Semiconductor growth equipment equipped with spray components

Abstract

This invention provides a semiconductor growth apparatus equipped with a spray assembly, comprising a process chamber, a base, a rotation drive assembly, a spray assembly, and a clamping assembly. The base is disposed within the process chamber, and a docking structure is provided in the middle of its bearing surface. The rotation drive assembly is rotatably connected to the base to drive the base to rotate. The spray assembly is disposed within the process chamber and extends into the process chamber to face the bearing surface. The spray assembly has several gas channels, each of which communicates with the process chamber through the sidewall of the spray assembly to provide process gas. The clamping assembly is movably disposed within the spray assembly, with its bottom penetrating the bottom of the spray assembly to move toward or away from the base and to rotate with the base. Several gas channels surround the clamping assembly. The bottom of the clamping assembly includes a pressing structure that extends out of the spray assembly and is detachably connected to the docking structure to provide clamping force to the base, thereby improving the rotational stability of the base and facilitating the uniform growth of the semiconductor material layer on the substrate surface.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and in particular to a semiconductor growth apparatus equipped with a spray assembly. Background Technology

[0002] Semiconductor growth equipment is a crucial piece of equipment in semiconductor manufacturing. It grows semiconductor material layers, such as epitaxial layers, by introducing specific process gases into a reaction chamber and causing a reaction on the heated substrate surface. The performance of semiconductor growth equipment directly determines the uniformity and repeatability of the semiconductor material layers, as well as the performance of semiconductor devices.

[0003] To achieve uniform growth of semiconductor material layers on the substrate surface, semiconductor growth equipment commonly employs rotating pedestal technology. The pedestal supporting the substrate is driven to rotate during the process, resulting in a more uniform distribution of process gases on the substrate surface. Therefore, the rotational stability of the pedestal becomes one of the key factors affecting film uniformity.

[0004] However, due to unavoidable constraints in mechanical installation, such as installation tolerances and the thermal expansion of the mechanical structure, the base is prone to vibration under high-speed rotation, which affects the stability of rotation. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor growth apparatus equipped with a spraying component to improve the rotational stability of the substrate, thereby facilitating the uniform growth of semiconductor material layers on the substrate surface.

[0006] To achieve the above objectives, the semiconductor growth apparatus of the present invention, equipped with a spray assembly, includes:

[0007] Process cavity;

[0008] A base is disposed within the process cavity, including a bearing surface to support the substrate, and a docking structure is provided in the middle of the bearing surface of the base;

[0009] A rotary drive assembly is rotatably connected to the base to drive the base to rotate;

[0010] A spray assembly is disposed in the process chamber and extends into the process chamber to face the bearing surface of the base. The spray assembly is provided with a plurality of gas channels, each of which communicates with the process chamber through the side wall of the spray assembly to provide process gas.

[0011] A clamping assembly is movably disposed on the spray assembly, with its bottom penetrating the bottom of the spray assembly to move toward or away from the base and to rotate with the base, and the plurality of gas channels surround the clamping assembly;

[0012] The bottom of the clamping assembly includes a pressing structure that extends out of the spray assembly and is detachably connected to the docking structure to provide clamping force to the base.

[0013] Preferably, the spray assembly includes a spray body and a top cover. The spray body penetrates and is fixed to the process cavity, and extends into the process cavity to face the bearing surface. Each of the gas flow channels is disposed within the spray body, and the gas outlet communicates with the process cavity through the side wall of the spray body. The top cover is fixedly disposed on the top of the spray body to form a sealed mounting cavity. The clamping assembly movably penetrates the spray body, and its top is located within the mounting cavity and elastically abuts against the top cover.

[0014] Preferably, the pressing assembly further includes a follower shaft, a limiting structure, and an elastic component; the follower shaft movably passes through the spray body and extends into the mounting cavity, and the bottom of the follower shaft is fixedly connected to the pressing structure; the limiting structure is located inside the mounting cavity and surrounds the top sidewall of the follower shaft to limit the extreme position of the follower shaft's descent; the elastic component is located inside the mounting cavity, surrounding the top of the follower shaft, with one end abutting against the top cover and the other end disposed on the limiting structure, so that it is in a compressed state and will not interfere with the follower shaft's movement during the follower shaft's movement.

[0015] Preferably, when the pressing structure and the docking structure are detachably connected, there is a gap between the pressing structure and the bottom surface of the spray body, and the limiting structure is suspended in the mounting cavity to avoid motion interference.

[0016] Preferably, the spray body has an axial through-channel communicating with the mounting cavity, and the follower shaft passes through the axial through-channel; the outer diameter of the limiting structure is larger than the inner diameter of the axial through-channel to limit the extreme position of the follower shaft's descent.

[0017] Preferably, the elastic component includes an anti-rotation component and an elastic element. The anti-rotation component is disposed on the limiting structure and surrounds the top of the follower shaft. The elastic element is disposed between the anti-rotation component and the top cover and is in a compressed state. The elastic element surrounds the top of the follower shaft and has a gap.

[0018] Preferably, when the pressing structure and the docking structure are detachably connected or disconnected, the elastic components are in a compressed state.

[0019] Preferably, one end of the elastic element is movably abutted or fixedly connected to the top cover, and the other end is movably abutted to the anti-rotation component.

[0020] Preferably, one end of the elastic element is fixedly connected to the anti-rotation component, and the other end is movably abutting against the top cover.

[0021] Preferably, the anti-rotation component includes a bottom fixed plate, a top movable plate, and a middle movable member; the bottom fixed plate is fixedly positioned around the limiting structure; the top movable plate is suspended around the follower shaft and has a gap between it and the follower shaft; the elastic member is disposed between the top movable plate and the top cover and is in a compressed state; the middle movable member is movably disposed between the top movable plate and the bottom fixed plate, surrounds the follower shaft and has a gap between it and the follower shaft, so as to adjust the state of the top movable plate and itself, thereby preventing the top movable plate and the elastic member from interfering with the movement of the follower shaft.

[0022] Preferably, the top movable plate and the bottom fixed plate rotate relative to each other, and both the top movable plate and the bottom fixed plate form point contact or surface contact with the middle movable component.

[0023] Preferably, the semiconductor growth apparatus further includes a preload adjustment component, which is disposed through and dynamically sealed in the top cover, with its bottom abutting against the top of the elastic component.

[0024] Preferably, the preload adjustment assembly includes an adjustment support plate and an adjustment drive; the adjustment support plate is disposed in the mounting cavity and abuts against the top end of the elastic component; the adjustment drive is movably disposed through and dynamically sealed on the top cover to move toward or away from the adjustment support plate, and its bottom extends into the mounting cavity and connects to the adjustment support plate.

[0025] Preferably, the semiconductor growth apparatus further includes a sealing cover that houses the top cover and the preload adjustment assembly and is detachably and sealingly connected to the spray body to enhance the sealing effect.

[0026] Preferably, the docking structure and the pressing structure are detachably connected in a concave-convex fit manner.

[0027] Preferably, the material of the pressing structure is the same as the material of the base, which is beneficial to the temperature uniformity of the base.

[0028] The advantages of the semiconductor growth apparatus equipped with a spray assembly described in this invention are as follows:

[0029] In this application, the pressing structure extending from the bottom of the spray assembly of the pressing component is detachably connected to the docking structure in the middle of the base bearing surface to provide pressing force. This allows the pressing component to provide pressing force to the base, and the pressing component is movably disposed on the spray assembly and can rotate with the base. This ensures that the base rotation is not affected, and the pressing component can apply pressing force to the base to achieve stability during base rotation, which is beneficial to the uniform growth of semiconductor material layer on the substrate surface. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the pressing structure and the docking structure in a pressed state in the semiconductor growth apparatus of an embodiment of the present invention;

[0031] Figure 2 This is a schematic diagram showing the bonding structure and the docking structure in a separated state in the semiconductor growth apparatus of an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of the spraying assembly and the pressing assembly in the semiconductor growth apparatus according to an embodiment of the present invention;

[0033] Figure 4 This is a schematic diagram of the structure of the top cover and clamping assembly in the semiconductor growth apparatus of this invention. Figure 1 ;

[0034] Figure 5 This is a schematic diagram of the structure of the top cover and clamping assembly in the semiconductor growth apparatus of this invention. Figure 2 ;

[0035] Figure 6 This is a schematic diagram of the structure of the base in the semiconductor growth apparatus according to an embodiment of the present invention;

[0036] Figure 7 This is a schematic diagram of the preload adjustment component and elastic element in the semiconductor growth apparatus of this invention.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. Process chamber; 11. Cover plate; 2. Base; 21. Bearing surface; 22. Docking structure; 3. Rotary drive assembly; 4. Spray assembly; 41. Gas flow channel; 42. Spray body; 421. Axial through channel; 43. Top cover; 431. Mounting cavity; 44. Air outlet; 45. Spray section; 46. Bearing; 5. Pressing assembly; 51. Pressing structure; 52. Follower shaft; 521. Upper shaft section; 522. Lower shaft section; 53. Limiting structure; 54. Elastic assembly; 541. Anti-rotation assembly; 5411. Bottom fixing plate; 5412. Top movable plate; 5413. Middle movable part; 542. Elastic part; 6. Base plate; 7. Preload adjustment assembly; 71. Adjusting bearing plate; 72. Adjusting drive component. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0040] To overcome the problems existing in the prior art, this invention provides a semiconductor growth apparatus equipped with a spraying component to improve the rotational stability of the substrate, thereby facilitating the uniform growth of semiconductor material layers on the substrate surface.

[0041] In some embodiments, reference is made to Figures 1 to 6 The semiconductor growth apparatus equipped with a spray assembly includes a process chamber 1, a base 2, a rotary drive assembly 3, a spray assembly 4, and a clamping assembly 5. The base 2 is disposed within the process chamber 1 and includes a bearing surface 21 to support a substrate 6. A mating structure 22 is provided in the middle of the bearing surface 21 of the base 2. The rotary drive assembly 3 is rotatably connected to the base 2 to drive the base 2 to rotate. The spray assembly 4 is disposed within the process chamber 1 and extends into the process chamber 1 to face the bearing surface 21 of the base 2. The spray assembly 4 contains... There are several gas channels 41, each of which communicates with the process chamber 1 through the side wall of the spray assembly 4 to provide process gas; the clamping assembly 5 is movably disposed on the spray assembly 4, and its bottom extends through the bottom of the spray assembly 4 to move toward or away from the base 2 and can rotate with the base 2, and the several gas channels 41 surround the clamping assembly 5; the bottom of the clamping assembly 5 includes a pressing structure 51, which extends out of the spray assembly 4 and is detachably connected to the docking structure 22 to provide clamping force to the base 2.

[0042] In this application, such as Figure 1As shown, after the process chamber 1 is closed, the pressing structure 51 in the pressing assembly 5 is pressed down and its bottom is attached to the base 2. Under the action of the pressing force, it remains pressed against the base 2. During the process, the rotation drive assembly 3 drives the base 2 to rotate. Under the action of the pressing force, the pressing structure 51 generates friction with the base 2 and rotates with the base 2. At this time, the top of the pressing structure 51 is spaced apart from the bottom of the spray assembly 4, that is, the pressing structure 51 is suspended at the bottom of the spray assembly 4. This avoids the spray assembly 4 interfering with the pressing structure 51 and affecting the rotation of the pressing assembly 5 with the base 2. In some specific embodiments, when the pressing structure and the docking structure are detachably connected, the gap between the top of the pressing structure and the bottom of the spray assembly 4 can be 0.5 mm.

[0043] like Figure 2 As shown, after the process chamber 1 is opened, the spray assembly 4 rises, causing the pressing assembly 5 to separate from the base 2. The pressing structure 51 no longer exerts pressure on the base 2, and the pressing structure 51 separates from the docking structure 22, leaving operating space for the robot to remove the wafer from the base 2. The pressing structure 51 is pressed against or detached from the base 2 as the spray assembly 4 moves towards or away from the base 2. That is, the pressing structure 51 and the docking structure 22 of the base 2 are detachably connected, so that the pressing structure 51 is pressed down and locked before the process, and the pressing structure 51 is raised and released after the process. This is suitable for automation systems and makes the replacement, cleaning and other maintenance operations of the base 2 or the pressing structure 51 itself more convenient, reducing equipment downtime.

[0044] In this application, the pressing structure 51 of the pressing component 5 is detachably connected to the docking structure 22 in the middle of the bearing surface 21 of the base 2 and provides a pressing force, so that the pressing component 5 can provide a top-down pressing force on the base 2. The pressing component 5 is movably disposed on the spraying component 4 and can rotate with the base 2, ensuring that the stability of the base 2 during rotation is achieved by applying a pressing force to the base 2 through the pressing component 5 without affecting the rotation of the base 2. This is beneficial to the uniform growth of the semiconductor material layer on the substrate surface, that is, it improves the film uniformity.

[0045] In addition, this application provides a plurality of gas flow channels 41 surrounding the pressing component 5 through the spray assembly 4. The process gas flows through each gas flow channel 41 from the side wall of the spray assembly 4 through the substrate 6 in a laminar flow manner. The specific implementation of each gas flow channel to provide laminar gas is a conventional technical means in the art.

[0046] In some embodiments, reference is made to Figure 1 and Figure 2The process chamber 1 includes a cover plate 11, and the spray assembly 4 is installed through the cover plate 11 and extends into the process chamber 1. The specific installation method of the spray assembly 4 on the process chamber 1 is a conventional technical means in the field, which is sufficient to ensure the sealing performance of the process chamber 1 after installation.

[0047] In some embodiments, the rotary drive assembly 3 includes a rotary spindle connected to the center of the bottom surface of the base 2, and a magnetohydrodynamic (MHD) rotary drive device. The rotary spindle extends to the outside of the process cavity 1 with a dynamic seal. The MHD rotary drive device is disposed outside the process cavity 1 and rotatably connected to the rotary spindle, and is sealed and adapted to the process cavity 1 to drive the base 2 to rotate. The specific implementation of the MHD rotary drive device and its adaptation to the process cavity 1 and the rotary spindle are conventional techniques in the art and will not be described in detail here.

[0048] In some embodiments, reference is made to Figures 1 to 5 The spray assembly 4 includes a spray body 42 and a top cover 43. The spray body 42 penetrates and is fixed to the cover plate 11 of the process cavity 1, and extends into the process cavity 1 to face the bearing surface 21. Each gas flow channel 41 is provided in the spray body 42, and the gas outlet 44 communicates with the process cavity 1 through the side wall of the spray body 42. The top cover 43 is fixedly provided on the top of the spray body 42, and a sealed mounting cavity 431 is formed in the top cover 43. The clamping assembly 5 movably penetrates the spray body 42, and its top is located in the mounting cavity 431 and elastically abuts against the top cover 43.

[0049] In this embodiment, the top of the clamping component 5 elastically abuts against the top cover 43, enabling it to provide axial clamping force to the base 2. This facilitates the stable and reliable application of the clamping force to the base 2, and the elastic abutment avoids stress concentration or loosening that may result from rigid connections. Furthermore, during the rotation of the base 2, the elasticity is automatically adjusted within a certain range based on the vibration of the base 2 (especially the axial vibration) to ensure that the applied clamping force is conducive to stable rotation and will not have any adverse effects on the rotation of the base 2 that do not meet process requirements. Specifically, the component providing the elastic abutment effect on the clamping component 5 can be reasonably selected and adapted according to the rotation speed of the base 2, process requirements, and structural compatibility characteristics between the clamping component 5 and the base 2, and the degree of compression of the component can be selected to achieve a suitable clamping force.

[0050] The clamping assembly 5 extends through the spray body 42, with its top located within the sealed mounting cavity 431 of the top cover 43. This effectively isolates the mechanical stress and vibration generated by the clamping action of the clamping assembly 5, preventing them from being transmitted to and interfering with the gas flow channel 41 inside the spray body 42. This ensures the stability and uniformity of the process gas flow. Furthermore, it allows for flexible replacement of the spray body 42 with different gas flow channel 41 designs, or replacement of the top cover 43 or clamping assembly 5 with different clamping forces and strokes, according to different process requirements (such as different pressures and gas chemical properties), without redesigning the entire structure of the spray assembly 4. The top cover 43 also helps ensure the sealing of the process chamber 1.

[0051] In some specific embodiments of the present invention, reference is made to Figure 3 and Figure 4 The top cover 43 is installed on the top of the spray body 42 by screws, and a sealing ring is provided between the top cover 43 and the top of the spray body 42 to achieve a seal.

[0052] In some specific embodiments of the present invention, reference is made to Figure 3 The sidewall of the spray body 42 is provided with a plurality of spray sections 45. Further, each spray section 45 is an annular spray section arranged circumferentially along the spray body 42, or multiple spray sections 45 are spaced apart circumferentially along the spray body 42 to form an annular spray section. The gas flow channel 41 is provided with a plurality of channels for respectively introducing different process gases or purge gases, and each gas flow channel 41 is connected to at least one spray section 45 for supplying process gas or purge gas to the spray section 45. Each spray section 45 includes a plurality of outlets 44 for spraying process gas or purge gas into the process chamber 1.

[0053] In some embodiments, reference is made to Figures 1 to 5 The pressing assembly 5 further includes a follower shaft 52, a limiting structure 53, and an elastic component 54. The follower shaft 52 movably passes through the spray body 42 and extends into the mounting cavity 431. The bottom of the follower shaft 52 is fixedly connected to the pressing structure 51. The limiting structure 53 is located inside the mounting cavity 431 and surrounds the top side wall of the follower shaft 52 to limit the extreme position of the follower shaft 52's descent. The elastic component 54 is located inside the mounting cavity 431, surrounding the top of the follower shaft 52. One end of the elastic component abuts against the top cover 43, and the other end is located on the limiting structure 53, so that it is in a compressed state and will not interfere with the follower shaft 52 during its movement.

[0054] In this embodiment, in the spray assembly 4, when the pressing structure 51 separates from the docking structure 22 on the base 2, the pressing structure 51 will, due to its gravity, cause the tension at the top of the pressing assembly 5 to become relatively loose, that is, the distance between the pressing structure 51 and the spray body 42 increases. The limiting structure 53, together with the follower shaft 52 enclosed by it, moves towards the direction of the pressing structure 51 until the limiting structure 53 descends to its limit position. The limiting structure 53 plays a limiting role to prevent the pressing structure 51 from driving the follower shaft 52 to directly detach from the spray body 42.

[0055] After the process chamber 1 is closed, the pressing structure 51 abuts against the base 2, and the base 2 exerts a relative supporting force on the pressing structure 51. Due to the clamping force applied by the elastic component 54 to the follower shaft 52 and the pressing structure 51, under the interaction of the clamping force and the supporting force, the pressing structure 51 can be suspended at the bottom of the spray assembly 4. This avoids interference between the spray assembly 4 and the pressing structure 51, thus preventing the pressing assembly 5 from rotating with the base 2. This can be achieved by reasonably designing the length of the follower shaft.

[0056] In this embodiment, one end of the elastic component 54 abuts against the top cover 43, and the other end is located on the limiting structure 53. This allows the elastic force to be converted into a downward clamping force acting on the follower shaft 52. Furthermore, the follower shaft 52 and the pressing structure 51 do not interfere with each other during movement. That is, the force source generating the elastic force on the elastic component 54 does not contact the follower shaft 52, preventing motion interference between them and thus avoiding any impact on the normal rotation of the base 2. Simultaneously, the elastic component 54 also provides a certain degree of buffering against vibrations that may occur during the rotation of the base 2. The bottom of the follower shaft 52 is fixed to the pressing structure 51, and the top receives the elastic force transmitted by the limiting structure 53. The pressing structure 51 then provides clamping force to the base 2. The force transmission path is short, the force loss is small, and the response is direct, ensuring the effective utilization of the clamping force. The limiting structure 53 is arranged around the top side wall of the follower shaft 52, which limits the extreme position of the descent of the follower shaft 52 and the pressing structure 51, and prevents the follower shaft 52 from detaching from the spray body 42 when the pressing assembly 5 is not under force.

[0057] In some embodiments, reference is made to Figure 1 and Figure 3When the pressing structure 51 is detachably connected to the docking structure 22, there is a gap between the pressing structure 51 and the bottom surface of the spray body 42. The limiting structure 53 is suspended in the mounting cavity 431 to avoid motion interference, that is, to prevent the motion interference between the limiting structure 53 and the top cover 43 from affecting the normal rotation of the base 2. When the pressing structure 51 is pressed down to abut against the docking structure 22 (i.e., the working position), there is a gap between the limiting structure 53 and the inner wall of the top cover 43 and the spray body 42. Moreover, in the working position, the limiting structure 53 is suspended, which also ensures that the clamping force provided by the elastic component 54 can be more effectively transmitted to the base 2 through the follower shaft 52.

[0058] In some embodiments, reference is made to Figure 1 The pressing structure 51 is detachably connected to the docking structure 22. The inner wall of the top cover 43 is also spaced from the structure into which the follower shaft 52 extends into the mounting cavity 431, so as to avoid the problem that the follower shaft 52 and the top cover 43 will abut against each other when the pressing structure 51 and the docking structure 22 of the base 2 are in pressure contact, which will affect the normal rotation of the base 2.

[0059] In some embodiments, reference is made to Figures 1 to 3 The spray body 42 has an axial through-channel 421 communicating with the mounting cavity 431, and the follower shaft 52 passes through the axial through-channel 421. The outer diameter of the limiting structure 53 is larger than the inner diameter of the axial through-channel 421 to limit the extreme position of the follower shaft 52's descent, preventing the pressing structure 51 connected to the follower shaft 52 from being damaged by collision due to excessive descent, or from detaching from the spray body 42. Moreover, there is no need to arrange an additional independent limit switch or stop block in the mounting cavity 431, resulting in a simple and compact structure.

[0060] In some embodiments, the limiting structure 53 is a flange or a retaining ring, which is fixedly sleeved on the follower shaft 52.

[0061] In some embodiments, reference is made to Figure 4 and Figure 5 The follower shaft 52 includes an upper shaft section 521 and a lower shaft section 522. The upper shaft section 521 is located in the mounting cavity 431, and the elastic component 54 is arranged around the upper shaft section 521.

[0062] In some specific embodiments, the upper shaft segment 521 is fixedly disposed on the top of the limiting structure 53. Further, the upper shaft segment 521 and the limiting structure 53 are an integral structure and are installed on the top of the lower shaft segment 522. In other specific embodiments, the limiting structure 53 is annular, sleeved on the upper shaft segment 521 and installed on the top of the lower shaft segment 522 by screws.

[0063] In some embodiments, the outer diameter of the upper shaft segment 521 is smaller than the outer diameter of the lower shaft segment 522.

[0064] In some embodiments, the follower shaft 52 forms a dynamic sealing fit with the axial through channel 421 to ensure that the process cavity 1 has good sealing performance, and the follower shaft 52 can rotate under the drive of the base 2 without affecting the normal rotation of the base 2.

[0065] In other embodiments, reference is made to Figure 3 The spray assembly 4 also includes a bearing 46, which is fixedly sleeved in the axial through channel 421. The follower shaft 52 passes through the bearing 46 and forms a dynamic seal with the inner ring of the bearing 46, so that the follower shaft 52 can rotate under the drive of the base 2 without affecting the normal rotation of the base 2, thus ensuring that the process chamber 1 has good sealing performance.

[0066] In some embodiments, reference is made to Figures 1 to 5 The elastic component 54 includes an anti-rotation component 541 and an elastic element 542. The anti-rotation component 541 is disposed on the limiting structure 53 and surrounds the top of the follower shaft 52. The elastic element 542 is disposed between the anti-rotation component 541 and the top cover 43 and is in a compressed state to provide the clamping force. The elastic element 542 surrounds the top of the follower shaft 52 and has a gap. The anti-rotation component 541 is used to transmit the axial clamping force of the elastic element 542 and isolate the circumferential torque of the follower shaft 52, so that the anti-rotation component 541 and the elastic element 542 will not interfere with the movement of the follower shaft.

[0067] During equipment operation, the base 2 is driven to rotate by the bottom rotation drive assembly 3. The rotational torque is transmitted to the follower shaft 52 through the adaptation between the base 2 and the pressing structure 51, causing it to rotate accordingly. If this torque is transmitted to the upper elastic element 542, it will cause the elastic element 542 to twist, generating unexpected lateral forces and accelerating fatigue, resulting in unnecessary vibration of the entire pressing system. In this embodiment, the anti-rotation assembly 541 can isolate or absorb the circumferential torque transmitted to the elastic element 542, effectively preventing the elastic element 542 from undergoing torsional deformation or force disorder, thereby ensuring that the elastic element 542 provides appropriate pressing force while also ensuring that the normal rotation of the base 2 is not affected.

[0068] In one specific embodiment, the elastic element 542 is a spring.

[0069] In some embodiments, by selecting elastic elements 542 of different specifications, the magnitude of the clamping force can be precisely designed and adjusted to meet the needs of different types of bases 2, rotation speeds, or process vibration environments.

[0070] In some embodiments, reference is made to Figures 1 to 5One end of the elastic element 542 is movably or fixedly connected to the top cover 43, and the other end is movably connected to the anti-rotation component 541. The fixed point of contact is positioned near the actuating end (anti-rotation component 541), while the connection to the top cover 43 is flexible (movable or fixed), facilitating adaptation to different internal structures of the top cover 43 and allowing for greater design freedom. In other embodiments, one end of the elastic element 542 is fixedly connected to the anti-rotation component 541, and the other end is movably connected to the top cover 43. This facilitates maintenance or replacement of the elastic element 542 by disassembling and assembling the top cover 43, ensuring effective clamping force and reducing or even avoiding the impact of axial torque on the output of the appropriate clamping force.

[0071] In some embodiments, the elastic component 54 is compressed to provide clamping force not only when the pressing structure 51 and the docking structure 22 are detachably connected, but also after the connection between the pressing structure 51 and the docking structure 22 is released, the elastic component 54 remains compressed. This ensures that the elastic component 54 is stable relative to the top cover 43, preventing motion interference with the follower shaft 52 caused by excessive extension. Specifically, during the installation of the follower shaft 52 and the elastic component 54, a pre-tightening is applied to the elastic component 54, ensuring that the outer wall of the follower shaft 52 and the inner wall of the spray body 42 are in close contact. The degree of contact is controlled to maintain the pre-tightening of the elastic component 54 even after the connection between the pressing structure 51 and the docking structure 22 is released. When the pressing structure 51 and the docking structure 22 are detachably connected, the follower shaft 52 can move relative to the spray body 42, increasing the compression of the elastic component 54.

[0072] In some embodiments, reference is made to Figures 3 to 5 The anti-rotation component 541 includes a bottom fixed plate 5411, a top movable plate 5412, and a middle movable member 5413. The bottom fixed plate 5411 is fixedly surrounding the limiting structure 53. The top movable plate 5412 is suspended around the follower shaft 52 and has a gap between it and the follower shaft 52. The elastic member 542 is disposed between the top movable plate 5412 and the top cover 43 and is in a compressed state. The middle movable member 5413 is movably disposed between the top movable plate 5412 and the bottom fixed plate 5411, surrounds the follower shaft 52, and has a gap between it and the follower shaft 52, so as to adjust the state of the top movable plate 5412 and itself during the movement of the bottom fixed plate 5411 with the limiting structure 53, so that the top movable plate 5412 and the elastic member 542 will not interfere with the movement of the follower shaft 52.

[0073] In this embodiment, the bottom fixing plate 5411 is fixed on the limiting structure 53 to transmit axial torque in sync with the follower shaft 52; the middle movable member 5413 can reduce or avoid the transmission of axial torque to the top movable plate 5412 and the elastic member 542; the top movable plate 5412 serves as a bearing platform for the elastic member 542, and can prevent the elastic member 542 from being affected by the axial torque, thus preventing the output of the appropriate clamping force.

[0074] In this embodiment, there are gaps between the top movable plate 5412 and the follower shaft 52, and between the middle movable member 5413 and the follower shaft 52. Combined with the self-adaptive capability of the middle movable member 5413, it is ensured that the anti-rotation component 541 will not interfere with the follower shaft 52 during its movement, and that the pressing structure 51 presses the base 2 at a stable rotational speed.

[0075] In some embodiments, reference is made to Figures 3 to 5 The top movable plate 5412 and the bottom fixed plate 5411 rotate relative to each other, and both the top movable plate 5412 and the bottom fixed plate 5411 form point contact or surface contact with the middle movable member 5413. This allows for axial and small angular compensation while maintaining high radial rigidity. When the equipment undergoes thermal cycling, the components can be more smoothly fine-tuned, avoiding jamming or additional loads caused by thermal stress.

[0076] In some embodiments, reference is made to Figures 3 to 5 The top movable plate 5412 and the bottom fixed plate 5411 are both annular plates. The middle movable component 5413 includes a number of balls, and the working surface of the annular plate is provided with a number of grooves that are adapted to the balls.

[0077] In some specific embodiments, the structure consisting of the top movable plate 5412, the bottom fixed plate 5411, and the middle movable member 5413 is a thrust bearing.

[0078] The magnitude of the clamping force affects the degree of contact between the base 2 and the pressing structure 51, which in turn affects the rotational dynamic characteristics of the base. Furthermore, different process control points (such as temperature, rotational speed, and gas flow control), or different arrangements of the substrates 6 in different sizes and quantities on the base 2, require different optimal clamping forces to achieve rotational stability and prevent damage to the base 2. To enable timely adjustment based on clamping force requirements, in some embodiments, reference is made to… Figure 7 The semiconductor growth apparatus further includes a preload adjustment component 7, which is disposed through and dynamically sealed in the top cover 43, and its bottom abuts against the top of the elastic component 54.

[0079] This embodiment uses an externally operable preload adjustment component 7 to adjust the clamping force by adjusting the compression degree of the elastic component 54 without opening the process chamber 1. This significantly shortens the debugging time and solves the problem of insufficient clamping force on the base 2 caused by the performance drift of the elastic component 542. Even after multiple process cycles, the equipment can still maintain good clamping performance on the base 2. Furthermore, it enables the equipment to be "softly" adapted to different processes, broadening the process applicability range of the equipment and helping to find and lock the optimal process window.

[0080] In some embodiments, reference is made to Figure 7 The preload adjustment assembly 7 includes an adjustment support plate 71 and an adjustment drive member 72. The adjustment support plate 71 is disposed within the mounting cavity 431 and abuts against the top end of the elastic component 54 (i.e., the elastic element 542). The adjustment drive member 72 is movably disposed through and dynamically sealed within the top cover 43 to move toward or away from the adjustment support plate 71, and its bottom extends into the mounting cavity 431 and connects to the adjustment support plate 71. Specifically, the adjustment drive member 72 drives the adjustment support plate 71 to move axially up and down, thereby adjusting the compression amount of the elastic element 542 and the clamping force applied to the pressing structure 51.

[0081] In some embodiments, the adjusting drive 72 is threadedly connected to the top cover 43, allowing the adjusting support plate 71 to be driven to move axially up and down by rotating the adjusting drive 72 forward or reverse, thereby adjusting the compression of the elastic element 542 and the clamping force applied to the pressing structure 51. The threaded connection has excellent self-locking properties; once adjusted to the correct position, the threaded pair can firmly lock in place without external torque, effectively resisting loosening tendencies caused by equipment vibration, thermal cycling, or internal stress changes, ensuring the stability of the set clamping force during the process.

[0082] In some specific embodiments, the top cover 43 is provided with a through hole, and the circumferential inner sidewall of the through hole is provided with an internal thread section. The adjusting drive 72 is provided with a plurality of external thread sections that are adapted to the internal thread section along the axial direction. The top cover 43 and the adjusting drive 72 are screwed together by a threaded pair and maintain a dynamic seal.

[0083] In other embodiments, the adjustment drive 72 includes a precision threaded rod, a linear motor push rod, etc.

[0084] In some embodiments, the adjustment drive 72 is equipped with scale markings, digital display markings, or servo control along the axial direction, enabling more intuitive and specific adjustment of the compression amount of the elastic element 542 and the axial clamping force applied to the pressing structure 51, thereby achieving high positioning.

[0085] In some embodiments, the semiconductor growth apparatus further includes a sealing cap that houses the top cover 43 and the preload adjustment assembly 7 and is detachably and sealingly connected to the spray body 42 to enhance the sealing effect.

[0086] In the spray assembly 4, the connection interface between the top cover 43 and the spray body 42, as well as the dynamic sealing point through which the pre-tightening force adjustment drive 72 passes through the top cover 43, are potential leakage risk points. In this embodiment, the entire top cover 43 is covered by a sealing cover and externally sealed to the spray body 42, which is equivalent to adding an independent, closed secondary sealing cavity outside the original sealing structure, i.e., the top cover 43.

[0087] In some embodiments, the mating structure 22 and the pressing structure 51 are detachably connected by a tongue-and-groove fit. When the pressing structure 51 is pressed down, the inclined surface or sidewall of the tongue-and-groove fit can automatically guide both to slide into the correct position until they fit together.

[0088] In some embodiments, the material of the pressing structure 51 is the same as that of the base 2, in order to improve the temperature uniformity of the base 2.

[0089] In high-temperature epitaxial growth processes, the substrate 2 (e.g., made of graphite) is heated to hundreds or even thousands of degrees Celsius, serving as the primary heat source and heat carrier. The pressing structure 51, as the component in close contact with and applying pressure, can become a source of thermal interference if its material differs from the substrate 2 (e.g., metal or ceramic) due to their different thermal conductivity, heat capacity, and coefficient of thermal expansion. This embodiment addresses this by using a pressing structure 51 made of the same material as the substrate 2 (e.g., both are made of graphite). Both exhibit highly consistent thermophysical behavior when heated, ensuring unobstructed and uniform heat transfer between them at the interface. This prevents the formation of localized hot or cold spots due to uneven interface thermal resistance, and ensures that both have the same surface emissivity, resulting in highly balanced heat exchange in the high-temperature region where radiative heat transfer is dominant.

[0090] Different materials expand at different rates at high temperatures. If the pressing structure 51 and the base 2 are made of different materials, even if the pressing structure 51 and the mating structure 22 are initially precisely fitted, the difference in expansion after heating will generate huge contact surface shear stress or cause structural bending deformation. This may lead to micro-slippage at the connection interface, compromising alignment accuracy, warping of the pressing structure 51 or the base 2 itself, and in severe cases, cracks leading to component damage. In this embodiment, the material of the pressing structure 51 is consistent with the material of the base 2, ensuring synchronous thermal expansion and eliminating thermal stress. This maintains the absolute tightness and positioning accuracy of the convex-concave mating connection at high temperatures, improves the long-term mechanical reliability of the pressing assembly 5 in thermal cycling, avoids fatigue failure, and avoids any additional stress that may cause changes in the flatness of the base 2, protecting the flatness of the substrate 6. Without concerns about thermal mismatch, the equipment can safely operate at higher set temperatures or with faster heating and cooling programs without worrying about excessive interface stress, which is beneficial for developing more advanced material growth processes (such as some wide bandgap semiconductors that require extremely high temperatures) and broadens the process window.

[0091] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A semiconductor growth apparatus equipped with a spray assembly, characterized in that, include: Process cavity; A base is disposed within the process cavity, including a bearing surface to support the substrate, and a docking structure is provided in the middle of the bearing surface of the base; A rotary drive assembly is rotatably connected to the base to drive the base to rotate; A spray assembly is disposed in the process chamber and extends into the process chamber to face the bearing surface of the base. The spray assembly is provided with a plurality of gas channels, each of which communicates with the process chamber through the side wall of the spray assembly to provide process gas. A clamping assembly is movably disposed on the spray assembly, with its bottom penetrating the bottom of the spray assembly to move toward or away from the base and to rotate with the base, and the plurality of gas channels surround the clamping assembly; The bottom of the clamping assembly includes a pressing structure that extends out of the spray assembly and is detachably connected to the docking structure to provide clamping force to the base.

2. The semiconductor growth apparatus equipped with a spray assembly according to claim 1, characterized in that, The spray assembly includes: The spray body penetrates and is fixed in the process cavity, and extends into the process cavity to face the bearing surface. Each of the gas channels is located in the spray body, and the gas outlet communicates with the process cavity through the side wall of the spray body. The top cover is fixedly installed on the top of the spray body to form a sealed installation cavity; The clamping assembly extends through the spray body, with its top located within the mounting cavity and elastically abutting against the top cover.

3. The semiconductor growth apparatus equipped with a spray assembly according to claim 2, characterized in that, The clamping assembly also includes: A follower shaft moves through the spray body and extends into the mounting cavity; the bottom of the follower shaft is fixedly connected to the pressing structure. A limiting structure is located inside the mounting cavity and surrounds the top sidewall of the follower shaft to limit the extreme position of the follower shaft's descent. An elastic component is located inside the mounting cavity, surrounding the top of the follower shaft. One end of the component abuts against the top cover, and the other end is located on the limiting structure, so that it is in a compressed state and will not interfere with the follower shaft during its movement.

4. The semiconductor growth apparatus equipped with a spray assembly according to claim 3, characterized in that, When the pressing structure and the docking structure are detachably connected, there is a gap between the pressing structure and the bottom surface of the spray body, and the limiting structure is suspended in the mounting cavity to avoid motion interference.

5. The semiconductor growth apparatus equipped with a spray assembly according to claim 3, characterized in that, The spray body has an axial through-channel communicating with the mounting cavity, and the follower shaft passes through the axial through-channel; the outer diameter of the limiting structure is larger than the inner diameter of the axial through-channel to limit the extreme position of the follower shaft's descent.

6. The semiconductor growth apparatus equipped with a spray assembly according to claim 3, characterized in that, The elastic component includes: An anti-rotation component is disposed on the limiting structure and surrounds the top of the follower shaft; An elastic element is disposed between the anti-rotation assembly and the top cover and is in a compressed state. The elastic element surrounds the top of the follower shaft and has a gap.

7. The semiconductor growth apparatus equipped with a spray assembly according to claim 3, characterized in that, When the pressing structure and the docking structure are detachably connected or disconnected, the elastic components are in a compressed state.

8. The semiconductor growth apparatus equipped with a spray assembly according to claim 6, characterized in that, One end of the elastic element is movably abutted or fixedly connected to the top cover, and the other end is movably abutted to the anti-rotation component; Alternatively: one end of the elastic element is fixedly connected to the anti-rotation component, and the other end is movably abutted against the top cover.

9. The semiconductor growth apparatus equipped with a spray assembly according to claim 6, characterized in that, The anti-rotation component includes: A bottom fixing plate is fixedly mounted around the limiting structure; A top movable plate is suspended around the follower shaft and has a gap with the follower shaft. The elastic element is located between the top movable plate and the top cover and is in a compressed state. The middle movable component is movably disposed between the top movable plate and the bottom fixed plate, surrounds the follower shaft and has a gap between it and the follower shaft, so as to adjust the state of the top movable plate and itself, thereby preventing the top movable plate and the elastic component from interfering with the movement of the follower shaft.

10. The semiconductor growth apparatus equipped with a spray assembly according to claim 9, characterized in that, The top movable plate and the bottom fixed plate rotate relative to each other, and both the top movable plate and the bottom fixed plate form point contact or surface contact with the middle movable component.

11. The semiconductor growth apparatus equipped with a spray assembly according to claim 3, characterized in that, It also includes a preload adjustment component, which is disposed through and dynamically sealed in the top cover, with its bottom abutting against the top of the elastic component.

12. The semiconductor growth apparatus equipped with a spray assembly according to claim 11, characterized in that, The preload adjustment assembly includes: Adjust the support plate, which is located inside the mounting cavity and abuts against the top of the elastic component; An adjustment drive unit is provided through and dynamically sealed in the top cover to move toward or away from the adjustment support plate, and its bottom extends into the mounting cavity and connects to the adjustment support plate.

13. The semiconductor growth apparatus equipped with a spray assembly according to claim 11, characterized in that, It also includes a sealing cap that houses the top cover and the preload adjustment assembly and is detachably and sealingly connected to the spray body to enhance the sealing effect.

14. The semiconductor growth apparatus equipped with a spray assembly according to claim 1, characterized in that, The docking structure and the pressing structure are detachably connected by a concave-convex fit.

15. The semiconductor growth apparatus equipped with a spray assembly according to claim 1, characterized in that, The material of the pressing structure is the same as that of the base, which is beneficial to the temperature uniformity of the base.

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