Machining method for array holes of thin-wall part and auxiliary device

Abstract

The invention relates to the technical field of thin-walled workpiece machining, in particular to a thin-walled workpiece array hole machining method and an auxiliary device.The thin-walled workpiece array hole machining method comprises the following steps that a thin-walled workpiece is fixed to a workbench of a machine tool, and the machining position of each array hole is determined; a first hole is machined and formed in the thin-wall part; 2-nth holes are sequentially machined and formed in the thin-wall part, n is larger than or equal to 3, if adjacent machining positions of the second hole or the nth hole are machined to form adjacent holes, elastic supporting pieces are fixed in the adjacent holes firstly, and hole walls of the adjacent holes are supported through the elastic supporting pieces; and disassembling the thin-wall part. By the adoption of the technical scheme, the damage risk in the thin-wall part array hole machining process can be effectively controlled, the machining quality and yield of the thin-wall hole array are improved, and the method is simple, low in cost and easy to implement.

Description

Technical Field

[0001] This invention relates to the field of thin-walled part processing technology, and in particular to a processing method and auxiliary device for array holes in thin-walled parts. Background Technology

[0002] Thin-walled components are widely used in key fields such as aerospace, electronic communications, medical devices, and automotive lightweighting, occupying an irreplaceable and important position in the modern industrial system. In the aerospace field, thin-walled structural components are often used in engine casings, spacecraft cabins, and other parts. Their lightweight characteristics effectively reduce the overall weight of the equipment, improving fuel efficiency and flight performance. In the electronic communications field, thin-walled aperture arrays are the core structure for signal transmission and filtering in 5G base station filters and mobile phone RF modules, directly affecting the communication quality of the equipment. In the medical device field, minimally invasive surgical instruments and biochips have even more stringent requirements for the precision and reliability of thin-walled components. The processing quality of thin-walled components directly affects the safety and accuracy of medical procedures. The rapid development of these fields has placed increasingly higher demands on the processing precision, efficiency, and quality of thin-walled components, especially array aperture structures, making thin-walled component processing technology one of the important indicators for measuring a country's high-end manufacturing level.

[0003] When machining thin-walled hole arrays (thin-walled holes can be countersunk holes or through holes) on a workpiece material, the entire machining process requires rigorous process planning and precise operational control. Taking a typical thin-walled metal part as an example, the key parameters such as the number of holes, hole diameter, hole position distribution, and hole wall thickness must first be determined according to the design drawings. For example, the hole diameter must be between 1mm and 2mm, and the distance between the edges of the holes must be 0.05mm (i.e., the hole wall thickness is 0.05mm, less than the thickness of an 80gsm A4 sheet of paper). Such dimensional accuracy places extremely high demands on the machining equipment and cutting tools. Before machining, the thin-walled part needs to be clamped and fixed. Because the workpiece wall is thin and easily deformed, a special fixture must be used for clamping to avoid plastic deformation of the workpiece during clamping by applying force evenly at multiple points. Subsequently, a suitable machining method is selected, currently the two most commonly used being drilling or milling. During drilling, high-hardness, high-wear-resistant micro-diameter drill bits must be selected, and machining should be performed with a slow feed rate and appropriate spindle speed to ensure that the drill bit can smoothly cut into the material. Milling, on the other hand, uses a high-speed rotating milling cutter to shape the hole, also requiring precise control of the cutter path and cutting parameters. During the machining process, after each hole is completed, the size and positional accuracy of the hole need to be checked online to adjust machining parameters in a timely manner and avoid error accumulation.

[0004] However, when machining the next hole using drilling or milling, the hole sidewalls primarily bear the tangential force applied by the cutting edge or the radial force applied by the tool. Although this tangential or radial force is much smaller than the axial force applied during machining, the hole wall is still highly susceptible to damage due to vibration, stress, and thermal deformation associated with machining. From a vibration perspective, thin-walled parts are inherently less rigid and are prone to forced vibration under cutting forces. This vibration causes fluctuations in the relative position between the tool and the workpiece, affecting not only the dimensional accuracy and surface roughness of the hole but also exacerbating uneven stress on the hole wall and increasing the risk of breakage. Regarding stress, the cutting process generates residual stress, and the structural characteristics of thin-walled parts make it difficult to release this residual stress. As the number of holes increases, the residual stress accumulates, and when the stress value exceeds the material's yield strength, cracks or even breakage will appear in the hole wall. Thermal deformation is also a significant factor. The cutting heat generated during the machining process causes localized temperature increases in thin-walled parts. Due to the extremely thin workpiece, heat transfer is rapid but uneven, leading to thermal expansion and contraction. This thermal deformation alters the actual position and size of the hole and subjects the hole wall to additional thermal stress, further reducing its structural stability. If a hole wall cracks due to these factors, the crack often propagates rapidly due to the integrity and structural interconnectedness of the thin-walled part, rendering the entire workpiece unusable and causing severe economic losses and project delays. Furthermore, thin-walled parts are often made of specialized materials, such as titanium alloys, high-temperature alloys, and composite materials. These materials are inherently more difficult to process and have higher material costs, further amplifying the losses from machining failures.

[0005] For machining array holes in thin-walled parts, Chinese patent CN115971550A discloses a high-pressure airbag-assisted precision milling method for thin-walled components. The method involves placing the thin-walled component to be machined on a supporting diaphragm and fixing it. A pressurized fluid medium is continuously injected into the high-pressure airbag auxiliary device and discharged through the outlet of the high-pressure airbag, ensuring complete contact between the machining area of ​​the thin-walled component and the supporting diaphragm. The high-pressure airbag auxiliary device moves synchronously with the milling cutter, and the high-pressure airbag and pressurized fluid medium jointly apply pressure to the thin-walled component. The milling cutter then mills the thin-walled component and removes the part. This method uses a flexible airbag to apply pressure to the machining area on the surface of the thin-walled component, ensuring complete contact between the machining area and the supporting diaphragm, thereby suppressing deformation of the thin-walled component during machining. However, while this method can suppress deformation, it cannot prevent thin-walled component damage during machining.

[0006] Therefore, how to effectively control the breakage risk during the machining of array holes in thin-walled parts has become a key technical problem that urgently needs to be solved in the field of machining. Summary of the Invention

[0007] This invention provides a method and auxiliary device for processing array holes in thin-walled parts. It can effectively control the risk of breakage during the processing of array holes in thin-walled parts, improve the processing quality and yield of thin-walled hole arrays, and the method is simple, low-cost and easy to implement.

[0008] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: This invention provides a method for processing arrayed holes in a thin-walled component, comprising the following steps: Fix the thin-walled part onto the machine tool's worktable and determine the machining positions of each array hole; The first hole is machined and formed on the thin-walled part; The second to nth holes are sequentially machined on the thin-walled part, where n≥3. If the adjacent machining positions of the second or nth hole have already been machined to form adjacent holes, then an elastic support is fixed in the adjacent hole first, and the elastic support forms support for the hole wall of the adjacent hole. Disassemble thin-walled components.

[0009] The beneficial effects of this invention are as follows: When a hole is formed in a thin-walled part, and adjacent holes have already been formed at the adjacent positions of the hole, an elastic support is first fixed in the adjacent holes. The elastic support provides support for the hole walls of the adjacent holes. Then, the processing is carried out. During the processing, the elastic support fully fits the inner wall of the hole through its elasticity, achieving comprehensive and uniform support. The elastic support that supports the hole walls of the adjacent holes can absorb the vibration generated during the processing, which protects the inner wall of the hole to a certain extent and prevents thin-wall damage during the processing. This greatly improves the processing quality and yield of the thin-walled hole array. Moreover, the method is simple, low-cost, and easy to implement.

[0010] Furthermore, after machining the second or nth hole, if there are elastic supports fixed in adjacent holes, the elastic supports in the adjacent holes are removed first; or, after machining all the array holes, all the elastic supports are removed at the same time.

[0011] The present invention also provides an auxiliary device for a processing method, comprising an elastic support, a pipe with one end connected to the elastic support, and a pressure generator with its outlet end connected to the other end of the pipe, the pressure generator being used to transport a fluid medium.

[0012] The beneficial effects of this invention are as follows: When it is necessary to support adjacent holes, the elastic support is first placed in the adjacent hole, and then the medium is transported through a pressure generator to the elastic support via a pipeline, causing the elastic support to expand and support the hole wall of the adjacent hole. After the hole wall of the adjacent hole is supported, the pressure generator is turned off, and the pressure is maintained in the elastic support to maintain the support of the elastic support for the hole wall of the adjacent hole. Then, the processing operation is performed. After the processing is completed, the fluid medium is output in reverse through the pressure generator, and the elastic support contracts, so that the elastic support can be removed. This effectively controls the risk of breakage during the processing of thin-walled part array holes, improves the processing quality and yield of thin-walled hole arrays, and the method is simple, low-cost, and easy to implement.

[0013] Based on the above technical solution, the present invention can be further improved as follows.

[0014] Furthermore, it also includes a first connector and a second connector, wherein the two ends of the first connector are respectively sealed and connected to one end of the elastic support and one end of the pipe, and the two ends of the second connector are respectively sealed and connected to the other end of the pipe and the pressure generator.

[0015] Furthermore, it also includes a one-way valve disposed on the pipeline.

[0016] Furthermore, it also includes a pressure monitor, which is disposed on the pipe or the elastic support.

[0017] Furthermore, the pipe is a flexible hose and is positioned away from the cutting tool.

[0018] The present invention also provides an auxiliary device for a processing method, including an elastic support member, wherein the elastic support member is a sealed elastic capsule structure.

[0019] The beneficial effects of this invention are: before processing, multiple elastic support members corresponding to the size of the hole to be processed can be prefabricated. During processing, the elastic support members can be placed in adjacent holes of the hole to be processed to form a support, and then processing can be carried out until the processing is completed, at which point all elastic support members are removed.

[0020] The present invention also provides an auxiliary device for a processing method, including an elastic support member, wherein the elastic support member is a peelable PU foam material, a soluble foam material, a thermoplastic foam material, a hot melt adhesive granule material, or a wax-based material.

[0021] The present invention also provides an auxiliary device for a processing method, including an elastic support member, wherein the elastic support member is a curable gel material. Attached Figure Description

[0022] Figure 1This is a flowchart of the processing method of the present invention; Figure 2 This is a partial structural diagram of the auxiliary device of the present invention in use. Figure 3 This is a structural diagram of the auxiliary device of the present invention.

[0023] The attached diagram lists the components represented by each number as follows: 1. Thin-walled component; 2. Elastic support component; 3. Pipeline; 31. First connector; 32. Second connector; 33. Check valve; 4. Pressure generator; 5. Pressure monitor. Detailed Implementation

[0024] The principles and features of the present invention are described below. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0025] Example 1 like Figure 1 and Figure 2 This embodiment provides a method for processing array holes in a thin-walled component, including the following steps: The thin-walled part 1 is fixed on the worktable of the machine tool, and the machining positions of each array hole are determined; The first hole is machined and formed on the thin-walled part 1; The second to nth holes are sequentially machined on the thin-walled part 1, where n≥3. If the adjacent machining positions of the second or nth hole have already been machined to form adjacent holes, then the elastic support 2 is fixed in the adjacent hole first, and the elastic support 2 forms support for the hole wall of the adjacent hole. Disassemble thin-walled component 1.

[0026] The beneficial effects of this embodiment are as follows: When a hole is formed on the thin-walled part 1, and adjacent holes have been formed at the adjacent positions of the hole, an elastic support 2 is first fixed in the adjacent holes. The elastic support 2 provides support for the hole walls of the adjacent holes. Then, the processing is carried out. During the processing, the elastic support 2 fully fits the inner wall of the hole through its elasticity, achieving comprehensive and uniform support. The elastic support 2, which supports the hole walls of the adjacent holes, can absorb the vibration generated during the processing, protect the inner wall of the hole to a certain extent, prevent the thin-walled part from being damaged during the processing, and greatly improve the processing quality and yield of the thin-walled hole array.

[0027] By adopting the above processing method, it is only necessary to place the elastic support 2 in the adjacent hole and make the elastic support 2 support the hole wall of the adjacent hole. The method is simple, low-cost and easy to implement.

[0028] In this invention, after the second or nth hole is machined, if an elastic support 2 is fixed in an adjacent hole, the elastic support 2 in the adjacent hole is removed first to reduce the damage or corrosion of the elastic support 2 by chips, cutting fluid, etc., and to reduce the spatial impact of the elastic support 2 and / or pipe 3 on the machining operation.

[0029] Alternatively, after all the array holes have been machined, all the elastic support components 2 can be disassembled at the same time.

[0030] It should be noted that selecting an elastic support 2 of the corresponding size according to the diameter of the hole to be processed is common practice in the field. These are all conventional methods or common knowledge, and will not be elaborated here. Those skilled in the art can make any selection according to their needs or convenience.

[0031] Meanwhile, it should be noted that the clamping and processing methods for thin-walled part 1, such as using a milling machine or a lathe for clamping and processing, are all existing technologies in this field. Applying them to the processing of thin-walled part 1 can be achieved without creative effort, and will not be elaborated here.

[0032] Furthermore, those skilled in the art can implement specific processing strategies for the array holes using the following methods. For example, the array has four rows of holes, staggered, with the edge distance between any hole and the surrounding 2-6 holes being 0.05mm. Specifically, the processing can be carried out using the following methods.

[0033] As one of the specific processing methods, if the holes are processed one by one in sequence, then when processing any other hole except the first one, elastic support members 2 need to be placed in the surrounding already processed holes to support the hole walls.

[0034] As a second specific processing method, the holes in the first row are first processed at intervals, with a distance of one hole between each two adjacent holes being processed. This ensures that the holes processed first are evenly spaced and do not form thin walls, and can be processed using ordinary drilling techniques. When processing the holes between two adjacent holes, an elastic support 2 is inserted into the adjacent holes that have already been processed. The elastic support 2 provides support for the holes before the intermediate holes are processed.

[0035] For the second processing method, when processing holes in other rows, one method can be used: first process the holes in the third row at intervals, with a distance of one hole between each adjacent hole being processed. This ensures that the holes processed first are evenly spaced and do not form thin walls, and can be processed using ordinary drilling techniques. Another method can be used: directly process the holes in the second row. In this case, only one side will have a thin wall. After the elastic support member 2 forms support for the hole, processing can be carried out.

[0036] Similarly, when machining other holes, the most complex situation may occur, where six holes have already been formed around the hole to be machined. In this case, six elastic support members 2 are needed to support the six holes that have already been formed.

[0037] After determining the machining method, holes can be machined sequentially using a drill bit or milling cutter in the predetermined manner.

[0038] Example 2 like Figure 2 and Figure 3 This second embodiment provides an auxiliary device, which is applied to the processing method of the array hole of the thin-walled part as described in the first embodiment. The auxiliary device includes an elastic support 2, a pipe 3 with one end connected to the elastic support 2, and a pressure generator 4 with the outlet end connected to the other end of the pipe 3. The pressure generator 4 is used to realize the transportation of fluid medium.

[0039] When it is necessary to support adjacent holes, the elastic support 2 is first placed in the adjacent hole. Then, the medium is transported through the pressure generator 4 and delivered to the elastic support 2 through the pipe 3, causing the elastic support 2 to expand and support the hole wall of the adjacent hole. After the hole wall of the adjacent hole is supported, the pressure generator 4 is turned off, and the pressure is maintained in the elastic support to maintain the support of the elastic support 2 on the hole wall of the adjacent hole. Then, the processing operation is carried out. After the processing is completed, the fluid medium is output in reverse through the pressure generator 4, and the elastic support 2 contracts, so the elastic support 2 can be removed. This effectively controls the risk of breakage during the processing of thin-walled part array holes, improves the processing quality and yield of thin-walled hole arrays, and the method is simple, low-cost, and easy to implement.

[0040] As one of the specific solutions in this second embodiment, the pressure generator 4 is a bidirectional air pump, specifically a bidirectional air pump or a pneumatic bidirectional diaphragm pump, and the fluid medium is a gas, such as nitrogen, so that the gas is delivered into the elastic support 2 through the bidirectional air pump to realize the expansion of the elastic support 2.

[0041] As a second specific solution in this embodiment, the pressure generator 4 is a bidirectional water pump, specifically a bidirectional cross-flow pump, a bidirectional flow channel water pump, or a pneumatic diaphragm bidirectional water injection pump, and the fluid medium is a liquid, such as water, so that the liquid is transported into the elastic support 2 through the bidirectional water pump to realize the expansion of the elastic support 2.

[0042] Correspondingly, the elastic support 2 is an air bladder or liquid bladder, which provides support to the borehole wall through expansion. The air bladder or liquid bladder has a multi-layered structure to balance rigidity and flexibility, buffer the propagation of expansion cracks, and enhance deformation stability. The outermost layer of the air bladder or liquid bladder is an anti-corrosion layer to prevent corrosion from cutting fluid and achieve a longer service life. Simultaneously, the air bladder or liquid bladder material should be able to withstand a certain temperature, and within the normal processing temperature range, it should not suffer from significant deformation or defects such as burn-through or wrinkles due to heat conducted from the borehole wall, thus not affecting normal performance (of course, those skilled in the art can choose high-temperature resistant materials for fabrication). Specifically, the air bladder or liquid bladder can be made of materials such as polyethylene terephthalate (PET), polyamide (nylon), polyurethane (PU / TPU), silicone, or various types of rubber (NR, SBR, EPDM, CR, Neoprene, NBR, IIR, FKM, Viton).

[0043] In this design, pipe 3 is a flexible hose and is positioned away from the cutting tool to prevent damage from the tool. Simultaneously, the placement of pipe 3 ensures sufficient space for the cutting tool to operate. Specifically, those skilled in the art can use a robotic arm or a similar pressing structure (such as a clamp) to secure pipe 3 and keep it away from the cutting tool.

[0044] Based on the above embodiments, the auxiliary device of this second embodiment also includes a first connector 31 and a second connector 32. The two ends of the first connector 31 are respectively sealed and connected to one end of the elastic support 2 and the pipe 3, and the two ends of the second connector 32 are respectively sealed and connected to the other end of the pipe 3 and the pressure generator 4.

[0045] The pipe 3 is stably connected to the elastic support 2 and the pressure generator 4 through the first connector 31 and the second connector 32.

[0046] It should be noted that the sealing connection between the first connector 31 and the elastic support 2 and the pipe 3, as well as the sealing connection between the second connector 32 and the pipe 3 and the pressure generator 4, are common in the art and are conventional methods or common knowledge. They will not be described in detail here. Those skilled in the art can use any sealing connection method according to their needs or convenience, such as thermal bonding (thermal welding), adhesive bonding (such as UV curable single-component adhesive) or mechanical connection sealing.

[0047] Based on the above embodiments, the auxiliary device in this second embodiment also includes a one-way valve 33, which is disposed on the pipeline 3.

[0048] When the fluid medium is introduced into the elastic support 2, causing the elastic support 2 to expand, the one-way valve 33 is opened. After the elastic support 2 expands and forms support for the wall of the adjacent hole, the one-way valve 33 is closed to maintain the pressure of the elastic support 2 and achieve continuous support for the hole wall.

[0049] Based on the above embodiments, the auxiliary device in this second embodiment also includes a pressure monitor 5, which is disposed on the pipeline 3 or the elastic support 2. The pressure monitor 5 can monitor and accurately sense and respond to pressure changes within the elastic support 2 in real time, especially in the event of airbag rupture and leakage, enabling rapid detection and response.

[0050] As one of the installation methods of the pressure monitor 5 in this embodiment, the pressure monitor 5 can be a pressure sensor and is configured on the pipeline 3, and the pressure monitor 5 is close to the elastic support 2 relative to the one-way valve 33.

[0051] As a second installation method for the pressure monitor 5 in this embodiment, the pressure monitor 5 is installed inside the elastic support 2, and can be a MEMS capacitive pressure sensor, a MEMS piezoresistive pressure sensor or a piezoelectric pressure sensor, and transmits data wirelessly.

[0052] As a third installation method of the pressure monitor 5 in this embodiment, the pressure monitor 5 is fixed to the outer wall of the elastic support 2. It can be a patch pressure sensor, a flexible pressure sensor or a fiber optic pressure sensor, integrated into the outer wall of the elastic support 2 to directly sense the pressure applied by the airbag to the hole wall.

[0053] Example 3 like Figure 2 and Figure 3 This embodiment three provides an auxiliary device, which is applied to the processing method of thin-walled part array holes as described in embodiment one. The auxiliary device includes an elastic support 2, which is a sealed elastic capsule structure.

[0054] Before processing, multiple elastic support members 2 corresponding to the size of the holes to be processed can be prefabricated. During processing, the elastic support members 2 can be placed in adjacent holes of the holes to be processed to form support, and then processing can be carried out until the processing is completed. Then all the elastic support members 2 are removed at the same time (of course, the elastic support members 2 can also be selectively removed first during the processing).

[0055] It should be noted that selecting and processing the elastic support 2 of the sealing elastic bladder structure of the corresponding size according to the size of the hole to be processed is a conventional method or common knowledge in the field, and will not be elaborated here. Those skilled in the art can process and manufacture it arbitrarily according to their needs or convenience. Specifically, the elastic support 2 can be made of rubber or silicone through molding, injection molding or impregnation in one piece. The bladder is provided with a valve for filling the medium, and a permanent sealing connection is achieved through bonding or vulcanization process.

[0056] Example 4 This embodiment four provides an auxiliary device, which is applied to the processing method of thin-walled part array holes as described in embodiment one. The auxiliary device includes an elastic support 2, which is a peelable PU foam material, a soluble foam material, a thermoplastic foam material, a hot melt adhesive particle material, or a wax-based material.

[0057] During operation, after filling the hole to be supported with the aforementioned elastic support material 2, the material is expanded using techniques known to those skilled in the art (such as heating or contact with water), filling the hole, solidifying, hardening, and supporting the hole wall. After processing, it is completely removed by heating or chemical solvents, leaving no residue in the hole.

[0058] Among them, the peelable PU foam material can expand by mixing and heating two components: component A: isocyanate; component B: polyol, foaming agent, and catalyst. After mixing, the foaming agent (such as physical foaming agent HCFC-141b, chemical foaming agent water) releases gases (such as...) upon heating or chemical reaction. This causes the PU system to expand, and the expansion rate can be adjusted through the formulation (usually 10-50 times, to suit the filling requirements of different pore sizes).

[0059] Soluble foam materials can be physically pre-expanded or mechanically pressed in. For example, soluble polyurethane foam is pre-expanded into porous foam blocks before leaving the factory. It can be directly cut into sizes that match the pore size and mechanically pressed into the pores to fill them (no additional expansion step is required; it relies on the elastic deformation of the foam to fit the pore walls). Soluble starch-based foam can be heated (60-80℃) to slightly expand the starch granules (expansion rate 2-5 times) to form a loose foam structure. After filling, it can maintain its shape by naturally cooling to room temperature (no curing is required; the supporting force is maintained by the hydrogen bonds between starch molecules).

[0060] Thermoplastic foams can expand by heating to their softening temperature range (above the glass transition temperature but below the melting temperature). For example, PE (polyethylene) foam softens when heated to 80-120℃, and the gas (such as air or nitrogen) in the closed pores expands, increasing the overall volume of the foam (expansion rate 3-10 times) and conforming to the pore walls. EVA (ethylene-vinyl acetate) foam softens and expands when heated to 60-90℃, is easily molded at low temperatures, and is suitable for low-temperature sensitive substrates (such as plastics and rubber parts).

[0061] Hot melt adhesive granules or wax-based materials are both hot melt materials. Their "expansion" is essentially "flow filling after heating and melting" (expansion without gas foaming, relying on the fluidity of the molten state to fill the pores). "Cure" is the solidification and hardening after the molten state cools, and the core depends on the triggering of "temperature change". For example, hot melt adhesive granules can be heated to 110-180℃ by hot melt glue gun or oven to melt, and solidify in 10-30 seconds after cooling to form a hard adhesive layer (Shore hardness D50-D70), which has strong adhesion to the pore walls (some hot melt adhesives contain tackifiers, which can bond tightly to metal and plastic substrates); wax-based materials can be heated to 50-90℃ by water bath or hot air to melt, and solidify in 5-15 seconds after cooling to form a brittle or tough wax layer (lower hardness, Shore hardness A60-A80), with weaker adhesion, which can be removed later by heating (remelting) or mechanical peeling.

[0062] Example 5 This fifth embodiment provides an auxiliary device, which is applied to the processing method of thin-walled part array holes as described in embodiment one. The auxiliary device includes an elastic support 2, which is a curable gel material.

[0063] In this embodiment, the curable gel material can be a physically swelling type curable gel (expanding by absorbing water / solvent, curing by solvent evaporation / cooling, simple operation), such as aqueous sodium polyacrylate (PAA-Na) gel, solvent-based polyvinyl chloride (PVC) gel, and thermotropic poly(N-isopropylacrylamide) (PNIPAM) gel. The aqueous sodium polyacrylate (PAA-Na) gel is a viscous liquid when uncured. After injection into the pores, the sodium polyacrylate segments combine with water molecules through hydrogen bonds, causing swelling, with a volume expansion of 5-20 times (the expansion rate can be adjusted by the water addition ratio: the more water added, the higher the expansion rate), filling the pores; solvent-based… Polyvinyl chloride (PVC) gel dissolves in a solvent to form a transparent solution. After being injected into the pore, the solvent slowly evaporates, and the PVC segments aggregate to form a gel. At the same time, due to the plasticizing effect of the plasticizer, the gel volume expands slightly (1.2-1.8 times) and tightly adheres to the pore wall. Thermotropic poly(N-isopropylacrylamide) gel is a "temperature-sensitive gel". At low temperatures (<32℃, the lowest critical dissolution temperature of PNIPAM, LCST), the gel absorbs water and swells, expanding in volume by 8-15 times. When the temperature is raised to >32℃, the gel dehydrates and shrinks. This characteristic can be used to achieve "precise expansion filling"—expansion in the pore at low temperatures and curing and shaping at higher temperatures.

[0064] Curable gel materials can also be selected from special functional curable gels, such as high-temperature resistant ceramic gels or biodegradable gels. For high-temperature resistant ceramic gels, after silica sol and ceramic powder are mixed, ammonia water initiates the polymerization of silica sol to form a gel network, while ceramic powder is dispersed in it, resulting in a volume expansion of 1.1-1.3 times (low expansion to avoid cracking at high temperatures); for biodegradable gels, the core components are chitosan (natural polysaccharide) + cross-linking agent (such as glutaraldehyde) + water. Chitosan dissolves in dilute acid (such as 1% acetic acid) to form a solution, which is then injected into the channels. The cross-linking agent cross-links the chitosan segments, while the solution absorbs water and swells, resulting in a volume expansion of 3-8 times.

[0065] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0066] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0067] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0068] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0069] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0070] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method for processing arrayed holes in a thin-walled component, characterized in that, Includes the following steps: The thin-walled part (1) is fixed on the worktable of the machine tool, and the machining position of each array hole is determined; The first hole is machined and formed on the thin-walled part (1); The second to nth holes are sequentially machined on the thin-walled part (1), n≥3. If the adjacent machining positions of the second or nth hole have been machined to form adjacent holes, then the elastic support (2) is fixed in the adjacent hole first, and the support of the hole wall of the adjacent hole is formed by the elastic support (2). Disassemble the thin-walled component (1).

2. The method for processing arrayed holes in a thin-walled component according to claim 1, characterized in that, After the second or nth hole is processed, if there is an elastic support (2) fixed in the adjacent hole, the elastic support (2) in the adjacent hole is removed first, or, after all the array holes are processed, all the elastic support (2) is removed at the same time.

3. An auxiliary device for processing an array of holes in a thin-walled part as described in claim 1 or 2, characterized in that, It includes an elastic support (2), a pipe (3) with one end connected to the elastic support (2), and a pressure generator (4) with its outlet end connected to the other end of the pipe (3). The pressure generator (4) is used to realize the transportation of fluid media.

4. The auxiliary device according to claim 3, characterized in that, It also includes a first connector (31) and a second connector (32), the two ends of the first connector (31) being sealed and connected to one end of the elastic support (2) and the pipe (3), respectively, and the two ends of the second connector (32) being sealed and connected to the other end of the pipe (3) and the pressure generator (4), respectively.

5. The auxiliary device according to claim 3, characterized in that, It also includes a one-way valve (33) disposed on the pipe (3).

6. The auxiliary device according to claim 3, characterized in that, It also includes a pressure monitor (5) disposed on the pipe (3) or the elastic support (2).

7. The auxiliary device according to claim 3, characterized in that, The pipe (3) is a flexible hose and is located away from the cutting tool.

8. An auxiliary device for processing an array of holes in a thin-walled part as described in claim 1 or 2, characterized in that, It includes an elastic support member (2), which is a sealed elastic bladder structure.

9. An auxiliary device for processing an array of holes in a thin-walled part as described in claim 1 or 2, characterized in that, Includes an elastic support member (2), which is a peelable PU foam material, a soluble foam material, a thermoplastic foam material, a hot melt adhesive granule material, or a wax-based material.

10. An auxiliary device for a method of machining array holes in a thin-walled part as described in claim 1 or 2, characterized in that, It includes an elastic support (2), which is a curable gel material.

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