Laser scanning cutting device

Abstract

This invention discloses a laser scanning cutting device, relating to the field of metal cutting technology. It includes a housing, a collimating mirror, a focusing mirror, and a galvanometer assembly. The galvanometer assembly includes a first galvanometer and a second galvanometer that cooperate with each other. The first galvanometer has a first reflecting surface arranged towards the collimating mirror, and a first tilt angle θ exists between the first reflecting surface and the optical axis of the collimating mirror, where 70°≤θ≤80°. The second galvanometer is arranged between the first galvanometer and the collimating mirror in a first direction. The vertical distance mm between the center of the mirror surface of the first galvanometer and the collimating mirror in the first direction, and the vertical distance mm between the center of the mirror surface of the second galvanometer and the collimating mirror in the first direction, satisfy a preset relationship. This allows the laser scanning cutting device to increase the oscillation rate of the first and second galvanometers without changing the motor output power, reducing the time it takes for the laser focus to move along a predetermined trajectory and improving the efficiency of laser cutting.

Description

Technical Field

[0001] This invention relates to the field of metal cutting technology, and in particular to a laser scanning cutting device. Background Technology

[0002] Laser cutting primarily uses a high-power laser beam to irradiate metallic materials, rapidly melting, vaporizing, or burning them to achieve efficient material separation. Traditional laser cutting employs static spot technology, where laser energy gradually attenuates as the distance from the focal plane increases. Consequently, when cutting thick plates, the fixed position of the laser focus relative to the cutting head prevents dynamic adjustment of the laser focus within the processing area. This results in the laser energy not being able to continuously and efficiently act on the area to be cut, easily leading to problems such as low energy utilization and reduced cutting speed.

[0003] To improve laser energy utilization, current laser cutting technology incorporates dynamic spot technology. This involves integrating a galvanometer assembly into the laser cutting head and controlling the deflection of the galvanometer to achieve real-time control of the laser beam focus. For example, Chinese invention patent CN116021174A discloses a dynamic control method for laser spot and a laser cutting device. This method arranges two galvanometers at the same horizontal height and uses a motor to drive the two galvanometers to swing around different axes, causing the laser beam to turn in the horizontal and vertical directions respectively. This achieves reciprocating motion of the laser spot along the X / Y axes. Simultaneously, by superimposing high-frequency oscillations in the Z-axis direction, the laser spot can cut the area to be processed with the laser within the optimal range, obtaining a cut surface that meets the requirements.

[0004] In dynamic laser beam technology, the oscillation rate of the galvanometer affects the movement rate of the laser spot, which is one of the key factors influencing cutting efficiency. Currently, the industry commonly increases the oscillation rate of the galvanometer by increasing the output power of the motor or adjusting the three-dimensional dynamic trajectory of the laser spot. However, increasing the output power of the motor can easily lead to increased heat generation in the cutting system and increased structural load; while adjusting the three-dimensional dynamic trajectory of the laser spot relies on algorithm optimization, which is limited by the response speed of the hardware itself, making it difficult to achieve an effective breakthrough in the oscillation rate of the galvanometer. Summary of the Invention

[0005] The purpose of this invention is to provide a laser scanning cutting device that improves the cutting efficiency of the laser scanning cutting device by adjusting the layout of the galvanometer assembly to effectively increase the oscillation rate of the galvanometer.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A laser scanning cutting device, having a first direction, a second direction, and a third direction that are mutually perpendicular, includes:

[0008] The housing is provided with a laser inlet and a laser outlet spaced apart along a first direction;

[0009] A collimating lens is disposed between the laser inlet and the laser outlet to receive the laser beam incident through the laser inlet;

[0010] A focusing lens is disposed between the collimating lens and the laser emission port, and is spaced apart from the collimating lens in the first direction;

[0011] A galvanometer assembly is disposed between the collimating lens and the focusing lens, and the galvanometer assembly includes a first galvanometer and a second galvanometer that cooperate with each other, wherein...

[0012] The first galvanometer is used to receive the laser beam incident along the first direction, and the first galvanometer has a first reflecting surface, which is arranged toward the collimating mirror and has a first tilt angle θ with the optical axis of the collimating mirror, 70°≤θ≤80°;

[0013] The second galvanometer is arranged between the first galvanometer and the collimating lens in the first direction to receive the laser beam reflected by the first galvanometer. The projections of the second galvanometer and the first galvanometer onto the same plane along the second direction are separated from each other, and their projections onto the same plane along the third direction are also separated from each other. Furthermore, the vertical distance between the center of the first galvanometer's mirror and the collimating lens in the first direction is... mm, the vertical distance between the center of the second galvanometer and the collimating mirror in the first direction is mm, 0.4≤ / ≤0.6.

[0014] In some embodiments, the distance between the center of the first galvanometer and the center of the second galvanometer in the first direction is H mm, and the vertical distance between the center of the first galvanometer and the center of the second galvanometer is [missing information]. mm, the vertical distance between the center of the second galvanometer and the focusing lens in the first direction is mm, 0.3≤ ≤0.4.

[0015] In some embodiments, the laser beam incident from the collimating lens to the first galvanometer is used as the first beam, and the shortest distance between the second galvanometer and the first beam in the second direction is S mm, where 45 ≤ S ≤ 65.

[0016] In some embodiments, the projections of the second galvanometer and the first galvanometer on the same plane along the first direction are separated from each other.

[0017] In some embodiments, the housing is provided with a cavity, and the first galvanometer and the second galvanometer are both arranged in the cavity; and the housing is also provided with a first channel and a second channel, both of which connect the cavity to the outside, and the central axis of the first channel is perpendicular to the optical axis of the collimating lens, and the central axis of the second channel extends toward the optical axis of the collimating lens and is inclined to the optical axis of the collimating lens.

[0018] In some embodiments, the first galvanometer and the second galvanometer are respectively connected to a driving member, and a fixing seat is fixedly connected to the outer side of the housing. The fixing seat is provided with a first fixing groove communicating with the first channel or the second channel, and the inner wall contour of the first fixing groove matches the outer peripheral contour of the driving member.

[0019] In some embodiments, the fixing base is detachably connected to a fixing cover, the fixing cover is provided with a second fixing groove that mates with the first fixing groove, the inner wall contour of the second fixing groove matches the outer peripheral contour of the driving member, and the second fixing groove and the first fixing groove mate to form a fixing channel, the driving member passing through the fixing channel.

[0020] In some embodiments, the driving member is provided with a positioning part that protrudes from the outer peripheral wall of the driving member, and also includes a positioning block. The positioning block is provided with a positioning channel through it, and the positioning block is connected to the housing so that the positioning channel communicates with the first channel or the second channel. The positioning part is connected to the positioning block to calibrate the position of the first galvanometer or the second galvanometer in the cavity.

[0021] In some embodiments, the housing is provided with a first receiving cavity, the first receiving cavity is connected to the cavity in the first direction, and the first receiving cavity is provided with a first receiving opening, the first receiving opening connecting the first receiving cavity to the outside of the housing;

[0022] The collimating lens is connected to a first mounting bracket, the outer contour of which is adapted to the inner wall of the first receiving cavity, and the first mounting bracket can enter and exit the first receiving cavity through the first receiving port.

[0023] In some embodiments, the housing is provided with a second receiving cavity, which communicates with the cavity in the first direction; and the housing is connected to a lifting assembly, which is provided with a lifting block that can move up and down in the first direction. The lifting block is connected to a focusing frame located in the second receiving cavity, and the focusing lens is fixed in the focusing frame.

[0024] In some embodiments, a second accommodating cavity is provided inside the housing, and the second accommodating cavity is connected to the cavity in the first direction; and the housing is connected to a connecting seat, the connecting seat is provided with a mounting groove communicating with the second accommodating cavity, and a first protective mirror is provided in the mounting groove; and a temperature sensor is connected to the housing, the temperature sensor being positioned toward the first protective mirror to collect the temperature of the first protective mirror.

[0025] In some embodiments, the connecting seat is provided with an air guide ring, the air guide ring is provided with an ejection channel communicating with the bottom of the mounting groove, and the air guide ring is spaced apart from the inner wall of the connecting seat to form a first air guide channel; the first air guide channel is connected to the ejection channel and to an external air source.

[0026] In some embodiments, the air guide ring has a first end and a second end arranged opposite to each other in the first direction, the first end facing the bottom of the mounting groove and spaced apart from the connecting seat to form an air intake channel, the air intake channel being connected to the first air guide channel.

[0027] In some embodiments, a buffer air ring is provided in the first air guide channel. The buffer air ring is sealed to the connecting seat to separate the first air guide channel. A first air passage is formed between the buffer air ring and the connecting seat, and a second air passage is formed between the buffer air ring and the air guide ring. The buffer air ring is provided with a vent hole that penetrates its side wall and the vent hole connects the first air passage and the second air passage.

[0028] In some embodiments, a pressure sensor is connected to the connector, and the pressure sensor is connected to the first air guide channel to collect the air pressure of the first air guide channel.

[0029] Compared with the prior art, the laser scanning and cutting device of this invention has the following advantages:

[0030] This laser scanning cutting device achieves laser scanning cutting by arranging a galvanometer assembly within the housing, allowing the laser focus to be dynamically adjusted during the laser cutting process. Furthermore, it separates the projections of the second and first galvanometers onto the same plane along a second direction and onto the same plane along a third direction, and limits the first galvanometer's tilt angle to 70°–80°. The vertical distance between the center of the first galvanometer's mirror and the collimating lens along the first direction is also specified. mm, the vertical distance between the center of the second galvanometer and the collimating mirror in the first direction. By controlling the ratio of mm to the first mirror within the range of 0.4 to 0.6, this laser scanning cutting device can avoid interference between the laser beam reflected back and forth in the first direction and the first galvanometer, and reduce the projection distortion of the laser beam on the first galvanometer. It also controls the divergence area of ​​the laser beam at the second galvanometer, further reducing projection distortion on the second galvanometer. This allows the mirror areas of the first and second galvanometers to approach the cross-sectional area of ​​the laser beam. Thus, without changing the motor output power, this laser scanning cutting device can increase the oscillation rate of the first and second galvanometers, thereby reducing the time it takes for the laser focus to move along the predetermined trajectory and improving laser cutting efficiency. Furthermore, by arranging the second galvanometer between the first galvanometer and the collimating lens, this laser scanning cutting device can increase the distance between the second galvanometer and the focusing lens in the first direction. This results in a longer distance between the second galvanometer and the laser focus in the first direction. Within the same action time, the amplitude of the second galvanometer's oscillation allows the laser spot to move a longer distance along the predetermined trajectory, thereby reducing the time it takes for the laser spot to pass through the predetermined trajectory and improving laser cutting efficiency. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the laser scanning and cutting device in an embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the internal optical path of the laser scanning and cutting device in an embodiment of the present invention;

[0033] Figure 3 yes Figure 2 A side view of the structure shown;

[0034] Figure 4 yes Figure 3 The enlarged view of A in the middle shows the first tilt angle θ;

[0035] Figure 5 yes Figure 3 The enlarged view of A shows the perpendicular distance between the center of the first galvanometer and the collimating lens in the first direction. mm, the vertical distance between the center of the second galvanometer and the collimating mirror in the first direction. mm;

[0036] Figure 6 This is a schematic diagram of the housing in an embodiment of the present invention;

[0037] Figure 7 This is a rear view of the housing in an embodiment of the present invention;

[0038] Figure 8 yes Figure 7 Cross-sectional schematic diagram of BB;

[0039] Figure 9 This is a partial structural schematic diagram of the laser scanning and cutting device in an embodiment of the present invention;

[0040] Figure 10 yes Figure 9 A cross-sectional schematic diagram of the structure shown;

[0041] Figure 11 yes Figure 10 Enlarged view of C;

[0042] Figure 12 This is a schematic diagram of the cooperation between the fixing base and the fixing cover in an embodiment of the present invention;

[0043] Figure 13 This is a schematic diagram of the positioning block in an embodiment of the present invention;

[0044] Figure 14 This is a schematic diagram of the cooperation between the first protective mirror inside the connector and the temperature sensor in an embodiment of the present invention;

[0045] Figure 15 This is a schematic diagram of the connector in an embodiment of the present invention;

[0046] Figure 16 yes Figure 15 A cross-sectional schematic diagram of the structure shown;

[0047] Figure 17 yes Figure 14 Top view of the structure shown (temperature sensor omitted);

[0048] Figure 18 yes Figure 17 DD section view;

[0049] Figure 19 yes Figure 18 A magnified view of E in the middle.

[0050] In the figure, 100 is a laser scanning and cutting device; X is the first direction; Y is the second direction; Z is the third direction; 1 is a housing; 1a is a laser inlet; 1b is a laser outlet; 1c is a cavity; 2 is a collimating lens; 3 is a focusing lens; 4 is a galvanometer assembly; 4a is the first galvanometer; 4a1 is the first reflecting surface; 4b is the second galvanometer; 4b1 is the second reflecting surface; 5 is the first channel; 6 is the second channel; 7 is a driving component; 7a is a positioning part; 8 is a fixing base; 9 is the first fixing groove; 10 is a fixing cover; 11 is the second fixing groove; 12 is a fixing channel; 13 is a positioning block; 13a is a positioning channel; 14 is the first receiving cavity; 14a is the first receiving opening; 15 is the first mounting bracket; 16 is the... Two accommodating cavities; 17. Lifting assembly; 17a. Lifting block; 18. Focusing frame; 19. Connecting seat; 19a. Airflow cavity; 19b. Air inlet channel; 20. Mounting slot; 21. First protective mirror; 22. Laser outlet; 23. Temperature sensor; 24. Second protective mirror; 25. Air guide ring; 25a. First end; 25b. Second end; 26. Ejection channel; 27. First air guide channel; 27a. First air passage; 27b. Second air passage; 28. Air inlet nozzle; 29. ​​Air inlet channel; 30. Buffer air ring; 30a. Vent hole; 31. Air pressure sensor; 32. Laser nozzle; 33. Laser beam; 33a. First beam; 33b. Second beam; 33c. Third beam. Detailed Implementation

[0051] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0052] In the description of this invention, it should be understood that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on or indirectly on that other element. When an element is referred to as being "connected to" another element, it can be directly connected to or indirectly connected to that other element. The terms "mounted," "connected," and "attached" should be interpreted broadly, for example, referring to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or a connection within two elements or an interaction between two elements. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0053] In the description of this invention, it should be understood that the terms "height," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," and "outer" used in this invention to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0054] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0055] Example

[0056] This invention provides a laser scanning cutting device 100, which can cut materials along a cutting path using a laser cutting head. In this embodiment, a first direction X is defined as the vertical direction of the laser scanning cutting device 100, and the vertical direction is distinguished by the upper and lower sides of the laser scanning cutting device 100 under normal use; a second direction Y is defined as the front-back direction of the laser scanning cutting device 100, and the side of the laser scanning cutting device 100 facing the user under normal use is the front side, and the opposite side is the rear side; a third direction Z is defined as the left-right direction of the laser scanning cutting device 100, and the left and right sides are distinguished by the direction the user faces the laser scanning cutting device 100.

[0057] refer to Figure 1-5 The laser scanning cutting device 100 includes a housing 1, a collimating lens 2, a focusing lens 3, and a galvanometer assembly 4. The housing 1 is provided with a laser inlet 1a and a laser outlet 1b spaced apart along a first direction X. The collimating lens 2 and the focusing lens 3 are both disposed inside the housing 1. The collimating lens 2 is disposed between the laser inlet 1a and the laser outlet 1b to receive the laser beam 33 incident through the laser inlet 1a. The focusing lens 3 is disposed between the collimating lens 2 and the laser outlet 1b, and is spaced apart from the collimating lens 2 along the first direction X.

[0058] When the laser scanning and cutting device 100 is in use, the laser beam 33 enters the housing 1 from the laser inlet 1a. After being collimated by the collimating lens 2, the laser beam 33 is incident downwards along the first direction X onto the galvanometer assembly 4. After being adjusted by the galvanometer assembly 4, the laser beam 33 is incident downwards along the first direction X onto the focusing lens 3. After being focused by the focusing lens 3, it is emitted from the laser outlet 1b onto the material below. By controlling the operation of the galvanometer assembly 4, the position of the laser beam 33 on the material can be dynamically adjusted during the laser cutting process, realizing dynamic laser scanning and cutting. The specifications of the collimating lens 2 and the focusing lens 3 can be configured according to the power of the laser scanning and cutting device 100, and will not be described in detail here.

[0059] refer to Figure 1-5 The galvanometer assembly 4 includes a first galvanometer 4a and a second galvanometer 4b that cooperate with each other. Both the first galvanometer 4a and the second galvanometer 4b are disposed within the housing 1. The first galvanometer 4a can be a galvanometer for adjusting the X-axis distance. It receives the laser beam 33 incident along the first direction X and reflects the incident laser beam 33 to the second galvanometer 4b, thereby reflecting the laser beam 33 incident downward from the collimating mirror 2 from the first galvanometer 4a to the second galvanometer 4b. The first galvanometer 4a has a first reflecting surface 4a1, which is arranged facing the collimating mirror 2 and has a first tilt angle θ with the optical axis of the collimating mirror 2, where 70°≤θ≤80°. The second galvanometer 4b has a second reflecting surface 4b1. The second galvanometer 4b can be a galvanometer for adjusting the Y-axis distance. It receives the laser beam 33 reflected from the first galvanometer 4a, achieving mutual cooperation with the first galvanometer 4a, and reflects the laser beam 33 to the focusing lens 3. Furthermore, the second galvanometer 4b is arranged in the first direction X between the first galvanometer 4a and the collimating lens 2. The projections of the second galvanometer 4b and the first galvanometer 4a onto the same plane along the second direction Y are separated from each other, and their projections onto the same plane along the third direction Z are also separated from each other. The vertical distance between the center of the mirror surface of the first galvanometer 4a and the collimating lens 2 in the first direction X is... mm, the vertical distance between the center of the second galvanometer 4b and the collimating mirror 2 in the first direction X is mm, then the perpendicular distance between the center of the first galvanometer 4a and the collimating mirror 2 in the first direction X. mm, the vertical distance between the center of the second galvanometer 4b and the collimating mirror 2 in the first direction X mm satisfies:

[0060] 0.4≤ / ≤0.6,······(1)

[0061] The center of the mirror surface of the first galvanometer 4a refers to the geometric center of the first reflecting surface 4a1 of the first galvanometer 4a, and the center of the mirror surface of the second galvanometer 4b refers to the geometric center of the second reflecting surface 4b1 of the second galvanometer 4b.

[0062] For example, the first tilt angle θ can be 70°, 71°, 72°, 73°, 74°, 75°, 76°, 77°, 78°, 79°, 80°, or any angle value between 70° and 80°.

[0063] For example, the vertical distance between the center of the first galvanometer 4a and the collimating mirror 2 in the first direction X mm, the vertical distance between the center of the second galvanometer 4b and the collimating mirror 2 in the first direction X The ratio of mm based on the parametric formula (1) can be 0.4, 0.42, 0.45, 0.48, 0.5, 0.53, 0.56, 0.57, 0.59, 0.6, or any value between 0.4 and 0.6.

[0064] It should be noted that the first galvanometer 4a is used to adjust the X-axis distance, meaning that the laser beam reflected by the first galvanometer 4a can be adjusted to position on the X-axis of the focal plane. The second galvanometer 4b is used to adjust the Y-axis distance, meaning that the laser beam reflected by the second galvanometer 4b can be adjusted to position on the Y-axis of the focal plane.

[0065] Based on the above design, the laser scanning and cutting device 100 can introduce the laser beam 33 emitted from the laser head into the housing 1 through the laser inlet 1a, so that the laser beam 33 enters the collimating lens 2, and after being collimated by the collimating lens 2, it is incident along the first direction X to the first galvanometer 4a, then reflected by the first galvanometer 4a to the second galvanometer 4b, and then reflected by the second galvanometer 4b to the focusing lens 3. After being focused by the focusing lens 3, it is emitted from the laser outlet 1b and exits the housing 1, and is directed towards the material through the laser nozzle 32. Under the drive of the corresponding driving member 7, the first galvanometer 4a can rotate around the first rotating axis to adjust the position of the laser focus on the focal plane X axis, and the second galvanometer 4b can rotate around the second rotating axis to adjust the position of the laser focus on the focal plane Y axis. The first rotating axis is in the same direction as the third direction Z, and the second rotating axis is located in the plane constructed by the first direction X and the second direction Y, inclined to the second direction Y and extending upward.

[0066] It should be noted that, under the action of the galvanometer assembly 4, the laser beam 33 of this laser scanning cutting device 100 will be reflected back and forth in the first direction X. As the first galvanometer 4a rotates around the first axis and the second galvanometer 4b rotates around the second axis, the laser beam passing through the first galvanometer 4a in the first direction X may interfere with the first galvanometer 4a. Therefore, this laser scanning cutting device 100 separates the projections of the second galvanometer 4b and the first galvanometer 4a on the same plane along the second direction Y and on the same plane along the third direction Z. In this way, even if the laser beam reflected from the first galvanometer 4a to the second galvanometer 4b deviates to the edge of the second galvanometer 4b, the laser beam 33 reflected by the second galvanometer 4b will not be interfered with by the first galvanometer 4a when it is incident on the focusing lens 3 in the first direction X. Thus, this laser scanning cutting device 100 can avoid interference between the laser beam 33 reflected back and forth in the first direction X and the first galvanometer 4a.

[0067] It should be noted that during the propagation of the laser beam 33, due to the diffraction effect, the laser beam 33 will inevitably have a certain divergence angle. As the propagation distance of the laser beam 33 increases, the beam diameter of the laser beam 33 will increase. Moreover, when the laser beam 33 is incident on the galvanometer at an angle, the reflection of the laser beam 33 in the sagittal and meridional directions is different, which will cause asymmetrical distortion of the shape of the spot of the laser beam 33 on the galvanometer. Therefore, in order to ensure that the galvanometer can receive the incident laser beam 33, in the existing laser scanning and cutting device, considering the combined area of ​​the spot generated by the incident laser beam 33 and the spot generated by the emitted laser beam 33, the mirror area of ​​the existing galvanometer is at least several times the cross-sectional area of ​​the laser beam 33. For example, when the diameter of the laser beam 33 is 16mm, the mirror size of the current galvanometer is 44mm×40mm. With the increase of the motor output power, this type of galvanometer is prone to breakage and other problems during high-frequency oscillation due to excessive weight and excessive area.

[0068] This laser scanning cutting apparatus 100 limits the first tilt angle of the first galvanometer 4a to 70°–80°, enabling the laser beam 33 to be incident on the first galvanometer 4a almost perpendicularly. This reduces the projection distortion of the laser beam 33 onto the first galvanometer 4a. Thus, without changing the specifications of the collimating mirror 2 (e.g., the diameter of the laser beam 33 remains 16mm), the mirror size of the first galvanometer 4a can be reduced to 32mm × 28mm, thereby reducing the mirror area of ​​the first galvanometer 4a to 50% of existing galvanometers. This significantly reduces the weight and area of ​​the first galvanometer 4a. Furthermore, this laser scanning cutting apparatus 100 sets the vertical distance between the center of the mirror of the first galvanometer 4a and the collimating mirror 2 in the first direction X. The perpendicular distance between the center of the second galvanometer 4b and the collimating mirror 2 in the first direction X The ratio of the two is controlled within the range of 0.4 to 0.6, thereby controlling the divergence area of ​​the laser beam 33 at the second galvanometer 4b, thus reducing the projection distortion of the laser beam 33 on the second galvanometer 4b, and consequently reducing the mirror area of ​​the second galvanometer 4b to 50% of that of the existing galvanometer. In this way, without increasing the output power of the motor, the laser scanning and cutting device 100 can increase the oscillation rate of the first galvanometer 4a and the second galvanometer 4b, and increase the oscillation frequency of the first galvanometer 4a and the second galvanometer 4b to 2000KHz, thereby reducing the time for the laser focus to move along the predetermined trajectory and improving the efficiency of laser cutting.

[0069] Furthermore, by arranging the second galvanometer 4b between the first galvanometer 4a and the collimating lens 2, the laser scanning cutting device 100 can increase the distance between the second galvanometer 4b and the focusing lens 3 in the first direction X compared to existing laser scanning cutting devices where the first galvanometer 4a and the second galvanometer 4b are at similar heights. This results in a longer distance between the second galvanometer 4b and the laser focal point in the first direction X, allowing the second galvanometer 4b to swing for a longer distance along the predetermined trajectory within the same time frame. This reduces the time it takes for the laser spot to travel along the predetermined trajectory and improves the efficiency of laser cutting.

[0070] It is important to note that the first tilt angle θ between the first reflecting surface 4a1 and the optical axis of the collimating mirror 2 not only affects the projection distortion of the laser beam 33 on the first galvanometer 4a, but also affects the propagation direction of the laser beam 33 reflected from the first galvanometer 4a. Taking the laser beam 33 incident from the collimating mirror 2 to the first galvanometer 4a as the first beam 33a and the laser beam 33 reflected from the first galvanometer 4a to the second galvanometer 4b as the second beam 33b, if the first tilt angle θ is too large, the first beam 33a and the second beam 33b are likely to be too close. This not only easily leads to the second beam 33b being reflected back to the collimating mirror 2, but also results in a small gap between the first beam 33a and the second beam 33b, making them prone to mutual thermal interference and affecting the stability of the laser beam 33. If the first tilt angle θ is too small, the laser beam 33 incident from the first galvanometer 4a is less likely to be reflected back to the collimating mirror 2. The projection distortion generated by the first galvanometer 4a will increase, which will require the first galvanometer 4a to be configured with a larger mirror size, thereby increasing the weight and area of ​​the first galvanometer 4a, which is not conducive to the high-speed swing of the first galvanometer 4a. Therefore, the laser scanning cutting device 100 limits the first tilt angle θ between the first reflecting surface 4a1 and the optical axis of the collimating mirror 2 to 70° to 80°. In this way, the projection distortion generated by the laser beam 33 at the first galvanometer 4a can be reduced, and the first beam 33a and the second beam 33b can meet the spacing requirements in a small space, avoiding mutual thermal interference between the first beam 33a and the second beam 33b.

[0071] It should be noted that when the laser beam 33 is incident on the galvanometer assembly 4, it will cause the mirror surfaces of the first galvanometer 4a and the second galvanometer 4b to heat up. If the first galvanometer 4a and the second galvanometer 4b are too close together, they are prone to direct thermal coupling, causing the heat sources generated by the first galvanometer 4a and the second galvanometer 4b to directly radiate and affect each other, thus affecting the stability of the laser beam 33 within the galvanometer assembly 4. If the first galvanometer 4a and the second galvanometer 4b are too far apart, the second galvanometer 4b is too close to the collimating mirror 2, which can easily lead to thermal coupling between the second galvanometer 4b and the collimating mirror 2, causing the heat sources generated by the second galvanometer 4b and the collimating mirror 2 to directly radiate and affect the stability of the laser beam 33 passing through the collimating mirror 2. Therefore, the laser scanning cutting device 100 sets the vertical distance between the center of the mirror surface of the first galvanometer 4a and the collimating mirror 2 in the first direction X. The perpendicular distance between the center of the second galvanometer 4b and the collimating mirror 2 in the first direction X The ratio between the two is controlled within the range of 0.4 to 0.6. In this way, the mutual influence between the first galvanometer 4a and the second galvanometer 4b, and between the second galvanometer 4b and the collimating mirror 2 can be avoided, and the spot area generated by the second beam 33b can be avoided to be too large. This ensures that the second galvanometer 4b and the first galvanometer 4a can adopt the same size specifications, thereby improving the consistency of the control of the laser scanning and cutting device 100.

[0072] In the laser scanning cutting apparatus 100, the laser beam 33 propagates along the collimating mirror 2 → galvanometer assembly 4 → focusing mirror 3, thus forming an optical path within the housing 1. The distance of this optical path is typically much smaller than the Rayleigh length of the collimated laser beam 33 to ensure a flat wavefront curvature of the laser beam 33 incident on the focusing mirror 3. It should be noted that the laser beam 33 propagating in air is easily disturbed by rising hot air currents, causing the laser beam 33 to drift and jitter, affecting its stable incidence on the centers of the first galvanometer 4a and the second galvanometer 4b. Therefore, some laser scanning cutting apparatuses 100 can control the denser areas of the laser beam 33 in the optical path to reduce the generation of rising hot air currents. (Reference) Figure 3-5 As an example of this embodiment, the distance between the center of the mirror surface of the first galvanometer 4a and the center of the mirror surface of the second galvanometer 4b in the first direction X is H mm, and the vertical distance between the center of the mirror surface of the first galvanometer 4a and the collimating mirror 2 in the first direction X is... mm, the vertical distance between the center of the mirror surface of the first galvanometer 4a and the center of the mirror surface of the second galvanometer 4b is mm, the vertical distance between the center of the second galvanometer 4b and the focusing lens in the first direction X is mm, then the above four parameters satisfy:

[0073] 0.3≤ ≤0.4. ······(2)

[0074] For example, the distance H mm between the center of the mirror surface of the first galvanometer 4a and the center of the mirror surface of the second galvanometer 4b in the first direction X, and the perpendicular distance between the center of the mirror surface of the first galvanometer 4a and the collimating mirror 2 in the first direction X. mm, the vertical distance between the center of the mirror surface of the first galvanometer 4a and the center of the mirror surface of the second galvanometer 4b is mm, the vertical distance between the center of the second galvanometer 4b and the focusing lens in the first direction X is The ratio of mm to the four components based on the parametric formula (2) can be 0.3, 0.316, 0.32, 0.34, 0.342, 0.352, 0.36, 0.37, 0.372, 0.38, 0.385, 0.39, 0.4, or any value between 0.3 and 0.4.

[0075] Understandably, in Figure 3-5 In the laser scanning and cutting device 100 shown, the laser beam 33 is refracted back and forth in the first direction X. Taking the laser beam 33 incident from the collimating lens 2 to the first galvanometer 4a as the first beam 33a, the laser beam 33 reflected from the first galvanometer 4a to the second galvanometer 4b as the second beam 33b, and the laser beam 33 reflected from the second galvanometer 4b to the focusing lens 3 as the third beam 33c as an example, the area where the first beam 33a, the second beam 33b, and the third beam 33c are projected and overlapped in the second direction Y between the first galvanometer 4a and the second galvanometer 4b is called the projection overlap area. Within the projection overlap area, the positions of the first beam 33a, the second beam 33b, and the third beam 33c in the second direction Y are close, causing them to easily radiate and influence each other in the projection overlap area, resulting in an increase in the upward airflow of hot air. Therefore, these laser scanning cutting devices 100 can improve the efficiency of laser cutting by adjusting the distance H mm between the mirror center of the first galvanometer 4a and the mirror center of the second galvanometer 4b in the first direction X, and the vertical distance between the mirror center of the first galvanometer 4a and the collimating mirror 2 in the first direction X. mm, the vertical distance between the center of the mirror surface of the first galvanometer 4a and the center of the mirror surface of the second galvanometer 4b mm, the vertical distance between the center of the second galvanometer 4b and the focusing lens in the first direction X. mm satisfies the range of the above parameter formula (2), thereby controlling the proportion of the projection overlap area in the optical path, avoiding the projection overlap area from being too large in the optical path, ensuring the propagation stability of the first beam 33a, the second beam 33b and the third beam 33c, and ensuring that the laser beam 33 can be incident on the center of the mirror surface of the first galvanometer 4a and the second galvanometer 4b.

[0076] exist Figure 4-5 In the laser scanning cutting apparatus 100 shown, the second galvanometer 4b extends toward the first beam 33a in the second direction Y. This may cause interference between the second galvanometer 4b and the first beam 33a, or cause the first beam 33a to be directly affected by the radiation from the heat source generated by the second galvanometer 4b. Therefore, in some laser scanning cutting apparatuses 100, reference... Figure 4-5 As an example of this embodiment, the laser beam 33 incident from the collimating mirror 2 to the first galvanometer 4a is the first beam 33a, and the shortest distance between the second galvanometer 4b and the first beam 33a in the second direction Y is S mm, where 45≤S≤65.

[0077] For example, the shortest distance S between the second galvanometer 4b and the first beam 33a in the second direction Y can be 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, or any value from 45 to 65.

[0078] When measuring the shortest distance S mm between the second galvanometer 4b and the first beam 33a in the second direction Y, a virtual beam can be calculated based on the power, emission angle and focal length of the collimating lens 2 of the laser beam 33. This virtual beam is then used as the target beam for measuring the interval distance S mm. The shortest distance between the second galvanometer 4b and the virtual beam in the second direction Y is calculated and measured. The calculated and measured results are then used as the value of the shortest distance S mm between the second galvanometer 4b and the first beam 33a in the second direction Y.

[0079] By controlling the shortest distance S mm between the second galvanometer 4b and the first beam 33a in the second direction Y, these laser scanning cutting devices 100 can ensure that the interval between the second galvanometer 4b and the first beam 33a meets the propagation requirements of the laser beam 33, avoid interference between the second galvanometer 4b and the first beam 33a, and prevent the first beam 33a from being directly affected by the radiation from the heat source generated by the second galvanometer 4b. It should be noted that the shortest distance S mm between the second galvanometer 4b and the first beam 33a in the second direction Y will also affect the proportion of the projection overlap area in the optical path. If the shortest distance S mm between the second galvanometer 4b and the first beam 33a in the second direction Y is too large, it will increase the proportion of the projection overlap area in the optical path, affecting the propagation stability of the first beam 33a, the second beam 33b, and the third beam 33c. Therefore, the shortest distance S mm between the second galvanometer 4b and the first beam 33a in the second direction Y is suitable to be controlled within the range of 45 to 65.

[0080] The oscillation amplitude of the first galvanometer 4a and the second galvanometer 4b is one of the factors affecting the laser focus adjustment range. As the oscillation amplitude of the first galvanometer 4a and the second galvanometer 4b increases, the distance between them also increases. (Reference) Figure 1-5 In some laser scanning cutting devices 100, the projections of the second galvanometer 4b and the first galvanometer 4a onto the same plane along the first direction X are separated from each other. This ensures that the projections of the first galvanometer 4a and the second galvanometer 4b onto the same plane along the first direction X, the second direction Y, and the third direction Z are all separated from each other, thus preventing interference between the first galvanometer 4a and the second galvanometer 4b in the first direction X, the second direction Y, and the third direction Z. In this way, these laser scanning cutting devices 100 can flexibly adjust the swing amplitude of the first galvanometer 4a and the second galvanometer 4b according to the requirements of the laser cutting process.

[0081] The first galvanometer mirror 4a and the second galvanometer mirror 4b are typically connected to a driving component 7 to drive them to oscillate, thus achieving the oscillating motion. This driving component 7 is usually a galvanometer motor; the continuously operating motor generates heat, forming a relatively stable heat source. To prevent the heat generated by the motor from affecting the propagation of the laser beam 33, the laser scanning and cutting device 100 can arrange the motor outside the housing 1, or at least partially outside the housing 1. Therefore, the housing 1 needs to have a corresponding mounting channel for the motor. (Reference) Figure 6-10 As an example of this embodiment, the housing 1 of the laser scanning cutting device 100 has a cavity 1c, in which the first galvanometer 4a and the second galvanometer 4b are both arranged. The housing 1 also has a first channel 5 and a second channel 6, both of which connect the cavity 1c to the outside for arranging motors that drive the first galvanometer 4a and the second galvanometer 4b to swing. The central axis of the first channel 5 is perpendicular to the optical axis of the collimating mirror 2, allowing the first galvanometer 4a to extend into the cavity 1c via the first channel 5. The central axis of the second channel 6 extends toward and is inclined to the optical axis of the collimating mirror 2, allowing the second galvanometer 4b to extend into the cavity 1c via the second channel 6. The motors utilize the first channel 5 and the second channel 6 to insert their output shafts into the housing 1, while their main structures, such as the stator and rotor, are arranged outside the housing 1, thereby keeping the main heat-generating components of the motor away from the propagation path of the laser beam 33.

[0082] To ensure stable motor connection, refer to Figure 9-12As an example of this embodiment, a fixing seat 8 is fixedly connected to the outer side of the housing 1. The fixing seat 8 is provided with a first fixing groove 9. The inner wall contour of the first fixing groove 9 matches the outer peripheral contour of the driving member 7. In this way, the driving member 7, such as a motor, connected to the first galvanometer 4a and the second galvanometer 4b can be installed in the first fixing groove 9 and supported by the fixing seat 8. Moreover, a fixing cover 10 is detachably connected to the fixing seat 8. The fixing cover 10 is provided with a second fixing groove 11 that matches the first fixing groove 9. The inner wall contour of the second fixing groove 11 matches the outer peripheral contour of the driving member 7, and the second fixing groove 11 and the first fixing groove 9 cooperate to form a fixing channel 12. The fixing channel 12 communicates with the first channel 5 or the second channel 6. The driving member 7 passes through the fixing channel 12, and its power output end extends into the first channel 5 or the second channel 6 to connect to the first galvanometer 4a or the second galvanometer 4b. Under the action of the fixing seat 8 and the fixing cover 10, it is firmly fixed in the fixing channel 12.

[0083] It should be noted that the distance by which the driving component 7 extends into the cavity 1c will affect the shortest distance S between the second galvanometer 4b and the first beam 33a in the second direction Y. To avoid the second galvanometer 4b interfering with the first beam 33a due to assembly errors, in some laser scanning cutting devices 100, reference is made to... Figure 11-13 As an example of this embodiment, a positioning part 7a is provided on the outer periphery of the driving member 7. The positioning part 7a protrudes from the outer peripheral wall of the driving member 7. Furthermore, the laser scanning cutting device 100 also includes a positioning block 13. The positioning block 13 is provided with a positioning channel 13a, and the positioning block 13 is connected to the housing 1, so that the positioning channel 13a communicates with the second channel 6. The positioning part 7a is connected to the positioning block 13 to calibrate the position of the second galvanometer 4b in the cavity 1c. With the cooperation of the positioning part 7a and the positioning block 13, the driving member 7 that abuts against the positioning block 13 can ensure assembly consistency, ensuring that the second galvanometers 4b of the same specifications can receive the second beam 33b and will not interfere with the first beam 33a.

[0084] Of course, in some laser scanning and cutting devices 100, the first galvanometer 4a may also meet the assembly consistency requirements. Therefore, the positioning channel 13a can also be connected to the first channel 5 and connected to the positioning block 13 through the positioning part 7a to calibrate the position of the first galvanometer 4a in the cavity 1c.

[0085] In some laser scanning cutting devices 100, as the parameters of the laser cutting process are adjusted, the focal length of the collimating lens 2 may have different requirements, necessitating the replacement of the collimating lens 2. (Reference) Figure 8 , Figure 10As an example of this embodiment, a first receiving cavity 14 is provided inside the housing 1. The first receiving cavity 14 is connected to the cavity 1c in the first direction X, and the first receiving cavity 14 is provided with a first receiving opening 14a, which connects the first receiving cavity 14 to the outside of the housing 1. The collimating lens 2 is connected to a first mounting bracket 15. The outer contour of the first mounting bracket 15 is adapted to the inner wall of the first receiving cavity 14, and the first mounting bracket 15 can enter and exit the first receiving cavity 14 through the first receiving opening 14a. The first mounting bracket 15 and the first receiving cavity 14 can form a modular assembly. By installing collimating lenses 2 with different focal lengths in the first mounting bracket 15 of the same size, the laser scanning cutting device 100 can quickly adjust the collimating lens 2 configured according to the parameters of the laser process, so that the laser scanning cutting device 100 can be adapted to different laser cutting processes.

[0086] The depth of the laser focal point affects the efficiency of laser cutting; therefore, some laser scanning and cutting devices 100 have the capability to adjust the laser focal point depth. (Reference) Figure 2 , Figure 8 As an example of this embodiment, in some laser scanning cutting devices 100, a second receiving cavity 16 is provided inside the housing 1, and the second receiving cavity 16 is connected to the cavity 1c in the first direction X; and the housing 1 is connected to a lifting assembly 17, which is provided with a lifting block 17a that can move up and down along the first direction X. The lifting block 17a is connected to a focusing frame 18 located in the second receiving cavity 16, and the focusing lens 3 is fixed in the focusing frame 18. The lifting assembly 17 can adopt a transmission structure such as a motor with lead screw drive, cylinder, or hydraulic cylinder to drive the lifting block 17a to move up and down along the first direction X. As the lifting block 17a moves along the first direction X, the distance between the focusing lens 3 and the material in the first direction X also changes. In this way, the position of the laser focus on the material in the first direction X will change as the lifting block 17a moves along the first direction X, thereby enabling these laser scanning cutting devices 100 to have the function of adjusting the laser focus position in the first direction X.

[0087] In some laser scanning cutting devices 100, protective mirrors are installed to prevent waste generated during the cutting process from entering the housing 1, thereby protecting the optical components inside the housing 1, such as the focusing lens 3, the first galvanometer 4a, the second galvanometer 4b, and the collimating lens 2. Over prolonged use, the protective mirrors are easily contaminated by waste and dust, leading to increased energy loss of the laser beam 33. The laser scanning cutting device 100 can monitor the contamination status of the mirrors in real time to avoid affecting the cutting quality. For example, refer to... Figure 2 , Figure 3 , Figure 10 , Figure 14As an example of this embodiment, in a partial laser scanning and cutting device 100, the housing 1 is connected to a connecting seat 19, the connecting seat 19 is provided with a mounting groove 20 communicating with the second accommodating cavity 16, the mounting groove 20 is provided with a first protective mirror 21, and the bottom of the mounting groove 20 is provided with a laser outlet 22; and a temperature sensor 23 is connected to the housing 1, the temperature sensor 23 is positioned toward the first protective mirror 21 to collect the temperature of the first protective mirror 21.

[0088] Understandably, the laser beam 33 loses some energy when passing through the first protective mirror 21, and some of this lost energy is converted into heat, causing the temperature of the first protective mirror 21 to rise. When the first protective mirror 21 is contaminated with waste residue or dust, the energy lost by the laser beam 33 as it passes through the first protective mirror 21 will increase, and the temperature rise of the first protective mirror 21 will be greater. Therefore, by setting a temperature sensor 23 on the housing 1 to collect the temperature of the first protective mirror 21, and by replacing the first protective mirror 21 in a timely manner when the collected temperature exceeds the preset temperature threshold of the first protective mirror 21, the contamination of the mirror can be effectively monitored, and the contamination of the first protective mirror 21 can be prevented from affecting the cutting quality.

[0089] Of course, based on the protection requirements of the laser scanning and cutting device 100, refer to Figure 10 Some laser scanning and cutting devices 100 may have a second protective mirror 24 installed above the first protective mirror 21 to improve the protection effect on the laser emission port 1b.

[0090] Laser cutting generates a large amount of waste residue, which accumulates near the cutting area and can easily affect the direct contact between the laser beam 33 and the material. Furthermore, laser cutting causes the laser nozzle 32 to heat up. Therefore, the laser scanning and cutting device 100 typically introduces cooling gas to blow away the waste residue and cool the laser nozzle 32. (Reference) Figure 14-19 As an example of this embodiment, a guide ring 25 is provided inside the connecting seat 19, and an outlet channel 26 communicating with the bottom of the mounting groove 20 is provided inside the guide ring 25. Furthermore, the guide ring 25 is spaced apart from the inner wall of the connecting seat 19 and forms a first guide channel 27. The first guide channel 27 is connected to the outlet channel 26 and is connected to an external air source.

[0091] As an example of setting an air guide ring 25 inside the connector 19, see [reference] Figure 14-19The connecting seat 19 is provided with an airflow cavity 19a and an air inlet channel 19b, which connects the airflow cavity 19a and the outside of the connecting seat 19, thereby enabling the airflow cavity 19a to communicate with the outside of the connecting seat 19. A guide ring 25 is arranged in the airflow cavity 19a, connecting the first guide channel 27 with the air inlet channel 19b. Airflow from an external air source is guided into the air inlet channel 19b via the air inlet nozzle 28, and then enters the emission channel 26 via the first guide channel 27, flowing in the same direction as the laser beam 33 towards the laser nozzle 32, thereby blowing away waste and cooling the laser nozzle 32.

[0092] The first gas guide channel 27 is connected to the ejection channel 26, which can be achieved by setting a channel within the gas guide ring 25 or by the gas guide ring 25 and the connecting seat 19 cooperating with each other. (Reference) Figure 14-19 As an example of this embodiment, the air guide ring 25 has a first end 25a and a second end 25b arranged opposite to each other in the first direction X. The first end 25a faces the bottom of the mounting groove 20 and is spaced apart from the connecting seat 19 to form an air intake channel 29. The air intake channel 29 is connected to the first air guide channel 27. In this way, the airflow entering the first air guide channel 27 through the air intake channel 19b will flow to the air intake channel 29 under the guidance of the air guide ring 25, and enter the emission channel 26 through the air intake channel 29. This allows the airflow to flow in the same direction as the laser beam 33 to the laser nozzle 32 in the emission channel 26, thus avoiding the airflow from affecting the propagation of the laser beam 33.

[0093] Some laser scanning and cutting devices 100 also incorporate buffer structures in the gas path to prevent airflow from directly impacting the guide ring 25 and causing airflow turbulence. For example, see reference... Figure 14-19 As an example of this embodiment, a buffer air ring 30 is provided in the first air guide channel 27. The buffer air ring 30 is sealed to the connecting seat 19 to separate the first air guide channel 27. A first air passage 27a is formed between the buffer air ring 30 and the connecting seat 19, and a second air passage 27b is formed between the buffer air ring 30 and the air guide ring 25. The buffer air ring 30 is provided with a vent hole 30a that penetrates its side wall and connects the first air passage 27a and the second air passage 27b.

[0094] By setting a buffer ring 30 within the first air guide channel 27, the airflow entering the first air guide channel 27 is blocked by the buffer ring 30, slowing down its flow velocity. The airflow then enters the second air passage 27b between the buffer ring 30 and the air guide ring 25 through the vent 30a, and flows to the inlet air passage 29 under the guidance of the air guide ring 25, and then enters the outlet air passage 26 through the inlet air passage 29. The number of vents 30a can be configured according to the airflow velocity. Multiple vents 30a are arranged circumferentially along the buffer ring 30 to ensure that the airflow enters the second air passage 27b relatively evenly.

[0095] Of course, the laser scanning and cutting device 100 can also monitor the air pressure in real time to avoid affecting the cutting quality. For example, refer to... Figure 14-19 As an example of this embodiment, in some laser scanning cutting devices 100, a pressure sensor 31 is connected to the connecting base 19. The pressure sensor 31 is connected to the first air guide channel 27 to collect the air pressure in the first air guide channel 27. By feeding back the air pressure in the first air guide channel 27 through the pressure sensor 31, the laser scanning cutting device 100 can effectively monitor the internal air pressure environment and avoid abnormal airflow affecting the cutting quality.

[0096] In summary, the laser scanning cutting device 100 provided in this embodiment of the invention achieves laser scanning cutting by arranging a galvanometer assembly 4 inside the housing 1, enabling the laser focus to be dynamically adjusted during the laser cutting process. Furthermore, by separating the projections of the second galvanometer 4b and the first galvanometer 4a onto the same plane along the second direction Y, and separating their projections onto the same plane along the third direction Z, and by limiting the first tilt angle of the first galvanometer 4a to 70°–80°, and by setting the vertical distance between the center of the mirror surface of the first galvanometer 4a and the collimating mirror 2 along the first direction X, the device achieves laser scanning cutting. mm, the vertical distance between the center of the second galvanometer 4b and the collimating mirror 2 in the first direction X By controlling the ratio of the two (mm) within the range of 0.4 to 0.6, this laser scanning cutting device 100 can avoid interference between the laser beam 33 reflected back and forth in the first direction X and the first galvanometer 4a, and reduce the incident angle of the laser beam 33 on the first galvanometer 4a, thereby reducing the projection distortion of the laser beam 33 on the first galvanometer 4a. Furthermore, it controls the divergence area of ​​the laser beam 33 at the second galvanometer 4b, reducing the projection distortion of the laser beam 33 on the second galvanometer 4b. This allows the mirror areas of the first galvanometer 4a and the second galvanometer 4b to approach the cross-sectional area of ​​the laser beam 33. In this way, without changing the motor output power, this laser scanning cutting device can achieve high efficiency. The device 100 can increase the swing rate of the first galvanometer 4a and the second galvanometer 4b, thereby reducing the time for the laser spot to move along the predetermined trajectory and improving the efficiency of laser cutting. Furthermore, by arranging the second galvanometer 4b between the first galvanometer 4a and the collimating lens 2, the laser scanning cutting device 100 can increase the distance between the second galvanometer 4b and the focusing lens 3 in the first direction X. As a result, the distance between the second galvanometer 4b and the laser spot in the first direction X is longer. In the same action time, the swing amplitude of the second galvanometer can make the laser spot move a longer distance along the predetermined trajectory, thereby reducing the time for the laser spot to pass through the predetermined trajectory and improving the efficiency of laser cutting.

[0097] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make several improvements and substitutions without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A laser scanning cutting device, having a first direction, a second direction, and a third direction that are mutually perpendicular to each other, comprising: The housing is provided with a laser inlet and a laser outlet spaced apart along a first direction; A collimating lens is disposed between the laser inlet and the laser outlet to receive the laser beam incident through the laser inlet; A focusing lens is disposed between the collimating lens and the laser emission port, and is spaced apart from the collimating lens in the first direction; The laser scanning and cutting device is characterized in that it further includes: A galvanometer assembly is disposed between the collimating lens and the focusing lens, and the galvanometer assembly includes a first galvanometer and a second galvanometer that cooperate with each other, wherein... The first galvanometer rotates about a first axis to receive a laser beam incident along the first direction. The first galvanometer has a first reflective surface, which is arranged facing the collimating mirror and has a first tilt angle θ with the optical axis of the collimating mirror, where 70°≤θ≤80°. The second galvanometer is positioned between the first galvanometer and the collimating lens in the first direction. It rotates about a second axis and is used to receive the laser beam reflected by the first galvanometer. The projections of the second galvanometer and the first galvanometer onto the same plane along the second direction are separated from each other, and their projections onto the same plane along the third direction are also separated from each other. Furthermore, the vertical distance between the center of the first galvanometer's mirror and the collimating lens in the first direction is... mm, the vertical distance between the center of the second galvanometer and the collimating mirror in the first direction is mm, 0.4≤ / ≤0.6, and the distance between the center of the first galvanometer and the center of the second galvanometer in the first direction is H mm, and the vertical distance between the center of the first galvanometer and the center of the second galvanometer is... mm, the vertical distance between the center of the second galvanometer and the focusing lens in the first direction is mm, 0.3≤ ≤0.4, The first rotating shaft is aligned with the third direction, while the second rotating shaft is arranged in the plane formed by the first and second directions, inclined to the second direction and extending upward.

2. The laser scanning and cutting device according to claim 1, characterized in that, The laser beam incident from the collimating lens to the first galvanometer is taken as the first beam, and the shortest distance between the second galvanometer and the first beam in the second direction is S mm, where 45≤S≤65.

3. The laser scanning and cutting device according to claim 1, characterized in that, The projections of the second galvanometer and the first galvanometer on the same plane along the first direction are separated from each other.

4. The laser scanning and cutting device according to claim 1, characterized in that, The housing has a cavity, and the first galvanometer and the second galvanometer are both arranged in the cavity. The housing also has a first channel and a second channel, which connect the cavity to the outside. The central axis of the first channel is perpendicular to the optical axis of the collimating mirror, and the central axis of the second channel extends toward the optical axis of the collimating mirror and is inclined to the optical axis of the collimating mirror.

5. The laser scanning and cutting device according to claim 4, characterized in that, The first galvanometer and the second galvanometer are respectively connected to a driving component, and a fixing seat is fixedly connected to the outer side of the housing. The fixing seat is provided with a first fixing groove communicating with the first channel or the second channel. The inner wall contour of the first fixing groove matches the outer peripheral contour of the driving component.

6. The laser scanning and cutting device according to claim 5, characterized in that, The fixing base is detachably connected to a fixing cover. The fixing cover is provided with a second fixing groove that cooperates with the first fixing groove. The inner wall contour of the second fixing groove matches the outer peripheral contour of the driving member. The second fixing groove and the first fixing groove cooperate to form a fixing channel, and the driving member passes through the fixing channel.

7. The laser scanning and cutting device according to claim 5, characterized in that, The driving component is provided with a positioning part, which protrudes from the outer peripheral wall of the driving component, and also includes a positioning block. The positioning block is provided with a positioning channel through it, and the positioning block is connected to the housing so that the positioning channel communicates with the first channel or the second channel. The positioning part is connected to the positioning block to calibrate the position of the first galvanometer or the second galvanometer in the cavity.

8. The laser scanning and cutting device according to claim 4, characterized in that, The housing has a first receiving cavity, which is connected to the cavity in the first direction. The first receiving cavity has a first receiving opening, which connects the first receiving cavity to the outside of the housing. The collimating lens is connected to a first mounting bracket, the outer contour of which is adapted to the inner wall of the first receiving cavity, and the first mounting bracket can enter and exit the first receiving cavity through the first receiving port.

9. The laser scanning and cutting device according to claim 4, characterized in that, The housing is provided with a second accommodating cavity, which is connected to the cavity in the first direction; and the housing is connected to a lifting assembly, which is provided with a lifting block that can move up and down in the first direction. The lifting block is connected to a focusing frame located in the second accommodating cavity, and the focusing lens is fixed in the focusing frame.

10. The laser scanning and cutting device according to claim 4, characterized in that, The housing has a second accommodating cavity, which communicates with the cavity in the first direction; the housing is connected to a connecting seat, which has a mounting groove communicating with the second accommodating cavity, and a first protective mirror is disposed in the mounting groove; and a temperature sensor is connected to the housing, which is positioned toward the first protective mirror to collect the temperature of the first protective mirror.

11. The laser scanning and cutting apparatus according to claim 10, characterized in that, The connecting seat is provided with an air guide ring, and the air guide ring is provided with an outlet channel communicating with the bottom of the mounting groove. Furthermore, the air guide ring is spaced apart from the inner wall of the connecting seat, forming a first air guide channel. The first air guide channel is connected to the outlet channel and is also connected to an external air source.

12. The laser scanning and cutting apparatus according to claim 11, characterized in that, The air guide ring has a first end and a second end arranged opposite to each other in the first direction. The first end faces the bottom of the mounting groove and is spaced apart from the connecting seat to form an air intake channel. The air intake channel is connected to the first air guide channel.

13. The laser scanning and cutting apparatus according to claim 11, characterized in that, A buffer air ring is provided in the first air guide channel. The buffer air ring is sealed to the connecting seat to separate the first air guide channel. A first air passage is formed between the buffer air ring and the connecting seat, and a second air passage is formed between the buffer air ring and the air guide ring. The buffer air ring is provided with a vent hole that penetrates its side wall. The vent hole connects the first air passage and the second air passage.

14. The laser scanning and cutting apparatus according to claim 11, characterized in that, A pressure sensor is connected to the connector, and the pressure sensor is connected to the first air guide channel to collect the air pressure of the first air guide channel.

Images