Electrical laminated product processing device and processing method

Abstract

The invention provides an electrical laminated product processing device and method, and belongs to the technical field of pressed product processing.The electrical laminated product processing device comprises a laminating machine body and a plurality of sets of laminated boards, a regulating and controlling mechanism is arranged between every two adjacent laminated boards, and each regulating and controlling mechanism comprises a pressure regulating assembly and a discharging assembly; the pressure regulating assembly is connected to the upper laminated board in the adjacent laminated boards, the discharging assembly is arranged on the lower laminated board in the adjacent laminated boards, and in the mold closing and pressurizing process, local pressure changes are detected in real time, and the relative thickness of all areas of materials is indirectly recognized in combination with a thickness correlation parameter N preset in the controller. And based on the thickness information, the controller differentially adjusts the heating temperatures corresponding to the first heating plate and the second heating plate, through real-time pressure feedback and dynamic temperature control, heating nonuniformity caused by nonuniform initial thickness of the material is actively compensated, and the curing consistency and the overall performance of the laminated product are effectively improved.

Description

Technical Field

[0001] This invention belongs to the field of pressed product processing technology, specifically relating to an electrical laminated product processing device and processing method. Background Technology

[0002] Electrical laminates, often simply called laminated products or laminated products, refer to insulating materials made by impregnating (or coating) fiber materials (as substrates) with synthetic resins (such as phenolic resins, epoxy resins, silicone resins, etc.) and then processing them through a series of processes including heating, pressurizing, lamination, and curing. The laminator is the heart of the entire manufacturing process, and the lamination process requires precise control of multiple parameters such as temperature, pressure, vacuum, and time to optimize product quality.

[0003] However, existing laminators often encounter thickness variations in the planar structure of multilayer materials during the fabrication of electrical laminates due to inherent material inhomogeneities (such as fluctuations in the areal density of reinforcing materials, differences in impregnating resin content, or overlapping layup seams). These thickness variations directly lead to dual inhomogeneities during heating and pressurization: during heating, thicker regions have longer heat transfer paths and higher thermal resistance, resulting in a slower internal heating rate under the same hot plate temperature and heating time, potentially preventing the resin from reaching the required temperature and reaction level for full curing; while thinner regions, with lower thermal resistance and faster heating, may experience premature gelation or even over-curing of the resin. During pressurization, under the same macroscopic set pressure, the pressure redistributes across a non-ideal plane. Thicker regions, with their larger compression stroke and higher local contact stress, may experience excessive resin extrusion, forming resin-deficient areas; while thinner regions, due to insufficient contact and inadequate pressure, struggle to effectively expel interlayer gas and achieve densification. This mismatch between temperature and pressure fields caused by uneven thickness will jointly result in microscopic defects such as uneven curing degree, uneven resin distribution, poor interfacial bonding, and residual bubbles in the product, which will ultimately seriously affect the electrical insulation performance, mechanical strength, and long-term reliability of the product.

[0004] Therefore, in order to solve the above problems, it is necessary to provide an electrical laminate processing device and processing method. Summary of the Invention

[0005] The purpose of this invention is to provide an electrical laminate processing apparatus and method, which aims to solve the problem of uneven heating and pressurization caused by the thickness difference of the material itself in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: An electrical laminate processing apparatus includes a laminator body and multiple sets of laminating plates. An adjustment mechanism is provided between adjacent laminating plates. The adjustment mechanism includes a pressure regulating component and a material feeding component. The pressure regulating component is connected to the upper laminating plate in the adjacent laminating plates, and the material feeding component is disposed on the lower laminating plate in the adjacent laminating plates. The pressure regulating component is configured to enter the material feeding component and apply pressure to the material when the mold is closed, and can detect and adjust the pressure distribution acting on the material.

[0007] Preferably, the pressure regulating assembly includes a transfer chamber fixedly connected to the upper lamination plate, and an adjusting component fixed to the bottom of the transfer chamber. The adjusting component is provided with multiple independent pressure units with open bottoms. The material discharging assembly includes an installation groove provided on the lower lamination plate. A material discharging mold is fixedly installed inside the installation groove. The material discharging mold is provided with a material trough corresponding to the position of the pressure unit.

[0008] Preferably, each pressure unit includes a receiving cavity opened within an adjusting member, a movable plate is sealed and slidably disposed within each receiving cavity, a communicating sliding groove is opened at the bottom of each receiving cavity, a connecting member is slidably connected inside each sliding groove, the bottom of the movable plate is fixedly connected to the top of the corresponding connecting member, a heat insulation plate is fixedly connected to the bottom of the connecting member, a first heating plate is provided at the bottom of each heat insulation plate; a solenoid valve communicating with a transfer chamber is provided at the top of each receiving cavity, and each receiving cavity is filled with gas.

[0009] Preferably, each of the adapters has a detection chamber inside, each detection chamber has a strain gauge at the bottom, each detection chamber has a limit ring fixedly connected to the top inner side, each detection chamber has a piston plate slidably connected in a sealed manner, and each piston plate has an elastic element connected between its bottom and the corresponding strain gauge; the bottom of the material trough of the feeding mold has a second heating plate corresponding to the position of the first heating plate.

[0010] Preferably, the laminator body further includes a controller and a pressurizing device. The strain gauge, solenoid valve, first heating plate and second heating plate are all electrically connected to the controller. The pressurizing device is used to drive the laminator to move.

[0011] A method for processing electrical laminated products includes the following steps: S1. Initial detection: The controller acquires the initial pressure detection value Z1 of each strain gauge when it is not in contact with the material, and sets the target pressure value M. S2. Mold closing and pressurization: Place the material in the discharge mold, start the pressurization equipment to drive the laminate to close the mold and pressurize the material; S3. Pressure feedback and temperature control: When the pressurizing equipment applies pressure to reach the target pressure value M, the controller obtains the current pressure detection value Z2 of each strain gauge. Based on the difference between the current pressure detection value Z2 and the initial pressure detection value Z1, and combined with the preset thickness correlation parameter N, the controller determines the relative thickness of each region of the material, and combined with the preset temperature correlation coefficient W, adjusts the heating temperature of the corresponding first heating plate and second heating plate. S4. Dynamic pressure regulation: During continuous pressurization, the controller controls each solenoid valve to open sequentially from the outside of the corresponding material area to the center, so that the gas in each pressure unit is connected to the transfer chamber to achieve pressure balance. S5. Maintain pressure for curing, then open the mold after curing.

[0012] Preferably, in step S3, the thickness correlation parameter N is a parameter pre-calibrated according to the layer level of the laminate and used to convert pressure difference information into thickness information.

[0013] Preferably, in step S3, the temperature correlation coefficient W is a parameter used to convert thickness information into temperature information. For material areas that are determined to be relatively thick, the heating temperature of the first heating plate and the second heating plate is increased accordingly; for areas that are determined to be relatively thin, the heating temperature is decreased accordingly.

[0014] Preferably, in step S4, after all solenoid valves are opened, each receiving cavity forms a pressure-interconnected whole through the transfer chamber.

[0015] Preferably, in step S1, the first heating plate and the second heating plate are in a non-working state before the material is placed.

[0016] Compared with the prior art, the beneficial effects of the present invention are: This invention achieves intelligent identification and temperature compensation for uneven material thickness during lamination by setting up a pressure regulating component composed of multiple independent pressure units and a material discharging component to work in concert. During mold closing and pressurization, each pressure unit detects local pressure changes in real time through strain gauges. Combined with the thickness correlation parameter N preset in the controller, the relative thickness of each region of the material is indirectly identified. Based on this thickness information, the controller differentially adjusts the heating temperature of the corresponding first and second heating plates: increasing the heating temperature for thicker regions to compensate for their high thermal resistance and slow heating; and decreasing the temperature for thinner regions to prevent premature or excessive resin curing. This structure, through real-time pressure feedback and dynamic temperature control, actively compensates for heating unevenness caused by uneven initial material thickness, effectively improving the curing consistency and overall performance of the laminated products.

[0017] This invention achieves dynamic and balanced local pressure regulation during lamination by installing solenoid valves connected to a transfer chamber at the top of the receiving chamber of each pressure unit and combining this with a sequential control strategy of the controller. During the continuous pressurization phase, the controller sequentially opens the solenoid valves from the outside of the material area towards the center, allowing the gas in each independent receiving chamber to communicate with each other through the transfer chamber, thereby achieving pressure flow and balance from the high-pressure area to the low-pressure area. This mechanism effectively alleviates the problem of excessively high or insufficient local contact stress caused by uneven thickness, and avoids defects such as excessive resin extrusion or difficulty in venting interlayer gas. Through the pressure exchange between the dynamic pressure regulation and pressure holding / curing stages, this invention significantly optimizes the uniformity of pressure distribution within the material plane, further improving the density, interfacial bonding strength, and structural reliability of the laminated product. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the control mechanism of the present invention; Figure 3 This is a schematic diagram of the voltage regulating component of the present invention; Figure 4 This is a schematic diagram of the internal structure of the adjusting component of the present invention; Figure 5 This is a schematic diagram of the structure of the adapter of the present invention; Figure 6 This is a schematic diagram of the internal structure of the adapter of the present invention; Figure 7 This is a schematic diagram of the transfer chamber of the present invention; Figure 8 This is a schematic diagram of the material feeding assembly of the present invention.

[0019] In the diagram: 1. Laminator body; 11. Laminator plate; 2. Control mechanism; 3. Pressure regulating assembly; 31. Transfer chamber; 32. Adjusting component; 33. Receiving cavity; 34. Sliding groove; 35. Movable plate; 36. Adapter; 37. Heat insulation plate; 38. First heating plate; 39. Detection cavity; 310. Strain gauge; 311. Limiting ring; 312. Piston plate; 313. Elastic component; 314. Solenoid valve; 4. Discharge assembly; 41. Mounting groove; 42. Discharge mold; 43. Material trough; 44. Second heating plate; 5. Controller; 6. Pressurizing equipment. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example 1

[0021] In the production of electrical laminates, existing laminators often encounter thickness variations in the multilayer material to be pressed due to the inherent inhomogeneity of the materials themselves (such as fluctuations in the areal density of reinforcing materials, differences in impregnating resin content, or overlapping of layup seams). This thickness variation directly leads to a dual problem of unevenness in the heating and pressurizing processes: during the heating stage, because thicker areas have longer heat transfer paths and greater thermal resistance, their internal heating rate lags behind under the same hot plate temperature and heating time, which may prevent the resin from reaching the temperature and degree of reaction required for full curing; while thinner areas, due to their lower thermal resistance and faster heating, may experience premature gelation or even over-curing of the resin.

[0022] Please see Figures 1 to 3 The present invention provides the following technical solution: an electrical laminate processing device, comprising a laminator body 1 and multiple sets of laminator plates 11, wherein an adjustment mechanism 2 is provided between adjacent laminator plates 11, the adjustment mechanism 2 comprising a pressure adjustment component 3 and a material feeding component 4, the pressure adjustment component 3 being connected to the upper laminator plate 11 among adjacent laminator plates 11, and the material feeding component 4 being disposed on the lower laminator plate 11 among adjacent laminator plates 11, the pressure adjustment component 3 being configured to enter the material feeding component 4 and apply pressure to the material when the mold is closed, and being able to detect and adjust the pressure distribution acting on the material.

[0023] The pressure regulating assembly 3 includes a transfer chamber 31 fixedly connected to the upper laminating plate 11, and an adjusting component 32 fixed to the bottom of the transfer chamber 31. The adjusting component 32 is provided with multiple independent pressure units with open bottoms. The material discharging assembly 4 includes an installation groove 41 provided on the lower laminating plate 11. A material discharging mold 42 is fixedly installed inside the installation groove 41. The material discharging mold 42 is provided with a material trough 43 corresponding to the position of the pressure unit.

[0024] Please see Figures 3 to 8Each pressure unit includes a receiving cavity 33 opened in the adjusting member 32. A movable plate 35 is sealed and slidably installed in each receiving cavity 33. A connected sliding groove 34 is opened at the bottom of each receiving cavity 33. A connecting member 36 is slidably connected inside each sliding groove 34. The bottom of the movable plate 35 is fixedly connected to the top of the corresponding connecting member 36. A heat insulation plate 37 is fixedly connected to the bottom of the connecting member 36. A first heating plate 38 is provided at the bottom of each heat insulation plate 37. A solenoid valve 314 connected to the transfer chamber 31 is provided at the top of each receiving cavity 33. Each receiving cavity 33 is filled with gas.

[0025] Each adapter 36 has a detection chamber 39 inside, and each detection chamber 39 has a strain gauge 310 at the bottom. Each detection chamber 39 has a limit ring 311 fixedly connected to the inner top of the top. Each detection chamber 39 has a piston plate 312 that is sealed and slidably connected inside. Each piston plate 312 has an elastic element 313 connected between the bottom of the piston plate 312 and the corresponding strain gauge 310. The bottom of the material trough 43 of the feeding mold 42 has a second heating plate 44 that corresponds to the position of the first heating plate 38.

[0026] Under normal conditions, i.e. when the equipment is not laminating, the movable plate 35 can contact the bottom inner side of the receiving cavity 33 under the weight of the adapter 36, and the piston plate 312 can contact the corresponding limiting ring 311 under the action of the elastic element 313.

[0027] The laminator body 1 also includes a controller 5 and a pressurizing device 6. The strain gauge 310, solenoid valve 314, first heating plate 38 and second heating plate 44 are all electrically connected to the controller 5. The pressurizing device 6 is used to drive the laminator 11 to move.

[0028] The pressurization device 6 is existing technology and will not be described in detail.

[0029] It should be noted that, initially, all solenoid valves 314 are in the closed position, and each receiving cavity 33 is an independent sealed air chamber. After the material sheet to be pressed is placed into the respective material slots 43 of the feeding mold 42, the pressurizing device 6 is started by the controller 5, driving the laminating plate 11 to close the mold. During the mold closing process, the pressure regulating component 3 gradually enters the corresponding feeding component 4, and the first heating plate 38 at the bottom of each pressure unit gradually approaches and eventually contacts the material in the material slot 43.

[0030] At the moment of contact, the material exerts a reaction force on the first heating plate 38 and the adapter 36 above it, pushing the adapter 36 and the movable plate 35 fixed thereto to move upward along the sliding groove 34, compressing the gas in the receiving cavity 33. Simultaneously, the piston plate 312 inside the adapter 36 moves downward in the detection cavity 39, compressing the elastic element 313 and applying pressure to the strain gauge 310 at the bottom. The strain gauge 310 detects the pressure signal in real time and transmits it to the controller 5.

[0031] Pressure detection using strain gauge 310 is an existing technology and will not be described in detail here.

[0032] As the pressurizing device 6 continues to apply pressure, the laminate 11 exerts overall pressure on the material. The controller 5 continuously compares the current pressure value of each strain gauge 310 with its initial value: if the material in a certain area is thicker, the corresponding adapter 36 moves upward more significantly, the gas compression in the receiving cavity 33 is more pronounced, the gas pressure increases, resulting in an increase in the actual pressure of that unit on the material, and the feedback value of the strain gauge 310 also increases accordingly; conversely, the feedback value is lower in areas where the material is thinner. By analyzing the pressure differences between each unit, the system can indirectly identify the thickness distribution of the material plane.

[0033] When the pressurizing device 6 reaches the target pressure value M, the controller 5 enters the pressure feedback and temperature control stage. The controller 5 reads the current pressure detection value Z2 of each strain gauge 310 at this time, and calculates the difference between it and the initial pressure detection value Z1 to obtain the pressure difference value of each region. Combined with the thickness correlation parameter N pre-calibrated according to the layer where the laminate 11 is located (this parameter establishes the mapping relationship between the pressure difference and the local thickness of the material), the controller 5 calculates the relative thickness of each region of the material.

[0034] Based on the obtained thickness distribution information, controller 5 performs differentiated temperature control: for areas identified as thicker, the heating temperatures of the first heating plate 38 and the second heating plate 44 are increased accordingly to enhance the heating effect in that area, compensate for the slow heating caused by the large thickness and high thermal resistance, and ensure that the resin in that area can reach the temperature required for full curing; for thinner areas, the heating temperature of the corresponding heating plate is appropriately reduced to avoid excessive heating due to low thermal resistance, which could cause premature or over-curing of the resin. Through this local temperature adjustment based on real-time thickness feedback, this embodiment achieves active compensation for heating uniformity during lamination, effectively improving the problem of curing degree differences caused by uneven initial material thickness.

[0035] In summary, this invention achieves intelligent identification and temperature compensation for uneven material thickness during lamination by setting up a pressure regulating component 3 composed of multiple independent pressure units and a material discharging component 4 to work in concert. During the mold closing and pressurization process, each pressure unit detects local pressure changes in real time through strain gauges 310, and indirectly identifies the relative thickness of each region of the material by combining the preset thickness correlation parameter N in the controller 5. Based on this thickness information, the controller 5 differentially adjusts the heating temperature of the corresponding first heating plate 38 and second heating plate 44: increasing the heating temperature for thicker regions to compensate for their high thermal resistance and slow heating; and decreasing the temperature for thinner regions to prevent premature or excessive curing of the resin. This structure actively compensates for the heating unevenness caused by the initial unevenness of the material thickness through real-time pressure feedback and dynamic temperature control, effectively improving the curing consistency and overall performance of the laminated products. Example 2

[0036] Based on the above embodiments, due to the inherent inhomogeneity of the material, during the pressurization stage, under the same macroscopic set pressure, the pressure redistributes as it is transmitted across a non-ideal plane. Thicker areas, due to their greater compression stroke and higher local contact stress, may experience excessive resin extrusion, resulting in resin-deficient zones. Conversely, thinner areas, due to insufficient contact and inadequate actual pressure resistance, struggle to effectively expel interlayer gas and achieve densification. This mismatch between the temperature and pressure fields caused by uneven thickness leads to microscopic defects such as uneven curing degree, uneven resin distribution, poor interfacial bonding, and residual bubbles within the product, ultimately severely impacting the electrical insulation performance, mechanical strength, and long-term reliability of the product.

[0037] Please see Figures 3 to 8 When the pressurizing device 6 drives the laminating plate 11 to close the mold, during the continuous pressurization and simultaneous temperature control, the controller 5 also initiates a dynamic pressure adjustment program. The controller 5 opens the solenoid valves 314 at the top of each pressure unit sequentially from the periphery of the material area towards the center. When a solenoid valve 314 opens, the corresponding receiving cavity 33 is temporarily connected to the receiving cavities 33 of other opened units through the transfer chamber 31. Because the air pressure in each receiving cavity 33 differs due to uneven material thickness, the gas flows from the high-pressure chamber to the low-pressure chamber through the transfer chamber 31 after connection, achieving pressure equalization. This process is equivalent to fine-tuning the local pressure while maintaining the overall pressure, alleviating the problem of excessively high or low local contact stress caused by uneven thickness.

[0038] During this process, the gas inside the corresponding outer receiving cavity 33 enters the transfer chamber 31 through the corresponding solenoid valve 314 to relieve pressure. This reduces the outer pressure and prevents the internal gas from being difficult to expel when the material area near the center is squeezed. After all the solenoid valves 314 have been opened in sequence, all the receiving cavities 33 form a pressure-connected whole through the transfer chamber 31, ensuring that the pressure can be more evenly distributed in the plane during the subsequent pressure holding and curing stage. Subsequently, the controller 5 controls the first heating plate 38 and the second heating plate 44 to maintain the adjusted heating power, and the laminator maintains the set pressure and temperature for a period of time to allow the resin to fully cure. After curing, the pressurizing device 6 drives the laminating plate 11 to open the mold, and the uniformly formed and consistent electrical laminated products can be taken out.

[0039] In summary, this invention achieves dynamic and balanced adjustment of local pressure during lamination by installing solenoid valves 314 connected to the transfer chamber 31 at the top of the receiving cavity 33 of each pressure unit, combined with the sequential control strategy of the controller 5. During the continuous pressurization stage, the controller 5 sequentially opens the solenoid valves 314 from the outside of the material area to the center, allowing the gas in each independent receiving cavity 33 to communicate with each other through the transfer chamber 31, thereby achieving pressure flow and balance from the high-pressure area to the low-pressure area. This mechanism effectively alleviates the problem of excessively high or insufficient local contact stress caused by uneven thickness, and avoids defects such as excessive resin extrusion or difficulty in venting interlayer gas. Through the pressure interconnection during the dynamic pressure adjustment and pressure holding and curing stages, this invention significantly optimizes the uniformity of pressure distribution in the material plane, further improving the density, interfacial bonding strength, and structural reliability of the laminated product. Example 3

[0040] A method for processing electrical laminated products includes the following steps: S1. Initial detection: The controller 5 acquires the initial pressure detection value Z1 of each strain gauge 310 when it is not in contact with the material, and sets the target pressure threshold M. S2. Mold closing and pressurization: Place the material in the discharge mold 42, start the pressurization device 6 to drive the laminating plate 11 to close the mold and pressurize the material; S3, Pressure Feedback and Temperature Control: When the pressurizing device 6 reaches the target pressure value M, the controller 5 obtains the current pressure detection value Z2 of each strain gauge 310. Based on the difference between the current pressure detection value Z2 and the initial pressure detection value Z1, and combined with the preset thickness correlation parameter N, the controller determines the relative thickness of each area of ​​the material. Based on the preset temperature correlation coefficient W, the controller adjusts the heating temperature of the corresponding first heating plate 38 and second heating plate 44 accordingly. S4. Dynamic pressure regulation: During continuous pressurization, the controller 5 controls each solenoid valve 314 to open sequentially from the outside of the corresponding material area to the center, so that the gas in each pressure unit is connected to the transfer chamber 31 to achieve pressure balance. S5. Maintain pressure for curing, then open the mold after curing.

[0041] In step S3, the thickness correlation parameter N is a parameter pre-calibrated according to the layer level of the laminate 11, used to convert pressure difference information into thickness information.

[0042] In step S3, the temperature correlation coefficient W is a parameter used to convert thickness information into temperature information. For areas of material that are determined to be relatively thick, the heating temperature of the first heating plate 38 and the second heating plate 44 is increased accordingly; for areas that are determined to be relatively thin, the heating temperature is decreased accordingly.

[0043] In step S4, when all solenoid valves 314 are opened, each receiving cavity 33 forms a pressure-interconnected whole through the transfer chamber 31.

[0044] In step S1, before placing the material, the first heating plate 38 and the second heating plate 44 are in a non-working state.

[0045] It should be noted that the temperature correlation coefficient W and the thickness correlation parameter N are both obtained from actual experiments. The thickness correlation parameter N corresponds to one for each layer. The reason is that when the bottom laminate 11 rises, it will drive the other top laminates 11 to rise synchronously. The weight of the upper laminates 11 will cause the pressure on the bottom laminates 11 to increase, and the effect is more serious the further down the layer is.

[0046] The calibration of the thickness correlation parameter N and the temperature correlation coefficient W is based on a combination of experimental calibration and theoretical modeling: First, using standard samples of known thicknesses, the strain gauge output values ​​of each pressure unit are measured under constant total pressure. A "pressure difference-thickness" mapping relationship is established through linear or nonlinear regression, thereby determining the parameter N for each laminate layer. Second, under the same pressure conditions, curing experiments are conducted on regions of different thicknesses. By monitoring the resin curing degree (e.g., DSC method) and temperature distribution, a "thickness deviation-temperature compensation value" correspondence is fitted, determining the temperature correlation coefficient W. These parameters are calibrated during the equipment commissioning phase and stored in the controller, ensuring that the system can accurately identify the thickness distribution and perform corresponding temperature compensation based on real-time pressure feedback, exhibiting clear reproducibility and feasibility. Existing technical methods are not elaborated further.

[0047] For example, assuming the standard curing temperature for this process is 165°C, when the mold is closed and pressurized to the target total pressure of 15MPa, controller 5 acquires the current pressure value Z2 of the five detection units. Assuming that due to the cutting and splicing of the prepreg, unit 1 located at the edge of the slab detects Z2_1 = 13.2MPa (pressure too low), while unit 5 located in the center detects Z2_5 = 16.8MPa (pressure too high); For thickness estimation, the system calls the pre-calibrated thickness correlation parameter N for this layer. It is assumed that, under the current pressure system, for every 0.1 MPa below the average pressure, the corresponding billet thickness in that area decreases by approximately 0.02 mm; and for every 0.1 MPa above the average pressure, the thickness increases by approximately 0.02 mm. The calculations show that area 1 is approximately 0.36 mm thinner than the standard thickness, and area 5 is approximately 0.36 mm thicker. Temperature decision-making and execution: The system calls the temperature correlation coefficient W. This coefficient stipulates that, to ensure that the resin in areas of different thicknesses reaches the same degree of curing, the heating temperature in that area needs to be increased by 2°C for every 0.1mm increase in thickness; conversely, it should be decreased by 2°C for a smaller increase in thickness. Therefore, for the thinner unit 3 region, the controller 5 instructs its corresponding first heating plate 38 and second heating plate 44 to reduce the temperature from 165°C to 157.8°C (a reduction of 7.2°C) to prevent the resin from prematurely over-curing or thermally decomposing due to the low thermal resistance and rapid heating in this thin region.

[0048] For the thicker Unit 5 region, the controller instructs its heating plate temperature to rise to 172.2°C (an increase of 7.2°C) to compensate for its longer heat conduction path, ensuring that heat can be fully transferred to the core of the blank, so that the resin in this region can also be fully cured within the set cycle. For other regions with a thickness close to the standard, the heating temperature is maintained at around 165°C with slight adjustments.

[0049] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electrical laminate processing apparatus, comprising a laminator body and multiple sets of laminating plates, characterized in that: An adjustment mechanism is provided between adjacent laminates. The adjustment mechanism includes a pressure regulating component and a material feeding component. The pressure regulating component is connected to the upper laminate in the adjacent laminates, and the material feeding component is disposed on the lower laminate in the adjacent laminates. The pressure regulating component is configured to enter the material feeding component and apply pressure to the material when the mold is closed, and can detect and adjust the pressure distribution acting on the material.

2. The electrical laminate processing apparatus according to claim 1, characterized in that: The pressure regulating assembly includes a transfer chamber fixedly connected to the upper lamination plate, and an adjusting component fixed to the bottom of the transfer chamber. The adjusting component is provided with multiple independent pressure units with open bottoms. The material discharging assembly includes an installation groove opened on the lower lamination plate. A material discharging mold is fixedly installed inside the installation groove. The material discharging mold is provided with a material trough corresponding to the position of the pressure unit.

3. The electrical laminate processing apparatus according to claim 2, characterized in that: Each pressure unit includes a receiving cavity formed within an adjusting member. A movable plate is sealed and slidably mounted within each receiving cavity. A communicating sliding groove is formed at the bottom of each receiving cavity. A connecting member is slidably connected inside each sliding groove. The bottom of the movable plate is fixedly connected to the top of the corresponding connecting member. A heat insulation plate is fixedly connected to the bottom of the connecting member. A first heating plate is provided at the bottom of each heat insulation plate. A solenoid valve communicating with a transfer chamber is provided at the top of each receiving cavity. Each receiving cavity is filled with gas.

4. The electrical laminate processing apparatus according to claim 3, characterized in that: Each of the adapters has a detection chamber inside, a strain gauge is provided at the bottom of each detection chamber, a limit ring is fixedly connected to the top inner side of each detection chamber, a piston plate is sealed and slidably connected inside each detection chamber, and an elastic element is connected between the bottom of each piston plate and the corresponding strain gauge; the bottom of the material trough of the feeding mold is provided with a second heating plate corresponding to the position of the first heating plate.

5. The electrical laminate processing apparatus according to claim 4, characterized in that: The laminator body also includes a controller and a pressurizing device. The strain gauge, solenoid valve, first heating plate and second heating plate are all electrically connected to the controller. The pressurizing device is used to drive the laminator plate to move.

6. A method for processing electrical laminated products, used in any one of the electrical laminated product processing apparatuses described in claims 1-5, characterized in that, Includes the following steps: S1. Initial detection: The controller acquires the initial pressure detection value Z1 of each strain gauge when it is not in contact with the material, and sets the target pressure value M. S2. Mold closing and pressurization: Place the material in the discharge mold, start the pressurization equipment to drive the laminate to close the mold and pressurize the material; S3. Pressure feedback and temperature control: When the pressurizing equipment applies pressure to reach the target pressure value M, the controller obtains the current pressure detection value Z2 of each strain gauge. Based on the difference between the current pressure detection value Z2 and the initial pressure detection value Z1, and combined with the preset thickness correlation parameter N, the controller determines the relative thickness of each region of the material, and combined with the preset temperature correlation coefficient W, adjusts the heating temperature of the corresponding first heating plate and second heating plate. S4. Dynamic pressure regulation: During continuous pressurization, the controller controls each solenoid valve to open sequentially from the outside of the corresponding material area to the center, so that the gas in each pressure unit is connected to the transfer chamber to achieve pressure balance. S5. Maintain pressure for curing, then open the mold after curing.

7. The method for processing electrical laminated products according to claim 6, characterized in that: In step S3, the thickness correlation parameter N is a parameter pre-calibrated according to the layer level of the laminate and used to convert pressure difference information into thickness information.

8. The method for processing electrical laminated products according to claim 6, characterized in that: In step S3, for areas of material that are determined to be relatively thick, the heating temperature of the first heating plate and the second heating plate is increased accordingly; for areas that are determined to be relatively thin, the heating temperature is decreased accordingly.

9. The method for processing electrical laminated products according to claim 6, characterized in that: In step S4, after all the solenoid valves are opened, the accommodating chambers form a pressure-interconnected whole through the transfer chamber.

10. The method for processing electrical laminated products according to claim 6, characterized in that: In step S1, before placing the material, the first heating plate and the second heating plate are in a non-working state.

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