Interconnect circuit for printed parts

Abstract

An interconnect circuit may include: a first portion including an array of electrical interconnect pads for connection to a host controller, the array of electrical interconnect pads including a first electrical interconnect pad on a first lateral side of the first portion and a second electrical interconnect pad on a second lateral side of the first portion; a second portion separate from the first portion, the second portion including an array of contact pads for connection to an integrated circuit, the array of contact pads on the first surface, the second portion includes a first contact pad for connection to a fluid ejection device, a second contact pad for connection to the fluid ejection device, a first trace connecting the first electrical interconnect pad and the first contact pad, and a second trace connecting the second electrical interconnect pad and the second contact pad, wherein the first trace is configured to conduct a higher voltage than the second trace.

Description

Background Technology

[0001] Inkjet printing involves depositing ink onto a surface, such as paper. Printing fluid can be stored in a print fluid reservoir until it is used for printing. The print die dispenses the printing fluid for printing. Interconnect circuitry can connect to the printer control interface and the print die. Attached Figure Description

[0002] Figure 1 The illustration shows a 3D view of an example printed part.

[0003] Figure 2 The diagram shows Figure 1 An exploded view of the printed part.

[0004] Figure 3 The diagram shows Figure 1 Front view of the printed part.

[0005] Figure 4 The diagram illustrates a fluid structure assembly, which includes, as shown in the figure... Figure 1 The fluid structure, fluid jetting device, and interconnecting circuitry used in the process.

[0006] Figure 5 The diagram shows Figure 1 Interconnection circuits.

[0007] Figure 6 An example fluid structure assembly is illustrated, which includes a fluid structure, a printed component with a fluid jet die, and interconnecting circuitry.

[0008] Figure 7 This is a block diagram of an example interconnect circuit.

[0009] Figure 8 This is a block diagram of an example printed part.

[0010] Figure 9 It is a block diagram of an example printed component including at least one connector.

[0011] Figure 10 The illustration shows that Figure 1 The contact pads on the north portion of the interconnect circuit.

[0012] Figure 11 The illustration shows that Figure 6 The contact pads on the north portion of the interconnect circuit.

[0013] Figure 12 The illustration shows an example connecting wire used to connect contact pads to a fluid jet die.

[0014] Figure 13 The illustration shows the part attached to the molded body. Figure 6Interconnection circuits.

[0015] Figure 14 The diagram shows Figure 1 The interconnect circuit includes a portion of the tool hole.

[0016] Figure 15 The diagram shows a cross-section of an example interconnect circuit.

[0017] Figure 16 The diagram shows Figure 6 An exploded view of the fluid structure components.

[0018] Figure 17 The diagram shows Figure 1 An exploded view of the fluid structure components.

[0019] Figure 18 This is a block diagram of an example interconnect circuit.

[0020] Figure 19 It includes Figure 18 A block diagram of an example fluid jet device component with interconnected circuitry.

[0021] Figure 20 This is a block diagram of an example interconnect circuit.

[0022] Figure 21 This is a block diagram of an example flexible circuit that includes a metal plating layer and a protective layer.

[0023] Figure 22 The diagram shows Figure 4 The southern end of the fluid structure component.

[0024] Figure 23 The diagram shows Figure 22 A close-up of a portion of it.

[0025] Figure 24 The diagram shows Figure 4 The north end of the fluid structure component.

[0026] Figure 25 The diagram shows Figure 24 A close-up of a portion of it.

[0027] Figure 26 This is a block diagram of an example interconnect circuit.

[0028] The foregoing and other features of this disclosure will become clear from the following description and appended claims, taken in conjunction with the accompanying drawings. It should be understood that these drawings depict only a few examples according to this disclosure and are therefore not to be considered as limiting the scope of this disclosure, which will be described more specifically and in detail using the drawings. Detailed Implementation

[0029] In the following detailed description, reference is made to the accompanying drawings, which form part of the detailed description. In the drawings, like reference numerals generally identify like parts unless the context otherwise requires. The illustrative examples set forth in the detailed description, drawings, and claims are not intended to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter set forth herein. It will be readily understood that, as generally described herein and illustrated in the drawings, aspects of this disclosure can be arranged, substituted, combined, and designed in a variety of different configurations, all of which are explicitly contemplated and are part of this disclosure.

[0030] This disclosure relates to printing components. Printing components can be any part of a printing system, such as a replaceable printing cartridge, or a component of a cartridge, such as a fluid jetting device (e.g., a printhead) or other integrated circuit associated with the cartridge. Printing components may include printing elements for dispensing printing fluid and reservoirs for storing the printing fluid. Printing fluid may include any 2D or 3D printing agent comprising inks for printing on a medium such as paper (2D) or (e.g., powdered) building material (3D). Printing fluid may include a dispensable fluid to be dispensed with relatively high precision (in terms of volume and / or position) for applications beyond 2D or 3D imaging, including but not limited to forensic, laboratory, or pharmaceutical applications.

[0031] Figure 1The illustration shows a perspective view of an example printing component 100. Printing component 100 may be a fluid jetting device assembly including a fluid jetting device. The printing component may be a replaceable print cartridge, or may be associated with a replaceable print cartridge. Printing component 100 includes a molding body 110. Molding body 110 may include reservoir chambers for storing printing fluid. The individual reservoir chambers of molding body 110 may store different types of printing fluid. In the example, molding body 110 includes three individual reservoir chambers for storing cyan, yellow, and magenta printing fluid, respectively. Printing component 100 may include a fluid structure 120. The fluid structure 120 may be attached to molding body 110. Fluid structure 120 may be located in a recess 109 of molding body 110. Fluid structure 120 may be attached to molding body 110 to create a fluid path from the reservoir chambers of molding body 110 to fluid jetting device 130. In this example, fluid jetting device 130 is a fluid jetting apparatus, and printing component 100 is a fluid jetting apparatus assembly, which includes an integrated circuit in the form of fluid jetting device 130. Fluid jetting device 130 includes a package containing at least one fluid jetting die. In this example, three separate fluid jetting dies are disposed within the package. The package may include molded, encapsulated, and / or PCB composites and / or other packaging materials. In some examples, other types of integrated circuits may be provided instead of the fluid jetting apparatus for connection to the molded body 110 and / or interconnect circuitry 140 and / or host printing equipment; however, in this example, we will refer to fluid jetting device 130 rather than the more general integrated circuit.

[0032] The fluid structure 120 may include and / or support a fluid jetting device 130. The fluid jetting device 130 may include at least one fluid jetting die. In the illustrated example, the fluid jetting device 130 may include a first fluid jetting die 131a, a second fluid jetting die 131b, and a third fluid jetting die 131c (collectively referred to as fluid jetting dies 131). Each of the fluid jetting dies 131 may include an array of nozzles for jetting printing fluid. The fluid jetting die 131 may receive printing fluid from a reservoir chamber of the molding body 110. Each fluid jetting die may output a different type of printing fluid. In the example, the first fluid jetting die 131a outputs cyan printing fluid, the second fluid jetting die 131b outputs magenta printing fluid, and the third fluid jetting die 131c outputs yellow printing fluid. The printing component 100 may include an encapsulation 134 on the fluid structure 120. The encapsulation 134 may cover wires 132 and / or connectors connecting the fluid jetting device 130 to the interconnect circuitry 140. The package 134 can be supported by the fluid structure 120.

[0033] The fluid jetting die 131 is a fluid integrated circuit, or in other words, an on-chip laboratory circuit designed to house logic for driving droplet generators, as well as guiding and jetting fluid. The fluid jetting die 131 may each include a substrate, a thin-film circuit system, and a nozzle board. The fluid jetting die 131 may include droplet generators or droplet ejectors, which may include nozzles in the nozzle board, resistors in the thin-film circuit system for driving droplets away from the nozzles, and transistors in the thin-film circuit system for activating the resistors. In examples illustrated in different figures, the fluid jetting device includes one or more dies embedded in a rigid molding composite. The composite fluid jetting device is attached to a fluid structure. In other examples, the fluid jetting device may include a single printed (i.e., fluid jetting) die having one or more droplet generator arrays (not embedded in the composite).

[0034] Printing component 100 includes interconnecting circuitry 140. Interconnecting circuitry 140 may be flexible circuitry. Interconnecting circuitry 140 may include circuitry for connection to the printer to control fluid jetting die 131. Interconnecting circuitry 140 may be attached to molding body 110. The circuitry of interconnecting circuitry 140 may include contact pads for receiving signals controlling fluid jetting die 131.

[0035] Figure 2 The diagram shows Figure 1 An exploded view of the printed component 100. The printed component 100 may include an interconnecting adhesive 121. The interconnecting adhesive 121 may be a pressure-sensitive adhesive. The interconnecting adhesive 121 may be used to attach the interconnecting circuit 140 to the fluid structure 120 as part of a fluid structure assembly. The fluid structure assembly may further include a fluid jetting device 130. The fluid structure assembly of the fluid structure 120 and the interconnecting circuit 140 may be attached to the molding body 110 by placing the fluid structure 120 in a recess 109 of the molding body 110 and bending the interconnecting circuit 140 to attach the interconnecting circuit 140 to the molding body 110 using a molding body-interconnecting adhesive 101.

[0036] The fluid structure 120 can be attached to the molding body 110 using a first joint adhesive 117a and a second joint adhesive 117b (collectively referred to herein as joint adhesive 117). The first joint adhesive 117a can be the same as the second joint adhesive 117b. The first joint adhesive 117a can surround a first output end and a second output end of the molding body 110. The second joint adhesive 117b can surround a third output end of the molding body 110. The first joint adhesive 117a can be located at a first fluid joint between the first output end of the molding body 110 and a first input end of the fluid structure 120, and at a second fluid joint between the second output end of the molding body 110 and a second input end of the fluid structure 120. The second joint adhesive 117b can be located at a third fluid joint between the third output end of the molding body 110 and a third input end of the fluid structure 120. The joint adhesive 117 can form a fluid-impermeable fluid path between the molding body and the fluid structure 120. The joint adhesive 117 can attach the fluid structure to the molding body.

[0037] The fluid structure 120 may be attached to the molding body 110 alternatively or additionally using at least one structural adhesive 115. At least one structural adhesive 115 may be located on a shelf 1114 in a recess 109 of the molding body 110. An edge of the fluid structure 120 may contact the at least one structural adhesive on the shelf 114 of the recess 109, thereby securing the fluid structure 120 within the recess. An interconnect circuit 140 may be sandwiched between the fluid structure 120 and the shelf 114. A front edge of the shelf 114 facing the front of the molding body 110 to which the interconnect circuit 140 is attached may be parallel to the front edge to facilitate bending of the interconnect circuit 140 to attach it to the front edge. The parallel alignment of the front edge of the shelf 114 with the front edge facilitates bending of the interconnect circuit 140 along a line parallel to the front edge, thereby aligning the interconnect circuit 140 with the molding body-interconnect adhesive 101.

[0038] The molding body 110 may include a support 112 for supporting interconnect circuitry 140. Interconnect circuitry 140 may be sandwiched between the support 112 and the fluid structure 120. A front edge of the support 112 facing the front of the molding body 110 may be parallel to the front surface to facilitate bending of the interconnect circuitry 140 to attach it to the front surface. The parallel front edge of the support 112 facilitates bending of the interconnect circuitry 140 along a line parallel to the front surface, such that the interconnect circuitry 140 is aligned with the molding body-interconnect adhesive 101. The front edge of the support 112 may be aligned with the front edge of the shelf 114 to facilitate bending of the interconnect circuitry 140 to attach it to the molding body 110. The support 112 may be a first support for the interconnect circuitry 140, and the shelf 114 may be a second support for the interconnect circuitry 140.

[0039] The printed component 100 may include a support adhesive 113 for attaching the interconnecting circuitry 140 to the support member 112. The printed component 100 may include at least one UV adhesive 111 for holding the fluid structure 120 in place, at least during manufacturing. In the example, the UV adhesive 111 is applied to the molding body 110, the fluid structure 120 is placed on the molding body, and the fluid structure contacts the UV adhesive 111. The UV adhesive 111 is cured to hold the fluid structure 120 in place, and hot air flows through the recess 109 to cure the connector adhesive 117, at least one structural adhesive 115, and the support adhesive 113.

[0040] The printed component 100 may include a printed component adhesive 133 for attaching the fluid jetting device 130 to the fluid structure 120. The fluid jetting device 130 may be attached to the fluid structure 120 before it is attached to the molded body. Wires 132 connecting the fluid jetting device 130 to the interconnect circuitry 140 may be covered by an encapsulation 134.

[0041] Figure 3 The diagram shows Figure 1A front view of the printed part 100. The central axis A of the electrical interconnect pad array 142 of the interconnect circuit 140 can be aligned with the central axis of the molding body 110. The electrical interconnect pad array 142 includes a plurality of electrical interconnect pads. The central axis A of the electrical interconnect pad array 142 can be aligned with the central axis of the second fluid jet die 131b of the fluid jetting device 130. The central axis A of the electrical interconnect pad array 142 can be aligned with the centroid of the printed part 100. In some examples, a first distance 104 between the first edge of the interconnect circuit 140 and the first edge of the molding body 110 and a second distance 102 between the second edge of the interconnect circuit 140 and the second edge of the molding body 110 are the same. In some examples, a third distance 106 between the first edge of the molding body 110 and the central axis A of the electrical interconnect pad array 142 and a fourth distance 108 between the second edge of the molding body 110 and the central axis A of the electrical interconnect pad array 142 are the same. The first and second edges of the molded body 110 may be defined by the side edges of the front wall of the molded body 110.

[0042] Aligning the central axis A of the electrical interconnect pad array 142 with the central axis of the molding body 110 and / or the second fluid jet die 131b reduces rotational movement of the print part 100 when mounted in a host controller (e.g., a printer). The host controller may include a contact array corresponding to the electrical interconnect pad array 142. The contact array can contact the electrical interconnect pad array 142 to connect the interconnect circuitry 140 to the host controller circuitry. Centering the interconnect circuitry 140 and / or aligning the central axis A of the electrical interconnect pad array 142 with the central axis of the molding body 110 reduces rotational movement of the print part due to contact between the contact array of the host controller and the electrical interconnect pad array 142. The host controller may be a printer. A relatively narrow interconnect circuitry and interconnect pad array are also achieved, whereby the fine lines of the interconnect circuitry can extend along the central axis A between the interconnect pads.

[0043] Figure 4 The diagram illustrates a fluid structure assembly, which includes... Figure 1 The fluid structure 120, fluid jet device 130, interconnecting circuit 140, wires 132, and package 134 (not shown) are included. The interconnecting circuit 140 may include a first (end) portion 141, an intermediate portion 145, and a second (end) portion 147. In the figures, the second portion 147 is partially covered by the head surface of the fluid structure 120.

[0044] The first part 141 may include an electrical interconnect pad array 142. The electrical interconnect pad array 142 may include electrical interconnect pads 142a to 142m. The electrical interconnect pads 142a to 142m may be arranged on both sides of the central axis A of the electrical interconnect pad array 142. The electrical interconnect pads 142a to 142m may be arranged in two columns, one column on a first side of the central axis A of the electrical interconnect pad array 142, and a second column on a second side of the central axis A of the electrical interconnect pad array 142. These two columns may extend substantially parallel to each other and parallel to the central axis A of the electrical interconnect pad array 142. In the installed state, the central axis A of the electrical interconnect pad array 142 may be aligned with the second fluid jet die 131b (or the intermediate nozzle array of the fluid jet device 130). In the illustrated example, all electrical interconnect pads 142a to 142m of the printed component for connection to the host controller are arranged in no more than two columns.

[0045] The central axis A of the electrical interconnect pad array 142 can be aligned with the central axis of the fluid jet device 130 or the central fluid jet die. A second part may include contact pads 146. Contact pads 146 can be connected to the fluid jet die 131 via wires 132. Wires 132 can pass through vias 124 to connect the fluid jet die 131 to the contact pads 136. Contact pads 146 may include a north contact pad and a south contact pad, with the north contact pad being further away from the electrical interconnect pad array 142 than the south contact pad. Wires 132 may include a north wire and a south wire, with the north wire being further away from the electrical interconnect pad array 142 than the south wire. Wires may be connecting wires, interconnect bundles, or other interconnect circuit systems. The north contact pad can be connected to the north end of the fluid jet die 131 via a north wire. The south contact pad can be connected to the south end of the fluid jet die 131 via a south wire.

[0046] The intermediate portion 145 may include a line 144 connecting the electrical interconnect pad array 142 to the contact pad 146. The line 144 may be a metallic trace and / or a flexible trace. In some examples, the electrical interconnect pad array 142 and the contact pad 146 may be defined at opposite ends of the line 144. The electrical interconnect pads 142a to 142m may be widened portions of the line 144 to facilitate connection to a contact array of the host controller. The contact pad 146 may be the portion of the line 144 connected to the conductor 132. The electrical interconnect pads 142 to 142m and the contact pad 146 may each have a widened region or bump formed at opposite ends of the line 144.

[0047] Interconnect circuitry 140 may include a flexible substrate 148. Connection wiring, including an array of electrical interconnect pads 142, lines 144, and contact pads 146, may be located on or above the flexible substrate 148. The flexible substrate 148 may be electrically insulating. Interconnect circuitry 140 may include a protective layer 149. Protective layer 149 may extend over a portion of the electrical interconnect pad array 142 and over lines 144. Electrical interconnect pads 142a to 142m may be exposed to facilitate connection to a contact array of a host controller. Contact pads 146 may be exposed to facilitate connection to wires that connect contact pads 146 to the fluid injection die 131.

[0048] The second portion 147 can be laterally displaced relative to the first portion 141. The second portion 147 can be laterally displaced relative to the central axis A of the electrical interconnect pad array 142. The central axis of the second portion 147 can be laterally displaced relative to the central axis A of the electrical interconnect pad array 142. The central axis of the second portion 147 can be parallel to the central axis A of the electrical interconnect pad array 142. The contact pad 146 can be laterally displaced relative to the central axis of the second portion. In the installed state, the contact pad can be laterally displaced relative to the central axis of the second portion toward the fluid jet device 130. In the installed state, the second portion 147 can extend only along one side of the fluid jet device 130. The conductor 132 can extend from the fluid jet die 131 toward the contact pad 146 in the same direction as the direction in which the second portion 147 is displaced from the central axis A of the electrical interconnect pad array 142. The second portion 147 can be displaced from the central axis A of the electrical interconnect pad array 142 in a first direction, and the conductor 132 can extend toward the contact pad 146 in the first direction.

[0049] The central axis of the intermediate portion 145 may extend at an acute angle relative to the central axis A of the electrical interconnect pad array 142. The central axis of the intermediate portion 145 may extend at a 45° angle relative to the central axis of the electrical interconnect pad array. The central axis of the flexible substrate 148 in the intermediate portion 145 may extend at an acute angle relative to the central axis A of the electrical interconnect pad array 142. The angle may be measured on the side of the central axis A closer to the second portion 147. The overall orientation of the lines 144 in the intermediate portion 145 may extend at an acute angle relative to the overall orientation of the lines 144 in the first portion 141 and / or the second portion 147.

[0050] Interconnect circuit 140 may include a metal structure 143. Metal structure 143 may include a first metal structure 143a and a second metal structure 143b. Metal structure 143 may be insulated from the electrical interconnect pad array 142, lines 144, and contact pads 146. Metal structure 143 may increase the rigidity of the flexible circuit. Metal structure 143 may have the same material as the electrical interconnect pad array 142, lines 144, and contact pads 146.

[0051] The electrical interconnect pads 142 to 142m in the electrical interconnect pad array 142 may include a first electrical interconnect pad 142a, a second electrical interconnect pad 142b, a third electrical interconnect pad 142c, a fourth electrical interconnect pad 142d, a fifth electrical interconnect pad 142e, a sixth electrical interconnect pad 142f, a seventh electrical interconnect pad 142g, an eighth electrical interconnect pad 142h, a ninth electrical interconnect pad 142i, a tenth electrical interconnect pad 142j, an eleventh electrical interconnect pad 142k, a twelfth electrical interconnect pad 142l, and a thirteenth electrical interconnect pad 142m. Each of the electrical interconnect pads 142 to 142m may correspond to a host controller contact on the host controller contact array. Each of the electrical interconnect pads 142 to 142m may correspond to a contact pad in contact pad 146, and the corresponding contact pad is connected to a corresponding wire in wire 132, which is connected via a corresponding line in line 144 to a corresponding connection pad in the connection pad circuitry of the fluid jet die 131. The connection pads of the fluid jet die may correspond to the host controller contact array, such that the host controller can control the fluid jet die 131 using electrical signals, voltages, and / or pulses transmitted from the host controller contact array via the electrical interconnect pad array 142, line 144, contact pad 146, and wire 132.

[0052] In this example, voltage is conducted from a contact on the host controller contact to a corresponding electrical interconnect pad in the electrical interconnect pad array 142. Voltage is conducted from the electrical interconnect pad to a corresponding line in line 144 connected to that electrical interconnect pad. Voltage is conducted from the line to a corresponding contact pad in contact pad 146 connected to that line. Voltage is conducted from the contact pad to a corresponding wire in conductor 132 connected to that contact pad. Voltage is conducted from the conductor to a corresponding connection pad in fluid jet die 131 connected to that conductor. The voltage causes one or more fluid jets to be ejected from the fluid jet die 131. In this way, the electrical interconnect pads, lines, contact pads, and conductors form an electrical path between the host controller contact and the corresponding connection pad in the fluid jet die 131.

[0053] The first electrical interconnect pad 142a can be a pen detection pad. The first electrical interconnect pad 142a can have a voltage from 0 V to 3.3 V. The second electrical interconnect pad 142b can be a sensing or analog read signal pad, which is a low-voltage input / output pad for temperature measurement, strain gauge sensing, and non-volatile memory read. The second electrical interconnect pad 142b can have a voltage from 0 V to 3.3 V. The second electrical interconnect pad 142b can transmit an analog signal value between 0 V and 3.3 V. The third electrical interconnect pad 142c can be a mode pad, supplying a low-voltage input signal for selecting between a data loading mode and a register access mode. The third electrical interconnect pad 142c can have a voltage from 0 V to 3.3 V. The third electrical interconnect pad 142c can transmit a logic low signal and a logic high signal. In some examples, the logic low signal can be approximately 0 V, and the logic high signal can be approximately 3.3 V. In some examples, the logic low signal can be approximately 3.3 V, and the logic high signal can be approximately 0 V. The fourth electrical interconnect pad 142d can be a clock pad, used to provide a clock signal and a low-voltage input signal for loading transmit pulse group data and for register access. The fourth electrical interconnect pad 142d can have a voltage from 0V to 3.3V. The fifth electrical interconnect pad 142e can be a first data select pad. The sixth electrical interconnect pad 142f can be a second data select pad. The seventh electrical interconnect pad 142g can be a third data select pad. The first, second, and third data select pads can be low-voltage input / output signal pads used to receive input from the fluid jet die 131 to load pulse data groups and configure register data. When serially shifting out status register data, the first, second, and third data select pads can be used to send the output from the fluid jet die 131 to the host controller contact array. The fifth to seventh electrical interconnect pads 142e to 142g can each have a voltage from 0V to 3.3V. The fifth through seventh electrical interconnect pads 142e to 142g can transmit logic low and logic high signals. In some examples, the logic low signal can be approximately 0 V and the logic high signal can be approximately 3.3 V. In some examples, the logic low signal can be approximately 3.3 V and the logic high signal can be approximately 0 V. The eighth electrical interconnect pad 142h can be a low-voltage ground pad and can be connected to the first electrical interconnect pad 142a. The ninth electrical interconnect pad 142i can be a high-voltage power source input pad, which is used to power the fluid jet resistor of the fluid jet die 131 and to program non-volatile memory bits. The ninth electrical interconnect pad 142i can have a voltage from 0 volts to 35 volts. The tenth electrical interconnect pad 142j can be a high-voltage ground pad, which serves as the return path for the fluid jet resistor of the fluid jet die 131.The eleventh electrical interconnect pad 142k can be a low-voltage power source input pad. The eleventh electrical interconnect pad 142k can have a voltage of 5.5 volts ±3%. The twelfth electrical interconnect pad 142l can be a emitter pad. The twelfth electrical interconnect pad 142l can transmit logic low and logic high signals of approximately 0 V and 3.3 V, respectively. The thirteenth electrical interconnect pad 142m can be a reset pad, which is used to reset the low-voltage input signal pad of one or more of the fluid injection dies 131. The thirteenth electrical interconnect pad 142m can transmit logic low and logic high signals of approximately 0 V and 3.3 V, respectively.

[0054] The voltages discussed in this article can be DC voltages. Furthermore, the voltages discussed in this article can be approximate values. Additionally, the voltages used for logic high and logic low can depend on the voltages used by the host controller. In the example, the host controller can use approximately 0 V for logic low and approximately 3.3 V for logic high. In another example, the host controller can use approximately 3.3 V for logic low and approximately 0 V for logic high.

[0055] The first loop between the second electrical interconnect pad 142b and ground can be separated from the second loop between the ninth electrical interconnect pad 142i and ground. The first loop and the second loop can be separate, such that the first loop and the second loop are not concentric, or such that the second loop does not surround the first loop.

[0056] In some examples, the electrical interconnect pads 142 to 142m may each be substantially square. In some examples, the electrical interconnect pads 142 to 142m may be substantially circular. A substantially square electrical interconnect pad has the advantage of including an increased contact surface compared to a circular electrical interconnect pad. A substantially square electrical interconnect pad has the advantage of being perpendicular to the edge of the protective layer 149, rather than forming an acute angle with the edge of the protective layer 149 as with a circular electrical interconnect pad. Being perpendicular to the edge of the protective layer 149 can provide a larger nucleation point for moisture, printing fluid, and / or debris compared to forming an acute angle. In some examples, the electrical interconnect pads 142 to 142m include at least one rounded corner. In some examples, the electrical interconnect pads 142 to 142m include at least one chamfered corner. In some examples, line 144 includes at least one rounded corner. In some examples, line 144 includes at least one chamfered corner.

[0057] Figure 5 The diagram shows Figure 1Interconnect circuit 140. Electrical interconnect pad array 142 is located on the same side of interconnect circuit 140 as lines 144 and contact pads 146. Interconnect circuit 140 can be a thin or ultra-thin circuit, such as a thin printed circuit board (PCB) with a thickness between 0.2 mm and 1 mm. Flexible substrate 148 can be rigid or semi-rigid and has hinges, allowing interconnect circuit 140 to bend to attach to molded body 110 and fluid jet device 130. Interconnect circuit 140 can have a thickness of less than 0.2 mm. Interconnect circuit 140 can include connection wiring including lines 144, electrical interconnect pad array 142, and contact pads 146 on flexible substrate 148. The term "flexible" as used in flexible substrate 148 or flexible circuit refers to the ability to bend or flex more than 90° without breaking or being damaged. In some examples, flexible substrate 148 can be a PET layer approximately 0.05 mm thick on which the circuit system is deposited to form interconnect circuitry. In some examples, the flexible substrate 148 may be polyimide.

[0058] Figure 6 An example fluid structure assembly is illustrated, comprising a fluid structure 620, a printed component 630 having a fluid jet die 631, interconnecting circuitry 640, wires 632 connecting the interconnecting circuitry 640 to the fluid jet die 631, and an encapsulation (not shown) covering the wires 632. The printed component 630 may be similar to... Figure 1 The fluid jetting device 130 differs in that the printing part 630 has only one fluid jetting core 631.

[0059] Interconnect circuitry 640 may include an array of electrical interconnect pads 642, which includes electrical interconnect pads 642a to 642k on a first portion 641 of interconnect circuitry 640. Interconnect circuitry 640 may include contact pads 646 on a second portion 647 of interconnect circuitry 640, the contact pads 646 being connected to the array of electrical interconnect pads 642 via lines 644 (e.g., metal traces and / or flexible traces). Conductors 632 (e.g., connecting conductors) may connect a fluid jet die 631 to the contact pads 646. Conductors 632 may pass through vias 624 to connect the fluid jet die 631 to the contact pads 646.

[0060] Interconnect circuitry 640 may include a flexible substrate 140, with an array of electrical interconnect pads 642, lines 644, and contact pads 646 located on or above the flexible substrate. The first portion 641, the intermediate portion 645, and the second portion 647 may be oriented similarly to... Figure 4 The circuit consists of a first part 141, a middle part 145, and a second part 147. The interconnecting circuit 640 can be a flexible circuit. The printing component 630 can be a fluid jetting device.

[0061] The interconnect circuit 640 may include a metal structure 643. The metal structure 643 may include a first metal structure 643a and a second metal structure 643b. The metal structure 643 may be insulated from the electrical interconnect pad array 642, the lines 644, and the contact pads 646. The metal structure 643 may increase the rigidity of the flexible circuit. The metal structure 643 may have the same material as the electrical interconnect pad array 642, the lines 644, and the contact pads 646.

[0062] In addition to the electrical interconnect pads 642a to 642k including only one data selection pad, the electrical interconnect pads 642a to 642k may have the same as Figure 4 The electrical interconnect pads 142a to 142m of the interconnect circuit 140 have similar functions. The fifth electrical interconnect pad 642e can be a single data selection pad of the electrical interconnect array 642. Electrical interconnect pads 642a to 642k and 642f to 642k can have the same functions and relative positions as electrical interconnect pads 142a to 142d and 142h to 142m.

[0063] Figure 7 This is a block diagram of an example interconnect circuit 700. The interconnect circuit may include: a first portion 741 including an array of electrical interconnect pads 742 for connection to a host controller-side contact array to electrically connect the interconnect circuit 700 to host controller circuitry, the array of electrical interconnect pads 742 extending on both sides of a central axis 701 of the array of electrical interconnect pads; and a second portion 747 including contact pads 746 connected to the electrical interconnect pads via lines 744 for connection to an integrated circuit of a printed component, the second portion 747 being laterally displaced relative to the central axis 701 of the array of electrical interconnect pads.

[0064] Interconnect circuitry 700 may include an intermediate portion connecting first portion 741 and second portion 747. The intermediate portion may include line 744. The central axis of the intermediate portion may extend at an acute angle relative to the central axis 701 of the electrical interconnect pad array. Interconnect circuitry 700 may include an electrically insulating support substrate for supporting line 744, wherein the central axis of the substrate in the intermediate portion extends at an acute angle relative to the central axis of the substrate in the first and / or second portions. The central axes of the first and second portions may extend parallel to each other. The general direction of the line in the intermediate portion extends at an acute angle to the general direction of the line in the first and / or second portions. The central axis of the intermediate portion may extend at a 45° angle relative to the central axis 701 of the electrical interconnect pad array. The second portion may extend only along one lateral side of the printed component. In the mounted state, the central axis 701 of the electrical interconnect pad array may be aligned with the central axis of the die of the integrated circuit of the printed component. First portion 741 may be attached to a molded reservoir body such that the central axis 701 of the electrical interconnect pad array is aligned with the central axis of the molded body. Contact pads 746 can be laterally displaced relative to the central axis of the second portion. In the mounted state, the contact pads can be laterally displaced relative to the central axis of the second portion toward the printed component. The contact pads can be arranged in two sets, one set for connecting to a first end of at least one fluid jet die of the printed component, and another set for connecting to a second end of the at least one fluid jet die of the printed component. The interconnect circuit can be a flexible circuit including a flexible substrate, and line 744 can be a flexible line. The printed component can be a fluid jetting device. The electrical interconnect pad array 742 can include two columns, wherein a first column is on a first side of the central axis 701 of the electrical interconnect pad array, and a second column is on a second side of the central axis 701 of the electrical interconnect pad array. These columns can extend substantially parallel to each other and parallel to the central axis 701 of the electrical interconnect pad array.

[0065] Figure 8 This is a block diagram of an example printed component 800. The printed component 800 may include a molded storage body 810, an integrated circuit 830, and... Figure 7 The interconnect circuit 740 is attached to the molded body 810 and the integrated circuit 830. A first portion 741 is attached to the surface of the molded body along the central axis 801 of the front of the molded body 810, and a second portion 747 includes at least one contact pad 746 electrically connected to the integrated circuit 830. The second portion 747 is laterally displaced relative to the central axis 801 of the surface of the molded body.

[0066] The at least one contact pad 746 may be connected to the integrated circuit 830 via one or more connecting wires. The printed component may include at least one die, and the at least one die may be connected to the interconnect circuit 740 via at least one corresponding connecting wire.

[0067] Figure 9 This is a block diagram of an example printed component 900 including at least one connector 932. The printed component 900 may include a molding body 910, an integrated circuit 934, and interconnect circuitry 940 attached to the molding body 910 and the integrated circuit 934. The interconnect circuitry 940 may include a first end portion 941 including at least one electrical interconnect pad 942 attached to the molding body 910, a second end portion 947 including at least one contact pad 946 laterally displaced relative to the first end portion 941 in a first direction, and at least one connector 932 electrically connecting the integrated circuit 934 and the at least one contact pad 936, the at least one connector 932 extending along the first direction.

[0068] Interconnect circuit 940 may be a flexible circuit including a flexible substrate. Integrated circuit 934 may be a fluid jetting device. Interconnect circuit 940 may include an array of electrical interconnect pads, the array including the at least one electrical interconnect pad 942. The electrical interconnect pad array may include two columns, a first column on a first side of the central axis of the electrical interconnect pad array, and a second column on a second side of the central axis of the electrical interconnect pad array. These columns may extend substantially parallel to each other and parallel to the central axis of the electrical interconnect pad array. Interconnect circuit 940 may include an intermediate portion connecting a first end portion 941 and a second end portion 947, wherein interconnect circuit 940 includes an electrically insulating support substrate, wherein the substrate of the intermediate portion extends at an acute angle relative to the central axis of the electrical interconnect pad array including the at least one electrical interconnect pad 942. The intermediate portion may extend at a 45° angle relative to the central axis of the electrical interconnect pad array. The second end portion 947 may extend only along one lateral side of integrated circuit 934. The central axis of the electrical interconnect pad array may be aligned with the central axis of the fluid jetting die of integrated circuit 934. The central axis of the electrical interconnect pad array can be aligned with the central axis of the molding body 910. The contact pads can be configured in two sets, one set connected to one end of at least one fluid jet die of the integrated circuit 934, and the other set connected to the other end of the at least one fluid jet die. At least one connector 932 can extend through a molding via in a fluid structure supporting the integrated circuit 934, the fluid structure being used to guide fluid from at least one molding reservoir of the molding body to at least one fluid jet die of the integrated circuit.

[0069] Figure 10 The diagram shows Figure 1 The interconnect circuit 140 has a north contact pad 1046 among its contact pads 146. A south contact pad in contact pad 146 may have similar characteristics to the north contact pad 1046. The north contact pad 1046 may be a portion of line 144 connected to a conductor to connect the interconnect circuit 140 to the fluid jet device 130. Line 144 may include a first segment connecting the electrical interconnect pad array 142 to the contact pad 146. Line 144 may include a second segment extending through the contact pad 146 to increase the rigidity of the interconnect circuit 140. For example, a second segment 1052 extends through the north contact pad 1046, parallel to at least a portion of the first segment of the line in line 144 extending between the electrical interconnect pads in the electrical interconnect pad array 142 and the contact pad in the north contact pad 1046. The second segment 1052 may extend below the protective layer 149. In some examples, the line may turn near the contact pad. The trace can be turned near the contact pad to allow the second segment 1052 to extend parallel to the trace 144. Another example is the second segment 1056, which extends perpendicular to its corresponding contact pad in the north contact pad 1046. The second segment 1056 can extend perpendicular to its corresponding trace and other traces in the trace 144 to increase the rigidity of the interconnect circuit 140. The second segments 1052 and 1056 can increase the rigidity of the interconnect circuit 140 to increase the reliability of the connection between the north conductor in the conductor 136 and the north contact pad 1046. The widths of the second segments 1052 and 1056 can be equal to or different from the width of the north contact 1046. The trace 144 can include a widening portion to increase the rigidity of the trace 144. An example is the widening portion 1058, which increases the width of the trace in the trace 144 to increase the rigidity of the interconnect circuit 140.

[0070] Line 144 may include a gusset plate to reinforce the line in a first and / or second segment. Example: Ggusset plate 1054 reinforces the line at a corner in line 144. Line 144 may include a gusset plate in a first and / or second segment. Line 144 may include a gusset plate near contact pad 1046. Ggusset plate 1054 may increase the rigidity of interconnect circuit 140 to increase the reliability of the connection between the north conductor in conductor 136 and the north contact pad 1046.

[0071] Figure 11 The illustration shows that Figure 6 The north contact pad 1146 is located on the north portion of the interconnect circuit 640. The south contact pad in contact pad 646 can have similar characteristics to the north contact pad 1146. The north contact pad 1146 of the interconnect circuit 640 can have characteristics similar to... Figure 1 The interconnect circuit 140 has similar characteristics to the north contact pad 1046.

[0072] North contact pad 1146 may be a portion of line 644 connected to a conductor to connect interconnect circuit 640 to fluid jet device 130. Line 644 may include a first segment connecting electrical interconnect pad array 642 to contact pad 646. Line 644 may include a second segment extending through contact pad 646 to increase the rigidity of interconnect circuit 640. Example: Second segment 1152 extends through north contact pad 1146, parallel to at least a portion of the first segment of line 644 extending between the electrical interconnect pads in electrical interconnect pad array 642 and the contact pad in north contact pad 1146. Second segment 1152 may extend below protective layer 649. In some examples, the line may turn near the contact pad. The line may turn near the contact pad to allow second segment 1152 to extend parallel to line 644. Another example: Second segment 1156 extends perpendicular to its corresponding contact pad in north contact pad 1146. The second segment 1156 may extend perpendicularly to its corresponding line and other lines in line 644 to increase the rigidity of interconnect circuit 640. Second segments 1152 and 1156 may increase the rigidity of interconnect circuit 640 to increase the reliability of the connection between the north conductor in conductor 636 and the north contact pad 1146. The widths of second segments 1152 and 1156 may be equal to or different from the width of north contact 1146. Line 644 may include widening portions to increase the rigidity of line 644. Example: Widening portion 1158 increases the width of the lines in line 644 to increase the rigidity of interconnect circuit 640.

[0073] Line 644 may include a gusset plate to reinforce the line in a first and / or second segment. Example: Gap plate 1154 reinforces the line at a corner in line 644. Line 644 may include a gusset plate in a first and / or second segment. Line 644 may include a gusset plate near contact pad 1146. Gap plate 1154 may increase the rigidity of interconnect circuit 640 to increase the reliability of the connection between the north conductor in conductor 636 and the north contact pad 1146.

[0074] Figure 12 The illustration shows an example connecting wire 1232 for connecting contact pad 1246 to a fluid jet die. The example connecting wire 1232 can be connected at contact pad 1246 to line 1244 of a flexible circuit. These are similar to... Figure 10 and Figure 11 Lines 144 and 644, and line 1244 may extend beyond contact pad 1246 and may include a gusset plate and a widened portion.

[0075] Figure 13 The illustration shows the part attached to the molded body 1310. Figure 6The interconnect circuit 640. The interconnect circuit 640 can use a similar... Figure 1 A molding body-interconnection circuit adhesive 101 (not shown) is attached to a molding body. An interconnection circuit 640 may be attached to the molding body 1310 and may be bent to attach to a printed part (not shown). The interconnection circuit 640 may be lifted away from the molding body 1310 along a lift-off edge 1301. The lift-off edge 1301 may correspond to the edge of the interconnection circuit adhesive. A second metal structure 643b may extend from below the lift-off edge 1301 to above the lift-off edge 1301. The second metal structure 643b may increase the stiffness of the interconnection circuit 640 across the lift-off edge 1301. The second metal structure 643b may distribute the peel force applied to the interconnection circuit 640 at the lift-off edge 1301 to prevent the interconnection circuit 640 from peeling off from the molding body 1310. In some examples, a first metal structure 643a and / or a second metal structure 643b extend across the lift-off edge 1301.

[0076] Figure 14 The diagram shows Figure 1 The interconnect circuit 140 includes a portion of a tool hole 1410. The tool hole 1410 can be used to attach the interconnect circuit 140 to a molded body (e.g., Figure 1 The interconnect circuitry 140 is aligned during the molding of the body 110. The tool hole 1410 can be formed by punching through or otherwise cutting through the substrate 148 and the protective layer 149. Forming the tool hole 1410 by punching through the substrate 148 and the protective layer 149 makes the tool hole 1410 more precise and rigid than the case where the tool hole is punched through the substrate 148 and then the protective layer is applied.

[0077] A gusset plate 1412 can be formed in line 144 to surround tool hole 1410. The gusset plate 1412 can reinforce tool hole 1410 to increase the rigidity of its edges and improve the accuracy of aligning interconnect circuit 640 for attachment using tool hole 1410. The gusset plate 1412 can also reinforce tool hole 1410 to prevent tearing or damage to interconnect circuit 140.

[0078] The second electrical interconnect pad 142ab may be located on the first lateral side of the electrical interconnect pad array 142, and the ninth electrical interconnect pad 142i may be located on the second lateral side of the electrical interconnect pad array 142. Having the second electrical interconnect pad 142b and the ninth electrical interconnect pad 142a on opposite sides of the electrical interconnect pad array 142 can improve the functionality of the second electrical interconnect pad 142b by separating the second electrical interconnect pad 142b carrying a low-voltage sensing signal from the high-voltage ninth electrical interconnect pad 142i carrying a high-voltage power signal. Separating the low-voltage component from the high-voltage component can reduce noise on the low-voltage component caused by the high-voltage component.

[0079] The traces connected to the second electrical interconnect pad 142b and the ninth electrical interconnect pad 142b can be separated by a first distance 1414. The trace connected to the second electrical interconnect pad 142b can be a second trace 144a. The trace connected to the ninth electrical interconnect pad 142i can be a ninth trace 144i. The first distance 1414 can be measured between the edges of the second trace 144b and the ninth trace 144i. The first distance 1414 can vary along the lengths of the second trace 144b and the ninth trace 144i.

[0080] The third electrical interconnect pad 142c and its corresponding third line 144c in line 144 can be separated from the second line 144b by a second distance 1416. The second distance 1416 can vary over the length of the third line 144c and the length of the second line 144b. The second distance 1416 can be measured between the edges of the third line 144c and the second line 144b.

[0081] The second distance 1416 can be smaller than the first distance 1414 because the second electrical interconnect pad 14b and the third electrical interconnect pad 142c are both low-voltage pads, so separating them and their corresponding lines is not as important as separating the second electrical interconnect pad 142b and the ninth (high-voltage) electrical interconnect pad 142i. The first distance 1414 can be greater than or equal to twice the second distance 1416. The first distance 1414 can be greater than or equal to twice the second distance along the length of line 144. The first distance 1414 and the second distance 1416 can each be greater than the minimum distance between adjacent lines in line 144. In the example, the second distance 1416 along the length of line 144 is greater than or equal to 60 micrometers, and the first distance 1414 along the length of line 144 is greater than or equal to 100 micrometers. In another example, the second distance 1416 along the length of line 144 is greater than or equal to 100 micrometers, and the first distance 1414 along the length of line 144 is greater than or equal to 270 micrometers.

[0082] Figure 15The diagram illustrates a cross-section of an example interconnect circuit 1540. The interconnect circuit 1540 can be similar to... Figure 1 Interconnection circuits 140 and / or Figure 6 The interconnect circuit 640. The discussion of the characteristics of the interconnect circuit 1540 can be applied to... Figure 1 Interconnection circuits 140 and / or Figure 6 The interconnect circuit 640.

[0083] Interconnect circuitry 1540 may include a substrate 1508. Interconnect circuitry 1540 may include a substrate adhesive 1501. Substrate adhesive 1501 may be used to attach components to substrate 1508, such as connection wiring 1544 including electrical interconnect pads, contact pads, and lines. Interconnect circuitry 1540 may include connection wiring 1544 on substrate adhesive 1501 above substrate 1508. Connection wiring 1544 may include a metal core 1544a and a metal plating 1544b. Metal core 1544a may be a conductive core including a conductive metal (such as copper). Metal plating 1544b may be a conductive metal plating including one or more conductive metals or metal alloys (such as a gold / nickel alloy). In an example, metal plating 1544b includes a nickel layer and a gold layer plated over the nickel layer. The nickel layer may be plated on the metal core 1544a, and then gold may be plated on the nickel layer to form metal plating 1544b. In some examples, a portion of the connection wiring 1544 includes a metal plating 1544b. In other examples, the entire connection wiring 1544 includes a metal plating 1544b.

[0084] Interconnect circuitry 1540 may include a protective layer 1509 and a protective layer adhesive 1502 for attaching the protective layer 1509 to interconnect circuitry 1540. The protective layer 1509 and protective layer adhesive 1502 may cover a portion of connection wiring 1544. A portion of connection wiring 1544 (such as electrical interconnect pads and contact pads) may be exposed to facilitate electrical connection. Interconnect circuitry can be formed by depositing a metal core 1544a of connection wiring 1544 over a substrate 1508, plating a metal plating layer 1544b over the metal core 1544a, and then adding the protective layer 1509 and protective layer adhesive 1502 to interconnect circuitry 1540. In this way, the entire connection wiring 1544 includes the metal plating layer 1544b, including the portion of connection wiring 1544 covered by the protective layer 1509. This has the advantage of increasing uniformity and conductivity in connection wiring 1544.

[0085] Figure 16 The diagram shows Figure 6An exploded view of the fluid structure components. Interconnect circuit 640 may have an array of electrical interconnect pads 642, lines 644, and contact pads 646 on its first surface. A second surface of interconnect circuit 640, opposite to the first surface, may... Figure 16 As shown, the electrical interconnect pad array 642, the line 644, and the contact pad 646 are in Figure 16 Not shown in the image.

[0086] Interconnect adhesive 621 can be used to attach interconnect circuitry 640 to fluid structure 620. Interconnect adhesive 621 can be shaped such that it does not cover vias 624 through which conductors 632 pass to connect printed components 630 to contact pads 646. In this way, package 634 can pass through vias 624 to contact interconnect circuitry 640, thereby increasing the stability of interconnect circuitry 640. Interconnect adhesive 621 can be shaped to allow supports (e.g., Figure 1 The support member 112) contacts the interconnect circuit 620, such that the interconnect circuit 620 is sandwiched between the support member and the fluid structure 620. The interconnect circuit adhesive 621 may be a pressure-sensitive adhesive or any other substance used to attach the interconnect circuit 640 to the fluid structure 620.

[0087] The fluid structure 620 may include a ventilation bend 622. The ventilation bend 622 can connect the nozzle array of the printed component 630 to the back or side of the fluid structure 620 to control the humidity of the nozzle array. The length and volume of the ventilation bend 622 determine the humidity of the nozzle array. An interconnecting circuit adhesive 621 covers the surface of the ventilation bend 622. Covering the surface of the ventilation bend 622 with the interconnecting circuit adhesive 621 allows for molding of the ventilation bend 622 and provides precise control over its volume and length.

[0088] Figure 17 The diagram shows Figure 1 An exploded view of the fluid structure components. Interconnect circuit 140 may have an array of electrical interconnect pads 142, lines 144, and contact pads 146 on a first surface of interconnect circuit 140. A second surface of interconnect circuit 140 opposite to the first surface may... Figure 17 As shown, the electrical interconnect pad array 142, the line 144, and the contact pad 146 are in Figure 17 Not shown in the image.

[0089] Interconnect adhesive 121 can be used to attach interconnect circuitry 140 to fluid structure 120. Interconnect adhesive 121 can be shaped such that it does not cover vias 124 through which conductors 132 pass to connect fluid jetting device 130 to contact pads 146. In this way, package 134 can pass through vias 124 to contact interconnect circuitry 140, thereby increasing the stability of interconnect circuitry 140. Interconnect adhesive 121 can be shaped to allow… Figure 1 The support 112 contacts the interconnect circuit 120, such that the interconnect circuit 120 is sandwiched between the support 112 and the fluid structure 120. The interconnect circuit adhesive 121 may be a pressure-sensitive adhesive or any other substance used to attach the interconnect circuit 140 to the fluid structure 120.

[0090] Figure 18 This is a block diagram of an example flexible circuit 1840 for a fluid jet assembly. The flexible circuit may include: a connection wiring 1818 including metal traces 1844, electrical interconnect pads 1842, and contacts 1846, wherein each metal trace is used to electrically connect an electrical interconnect pad on a first portion 1841 of the flexible circuit 1840 to a contact on a second portion 1847 of the flexible circuit 1840, the contact being used to connect to a fluid jet die; and a metal structure 1843 located between and spaced from the electrical interconnect pads and contacts, electrically insulated from the wiring 1818, the metal structure 1843 being used to increase the stiffness of at least a portion of the flexible circuit 1840.

[0091] The flexible circuit 1840 may include a substrate and a protective layer on the opposite side of the wiring 1818, wherein at least a portion of the metal structure 1843 extends between the substrate and the protective layer and / or in the same layer as the wiring 1818. The metal trace may include a first segment connecting electrical interconnect pads to contacts, and a second segment extending beyond the contacts to increase the rigidity of the flexible circuit 1840. The contacts may extend between the first and second segments, and the trace may turn near the contacts. At least a portion of the first and second segments may extend between the substrate and the protective layer of the flexible circuit 1840, while the contacts are exposed. The first and second segments may be perpendicular to each other and / or parallel. The metal trace may include a gusset connecting the first and second segments and / or near the contacts and / or in the second segment. The metal trace, electrical interconnect pads, and contacts may have the same height and / or may be part of the same wiring layer. The flexible circuit 1840 may include a metal plating over the electrical interconnect pads, metal traces, and contacts, and a protective layer over a portion of the metal plating. The flexible circuit 1840 may include holes for aligning the flexible circuit to attach to a fluid jetting device assembly, the holes being formed by punching through a substrate and a protective layer of the flexible circuit 1840.

[0092] Figure 19 It includes Figure 18 A block diagram of an example fluid jetting device assembly 1900 with interconnecting circuitry 1840. The fluid jetting device assembly 1900 may include... Figure 18 The flexible circuit 1840 and the fluid jetting die 1931 at the bottom 1905 of the fluid jetting device assembly 1900, wherein the electrical interconnect pads 1842 of the flexible circuit 1840 extend along the front portion 1910 of the fluid jetting device assembly 1900, wherein one or more metal traces 1844 extend along the front portion 1910 and the bottom 1905 of the fluid jetting device assembly 1900 and bend between the front and the bottom to connect to the fluid jetting die 1931, and wherein a metal structure 1843 is disposed at the front portion 1910 of the fluid jetting device assembly 1900, below the interconnect pads 1842.

[0093] Figure 20This is a block diagram of an example interconnect circuit 2000 for connecting the integrated circuit of the printing component to the printer controller. Interconnect circuitry 2000 may include a thin substrate 2048 and interconnect wiring 2018 supported by the substrate 2048. Interconnect wiring 2018 may include metal traces 2044, electrical interconnect pads 2042, and contacts 2046, and a protective layer 2049 for protecting at least a portion of wiring 2018. Each metal trace in the metal traces 2044 is used to electrically connect an electrical interconnect pad in the electrical interconnect pad 2042 on a first portion of the flexible substrate 2048 to a contact of a contact pad 2046 on a second portion of the flexible substrate 2048. The interconnect pad is used for connection to a printer, and the contact is used for connection to a fluid jet die. At least one metal trace in the metal traces 2044 includes a first segment 2044a in the first and second portions, between the interconnect pad and the contact, and a second segment 2044b in the second portion extending beyond the contact. The interconnect pads 2042 and the contacts are exposed from the protective layer 2049 to facilitate connection to the printer and the die, respectively.

[0094] The interconnect circuit may include a metal structure located between and spaced apart from the electrical interconnect pads and contacts, the metal structure being electrically insulated from the connection wiring, and the metal structure being used to increase the stiffness of at least a portion of the flexible circuit.

[0095] Figure 21 This is a block diagram of an example flexible circuit 2100 for a fluid jet assembly, including a metal plating layer 2144a and a protective layer 2149. The flexible circuit 2100 may include: a flexible substrate 2148; interconnect wiring 2118 above the substrate, the interconnect wiring 2118 including metal traces 2144, electrical interconnect pads 2142, and contacts 2146, wherein each metal trace is used to electrically connect an electrical interconnect pad on a first portion of the flexible circuit 2100 to a contact on a second portion of the flexible circuit 2100, wherein each electrical interconnect pad is used to connect to a corresponding printer contact, and wherein each contact is used to connect to a fluid jet die; a metal plating layer 2121 above the electrical interconnect pads 2142, metal traces 2144, and contacts 2146; and a protective layer 2149 above a portion of the metal plating layer 2121.

[0096] Electrical interconnect pads 2142, contacts 2146, and metal traces 2144 may have the same height. At least one of the metal traces 2144 may include a first segment connecting the electrical interconnect pad to the contact, and a second segment extending beyond the contact to increase the rigidity of the flexible circuit 2140. At least a portion of the second segment extends between the substrate and the protective layer 2149 of the flexible circuit 2140. The first and second segments may be perpendicular and / or parallel to each other. At least one of the metal traces 2144 may include a triangular gusset connecting the first and second segments and / or near the contact and / or within the second segment. The flexible circuit 2140 may include a hole for aligning the flexible circuit 2140 to attach to a fluid jetting device assembly, the hole being formed by punching through the substrate and the protective layer 2149 of the flexible circuit 2140, the hole being positioned near the interconnect pads 2142. At least one of the metal traces 2144 includes a circular gusset to reinforce the hole.

[0097] Figure 22 The diagram shows Figure 4 The south end of the fluid structure assembly. The south end of the fluid structure assembly includes a south contact pad in contact pad 146 and a south conductor in conductor 132. Each of the first fluid jet die 131a, the second fluid jet die 131b, and the third fluid jet die 131c includes a south connection pad connected to the south contact pad via the south conductor.

[0098] Figure 23 The diagram shows Figure 22 A close-up of part 2201. The south contact pad in contact pad 146 can be connected to the eleventh line 144k, the tenth line 144j, and the ninth line 144i in the circuit. The eleventh line 144k can be connected to the eleventh electrical interconnect pad 142k. The tenth line 144j can be connected to the tenth electrical interconnect pad 142j. The ninth line 144i can be connected to the ninth electrical interconnect pad 142i.

[0099] The south conductor may include the eleventh conductor 132k connected to the eleventh line 144k at the corresponding contact pad, the tenth conductor 132j ​​connected to the tenth line 144j at the corresponding contact pad, and the ninth conductor 132i connected to the ninth line 144i at the corresponding contact pad. The reference to south conductor does not indicate the number or order of conductors, but rather the electrical connection to the corresponding line in line 144.

[0100] Figure 24 The diagram shows Figure 4The north end of the fluid structure assembly. The north end of the fluid structure assembly includes a north contact pad in contact pad 146 and a north conductor in conductor 132. Each of the first fluid jet die 131a, the second fluid jet die 131b, and the third fluid jet die 131c includes a north connection pad connected to the north contact pad via the north conductor.

[0101] Figure 25 The diagram shows Figure 24 A close-up of part 2401. The north contact pad in contact pad 146 can be connected to the tenth line 144j, the ninth line 144i, the twelfth line 144l, the thirteenth line 144m, the eighth line 144h, the second line 144b, the third line 144c, the fourth line 144d, the fifth line 144e, the sixth line 144f, and the seventh line 144g, each line connected to its corresponding electrical interconnect pad in the electrical interconnect pad array 142.

[0102] The south conductor may include the fourteenth conductor 132j-2 connected to the tenth line 144j at the corresponding contact pad, the fifteenth conductor 132i-2 connected to the ninth line 144i at the corresponding contact pad, the twelfth conductor connected to the twelfth line 144l at the corresponding contact pad, the thirteenth conductor 132m connected to the thirteenth line 144m at the corresponding contact pad, the eighth conductor 132h connected to the eighth line 144h at the corresponding contact pad, the second conductor 132b connected to the second line 144b at the corresponding contact pad, the third conductor 132c connected to the third line 144c at the corresponding contact pad, the fourth conductor 132d connected to the fourth line 144d at the corresponding contact pad, the fifth conductor 132e connected to the fifth line 144e at the corresponding contact pad, the sixth conductor 132f connected to the sixth line 144f at the corresponding contact pad, and the seventh conductor 132g connected to the seventh line 144g at the corresponding contact pad. The reference to the north conductor does not indicate the number or order of conductors, but rather the electrical connection to the corresponding line in line 144.

[0103] In this way, the fluid jet die 131 is electrically connected to the electrical interconnect pad array 142, enabling the host controller to control the fluid jet die 131.

[0104] Figure 26This is a block diagram of an example flexible circuit 2640 for connecting an integrated circuit of a printed component to a host controller. The flexible circuit 2640 may include a first portion 2641 including an electrical interconnect pad array 2642 for connection to the host controller. The electrical interconnect pad array 2642 includes a first electrical interconnect pad 2642a on a first lateral side of the first portion 2641 and a second electrical interconnect pad 2642b on a second lateral side of the first portion 2641. The flexible circuit 2640 may include a second portion 2647 separate from the first portion 2641, including a contact pad array 2646 for connection to the integrated circuit. The contact pad array 2646 includes a first contact pad 2646a for connection to a fluid jetting device and a second contact pad 2646b for connection to the fluid jetting device. The flexible circuit 2640 may include a first trace 2644a connecting a first electrical interconnect pad 2642a to a first contact pad 2646a, and a second trace 2644b connecting a second electrical interconnect pad 2642b to a second contact pad 2646b, wherein the first trace 2644a is configured to conduct a higher voltage than the second trace 2644b, and wherein the first electrical interconnect pad 2642a, the second electrical interconnect pad 2642b, the first contact pad 2646a, the second contact pad 2646b, the first trace 2644a, and the second trace 2644b are on the same surface of the flexible circuit 2640.

[0105] The electrical interconnect pad array 2642 may be arranged in two parallel columns, equidistant from the central axis, on two lateral sides of the central axis, one column on a first side of the first portion 2641 and the other column on a second side of the first portion. The width of the electrical interconnect pad array 2641 may be less than four times the width of the surface of the first electrical interconnect pad. Corresponding traces may extend at least partially parallel to the central axis and extend parallel to each other in at least the first portion 2641. Parallel portions of the traces in the first portion 2641 may extend at least partially between interconnect pads 2642a and 2642b. The first electrical interconnect pad 2642a includes at least one of a high-power source, logic power below the high-power source, transmit, reset, and / or ground with power below the high-power source, and at least one of the second electrical interconnect pads includes at least one of a data, clock, mode, and / or analog read pad. The first trace 2644a may be wider than the second trace 2644b. The first trace 2644a is used to deliver power to the fluid jetting device to drive the fluid jetting. The second trace 2644b may be an analog readout trace for sensing at least one characteristic of the fluid jetting device. The first trace 2644a and the second trace 2644b include at least one rounded or chamfered corner. The fluid jetting device may be configured to transmit analog data signals to a host controller. The fluid jetting device may include a droplet generator for jetting fluid.

[0106] Figure 27 This is a block diagram of an example flexible circuit 2740 including a third trace 2744c connecting a third electronic interconnect pad 2742c to a third contact pad 2746c. The flexible circuit 2700 may include: a first portion 2741 including a first electrical interconnect pad 2742a on a first lateral side of the first portion 2741, a second electrical interconnect pad 2742b on a second lateral side of the first portion, and a third electrical interconnect pad 2742c on the first lateral side of the first portion 2741; and a second portion 2747 including a first contact pad 2746a for connection to a fluid jetting device, a second contact pad 2746b for connection to a fluid jetting device, and a third contact pad 2746c for connection to a fluid jetting device. The flexible circuit 2740 may include a first trace 2744a connecting a first electrical interconnect pad 2742a to a first contact pad 2746a, a second trace 2744b connecting a second electrical interconnect pad 2742a to a second contact pad 2746b, and a third trace 2744c connecting a third electrical interconnect pad 2742c to a third contact pad 2746c, wherein the second trace 2744b is separated from the first trace 2744a by a first distance, and the third trace 2744c is separated from the first trace 2742a by a second distance, wherein the first distance is greater than the second distance.

[0107] The first trace 2744a is configured to receive a higher voltage than the second trace 2744b. The first trace 2744a is wider than the second trace 2744b. The first trace 2744a can be used to deliver power to the fluid jetting device to drive the fluid jetting. The second trace 2744b can be an analog readout trace used to sense at least one characteristic of the fluid jetting device. The third trace can control the data transmission mode of the fluid jetting device. A first distance is greater than or equal to twice the second distance. The first, second, and third traces can include at least one rounded or chamfered corner. The second contact pad 2746b is closer to the distal edge of the second portion than the first contact pad 2746a.

[0108] Figure 28 This is a block diagram of an example thin circuit 2840 for attachment to a replaceable component that is replaced relative to a host printer. The thin circuit 2840 may include: an insulating support structure 2848; an electrical interconnect pad array 2842 for enabling the replaceable component to communicate with host printer circuitry, the electrical interconnect pad array 2842 consisting of two parallel columns 2842a, 2842b on each side of a central axis 2801, each column including multiple pads, wherein the first column 2842a of the two parallel columns includes pads for conducting higher energy signals, including high-power sources, logic power below high power, transmit, reset, and / or ground; the second column 2842b of the two parallel columns includes pads for conducting lower energy signals below the higher energy signals, including data, clock, mode, and / or analog read signals; and parallel wiring 2844a, 2844b extending from the electrical interconnect pad array to connect to an integrated circuit of the printed component.

[0109] The first column 2482a may include a first higher-energy electrical interconnect pad for conducting voltages greater than 4 VDC, and / or a second higher-energy electrical interconnect pad for conducting voltages greater than 10 VDC, and the second column 2842b may include a first lower-energy electrical interconnect pad for transmitting a logic low value of approximately 0 V and a logic high value of approximately 3.3 V, and / or a second lower-energy electrical interconnect pad for transmitting an analog voltage value between 0 V and 3.3 V. The first column 2842a may include at least one lower-energy electrical interconnect pad for transmitting a logic low value of approximately 0 V and a logic high value of approximately 3.3 V, and / or the second column 2842b may include multiple lower-energy electrical interconnect pads for transmitting a logic low value of approximately 0 V and a logic high value of approximately 3.3 V. The integrated circuit may be configured to transfer memory and / or analog values ​​on the lower-energy pads using lower-energy signals in response to instruction signals on the lower-energy pads. The integrated circuit may include a fluid jetting device for jetting fluid based on lower-energy signals and higher-energy signals.

[0110] The thin circuit 2840 can be a flexible circuit or a thin printed circuit board (PCB). The integrated circuit may include a fluid jetting device or a replacement memory device for a fluid jetting device. The first distance between the power wiring of the parallel wirings 2844a and 2844b and the analog read signal wiring of the parallel wirings may be greater than the second distance between the analog read signal wiring and the mode wiring of the parallel wirings. The first distance may be greater than or equal to twice the second distance. The parallel wirings may include at least one rounded or chamfered corner.

[0111] Any printing part assembly or fluid jetting assembly discussed herein may include any interconnecting circuitry or flexible circuitry discussed herein. Furthermore, any interconnecting circuitry discussed herein may be part of any printing part assembly or fluid jetting assembly discussed herein. Moreover, the characteristics of the interconnecting circuitry or flexible circuitry are not limited to the specific examples discussed. Characteristics described in connection with one interconnecting circuitry may be applicable to another interconnecting circuitry. For example, Figure 13 The paper discusses how the metal structure 643 of interconnect circuit 640 can extend above the lift-off edge 1301 of interconnect circuit 640. Similarly, the metal structure 143 of interconnect circuit 140 can extend above the lift-off edge of interconnect circuit 140. In another example, Figure 1 The electrical interconnect pads 142a to 142m of the interconnect circuit 140 are described as being capable of having rounded or chamfered corners. Similarly, the electrical interconnect pads 642a to 642k of the interconnect circuit 640 may have rounded or chamfered corners.

[0112] The topics described herein sometimes illustrate different components contained within or connected to different other components. It should be understood that the architectures depicted are merely exemplary, and many other architectures that achieve the same functionality can actually be implemented. Conceptually, any arrangement of components that achieve the same functionality is effectively “associated” to achieve the desired functionality. Therefore, any two components combined herein to achieve a particular function can be considered “associated” with each other so that the desired functionality can be achieved regardless of the architecture or intermediate components. Similarly, any two such associated components can also be considered “operably connected” or “operably linked” to each other to achieve the desired functionality, and any two components that can be suchly associated can also be considered “operably linked” to each other to achieve the desired functionality. Specific examples of operably linked components include, but are not limited to, components that can physically cooperate and / or physically interact and / or components that can wirelessly interact and / or logically interact and / or logically interact.

[0113] Regarding the use of virtually any plural and / or singular terms in this document, those skilled in the art may appropriately convert from plural to singular and / or from singular to plural depending on the context and / or application. For clarity, various singular / plural permutations may be explicitly stated herein. For example, a statement of multiple elements may be understood to include the elements under discussion.

[0114] Those skilled in the art will understand that, in general, the terminology used herein, particularly in the appended claims (e.g., the body of the appended claims), is typically intended to be “open-ended” terms (e.g., the term “comprising” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “including” should be interpreted as “including but not limited to,” etc.). Those skilled in the art will further understand that if a particular number of introductory claim statements are intended, this intention will be explicitly stated in the claims, and where such a statement is absent, this intention does not exist. For example, to aid understanding, the appended claims below may contain the use of the introductory phrases “at least one” and “one or more” to introduce claim statements. However, the use of such phrases should not be construed as implying that the indefinite article “a” or “an” leading to a claim statement limits any particular claim containing such an introductory claim statement to an invention containing only one such statement, even when the same claim includes the introductory phrase “one or more” or “at least one” and an indefinite article (such as “a” or “an”) (e.g., “a” and / or “an” should typically be interpreted as meaning “at least one” or “one or more”); the same applies to the use of definite articles used to lead to claim statements. Furthermore, even when a specific number of introductory claim statements are explicitly stated, those skilled in the art will recognize that such a statement should typically be interpreted as meaning at least the number stated (e.g., a simple statement of “two statements” without other modifiers typically means at least two statements, or two or more statements). Furthermore, in cases where conventional expressions such as "at least one of A, B, and C" are used, such grammatical structures are generally intended to have a meaning that a person skilled in the art would understand from the conventional expression (e.g., "a system having at least one of A, B, and C" includes, but is not limited to, systems having a single A, a single B, a single C, A and B together, A and C together, B and C together, and / or A, B, and C together, etc.). In cases where conventional expressions such as "at least one of A, B, or C" are used, such grammatical structures are generally intended to have a meaning that a person skilled in the art would understand from the conventional expression (e.g., "a system having at least one of A, B, or C" includes, but is not limited to, systems having a single A, a single B, a single C, A and B together, A and C together, B and C together, and / or A, B, and C together, etc.). A person skilled in the art will further understand that virtually any separate words and / or phrases presenting two or more alternative terms, whether in the specification, claims, or drawings, should be understood to presuppose the possibility of including one, any, or both of the terms. For example, the phrase “A or B” will be understood to include the possibility of “A” or “B” or “A or B”.Furthermore, unless otherwise stated, the terms “approximately,” “about,” “around,” “basically,” etc., are used to mean positive or negative 10 percent.

[0115] For purposes of illustration and description, the foregoing description has presented illustrative examples. The foregoing description is not intended to be exhaustive or to limit the precise forms disclosed, and modifications and variations are possible, or may be derived from practice of the disclosed embodiments, in light of the above teachings. The scope of the invention is intended to be defined by the appended claims and their equivalents.

[0116] Depending on the aspect, this disclosure may relate to interconnect circuitry for connecting a printing component to a host controller (such as a printer ASIC). The interconnect circuitry can be any thin circuit, such as a flexible circuit (soft circuit) or a thin or ultra-thin PCB; for example, a flexible circuit can be replaced with a thin PCB. The printing component may include any component of a fluid jetting device, a memory device, or a print cartridge. The connection circuitry system of the interconnect circuitry may include lines, wires, traces, or wiring. Connectors (such as wires, like connecting wires) can connect the electrical interconnect pads of the interconnect circuitry to the integrated circuit of the printing component.

[0117] According to one aspect, this disclosure relates to a flexible or other thin circuit for connecting an integrated circuit of a printed component to a host controller, the flexible circuit including a first portion and a second portion, the first portion including an array of electrical interconnect pads for connection to the host controller, the array of electrical interconnect pads including: a first electrical interconnect pad on a first lateral side of the first portion; and a second electrical interconnect pad on a second lateral side of the first portion; the second portion being separate from the first portion, the second portion including an array of contact pads for connection to the integrated circuit on a first surface, the second portion including: a first contact pad for connection to a fluid jetting device; a second contact pad for connection to the fluid jetting device; a first trace connecting the first electrical interconnect pad to the first contact pad; and a second trace connecting the second electrical interconnect pad to the second contact pad.

[0118] According to another aspect, a flexible circuit includes: a first portion, the first portion including: a first electrical interconnect pad, the first electrical interconnect pad being located on a first lateral side of the first portion; A second electrical interconnect pad is located on a second lateral side of the first portion; and a third electrical interconnect pad is located on a first lateral side of the first portion; the second portion includes: a first contact pad for connection to a fluid jetting device; a second contact pad for connection to a fluid jetting device; and A third contact pad for connection to a fluid jetting device; a first trace connecting a first electrical interconnect pad to the first contact pad; a second trace connecting a second electrical interconnect pad to the second contact pad, the second trace being separated from the first trace by a first distance; and a third trace connecting a third electrical interconnect pad to the third contact pad, the third trace being separated from the first trace by a second distance, wherein the first distance is greater than the second distance.

[0119] According to another aspect, a thin circuit is provided for attachment to a replaceable printing component relative to a host printer, the thin circuit comprising: an insulating support structure; an array of electrical interconnect pads for enabling the replaceable component to communicate with host printer circuitry; the electrical interconnect pad array comprising two parallel columns on each side of a central axis, each column including a plurality of pads, the columns being located on opposite sides of the axis; wherein a first column of the two parallel columns includes pads for conducting higher energy signals, including high-power source pads, logic pads below the high-power source pads, emit pads below the power of the high-power source pads, reset pads, and / or ground pads; a second column of the two parallel columns includes pads for conducting lower energy signals below the higher energy signals, including data pads, clock pads, mode pads, and / or analog read signal pads; and parallel wiring extending from the electrical interconnect pad array to connect to an integrated circuit of the component.

[0120] According to another aspect, an interconnect circuit is provided, the interconnect circuit comprising: a first portion including an array of electrically interconnected pads for connection to a host controller-side contact array to electrically connect the interconnect circuit to host controller circuitry, the array of electrically interconnected pads extending on both sides of a central axis of the array of electrically interconnected pads; and a second portion including contact pads connected by lines to the electrically interconnected pads for connection to an integrated circuit of a printed component, the second portion being laterally displaced relative to the central axis of the array of electrically interconnected pads.

[0121] According to another aspect, a printed component is provided, the printed component comprising: a molded body; an integrated circuit; and an interconnect circuit attached to the molded body and the integrated circuit, the interconnect circuit comprising: a first end portion including at least one electrical interconnect pad, the first end portion being attached to the molded body; a second end portion including at least one contact pad, the second end portion being laterally displaced relative to the first end portion in a first direction; and at least one connector electrically connecting the integrated circuit and the at least one contact pad, the at least one connector extending along the first direction.

[0122] According to another aspect, a flexible circuit for a fluid jet assembly is provided, the flexible circuit comprising: connection wiring including metal traces, electrical interconnect pads, and contacts, wherein each metal trace is used to electrically connect an electrical interconnect pad on a first portion of the flexible circuit to a contact on a second portion of the flexible circuit, the contact being used to connect to a fluid jet die; and a metal structure located between and spaced from the electrical interconnect pads and contacts, the metal structure being electrically insulated from the wiring, the metal structure being used to increase the stiffness of at least a portion of the flexible circuit.

[0123] According to another aspect, an interconnect circuit is provided for connecting an integrated circuit of a printing component to a printer controller. The interconnect circuit includes: a thin substrate and interconnect wiring supported by the substrate, the interconnect wiring including metal traces, electrical interconnect pads, and contacts; and a protective layer for protecting at least a portion of the wiring, wherein each metal trace is used to electrically connect an electrical interconnect pad on a first portion of a flexible substrate to a contact on a second portion of the flexible substrate, the interconnect pad being used for connection to a printer, and the contact being used for connection to a fluid jet die, wherein at least one of the metal traces includes a first segment in the first and second portions, between the interconnect pad and the contact, and a second segment in the second portion extending beyond the contact, and wherein the interconnect pad and the contact are exposed from the protective layer to facilitate connection to the printer and the die, respectively.

[0124] In another aspect, a flexible circuit for a fluid jet assembly can be provided, the flexible circuit comprising: a flexible substrate; interconnect wiring over the substrate, the interconnect wiring including metal traces, electrical interconnect pads, and contacts, wherein each metal trace is used to electrically connect an electrical interconnect pad on a first portion of the flexible circuit to a contact on a second portion of the flexible circuit, wherein each electrical interconnect pad is connected to a corresponding printer contact, and wherein each contact is used to connect to a fluid jet die; a metal plating layer over the electrical interconnect pads, metal traces, and contacts; and a protective layer over a portion of the metal plating layer.

[0125] According to another aspect, an interconnect circuit is provided for connecting an integrated circuit for a fluid jet assembly to a printer, the interconnect circuit comprising: a flexible substrate; an array of electrical interconnect pads on the substrate for connection to corresponding printer contacts; an array of contacts on the substrate for electrical connection to at least one integrated circuit; and a metal trace connecting each electrical interconnect pad to a corresponding contact, wherein each electrical interconnect pad, metal trace, and contact may be located on the same side of the substrate.

[0126] According to another aspect, a flexible circuit for a fluid jet assembly is provided, the flexible circuit comprising: a substrate; and connection wiring above the substrate for connecting a printer to a fluid jet die of the fluid jet assembly, the connection wiring including a printer connection contact near a first end of the connection wiring and a die contact near a second end of the connection wiring, wherein the printer connection contact is rectangular.

[0127] Any one or any combination of these aspects may be provided with any one or any combination of the following features. Each of the following features may be incorporated into the foregoing aspects or omitted. The first trace may be configured to conduct a higher voltage than the second trace. The first electrical interconnect pad, the second electrical interconnect pad, the first contact pad, the second contact pad, the first trace, and the second trace may be on the same surface of the flexible circuit. The electrical interconnect pad array may be arranged in two parallel columns, equidistant from the central axis on both lateral sides, one column on a first side of the first portion and the other column on a second side of the first portion. All interconnect pads for connection to the host controller may be arranged in no more than two columns. The width of the electrical interconnect pad array may be less than four times the width of the surface of the contact pad. Corresponding traces may extend at least partially parallel to the central axis and extend parallel to each other at least in the first portion. Parallel portions of the traces in the first portion may extend at least partially between the interconnect pads. The first electrical interconnect pad may include at least one of the following: a high-power source, a logic power below the high-power source, a transmit, reset, and / or ground with power below the high-power source, and at least one second electrical interconnect pad may include at least one of a data, clock, mode, and / or analog readout pad. The first trace may be wider than the second trace. The first trace may be used to deliver power to the fluid jetting device to drive fluid jetting. The second trace may be an analog readout trace for transmitting analog values ​​corresponding to at least one sensing characteristic of the data and / or the fluid jetting device. The first and second traces may include at least one chamfered corner. The fluid jetting device may be configured to transmit analog data signals to a host controller. The fluid jetting device includes a droplet generator for jetting fluid. The first trace may be configured to receive a higher voltage than the second trace. The first trace may be wider than the second trace. The first trace may be configured to deliver power to the fluid jetting device to drive fluid jetting. The second trace may be an analog readout trace for sensing at least one characteristic of the fluid jetting device. The third trace may be used to control the data transmission mode of the fluid jetting device. The first distance may be greater than or equal to twice the second distance. The first, second, and third traces may include at least one chamfered corner. The second contact pad may be located closer to the distal edge of the second portion than the first contact pad. The first column may include: a first higher-energy electrical interconnect pad for conducting voltages greater than 4 VDC, and / or a second higher-energy electrical interconnect pad for conducting voltages greater than 10 VDC, and the second column may include: a first lower-energy electrical interconnect pad for transmitting logic low values ​​of approximately 0 V and logic high values ​​of approximately 3.3 V, and / or a second lower-energy electrical interconnect pad for transmitting analog voltage values ​​between 0 V and 3.3 V.The first column may include at least one low-energy electrical interconnect pad for transmitting a logic low value of approximately 0 V and a logic high value of approximately 3.3 V, and / or the second column may include multiple low-energy electrical interconnect pads for transmitting a logic low value of approximately 0 V and a logic high value of approximately 3.3 V. The integrated circuit may be configured to transmit memory and / or analog values ​​on the low-energy pads using low-energy signals in response to instruction signals on the low-energy pads. The integrated circuit may include a fluid jetting device for jetting fluid based on low-energy and high-energy signals. The thin circuit may be a flexible circuit or a thin printed circuit board (PCB). The integrated circuit may include a fluid jetting device or an alternative memory device for the fluid jetting device. A first distance between the parallel power traces and the parallel analog read signal traces may be greater than a second distance between the analog read signal traces and the parallel mode traces. The first distance may be greater than or equal to twice the second distance. The parallel traces may include at least one chamfered corner. The fluid jetting device assembly may include: a fluid jetting device; and a flexible / thin / interconnect circuit. An intermediate section may connect the first and second sections. The central axis of the intermediate portion may extend at an acute angle relative to the central axis of the electrical interconnect pad array. An electrically insulating support substrate may support the wiring, wherein the central axis of the substrate in the intermediate portion extends at an acute angle relative to the central axis of the substrate in the first and / or second portions. The central axes of the first and second portions may extend parallel to each other. The overall direction of the wiring in the intermediate portion may extend at an acute angle to the overall direction of the wiring in the first and / or second portions. The central axis of the intermediate portion may extend at a 45° angle relative to the central axis of the electrical interconnect pad array. The contact pads may be laterally displaced relative to the central axis of the second portion. In the mounted state, the contact pads may be laterally displaced relative to the central axis of the second portion toward the integrated circuit. The integrated circuit may include at least one fluid jet die, and the contact pads may be configured in two sets, one set for connecting to a first end of the at least one fluid jet die of the printed component, and another set for connecting to a second end of the at least one fluid jet die of the printed component. The interconnect circuit may be a flexible circuit including a flexible substrate, and the wiring may be flexible wiring. The printed component may include a fluid jetting device. The electrical interconnect pad array may include two columns, with a first column on a first side of the central axis of the electrical interconnect pad array and a second column on a second side of the central axis of the electrical interconnect pad array. These columns may extend substantially parallel to each other and parallel to the central axis of the electrical interconnect pad array. The second portion may extend only along one side of the integrated circuit. In the mounted state, the central axis of the electrical interconnect pad array may be aligned with the central axis of the integrated circuit of the printed component.The printed component may include a molded reservoir body for holding fluid, wherein a first portion is attached to the molded reservoir body such that the central axis of an array of electrical interconnect pads is aligned with the central axis of the molded body. The printed component may include the molded reservoir body; interconnect circuitry is attached to the molded body and an integrated circuit, the first portion being attached to a face of the molded body along the central axis of the front of the molded body; and a second portion including at least one contact pad electrically connected to the integrated circuit, the second portion being laterally displaced relative to the central axis of the face of the molded body. The at least one contact pad may be connected to the integrated circuit via one or more wires. The integrated circuit may include at least one fluid jetting die, and the at least one die is connected to the interconnect circuitry via at least one corresponding wire. The interconnect circuitry may be a flexible circuitry including a flexible substrate. The integrated circuitry may be a fluid jetting device. The printed component may include an array of electrical interconnect pads including the at least one electrical interconnect pad. The electrical interconnect pad array may include two columns, wherein a first column is on a first side of the central axis of the electrical interconnect pad array, and a second column is on a second side of the central axis of the electrical interconnect pad array. These columns may extend substantially parallel to each other and parallel to the central axis of the electrical interconnect pad array. The interconnect circuit may include an intermediate portion connecting the first end portion and the second end portion, wherein the interconnect circuit includes an electrically insulating support substrate, wherein the substrate of the intermediate portion extends at an acute angle relative to the central axis of the electrical interconnect pad array including the at least one electrical interconnect pad. The intermediate portion may extend at a 45° angle relative to the central axis of the electrical interconnect pad array. The second end portion may extend only along one lateral side of the integrated circuit. The central axis of the electrical interconnect pad array may be aligned with the central axis of the fluid jet die of the integrated circuit. The central axis of the electrical interconnect pad array may be aligned with the central axis of the molded body. The at least one contact pad may be laterally displaced toward the integrated circuit relative to the central axis of the second end portion. The contact pads may be arranged in two sets, one set of contact pads connected to one end of the at least one fluid jet die of the integrated circuit, and another set of contact pads connected to the other end of the at least one fluid jet die. The at least one connector may extend through a molded via in a fluid structure supporting the integrated circuit, the fluid structure being used to guide fluid from at least one molded reservoir of the molded body to at least one fluid jet die of the integrated circuit. Flexible (or other thin) circuits may include a substrate and a protective layer on the opposite side of the wiring, wherein at least a portion of the metal structure extends between the substrate and the protective layer and / or in the same layer as the wiring. The metal trace may include a first segment connecting electrical interconnect pads to contacts, and a second segment extending beyond the contacts to increase the rigidity of the flexible circuit. Contacts may extend between the first and second segments, and the trace may turn near the contacts.At least a portion of the first and second segments may extend between the substrate and the protective layer of the flexible circuit, with the contacts exposed. The first and second segments may be perpendicular to each other and / or parallel. The metal traces may include gussets connecting the first and second segments and / or near the contacts and / or within the second segment. The metal traces, electrical interconnect pads, and contacts may have the same height and / or be part of the same wiring layer. The flexible circuit may further include: a metal plating over the electrical interconnect pads, metal traces, and contacts; and a protective layer over a portion of the metal plating. The flexible circuit may include holes for aligning the flexible circuit for attachment to a fluid jetting device assembly, wherein the holes may be formed by punching through the substrate and the protective layer of the flexible circuit. A fluid jetting device assembly may include: a flexible circuit; and a fluid jetting die at the bottom of the fluid jetting device assembly, wherein electrical interconnect pads of the flexible circuit extend along the front portion of the fluid jetting device assembly, wherein one or more metal traces extend along the front and bottom portions of the fluid jetting device assembly and bend between the front and bottom portions to connect to the fluid jetting die, and wherein a metal structure is disposed at the front portion of the fluid jetting device assembly, below the interconnect pads. The metal structure may be located between and spaced apart from the electrical interconnect pads and contacts. The metal structure may be electrically insulated from the connection wiring. The metal structure may increase the stiffness of at least a portion of the flexible circuit. The electrical interconnect pads, contacts, and metal traces may have the same height. At least one of the metal traces may include a first segment connecting the electrical interconnect pads to the contacts, and a second segment extending beyond the contacts to increase the stiffness of the flexible circuit. At least a portion of the second segment may extend between a substrate and a protective layer of the flexible circuit. The first and second segments may be perpendicular and / or parallel to each other. At least one of the metal traces may include a triangular gusset connecting the first and second segments and / or near and / or within the second segment. The flexible circuit may include a hole for aligning the flexible circuit to attach to the fluid jetting device assembly. This hole may be formed by punching through the substrate and protective layer of the flexible circuit, and the hole is positioned near the interconnect pads. At least one of the metal traces may include a circular gusset to reinforce the hole. The fluid jetting device assembly may include: a flexible circuit, wherein a fluid jetting die is located at the bottom of the fluid jetting device assembly, electrical interconnect pads of the flexible circuit extend along the front of the fluid jetting device assembly, and metal traces are curved around the front and bottom of the fluid jetting device assembly to connect to the fluid jetting die. The array of electrical interconnect pads, the array of contacts, and the metal traces may have the same height. At least one of the metal traces may include a first segment connecting the electrical interconnect pads to the contacts, and a second segment extending from the contacts to increase the rigidity of the interconnect circuit. At least a portion of the second segment may extend between the substrate and the protective layer of the flexible circuit. The first and second segments may be perpendicular to each other.The at least one metal trace may include a triangular gusset connecting the first and second segments. The interconnect circuitry may include alignment holes, for example, holes for aligning the interconnect circuitry to attach to the fluid jetting device assembly. Alignment holes of this disclosure may be formed by stamping through a substrate and a protective layer of the flexible circuitry. The at least one metal trace may include a rounded gusset to reinforce the hole. The fluid jetting device assembly may include: interconnect circuitry with a fluid jetting die at the bottom of the fluid jetting device assembly, electrical interconnect pads of the flexible circuitry extending along the front of the fluid jetting device assembly, and the one or more metal traces bending around the front and bottom of the fluid jetting device assembly to connect to the fluid jetting die. A metal plating layer may be disposed above the connection circuitry. A protective layer may be disposed above at least a portion of the metal plating layer. Rectangular printer connection contacts may have rounded corners. Rectangular printer connection contacts may have chamfered corners. Printer connection contacts (i.e., electrical interconnect pads) may be arranged along two parallel lines. Die contacts may be arranged in a straight line. A metallic structure can be provided to the flexible circuit to increase its stiffness, wherein the metallic structure can be insulated from the connection wiring. The metallic structure can have the same material as the connection wiring. The fluid jetting device assembly can include: a flexible circuit; a fluid jetting die at the bottom of the fluid jetting device assembly, wherein printer connection contacts of the flexible circuit extend along the front of the fluid jetting device assembly, and the connection circuitry can be bent around the front and bottom of the fluid jetting device assembly to connect to the fluid jetting die. The die contacts can be positioned horizontally above the fluid jetting die as the flexible circuit bends from the front of the fluid jetting device assembly toward the fluid jetting device, extending along a top surface opposite to the printing surface of the fluid jetting device. The fluid jetting device assembly can include a reservoir body for supplying fluid to the fluid jetting die.

Claims

1. A flexible circuit for connecting an integrated circuit of a printed component to a host controller, the flexible circuit comprising: The first part includes an array of electrical interconnect pads for connection to the host controller, the array of electrical interconnect pads comprising: The first electrical interconnect pad is located on a first lateral side of the first portion; and The second electrical interconnect pad is located on the second lateral side of the first portion; A second portion, separate from the first portion, includes an array of contact pads for connection to the integrated circuit, the array of contact pads being located on the first surface. The second portion includes: The first contact pad is used to connect to the fluid jetting device; The second contact pad is used to connect to the fluid jetting device; A first trace connects the first electrical interconnect pad to the first contact pad; and The second trace connects the second electrical interconnect pad to the second contact pad, wherein the first trace is configured to conduct a higher voltage than the second trace, and wherein the first electrical interconnect pad, the second electrical interconnect pad, the first contact pad, the second contact pad, the first trace, and the second trace are on the same surface of the flexible circuit.

2. The flexible circuit as described in claim 1, wherein, The first electrical interconnect pad, the second electrical interconnect pad, the first contact pad, the second contact pad, the first trace, and the second trace are on the same surface of the flexible circuit.

3. The flexible circuit as described in claim 1 or claim 2, wherein, The electrical interconnect pad array is arranged in two parallel columns along two lateral sides of the central axis and at equal intervals with the central axis, one column on the first side of the first portion and the other column on the second side of the first portion.

4. The flexible circuit as described in any one of claims 1 to 3, wherein, The width of the electrical interconnect pad array is less than four times the width of the surface of the contact pad.

5. The flexible circuit as described in any one of claims 1 to 4, wherein, The corresponding traces are at least partially parallel to the central axis and extend parallel to each other in at least the first portion.

6. The flexible circuit as described in any one of claims 1 to 5, wherein, The parallel portions of the traces in the first part extend at least partially between the interconnect pads.

7. The flexible circuit as described in any one of claims 1 to 6, wherein, The first electrical interconnect pad includes at least one of the following: a high power source, a logic power lower than the high power source, a transmit, reset, and / or ground with a power lower than the high power source, and wherein at least one of the second electrical interconnect pads includes at least one of a data, clock, mode, and / or analog read pad.

8. The flexible circuit as described in any one of claims 1 to 7, wherein, The first trace is wider than the second trace.

9. The flexible circuit as described in any one of claims 1 to 8, wherein, The first trace is used to deliver electrical power to the fluid jetting device to drive the fluid jetting.

10. The flexible circuit according to any one of claims 1 to 9, wherein, The second trace is an analog readout trace used to transmit analog values ​​corresponding to data and / or at least one sensing characteristic of the fluid jetting device.

11. The flexible circuit according to any one of claims 1 to 10, wherein, The first trace and the second trace include at least one chamfered corner.

12. The flexible circuit according to any one of claims 1 to 11, wherein, The fluid jetting device is configured to transmit analog data signals to the host controller.

13. The flexible circuit as described in any one of claims 1 to 12, wherein, The fluid jetting device includes a droplet generator for jetting fluid.

14. A flexible circuit, the flexible circuit comprising: The first part includes: The first electrical interconnect pad is located on the first lateral side of the first portion; The second electrical interconnect pad is located on the second lateral side of the first portion; and The third electrical interconnect pad is located on the first lateral side of the first portion; Part Two, Part Two includes: The first contact pad is used to connect to the fluid jetting device; A second contact pad, the second contact pad being used for connection to the fluid jetting device; and The third contact pad is used to connect to the fluid jetting device; A first trace connects the first electrical interconnect pad to the first contact pad; A second trace, the second trace connecting the second electrical interconnect pad to the second contact pad, the second trace being separated from the first trace by a first distance; and A third trace connects the third electrical interconnect pad to the third contact pad, and the third trace is separated from the first trace by a second distance, wherein the first distance is greater than the second distance.

15. The flexible circuit as described in claim 14, wherein, The first trace is configured to receive a higher voltage than the second trace.

16. The flexible circuit as claimed in claim 14 or claim 15, wherein, The first trace is wider than the second trace.

17. The flexible circuit according to any one of claims 14 to 16, wherein, The first trace is used to deliver electrical power to the fluid jetting device to drive the fluid jetting.

18. The flexible circuit according to any one of claims 14 to 17, wherein, The second trace is an analog readout trace used to transmit analog values ​​corresponding to data and / or at least one sensing characteristic of the fluid jetting device.

19. The flexible circuit as described in any one of claims 14 to 18, wherein, The third trace is used to control the data transmission mode of the fluid jetting device.

20. The flexible circuit according to any one of claims 14 to 19, wherein, The first distance is greater than or equal to twice the second distance.

21. The flexible circuit according to any one of claims 14 to 20, wherein, The first trace, the second trace, and the third trace each include at least one chamfered corner.

22. The flexible circuit as described in any one of claims 1 to 21, wherein, The second contact pad is closer to the far edge of the second portion than the first contact pad.

23. A thin circuit for attachment to a replaceable printing component relative to a host printer, the thin circuit comprising: Insulating support structure; An array of electrical interconnect pads, which enables replaceable components to communicate with host printer circuitry; The electrical interconnect pad array consists of two parallel columns on each side of the central axis, each column including multiple pads, the columns being on opposite sides of the axis; The first column of the two parallel columns includes pads for conducting higher energy signals. The pads include a high-power source pad, a logic pad with a power lower than the high-power source pad, a transmit pad with a power lower than the high-power source pad, a reset pad, and / or a ground pad. The second column of the two parallel columns includes pads for conducting lower energy signals with energy levels lower than the higher energy signal, the pads including data pads, clock pads, mode pads, and / or analog read signal pads; and Parallel wiring extends from the electrical interconnect pad array to connect to the integrated circuit of the component.

24. The thin circuit of claim 23, further comprising parallel wiring extending from the electrical interconnect pad array to connect to an integrated circuit of the component.

25. The thin circuit as claimed in claim 23 or claim 24, wherein, The first column includes: First high-energy electrical interconnect pads for conducting voltages greater than 4 VDC, and / or A second, higher-energy electrical interconnect pad is used to conduct voltages greater than 10 VDC, and wherein, The second column includes: The first lower-energy electrical interconnect pads are used to transmit logic low values ​​of approximately 0 V and logic high values ​​of approximately 3.3 V, and / or A second lower-energy electrical interconnect pad that transmits analog voltage values ​​between 0 V and 3.3 V.

26. The thin circuit according to any one of claims 23 to 25, wherein, The first column includes at least one lower-energy electrical interconnect pad for transmitting a logic low value of approximately 0V and a logic high value of approximately 3.3V, and / or the second column includes multiple lower-energy electrical interconnect pads for transmitting a logic low value of approximately 0V and a logic high value of approximately 3.3V.

27. The thin circuit according to any one of claims 23 to 26, wherein, The integrated circuit is configured to use a low-energy signal to transfer memory and / or analog values ​​on the low-energy pad in response to an instruction signal on the low-energy pad.

28. The thin circuit according to any one of claims 23 to 27, wherein, The integrated circuit includes a fluid jetting device for jetting fluid based on the lower energy signal and the higher energy signal.

29. The thin circuit according to any one of claims 23 to 28, wherein, The thin circuit is a flexible circuit or a thin printed circuit board (PCB).

30. The thin circuit according to any one of claims 23 to 29, wherein, The integrated circuit includes a fluid jetting device or a replacement memory device for a fluid jetting device.

31. The thin circuit according to any one of claims 23 to 30, wherein, The first distance between the power wiring of the parallel wiring and the analog read signal wiring of the parallel wiring is greater than the second distance between the analog read signal wiring and the mode wiring of the parallel wiring.

32. The thin circuit of claim 30, wherein, The first distance is greater than or equal to twice the second distance.

33. The thin circuit according to any one of claims 23 to 32, wherein, The parallel wiring includes at least one chamfered corner.

34. A fluid jetting device assembly, the fluid jetting device assembly comprising: Fluid jetting device; as well as The flexible circuit as described in any one of claims 1 to 22.

35. A fluid jetting device assembly, the fluid jetting device assembly comprising: Fluid jetting device; as well as The thin circuit as described in any one of claims 23 to 33.

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