Middle frame and processing method thereof, electronic equipment and wearable equipment

Abstract

The embodiment of the invention provides a middle frame and a processing method thereof, electronic equipment and wearable equipment, and relates to the technical field of electronic products. The middle frame comprises a metal frame body, a non-metal frame body and a sealing layer, and a protruding feed part is arranged on the inner side of the metal frame body. The non-metal frame body is arranged on the inner side of the metal frame body, the feed part penetrates through the non-metal frame body, and the end part of the feed part protrudes out of the non-metal frame body. The sealing layer is arranged around the periphery of the feed part, the sealing layer is in sealing connection with the non-metal frame body and the feed part, and the end part of the feed part protrudes out of the sealing layer. The middle frame has good waterproof performance, and the waterproof performance of the electronic equipment applying the middle frame can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic products, and in particular to a middle frame, a processing method thereof, an electronic device and a wearable device. BACKGROUND

[0002] As an important wearable device, the smart watch is widely welcomed by people because it can be used as a regular watch and can monitor the health of the wearer in real time. The middle frame of the smart watch and other wearable devices usually adopts an iron-plastic combined middle frame scheme because of the demand for antenna clearance. The appearance surface is made of metal material, and the inside is made of plastic material. However, in some cases, the metal part of the middle frame needs to be electrified so that the metal part of the middle frame can radiate signals as an antenna.

[0003] Usually, in order to electrify the metal part located on the outside of the middle frame, part of the structure of the metal part is penetrated from the outside to the inside, and a feeding point is formed on the inside of the plastic part.

[0004] However, in a smart watch with a waterproof level of 5atm, if the joint between the metal part and the plastic part cracks, there is a risk of waterproof failure. SUMMARY

[0005] The embodiments of the present application provide a middle frame, a processing method thereof, an electronic device and a wearable device, which are applied to the technical field of electronic products. The middle frame has good waterproof performance, and can improve the waterproof performance of the electronic device using the middle frame.

[0006] In a first aspect, the embodiments of the present application provide a middle frame. The middle frame includes a metal frame body, a non-metal frame body and a sealing layer. The metal frame body has a protruding feeding portion on the inside. The non-metal frame body is arranged on the inside of the metal frame body, the feeding portion penetrates the non-metal frame body, and the end of the feeding portion protrudes from the non-metal frame body. The sealing layer is arranged around the outer periphery of the feeding portion, and the sealing layer is sealingly connected with the non-metal frame body and the feeding portion. The end of the feeding portion protrudes from the sealing layer.

[0007] The middle frame in the embodiments of the present application can meet the antenna clearance requirement by arranging the metal frame body and the non-metal frame body on the inside of the metal frame body, and can ensure the antenna performance of the middle frame. By arranging the feeding portion on the inside of the metal frame body, the electronic device inside the middle frame can be electrically connected with the metal frame body, so that the metal frame body can be used as a radiator of the antenna, and the antenna performance can be improved. By arranging the sealing layer around the outer periphery of the feeding portion, the sealing property between the position where the metal frame body is provided with the feeding portion and the non-metal frame body can be improved, and the waterproof level of the middle frame can be improved.

[0008] In a possible implementation, the material of the sealing layer is epoxy glue, and the Brookfield viscosity of the epoxy glue at 85 degrees Celsius is between 5720cP and 8580cP.

[0009] By setting the sealing layer as an epoxy adhesive with a Brookfield viscosity at 85 degrees Celsius between 5720 cP and 8580 cP, the viscosity of the sealing layer is high and the flowability is small when the sealing layer is set, preventing the epoxy adhesive from flowing too much and covering the power feeding portion during the flow process, thereby affecting the conductivity of the power feeding portion.

[0010] In a possible implementation, the side of the non-metal frame body opposite to the metal frame body is provided with a groove, the groove is arranged around the power feeding portion, and the sealing layer is arranged in the groove.

[0011] By arranging the groove on the side of the non-metal frame body opposite to the metal frame body, a mounting position is provided for the sealing layer. In addition, the arrangement of the groove can embed the sealing layer in the non-metal frame body, prevent the arrangement of the sealing layer from increasing the volume of the non-metal frame body, and prevent the side of the sealing layer opposite to the metal frame body from extending to the outside of the power feeding portion, so as to ensure that the end portion of the power feeding portion can be conveniently electrically connected with the electronic device inside the middle frame. By arranging the groove around the power feeding portion, the sealing between the power feeding portion and the non-metal frame body can be increased, the sealing between the metal frame body and the non-metal frame body of the middle frame can be improved, and the waterproof level can be further improved.

[0012] In a possible implementation, in a first direction, the size of the groove bottom to the end portion of the power feeding portion is greater than or equal to 0.3 mm, and the first direction is parallel to the extension direction of the power feeding portion.

[0013] By setting the size of the groove bottom to the end portion of the power feeding portion to be greater than or equal to 0.3 mm, sufficient space can be provided for the arrangement of the sealing layer, the thickness of the sealing layer can be ensured, and the sealing between the power feeding portion and the non-metal frame body can be improved. In addition, since the viscosity of the sealing layer is high, the glue thickness during production is large, and therefore, by setting the size of the groove bottom to the end portion of the power feeding portion to be greater than or equal to 0.3 mm, sufficient space can be provided for the sealing layer when the sealing layer is arranged in the groove.

[0014] In a possible implementation, the groove includes a first groove, the first groove is located at the top end of the power feeding portion in the middle frame thickness direction, and the minimum size of the first groove in the middle frame thickness direction is greater than or equal to 0.8 mm.

[0015] By setting the minimum size of the first groove located at the top end of the power feeding portion in the middle frame thickness direction to be greater than or equal to 0.8 mm, the glue dispensing can be facilitated, and when the glue is dispensed in the first groove, sufficient flow space can be provided for the sealing layer in the middle frame thickness direction, so as to prevent the sealing layer from flowing onto the power feeding portion and affecting the conductivity of the power feeding portion.

[0016] In a possible implementation, in the thickness direction of the middle frame, the distance from the top surface of the non-metal frame body to the side of the first groove away from the power supply part is greater than 0.

[0017] In this way, the top of the first groove is provided with the partial non-metal frame body, that is, in the thickness direction of the middle frame, the sealing layer does not extend to the top of the non-metal frame body, so that the top surface of the non-metal frame body is relatively flat, which can improve the flatness of the assembly plane when assembled with other components, and further improve the overall waterproof performance.

[0018] In a possible implementation, the groove includes a second groove, the second groove is located at the bottom end of the power supply part in the thickness direction of the middle frame, and the top end of the power supply part is away from the bottom end of the power supply part. The minimum size of the second groove in the thickness direction of the middle frame is greater than or equal to 0.65 millimeters.

[0019] By setting the minimum size of the second groove at the bottom end of the power supply part in the thickness direction of the middle frame to be greater than or equal to 0.65 millimeters, the glue dispensing can be facilitated, and when dispensing glue in the second groove, sufficient flow space can be provided for the sealing layer in the thickness direction of the middle frame, thereby improving the sealing between the sealing layer and the non-metal frame body and the power supply part.

[0020] In a possible implementation, the groove includes a third groove and a fourth groove, the third groove and the fourth groove are oppositely arranged along a second direction, and the second direction is perpendicular to the first direction and the thickness direction of the middle frame. The third groove is in communication with the first groove and the second groove, the fourth groove is in communication with the first groove and the third groove, and transition arc surfaces are formed between the third groove and the power supply part and between the fourth groove and the power supply part, and the transition arc surfaces are recessed inward.

[0021] By setting the transition surfaces between the third groove and the fourth groove and the power supply part, the processing difficulty of the third groove and the fourth groove can be reduced, and the processing cost can be reduced.

[0022] In a possible implementation, the power supply part is a cuboid structure, and the cuboid structure includes a first side wall, a second side wall, a third side wall and a fourth side wall. The first side wall and the second side wall are oppositely arranged along the thickness direction of the middle frame, and the third side wall and the fourth side wall are oppositely arranged along the second direction. The transition arc surfaces are located on the third side wall and the fourth side wall.

[0023] By setting the feeding portion as a cuboid structure, the machining difficulty of the groove can be reduced. The cuboid-shaped feeding portion can form a square feed point at the end of the feeding portion, and the electric field distribution of the square feed point is uniform, which can reduce the concentration of the electric field on some points, thereby reducing the risk of electrical stress and corona discharge. In high-frequency applications, the square feed point design can better achieve impedance matching, reduce reflection and loss, and improve transmission efficiency. In addition, by locating the transition arc surface between the third side wall and the fourth side wall, the transition arc surface can be located on both sides of the feeding portion, so that the machining difficulty of the third groove and the fourth groove outside the feeding portion can be reduced when the third groove and the fourth groove are machined.

[0024] In a possible implementation, the thickness of the sealing layer is greater than or equal to 0.3 mm.

[0025] In this way, the sealing performance of the sealing layer can be improved.

[0026] In a possible implementation, the feeding portion includes a glue pulling hole, and the glue pulling hole is recessed inward from the surface of the outer peripheral wall of the feeding portion.

[0027] By providing the glue pulling hole on the feeding portion, when the non-metal frame body is arranged on the metal frame body, the contact area between the non-metal frame body and the feeding portion can be increased, the bonding force between the non-metal frame body and the metal frame body can be increased, and thus the sealing performance between the metal frame body and the non-metal frame body can be improved.

[0028] In a possible implementation, the glue pulling hole is arranged along the thickness direction of the middle frame and penetrates the feeding portion.

[0029] In this way, when the non-metal frame body is arranged on the metal frame body, the material of the non-metal frame body flows toward the glue pulling hole under the action of gravity, and thus the contact area between the non-metal frame body and the feeding portion can be increased, and the bonding force between the non-metal frame body and the metal frame body can be increased. By arranging the glue pulling hole to penetrate the feeding portion, the non-metal frame body connected at the glue pulling hole can be formed, and thus the structural strength of the non-metal frame body can be improved.

[0030] In a possible implementation, the diameter of the glue pulling hole is greater than or equal to 1 mm.

[0031] In this way, the diameter of the glue pulling hole can be relatively large, and a larger hole diameter can reduce the air bubbles generated in the gluing process, so as to avoid the influence of the air bubbles on the bonding strength and appearance quality. In the manufacturing process, a larger hole diameter is relatively easy to process, can ensure the consistency and precision of the hole diameter, and can reduce the manufacturing difficulty and cost. The larger glue pulling hole design can adapt to different types of gluing equipment, and increase the flexibility and adaptability of the process.

[0032] In a second aspect, an electronic device is provided, including any of the middle frames in the first aspect.

[0033] The electronic device provided by the embodiments of the present application can improve the waterproof performance of the electronic device by setting the middle frame of the first aspect.

[0034] In a third aspect, the embodiments of the present application provide a wearable device, which comprises the middle frame of any one of the first aspect.

[0035] The wearable device provided by the embodiments of the present application can improve the waterproof performance of the wearable device by setting the middle frame of the first aspect.

[0036] In a fourth aspect, the embodiments of the present application provide a processing method of a middle frame, which comprises: providing a metal frame body, and the inner side of the metal frame body is provided with a protruding power feeding part; setting a non-metal frame body on the inner side of the metal frame body, and the power feeding part penetrates through the non-metal frame body, and the end part of the power feeding part protrudes from the non-metal frame body; and setting a sealing layer on the outer periphery of the power feeding part, and the sealing layer is in sealing connection with the non-metal frame body and the power feeding part, and the end part of the power feeding part protrudes from the sealing layer.

[0037] The metal frame body is provided first, and the power feeding part is set on the provided metal frame body, so that the electronic devices inside the middle frame and the metal frame body are electrically connected, so that the metal frame body can serve as a radiator of an antenna, and the performance of the antenna is improved. The non-metal frame body is set on the inner side of the metal frame body, and the power feeding part penetrates through the non-metal frame body, so that the power feeding part can be located on the outer side of the non-metal frame body, so as to be electrically connected with the electronic devices inside the middle frame.

[0038] In addition, the metal frame body is provided first, and then the non-metal frame body is set on the metal frame body, which can reduce the processing difficulty and in turn reduce the processing cost. The non-metal frame body is set on the inner side of the metal frame body, which can meet the clearance requirement of the antenna and ensure the performance of the antenna using the middle frame. The sealing layer is set on the outer periphery of the power feeding part, which can enhance the sealing property between the position where the metal frame body is provided with the power feeding part and the non-metal frame body, and in turn enhance the bonding force between the metal frame body and the non-metal frame body, and in turn enhance the sealing property between the metal frame body and the non-metal frame body, and in turn enhance the waterproof level of the middle frame.

[0039] In a possible implementation, the non-metal frame body is set on the inner side of the metal frame body, and the method further comprises: setting a glue pulling hole on the power feeding part, and the glue pulling hole is recessed inward from the surface of the outer peripheral wall of the power feeding part.

[0040] In this way, when the non-metal frame body is set on the inner side of the metal frame body, part of the structure of the non-metal frame body is formed in the glue pulling hole, so as to increase the bonding force between the non-metal frame and the metal frame, and in turn increase the waterproof performance of the middle frame.

[0041] In a possible implementation, the glue pulling hole is set along the thickness direction of the middle frame, and the glue pulling hole penetrates through the power feeding part.

[0042] In this way, when the non-metal frame is arranged on the metal frame, the material of the non-metal frame flows towards the glue pulling hole under the action of gravity, thereby increasing the contact area between the non-metal frame and the feeding portion and the bonding force between the non-metal frame and the metal frame. By arranging the glue pulling hole to pass through the feeding portion, the non-metal frame can be formed at the glue pulling hole, thereby improving the structural strength of the non-metal frame.

[0043] In one possible implementation, the sealing layer is arranged on the outer periphery of the feeding portion, including: arranging a groove on the non-metal frame located on the outer periphery of the feeding portion. The sealing layer is arranged in the groove.

[0044] By arranging the groove on the side of the non-metal frame away from the metal frame, a mounting position is provided for the sealing layer. In addition, the arrangement of the groove can embed the sealing layer in the non-metal frame, prevent the arrangement of the sealing layer from increasing the volume of the non-metal frame, prevent the side of the sealing layer away from the metal frame from extending to the outside of the feeding portion, and ensure that the end of the feeding portion can be conveniently electrically connected to the electronic devices inside the middle frame. By arranging the groove around the feeding portion, the sealing between the feeding portion and the non-metal frame can be increased, the sealing between the metal frame and the non-metal frame of the middle frame can be improved, and the waterproof level can be improved.

[0045] In one possible implementation, the sealing layer is arranged in the groove, including: dispensing glue in the groove around the feeding portion by using an L-shaped needle, and standing still at 85 degrees Celsius for at least 30 minutes, wherein the material of the sealing layer is epoxy glue, and the Brookfield viscosity of the epoxy glue at 85 degrees Celsius is between 5720 cP and 8580 cP.

[0046] By using the L-shaped needle for dispensing glue, the L-shaped needle has a right-angle bend, which enables it to dispense glue in difficult-to-reach areas. This design is particularly suitable for operation in narrow or complex geometries. Dispensing glue can be performed at various angles and positions, which is particularly suitable for complex assembly and manufacturing processes, and can accurately control the flow and position of glue. The L-shaped needle can accurately control the flow and position of glue, ensuring the consistency and accuracy of dispensing glue. Precise dispensing control can reduce glue waste and reduce production costs. By standing still at 85 degrees Celsius for at least 30 minutes, the epoxy glue can be fully solidified, improving the sealing of the sealing layer and the feeding portion and the non-metal frame.

[0047] In one possible implementation, the non-metal frame is arranged on the inner side of the metal frame, including: injection molding the non-metal frame on the inner side of the metal frame.

[0048] By injection molding the non-metal frame on the inner side of the metal frame, complex shapes and details can be achieved due to the injection molding process, meeting the diversified design requirements, and thus meeting the characteristics of the diversity of non-metal frame structures. Non-metal materials can integrate multiple functions such as embedding electronic components, wires, seals, etc. during the injection molding process, improving the integration and functionality of the product. The cost of non-metal materials is usually lower than that of metal materials, and through composite manufacturing, the overall manufacturing cost can be reduced. The injection molding process can realize one-time molding, reducing multiple processing and assembly steps, and improving production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0049] Figure 1 is a cross-sectional schematic view of a middle frame structure;

[0050] Figure 2 is a structural schematic view of an electronic device provided by an embodiment of the present application;

[0051] Figure 3 is a cross-sectional structural schematic view of a middle frame provided by an embodiment of the present application;

[0052] Figure 4 is a partial structural schematic view of a middle frame provided by an embodiment of the present application;

[0053] Figure 5 is a partial structural schematic view of a metal frame of a middle frame provided by an embodiment of the present application;

[0054] Figure 6 is a partial structural schematic view of the inner side of a middle frame provided by an embodiment of the present application;

[0055] Figure 7 is a cross-sectional structural schematic view of a middle frame provided by an embodiment of the present application;

[0056] Figure 8 is a partial structural schematic view of a metal frame of a middle frame provided by an embodiment of the present application;

[0057] Figure 9 is a cross-sectional structural schematic view of a middle frame provided by an embodiment of the present application;

[0058] Figure 10 is a flowchart of a preparation method of a middle frame provided by an embodiment of the present application;

[0059] Figure 11 is a flowchart of a preparation method of a middle frame provided by an embodiment of the present application.

[0060] BRIEF DESCRIPTION OF DRAWINGS:

[0061] 10, 100 - middle frame; 110 - metal frame; 111 - power feeding part;

[0062] 112 - glue hole; 113 - end portion; 114 - first side wall;

[0063] 115 - second side wall; 116 - third side wall; 117 - fourth side wall;

[0064] 120 - non-metal frame; 121 - groove; 122 - first groove;

[0065] 123 - second groove; 124 - third groove; 125 - fourth groove;

[0066] 126 - transition arc surface; 130 - sealing layer; 1000 - electronic device;

[0067] 200 - device body; 210 - display screen; 300 - watchband;

[0068] 11 - metal part; 12 - non-metal part. DETAILED DESCRIPTION

[0069] In order to facilitate the clear description of the technical solutions of the embodiments of the present application, the following briefly introduces some terms and technologies involved in the embodiments of the present application:

[0070] Injection molding is a process of injecting molten plastic material into a mold and forming a specific shape after cooling.

[0071] CNC machining (computer numerical control) is a technology of using a computer to control a machine tool for precision machining.

[0072] Brookfield viscosity is usually measured in units of centipoise (cP), and 1 centipoise is equal to 0.01 poise (Poise). In the International System of Units, the unit of viscosity is Pascal-second (Pa·s), and 1 Pa·s is equal to 1000 cP.

[0073] In the embodiments of the present application, the terms "first", "second", etc. are used to distinguish the same or similar items with basically the same function and effect. For example, the first chip and the second chip are only used to distinguish different chips, and do not limit the sequence. Those skilled in the art can understand that the terms "first", "second", etc. do not limit the quantity and execution order, and the terms "first", "second", etc. also do not necessarily mean different.

[0074] It should be noted that in the embodiments of the present application, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "for example" should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the embodied words are used merely to present concepts in a concrete manner.

[0075] In the embodiments of the present application, "at least one" means one or more, and "multiple" means two or more. The association relationship of "and / or" describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the cases of A alone, A and B together, and B alone, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it. "At least one of the following" or similar expressions means any combination of these items, including any combination of single item or multiple items. For example, at least one of a, b, or c can represent a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, and c can be single or multiple.

[0076] As one of the important wearable products, the smart watch not only has the basic functions of the conventional electronic watch, but also can realize the detection of sports health. For the smart watch, the watchband has a direct impact on the wearing scene and comfort. Different watchbands have different comfort levels in different wearing scenes, and the stability of sports health detection is also different. In addition, for users, the smart watch usually has waterproof performance.

[0077] The wearable device with a 5atm waterproof level means that the wearable device can withstand a pressure of 5 atmospheres, equivalent to a depth of 50 meters underwater. This waterproof level is suitable for daily use, including washing hands, raining, swimming, etc., but not suitable for diving or high-pressure water flow environment. Due to the antenna clearance requirement of the wearable product, the middle frame usually adopts an iron-plastic combined middle frame scheme, that is, the appearance surface is made of metal material, and the inside is made of non-metal material such as plastic or ceramic.

[0078] As shown in Figure 1 The middle frame 10 includes a metal part 11 and a non-metal part 12, where the metal part 11 is located outside the non-metal part 12. When the side wall of the middle frame 10 needs to be electrically connected to other electronic devices, the metal part 11 of the middle frame 10 will be exposed. However, in the case of 5atm, the iron-plastic combined part is prone to sealing failure. Among them, Figure 1 The dotted line with an arrow in

[0079] In order to solve the above technical problems and improve the waterproof performance, the application provides a middle frame, a processing method thereof, an electronic device and a wearable device.

[0080] The middle frame, the processing method thereof, the electronic device and the wearable device provided by the application will be described below in combination with the drawings.

[0081] As shown in Figure 2 The application provides an electronic device 1000, which comprises a middle frame 100. The middle frame 100 can comprise a metal frame body 110, a non-metal frame body 120 and a sealing layer 130 (see Figure 3 The electronic device 1000 can be a wearable device. The wearable device can be a smart watch, which can comprise a device body 200 and a watch band 300 connected with the device body 200. The device body 200 comprises the middle frame 100 provided by the above embodiments, and the device body 200 further comprises a display screen 210. The middle frame 100 is arranged at the outer periphery of the display screen 210, and the watch band 300 is connected with the device body 200 through the middle frame 100.

[0082] It should be noted that the electronic device can be a handheld device provided with a middle frame, a vehicle-mounted device, etc. For example, some electronic devices are: a mobile phone, a tablet computer, a palm computer, a notebook computer, a mobile internet device (MID), a wearable device, a virtual reality (VR) device, an augmented reality (AR) device, a wireless terminal in industrial control, a wireless terminal in self driving, a wireless terminal in remote medical surgery, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, a cellular phone, a cordless phone, a session initiation protocol (SIP) phone, a wireless local loop (WLL) station, a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, a wearable device, a terminal device in a 5G network, or a terminal device in a future evolved public land mobile network (PLMN), etc., and the embodiments of the present application are not limited thereto.

[0083] The electronic device provided by the embodiments of the present application can improve the waterproof performance of the middle frame by setting the middle frame to include a metal frame body and a non-metal frame body and setting a sealing layer outside the power feeding part, thereby improving the waterproof performance of the electronic device.

[0084] The embodiments of the present application also provide a wearable device, which can at least include a middle frame. The middle frame 100 includes a metal frame body 110, a non-metal frame body 120, and a sealing layer 130 (see Figure 3

[0085] ​It should be noted that wearable devices, also known as wearable smart devices, are a general term for devices that utilize wearable technology to intelligently design and develop everyday wearables, such as glasses, gloves, watches, clothing, and shoes. Wearable devices are portable devices that are worn directly on the body or integrated into the user's clothing or accessories. Wearable devices are not merely hardware devices; they achieve powerful functions through software support, data interaction, and cloud interaction. Broadly speaking, wearable smart devices include those that are feature-rich, large in size, and can perform complete or partial functions without relying on a smartphone, such as smartwatches or smart glasses, as well as those that focus on a specific application function and require the use of other devices such as smartphones, such as various smart bracelets and smart jewelry for vital sign monitoring.

[0086] The wearable device provided in this application embodiment can be a smartwatch, smart bracelet, etc. with a mid-frame.

[0087] The wearable device provided in this application embodiment can improve its waterproof performance by setting the middle frame in this application embodiment.

[0088] The middle frame in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0089] It should be noted that in this application, the thickness direction of the middle frame is taken as the z-direction, the extension direction of the power supply part is taken as the x-direction, and the second direction is taken as the y-direction.

[0090] like Figure 3 As shown in the figure, this application embodiment proposes a middle frame 100, which includes a metal frame 110, a non-metallic frame 120, and a sealing layer 130. The metal frame 110 has a protruding power supply portion 111 on its inner side. The non-metallic frame 120 is disposed inside the metal frame 110, and the power supply portion 111 penetrates through the non-metallic frame 120, with its end portion 113 protruding out of the non-metallic frame 120. For example, one end of the power supply portion 111 passes through the non-metallic frame 120 and protrudes from the side of the non-metallic frame 120 opposite to the metal frame 110. The sealing layer 130 surrounds the outer periphery of the power supply portion 111, and the sealing layer 130 is sealed to both the non-metallic frame 120 and the power supply portion 111. The end portion 113 of the power supply portion 111 protrudes out of the sealing layer 130; for example, the sealing layer 130 does not cover the end portion 113 of the power supply portion 111.

[0091] The middle frame 100 in the embodiment of the present application can meet the clearance requirement of the antenna by setting the metal frame body 110 and the non-metal frame body 120 inside the metal frame body 110, and ensure the antenna performance of the middle frame 100. The electronic devices inside the middle frame 100 can be electrically connected with the metal frame body 110 by setting the feed part 111 inside the metal frame body 110, so that the metal frame body 110 can be used as a radiator of the antenna to improve the antenna performance. The sealing layer 130 is set on the outer periphery of the feed part 111 to enhance the sealing between the position of the metal frame body 110 where the feed part 111 is arranged and the non-metal frame body 120, thereby improving the waterproof level of the middle frame 100.

[0092] For example, the material of the non-metal frame body 120 can be plastic, polycarbonate, polyamide, polypropylene, composite material, glass fiber reinforced plastic, rubber and elastomer, silicone rubber, ceramic material, etc. In the embodiment of the present application, the material of the non-metal frame body 120 is not limited further.

[0093] For example, the material of the metal frame body 110 can be stainless steel, aluminum alloy, titanium alloy, etc. In the embodiment of the present application, the material of the metal frame body 110 is not limited further.

[0094] In a possible implementation, the material of the sealing layer 130 is epoxy glue, and the Brookfield viscosity of the epoxy glue at 85 degrees Celsius is between 5720 cP and 8580 cP.

[0095] For example, the Brookfield viscosity of the epoxy glue at 85 degrees Celsius can be 5720 cP, 6000 cP, 7150 cP, 7500 cP, 8000 cP, 8580 cP, etc. In the embodiment of the present application, the Brookfield viscosity of the epoxy glue at 85 degrees Celsius is not limited further.

[0096] It should be noted that the Brookfield viscosity of the epoxy glue at 85 degrees Celsius can have a certain error range, for example, the temperature within the range of plus or minus 3 degrees Celsius can be regarded as 85 degrees Celsius.

[0097] By setting the sealing layer 130 as the epoxy glue with the Brookfield viscosity between 5720 cP and 8580 cP at 85 degrees Celsius, the viscosity of the sealing layer 130 is high and the flowability is small when the sealing layer 130 is set, so that the flowability of the epoxy glue is prevented from being too large when the sealing layer 130 is set, and the feed part 111 is covered in the flowing process, thereby affecting the conductivity of the feed part 111.

[0098] In a possible implementation, as shown in FIG. 2, the sealing layer 130 is arranged on the outer periphery of the feed part 111. Figure 4As shown, the non-metal frame 120 can be provided with a groove 121 on the side facing away from the metal frame 110, and the sealing layer 130 can be arranged in the groove 121.

[0099] By arranging the groove 121 on the side of the non-metal frame 120 facing away from the metal frame 110, a mounting position can be provided for the sealing layer 130. In addition, the groove 121 can be arranged such that the sealing layer 130 is embedded in the non-metal frame 120, preventing the arrangement of the sealing layer 130 from increasing the volume of the non-metal frame 120, and preventing the side of the sealing layer 130 facing away from the metal frame 110 from extending to the outside of the feed portion 111, so as to ensure that the end portion 113 of the feed portion 111 can be conveniently electrically connected to the electronic devices inside the middle frame 100. By arranging the groove 121 around the feed portion 111, the sealing between the feed portion 111 and the non-metal frame 120 can be increased, and the sealing between the metal frame 110 and the non-metal frame 120 of the middle frame 100 can be improved, thereby improving the waterproof level.

[0100] Of course, in some embodiments, the groove 121 can not be arranged, and the sealing layer 130 can be directly arranged outside the feed portion 111, so that the outer periphery of the feed portion 111 can be sealingly connected to the non-metal frame 120.

[0101] In a possible implementation, in a first direction (x direction), the size a of the groove bottom of the groove 121 to the end portion 113 of the feed portion 111 is greater than or equal to 0.3 mm, and the first direction is parallel to the extension direction of the feed portion 111. For example, in the x direction, the size of the groove bottom of the groove 121 to the end portion 113 of the feed portion 111 can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, or 0.7 mm, etc. In the embodiments of the present application, the size of the groove bottom of the groove 121 to the end portion 113 of the feed portion 111 is not limited further.

[0102] By setting the size of the groove bottom of the groove 121 to the end portion 113 of the feed portion 111 to be greater than or equal to 0.3 mm, sufficient space can be provided for the arrangement of the sealing layer 130, and the thickness of the sealing layer 130 can be ensured, and the sealing between the feed portion 111 and the non-metal frame 120 can be improved. In addition, since the viscosity of the sealing layer 130 is high, the glue thickness during production is large, and therefore, by setting the size of the groove bottom of the groove 121 to the end portion 113 of the feed portion 111 to be greater than or equal to 0.3 mm, sufficient space can be provided for the sealing layer 130 when the sealing layer 130 is arranged in the groove 121.

[0103] In a possible implementation, as shown in FIG. 2, the groove 121 can be arranged on the side of the non-metal frame 120 facing away from the metal frame 110, and the sealing layer 130 can be arranged in the groove 121. Figure 5As shown, the feeding portion 111 is in a cuboid structure. In a possible implementation, the cuboid structure includes a first side wall 114, a second side wall 115, a third side wall 116, and a fourth side wall 117. Among them, the first side wall 114 and the second side wall 115 are oppositely arranged along the thickness direction of the middle frame 100, and the third side wall 116 and the fourth side wall 117 are oppositely arranged along the second direction.

[0104] By setting the feeding portion 111 as a cuboid structure, the machining difficulty of the groove 121 can be reduced. The cuboid-shaped feeding portion 111 can form a square feed point at the end 113 of the feeding portion 111. The electric field distribution of the square feed point is uniform, which can reduce the concentration of the electric field on some points, thereby reducing the risk of electrical stress and corona discharge. In high-frequency applications, the square feed point design can better achieve impedance matching, reduce reflection and loss, and improve transmission efficiency.

[0105] As shown in Figure 6 As shown, the groove 121 can include a first groove 122, a second groove 123, a third groove 124, and a fourth groove 125 arranged at the outer periphery of the feeding portion 111. The first groove 122 and the second groove 123 are respectively located at the top end and the bottom end of the feeding portion 111 along the thickness direction (z direction) of the middle frame 100. The top end of the feeding portion 111 is away from the bottom end of the feeding portion 111. The third groove 124 and the fourth groove 125 are oppositely arranged along the second direction (y direction), and the second direction is perpendicular to the first direction and the thickness direction of the middle frame 100.

[0106] The third groove 124 communicates with the first groove 122 and the second groove 123, the fourth groove 125 communicates with the first groove 122 and the third groove 124, and the third groove 124 and the feeding portion 111 and the fourth groove 125 and the feeding portion 111 are both formed with a transition arc surface 126, and the transition arc surface 126 is recessed inward. Among them, the transition arc surface 126 is located at the third side wall 116 and the fourth side wall 117.

[0107] By setting the transition surface between the third groove 124 and the fourth groove 125 and the feeding portion 111, the machining difficulty of the third groove 124 and the fourth groove 125 can be reduced, thereby reducing the processing cost. In addition, by locating the transition arc surface 126 at the third side wall 116 and the fourth side wall 117, the transition arc surface 126 can be located on both sides of the feeding portion 111. Therefore, when machining the third groove 124 and the fourth groove 125 outside the feeding portion 111, the machining difficulty of the third groove 124 and the fourth groove 125 can be reduced.

[0108] It should be noted that in some embodiments, in order to increase the bonding area between the feeding portion 111 and the non-metal frame 120, the transition arc surface 126 can also not be arranged, and the specific arrangement can be determined according to the specific

[0109] As shown in Figure 7 the minimum size b of the first groove 122 in the thickness direction of the middle frame 100 is greater than or equal to 0.8 mm. For example, the minimum size of the first groove 122 in the thickness direction of the middle frame 100 can be 0.8 mm, 0.9 mm, 1 mm, 1.1 mm, 1.2 mm, etc. In the embodiments of the present application, the minimum size of the first groove 122 in the thickness direction of the middle frame 100 is not further limited.

[0110] By setting the minimum size of the first groove 122 at the top end of the feed portion 111 in the thickness direction of the middle frame 100 to be greater than or equal to 0.8 mm, the glue dispensing can be facilitated, and when dispensing glue in the first groove 122, the sealing layer 130 can be provided with sufficient flow space in the thickness direction of the middle frame 100, preventing the sealing layer 130 from flowing onto the feed portion 111 and affecting the conductivity of the feed portion 111.

[0111] In a possible implementation, in the thickness direction of the middle frame 100, the distance c from the top surface of the non-metal frame 120 to the side of the first groove 122 away from the feed portion 111 is greater than 0.

[0112] In this way, the top of the first groove 122 is provided with part of the non-metal frame 120, that is, in the thickness direction of the middle frame 100, the sealing layer 130 does not extend to the top of the non-metal frame 120, so that the top surface of the non-metal frame 120 is relatively flat, which can improve the flatness of the assembly plane when assembling with other components, and further improve the overall waterproof performance.

[0113] Of course, in some embodiments in which the top of the non-metal frame 120 does not need to be connected with other components, the top of the sealing layer 130 can also be arranged to extend to the top of the non-metal frame 120, which can increase the size of the sealing layer 130 and further improve the sealing performance between the non-metal frame 120 and the feed portion 111.

[0114] In addition, in some embodiments, a chamfer can also be arranged at the transition position between the inner wall and the top surface of the non-metal frame 120, which can reduce the right angles inside the middle frame 100 and reduce the sharp parts inside the middle frame 100, thereby reducing the scratching of other components during assembly and reducing the assembly difficulty.

[0115] In a possible implementation, the minimum size of the second groove 123 in the thickness direction of the middle frame 100 is greater than d or equal to 0.65 mm.

[0116] By making the minimum dimension of the second groove 123 located at the bottom of the power supply section 111 in the thickness direction of the middle frame 100 greater than or equal to 0.65 mm, it is convenient to apply adhesive. When applying adhesive in the second groove 123, sufficient flow space can be provided for the sealing layer 130 in the thickness direction of the middle frame 100, thereby improving the sealing performance between the sealing layer 130 and the non-metallic frame 120 and the power supply section 111.

[0117] In one possible implementation, the thickness e of the sealing layer 130 is greater than or equal to 0.3 mm. This configuration can improve the sealing performance of the sealing layer 130.

[0118] In one possible implementation, such as Figure 8 As shown, the power supply part 111 includes a glue-pulling hole 112, which is recessed inward from the surface of the outer peripheral wall of the power supply part 111.

[0119] In the embodiments of this application, the depth of the recessed adhesive hole 112 is not limited. For example, it can directly penetrate the power supply part 111. Of course, the depth of the recess can also not penetrate the power supply part 111, such as extending to half the thickness of the power supply part 111.

[0120] By providing adhesive-holding holes 112 in the power supply section 111, the contact area between the non-metallic frame 120 and the power supply section 111 can be increased when the non-metallic frame 120 is placed on the metal frame 110. This increases the bonding force between the non-metallic frame 120 and the metal frame 110, enhances the adhesive holding force between the non-metallic frame 120 and the metal frame 110, and thereby improves the sealing performance between the metal frame 110 and the non-metallic frame 120.

[0121] For example, such as Figure 9 As shown, the adhesive-pulling hole 112 is provided along the thickness direction of the middle frame 100, and the adhesive-pulling hole 112 passes through the power supply part 111.

[0122] This configuration allows the material of the non-metallic frame 120 to flow into the adhesive-drawing hole 112 under gravity when the non-metallic frame 120 is placed on the metal frame 110. This increases the contact area between the non-metallic frame 120 and the power supply section 111, thereby increasing the bonding force between them. By making the adhesive-drawing hole 112 penetrate the power supply section 111, a connected non-metallic frame 120 can be formed at the adhesive-drawing hole 112, thus improving the structural strength of the non-metallic frame 120.

[0123] Of course, in other embodiments, the adhesive-pulling hole 112 can also be arranged in other directions, for example, it can be arranged along the y direction. In this embodiment, the arrangement direction of the adhesive-pulling hole 112 is not further limited.

[0124] In one possible implementation, the diameter of the adhesive-pulling hole 112 is greater than or equal to 1 mm. For example, the diameter of the adhesive-pulling hole 112 can be 1 mm, 2 mm, 3 mm, etc. In this embodiment, the diameter of the adhesive-pulling hole 112 is not further limited.

[0125] It should be noted that the number of adhesive-pull holes 112 is not limited in this embodiment. For example, there can be multiple adhesive-pull holes 112. By providing multiple adhesive-pull holes 112, the bonding force between the non-metallic frame 120 and the metal frame 110 can be increased. In addition, providing multiple adhesive-pull holes 112 can also reduce the weight of the middle frame 100, reduce the amount of metal used, and thus reduce costs.

[0126] Of course, in some embodiments, a relatively large-diameter adhesive-pulling hole 112 can be provided, which can reduce the number of times the adhesive-pulling hole 112 is processed, thereby reducing processing costs. In the embodiments of this application, the number of adhesive-pulling holes 112 is not further limited.

[0127] This design allows for a larger diameter of the adhesive application hole 112. A larger hole diameter reduces air bubbles generated during adhesive application, preventing them from affecting bond strength and appearance quality. During manufacturing, a larger hole diameter is relatively easier to process, ensuring consistency and precision, and reducing manufacturing difficulty and cost. The larger adhesive application hole 112 design also adapts to different types of adhesive application equipment, increasing process flexibility and adaptability.

[0128] This application provides a method for processing a mid-frame, such as... Figure 10 As shown, the method may include the following steps.

[0129] S101. A metal frame is provided, with a protruding power supply section on the inner side of the metal frame.

[0130] S102. A non-metallic frame is provided inside the metal frame, the power supply part passes through the non-metallic frame, and the end of the power supply part protrudes out of the non-metallic frame.

[0131] S103. A sealing layer is provided on the outer periphery of the power supply part. The sealing layer is sealed to the non-metallic frame and the power supply part. The end of the power supply part protrudes from the sealing layer.

[0132] By first providing a metal frame and then installing a feed section on the metal frame, electrical connection can be established between the electronic components inside the middle frame and the metal frame, allowing the metal frame to function as a radiator for the antenna and improving antenna performance. Alternatively, by installing a non-metallic frame inside the metal frame and having the feed section penetrate the non-metallic frame, the feed section can be located outside the non-metallic frame for electrical connection with the electronic components inside the middle frame.

[0133] Furthermore, providing the metal frame first and then mounting the non-metallic frame on top of it reduces manufacturing difficulty and thus lowers manufacturing costs. Placing the non-metallic frame inside the metal frame meets the antenna's clearance requirements, ensuring antenna performance using this midframe. By adding a sealing layer around the feed section, the sealing between the feed section and the non-metallic frame is strengthened, improving the bonding strength between them and enhancing the overall sealing performance, thereby improving the midframe's waterproof rating.

[0134] In one possible implementation, such as Figure 11 As shown, the following steps may also be included before step S102.

[0135] S1011. A glue-pulling hole is provided on the power supply part, and the glue-pulling hole is recessed inward from the surface of the outer peripheral wall of the power supply part.

[0136] This design allows the non-metallic frame to be partially formed within the adhesive holes when placed inside the metal frame, thereby increasing the bonding strength between the non-metallic and metal frames and thus enhancing the waterproof performance of the mid-frame.

[0137] In one possible implementation, the adhesive-pulling hole is set along the thickness direction of the middle frame and passes through the power supply section.

[0138] This design allows the material of the non-metallic frame to flow into the adhesive-drawing hole under gravity when the non-metallic frame is placed on top of the metal frame. This increases the contact area between the non-metallic frame and the power supply unit, thereby increasing the bonding strength between them. By making the adhesive-drawing hole penetrate the power supply unit, a connected non-metallic frame can be formed at the adhesive-drawing hole, thus improving the structural strength of the non-metallic frame.

[0139] The following is a detailed explanation of step S103.

[0140] Step S103 may specifically include the following steps.

[0141] Step 1.1: Set a groove on the non-metallic frame located on the outer periphery of the power supply section.

[0142] Step 1.2: Set a sealing layer in the groove.

[0143] By providing a groove on the side of the non-metallic frame facing away from the metallic frame, an installation position can be provided for the sealing layer. Furthermore, the groove allows the sealing layer to be embedded within the non-metallic frame, preventing it from increasing the volume of the non-metallic frame and preventing the sealing layer from extending beyond the outside of the power supply section. This ensures that the end of the power supply section can easily connect to electronic components inside the middle frame. By surrounding the power supply section with the groove, the sealing between the power supply section and the non-metallic frame is increased, improving the sealing between the metallic and non-metallic frames of the middle frame, thereby enhancing the waterproof rating.

[0144] In one possible implementation, step 1.2 may specifically include the following steps.

[0145] Step 1.3: Apply adhesive to the groove around the circumference of the power supply part using an L-shaped needle.

[0146] Step 1.4: Let stand at 85 degrees Celsius for at least 30 minutes. The sealing layer material is epoxy resin, and the Brinell viscosity of the epoxy resin at 85 degrees Celsius is between 5720 cP and 8580 cP.

[0147] Dispensing is performed using an L-shaped needle, which features a right-angle bend that allows for dispensing in hard-to-reach areas. This design is particularly suitable for operations in tight or complex geometries. Dispensing can be performed at various angles and positions, making it especially suitable for complex assembly and manufacturing processes, and allowing for precise control of adhesive flow and location. The L-shaped needle ensures consistent and accurate dispensing by precisely controlling the flow and location of the adhesive. Precise dispensing control reduces adhesive waste and lowers production costs. By allowing the epoxy adhesive to stand at 85 degrees Celsius for at least 30 minutes, it can be fully cured, improving the sealing performance of the sealing layer, power supply components, and non-metallic frame.

[0148] In one possible implementation, the specific process of setting a non-metallic frame inside the metal frame can be to injection mold the non-metallic frame inside the metal frame.

[0149] By injection molding a non-metallic frame inside a metal frame, the injection molding process allows for the manufacture of complex shapes and details, meeting diverse design needs and accommodating the versatility of non-metallic frame structures. Non-metallic materials can integrate multiple functions during injection molding, such as embedding electronic components, wires, and seals, improving product integration and functionality. The cost of non-metallic materials is typically lower than that of metallic materials, and composite manufacturing can reduce overall manufacturing costs. Injection molding allows for one-step molding, reducing multiple processing and assembly steps and improving production efficiency.

[0150] Of course, in other embodiments, the specific process of setting a non-metallic frame inside the metal frame can be nano-injection molding, two-color injection molding, etc. In this embodiment, the specific process of setting a non-metallic frame inside the metal frame is not further limited.

[0151] The method for preparing the middle frame provided in this application embodiment has a simple processing technology and can reduce processing costs.

[0152] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solution of the present invention should be included within the scope of protection of the present invention.

Claims

1. A middle frame, characterized in that, The metal frame body has a protruding power feeding portion on the inner side thereof; The non-metal frame body is arranged on the inner side of the metal frame body, the power feeding portion penetrates through the non-metal frame body, and the end of the power feeding portion protrudes out of the non-metal frame body; The sealing layer is arranged around the outer periphery of the power feeding portion, and the sealing layer is sealingly connected with the non-metal frame body and the power feeding portion, and the end of the power feeding portion protrudes out of the sealing layer. The material of the sealing layer is epoxy glue, and the Brookfield viscosity of the epoxy glue at 85 degrees Celsius is between 5720 cP and 8580 cP.

2. The middle frame of claim 1, wherein, The side of the non-metal frame body away from the metal frame body is provided with a groove, the groove is arranged around the power feeding portion, and the sealing layer is arranged in the groove.

3. The middle frame of claim 2, wherein, In a first direction parallel to the extension direction of the power feeding portion, the size of the groove bottom to the end of the power feeding portion is greater than or equal to 0.3 mm.

4. The middle frame of claim 3, wherein, The groove includes a first groove at the top end of the power feeding portion in the thickness direction of the middle frame, and the minimum size of the first groove in the thickness direction of the middle frame is greater than or equal to 0.8 mm.

5. The middle frame of claim 4, wherein, In the thickness direction of the middle frame, the distance from the top surface of the non-metal frame body to the side of the first groove away from the power feeding portion is greater than 0.

6. The middle frame of claim 5, wherein, The groove includes a second groove at the bottom end of the power feeding portion in the thickness direction of the middle frame, and the top end of the power feeding portion is opposite to the bottom end of the power feeding portion; 7. The middle frame of claim 5, wherein, The minimum size of the second groove in the thickness direction of the middle frame is greater than or equal to 0.65 mm. The groove includes a third groove and a fourth groove, the third groove and the fourth groove are oppositely arranged along a second direction, and the second direction is perpendicular to the first direction and the thickness direction of the middle frame; 8. The middle frame of claim 7, wherein, The third groove and the first groove and the second groove are in communication, the fourth groove and the first groove and the third groove are in communication, and the third groove and the fourth groove and the power feeding portion are formed with a transition arc surface, and the transition arc surface is recessed inward. The power feeding portion is a cuboid structure, and the cuboid structure includes a first side wall, a second side wall, a third side wall and a fourth side wall; wherein 9. The middle frame of claim 8, wherein, The first side wall and the second side wall are oppositely arranged along the thickness direction of the middle frame, and the third side wall and the fourth side wall are oppositely arranged along the second direction; The transition arc surface is located between the third side wall and the fourth side wall. The thickness of the sealing layer is greater than or equal to 0.3 mm.

10. The middle frame according to any one of claims 1-9, wherein, The power feeding portion includes a glue pulling hole, and the glue pulling hole is recessed inward from the surface of the outer peripheral wall of the power feeding portion.

11. The middle frame according to any one of claims 1-9, wherein, The glue pulling hole is arranged along the thickness direction of the middle frame, and the glue pulling hole penetrates through the power feeding portion.

12. The middle frame of claim 11, wherein, The diameter of the glue pulling hole is greater than or equal to 1 mm.

13. The middle frame of claim 11, wherein, The middle frame includes any one of the middle frames according to claims 1-13.

14. An electronic device, comprising: The middle frame includes any one of the middle frames according to claims 1-13.

15. A wearable device, comprising: The metal frame body has a protruding power feeding portion on the inner side thereof; 16. A method of processing a middle frame, characterized by, ​ ​ A non-metal frame is arranged inside the metal frame, the feeding part penetrates the non-metal frame, and the end of the feeding part protrudes from the non-metal frame; A sealing layer is arranged on the outer periphery of the feeding part, the sealing layer is in sealing connection with the non-metal frame and the feeding part, and the end of the feeding part protrudes from the sealing layer.

17. The method of claim 16, wherein, The non-metal frame arranged inside the metal frame comprises: A glue pulling hole is arranged on the feeding part, and the glue pulling hole is recessed inward from the surface of the outer peripheral wall of the feeding part.

18. The method of claim 17, wherein, The glue pulling hole is arranged along the thickness direction of the middle frame, and the glue pulling hole penetrates the feeding part.

19. The method of any one of claims 16-18, wherein, The sealing layer arranged on the outer periphery of the feeding part comprises: A groove is arranged on the non-metal frame located on the outer periphery of the feeding part; The sealing layer is arranged in the groove.

20. The method of claim 19, wherein, The sealing layer arranged in the groove comprises: The glue pulling hole is arranged along the thickness direction of the middle frame, and the glue pulling hole penetrates the feeding part.

21. The method of any one of claims 16-18, wherein, The sealing layer arranged on the outer periphery of the feeding part comprises: A groove is arranged on the non-metal frame located on the outer periphery of the feeding part; The sealing layer is arranged in the groove. The sealing layer arranged in the groove comprises: The glue pulling hole is arranged along the thickness direction of the middle frame, and the glue pulling hole penetrates the feeding part. The non-metal frame arranged inside the metal frame comprises: The non-metal frame is injection molded inside the metal frame.

Images