Corrosion / erosion sensor and corresponding method of operation

Abstract

The present disclosure relates to corrosion / erosion sensors, such as wireless corrosion / erosion sensors, and related systems and methods.

Description

[0001] Related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 509,515, filed June 21, 2023, entitled “Corrosion / Erosion Sensors and Related Systems and Methods,” which is incorporated herein by reference in its entirety for all purposes. Technical Field

[0003] This paper provides an overview of corrosion / erosion sensors, such as wireless corrosion / erosion sensors, as well as related systems and methods. Summary of the Invention

[0004] This disclosure relates to corrosion / erosion sensors, such as wireless corrosion / erosion sensors, and related systems and methods. In some cases, the subject matter of this disclosure relates to interrelated products, alternative solutions to specific problems, and / or multiple different uses of one or more systems and / or articles.

[0005] According to certain embodiments, a sensor system is described. In some embodiments, the sensor system includes a single circuit comprising a first RLC circuit path and a second RLC circuit path, wherein at least a portion of the first RLC circuit path is configured to corrode and / or erode, and the second RLC circuit path is configured as a reference circuit such that one or more circuit signals can be used to determine whether a portion of the first RLC circuit path has been corroded and / or erode and / or the extent to which a portion of the first RLC circuit path has been corroded and / or erode.

[0006] According to some embodiments, a method for operating a sensor system is described. In some embodiments, the method includes measuring a first signal of a single circuit disposed in the sensor system using the sensor system, wherein the single circuit includes a first RLC circuit path and a second RLC circuit path, wherein at least a portion of the first RLC circuit path is configured to be corroded and / or eroded, and the second RLC circuit path is configured as a reference circuit, such that one or more circuit signals can be used at least partially to determine whether a portion of the first RLC circuit path has been corroded and / or eroded and / or the extent to which a portion of the first RLC circuit path has been corroded and / or eroded. In some embodiments, the method includes measuring a second signal of the single circuit using the sensor system, wherein the second signal is a reference signal of the reference circuit. In some embodiments, the method includes using a processor at least partially based on a comparison between the first signal and the second signal to determine whether a portion of the first RLC circuit path has been corroded and / or eroded and / or the extent to which a portion of the first RLC circuit path has been corroded and / or eroded.

[0007] Other advantages and novel features of this disclosure will become apparent from the following detailed description of various non-limiting embodiments of this disclosure when considered in conjunction with the accompanying drawings. In the event of conflicting and / or inconsistent disclosures in this specification and in documents incorporated by reference, this specification shall prevail. Attached Figure Description

[0008] Non-limiting embodiments of this disclosure will be described by way of example with reference to the accompanying drawings, which are schematic and not intended to be drawn to scale unless otherwise indicated. In the drawings, each identical or substantially identical component shown is generally indicated by a single reference numeral. For clarity, not every component is labeled in every drawing, nor is every component shown in every embodiment of this disclosure, unless illustration is required to allow those skilled in the art to understand the disclosure.

[0009] Figure 1A It is a top view schematic illustration of a circuit including a first RLC circuit path and a second RLC circuit path, wherein the first RLC circuit path includes an inductor and a first capacitor electronically coupled to the inductor, and the second RLC circuit path includes an inductor and a second capacitor electronically coupled to the inductor.

[0010] Figure 1B yes Figure 1A A schematic top view of the circuit, in which the first RLC circuit path is represented by a dashed line.

[0011] Figure 1C yes Figure 1AA schematic top view of the circuit, in which the second RLC circuit path is represented by a dashed line.

[0012] Figure 1D It is a top view schematic illustration of a circuit including a first RLC circuit path and a second RLC circuit path, wherein the first RLC circuit path includes a first inductor and a first capacitor electronically coupled to the first inductor, and the second RLC circuit path includes a second inductor and a second capacitor electronically coupled to the second inductor.

[0013] Figure 1E yes Figure 1D A schematic top view of the circuit, in which the first RLC circuit path is represented by a dashed line.

[0014] Figure 1F yes Figure 1D A schematic top view of the circuit, in which the second RLC circuit path is represented by a dashed line.

[0015] Figure 2 This is a diagram of an RLC circuit path according to certain implementations.

[0016] Figure 3A This is a schematic illustration of the manufacture of an inductor according to certain embodiments, wherein conductive nanostructures are used to form the conductive path of the inductor.

[0017] Figure 3B This is a schematic illustration of the manufacture of an interdigital capacitor according to certain embodiments, wherein conductive nanostructures are used to form the electrodes of the interdigital capacitor.

[0018] Figures 4A to 4D are a series of schematic cross-sectional views illustrating the fabrication of a parallel-plate capacitor according to certain embodiments, wherein conductive nanostructures are used to form the electrodes of the parallel-plate capacitor.

[0019] Figure 5 This is a block diagram illustrating an exemplary sensor system according to certain implementations.

[0020] Figure 6 This is a schematic diagram illustrating the measurement of the resonant frequency of a sensor according to some embodiments.

[0021] Figure 7 A comparison of the resonant frequency of a first signal of a single circuit and the resonant frequency of a second signal of a single circuit according to some embodiments is shown. Detailed Implementation

[0022] Corrosion / erosion sensors (e.g., wireless corrosion / erosion sensors), and related systems and methods are generally described. According to some embodiments, the sensor includes a single circuit comprising a first RLC circuit path and a second RLC circuit path. The first RLC circuit path may include an inductor and a first capacitor electronically coupled to the inductor, and the second circuit path may include an inductor and a second capacitor electronically coupled to the inductor.

[0023] According to some embodiments, at least a portion of the first RLC circuit path is configured to be corroded and / or eroded, and a second RLC circuit path is configured as a reference circuit, allowing determination of whether a portion of the first RLC circuit path has been corroded and / or eroded, and / or the extent to which the first RLC circuit path has been corroded and / or eroded. For example, in some embodiments, a coating disposed on a portion of the inductor in the first RLC circuit path may corrode and / or erode, thus altering the return signal of the first RLC circuit path. The second RLC circuit path, which does not have a coating, may have an invariant return signal, which is used as a reference signal and compared with the return signal of the first RLC circuit path. Configuring the sensor in this way allows determination of whether a portion of the first RLC circuit path has been corroded and / or eroded, and / or the extent to which the first RLC circuit path has been corroded and / or eroded.

[0024] In some embodiments, the sensor may be disposed in a sensor system configured to measure the return signals of a first RLC circuit path and a second RLC circuit path. In some embodiments, the sensor system may include a processor configured to determine, at least in part, whether a portion of the first RLC circuit path has been corroded and / or eroded, based on a comparison between the return signals of the first and second RLC circuit paths. Suitable signals of the circuit that can be analyzed by the processor include, for example, resonant frequency and / or quality factor.

[0025] In some embodiments, conductive sensor elements (e.g., the electronic path of an inductor, the electrodes of a capacitor, etc.) comprise nanocomposite materials (e.g., formed by arranging conductive elongated nanostructures within a conductive or non-conductive matrix material).

[0026] Some of the circuit arrangements described herein can be used as wireless sensors. For example, in some embodiments, the circuit can be used as an RLC resonator. In some embodiments, the RLC resonator can be wirelessly interrogated to determine whether the return signal of the first RLC circuit path has changed compared to the return signal of the second RLC circuit path, indicating that a portion of the first RLC circuit path has been corroded and / or eroded. As mentioned above, for example, in some embodiments, the return signal of the first RLC circuit path changes when a portion of the first RLC circuit path is corroded and / or eroded. In some embodiments, the return signal of the first RLC circuit path is compared with the return signal of the second RLC circuit path to at least partially determine whether a portion of the first RLC circuit path has been corroded and / or eroded. The presence of a reference signal can help distinguish between changes in the return signal of the first RLC circuit path that may be due to factors other than corrosion / erosion of the first RLC circuit path (e.g., the presence of structural defects such as cracks, mechanical strain, etc.) and changes in the return signal of the first RLC circuit path that are due to corrosion / erosion of the first RLC circuit path. Advantageously, in some embodiments, the sensor system described herein can detect corrosion and / or erosion while avoiding problems associated with circuit failures due to corrosion and / or erosion.

[0027] In some implementations, the circuit may be an oscillator. In some implementations, the circuit may be wirelessly interrogated, and the return signals of the first RLC circuit path and the second RLC circuit path may be generated by the circuit. The return signals of the first and second RLC circuit paths may be detected and analyzed by a processor to determine whether a portion of the first RLC circuit path has been corroded and / or eroded.

[0028] In some implementations, a single circuit may be positioned on a target material on which the structural health is to be monitored. Examples of suitable target materials include, but are not limited to, components of land systems and / or vehicles, water systems and / or vehicles, air systems and / or vehicles, and / or space systems and / or vehicles. In some implementations, target materials are components of aircraft, ships, motor vehicles (e.g., motorcycles, cars, trucks, buses, etc.), spacecraft (e.g., rockets, etc.), building components (e.g., beams, steel components, concrete components, etc.), and so on.

[0029] In some implementations, a single circuit includes a first RLC circuit path. Figure 1A This is a schematic top view of a circuit 100a including a first RLC circuit path according to certain embodiments. Figure 1AAs shown, the first RLC circuit path includes a first portion 128 of inductor 106 and a first capacitor 108a electronically coupled to the first portion 128 of inductor 106 via conductive paths 114a and 114b. In some embodiments, conductive paths 114a and 114b may comprise metal, carbon, or any other suitable conductive material.

[0030] The inductor 106 can take any of a variety of suitable configurations. Figure 1A In the illustrated embodiment, inductor 106 includes conductive paths arranged in a helical shape. Other inductor shapes and / or configurations are also possible.

[0031] In some embodiments, as described in more detail herein, the inductor may include conductive nanostructures (e.g., conductive elongated nanostructures such as carbon nanotubes) embedded within a conductive or non-conductive (e.g., electrically insulating) matrix. In some embodiments, the conductive nanostructures serve the electronic functions of the inductor.

[0032] According to some embodiments, a portion of the inductor may include a coating. For example, a first portion 128 of inductor 106 may include a coating. In some embodiments where the inductor includes a conductive elongated nanostructure, the coating is disposed on the conductive elongated nanostructure.

[0033] Any suitable coating can be used. In some embodiments, the coating comprises a conductive material. For example, in some embodiments, the coating comprises a metal. In some embodiments, suitable metals include iron (Fe), silver (Ag), stainless steel (SS), and / or combinations thereof. In some embodiments, coatings comprising Fe and / or SS can be used to detect corrosion. In some embodiments, coatings comprising Ag can be used to detect erosion. Other coatings and / or metals are also possible. As further detailed herein, the coating can be configured to corrode and / or erode.

[0034] The coating can have any thickness among a variety of suitable thicknesses. For example, in some embodiments, the coating has a thickness greater than or equal to 1 nm, greater than or equal to 10 nm, greater than or equal to 100 nm, greater than or equal to 1 micrometer, or greater than or equal to 10 micrometers. In some embodiments, the coating has a thickness less than or equal to 100 micrometers, less than or equal to 10 micrometers, less than or equal to 1 micrometer, less than or equal to 100 nm, or less than or equal to 10 nm. Combinations of the ranges listed above are possible (e.g., a coating having a thickness greater than or equal to 1 nm and less than or equal to 100 micrometers, or a coating having a thickness greater than or equal to 100 nm and less than or equal to 1 micrometer). Other ranges are also possible.

[0035] Inductors can be any size from a variety of suitable dimensions. For example, refer to... Figure 1A The inductor 106 has a first dimension 120 and a second dimension 122, wherein the second dimension 122 is perpendicular to the first dimension 120.

[0036] The first size of the inductor can be any of a variety of suitable values. For example, in some embodiments, the first size of the inductor is greater than or equal to 10 micrometers, greater than or equal to 100 micrometers, greater than or equal to 1 millimeter, greater than or equal to 1 centimeter, or greater than or equal to 10 centimeters. In some embodiments, the first size of the inductor is less than or equal to 1 meter, less than or equal to 10 centimeters, less than or equal to 1 centimeter, less than or equal to 1 millimeter, or less than or equal to 100 micrometers. Combinations of the ranges listed above are possible (e.g., the first size of the inductor is greater than or equal to 10 micrometers and less than or equal to 1 meter, the first size of the inductor is greater than or equal to 1 millimeter and less than or equal to 1 centimeter). Other ranges are also possible.

[0037] The second dimension of the inductor (e.g., perpendicular to the first dimension of the inductor) can be any of a variety of suitable values. For example, according to some embodiments, the second dimension of the inductor is greater than or equal to 10 micrometers, greater than or equal to 100 micrometers, greater than or equal to 1 millimeter, greater than or equal to 1 centimeter, or greater than or equal to 10 centimeters. In some embodiments, the second dimension of the inductor is less than or equal to 1 meter, less than or equal to 10 centimeters, less than or equal to 1 centimeter, less than or equal to 1 millimeter, or less than or equal to 100 micrometers. Combinations of the ranges listed above are possible (e.g., the second dimension of the inductor is greater than or equal to 10 micrometers and less than or equal to 1 meter, or the second dimension of the inductor is greater than or equal to 1 millimeter and less than or equal to 1 centimeter). Other ranges are also possible.

[0038] The first capacitor 108a can take any of a variety of suitable configurations. In some embodiments, the first capacitor 108a is an interdigitated capacitor including a first electrode and a second electrode. In other embodiments, the first capacitor 108a is a parallel-plate capacitor (e.g., a circular parallel-plate capacitor, a square parallel-plate capacitor, etc.). In some embodiments, the parallel-plate capacitor includes a first electrode, a second electrode, and a conductive or non-conductive material between the first and second electrodes. Examples of conductive materials used in a parallel-plate capacitor include, but are not limited to, conductive polymers, metals, or combinations thereof. Examples of non-conductive materials used in a parallel-plate capacitor include, but are not limited to, polymers (e.g., epoxy resins (e.g., EPON resin), p-methylstyrene (PMS), p-methoxyamphetamine (PMA), polyimides (e.g., Kapton®), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), bismaleimide (BMI), cyanate esters, etc.), metals and / or metal-like oxides, glass, ceramics, or any combination of two or more of these materials.

[0039] As described in more detail herein, in some embodiments, the first capacitor may include a conductive nanostructure (e.g., a conductive elongated nanostructure such as a carbon nanotube) embedded within a conductive or non-conductive (e.g., electrically insulating) matrix. In some embodiments, the conductive nanostructure performs the electronic function of the first capacitor.

[0040] exist Figure 1A In the illustrated embodiment, inductor 106 is electronically coupled to first capacitor 108a. Specifically, the first electrode 116a of first capacitor 108a can be electronically coupled to the second end 126 of inductor 106 via conductive path 114a, and the second electrode 118a of first capacitor 108a can be electronically coupled to the first portion 128 of inductor 106 via conductive path 114b.

[0041] According to some implementations, when inductor 106 is electronically coupled to first capacitor 108a, inductor 106 and first capacitor 108a can then form an RLC circuit path (e.g., a first RLC circuit path). Figure 2 The RLC circuit path is shown. In some embodiments, a dedicated resistor may be incorporated into the RLC circuit path. In other embodiments, the intrinsic resistivity of the circuit elements and / or the conductive paths that couple the circuit elements to each other may be used as the resistor for the RLC circuit path.

[0042] Figure 1B This is a schematic top view of circuit 100a, where the first RLC circuit path is indicated by dashed lines. (See diagram below.) Figure 1BAs shown, in some embodiments, the first RLC circuit path includes a path from the first electrode 116a of the first capacitor 108a, through a conductive path 114a, through the second end 126 of the inductor 106, and through the first portion 128 of the inductor 106 (e.g., Figure 1B The conductive path (shown as a portion of the inductor 106 in the dashed line) passes through conductive path 114b and reaches the second electrode 118a of the first capacitor 108a.

[0043] As described in more detail herein, the first portion 128 of inductor 106 (e.g., Figure 1B The portion of inductor 106 shown in dashed lines may include a coating (e.g., a conductive coating such as a metal).

[0044] In some implementations, the first RLC circuit path can be configured to generate a return signal. For example, in some implementations, the circuit can be a resonator, and the first RLC circuit path can generate a return signal in response to a suitable input signal. Any of a variety of suitable input signals can be used. For example, in some implementations, the sensor system is a wireless sensor system, and the input signal includes electromagnetic radiation. In other implementations, the sensor system is a wired sensor system, and the input signal includes power (e.g., voltage, current) from a power supply. As described in more detail herein, the return signal of the first RLC circuit path can be sent to a processor and analyzed by it.

[0045] In some implementations, circuit 100a includes a second RLC circuit path. Figure 1C This is a schematic top view of circuit 100a, where the second RLC circuit path is indicated by dashed lines. (Refer to...) Figure 1C The second RLC circuit path includes a second portion 130 of inductor 106 and a second capacitor 108b electronically coupled to the second portion 130 of inductor 106 via conductive paths 114b and 114c. In some embodiments, conductive paths 114b and 114c may comprise metal, carbon, or any other suitable conductive material.

[0046] According to some embodiments, the second portion 130 of the inductor 106 (e.g., Figure 1C The portion of inductor 106 shown in dashed lines does not include the coating.

[0047] The second capacitor 108b can take any of a variety of suitable configurations. In some embodiments, the second capacitor 108b is an interdigitated capacitor including a first electrode and a second electrode. In other embodiments, the second capacitor 108b is a parallel-plate capacitor (e.g., a circular parallel-plate capacitor, a square parallel-plate capacitor, etc.). In some embodiments, the parallel-plate capacitor includes a first electrode, a second electrode, and a conductive or non-conductive material between the first and second electrodes. Examples of conductive materials used in a parallel-plate capacitor include, but are not limited to, conductive polymers, metals, or combinations thereof. Examples of non-conductive materials used in a parallel-plate capacitor include, but are not limited to, polymers (e.g., epoxy resins (e.g., EPON resin), p-methylstyrene (PMS), p-methoxyamphetamine (PMA), polyimides (e.g., Kapton®), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), bismaleimide (BMI), cyanate esters, etc.), metals and / or metal-like oxides, glass, ceramics, or any combination of two or more of these materials.

[0048] As described in more detail herein, in some embodiments, the second capacitor may include a conductive nanostructure (e.g., a conductive elongated nanostructure such as a carbon nanotube) embedded within a conductive or non-conductive (e.g., electrically insulating) matrix. In some embodiments, the conductive nanostructure performs the electronic function of the second capacitor.

[0049] exist Figure 1C In the illustrated embodiment, inductor 106 is electronically coupled to second capacitor 108b. Specifically, the first electrode 116b of second capacitor 108b can be electronically coupled to the second portion 130 of inductor 106 via conductive path 114b, and the second electrode 118b of second capacitor 108b can be electronically coupled to the first end 124 of inductor 106 via conductive path 114c.

[0050] According to some embodiments, when inductor 106 is electronically coupled to second capacitor 108b, then inductor 106 and second capacitor 108b can form an RLC circuit path (e.g., a second RLC circuit path), for example... Figure 2 The RLC circuit path is shown. In some embodiments, a dedicated resistor may be incorporated into the RLC circuit path. In other embodiments, the intrinsic resistivity of the circuit elements and / or the conductive paths that couple the circuit elements to each other may be used as the resistor for the RLC circuit path.

[0051] like Figure 1CAs shown, in some embodiments, the second RLC circuit path includes a path from the first electrode 116b of the second capacitor 108b, through a conductive path 114b, through the second portion 130 of the inductor 106 (e.g., Figure 1C The conductive path (shown in dashed lines as a portion of inductor 106), through the first end 124 of inductor 106, through conductive path 114c, and to the second electrode 118b of capacitor 108b.

[0052] In some implementations, the first RLC circuit path and the second RLC circuit path are RLC circuit paths associated with a single inductor. For example, refer to... Figures 1B to 1C The first RLC circuit path (e.g., in) Figure 1B (as shown in) and the second RLC circuit path (e.g., in) Figure 1C (As shown in the diagram) Both are associated with inductor 106. In other embodiments (e.g., as shown in the diagram) Figures 1D to 1F As shown), separate inductors can be used (e.g., inductors arranged side by side).

[0053] In some implementations, different capacitors are used in each of the first and second RLC circuit paths. For example, see reference... Figures 1B to 1C A first capacitor 108a is used in the first RLC circuit path, and a second capacitor 108b is used in the second RLC circuit path. In some embodiments, different portions of the same inductor are used in the first and second RLC circuit paths. (See also...) Figures 1B to 1C For example, the first portion 128 of the inductor 106 is used in the first RLC circuit path, and the second portion 130 of the inductor 106 is used in the second RLC circuit path.

[0054] According to some implementation methods, such as Figures 1B to 1C As shown, at least a portion of the second RLC circuit path may overlap with at least a portion of the first RLC circuit path. In some embodiments, for example, the second RLC circuit path includes a conductive path 114b that overlaps with the first RLC circuit path.

[0055] As described in more detail herein, the second RLC circuit path can be configured to generate a return signal according to certain embodiments. For example, in some embodiments, the circuit can be a resonator, and the second RLC circuit path can generate a return signal in response to a suitable input signal. Any of a variety of suitable input signals can be used. For example, in some embodiments, the sensor system is a wireless sensor system, and the input signal includes electromagnetic radiation. In other embodiments, the sensor system is a wired sensor system, and the input signal includes power (e.g., voltage, current) from a power supply. In some embodiments, the return signal of the second RLC circuit path can be different from the return signal of the first RLC circuit path. As described in more detail herein, the return signal of the second RLC circuit path can be sent to a processor and analyzed thereon.

[0056] In some embodiments, as described above, the nanostructure can be incorporated into one or more elements of a circuit (e.g., into an inductor and / or capacitor). In some embodiments, the nanostructure can realize the electronic function of the circuit components. For example, in some embodiments, the nanostructure is conductive and can be embedded in a conductive or non-conductive matrix to impart conductivity to the circuit elements.

[0057] Figure 3A This is a schematic illustration of the fabrication of an inductor according to certain embodiments, wherein conductive nanostructures are used to form the conductive paths of the inductor. In some embodiments, a substrate 301a is provided and patterned with an active growth material 302a, such as a catalyst. For example, patterning can be performed using photolithography. According to some embodiments, a forest of vertically aligned patterned nanostructures 304a is grown on the substrate 301a, and then (e.g., using a roller) the forest of vertically aligned patterned nanostructures 304a is knocked down, an electrically insulating material 310a is drop-cast, and a spin-coating 312a is performed to provide an inductor 106 comprising a forest of substantially parallel patterned nanostructures 304a embedded in an electrically insulating material 310a (e.g., a structural polymer matrix).

[0058] Figure 3BThis is a schematic illustration of the fabrication of an interdigital capacitor according to certain embodiments, wherein conductive nanostructures are used to form the electrodes of the capacitor. In some embodiments, a substrate 301b is provided, and the substrate is patterned with an active growth material 302b, such as a catalyst. For example, the patterning can be performed using photolithography. According to some embodiments, a forest of vertically aligned patterned nanostructures 304b is grown on the substrate 301b, and then (e.g., using a roller) the forest of vertically aligned patterned nanostructures 304b is knocked down, an electrically insulating material 310b is drop-cast, and a spin-coating 312b is performed to provide a first electrode 116 and / or a second electrode 118 of the capacitor 108. In some embodiments, the first electrode 116 and / or the second electrode 118 of the capacitor 108 comprises a forest of substantially parallel patterned nanostructures 304b embedded in an electrically insulating material 310b (e.g., a structural polymer matrix).

[0059] Figures 4A to 4D are a series of cross-sectional schematic illustrations showing the fabrication of a parallel-plate capacitor according to certain embodiments, wherein conductive nanostructures are used to form the electrodes of the parallel-plate capacitor. In Figure 4A, an assembly of elongated nanostructures 401 has been formed on a substrate 301c (e.g., a Kapton substrate), for example, using catalytic growth of carbon nanotubes. The assembly of elongated nanostructures has been implanted with a non-conductive material 402a (e.g., EPON). The elongated nanostructures can provide conductivity, such that the combination of elongated nanostructures 401 and non-conductive material 402a forms the first electrode of the parallel-plate capacitor. In Figure 4B, an additional non-conductive material 402b (e.g., EPON) has been placed on top of the elongated nanostructures 401 and the non-conductive material 402a. In Figure 4C, the non-conductive material 402b has been modified into a layer shape. In a non-limiting embodiment, the non-conductive material 402b is a layer of a Kapton film having an epoxy resin (e.g., having a thickness of less than 50 micrometers or less than 10 micrometers). In Figure 4D, a second electrode, including a conductive elongated nanostructure 401 embedded in a non-conductive material layer 402c, has been added on top of the stack from Figure 4C. An additional substrate 301d may also be included. Optionally, for example, the stack can be cured using a hot press to form the final parallel-plate capacitor. Optionally, substrates 301c and / or 301d may be omitted or removed from the capacitor.

[0060] Non-limiting examples of using conductive nanostructures embedded in a non-conductive matrix to form circuit components are described, for example, in the following patent applications: International Patent Application Publication No. WO 2019 / 118706, filed December 13, 2018, as International Application No. PCT / US2018 / 065422, entitled “Structural Electronics Wireless Sensor Nodes”, published June 20, 2019; and U.S. Patent Application No. 16 / 900,159, filed June 12, 2020, as U.S. Patent Publication No. 2020 / 0309674, entitled “Structural Electronics Wireless Sensor Nodes”, each of which is incorporated herein by reference in its entirety for all purposes.

[0061] Any of a variety of suitable nanostructures can be used in conjunction with the embodiments described herein. The term "nanostructure" is used herein in a manner consistent with its common meaning in the art and refers to a structure having a feature size, such as a cross-sectional diameter or other suitable size, greater than or equal to 1 nm and less than 1 micrometer. In some embodiments, the nanostructure has at least one feature size less than 750 nm, less than 500 nm, less than 250 nm, less than 100 nm, less than 75 nm, less than 50 nm, less than 25 nm, less than 10 nm, or in some cases less than 5 nm.

[0062] In some embodiments, the nanostructure is an elongated nanostructure (e.g., having an aspect ratio of at least 10, and in some embodiments, at least 100; at least 1000; at least 10000; at least 100000; or more aspect ratios). In some embodiments, the elongated nanostructure is a nanofiber, nanowire, nanorod, etc. In some respects, the nanostructure is conductive.

[0063] In some embodiments, the nanostructure includes a carbon-based nanostructure (i.e., the nanostructure is at least 50 atomic percent (at%) of carbon, and in some cases, at least 60 at%, at least 70 at%, at least 80 at%, at least 90 at%, at least 95 at%, at least 99 at% or more of carbon). In some embodiments, the nanostructure includes carbon nanotubes (CNTs). The term “carbon nanotube” is used herein in a manner consistent with its common meaning in the art and refers to a substantially cylindrical molecular or nanostructure comprising a fused network of predominantly six-membered rings (e.g., six-membered aromatic rings) that predominantly comprise carbon atoms. Further details regarding CNTs are described below. In some embodiments, the nanostructure includes a metal. In some embodiments, the metal is a conductive metal. For example, the nanostructure may include silicon (Si), germanium (Ge), gold (Au), metal oxides (e.g., In₂O₃, SnO₂, ZnO), etc.

[0064] Additional examples of nanostructures that can be used include, but are not limited to, metal nanowires, conductive particles, buckyballs, graphene sheets, etc.

[0065] In some embodiments, one or more circuit elements (e.g., capacitors, inductors) may include conductive nanostructures embedded in a conductive or non-conductive matrix. Examples of conductive matrices include, but are not limited to, conductive polymers, metals, or combinations thereof. Examples of non-conductive matrices include, but are not limited to, polymers (e.g., epoxy resins, such as EPON resin), p-methylstyrene (PMS), p-methoxyamphetamine (PMA), and polyimides (e.g., Kapton). ® ( ), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), bismaleimide (BMI), cyanate esters, etc., metals and / or metal-like oxides, glass, ceramics, or any combination of two or more of these materials.

[0066] According to some embodiments, at least a portion of the first RLC circuit path is configured to be etched and / or eroded. For example, in some embodiments, a portion of the inductor in the first RLC circuit path may include a coating configured to be etched and / or eroded. (See also...) Figure 1B For example, in Figure 1B Some or all of the first portion 128 of the inductor 106 shown in dashed lines (e.g., corresponding to a portion of the inductor 106 in the first RLC circuit path) includes a coating.

[0067] The sensor system described herein can be positioned on or near the target material being monitored, such that the coating experiences substantially the same conditions as the target material. Any suitable target material can be used. For example, in some embodiments, the target material is a component of a land system and / or vehicle, a water system and / or vehicle, an air system and / or vehicle, and / or a space system and / or vehicle. In some embodiments, the target material is a component of an aircraft, ship, motor vehicle (e.g., motorcycle, car, truck, bus, etc.), spacecraft (e.g., rocket, etc.), building component (e.g., beam, steel component, concrete component, etc.), and so on.

[0068] In some embodiments, the coating may comprise a material corroded at a rate less than 20% of the corrosion rate of the target material monitored by the sensor system. For example, in some embodiments, the coating comprises a material corroded at a rate less than 20%, 15%, 10%, 5%, or 1% of the corrosion rate of the target material monitored by the sensor system. According to some embodiments, the coating and the target material comprise the same material, such that the corrosion rate of the coating and the corrosion rate of the target material are the same.

[0069] The coating may corrode and / or erode when exposed to any of the various suitable corrosive conditions. For example, in some embodiments, the coating may corrode and / or erode when exposed to water (e.g., moisture, condensation, rainwater, etc.), oxygen, high temperature, low temperature, mechanical vibration, etc.

[0070] According to certain implementation methods, Figure 1B The first RLC circuit path, shown in dashed lines, is (e.g., from the first electrode 116a of the first capacitor 108a, through conductive path 114a, through the second end 126 of the inductor 106, through the first portion 128 of the inductor 106, for example, Figure 1BThe portion of inductor 106 shown in dashed lines (the conductive path through conductive path 114b and to the second electrode 118b of the first capacitor 108a) is configured to generate a return signal. In some embodiments, the return signal of the first RLC circuit path may be altered due to corrosion and / or erosion of a coating disposed on a portion of the inductor (e.g., some or all of the first portion 128 of the inductor) upon exposure to one or more corrosive conditions. For example, in some embodiments, the return signal of the first RLC circuit path may be altered due to a change in the inductance of the circuit caused by corrosion and / or erosion of the coating disposed on a portion of the inductor. In some embodiments, as further detailed herein, the return signal of the first RLC circuit path that may be altered due to corrosion and / or erosion may be compared with the return signal of the second RLC circuit path that will not be altered due to corrosion and / or erosion to determine whether a portion of the inductor in the first RLC circuit path has been corroded and / or eroded.

[0071] In some embodiments, the second RLC circuit path is configured as a reference circuit to determine whether portions of the first RLC circuit path have been corroded and / or eroded. For example, in some embodiments, no portion of the inductor in the second RLC circuit path includes a coating. For example, a reference... Figure 1C , Figure 1C None of the second portions 130 of the inductor 106 shown in dashed lines (e.g., corresponding to portions of the inductor 106 in the second RLC circuit path) include a coating.

[0072] According to some implementation methods Figure 1C The second RLC circuit path, shown in dashed lines, runs from the first electrode 116b of the second capacitor 108b, through conductive path 114b, through the second portion 130 of the inductor 106 (e.g., Figure 1C The portion of inductor 106 shown in dashed lines (through the first end 124 of inductor 106, through conductive path 114c, and to the second electrode 118b of capacitor 108b) is configured to generate a return signal. In some embodiments, the return signal of the second RLC circuit path is not altered by corrosion and / or erosion of the coating disposed on a portion of the inductor (e.g., some or all of the first portion 128 of the inductor) upon exposure to one or more corrosive conditions. In some embodiments, as further detailed herein, the return signal of the second RLC circuit path, which is not altered by corrosion and / or erosion, can be compared with the return signal of the first RLC circuit path, which may be altered by corrosion and / or erosion, to determine whether a portion of the inductor in the first RLC circuit path has been corroded and / or eroded.

[0073] According to some implementations, a single circuit (e.g., including a first RLC circuit path and a second RLC circuit path) includes a first inductor and a second inductor. Figure 1D It is a top view schematic illustration of a circuit 100b including a first RLC circuit path and a second RLC circuit path, wherein the first RLC circuit path includes a first inductor 106a and a first capacitor 108a' electronically coupled to the first inductor 106a, and the second RLC circuit path includes a second inductor 106b and a second capacitor 108b' electronically coupled to the second inductor 106b.

[0074] As mentioned in this article Figure 1A More specifically, the first inductor (e.g., first inductor 106a) and the second inductor (e.g., second inductor 106b) can take any of a variety of suitable configurations. For example, in some embodiments, the first inductor and / or the second inductor includes conductive paths arranged in a helical shape, but other inductor shapes and / or configurations are possible.

[0075] As referenced in this article Figure 3A In more detail, the first inductor (e.g., first inductor 106a) and / or the second inductor (e.g., second inductor 106b) may include conductive nanostructures (e.g., conductive elongated nanostructures such as carbon nanotubes) embedded within a conductive or non-conductive (e.g., electrically insulating) matrix. In some embodiments, the conductive nanostructure of the first inductor performs the electronic function of the first inductor. In some embodiments, the conductive nanostructure of the second inductor performs the electronic function of the second inductor.

[0076] In some embodiments, at least a portion of the first inductor includes a coating. For example, see reference... Figure 1D At least a portion of the first inductor 106a includes a coating. In some embodiments, at least a portion of the first inductor 106a includes a coating, while the second inductor 106b does not include a coating.

[0077] As described in more detail herein, any coating from a variety of suitable coatings may be used. For example, in some embodiments, the coating comprises a metal (e.g., Fe, Ag, SS, etc.).

[0078] As described in more detail herein, the coating can have any thickness among a variety of suitable thicknesses. For example, in some embodiments, the coating has a thickness greater than or equal to 1 nm and less than or equal to 100 micrometers.

[0079] As referenced in this article Figure 1AMore specifically, the first inductor and / or the second inductor can have any of a variety of suitable dimensions. In some embodiments, the first inductor and the second inductor have the same or substantially the same dimensions. For example, in some embodiments, the value of the first dimension of the first inductor is within 20% (or within 15%, 10%, 5%, 1%, or 0.1%) of the value of the first dimension of the second inductor. In some embodiments, the value of the second dimension of the first inductor is within 20% (or within 15%, 10%, 5%, 1%, or 0.1%) of the value of the second dimension of the second inductor. In some embodiments, as described in more detail herein, configuring the first and second inductors such that they have the same or substantially the same dimensions advantageously allows for accurate comparison of the return signals of the first RLC circuit path and the second RLC circuit path to at least partially determine whether the first RLC circuit path has been corroded and / or eroded.

[0080] The first inductor and the second inductor can be positioned adjacent to each other (e.g., side-by-side), such that the first inductor and the second inductor are spaced a certain distance apart. For example, refer to Figure 1D The first inductor 106a and the second inductor 106b are positioned adjacent to each other, such that the outermost end 132a of the first inductor 106a and the outermost end 132b of the second inductor 106b adjacent to the outermost end 132a of the first inductor 106a are spaced apart by a certain distance 130.

[0081] The first inductor and the second inductor can be spaced apart by any suitable distance. In some embodiments, the shortest distance between the first inductor and the second inductor is less than or equal to 100 meters, less than or equal to 50 meters, less than or equal to 10 meters, less than or equal to 5 meters, less than or equal to 1 meter, less than or equal to 50 centimeters, less than or equal to 10 centimeters, less than or equal to 5 centimeters, less than or equal to 1 centimeter, less than or equal to 0.5 centimeters, less than or equal to 100 nanometers, less than or equal to 50 nanometers, less than or equal to 10 nanometers, less than or equal to 5 nanometers, or less than or equal to 5 nanometers. In some implementations, the shortest distance between the first inductor and the second inductor is greater than or equal to 1 nanometer, greater than or equal to 5 nanometers, greater than or equal to 10 nanometers, greater than or equal to 50 nanometers, greater than or equal to 100 nanometers, greater than or equal to 0.5 micrometers, greater than or equal to 1 micrometer, greater than or equal to 5 micrometers, greater than or equal to 10 micrometers, greater than or equal to 50 micrometers, greater than or equal to 100 micrometers, greater than or equal to 500 micrometers, greater than or equal to 0.1 centimeters, greater than or equal to 0.5 centimeters, greater than or equal to 1 centimeter, greater than or equal to 5 centimeters, greater than or equal to 10 meters, greater than or equal to 5 meters, greater than or equal to 10 meters, greater than or equal to 50 meters, or greater than or equal to 50 meters. Combinations of the ranges listed above are possible (e.g., the distance between the first inductor and the second inductor is less than or equal to 100 meters and greater than or equal to 1 nanometer, or the distance between the first inductor and the second inductor is less than or equal to 0.1 centimeters and greater than or equal to 500 micrometers). Other ranges are also possible.

[0082] As described in more detail herein, in some embodiments, the first and second inductors are configured such that they are spaced at a minimum distance, advantageously allowing for an accurate comparison of the return signals of the first and second RLC circuit paths to at least partially determine whether the first RLC circuit path has been corroded and / or eroded. For example, in some embodiments, having a minimum distance between the first and second inductors ensures that the first and second inductors are exposed to the same or substantially the same environment, making it possible to accurately compare the return signals of the first and second RLC circuit paths to at least partially determine whether the first RLC circuit path has been corroded and / or eroded.

[0083] Reference Figure 1D The first capacitor 108a' can take any of the various suitable constructions, as referred to herein. Figure 1AMore detailed description. For example, in some embodiments, the first capacitor 108a' is an interdigital capacitor including a first electrode and a second electrode. In other embodiments, the first capacitor 108a' is a parallel-plate capacitor including a first electrode, a second electrode, and a conductive or non-conductive material between the first and second electrodes.

[0084] In some implementations, as referred to herein Figure 3B As described in more detail in Figure 4D, the first capacitor 108a' includes a conductive nanostructure (e.g., a conductive elongated nanostructure such as a carbon nanotube) embedded within a conductive or non-conductive (e.g., electrically insulating) matrix. In some embodiments, the conductive nanostructure of the first capacitor 108a' enables the electronic function of the first capacitor 108a'.

[0085] According to some implementation methods, such as Figure 1D As shown, the first inductor 106a is electronically coupled to the first capacitor 108a'. Specifically, the first electrode 116a' of the first capacitor 108a' may be electronically coupled to the second end 126' of the first inductor 106a via a conductive path 114a', and the second electrode 118a' of the first capacitor 108a' may be electronically coupled to the first end 124a' of the first inductor 106a via a conductive path 114b'. As described in more detail herein, in some embodiments, conductive paths 114a' and 114b' may comprise metal, carbon, or any other suitable conductive material.

[0086] In some embodiments, when the first inductor 106a is electronically coupled to the first capacitor 108a', the first inductor 106a and the first capacitor 108a' can form an RLC circuit path (e.g., a first RLC circuit path). Figure 2 The RLC circuit path is shown. In some embodiments, a dedicated resistor may be incorporated into the RLC circuit path. In other embodiments, the intrinsic resistivity of the circuit elements and / or the conductive paths that couple the circuit elements to each other may be used as the resistor for the RLC circuit path.

[0087] Reference Figure 1D The second capacitor 108b' can take any of the various suitable configurations, as referred to herein. Figure 1A More specifically, in some embodiments, the second capacitor 108b' is an interdigital capacitor including a first electrode and a second electrode. In other embodiments, the second capacitor 108b' is a parallel-plate capacitor including a first electrode, a second electrode, and a conductive or non-conductive material between the first and second electrodes.

[0088] In some implementations, as referred to herein Figure 3BAs described in more detail in Figure 4D, the second capacitor 108b' includes a conductive nanostructure (e.g., a conductive elongated nanostructure such as a carbon nanotube) embedded within a conductive or non-conductive (e.g., electrically insulating) matrix. In some embodiments, the conductive nanostructure of the second capacitor 108b' enables the electronic function of the second capacitor 108b'.

[0089] According to some implementation methods, such as Figure 1D As shown, the second inductor 106 is electronically coupled to the second capacitor 108b'. Specifically, the second electrode 118b' of the second capacitor 108b' can be electronically coupled to the first end 124a' of the second inductor 106b' via a conductive path 114c'. In some embodiments, such as... Figure 1D As shown, the first inductor 106a is electronically coupled to the second capacitor 108b'. Specifically, the first electrode 116b' of the second capacitor 108b' can be electronically coupled to the first end 124' of the first inductor 106a via a conductive path 114b'. As described in more detail herein, in some embodiments, conductive paths 114b' and 114c' may comprise metal, carbon, or any other suitable conductive material. In some embodiments, such as... Figure 1D As shown, the first inductor 106a is electronically coupled to the second inductor 106b. Specifically, the first end 124' of the first inductor 106a can be electronically coupled to the second end 126' of the second inductor 106b via a conductive path 114d. In some embodiments, the conductive path 114d comprises metal, carbon, or any other suitable conductive material. It should be understood that although the conductive path 114b' is... Figures 1D to 1F The overlapping portion of inductor 106a is shown in the figure, but according to some embodiments, conductive path 114b' only contacts the first end 124' of inductor 106a and not the other overlapping portions of inductor 106a in these figures. Similarly, although conductive path 114c' is shown in the figure, the overlapping portion of inductor 106a is shown in the figure. Figures 1D to 1F The overlapping portion of inductor 106b is shown in the figure, but according to some embodiments, the conductive path 114c' only contacts the first end 124” of inductor 106b and not the other overlapping portions of inductor 106b in these figures.

[0090] In some embodiments, when the first inductor 106a and the second inductor 106b are electronically coupled to the second capacitor 108b', and when the first inductor 106a is electronically coupled to the second inductor 106b, then the second inductor 106b and the second capacitor 108b' can form an RLC circuit path (e.g., a second RLC circuit path). Figure 2The RLC circuit path is shown. In some embodiments, a dedicated resistor may be incorporated into the RLC circuit path. In other embodiments, the intrinsic resistivity of the circuit elements and / or the conductive paths that couple the circuit elements to each other may be used as the resistor for the RLC circuit path.

[0091] In some implementations, as described in more detail herein, circuit 100b includes a first RLC circuit path. Figure 1E This is a schematic top view of circuit 100b, where the first RLC circuit path is shown as a dashed line. In some embodiments, refer to... Figure 1E The first RLC circuit path includes a first inductor 106a and a first capacitor 108a' electronically coupled to the first inductor 106a via conductive paths 114a' and 114b'. For example... Figure 1E As shown, in some embodiments, the first RLC circuit path includes a conductive path from the first electrode 116a' of the first capacitor 108a', through conductive path 114a', through the second end 126' of the first inductor 106a, through the first inductor 106a, through the first end 124' of the first inductor 106a, through conductive path 114b', and to the second electrode 118a' of the first capacitor 108a'.

[0092] In some implementations, as described in more detail herein, the first RLC circuit path can be configured to generate a return signal.

[0093] According to some implementations, as described in more detail herein, circuit 100b includes a second RLC circuit path. Figure 1F This is a schematic top view of circuit 100b, where the second RLC circuit path is shown as a dashed line. (Refer to...) Figure 1F The second RLC circuit path includes a second inductor 106b and a second capacitor 108b' electronically coupled to the second inductor 106b via conductive paths 114b', 114c', and 114d. For example... Figure 1F As shown, in some embodiments, the second RLC circuit path includes a conductive path from the first electrode 116b' of the second capacitor 108b', through conductive path 114b', through the first end 124' of the first inductor 106a, through conductive path 114d, through the second end 126" of the second inductor 106b, through the second inductor 106b, through the first end 124" of the second inductor 106b, through conductive path 114c', and to the second electrode 118b' of the second capacitor 108b'.

[0094] In some implementations, as described in more detail herein, the second RLC circuit path can be configured to generate a return signal.

[0095] According to some implementations, as described in more detail herein, different capacitors are used in each of the first and second RLC circuit paths. For example, refer to... Figures 1E to 1F A first capacitor 108a' is used in the first RLC circuit path, and a second capacitor 108b' is used in the second RLC circuit path. In some embodiments, different inductors are used in each of the first and second RLC circuit paths. For example, refer to... Figures 1E to 1F A first inductor 106a is used in the first RLC circuit path, and a second inductor 106b is used in the second RLC circuit path.

[0096] In some embodiments in which at least a portion of the first inductor 106a includes a coating, Figure 1E At least a portion of the first RLC circuit path, shown in dashed lines, is configured to be corroded and / or eroded. For example, in some embodiments, at least a portion of the coating disposed on at least a portion of the first inductor 106a is configured to be corroded and / or eroded. According to some embodiments, the return signal of the first RLC circuit path may be altered due to corrosion and / or erosion of at least a portion of the coating disposed on at least a portion of the first inductor 106a when exposed to one or more corrosive conditions. For example, in some embodiments, the return signal of the first RLC circuit path is altered due to a change in the inductance of circuit 100b caused by corrosion and / or erosion of at least a portion of the coating disposed on at least a portion of the first inductor 106a. As described in more detail herein, the return signal of the first RLC circuit path that may be altered due to corrosion and / or erosion may be compared with the return signal of a second RLC circuit path that will not be altered due to corrosion and / or erosion to determine whether a portion of the first inductor 106a in the first RLC circuit path (e.g., at least a portion of the coating disposed on at least a portion of the first inductor 106a) has been corroded and / or eroded.

[0097] According to some implementation methods Figure 1FThe second RLC circuit path, shown in dashed lines, is configured as a reference circuit to determine whether a portion of the first RLC circuit path has been corroded and / or eroded. For example, in some embodiments, no portion of the second inductor 106b includes a coating. In some embodiments, the return signal of the second RLC circuit path is not altered by corrosion and / or erosion of at least a portion of the coating disposed on at least a portion of the first inductor 106a when exposed to one or more corrosive conditions. In some embodiments, as further detailed herein, the return signal of the second RLC circuit path, which is not altered by corrosion and / or erosion, can be compared with the return signal of the first RLC circuit path, which may be altered by corrosion and / or erosion, to determine whether a portion of the first inductor 106a in the first RLC circuit path (e.g., at least a portion of the coating disposed on at least a portion of the first inductor 106a) has been corroded and / or eroded.

[0098] According to certain implementations, the circuits described herein can be placed in a sensor system. Figure 5 This is a block diagram illustrating an exemplary sensor system 500 according to certain embodiments. Figure 5 As shown, the sensor system 500 includes a single circuit 100.

[0099] In some embodiments, the sensor system 500 is configured to measure one or more first signals of a single circuit 100 (e.g., one or more return signals of a first RLC circuit path of the single circuit) and one or more second signals of the single circuit 100 (e.g., one or more return signals of a second RLC circuit path of the single circuit). In some embodiments, one or more first signals and / or one or more second signals of the single circuit may be oscillating signals of the single circuit.

[0100] In some embodiments, the sensor system 500 includes an optional energy storage module 502. In some embodiments, the energy storage module 502 is a power supply that provides power to at least some components of the sensor system 500. In some embodiments, the energy storage module 502 may be connected to an external power supply that provides a suitable power supply (e.g., voltage and / or current) for the operation of the sensor system 500. Figure 5 (Not shown in the diagram), although such an external power connection is not required. The energy storage module 502 may be included in some embodiments of the sensor system, which are wired sensor systems. In some embodiments where the sensor system is a wireless sensor system, the energy storage module 502 may not be included in the sensor system 500.

[0101] According to some embodiments, the energy storage module 502 is configured to store electrical energy and provide power to at least a portion of the circuit. In one embodiment, the energy storage module 502 may include a battery or capacitor for storing energy. In another embodiment, the energy storage module 502 may additionally include one or more energy harvesters. Figure 5 (Not shown) to recharge the battery or capacitor, allowing the sensor system 500 to operate for extended periods without needing to be connected to an external power source, such as a power outlet, to recharge the battery or capacitor inside the energy storage module 502. The energy harvester can be a mechanical harvester that converts mechanical acoustic energy, such as vibration or human motion, into electricity; a thermoelectric harvester that converts temperature gradients, such as temperature differences between different parts of the sensor system 800, into electricity; a solar or photovoltaic harvester that converts ambient light into electricity; and / or an electrochemical energy harvester that converts electrochemical potential differences in the system environment into electricity.

[0102] In some embodiments, the sensor system 500 includes a processor 504. In some embodiments, the processor may be configured to determine, at least in part, whether a portion of a first RLC circuit path has been corroded and / or eroded, and / or the extent to which a portion of the first RLC circuit path has been corroded and / or eroded, based on a comparison between one or more first signals of a single circuit and one or more second signals of a single circuit. Examples of processors that may be used include commercially available processors such as those from the x86 family; Celeron, Pentium, and Core processors available from Intel; similar devices from AMD and Cyrix; the 680X0 series microprocessors available from Motorola; and PowerPC microprocessors from IBM. Many other processors are also available.

[0103] Processor 504 may use any suitable communication protocol to communicate with circuit 100. For example, in some embodiments, processor 504 may receive one or more first signals and / or one or more second signals from a single circuit from wireless communication module 506. In other embodiments, processor 504 may be a local processor attached to circuit 100. In still other embodiments, processor 504 may be cloud-based and communicate with circuit 100 using a wired or wireless interface.

[0104] In some implementations, the comparison between one or more first signals of a single circuit and one or more second signals of a single circuit (e.g., one or more reference signals of a reference circuit) includes a comparison between the resonant frequencies of one or more first signals and the resonant frequencies of one or more second signals.

[0105] The resonant frequency of one or more first signals in a single circuit can be any frequency from a variety of suitable frequencies. For example, in some embodiments, the resonant frequency of one or more first signals is greater than or equal to 10 Hz, greater than or equal to 100 Hz, greater than or equal to 1 kHz, greater than or equal to 10 kHz, greater than or equal to 100 kHz, greater than or equal to 1 MHz, or greater than or equal to 10 MHz. In some embodiments, the resonant frequency of one or more first signals is less than or equal to 100 MHz, less than or equal to 10 MHz, less than or equal to 1 MHz, less than or equal to 100 kHz, less than or equal to 1 kHz, or less than or equal to 100 Hz. Combinations of the ranges listed above are also possible (e.g., the resonant frequency of one or more first signals is greater than or equal to 10 Hz and less than or equal to 10 MHz, or the resonant frequency of one or more first signals is greater than or equal to 10 kHz and less than or equal to 100 MHz). Other ranges are also possible.

[0106] The resonant frequency of one or more second signals (e.g., one or more reference signals of a reference circuit) in a single circuit can be any frequency among a variety of suitable frequencies. For example, in some embodiments, the resonant frequency of one or more second signals is greater than or equal to 10 Hz, greater than or equal to 100 Hz, greater than or equal to 1 kHz, greater than or equal to 10 kHz, greater than or equal to 100 kHz, greater than or equal to 1 MHz, or greater than or equal to 10 MHz. In some embodiments, the resonant frequency of one or more second signals is less than or equal to 100 MHz, less than or equal to 10 MHz, less than or equal to 1 MHz, less than or equal to 100 kHz, less than or equal to 1 kHz, or less than or equal to 100 Hz. Combinations of the ranges listed above are also possible (e.g., the resonant frequency of one or more second signals is greater than or equal to 10 Hz and less than or equal to 10 MHz, or the resonant frequency of one or more second signals is greater than or equal to 10 kHz and less than or equal to 100 MHz). Other ranges are also possible.

[0107] According to some implementations, the processor can be configured to determine, at least in part, whether a portion of the first RLC circuit path has been corroded and / or eroded and / or the extent to which a portion of the first RLC circuit path has been corroded and / or eroded based on the change in the resonant frequency of the first signal before and after corrosion, and to use the change in the resonant frequency of the second signal to distinguish changes in the resonant frequency of the first signal that may be caused by factors other than corrosion and / or erosion of the first RLC circuit path.

[0108] For example, in some implementations, the processor may be configured to: (i) determine the resonant frequency (RF) of the first RLC circuit path prior to potential corrosion and / or erosion of the first RLC circuit path. 1,i ); and (ii) the resonant frequency (RF) of the second RLC circuit path prior to potential corrosion and / or erosion of the first RLC circuit path. 2,i In some implementations, the processor can then be configured to: (i) determine the resonant frequency (RF) of the first RLC circuit path after potential corrosion and / or erosion of the first RLC circuit path. 1,f (ii) the resonant frequency (RF) of the second RLC circuit path following potential corrosion and / or erosion of the first RLC circuit path. 2,f According to some implementations, the processor can then be configured to: (i) transmit from RF 1,f Subtract RF 1,i To determine the change in resonant frequency (ΔRF1) of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path; and (ii) by means of RF 2,f Subtract RF 2,i The processor is configured to determine the change in resonant frequency (ΔRF2) of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path. In some embodiments, the processor may then be configured to compare ΔRF1 and ΔRF2 to determine whether a portion of the first RLC circuit path has been corroded and / or eroded and / or to what extent a portion of the first RLC circuit path has been corroded and / or eroded.

[0109] For example, according to some embodiments, if the change in resonant frequency (ΔRF1) of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is the same as the change in resonant frequency (ΔRF2) of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path, then the processor can determine that the change in the resonant frequency of the first RLC circuit path is not caused by corrosion and / or erosion of the first RLC circuit path. For example, in some embodiments, the change in the resonant frequency of the first RLC circuit path may be caused by factors other than corrosion and / or erosion, such as the presence of structural defects such as cracks, mechanical strain, etc.

[0110] In some implementations, if the change in resonant frequency (ΔRF1) of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is different from the change in resonant frequency (ΔRF2) of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path, then the processor can determine that the change in resonant frequency of the first RLC circuit path is caused by corrosion and / or erosion of the first RLC circuit path.

[0111] According to some implementations, the percentage change (%ΔRF) between the resonant frequency of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path and the resonant frequency of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is calculated as follows:

[0112]

[0113] Where: (i) ΔRF2 is the resonant frequency (RF) of the second RLC circuit path after potential corrosion and / or erosion of the first RLC circuit path. 2,f ) and the resonant frequency (RF) prior to potential corrosion and / or erosion of the first RLC circuit path. 2,i (ii) the absolute difference between them; 1,i It is the resonant frequency of the first RLC circuit path prior to potential corrosion and / or erosion of the first RLC circuit path; (iii) RF 2,i (iv) ΔRF1 is the resonant frequency of the second RLC circuit path prior to potential corrosion of the first RLC circuit path; and (iv) ΔRF1 is the resonant frequency of the first RLC circuit path after potential corrosion and / or erosion of the first RLC circuit path (RF). 1,f ) and the resonant frequency (RF) prior to potential corrosion and / or erosion of the first RLC circuit path. 1,i The absolute difference between them.

[0114] The percentage change between the resonant frequency of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path and the resonant frequency of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path can be any of a variety of suitable values. For example, in some embodiments, the percentage change between the resonant frequency of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path and the resonant frequency of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is greater than or equal to 0%, greater than or equal to 1%, greater than or equal to 5%, greater than or equal to 10%, greater than or equal to 15%, greater than or equal to 20%, greater than or equal to 25%, greater than or equal to 30%, greater than or equal to 35%, greater than or equal to 40%, or greater than or equal to 45%. In some implementations, the percentage change between the resonant frequency of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path and the resonant frequency of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is less than or equal to 50%, less than or equal to 45%, less than or equal to 40%, less than or equal to 35%, less than or equal to 30%, less than or equal to 25%, less than or equal to 20%, less than or equal to 15%, less than or equal to 10%, less than or equal to 5%, or less than or equal to 1%. Combinations of the ranges listed above are possible (e.g., the percentage change between the resonant frequency of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path and the resonant frequency of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is greater than or equal to 0% and less than or equal to 50%, and the percentage change between the resonant frequency of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path and the resonant frequency of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is greater than or equal to 20% and less than or equal to 30%). Other ranges are also possible.

[0115] In some embodiments, the change (e.g., percentage change) between the resonant frequency of the first RLC circuit path before and after corrosion and / or erosion of the first RLC circuit path and the resonant frequency of the second RLC circuit path before and / or erosion of the first RLC circuit path is proportional to the thickness of the coating that has been corroded and / or eroded on a portion (e.g., a first portion) of the inductor disposed in the first RLC circuit path. For example, in some embodiments, when the coating disposed on a portion of the inductor has been corroded and / or eroded, resulting in a change in the coating thickness from a first thickness to a second thickness (where the second thickness is less than the first thickness), the resonant frequency of the first RLC circuit path may change by a first amount. In some embodiments, when the coating disposed on a portion of the inductor has been corroded and / or eroded, resulting in a change in the coating thickness from a second thickness to a third thickness (where the third thickness is less than the second thickness), the resonant frequency of the first RLC circuit path may change by a second amount greater than the first amount. Advantageously, the change (e.g., percentage change) between the resonant frequency of the first RLC circuit path before and after corrosion and / or erosion of the first RLC circuit path and the resonant frequency of the second RLC circuit path before and after corrosion and / or erosion of the first RLC circuit path can be used to determine the extent to which a portion of the first RLC circuit path has been corroded and / or eroded, the change between the resonant frequencies being proportional to the thickness of the coating that has been corroded and / or eroded on a portion (e.g., the first portion) of the inductor disposed in the first RLC circuit path.

[0116] According to some implementations, a comparison between a first signal of a single circuit and a second signal of a single circuit (e.g., a reference signal of a reference circuit) includes a comparison between the quality factors (or Q factors) of one or more first signals and the quality factors of one or more second signals. As used herein, the phrase "quality factor" is given its common meaning in the art and refers to the ratio of initial energy stored in an oscillator to energy lost during one cycle of oscillation. In some implementations, the quality factor is calculated using the following equation:

[0117]

[0118] Where f r It is the resonant frequency, and Δf is the resonant width or full width at half maximum (FWHM).

[0119] According to some implementations, in order to account for small quality factor values ​​(i.e., less than 1), a 10% quality factor or a 20% quality factor can be calculated according to the equation above, where Δf is the resonance width or full width at 90% or 80% of the maximum value, respectively.

[0120] The quality factor of the first signal in a single circuit can be any value from a variety of suitable options. For example, in some embodiments, the quality factor of the first signal is greater than or equal to 0.1, greater than or equal to 0.5, greater than or equal to 1, greater than or equal to 5, greater than or equal to 10, greater than or equal to 15, or greater than or equal to 20. In some embodiments, the quality factor of the first signal is less than or equal to 50, less than or equal to 20, less than or equal to 15, less than or equal to 10, less than or equal to 5, less than or equal to 1, or less than or equal to 0.5. Combinations of the ranges listed above are possible (e.g., the quality factor of the first signal is greater than or equal to 0.5 and less than or equal to 50, or the quality factor of the first signal is greater than or equal to 5 and less than or equal to 10). Other ranges are also possible.

[0121] The quality factor of the second signal in a single circuit can be any value from a variety of suitable options. For example, in some embodiments, the quality factor of the second signal is greater than or equal to 0.1, greater than or equal to 0.5, greater than or equal to 1, greater than or equal to 5, greater than or equal to 10, greater than or equal to 15, greater than or equal to 20, or greater than or equal to 25. In some embodiments, the quality factor of the second signal is less than or equal to 50, less than or equal to 25, less than or equal to 20, less than or equal to 15, less than or equal to 10, less than or equal to 5, less than or equal to 1, or less than or equal to 0.5. Combinations of the ranges listed above are possible (e.g., the quality factor of the second signal is greater than or equal to 0.5 and less than or equal to 50, or the quality factor of the second signal is greater than or equal to 5 and less than or equal to 10). Other ranges are also possible.

[0122] According to some implementations, the processor can be configured to determine, at least in part, whether a portion of the first RLC circuit path has been corroded and / or eroded and / or to what extent the portion of the first RLC circuit path has been corroded and / or eroded based on a change in the quality factor of the first signal before and after corrosion, and to use a change in the quality factor of the second signal to distinguish changes in the quality factor of the first signal that may be due to factors other than corrosion and / or erosion.

[0123] For example, in some implementations, the processor may be configured to: (i) determine the quality factor (Q) of the first RLC circuit path prior to potential corrosion and / or erosion of the first RLC circuit path. 1,i (ii) the quality factor (Q) of the second RLC circuit path prior to potential corrosion and / or erosion of the first RLC circuit path. 2,i In some implementations, the processor may then be configured to: (i) determine the quality factor (Q) of the first RLC circuit path after potential corrosion and / or erosion of the first RLC circuit path. 1,f(ii) the quality factor (Q) of the second RLC circuit path after potential corrosion and / or erosion of the first RLC circuit path. 2,f According to some implementations, the processor can then be configured to: (i) via Q 1,f Subtract Q from the middle 1,i To determine the change in quality factor (ΔQ1) of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path; and (ii) by means of Q 2,f Subtract Q from the middle 2,i To determine the change in quality factor (ΔQ2) of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path. In some embodiments, the processor may then be configured to compare ΔQ1 and ΔQ2 to determine whether a portion of the first RLC circuit path has been corroded and / or eroded and / or to what extent a portion of the first RLC circuit path has been corroded and / or eroded.

[0124] For example, according to some embodiments, if the change in quality factor (ΔQ1) of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is the same as the change in quality factor (ΔQ2) of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path, then the processor can determine that the change in quality factor of the first RLC circuit path is not caused by corrosion and / or erosion of the first RLC circuit path. For example, in some embodiments, the change in quality factor of the first RLC circuit path may be caused by factors other than corrosion and / or erosion, such as the presence of structural defects such as cracks, mechanical strain, etc.

[0125] In some implementations, if the change in quality factor (ΔQ1) of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path differs from the change in quality factor (ΔQ2) of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path, then the processor can determine that the change in quality factor of the first RLC circuit path is due to corrosion and / or erosion of the first RLC circuit path. According to some implementations, the percentage change (%ΔQ) between the quality factor of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path and the quality factor of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is calculated as follows:

[0126]

[0127] Where: (i) ΔQ2 is the quality factor (Q) of the second RLC circuit path after potential corrosion and / or erosion of the first RLC circuit path. 2,f The quality factor (Q) prior to potential corrosion and / or erosion of the first RLC circuit path. 2,i (ii) The absolute difference between them; 1,i It is the quality factor of the first RLC circuit path prior to potential corrosion and / or erosion of the first RLC circuit path; (iii) Q 2,i (iv) ΔQ1 is the quality factor of the second RLC circuit path before potential corrosion of the first RLC circuit path; and (iv) ΔQ1 is the quality factor of the first RLC circuit path after potential corrosion and / or erosion of the first RLC circuit path (Q 1,f The quality factor (Q) prior to potential corrosion and / or erosion of the first RLC circuit path. 1,i The absolute difference between them.

[0128] The percentage change between the quality factor of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path and the quality factor of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path can be any of a variety of suitable values. For example, in some embodiments, the percentage change between the quality factor of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path and the quality factor of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is greater than or equal to 0%, greater than or equal to 1%, greater than or equal to 5%, greater than or equal to 10%, greater than or equal to 15%, greater than or equal to 20%, greater than or equal to 25%, greater than or equal to 30%, greater than or equal to 35%, greater than or equal to 40%, or greater than or equal to 45%. In some implementations, the percentage change between the quality factor of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path and the quality factor of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is less than or equal to 50%, less than or equal to 45%, less than or equal to 40%, less than or equal to 35%, less than or equal to 30%, less than or equal to 25%, less than or equal to 20%, less than or equal to 15%, less than or equal to 10%, less than or equal to 5%, or less than or equal to 1%. Combinations of the ranges listed above are possible (e.g., a percentage change in the quality factor of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path compared to the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is greater than or equal to 1% and less than or equal to 50%; a percentage change in the quality factor of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path compared to the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is greater than or equal to 20% and less than or equal to 30%). Other ranges are also possible.

[0129] In some embodiments, the change (e.g., percentage change) between the quality factor of the first RLC circuit path before and after corrosion and / or erosion of the first RLC circuit path and the quality factor of the second RLC circuit path before and after corrosion and / or erosion of the first RLC circuit path is proportional to the thickness of the coating that has been corroded and / or eroded on a portion (e.g., a first portion) of the inductor disposed in the first RLC circuit path. For example, in some embodiments, when the coating disposed on a portion of the inductor has been corroded and / or eroded, resulting in a change in the coating thickness from a first thickness to a second thickness (where the second thickness is less than the first thickness), the quality factor of the first RLC circuit path may change by a first amount. In some embodiments, when the coating disposed on a portion of the inductor has been corroded and / or eroded, resulting in a change in the coating thickness from a second thickness to a third thickness (where the third thickness is less than the second thickness), the quality factor of the first RLC circuit path may change by a second amount greater than the first amount. Advantageously, the change (e.g., percentage change) between the quality factor of the first RLC circuit path before and after corrosion and / or erosion of the first RLC circuit path and the quality factor of the second RLC circuit path before and after corrosion and / or erosion of the first RLC circuit path can be used to determine the extent to which a portion of the first RLC circuit path has been corroded and / or eroded, the change in quality factor being proportional to the thickness of the coating that has been corroded and / or eroded on a portion (e.g., the first portion) of the inductor disposed in the first RLC circuit path.

[0130] Reference Figure 5 According to some embodiments, sensor system 500 is a wireless sensor system. For example, in some embodiments, sensor system 500 includes wireless communication module 506. In some embodiments, wireless communication module 506 may be configured to wirelessly transmit information outside of sensor system 500. For example, in some embodiments, wireless communication module 506 may be configured to send signals (e.g., wireless signals) to circuit 100.

[0131] One or more components of the sensor system 500 may be housed in the housing ( Figure 6 (Not shown in the image). For example, circuit 100, energy storage module 502, processor 504, and / or wireless communication module 506 may be housed within a housing. Optionally or additionally, processor 504 may be provided externally to the housing, for example as a remote processor in the cloud, and coupled to circuit 100 and / or wireless communication module 506 using any suitable communication means.

[0132] As described above, in some embodiments, the circuit described herein can be used as an RLC circuit (e.g., a wireless RLC circuit). Figure 6This is a schematic diagram illustrating one operating mode of the resonant inductive pulse echo method.

[0133] According to some embodiments, the concept of a pulse-echo non-invasive sensor architecture is to keep the embedded sensing circuitry as simple as possible and shift the complexity to the reader. According to some embodiments, the measurement method is "pulse-echo". In such embodiments, the reader can apply a driving waveform to power a resonator. In some embodiments, the driving waveform is then removed for detection. After removing the driving waveform, the circuit can generate a signal (e.g., an attenuated signal in the frequency of the inductor and capacitor) that can be used to determine the mechanical characteristics of the circuit. In some embodiments, determining the mechanical characteristics of the circuit includes: determining whether a mechanical transformation has occurred in the circuit; determining the type of mechanical transformation that has occurred in the circuit; and / or determining whether a portion of the circuit has been corroded and / or eroded. For example, according to some embodiments, if a mechanical transformation has occurred in the circuit, the signal returned by the circuit to the reader reflects a change in the circuit's resonant frequency and / or a change in the circuit's quality factor; however, if a mechanical transformation has not yet occurred in the circuit, the signal returned by the sensor to the reader will not reflect a change in the circuit's resonant frequency and / or a change in the circuit's quality factor. As an example, in some implementations, the reader can use an ADC to sample information and can perform a finite Fourier transform (FFT) to estimate changes in the circuit's resonant frequency and / or changes in the circuit's quality factor, and can map changes in the circuit's resonant frequency and / or changes in the circuit's quality factor to mechanical transformations.

[0134] According to certain embodiments, methods for operating a sensor system are described. In some embodiments, the method includes applying energy to a portion of the sensor system (e.g., the circuitry of the sensor system). For example, in some embodiments, the sensor system is a wireless sensor system, and the application includes applying electromagnetic radiation (e.g., a driving waveform) from a reader to the circuitry of the wireless sensor system. In other embodiments, the sensor system is a wired sensor system, and the application includes applying power (e.g., voltage and / or current) from a power supply (e.g., an energy storage module) to the circuitry of the wired sensor system. In some embodiments, as a result of applying energy to the circuitry, the circuitry may generate a signal. According to some embodiments, the signal of the circuitry may be generated from an RLC circuit path (e.g., a first RLC circuit path and / or a second RLC circuit path). In some embodiments, the signal may be a return signal returned to the reader.

[0135] In some embodiments, the method includes measuring one or more first signals of a single circuit disposed in the sensor system using a sensor system. For example, in some embodiments, one or more first signals of a single circuit correspond to one or more signals (e.g., one or more return signals) from a first RLC circuit path, wherein a portion of the first RLC circuit path has been corroded and / or eroded. In some embodiments, the measurement includes measuring one or more first signals using a reader. According to some embodiments, the measurement includes measuring one or more first signals using a "pulse-echo" method, such as... Figure 6 As shown and described in more detail herein. In some embodiments, one or more first signals may be one or more oscillating signals of a single circuit.

[0136] In some embodiments, the method includes measuring one or more second signals of a single circuit disposed in the sensor system using a sensor system. For example, in some embodiments, one or more second signals of a single circuit correspond to one or more signals (e.g., one or more return signals) from a second RLC circuit path (e.g., a reference circuit), wherein a portion of the second RLC circuit path has not yet been corroded and / or eroded. In some embodiments, the measurement includes measuring one or more second signals using a reader. According to some embodiments, the measurement includes measuring one or more second signals using a "pulse-echo" method, such as... Figure 6 As shown and described in more detail herein. In some embodiments, one or more second signals may be one or more oscillating signals of a single circuit.

[0137] In some embodiments, the method includes transmitting signals (e.g., one or more first signals and one or more second signals) to a processor and / or receiving signals with the processor. In some embodiments, the processor may be used to compare properties of one or more first signals (e.g., the resonant frequency and / or quality factor of one or more first signals, e.g., where a portion of a first RLC circuit path has been corroded and / or eroded) with corresponding properties of one or more second signals (e.g., the resonant frequency and / or quality factor of one or more second signals, e.g., where a portion of a second RLC circuit path has not yet been corroded and / or eroded).

[0138] According to some implementations, the method includes determining, by a processor, at least in part based on a comparison between one or more first signals of a single circuit and one or more second signals (e.g., one or more reference signals) of a single circuit, whether a portion of a first RLC circuit path has been corroded and / or eroded, and / or the extent to which a portion of the first RLC circuit path has been corroded and / or eroded.

[0139] In some embodiments, the method includes using a processor to determine a comparison between the resonant frequencies of one or more first signals (e.g., where a portion of a first RLC circuit path has been corroded and / or eroded) and the resonant frequencies of one or more second signals (e.g., where a portion of a second RLC circuit path has not yet been corroded and / or eroded). For example, in some embodiments, the method includes using a processor to determine, at least in part, whether a portion of the first RLC circuit path has been corroded and / or eroded and / or the extent to which a portion of the first RLC circuit path has been corroded and / or eroded, based on changes in the resonant frequencies of the second signals before and after potential corrosion, using changes in the resonant frequencies of the second signals to distinguish changes in the resonant frequencies of the first signals that may be due to factors other than corrosion and / or erosion of the first RLC circuit path. For example, in some embodiments, the method includes using a processor to determine whether changes in the resonant frequencies of the first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path are the same as changes in the resonant frequencies of the second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path, indicating that changes in the resonant frequencies of the first RLC circuit path are not due to corrosion and / or erosion of the first RLC circuit path. In some embodiments, the method includes using a processor to determine whether a change in the resonant frequency of a first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is different from a change in the resonant frequency of a second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path, indicating that the change in the resonant frequency of the first RLC circuit path is caused by corrosion and / or erosion of the first RLC circuit path.

[0140] In some embodiments, the method includes using a processor to determine a comparison between the quality factors of one or more first signals (e.g., where a portion of a first RLC circuit path has been corroded and / or eroded) and the quality factors of one or more second signals (e.g., where a portion of a second RLC circuit path has not yet been corroded and / or eroded). For example, in some embodiments, the method includes using a processor to determine, at least in part, whether a portion of the first RLC circuit path has been corroded and / or eroded and / or the extent to which a portion of the first RLC circuit path has been corroded and / or eroded based on changes in the quality factors of the first signals before and after potential corrosion, and using changes in the quality factors of the second signals to distinguish changes in the quality factors of the first signals that may be due to factors other than corrosion and / or erosion of the first RLC circuit path. For example, in some embodiments, the method includes using a processor to determine whether a change in the quality factor of a first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is the same as a change in the quality factor of a second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path, indicating that the change in the quality factor of the first RLC circuit path is not caused by corrosion and / or erosion of the first RLC circuit path. In some embodiments, the method includes using a processor to determine whether a change in the quality factor of a first RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path is different from a change in the quality factor of a second RLC circuit path before and after potential corrosion and / or erosion of the first RLC circuit path, indicating that the change in the quality factor of the first RLC circuit path is caused by corrosion and / or erosion of the first RLC circuit path.

[0141] Figure 7 An example comparing the resonant frequency of a first signal and the resonant frequency of a second signal in a single circuit is shown. Figure 7As shown, the resonant frequency of the first signal is between 500 kHz and 600 kHz, and the resonant frequency of the second signal is between 1 MHz and 1.5 MHz. According to some embodiments, the resonant frequency of the first signal may correspond to the resonant frequency of a first RLC circuit path of a single circuit, and the resonant frequency of the second signal (e.g., a reference signal) may correspond to the resonant frequency of a second RLC circuit path (e.g., a reference circuit) of a single circuit. In some embodiments, a processor associated with a sensor system including a single circuit may be configured to determine, at least in part, whether a portion of the first RLC circuit path has been corroded and / or eroded, and / or the extent to which a portion of the first RLC circuit path has been corroded and / or eroded, based on the change in the resonant frequency of the first signal before and after corrosion, using the change in the resonant frequency of the second signal to distinguish changes in the resonant frequency of the first signal that may be due to factors other than corrosion and / or erosion of the first RLC circuit path.

[0142] Although several embodiments of the invention have been described and illustrated herein, those skilled in the art will readily conceive of various other means and / or structures for performing functions and / or obtaining results and / or one or more of the advantages described herein, and each of such variations and / or modifications is considered to be within the scope of the invention. More generally, those skilled in the art will readily understand that all parameters, dimensions, materials, and configurations described herein are intended to be exemplary, and actual parameters, dimensions, materials, and / or configurations will depend on the specific application or application of the teachings of the invention. Those skilled in the art will recognize or be able to determine many equivalents of the specific embodiments of the invention described herein using only conventional experimentation. Therefore, it should be understood that the foregoing embodiments are presented by way of example only, and the invention can be practiced in ways other than those specifically described and claimed within the scope of the appended claims and their equivalents. The invention is directed toward each individual feature, system, article, material, and / or method described herein. Furthermore, any combination of two or more such features, systems, articles, materials, and / or methods is included within the scope of the invention if such features, systems, articles, materials, and / or methods are not contradictory.

[0143] Unless explicitly indicated otherwise, the indefinite articles “a” and “an” as used herein in the specification and claims shall be understood to mean “at least one”.

[0144] The phrase “and / or” as used herein in the specification and claims should be understood to mean “one or both” of the elements so combined, that is, elements exist together in some cases and separately in others. Other elements may optionally be present, whether related to or unrelated to those specifically identified by the “and / or” clause, unless explicitly indicated otherwise. Thus, as a non-limiting example, when used in conjunction with open-ended language such as “comprising,” the reference to “A and / or B” can: in one embodiment refer to A without B (optionally including elements other than B); in another embodiment refer to B without A (optionally including elements other than A); in yet another embodiment refer to both A and B (optionally including other elements); and so on.

[0145] As used herein in the specification and claims, “or” should be understood to have the same meaning as “and / or” as defined above. For example, when items in a list are separated, “or” or “and / or” should be interpreted as inclusive, i.e., including multiple elements or at least one element in the list of elements, but also including more than one element, and optionally including additional unlisted items. Only explicitly indicating the opposite terms such as “only one of…” or “exact one of…”, or when used in claims, “consisting of…” will mean including multiple elements or exactly one element in the list of elements. Generally, when preceded by exclusive terms such as “one of,” “one of…,” “only one of…,” or “exact one of…,” the term “or” as used herein should only be understood to indicate an exclusive alternative (i.e., one or the other but not both). “Substantially consisting of…” when used in claims should have the ordinary meaning used in the field of patent law.

[0146] As used herein in the specification and claims, the phrase "at least one" when referring to a list of one or more elements should be understood to mean at least one element selected from any one or more elements in the list, but does not necessarily include each and every element specifically listed in the list, and does not exclude any combination of elements in the list. This definition also allows for the optional presence of elements other than those specifically identified in the list of elements referred to by the phrase "at least one," whether related to or unrelated to those specifically identified elements. Therefore, as a non-limiting example, "at least one of A and B" (or equivalently, "at least one of A or B", or equivalently, "at least one of A and / or B") can: in one embodiment refer to at least one A, optionally including more than one A, while B is absent (and optionally including elements other than B); in another embodiment refer to at least one B, optionally including more than one B, while A is absent (and optionally including elements other than A); in yet another embodiment, refer to at least one A, optionally including more than one A, and at least one B, optionally including more than one B (and optionally including other elements); and so on.

[0147] Some implementations can be implemented as methods, and various examples of methods have been described. Actions performed as part of a method can be ordered in any suitable manner. Thus, implementations in which actions are performed in a different order than those shown can be constructed, which may include actions that are different from those described (e.g., more or fewer), and / or may involve performing some actions simultaneously, even if these actions are shown to be performed sequentially in the implementations specifically described above.

[0148] The use of ordinal terms such as “first,” “second,” “third,” etc., to modify a claim element does not imply any priority, precedence, or order of one claim element relative to another claim element, or the temporal order of the actions of the method of execution. Rather, it serves only as a label to distinguish one claim element with a specific name from another element with the same name (but for use with ordinal terms) to differentiate claim elements.

[0149] In the claims and the description above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” etc., shall be understood as open-ended, meaning including but not limited to. As set forth in Section 2111.03 of the Patent Examination Procedure Manual of the U.S. Patent Office, only the transitional phrases “consisting of” and “consisting substantially of” shall be closed or semi-closed transitional phrases, respectively.

Claims

1. A sensor system, comprising: A single circuit includes: First RLC circuit path; and Second RLC circuit path, Wherein, at least a portion of the first RLC circuit path is configured to be corroded and / or eroded, and the second RLC circuit path is configured as a reference circuit, such that one or more circuit signals can be used to determine whether the portion of the first RLC circuit path has been corroded and / or eroded and / or the extent to which the portion of the first RLC circuit path has been corroded and / or eroded.

2. The sensor system according to claim 1, wherein, The sensor system is a wireless sensor system.

3. The sensor system according to any one of claims 1 to 2, wherein, The first RLC circuit path includes a first portion of an inductor, the inductor including an elongated nanostructure that implements the electronic functions of the inductor.

4. The sensor system according to claim 3, wherein, The first portion of the inductor includes a coating disposed on the elongated nanostructure.

5. The sensor system according to claim 4, wherein, The coating comprises metal.

6. The sensor system according to any one of claims 4 to 5, wherein, The coating is configured to corrode and / or erode.

7. The sensor system according to any one of claims 3 to 6, wherein, The first RLC circuit path includes a first capacitor, which includes an elongated nanostructure that performs the electronic functions of the capacitor.

8. The sensor system according to claim 7, wherein, The first electrode of the first capacitor is electronically coupled to the first portion of the inductor via a first conductive path, and wherein the second electrode of the first capacitor is electronically coupled to the first portion of the inductor via a second conductive path.

9. The sensor system according to any one of claims 3 to 8, wherein, The second RLC circuit path includes the second portion of the inductor.

10. The sensor system according to any one of claims 8 to 9, wherein, The second RLC circuit path includes a second capacitor, which includes an elongated nanostructure that enables the electronic functions of the capacitor.

11. The sensor system according to claim 10, wherein, The first electrode of the second capacitor is electronically coupled to the second portion of the inductor via the second conductive path, and wherein the second electrode of the second capacitor is electronically coupled to the second portion of the inductor via a third conductive path.

12. A method for operating a sensor system, comprising: The sensor system measures a first signal from a single circuit disposed within the sensor system, wherein the single circuit comprises: First RLC circuit path; and Second RLC circuit path, Wherein, at least a portion of the first RLC circuit path is configured to be corroded and / or eroded, and the second RLC circuit path is configured as a reference circuit, such that one or more circuit signals can be used at least partially to determine whether the portion of the first RLC circuit path has been corroded and / or eroded and / or the extent to which the portion of the first RLC circuit path has been corroded and / or eroded. The sensor system measures a second signal of the single circuit, wherein the second signal is a reference signal of the reference circuit; and The processor determines, at least in part, whether the portion of the first RLC circuit path has been corroded and / or eroded, and / or the extent to which the portion of the first RLC circuit path has been corroded and / or eroded, based on a comparison between the first signal and the second signal.

13. The method according to claim 12, wherein, The sensor system is a wireless sensor system.

14. The method of any one of claims 12 to 13, further comprising supplying power to at least a portion of the single circuit using an energy storage module configured to store electrical energy.

15. The method according to any one of claims 12 to 14, wherein, The first signal of the single circuit is the oscillation signal of the single circuit.

16. The method according to any one of claims 12 to 15, wherein, The second signal of the single circuit is the oscillation signal of the single circuit.

17. The method according to any one of claims 12 to 16, further comprising transmitting a signal representing the first signal of the single circuit and the second signal of the single circuit from the single circuit to the processor.

18. The method according to any one of claims 12 to 17, wherein, The comparison includes a comparison of the resonant frequency of the first signal and the resonant frequency of the second signal.

19. The method according to any one of claims 12 to 18, wherein, The comparison includes the following comparisons: (i) the resonant frequency of the first signal before and after potential corrosion and / or erosion of the first RLC circuit path; and (ii) the resonant frequency of the second signal before and after potential corrosion and / or erosion of the first RLC circuit path.

20. The method according to any one of claims 12 to 19, wherein, The comparison includes a comparison of the quality factor of the first signal and the quality factor of the second signal.

21. The method according to any one of claims 12 to 20, wherein, The comparison includes the following comparisons: (i) the quality factor of the first signal before and after potential corrosion and / or erosion in the first RLC circuit path; and (ii) the quality factor of the second signal before and after potential corrosion and / or erosion in the first RLC circuit path.

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