Stretchable substrate, stretchable device, and method for manufacturing stretchable substrate and stretchable device

Abstract

A stretchable substrate having a first main surface and a second main surface facing each other, the stretchable substrate having one of the following characteristics: (1) the ratio of oxygen atoms in at least one of the first main surface and the second main surface with respect to the total atoms as measured by X-ray photoelectron spectroscopy is 5 at% or more, and (2) the ratio of oxygen atoms in at least one of the first main surface and the second main surface with respect to the total atoms as measured by X-ray photoelectron spectroscopy is 5 at% or more; (2) the arithmetic average surface roughness of the surface measured by a laser microscope on the first main surface or the second main surface is 6 [mu] m or more; (3) at least one of the first main surface and the second main surface has a metal-containing portion; and (4) a metal-containing region is provided along at least one of the first main surface and the second main surface.

Description

Technical Field

[0001] This invention relates to stretchable substrates, stretchable devices, and methods for manufacturing the same. Background Technology

[0002] Conventionally, fluororubber molded articles and elastomers described in Japanese Patent Application Publication No. 2002-293950 (Patent Document 1) have been used as stretchable substrates. In the aforementioned document, the fluororubber molded article contains 0.01 to 10 parts by weight of silica powder relative to 100 parts by weight of fluororubber, has a cross-linking structure based on a polyamine-based cross-linking agent, and has a wrinkled, finely textured surface. Such a stretchable substrate has moderate stretchability. Moreover, the wrinkled, finely textured surface of the stretchable substrate results in lower surface frictional resistance.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2002-293950 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] To manufacture a stretchable substrate with reduced adhesion as in the past, it is necessary to add a composition containing inorganic fillers such as silica. In such a stretchable substrate, for example, the properties of the stretchable substrate may change due to the presence of silica. For example, there is a concern that the stretchable properties may change, leading to plastic deformation of the stretchable substrate, specifically, an increase in permanent deformation.

[0008] The problem to be solved by the present invention is to provide a stretchable substrate, a stretchable device, and a method thereof that can suppress self-adhesion at the surface while suppressing permanent deformation.

[0009] Solution for solving the problem

[0010] To address the aforementioned problem, one embodiment of the present disclosure provides a stretchable substrate having a first main surface and a second main surface opposite to each other, wherein the stretchable substrate has any of the following characteristics: (1) the ratio of oxygen atoms to all atoms in at least one of the first main surface and the second main surface, as determined by X-ray photoelectron spectroscopy, is 5 atomic% or more; (2) the arithmetic mean surface roughness of the surface at the first main surface or the second main surface, as determined by laser microscopy, is 6 μm or more; (3) at least one of the first main surface and the second main surface has a metal-containing portion containing metal atoms; and (4) a metal-containing region containing metal atoms is provided along at least one of the first main surface and the second main surface.

[0011] By having the above structure, a surface-modified stretchable substrate is obtained. As a result, the stickiness and self-adhesion of the stretchable substrate can be suppressed.

[0012] One aspect of this disclosure is a stretchable substrate having a first main surface and a second main surface opposite to each other, wherein the ratio of oxygen atoms to all atoms in at least one of the first main surface and the second main surface, as determined by X-ray photoelectron spectroscopy, is 5 atomic% or more.

[0013] By having the above structure, a surface-modified stretchable substrate is obtained. As a result, the stickiness and self-adhesion of the stretchable substrate can be suppressed.

[0014] One embodiment of the present disclosure has a stretchable substrate having a first main surface and a second main surface opposite to each other, wherein the arithmetic mean surface roughness of the surface at the first main surface or the second main surface, as measured by a laser microscope, is 6 μm or more.

[0015] By having the above structure, a surface-modified stretchable substrate is created. As a result, self-adhesion of the stretchable substrate can be suppressed.

[0016] One aspect of this disclosure is a stretchable substrate having a first main surface and a second main surface opposite to each other, at least one of the first main surface and the second main surface having a metal-containing portion containing metal atoms.

[0017] By having a metal-containing portion on at least one of the first and second main surfaces of the stretchable substrate, the diffusion of molecules that cause self-adhesion can be suppressed, thereby suppressing the self-adhesion of the stretchable substrate. Here, the metal-containing portion refers to a portion containing a metal-containing compound.

[0018] A stretchable substrate having a first main surface and a second main surface opposite to each other, wherein a metal-containing portion comprising metal atoms is provided along at least one of the first main surface and the second main surface.

[0019] By having the above structure, the diffusion of molecules that cause self-adhesion can be suppressed, thereby suppressing the self-adhesion of the stretchable substrate. Furthermore, the metal portion adheres to substrates other than the stretchable substrate, improving the adhesion between the stretchable substrate and other substrates.

[0020] One embodiment of the present disclosure provides a scalable device having a scalable substrate of the present disclosure and wiring disposed on the first main surface of the scalable substrate.

[0021] With the above structure, it is possible to provide a stretchable device that suppresses stickiness and self-adhesion.

[0022] One embodiment of the extensible device disclosed herein also has a protective layer.

[0023] With the above structure, the wiring can be protected.

[0024] A method for manufacturing a stretchable substrate according to one aspect of this disclosure includes: a preparation step in which a substrate is prepared; and an ozone treatment step in which at least one of a first main surface of the substrate and a second main surface located on the opposite side of the first main surface is subjected to ozone treatment.

[0025] By performing the above processes, a stretchable substrate containing oxygen atoms can be formed. As a result, the surface of the substrate is modified, which can suppress the stickiness and self-adhesion of the stretchable substrate.

[0026] A method for manufacturing a scalable device according to one aspect of this disclosure includes: a preparation step in which a substrate having a first main surface and a second main surface opposite to each other is prepared; an arrangement step in which wiring is arranged on the first main surface of the substrate; and an ozone treatment step in which, after the arrangement step, at least one of the first main surface and the second main surface is subjected to ozone treatment.

[0027] By performing the above processes, it is possible to form a stretchable device that suppresses self-adhesion. Furthermore, ozone treatment can be performed while the wiring is in place, simplifying the manufacturing process.

[0028] A method for manufacturing a stretchable device according to one aspect of this disclosure includes: a preparation step in which a substrate having a first main surface and a second main surface opposite to each other is prepared; an arrangement step in which wiring is arranged on the first main surface of the substrate; and an embossing step in which, after the arrangement step, at least one of the first main surface and the second main surface is embossed.

[0029] By performing the above-mentioned processes, self-adhesion on the surface of stretchable devices can be suppressed. Furthermore, embossing can be performed while the wiring is in place, simplifying the manufacturing process.

[0030] A method for manufacturing a stretchable device according to one aspect of this disclosure includes: a preparation step in which a first substrate having a first main surface and a second main surface opposite to each other is prepared; and a forming step in which a metal-containing portion is formed at least on the second main surface of the first substrate.

[0031] A method for manufacturing a stretchable device according to one aspect of this disclosure includes: a preparation step in which a substrate is prepared; and a forming step in which a metal-containing portion is formed on at least one of a first main surface of the substrate and a second main surface located on the opposite side of the first main surface.

[0032] By having at least one of the first and second main surfaces of the stretchable substrate containing a metal portion, it is possible to suppress the diffusion of molecules that cause self-adhesion and to suppress the self-adhesion of the stretchable device.

[0033] A method for manufacturing a scalable device according to one aspect of this disclosure includes: a preparation step in which a first substrate having a first main surface and a second main surface opposite to each other is prepared; a configuration step in which wiring is configured on the first main surface of the first substrate; and a forming step in which, after the configuration step, a metal-containing portion is formed on at least the second main surface of the first substrate.

[0034] By performing the above processes, it is possible to form a stretchable device that suppresses self-adhesion.

[0035] The effects of the invention

[0036] According to this disclosure, it is possible to provide a stretchable substrate, a stretchable device, and a method for manufacturing the same, which can suppress self-adhesion at the surface while suppressing permanent deformation. Attached Figure Description

[0037] Figure 1 This is a partial top view of the stretchable device according to the first embodiment.

[0038] Figure 2 It is along Figure 1 Sectional view II-II.

[0039] Figure 3A This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the first embodiment.

[0040] Figure 3B This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the first embodiment.

[0041] Figure 3C This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the first embodiment.

[0042] Figure 4 This is a cross-sectional view of the stretchable device according to the second embodiment.

[0043] Figure 5A This is a schematic diagram showing the first main surface of the stretchable substrate of the second embodiment.

[0044] Figure 5B This is a schematic diagram showing the embossing sheet used to form the first main surface of the stretchable substrate of the second embodiment.

[0045] Figure 6A This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the second embodiment.

[0046] Figure 6B This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the second embodiment.

[0047] Figure 6C This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the second embodiment.

[0048] Figure 7A This is a schematic diagram showing a modified example 1 of the first main surface of the stretchable substrate of the second embodiment.

[0049] Figure 7B This is a schematic diagram showing the embossing sheet used in a modified example 1 for forming the first main surface of the stretchable substrate of the second embodiment.

[0050] Figure 8A This is a schematic diagram showing a variation of the sheet material used for embossing.

[0051] Figure 8B This is a schematic diagram showing a variation of the sheet material used for embossing.

[0052] Figure 8C This is a schematic diagram showing a variation of the sheet material used for embossing.

[0053] Figure 8D This is a schematic diagram showing a variation of the sheet material used for embossing.

[0054] Figure 9 This is a cross-sectional view of the stretchable device according to the third embodiment.

[0055] Figure 10A This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the third embodiment.

[0056] Figure 10B This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the third embodiment.

[0057] Figure 10C This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the third embodiment.

[0058] Figure 11 This is a cross-sectional view of a variation of the third embodiment, Example 1.

[0059] Figure 12 This is a cross-sectional view of a variation of the third embodiment, Example 2.

[0060] Figure 13 This is a cross-sectional view of the stretchable device according to the fourth embodiment.

[0061] Figure 14A This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the fourth embodiment.

[0062] Figure 14B This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the fourth embodiment.

[0063] Figure 14C This is an explanatory diagram illustrating the manufacturing method of the stretchable device according to the fourth embodiment.

[0064] Figure 15 This is an explanatory diagram showing the surface roughness of the stretchable substrate of Example 15.

[0065] Figure 16 This is an explanatory diagram illustrating the phase-hardened portion of the stretchable substrate in Example 19.

[0066] Figure 17 This is an explanatory diagram illustrating the determination method of the peel test.

[0067] Figure 18 This is a graph showing the relationship between the moving distance and the peeling force in the peel test of Example 40 and Comparative Example 5.

[0068] Figure 19 This is a graph showing the relationship between pressing temperature and peel strength in a peel test. Detailed Implementation

[0069] The following describes in detail a scalable device as one embodiment of the present disclosure through illustrated embodiments. Furthermore, the drawings contain some schematic representations and may not always reflect actual dimensions or proportions.

[0070] The extensible device disclosed herein has an extensible substrate and wiring disposed on a first main surface of the extensible substrate.

[0071] The aforementioned stretchable substrate has a first main surface and a second main surface opposite to each other, wherein the stretchable substrate has any of the following characteristics: (1) the ratio of oxygen atoms to all atoms in at least one of the first main surface and the second main surface, as determined by X-ray photoelectron spectroscopy, is 5 atomic% or more; (2) the arithmetic mean surface roughness of the surface at the first main surface or the second main surface, as determined by laser microscopy, is 6 μm or more; (3) at least one of the first main surface and the second main surface has a metal-containing portion containing metal atoms; and (4) a metal-containing region containing metal atoms is provided along at least one of the first main surface and the second main surface. Hereinafter, each of the characteristics in (1) to (4) will be described as a specific embodiment.

[0072] <First Embodiment>

[0073] (structure)

[0074] Reference Figure 1 and Figure 2 The structure of the stretchable device 100 of the first embodiment will be described. Figure 1 This is a partial top view of the stretchable device 100. Figure 2 It is along the stretchable device 100 Figure 1 Sectional view II-II in the diagram.

[0075] like Figure 1 and Figure 2 As shown, the stretchable device 100 has a stretchable substrate 1 and wiring 2 disposed on a first main surface 1a of the stretchable substrate 1.

[0076] Furthermore, the shape of the stretchable device 100 is not particularly limited. This specification describes a configuration where one stretchable substrate is connected to the stretchable device 100 as an example, but configurations where two or more stretchable substrates are connected to the stretchable device 100 are also possible. Additionally, the wiring 2 is not limited to... Figure 1 With that configuration, the direction of extension is not limited. Specifically, the length direction of the flexible substrate 1 and the extension direction of the wiring 2 may not be the same, or they may not extend in the same direction. In addition, the number of wiring 2 is not particularly limited; it can be one or more.

[0077] Furthermore, the term "above" in this specification may not correspond to the actual vertical orientation of the telescopic device 100 during use. More specifically, "on the main surface of the telescopic substrate 1" does not refer to an absolute direction such as vertically upward as defined by the direction of gravity, but rather to the outermost direction of the outer and inner sides, defined by the main surface of the telescopic substrate 1. Additionally, for a given element, "above" includes not only the upper position separated from the element (i.e., the upper side of the element separated by other objects) and the upper position separated by a gap, but also the position directly above (on) that is in contact with the element.

[0078] The stretchable substrate 1 has a first main surface 1a and a second main surface 1b located on opposite sides of each other. The stretchable substrate 1 has a stretchable substrate end 11 connecting the first main surface 1a and the second main surface 1b. The stretchable substrate 1 is stretchable. Because the stretchable substrate 1 is stretchable, the risk of breakage during the stretching and contraction of the stretchable device 100 during use can be reduced without inhibiting the stretching and contraction of the wiring 2.

[0079] In the stretchable substrate 1, the oxygen atom ratio of the first main surface 1a, as measured by X-ray photoelectron spectroscopy (XPS), is 5 atomic% or more. Preferably, the oxygen atom ratio is 25 atomic% or less. By having the above structure, the surface of the stretchable substrate is modified. As a result, the stickiness and self-adhesion of the stretchable substrate 1 can be suppressed. It is generally believed that the stickiness and self-adhesion of the stretchable substrate 1 are improved by including oxygen atoms. However, in this embodiment, it is known that stickiness and self-adhesion can be suppressed by including oxygen atoms. For example, the stretchable substrate 1 can be used for biological applications. As a result, the stretchable substrate 1 is easier to process, and biological applications (e.g., users) can use the stretchable substrate 1 comfortably. Furthermore, in this embodiment, oxygen atoms are introduced into the first main surface 1a, but oxygen atoms can also be introduced into the second main surface 1b, or into both the first main surface 1a and the second main surface 1b. Additionally, the above-mentioned oxygen atom ratio is a ratio relative to all atoms.

[0080] For X-ray photoelectron spectroscopy, the detection sensitivity at the first main surface 1a is high, thus it can be used to determine the ratio of constituent elements at the first main surface 1a. The ratio of oxygen atoms can be determined by X-ray photoelectron spectroscopy at a location on the first main surface 1a where the wiring 2 is absent. This location can be situated at the end of the stretchable substrate 1 or between the stretchable substrate 1 and the wiring. From the perspective of suppressing self-adhesion, it is preferable to locate this location at the end of the stretchable substrate 1. Furthermore, the second main surface 1b can also have the same oxygen atom ratio as the first main surface 1a. The oxygen concentration ratio of the second main surface 1b can be measured in the same manner as the oxygen atom ratio of the first main surface 1a.

[0081] The oxygen atom ratio at the central portion of the first main surface 1a and the second main surface 1b in a direction orthogonal to the first main surface 1a and the second main surface 1b is preferably 5 atomic% or less, more preferably 1 atomic% or less. For example, by performing ozone treatment, the portion closer to the first main surface 1a or the second main surface 1b than the aforementioned central portion is oxidized, resulting in a higher concentration of oxygen atoms at the position closer to the first main surface 1a or the second main surface 1b than the aforementioned central portion. This structure helps suppress the stickiness and self-adhesion of the stretchable substrate 1. Furthermore, the central portion of the first main surface 1a and the second main surface 1b refers to the intersection of the central portion in the height direction of the first main surface 1a and the second main surface 1b and the central portion in the width direction of the stretchable substrate when viewed from a direction orthogonal to the first main surface 1a and the second main surface 1b. The aforementioned central portion need to be approximately the center; for example, a deviation of ±20% from the center of the first main surface 1a and the second main surface 1b can also be measured.

[0082] The ratio of oxygen atoms to all atoms in the first principal surface 1a is 5 atomic% or more, and may also be 4 atomic% or more higher than the ratio of oxygen atoms in the central portions of the first principal surface 1a and the second principal surface 1b in directions orthogonal to the first principal surface 1a and the second principal surface 1b. For example, the ratio of oxygen atoms to all atoms in the central portions of the first principal surface 1a and the second principal surface 1b in directions orthogonal to the first principal surface 1a and the second principal surface 1b is 1 atomic%, and the ratio of oxygen atoms in at least one of the first principal surface 1a and the second principal surface 1b is 5 atomic% or more.

[0083] Oxygen atoms can be introduced into the first main surface 1a of the stretchable substrate 1, for example, by ozone treatment. Ozone treatment can be performed, for example, using a low-pressure mercury lamp. Ozone treatment can be performed, for example, by setting the ozone concentration to approximately 10-120 ppm and exposing the substrate to ultraviolet (UV) radiation for approximately 1-3 minutes. The introduction of oxygen atoms can also be performed similarly when introducing them into the second main surface 1b.

[0084] For the stretchable substrate 1, it is preferable that no inorganic materials need to be added. This structure suppresses permanent deformation and surface self-adhesion. The aforementioned stretchable substrate 1 can be used as a sensor device.

[0085] Examples of the stretchable substrate 1 include sheet-like, film-like, or block-like substrates made of a stretchable resin material. The resin material is preferably rubber or an elastomer. By using the aforementioned substrate, the surface of the stretchable substrate 1 is modified, thereby suppressing the stickiness and self-adhesion of the stretchable substrate 1.

[0086] The resin material is not particularly limited as long as it is rubber or elastomer. Examples include acrylic resins, styrene resins, and urethane resins. Preferably, it includes at least one resin selected from the group consisting of acrylic resins, styrene resins, and urethane resins.

[0087] As an acrylic resin, examples include acrylic thermoplastic elastomers.

[0088] As a styrene-based resin, styrene-based elastomers can be cited as an example.

[0089] Examples of urethane-based resins include thermoplastic polyurethane.

[0090] The thickness of the stretchable substrate 1 is not particularly limited, but from the viewpoint that it does not hinder the stretching and contraction of the surface of the organism when pasted onto it, it is preferably 1 mm or less, more preferably 100 μm or less, and even more preferably 50 μm or less. In addition, the thickness of the stretchable substrate 1 is more preferably 1 μm or more.

[0091] Wiring 2 is disposed on the first main surface 1a of the stretchable substrate 1. Preferably, wiring 2 is stretchable. As a material for wiring 2, for example, a mixture composed of metal powders such as Ag, Cu, and Ni as conductive particles and an elastic system resin such as silicone resin can be used. The average particle size of the conductive particles is not particularly limited, but is preferably 0.01 μm or more and 10 μm or less. In addition, the shape of the conductive particles is preferably spherical, but not limited to spherical, and can also be flat or have a protruding structure to improve stretchability. In addition, the elastic system resin includes at least one resin (elastic system resin) selected from the group consisting of epoxy resin, urethane resin, acrylic resin and silicone resin, which is preferred for ensuring stretchability. Furthermore, wiring 2 can be provided on the first main surface 1a of the stretchable substrate 1, or there can be only one wiring 2 to 3 or more wiring 2.

[0092] The thickness of wiring 2 is preferably 100 μm or less, more preferably 50 μm or less. Furthermore, the thickness of the flexible wiring is more preferably 1 μm or more, and may also be 5 μm or more. Additionally, the thickness, width, and length of wiring 2 are not particularly limited. Furthermore, wiring 2 may not be flexible.

[0093] (Manufacturing method)

[0094] Reference Figure 3A , Figure 3B as well as Figure 3C This describes the manufacturing method of the elastic device 100.

[0095] First, such as Figure 3A As shown, a substrate 80 having a first surface 80a and a second surface 80b facing each other is prepared (preparation step). Figure 3B As shown, the material for the wiring 2 is coated onto the first surface 80a of the substrate 80. If the material for the wiring 2 is, for example, a conductive paste containing a mixture of Ag and resin, the conductive paste is coated onto the substrate. The coating method can also be screen printing, gravure printing, or inkjet printing. Then, the conductive paste is thermally cured to achieve a predetermined resistance value, thereby forming the wiring 2 on the substrate 80 (configuration process). Figure 3C As shown, sheet 3 is prepared. Sheet 3 covers the portion that is not intended for ozone treatment. Sheet 3 has a first main surface 3a and a second main surface 3b located on the side opposite to the first main surface 3a. Figure 3C As shown, a second main surface 3b of sheet 3 is provided on the upper surface of wiring 2 on the side opposite to substrate 80. Ozone L is irradiated onto the first main surface 3a of sheet 3 and the first surface 80a of substrate 80 (ozone treatment process). That is, ozone L is not irradiated onto wiring 2. Thus, a stretchable device 100 is formed. Furthermore, sheet 3... Figure 3CThe wiring 2 is separate from the substrate 80, but it can also be arranged in contact with the wiring 2. In the first embodiment, the wiring 2 is provided on the substrate 80, but the object of the first embodiment may also be a substrate 80 without the wiring 2. In the first embodiment, one substrate 80 is used as the substrate 80, but multiple substrates 80 may be stacked. By performing the above-described process, a self-adhesive stretchable device 100 can be formed. In addition, ozone treatment can be performed with the wiring 2 present, which simplifies the manufacturing method. Alternatively, after the ozone treatment process, an embossing process can be performed in which an embossing sheet is pressed onto the first surface 80a of the substrate 80.

[0096] (Example 1)

[0097] In the stretchable substrate 1, the oxygen atom ratio at the first main surface 1a is 5 atomic percent or more, and the arithmetic mean surface roughness Ra of the first main surface 1a, measured using an atomic force microscope (AFM), is 8 nm or more, for example, it can be 10 nm or more. By having the above structure, the surface roughness can be increased, and the stickiness and self-adhesion of the stretchable substrate 1 can be further suppressed. For example, not only at room temperature, but also under more severe conditions (e.g., 70°C), self-adhesion can be reduced. Specifically, in the evaluation of self-adhesion, according to JIS K 6404-3:1999, the stretchable substrate 1 is overlapped at 70°C, and a weight is placed on the overlapped stretchable substrates for measurement. In addition, similar to the measurement at 70°C, the stretchable substrate 1 is overlapped at room temperature, and a weight is placed on the overlapped stretchable substrates for measurement. Furthermore, in this embodiment, the arithmetic mean surface roughness Ra of the first main surface 1a is measured, but the same arithmetic mean surface roughness Ra can also be measured on the second main surface 1b. The arithmetic mean surface roughness Ra can, for example, be 100 nm or less. The measurement based on atomic force microscopy can be performed either at the end of the stretchable substrate 1 or at the portion of the stretchable substrate 1 located between the wirings 2. From the perspective of suppressing self-adhesion, it is preferable to perform the above measurement at the end of the stretchable substrate 1. The second main surface 1b of the stretchable substrate 1 can also have the same arithmetic mean surface roughness Ra as the first main surface 1a.

[0098] The first variation can be obtained, for example, by heat-treating the stretchable substrate 1 obtained in the first embodiment. The heat treatment is not particularly limited, but it can be performed at, for example, 150°C or higher, specifically 160°C or higher. The heat treatment can be performed, for example, at 180°C or lower. The heat treatment time is not particularly limited, but it can be performed for, for example, 10 minutes or more and 180 minutes or less, specifically 20 minutes or more, and more specifically 30 minutes or more.

[0099] (Second variation)

[0100] In the stretchable substrate 1, the oxygen atom ratio at the surface is 5 atomic percent or more. Furthermore, it may have a first portion and a second portion with different phases as measured by atomic force microscopy, where the phase of the first portion is advanced by 10° or more compared to the phase of the second portion, and the surface occupancy of the first portion is 80% or more. That is, the first portion of the stretchable substrate 1 may be harder than the second portion, and the surface occupancy of the harder first portion may be 80% or more of the stretchable substrate 1. The surface occupancy may, for example, be 100% or less of the stretchable substrate 1. By having the above structure, the surface of the stretchable substrate 1 is hardened, further suppressing the stickiness and self-adhesion of the stretchable substrate 1. For example, not only at room temperature, but also under more severe conditions (e.g., 70°C), the self-adhesion of the stretchable substrate 1 can be reduced. Furthermore, "surface occupancy" refers to the ratio of the area occupied by the first portion to the measured area. In this embodiment, the value obtained by measuring the surface occupancy of the first main surface 1a is used, but the above value may also be the surface occupancy of the second main surface 1b, or the surface occupancy of both the first main surface 1a and the second main surface 1b.

[0101] The surface occupancy was determined using an atomic force microscope. Specifically, in the region on the first principal surface 1a where the wiring 2 is absent, a phase image that allows for the determination of viscoelasticity using an atomic force microscope was obtained, and the surface occupancy of the harder portion with a phase advance of 10° or more was determined based on this phase image.

[0102] The aforementioned region can be located either at the end of the stretchable substrate 1 or in the portion of the stretchable substrate 1 located between the wiring 2. From the perspective of suppressing self-adhesion, it is preferable to locate the aforementioned region at the end of the stretchable substrate 1.

[0103] The stretchable substrate 1 of the second modification can be obtained by heat treatment of a substrate 80 with an oxygen atom ratio of 5 atoms or more. The heat treatment is not particularly limited, but can be performed at, for example, 70°C or higher, specifically 80°C or higher. The heat treatment can be performed at, for example, 110°C or lower, specifically 100°C or lower. The heat treatment time is not particularly limited, but can be performed for, for example, 20 minutes or more and 120 minutes or less, specifically 30 minutes or more and 90 minutes or less.

[0104] Furthermore, in the stretchable substrate 1, the ratio of oxygen atoms on the surface as measured by X-ray photoelectron spectroscopy is 5 atomic% or more, the arithmetic mean surface roughness Ra of the surface as measured by atomic force microscopy is 8 nm or more, and the surface occupancy of the harder portion with a phase advance of 10° or more as measured by atomic force microscopy is 80% or more.

[0105] <Second Implementation>

[0106] Reference Figure 4 The structure of the stretchable device 100A according to the second embodiment will be described. Unlike the first embodiment, the stretchable substrate 1A of this embodiment has a specific arithmetic mean surface roughness. That is, in the second embodiment, the oxygen atom ratio on the surface of the stretchable substrate 1A may not be 5 atomic% or more. Other structures are the same as those in the first embodiment, and their description is omitted. For the structure and material of the stretchable substrate 1A, the first main surface 1a, the second main surface 1b, and the substrate 80, unless otherwise described below, the same structure and material as those of the stretchable substrate 1A, the first main surface 1a, the second main surface 1b, and the substrate 80 of the first embodiment can be used respectively. Furthermore, the oxygen atom ratio on the surface of the stretchable substrate 1A may also be 5 atomic% or more.

[0107] like Figure 4 As shown, the arithmetic mean surface roughness Ra' of the first main surface 1a, measured using a laser microscope, at the stretchable substrate 1A is 6 μm or more. By having the above structure, the surface of the stretchable substrate 1A is modified. As a result, the stickiness and self-adhesion of the stretchable substrate 1A can be suppressed. The arithmetic mean surface roughness Ra' of the first main surface 1a of the stretchable substrate 1A can also be, for example, 10 μm or less. The arithmetic mean surface roughness Ra' can be measured in the region on the first main surface 1a where the wiring 2 is absent. This region can be provided at the end of the stretchable substrate 1A or in the portion of the stretchable substrate 1A located between the wiring 2. From the perspective of suppressing self-adhesion, it is preferable to provide this region at the end of the stretchable substrate 1A. The arithmetic mean surface roughness Ra' is measured, for example, using a non-contact membrane pressure measuring device. Alternatively, the arithmetic mean surface roughness Ra' can also be measured using a contact membrane pressure measuring device. In this embodiment, the arithmetic mean surface roughness Ra' at the first main surface 1a of the stretchable substrate 1A is described as 6 μm or more, but it may also be 3 μm or more, for example. Furthermore, in this embodiment, the arithmetic mean surface roughness Ra' of the first main surface 1a is described, but not only the arithmetic mean surface roughness Ra' of the first main surface 1a may be within the above range, but the arithmetic mean surface roughness Ra' of the second main surface 1b may also be within the above range.

[0108] like Figure 5A As shown, preferably, the first main surface 1a of the stretchable substrate 1A has a grid shape. In the grid shape, a plurality of rectangular first shapes 4A and rectangular second shapes 4B are alternately provided in the longitudinal and transverse directions. The rectangles are, for example, 10 to 100 μm square.

[0109] The first shape 4A has a plurality of protrusions 4a1 and grooves 4a2. The grooves 4a2 extend laterally. The grooves 4a2 are arranged parallel to each other in the lateral direction. The protrusions 4a1 are located between adjacent grooves 4a2. By performing the above process, unevenness can be formed on the surface of the stretchable substrate 1A. That is, by performing the above process, the surface roughness can be increased. In addition, the surface of the stretchable substrate 1A can be hardened. As a result, the self-adhesion of the stretchable substrate 1A can be further suppressed.

[0110] The second shape 4B has multiple protrusions 4b1 and grooves 4b2. The grooves 4b2 extend laterally. The grooves 4b2 are arranged parallel to each other laterally. The protrusions 4b1 are located between adjacent grooves 4b2. By having the above structure, it is difficult for the component to contact the first main surface 1a, and the adhesiveness and self-adhesion of the stretchable substrate 1A can be suppressed. In addition, the above-mentioned grid shape may only be provided on a portion of the first main surface 1a. Furthermore, the above-mentioned grid shape may not only be provided on the first main surface 1a, but may also be provided on the second main surface 1b.

[0111] like Figure 5B As shown, the grid shape is formed on the first main surface 1a by embossing using embossing sheet 5. In embossing sheet 5, warp yarns 5a1 and weft yarns 5b1 are woven alternately. Embossing includes a heat-pressing process involving heat treatment and pressure treatment.

[0112] Reference Figure 6A , Figure 6B as well as Figure 6C This describes the manufacturing method of the stretchable device 100A.

[0113] First, such as Figure 6A As shown, prepare substrate 80 (preparation process). (As indicated) Figure 6B As shown, the material for the wiring 2 is coated on the first surface 80a of the substrate 80 (configuration process). For example... Figure 6C As shown, an embossing sheet 5 with a surface pattern is provided on the upper surface of the wiring 2 on the side opposite to the substrate 80. The embossing sheet 5 does not contact the wiring 2. The embossing sheet 5 is pressed onto the first surface 80a of the substrate 80. As a result, the shape of the embossing sheet 5 is transferred to the first surface 80a, forming the first main surface 1a (embossing process). In addition, the embossing sheet 5 may also partially cover areas other than the wiring 2 on the first surface 80a. By performing the above process, self-adhesion on the surface of the stretchable device 100A can be suppressed. Furthermore, the embossing process can be performed while the wiring 2 is present, which simplifies the manufacturing method.

[0114] Furthermore, in this embodiment, the embossing sheet 5 is arranged so as not to overlap with the wiring 2. However, in another embodiment, a protective layer protecting the wiring 2 may be provided, and the embossing sheet 5 may be pressed onto the substrate 80 and the protective layer. Alternatively, the embossing process may be performed on the surface of the substrate 80 opposite to the wiring 2.

[0115] (Example 1)

[0116] The first main surface 1a of the stretchable substrate 1A has Figure 7A The shape shown is used to replace Figure 5A The grid shape shown.

[0117] like Figure 7A As shown, the first main surface 1a has a plurality of first recesses 4c1 and a plurality of second recesses 4c2 orthogonal to the first recesses 4c1. The angle θ between the extending direction of the first recesses 4c1 and the orthogonal line D orthogonal to the length direction of the stretchable substrate 1A is approximately 45°. The angle between the extending direction of the second recesses 4c2 and the orthogonal line D orthogonal to the length direction of the stretchable substrate 1A is approximately -45°. A first recess 4c1, another first recess 4c1 adjacent to the first recess 4c1, a second recess 4c2, and another second recess 4c2 adjacent to the second recess 4c2 form a rectangle 4c3. The above shape may also be provided only in a part of the first main surface 1a. The shape of the first modified example may be provided not only on the first main surface 1a but also on the second main surface 1b. The angle at which the first recesses 4c1 and the second recesses 4c2 intersect may not be 90°, but may be approximately 90°. Furthermore, the angle θ is not limited to the values ​​mentioned above; for example, it can be 0°, 15°, or 30°. That is, the angle θ can also take any value between 0° and 90°.

[0118] The distance between adjacent first recesses 4c1 is, for example, 1 to 10 μm. The distance between adjacent second recesses 4c2 is, for example, 1 to 10 μm.

[0119] like Figure 7B As shown, the shape of the first modified example is formed on the first main surface 1a by embossing using an embossing sheet 5C. The embossing sheet 5C has a first protrusion 5c1, a second protrusion 5c2, and a recess surrounded by the first protrusion 5c1 and the second protrusion 5c2.

[0120] Furthermore, for the embossing process, the embossing can be performed using a sheet material with recesses and protrusions formed on the first main surface 1a of the stretchable substrate 1A. The recesses and protrusions can be patterned or random. The protrusions can also be of different sizes and shapes, and the recesses can also be of different sizes and shapes. For example, as... Figure 8AAs shown, the embossing sheet 5 can also be a sheet with a diamond-shaped protrusion 4d1 and other recesses 4d2 on the first main surface 1a. Additionally, as... Figure 8B As shown, the embossing sheet 5 can also be a sheet with a wavy protrusion 4e1 and other recesses 4e2 on the first main surface 1a. For example... Figure 8C As shown, the sheet material for embossing can also be a sheet material with a circular shape 4f1 and other portions 4f2 provided on the first main surface 1a. Additionally, as... Figure 8D As shown, the sheet material for embossing can also be a sheet material with mesh-like protrusions 4g1 and other recesses 4g2 on the first main surface 1a.

[0121] <Third Implementation>

[0122] Reference Figure 9 The structure of the stretchable device 100B in the third embodiment will be described. Figure 9 This is a cross-sectional view of the stretchable device 100B, and... Figure 2 Correspondingly, the third embodiment differs from the first embodiment in the method of processing the stretchable substrate. This difference will be described below. Other structures are the same as those in the first embodiment, and their descriptions are omitted. Regarding the structure and material of the stretchable substrate 1B, the first main surface 1a, the second main surface 1b, and the substrate 80, unless otherwise described below, the same structure and material as those of the stretchable substrate 1, the first main surface 1a, the second main surface 1b, and the substrate 80 in the first embodiment can be used respectively.

[0123] like Figure 9 As shown, the stretchable device 100B includes: a stretchable substrate 1B having a first main surface 1a and a second main surface 1b facing each other; and a wiring 2 disposed on the first main surface 1a. In the third embodiment, the first surface 80a of the substrate 80 is the same as the first main surface 1a of the stretchable substrate 1B. The side of the metal-containing portion 81 opposite to the second surface 80b is the second main surface 1b of the stretchable substrate 1B. By having the metal-containing portion 81, the diffusion of molecules that cause self-adhesion in the substrate 80 can be suppressed, and the self-adhesion of the stretchable substrates 1B to each other can be suppressed. Here, the metal-containing portion 81 refers to a portion containing a metal-containing compound. Examples of metal-containing compounds include metals and metal oxides.

[0124] Furthermore, the metal-containing portion 81 may contain multiple metal atoms or only one metal atom. In the third embodiment, the metal-containing portion 81 is located on the second main surface 1b side, but the metal-containing portion 81 may also be located on the first main surface 1a side, or on both the first main surface 1a side and the second main surface 1b side. The stretchable substrate 1B may also have: a substrate 80 having the metal-containing portion 81; a wiring 2 located on the side of the substrate 80 opposite to the metal-containing portion 81; and another substrate 80 located on the wiring 2. Additionally, the stretchable substrate 1B may also have the metal-containing portion 81 on the side of the other substrate 80 opposite to the wiring 2. The substrate 80 may be composed of only one layer or multiple layers. The stretchable substrate 1B may be composed of only one layer or multiple layers.

[0125] Preferably, at the second main surface 1b, the metal composition ratio of the metal-containing portion 81, as determined by X-ray photoelectron spectroscopy, is 0.5 atomic% or more. There is no particular upper limit to the metal composition ratio of the metal-containing portion 81, but it can be, for example, 3 atomic% or less. With the above structure, metal atoms can be uniformly dispersed. This helps to suppress the hardening of the stretchable substrate 1B. Furthermore, by uniformly dispersing the metal atoms, coloring from the metal atoms can be dispersed. If the proportion of metal elements is too high, the safety of the stretchable substrate 1B decreases. If the proportion of metal elements is too low, molecular diffusion of the substrate 80 cannot be suppressed, leading to, for example, self-adhesion between the stretchable substrates 1B.

[0126] Preferably, the metal-containing portion 81 comprises at least one selected from the group consisting of Al, Fe, Ni, Au, Pt, Ag, and Ti. By having the above structure, molecular diffusion that causes self-adhesion in the substrate 80 can be suppressed, and self-adhesion between the stretchable substrates 1B can be further suppressed.

[0127] Preferably, the metal portion 81 contains Al. From a biocompatibility perspective, the above structure is preferred. In particular, considering that Al is stabilized in the form of an oxide, this is preferred from the perspective of improving the safety of the stretchable substrate 1B. Furthermore, from a cost perspective, the above structure is also preferred. Alternatively, Al may exist as a metal rather than an oxide.

[0128] Preferably, the metal-containing portion 81 comprises at least one of a metal and a metal oxide. With the above structure, the metal-containing portion 81 can stably exist on the substrate 80. Furthermore, the metal-containing portion 81 may comprise multiple metal atoms or only a single metal atom.

[0129] Preferably, the flexible substrate 1B also has a protective layer for protecting the wiring 2. The protective layer is disposed on the same layer as the wiring 2 or is disposed to cover the wiring 2. With the above structure, the wiring 2 can be protected. The protective layer can be a single layer or multiple layers stacked together. The protective layer can also be a substrate 80.

[0130] Preferably, the protective layer covers the wiring 2, and the side of the protective layer opposite to the wiring 2 has a metal-containing portion 81.

[0131] (Manufacturing method)

[0132] Reference Figure 10A , Figure 10B as well as Figure 10C This describes the manufacturing method of the stretchable device 100B.

[0133] First, such as Figure 10A As shown, prepare substrate 80 (preparation process). (As indicated) Figure 10B As shown, the material for forming the wiring 2 is formed on the first surface 80a of the substrate 80 (configuration process). For example... Figure 10C As shown, a metal-containing portion 81 is formed on the second surface 80b by a sputtering process (forming step). For example, a ULVAC SV-200 can be used for the sputtering process. Furthermore, in order to form the metal-containing portion 81, not only sputtering but also thin film formation methods such as vapor deposition and chemical vapor deposition (CVD) can be used. This forms the stretchable device 100B. Alternatively, in the preparation step, two substrates 80 can be prepared, and in the configuration step, material for the wiring 2 can be formed on the first surface 80a of one substrate 80, and another substrate 80 can be formed on the wiring 2.

[0134] (Example 1)

[0135] like Figure 11 As shown, in the stretchable device 100C, the substrate 80 is formed of substrate 82 and substrate 83. Specifically, the stretchable device 100C has the original stretchable substrate 82 covering the metal-containing portion 81, substrate 83 on the side of substrate 82 opposite to the metal-containing portion 81, and wiring 2 on the side of substrate 83 opposite to substrate 82. The surface of substrate 83 where wiring 2 is provided is the first main surface 1a of the stretchable substrate 1B. Furthermore, substrate 80 may be formed of three or more layers. Unless otherwise specified, the reference numerals are the same structures as in the third embodiment, and their descriptions are omitted.

[0136] (Second variation)

[0137] like Figure 12As shown, in the stretchable device 100D, the substrate 80 is formed of substrate 82 and substrate 83, with wiring 2 sandwiched between substrate 82 and substrate 83. Specifically, the stretchable device 100C has substrate 82, wiring 2 on substrate 82, and substrate 83 covering wiring 2. The side of substrate 83 opposite to wiring 2 is the first main surface 1a of the stretchable substrate 1B. A metal-containing portion 81 is provided on the side of substrate 82 opposite to wiring 2. Furthermore, substrate 82 may be formed of two or more layers. Substrate 83 may also be formed of two or more layers. In addition, in the second variation, the metal-containing portion 81 is located on the side of substrate 82 opposite to wiring 2, but it may also be located on the side of substrate 83 opposite to wiring 2, or on both the side of substrate 82 opposite to wiring 2 and the side of substrate 83 opposite to wiring 2. Furthermore, unless otherwise specified, the reference numerals are the same structures as in the third embodiment, and their descriptions are omitted.

[0138] <Fourth Implementation>

[0139] Reference Figure 13 The structure of the stretchable device 100E in the fourth embodiment will be described. Figure 13 This is a cross-sectional view of the 100E telescopic device, and... Figure 9 Correspondingly, the fourth embodiment does not have the metal-containing portion 81 of the third embodiment, but has a metal-containing region 81d within the substrate 80C. This different structure will be described below. Other structures are the same as those in the third embodiment, and their descriptions are omitted. Regarding the structure and material of the stretchable substrate 1C, the first main surface 1a, and the second main surface 1b, unless otherwise described below, the same structure and material as those of the stretchable substrate 1, the first main surface 1a, and the second main surface 1b of the first embodiment can be used respectively. Regarding the structure and material of the substrate 80C, except for the metal-containing region 81d, the same structure and material as those of the substrate 80 of the first embodiment can be used.

[0140] like Figure 13As shown, the stretchable device 100E includes: a stretchable substrate 1C having a first main surface 1a and a second main surface 1b opposite to each other; and a wiring 2 disposed on the first main surface 1a. In the fourth embodiment, the first surface 80a of the substrate 80C is the same as the first main surface 1a of the stretchable substrate 1C. The second surface 80b of the substrate 80C is the second main surface 1b of the stretchable substrate 1C. In the second surface 80b of the substrate 80C, a metal-containing region 81d is provided along the second surface 80b (second main surface 1b). The metal-containing region 81d exists within the stretchable substrate 1C. By having the above structure, the diffusion of molecules that cause self-adhesion in the substrate 80C can be suppressed, and the self-adhesion of the stretchable substrate 1C can be suppressed. Moreover, when bonded to other substrates besides the stretchable substrate 1C, the adhesion of the metal-containing region 81d to other substrates is improved, and the adhesion force between the stretchable substrate 1C and other substrates is improved. Furthermore, the stretchable substrate 1C, by having a metal-containing region 81d, can adhere tightly to other substrates even at lower pressing temperatures. Therefore, even at low temperatures, attachment processes, such as attachment to other substrates, can be performed, reducing the load on the substrate 80C and wiring 2 due to heat treatment. Additionally, the metal-containing region 81d can also be located separately from the second main surface 1b of the stretchable substrate 1C.

[0141] Preferably, the metal-containing region 81d at the second main surface 1b of the stretchable substrate 1C contains a metal atom ratio of 0.2 atomic% or more and 2.5 atomic% or less. Here, the ratio at the second main surface 1b refers to the ratio of metal atoms at the second main surface 1b to the total number of atoms. The metal atom ratio can be determined using X-ray photoelectron spectroscopy.

[0142] Preferably, the metal-containing regions 81d are distributed in the second surface 80b of the substrate 80C. Specifically, a material constituting the substrate 80C, such as a stretchable resin material, is present between the metal-containing regions 81d. That is, the metal-containing regions 81d do not have a layered shape.

[0143] Preferably, the metal-containing region 81d is a metal or a metal oxide. By having the above structure, the metal-containing region 81d is safely present. Furthermore, the metal-containing region 81d may contain multiple metal atoms or only a single metal atom.

[0144] Preferably, the metal-containing region 81d more preferably contains a metal oxide.

[0145] Preferably, the metal-containing region 81d comprises at least one selected from the group consisting of Al, Fe, Ni, Au, Pt, Ag, and Ti. By having the above structure, molecular diffusion that causes self-adhesion in the substrate 80C can be suppressed, and self-adhesion between the stretchable substrates 1C can be further suppressed.

[0146] Preferably, the metal-containing region 81d contains Al. From a biocompatibility perspective, the above structure is preferred. In particular, considering that Al is stabilized in the form of an oxide, it is preferred from the perspective of improving the safety of the stretchable substrate 1C. Furthermore, from a cost perspective, the above structure is also preferred. Additionally, Al can also exist as a metal.

[0147] Furthermore, in the fourth embodiment, the metal-containing region 81d is located on the second principal surface 1b, but the metal-containing region 81d may also be located on the first principal surface 1a, or it may be located on both the first principal surface 1a and the second principal surface 1b. In this case, the ratio at the first principal surface 1a refers to the presence ratio, similar to the ratio at the second principal surface 1b. Additionally, the ratio of metal atoms is a ratio relative to all atoms.

[0148] (Manufacturing method)

[0149] Reference Figure 14A , Figure 14B as well as Figure 14C This describes the manufacturing method of the stretchable device 100E.

[0150] like Figure 14A As shown, a substrate 80C is prepared having a first main surface 1a and a second main surface 1b that are opposite to each other. Figure 14B As shown, wiring 2 is provided on the first main surface 1a of substrate 80C. (As indicated...) Figure 14C As shown, a metal-containing region 81d is provided in the substrate 80C. Thus, a stretchable device 100E is formed.

[0151] Example

[0152] The following examples will illustrate the subject in more detail, but this disclosure is not limited to these examples.

[0153] <First Embodiment>

[0154] (Example 1)

[0155] Prepare two styrene-based elastomer membranes. Ozone treat these styrene-based elastomer membranes using the following method.

[0156] [Ozone Treatment]

[0157] Ozone treatment was performed using the Sun Energy SKB2003N, which generates ozone using a low-pressure mercury lamp.

[0158] The ratio of oxygen atoms on the surface of the substrate after ozone treatment is determined as follows.

[0159] [Determination of the oxygen atom ratio on the surface of the substrate]

[0160] The following apparatus was used to determine the ratio of oxygen atoms at the outermost surface of a substrate.

[0161] Apparatus: X-ray photoelectron spectroscopy (XPS, Quantes manufactured by ULVAC-PHI)

[0162] Accelerating voltage: 15kV

[0163] Measurement area: 1000μm × 200μm

[0164] After ozone treatment, the ozone-treated surfaces are overlapped to perform the following self-adhesion test.

[0165] [Self-adhesive test]

[0166] (1) Measurement at 70℃

[0167] The test was conducted based on JIS K 6404-3:1999 (Test methods for rubber-coated fabrics and plastic-coated fabrics). Specifically, in the sealing test, two glass plates approximately 150 mm in length, 150 mm in width, and 3 mm in thickness were prepared. The prepared film was sandwiched between the two glass plates, overlapping each other. A 5.0 kg weight was placed on the glass plates, and the mixture was left to stand at 70°C for 3 hours. Then, the two test pieces were checked for peeling.

[0168] As a test piece, the membrane obtained in the examples or comparative examples was used.

[0169] • Adhesion: The test piece could not be peeled off.

[0170] • Micro-adhesion: The membrane can be peeled off by applying force.

[0171] • Not bonded: The film is not bonded.

[0172] (2) Determined at room temperature

[0173] Except for measuring the temperature at room temperature, the measurements and evaluations were performed in the same manner as the measurements at 70°C described above.

[0174] (Examples 2-6)

[0175] Two styrene-based elastomer films were prepared in the same manner as in Example 1. These styrene-based elastomer films were then subjected to ozone treatment. The ratio of oxygen atoms on the surface of the substrate after ozone treatment, in the same manner as in Example 1, was also recorded.

[0176] After ozone treatment, the ozone-treated surfaces were overlapped and a self-adhesive test was performed in the same manner as in Example 1.

[0177] (Comparative Example 1)

[0178] Two styrene-based elastomer films were prepared in the same manner as in Example 1. The ratio of oxygen atoms on the surface of the substrate was determined in the same manner as in Example 1.

[0179] Two styrene-based elastomer films were overlapped and self-adhesive tests were performed in the same manner as in Example 1.

[0180] (Comparative Example 2)

[0181] Two styrene-based elastomer films were prepared in the same manner as in Example 1. These styrene-based elastomer films were then subjected to ozone treatment. The ratio of oxygen atoms on the surface of the substrate after ozone treatment, in the same manner as in Example 1, was also recorded.

[0182] After ozone treatment, the ozone-treated surfaces were overlapped and a self-adhesive test was performed in the same manner as in Example 1.

[0183] The results are shown in Table 1.

[0184] [Table 1]

[0185]

[0186] As shown in Table 1, in Comparative Example 1, no ozone treatment was performed, and the oxygen atom ratio was 1.4 atomic%. That is, before ozone treatment, the styrene-based elastomer film contained almost no oxygen atoms. In Comparative Example 1, adhesion occurred at room temperature. In Comparative Example 2, the oxygen atom ratio was 2.3 atomic%, but it showed slight adhesion at room temperature and adhesion under more severe conditions (70°C). Examples 1-6 also contained oxygen atoms, did not adhere at room temperature, and showed slight adhesion even under more severe conditions (70°C).

[0187] Furthermore, in the above embodiments, it is not possible to add oxygen atoms with values ​​higher than those recorded in Table 1.

[0188] <Second Embodiment>

[0189] (Example 7)

[0190] Two urethane-based elastomer films were prepared. These styrene-based elastomer films were ozone-treated using the same method as in Example 1. The oxygen atom ratio on the surface of the ozone-treated substrate was measured in the same manner as in Example 1.

[0191] After ozone treatment, the ozone-treated surfaces were overlapped and a self-adhesive test was performed in the same manner as in Example 1.

[0192] (Examples 8-12)

[0193] Two urethane-based elastomer films were prepared in the same manner as in Example 7. These urethane-based elastomer films were then subjected to ozone treatment. The ratio of oxygen atoms on the surface of the substrate after ozone treatment was the same as in Example 1.

[0194] After ozone treatment, the ozone-treated surfaces were overlapped and a self-adhesive test was performed in the same manner as in Example 1.

[0195] (Comparative Example 3)

[0196] Two urethane-based elastomer films were prepared in the same manner as in Example 7. The ratio of oxygen atoms on the surface of the substrate was determined in the same manner as in Example 1.

[0197] Two styrene-based elastomer films were overlapped and self-adhesive tests were performed in the same manner as in Example 1.

[0198] (Comparative Example 4)

[0199] Two urethane-based elastomer films were prepared in the same manner as in Example 7. These urethane-based elastomer films were then subjected to ozone treatment. The ratio of oxygen atoms on the surface of the substrate after ozone treatment was the same as in Example 1.

[0200] After ozone treatment, the ozone-treated surfaces were overlapped and a self-adhesive test was performed in the same manner as in Example 1.

[0201] The results are shown in Table 2.

[0202] [Table 2]

[0203]

[0204] As shown in Table 2, when the oxygen atom ratio is low (Comparative Examples 3 and 4), bonding occurs at room temperature and 70°C. It can be seen that by increasing the oxygen atom ratio (Examples 7-12), a surface that does not bond at room temperature and 70°C can be formed.

[0205] <Version 3>

[0206] (Example 13)

[0207] Two styrene-based elastomer films identical to those in Example 4 were prepared. These styrene-based elastomer films were subjected to ozone treatment. The arithmetic mean surface roughness Ra of the ozone-treated main surface was measured.

[0208] <Determination of Arithmetic Mean Surface Roughness Ra>

[0209] Atomic force microscope: Atomic force microscope (AFM, manufactured by Bruker).

[0210] Measurement area: 2μm×2μm

[0211] Measurement interval: 256μm × 256μm

[0212] The ozone-treated surfaces were overlapped and heat-treated at 160°C for 10 minutes.

[0213] (Examples 14-17)

[0214] Two styrene-based elastomer films were prepared in the same manner as in Example 4. These styrene-based elastomer films were subjected to ozone treatment. The arithmetic mean surface roughness Ra of the ozone-treated main surface was measured in the same manner as in Example 13. The ozone-treated surfaces were then overlapped and heat-treated as shown in Table 3.

[0215] The results are shown in Table 3. Additionally, Example 4, which was not subjected to heat treatment, is also shown in Table 3 for comparison purposes.

[0216] [Table 3]

[0217]

[0218] As shown in Table 3, in Example 4 (without heat treatment), no bonding occurred at room temperature, but micro-bonding occurred under more severe conditions (70°C). In Examples 14-17, no bonding occurred not only at room temperature but also at 70°C. In Examples 14-17, the arithmetic mean surface roughness Ra increased, suggesting that by having such a surface, it is possible to form a surface that does not bond at both room temperature and 70°C.

[0219] Specifically, based on Figure 15 To illustrate. Figure 15 This is an explanatory diagram illustrating the surface roughness of a stretchable substrate. Figure 15 The image was drawn based on photographs obtained using atomic force microscopy to measure the surface roughness of the substrate in Example 15. Figure 15 In the figure, the surface hardness increases in the order of white portion 61, coarse-spotted portion 62, and fine-spotted portion 63. It can be seen that by heat treatment at 160℃, the points 62 and 63 increase, which can roughen the surface of the substrate.

[0220] Furthermore, in the above Examples 13 to 17, the ratio of oxygen atoms was considered to be 5 atomic% or more.

[0221] <4th Embodiment>

[0222] (Example 18)

[0223] Two styrene-based elastomer films were prepared in the same manner as in Example 4. These styrene-based elastomer films were then subjected to ozone treatment. The ozone-treated films were divided into a first part and a second part, which had different phases as determined by electron force microscopy. The surface occupancy of the harder portion of the first part, which had no phase lag, was then measured.

[0224] <Determination of Surface Occupancy>

[0225] Apparatus: Atomic force microscope (AFM, manufactured by Bruker)

[0226] Measurement area: 2000μm × 2000μm

[0227] Then, the ozone-treated surfaces were overlapped and heat-treated. After heat treatment, a self-adhesion test was performed in the same manner as in Example 1.

[0228] (Examples 19-22)

[0229] Two styrene-based elastomer films were prepared in the same manner as in Example 18. These styrene-based elastomer films were subjected to ozone treatment. The ozone-treated films were divided into a first part and a second part with different phases as determined by electron force microscopy. The surface occupancy of the harder portion without phase retardation, which is the first part, was measured in the same manner as in Example 18.

[0230] The results are shown in Table 4. Additionally, Example 4, which was not subjected to heat treatment, is also shown in Table 4 for comparison purposes.

[0231] [Table 4]

[0232]

[0233] As shown in Table 4, in Example 4, which only underwent ozone treatment, no adhesion occurred at room temperature, but slight adhesion occurred at 70°C. In contrast, in Examples 18-22, which underwent heat treatment after ozone treatment, no adhesion occurred at both room temperature and 70°C. It is believed that in Examples 18-22, the surface occupancy increased due to heat treatment, resulting in no adhesion not only at room temperature but also at 70°C.

[0234] Specifically, based on Figure 16 To illustrate. In Figure 16 Within this, there exist two parts, 71 and 72, represented in granular form. For example... Figure 16 As shown, the proportion of Part 1 71 increases after heat treatment.

[0235] <5th Embodiment>

[0236] (See Example 23)

[0237] Two urethane elastomer films were prepared in the same manner as in Comparative Example 3. These urethane elastomer films were overlapped and embossed by pressing them against a film for embossing.

[0238] <Film for Embossing>

[0239] The embossing film has a grid shape, including a first shape 4A with a rectangular portion having longitudinal grooves and a second shape 4B with a rectangular portion having transverse grooves. The rectangle is 25 μm square. The first shape 4A and the second shape 4B each have 3 to 10 grooves.

[0240] After embossing, the arithmetic mean surface roughness Ra' of the surface is measured using a laser microscope.

[0241] <Determination of Arithmetic Mean Surface Roughness Ra'>

[0242] Laser microscope: VK-9500 (manufactured by Keyence Corporation)

[0243] Measurement method: Laser non-contact

[0244] Measurement area: 1012μm × 1350μm

[0245] (Examples 24 and 25)

[0246] Prepare two urethane elastomer films in the same manner as in Reference Example 23. Overlap these urethane elastomer films and press them under pressure using the same embossing film as in Reference Example 23, but the depth of pressure pressing is greater than in Reference Example 23.

[0247] <Pressure compression>

[0248] Press the mixture at 70°C for 1 minute.

[0249] After embossing, the arithmetic mean surface roughness Ra' of the surface was measured in the same manner as in Reference Example 23.

[0250] The results are shown in Table 5.

[0251] [Table 5]

[0252]

[0253] As shown in Table 5, in Comparative Example 3, no embossing was performed, and the material was bonded at room temperature. In Reference Example 23, the material was not bonded at room temperature. In Examples 24 and 25, the material was not bonded at room temperature and 70°C, respectively. This is believed to be because, compared to before embossing (Comparative Example 3), the arithmetic mean surface roughness Ra' increased after embossing (Reference Example 23, Examples 24 and 25), resulting in a smaller area at the top of the protrusion and a reduced contact area.

[0254] <Sixth Embodiment>

[0255] (Examples 26-29)

[0256] Two styrene-based elastomer films were prepared. These styrene-based elastomer films were sputtered using Al metal via ULVAC SV-200. It was observed that aluminum oxide was formed during X-ray photoelectron spectroscopy (XPS).

[0257] The composition ratio of Al elements in the sputtered substrate and the self-adhesion test were determined in the same manner as in Example 1.

[0258] The results are shown in Table 6. In addition, for comparison purposes, Comparative Example 1 without sputtering treatment is also shown in Table 6.

[0259] [Table 6]

[0260]

[0261] As shown in Table 6, in Comparative Example 1, no sputtering treatment was performed, and the material self-adheded at both room temperature and 70°C. In Examples 26-29, no adhesion occurred despite sputtering treatment. In particular, in Examples 28 and 29, where the Al ratio was 0.5 atomic% or higher, no adhesion occurred even under more severe conditions (70°C).

[0262] Furthermore, the cytotoxicity test specified in ISO 10993-5 was performed on the Al-containing stretchable substrate obtained in Example 26, but no toxicity was confirmed. The reason given is that the amount of Al formed on the surface in this method is extremely small, and due to its small quantity, it is stabilized in the form of oxides. Based on this result, the safety of the stretchable substrate obtained in this method is considered to be good.

[0263] <Seventh Embodiment>

[0264] (Examples 30-33)

[0265] Two urethane-based elastomer films were prepared. These urethane-based elastomer films were subjected to Al metal sputtering treatment using the same method as in Example 26.

[0266] After sputtering, the sputtered surfaces were overlapped and a self-adhesive test was performed in the same manner as in Example 26.

[0267] The results are shown in Table 7. In addition, Comparative Example 3, which was not subjected to sputtering treatment, is also shown in Table 6 for comparison.

[0268] [Table 7]

[0269]

[0270] As shown in Table 7, in Comparative Example 3, no sputtering treatment was performed, and the material self-adheded at both room temperature and 70°C. In Examples 30-33, no adhesion occurred despite sputtering treatment. In particular, in Examples 32 and 33, where the Al ratio was 0.5 atomic% or higher, no adhesion occurred even under more severe conditions (70°C).

[0271] <Embodiment 8>

[0272] (Examples 34-39)

[0273] Prepare two urethane-based elastomer films. These urethane-based elastomer films were subjected to sputtering treatment using the metals shown in Table 8, in the same manner as in Example 26.

[0274] After sputtering, the sputtered surfaces were overlapped and a self-adhesive test was performed in the same manner as in Example 26.

[0275] The results are shown in Table 8.

[0276] [Table 8]

[0277]

[0278] As shown in Table 8, it can be seen that using Fe, Ni, Au, Pt, Ag, and Ti can achieve a self-adhesion inhibition effect on the stretchable substrates. It can be confirmed that forming a metal or metal oxide film on the substrate can suppress self-adhesion. It is believed that not only when using Al and the metals shown in Table 8, but also when using other metals, the presence of a small amount of metal on the substrate can form a film that inhibits molecular diffusion, achieving the same effect.

[0279] <Version 9>

[0280] (Example 40)

[0281] Prepare two styrene-based elastomer membranes. Perform plasma treatment on these styrene-based elastomer membranes.

[0282] [Plasma Processing]

[0283] Plasma treatment was performed using a PC-1000 (Samco).

[0284] X-ray photoelectron spectroscopy (XPS) was used to determine the presence of aluminum oxide in the plasma-treated film. The ratio of aluminum atoms to the total elements at the plasma-treated surface was 0.8 atoms.

[0285] After plasma treatment, the plasma-treated surfaces were overlapped and a self-adhesion test was conducted. The self-adhesion test confirmed that no elastomers adhered to each other.

[0286] In addition, after plasma treatment, the substrate is pressed and bonded to a nylon substrate at 100–120°C using a polyester urethane-based adhesive for 1 minute. The pressure is set to 0.6 MPa. Then, as... Figure 17 As shown, a 180° peel test was performed. The results are presented below. Figure 18 and Figure 19 Furthermore, in Figure 18 The peel force of the substrate used in Example 40 is shown to be 2.19 N·10 mm. -1 The peel force obtained using the substrate of Comparative Example 5 was 0.28 N·10 mm. -1 The result.

[0287] [180° peel test (peel strength)]

[0288] The 180° peel test was conducted in accordance with the JIS Z 0237 test method for adhesive tapes and the JIS Z 0238 test method for heat-sealed flexible packaging bags and semi-rigid containers. Specifically, a plasma-treated substrate 80C was bonded to a nylon substrate 92 using an adhesive layer 91 composed of adhesive. A tensile force F was applied to the substrate 80C and the nylon substrate 92 in a direction of separation, i.e., a 180° separation direction, and peeling was performed. A force gauge was used to measure the peel strength. Furthermore, aluminum oxide, which forms a metal-containing region 81d, is present on the surface of the substrate 80C on the side of the adhesive layer 91.

[0289] (Examples 41 and 42)

[0290] After plasma treatment, except for changing the pressing temperature, the process was the same as in Example 40, and a peeling test was performed.

[0291] (Comparative Example 5)

[0292] Two styrene-based elastomer films were prepared in the same manner as in Example 40. The styrene-based elastomer films were overlapped, and a self-adhesion test was performed. Additionally, as in Example 40... Figure 17 As shown, a 180° peel test was performed. Additionally, in Comparative Example 5, compared to... Figure 17 Unlike other materials, it did not undergo plasma treatment and did not form aluminum oxide. Figure 18 Of the two peel force measurement results shown, in Comparative Example 5, the peel force was the lower value of 0.28 N·10 mm. -1 .

[0293] (Compare Examples 6 and 7)

[0294] After plasma treatment, except for changing the pressing temperature, the treatment was the same as that of Comparative Example 5, and a peeling test was performed.

[0295] The results are shown in Table 9.

[0296] [Table 9]

[0297]

[0298] As shown in Table 9 and Figure 18 As shown, compared to Comparative Example 5 which did not undergo plasma treatment, the peel force in the 180° peel test of Example 40, which underwent plasma treatment, was greater. That is, the adhesion strength was increased by plasma treatment.

[0299] exist Figure 19 In Table 9, the results of Examples 40-42 are represented by black squares, and the results of Comparative Examples 5-7 are represented by black circles. (See Table 9 and...) Figure 19 As shown, in Examples 40-42, even with variations in pressing temperature, the peel strength showed minimal variation, maintaining good peel strength regardless of differences in pressing temperature. In contrast, in Comparative Examples 5-7, the peel force was smaller than in Examples 40-42, and variations in pressing temperature affected the peel strength. Specifically, in Comparative Examples 5-7, peeling was easier when the pressing temperature was lower. As described above, it can be seen that in Examples 40-41, higher peel strength could be obtained even at lower pressing temperatures. By enabling sealing at lower temperatures, the load caused by heat treatment is reduced for flexible substrates and wiring.

[0300] Furthermore, in Examples 1 to 22, 24 to 42 and Reference Example 23 above, the physical properties were measured using only the substrate, but the same method can be used when wiring is involved.

[0301] Furthermore, this disclosure is not limited to the embodiments described above, and design changes can be made without departing from the spirit of this disclosure. For example, the feature points of each of the first to fourth embodiments can be combined in various ways.

[0302] This application claims priority based on Japanese Patent Application No. 2023-116845, filed with the State of Japan on July 18, 2023, the entire contents of which are incorporated herein by reference.

[0303] This disclosure includes the following scheme.

[0304] <1> A stretchable substrate having a first main surface and a second main surface opposite to each other, wherein the stretchable substrate has any of the following characteristics: (1) the ratio of oxygen atoms to all atoms in at least one of the first main surface and the second main surface, as determined by X-ray photoelectron spectroscopy, is 5 atomic% or more; (2) the arithmetic mean surface roughness of the surface at the first main surface or the second main surface, as determined by laser microscopy, is 6 μm or more; (3) at least one of the first main surface and the second main surface has a metal-containing portion containing metal atoms; and (4) a metal-containing region containing metal atoms is provided along at least one of the first main surface and the second main surface.

[0305] <2> According to the stretchable substrate of <1>, the ratio of oxygen atoms to all atoms in at least one of the first main surface and the second main surface, as determined by the X-ray photoelectron spectroscopy method, is 5 atomic% or more.

[0306] <3> According to the stretchable substrate described in <2>, the oxygen atom ratio at the center portion of the first main surface and the second main surface in a direction orthogonal to the first main surface and the second main surface is 5 atoms or less.

[0307] <4> According to <2> or <3>, the stretchable substrate, wherein the arithmetic mean surface roughness of the first main surface or the second main surface, as measured by the atomic force microscope, is 10 nm or more.

[0308] <5> The stretchable substrate according to any one of <2> to <4>, wherein, at the first main surface or the second main surface, there are a first portion and a second portion with different phases as determined by atomic force microscopy, the phase of the first portion being more than 10° ahead of the phase of the second portion, and the surface occupancy of the first portion being more than 80%.

[0309] <6> According to <1> the stretchable substrate, wherein the arithmetic mean surface roughness of the surface measured by the laser microscope at the first main surface or the second main surface is 6 μm or more.

[0310] <7> The stretchable substrate according to <1>, wherein at least one of the first main surface and the second main surface has the metal-containing portion containing the metal atoms.

[0311] <8> According to the stretchable substrate of <7>, the metal composition ratio of the metal-containing portion relative to all elements, as determined by X-ray photoelectron spectroscopy, is 0.5 atomic% or more at the first main surface or the second main surface.

[0312] <9> According to <7> or <8>, the ratio of oxygen atoms at the center portion of the first main surface and the second main surface in a direction orthogonal to the first main surface and the second main surface is 5 atoms or less.

[0313] <10> The stretchable substrate according to <1>, wherein the metal-containing region comprising the metal atoms is provided along at least one of the first main surface and the second main surface.

[0314] <11> According to the stretchable substrate of <10>, the ratio of the metal atoms at the first main surface or the second main surface is 0.2 atomic% or more and 2.5 atomic% or less.

[0315] <12> The stretchable substrate according to any one of <7> to <11>, wherein the metal atoms comprise at least one selected from the group consisting of Al, Fe, Ni, Au, Pt, Ag and Ti.

[0316] <13> The stretchable substrate according to any one of <7> to <9> and <12>, wherein the metal-containing portion comprises at least one of a metal and a metal oxide.

[0317] <14> The stretchable substrate according to any one of <10> to <12>, wherein the metal-containing region comprises at least one of a metal and a metal oxide.

[0318] <15> The stretchable substrate according to any one of <1> to <14>, wherein the stretchable substrate is rubber or an elastomer.

[0319] <16> A stretchable device, wherein the stretchable device has a stretchable substrate as described in any one of <1> to <15> and wiring disposed on the first main surface of the stretchable substrate.

[0320] <17> A stretchable device, wherein the stretchable device has a stretchable substrate as described in any one of <2> to <5>, <10> to <12>, <14>, and <15> and wiring disposed on the first main surface of the stretchable substrate.

[0321] <18> A stretchable device, wherein the stretchable device has a stretchable substrate as described in any one of <6> to <9>, <12>, <13>, and <15> and wiring disposed on the first main surface of the stretchable substrate.

[0322] <19> The stretchable device according to <18> further comprises a protective layer.

[0323] <20> The stretchable device according to <19>, wherein the protective layer covers the wiring, and the side of the protective layer opposite to the wiring has the metal-containing portion.

[0324] <21> A method for manufacturing a stretchable substrate, wherein the method comprises: a preparation step in which a substrate is prepared; and an ozone treatment step in which at least one of a first main surface of the substrate and a second main surface located on the opposite side of the first main surface is subjected to ozone treatment.

[0325] <22> The method for manufacturing a stretchable substrate according to <21>, wherein the stretchable substrate contains at least 5% oxygen atoms in at least one of the first main surface and the second main surface.

[0326] <23> The method for manufacturing a stretchable substrate according to <21> or <22>, wherein, for the stretchable substrate, the ratio of oxygen atoms at at least one of the first main surface and the second main surface increases by more than 5 atomic% relative to the substrate.

[0327] <24> A method for manufacturing a stretchable substrate according to any one of <21> to <23>, wherein an embossing process is performed after the ozone treatment process, wherein at least one of the first main surface and the second main surface is embossed.

[0328] <25> A method for manufacturing a stretchable device, wherein the method comprises: a preparation step in which a substrate having a first main surface and a second main surface opposite to each other is prepared; an arrangement step in which wiring is arranged on the first main surface of the substrate; and an ozone treatment step in which, after the arrangement step, at least one of the first main surface and the second main surface is subjected to ozone treatment.

[0329] <26> A method for manufacturing a stretchable device, wherein the method comprises: a preparation step in which a substrate having a first main surface and a second main surface opposite to each other is prepared; an arrangement step in which wiring is arranged on the first main surface of the substrate; and an embossing step in which, after the arrangement step, at least one of the first main surface and the second main surface is embossed.

[0330] <27> A method for manufacturing a stretchable device, wherein the method comprises: a preparation step in which a substrate is prepared; and a forming step in which a metal-containing portion is formed on at least one of a first main surface of the substrate and a second main surface located on the opposite side of the first main surface.

[0331] <28> A method for manufacturing a stretchable device, wherein the method comprises: a preparation step in which a first substrate having a first main surface and a second main surface opposite to each other is prepared; and a forming step in which a metal-containing portion is formed at least on the second main surface of the first substrate.

[0332] <29> The method for manufacturing a stretchable device according to <28> includes a configuration step after the preparation step and before the forming step, wherein wiring is configured on the first main surface of the substrate in the configuration step.

[0333] <30> The method for manufacturing a stretchable device according to <29> further includes preparing a second substrate having a first main surface and a second main surface opposite to each other, wherein, in the configuration step, the first main surface of the second substrate is configured on the wiring.

[0334] Explanation of reference numerals in the attached figures

[0335] 100, 100A, 100B, 100C, 100D, 100E, Stretchable devices; 1, 1A, 1B, 1C, Stretchable substrates; 2, Wiring; 3, Sheets; 4A, First shape; 4B, Second shape; 4a1, 4b1, Protrusions; 4a2, 4b2, Recesses; 5, 5C, Sheets for embossing; 5a1, Warp section; 5b1, Weft section; 61, White portion; 62, Coarse dotted portion; 63, Fine dotted portion; 71, Part 1; 72, Part 2; 80, 82, 83, Substrate; 81, Metal-containing portion.

Claims

1. A stretchable substrate having a first main surface and a second main surface opposite to each other, wherein, The stretchable substrate has any of the following characteristics: (1) The ratio of oxygen atoms in at least one of the first principal plane and the second principal plane, as determined by X-ray photoelectron spectroscopy, to the total number of atoms is 5 atomic% or more; (2) The arithmetic mean surface roughness of the surface measured by laser microscope at the first main surface or the second main surface is 6 μm or more; (3) At least one of the first principal surface and the second principal surface has a metallic portion containing metal atoms; and (4) A metal-containing region containing metal atoms is provided along at least one of the first main surface and the second main surface.

2. The stretchable substrate according to claim 1, wherein, The ratio of oxygen atoms to all atoms in at least one of the first principal plane and the second principal plane, as determined by X-ray photoelectron spectroscopy, is 5 atomic percent or more.

3. The stretchable substrate according to claim 2, wherein, The oxygen atom ratio at the center of the first principal surface and the second principal surface in a direction orthogonal to the first principal surface and the second principal surface is less than 5 atoms.

4. The stretchable substrate according to claim 1, wherein, At the first or second main surface, the arithmetic mean surface roughness of the surface, as measured by the laser microscope, is 6 μm or more.

5. The stretchable substrate according to claim 1, wherein, At least one of the first main surface and the second main surface has the metal-containing portion containing the metal atoms.

6. The stretchable substrate according to claim 5, wherein, At the first or second principal surface, the metal composition of the metal-containing portion relative to all elements, as determined by X-ray photoelectron spectroscopy, is 0.5 atomic% or more.

7. The stretchable substrate according to claim 5 or 6, wherein, The oxygen atom ratio at the center of the first principal surface and the second principal surface in a direction orthogonal to the first principal surface and the second principal surface is less than 5 atoms.

8. The stretchable substrate according to claim 1, wherein, The metal-containing region comprising the metal atoms is provided along at least one of the first principal surface and the second principal surface.

9. The stretchable substrate according to claim 8, wherein, The ratio of the metal atoms at the first or second principal surface is 0.2 atomic% or more and 2.5 atomic% or less.

10. The stretchable substrate according to any one of claims 5 to 8, wherein, The metal atom comprises at least one selected from the group consisting of Al, Fe, Ni, Au, Pt, Ag, and Ti.

11. The stretchable substrate according to any one of claims 1 to 10, wherein, The flexible substrate is made of rubber or an elastomer.

12. A stretchable device, wherein, The scalable device has a scalable substrate as described in any one of claims 1 to 11 and wiring disposed on the first main surface of the scalable substrate.

13. The stretchable device according to claim 12, wherein, The scalable device has the scalable substrate as described in claim 4 or 5, wiring disposed on the first main surface of the scalable substrate, and a protective layer. The protective layer covers the wiring. The protective layer has the metal-containing portion on the side opposite to the wiring.

14. A method for manufacturing a stretchable substrate, wherein, The manufacturing method includes: Preparation process, in which a substrate is prepared; and An ozone treatment process in which at least one of a first main surface of the substrate and a second main surface located on the opposite side of the first main surface is subjected to ozone treatment.

15. The method for manufacturing a stretchable substrate according to claim 14, wherein, The stretchable substrate contains at least 5% oxygen atoms in at least one of the first main surface and the second main surface.

16. The method for manufacturing a stretchable substrate according to claim 14 or 15, wherein, The manufacturing method further includes an embossing process after the ozone treatment process, in which at least one of the first main surface and the second main surface is embossed.

17. A method for manufacturing a stretchable device, wherein, This manufacturing method has the following characteristics: The preparation process involves preparing a substrate having a first main surface and a second main surface that are opposite to each other. A configuration step, in which wiring is configured on the first main surface of the substrate; and An ozone treatment step is performed after the configuration step, wherein at least one of the first main surface and the second main surface is subjected to ozone treatment.

18. A method for manufacturing a stretchable device, wherein, This manufacturing method has the following characteristics: The preparation process involves preparing a substrate having a first main surface and a second main surface that are opposite to each other. A configuration step, in which wiring is configured on the first main surface of the substrate; and The embossing process, after the configuration process, involves embossing at least one of the first main surface and the second main surface.

19. A method for manufacturing a stretchable device, wherein, This manufacturing method has the following characteristics: A preparation process is performed in which a first substrate having a first main surface and a second main surface that are opposite to each other is prepared; and A forming process in which at least a metal-containing portion is formed on the second main surface of the first substrate.

20. The method for manufacturing a stretchable device according to claim 19, wherein, A configuration step is performed after the preparation step and before the forming step, in which wiring is configured on the first main surface of the first substrate. Further prepare a second substrate having a first main surface and a second main surface that are opposite to each other. In the configuration process, the first main surface of the second substrate is configured on the wiring line.

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