be adequately supplemented by the dummy vias H_vd and the dummy pattern 2519 alone, or the overheat suppression effect may be insufficient.

[0483] As described above, with the increasing number of layers in the first coil circuit board module 251, the rigidity of the second central internal region 2511a should be further enhanced or the heating efficiency should be further improved. Therefore, as... Figure 25 As shown, the dummy via H_vd and the dummy pattern 2519 can be set together in the second central inner region 2511a.

[0484] Similar to the dummy pattern 2519 in the second embodiment described above, the dummy pattern 2519 can be extended linearly and arranged with equal intervals between each other.

[0485] In this case, as shown in the figure, the first end 2519a and the second end 2519b of each dummy pattern 2519 can be physically connected to the top pad H_vd2 or the bottom pad H_vd3 of the dummy via H_vd, and can therefore be integrated with it.

[0486] In other words, the dummy pattern 2519 provided in the upper surface 251t of the first coil circuit board module 251 can be configured such that its first end 2519a and second end 2519b are physically connected to the top pad H_vd2 of the dummy via H_vd.

[0487] Alternatively, the dummy pattern 2519 disposed in the lower end surface 251v of the first coil circuit board module 251 can be configured such that both its first end 2519a and its second end 2519b are physically connected to the bottom pad H_vd3 of the dummy via H_vd.

[0488] Additionally, although not illustrated, when the dummy pattern 2519 is disposed in the inner layer between the upper end surface 251t and the lower end surface 251v of the first coil circuit board module 251, both the first end 2519a and the second end 2519b of the dummy pattern 2519 can be connected to the internal conductor H_vd4 of the dummy via H_vd.

[0489] As described above, the dummy pattern 2519 is disposed between a pair of dummy vias H_vd spaced apart from each other, and the pair of dummy vias H_vd are physically connected to each other via the dummy pattern 2519, so that the rigidity enhancement effect and heat conduction efficiency can be further improved compared with the configuration in which the dummy pattern 2519 and the dummy vias H_vd are physically isolated from each other.

[0490] However, Figure 25 The configuration shown is merely an example. It should be understood that the configuration in which the dummy via H_vd and the dummy pattern 2519 are not connected to each other is naturally within the scope of this disclosure. In the following, the configuration in which the top pad H_vd2 and the bottom pad H_vd3 of the dummy via H_vd are connected to the first end 2519a or the second end 2519b of the dummy pattern 2519 will be described by way of example.

[0491] Figure 26 The connection structure between the dummy via H_vd and the dummy pattern 2519 is shown.

[0492] That is, such as Figure 26 As shown in (a), a pair of top pads H_vd2 or bottom pads H_vd3 passing through a through-hole type dummy via H_vd can be connected to each other via dummy pattern 2519.

[0493] In the illustrated embodiment, a pair of top pads H_vd2 passing through through-hole type dummy vias H_vd are connected to each other via a top dummy pattern 2519, and a pair of bottom pads H_vd3 passing through through-hole type dummy vias H_vd are connected to each other via a bottom dummy pattern 2519. Alternatively, only the top pads H_vd2 or the bottom pads H_vd3 of a pair of dummy vias H_vd may be connected to each other via dummy pattern 2519.

[0494] Furthermore, as shown in the figure, when the dummy via H_vd is provided in the form of a buried via embedded in the first coil circuit board module 251, the dummy pattern 2519 can be connected to the top pad H_vd2 or the bottom pad H_vd3 of the buried via.

[0495] In addition, such as Figure 26 As shown in (b), two or more dummy patterns 2519 can be connected to the top pad H_vd2 or the bottom pad H_vd3 of a dummy via H_vd.

[0496] In addition, such as Figure 26 As shown in (c), the first end 2519a and the second end 2519b of the dummy pattern 2519 can be connected to the top pad H_vd2 and the bottom pad H_vd3 of the dummy via H_vd, which is set in the form of a blind via, respectively.

[0497] However, the connection structure between the dummy via H_vd and the dummy pattern 2519 described above is merely an example.

[0498] The connection structure between the dummy via H_vd and the dummy pattern 2519 can be modified or combined differently to take into account various factors, such as the number of layers of the first coil circuit board module 251, its thickness in the vertical direction, the area of ​​its second central internal region 2511a, and the shape of the second central internal region 2511a. Such modifications can be considered within the scope of this disclosure.

[0499] Although this disclosure has been described above with reference to the accompanying drawings, it is not limited to the embodiments and drawings disclosed herein. It will be apparent to those skilled in the art that various modifications can be made to it within the scope of the technical concept of this disclosure. Furthermore, even though the effects of configurations according to this disclosure are not explicitly described while embodiments of this disclosure are illustrated, it should be understood that the predictable effects are thus attributable to them.

Claims

1. A cooking utensil, the cooking utensil comprising: Top plate, on which the container is placed; as well as A heater configured to receive electrical power to generate a magnetic field to heat the container. The heater includes a coil circuit board module, which includes a working coil pattern for generating the magnetic field. The coil circuit board module further includes dummy vias or dummy patterns formed therein, wherein the dummy vias or dummy patterns are electrically insulated from the working coil pattern.

2. The cooking appliance according to claim 1, wherein, The coil circuit board module also includes a sensing coil pattern for sensing whether the container is placed. Each of the dummy vias and the dummy patterns is positioned to be electrically insulated from the sensing coil pattern.

3. The cooking appliance according to claim 1, wherein, A central interior region is defined on the inner side of the working coil pattern in the horizontal direction. The dummy via and the dummy pattern are positioned such that they are located within the central interior region when viewed from the top plate.

4. The cooking appliance according to claim 1, wherein, The working coil pattern is spirally wound to form multiple turns. The inter-turn region is defined between the turns that constitute the working coil pattern and are arranged adjacent to each other in the horizontal direction. When viewed from the top plate, the dummy vias and the dummy patterns are located within the inter-turn area.

5. The cooking appliance according to claim 1, wherein, The working coil pattern includes multiple working coil patterns. The inter-coil region is defined between horizontally adjacent working coil patterns among the plurality of working coil patterns. When viewed from the top plate, the dummy via and the dummy pattern are located in the area between the coils.

6. The cooking appliance according to claim 1, wherein, The dummy vias include multiple dummy vias. When viewed from the top plate, the plurality of dummy vias are arranged in a grid shape.

7. The cooking appliance according to claim 6, wherein, The grid shape is either a quadrilateral grid or a hexagonal grid.

8. The cooking appliance according to claim 6, wherein, Each of the plurality of dummy vias includes: A top pad, the top pad being formed in the upper surface of the coil circuit board module; and A bottom pad, electrically connected to the top pad, is formed in the lower end surface of the coil circuit board module. Wherein, the horizontal distance between the centers of a pair of adjacent dummy vias is greater than the outer diameter of the top pad and the outer diameter of the bottom pad.

9. The cooking appliance according to claim 1, wherein, The dummy via extends along a through hole that extends vertically from the upper surface of the coil circuit board module through the coil circuit board module to the lower surface of the coil circuit board module.

10. The cooking appliance according to claim 9, wherein, The dummy vias include: A top pad is formed in the upper surface of the coil circuit board module; A bottom pad, the bottom pad being formed in the lower end surface of the coil circuit board module; and An inner conductor electrically connects the top pad and the bottom pad to each other and extends along the through-hole.

11. The cooking appliance according to claim 10, wherein, The dummy via is formed in a hollow state from the top pad to the bottom pad.

12. The cooking appliance according to claim 10, wherein, The dummy via is formed in a solid state from the top pad to the bottom pad.

13. The cooking appliance according to claim 10, wherein, The dummy via is formed in a state where at least one of the top pad or the bottom pad closes the via.

14. The cooking appliance according to claim 1, wherein, The dummy pattern extends in a direction parallel to the winding direction of the working coil pattern or in a direction intersecting the winding direction of the working coil pattern.

15. The cooking appliance according to claim 1, wherein, The dummy pattern includes multiple dummy patterns. The plurality of dummy patterns are arranged to be spaced apart from each other.

16. The cooking appliance according to claim 1, wherein, The coil circuit board module includes multiple working coil patterns arranged in a multi-layered structure, and the multiple layered structures are integrally formed with each other.

17. The cooking appliance according to claim 19, wherein, The dummy pattern includes multiple dummy patterns. At least some of the dummy patterns are disposed on the upper or lower surface of the coil circuit board module.

18. The cooking appliance according to claim 1, wherein, The coil circuit board module includes multiple working coil patterns arranged in a multi-layered structure along the vertical direction. Among them, other dummy patterns in the plurality of dummy patterns are set in the inner layer of the plurality of layered structures.

19. The cooking appliance according to claim 1, wherein, Both the dummy via and the dummy pattern are located in the coil circuit board module. One end of the dummy pattern is connected to the dummy via.

20. A household appliance, the household appliance comprising: Top plate, which is in contact with the object; as well as A coil circuit board module, disposed below the top plate, includes a working coil pattern for heating the object. The coil circuit board module also includes a dummy metal part that is electrically insulated from the working coil pattern.

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