Well-shaped stack type packed bed heat storage device and operation method thereof

Abstract

The embodiment of the invention provides a well-shaped stack type packed bed heat storage device and an operation method thereof, and relates to the technical field of heat storage. The heat storage device comprises a heat storage chamber, a circulation chamber, a plurality of heat storage pieces, a heat charging auxiliary unit and a heat releasing auxiliary unit. The top end and the bottom end of the heat storage chamber are each provided with a circulation chamber, and the circulation chambers communicate with the heat storage chamber. An opening is formed in the cavity wall of the circulation chamber and used for allowing a medium to enter or flow out of the circulation chamber. The plurality of heat storage pieces form a first heat storage unit and a second heat storage unit; the first heat storage units and the second heat storage units are alternately arranged in the heat storage chamber in the height direction of the heat storage chamber. The heat-charging auxiliary unit is located on the lower portion of the heat storage chamber, and the heat-releasing auxiliary unit is located on the upper portion of the heat storage chamber. According to the heat storage device, the heat storage density of the heat storage device is increased, the heat exchange efficiency, the heat charging and discharging rate and the heat storage capacity utilization rate of the heat storage device are improved, the temperature gradient in a bed body is effectively reduced, the adaptability of a system to a fluctuating heat source is enhanced, and therefore long-term operation reliability is guaranteed.

Description

Technical Field

[0001] This application relates to the field of thermal storage technology, and in particular to a well-shaped stacked filled bed thermal storage device and its operation method. Background Technology

[0002] Thermal energy storage technology is an energy storage technology that uses thermal storage materials as a medium to store thermal energy such as solar thermal energy, industrial waste heat, low-grade waste heat, or thermal energy converted from abandoned or off-peak electricity, and releases it when needed. Among them, single-tank or modular filled bed thermal energy storage systems are becoming an important development direction in the field of thermal energy storage due to their advantages such as compact structure, large heat transfer area, and strong spatial adaptability.

[0003] Patent CN108534578B discloses a packed bed thermal storage device and a method for preparing thermal storage spheres. This packed bed thermal storage device uses thermal storage spheres as thermal storage units, and achieves enhanced heat and mass transfer through methods such as split-type single-tank solid-phase filling or double-layer variable-diameter sphere arrangement. However, this thermal storage device is limited by the theoretical limit of close-packing of equal-diameter spheres, resulting in a relatively low thermal storage density. Summary of the Invention

[0004] This application provides a well-shaped stacked filled bed thermal storage device and its operation method, which aims to improve thermal storage density, thermal storage rate and thermal storage capacity utilization, effectively reduce the internal temperature gradient of the bed, enhance the system's adaptability to fluctuating heat sources, and thus ensure long-term operational reliability.

[0005] On one hand, this application provides a well-shaped stacked packed bed thermal storage device, comprising:

[0006] A thermal storage chamber having a top and a bottom in the height direction;

[0007] The heat storage chamber has a circulation chamber at its top and a circulation chamber at its bottom, and the circulation chamber is connected to the heat storage chamber; the cavity wall of the circulation chamber has an opening for the medium to enter or flow out of the circulation chamber;

[0008] Multiple heat storage components, wherein the heat storage components are strip-shaped, and the multiple heat storage components are stacked in the heat storage chamber;

[0009] A heat charging auxiliary unit is located at the lower part of the heat storage chamber. The heat charging auxiliary unit includes a heat charging diversion structure located inside the heat storage chamber and a heat charging bypass inlet located outside the heat storage chamber. The heat charging bypass inlet is connected to the heat charging diversion structure to introduce the medium into the heat charging diversion structure. The heat charging diversion structure includes a plurality of first output holes.

[0010] A heat release auxiliary unit is located at the upper part of the heat storage chamber. The heat release auxiliary unit includes a heat release diversion structure located inside the heat storage chamber and a heat release bypass inlet located outside the heat storage chamber. The heat release bypass inlet is connected to the heat release diversion structure to introduce the medium into the heat release diversion structure. The heat release diversion structure includes a plurality of second output holes.

[0011] In some embodiments, the plurality of heat storage components include a plurality of first heat storage components and a plurality of second heat storage components. Parts of the plurality of first heat storage components are spaced apart along the length direction of the heat storage chamber to form a first heat storage unit. Parts of the plurality of second heat storage components are spaced apart along the depth direction of the heat storage chamber to form a second heat storage unit. Along the height direction of the heat storage chamber, the first heat storage unit and the second heat storage unit are alternately disposed in the heat storage chamber.

[0012] In some embodiments, the heat charging and diversion structure includes a first inlet pipe and a first diversion pipe connected together. The first inlet pipe is connected to the heat charging bypass inlet, and a plurality of first outlet holes are spaced apart on the first diversion pipe, with the first outlet holes facing the top of the heat storage chamber.

[0013] The heat release diversion structure includes a second inlet pipe and a second diversion pipe connected together. The second inlet pipe is connected to the heat charging bypass inlet. A plurality of second output holes are spaced apart on the second diversion pipe, and the second output holes face the top of the heat storage chamber.

[0014] In some embodiments, adjacent first and second thermal storage units together form a plurality of flow channels for the flow of the medium; the plurality of flow channels are interconnected.

[0015] The first heat storage elements in two first heat storage units adjacent to the same second heat storage unit are alternately arranged along the length of the heat storage chamber.

[0016] In some embodiments, the inner wall of the heat storage chamber has at least one set of occupant structures, and the outermost first heat storage element of any of the adjacent first heat storage units abuts against the occupant structures.

[0017] In some embodiments, the first heat storage element and the second heat storage element are provided with a plurality of annular grooves in their respective length directions, and the groove width and / or groove depth of at least some adjacent annular grooves are different from each other.

[0018] In some embodiments, the heat storage component includes a heat storage carrier and a heat storage filler, the heat storage carrier having a cavity, and the heat storage filler filling the cavity.

[0019] In some embodiments, a support and positioning structure is provided between the heat storage chamber and the circulation chamber, and the support and positioning structure is a porous structure.

[0020] In some embodiments, the flow chamber has a blocking side and an opening side in the length direction, and the opening side has the opening; a flow equalization element is provided between the flow chamber and the heat storage chamber, the flow equalization element including a plurality of connecting channels arranged along the length direction of the flow chamber to connect the flow chamber and the heat storage chamber, wherein the length direction of the flow chamber is parallel to the length direction of the heat storage chamber.

[0021] In some embodiments, the flow chamber is further provided with a flow guiding component, which is disposed on the side of the flow equalization element near the flow chamber. The flow guiding component includes a plurality of flow guiding plates, which are disposed on one end of the communication channel near the flow chamber and connected to the flow equalization element.

[0022] The guide plate bends and extends from the connecting channel toward the opening side.

[0023] In some embodiments, along the height direction of the heat storage chamber, the diameter of the heat storage element near the top of the heat storage chamber is smaller than the diameter of the heat storage element near the bottom of the heat storage chamber.

[0024] On the other hand, embodiments of this application provide an operation method for a well-shaped stacked packed bed thermal storage device, applicable to the aforementioned well-shaped stacked packed bed thermal storage device.

[0025] The well-shaped packed bed thermal storage device is heated by a first heat transfer fluid. During the heating process, the first heat transfer fluid enters from the opening of the flow chamber at the top of the thermal storage chamber. The heating process includes:

[0026] The first temperature, the second temperature, the third temperature and the fourth temperature are obtained, wherein the first temperature is the temperature when the first heat transfer fluid enters the opening of the flow chamber at the top of the heat storage chamber, the second temperature is the temperature of the heat storage element at the top of the heat storage chamber, the third temperature is the temperature of the heat storage element at the top of the heat charging auxiliary unit, and the fourth temperature is the temperature when the first heat transfer fluid flows out of the opening of the flow chamber at the bottom of the heat storage chamber.

[0027] If the difference between the first temperature and the second temperature is greater than the first preset temperature difference, the first heat transfer fluid is continuously introduced; if the difference between the first temperature and the second temperature is less than the first preset temperature difference, and the difference between the first temperature and the third temperature is less than the first preset temperature difference, the first heat transfer fluid is introduced from the heat charging auxiliary unit into the lower part of the heat storage chamber; if the first temperature is less than the second temperature but the difference between the first temperature and the third temperature is greater than the first preset temperature difference, the first heat transfer fluid is introduced from the heat charging auxiliary unit into the lower part of the heat storage chamber; wherein, the first preset temperature difference is a preset temperature difference between the heat storage component and the first temperature; the value range of the first preset temperature difference is not less than 5°C, and is less than the difference between the first temperature and the melting point of the heat storage filling material in the heat storage component;

[0028] If the difference between the first temperature and the fourth temperature is less than the first preset temperature difference, then the heating process is complete.

[0029] The well-shaped stacked packed bed thermal storage device releases heat through a second heat transfer fluid. During the heat release process, the second heat transfer fluid enters from the opening of the flow chamber at the bottom of the thermal storage chamber. The heat release process includes:

[0030] The fifth temperature, the sixth temperature, and the seventh temperature are obtained, wherein the fifth temperature is the temperature at which the second heat transfer fluid enters the opening of the flow chamber at the bottom of the heat storage chamber, the sixth temperature is the temperature of the heat storage element at the lower end of the heat release auxiliary unit, and the seventh temperature is the temperature at which the second heat transfer fluid flows out of the opening of the flow chamber at the top of the heat storage chamber.

[0031] If the difference between the sixth temperature and the fifth temperature is greater than the second preset temperature difference, the second heat transfer fluid is continuously introduced; if the difference between the sixth temperature and the fifth temperature is less than the second preset temperature difference, the second heat transfer fluid is introduced from the heat release auxiliary unit into the upper part of the heat storage chamber; wherein, the second preset temperature difference is not less than 2°C and is less than the difference between the melting point of the heat storage filling material in the heat storage component and the fifth temperature.

[0032] If the difference between the seventh temperature and the fifth temperature is less than the second preset temperature difference, then heat release is complete.

[0033] This application provides a well-shaped stacked filled bed thermal storage device and its operation method. The well-shaped stacked filled bed thermal storage device includes a thermal storage chamber, a circulation chamber, and multiple strip-shaped thermal storage elements. By filling the thermal storage chamber with strip-shaped thermal storage elements, a higher filling rate can be achieved than that of spherical thermal storage elements, thereby effectively increasing the volume of phase change material in the thermal storage chamber and thus improving the volumetric thermal storage density of the thermal storage device.

[0034] Meanwhile, the thermal storage device arranges strip-shaped thermal storage components parallel to each other along the length of the thermal storage chamber to form a first thermal storage unit, and arranges strip-shaped thermal storage components parallel to each other along the depth of the thermal storage chamber to form a second thermal storage unit. The second thermal storage units are alternately arranged in the thermal storage chamber along the height of the thermal storage chamber, so that the thermal storage components of adjacent upper and lower layers are perpendicular or staggered to each other, which is conducive to uniform gaps between adjacent thermal storage components and reduces waste of interlayer space. At the same time, this layout can induce turbulence, so that the medium can form multi-directional contact with the thermal storage components during the flow process, which helps to improve the heat exchange area and heat exchange efficiency.

[0035] In addition, by using the heat charging auxiliary unit and the heat release auxiliary unit, the heat transfer fluid is guided and the heat is evenly distributed, which further improves the heat charging and releasing rate and the utilization rate of heat storage capacity. At the same time, it improves the uniformity of temperature distribution inside the bed and enhances the system's adaptability to intermittent heat sources and operational reliability. Attached Figure Description

[0036] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0037] Figure 1 This is a schematic diagram of the structure of the well-shaped stacked packed bed thermal storage device provided in the embodiments of this application;

[0038] Figure 2 This is a schematic diagram of the first heat-charging and diversion structure provided in the embodiments of this application;

[0039] Figure 3 This is a schematic diagram of the second heat-charging and diversion structure provided in the embodiments of this application;

[0040] Figure 4 This is a schematic diagram of the heat dissipation and diversion structure provided in the embodiments of this application;

[0041] Figure 5 This is a schematic diagram of the heat storage component arrangement of the well-shaped stacked filled bed heat storage device provided in the embodiments of this application;

[0042] Figure 6 A schematic diagram of the structure of the first type of heat storage component of the well-shaped stacked filled bed heat storage device provided in the embodiments of this application;

[0043] Figure 7 This is a schematic diagram of the structure of a second type of heat storage component in the well-shaped stacked filled bed heat storage device provided in the embodiments of this application;

[0044] Figure 8 This is a schematic diagram of the structure of a first type of first thermal storage unit provided in an embodiment of this application;

[0045] Figure 9This is a schematic diagram of the structure of the second type of first thermal energy storage unit provided in the embodiments of this application;

[0046] Figure 10 This is a cross-sectional schematic diagram of the heat storage component provided in the embodiments of this application;

[0047] Figure 11 Cross-sectional schematic diagrams of four other heat storage components provided in the embodiments of this application.

[0048] Figure label:

[0049] 100-Heat storage chamber; 120-Heat charging auxiliary unit; 121-Heat charging bypass inlet; 122-Heat charging diversion structure; 122a-First inlet pipe; 122b-First diversion pipe; 122c-First outlet hole; 130-Heat release auxiliary unit; 131-Heat release bypass inlet; 132-Heat release diversion structure; 132a-Second inlet pipe; 132b-Second diversion pipe; 132c-Second outlet hole; 140-Supporting and positioning structure; 150-Occupying structure; 160-Insulation layer;

[0050] 200 - Flow chamber; 201 - Connecting channel; 202 - Guide plate; 210 - Opening side; 220 - Blocking side;

[0051] 300 - Heat storage component; 301 - First heat storage component; 302 - Second heat storage component; 303 - Annular groove; 310 - First heat storage unit; 320 - Second heat storage unit; 330 - Heat storage carrier; 340 - Heat storage filler; 350 - Reinforcing rib.

[0052] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0053] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0054] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in a sequence other than those illustrated or described herein.

[0055] In this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0056] In related technologies, thermal storage devices enhance heat and mass transfer through methods such as split-type single-tank solid-phase filling or double-layer variable-diameter spherical arrangement. The thermal storage unit of this device is a thermal storage sphere, which includes an encapsulated shell and an internal phase change material. The phase change material absorbs or releases a large amount of latent heat during its solid-liquid or solid-solid phase change process, achieving energy storage and release. However, the thermal storage spheres in these devices are limited by the theoretical limit of close-packing of equal-diameter spheres, with a packing ratio of only π / 6≈52.36%, which can only be achieved when the radius is sufficiently large and the packing ratio is not considered, resulting in a low thermal storage density. Secondly, when the radius is sufficiently large, the effective heat transfer area of ​​the thermal storage sphere decreases, which is detrimental to heat exchange between the heat transfer fluid and the phase change material. Furthermore, the manufacturing process of the thermal storage spheres is complex, leading to high costs.

[0057] While the disordered filling strategy employed in this type of thermal storage device can enhance turbulent heat transfer to some extent, it also leads to a sharp increase in flow resistance, resulting in low heat transfer efficiency.

[0058] Furthermore, existing filled bed thermal storage devices mostly employ a fixed single-flow-path mode, which easily leads to uneven heating of the upper and lower thermal storage components during the charging process. The upper thermal storage components, continuously in contact with the high-temperature fluid, heat up rapidly, while the lower thermal storage components, due to the extended heat transfer path and the gradual decrease in fluid temperature, exhibit a significantly delayed charging response, even forming melting "dead zones." This non-uniformity limits the device's efficient charging capacity during periods of ample sunlight or in off-peak electricity price windows, and also results in an unbalanced temperature distribution within the bed. Similar non-uniformity exists during heat release, further weakening the system's energy release efficiency and operational stability. Inconsistent thermal response not only reduces the capacity utilization rate of the thermal storage system but may also affect the long-term reliability of the thermal storage materials and structure due to localized overheating or accumulated temperature stress.

[0059] Based on this, this application provides a well-shaped stacked filled bed thermal storage device and its operation method, which can improve the thermal storage density, thermal storage rate and thermal storage capacity utilization, effectively reduce the internal temperature gradient of the bed, enhance the system's adaptability to fluctuating heat sources, and thus ensure long-term operational reliability.

[0060] The thermal storage device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0061] The well-shaped stacked packed bed thermal storage device provided in this application includes a thermal storage chamber, a circulation chamber, and multiple thermal storage components. For ease of explanation, the well-shaped stacked packed bed thermal storage device will be referred to as a thermal storage device below.

[0062] Please see Figures 1 to 4 The thermal storage device contains a thermal storage chamber 100 and a circulation chamber 200. The thermal storage chamber 100 has a top and a bottom in the vertical direction, and each of the top and bottom ends has a circulation chamber 200. The circulation chambers 200 and the thermal storage chamber 100 can be connected through a flow equalization structure. A main inlet and outlet are provided on one side wall of the circulation chamber 200 for the heat transfer medium to enter or exit the circulation chamber 200. The heat transfer medium can be a gas or a liquid. The heat transfer medium can exist in fluid form within the thermal storage device, thus forming a heat transfer fluid.

[0063] The heat storage chamber 100 provides a working space for the strip-shaped heat storage components 300. The enclosed structure of the heat storage chamber 100 maintains a stable internal temperature, reduces heat loss to the outside, and provides a suitable temperature environment for the phase change heat storage process. The heat storage chamber 100 is connected to the flow chamber 200 at both ends in the height direction, forming a medium flow path of "flow chamber 200 - heat storage chamber 100 - flow chamber 200," ensuring that the heat transfer medium can penetrate the entire heat storage space and exchange heat with all the strip-shaped heat storage components 300. At least one heat charging auxiliary unit 120 and one heat dissipation auxiliary unit 130 are respectively provided in the lower and upper parts of the heat storage chamber 100 to guide the bypass flow of a portion of the heat transfer medium.

[0064] The flow chamber 200 is used for the introduction or exit of the heat transfer medium, enabling buffering, guiding, and equalizing of the heat transfer medium. The flow chamber 200 has an opening in its wall for the heat transfer medium to enter or exit. When the heat transfer medium enters the flow chamber 200 through the opening, it passes through one of the flow chambers 200 into the heat storage chamber 100 to exchange heat with the heat storage element 300, and then flows out from the other flow chamber 200. This allows the heat transfer medium to flow within the heat storage device, ensuring sufficient contact between the heat transfer medium and the heat storage element 300.

[0065] In this configuration, when the heat storage device is charged, the flow chamber 200 at the top of the heat storage chamber 100 can serve as the inlet for the heat transfer medium to flow in, and the flow chamber 200 at the bottom of the heat storage chamber 100 can serve as the outlet for the heat transfer medium to flow out. When the heat storage device is released, the flow chamber 200 at the top of the heat storage chamber 100 can serve as the outlet, and the flow chamber 200 at the bottom of the heat storage chamber 100 can serve as the inlet. In this way, the flow of the heat transfer medium is ensured during the charging and releasing processes of the heat storage device.

[0066] The thermal storage device in this embodiment of the application further includes a heat charging auxiliary unit 120 and a heat release auxiliary unit 130. During the heat charging and heat release process of the thermal storage device, the heat charging auxiliary unit 120 and the heat release auxiliary unit 130 can guide part of the heat transfer fluid to bypass the section that has been fully heat exchanged and directly enter the downstream area where the heat charging and heat release are lagging, based on the internal temperature distribution of the bed, for targeted heat exchange.

[0067] The heat charging auxiliary unit 120 is located at the lower part of the heat storage chamber 100. The heat charging auxiliary unit 120 includes a heat charging diversion structure 122 located inside the heat storage chamber 100 and a heat charging bypass inlet 121 located outside the heat storage chamber 100. The heat charging bypass inlet 121 is connected to the heat charging diversion structure 122 to introduce a medium into the heat charging diversion structure 122. The heat charging diversion structure 122 includes a plurality of first output holes 122c.

[0068] The heat-charging and diversion structure 122 includes a first inlet pipe 122a and a first diversion pipe 122b that are connected to each other. The first inlet pipe 122a is connected to the heat-charging bypass inlet 121. A plurality of first outlet holes 122c are spaced apart on the first diversion pipe 122b and the first outlet holes 122c face the top of the heat storage chamber 100. The first outlet holes 122c can guide the heat transfer medium to the lower side of the first diversion pipe 122b.

[0069] The heat-filling and diversion structure 122 can adopt a pipe network structure composed of a main pipe and multiple branch pipes. The branch pipes are evenly distributed in the gaps between the heat storage units at the bottom of the heat storage chamber 100. The aperture and spacing of the first output hole 122c can be designed according to the gap size of the heat storage unit, so that the sprayed medium can evenly cover the heat storage component 300 at the bottom of the heat-filling and diversion structure 122.

[0070] During the heat storage device's charging operation, the heat transfer medium enters through the flow chamber 200 on the upper side of the heat storage chamber 100, and after initial uniform distribution, flows downward into the heat storage chamber 100. In the later stage of charging, when the temperature of the upper heat storage element 300 is close to the heat source temperature while the lower part is still at a relatively low temperature, the high-temperature heat transfer fluid can bypass through the charging auxiliary unit 120 to the lower part of the heat storage chamber 100, directly exchanging heat with the downstream heat storage element 300 to cool down. Due to natural convection, the heat transfer medium that has been cooled down can flow downward.

[0071] The heat release auxiliary unit 130 is located on the upper part of the heat storage chamber 100. The heat release auxiliary unit 130 includes a heat release diversion structure 132 located inside the heat storage chamber 100 and a heat release bypass inlet 131 located outside the heat storage chamber 100. The heat release bypass inlet 131 is connected to the heat release diversion structure 132 to introduce a medium into the heat release diversion structure 132. The heat release diversion structure 132 includes a plurality of second output holes 132c.

[0072] The heat dissipation diversion structure 132 includes a second inlet pipe 132a and a second diversion pipe 132b that are connected to each other. The second inlet pipe 132a is connected to the heat charging bypass inlet 121. A plurality of second outlet holes 132c are spaced apart on the second diversion pipe 132b and the second outlet holes 132c face the top of the heat storage chamber 100. The second outlet holes 132c can guide the heat transfer medium to the upper side of the second diversion pipe 132b.

[0073] In the heat release operation, the heat transfer medium enters through the flow chamber 200 at the bottom of the heat storage chamber 100, and after initial uniform distribution, flows upward into the heat storage chamber 100. In the later stage of heat release, when the upper heat storage component 300 still has a relatively high temperature, some of the low-temperature heat transfer fluid can bypass through the heat release auxiliary unit 130 to the upper middle part of the heat storage chamber 100 to directly extract the remaining heat energy. After the heat transfer fluid is heated, it flows upward.

[0074] Therefore, the heat storage device in this application embodiment effectively alleviates the temperature stratification phenomenon caused by the traditional fixed flow path through the heat charging auxiliary unit 120 and the heat dissipation auxiliary unit 130, significantly improves the overall utilization rate of heat charging and dissipation rate and heat storage capacity, and realizes rapid and deep heat charging and dissipation of the heat storage medium.

[0075] Please see Figure 1 and Figure 5 In some embodiments, the plurality of strip-shaped heat storage elements 300 include a plurality of first heat storage elements 301 and a plurality of second heat storage elements 302. Parts of the plurality of first heat storage elements 301 are spaced apart along the length direction of the heat storage chamber 100 and form a first heat storage unit 310. Parts of the plurality of second heat storage elements 302 are spaced apart along the depth direction of the heat storage chamber 100 and form a second heat storage unit 320. Furthermore, along the height direction of the heat storage chamber 100, the first heat storage unit 310 and the second heat storage unit 320 are alternately arranged in the heat storage chamber 100.

[0076] The strip-shaped heat storage element 300 contains a phase change material, which stores and releases heat through a phase change process. Specifically, heat is stored and released through endothermic melting and exothermic solidification. When a high-temperature heat transfer medium flows through the heat storage chamber 100, heat is transferred to the internal phase change material through the outer shell of the strip-shaped heat storage element 300. After absorbing heat, the phase change material changes from a solid to a liquid state, completing the heat storage process. When heat release is required, a low-temperature heat transfer medium flows through the heat storage chamber 100, and the phase change material releases heat, changing from a liquid to a solid state. The heat is then transferred to the medium through the outer shell, realizing the heat release process.

[0077] Compared to spherical heat storage components 300, strip-shaped heat storage components 300, due to their structural characteristics, have smaller gaps between adjacent strip-shaped heat storage components 300 during stacking, thus increasing the filling volume of the heat storage components 300 in the heat storage chamber 100. This, in turn, helps to increase the volume of phase change material within the heat storage chamber 100, effectively improving the heat storage density of the heat storage device. Furthermore, taking a circular cross-section strip-shaped heat storage component as an example, the packing ratio can reach up to π / 4≈78.5%, independent of the radius and depending only on the center distance between adjacent strip-shaped heat storage components 300. Therefore, the effective heat exchange area can be increased by reducing the radius.

[0078] The spherical thermal storage component 300 requires complex manufacturing processes such as mold injection, spherical grinding, and sealing welding, resulting in low raw material utilization, high packaging difficulty, and high unit thermal storage capacity cost. In contrast, the strip-shaped thermal storage component 300 in this embodiment has a simple structure, which facilitates the molding of the thermal storage component 300 and the encapsulation of the phase change material, thereby reducing raw material processing and assembly costs. For example, the strip-shaped thermal storage component 300 has a columnar structure, and its cross-section can be circular, rectangular, or polygonal. Its length is adapted to the length of the thermal storage chamber 100, and its diameter or equivalent diameter can be adaptively designed according to the depth and filling requirements of the thermal storage chamber 100.

[0079] In this embodiment, the strip-shaped heat storage element 300 forms a first heat storage unit 310 through the first heat storage element 301 and a second heat storage unit 320 through the second heat storage element 302. There are multiple sets of both the first heat storage unit 310 and the second heat storage unit 320. Along the height of the heat storage chamber 100, the first heat storage unit 310 and the second heat storage unit 320 are arranged alternately, so that the heat storage elements 300 of adjacent layers of heat storage units are staggered, forming flow channels for the heat transfer medium to circulate. Because the heat storage elements 300 of adjacent layers of heat storage units are staggered, it is beneficial for the flow channels to diverge along the height of the heat storage chamber 100, resulting in multiple flow channels that are crisscrossed and interconnected. This helps to induce turbulence, allowing the heat transfer medium to form multi-directional contact with the heat storage element 300 during flow, thereby helping to improve the heat exchange area and heat exchange efficiency.

[0080] Therefore, the thermal storage device provided in this embodiment uses a strip-shaped thermal storage element 300 instead of the spherical thermal storage element 300 in the related technology, which reduces the space waste caused by the multiple gaps between the spheres and increases the filling volume of the thermal storage phase change material, thereby helping to improve the thermal storage density of the thermal storage device. At the same time, the thermal storage device in this embodiment arranges the first thermal storage unit 310 and the second thermal storage unit 320 formed by the strip-shaped thermal storage element 300 alternately along the height direction, and disperses in the height direction of the thermal storage chamber 100. The gaps between the thermal storage elements 300 form multiple cross-sectional and interconnected flow channels, which helps to induce turbulence and improve the heat exchange area and heat exchange efficiency.

[0081] Furthermore, in some embodiments, please refer to Figure 1 and Figure 5 The adjacent first thermal storage unit 310 and second thermal storage unit 320 together form multiple flow channels for the flow of the medium, and the multiple flow channels are interconnected.

[0082] The adjacent first thermal storage unit 310 and second thermal storage unit 320, the first thermal storage element 301 in the first thermal storage unit 310 is spaced apart along the length direction, and the second thermal storage element 302 in the second thermal storage unit 320 is spaced apart along the depth direction. The gaps between the two are intersecting and connected to each other, thereby forming multiple flow channels for the flow of the medium. These flow channels are not independent and closed channels, but are interconnected through the intersection and alignment of the gaps between the thermal storage elements 300.

[0083] In addition, the heat storage elements 300 in the adjacent first heat storage unit 310 or second heat storage unit 320 can be arranged in the following manner: the first heat storage elements 301 in the two first heat storage units 310 adjacent to the same second heat storage unit 320 are alternately arranged along the length of the heat storage chamber 100.

[0084] In other words, along the length of the heat storage chamber 100, the projection of the central axis of the upper first heat storage element 301 lies in the gap between the two lower first heat storage elements 301, thus forming an arrangement structure in which the upper heat storage elements 300 fill the gaps in the lower layers. Furthermore, this alternating arrangement of the upper first heat storage elements 301, along with the second heat storage elements 302 arranged along the depth direction in the intermediate second heat storage unit 320, ensures that the upper first heat storage elements 301 and the lower heat storage elements 300 are arranged alternately along the length of the heat storage chamber 100. This ensures that the projections of the first heat storage elements 301 along the length direction do not overlap, allowing the upper first heat storage elements 301 to fill the gaps between the lower heat storage elements 300, thereby further improving the space utilization rate of the heat storage chamber 100.

[0085] In some embodiments, please refer to Figure 5The heat storage components 300 in two adjacent first heat storage units 310 or two second heat storage units 320 are arranged in a staggered manner.

[0086] For ease of description, the first thermal storage unit 310 is used as an example below. Specifically, the strip-shaped thermal storage elements 300 of the upper first thermal storage unit 310 and the strip-shaped thermal storage elements 300 of the lower first thermal storage unit 310 are staggered, that is, the thermal storage element 300 of one is located in the gap between two side-by-side thermal storage elements 300 of the other, so that the gap between two adjacent thermal storage elements 300 in the upper first thermal storage unit 301 and the gap between two adjacent thermal storage elements 300 in the lower first thermal storage unit 301 are staggered in the height direction of the thermal storage chamber 100.

[0087] In this way, when the heat transfer medium flows through two adjacent heat storage units of the same type, it needs to bypass the misaligned heat storage element 300, forming a local velocity change. This helps to break the laminar boundary layer and further induce turbulence, thereby strengthening the multi-directional contact between the heat transfer medium and the heat storage element 300 during the flow process, which helps to further improve the heat exchange area and heat exchange efficiency.

[0088] In some alternative embodiments, please refer to Figure 1 The inner wall of the heat storage chamber 100 has at least one set of occupant structures 150. The first heat storage element 301 of any one of the adjacent first heat storage units 310 abuts against the occupant structure 150, so that the upper first heat storage element 301 and the lower heat storage element 300 are arranged in a staggered manner in the length direction of the heat storage chamber 100.

[0089] The occupant structure 150 will occupy the lateral space of the first heat storage unit 310, causing the installation position of the first heat storage component 301 to be laterally offset, thereby causing the first heat storage component 301 to be misaligned with the first heat storage component 301 above or below it, and thus causing the upper first heat storage component 301 and the lower heat storage component 300 to be arranged in a misaligned manner along the length of the heat storage chamber 100.

[0090] During the installation of the heat storage component 300, if manual placement is relied upon to achieve the alternating arrangement of the heat storage components 300, the alternating structure is prone to failure due to installation errors or subsequent displacement. However, by using the spacer structure 150 to abut and limit the first heat storage unit 310, it is helpful to achieve the alternating arrangement of the first heat storage components 301 of the adjacent first heat storage units 310, which facilitates the placement of the heat storage components 300.

[0091] Furthermore, in some embodiments, please refer to Figure 1The occupant structure 150 includes two occupant protrusions located at the same height in the heat storage chamber 100, and positioned on opposite sides of the heat storage chamber 100 along its length. The two occupant protrusions abut against the two outermost first heat storage elements 301 of the first heat storage unit 310 at the same height.

[0092] The two spacer protrusions are located on the same height plane of the heat storage chamber 100. This height plane corresponds to the installation height of the corresponding first heat storage unit 310. That is, the central axis of all the first heat storage components 301 in the first heat storage unit 310 is parallel and coplanar with the height plane where the two spacer protrusions are located. This ensures that the spacer protrusions can accurately act on the radial sidewall of the first heat storage component 301, rather than the end or other non-stressed areas. At the same time, the two opposing spacer protrusions abut against each other in both directions, so that the left and right sides of the first heat storage unit 310 are subjected to equal support force, preventing the unit from tilting or deforming as a whole.

[0093] In some alternative embodiments, please refer to Figures 6 to 9 The first heat storage element 301 and the second heat storage element 302 are each provided with a plurality of annular grooves 303 in their respective length directions, and at least some of the adjacent annular grooves 303 have different groove widths and / or groove depths.

[0094] When the heat transfer medium flows along the surface of the heat storage element 300 within the heat storage chamber 100, it initially enters a laminar flow state upon contact with the surface of the heat storage element 300, resulting in low heat transfer efficiency in the laminar boundary layer near the surface. When the airflow passes through the annular groove 303, the abrupt change in groove width and / or groove depth causes an instantaneous alteration in the flow space, with the airflow velocity and direction adjusting synchronously. This directly impacts the laminar boundary layer, leading to boundary layer fragmentation and generating initial disturbances.

[0095] The airflow continues through the subsequent irregular annular grooves 303. Due to the size differences between adjacent grooves, vortices of varying scales are formed in different grooves. These vortices of different scales collide and merge in the inter-groove region, causing the overall airflow to transition into a state of irregular turbulence. After the airflow has passed through all the annular grooves 303, the turbulent field formed has diffused throughout the entire flow channel cross-section through airflow interaction, achieving full coverage. Even when the airflow enters adjacent thermal storage units, the turbulent state maintains a low attenuation rate, ensuring the enhanced heat transfer effect of the airflow throughout the entire process.

[0096] Therefore, by providing multiple annular grooves 303 with different widths and / or depths on the outer periphery of the heat storage element 300, this embodiment can form channels for medium flow that are randomly distributed and of different sizes among the heat storage elements 300, thereby promoting turbulence after the heat transfer medium flows through, which helps to increase the heat exchange between the heat transfer fluid and the heat storage element 300; at the same time, the channel can increase the contact area between the heat transfer fluid and the heat storage element 300 to enhance heat transfer.

[0097] For example, please refer to Figures 6 to 9 The maximum outer diameter of the heat storage element 300 is 40mm, the wall thickness of the heat storage element 300 is 2mm, and the distance between the axes of two adjacent heat storage elements 300 is 42mm to 45mm. Among them, the width and depth of adjacent annular grooves 303 on the heat storage element 300 are not equal, and the groove depth of the annular groove 303 is 1.5mm less than the wall thickness.

[0098] In some alternative embodiments, please refer to Figure 10 The heat storage component 300 includes a heat storage carrier 330 and a heat storage filler 340. The heat storage carrier 330 has a cavity, and the heat storage filler 340 fills the cavity.

[0099] The heat storage carrier 330 is the outer shell of the heat storage component 300. The heat storage carrier 330 encapsulates the heat storage filler 340 in the cavity through a sealed tubular structure, which prevents the heat storage filler 340 from leaking during the phase change process. At the same time, it isolates the external airflow from direct contact with the heat storage filler 340, preventing the filler from being oxidized or contaminated. On the other hand, thanks to the high thermal conductivity of the material, the heat from the external airflow is quickly transferred to the internal heat storage filler 340, or the heat released by the heat storage filler 340 is transferred to the external airflow.

[0100] The heat storage carrier 330 can be in the shape of a long strip tube. Its material is selected from metal, ceramic or alloy materials with high temperature resistance and high thermal conductivity to ensure rapid heat transfer and long-term resistance to the phase change temperature of the heat storage filler 340.

[0101] The heat storage filler 340 achieves efficient heat storage and release through phase change. It can be selected from phase change materials, such as paraffin-based, fatty acid-based organic phase change materials, or salt-based, metal alloy-based inorganic phase change materials, or composite phase change materials.

[0102] The thermal storage medium 330 can be selected based on the compatibility and corrosivity of the thermal storage filler 340, as well as the thermal storage temperature range. For example, the thermal storage medium 330 may be made of stainless steel, and the thermal storage filler 340 may be paraffin wax. The stainless steel can be 304 stainless steel, which has good high-temperature resistance and corrosion resistance.

[0103] In some embodiments, please refer to Figure 11 The inner wall of the heat storage carrier 330 is provided with reinforcing ribs 350. Multiple reinforcing ribs 350 can be provided, and the multiple reinforcing ribs 350 are spaced apart along the circumference of the inner cavity of the heat storage carrier 330. The reinforcing ribs 350 increase the contact area between the heat storage carrier 330 and the heat storage filler 340, thereby improving the heat exchange efficiency between the heat storage filler 340 and the heat storage carrier 330, which helps to improve the overall heat transfer efficiency between the heat storage component 300 and the external heat transfer medium.

[0104] Furthermore, in this embodiment, the reinforcing ribs 350 can enhance the structural strength of the heat storage carrier 330, thereby improving its resistance to bending deformation.

[0105] In some alternative embodiments, please refer to Figure 1 A support and positioning structure 140 is provided between the heat storage chamber 100 and the circulation chamber 200. The support and positioning structure 140 is a porous structure.

[0106] The support and positioning structure 140 provides auxiliary support for the first thermal storage unit 310 and the second thermal storage unit 320. The support and positioning structure 140 evenly distributes the local gravity borne by each through hole to the entire structure, and then transfers it to the wall of the thermal storage chamber 100 through the connection structure between the edge of the support and positioning structure 140 and the inner wall of the thermal storage chamber 100. Finally, the entire structure is supported by the cavity wall of the thermal storage chamber 100, thus avoiding local overload and bending deformation of the thermal storage component 300.

[0107] Because the support and positioning structure 140 is porous, the heat transfer medium can directly pass through the through-holes from one of the heat storage units into the adjacent heat storage units without bypassing the support and positioning structure 140, thus not affecting the flow of the heat transfer fluid. At the same time, the porous structure on the support and positioning structure 140 can disperse the flow path of the heat transfer medium, which helps to increase the probability of contact between the heat transfer medium and the heat storage element 300 near the cavity wall of the heat storage chamber 100, thereby improving the heat transfer efficiency.

[0108] In this design, the pore size of the support and positioning structure 140, while sufficiently supporting the weight of the thermal storage unit, can strike a balance between saving material usage and promoting the most uniform distribution of heat transfer fluid. It can be understood that a larger pore size results in a higher proportion of non-material areas in the support and positioning structure 140 plate, less material usage per unit, and lower manufacturing costs; conversely, a smaller pore size results in a smaller through-hole diameter, higher distribution density, stronger airflow diversion effect, and easier and more uniform airflow distribution to each thermal storage rod, avoiding insufficient heat exchange in the edge areas of the thermal storage rods.

[0109] In some embodiments, the heat storage chamber 100 is filled with at least two different heat storage fillers 340. The heat storage fillers 300 in the upper part of the heat storage chamber 100 are filled with heat storage fillers 340 with higher melting points, and the heat storage fillers 300 in the lower part of the heat storage chamber 100 are filled with heat storage fillers 340 with lower melting points, in order to match the temperature slip characteristics of the heat transfer fluid. The heat storage fillers 300 with the two heat storage fillers 340 having different melting points can be separated by the support and positioning structure 140.

[0110] In some alternative embodiments, in the height direction of the heat storage chamber 100, the diameter of the heat storage element 300 near the top of the heat storage chamber 100 is smaller than the diameter of the heat storage element 300 near the bottom of the heat storage chamber 100.

[0111] During the heat storage process, the temperature of the heat transfer fluid gradually decreases along the flow direction. Specifically, during heat charging, the heat storage element 300 at the inlet section has a high temperature, a large temperature difference, and good heat exchange effect; during heat release, the heat storage element 300 at the outlet section has a low temperature, a small temperature difference, and poor heat exchange effect. Therefore, a larger diameter heat storage element 300 is arranged on the upper side of the heat storage chamber 100 to increase the amount of heat storage material used in the heat storage device; a smaller diameter heat storage element 300 is arranged on the lower side of the heat storage chamber 100 to increase the heat exchange area to match the temperature slip characteristics of the heat transfer fluid, thereby improving the heat storage rate density of the heat storage device.

[0112] In some embodiments, the diameter of the upper heat storage element 300 of the heat storage chamber 100 is larger than the diameter of the lower heat storage element 300, so as to improve the heat exchange rate at the end of the heat storage device charging period.

[0113] The flow chamber 200 has a certain length, and its length direction is the same as that of the heat storage chamber 100. The depth direction of the flow chamber 200 is also consistent with that of the heat storage chamber 100. In this way, the flow chamber 200 provides sufficient buffer space for the medium and reduces the possibility of medium stagnation due to excessive cavity size. The flow chamber 200 has a blocking side 220 and an opening side 210 along its length. The opening side 210 has an opening, which is the port for the heat transfer medium to enter or exit the flow chamber 200. The blocking side 220 is a closed structure and can be the side wall of the flow chamber 200, preventing the heat transfer medium from entering or exiting through the blocking side 220. Multiple connecting channels 201 are provided between the flow chamber 200 and the heat storage chamber 100 to connect the flow chamber 200 and the heat storage chamber 100.

[0114] In some embodiments, a flow equalization element is provided between the flow chamber 200 and the heat storage chamber 100. The flow equalization element includes a plurality of connecting channels 201 arranged along the length direction of the flow chamber 200 to connect the flow chamber 200 and the heat storage chamber 100; wherein the length direction of the flow chamber 200 is parallel to the length direction of the heat storage chamber 100.

[0115] The flow equalization element, through its multiple connecting channels 201, allows the heat transfer fluid flowing into the circulation chamber 200 to be split at the flow equalization element, thereby enabling the heat transfer fluid to enter the heat storage chamber 100 through each connecting channel 201, achieving near-uniform flow into the heat storage chamber 100 and increasing the diffusion area of ​​the heat transfer fluid within the heat storage chamber 100. The multiple connecting channels 201 can be evenly spaced on the flow equalization element, which helps to ensure uniform distribution of the heat transfer fluid on the flow equalization element.

[0116] The flow chamber 200 is also provided with a flow guiding assembly, which is located on the side of the flow equalization component near the flow chamber 200. The flow guiding assembly includes multiple flow guide plates 202, which are located at one end of the connecting channel 201 near the flow chamber 200 and connected to the flow equalization component. The flow guide plates 202 bend and extend from the connecting channel 201 toward the opening side.

[0117] The guide plate 202 is located at the end of the connecting channel 201 and can guide the heat transfer medium flowing into or out of the circulation chamber 200. Since the guide plate 202 bends and extends from the connecting channel 201 toward the opening side, the heat transfer medium flowing into the circulation chamber 200 can flow along the direction defined by the guide plate 202, which helps the heat transfer medium to flow into the connecting channel 201 and into the heat storage chamber 100, and helps the heat transfer medium to flow out of the connecting channel 201 and to the opening 210 of the opening side of the circulation chamber 200.

[0118] Furthermore, since multiple guide plates 202 can be arranged at intervals along the length of the flow chamber 200 at each connecting channel 201, it further helps the heat transfer medium to flow evenly in the flow chamber 200 and promotes the heat transfer fluid to enter and exit the heat storage chamber 100 evenly.

[0119] The guide plate 202 can be a streamlined plate structure. The guide plate 202 can alter and guide the heat transfer fluid flow into the connecting channel 201 through its own structure. The guide component works in conjunction with the flow equalization component to guide the heat transfer fluid into the heat storage chamber 100 in a uniform and dispersed manner, where it exchanges heat with the heat storage component 300. This helps eliminate the melting or solidification dead zones of the phase change material within the heat storage component 300, improves the heat charging rate and heat storage capacity utilization, and effectively reduces the internal temperature gradient of the heat storage device, thereby improving the service life of the heat storage device. In some embodiments, a thermal insulation layer 160 is provided between the inner and outer shells of the heat storage chamber 100 and the flow chamber 200 to improve the heat storage performance of the heat storage device. The thermal insulation layer 160 uses thermal insulation material, which can be organic, inorganic, or composite thermal insulation material.

[0120] On the other hand, this application also provides an operation method for a well-shaped stacked packed bed thermal storage device, applicable to any of the well-shaped stacked packed bed thermal storage devices described above. The well-shaped stacked packed bed thermal storage device has a heat charging process and a heat release process.

[0121] During the heat charging process, the well-shaped packed bed thermal storage device is heated by a high-temperature first heat transfer fluid. The first heat transfer fluid enters from the opening of the flow chamber 200 at the top of the thermal storage chamber 100. The heat charging process includes:

[0122] The first temperature, second temperature, third temperature, and fourth temperature are acquired in real time. The first temperature is the temperature when the first heat transfer fluid enters the opening of the flow chamber 200 at the top of the heat storage chamber 100; the second temperature is the temperature of the heat storage element 300 at the top of the heat storage chamber 100; the third temperature is the temperature of the heat storage element 300 at the upper end of the heat charging auxiliary unit 120; and the fourth temperature is the temperature when the first heat transfer fluid flows out of the opening of the flow chamber 200 at the bottom of the heat storage chamber 100.

[0123] If the difference between the first temperature and the second temperature is greater than the first preset temperature difference, the first heat transfer fluid is continuously introduced. At this time, both the top heat storage component 300 and the middle heat storage component 300 are in a state of high-efficiency heat absorption.

[0124] If the difference between the first temperature and the second temperature is less than the first preset temperature difference and the difference between the first temperature and the third temperature is less than the first preset temperature difference, then the first heat transfer fluid is introduced from the heat charging auxiliary unit 120 into the lower part of the heat storage chamber 100.

[0125] If the first temperature is lower than the second temperature but the difference between the first temperature and the third temperature is greater than the first preset temperature difference, it indicates that the heat source temperature is lower than the temperature of the upper heat storage component but still higher than the temperature of the lower heat storage component. In this case, the first heat transfer fluid is introduced from the heat charging auxiliary unit 120 into the lower part of the heat storage chamber 100.

[0126] When the difference between the first temperature and the second temperature is less than the first preset temperature difference, and the difference between the first temperature and the third temperature is less than the first preset temperature difference, it indicates that all the strip-shaped heat storage elements 300 from the top to the upper end of the heat charging auxiliary unit 120 have completed heat charging, that is, the leading edge of the inclined temperature layer shrinks from the top of the heat storage chamber 100 to the heat charging auxiliary unit 120. The heat storage elements 300 at the bottom of the heat charging auxiliary unit 120 still have sufficient heat storage potential. At this time, the first heat transfer fluid can reduce or stop entering from the opening of the top flow chamber 200, and enter the heat charging diversion structure 122 of the heat charging auxiliary unit 120 from the heat charging bypass inlet 121 outside the heat storage chamber 100, and be evenly sprayed onto the heat storage elements 300 at the bottom of the heat storage chamber 100 through multiple first output holes 122c on the branch pipe wall, thereby improving the heat charging rate of the entire heat storage device.

[0127] If the difference between the first temperature and the fourth temperature is less than the first preset temperature difference and the accumulated heat charge reaches a certain proportion (90% to 95%) of the theoretical total heat storage capacity, then the heat charge is complete. That is to say, the temperature of the strip heat storage element 300 at the bottom of the heat storage chamber 100 has risen above the melting point of the phase change heat storage material, and all heat storage units along the height direction of the heat storage chamber 100 have reached the saturated heat storage state.

[0128] It should be noted that the first, second, third, and fourth temperatures can all be acquired using temperature sensors. The method for obtaining the cumulative heat charge is common knowledge in this technical field and will not be elaborated upon here. The first heat transfer fluid can be high-temperature heat transfer oil, high-temperature air, high-temperature nitrogen, etc.

[0129] A temperature sensor for collecting the first temperature can be installed at the opening of the flow chamber 200 at the top of the heat storage chamber 100. A temperature sensor for collecting the second temperature can be attached to the sealed outer shell of the strip-shaped heat storage element 300 of the top first heat storage unit 310. A temperature sensor for collecting the third temperature can be installed on the outer shell of the strip-shaped heat storage element 300 of the second heat storage unit 320 in the middle of the heat storage chamber 100, at the upper end of the heating auxiliary unit 120. A temperature sensor for collecting the fourth temperature can be installed at the opening of the flow chamber 200 at the bottom of the heat storage chamber 100.

[0130] The first preset temperature difference is not less than 5°C and is less than the difference between the first temperature and the melting point of the heat storage filler (phase change material) inside the heat storage component 300, thereby ensuring that there is a sufficient heat exchange temperature difference between the first heat transfer fluid and the heat storage component 300 to drive heat to be efficiently transferred from the first heat transfer fluid to the phase change material inside the heat storage component 300, so as to cause the phase change material to undergo solid-liquid phase change and store latent heat.

[0131] In the later stages of the heat storage device in this embodiment, the temperature of the heat storage element 300 at the top of the heat storage chamber 100 approaches the temperature when the first heat transfer fluid enters the heat storage device, indicating that it has been basically fully charged. However, the temperature of the heat storage element 300 at the bottom of the heat storage chamber 100 is lower and it is not yet fully charged. As a result, a sloped temperature layer region is formed in the area of ​​the heat storage chamber 100 near the outlet of the first heat transfer fluid, and this sloped temperature layer region continuously moves towards the outlet of the first heat transfer fluid as the heat storage progresses. Therefore, in order to reduce the thickness of the sloped temperature layer and make full use of the phase change material inside the heat storage element 300, the first heat transfer fluid is bypassed into the lower part of the heat storage chamber 100 through the heat storage auxiliary unit 120 in the later stages of the heat storage, thereby increasing the heat exchange temperature difference in the sloped temperature layer region at the bottom of the heat storage chamber 100 and accelerating the heat storage in the sloped temperature layer region. In addition, for heat sources with fluctuating temperatures, if the temperature does not meet the charging conditions of the top heat storage unit 300 but meets the charging conditions of the heat storage unit 300 below the heat storage auxiliary unit 120, the first heat transfer fluid can be used to preheat the heat storage unit 300 at the bottom of the heat storage chamber 100.

[0132] The well-shaped packed bed thermal storage device releases heat through a low-temperature second heat transfer fluid. During the heat release process, the second heat transfer fluid enters from the opening of the flow chamber 200 at the bottom of the thermal storage chamber 100. The heat release process includes:

[0133] The fifth temperature, the sixth temperature, and the seventh temperature are obtained, wherein the fifth temperature is the temperature at which the second heat transfer fluid enters the opening of the flow chamber 200 at the bottom of the heat storage chamber 100, the sixth temperature is the temperature of the heat storage element 300 at the lower end of the heat release auxiliary unit 130, and the seventh temperature is the temperature at which the second heat transfer fluid enters the opening of the flow chamber 200 at the top of the heat storage chamber 100.

[0134] If the difference between the sixth temperature and the fifth temperature is greater than the second preset temperature difference, the second heat transfer fluid will continue to be introduced.

[0135] If the difference between the sixth temperature and the fifth temperature is less than the second preset temperature difference, it indicates that the phase change material inside the heat storage component 300 at the lower end of the heat release auxiliary unit 130 has finished releasing heat. Then, the second heat transfer fluid is introduced from the heat release auxiliary unit 130 into the upper part of the heat storage chamber 100. The second heat transfer fluid stops flowing in from the opening of the bottom flow chamber 200 and instead enters the heat release diversion structure 132 of the heat release auxiliary unit 130 from the heat release bypass inlet 131 outside the heat storage chamber 100. It is then evenly sprayed onto the heat storage component 300 at the upper part of the heat storage chamber 100 through multiple second output holes 132c on the branch pipe wall.

[0136] If the difference between the seventh temperature and the fifth temperature is less than the second preset temperature difference, or if the seventh temperature is lower than the lower limit of the heat release temperature, then the heat release is completed, ensuring that the heat release temperature is always higher than the required minimum value.

[0137] It should be noted that the fifth, sixth, and seventh temperatures can all be acquired using temperature sensors. The second heat transfer fluid can be cryogenic air / nitrogen / argon, cryogenic heat transfer oil, cryogenic water, etc. The second preset temperature difference can also be determined based on the solidification temperature of the phase change material used in the heat storage device. That is, the second preset temperature difference is not less than 2℃ and is less than the difference between the solidification point of the heat storage filling material (phase change material) inside the heat storage element 300 and the fifth temperature. This ensures that there is a sufficient temperature gradient between the heat storage element 300 and the second heat transfer fluid, driving the phase change material inside the heat storage element 300 to release latent heat through solid-liquid phase change and transfer the heat to the second heat transfer fluid. The lower limit of the heat release temperature is the minimum allowable temperature set according to the heat consumption requirements. When the seventh temperature is less than this value, it indicates that the temperature of the heat storage element 300 at the top of the heat storage chamber is close to the minimum allowable value, and continued heat release may cause the output temperature to be lower than required.

[0138] In the early stage of heat release, the second heat transfer fluid enters the circulation chamber 200 from the opening at the bottom of the heat storage chamber 100. The heat storage element 300 at the bottom of the heat storage chamber 100 still has a high temperature and there is a sufficient heat exchange temperature difference between it and the second heat transfer fluid. The heat storage element 300 in the area above the heat release auxiliary unit 130 has not completely released heat.

[0139] At this time, the second heat transfer fluid with a lower temperature enters the heat storage chamber 100 through the flow guiding component and flow equalization component of the bottom flow chamber 200 of the heat storage device. The second heat transfer fluid first exchanges heat with the heat storage component 300 at the bottom of the heat storage device and is heated. The solid sensible heat of the heat storage carrier 330 and the liquid sensible heat of the heat storage filler 340, the latent heat of solidification of the heat storage filler 340 and the solid sensible heat of the heat storage filler 340 are successively removed. The heat storage component 300 is cooled down, the temperature is maintained, and then cooled down again.

[0140] Subsequently, the second heat transfer fluid continues to flow towards the top of the heat storage chamber 100, exchanging heat with the heat storage component 300 step by step from bottom to top, achieving orderly and efficient heat extraction; the fluid finally flows out from the top circulation chamber 200, providing heat energy to the user end.

[0141] After a period of heat release, the temperature of the heat storage element 300 inside the heat storage chamber 100 approaches the inlet temperature of the low-temperature gas, thus completing the heat release first. However, the temperature of the upper heat storage element 300 is higher than that of the low-temperature second heat transfer fluid, leaving a significant amount of heat unreleased. Therefore, a temperature gradient layer is formed in the upper part of the heat storage chamber 100, and this layer continuously moves upwards as heat release progresses. If the second heat transfer fluid continues to enter the heat storage chamber 100 from the bottom flow chamber 200, the low-temperature fluid will ineffectively flow through the cooled area, resulting in wasted pump power and reduced heat exchange efficiency. By using the heat release auxiliary unit 130 to directly guide the second heat transfer fluid to the upper part of the heat storage chamber 100, the downstream cooling zone can be bypassed, increasing the effective heat exchange temperature difference. This allows for precise and deep extraction of heat from the upper part of the heat storage chamber 100, reducing parasitic heat loss caused by the temperature gradient layer, and significantly improving the utilization rate of the heat storage capacity.

[0142] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0143] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A well-shaped stacked filled bed thermal storage device, characterized in that, include: A heat storage chamber (100) having a top end and a bottom end in the height direction; The heat storage chamber (100) has a flow chamber (200) at its top and bottom respectively, and the flow chamber (200) is connected to the heat storage chamber (100); the cavity wall of the flow chamber (200) has an opening for the medium to enter or flow out of the flow chamber (200). Multiple heat storage elements (300) are strip-shaped and are stacked inside the heat storage chamber (100); A heat charging auxiliary unit (120) is located at the lower part of the heat storage chamber (100). The heat charging auxiliary unit (120) includes a heat charging diversion structure (122) located inside the heat storage chamber (100) and a heat charging bypass inlet (121) located outside the heat storage chamber (100). The heat charging bypass inlet (121) is connected to the heat charging diversion structure (122) to introduce the medium into the heat charging diversion structure (122). The heat charging diversion structure (122) includes a plurality of first output holes (122c). A heat release auxiliary unit (130) is located on the upper part of the heat storage chamber (100). The heat release auxiliary unit (130) includes a heat release diversion structure (132) located inside the heat storage chamber (100) and a heat release bypass inlet (131) located outside the heat storage chamber (100). The heat release bypass inlet (131) is connected to the heat release diversion structure (132) to introduce the medium into the heat release diversion structure (132). The heat release diversion structure (132) includes a plurality of second output holes (132c).

2. The well-shaped stacked packed bed thermal storage device according to claim 1, characterized in that, The plurality of heat storage components (300) include a plurality of first heat storage components (301) and a plurality of second heat storage components (302). Parts of the plurality of first heat storage components (301) are spaced apart along the length direction of the heat storage chamber (100) to form a first heat storage unit (310). Parts of the plurality of second heat storage components (302) are spaced apart along the depth direction of the heat storage chamber (100) to form a second heat storage unit (320). Along the height direction of the heat storage chamber (100), the first heat storage unit (310) and the second heat storage unit (320) are alternately arranged in the heat storage chamber (100).

3. The well-shaped stacked packed bed thermal storage device according to claim 1, characterized in that, The heat charging and diversion structure (122) includes a first inlet pipe (122a) and a first diversion pipe (122b) connected to each other. The first inlet pipe (122a) is connected to the heat charging bypass inlet (121). A plurality of first outlet holes (122c) are spaced apart on the first diversion pipe (122b), and the first outlet holes (122c) face the top of the heat storage chamber (100). The heat release diversion structure (132) includes a second inlet pipe (132a) and a second diversion pipe (132b) connected together. The second inlet pipe (132a) is connected to the heat charging bypass inlet (121). A plurality of second outlet holes (132c) are spaced apart on the second diversion pipe (132b), and the second outlet holes (132c) face the top of the heat storage chamber (100).

4. The well-shaped stacked packed bed thermal storage device according to claim 2, characterized in that, The first thermal storage unit (310) and the second thermal storage unit (320) together form a plurality of flow channels for the flow of the medium; the plurality of flow channels are interconnected; The first heat storage elements (301) in two first heat storage units (310) adjacent to the same second heat storage unit (320) are alternately arranged along the length direction of the heat storage chamber (100).

5. The well-shaped stacked packed bed thermal storage device according to claim 4, characterized in that, The inner wall of the heat storage chamber (100) has at least one set of occupant structures (150), and the outermost first heat storage element (301) of any of the adjacent first heat storage units (310) abuts against the occupant structure (150).

6. The well-shaped stacked packed bed thermal storage device according to claim 2, characterized in that, The first heat storage component (301) and the second heat storage component (302) are provided with a plurality of annular grooves (303) in their respective length directions, and the groove width and / or groove depth of at least some of the adjacent annular grooves (303) are different from each other.

7. The well-shaped stacked packed bed thermal storage device according to claim 1, characterized in that, The heat storage component (300) includes a heat storage carrier (330) and a heat storage filler (340), wherein the heat storage carrier (330) has a cavity and the heat storage filler (340) fills the cavity.

8. The well-shaped stacked packed bed thermal storage device according to any one of claims 1-7, characterized in that, A support and positioning structure (140) is provided between the heat storage chamber (100) and the circulation chamber (200), and the support and positioning structure (140) is a porous structure.

9. The well-shaped stacked packed bed thermal storage device according to any one of claims 1-7, characterized in that, The flow chamber (200) has a blocking side (220) and an opening side (210) in the length direction, and the opening side (210) has the opening; a flow equalization element is provided between the flow chamber (200) and the heat storage chamber (100), and the flow equalization element includes a plurality of connecting channels (201) arranged along the length direction of the flow chamber (200) to connect the flow chamber (200) and the heat storage chamber (100). The length direction of the circulation chamber (200) is parallel to the length direction of the heat storage chamber (100).

10. The well-shaped stacked packed bed thermal storage device according to claim 9, characterized in that, The flow chamber (200) is also provided with a flow guiding component. The flow guiding component is located on the side of the flow equalization component near the flow chamber (200). The flow guiding component includes a plurality of flow guiding plates (202). The flow guiding plates (202) are located at one end of the connecting channel (201) near the flow chamber (200) and are connected to the flow equalization component. The guide plate (202) extends in a curved direction from the connecting channel (201) toward the opening side (210).

11. The well-shaped stacked packed bed thermal storage device according to any one of claims 1-7, characterized in that, Along the height direction of the heat storage chamber (100), the diameter of the heat storage element (300) near the top of the heat storage chamber (100) is smaller than the diameter of the heat storage element (300) near the bottom of the heat storage chamber (100).

12. A method for operating a well-shaped stacked packed bed thermal storage device, applied to the well-shaped stacked packed bed thermal storage device as described in any one of claims 1-11, characterized in that, The well-shaped stacked packed bed thermal storage device is heated by a first heat transfer fluid. During the heating process, the first heat transfer fluid enters from the opening of the flow chamber (200) at the top of the thermal storage chamber (100). The heating process includes: The first temperature, the second temperature, the third temperature and the fourth temperature are obtained, wherein the first temperature is the temperature when the first heat transfer fluid enters the opening of the flow chamber (200) at the top of the heat storage chamber (100), the second temperature is the temperature of the heat storage element (300) at the top of the heat storage chamber (100), the third temperature is the temperature of the heat storage element (300) at the upper end of the heat charging auxiliary unit (120), and the fourth temperature is the temperature when the first heat transfer fluid flows out of the opening of the flow chamber (200) at the bottom of the heat storage chamber (100); If the difference between the first temperature and the second temperature is greater than the first preset temperature difference, the first heat transfer fluid is continuously introduced; if the difference between the first temperature and the second temperature is less than the first preset temperature difference, and the difference between the first temperature and the third temperature is less than the first preset temperature difference, the first heat transfer fluid is introduced from the heat charging auxiliary unit (120) into the lower part of the heat storage chamber (100); if the first temperature is less than the second temperature but the difference between the first temperature and the third temperature is greater than the first preset temperature difference, the first heat transfer fluid is introduced from the heat charging auxiliary unit (120) into the lower part of the heat storage chamber (100); wherein, the first preset temperature difference is not less than 5°C, and is less than the difference between the first temperature and the melting point of the heat storage filling material in the heat storage component (300); If the difference between the first temperature and the fourth temperature is less than the first preset temperature difference, then the heating process is complete. The well-shaped stacked packed bed thermal storage device releases heat through a second heat transfer fluid. During the heat release process, the second heat transfer fluid enters from the opening of the flow chamber (200) at the bottom of the thermal storage chamber (100). The heat release process includes: The fifth temperature, the sixth temperature and the seventh temperature are obtained, wherein the fifth temperature is the temperature when the second heat transfer fluid enters the opening of the flow chamber (200) at the bottom of the heat storage chamber (100), the sixth temperature is the temperature of the heat storage element (300) at the lower end of the heat release auxiliary unit (130), and the seventh temperature is the temperature when the second heat transfer fluid flows out of the opening of the flow chamber (200) at the top of the heat storage chamber (100); If the difference between the sixth temperature and the fifth temperature is greater than the second preset temperature difference, the second heat transfer fluid is continuously introduced; if the difference between the sixth temperature and the fifth temperature is less than the second preset temperature difference, the second heat transfer fluid is introduced from the heat release auxiliary unit (130) into the upper part of the heat storage chamber (100); wherein, the second preset temperature difference is not less than 2°C and is less than the difference between the melting point of the heat storage filling material in the heat storage component (300) and the fifth temperature; If the difference between the seventh temperature and the fifth temperature is less than the second preset temperature difference, then heat release is complete.

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