Selective in-mold bonding 4D injection molding device and product deformation regulation and control method
By using a selective in-mold bonding 4D injection molding device and method, temperature and pressure gradients are established within the mold cavity using inserts. Combined with response surface methodology and artificial intelligence, the production of diverse products from the same mold is achieved, solving the problem of product shape and function control in existing technologies and improving production efficiency and precision.
Patent Information
- Application Number
- CN202512027988.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-30
- Publication Date
- 2026-03-03
AI Technical Summary
Existing injection molding technology makes it difficult to produce "one-to-one" products, cannot control the shape and function of products with large deformations through process parameter adjustment, and does not introduce a time dimension for active control of warpage deformation.
A selective in-mold bonding 4D injection molding device is used to establish a non-uniform temperature and pressure gradient by embedding blocks of specific shapes and sizes in the mold cavity. By utilizing time-related cooling and depressurization processes, combined with response surface methodology and artificial intelligence algorithms, programmable control of the product shape and deformation can be achieved.
It enables the batch production of products with different shapes and functions using the same mold, reduces mold replacement costs, and improves the flexibility and precision of product manufacturing. It is suitable for manufacturing products made of various materials and with complex shapes.