Cooling plate and optical module heat dissipation device

Abstract

The embodiment of the invention discloses a cooling plate and an optical module heat dissipation device, and the cooling plate comprises a cooling plate body, a first connection boss and a second connection boss, and the first connection boss and the second connection boss are respectively connected to the middle positions of the two side surfaces of the cooling plate body along the first direction. A liquid inlet flow channel of the first connecting boss and a liquid outlet flow channel of the second connecting boss communicate with the two ends of a cooling flow channel of the cold plate body correspondingly, and first avoiding spaces are formed by the two side faces, in the second direction, of the first connecting boss and the side face of the cold plate body correspondingly. Second avoiding spaces are formed by the two side faces, in the second direction, of the second connecting boss and the side face of the cold plate body correspondingly. According to the cooling plate, on the premise that the cooling area is not changed, enough installation space can be provided for connecting pipelines between the adjacent cooling plates, meanwhile, the cooling plate can be directly connected with an external connecting pipeline, the number of welding structures is reduced, and the liquid leakage risk is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation technology, in particular to a cooling plate and a light module heat dissipation device. BACKGROUND

[0002] With the development trend of high speed and high density integration of the light module, the heat generated in the unit volume of the light module is significantly increased, and higher requirements are put forward for the heat dissipation performance. The liquid cooling structure based on the cooling plate is widely used in the heat management system of the light module due to its high heat conduction efficiency, compact structure and strong controllability.

[0003] The cooling plate usually guides the flow of the cooling liquid through the internal flow channel to quickly take away the heat generated by the light module. In order to realize the circulation of the cooling liquid, the inlet and outlet liquid pipelines need to be connected at both ends of the cooling plate. However, in the layout of the optical communication equipment cabinet or the plug-in module, the space is limited, and the gap between the cooling plate and the surrounding components and structural parts is often insufficient, which leads to difficult installation of the pipeline between the cooling plates and deformation or interface leakage of the cooling plate caused by assembly stress, thereby affecting the overall heat dissipation performance and even the system stability. SUMMARY

[0004] Therefore, the embodiments of the present application provide a cooling plate and a light module heat dissipation device, which can provide sufficient installation space for the connecting pipeline between adjacent cooling plates while ensuring the cooling area.

[0005] In a first aspect, the embodiments of the present application provide a cooling plate, which comprises: a cold plate body, which is internally provided with a cooling flow channel, and a top surface of the cold plate body is provided with a positioning column; a first connecting boss and a second connecting boss, which are respectively connected at the middle positions of the two side surfaces of the cold plate body along a first direction, the first connecting boss is provided with an inlet flow channel, and the second connecting boss is provided with an outlet flow channel, two ends of the inlet flow channel are in communication with an inlet of the cooling flow channel and the outside, and two ends of the outlet flow channel are in communication with an outlet of the cooling flow channel and the outside; wherein the two side surfaces of the first connecting boss along a second direction form a first avoiding space with the side surface of the cold plate body, respectively, the two side surfaces of the second connecting boss along the second direction form a second avoiding space with the side surface of the cold plate body, respectively, and the first direction is perpendicular to the second direction.

[0006] Optionally, the positions of the inlet and outlet of the cooling flow channel are diagonally arranged; the inlet flow channel comprises a first connecting flow channel and a first curved flow channel in communication, and the outlet flow channel comprises a second connecting flow channel and a second curved flow channel in communication; Wherein, the first connecting channel and the second connecting channel are parallel to the second direction, the first curved channel extends to communicate with the inlet, and the second curved channel extends to communicate with the outlet.

[0007] Optionally, the bottom surfaces of the first connecting boss and the second connecting boss are flush with the bottom surface of the cold plate body, and the top surfaces of the first connecting boss and the second connecting boss are higher than the top surface of the cold plate body.

[0008] Optionally, the first connecting boss includes an integrally formed first boss and a first thickened platform, and the second connecting boss includes an integrally formed second boss and a second thickened platform. The first boss and the second boss are symmetrically connected to the middle positions of the two sides of the cold plate body along the first direction. The first thickened platform and the second thickened platform are respectively provided on the top surface of the cold plate body and are arranged in a centrally symmetrical manner. The bottom surface of the first boss and the bottom surface of the second boss are flush with the bottom surface of the cold plate body. The top surface of the first boss, the top surface of the second boss, the top surface of the first thickened platform, and the top surface of the second thickened platform are flush with each other.

[0009] Optionally, the first connecting channel is disposed on the first protrusion, the second connecting channel is disposed on the second protrusion, the first curved channel is disposed within the first thickened platform and extends along the thickness direction into the body of the cold plate and communicates with the liquid inlet, and the second curved channel is disposed within the second thickened platform and extends along the thickness direction into the body of the cold plate and communicates with the liquid outlet.

[0010] Optionally, the cooling channel includes a first channel, a second channel, and a plurality of reversing channels. The first channel and the second channel extend along the first direction, and the plurality of reversing channels are connected in parallel between the first channel and the second channel. The liquid inlet is located at one end of the first channel near the first connecting boss, and the liquid outlet is located at one end of the second channel near the second connecting boss.

[0011] Optionally, the first flow channel is provided with a gradually narrowing width from one end of the inlet to the other, and the second flow channel is provided with a gradually narrowing width from one end of the outlet to the other.

[0012] Optionally, the cold plate body includes: The upper cold plate is provided with a mounting groove, and the first curved flow channel, the first flow channel, the second curved flow channel and the second flow channel are disposed in the mounting groove; The lower cold plate is provided with a connecting groove, and a plurality of partitions are provided in the connecting groove, which are arranged parallel to each other along the second direction. The reversing flow channel is formed between adjacent partitions. The lower cold plate is installed in the mounting groove, and the first flow channel and the second flow channel are respectively connected to the two ends of the connecting groove along the second direction along the thickness direction.

[0013] Secondly, embodiments of the present invention provide a heat dissipation device for an optical module, the heat dissipation device for the optical module comprising: The mounting cage includes a first mounting layer and a second mounting layer spaced apart along a third direction, and both the first mounting layer and the second mounting layer include a plurality of mounting positions arranged adjacent to each other along the second direction. Multiple optical modules, each of which is plugged into one of the mounting positions; Multiple heat dissipation components, each of which is disposed on the top of one of the mounting positions, the heat dissipation components including the cooling plate as described in the first aspect; The cooling plates of the first mounting layer and the cooling plates of the second mounting layer are connected in parallel through a first pipe, and the cooling plates of the first mounting layer and the cooling plates of the second mounting layer are connected in series through a second pipe. At least a portion of the pipe body of the first pipe and the second pipe is a retractable corrugated pipe.

[0014] Optionally, the optical module heat dissipation device further includes: The inlet pipe and outlet pipe are respectively connected to one of the cooling plates of the first mounting layer and the second mounting layer.

[0015] Optionally, the optical module heat dissipation device further includes two fixing plates, which are respectively disposed above the first mounting layer and the second mounting layer: The heat dissipation assembly also includes an elastic mechanism disposed between the top surface of the cooling plate and the fixing plate, wherein the elastic extension and retraction direction of the elastic mechanism is perpendicular to the insertion and removal direction of the optical module. When the optical module is in an unplugged state, the elastic mechanism extends elastically; When the optical module is in the plugged-in / plugged-out state, the elastic mechanism elastically contracts and provides elastic force to the cooling plate.

[0016] This invention provides a cooling plate and a heat dissipation device for an optical module. The cooling plate includes a cold plate body, a first connecting boss, and a second connecting boss. The first and second connecting bosses are respectively connected to the middle positions of the two sides of the cold plate body along a first direction. The liquid inlet channel of the first connecting boss and the liquid outlet channel of the second connecting boss are respectively connected to the two ends of the cooling channel of the cold plate body. The two sides of the first connecting boss along a second direction form a first clearance space with the side of the cold plate body, and the two sides of the second connecting boss along the second direction form a second clearance space with the side of the cold plate body. This cooling plate can provide sufficient installation space for the connecting pipes between adjacent cooling plates while ensuring that the cooling area remains unchanged. At the same time, the cooling plate can be directly connected to external connecting pipes, reducing welding structures and reducing the risk of leakage. Attached Figure Description

[0017] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the invention with reference to the accompanying drawings, in which: Figure 1 This is a structural schematic diagram of the cooling plate at a first angle according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the cooling plate at a second angle according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the upper cold plate according to an embodiment of the present invention; Figure 4 This is a structural schematic diagram of the lower cold plate at the first angle according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the lower cold plate at the second angle according to an embodiment of the present invention; Figure 6 This is a cross-sectional view of the cooling plate according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the optical module heat dissipation device according to an embodiment of the present invention; Figure 8 This is an exploded view of the optical module heat dissipation device according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the cooling system of the optical module heat dissipation device according to an embodiment of the present invention; Figure 10 This is a schematic diagram showing the connection between the upper cooling plate and the lower cooling plate in an embodiment of the present invention; Figure 11 This is a schematic diagram of the flow direction of coolant in the upper cooling plate according to an embodiment of the present invention; Figure 12 This is a schematic diagram of the flow direction of coolant in the lower cooling plate of this invention.

[0018] Figure label: 100-Cooling plate; 1-Cooling plate body; 11-Cooling channel; 111-First channel; 112-Second channel; 113-Reversing channel; 12-Inlet; 13-Outlet; 14-Upper cooling plate; 141-Mounting groove; 15-Lower cooling plate; 151-Connecting groove; 152-Baffle; 153-Main body; 154-Connecting edge; 16-Positioning post; 17-Slot; 2-First connecting boss; 21-Inlet channel; 211-First connecting channel; 212-First curved channel; 22-First boss; 23-First thickened platform; 3-Second connecting boss; 31-Outlet Flow channel; 311-Second connecting flow channel; 312-Second curved flow channel; 32-Second boss; 33-Second thickened platform; 4-First clearance space; 5-Second clearance space; X-First direction; Y-Second direction; Z-Third direction; 200-Mounting cage; 201-First mounting layer; 202-Second mounting layer; 203-Mounting position; 300-Optical module; 400-Heat dissipation component; 401-Elastic mechanism; 500-First pipeline; 600-Second pipeline; 700-Water inlet pipe; 800-Water outlet pipe; 900-Fixing plate; 901-Positioning hole; 10-PCB board. Detailed Implementation

[0019] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0020] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only, and the scale shown in the drawings is only one embodiment; other embodiments are not necessarily implemented to scale.

[0021] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0023] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0024] To facilitate the description of the embodiments of this application, the coordinate system in the accompanying drawings is explained. The first direction X can be the length direction of the cooling plate in the horizontal direction and the insertion / removal direction of each optical module; the second direction Y can be the width direction of the cooling plate in the horizontal direction and the adjacency direction of each optical module; the third direction Z can be the thickness direction of the cooling plate and the upper and lower directions of the double-layer mounting cage; the first direction X, the second direction Y and the third direction Z are perpendicular to each other.

[0025] like Figure 1 and Figure 2 As shown, the cooling plate 100 includes a cold plate body 1, and a cooling channel 11 is provided inside the cold plate body 1. Coolant flows in the cooling channel 11 to carry away the heat transferred to the cold plate body 1, thereby achieving heat dissipation.

[0026] like Figure 1 and Figure 2 As shown, the cooling plate 100 includes a first connecting boss 2 and a second connecting boss 3, respectively connected to the middle positions of the two sides of the cooling plate body 1 along the first direction X. This middle position refers to a non-edge position on the side, not limited to the center position. Figure 3 As shown, the first connecting boss 2 is provided with an inlet channel 21, and the second connecting boss 3 is provided with an outlet channel 31. The inlet channel 21 and the outlet channel 31 are respectively connected to both ends of the cooling channel 11 (i.e., the inlet port 12 and the outlet port 13). The coolant can enter the cooling channel 11 through the inlet channel 21 and then flow out through the outlet channel 31; or, the coolant can enter the cooling channel 11 through the outlet channel 31 and then flow out through the inlet channel 21; thereby realizing heat exchange with the cooling plate 100, and thus quickly removing the heat from the heat-generating components (such as optical modules) in contact with the cooling plate 100.

[0027] like Figure 3 and Figure 6 As shown, the inlet 12 and outlet 13 of the cooling channel 11 are arranged diagonally. Both ends of the inlet channel 21 are connected to the outside and the inlet 12, respectively, and both ends of the outlet channel 31 are connected to the outside and the outlet 13, respectively. This diagonal arrangement of the inlet 12 and outlet 13 allows the coolant to flow from one side of the cold plate body 1 to the other after entering the cooling channel 11 through either the inlet 12 or outlet 13. This ensures the coolant flows throughout the entire cold plate body 1, reducing localized overheating or uneven cooling and improving overall heat dissipation efficiency.

[0028] Among them, such as Figure 1 and Figure 2 As shown, the two sides of the first connecting boss 2 along the second direction Y and the side of the cold plate body 1 respectively form a first clearance space 4, and the two sides of the second connecting boss 3 along the second direction Y and the side of the cold plate body 1 respectively form a second clearance space 5.

[0029] The first connecting boss 2 and the second connecting boss 3 are arranged at both ends of the cold plate body 1 to form a first clearance space 4 and a second clearance space 5. Under the premise of ensuring that the cooling area of ​​the cold plate body 1 remains unchanged, more installation space can be reserved at both ends of the cold plate body 1, which facilitates the connection between adjacent cooling plates 100.

[0030] In one specific embodiment, the first connecting boss 2 and the second connecting boss 3 are respectively located at the center of the two sides of the cold plate body 1 along the first direction X, so that the structures at both ends of the cold plate body 1 are completely identical and symmetrical, which makes it easy for the pipes connecting the multiple cooling plates 100 to be completely identical, which is beneficial to the floating between adjacent cooling plates 100. At the same time, the identical adjacent pipes can also reduce costs and installation difficulty.

[0031] like Figure 1 As shown, the bottom surfaces of the first connecting boss 2 and the second connecting boss 3 are flush with the bottom surface of the cold plate body 1, while the top surfaces of the first connecting boss 2 and the second connecting boss 3 are higher than the top surface of the cold plate body 1. That is, the thickness of the first connecting boss 2 and the second connecting boss 3 is greater than the thickness of the cold plate body 1. This results in larger dimensions (usually referring to diameter) of the inlet channel 21 and outlet channel 31, facilitating pipe connections to adjacent cooling plates 100. At the same time, the larger dimensions of the inlet channel 21 and outlet channel 31 can reduce the overall flow resistance of the coolant within the cooling plate 100, improving the heat dissipation effect.

[0032] like Figure 1 As shown, the first connecting boss 2 includes a first boss 22 and a first thickened platform 23, and the second connecting boss 3 includes a second boss 32 and a second thickened platform 33. The first boss 22 and the second boss 32 are symmetrically connected to the middle positions of the two sides of the cold plate body 1 along the first direction X. The first thickened platform 23 and the second thickened platform 33 are respectively disposed on the top surface of the cold plate body 1 and are centrally symmetrically arranged. The bottom surfaces of the first boss 22 and the second boss 32 are flush with the bottom surface of the cold plate body 1, and the top surfaces of the first boss 22, the second boss 32, the first thickened platform 23, and the second thickened platform 33 are flush with each other.

[0033] like Figure 3 and Figure 6As shown, the inlet channel 21 includes a first connecting channel 211 and a first curved channel 212 that are connected together, and the outlet channel 31 includes a second connecting channel 311 and a second curved channel 312 that are connected together. The first connecting channel 211 and the second connecting channel 311 are parallel to the second direction Y. One end of the first curved channel 212 is laterally connected to the first connecting channel 211, and the other end of the first curved channel 212 extends to connect with the inlet 12. One end of the second curved channel 312 is laterally connected to the second connecting channel 311, and the other end of the second curved channel 312 extends to connect with the outlet 13.

[0034] The first protrusion 22 and the second protrusion 32 are respectively located at the center of the two sides of the cold plate body 1 along the first direction X, so that the structures at both ends of the cold plate body 1 are completely identical and symmetrical, which makes it easy for the pipes connecting the multiple cooling plates 100 to be completely identical, which is beneficial to the floating between adjacent cooling plates 100. At the same time, the identical adjacent pipes can also reduce costs and installation difficulty.

[0035] The first connecting channel 211 is disposed through the first boss 22, and the second connecting channel 311 is disposed through the second boss 32. The first curved channel 212 is disposed within the first thickened platform 23 and extends along the thickness direction into the cold plate body 1, communicating with the liquid inlet 12. The second curved channel 312 is disposed within the second thickened platform 33 and extends along the thickness direction into the cold plate body 1, communicating with the liquid outlet 13. The center positions of the first curved channel 212 and the first connecting channel 211 are laterally connected, and the center positions of the second curved channel 312 and the second connecting channel 311 are laterally connected. The first curved channel 212 and the second curved channel 312 are centrally symmetrically arranged, which ensures that the coolant flows into the multiple cooling plates 100 at a consistent speed, thereby improving the heat dissipation efficiency of multiple heat-generating components.

[0036] In this embodiment, the cooling channel 11 includes a first channel 111, a second channel 112, and a plurality of reversing channels 113. The first channel 111 and the second channel 112 extend along a first direction X. The plurality of reversing channels 113 are connected in parallel between the first channel 111 and the second channel 112. The liquid inlet 12 is located at one end of the first channel 111 near the first connecting boss 2, and the liquid outlet 13 is located at one end of the second channel 112 near the second connecting boss 3. The coolant sequentially passes through the liquid inlet channel 21, the first channel 111, and the plurality of reversing channels 113 to reach the second channel 112, and then flows out through the liquid outlet channel 31; the coolant sequentially passes through the liquid outlet channel 31, the second channel 112, and the plurality of reversing channels 113 to reach the first channel 111, and then flows out through the liquid inlet channel 21. The structure of the cooling channel 11 described above can reduce the problem of local overheating or uneven cooling and improve the overall heat dissipation efficiency. In another embodiment, a plurality of reversing channels 113 are vertically connected to the first channel 111 and the second channel 112.

[0037] In this embodiment, the first flow channel 111 has a gradually narrowing width from one end of the inlet 12 to the other, and the second flow channel 112 has a gradually narrowing width from one end of the outlet 13 to the other, which can optimize the coolant flow distribution and heat exchange uniformity. In this embodiment, the overall design of the first flow channel 111 and the second flow channel 112 is a centrally symmetrical structure.

[0038] In this embodiment of the application, the cold plate body 1 includes an upper cold plate 14 and a lower cold plate 15, such as Figure 2 As shown. Figure 3 As shown, the upper cold plate 14 is provided with a mounting groove 141. Both ends of the mounting groove 141 extend along the first direction X to below the first connecting boss 2 and the second connecting boss 3. The first curved flow channel 212, the first flow channel 111, the second curved flow channel 312, and the second flow channel 112 are disposed in the mounting groove 141. The first curved flow channel 212, the first flow channel 111, the second curved flow channel 312, and the second flow channel 112 are formed by the bottom surface of the mounting groove 141 being recessed downwards.

[0039] like Figure 4 and Figure 5 As shown, the lower cold plate 15 is provided with a connecting groove 151, and a plurality of partitions 152 are arranged parallel to each other along the second direction Y within the connecting groove 151. A reversing flow channel 113 is formed between adjacent partitions 152. The length of the partition 152 is less than the width of the connecting groove 151.

[0040] When the upper cold plate 14 and the lower cold plate 15 are closed together, the lower cold plate 15 is installed in the mounting groove 141, and a plurality of partitions 152 abut against the bottom surface of the upper cold plate 14 located between the first flow channel 111 and the second flow channel 112. The first flow channel 111 and the second flow channel 112 are respectively connected to the two ends of the connecting groove 151 along the second direction Y in the thickness direction.

[0041] In another embodiment, the first boss 22 and the first thickened platform 23 are integrally formed, and the second boss 32 and the second thickened platform 33 are integrally formed. In yet another embodiment, the first boss 22, the first thickened platform 23, the second boss 32 and the second thickened platform 33 are integrally formed.

[0042] In this embodiment, the lower cooling plate 15 includes a main body 153 and a connecting edge 154 extending horizontally outward from the top of the outer edge of the main body 153. A connecting groove 151 and a partition 152 are disposed in the main body 153, such that after the lower cooling plate 15 and the upper cooling plate 14 are connected, the size of the cooling channel 11 along the thickness direction can be increased, facilitating coolant flow and improving heat dissipation efficiency. The shape formed by the connecting edge 154 matches the shape of the mounting groove 141. After the lower cooling plate 15 and the upper cooling plate 14 are connected, the connecting edge 154 is connected within the mounting groove 141, and the bottom surface of the connecting edge 154 is flush with the bottom surface of the upper cooling plate 14. The main body 153 protrudes below the bottom surface of the upper cooling plate 14. When the cooling plate 100 is installed in the mounting position 203 of the mounting cage 200, the main body 153 extends into the top opening of the mounting position 203, and the connecting edge 154 abuts against the top of the mounting position 203.

[0043] In this embodiment, a slot 17 is formed between the opposing sides of the first thickened platform 23 and the second thickened platform 33 and the top surface of the cold plate body 1. The slot 17 can be matched and connected with the fixing plate 900 when the cooling plate 100 is installed on the mounting cage 200. Optionally, a positioning post 16 is provided on the top surface of the cold plate body 1, and the number of positioning posts 16 is not limited. When the cooling plate 100 is installed on the mounting cage 200, the positioning post 16 can be further matched and connected with the positioning hole on the fixing plate 900 to limit the positioning of the fixing plate 900.

[0044] In other embodiments, the lower cooling plate 15 may also be configured as a plate structure.

[0045] In other embodiments, the cooling channel 11 may also be configured as an S-shape, etc.

[0046] The cooling plate in this embodiment features a first connecting boss and a second connecting boss at the midpoint of each side of the cooling plate body. This creates clearance spaces at both ends of the cooling plate body, providing sufficient installation space for connecting pipes between adjacent cooling plates while maintaining a constant cooling area. The connecting bosses allow direct connection to external pipes without the need for additional T-junctions, reducing welding and the risk of leakage. The cooling plate directs coolant to one side and out the other, resulting in low overall system flow resistance and high heat dissipation performance.

[0047] like Figure 7 and Figure 8 As shown, the optical module heat dissipation device provided in this application embodiment includes: a mounting cage 200, which is a double-layer stacked optical mouse cage, including a first mounting layer 201 and a second mounting layer 202 arranged vertically and vertically along the third direction Z, with the first mounting layer 201 located above the second mounting layer 202; both the first mounting layer 201 and the second mounting layer 202 include a plurality of mounting positions 203 arranged adjacent to each other along the second direction Y.

[0048] The optical module heat dissipation device also includes: multiple optical modules 300, each optical module 300 being inserted into a corresponding mounting position 203; such as Figure 7 As shown, the optical module is inserted into the mounting position 203 from front to back.

[0049] The optical module heat dissipation device also includes: multiple heat dissipation components 400, each heat dissipation component 400 being disposed on the top of a mounting position 203; that is, the heat dissipation component 400 disposed on the top of the mounting position 203 of the second mounting layer 202 is located between the first mounting layer 201 and the second mounting layer 202.

[0050] The heat dissipation component 400 includes a cooling plate 100, the structure of which is the same as that of the cooling plate 100 in the above embodiment, and will not be described in detail here.

[0051] The mounting position 203 has an opening at its top. When the cooling plate 100 is positioned at the top of the mounting position 203, its main body 153 is accommodated within the opening. When the optical module 300 is inserted into the mounting position 203, the optical module 300 will abut against the bottom surface of the cooling plate 100, and the abutting force of the optical module 300 will cause the cooling plate 100 to float upwards.

[0052] like Figure 8 As shown, the heat dissipation assembly 400 also includes an elastic mechanism 401 disposed on the top surface of the cooling plate 100. The elastic extension and retraction direction of the elastic mechanism 401 is... Figure 7The vertical direction shown is perpendicular to the insertion / removal direction of the optical module 300. During the insertion / removal process of the optical module 300, the elastic mechanism 401 can prevent the cooling plate 100 from disengaging from the optical module 300, ensuring full contact between the cooling plate 100 and the optical module 300 and good heat exchange.

[0053] When the optical module 300 is in the non-inserted state, the main body 153 of the cooling plate 100 is housed within the mounting position 203, the cooling plate 100 is in its initial state, and the elastic mechanism 401 does not provide elastic force to the cooling plate 100. When the optical module 300 is in the inserted / removed state, the optical module 300 provides upward (…) force to the cooling plate 100. Figure 7 When the cooling plate 100 floats upward, the state of the elastic mechanism 401 changes, and the elastic mechanism 401 provides a downward (upward) force to the cooling plate 100. Figure 7 The elastic force (downward) acting on the cooling plate 100 is opposite in direction to the resisting force, so that the cooling plate 100 can make full contact with the optical module 300, ensuring that the cooling plate 100 exchanges heat with the optical module 300 at all times.

[0054] In this embodiment, the elastic mechanism 401 can be a metal spring.

[0055] like Figure 7 and Figure 8 As shown, the optical module heat dissipation device also includes two fixing plates 900, which are respectively disposed above the first mounting layer 201 and the second mounting layer 202. That is, the fixing plate 900 disposed above the second mounting layer 202 is located between the first mounting layer 201 and the second mounting layer 202.

[0056] The mounting cage 200 is fixed on the PCB board 10. The two ends of the two fixing plates 900 are respectively straddling the sides of the first mounting layer 201 and the second mounting layer 202. The two ends of the two fixing plates 900 can be assembled and fixed together by screws or other fasteners. The fixing plate 900 located at the bottom layer is fixed on the PCB board 10.

[0057] Each heat dissipation component 400 has an elastic mechanism 401 disposed between the cooling plate 100 and the corresponding fixing plate 900. Specifically, the elastic mechanism 401 is located in a slot 17 on the top surface of the cooling plate 100. The top surface of the fixing plate 900 is configured to match the multiple slots 17, thereby achieving positioning between the fixing plate 900 and the multiple cooling plates 100.

[0058] The fixed plate 900 is provided with multiple positioning holes 901, which can be connected to the positioning posts 16 provided on the top surface of multiple cooling plates 100 on the same layer, so as to realize the limiting connection of the fixed plate 900.

[0059] like Figure 9and Figure 10 As shown, the cooling plates 100 of the first mounting layer 201 and the cooling plates 100 of the second mounting layer 202 are connected in parallel through the first pipe 500, so that the coolant can flow into and out of multiple cooling plates 100 at the same time, thereby achieving simultaneous heat dissipation for multiple optical modules 300.

[0060] The cooling plate 100 of the first mounting layer 201 and the cooling plate 100 of the second mounting layer 202 are connected in series via a second pipe 600. The second pipe 600 is used to introduce coolant from the upper cooling plate 100 into the lower cooling plate 100.

[0061] In this embodiment, the optical module heat dissipation device further includes an inlet pipe 700 and an outlet pipe 800, which are respectively connected to a cooling plate 100 of the first mounting layer 201 and the second mounting layer 202. The inlet pipe 700 is used to connect the external circulation system to the cooling plate 100 of the optical module heat dissipation device, introducing coolant into the cooling plate 100 for heat dissipation. The outlet pipe 800 is used to connect the external circulation system to the cooling plate 100 of the optical module heat dissipation device, leading the coolant after passing through the cooling plate 100 out to the external circulation system.

[0062] Specifically, multiple cooling plates 100 are arranged side by side in each layer, with the first connecting protrusions 2 of the multiple cooling plates 100 located on the same side and the second connecting protrusions 3 of the multiple cooling plates 100 located on the other side. The liquid inlet channels 21 between two adjacent cooling plates 100 are connected by a first pipe 500, and the liquid outlet channels 31 between two adjacent cooling plates 100 are also connected by a first pipe 500, achieving parallel connection. The water inlet pipe 700 is connected to the liquid inlet channel 21 of the cooling plate 100 located on one side of the upper layer, such as the water inlet pipe 700 being connected to the liquid inlet channel 21 of the rightmost cooling plate 100 on the upper layer. The water outlet pipe 800 is connected to the liquid inlet channel 21 of the cooling plate 100 located on one side of the lower layer, such as the water outlet pipe 800 being connected to the liquid inlet channel 21 of the rightmost cooling plate 100 on the lower layer. The second pipe 600 connects the liquid outlet channel 31 of the upper cooling plate 100 and the liquid outlet channel 31 of the lower cooling plate 100 on the same side. For example, the second pipe 600 connects the upper and lower cooling plates 100 on the side away from the inlet pipe 700 and the outlet pipe 800. It should be noted that the end of the liquid inlet channel 21 of the upper cooling plate 100 that is not connected to the inlet pipe 700 is fitted with a plug, and the end of the liquid outlet channel 31 of the cooling plate 100 that is not connected to the second pipe 600 is fitted with a plug; the end of the liquid inlet channel 21 of the lower cooling plate 100 that is not connected to the outlet pipe 800 is fitted with a plug, and the end of the liquid outlet channel 31 of the cooling plate 100 that is not connected to the second pipe 600 is fitted with a plug; thus, a complete cooling circulation pipeline is achieved between the upper cooling plate 100 and the lower cooling plate 100.

[0063] In this embodiment, at least a portion of the first conduit 500 and the second conduit 600 are expandable corrugated pipes, or all of them are corrugated pipes. Both ends of the first conduit 500 and the second conduit 600 are welded and fixed to the cooling plate 100. The corrugated pipe of the first conduit 500 can utilize its flexibility to absorb the vertical movement of the corresponding cooling plate 100 during the insertion and removal of a single optical module 300, ensuring close contact between the optical module 300 and the cooling plate 100 and improving heat dissipation efficiency. The corrugated pipe of the first conduit 500 can be stretched axially, adapting to the horizontal distance between the cooling plates 100. The corrugated pipe of the second conduit 600, when connecting the upper and lower cooling plates 100, is more adaptable to the internal structure of the optical module heat dissipation device, facilitating installation. Simultaneously, the corrugated pipe of the second conduit 600 can also adapt to the height difference caused by the floating of the connected cooling plates 100, enhancing the floating capability of the cooling plates 100.

[0064] In another embodiment, the first conduit 500 and the second conduit 600 are metal bellows.

[0065] In addition, the inlet pipe 700 and the outlet pipe 800 can also be configured as having a corrugated pipe structure with at least part of the pipe body.

[0066] The flow direction of the coolant in the upper cooling plate and the flow pattern of the coolant in the lower cooling plate in this embodiment are as follows: Figure 11 and Figure 12 As shown, the coolant flows through the internal channels of the cooling plate 100 for heat dissipation and exchange, efficiently transferring and dissipating the heat generated by the optical module 300 during operation, effectively controlling the temperature of the optical module 300, thereby ensuring stable system operation.

[0067] The first conduit 500 and the second conduit 600 can absorb the height dimensional tolerance during the insertion and removal of the optical module 300. The elastic mechanism 401 continuously applies pressure to the cooling plate 100 and maintains the balance of the cooling plate 100, improving the contact effect between the cooling plate 100 and the optical module 300 after insertion and removal, and effectively carrying away the heat generated by the optical module 300 during operation.

[0068] The optical module heat dissipation device in this embodiment includes multiple cooling plates as described in the previous embodiment. Cooling plates on the same layer are connected by corrugated pipes, and cooling plates on different layers are also connected by corrugated pipes. This cooling plate provides sufficient installation space for connecting pipes between adjacent cooling plates while maintaining a constant cooling area. Simultaneously, the cooling plate can be directly connected to external connecting pipes, reducing welding structures and the risk of leakage. The corrugated pipes connecting the cooling plates accommodate the installation space between adjacent cooling plates and also absorb height dimensional tolerances during optical module insertion and removal.

[0069] The above description is merely one embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A cooling plate, characterized in that, The cooling plate includes: The cold plate body has internal cooling channels, and the top surface of the cold plate body is provided with positioning posts; The first connecting boss and the second connecting boss are respectively connected to the middle positions of the two sides of the cold plate body along the first direction. The first connecting boss is provided with a liquid inlet channel, and the second connecting boss is provided with a liquid outlet channel. The two ends of the liquid inlet channel are connected to the liquid inlet of the cooling channel and the outside, and the two ends of the liquid outlet channel are connected to the liquid outlet of the cooling channel and the outside. Wherein, the two sides of the first connecting boss along the second direction form a first clearance space with the side of the cold plate body, and the two sides of the second connecting boss along the second direction form a second clearance space with the side of the cold plate body, wherein the first direction is perpendicular to the second direction.

2. The cooling plate according to claim 1, characterized in that, The inlet and outlet of the cooling channel are arranged diagonally. The liquid inlet channel includes a first connecting channel and a first curved channel that are connected together, and the liquid outlet channel includes a second connecting channel and a second curved channel that are connected together. Wherein, the first connecting channel and the second connecting channel are parallel to the second direction, the first curved channel extends to communicate with the inlet, and the second curved channel extends to communicate with the outlet.

3. The cooling plate according to claim 2, characterized in that, The bottom surfaces of the first connecting boss and the second connecting boss are flush with the bottom surface of the cold plate body, and the top surfaces of the first connecting boss and the second connecting boss are higher than the top surface of the cold plate body.

4. The cooling plate according to claim 2 or 3, characterized in that, The first connecting boss includes an integrally formed first boss and a first thickened platform, and the second connecting boss includes an integrally formed second boss and a second thickened platform; The first boss and the second boss are symmetrically connected to the middle positions of the two sides of the cold plate body along the first direction. The first thickened platform and the second thickened platform are respectively provided on the top surface of the cold plate body and are arranged in a centrally symmetrical manner. The bottom surface of the first boss and the bottom surface of the second boss are flush with the bottom surface of the cold plate body. The top surface of the first boss, the top surface of the second boss, the top surface of the first thickened platform, and the top surface of the second thickened platform are flush with each other.

5. The cooling plate according to claim 4, characterized in that, The first connecting channel is disposed on the first protrusion, the second connecting channel is disposed on the second protrusion, the first curved channel is disposed within the first thickened platform and extends along the thickness direction into the body of the cold plate and communicates with the liquid inlet, and the second curved channel is disposed within the second thickened platform and extends along the thickness direction into the body of the cold plate and communicates with the liquid outlet.

6. The cooling plate according to claim 2 or 3, characterized in that, The cooling channel includes a first channel, a second channel, and several reversing channels. The first channel and the second channel extend along the first direction. The several reversing channels are connected in parallel between the first channel and the second channel. The liquid inlet is located at one end of the first channel near the first connecting boss, and the liquid outlet is located at one end of the second channel near the second connecting boss.

7. The cooling plate according to claim 6, characterized in that, The first flow channel has an inlet that gradually narrows in width from one end to the other, and the second flow channel has an outlet that gradually narrows in width from one end to the other.

8. The cooling plate according to claim 6, characterized in that, The cold plate body includes: The upper cold plate is provided with a mounting groove, and the first curved flow channel, the first flow channel, the second curved flow channel and the second flow channel are disposed in the mounting groove; The lower cold plate is provided with a connecting groove, and a plurality of partitions are provided in the connecting groove, which are arranged parallel to each other along the second direction. The reversing flow channel is formed between adjacent partitions. The lower cold plate is installed in the mounting groove, and the first flow channel and the second flow channel are respectively connected to the two ends of the connecting groove along the second direction along the thickness direction.

9. A heat dissipation device for an optical module, characterized in that, The optical module heat dissipation device includes: The mounting cage includes a first mounting layer and a second mounting layer spaced apart along a third direction, and both the first mounting layer and the second mounting layer include a plurality of mounting positions arranged adjacent to each other along the second direction. Multiple optical modules, each of which is plugged into one of the mounting positions; Multiple heat dissipation components, each of which is correspondingly disposed on the top of one of the mounting positions, the heat dissipation components including a cooling plate as described in any one of claims 1-8; The cooling plates of the first mounting layer and the cooling plates of the second mounting layer are connected in parallel through a first pipe, and the cooling plates of the first mounting layer and the cooling plates of the second mounting layer are connected in series through a second pipe. At least a portion of the pipe body of the first pipe and the second pipe is a retractable corrugated pipe.

10. The optical module heat dissipation device according to claim 9, characterized in that, The optical module heat dissipation device also includes: The inlet pipe and outlet pipe are respectively connected to one of the cooling plates of the first mounting layer and the second mounting layer.

11. The optical module heat dissipation device according to claim 9, characterized in that, The optical module heat dissipation device also includes two fixing plates, which are respectively disposed above the first mounting layer and the second mounting layer: The heat dissipation assembly also includes an elastic mechanism disposed between the top surface of the cooling plate and the fixing plate, wherein the elastic extension and retraction direction of the elastic mechanism is perpendicular to the insertion and removal direction of the optical module. When the optical module is in an unplugged state, the elastic mechanism extends elastically; When the optical module is in the plugged-in / plugged-out state, the elastic mechanism elastically contracts and provides elastic force to the cooling plate.

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