Device and method for supplying grinding fluid in semiconductor production process

Abstract

The invention relates to the technical field of semiconductor processing, in particular to a device and method for supplying grinding fluid in the semiconductor production process, comprising a supply device and a stock solution barrel arranged in the supply device, and further comprising a fluid inlet pipe, one end of which fixedly penetrates through the side wall of the stock solution barrel, the inner part of which is inclined downwards, and the other end of which is connected with a production device, grinding fluid is conveyed; one end of the gas pipe is communicated with the liquid inlet pipe, and the other end of the gas pipe is connected with the nitrogen generation device; the flow guide plate is obliquely and fixedly mounted in the stock solution barrel, and a notch is formed in the flow guide plate; one end of the air duct extends into the notch, and the other end is connected with the air pipe; and the flow guide assembly is arranged on the flow guide plate and used for preventing the grinding fluid from splashing. According to the supply device, the flow guide assembly drives the rotating fan blades to rotate, columnar liquid flow can be cut into uniform thin-layer liquid films, and the problem of bubble retention caused by liquid flow concentration of a flow guide plate is solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a device and method for supplying polishing slurry in the semiconductor manufacturing process. Background Technology

[0002] In the semiconductor manufacturing industry, polishing slurries (such as chemical mechanical polishing slurries) are core consumables. Their purity and recovery rate directly affect wafer processing yield and production costs. During the chemical supply process, occasional work such as replacing parts is required. During the replacement process, residual liquid in the pipelines and equipment is discharged into the waste liquid recovery tank, resulting in waste of raw materials and an increase in hazardous waste treatment costs. Therefore, nitrogen gas is connected to the reserved valve in the supply pipeline. When it is necessary to drain the liquid, first open the drain valve leading to the raw material tank, and then open the purging valve connected to the nitrogen gas to purge the liquid back to the raw material tank through nitrogen gas, so as to achieve reuse.

[0003] Nitrogen-purged polishing slurry, ejected from the inlet, possesses strong impact kinetic energy. If it falls directly into the raw slurry tank, it is prone to splashing and spreading in all directions. Typically, an inclined guide plate is installed inside the raw slurry tank. This inclined guide plate can collect residual slurry, constraining its movement direction to a unidirectional trajectory along the inclined surface, ensuring that the residual slurry eventually flows into the collection area at the bottom of the tank, reducing recovery losses caused by irregular diffusion. However, the polishing slurry carried by nitrogen purging contains a large number of tiny air bubbles. The guide plate can only achieve simple gas-liquid separation by gravity and cannot effectively break up the tiny air bubbles. When residual air bubbles fall into the collection area along with the polishing slurry, it will cause a decrease in the uniformity of the polishing slurry. When it is reused for wafer polishing, it is easy to cause defects such as scratches and bumps on the wafer surface, reducing product yield. Summary of the Invention

[0004] Therefore, it is necessary to provide a grinding slurry supply device for semiconductor manufacturing processes that reduces the number of air bubbles in the grinding slurry, in order to address the above-mentioned technical problems.

[0005] The present invention provides a slurry supply device for use in semiconductor manufacturing processes, comprising a supply device and a raw slurry tank disposed inside the supply device, and further comprising: The inlet pipe has one end fixed through the side wall of the raw liquid tank, with the inner part of the tank tilted downwards, and the other end connected to the production equipment for conveying the grinding liquid. The gas tube is in the form of a three-way tube, with one end connected to the liquid inlet tube and the other end connected to the nitrogen generating device; A guide plate is installed at an angle inside the original liquid tank, and a slot is opened inside it; The air duct extends into the slot at one end and is connected to the air pipe at the other end. A flow guide assembly, provided on the flow guide plate, is used to prevent the polishing fluid from splashing.

[0006] In one embodiment, the flow guiding assembly includes a rotating shaft, one end of which extends through the upper surface of the flow guiding plate and the other end is located inside the slot. A rotating fan blade is fixedly sleeved on the outer side of the other end of the rotating shaft, and the bottom of the rotating fan blade is movably attached to the surface of the flow guiding plate.

[0007] In one embodiment, the blades of the rotating fan are designed to be arc-shaped.

[0008] In one embodiment, a wind guide shroud is fixedly provided on the inner wall of the slot, the wind guide shroud is sleeved on the outside of the rotating shaft, the air duct is connected to the inside of the wind guide shroud, and turbine blades are fixedly sleeved on the outside of the part of the rotating shaft located inside the wind guide shroud.

[0009] In one embodiment, multiple guide grooves are arranged in a horizontal linear array at a position slightly below the upper surface of the guide plate.

[0010] In one embodiment, the guide plate is horizontally linearly arrayed with multiple rotating cylinders located above the rotating fan blades. One end of each rotating cylinder movably penetrates the upper surface of the guide plate, and the other end is rotatably connected to the inner wall of the slot. Multiple sharp teeth are movably arrayed in a ring on the outer side of the rotating cylinder.

[0011] In one embodiment, the plurality of rotating cylinders are connected by a first belt drive.

[0012] In one embodiment, one of the centrally located rotating cylinders is connected to the rotating shaft via a second belt drive.

[0013] In one embodiment, a fixed rod is movably disposed inside the rotating cylinder. One end of the fixed rod is fixedly inserted through the guide plate, and the other end is fixedly connected to the inner wall of the slot. An arc-shaped plate is fixedly sleeved on the outside of the fixed rod, and the sharp teeth located on the inner side of the rotating cylinder are slidably embedded in the surface of the arc-shaped plate.

[0014] In one embodiment, an air outlet pipe is fixedly installed through one side of the guide plate, the air outlet pipe is interconnected with the inside of the slot, and the other end of the air outlet pipe is fixedly installed through the raw liquid tank.

[0015] In one embodiment, the rotating fan blades are made of a highly clean, corrosion-resistant, and low-friction material.

[0016] In one embodiment, a supply method includes the following steps: S1, nitrogen gas is blown into the trachea to blow the grinding fluid in the inlet pipe onto the guide plate; S2, the rotating shaft drives the rotating fan blades to rotate, and the rotating fan blades come into contact with the grinding fluid that slides down the surface of the guide plate during the rotation process; S3, the rotation of the shaft drives the rotating drum and the sharp teeth to rotate via the second belt; S4, through the action of the first belt, multiple rotating drums rotate synchronously together; S5, through the cooperation of the pointed teeth and the arc plate, drives the pointed teeth to move laterally back and forth relative to the rotating cylinder.

[0017] The aforementioned device and method for supplying polishing slurry in semiconductor manufacturing processes utilizes a flow guiding component to drive rotating fan blades. This process cuts the columnar liquid flow into a uniform thin film, fully exposing the previously encapsulated microbubbles to the surface of the liquid flow. This significantly reduces the adhesion between the bubbles and the liquid flow, creating conditions for the bubbles to float and solving the problem of bubble retention caused by concentrated liquid flow on the flow guide plate. The curved surface of the arc-shaped flow guide channel is aligned with the direction of liquid flow, constraining the liquid film dispersed by the rotating fan blades into a stable thin stream flowing along the channel, thus preventing secondary entrainment of bubbles at the source. The sharp teeth perform a transverse (perpendicular to the direction of liquid flow) reciprocating motion while rotating, actively piercing bubbles in the residual liquid. The sharp teeth's tip stress punctures the microbubbles, and the combination of these two methods covers different areas of the residual liquid, achieving multi-dimensional fragmentation through "rotational shearing + reciprocating puncture." The bubble fragmentation efficiency is improved compared to a single rotating structure. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the raw liquid tank in this invention; Figure 3 This is a schematic diagram of the internal structure of the raw material tank in this invention; Figure 4 This is a schematic diagram of the flow guide plate in this invention; Figure 5 This is a schematic diagram of the slot structure in this invention; Figure 6 This is a schematic diagram of the air outlet duct in this invention; Figure 7 This is a schematic diagram of the internal structure of the guide plate in this invention; Figure 8 This is a schematic diagram of the worm gear blade in this invention; Figure 9 This is a schematic diagram of the arc-shaped plate in this invention.

[0020] Figure label: 1. Supply equipment; 2. Raw material tank; 3. Inlet pipe; 4. Air pipe; 5. Guide plate; 51. Groove; 52. Guide groove; 6. Air duct; 7. Guide assembly; 71. Shaft; 72. Rotating fan blade; 73. Air guide cover; 74. Turbine blade; 8. Rotating cylinder; 9. Pointed teeth; 10. First belt; 11. Second belt; 12. Fixing rod; 13. Arc plate; 14. Air outlet pipe. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this specification are for illustrative purposes only and do not represent the only possible implementation.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0026] The following is combined Figures 1-9 This invention describes a device and method for supplying polishing slurry in semiconductor manufacturing processes.

[0027] like Figures 1-8 As shown, in one embodiment, a supply device for polishing slurry in semiconductor manufacturing includes a supply device 1 and a raw slurry tank 2 disposed inside the supply device 1, and further includes: The liquid inlet pipe 3 has one end fixedly penetrating through the side wall of the raw liquid tank 2, with the inner part of the tank tilted downwards, and the other end connected to the production equipment for conveying the grinding liquid. The gas pipe 4 is in the form of a three-way pipe, with one end connected to the liquid inlet pipe 3 and the other end connected to the nitrogen generating device; The guide plate 5 is inclinedly and fixedly installed inside the original liquid tank 2, and a slot 51 is opened inside it; The air duct 6 extends into the slot 51 at one end and is connected to the air pipe 4 at the other end. The flow guiding component 7 is provided on the flow guiding plate 5 to prevent the polishing fluid from splashing.

[0028] Specifically, during normal operation, the production equipment draws grinding fluid from the raw material tank 2 inside the supply equipment 1 through the inlet pipe 3. At this time, the air pipe 4 is closed through the valve. When it is necessary to replace the parts of the production equipment, the valve between the inlet pipe 3 and the production equipment side is closed, and the valve connected to the end of the air pipe 4 and the inlet pipe 3 is opened. Nitrogen gas is then introduced into the inlet pipe 3 through the air pipe 4. The nitrogen gas blows the residual grinding fluid in the inlet pipe 3 onto the guide plate 5 set in the raw material tank 2. When the introduced nitrogen gas blows the residual liquid, the high-speed airflow will "entrain" some nitrogen gas into the residual liquid, forming a diameter of 10-100μm. Tiny bubbles, evenly dispersed in the residual liquid, are inert gas bubbles (nitrogen). They themselves do not cause chemical pollution, but they can negatively affect the recycling and reuse of semiconductor polishing slurry. The residual liquid, mixed with bubbles, moves downward along the guide plate 5. At the same time, the valve on one side of the air pipe 4 and the air duct 6 is also opened, and nitrogen enters the slot 51 of the guide plate 5 through the air duct 6. The airflow formed by this nitrogen filling serves as the power source for the operation of the guide component 7. Because the original liquid tank 2 needs to be kept closed to avoid external pollution sources from contaminating the polishing slurry, motors, hydraulic rods, and other drive sources cannot be used. The residual liquid purged by nitrogen easily forms a concentrated columnar liquid flow on the guide plate 5, and the tiny bubbles are wrapped inside the liquid flow. It is difficult to break through the enveloping force of the liquid flow by gravity alone. When the flow guiding component 7 is working, it can cut the columnar liquid flow into a uniform thin liquid film, so that the originally wrapped tiny bubbles are fully exposed on the surface of the liquid flow, greatly reducing the adhesion between the bubbles and the liquid flow, creating conditions for the bubbles to float, and solving the problem of bubble retention caused by the concentrated liquid flow of the flow guiding plate 5.

[0029] See Figures 4-5 and Figures 7-8 As shown, in this embodiment, the flow guiding component 7 includes a rotating shaft 71. One end of the rotating shaft 71 extends through the upper surface of the flow guiding plate 5, and the other end is located inside the slot 51. A rotating fan blade 72 is fixedly sleeved on the outer side of the other end of the rotating shaft 71. The bottom of the rotating fan blade 72 is movably attached to the surface of the flow guiding plate 5.

[0030] Specifically, the rotation of the shaft 71 drives the rotating fan blade 72 to rotate. The rotating fan blade 72 rotates in contact with the surface of the guide plate 5. The gap between the edge of the rotating fan blade 72 and the surface of the guide plate 5 is ≤0.2mm. When the residual liquid flows through this gap, it will be subjected to continuous shear force by the rotation of the fan blade. For microbubbles with a diameter of 10-100μm, this shear force can directly tear the liquid film structure of the bubble, breaking it into smaller gas nuclei. These gas nuclei will quickly converge into large bubbles that are easy to float. The guide plate 5 cannot provide this kind of active breaking force by gravity alone, and the microbubbles are easy to fall with the liquid flow. Secondly, when the rotating fan blade 72 rotates, it can cut the columnar liquid flow into a uniform thin liquid film, so that the originally wrapped microbubbles are fully exposed on the surface of the liquid flow, which greatly reduces the adhesion between the bubbles and the liquid flow, creates conditions for the bubbles to float, and solves the problem of bubble retention caused by the concentration of liquid flow in the guide plate 5.

[0031] See Figure 7 As shown, in this embodiment, the blade shape of the rotating fan blade 72 is designed to be arc-shaped.

[0032] Specifically, the curved surface of the arc-shaped fan blades is aligned with the inclined surface of the guide plate 5. When the residual liquid flows through the rotating fan blades 72, it spreads into a uniform thin film along the arc-shaped surface, rather than forming dispersed droplets or columnar liquid flows on the flat fan blades. This liquid film morphology allows the tiny bubbles that were originally encased inside the liquid flow to be fully exposed at the liquid-gas interface, significantly reducing the adhesion between the bubbles and the residual liquid and accelerating the bubbles' escape.

[0033] See Figure 5 and Figures 7-8 As shown, in this embodiment, a wind guide shroud 73 is fixedly provided on the inner wall of the slot 51. The wind guide shroud 73 is sleeved on the outside of the rotating shaft 71. The air duct 6 is connected to the inside of the wind guide shroud 73. Turbine blades 74 are fixedly sleeved on the outside of the part of the rotating shaft 71 located inside the wind guide shroud 73.

[0034] Specifically, the nitrogen gas flow entering the slot 51 through the air duct 6 is driven by the wind-gathering effect of the air guide shroud 73 to rotate the turbine blades 74, and the rotating shaft 71 rotates along with it. The rotation of the rotating shaft 71 drives the rotating fan blades 72 to rotate, breaking up the air bubbles mixed in the residual liquid.

[0035] See Figure 6 As shown, in this embodiment, multiple guide grooves 52 are arranged in a horizontal linear array at a lower position on the upper surface of the guide plate 5.

[0036] Specifically, the curved surface of the arc-shaped guide channel 52 is aligned with the direction of liquid flow, which can constrain the liquid film dispersed by the rotating fan blades 72 into a stable thin stream flowing along the channel, preventing the liquid flow from spreading and generating turbulence on the flat plate surface. Turbulence is the main cause of the re-mixing of floated air bubbles into the liquid flow. The arc-shaped channel, by stabilizing the liquid flow pattern, eliminates the secondary entrainment of air bubbles at the source.

[0037] See Figures 4-9 As shown, in this embodiment, the guide plate 5 is located above the rotating fan blade 72 and has multiple rotating cylinders 8 mounted in a horizontal linear array. One end of each rotating cylinder 8 extends through the upper surface of the guide plate 5 and is rotatably connected to the inner wall of the slot 51. Multiple sharp teeth 9 are mounted in a ring array on the outer side of the rotating cylinder 8.

[0038] Specifically, the rotation of the rotating cylinder 8 will drive multiple sharp teeth 9 to rotate synchronously, forming an annular shear force on the residual liquid, which can break up the clustered bubbles into smaller bubbles; secondly, the multiple sharp teeth 9 in the annular array can form a continuous breaking zone when the rotating cylinder 8 rotates. When the residual liquid flows through, it will be repeatedly acted by multiple sets of sharp teeth 9, preventing bubbles from "leaking" through the breaking structure, which is especially suitable for situations where bubbles are unevenly distributed in high-viscosity residual liquids.

[0039] See Figure 7 and Figure 8 As shown, in this embodiment, the plurality of rotating cylinders 8 are connected by a first belt 10.

[0040] Specifically, the rotation of one of the rotating cylinders 8 can be achieved by the action of the first belt 10, which enables the other rotating cylinders 8 to rotate synchronously together.

[0041] See Figure 7 and Figure 8 As shown, in this embodiment, one of the centrally located rotating cylinders 8 is connected to the rotating shaft 71 via a second belt 11.

[0042] Specifically, the rotation of the rotating shaft 71 drives one of the rotating drums 8 to rotate through the action of the second belt 11. The rotation of the rotating drum 8 drives multiple rotating drums 8 to rotate synchronously through the action of the first belt 10, which can realize the synchronous rotation of multiple sets of sharp teeth 9, resulting in a better effect on breaking up bubbles.

[0043] See Figures 7-9 As shown, in this embodiment, a fixed rod 12 is movably arranged inside the rotating cylinder 8. One end of the fixed rod 12 is fixedly inserted through the guide plate 5, and the other end is fixedly connected to the inner wall of the slot 51. An arc-shaped plate 13 is fixedly sleeved on the outside of the fixed rod 12. The sharp teeth 9 located on the inner side of the rotating cylinder 8 are slidably embedded in the surface of the arc-shaped plate 13.

[0044] Specifically, during the rotation of the rotating cylinder 8, the fixed rod 12 remains stationary, while one side of the pointed tooth 9 rotates around the arc plate 13. During its revolution, the pointed tooth 9 moves laterally back and forth relative to the rotating cylinder 8. While rotating, the pointed tooth 9 performs a lateral (perpendicular to the direction of liquid flow) reciprocating motion, which can actively pierce the bubbles in the residual liquid. The stress at the tip of the pointed tooth 9 is used to pierce the tiny bubbles. The combination of the two can cover different areas of the residual liquid, achieving multi-dimensional crushing of "rotational shearing + reciprocating piercing". The bubble crushing efficiency is improved compared to a single rotating structure.

[0045] See Figure 6 As shown, in this embodiment, an air outlet pipe 14 is fixedly installed through one side of the guide plate 5. The air outlet pipe 14 is interconnected with the inside of the slot 51, and the other end of the air outlet pipe 14 is fixedly installed through the original liquid tank 2.

[0046] Specifically, the nitrogen gas that enters the slot 51 through the air duct 6 is discharged from the raw liquid tank 2 through the air outlet pipe 14 to avoid mixing with the grinding liquid in the raw liquid tank 2.

[0047] In this embodiment, the rotating fan blade 72 is made of a high-cleanliness, corrosion-resistant, and low-friction material.

[0048] Specifically, semiconductor wafer polishing requires ultra-high purity polishing slurries. Any minute impurities (such as metal ions, plastic debris, and additive leachates) can cause fatal defects such as scratches, pinholes, and bumps on the wafer surface. High-purity materials (such as PFA and silicon nitride ceramics) are chemically stable, free of leachates and wear debris, ensuring that the purity of the polishing slurry is not affected and preventing yield decline due to contamination from the source. Corrosion-resistant materials (such as PFA and alumina ceramics) can withstand long-term corrosion from acids, alkalis, and oxidants, while resisting wear from abrasive particles, ensuring the sharpness and structural integrity of the rotating fan blade 72 edge, maintaining a stable bubble breaking effect, and preventing an increase in bubble residue due to failure of the rotating fan blade 72. Low-friction materials (such as the self-lubricating properties of PFA and the low-friction characteristics of ceramic bearings) can reduce rotational resistance.

[0049] In this embodiment, a supply method includes the following steps: S1, nitrogen gas is blown into the air pipe 4 to blow the grinding fluid in the liquid inlet pipe 3 onto the guide plate 5; S2, the rotating shaft 71 rotates, driving the rotating fan blade 72 to rotate. During the rotation of the rotating fan blade 72, it comes into contact with the grinding fluid that slides down the surface of the guide plate 5. S3, the rotating shaft 71 rotates and drives the rotating cylinder 8 and the sharp tooth 9 to rotate through the second belt 11; S4, through the action of the first belt 10, multiple rotating cylinders 8 rotate synchronously together; S5, through the cooperation of the pointed tooth 9 and the arc plate 13, drives the pointed tooth 9 to move laterally back and forth relative to the rotating cylinder 8.

[0050] Specifically, four exhaust pipes need to be installed above the original liquid tank 2 to facilitate the discharge of nitrogen gas separated from the residual liquid.

[0051] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-described embodiments are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A device for supplying polishing slurry in semiconductor manufacturing processes, comprising a supply unit and a raw slurry tank disposed inside the supply unit, characterized in that, Also includes: The inlet pipe has one end fixed through the side wall of the raw liquid tank, with the inner part of the tank tilted downwards, and the other end connected to the production equipment for conveying the grinding liquid. The gas tube is in the form of a three-way tube, with one end connected to the liquid inlet tube and the other end connected to the nitrogen generating device; A guide plate is installed at an angle inside the original liquid tank, and a slot is opened inside it; The air duct extends into the slot at one end and is connected to the air pipe at the other end. A flow guide assembly, provided on the flow guide plate, is used to prevent the polishing fluid from splashing.

2. The device for supplying polishing slurry in semiconductor manufacturing process according to claim 1, characterized in that, The flow guiding assembly includes a rotating shaft, one end of which movably passes through the upper surface of the flow guiding plate and the other end is located inside the slot. A rotating fan blade is fixedly sleeved on the outer side of the other end of the rotating shaft, and the bottom of the rotating fan blade is movably attached to the surface of the flow guiding plate.

3. The device for supplying polishing slurry in semiconductor manufacturing process according to claim 2, characterized in that, The rotating fan blades are designed with an arc shape.

4. The device for supplying polishing slurry in semiconductor manufacturing process according to claim 2, characterized in that, A wind guide shroud is fixedly installed on the inner wall of the slot. The wind guide shroud is sleeved on the outside of the rotating shaft. The air duct is connected to the inside of the wind guide shroud. Turbine blades are fixedly sleeved on the outside of the part of the rotating shaft inside the wind guide shroud.

5. A device for supplying polishing slurry in semiconductor manufacturing process according to claim 2, characterized in that, Multiple guide grooves are arranged in a horizontal linear array at the lower position of the upper surface of the guide plate.

6. A device for supplying polishing slurry in semiconductor manufacturing process according to claim 2, characterized in that, The guide plate is located above the rotating fan blade and has multiple rotating cylinders mounted in a horizontal linear array. One end of each rotating cylinder extends through the upper surface of the guide plate and is rotatably connected to the inner wall of the slot. Multiple sharp teeth are mounted in a ring array on the outer side of each rotating cylinder.

7. A device for supplying polishing slurry in semiconductor manufacturing process according to claim 6, characterized in that, The multiple rotating cylinders are connected by a first belt drive.

8. A device for supplying polishing slurry in semiconductor manufacturing process according to claim 6, characterized in that, One of the central rotating cylinders is connected to the rotating shaft via a second belt drive.

9. A device for supplying polishing slurry in semiconductor manufacturing process according to claim 6, characterized in that, A fixed rod is movably arranged inside the rotating cylinder. One end of the fixed rod is fixedly inserted through the guide plate, and the other end is fixedly connected to the inner wall of the slot. An arc-shaped plate is fixedly sleeved on the outside of the fixed rod, and the sharp teeth located on the inner side of the rotating cylinder are slidably embedded in the surface of the arc-shaped plate.

10. A device for supplying polishing slurry in semiconductor manufacturing process according to claim 1, characterized in that, An air outlet pipe is fixedly installed through one side of the guide plate, and the air outlet pipe is connected to the inside of the slot. The other end of the air outlet pipe is fixedly installed through the raw liquid tank.

11. A device for supplying polishing slurry in semiconductor manufacturing process according to claim 2, characterized in that, The rotating fan blades are made of a high-purity, corrosion-resistant, and low-friction material.

12. A method for supplying polishing slurry using the apparatus for supplying polishing slurry in semiconductor manufacturing as described in any one of claims 1-11, characterized in that, Includes the following steps: S1, nitrogen gas is blown into the trachea to blow the grinding fluid in the inlet pipe onto the guide plate; S2, the rotating shaft drives the rotating fan blades to rotate, and the rotating fan blades come into contact with the grinding fluid that slides down the surface of the guide plate during the rotation process; S3, the rotation of the shaft drives the rotating drum and the sharp teeth to rotate via the second belt; S4, through the action of the first belt, multiple rotating drums rotate synchronously together; S5, through the cooperation of the pointed teeth and the arc plate, drives the pointed teeth to move laterally back and forth relative to the rotating cylinder.

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