High-precision parallel laminating mechanism

Abstract

The invention discloses a high-precision parallel laminating mechanism, which comprises a second bearing platform, a bearing position arranged on the second bearing platform and used for bearing a second laminating object, and a first loading platform capable of sliding towards the second bearing platform in a reciprocating manner, and a first loading block is arranged on one side, facing the second bearing platform, of the first loading platform; the second attaching part further comprises a plurality of horizontal sensors, the detection ends of the horizontal sensors correspond to the first loading table, and the horizontal sensors are connected with the controller. The device further comprises a plurality of first leveling devices, the output ends of the first leveling devices are connected with the first loading table, and the first leveling devices are connected with the controller in a wired or wireless mode. The invention aims to provide the high-precision parallel laminating mechanism, and aims to realize high-precision parallel laminating of a plurality of glass products into a whole.

Description

Technical Field

[0001] This invention relates to the field of bonding equipment, and more particularly to a high-precision parallel bonding mechanism. Background Technology

[0002] With the rapid development of technology, multi-layered glass products are used in products such as foldable screen phone screen modules, optical sensor packaging, and precision instrument windows. Multi-layered glass products typically require the precise bonding of two, four, or even more glass substrates using an adhesive to form a stacked structure with specific functions.

[0003] Chinese invention patent CN104589771B discloses a glass lamination device capable of laminating two layers of glass. However, the existing technology has the following shortcomings: In the existing lamination process, a clamp is typically used to grip the first glass substrate and then move it towards the second glass substrate for alignment and pressing. However, during this process, due to the flatness error of the adsorption platform and the displacement error of the clamp, the accumulated errors at the moment of contact can easily cause the two glass products to be non-parallel. This non-parallelism may lead to quality problems in the laminated product, such as: 1. The formation of local bubbles that are difficult to eliminate, affecting optical performance and product yield; 2. Uneven adhesive layer thickness, which leads to inconsistent bonding strength and potential stress concentration in some areas, resulting in insufficient product reliability and durability; 3. Non-parallel contact may cause excessive local stress, leading to micro-cracks or direct breakage of a glass substrate, reducing yield and lowering the company's market competitiveness. Summary of the Invention

[0004] Purpose of the invention: The purpose of this invention is to provide a high-precision parallel bonding mechanism, which aims to achieve the high-precision parallel bonding of several glass products into one piece.

[0005] Technical Solution: The high-precision parallel bonding mechanism of the present invention includes a first bonding part and a second bonding part. The second bonding part includes a second support platform, on which a support position for supporting a second bonding object is provided. The first bonding part includes a first loading table that can reciprocate toward the second support platform. A first loading block for loading the first bonding object is provided on the side of the first loading table facing the second support platform. The second bonding part also includes a plurality of horizontal sensors. The detection end of the horizontal sensor corresponds to the first loading table. The horizontal sensor is connected to the controller via wired or wireless means. The first bonding part also includes a plurality of first leveling devices for adjusting the posture of the first loading table to ensure that the first bonding object and the second bonding object are parallel. The output end of the first leveling device is connected to the first loading table. The plurality of first leveling devices are respectively connected to the controller via wired or wireless means. Since the area of ​​the first loading block is relatively small and inconvenient to detect, the end face of the first loading platform facing the second bearing platform is set to be parallel to the end face of the first loading block facing the second bearing platform. The horizontal sensor detects the parallelism between the first loading platform and the second bearing platform, which is to indirectly detect the parallelism between the first loading platform and the second bearing platform, and thus indirectly detect the parallelism between the first bonding object and the second bonding object.

[0006] Furthermore, the plurality of horizontal sensors are arranged around the second support platform, or the plurality of horizontal sensors are arranged on the second support platform.

[0007] Furthermore, the number of the first leveling devices corresponds to the number of level sensors.

[0008] Furthermore, the output end of each of the first leveling devices is connected to the first loading platform via a first floating joint. The first floating joint is used to prevent the output end of the first leveling device from bending during installation, which would cause a decrease in parallelism accuracy during fitting.

[0009] Furthermore, it also includes a first support frame, a first slide rail is provided on one side of the first support frame, a second bracket is slidably arranged on the first slide rail, and the plurality of first leveling devices are fixedly connected to the second bracket.

[0010] Furthermore, the first support frame is fixedly equipped with a first feeding device, and the output end of the first feeding device is fixedly connected to the second support.

[0011] Furthermore, a first clamping device is provided on the second bracket, and the position of the clamping end of the first clamping device corresponds to the position of the first object to be bonded. The two clamping ends of the first clamping device are located at both ends of the first object to be bonded along its length.

[0012] Furthermore, the first clamping device includes a first clamping cylinder. Two first clamping output ends are provided on the side of the first clamping cylinder facing the second bearing platform. Each first clamping output end includes a first jaw adapter plate connected to the first clamping cylinder. The end of the first jaw adapter plate is provided with a first clamping block for clamping the first mating object. The first clamping cylinder is used to assist in clamping the mated product, facilitating product removal.

[0013] Furthermore, the first loading block has several suction ports on one side for loading the first object to be bonded.

[0014] Furthermore, it also includes a second clamping device for clamping the second mating object, the clamping end of the second clamping device being positioned corresponding to the position of the second mating object. The two clamping ends of the second clamping device are located at opposite ends of the second mating object along its length.

[0015] Furthermore, the second clamping device includes a second clamping cylinder, and the second clamping cylinder is provided with two second clamping output ends on one side facing the second bearing platform. Each second clamping output end includes a second jaw adapter plate connected to the second clamping cylinder, and the end of the second jaw adapter plate is provided with a second clamping block for clamping the second object to be attached.

[0016] Furthermore, it also includes a photocuring device, the irradiation end of which corresponds to the second support platform, and the photocuring device is connected to the controller via wired or wireless means.

[0017] Furthermore, it also includes several third leveling devices to ensure that the sides of the objects being bonded are parallel. The output ends of the third leveling devices are positioned corresponding to the bearing positions of the second bearing platform. When more than two objects need to be bonded, and at least one object needs to be bonded to the side, the output ends of the several third leveling devices abut against the objects being bonded and apply the same pressure, thereby ensuring that the objects on the side are bonded in parallel.

[0018] Furthermore, it also includes a hollow first housing portion and a hollow second housing portion, which are closable and can be switched between a closed state and an open state. In the closed state, the first housing portion and the second housing portion together form a receiving cavity for accommodating the first fitting portion and the second fitting portion. The first fitting portion and the second fitting portion are respectively located in the cavity of the second housing portion and fixedly connected to the second housing portion. The output end of the vacuum pump communicates with the receiving cavity.

[0019] Furthermore, it also includes several sliding switching sliders, which are connected to the first housing portion. The switching sliders are used to open or close the first housing portion.

[0020] Furthermore, the switching slider is connected to the first housing part via a second floating joint.

[0021] Furthermore, a plurality of switching guide rails are provided on the side of the first housing portion, and a switching slider is slidably disposed on each of the switching guide rails, the switching slider being connected to the output end of the switching power source.

[0022] Furthermore, the third leveling device is fixedly connected to the second housing portion.

[0023] Furthermore, the first housing section has a transparent observation window for easy observation by staff.

[0024] Beneficial effects: Compared with the prior art, the present invention has the following significant advantages: The present invention sets a plurality of horizontal sensors in the second bonding part to detect the parallelism between the first bonding object and the second bonding object directly or indirectly, so as to ensure that the flatness error between the first bonding object and the second bonding object is small during the bonding process and improve product quality. Attached Figure Description

[0025] Figure 1 This is a perspective view of the present invention.

[0026] Figure 2 This is a perspective view of the first fitting portion at one angle in the first embodiment of the present invention.

[0027] Figure 3 This is a perspective view of the first fitting portion from another angle in the first embodiment of the present invention.

[0028] Figure 4 This is a schematic diagram of the first loading block in the first embodiment of the present invention.

[0029] Figure 5 This is a perspective view of the second bonding portion in the first embodiment of the present invention.

[0030] Figure 6 This is a perspective view of the second support platform in the first embodiment of the present invention.

[0031] Figure 7 This is a schematic diagram of the combination of the first bonding portion and the second bonding portion in the first embodiment of the present invention.

[0032] Figure 8 This is a schematic diagram of the opening and closing device in the first embodiment of the present invention.

[0033] Figure 9 This is a schematic diagram of the first housing portion in the first embodiment of the present invention.

[0034] Figure 10 This is a schematic diagram of the second housing portion in the first embodiment of the present invention.

[0035] Figure 11 This is a schematic diagram of the second bonding portion in the second embodiment of the present invention.

[0036] Figure 12 This is a schematic diagram of the combination of the first bonding portion and the second bonding portion in the second embodiment of the present invention.

[0037] Figure 13 This is a schematic diagram of the second carrier platform in the second embodiment of the present invention.

[0038] Figure 14 for Figure 13 Enlarged view at point A.

[0039] The components are as follows: 101, First vacuum pump; 102, Second vacuum pump; 2, Bonding mechanism; 201, Controller; 3, First bonding part; 301, First support frame; 302, First leveling cylinder; 303, First feed motor; 304, Second bracket; 305, First clamping cylinder; 306, First gripper adapter plate; 307, First clamping block; 308, First loading block; 3081, Adsorption port; 309, First loading platform; 310, First floating joint; 311, First slide rail; 4, Second bonding part; 401, Horizontal sensor; 402, Second bearing platform; 4021, Glue overflow tank; 403, Light curing... 404. Second support plate; 405. Second clamping cylinder; 406. Second gripper adapter plate; 407. Second clamping block; 408. Third leveling cylinder; 5. Opening and closing device; 501. Switching motor; 502. Switching guide rail; 503. Switching slider; 504. Second floating joint; 6. First housing part; 601. First housing side wall; 602. Housing top cover; 603. First observation window; 604. Second observation window; 7. Second housing part; 701. Second housing side wall; 702. Second housing bottom plate; 703. Vacuum tube; 8. First bonding object; 9. Second bonding object; 10. Third bonding object. Detailed Implementation

[0040] The technical solution of the present invention will be further described below with reference to the accompanying drawings.

[0041] Example 1

[0042] See appendix Figures 1-10The present invention discloses a high-precision parallel bonding mechanism, comprising a bonding mechanism 2, which includes a first bonding part 3 and a second bonding part 4. The second bonding part 4 includes a second support platform 402, on which a support position for supporting a second bonding object 9 is provided. The first bonding part 3 includes a first loading table 309 that can reciprocate toward the second support platform 402. A first loading block 308 for loading the first bonding object 8 is provided on the side of the first loading table 309 facing the second support platform 402. The second bonding part 4 also includes a plurality of A horizontal sensor 401 is included, with its detection end corresponding to the first loading platform 309. The horizontal sensor 401 is connected to the controller 201 via wired or wireless means. The first bonding part 3 also includes several first leveling cylinders 302 for adjusting the posture of the first loading platform 309 to ensure that the first bonding object 8 and the second bonding object 9 are parallel. The output ends of the first leveling cylinders 302 are connected to the first loading platform 309, and the several first leveling cylinders 302 are respectively connected to the controller 201 via wired or wireless means. Since the area of ​​the first loading block 308 is relatively small and inconvenient to detect, the end face of the first loading platform 309 facing the second bearing platform 402 is set to be parallel to the end face of the first loading block 308 facing the second bearing platform 402. The horizontal sensor 401 detects the parallelism between the first loading platform 309 and the second bearing platform 402, which is to indirectly detect the parallelism between the first loading platform 309 and the second bearing platform 402, and thus indirectly detect the parallelism between the first bonding object 8 and the second bonding object 9.

[0043] Optionally, an auxiliary spring is also provided between each first leveling cylinder 302 and the first loading platform 309. One end of the auxiliary spring is detachably connected to the first leveling cylinder 302, and the other end of the auxiliary spring is detachably connected to the first loading platform 309.

[0044] Optionally, a plurality of horizontal sensors 401 may be arranged around the second support platform 402, or a plurality of horizontal sensors 401 may be arranged on the second support platform 402.

[0045] Optionally, the number of first leveling cylinders 302 corresponds to the number of level sensors 401.

[0046] Optionally, the output end of each first leveling cylinder 302 is connected to the first loading platform 309 via a first floating joint 310. The first floating joint 310 is used to prevent the output end of the first leveling cylinder 302 from bending during installation, which would cause a decrease in parallelism accuracy during fitting.

[0047] Optionally, it also includes a first support frame 301, a first slide rail 311 is provided on one side of the first support frame 301, a second bracket 304 is slidably provided on the first slide rail 311, and a plurality of first leveling cylinders 302 are fixedly connected to the second bracket 304.

[0048] Optionally, the first support frame 301 is fixedly equipped with the first feed motor 303, and the output end of the first feed motor 303 is fixedly connected to the second bracket 304.

[0049] Optionally, a first clamping device is provided on the second bracket 304, and the position of the clamping end of the first clamping device corresponds to the position of the first mating object 8. The two clamping ends of the first clamping device are located at both ends of the first mating object 8 along its length.

[0050] Optionally, the first clamping device includes a first clamping cylinder 305. Two first clamping output ends are provided on the side of the first clamping cylinder 305 facing the second support platform 402. Each first clamping output end includes a first jaw adapter plate 306 connected to the first clamping cylinder 305. The end of the first jaw adapter plate 306 is provided with a first clamping block 307 for clamping the first bonding object 8. The first clamping cylinder 305 is used to assist in clamping the bonded product, facilitating product removal.

[0051] Optionally, the first loading block 308 has several adsorption ports 3081 on one side for loading the first bonding object 8. In this embodiment, the first loading block 308 has a vacuum channel inside, which communicates with the adsorption ports 3081. The other end of the vacuum channel is connected to the second vacuum pump 102 through a vacuum connecting pipe (not shown for simplicity). In other embodiments, the adsorption ports 3081 can also be other adsorption methods, such as electrostatic adsorption.

[0052] Optionally, the second mating part 4 further includes a second clamping device for clamping the second mating object 9, the position of the clamping end of the second clamping device corresponding to the position of the second mating object 9. The two clamping ends of the second clamping device are located at both ends of the second mating object 9 along its length.

[0053] Optionally, the second clamping device includes a second clamping cylinder 405. The second clamping cylinder 405 has two second clamping output ends on one side facing the second bearing platform 402. Each second clamping output end includes a second jaw adapter plate 406 connected to the second clamping cylinder 405. The end of the second jaw adapter plate 406 is provided with a second clamping block 407 for clamping the second contact object 9.

[0054] Optionally, a light curing device 403 is also included. The irradiation end of the light curing device 403 corresponds to the second support platform 402, and the light curing device 403 is connected to the controller 201 via wired or wireless means. In this embodiment, the light curing device 403 is an irradiation lamp.

[0055] Optionally, the second fitting part 4 may also include a second support plate 404 for adjusting the height of the second bearing platform 402.

[0056] Optionally, the system also includes a hollow first housing portion 6 and a hollow second housing portion 7. The first housing portion 6 and the second housing portion 7 are closable, allowing them to switch between a closed state and an open state. In the closed state, the first housing portion 6 and the second housing portion 7 together form a receiving cavity for accommodating the first bonding portion 3 and the second bonding portion 4. The first bonding portion 3 and the second bonding portion 4 are respectively located within the cavity of the second housing portion 7 and are fixedly connected to the second housing portion 7. The output end of the first vacuum pump 101 communicates with the receiving cavity. In this embodiment, maintaining a vacuum within the receiving cavity jointly formed by the first housing portion 6 and the second housing portion 7 is more conducive to the bonding of the first bonding object 8 and the second bonding object 9.

[0057] Optionally, the second housing part 7 is formed by four second housing sidewalls 701, the bottom plate 702 of the second housing closes the bottom of the second housing sidewalls 701, and the first vacuum pump 101 communicates with the inner cavity of the second housing part 7 through a vacuum tube 703.

[0058] Optionally, two opening and closing devices 5 are symmetrically arranged on both sides of the first housing part 6. Each opening and closing device 5 is used to open or close the first housing part 6. The opening and closing device 5 includes a switching slider 503 disposed on the side of the first housing part 6 for opening or closing the first housing part 6. The switching slider 503 is connected to the first housing part 6.

[0059] Optionally, the switching slider 503 is connected to the first housing part 6 via the second floating joint 504.

[0060] Optionally, a plurality of switching guide rails 502 are provided on the side of the first housing part 6, and a switching slider 503 is slidably disposed on each switching guide rail 502. The switching slider 503 is connected to the output end of the switching power source. In this embodiment, the switching power source is a switching motor 501.

[0061] Optionally, the first housing portion 6 is provided with a transparent first observation window 603 and a second observation window 604 for easy observation by staff. In this embodiment, the first housing portion 6 is formed by four first housing sidewalls 601, and a first housing top is provided at the top of the first housing sidewalls 601. A first housing top plate covers the top of the first housing portion 6. In order to reduce the power of the first vacuum pump 101 and increase economy, the height of the first housing sidewalls 601 is relatively short. In order to avoid the first feed motor 303, which is relatively tall, an opening is provided in the first housing top plate to allow the first housing top plate to protrude. A housing top cover 602 for sealing the first feed motor 303 is provided at the opening of the first housing top plate. In other embodiments, the height of the first housing sidewalls 601 can also be made relatively high, thereby making the internal volume of the first housing portion 6 larger, which requires the use of a more powerful first vacuum pump 101.

[0062] Example 2

[0063] See appendix Figures 11-14 and in conjunction with the appendix Figures 1-10 The difference between Embodiment 2 and Embodiment 1 is that, in order to fit the first fitting object 8, the second fitting object 9, and the third fitting object 10, this embodiment also includes several third leveling cylinders 408 to ensure the parallelism of the sides of the fitting objects. The positions of the output ends of the third leveling cylinders 408 correspond to the positions of the bearing positions of the second bearing platform 402. When more than two fitting objects need to be fitted, and at least one fitting object needs to be fitted to the side, the output ends of the several third leveling cylinders 408 abut against the fitting objects and apply the same pressure, thereby ensuring that the side fitting objects are parallel and fitted.

[0064] Optionally, the third leveling cylinder 408 is fixedly connected to the second housing part 7.

[0065] Optionally, an overflow groove 4021 is provided on the second bearing platform 402 to prevent excessive glue. The position of the overflow groove 4021 corresponds to the joint position of the first bonding object 8, the second bonding object 9, and the third bonding object 10.

Claims

1. A high-precision parallel bonding mechanism, characterized in that: The device includes a first bonding portion (3) and a second bonding portion (4). The second bonding portion (4) includes a second support platform (402). A support position for supporting a second bonding object (9) is provided on the second support platform (402). The first bonding portion (3) includes a first loading table (309) that can reciprocate toward the second support platform (402). A first loading block (308) for loading the first bonding object (8) is provided on the side of the first loading table (309) facing the second support platform (402). The second bonding portion (4) also includes several horizontal sensors. The device (401) has a detection end corresponding to the first loading platform (309), and the horizontal sensor (401) is connected to the controller (201) via wired or wireless means; the first fitting part (3) also includes several first leveling devices for adjusting the posture of the first loading platform (309) to ensure that the first fitting object (8) and the second fitting object (9) are parallel, the output end of the first leveling device is connected to the first loading platform (309), and the several first leveling devices are respectively connected to the controller (201) via wired or wireless means.

2. The high-precision parallel bonding mechanism according to claim 1, characterized in that: The output of each of the first leveling devices is connected to the first loading platform (309) via a first floating joint (310).

3. The high-precision parallel bonding mechanism according to claim 1, characterized in that: It also includes a first support frame (301), a first slide rail (311) is provided on one side of the first support frame (301), a second bracket (304) is slidably provided on the first slide rail (311), a first feeding device is fixedly provided on the first support frame (301), the output end of the first feeding device is fixedly connected to the second bracket (304), and the plurality of first leveling devices are fixedly connected to the second bracket (304).

4. The high-precision parallel bonding mechanism according to claim 3, characterized in that: The second bracket (304) is provided with a first clamping device, which includes a first clamping cylinder (305). The first clamping cylinder (305) is provided with two first clamping output ends on the side facing the second bearing platform (402). Each first clamping output end includes a first jaw adapter plate (306) connected to the first clamping cylinder (305). The end of the first jaw adapter plate (306) is provided with a first clamping block (307) for clamping the first contact object (8).

5. The high-precision parallel bonding mechanism according to claim 1, characterized in that: It also includes a second clamping device for clamping the second bonding object (9), the second clamping device includes a second clamping cylinder (405), the second clamping cylinder (405) is provided with two second clamping output ends on the side facing the second bearing platform (402), each of the second clamping output ends includes a second jaw adapter plate (406) connected to the second clamping cylinder (405), and the end of the second jaw adapter plate (406) is provided with a second clamping block (407) for clamping the second bonding object (9).

6. The high-precision parallel bonding mechanism according to claim 1, characterized in that: It also includes a photocuring device (403), the irradiation end of which corresponds to the second support platform (402), and the photocuring device (403) is connected to the controller (201) via wired or wireless means.

7. The high-precision parallel bonding mechanism according to claim 1, characterized in that: It also includes several third leveling devices, the position of the output end of the third leveling device corresponding to the position of the bearing position of the second bearing platform (402).

8. The high-precision parallel bonding mechanism according to claim 1, characterized in that: It also includes a hollow first housing part (6) and a second housing part (7), the first housing part (6) and the second housing part (7) are closable, so that the first housing part (6) and the second housing part (7) can switch between a closed state and an open state. In the closed state, the first housing part (6) and the second housing part (7) together form a receiving cavity for accommodating the first fitting part (3) and the second fitting part (4). The first fitting part (3) and the second fitting part (4) are respectively fixedly connected to the second housing part (7); the output end of the vacuum pump is connected to the receiving cavity.

9. The high-precision parallel bonding mechanism according to claim 8, characterized in that: It also includes several sliding switching sliders (503), which are connected to the first housing part (6).

10. The high-precision parallel bonding mechanism according to claim 9, characterized in that: The first housing part (6) is provided with a plurality of switching guide rails (502) on its side, and a switching slider (503) is slidably provided on each of the switching guide rails (502), and the switching slider (503) is connected to the output end of the switching power source.

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