Diamond machine and diamond grinding method

Abstract

The invention discloses a diamond machine and a diamond polishing method, and the diamond machine comprises a polishing device which comprises a grinding wheel and a polishing driving mechanism used for driving the grinding wheel to rotate; at least one diamond clamping device; the control device is used for controlling the polishing device and the diamond clamping device; the diamond clamping device comprises a diamond clamp used for clamping a diamond; the diamond angle adjusting mechanism is used for adjusting the diamond clamp to achieve diamond angle adjustment, and the grinding feeding mechanism is used for driving the diamond angle adjusting mechanism to be vertically away from or close to the grinding wheel; the diamond angle adjusting mechanism comprises a parallel rotating assembly and a load detecting assembly. The parallel rotating assembly is used for driving the diamond clamp to move circumferentially on the plane parallel to the grinding wheel. The load detection assembly is used for detecting the force borne by the diamond during polishing; when the force borne by the diamond exceeds a set value, the parallel rotating assembly drives the diamond clamp to circumferentially move by a set angle. The method can be used for well treating the hard-to-wear surface of the crystal phase.

Description

Technical Field

[0001] This invention relates to the field of diamond polishing, and in particular to a diamond polishing machine and a diamond polishing method. Background Technology

[0002] Diamonds need to be polished to achieve their perfect shape, but a standard diamond typically consists of 57 or 58 facets. These tiny facets are usually polished using a diamond polishing machine. However, during the polishing process, difficult-to-polish facets are encountered. There are three specific terms for these difficult-to-polish facets: 100 facets, 110 facets, and 111 facets, in descending order of difficulty. The most difficult facet is the 111 facet. Under a microscope, its surface shows a grid-like texture, so it must be polished tangentially to the diamond's grain to ensure successful polishing. Otherwise, excessive pressure can cause the diamond to oxidize and turn red, eventually leading to cracking. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, the present invention provides a diamond machine and a diamond polishing method, which has the advantage of effectively dealing with difficult-to-polish crystal surfaces.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A diamond machine, comprising: frame; A grinding device, including a grinding wheel and a grinding drive mechanism for driving the grinding wheel to rotate; At least one diamond clamping device; and, Control device for controlling the polishing device and the diamond clamping device; The diamond clamping device includes: Diamond clamps are used to hold diamonds. A diamond angle adjustment mechanism for adjusting the diamond clamp to achieve diamond angle adjustment; and... A grinding feed mechanism is used to drive the diamond angle adjustment mechanism vertically away from or towards the grinding wheel; The diamond angle adjustment mechanism includes a parallel rotation component and a load detection component. The parallel rotation component is used to drive the diamond clamp to move circumferentially on a plane parallel to the grinding wheel. The load detection component is used to detect the force on the diamond during polishing. When the force on the diamond exceeds a set value, the parallel rotation component drives the diamond clamp to move circumferentially by a set angle.

[0005] By adopting the above technical solution, when encountering a difficult-to-grind crystal phase during the face grinding process, the parallel rotation component drives the diamond chuck and the diamond on the diamond chuck to move circumferentially at a certain angle on a plane parallel to the grinding wheel, thereby changing the direction of the force applied by the grinding wheel to the diamond crystal phase, avoiding forced grinding that could cause the diamond to turn red or crack, and improving the grinding quality.

[0006] Optionally, the parallel rotation component drives the diamond clamp to move at equal angles.

[0007] By adopting the above technical solution, diamonds can achieve multi-point load detection, thereby quickly avoiding the difficult points of diamond polishing and improving polishing efficiency.

[0008] Optionally, it also includes at least one high-definition microscope lens; the high-definition microscope lens and the diamond clamping device correspond one-to-one; the high-definition microscope lens is used to observe the diamond; the high-definition microscope lens is electrically connected to the control device.

[0009] By adopting the above technical solution, diamonds can be observed more conveniently and accurately, replacing manual observation with a magnifying glass. At the same time, the high-definition microscope lens is electrically connected to the control device, which can upload images for further comparative research.

[0010] Optionally, the diamond clamping device further includes a translation drive mechanism; the translation drive mechanism is used to drive the diamond angle adjustment mechanism away from or towards the high-definition microscope head.

[0011] By adopting the above technical solution, the distance between the diamond and the high-definition microscope lens can be changed to adapt to different observation needs.

[0012] Optionally, the diamond angle adjustment mechanism further includes a rotating base, a first tilting rotation component, a tilting swing arm, a second tilting rotation component, a clamp support base, and a diamond rotation component; the parallel rotation component drives the rotating base to rotate; the first tilting rotation component is disposed on the rotating base and drives the tilting swing arm to swing on the vertical plane of the grinding wheel; the second tilting rotation component is disposed on the tilting swing arm and drives the clamp support base to swing on the swing plane of the tilting swing arm; the diamond rotation component is disposed on the clamp support base and drives the diamond clamp to rotate, thereby causing the diamond to rotate.

[0013] By adopting the above technical solution, before polishing the first facet, the angle of the desired facet can be quickly adjusted by the first tilting and rotating component driving the tilting arm and the second tilting and rotating component. The angle of the next adjacent facet can be quickly adjusted by the second tilting and rotating component. The diamond rotating component drives the diamond to rotate, which can realize the switching of adjacent facets in the circumference. In this way, the polishing of all facets of the diamond can be completed quickly, improving polishing efficiency.

[0014] Optionally, the grinding feed mechanism includes a vertical support base, a vertically sliding vertical moving seat mounted on the vertical support base, and a grinding feed assembly for driving the vertical moving seat; the diamond angle adjustment mechanism is mounted on the vertical moving seat; and a first grating for monitoring the displacement of the vertical moving seat is provided between the vertical support base and the vertical moving seat.

[0015] By adopting the above technical solution, the spacing of the grinding feed linear component can be precisely controlled through the first grating, thereby adapting to situations where the diamond grinding amount is small and improving the grinding accuracy and quality.

[0016] Optionally, the frame includes a base and a protective cover with a front opening; two diamond clamping devices are provided and are symmetrically arranged with respect to the opening of the protective cover; the two diamond clamping devices are symmetrically arranged with respect to the grinding wheel.

[0017] By adopting the above technical solution, two diamond clamping devices can process two diamonds simultaneously, improving polishing efficiency. At the same time, the two diamond clamping devices are symmetrically arranged relative to the grinding wheel, so that the grinding wheel is subjected to symmetrical forces during operation, thereby ensuring the levelness of the grinding wheel and making the angle of the processed diamond facets more accurate, thus improving the polishing quality. In addition, the two openings of the protective cover are symmetrically arranged, which is conducive to the manual loading and unloading of diamonds.

[0018] Optionally, the diamond clamp includes a clamping base, a clamping assembly, and a diamond chuck; the clamping assembly is disposed within the clamping base and is used to clamp and release the diamond chuck; the diamond chuck is used to hold a diamond.

[0019] By adopting the above technical solution, the diamond chuck can be disassembled, so that diamonds can be installed and removed from the outside of the diamond machine, making diamond installation and removal more convenient.

[0020] A diamond polishing method, using a diamond polishing machine; includes the following steps: Step S100: Mount the diamond on the diamond fixture of the diamond machine, with the pavilion of the diamond facing the grinding wheel. Step S200: The diamond angle adjustment mechanism of the diamond machine adjusts the angle of the diamond so that the surface of the diamond to be polished is facing the working surface of the grinding wheel. In step S300, the grinding feed mechanism of the diamond machine drives the diamond to vertically approach the working surface of the rotating grinding wheel for grinding, and the control device controls the feed amount of the grinding feed mechanism. In step S400, the grinding feed mechanism of the diamond machine drives the diamond vertically away from the working surface of the rotating grinding wheel; Step S500: Repeat steps S200-S400 to complete the polishing of all facets of the pavilion of the diamond. Step S600: Remove the diamond from the diamond jig of the diamond machine and then install the diamond so that the crown of the diamond faces the grinding wheel. Step S700: Repeat steps S200-S400 to complete the polishing of all facets of the diamond's crown. Step S800: Remove the diamond from the diamond clamp of the diamond machine; In step S300, when the load detection component of the diamond angle adjustment mechanism detects that the force on the diamond exceeds the set value, the parallel rotation component drives the diamond clamp to rotate by the set angle.

[0021] By adopting the above technical solution, when encountering difficult-to-grind crystal phases during diamond polishing, the diamond can be avoided by rotating its angle, thus preventing the diamond from turning red or cracking due to gravity grinding.

[0022] Optionally, after step S600 is completed, the diamond is observed by the high-definition microscope of the diamond machine, and the control device of the diamond machine controls the diamond angle adjustment mechanism to adjust the angle of the diamond so that the edge line between adjacent main facets of the diamond pavilion is aligned with the preset reference line.

[0023] By adopting the above technical solution, the benchmark positioning for polishing the crown of a diamond can be achieved with the help of a high-definition microscope lens and a diamond angle adjustment mechanism, thereby improving the quality of subsequent polishing. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the present invention.

[0025] Figure 2 This is a cross-sectional structural diagram of the present invention.

[0026] Figure 3 This is the invention Figure 2 A schematic diagram of a local structure.

[0027] Figure 4 This is the invention Figure 3 A magnified structural diagram of part A in the diagram.

[0028] Figure 5 This is a cross-sectional structural diagram of the diamond clamp of the present invention.

[0029] Explanation of reference numerals in the attached figures: 10. Rack; 11. Base; 12. Protective cover; 20. Grinding device; 21. Grinding wheel; 22. Grinding servo motor; 30. Diamond clamping device; 31. Diamond clamp; 311. Clamping seat; 312. Clamping assembly; 313. Diamond chuck; 32. Diamond angle adjustment mechanism; 321. Parallel rotation assembly; 322. Load detection assembly; 323. Rotary seat; 324. First tilting rotation assembly; 325. Tilt swing arm; 326. Second tilting rotation assembly; 327. Clamping support seat; 328. Diamond rotation assembly; 33. Grinding feed mechanism; 331. Vertical support seat; 332. Vertical moving seat; 34. Translation drive mechanism; 341. Translation seat; 40. High-definition microscope lens; 50. Display screen. Detailed Implementation

[0030] The following is in conjunction with the appendix Figures 1-5 The present invention will be described in further detail below.

[0031] Example 1: A diamond machine is disclosed, with reference to... Figure 1 The system includes a frame 10, a grinding device 20, two diamond clamping devices 30, and a control device. The frame 10 includes a base 11 and a protective cover 12. The front end of the protective cover 12 has an opening, which is the end near the operator's loading and unloading position. The two diamond clamping devices 30 are symmetrically arranged with respect to the opening of the protective cover 12. The grinding device 20 includes a grinding wheel 21 and a grinding drive mechanism for driving the grinding wheel 21 to rotate. The grinding drive mechanism includes a grinding servo motor 22 and is mounted on the base 11. The grinding wheel 21 is coaxially fixed to the upper end of the output shaft of the grinding servo motor 22. The two diamond clamping devices 30 are symmetrically arranged with respect to the grinding wheel 21, so that the two diamonds apply force to the grinding wheel 21 simultaneously during grinding, and the grinding wheel 21 is subjected to balanced forces. The control device is used to control the two diamond clamping devices 30 and the grinding device 20.

[0032] refer to Figure 2 and Figure 3 The diamond clamping device 30 includes a diamond clamp 31, a diamond angle adjustment mechanism 32, and a grinding feed mechanism 33. The diamond clamp 31 is used to clamp the diamond. The diamond angle adjustment mechanism 32 adjusts the diamond clamp 31 to achieve diamond angle adjustment. The grinding feed mechanism 33 drives the diamond angle adjustment mechanism 32 and the diamond clamp 31 to move vertically away from or towards the grinding wheel 21 to achieve diamond facet grinding.

[0033] refer to Figure 3The grinding feed mechanism 33 includes a vertical support base 331, a vertically sliding seat 332 mounted on the vertical support base 331, and a grinding feed assembly for driving the vertically sliding seat 332. A pair of vertically arranged linear guides are installed between the vertically sliding seat 332 and the vertical support base 331. A diamond angle adjustment mechanism 32 is mounted on the vertically sliding seat 332. The grinding feed assembly adopts a servo motor and a lead screw and nut mechanism. In order to accurately control the vertical displacement of the vertically sliding seat 332, a first grating is provided between the vertically sliding seat 332 and the vertical support base 331. The first grating includes a first scale grating mounted on the vertically sliding seat 332 and a first grating reading head mounted on the vertical support base 331.

[0034] refer to Figure 4 The diamond angle adjustment mechanism 32 includes a parallel rotation component 321, a rotating seat 323, a first tilting rotation component 324, a tilting swing arm 325, a second tilting rotation component 326, a clamp support seat 327, and a diamond rotation component 328. The parallel rotation component 321 drives the rotating seat 323 to rotate. The first tilting rotation component 324 is mounted on the rotating seat 323 and drives the tilting swing arm 325 to swing on the vertical plane of the grinding wheel 21. The second tilting rotation component 326 is mounted on the tilting swing arm 325 and drives the clamp support seat 327 to swing on the swing plane of the tilting swing arm 325. The diamond rotation component 328 is mounted on the clamp support seat 327 and drives the diamond clamp 31 to rotate, thereby causing the diamond to rotate. The parallel rotation assembly 321, the first tilting rotation assembly 324, the second tilting rotation assembly 326, and the diamond rotation assembly 328 all use geared motors. The output shaft of the parallel rotation assembly 321 is perpendicular to the working surface of the grinding wheel 21, the output shafts of the first tilting rotation assembly 324 and the second tilting rotation assembly 326 are parallel to the working surface of the grinding wheel 21, and the output shaft of the diamond rotation assembly 328 is parallel to the tilting arm 325.

[0035] The rotating seat 323 is an inverted L-shape. The horizontal portion of the rotating seat 323 is vertically fixed to the lower end of the output shaft of the parallel rotating assembly 321. The tilting arm 325, the first tilting rotating assembly 324, and the second tilting rotating assembly 326 are located on the side of the vertical portion of the rotating seat 323 away from the horizontal portion. The clamping support 327 is disposed on the end face of the tilting arm 325 near the rotating seat 323. Thus, during diamond grinding, the diamond clamp 31 can be close to or located on the axis of the output shaft of the parallel rotating assembly 321. When the parallel rotating assembly 321 drives the rotating seat 323, the first tilting rotating assembly 324, and the second tilting rotating assembly 325... 4. When the tilting arm 325, the second tilting rotation component 326, the clamp support 327, the diamond rotation component 328, and the diamond clamp 31 rotate on the horizontal plane, the range of diamond rotation is small and will not exceed the working range of the grinding wheel 21. At the same time, the center of gravity of the module composed of the rotating seat 323, the first tilting rotation component 324, the tilting arm 325, the second tilting rotation component 326, the clamp support 327, the diamond rotation component 328, and the diamond clamp 31 can be located on the axis of the output shaft of the parallel rotation component 321, which is beneficial to the force balance of the output shaft of the parallel rotation component 32.

[0036] To monitor the stress state during diamond polishing, the output shaft of the second tilting rotation assembly 326 is designated as the load shaft. A load detection assembly is installed within the second tilting rotation assembly 326. When the load shaft is subjected to pressure, the power of the second tilting rotation assembly 326 changes. The load detection assembly detects the power of the second tilting rotation assembly 326 to monitor the load change. The load detection assembly can be a Hall effect current sensor and a voltage sensor built into the second tilting rotation assembly 326. The control device calculates the power of the second tilting rotation assembly 326 based on the electrical signals transmitted by the Hall effect current sensor and voltage sensor, thereby monitoring the stress state during diamond polishing. During operation, when the control device calculates that the load on the load shaft exceeds the set value based on the values ​​detected by the load detection assembly, it indicates that the force on the diamond exceeds the set value. At this time, the control device controls the parallel rotation assembly 321 to move the diamond clamp 31 circumferentially by a set angle to avoid the diamond becoming red or cracked due to gravity grinding. The parallel rotation component 321 is divided into multiple set angles for each rotation. The parallel rotation component 321 drives the diamond clamp 31 to move intermittently in a circular motion at set angles. The best embodiment is that each rotation of the parallel rotation component 321 is 12 set angles, that is, the set angle is 30 degrees.

[0037] refer to Figure 5The diamond clamp 31 includes a clamping seat 311, a clamping assembly 312, and a diamond chuck 313. The clamping assembly 312 is disposed within the clamping seat 311 and is used to clamp and release the diamond chuck 313. The diamond chuck 313 is used to clamp a diamond. The clamping seat 311 is rotatably connected to the clamping support 327 via a bearing. The clamping seat 311 is fixedly connected to the output shaft of the diamond rotating assembly 328. The clamping assembly 312 includes a clamping cylinder and a clamping jaw 314 coaxially fixed to the piston rod of the clamping cylinder. The clamping jaw 314 includes a clamping link. The chuck 313 has a connecting portion 3141 and four circumferentially distributed gripper portions 3142; one end of each gripper portion 3142 is fixed to the clamping connecting portion 3141; the outer surface of each gripper portion 3142 is a conical surface and the diameter of the end near the clamping connecting portion 3141 is smaller than the diameter of the end away from the clamping connecting portion 3141; the clamping seat 311 has a shrinkage hole 3110 formed on it to cooperate with the gripper 314, and the sidewall of the shrinkage hole 3110 is a conical surface to cooperate with the four gripper portions 3142; the diamond chuck 313 adopts the existing standard diamond chuck.

[0038] During operation, the diamond is first installed in the diamond chuck 313, and then the diamond chuck 313 is inserted between the four jaw portions 3142 of the clamping jaw 314. After that, the clamping cylinder drives the clamping jaw 314 to move inward. During this process, the conical surface of the shrinkage hole 3110 drives the four jaw portions 3142 to converge inward through the outer surface of the jaw portions 3142, thereby fixing the diamond chuck 313.

[0039] Example 2: The difference between Example 2 and Example 1 is that each diamond clamping device 30 is equipped with a high-definition microscope lens 40 for observing the diamond. The high-definition microscope lens 40 is specifically located at the bottom of the vertical support base 331 and is electrically connected to the control device. This allows observation of the diamond's polishing process through the high-definition microscope lens 40. Additionally, the control device includes a display screen 50, which displays a reference line for the diamond's crown polishing. Using the image information obtained from the high-definition microscope lens 40, a preset program within the control device controls the diamond angle adjustment mechanism 32 to adjust the diamond's angle so that the edges between adjacent main facets of the diamond's pavilion are aligned with the preset reference line on the display screen 50, thereby completing the reference calibration for the diamond's crown polishing.

[0040] To control the distance between the diamond and the high-definition microscope lens 40, the diamond clamping device 30 also includes a translation drive mechanism 34 disposed between the parallel rotation assembly 321 and the vertical moving seat 332; the translation drive mechanism 34 is used to drive the diamond angle adjustment mechanism 32 away from or towards the high-definition microscope lens 40; the translation drive mechanism 34 includes a translation seat 341 horizontally disposed on the bottom surface of the vertical moving seat 332 and a translation drive assembly for driving the translation seat 341; a pair of parallel and horizontally disposed linear guide rails are installed between the translation seat 341 and the bottom surface of the vertical moving seat 332; the parallel rotation assembly 321 is fixed on the vertical moving seat 332; the translation drive assembly adopts a linear motor mechanism; in order to accurately control the horizontal displacement of the translation seat 341, a grating reading head is installed on the bottom surface of the vertical moving seat 332, and a scale grating is installed on the translation seat 341.

[0041] Example 3: A diamond polishing method, using the diamond polishing machine of Example 1; including the following steps: Step S100 involves mounting the diamond on the diamond clamp 31 of the diamond machine, with the pavilion of the diamond facing the grinding wheel 21. This includes the following steps: Step S101: Insert the crown of the diamond into the diamond chuck 313; Step S102: Install the diamond chuck 313 on the clamping assembly 312, and clamp the diamond chuck 313 with the pavilion of the diamond facing the grinding wheel 21. Step S200: The diamond angle adjustment mechanism 32 of the diamond machine adjusts the angle of the diamond so that the surface of the diamond to be polished is directly facing the working surface of the grinding wheel 21. This includes the following steps: In step S201, the preset program inside the control device controls the first tilting rotation component 324 to drive the tilting swing arm 325 to swing in the vertical plane and the second tilting rotation component 326 to drive the clamp support 327 to swing in the vertical plane, so that the diamond facet is parallel to the working surface of the grinding wheel 21. In step S300, the grinding feed mechanism 33 of the diamond machine drives the diamond to vertically approach the working surface of the rotating grinding wheel 21 for grinding, and the control device controls the feed amount of the grinding feed mechanism 33. In step S400, the grinding feed mechanism 33 of the diamond machine drives the diamond vertically away from the working surface of the rotating grinding wheel 21. Step S500: Repeat steps S200-S400 to complete the polishing of all facets of the pavilion of the diamond. Step S600: Remove the diamond from the diamond clamp 31 of the diamond machine, and then install the diamond so that the crown of the diamond faces the grinding wheel 21; specifically, the following steps are included: Step S601: Remove the diamond chuck 313 from the clamping assembly 312; Step S602: Remove the diamond from the diamond chuck 313, then turn the diamond over, and then insert the pavilion of the diamond into the diamond chuck 313. Step S603: Install the diamond chuck 313 on the clamping assembly 312, and clamp the diamond chuck 313 with the diamond crown facing the grinding wheel 21. Step S700: Repeat steps S200-S400 to complete the polishing of all facets of the diamond's crown. Step S800: Remove the diamond chuck 313 from the clamping assembly 312 and remove the diamond from the diamond chuck 313.

[0042] In step S300, when the load detection component of the diamond angle adjustment mechanism 32 detects that the force on the diamond exceeds the set value, the parallel rotation component 321 drives the diamond clamp 31 to rotate at the set angle, which can avoid the diamond from turning red and cracking due to gravity grinding.

[0043] After step S600 is completed, the high-definition microscope lens 40 of the diamond machine observes the diamond, and the control device of the diamond machine controls the diamond angle adjustment mechanism 32 to adjust the angle of the diamond so that the edge line between adjacent main facets of the diamond pavilion is aligned with the preset reference line.

[0044] In other embodiments, to improve the efficiency of diamond grinding, the distance between the contact points of the diamonds held by the two diamond clamping devices 30 and the grinding wheel 21 and the center of the grinding wheel 21 is different. To achieve this, a distance sensor is provided between the translation seat 341 and the vertical support seat 331, and the distance sensor is electrically connected to the control device. During diamond grinding, the distance sensor and the control device make the distance between the two translation seats 341 and their respective vertical support seats 331 different, that is, the distance between the output shafts of the two parallel rotating components 321 and their respective vertical support seats 331 is different. This makes the contact points of the diamonds held by the two diamond clamping devices 30 and the grinding wheel 21 different from the center of the grinding wheel 21. In this way, the two diamonds will not be ground on the same concentric circle of the grinding wheel 21 and will not affect each other, thereby improving the efficiency of diamond grinding.

[0045] The above are all preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A diamond machine, characterized in that: include: Rack (10); The grinding device (20) includes a grinding wheel (21) and a grinding drive mechanism for driving the grinding wheel (21) to rotate; At least one diamond clamping device (30); and, A control device for controlling the polishing device (20) and the diamond clamping device (30). The diamond clamping device (30) includes: Diamond clamp (31) is used to hold diamonds; A diamond angle adjustment mechanism (32) is used to adjust the diamond clamp (31) to achieve diamond angle adjustment; and, A grinding feed mechanism (33) is used to drive the diamond angle adjustment mechanism (32) to move vertically away from or towards the grinding wheel (21). The diamond angle adjustment mechanism (32) includes a parallel rotation component (321) and a load detection component. The parallel rotation component (321) is used to drive the diamond clamp (31) to move circumferentially on a plane parallel to the grinding wheel (21). The load detection component is used to detect the force on the diamond during polishing. When the force on the diamond exceeds a set value, the parallel rotation component (321) drives the diamond clamp (31) to move circumferentially by a set angle.

2. A diamond machine according to claim 1, characterized in that: The parallel rotation assembly (321) drives the diamond clamp (31) to move at equal angles.

3. A diamond machine according to claim 1, characterized in that: It also includes at least one high-definition microscope lens (40); the high-definition microscope lens (40) and the diamond clamping device (30) correspond one-to-one; the high-definition microscope lens (40) is used to observe diamonds; the high-definition microscope lens (40) is electrically connected to the control device.

4. A diamond machine according to claim 3, characterized in that: The diamond clamping device (30) further includes a translation drive mechanism (34); the translation drive mechanism (34) is used to drive the diamond angle adjustment mechanism (32) away from or towards the high-definition microscope head (40).

5. A diamond machine according to claim 1, characterized in that: The diamond angle adjustment mechanism (32) further includes a rotating seat (323), a first tilting rotation component (324), a tilting arm (325), a second tilting rotation component (326), a clamp support seat (327), and a diamond rotation component (328); the parallel rotation component (321) drives the rotating seat (323) to rotate; the first tilting rotation component (324) is disposed on the rotating seat (323) and drives the tilting arm (325) to swing on the vertical plane of the grinding wheel (21); the second tilting rotation component (326) is disposed on the tilting arm (325) and drives the clamp support seat (327) to swing on the swing plane of the tilting arm (325); the diamond rotation component (328) is disposed on the clamp support seat (327) and drives the diamond clamp (31) to rotate, thereby causing the diamond to rotate.

6. A diamond machine according to claim 1, characterized in that: The grinding feed mechanism (33) includes a vertical support base (331), a vertical moving base (332) vertically slidably disposed on the vertical support base (331), and a grinding feed assembly for driving the vertical moving base (332); the diamond angle adjustment mechanism (32) is disposed on the vertical moving base (332); a first grating for monitoring the displacement of the vertical moving base (332) is disposed between the vertical support base (331) and the vertical moving base (332).

7. A diamond machine according to claim 1, characterized in that: The frame (10) includes a base (11) and a protective cover (12) with a front opening; two diamond clamping devices (30) are provided and are symmetrically arranged with respect to the opening of the protective cover (12); the two diamond clamping devices (30) are symmetrically arranged with respect to the grinding wheel (21).

8. A diamond machine according to claim 1, characterized in that: The diamond clamp (31) includes a clamping base (311), a clamping assembly (312), and a diamond chuck (313); the clamping assembly (312) is disposed within the clamping base (311) and is used to clamp and release the diamond chuck (313); the diamond chuck (313) is used to clamp a diamond.

9. A diamond polishing method, characterized in that: Polishing diamonds using a diamond polishing machine includes the following steps: Step S100: Install the diamond on the diamond clamp (31) of the diamond machine, so that the pavilion of the diamond faces the grinding wheel (21). Step S200: The diamond angle adjustment mechanism (32) of the diamond machine adjusts the angle of the diamond so that the surface of the diamond to be polished is facing the working surface of the grinding wheel (21). In step S300, the grinding feed mechanism (33) of the diamond machine drives the diamond to vertically approach the working surface of the rotating grinding wheel (21) for grinding, and the control device controls the feed amount of the grinding feed mechanism (33); In step S400, the grinding feed mechanism (33) of the diamond machine drives the diamond vertically away from the working surface of the rotating grinding wheel (21); Step S500: Repeat steps S200-S400 to complete the polishing of all facets of the pavilion of the diamond. Step S600: Remove the diamond from the diamond clamp (31) of the diamond machine and then install the diamond so that the crown of the diamond faces the grinding wheel (21). Step S700: Repeat steps S200-S400 to complete the polishing of all facets of the diamond's crown. Step S800: Remove the diamond from the diamond clamp (31) of the diamond machine; In step S300, when the load detection component of the diamond angle adjustment mechanism (32) detects that the force on the diamond exceeds the set value, the parallel rotation component (321) drives the diamond clamp (31) to rotate by the set angle.

10. A diamond polishing method according to claim 9, characterized in that: After step S600 is completed, the diamond is observed by the high-definition microscope lens (40) of the diamond machine, and the control device of the diamond machine controls the diamond angle adjustment mechanism (32) to adjust the angle of the diamond so that the edge line between the adjacent main facets of the diamond pavilion is aligned with the preset reference line.

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