Assembly, apparatus and method for processing powder in additive manufacturing

Abstract

An assembly (10), apparatus (20) and method (30) for treating powder (P) in additive manufacturing are provided. The vibration plate (11) is used for bearing received powder (P) and transmitting vibration to the received powder (P); the vibration excitation part (12) applies vibration force to enable the vibration plate (11) to generate resonance to form a standing wave, so that a powder layer (PL) of a specific pattern driven by the standing wave is formed on the vibration plate (11); and the transfer part (13) changes the position relation between the powder layer (PL) and the vibration plate (11). The powder layer (PL) is transferred from the vibrating plate (11) to the substrate platform (21) in a shape maintaining or approaching a specific pattern to form one of the powder layers (PL) for additive manufacturing, so that the distribution and transfer of the powder layers (PL) can be accurately controlled, and the specific pattern is formed by scattering powder agglomeration. Accurate forming of high-quality and complex parts is achieved in the additive manufacturing process.

Description

Technical Field

[0001] This disclosure relates to the field of additive manufacturing (AM), and more specifically to components, equipment, and methods for processing powders in additive manufacturing. Background Technology

[0002] Additive manufacturing technology, particularly 3D printing technology that uses powder as raw material to build complex multidimensional structures, involves melting powder through a focused high-energy light beam and then solidifying it to obtain a specified spatial configuration. In the field of metal additive manufacturing, commonly used technologies include Laser Powder Bed Fusion (LPBF), Electron Beam Melting (EBM), and Selective Laser Sintering (SLS). Among these, LPBF is one of the most widely used technologies. In the LPBF process, metal material in powder form is uniformly distributed on a substrate platform using a powder-laying device. A laser focuses a high-energy beam along a predetermined path, melting the powder material to form a localized molten pool, which then solidifies upon cooling, forming a near-two-dimensional solid layer. Subsequently, the substrate platform descends to a specified layer thickness, and the equipment repeats the powder laying and laser melting process. By repeating this process multiple times, layer by layer, the entire part is manufactured.

[0003] Despite the significant advantages of LPBF technology, traditional powder bed laying methods still have several shortcomings: First, traditional methods struggle to ensure complete uniformity of the powder layer, especially when using ultrafine powders, which easily leads to agglomeration. This results in uneven material distribution, affecting the compactness and mechanical properties of the component. Second, uneven powder distribution can cause internal defects, such as pores and inclusions, to form during melting and solidification, impacting the strength and reliability of the component. Furthermore, the powder bed formed by powder bed laying typically covers both shaped and unshaped areas of the component, leading to powder material waste and significantly increasing production costs. Summary of the Invention

[0004] This disclosure provides a component, apparatus, and method for handling powders in additive manufacturing, which can precisely control the distribution and transfer of powder layers and achieve the precise forming of high-quality, complex parts in the additive manufacturing process by breaking up powder agglomerates and forming specific patterns.

[0005] In a first aspect, this disclosure provides an assembly for processing powder in additive manufacturing, comprising: a vibrating plate for carrying received powder and transmitting vibration thereto; an excitation unit connected to the vibrating plate and configured to apply a vibrational force to cause the vibrating plate to resonate to form a standing wave, thereby forming a powder layer on the vibrating plate with a specific pattern driven by the standing wave; and a transfer unit configured to change the positional relationship between the powder layer and the vibrating plate, such that the powder layer is transferred from the vibrating plate to a substrate platform in a shape that maintains or approximates the specific pattern, to form one of the powder layers for additive manufacturing.

[0006] According to a preferred embodiment of the first aspect, the component further includes a control system configured to control the excitation unit to apply specific or continuously varying vibration parameters to the vibrating plate based on at least one layer information of the manufactured component, and to control the operation of the transfer unit.

[0007] According to a preferred embodiment of the first aspect, the vibration parameters include one or more of the vibration frequency, amplitude, intensity, and time interval.

[0008] According to a preferred embodiment of the first aspect, the amount of powder received by the vibrating plate is a value determined based on one of the layer information of the manufacturing component, which is capable of forming a powder layer of a predetermined thickness partially or completely after vibration.

[0009] According to a preferred embodiment of the first aspect, the component further includes a flattening portion that is movable relative to the substrate platform to uniformly flatten the powder layer transferred to the substrate platform.

[0010] According to a preferred embodiment of the first aspect, the flattening portion is configured to have a pressure plate that moves vertically toward the substrate platform to press and adhere it, and / or a roller that rolls and presses horizontally above the substrate platform.

[0011] According to a preferred embodiment of the first aspect, wherein the vibrating plate is disposed in stages within the space above the substrate platform, the assembly further includes a moving part configured to drive the vibrating plate away from the area covering the substrate platform after the transfer of one of the powder layers is completed, and to drive the vibrating plate back to the space above the substrate platform when a new powder layer needs to be applied.

[0012] According to a preferred embodiment of the first aspect, the component further includes a high-energy beam scanning device configured to control a high-energy beam to scan along the contour of a powder layer applied to the substrate platform to form a contour support structure when manufacturing the layer cross-section of the shaped part.

[0013] According to a preferred embodiment of the first aspect, the distribution position of the powder layer on the vibrating plate after vibration is applied is different from the distribution position on the substrate platform after transfer. The distribution position of the powder layer on the vibrating plate is determined after transfer error compensation so that the powder layer transferred to the substrate platform matches the shape anchored by one of the layer information of the manufactured component.

[0014] According to a preferred embodiment of the first aspect, the transfer unit includes a movable tilting mechanism configured to gradually transfer a powder layer from a vibrating plate to a substrate platform by tilting the vibrating plate in a moving state.

[0015] According to a preferred embodiment of the first aspect, the transfer unit includes a removal mechanism configured to rapidly remove the vibrating plate during the transfer of the powder layer, so that the powder layer falls inertially onto the substrate platform.

[0016] According to a preferred embodiment of the first aspect, the transfer section includes a plurality of microvalves distributed inside the vibrating plate and configured to allow the vibrating plate to form vertically penetrating holes in an open or closed state, so that the powder layer can fall freely onto the substrate platform through the holes.

[0017] According to a preferred embodiment of the first aspect, the transfer unit includes: a flexible pad disposed above the vibrating plate for carrying received powder; rollers disposed on both sides of the vibrating plate for moving the flexible pad in different directions so that it can roll along the surface of the vibrating plate to gradually transfer the powder layer to the edge of the vibrating plate; and a moving device for driving the vibrating plate to move horizontally so that the powder layer is uniformly detached from one side of the vibrating plate and falls onto the substrate platform.

[0018] According to a preferred embodiment of the first aspect, the transfer unit includes: an adsorption mechanism disposed inside or at the bottom of the vibrating plate and configured to achieve directional transfer of the powder layer by adsorbing or releasing powder on the vibrating plate; and a flipping mechanism configured to flip the vibrating plate so that the powder on the vibrating plate is transferred from the vibrating plate to the substrate platform by a free-falling path with the assistance of the adsorption mechanism.

[0019] According to a preferred embodiment of the first aspect, the transfer unit includes an airflow assist mechanism configured to apply a controllable airflow during the powder layer transfer process to optimize the distribution and transfer path of the powder layer.

[0020] According to a preferred embodiment of the first aspect, the substrate platform is composed of multiple independent plates, each plate being able to be assembled into a whole for individually forming parts on powder carried by one or more of its plates, wherein a specific pattern formed by the powder layer corresponds to the distribution of the plates carrying the powder.

[0021] According to a preferred embodiment of the first aspect, the component further includes a powder feeding device disposed in the space above the vibrating plate to release powder onto the vibrating plate and / or disposed on one side of the vibrating plate in the horizontal direction to deliver powder onto the vibrating plate.

[0022] According to a preferred embodiment of the first aspect, wherein when the powder feeding device is disposed on one side of the vibrating plate in the horizontal direction to feed powder to the vibrating plate, the powder feeding device includes: a liftable powder container configured to rise vertically to a horizontal plane in contact with the vibrating plate; and a movable powder conveyor disposed on the horizontal plane to move and convey powder overflowing from the top of the powder container to above the vibrating plate.

[0023] According to a preferred embodiment of the first aspect, the excitation unit includes at least one of a mechanical exciter, an audio exciter, a piezoelectric exciter, and an electromagnetic exciter.

[0024] In a second aspect, this disclosure provides an additive manufacturing apparatus that includes the components described in any one of the first aspects.

[0025] Thirdly, this disclosure provides a method for controlling the processing of powder by a component according to any one of the first aspects, the method comprising: controlling the excitation unit to apply a vibration force to the vibrating plate during the manufacturing of at least one layer of a component to cause the vibrating plate to resonate and form a standing wave, thereby causing the powder received by the vibrating plate to form a powder layer with a specific pattern driven by the standing wave; and controlling the transfer unit to change the positional relationship between the powder layer and the vibrating plate, so that the powder layer is transferred from the vibrating plate to a substrate platform in a shape that maintains or is close to the specific pattern, to form one of the powder layers for additive manufacturing.

[0026] According to a preferred embodiment of the third aspect, the method further includes: controlling the excitation unit to apply specific or continuously varying vibration parameters to the vibrating plate based on at least one layer information of the manufactured component.

[0027] According to a preferred embodiment of the third aspect, the method further includes: controlling the flattening portion to move relative to the substrate platform to uniformly flatten the powder layer transferred to the substrate platform.

[0028] According to a preferred embodiment of the third aspect, the method further includes: controlling the moving part to drive the vibrating plate away from the area covered by the substrate platform after completing the transfer of one of the powder layers, and driving the vibrating plate back to the space above the substrate platform when a new powder layer needs to be applied.

[0029] It should be understood that the above general description and the following detailed description are exemplary only and do not limit this disclosure. Attached Figure Description

[0030] The complete and feasible disclosure of this disclosure, including its best mode, is set forth in the specification with reference to the accompanying drawings for those skilled in the art, wherein:

[0031] Figure 1 The diagram illustrates the construction and application of components according to some embodiments of this disclosure;

[0032] Figure 2 A schematic diagram illustrating the powder distribution and transfer process of some embodiments of this disclosure is shown;

[0033] Figure 3 A top view schematic diagram of a substrate platform according to some embodiments of the present disclosure is shown;

[0034] Figure 4 and Figure 5 Schematic diagrams illustrating the structure and application of different morphologies of the flattening portion according to some embodiments of this disclosure are shown respectively;

[0035] Figure 6 A schematic diagram of another construction of the vibrating plate relative to the substrate platform according to some embodiments of the present disclosure is shown;

[0036] Figure 7 The diagram illustrates the structure and application of the transfer unit according to some embodiments of this disclosure;

[0037] Figure 8 Schematic diagrams illustrating the construction and application of tilting mechanisms according to some embodiments of this disclosure are shown;

[0038] Figure 9 The diagram illustrates the construction and application of the extraction mechanism according to some embodiments of this disclosure;

[0039] Figure 10 The diagram illustrates the construction and application of microvalves according to some embodiments of this disclosure;

[0040] Figure 11 Schematic diagrams illustrating the construction and application of some embodiments of the reeling mechanism of this disclosure are shown;

[0041] Figure 12 Schematic diagrams illustrating the construction and application of electromagnetic mechanisms and flipping mechanisms according to some embodiments of this disclosure are shown;

[0042] Figure 13 Schematic diagrams illustrating the construction and application of airflow assist mechanisms according to some embodiments of this disclosure are shown;

[0043] Figure 14 A schematic diagram of the structure of a substrate platform according to some embodiments of the present disclosure is shown;

[0044] Figure 15 and Figure 16 Schematic diagrams of two different configurations of powder feeding devices according to some embodiments of this disclosure are shown respectively;

[0045] Figure 17 An exemplary structural diagram of an AM device according to some embodiments of the present disclosure is shown;

[0046] Figure 18 A schematic flowchart illustrating a method for processing powder using a control component according to some embodiments of the present disclosure is shown. Detailed Implementation

[0047] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0048] This disclosure relates to powder handling in AM devices (such as LPBF (Laser Powder Bed Fusion), EBM (Electron Beam Melting), SLM (Selective Laser Melting), and SLS (Selective Laser Sintering), and other AM devices that use powder as a component building material). In particular, components for AM devices are proposed for dispensing or performing powder handling. These components may be included as part of the AM device or associated with the AM device as an additional component. Generally, the components involved in this disclosure are considered as parts of an AM device used for powder handling.

[0049] The term "powder" in this disclosure refers to raw materials used to manufacture three-dimensional objects (parts), and in terms of physical structure, refers to powder particles that can have different shapes, sizes, and particle sizes. The "powder" used herein is preferably made of metallic materials, such as stainless steel (e.g., 316L), copper, copper alloys (e.g., copper-aluminum alloys), titanium, titanium alloys, aluminum, aluminum alloys, and other usable metallic materials. Alternatively, powders of ceramics, plastics, and composite materials can also be used to construct three-dimensional objects.

[0050] Figure 1 A schematic diagram of the structure and application of component 10 is shown. Component 10 may include a vibrating plate 11 for carrying the received powder P and transmitting vibration to the powder P, an excitation part 12 connected to the vibrating plate 11 and used to apply vibration force to make the vibrating plate 11 resonate, and a transfer part 13 for changing the positional relationship between the powder layer PL and the vibrating plate 11.

[0051] The vibrating plate 11 can be made of metal (such as aluminum alloy, stainless steel, or titanium alloy) to withstand the mechanical stress and high temperature generated during the AM process, and to enable the vibrating plate to generate the required resonant frequency and vibration mode when the excitation section 12 applies vibration force. The surface of the vibrating plate 11 should be smooth and free of defects to ensure that the powder P can be uniformly distributed during vibration. The vibrating plate 11 can adopt a relatively thin plate structure (such as rectangular, circular, or other shapes) to facilitate resonance under the action of the excitation section 12. The edges of the vibrating plate 11 may affect the formation of standing waves, so fine machining can be used to reduce the interference of edge effects on standing waves. In addition, since the surface characteristics of the vibrating plate 11 have a direct impact on the arrangement and transfer of powder P, the surface of the vibrating plate 11 can be treated, for example, by adjusting its coefficient of friction, thereby affecting the movement and aggregation characteristics of powder P on the plate surface. Adding appropriate surface texture structures can promote the uniform distribution of powder P during vibration. Fine texture structures can provide tiny anchor points and enhance the stability of powder P.

[0052] The excitation unit 12 is used to apply vibrational force to generate standing waves in the vibrating plate 11, thereby driving the powder P to form a specific powder layer PL pattern. The excitation unit 12 can use different vibrators to apply vibration, such as a mechanical exciter (which uses a motor or mechanical device to generate periodic vibration, and can act directly on the vibrating plate 11 through a connecting rod or vibration coupler), an audio exciter (which drives a speaker to vibrate through an audio signal to induce vibration of the vibrating plate 11, or uses a dedicated audio excitation device to convert the audio signal into mechanical vibration through a power amplifier), a piezoelectric exciter (which uses a piezoelectric material (such as piezoelectric ceramic) as the excitation source, and induces mechanical deformation by applying voltage, thereby generating vibrational force), an electromagnetic exciter (which generates vibrational force through the interaction of an electromagnetic coil and a permanent magnet), or a combination thereof.

[0053] The transfer section 13 is used to physically transfer a powder layer PL with a specific pattern formed on the vibrating plate 11 to the substrate platform 21 while maintaining or approximating the shape of the specific pattern, so as to form a powder layer PL for high-energy beam sintering or melting, thereby forming a layer structure of the shaped part 210 under the action of the high-energy beam.

[0054] Through the synergistic action of the vibrating plate 11, the excitation section 12, and the transfer section 13, the assembly 10 can precisely control the distribution and transfer process of the powder P. It should be understood that the vibration applied by the excitation section 12 effectively breaks up agglomerates of the powder P. Specifically, when the excitation section 12 applies a vibrational force, the vibrating plate 11 begins to resonate, forming standing waves on the vibrating plate 11. The formation of the standing waves causes the surface of the vibrating plate 11 to vibrate periodically, thereby transferring this vibrational energy to the powder P on it. This periodic mechanical vibration effectively overcomes the adhesion, electrostatic, and van der Waals forces between powder particles, thus breaking up agglomerates of the powder P. Especially for powder agglomerates formed due to moisture, static electricity, or long-term accumulation, the vibration applied by the excitation section 12 can break up these agglomerates, restoring the powder P to a free-flowing state.

[0055] Figure 2 A schematic diagram of the distribution and transfer process of powder P is shown. Before resonance, the powder P applied to the vibrating plate 11 can be in a disordered stacked state or has already formed a relatively uniform deposited powder layer PL. When the excitation unit 12 applies a vibrational force, the vibrating plate 11 begins to generate standing waves, thereby pushing the powder P to form a powder layer PL with a specific pattern. This process utilizes the principle of the Crani pattern, that is, a stable waveform is formed in space by vibration, including wave nodes and antinodes. At the wave nodes, the amplitude of vibration is the smallest, so the powder P tends to gather there, while at the antinodes, the amplitude of vibration is the largest, and the vibrational force on the powder P is also the largest, thus pushing it away from the antinodes. However, if the particle size and weight of the powder particles used are small, the powder P may gather on the antinodes instead of on the wave nodes, forming an inverse Crani pattern, also known as a Faraday pile. The pattern formed by the standing wave directly affects the arrangement of powder P on the vibrating plate 11, and the change in waveform causes the powder P to form different patterns on the vibrating plate 11. The shape of this pattern can be controlled as needed, ranging from simple, uniformly arranged patterns to complex, non-uniform patterns, or even a fully distributed powder layer (PL). This powder layer (PL) formed by standing waves not only meets the morphological requirements of different AM processes but also improves the uniformity and density of the powder layer (PL) by breaking up powder agglomerates. This process is not merely about forming a specific pattern; more importantly, it eliminates powder agglomeration through vibration, ensuring that the powder (P) is evenly distributed during the AM process and improving the forming quality of each layer.

[0056] In some embodiments, component 10 further includes a control system 14 connected to the excitation unit 12 and the transfer unit 13 respectively. Figure 1 The control system 14 controls the excitation unit 12 to apply specific or continuously varying vibration parameters to the vibrating plate 11 based on at least one layer information of the forming component 210, and controls the operation of the transfer unit 13. Vibration parameters include any one or a combination of vibration frequency, amplitude, intensity, and time interval. The control system 14 can dynamically adjust these parameters according to the design requirements and material properties of the forming component 210. For example, the selection of vibration frequency can affect the formation of standing waves and the distribution of powder P; higher frequencies are suitable for the uniform distribution of fine particles, while lower frequencies are suitable for the arrangement of larger particles. Vibration amplitude affects the distance the powder particles travel on the vibrating plate 11 and their arrangement effect; a larger amplitude can help break up more stubborn powder agglomerates. The intensity of the vibration force is directly related to the energy received by the powder particles, thus affecting the distribution density and layer thickness of the powder P. The time interval involves the period and duration of vibration application; a reasonable time interval setting can ensure that the powder P is fully rearranged during vibration and avoid powder P scattering or unstable accumulation caused by excessive vibration.

[0057] The control system 14 monitors and adjusts these vibration parameters in real time, enabling the excitation unit 12 to apply vibration force in an optimal manner, thereby forming a powder layer PL with a uniform and dense particle pattern on the vibrating plate 11. At the same time, the control system 14 can also control the operation of the transfer unit 13 to ensure that the formed powder layer PL is transferred from the vibrating plate 11 to the substrate platform 21 at the optimal time.

[0058] Figure 3A top view of the substrate platform 21 is shown. It should be understood that when the powder layer PL transferred to the substrate platform 21 forms a specific pattern with an incomplete distribution, it leaves hollow areas in the surrounding region. To ensure successful application of a new powder layer PL in this situation and to guarantee the continuity and integrity of the manufacturing process of the formed part 210, in some embodiments of this disclosure, a high-energy beam scanning device can be used to sinter or melt along the contour (outer and inner edges) of the powder layer PL applied to the substrate platform 21 during the fabrication of the layer cross-section of the formed part 210 to form a contour support structure. Specifically, the formation process of this contour support structure is as follows: the edge of the powder layer PL is scanned using a high-energy beam scanning device (such as an optical path system consisting of a laser, a galvanometer, and a focusing field lens). The high-energy beam moves along the outer and inner edges of the powder layer PL, causing the powder in the edge region to melt and solidify rapidly, forming a temporary support structure (which can be understood as a kind of enclosure). This enclosure provides the necessary physical support to prevent the powder P from collapsing into the hollow areas during the subsequent layer deposition process. By forming support structures at the outer and inner edges of each powder layer PL, the stacking stability of each powder layer P can be ensured. This support structure not only supports the powder layer P below it but also provides a stable foundation throughout the manufacturing process, preventing powder from moving into the cut-out areas. Throughout the manufacturing process, the build area of ​​the formed part 210 should remain inside the powder layer PL and be smaller than the coverage area of ​​the powder layer PL. This means that the actual build area of ​​the formed part 210 will not extend into the cut-out areas, thus ensuring the integrity of the powder layer PL.

[0059] The amount of powder received by the vibrating plate 11 can be precisely controlled. This amount can be determined based on the layer information of the forming component 210 to ensure that a powder layer PL of a preset thickness / range is formed after vibration. Specifically, during the manufacturing process, the control system 14 accurately calculates the required amount of powder based on the layer information designed for the forming component 210 and distributes it onto the vibrating plate 11. To achieve this, the control system 14 can combine multiple parameters to determine the optimal amount of powder. These parameters include, but are not limited to, the geometry of the layer, the designed thickness, and the characteristics of the powder material used. By comprehensively considering these factors, the control system 14 can adjust the operation of the powder feeding device to accurately deposit the required amount of powder on the vibrating plate 11. For example, if a layer of the forming component 210 requires a thicker powder layer PL, the control system 14 will increase the powder supply of the powder feeding device to ensure that the required thickness is formed after vibration. Similarly, for thinner layers, the control system 14 will reduce the powder supply to avoid excess powder leading to waste or affecting the quality of subsequent layers. The benefits of this precise control are not only that it optimizes the utilization rate of powder P and reduces material waste, but also that it ensures that the thickness of powder P in each layer meets the design requirements.

[0060] In transfer methods with zero or near-zero error (such as electromagnetic adsorption transfer, which will be mentioned later), the distribution position of the powder layer PL on the vibrating plate 11 after vibration corresponds to its distribution position on the substrate platform 21 after transfer. On the vibrating plate 11, the powder P forms a specific pattern after vibration. These patterns are usually formed by standing waves. Depending on the position of the standing wave nodes and antinodes, the powder particles are distributed in a specific shape on the vibrating plate 11. These shapes can be uniform, non-uniform, complex, or simple. To achieve the corresponding distribution, the transfer unit 13 needs to precisely control the transfer process of the powder layer PL to ensure that the powder layer PL does not undergo significant deformation or displacement during the transfer process. During the transfer process, the powder layer PL on the vibrating plate 11 is directly transferred to the substrate platform 21. Since the distribution of the powder layer PL on the vibrating plate 11 corresponds to the distribution on the substrate platform 21, the position and shape of the transferred powder layer PL on the substrate platform 21 are consistent with its position and shape on the vibrating plate 11. This ensures that the stacking position and shape of each powder layer are almost or completely consistent with the designed layer information, thereby guaranteeing the precise manufacturing of the formed part 210.

[0061] In some embodiments, the distribution position of the powder layer PL on the vibrating plate 11 after vibration differs from its distribution position on the substrate platform 21 after transfer. The distribution position of the powder layer PL on the vibrating plate 11 is determined after transfer error compensation, that is, under the influence of transfer error, the powder layer PL transferred to the substrate platform 21 is made to match the shape anchored by one of the layer information of the forming component 210. In this embodiment, the powder layer PL on the vibrating plate 11 does not directly correspond to the distribution on the substrate platform 21. Instead, considering the errors that may occur during the transfer process, the powder layer PL on the vibrating plate 11 is pre-adjusted and compensated, including calculating the influence of factors such as transfer path, angle, and speed on the distribution of the powder layer PL. Transfer errors may be caused by various factors, such as the relative motion between the vibrating plate 11 and the substrate platform 21, and the mechanical precision of the transfer component. To ensure that the distribution of the powder layer PL on the substrate platform 21 matches the layer information of the forming component 210, the control system 14 pre-calculates these errors and compensates for them in the powder distribution on the vibrating plate 11. For example, if there is a certain offset during the transfer process, the powder layer PL on the vibrating plate 11 will be pre-adjusted in the opposite direction to counteract this offset. During the transfer process, the transfer unit 13 will transfer the adjusted powder layer PL from the vibrating plate 11 to the substrate platform 21. Since the powder distribution on the vibrating plate 11 has taken into account the transfer error, the powder layer PL that is finally transferred to the substrate platform can accurately match the layer information of the forming component 210.

[0062] Figure 4 and Figure 5The diagrams show the structure and application of different flattening portions 15. In some embodiments, in order to make the powder layer PL transferred to the substrate platform 21 uniformly flat, the assembly 10 further includes a flattening portion 15, which can move relative to the substrate platform 21 to uniformly flatten the powder layer PL, so as to ensure that the powder of each layer can maintain a consistent thickness and density in the subsequent additive manufacturing process, thereby ensuring the forming quality of the formed part 210.

[0063] For example, the flattening section 15 can be configured with a pressure plate 151 that moves vertically toward the substrate platform 21 to press and adhere it. During operation, the pressure plate 151 presses vertically downward from above, and under the control of a drive device (such as a hydraulic / electric telescopic device), the pressure plate 151 can press the powder layer PL with uniform pressure, flattening its surface. Alternatively, the flattening section 15 can also be configured with a roller 152 that rolls horizontally above the substrate platform 21 for pressing. The roller 152 is typically cylindrical and can roll smoothly under the control of a drive device (such as a linear guide and a rotary motor). The surface of the roller 152 can be smooth or textured to enhance its flattening effect. During operation, the roller 152 rolls above the substrate platform 21, flattening the powder layer PL through its own weight or applied pressure, maintaining the uniformity of the powder layer PL. Optionally, the pressure plate 151 and the roller 152 can be provided simultaneously to cooperate in pressing the powder layer PL. The operation of the flattening section 15 by the drive unit can be controlled by the control system 14. The control system 14 can adjust the flattening parameters (such as pressure, speed, stroke, etc.) of the flattening section 15 according to the layer information of the manufactured part 210 to ensure the consistency of powder layer PL in the manufacturing of each layer. The control system 14 can also dynamically adjust the operating parameters of the flattening section 15 according to feedback information in actual operation to adapt to different working conditions.

[0064] Figure 6 A schematic diagram of another configuration of the vibrating plate 11 relative to the substrate platform 21 is shown. Besides, as shown... Figure 1 As shown, the vibrating plate 11 is disposed above the substrate platform 21; in some embodiments, the vibrating plate 11 is disposed on one side of the substrate platform 21. Figure 6As shown, the vibrating plate 11 is positioned on the same horizontal plane as the substrate platform 21 (or with a height difference), but on one side relative to the substrate platform 21. The vibrating plate 11 is fixed to the side of the substrate platform 21 by a support structure, ensuring its stability during operation and preventing it from being affected by external factors. This arrangement utilizes the lateral space of the equipment, separating the vibrating plate 11 from the substrate platform 21, thus avoiding space constraints caused by placing the vibrating plate 11 above the substrate platform 21. In practical implementations with this structure, the distance and angle between the vibrating plate 11 and the substrate platform 21 need to be considered to ensure that the powder layer PL accurately reaches the designated position during transfer. For example, the vibrating plate 11 can rotate relative to the substrate platform 21 to transfer the powder layer PL, using methods such as electromagnetic adsorption transfer, which will be mentioned later.

[0065] Figure 7 A schematic diagram illustrating the structure and application of the transfer unit 16 is shown. In this embodiment, the vibrating plate 11 is positioned in stages within the space above the substrate platform 21 to facilitate flexible transfer of the powder layer PL and subsequent high-energy beam scanning operations. The assembly 10 also includes a moving unit 16 configured to drive the vibrating plate 11 away from the coverage area of ​​the substrate platform 21 after the powder layer PL transfer is complete, thereby allowing the high-energy beam scanning device to scan and process the powder layer PL on the substrate platform 21. Once the powder layer PL is successfully transferred to the substrate platform 21, the moving unit 16 begins to drive the vibrating plate 11 to move (e.g., horizontally) away from the coverage area of ​​the substrate platform 21. The control system 14 monitors and adjusts the movement path in real time to ensure that the vibrating plate 11 can move quickly and smoothly to a predetermined position without interfering with subsequent processing operations on the substrate platform 21. After the vibrating plate 11 is removed, the high-energy beam scanning device (such as an optical path system consisting of a laser, a galvanometer, and a focusing field lens) begins to scan the powder layer PL on the substrate platform 21. The high-energy beam scanning device sinters or melts the powder layer PL according to the layer information of the manufactured component 210 to form a part of the manufactured component 210. After the processing of one powder layer PL is completed, the moving part 16 drives the vibrating plate 11 back above the substrate platform 21 to prepare for the application of the next layer of powder P. After the vibrating plate 11 is repositioned above the substrate platform 21, the above-described powder receiving, vibration, transfer and movement operations are repeated until the entire manufactured component 210 is completed.

[0066] The specific construction of the moving part 16 is optional. For example, it can be configured as a guide rail 161, a slider 162, and a drive motor 163, and controlled by the control system 14 to drive the vibrating plate 11 to move horizontally. The guide rail 161 (e.g., a linear guide rail) can be located below the vibrating plate 11 and connected to it (via the slider) via a support rod 111, or it can be located on top of the AM equipment and suspended (via the slider) by the support rod 111, providing a path for the vibrating plate 11 to move. The drive motor 163 can transmit power to the slider 162 via a transmission device (such as a gear, belt, or lead screw), driving the vibrating plate 11 to move along the guide rail 161. The control system 14 can receive layer information from the manufacturing component 210, calculate the target position of the vibrating plate 11, and send corresponding control signals to the drive motor. In addition, the moving part 16 can also be configured as a foldable mechanism, capable of folding and unfolding the vibrating plate 11 after the transfer of the powder layer PL is completed. This configuration is also controlled by the control system 14 to achieve efficient movement and accurate positioning of the vibrating plate 11. The foldable mechanism may consist of multiple hinge points, folding arms, and a drive unit, enabling the vibratory plate 11 to be folded to one side of the substrate platform 21 when not needed. The drive unit may be a hydraulic cylinder, an electric actuator, or a motor-driven folding device, controlled by the control system 14 to extend or rotate, thereby achieving the folding and unfolding of the vibratory plate 11. Furthermore, the transfer unit 12 disclosed above may also be used as the moving unit 16 for certain specific functions (such as extraction).

[0067] The following is combined Figure 8-12 The various implementation methods of the transfer unit 13 involved in this disclosure will be further explained.

[0068] tilt transfer

[0069] Figure 8 A schematic diagram illustrating the construction and application of the tilting mechanism 131 is shown. Figure 8 In the example, the transfer unit 13 includes a movable tilting mechanism 131, which is configured to gradually transfer the powder layer PL from the vibrating plate 11 to the substrate platform 21 by tilting the vibrating plate 11 in a moving state. The tilting mechanism 131 is constructed with a multi-degree-of-freedom robotic arm to achieve precise positioning and control of the vibrating plate 11. The robotic arm consists of multiple joints and links, each of which can move independently, allowing the robotic arm to move freely in multiple directions to control the vibrating plate 11 to maintain balance during tilting and ensure stable transfer of the powder layer PL.

[0070] During operation, the robotic arm first positions the vibrating plate 11 above the substrate platform 21 and maintains it horizontally to form a uniform powder layer PL. The control system 14 controls each joint of the robotic arm through precise calculation and programming to achieve smooth and controllable tilting motion. As the robotic arm moves, the vibrating plate 11 begins to tilt, and the powder layer PL gradually slides along the plate surface. By gradually increasing the tilt angle, the robotic arm can ensure that the powder layer PL is evenly distributed during the transfer process. During the tilting process, the vibrating plate 11 maintains slight vibration to prevent uneven sliding of the powder layer PL. The vibration frequency and amplitude are also adjusted in real time by the control system 14 to adapt to different powder characteristics and transfer conditions. When the vibrating plate 11 reaches the preset maximum tilt angle, the powder layer PL has been completely transferred to the substrate platform 21. At this time, the control system 14 issues a command to stop the movement of the robotic arm. In this way, the tilting mechanism 131 achieves efficient and precise powder layer PL transfer, ensuring that each layer of powder is evenly distributed on the substrate platform 21, providing an ideal powder layer PL foundation for subsequent high-energy beam processing.

[0071] Extraction and Transfer

[0072] Figure 9 A schematic diagram illustrating the construction and application of the extraction mechanism 132 is shown. Figure 9 In the example, the transfer unit 13 includes a removal mechanism 132, which is configured to rapidly remove the vibrating plate 11 after the powder layer PL is formed, causing the powder layer PL to fall onto the substrate platform 21 by inertia. The core of this process is to utilize the sudden removal of the vibrating plate 11 to allow the already arranged powder layer PL to be transferred quickly and uniformly onto the substrate platform 21 without significant changes in the morphology of the powder layer PL due to excessive movement. The removal mechanism 132 is, for example, a high-speed drive device (such as a linear motor, pneumatic device, electromagnetic propulsion system, or the previously disclosed robotic arm), capable of removing the vibrating plate 11 horizontally at extremely high speeds, completing the removal action of the vibrating plate 11 in a very short time, allowing the vibrating plate 11 to be rapidly removed before the powder layer PL falls, providing a free path for the powder to fall.

[0073] During operation, the vibrating plate 11 is first positioned above the substrate platform 21 and vibrates to form the desired powder layer PL from the powder P. At this time, the powder layer PL is in a relatively stable state, and due to the flat surface of the vibrating plate 11, the powder layer PL maintains its preset shape. Then, the control system 14 sends a signal to start the extraction mechanism 132. In a very short time, the vibrating plate 11 is rapidly extracted, causing the powder layer PL to fall freely due to loss of support. Because the extraction process occurs extremely quickly, the shape of the powder layer PL is mainly determined by its inertia. This means that if the extraction process is smooth and without vibration, the powder layer PL will maintain its original arrangement and form the same or essentially the same pattern on the substrate platform 21 as on the vibrating plate 11. This is particularly suitable for situations where complex or fine powder patterns need to be formed on the substrate platform 21, as it can complete the precise transfer of the powder layer PL in a very short time.

[0074] Fall Transfer

[0075] Figure 10 A schematic diagram illustrating the construction and application of the microvalve 133 is shown. Figure 10 In this example, the transfer unit 13 includes multiple microvalves 133, which can be implemented using micro-electromechanical systems (MEMS) technology and are distributed inside the vibrating plate 11. The microvalves 133 are configured to form vertically penetrating holes 112 in their open / closed state, allowing the powder layer PL to fall freely onto the substrate platform 21 through these holes, thus achieving the transfer of the powder layer PL. MEMS technology enables these microvalves 133 to precisely control the powder P transfer process by fabricating and integrating mechanical components, sensors, actuators, and electronic circuits at the micrometer level. The vibrating plate 11 is normally closed, with its surface fully supporting the powder layer PL. When it is necessary to transfer the powder layer PL onto the substrate platform 21, the control system 14 sends a signal to precisely control the selected microvalves 133 (each microvalves 133 can be controlled independently) to open via the MEMS drive system, forming the penetrating holes 112. Each microvalves 133 consist of tiny mechanical components, including micro-actuators and control circuitry, capable of rapidly responding to control signals to achieve precise opening and closing operations. Using MEMS technology, the microvalve 133 can open and close in a very short time, thereby ensuring the precise transfer of powder P to a predetermined position.

[0076] During operation, when the control system 14 issues a command, the MEMS drive system quickly activates the selected microvalve 133. The opening of the microvalve 133 creates a series of small holes 112, allowing the powder layer PL to fall evenly onto the substrate platform 21 under gravity. Since the operation of each microvalve 133 can be controlled independently, different areas of the microvalve 133 can be opened as needed to achieve the transfer of specific portions of the powder layer PL. Due to the very small size of the microvalve 133, they can be densely distributed across the entire surface of the vibrating plate 11, thereby covering a larger powder transfer area. Additionally, to ensure that the powder layer PL falls evenly through the holes 112, the vibrating plate 11 may be slightly vibrated or tilted before the microvalve 133 is opened to ensure that the powder layer PL is in the optimal falling state and to prevent the powder P from becoming blocked or unevenly distributed during the falling process.

[0077] Scrolling transfer

[0078] In some embodiments of this disclosure, the transfer unit 13 further includes a winding mechanism. Figure 11 A schematic diagram illustrating the structure and application of the winding device is shown. Figure 11 In the example, the rolling mechanism includes a flexible pad 137, rollers 138A and 138B, and a moving device 139.

[0079] The flexible pad 137 is disposed above the vibrating plate 11 and is used to support the received powder P.

[0080] Rollers 138A and 138B are respectively mounted on both sides of the vibrating plate 11 to receive and release the flexible pad 137. Rollers 138A and 138B rotate synchronously, causing the flexible pad 137 to smoothly roll along the surface of the vibrating plate 11. Through this rolling process, the flexible pad 137 gradually transfers the powder layer PL it carries to one side of the vibrating plate 11. When the flexible pad 137 approaches the edge of the vibrating plate 11, the powder layer PL will naturally detach from the flexible pad 137 due to lack of support and fall evenly onto the substrate platform 21 under gravity. This allows the powder layer PL to maintain its original shape and distribution pattern, avoiding deformation or scattering of the powder layer due to sudden transfer or strong impact.

[0081] The winding mechanism also includes a drive motor (not shown) for driving the rollers 138A and 138B to rotate under the control of the control system 14.

[0082] The rolling mechanism also includes a tensioning device (not shown). This tensioning device effectively tensions the flexible pad 137, ensuring that it remains flat and does not curl during operation. Specifically, through the action of the tensioning device, the flexible pad 137 will not wrinkle or loosen due to uneven force or stress generated during the rolling operation of rollers 138A and 138B, ensuring that the flexible pad 137 remains smooth and flat on the surface of the vibrating plate 11, thereby providing a stable bearing surface for the powder layer PL.

[0083] The moving device 139 drives the vibrating plate 11 to move horizontally, so that the powder layer PL is evenly detached from one side of the vibrating plate 11 and falls onto the substrate platform 21. The moving device 139, in conjunction with the movement of rollers 138A and 138B, makes the entire transfer process of the powder layer PL smoother. By controlling the horizontal movement speed of the vibrating plate 11 to coordinate with the rolling speed of rollers 38A and 138B, it is possible to ensure that the powder layer PL maintains its integrity during the transfer process, avoiding problems such as powder agglomeration or uneven distribution.

[0084] Adsorption and transfer

[0085] Figure 12 A schematic diagram illustrating the construction and application of the adsorption mechanism 134 and the flipping mechanism 135 is shown. Figure 12 In the example, the transfer unit 13 includes an adsorption mechanism 134 and a flipping mechanism 135, which work together to achieve the directional transfer of the powder layer PL. The adsorption mechanism 134 is installed inside or at the bottom of the vibrating plate 11, and its purpose is to use adsorption force to control the adsorption and release of powder P. The flipping mechanism 135 is used to flip the vibrating plate 11 from its original position, so that the powder P, with the assistance of the adsorption mechanism 134, is transferred from the vibrating plate 11 to the substrate platform 21 via a free fall path.

[0086] In one implementation, the adsorption mechanism 134 can be an electrostatic adsorption device to achieve precise adsorption and release of powder P using the effect of an electrostatic field. Specifically, a set of charged electrodes can be integrated inside or at the bottom of the vibrating plate 11. A certain voltage is applied by the control system 14 to form a strong electrostatic field on the electrode surface. After resonance ends, the powder P on the vibrating plate 11 will acquire an opposite charge to the electrodes due to electrostatic induction, thus being firmly adsorbed onto the surface of the vibrating plate 11. When it is necessary to release the powder P, by applying a voltage in the opposite direction or directly cutting off the electric field, the powder particles will lose the electrostatic adsorption force and thus fall freely from the vibrating plate 11.

[0087] Alternatively, the adsorption mechanism 134 can also be a vacuum adsorption device. For example, the adsorption control of powder P can be achieved by integrating a micro vacuum chamber or micropore array inside the vibrating plate 11. When it is necessary to adsorb powder P onto the surface of the vibrating plate 11, the vacuum adsorption device starts a micro vacuum pump to generate a local negative pressure in the micropores or vacuum chamber, thereby firmly adsorbing powder P onto the vibrating plate. When it is necessary to release powder P, the vacuum adsorption device stops the vacuum pump or fills the vacuum chamber with gas, causing the powder particles to lose the adsorption force of the negative pressure, thereby detaching from the surface of the vibrating plate 11 and falling freely onto the substrate platform 21.

[0088] Alternatively, the adsorption mechanism 134 can also be an electromagnetic adsorption device to adsorb and release some magnetic powder P. The electromagnetic adsorption device, for example, consists of multiple electromagnetic coils that generate a magnetic field when an electric current passes through them, thereby adsorbing magnetic metal powder particles. When the current stops, the magnetic field disappears, and the powder particles are released.

[0089] In actual operation, the powder P on the vibrating plate 11 is first firmly adsorbed by the adsorption mechanism 134. The adsorption mechanism 134 uses adsorption force to stably attach the powder P to the surface of the vibrating plate 11, preventing the powder P from scattering or moving during the transfer process and ensuring that the powder particles maintain a predetermined arrangement on the vibrating plate 11. The flipping mechanism 135 is used to flip the vibrating plate 11 from its original position, allowing the powder P to be transferred from the vibrating plate 11 to the substrate platform 21 by free fall with the assistance of the adsorption mechanism 134. The flipping mechanism 135 can be, for example, the robotic arm disclosed above, which can precisely rotate the vibrating plate 11 under the command of the control system 14. After flipping, the control system 14 issues a command, the adsorption mechanism 134 stops adsorption, and the powder P loses its adsorption force. At this time, the flipping mechanism 135 quickly and smoothly flips the vibrating plate 11 180° from its current position, allowing the powder P to fall freely onto the substrate platform 21 under the action of gravity.

[0090] The advantage of this adsorption-transfer method lies in its ability to achieve precise directional transfer of the powder layer PL, while avoiding potential scattering or uneven distribution of the powder P during the transfer process. Through the control of the adsorption mechanism 134, the powder P can maintain a stable arrangement on the vibrating plate 11, ensuring that the distribution of the transferred powder layer PL on the substrate platform 21 matches the expected shape. Furthermore, for powder layer patterns of different types and shapes, precise control of the powder layer PL can be achieved by adjusting the adsorption intensity and flipping angle. Throughout the transfer process, the control system 14 not only coordinates the operation of the adsorption mechanism 134 and the flipping mechanism 135, but also adjusts the transfer parameters based on real-time monitored data, ensuring optimal results for each transfer. For example, during the descent of the powder layer PL, the control system 14 can dynamically adjust the flipping speed and angle by monitoring sensor data to optimize the distribution of the powder layer PL.

[0091] Airflow assist

[0092] Figure 13 A schematic diagram illustrating the structure and application of the airflow assist mechanism 136 is shown. Based on any of the above-described transfer methods, particularly in applications of tilt transfer and extraction transfer, the transfer unit 13 may include the airflow assist mechanism 136, which is configured to apply a controllable airflow during the transfer of the powder layer PL to optimize the distribution and transfer path of the powder layer PL.

[0093] Specifically, the airflow assist mechanism 136 may consist of one or more adjustable nozzles that, under the command of the control system 14, apply an airflow with a specific direction, velocity, and pressure to the powder layer PL. By precisely controlling these parameters, the airflow assist mechanism 136 can perform the following functions during the transfer of the powder layer PL: First, the airflow assist mechanism 136 provides additional power when the powder layer PL begins to transfer, ensuring that the powder layer PL can smoothly leave the vibrating plate 11 and move towards the substrate platform 21. For inclined transfer methods, this airflow can assist the powder particles to slide along the inclined surface of the vibrating plate, ensuring that they are transferred downwards at a predetermined speed and direction. For extraction or magnetic transfer methods, the airflow can help the powder layer PL overcome inertia, ensuring that it can obtain a stable initial motion state at the start of the transfer. Second, during the transfer of the powder layer PL, the airflow assist mechanism 136 can finely control the movement trajectory of the powder particles by adjusting the direction and intensity of the airflow, preventing the powder P from scattering or deviating during the transfer process. Especially when the powder layer PL has a complex or irregular shape, the airflow assist can maintain the integrity of the powder layer PL, ensuring that it still maintains the predetermined arrangement and distribution state when it reaches the substrate platform 21. In addition, the airflow assist mechanism 136 can also be used to make final adjustments and corrections to the powder layer PL when it approaches the substrate platform 21. By applying a slight airflow when the powder P is about to fall onto the substrate platform 21, the uneven distribution caused by gravity or other factors can be effectively eliminated, thereby ensuring that the powder layer PL can be uniformly and accurately covered on the predetermined area, and the cumulative error between layers can be effectively reduced, ultimately improving the forming accuracy of the entire part.

[0094] In addition to controlling the operation of various mechanisms in the transfer unit 13, the control system 14 can also dynamically adjust the intensity and direction of the airflow based on real-time data. For example, sensors can monitor the movement state of the powder layer PL in real time and feed the data back to the control system 14. The control system 14 then adjusts the output of the airflow assist mechanism 136 based on this data to ensure that the path and speed of the powder layer PL during the transfer process conform to the design.

[0095] Figure 14 A schematic diagram of one possible structure of the substrate platform 21 is shown. Figure 14 In the example, the substrate platform 21 is composed of multiple independent plates 211. The plates 211 can be spliced ​​into a whole substrate platform 21 for carrying powder P and manufacturing the shaped part 210, or they can be separated into multiple independent plates 211 after the forming process is completed so that the shaped part 210 carried on each plate 211 can be processed separately.

[0096] Specifically, during the AM process, the various plates 211 of the substrate platform 21 can be tightly joined together to form a flat, integrated platform. This allows the powder P carried by each plate 211 in the connected state to be evenly distributed on part or the entire platform surface. The formation of the powder layer PL is achieved through zoned distribution based on the specific pattern of the desired component 210, meaning the distribution position and quantity of powder P are precisely controlled according to the arrangement and load-bearing capacity of each plate 211. The powder distribution on each plate 211 corresponds to the shape and size of the component 210 to be formed on that plate 211, thereby achieving precise material utilization and forming control. This zoned distribution method not only reduces material waste but also improves powder utilization during the forming process. After the forming component 210 is manufactured, these joined plates 211 can be easily separated to form independent, separated plates 211. The formed component 210 carried on each plate 211 can be post-processed separately without affecting the components on other plates 211. Since each plate 211 is independent, different post-processing processes and parameters can be freely selected according to the specific requirements of the component 210.

[0097] Furthermore, the separate plates 211 simplify the removal and transportation of the formed parts 210. Since each plate 211 can be handled individually, the complexity and difficulty of removal and handling traditional large-size substrate platforms are reduced. This setup is particularly effective in reducing operational complexity in post-processing stages for mass production or complex-shaped formed parts 210.

[0098] In some embodiments, component 10 further includes a powder feeding device 17. Figure 15 and Figure 16 Two different powder feeding devices 17 are shown, which are used to provide a continuous supply of powder P to the vibrating plate 11.

[0099] exist Figure 15 In the illustrated configuration, the powder feeding device 17 is positioned in the space above the vibrating plate 11. The powder feeding device 17 directly releases powder P onto the vibrating plate 11, enabling the powder P to quickly and uniformly cover the surface of the vibrating plate 11. This allows for precise control of the release amount and distribution area of ​​the powder P, ensuring that the powder layer PL on the vibrating plate 11 meets the specific requirements of the forming part 210. The powder feeding device 17 may include one or more nozzles or distributors to release powder P at a specific speed and direction according to a preset program, thereby achieving precise control of the powder P distribution on the vibrating plate 11. Furthermore, the powder feeding device 17 can be integrated with the control system 14 as needed to achieve automated operation.

[0100] Figure 16Another schematic diagram of the powder feeding device 17 is shown. In this configuration, the powder feeding device 17 consists of two parts: a liftable powder container 171 and a movable powder conveyor 172. The powder container 171 can be vertically adjusted so that its upper part is on the same horizontal plane as the vibrating plate 11. Considering that the vibrating plate 11 may be at different heights at different manufacturing stages, the powder container 171 can be horizontally aligned with the vibrating plate 11 when powder needs to be supplied to the vibrating plate 11, thus ensuring that the powder P can be smoothly transferred to the surface of the vibrating plate 11.

[0101] The powder container 171 stores powder P for the manufacturing process. When the powder container 171 rises to a horizontal plane that connects with the vibrating plate 11, the powder P overflows from the top of the container under the action of the driving component (which can be controlled by the control system 14), forming a powder P accumulation on the top of the powder container 171. "Powder P accumulation on the top of the powder container 171" refers to the powder P overflowing from the inside of the powder container 171 to the top layer under the drive of the lifting device. At this time, the powder conveyor 172 is moved and arranged on one side of the accumulated powder P to transport the accumulated powder P along the moving plane above the vibrating plate 11. That is, the powder conveyor 172 (a device capable of moving on a horizontal plane) uniformly transports the powder P overflowing from the powder container 171 to the surface of the vibrating plate 11. The powder conveyor 172 can take various forms, such as a scraper or the rollers disclosed above, to ensure that the powder P can be smoothly delivered to various areas of the vibrating plate 11. Additionally, the powder feeding device 17, consisting of the powder container 171 and the powder conveyor 172, can also directly supply powder to the substrate platform 21 by lowering it to a horizontal plane that is in contact with the substrate platform 21. Furthermore, the powder conveying container 172 (such as a roller) can move above the substrate platform 21 to press the transferred powder layer PL, i.e., it can be used as the flattening section 15 with a roller structure disclosed above. It should be understood that the powder layer PL is formed by the accumulation of a certain amount of powder P.

[0102] In actual operation, the coordination between the powder container 171 and the powder conveyor 172 is the core of the entire powder feeding process. The powder container 171 is synchronized with the vibrating plate 11 via a lifting device, which not only reduces powder P waste but also prevents unnecessary powder spillage due to height differences during conveying. Furthermore, the movement path and speed of the powder conveyor 172 can be precisely adjusted by the control system 14 to adapt to the powder requirements at different positions on the vibrating plate 11. Another significant advantage of this configuration is its adaptability to complex manufacturing environments. In some manufacturing processes, the vibrating plate 11 needs to be adjusted in height and position at different manufacturing stages, and the liftable design of the powder feeding device 17 allows it to seamlessly adapt to these changes, improving manufacturing efficiency and reducing potential manufacturing defects caused by uneven powder supply. In addition, in some embodiments, they can be used together. Figure 15 and Figure 16 The powder feeding device 17 in the example is used for AM equipment.

[0103] As described above, component 10 of this disclosure is considered a key component in an AM (Advanced AM) device for processing powder P. Therefore, the detailed description of component 10 in this disclosure also applies to the interpretation of the overall construction of the AM device. The design of the AM device can freely select from the various structural and functional components 10 disclosed above to assemble the required device architecture.

[0104] Figure 17 An exemplary structural diagram of AM device 20 is shown. Figure 17 In the example, AM device 20, in addition to some components included in component 10, also includes a high-energy beam scanning device 18 (which may also be included in component 10) for controlling a high-energy beam L to scan along the contour of the powder layer PL applied on the substrate platform 21 to form a contour support structure during the fabrication of the layer cross-section of the shaped component 210. Specifically, when the layer cross-section of the shaped component 210 begins to be constructed, the control system 14 controls the high-energy beam scanning device 18 to precisely scan the powder layer PL on the substrate platform 21. For example, the high-energy beam L can scan along the edge of the powder layer PL to form a stable and strongly supportive contour support structure. The formation of this contour support structure enables the layers to bond firmly during the subsequent layer fabrication process and prevents the powder from collapsing or moving in non-fabrication areas.

[0105] In some embodiments, the contour support structure can also be used to add dissimilar materials, enabling the printing of multiple materials and offering the advantage of easy removal of different materials. By introducing dissimilar materials into the contour support structure, material properties can be optimized. Furthermore, another advantage of using dissimilar materials is that different materials can be more easily removed or processed in subsequent manufacturing processes. Due to the differences in physical and chemical properties of different materials, they possess easily peelable characteristics, allowing for the easy removal of unwanted support material without adversely affecting the main structure.

[0106] In addition to forming the contour support structure, the high-energy beam scanning device 18 is also used for the core manufacturing of the shaped component 210. The high-energy beam scanning device 18 selectively emits a high-energy beam L according to a preset path and scanning strategy to locally sinter or melt the powder layer PL, allowing the powder layer PL to gradually solidify and form the layer cross-section of the component 210. With each layer stacked, the final shaped component 210 is gradually constructed. Furthermore, other conventional components used in the AM process, such as the powder supply system, substrate heating system, environmental control system, and manufacturing monitoring system, can all be included in the AM equipment 20 disclosed herein.

[0107] It should be understood that existing technologies exist for eliminating powder agglomeration by vibrating the powder, but these methods typically focus on two paths: directly vibrating the powder during the layup process, or using a vibrating substrate platform. While both methods can reduce powder agglomeration to some extent, their limitations are quite significant. First, directly vibrating the powder layer often fails to achieve resonance through precise control of vibration parameters, meaning it cannot generate standing waves. The presence of standing waves is crucial for forming a specific patterned powder layer driven by wave nodes and antinodes. This pattern not only helps to uniformly distribute the powder but also allows for better control of powder particle alignment, thereby improving the forming accuracy and quality of parts in subsequent additive manufacturing processes. Second, the method using a vibrating substrate platform typically fails to achieve ideal resonance due to limitations in the structure and installation conditions of the substrate platform, especially its thickness and fixing method. As the supporting foundation for the entire additive manufacturing process, the thickness and material properties of the substrate platform make it insensitive to resonance and difficult to form standing waves. Furthermore, directly vibrating the substrate platform can also adversely affect the powder layer on it and subsequent processing. Because vibrations of the substrate platform are transmitted to the powder layer on it, they can cause powder redistribution or interlayer inhomogeneity, negatively impacting the final quality of the molded part. This inhomogeneity and instability not only reduce the precision of the finished product but can also increase errors during processing, affecting product consistency. Therefore, the simple vibration method used in the prior art is insufficient to meet the requirements of high-quality powder processing. The method and apparatus provided in this disclosure improve upon these limitations by applying resonant vibration to the vibrating plate, generating standing waves and precisely controlling the distribution and arrangement of the powder, thereby forming a powder layer with a specific pattern.

[0108] It should be understood that the various processes and steps in AM component 10 mentioned above can serve as methods improved by this disclosure and constitute, for example, a method for controlling the powder handling of the component. Although the specific details of this method have been described in detail above, the following references are made for a clearer understanding of the core methods involved in this disclosure. Figure 18 (The structure and function of the components can be found in the reference) Figure 1-16 (Any of the attached figures) briefly describes its main steps.

[0109] Figure 18 A schematic flow diagram of a method 30 for processing powder P by control component 10 is shown. The method 30 disclosed herein mainly includes the following steps:

[0110] 301. When forming at least one layer of the forming component 210, the control excitation unit 12 applies a vibration force to the vibrating plate 11 to cause the vibrating plate 11 to resonate and form a standing wave, thereby causing the powder P received by the vibrating plate 11 to form a powder layer PL with a specific pattern driven by the standing wave.

[0111] 302. The control transfer unit 13 changes the positional relationship between the powder layer PL and the vibrating plate 11, so that the powder layer PL is transferred from the vibrating plate 11 to the substrate platform 21 in a shape that maintains or is close to a specific pattern, so as to form one of the powder layers PL for additive manufacturing.

[0112] In some embodiments, method 30 further includes: controlling the excitation unit 12 to apply specific or continuously varying vibration parameters to the vibrating plate 11 based on at least one layer information of the forming component 210.

[0113] In some embodiments, method 30 further includes: controlling the flattening portion 15 to move relative to the substrate platform 21 to uniformly flatten the powder layer PL transferred onto the substrate platform 21.

[0114] In some embodiments, method 30 further includes: controlling the moving part 16 to drive the vibrating plate 11 away from the area covered by the substrate platform 21 after the transfer of one of the powder layers PL is completed, and driving the vibrating plate 11 back to the space above the substrate platform 21 when a new powder layer PL needs to be applied.

[0115] It should be understood that Method 30 generally discloses some key steps for controlling the processing of powder P in AM assembly 10 to facilitate the precise formation and stable transfer of powder layer PL during the AM process. By controlling the excitation unit 12 to generate standing waves to drive powder P to form a specific pattern, and then precisely transferring the pattern onto substrate platform 21 by transfer unit 13, Method 30 can effectively control the morphology and distribution of powder layer PL. In addition, Method 30 may also include additional steps such as vibration parameter control, powder layer flattening, and vibratory plate movement to further optimize the manufacturing process.

[0116] It should be understood that the control process of method 30 described above in this application can be implemented wholly or partially through software, hardware, firmware, or any other combination. When implemented using software, it can be implemented wholly or partially in the form of a computer program product. A computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the flow or function according to the method embodiment is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., digital video discs (DVDs)), or semiconductor media (e.g., solid-state disks (SSDs)).

[0117] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope.

Claims

1. An assembly (10) for processing powder (P) in additive manufacturing, comprising: A vibrating plate (11) is used to carry the received powder (P) and transmit vibration to it; The excitation unit (12), which is connected to the vibrating plate (11), is configured to apply a vibration force to cause the vibrating plate (11) to resonate and form a standing wave, thereby forming a powder layer (PL) with a specific pattern driven by the standing wave on the vibrating plate (11). as well as The transfer unit (13) is configured to change the positional relationship between the powder layer (PL) and the vibrating plate (11) so that the powder layer (PL) is transferred from the vibrating plate (11) to the substrate platform (21) in a shape that maintains or is close to the specific pattern, so as to form one of the powder layers (PL) for additive manufacturing.

2. The component (10) according to claim 1, wherein the component (10) further comprises a control system (14) configured to control the excitation unit (12) to apply vibration parameters to the vibrating plate (11) with specific or continuously varying vibration parameters based on at least one layer information of the forming member (210), and to control the operation of the transfer unit (13).

3. The component (10) according to claim 2, wherein the vibration parameters include one or more of the vibration frequency, amplitude, intensity and time interval.

4. The component (10) according to claim 1, wherein the amount of powder received by the vibrating plate (11) is a value determined according to one of the layer information of the forming component (210) that enables the formation of a powder layer (PL) of a predetermined thickness after vibration, either partially or completely.

5. The component (10) according to claim 1 or 4, wherein the component (10) further comprises a flattening portion (15) movable relative to the substrate platform (21) to uniformly flatten the powder layer (PL) transferred onto the substrate platform (21).

6. The component (10) according to claim 5, wherein the flattening part (15) is configured to have a pressure plate (151) that moves in a vertical direction toward the substrate platform (21) to press against it and / or has a roller (152) that rolls and presses over the substrate platform (21) in a horizontal direction.

7. The component (10) according to claim 1, wherein the vibrating plate (11) is disposed in stages in the space above the substrate platform (21), the component (10) further comprising a moving part (16) configured to drive the vibrating plate (11) away from the area covering the substrate platform (21) after the transfer of one of the powder layers (PL) is completed, and to drive the vibrating plate (11) back to the space above the substrate platform (21) when a new powder layer (PL) needs to be applied.

8. The component (10) according to claim 1, wherein the component (10) further comprises a high-energy beam scanning device (18) configured to control a high-energy beam (L) to scan along the contour of a powder layer (PL) applied on the substrate platform (21) to form a contour support structure when manufacturing the layer cross section of the shaped part (210).

9. The component (10) according to claim 1, wherein the distribution position of the powder layer (PL) on the vibrating plate (11) after vibration is applied is different from the distribution position on the substrate platform (21) after transfer, and the distribution position of the powder layer (PL) on the vibrating plate (11) is determined according to the transfer error compensation so that the powder layer transferred to the substrate platform (21) matches the shape anchored by one of the layer information of the forming component (210).

10. The component (10) according to claim 1, wherein the transfer unit (13) includes a movable tilting mechanism (131) configured to gradually transfer the powder layer (PL) from the vibrating plate (11) to the substrate platform (21) by tilting the vibrating plate (11) in a moving state.

11. The component (10) according to claim 1, wherein the transfer unit (13) includes a removal mechanism (132) configured to rapidly remove the vibrating plate (11) during the transfer of the powder layer (PL) so that the powder layer (PL) falls inertially onto the substrate platform (21).

12. The component (10) according to claim 1, wherein the transfer part (13) includes a plurality of microvalves (133) distributed inside the vibrating plate (11) and configured to enable the vibrating plate (11) to form a vertically penetrating hole (112) in the open or closed state, so that the powder layer (PL) falls freely onto the substrate platform (21) through the hole (112).

13. The component (10) according to claim 1, wherein the transfer unit (13) comprises: A flexible pad (137) is disposed above the vibrating plate (11) for carrying the received powder (P); Rollers (138A, 138B) are respectively disposed on both sides of the vibrating plate (11) and are used to take the flexible pad (137) in different directions so that it can be rolled along the surface of the vibrating plate (11) to gradually transfer the powder layer (PL) to the edge of the vibrating plate (11). A moving device (139) is used to drive the vibrating plate (11) to move in a horizontal direction so that the powder layer (PL) is uniformly detached from one side of the vibrating plate (11) and falls onto the substrate platform (21).

14. The component (10) according to claim 1, wherein the transfer unit (13) comprises: An adsorption mechanism (134) is disposed inside or at the bottom of the vibrating plate (11) and is configured to achieve directional transfer of the powder layer (PL) by adsorbing or releasing the powder (P) on the vibrating plate (11); as well as A flipping mechanism (135) is configured to flip the vibrating plate (11) so that the powder (P) on the vibrating plate (11) is transferred from the vibrating plate (11) to the substrate platform (21) by a free fall path with the assistance of the adsorption mechanism (134).

15. The component (10) according to any one of claims 10-14, wherein the transfer unit (13) includes an airflow assist mechanism (136) configured to apply a controllable airflow during the powder layer (PL) transfer process to optimize the distribution and transfer path of the powder layer (PL).

16. The component (10) according to claim 1, wherein the substrate platform (21) is composed of a plurality of independent plates (211), each plate (211) being able to be spliced ​​into a whole for individually forming a part (210) on powder (P) carried by one or more of its plates (211), wherein a specific pattern formed by the powder layer (PL) corresponds to the distribution of the plates (211) carrying the powder (P).

17. The component (10) according to claim 1, wherein the component (10) further comprises a powder feeding device (17) disposed in the space above the vibrating plate (11) to release powder (P) onto the vibrating plate (11) and / or disposed on one side of the vibrating plate (11) in the horizontal direction to deliver powder to the vibrating plate (11).

18. The component according to claim 17, wherein when the powder feeding device (17) is disposed on one side of the vibrating plate (11) in the horizontal direction to feed powder (P) to the vibrating plate (11), the powder feeding device (17) comprises: A liftable powder container (171) is configured to rise vertically to a horizontal plane that is in contact with the vibrating plate (11). A movable powder conveyor (172) is disposed on the horizontal plane to move and convey powder (P) overflowing from the top of the powder container (171) to above the vibrating plate (11).

19. The component (10) according to claim 1, wherein the excitation unit (12) comprises at least one of a mechanical exciter, an audio exciter, a piezoelectric exciter, and an electromagnetic exciter.

20. An additive manufacturing apparatus (20) comprising the component (10) according to any one of claims 1-19.

21. A method (30) for controlling the processing of powder (P) by the component (20) according to any one of claims 1-19, the method (30) comprising: When forming at least one layer of the forming component (210), the excitation part (12) is controlled to apply a vibration force to the vibrating plate (11) to cause the vibrating plate (11) to resonate and form a standing wave, thereby causing the powder (P) received by the vibrating plate (11) to form a powder layer (PL) with a specific pattern driven by the standing wave. as well as The transfer unit (13) is controlled to change the positional relationship between the powder layer (PL) and the vibrating plate (11), so that the powder layer (PL) is transferred from the vibrating plate (11) to the substrate platform (21) in a shape that maintains or is close to the specific pattern, so as to form one of the powder layers (PL) for additive manufacturing.

22. The method (30) according to claim 21, wherein the method (30) further comprises: Based on at least one layer information of the forming component (210), the excitation unit (12) is controlled to apply vibration parameters to the vibrating plate (11) with specific or continuously varying vibration parameters.

23. The method (30) according to claim 21, wherein the method (30) further comprises: The flattening part (15) is controlled to move relative to the substrate platform (21) to uniformly flatten the powder layer (PL) transferred onto the substrate platform (21).

24. The method (30) according to claim 21, wherein the method (30) further comprises: The control unit (16) drives the vibrating plate (11) away from the area covered by the substrate platform (21) after completing the transfer of one of the powder layers (PL), and drives the vibrating plate (11) back to the space above the substrate platform (21) when a new powder layer (PL) needs to be applied.

Images