Ultrasonic sensor jumper structure and ultrasonic sensor

Abstract

The invention relates to the technical field of ultrasonic sensors, in particular to an ultrasonic sensor jumper wire structure and an ultrasonic sensor, the jumper wire structure comprises a metal jumper wire with set rigidity, one end of the metal jumper wire is fixedly connected with an aluminum shell, and the other end of the metal jumper wire is fixedly connected with a PCB adapter plate; wherein the aluminum shell is electrically connected with the negative electrode of the PCB adapter plate through a metal jumper wire, and the metal jumper wire is used for rigidly supporting the PCB adapter plate. According to the invention, the electrical connection between the aluminum shell and the negative electrode of the PCB adapter plate is realized by arranging the metal jumper wire with set rigidity through the jumper wire structure of the ultrasonic sensor, and meanwhile, the metal jumper wire is utilized to rigidly support the PCB adapter plate, so that the steps of drilling holes in the aluminum shell, pressing rivets and welding a negative electrode adapter wire in the traditional scheme are cancelled; and the negative electrode is conducted only through the metal jumper wire, so that the processing procedures are obviously reduced, the production operation difficulty and the manual dependence are reduced, and the manufacturing efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of ultrasonic sensor technology, and in particular to an ultrasonic sensor jumper structure and an ultrasonic sensor. Background Technology

[0002] An ultrasonic sensor is a sensor developed using the properties of ultrasonic waves. It generally includes an ultrasonic probe, which consists of an aluminum housing and a piezoelectric ceramic plate inside the aluminum housing, used to transmit or receive ultrasonic signals.

[0003] In existing single-sided ceramic ultrasonic sensors, the negative electrode of the piezoelectric ceramic sheet requires connection via adhesive, aluminum shell, rivets, negative electrode adapter wire (silk-coated wire), PCB adapter board, and plug wire to achieve conductivity. This process has the following disadvantages: Complex manufacturing process: To achieve negative electrode conductivity, holes need to be drilled in the aluminum shell, rivets need to be inserted, and the negative electrode adapter wire needs to be welded; High production difficulty: Due to space constraints, the negative electrode adapter wire welding requires manual welding, which is difficult; Inability to position the PCB adapter board: The PCB adapter board may shift or deviate within the aluminum shell cavity, easily causing the negative electrode adapter wire or plug connection wire to loosen; High material cost: Rivets and drilling holes in the aluminum shell both incur costs.

[0004] Existing technologies include solutions where both the positive and negative electrodes of the piezoelectric ceramic sheet are located at one end of the piezoelectric ceramic sheet, such as “CN106441393A” and “CN203037850U”. This avoids drilling holes in the aluminum shell. However, this solution requires a plating layer on the piezoelectric ceramic sheet to lead the negative electrode from the other end of the piezoelectric ceramic sheet to the positive end. This increases costs, and the problem of the PCB adapter board not being able to be positioned still exists. Furthermore, the piezoelectric ceramic sheet has poor voltage resistance and is easily broken down at the flow edge (where the negative electrode is led to the positive end through the plating layer).

[0005] The information disclosed in this background section is intended only to enhance the understanding of the general background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0006] This invention provides an ultrasonic sensor jumper structure and an ultrasonic sensor, thereby effectively solving the problems in the background art.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is: an ultrasonic sensor jumper structure, comprising: A metal jumper with a set stiffness, wherein one end of the metal jumper is fixedly connected to an aluminum shell and the other end is fixedly connected to a PCB adapter board; The aluminum shell is electrically connected to the negative terminal of the PCB adapter board via the metal jumper, which provides rigid support for the PCB adapter board.

[0008] Furthermore, one end of the metal jumper is welded and fixed to the aluminum shell, and the other end is welded and fixed to the negative terminal of the PCB adapter board.

[0009] Furthermore, the metal jumper is welded to the aluminum shell by laser welding, and the metal jumper is welded to the negative terminal of the PCB adapter board by laser welding.

[0010] Furthermore, the metal jumper is made of the same material as the aluminum shell.

[0011] Furthermore, the metal jumper has an L-shaped structure and includes a horizontal end parallel to the piezoelectric ceramic sheet and a vertical end perpendicular to the piezoelectric ceramic sheet; The horizontal end is fixedly connected to the aluminum shell, and the vertical end is fixedly connected to the PCB adapter board.

[0012] Furthermore, the vertical end is inserted into the negative terminal of the PCB adapter board and soldered, and the horizontal end is attached to and soldered to the corresponding receiving slot on the aluminum shell.

[0013] Furthermore, when the vertical end is inserted into the negative terminal of the PCB adapter board, the PCB adapter board is at least partially located on the horizontal end.

[0014] The present invention also includes an ultrasonic sensor, comprising: Aluminum shell, PCB adapter board, piezoelectric ceramic sheet and jumper structure as described above; One end of the negative electrode of the piezoelectric ceramic sheet is bonded and fixed inside the aluminum shell. The positive electrode of the PCB adapter board is connected to the positive electrode of the piezoelectric ceramic sheet through a lead wire. The negative electrode of the PCB adapter board is connected to the aluminum shell through the jumper structure. The metal jumper provides rigid support for the PCB adapter board.

[0015] Furthermore, the aluminum shell is provided with a receiving groove, which accommodates the metal jumper wire, and the metal jumper wire is attached to and welded to the receiving groove.

[0016] Furthermore, the receiving groove gradually decreases in size from the end to the bottom.

[0017] The beneficial effects of this invention are as follows: By using an ultrasonic sensor jumper structure, a metal jumper with a set rigidity is used to achieve electrical connection between the aluminum shell and the negative terminal of the PCB adapter board. Simultaneously, the metal jumper provides rigid support to the PCB adapter board, eliminating the steps of drilling holes in the aluminum shell, pressing rivets, and welding the negative terminal adapter wire in traditional solutions. Negative terminal conduction is achieved solely through the metal jumper, significantly reducing processing steps, lowering production difficulty and reliance on manual labor, and improving manufacturing efficiency. Traditional negative terminal adapter wires require manual welding due to space constraints, leading to inconsistent operation. This embodiment uses a metal jumper for fixed connection, ensuring reliable and stable connection and avoiding inconsistent welding quality, thereby improving overall consistency and production yield. The metal jumper has a preset rigidity, not only achieving electrical connection but also providing rigid support to the PCB adapter board, limiting its displacement, movement, or tilting within the aluminum shell cavity, preventing failures caused by loose adapter board or connector wires, and improving the mechanical reliability of the sensor structure. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the jumper structure; Figure 2 This is a schematic diagram showing the connection between the PCB adapter board and the positive and negative electrodes of the piezoelectric ceramic sheet. Figure 3 This is a schematic diagram of the structure of a metal jumper; Figure 4 This is a schematic diagram of the structure of an ultrasonic sensor; Figure 5 for Figure 4 A magnified view of a portion of point A in the middle. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0021] like Figure 1 As shown: An ultrasonic sensor jumper structure, comprising: A metal jumper 1 with a set rigidity, one end of which is fixedly connected to an aluminum shell 2 and the other end is fixedly connected to a PCB adapter board 3. The aluminum shell 2 is electrically connected to the negative terminal of the PCB adapter board 3 via a metal jumper 1, which provides rigid support for the PCB adapter board 3.

[0022] By employing a jumper structure for the ultrasonic sensor, a metal jumper 1 with a predetermined rigidity is used to achieve electrical connection between the aluminum shell 2 and the negative terminal of the PCB adapter board 3. Simultaneously, the metal jumper 1 provides rigid support to the PCB adapter board 3, eliminating the steps of drilling holes in the aluminum shell 2, pressing rivets, and welding the negative terminal adapter wire in traditional solutions. Negative terminal conduction is achieved solely through the metal jumper 1, significantly reducing processing steps, lowering production difficulty and reliance on manual labor, and improving manufacturing efficiency. Traditional negative terminal adapter wires require manual welding due to space constraints, leading to inconsistent operation. This embodiment uses a fixed connection with the metal jumper 1, ensuring reliable and stable connection and avoiding inconsistent welding quality, thereby improving overall consistency and production yield. The metal jumper 1, with its predetermined rigidity, not only achieves electrical connection but also provides rigid support to the PCB adapter board, limiting its displacement, movement, or tilting within the aluminum shell 2 cavity. This prevents failures caused by loose adapter board or connector wires, improving the mechanical reliability of the sensor structure.

[0023] Unlike existing technologies that use plating to lead the back electrode of the ceramic sheet to the positive terminal, the negative electrode conduction path in this embodiment is entirely externally implemented. This eliminates the need for electrode extension across regions on the piezoelectric ceramic sheet 4, preventing localized electric field distortion and thus avoiding the risk of ceramic sheet breakdown. This improves withstand voltage performance and long-term reliability. The metal jumper 1 serves both conductive and support functions, reducing the space occupied by independent support structures and adapter cables. This simplifies and compacts the internal structure of the sensor, facilitating miniaturization and highly integrated design.

[0024] In this embodiment, one end of the metal jumper 1 is welded and fixed to the aluminum shell 2, and the other end is welded and fixed to the negative terminal of the PCB adapter board 3.

[0025] By welding metal jumpers 1 to the aluminum shell 2 and the negative terminal of the PCB adapter board, a stable and reliable electrical connection path is formed. This welding method creates a metallurgical bond with high connection strength, reducing the likelihood of loosening, detachment, or poor contact. This is significantly superior to mechanical snap-fit ​​or crimping methods. The low contact resistance of the welded connection ensures stable and reliable negative signal transmission, avoiding the impedance instability problems caused by multi-stage metal conduction paths in traditional structures. The high solder joint strength can withstand the vibration of the ultrasonic sensor during operation and the stress on the shell, making the overall structure more impact- and vibration-resistant, and extending its service life.

[0026] Among them, the metal jumper 1 and the aluminum shell 2 are welded and fixed by laser welding, and the metal jumper 1 and the negative terminal of the PCB adapter board 3 are welded and fixed by laser welding.

[0027] Laser welding offers high focus and concentrated energy, enabling metallurgical connections to be completed within extremely small welding areas without causing thermal damage to other parts of the aluminum shell 2 or the PCB adapter board. Ultrasonic sensors have limited internal space, but laser welding allows for precise welding of metal jumpers 1 within confined spaces, overcoming the bottleneck of traditional welding methods. Laser welding produces uniform and dense weld joints with highly stable connection strength and conductivity, making it suitable for long-life, high-reliability sensor products.

[0028] As a preferred embodiment of the above, the metal jumper 1 and the aluminum shell 2 are made of the same material.

[0029] When the metal jumper 1 and the aluminum shell 2 are made of the same material, their melting points, thermal conductivity, coefficients of thermal expansion, and other physical properties match, significantly improving the fusion quality during the welding process. This results in denser and stronger welds, reducing the risk of incomplete welds and cracks. The consistent expansion behavior of materials under temperature changes effectively avoids stress concentration caused by inconsistent thermal expansion, thus improving the reliability and lifespan of the sensor under temperature cycling and vibration conditions. The high connection stability between materials avoids contact potential differences or resistance changes caused by oxidation between dissimilar metals, making the negative electrode connection more stable and reliable. Using the same metal effectively avoids electrochemical corrosion caused by contact between dissimilar metals, preventing corrosion buildup or oxidation that could lead to poor conductivity and improving product durability.

[0030] In this embodiment, the metal jumper 1 has an L-shaped structure and includes a horizontal end 11 parallel to the piezoelectric ceramic sheet 4 and a vertical end 12 perpendicular to the piezoelectric ceramic sheet 4. The horizontal end 11 is fixedly connected to the aluminum shell 2, and the vertical end 12 is fixedly connected to the PCB adapter board 3.

[0031] The L-shaped structure makes full use of the limited space inside the ultrasonic sensor, allowing the jumper wires to be arranged along the shell contour, avoiding interference with the piezoelectric ceramic sheet 4, connectors, and other structures, thus improving the overall wiring rationality. Since the vertical end 12 is vertically connected to the PCB adapter board, it forms a rigid support structure similar to a "pillar," stabilizing the PCB's position and preventing its movement or tilting within the cavity, significantly improving mechanical stability. The horizontal end 11 is fixed to the aluminum shell 2, and the vertical end 12 is fixed to the PCB, creating a shorter and straighter conductive path, reducing the risk of mechanical failure due to wire bending or pulling, and improving reliability. The L-shaped structure can disperse stress under vibration, preventing fatigue fracture of the jumper wires due to unidirectional force, improving the overall vibration resistance of the structure, making it very suitable for applications with frequent vibrations, such as ultrasonic sensors.

[0032] The vertical end 12 is inserted into the negative terminal of the PCB adapter board 3 and soldered, while the horizontal end 11 is attached to and soldered to the corresponding receiving groove 21 on the aluminum shell 2.

[0033] A dedicated receiving groove 21 is provided on the aluminum shell 2 so that the horizontal end 11 of the jumper wire has a clear positioning surface, which can prevent the jumper wire from shifting and ensure the stability of the welding gap.

[0034] As a preferred embodiment of the above, when the vertical end 12 is inserted into the negative terminal of the PCB adapter board 3, the PCB adapter board 3 is at least partially located on the horizontal end 11.

[0035] This embodiment also includes an ultrasonic sensor, comprising: 2. Aluminum shell, 3. PCB adapter board, 4. Piezoelectric ceramic sheet and jumper structure as described above; One end of the negative electrode of the piezoelectric ceramic sheet 4 is bonded and fixed inside the aluminum shell 2. The positive electrode of the PCB adapter board 3 is connected to the positive electrode of the piezoelectric ceramic sheet 4 through a lead wire. The negative electrode of the PCB adapter board 3 is connected to the aluminum shell 2 through a jumper structure. The metal jumper 1 provides rigid support for the PCB adapter board 3.

[0036] The aluminum shell 2 is provided with a receiving groove 21, which holds the metal jumper 1, and the metal jumper 1 is attached to and welded to the receiving groove 21.

[0037] As a preferred embodiment of the above, the receiving groove 21 gradually decreases in size from the end to the bottom.

[0038] Because the inlet of the receiving slot 21 is wide and gradually narrows inside, the horizontal end 11 of the metal jumper 1 will be naturally guided and automatically slide into the correct position when it is placed in the slot, forming a similar "guided positioning" effect, which makes assembly more convenient and faster, and significantly improves assembly efficiency and consistency.

[0039] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0040] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0041] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0042] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An ultrasonic sensor jumper structure, characterized in that, include: A metal jumper with a set stiffness, wherein one end of the metal jumper is fixedly connected to an aluminum shell and the other end is fixedly connected to a PCB adapter board; The aluminum shell is electrically connected to the negative terminal of the PCB adapter board via the metal jumper, which provides rigid support for the PCB adapter board.

2. The ultrasonic sensor jumper structure according to claim 1, characterized in that, One end of the metal jumper is welded and fixed to the aluminum shell, and the other end is welded and fixed to the negative terminal of the PCB adapter board.

3. The ultrasonic sensor jumper structure according to claim 2, characterized in that, The metal jumper is welded to the aluminum shell by laser welding, and the metal jumper is welded to the negative terminal of the PCB adapter board by laser welding.

4. The ultrasonic sensor jumper structure according to claim 2, characterized in that, The metal jumper is made of the same material as the aluminum shell.

5. The ultrasonic sensor jumper structure according to claim 2, characterized in that, The metal jumper has an L-shaped structure and includes a horizontal end parallel to the piezoelectric ceramic sheet and a vertical end perpendicular to the piezoelectric ceramic sheet. The horizontal end is fixedly connected to the aluminum shell, and the vertical end is fixedly connected to the PCB adapter board.

6. The ultrasonic sensor jumper structure according to claim 5, characterized in that, The vertical end is inserted into the negative terminal of the PCB adapter board and soldered, and the horizontal end is attached to and soldered to the corresponding receiving slot on the aluminum shell.

7. The ultrasonic sensor jumper structure according to claim 6, characterized in that, When the vertical end is inserted into the negative terminal of the PCB adapter board, the PCB adapter board is at least partially located on the horizontal end.

8. An ultrasonic sensor, characterized in that, include: Aluminum shell, PCB adapter board, piezoelectric ceramic sheet and jumper structure as described in any one of claims 1 to 7; One end of the negative electrode of the piezoelectric ceramic sheet is bonded and fixed inside the aluminum shell. The positive electrode of the PCB adapter board is connected to the positive electrode of the piezoelectric ceramic sheet through a lead wire. The negative electrode of the PCB adapter board is connected to the aluminum shell through the jumper structure. The metal jumper provides rigid support for the PCB adapter board.

9. The ultrasonic sensor according to claim 8, characterized in that, The aluminum shell is provided with a receiving groove, which accommodates the metal jumper wire, and the metal jumper wire is attached to and welded to the receiving groove.

10. The ultrasonic sensor according to claim 9, characterized in that, The receiving groove gradually decreases in size from the end to the bottom.

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