Floating type welding wire cutting process and welding wire cutting system

Abstract

The invention belongs to the technical field of semiconductor wire welding (bonding), and particularly relates to a floating type wire welding and cutting process and a wire welding and cutting system.The floating type wire welding and cutting process comprises the steps that a chopper moves upwards from a starting point to a first transfer point; the chopper obliquely moves downwards from the first transfer point to a second transfer point; the chopper moves upwards from the second transfer point to a third transfer point; the chopper obliquely moves downwards from the third transfer point to the end point; the method is applied to semiconductor bonding wires (bonding), the chopper moving track is optimized, namely, the chopper sequentially passes through the first transfer point, the second transfer point, the third transfer point and the first transfer point from the starting point to the end point, namely, two-cutter line cutting is adopted to start line cutting at the high point and end line cutting at the low point, even if a product is in a floating state, an ideal platform can be cut out, and the production efficiency is improved. Meanwhile, the cleaver is uniform in stress, abrasion of the cleaver can be reduced, the service life of the cleaver is prolonged, the operation parameters of the cleaver are adjusted according to different modes and wires, and the operation efficiency is higher.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor wire bonding technology, and particularly relates to a floating wire bonding process and wire bonding system. Background Technology

[0002] When bonding floating products, during the inverse string placement and fore-strike string tail pressing processes, the traditional string cutting process (where the cutting blade only lifts upwards and then diagonally downwards to complete the cut) will have the following disadvantages due to the product's floating nature: Figure 1 The tangent is not cut cleanly, leaving a small tail; such as Figure 2 Uneven tangent platform makes secondary welding difficult; weak weld lines lead to product failure, etc. Figure 3 The unidirectional tangential cutting tool is severely worn; there are many production alarms, making debugging difficult.

[0003] The above problems are caused by the fact that when welding the ball, the overall frame floats downwards. When the welding is completed and the cutting tool is lifted to cut the ball, the overall frame floats upwards. The upward range is unstable, which leads to unstable tangent lines, i.e., various abnormalities occur.

[0004] Therefore, there is an urgent need to develop a new floating welding tangent process and welding tangent system to solve the technical problems of unclean tangents, difficulty in secondary welding, weak weld lines, and wear of the cleaver during the welding process of floating products.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0006] This disclosure provides at least one floating welding tangent process and welding tangent system.

[0007] In a first aspect, embodiments of this disclosure provide a floating welding tangent process, comprising: moving a cleaver upward from a starting point to a first intermediate point; moving the cleaver diagonally downward from the first intermediate point to a second intermediate point, wherein the second intermediate point is located below the first intermediate point; moving the cleaver upward from the second intermediate point to a third intermediate point, wherein the third intermediate point is located above the first intermediate point; and moving the cleaver diagonally downward from the third intermediate point to an end point, wherein the cleaver passes through the first intermediate point.

[0008] In one optional implementation, when in BSOB stitching mode, a planar coordinate system is established with the starting point as the origin, and the units of the horizontal and vertical coordinates are both μm. Then, the coordinates of the first transfer point are (0, L1), the coordinates of the second transfer point are (1 / 2CD±4, L2), the coordinates of the third transfer point are (1 / 2CD±4, L2+80), and the coordinates of the endpoint are (-1 / 2CD-4, 20); where CD is a set value, L1 is 70-80, and L2 is 20-30.

[0009] In one optional implementation, when in BBOS stitching mode, a planar coordinate system is established with the starting point as the origin, and the units of the horizontal and vertical coordinates are both μm. Then, the coordinates of the first transfer point are (0, L1), the coordinates of the second transfer point are (±1 / 2CD±4, L2), the coordinates of the third transfer point are (±1 / 2CD±4, L2+80), and the coordinates of the endpoint are (…). 20); where CD is the set value, L1 is 70-80, and L2 is 20-30.

[0010] In one alternative implementation, the CD value is set according to the wire type, wire diameter, and bonding pattern.

[0011] In one alternative implementation, when the wire type is silver wire, the wire diameter is 20μm, and the bonding mode is BSOB, CD is 45.

[0012] In one alternative implementation, when the wire type is gold alloy wire, the wire diameter is 20 μm, and the bonding mode is BSOB, CD is 45.

[0013] In one alternative implementation, when the wire type is copper wire, the wire diameter is 42μm, and the bonding mode is BSOB, CD is 90.

[0014] Secondly, embodiments of this disclosure also provide a welding tangent system employing the floating welding tangent process described above, comprising: a control module and a cleaving blade; the control module is configured to drive the cleaving blade to move upward from a starting point to a first intermediate point; the control module is configured to drive the cleaving blade to move diagonally downward from the first intermediate point to a second intermediate point, wherein the second intermediate point is located below the first intermediate point; the control module is configured to drive the cleaving blade to move upward from the second intermediate point to a third intermediate point, wherein the third intermediate point is located above the first intermediate point; the control module is configured to drive the cleaving blade to move diagonally downward from the third intermediate point to an end point, wherein the cleaving blade passes through the first intermediate point.

[0015] In one optional implementation, when in BSOB wire bonding mode, the control module establishes a planar coordinate system with the starting point as the origin, and the units of the horizontal and vertical coordinates are both μm. Then, the coordinates of the first transfer point are (0, L1), the coordinates of the second transfer point are (1 / 2CD±4, L2), the coordinates of the third transfer point are (1 / 2CD±4, L2+80), and the coordinates of the endpoint are (-1 / 2CD-4, 20); where CD is a set value, L1 is 70-80, and L2 is 20-30.

[0016] In one optional implementation, when in BBOS wire-punching mode, the control module establishes a planar coordinate system with the starting point as the origin, and the units of the horizontal and vertical coordinates are both μm. Then, the coordinates of the first transfer point are (0, L1), the coordinates of the second transfer point are (±1 / 2CD±4, L2), the coordinates of the third transfer point are (±1 / 2CD±4, L2+80), and the coordinates of the endpoint are (…). 20); where CD is the set value, L1 is 70-80, and L2 is 20-30.

[0017] The beneficial effects of this invention are that, when applied to semiconductor wire bonding, by optimizing the cutting tool's trajectory—that is, the cutting tool sequentially passes through the first, second, and third transfer points back to the endpoint from the starting point—it employs a two-blade cutting method, starting the cutting at a high point and ending at a low point. Even if the product is in a floating state, it can cut an ideal platform, avoiding residual cutting tails. At the same time, the cutting tool is subjected to uniform force, which reduces wear and increases its lifespan. Furthermore, by adjusting the cutting tool's operating parameters according to different modes and wire materials, the operating efficiency is even higher.

[0018] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and the drawings.

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1A schematic diagram of a product when the traditional tangential cutting process does not result in a clean cut.

[0022] Figure 2 This is a schematic diagram of a product that is difficult to weld using the traditional tangential welding process.

[0023] Figure 3 This is a schematic diagram of a product when the cleaving blade of a traditional tangential cutting process is severely worn.

[0024] Figure 4 A schematic diagram illustrating the movement of a cleaver in a floating welding tangent process, provided in an embodiment of this disclosure;

[0025] Figure 5 A planar coordinate system diagram of the movement of a cleaver in a floating welding tangential process provided in this embodiment of the present disclosure;

[0026] Figure 6 A schematic diagram of a product using 20μm silver wire in BSOB mode for a floating welding tangent process provided in an embodiment of this disclosure;

[0027] Figure 7 An image showing the effect of a product using 20μm silver wire in BSOB mode for a floating welding tangent process provided in this embodiment of the disclosure;

[0028] Figure 8 A schematic diagram of a product using 20μm gold alloy wire in BSOB mode for a floating welding tangent process provided in an embodiment of this disclosure;

[0029] Figure 9 An image showing the effect of a product using 20μm gold alloy wire in BSOB mode for a floating welding tangent process provided in this embodiment of the disclosure;

[0030] Figure 10 This is a schematic diagram of a product using 42μm copper wire in BSOB mode, provided as an embodiment of the present disclosure, for a floating welding tangent process.

[0031] In the picture:

[0032] 1. Starting point; 2. First transfer point; 3. Second transfer point; 4. Third transfer point; 5. End point. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0035] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0036] Research has revealed that during wire bonding of floating products, the following drawbacks occur when performing inverse string placement and forehand string tail pressing processes: due to the product's floating nature, using the traditional wire-cutting process (where the cutting blade only lifts upwards and then diagonally downwards to cut the wire) will result in the following issues: Figure 1 The tangent is not cut cleanly, leaving a small tail; such as Figure 2 Uneven tangent platform makes secondary welding difficult; weak weld lines lead to product failure, etc. Figure 3 The unidirectional tangential cutting tool is severely worn; there are numerous production alarms, making debugging difficult. The cause of these problems is that during the welding and ball pressing process, the overall frame floats downwards. When welding is completed and the cutting tool is raised to cut the ball, the overall frame floats upwards. The upward range is unstable, leading to unstable tangential lines and various abnormalities.

[0037] Based on the above research, this disclosure provides a floating welding tangent process and welding tangent system, which optimizes the trajectory of the cleaver. The cleaver moves sequentially from the starting point through the first transfer point, the second transfer point, the third transfer point, and back to the end point. This means that two cleavers are used to cut the wire at a high point and end at a low point. Even if the product is floating, it can cut an ideal platform and avoid residual tails. At the same time, the force on the cleaver is uniform, which can reduce cleaver wear and improve cleaver life. Furthermore, the cleaver operating parameters can be adjusted according to different modes and wire materials, resulting in higher operating efficiency.

[0038] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure below should be considered as the inventor's contribution to this disclosure.

[0039] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0040] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0041] like Figures 4 to 10 As shown, at least one embodiment provides a floating welding tangent process, which includes: moving a cleaver upward from a starting point 1 to a first intermediate point 2; moving the cleaver diagonally downward from the first intermediate point 2 to a second intermediate point 3, with the second intermediate point 3 located below the first intermediate point 2; moving the cleaver upward from the second intermediate point 3 to a third intermediate point 4, with the third intermediate point 4 located above the first intermediate point 2; and moving the cleaver diagonally downward from the third intermediate point 4 to an end point 5, with the cleaver passing through the first intermediate point 2.

[0042] In at least one embodiment, applied to semiconductor wire bonding, by optimizing the cutting tool's trajectory—that is, the cutting tool sequentially passes through the first transfer point 2, the second transfer point 3, the third transfer point 4, and the first transfer point 2 again to the end point 5 from the starting point 1—that is, by using two cutting tools to cut the wire at a high point and end at a low point, an ideal platform can be cut even if the product is in a floating state, avoiding residual tails in the cutting wire. At the same time, the cutting tool is subjected to uniform force, which can reduce cutting tool wear and improve cutting tool life. Furthermore, the cutting tool's operating parameters can be adjusted according to different modes and wire materials, resulting in higher operating efficiency.

[0043] In at least one embodiment, please refer to Figure 5When in BSOB stitching mode, a planar coordinate system is established with the starting point 1 as the origin, and the units of the horizontal and vertical coordinates are both μm. Then the coordinates of the first transfer point 2 are (0, L1), the coordinates of the second transfer point 3 are (1 / 2CD±4, L2), the coordinates of the third transfer point 4 are (1 / 2CD±4, L2+80), and the coordinates of the endpoint 5 are (-1 / 2CD-4, 20). Among them, CD is a set value, L1 is 70-80, and L2 is 20-30.

[0044] Specifically, BSOB stands for Bond Scrub On Ball, which involves a second bonding process on an existing ball solder joint to form a pin solder joint.

[0045] Specifically, when in BSOB stringing mode, the vertical distance of the cleaver moving upward from the starting point 1 to the first transfer point 2 is L1. The horizontal and vertical distances of the cleaver moving diagonally downward from the first transfer point 2 to the second transfer point 3 are (1 / 2CD±4)μm and (L1-L2)μm, respectively. The vertical distance of the cleaver moving upward from the second transfer point 3 to the third transfer point 4 is 80μm. The horizontal and vertical distances of the cleaver moving diagonally downward from the third transfer point 4 to the end point 5 are (CD±4+4)μm and (60+L2)μm, respectively. L1 is 70-80μm and L2 is 20-30μm.

[0046] In at least one embodiment, when in BBOS stitching mode, a planar coordinate system is established with the starting point 1 as the origin, and the units of the horizontal and vertical coordinates are both μm. Then, the coordinates of the first transfer point 2 are (0, L1), the coordinates of the second transfer point 3 are (±1 / 2CD±4, L2), the coordinates of the third transfer point 4 are (±1 / 2CD±4, L2+80), and the coordinates of the endpoint 5 are (…). 20); where CD is the set value, L1 is 70-80, and L2 is 20-30.

[0047] Specifically, BBOS stands for Bond Ball On Stitch, which involves a second bonding process on an existing pin solder joint to form a ball solder joint.

[0048] Specifically, when in BBOS mode, the vertical distance of the chopping knife moving upward from the starting point 1 to the first intermediate point 2 is L1. The horizontal and vertical distances of the chopping knife moving diagonally downward from the first intermediate point 2 to the second intermediate point 3 are (1 / 2CD±4)μm and (L1-L2)μm, respectively. The vertical distance of the chopping knife moving upward from the second intermediate point 3 to the third intermediate point 4 is 80μm. The horizontal and vertical distances of the chopping knife moving diagonally downward from the third intermediate point 4 to the endpoint 5 are (CD±4+4)μm and (60+L2)μm, respectively. L1 is 70-80μm and L2 is 20-30μm.

[0049] In at least one embodiment, the CD value is set according to the wire type, wire diameter, and bonding pattern.

[0050] Specifically, the CD value is also related to the type of chopping knife selected, which can be, but is not limited to, ceramic chopping knives.

[0051] In at least one embodiment, please refer to Figure 6 , Figure 7 When the wire type is silver wire, the wire diameter is 20μm, and the bonding mode is BSOB, CD is 45.

[0052] For details, please refer to 6. Figure 7 The specific parameters are as follows: the coordinates of the first transfer point 2 are (0, 80), the coordinates of the second transfer point 3 are (20, 20), the coordinates of the third transfer point 4 are (20, 100), and the coordinates of the endpoint 5 are (-25, 20); the BSOB value ball tangent platform is intact, and the fish tail is normal after the second BSOB welding is completed, with no defects or small tails.

[0053] In at least one embodiment, please refer to Figure 8 , Figure 9 When the wire type is gold alloy wire, the wire diameter is 20μm, and the bonding mode is BSOB, CD is 45.

[0054] For details, please refer to 8. Figure 9 The specific parameters are as follows: the coordinates of the first transfer point 2 are (0, 80), the coordinates of the second transfer point 3 are (20, 20), the coordinates of the third transfer point 4 are (20, 100), and the coordinates of the endpoint 5 are (-25, 20); the BSOB value ball tangent platform is intact, and the fish tail is normal after the second BSOB welding is completed, with no defects or small tails.

[0055] In at least one embodiment, please refer to Figure 10 When the wire type is copper wire, the wire diameter is 42μm, and the bonding mode is BSOB, CD is 90.

[0056] Specifically, please refer to 10. The specific parameters are: the coordinates of the first transfer point 2 are (0, 70), the coordinates of the second transfer point 3 are (41, 31), the coordinates of the third transfer point 4 are (41, 110), and the coordinates of the endpoint 5 are (-49, 30); the tangent is stable.

[0057] Based on the same technical concept, at least one embodiment also provides a welding tangent system employing the floating welding tangent process described above, comprising: a control module and a cleaving blade; the control module is configured to drive the cleaving blade to move upward from a starting point 1 to a first intermediate point 2; the control module is configured to drive the cleaving blade to move diagonally downward from the first intermediate point 2 to a second intermediate point 3, wherein the second intermediate point 3 is located below the first intermediate point 2; the control module is configured to drive the cleaving blade to move upward from the second intermediate point 3 to a third intermediate point 4, wherein the third intermediate point 4 is located above the first intermediate point 2; the control module is configured to drive the cleaving blade to move diagonally downward from the third intermediate point 4 to an end point 5, wherein the cleaving blade passes through the first intermediate point 2.

[0058] In at least one embodiment, when in BSOB wire bonding mode, the control module establishes a planar coordinate system with the starting point 1 as the origin, and the units of the horizontal and vertical coordinates are both μm. Then, the coordinates of the first transfer point 2 are (0, L1), the coordinates of the second transfer point 3 are (1 / 2CD±4, L2), the coordinates of the third transfer point 4 are (1 / 2CD±4, L2+80), and the coordinates of the endpoint 5 are (-1 / 2CD-4, 20); where CD is a set value, L1 is 70-80, and L2 is 20-30.

[0059] In at least one embodiment, when in BBOS wire-punching mode, the control module establishes a planar coordinate system with the starting point 1 as the origin, and the units of the horizontal and vertical coordinates are both μm. Then, the coordinates of the first transfer point 2 are (0, L1), the coordinates of the second transfer point 3 are (±1 / 2CD±4, L2), the coordinates of the third transfer point 4 are (±1 / 2CD±4, L2+80), and the coordinates of the endpoint 5 are (…). 20); where CD is the set value, L1 is 70-80, and L2 is 20-30.

[0060] In summary, this invention, applied to semiconductor wire bonding, optimizes the cutting tool's trajectory. The cutting tool moves sequentially from the starting point through a first, second, and third transfer point back to the endpoint, employing a two-blade cutting mechanism that begins and ends at a high point. Even when the product is floating, it cuts an ideal platform, avoiding residual wire tails. Simultaneously, the cutting tool experiences uniform force, reducing wear and extending its lifespan. Furthermore, adjusting the cutting tool's operating parameters according to different modes and wire materials increases operational efficiency. Batch production observations of various wire materials have yielded comprehensive parameter formulas, completely resolving parameter consistency issues. It solves the problem of wire tangling and flying wire, improving operator efficiency; reduces cutting tool wear, extending tool lifespan; standardizes parameter ranges, simplifying debugging and improving work efficiency; ensures smooth production operations, increasing wire utilization; significantly improves yield and output; and even with expensive wires (primarily pure gold wire for safety standards), the cutting tool lifespan is doubled, demonstrating significant quality improvement and cost reduction.

[0061] While this patent document contains numerous details, it should not be construed as limiting the scope of any invention or claim, but rather as a description of features of specific embodiments of a particular invention. Certain features described in the context of individual embodiments may also be implemented in combination in a single embodiment. Conversely, various functions described in the context of a single embodiment may also be implemented individually in multiple embodiments, or in any suitable sub-combination. Furthermore, although the foregoing features may be described as functioning in certain combinations, or even initially claimed to be so, in certain circumstances, one or more features from a combination of claims may be removed from the combination, and a combination of claims may refer to a sub-combination or a variation of a sub-combination.

[0062] Only some implementations and examples are described; other implementations, enhancements, and variations can be made based on the content described and illustrated in this patent document.

[0063] While several embodiments are provided in this disclosure, it should be understood that the disclosed systems and methods may be embodied in many other specific forms without departing from the spirit or scope of this disclosure. The present examples are intended to be illustrative rather than restrictive and are not limited to the details given.

Claims

1. A floating welding tangent process, characterized in that, include: The cleaver moves upward from the starting point (1) to the first intermediate point (2); The cleaver moves diagonally downward from the first transfer point (2) to the second transfer point (3), and the second transfer point (3) is located below the first transfer point (2); The cleaver moves upward from the second transfer point (3) to the third transfer point (4), and the third transfer point (4) is located above the first transfer point (2); The cleaver moves diagonally downward from the third transfer point (4) to the end point (5), and the cleaver passes through the first transfer point (2).

2. The floating welding tangent process as described in claim 1, characterized in that, When in BSOB stringing mode, a plane coordinate system is established with the starting point (1) as the origin, and the units of the horizontal and vertical coordinates are both μm. Then the coordinates of the first transfer point (2) are (0, L1), the coordinates of the second transfer point (3) are (1 / 2CD±4, L2), the coordinates of the third transfer point (4) are (1 / 2CD±4, L2+80), and the coordinates of the end point (5) are (-1 / 2CD-4, 20). Where CD is the set value, L1 is 70-80, and L2 is 20-30.

3. The floating welding tangent process as described in claim 1, characterized in that, When in BBOS stringing mode, a planar coordinate system is established with the starting point (1) as the origin, and the units of the horizontal and vertical coordinates are both μm. The coordinates of the first transfer point (2) are (0, L1), the coordinates of the second transfer point (3) are (±1 / 2CD±4, L2), the coordinates of the third transfer point (4) are (±1 / 2CD±4, L2+80), and the coordinates of the endpoint (5) are (...). 20); Where CD is the set value, L1 is 70-80, and L2 is 20-30.

4. The floating welding tangent process as described in claim 2 or 3, characterized in that, The CD value is set according to the type of wire, wire diameter, and bonding pattern.

5. The floating welding tangent process as described in claim 4, characterized in that, When the wire type is silver wire, the wire diameter is 20μm, and the bonding mode is BSOB, CD is 45.

6. The floating welding tangent process as described in claim 4, characterized in that, When the wire type is gold alloy wire, the wire diameter is 20μm, and the bonding mode is BSOB, CD is 45.

7. The floating welding tangent process as described in claim 4, characterized in that, When the wire type is copper wire, the wire diameter is 42μm, and the bonding mode is BSOB, CD is 90.

8. A welding tangent system employing the floating welding tangent process as described in any one of claims 1-7, characterized in that, include: Control module and cleaver; The control module is configured to drive the chopping blade to move upward from the starting point (1) to the first intermediate point (2); The control module is configured to drive the chopping blade to move diagonally downward from the first transfer point (2) to the second transfer point (3), and the second transfer point (3) is located below the first transfer point (2); The control module is configured to drive the chopping blade to move upward from the second transfer point (3) to the third transfer point (4), and the third transfer point (4) is located above the first transfer point (2); The control module is configured to drive the chopping blade to move diagonally downward from the third transfer point (4) to the end point (5), and the chopping blade passes through the first transfer point (2).

9. The welding tangent system as described in claim 8, characterized in that, When in BSOB wire-punching mode, the control module establishes a plane coordinate system with the starting point (1) as the origin, and the units of the horizontal and vertical coordinates are both μm. Then the coordinates of the first transfer point (2) are (0, L1), the coordinates of the second transfer point (3) are (1 / 2CD±4, L2), the coordinates of the third transfer point (4) are (1 / 2CD±4, L2+80), and the coordinates of the end point (5) are (-1 / 2CD-4, 20). Where CD is the set value, L1 is 70-80, and L2 is 20-30.

10. The welding tangent system as described in claim 8, characterized in that, When in BBOS wire-punching mode, the control module establishes a planar coordinate system with the starting point (1) as the origin, and the units of the horizontal and vertical coordinates are both μm. Therefore, the coordinates of the first transfer point (2) are (0, L1), the coordinates of the second transfer point (3) are (±1 / 2CD±4, L2), the coordinates of the third transfer point (4) are (±1 / 2CD±4, L2+80), and the coordinates of the endpoint (5) are (...). 20); Where CD is the set value, L1 is 70-80, and L2 is 20-30.

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