High-temperature chemical liquid cooling mechanism and cooling equipment for semiconductor wet cleaning

Abstract

The invention discloses a high-temperature chemical liquid cooling mechanism and cooling equipment for wet cleaning of semiconductors in the technical field of chemical waste liquid cooling, and the high-temperature chemical liquid cooling mechanism comprises a cooling tank, a cooling coil pipe arranged in the cooling tank and an inert gas mixing mechanism located below the coil pipe. The control system is provided with two-stage temperature monitoring interlocking logic, the control system is provided with two-stage temperature monitoring interlocking logic, and the two-stage temperature monitoring interlocking logic is provided with two-stage temperature monitoring interlocking logic, and the two-stage temperature monitoring interlocking logic is connected with the two-stage temperature monitoring interlocking logic through the two-stage temperature monitoring interlocking logic and the two-stage temperature monitoring interlocking logic through the two-stage temperature monitoring interlocking logic. Only when the temperature values in the cooling tank and the buffer tank both meet the preset safety value, the control system controls the drain valve to be opened so as to execute final drainage. The problem that thermal stratification is easily caused by static cooling is solved, and accidental discharge of high-temperature waste liquid is effectively prevented through dual temperature control interlocking.

Description

Technical Field

[0001] This invention relates to the field of chemical waste liquid cooling technology, specifically to a high-temperature chemical liquid cooling mechanism and cooling equipment for semiconductor wet cleaning. Background Technology

[0002] In fields such as semiconductor wet cleaning and fine chemical synthesis, the treated high-temperature chemical liquids usually need to undergo strict cooling treatment before they can be discharged or recycled.

[0003] Traditional cooling processes typically employ large tanks with immersion cooling coils for heat exchange. However, when handling large volumes of high-viscosity liquids, the natural convection of the fluid within the tank is weak, leading to the formation of a low-temperature layer near the cooling coils, while the liquid temperature remains higher in areas far from the coils or in the center of the tank. This results in a severe temperature stratification problem.

[0004] Temperature stratification not only significantly reduces overall heat exchange efficiency, prolongs cooling time, and affects production cycle time, but more importantly, it creates local hot spots, posing a major safety hazard when handling high-risk, easily decomposed, or potentially exothermic chemical liquids. Existing conventional cooling methods cannot effectively eliminate the stubborn thermodynamic stratification that occurs during high-heat-load cooling.

[0005] Furthermore, regardless of cooling efficiency, the ultimate goal of cooling equipment is to ensure that the discharged chemical solutions comply with stringent safety and environmental regulations.

[0006] Existing equipment typically relies on temperature detection at the outlet or a single storage stage. If the sensor drifts or malfunctions, or if there are undetected localized hot spots in the liquid inside the tank, the system may misjudge the discharge temperature as qualified, resulting in the accidental discharge of corrosive liquid that exceeds the temperature limit. This discharge mechanism is seriously inadequate in terms of safety and reliability when dealing with high-requirement semiconductor process waste liquids. Summary of the Invention

[0007] The purpose of this invention is to provide a high-temperature chemical liquid cooling mechanism and cooling equipment for semiconductor wet cleaning, so as to solve the problems of temperature stratification, low cooling efficiency and unevenness of the liquid in the tank when the cooling tank is handling high-temperature and high-viscosity chemical liquid due to weak natural convection, as well as the safety hazards of accidental discharge of overheated liquid due to the lack of a multi-level temperature safety interlock mechanism in the existing equipment.

[0008] To solve the above-mentioned technical problems, the present invention specifically provides the following technical solution: A high-temperature chemical liquid cooling mechanism for semiconductor wet cleaning includes: A cooling tank, which has an internal cavity for containing high-temperature chemical liquids; Cooling coils, located within the inner cavity, are used to introduce cooling media to exchange heat and cool down high-temperature chemical liquids; An inert gas mixing mechanism is located at the bottom of the inner cavity and below the cooling coil. The inert gas mixing mechanism is used to inject inert gas into the high-temperature chemical liquid, so that the bubbles rise and induce a forced convection circulation, thereby breaking the temperature stratification of the liquid in the cooling tank. The cooling tank is equipped with an exhaust port at the top, which is used to discharge inert gases that overflow from the high-temperature chemical liquid.

[0009] Furthermore, the inert gas mixing mechanism includes: A vent pipe is located in the inner cavity and is coaxial with the cooling tank. The upper end of the vent pipe is fixed to the top of the cooling tank and is connected to an inert gas source. The annular tube is located at the bottom of the inner cavity and is coaxial with the vent tube. The lower end of the vent tube is connected to the annular tube through a diverter tube to evenly distribute the inert gas from the vent tube to the annular tube. Among them, several air outlets are evenly distributed in the circumferential direction on the annular tube. The axial direction of the air outlets forms a tangential angle with the center of the annular tube. The tangential angle is used to generate a lateral thrust on the liquid in the cooling tank when the inert gas is ejected, so as to induce the formation of tangential vortex in the liquid in the cooling tank. The axial direction of the vent is tilted downward at 45° relative to the horizontal plane so that the inert gas generates a purging force on the bottom of the inner cavity of the cooling tank before rising.

[0010] Furthermore, the cooling tank is provided with several coil racks evenly distributed circumferentially. Each coil rack has an axial extension direction that is parallel to the axial direction of the cooling tank. Each coil rack has several mounting holes evenly distributed at equal intervals along the axial extension direction. The cooling coils pass through all the mounting holes in a spiral shape and are limited by the hole walls. The cooling tank is equipped with several annular inner support frames that are spaced apart along its axis. All annular inner support frames are fixedly connected to all coil frames. Each coil frame has an arc-shaped tension arm on its outer side, which has elastic deformation capability to keep it pressed against the inner wall of the cooling tank.

[0011] Furthermore, the cooling tank is a composite structure consisting of a metal outer shell and a polytetrafluoroethylene (PTFE) liner, with the PTFE liner tightly attached to the inner wall of the metal outer shell. The cooling coils and inert gas mixing mechanism are made of perfluoroalkoxy or polytetrafluoroethylene.

[0012] A high-temperature chemical liquid cooling device for semiconductor wet cleaning includes a cooling mechanism and further includes: A buffer tank is located downstream of the cooling tank, with the bottom outlet of the cooling tank connected to the inlet of the buffer tank. The first drain valve is located between the bottom outlet of the cooling tank and the inlet of the buffer tank. The second drain valve is connected to the drain port of the buffer tank; The first temperature sensor is installed inside the cooling tank to detect the temperature of the liquid inside the cooling tank; The second temperature sensor is installed inside the buffer tank to detect the temperature of the liquid inside the buffer tank. The control system is electrically connected to the first drain valve, the second drain valve, the first temperature sensor, and the second temperature sensor. The control system is configured to perform a two-stage temperature interlocked drain operation. When the temperature value detected by the first temperature sensor meets the first preset safety value, the first drain valve is opened to allow the cooled chemical liquid to enter the buffer tank. When the temperature value detected by the second temperature sensor also meets the second preset safety value, the second drain valve is controlled to perform the final drain operation.

[0013] Furthermore, the buffer tank is installed below the bottom drain of the cooling tank to facilitate liquid flow; A return pipe is provided between the buffer tank and the cooling tank, and a return valve is provided on the return pipe. The top of the cooling tank is provided with a return port specifically connected to the return pipe. The reflux valve is electrically connected to the control system. When the second temperature sensor detects that the liquid temperature in the buffer tank is higher than the second preset safety value, the control system opens the reflux valve to pump the unqualified liquid back from the buffer tank to the cooling tank for secondary cooling through the reflux pipe.

[0014] Furthermore, the upper part of the cooling tank is connected to the buffer tank via an overflow pipe.

[0015] Furthermore, the top of the cooling tank is connected to multiple liquid inlet pipes, each of which is equipped with a manual isolation valve and a pneumatic control valve in series. The cooling tank is equipped with a first liquid level sensor, which is configured to detect whether the liquid level in the cooling tank has reached the upper limit. When the liquid level reaches the upper limit, the control system forcibly closes the pneumatic control valve to prevent overflow. The manual isolation valve is located upstream of the pneumatic control valve and is used to physically shut off the input of high-temperature chemical liquids during equipment maintenance or emergency situations.

[0016] Furthermore, the buffer tank is made of polytetrafluoroethylene and has an integrated second liquid level sensor. The second liquid level sensor is used to detect whether the liquid in the buffer tank has reached the high limit or low limit and is interlocked with the control system to control the opening and closing of the first drain valve to prevent overflow or pump dry running.

[0017] Furthermore, the top of the buffer tank is equipped with an exhaust system, which is connected to the factory's ventilation system; The buffer tank is also equipped with a pressure sensor for detecting the pressure inside the tank. The control system is configured to adjust the operation of the exhaust system based on the feedback from the pressure sensor so that the pressure inside the buffer tank is always maintained within a slightly negative pressure safe range.

[0018] The beneficial effects of this invention are: This invention utilizes an inert gas mixing mechanism installed below the cooling coil. The injected inert gas generates bubbles in the liquid, which rise and induce a forced convection circulation of the liquid inside the tank from bottom to top. This circulation flow field can actively disrupt the temperature boundary layer and thermodynamic stratification that naturally form in high-temperature, high-viscosity chemical liquids during static cooling, thereby achieving uniform and rapid cooling of the entire tank of liquid. Meanwhile, the two-level temperature monitoring interlock logic combined with the buffer tank forces the final liquid discharge to be carried out only after the temperature data in both the cooling tank and the buffer tank independently meet the preset safety value. This eliminates the risk of accidental discharge of overheated liquid due to single-point sensor failure or local temperature difference from the control logic perspective, and significantly improves the process safety of the system. Attached Figure Description

[0019] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0020] Figure 1 This is a three-dimensional structural diagram of the cooling tank of the present invention; Figure 2 This is a three-dimensional schematic diagram of the internal structure of the cooling tank of the present invention; Figure 3 This is a three-dimensional structural schematic diagram of the inert gas mixing mechanism of the present invention; Figure 4 This is a cross-sectional view of the air outlet in the direction of the present invention. Figure 5 This is a three-dimensional structural diagram of the coil rack of the present invention; Figure 6 This is a schematic diagram showing the connection state between the cooling coil and the coil support of the present invention; Figure 7 This is a schematic diagram of the planar structure of the cooling tank of the present invention; Figure 8 This is a three-dimensional structural diagram of the cooling device of the present invention; Figure 9This is a three-dimensional structural diagram of the buffer tank of the present invention; Figure 10 This is a schematic diagram of the valve assembly at the liquid inlet of the cooling tank of the present invention; The labels in the diagram represent the following: 1-Cooling tank; 1a-Metal outer shell; 1b-PTFE liner; 1c-Exhaust port; 1d-Return port; 1e-Liquid outlet; 2-Cooling coil; 3-Vent pipe; 4-Annular pipe; 4a-Vent hole; 5-Diverter pipe; 6-Coil rack; 6a-Mounting hole; 6b-Arc-shaped tension arm; 7-Annular inner support frame; 8-Buffer tank; 8a-Liquid inlet; 9-First drain valve; 10-Second drain valve; 11-First temperature sensor; 12-Second temperature sensor; 13-Return pipe; 14-Return valve; 15-Overflow pipe; 16-Manual isolation valve; 17-Pneumatic control valve; 18-First liquid level sensor; 19-Second liquid level sensor; 20-Exhaust system; 21-Pressure sensor. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] This embodiment provides a high-temperature chemical liquid cooling mechanism for semiconductor wet cleaning, which aims to solve the problem of low and uneven cooling efficiency caused by temperature stratification due to the weak natural convection capacity of the fluid when the traditional cooling tank 1 is processing high-temperature and high-viscosity chemical liquids.

[0023] Specifically, refer to Figures 1 to 7 The high-temperature chemical liquid cooling mechanism for semiconductor wet cleaning includes a cooling tank 1, a cooling coil 2, and an inert gas mixing mechanism.

[0024] The cooling tank 1 has an inner cavity that contains a high-temperature chemical liquid. The cooling coil 2 is installed in the inner cavity and is used to introduce cooling medium such as cooling water. It exchanges heat with the high-temperature chemical liquid through the tube wall to cool down. The inert gas mixing mechanism is located at the bottom of the inner cavity and below the cooling coil 2. This inert gas mixing mechanism is used to inject inert gases such as nitrogen into the high-temperature chemical liquid. The injected gas rises rapidly under the action of buoyancy, causing the surrounding liquid to generate a strong upward flow and inducing the formation of bubble-driven forced convection circulation. This forced circulation breaks the original static or laminar flow state of the liquid in cooling tank 1, eliminates the temperature stratification phenomenon of cold near the coil area and hot away from the coil area, and achieves uniform mixing and rapid cooling of the liquid in the entire tank.

[0025] In addition, the top of the cooling tank 1 is provided with an exhaust port 1c, which is used to discharge inert gases that overflow from the high-temperature chemical liquid and volatile waste gases that may be generated, so as to maintain the pressure balance inside the tank.

[0026] Furthermore, in order to optimize the distribution of inert gas in the cooling tank 1 and improve the mixing efficiency, the inert gas mixing mechanism of this embodiment adopts a specific structural design. Specifically, the inert gas mixing mechanism includes a vent pipe 3 and an annular pipe 4. The vent pipe 3 is located in the inner cavity and is coaxial with the cooling tank 1. Its upper end is fixed to the top of the cooling tank 1 and connected to an external inert gas source, which is responsible for introducing gas.

[0027] The annular tube 4 is located at the bottom of the inner cavity and is coaxial with the vent tube 3. The lower end of the vent tube 3 is connected to the annular tube 4 through the diverter tube 5, which evenly diverts the gas into the annular tube 4. Several vent holes 4a are evenly distributed along the circumference on the annular tube 4.

[0028] Considering that if the gas is only ejected vertically upwards, its ability to laterally disturb the liquid is limited, the axial direction of the outlet 4a forms a tangential angle with the center of the annular pipe 4. This tangential angle causes the inert gas to generate a lateral thrust on the liquid in the cooling tank 1 when it is ejected, thereby inducing the formation of a tangential vortex in the liquid in the cooling tank 1. This tangential vortex, combined with the axial circulation caused by the rising of bubbles, constitutes a complex three-dimensional flow field, which further enhances the mixing effect.

[0029] Meanwhile, to address the issue of cooling dead zones or impurity settling easily at the bottom of cooling tank 1 due to poor liquid flow, the axial direction of the vent 4a is inclined downwards at 45° relative to the horizontal plane (see...). Figure 6 As shown in the figure, this design allows the inert gas to be sprayed diagonally downwards before rising, generating a purging force on the bottom of the inner cavity of the cooling tank 1, effectively removing sediment and eliminating the temperature dead zone at the bottom.

[0030] In response to the problem that the cooling coil 2 is prone to thermal expansion and contraction in high-temperature environments, and that improper fixing methods can lead to stress concentration and damage, this embodiment adopts a special support structure.

[0031] Specifically, the cooling tank 1 is provided with several coil racks 6 evenly distributed circumferentially. Each coil rack 6 has an axial extension direction parallel to the axial direction of the cooling tank 1. Each coil rack 6 has several mounting holes 6a evenly distributed at equal intervals along the axial extension direction. The cooling coil 2 passes through all the mounting holes 6a in a spiral shape and is limited by the hole wall of the mounting hole 6a, thereby forming a stable spiral coil structure.

[0032] To accommodate the thermal deformation of the coil, the cooling tank 1 is equipped with several annular inner support frames 7 spaced apart along its axis. All annular inner support frames 7 are fixedly connected to all coil frames 6. The key feature is that each coil frame 6 has an arc-shaped tension arm 6b on its outer side. This arc-shaped tension arm 6b has elastic deformation capability. When the cooling coil 2 expands or contracts due to temperature changes, the arc-shaped tension arm 6b can undergo corresponding elastic deformation to absorb stress, while maintaining tight contact with the inner wall of the cooling tank 1, ensuring the stability and safety of the coil structure.

[0033] Considering that the high-temperature chemical solutions used in semiconductor wet cleaning are usually highly corrosive (such as high-temperature sulfuric acid and phosphoric acid), ordinary metal materials cannot withstand them for a long time, while pure plastic tanks are not strong enough. Therefore, in this embodiment, the cooling tank 1 adopts a composite structure composed of a metal shell 1a and a polytetrafluoroethylene (PTFE) liner, with the PTFE liner 1b tightly attached to the inner wall of the metal shell 1a.

[0034] The metal outer casing 1a provides the necessary mechanical strength and pressure resistance, while the PTFE lining provides excellent chemical corrosion resistance. Similarly, the cooling coil 2, which comes into direct contact with the chemical liquid, and the inert gas mixing mechanism are both made of perfluoroalkoxy (PFA) or polytetrafluoroethylene (PTFE), ensuring long-term reliable operation of the entire system under harsh conditions.

[0035] Based on the above-mentioned cooling mechanism, this embodiment also provides a high-temperature chemical liquid cooling device for semiconductor wet cleaning. Relying solely on the cooling function of the cooling tank 1 itself, it is difficult to guarantee the absolute safety of the final discharged liquid temperature, and a single discharge control has the risk of failure. Therefore, this device introduces a dual-level buffer and temperature control mechanism.

[0036] Specifically, in combination Figures 8 to 10 The equipment also includes a buffer tank 8, a first drain valve 9, a second drain valve 10, a first temperature sensor 11, a second temperature sensor 12, and a control system.

[0037] The buffer tank 8 is located downstream of the cooling tank 1. The bottom outlet of the cooling tank 1 is connected to the inlet of the buffer tank 8. The first drain valve 9 is located between the bottom outlet of the cooling tank 1 and the inlet of the buffer tank 8 to control the initial drain. The second drain valve 10 is connected to the drain of the buffer tank 8 to control the final drain. The first temperature sensor 11 is installed inside the cooling tank 1 to detect the temperature of the liquid inside it, and the second temperature sensor 12 is installed inside the buffer tank 8 to detect the temperature of the liquid inside it. The control system is electrically connected to the above valves and sensors and is configured to perform a two-stage temperature interlocked drain operation: the first drain valve 9 can only be opened when the temperature value detected by the first temperature sensor 11 meets the first preset safety value (e.g., 60°C), allowing the cooled chemical liquid to enter the buffer tank 8 for temporary storage. Subsequently, the second drain valve 10 is controlled to perform the final drain operation only when the temperature value detected by the second temperature sensor 12 also meets the second preset safety value (e.g., the temperature that meets the emission standards). This dual confirmation mechanism greatly reduces the risk of overheated liquid being accidentally discharged.

[0038] In order to ensure smooth flow of liquid within the system and to reprocess substandard liquid, the buffer tank 8 is installed below the bottom drain of the cooling tank 1 so that the liquid can flow by gravity. More importantly, if the liquid temperature in the buffer tank 8 still does not meet the discharge standard after testing, direct discharge will be prohibited.

[0039] To this end, a return pipe 13 is provided between the buffer tank 8 and the cooling tank 1, and a return valve 14 is provided on the return pipe 13. The top of the cooling tank 1 is provided with a return port 1d that is dedicated to the return pipe 13. The return valve 14 is electrically connected to the control system. When the second temperature sensor 12 detects that the liquid temperature in the buffer tank 8 is higher than the second preset safety value, the control system opens the return valve 14 and uses a pumping device to pump the unqualified liquid from the buffer tank 8 back to the cooling tank 1 through the return pipe 13 for secondary cooling until the temperature is qualified, thus forming a closed-loop temperature control guarantee.

[0040] During the liquid transportation process, there may be a situation where the flow rate is out of control and overflow occurs. In order to provide passive safety protection, the upper part of the cooling tank 1 is connected to the buffer tank 8 through an overflow pipe 15. When the liquid level in the cooling tank 1 rises abnormally and exceeds the overflow pipe 15, the excess liquid will automatically flow into the buffer tank 8 to avoid overflow from the top of the cooling tank 1 and causing a safety accident.

[0041] In addition, to ensure the safety and controllability of the liquid inlet process and to physically cut off the source in an emergency, the top of the cooling tank 1 is connected to multiple liquid inlet pipes, and each liquid inlet pipe is equipped with a manual isolation valve 16 and a pneumatic control valve 17 in series. The cooling tank 1 is equipped with a first liquid level sensor 18, which is configured to detect whether the liquid level in the cooling tank 1 has reached the upper limit. When the liquid level reaches the upper limit, the control system forcibly closes the pneumatic control valve 17 to prevent overflow. The manual isolation valve 16 is located upstream of the pneumatic control valve 17 and is used to manually and physically cut off the input of high-temperature chemical liquid in emergency situations such as equipment maintenance or pneumatic valve failure, providing dual liquid inlet safety protection.

[0042] As the last checkpoint before drainage, the level control of the buffer tank 8 is also crucial. The buffer tank 8 is made of polytetrafluoroethylene and has an integrated second level sensor 19 inside. The second level sensor 19 is used to detect whether the liquid in the buffer tank 8 has reached the high limit or low limit and is interlocked with the control system. When the high limit is reached, the control system controls the first drain valve 9 to close to prevent the buffer tank 8 from overflowing. When the low limit is reached, the control system controls the drain pump to stop working to prevent the pump body from running dry and being damaged.

[0043] Finally, considering that a small amount of volatile gas may still be generated in the buffer tank 8 at high temperature, and that pressure fluctuations will occur when the tank is filled and drained, the top of the buffer tank 8 is equipped with an exhaust system 20, which is connected to the factory's exhaust system to safely discharge the waste gas. The buffer tank 8 is also equipped with a pressure sensor 21 for detecting the pressure inside the tank. The control system is configured to adjust the operating status of the exhaust system 20 (such as adjusting the opening of the exhaust valve) based on the feedback from the pressure sensor 21, so that the pressure inside the buffer tank 8 is always maintained within a slightly negative pressure safety range. This slightly negative pressure control not only prevents harmful gases from leaking into the environment, but also avoids damage to the tank due to excessive negative pressure, thus ensuring the environmental safety and structural integrity of the equipment.

[0044] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art can make various modifications or equivalent substitutions to the present invention within its spirit and scope of protection, and such modifications or equivalent substitutions should also be considered as falling within the scope of protection of the embodiments of the present invention.

Claims

1. A high-temperature chemical liquid cooling mechanism for semiconductor wet cleaning, characterized by comprising: a cooling mechanism for cooling a high-temperature chemical liquid; and a temperature sensor for measuring a temperature of the high-temperature chemical liquid. The application relates to a cooling tank for high-temperature chemical liquid. The cooling tank comprises: a cooling tank (1) with an inner cavity for containing high-temperature chemical liquid; a cooling coil (2) arranged in the inner cavity and used for passing cooling medium to exchange heat with the high-temperature chemical liquid; an inert gas mixing mechanism arranged at the bottom of the inner cavity and below the cooling coil (2), which is used for injecting inert gas into the high-temperature chemical liquid to induce a forced convection circulation by bubble floating and breaking the temperature stratification of the liquid in the cooling tank (1); 2. The high-temperature chemical liquid cooling mechanism for semiconductor wet cleaning according to claim 1, characterized by wherein the top of the cooling tank (1) is provided with an exhaust port (1c) for discharging the inert gas overflowing from the high-temperature chemical liquid. The inert gas mixing mechanism comprises: an air pipe (3) arranged in the inner cavity and coaxial with the cooling tank (1), the upper end of the air pipe (3) being fixed to the top of the cooling tank (1), and the upper end of the air pipe (3) being connected with an inert gas source; a ring pipe (4) arranged at the bottom of the inner cavity and coaxial with the air pipe (3), the lower end of the air pipe (3) being connected with the ring pipe (4) through a shunt pipe (5) to uniformly shunt the inert gas from the air pipe (3) to the ring pipe (4); wherein a plurality of gas outlet holes (4a) are uniformly arranged on the ring pipe (4) and distributed in the circumferential direction, the axis direction of the gas outlet holes (4a) being formed with a tangential angle with the center of the ring pipe (4), so that the inert gas is sprayed to generate a transverse thrust on the liquid in the cooling tank (1) to induce a tangential rotational flow in the liquid in the cooling tank (1); 3. The high-temperature chemical liquid cooling mechanism for semiconductor wet cleaning according to claim 1, characterized by the axis direction of the gas outlet holes (4a) is downwardly inclined by 45 degrees relative to the horizontal plane to generate a sweeping force on the bottom of the inner cavity of the cooling tank (1) before the inert gas rises. The cooling tank (1) is provided with a plurality of coil racks (6) uniformly distributed in the circumferential direction, each of the coil racks (6) has an axial extension direction which is parallel to the axial direction of the cooling tank (1), each of the coil racks (6) is formed with a plurality of mounting holes (6a) uniformly distributed in the axial extension direction, and the cooling coil (2) is spirally arranged in all the mounting holes (6a) and is limited by the hole walls of the mounting holes (6a); 4. The high-temperature chemical liquid cooling mechanism for semiconductor wet cleaning according to claim 1, characterized by the cooling tank (1) is provided with a plurality of annular inner support racks (7) spaced apart along the axis of the cooling tank (1), all the annular inner support racks (7) are fixedly connected with all the coil racks (6), the outer side of each of the coil racks (6) is formed with a circular arc tension arm (6b) which has an elastic deformation capacity to tightly abut against the inner wall of the cooling tank (1). The cooling tank (1) is a composite structure composed of a metal shell (1a) and a polytetrafluoroethylene lining (1b), and the polytetrafluoroethylene lining (1b) is tightly attached to the inner wall of the metal shell (1a); 5. A high-temperature chemical liquid cooling apparatus for semiconductor wet cleaning, comprising the cooling mechanism according to any one of claims 1 to 4, characterized in that, the cooling coil (2) and the inert gas mixing mechanism are made of perfluoroalkoxy or polytetrafluoroethylene. The application further relates to a cooling tank for high-temperature chemical liquid. A buffer tank (8) is arranged downstream of the cooling tank (1), and a bottom liquid outlet of the cooling tank (1) is communicated with a liquid inlet of the buffer tank (8); A first liquid discharge valve (9) is arranged between the bottom liquid outlet of the cooling tank (1) and the liquid inlet of the buffer tank (8); A second liquid discharge valve (10) is connected to a liquid outlet of the buffer tank (8); A first temperature sensor (11) is arranged in the cooling tank (1) to detect the temperature of the liquid in the cooling tank (1); A second temperature sensor (12) is arranged in the buffer tank (8) to detect the temperature of the liquid in the buffer tank (8); A control system is electrically connected to the first liquid discharge valve (9), the second liquid discharge valve (10), the first temperature sensor (11), and the second temperature sensor (12), and is configured to perform a two-stage temperature interlocking liquid discharge operation: When the temperature value detected by the first temperature sensor (11) meets a first preset safety value, the first liquid discharge valve (9) is controlled to be opened to allow the cooled chemical liquid to enter the buffer tank (8); When the temperature value detected by the second temperature sensor (12) also meets a second preset safety value, the second liquid discharge valve (10) is controlled to perform a final liquid discharge operation.

6. The high-temperature chemical liquid cooling apparatus for semiconductor wet cleaning according to claim 5, characterized by The installation position of the buffer tank (8) is lower than the bottom liquid outlet of the cooling tank (1) to facilitate liquid flow; A backflow pipe (13) and a backflow valve (14) arranged on the backflow pipe (13) are arranged between the buffer tank (8) and the cooling tank (1), and a backflow port (1d) connected to the backflow pipe (13) is arranged at the top of the cooling tank (1); The backflow valve (14) is electrically connected to the control system, and when the temperature of the liquid in the buffer tank (8) detected by the second temperature sensor (12) is higher than the second preset safety value, the control system opens the backflow valve (14) to pump the unqualified liquid from the buffer tank (8) back to the cooling tank (1) through the backflow pipe (13) for secondary cooling.

7. The high-temperature chemical liquid cooling apparatus for semiconductor wet cleaning according to claim 5, characterized by The upper half of the cooling tank (1) is communicated with the buffer tank (8) through an overflow pipe (15).

8. The high-temperature chemical liquid cooling apparatus for semiconductor wet cleaning according to claim 5, characterized by The top of the cooling tank (1) is connected with a plurality of liquid inlet pipes, a manual isolation valve (16) and a pneumatic control valve (17) are arranged in series on each liquid inlet pipe, a first liquid level sensor (18) is arranged in the cooling tank (1), and the first liquid level sensor (18) is configured to detect whether the liquid level in the cooling tank (1) reaches an upper limit, and when the liquid level reaches the upper limit, the control system forcibly closes the pneumatic control valve (17) to prevent overflow; The manual isolation valve (16) is located upstream of the pneumatic control valve (17) to physically cut off the input of high-temperature chemical liquid in equipment maintenance or emergency state.

9. The high-temperature chemical liquid cooling apparatus for semiconductor wet cleaning according to claim 5, characterized by The buffer tank (8) is made of polytetrafluoroethylene material, and a second liquid level sensor (19) is integrated inside the buffer tank (8), which is used to detect whether the liquid in the buffer tank (8) reaches the high limit or the low limit, and is interlocked with the control system to control the opening and closing of the first liquid discharge valve (9), preventing overflow or pump body idling.

10. The high-temperature chemical liquid cooling apparatus for semiconductor wet cleaning according to claim 5, characterized by An exhaust system (20) is arranged on the top of the buffer tank (8), which is connected with the exhaust system of the factory; The buffer tank (8) is also provided with a pressure sensor (21) for detecting the pressure in the tank, and the control system is configured to adjust the operating state of the exhaust system (20) according to the feedback of the pressure sensor (21), so that the pressure in the buffer tank (8) is always maintained within a safe range of micro negative pressure.

Images