Rotary semiconductor element storage structure

Abstract

The invention discloses a rotary semiconductor element storage structure, which is used for storing a plurality of exposed semiconductor elements and comprises a cabin body, a chip storage rotating tower and a driving device. The cabin body is a hollow structure which can be closed selectively and is provided with a plurality of partition plates, and the partition plates are used for selectively and spatially separating a containing space and a maintenance area. The wafer storage turret is pivoted in the accommodating space and is provided with a plurality of horizontally-arranged storage positions which are arranged up and down and are used for selectively placing the plurality of exposed semiconductor elements. And the driving device is arranged in the maintenance area and is used for driving the wafer storage rotating tower, so that the wafer storage rotating tower for placing the plurality of exposed semiconductor elements can rotate in situ relative to the cabin body.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor device storage technology, specifically referring to a rotating semiconductor device storage structure that can save storage space, increase the storage capacity of semiconductor devices, and facilitate easy access. Background Technology

[0002] With the advancement and improvement of network and communication technologies, coupled with the development of smartphones, electric vehicles, IoT (Internet of Things), and AI technologies, people have gained a richer and more convenient life. These technological products are mainly made using semiconductor components, including but not limited to wafers, photomasks, and liquid crystal display panels. According to current semiconductor component manufacturing technology, the circuit patterns of semiconductor components are transferred from the photomask to the surface of the wafer through a photolithography process. As the line diameter of the circuit patterns of the aforementioned semiconductor components has evolved from the early micrometer level to the nanometer level, in order to cope with the contamination of semiconductor components caused by particles in the environment and harmful gases released during the manufacturing process, contamination control measures during storage, transportation, and manufacturing have become more stringent.

[0003] In semiconductor manufacturing plants, maintaining cleanliness during the manufacturing process primarily relies on designing cleanrooms. However, due to the large size of cleanrooms and the mutual interference of airflow between different devices, the cleanliness of the environment can still be easily affected. Therefore, the storage and transportation of semiconductor components outside the manufacturing process require a separate container with an independent clean environment. Taking photomasks as an example, due to the aforementioned miniaturization of semiconductor components, contamination of the photomask can cause distortion or deformation of the circuit patterns on the wafer surface. To maintain the cleanliness of the photomask during storage or transportation outside the manufacturing process, it is typically housed in a SEMI standard photomask transport box (Reticle SMIF). Within the Pod (RSP), to reduce the adhesion of harmful contaminants such as particles, chemicals, or free gas molecules from the environment to the photomask surface, thus reducing defects, the photomask transport boxes containing the photomasks are then stored in a large storage cabinet (Stocker). Currently, the storage cabinet uses a matrix arrangement on one side of the surface, and a robotic arm that can move forward, backward, left, right, and up and down to pick up and place photomask transport boxes in different storage positions. This increases the travel distance of the robotic arm, thus increasing the time spent picking up and placing photomask transport boxes and reducing its operating efficiency. Furthermore, this approach also significantly increases... Increasing the storage space of each photomask transport box requires increasing the operating space and load-bearing capacity of the robotic arm used to transport the photomasks. This increases the difficulty and cost of manufacturing and installing the robotic arm. In order to maintain the cleanliness of the internal environment of each photomask transport box, an inflation plate connected to an inflation system is usually designed on each storage position of the storage cabinet to fill the photomask transport box with clean gas. This inadvertently complicates the structure of the storage cabinet, increases its manufacturing and maintenance costs, and also increases the volume of the storage cabinet. With the same volume, a smaller volume will directly reduce the storage capacity of the semiconductor components in the storage cabinet.

[0004] In other words, existing storage cabinets suffer from poor efficiency in retrieving and placing semiconductor components due to their imperfect storage layout design. They also have problems such as complex structure, large footprint, and high cost. Therefore, how to solve the aforementioned problems is the solution that this invention seeks to explore.

[0005] In view of the above-mentioned shortcomings, the inventor of this case believed that it was necessary to make corrections. Therefore, based on years of experience in related technologies and product design and manufacturing, and adhering to the concept of good design, the inventor studied and improved the above-mentioned shortcomings. After continuous efforts in trial and error, the inventor finally successfully developed a rotating semiconductor element storage structure to overcome the troubles and inconveniences caused by the matrix storage design of existing storage cabinets. Summary of the Invention

[0006] Therefore, the main objective of this invention is to provide a rotary semiconductor component storage structure that uses rotation to move the flat storage position of the semiconductor component, thereby reducing the travel distance of the robotic arm and shortening the time the robotic arm spends picking up and placing semiconductor components, thus improving its operating efficiency.

[0007] Furthermore, a secondary objective of the present invention is to provide a rotating semiconductor device storage structure that can significantly simplify the construction of flat storage compartments and effectively increase the number of flat storage compartments, thereby effectively saving the volume and footprint of the storage cabinet and further reducing the manufacturing and maintenance costs of the storage cabinet.

[0008] Furthermore, another major objective of this invention is to provide a rotary semiconductor device storage structure that utilizes a modular design with a flat storage location, making it easy to install and maintain. It can also remove particles from the surface of the stored semiconductor devices, thereby improving the cleanliness of the stored semiconductor devices and reducing the chance of contamination.

[0009] Based on this, the present invention mainly achieves the aforementioned objectives and effects through the following technical means: The present invention provides a rotary semiconductor device storage structure for storing multiple exposed semiconductor devices. This rotary semiconductor device storage structure includes: a chamber, a storage turret, and a driving device. The chamber is a hollow structure that can be selectively enclosed, having multiple partitions to selectively separate a storage space and a maintenance area. The storage turret is pivotally mounted within the storage space and has multiple horizontally arranged storage positions for selectively placing the multiple exposed semiconductor devices. The driving device is located within the maintenance area and drives the storage turret, allowing the storage turret holding the multiple exposed semiconductor devices to rotate relative to the chamber in place.

[0010] Preferably, the storage turret also has multiple storage basket groups arranged vertically, each storage basket group having a back plate, two side plates disposed on both sides of the back plate, and multiple equidistant storage carrier plates. The multiple storage carrier plates are fixed in layers between the back plate and the two side plates to form multiple flat storage positions.

[0011] Preferably, the chip carrier has a back carrier and two side carriers disposed on both sides of the back carrier. Each side carrier has a limiting member at both ends. Each limiting member has at least one supporting protrusion to support the bottom surface of the plurality of exposed semiconductor elements. Each limiting member has at least one side baffle on its outer edge for the sides of the plurality of exposed semiconductor elements to abut against, thereby limiting the left and right positions of the plurality of exposed semiconductor elements. Each limiting member also has a stop block at its end for the front and rear ends of the plurality of exposed semiconductor elements to abut against, so that the plurality of exposed semiconductor elements can be stably placed on the chip carrier.

[0012] Preferably, the side baffles and baffles of the wafer carrier each have a guiding slope on their opposing inner surfaces, so that the multiple exposed semiconductor elements can be placed in a guiding manner.

[0013] Preferably, each backplate of the casing has multiple airflow slots corresponding to the multiple flat storage positions to guide airflow toward the multiple exposed semiconductor element surfaces, effectively reducing particle adhesion to the multiple exposed semiconductor element surfaces.

[0014] Preferably, the wafer storage turret also has a shock-absorbing device, which includes a wafer pressing module and a shock-absorbing trigger module. The shock-absorbing trigger module can move the wafer pressing module up and down to selectively restrict the plurality of exposed semiconductor elements in the flat storage position.

[0015] Preferably, the pressing module includes a guide post and multiple blades. The blades are locked on both sides of the guide post. When the guide post slides up and down, each blade can move between a release position and a restriction position relative to the upper surface of each exposed semiconductor element. The release position allows the multiple exposed semiconductor elements to be removed from the wafer carrier, and the restriction position restricts the multiple exposed semiconductor elements from being removed from the wafer carrier.

[0016] Preferably, each of the blades has a limiting protrusion disposed at the end of each blade, and the limiting protrusion may be selected from materials such as PEEK or PEI.

[0017] Preferably, the drive device has a motor element and a manual crank. The motor element can drive the turret to rotate in place relative to the capsule. The manual crank can be used to indirectly drive the turret to rotate manually when the motor element fails.

[0018] Preferably, it also includes a robotic arm that can move up and down. When the drive device rotates the wafer storage turret to the position corresponding to the robotic arm, the robotic arm can move up and down to place or grab one of the plurality of exposed semiconductor components in a designated flat storage position.

[0019] Preferably, the storage compartment has a storage space inside, and the top and bottom of the storage space are respectively provided with an upper convex shaft and a lower convex shaft. The top frame of the cage has a bearing seat supported by a plurality of radial ribs, and the bearing seat has a stepped shaft hole corresponding to the upper convex shaft. The bottom frame of the cage is provided with a bearing liner of the passive assembly between the lower convex shafts, and the passive assembly is provided with a gear sleeve on the periphery of the bottom frame. The motor element of the drive device can actuate a drive gear through a reduction gear. The drive gear can mesh with the gear sleeve, so that the storage turret can be actuated by the drive device.

[0020] Preferably, the multiple baskets on the cage can be a segmented structure, and the cage has at least one middle ring frame between the bottom frame and the top frame. The multiple middle ring frames have multiple first and second locking parts corresponding to the first and second mounting parts of the bottom frame and the top frame, respectively, so that the multiple segmented baskets can be locked between the first mounting part of the bottom frame and the lower first locking part of the middle ring frame, and between the upper second locking part of the middle ring frame and the second mounting part of the top frame.

[0021] Preferably, the shock-absorbing device has a pressure plate module with opposing guide seats on the bottom and top frames of the cage, and the multiple guide posts slide together between the opposing guide seats. Furthermore, the multiple blades can form at least one blade group, and the at least one blade group has a sleeve that can be locked to the guide post. The shock-absorbing actuation module has multiple equiangular driving elements around the periphery of the cage, and the multiple driving elements are fixed on a fixed base. The multiple driving elements have actuating rods that can extend and retract relative to the fixed base. The actuating rods of the multiple driving elements together form a pressure ring surrounding the cage. Furthermore, the shock-absorbing trigger module has a connecting plate spanning the bottom of at least two adjacent guide posts, and the outer edges of the multiple connecting plates are each formed with at least one convex pressure plate that overlaps with the pressure ring. An elastic pressure restraint is provided between the at least one convex pressure plate and the pressure ring at their relative positions, so that when the actuating rods of the multiple driving elements retract and drive the multiple pressure rings, the multiple pressure rings can press down on the multiple connecting plates through the multiple elastic pressure restraints, and the multiple connecting plates can synchronously drive the relative guide posts to move downward, thereby actuating the blade assembly of the aforementioned pressure plate module to move downward to the restricted position through the moving guide posts.

[0022] Preferably, the plurality of linkage plates are provided with an upper buffer and a lower buffer above and below each of the guide posts, respectively, to reduce the impact force of the blades of the plurality of blade groups on the plurality of semiconductor elements.

[0023] Preferably, the top frame of the storage turret cage is provided with multiple lifting rings for hanging the cage upwards, so as to facilitate the assembly or maintenance of the passive assembly at the bottom of the cage.

[0024] To further understand the structure, features and other objectives of the present invention, preferred embodiments of the present invention are described below in detail with reference to the accompanying drawings, so that those skilled in the art can implement the invention. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the rotating semiconductor element storage structure of the present invention applied to a storage compartment.

[0026] Figure 2 This is a three-dimensional schematic diagram of the rotating semiconductor element storage structure of the present invention, used to illustrate its appearance and relative relationships.

[0027] Figure 3 This is a schematic diagram of most of the rotating semiconductor element storage structure of the present invention.

[0028] Figure 4 This is a partially exploded schematic diagram of the bottom of the rotating semiconductor element storage structure of the present invention, to illustrate the state of the bottom and their relative relationships.

[0029] Figure 5 This is a schematic diagram of the bottom component of the rotating semiconductor element storage structure of the present invention.

[0030] Figure 6 This is a partially exploded schematic diagram of the top of the rotating semiconductor element storage structure of the present invention, to illustrate the state of the top and its relative relationships.

[0031] Figure 7 This is a partially exploded schematic diagram of the middle section of the rotating semiconductor element storage structure of the present invention, to illustrate the state of the bottom and their relative relationships.

[0032] Figure 8 This is a three-dimensional schematic diagram of the driving module in the rotating semiconductor element storage structure of the present invention.

[0033] Figure 9 This is a partial external view of the storage basket group and the pressing module in the rotary semiconductor element storage structure of the present invention.

[0034] Figure 10 This is a partially exploded schematic diagram of the storage basket group and the pressing module in the rotating semiconductor element storage structure of the present invention.

[0035] Figure 11 This is a side cross-sectional view of the storage basket group in the rotating semiconductor element storage structure of the present invention.

[0036] Figure 12 This is a schematic end view cross-sectional view of the storage basket group in the rotating semiconductor element storage structure of the present invention.

[0037] Figure 13 This is a schematic diagram of the shockproof device in the rotating semiconductor element storage structure of the present invention.

[0038] Figure 14 This is a partial external schematic diagram of the shockproof device in the rotating semiconductor element storage structure of the present invention.

[0039] Figure 15 This is a partially enlarged schematic diagram of the shockproof device in the rotating semiconductor element storage structure of the present invention.

[0040] Figure 16This is a side view of the shockproof device in the rotating semiconductor element storage structure of the present invention.

[0041] Figure 17 This is a schematic diagram of the operation of the shock-absorbing device in the rotating semiconductor element storage structure of the present invention, to illustrate the operation mode of its shock-absorbing trigger module and its relative relationships.

[0042] Explanation of reference numerals in the attached drawings: 100-Storage turret; 500-Drive unit; 510-Motor component; 520-Reduction gear; 530-Drive gear; 540-Manual wheel; 550-Manual crank; 800-Storage chamber; 801-Retention space; 802-Upper convex shaft; 803-Lower convex shaft; 900-Semiconductor component; 10-Cage; 11-Bottom frame; 110-First mounting part; 12-Top frame; 120-Second mounting part; 121-Support rib; 122-Shaft seat; 123-Step shaft hole; 15-Basket plate; 16-Middle section ring frame; 161-First locking part; 162-Second locking part; 163-Middle guide seat; 18-First airflow slot; 19-Lifting ring; 20-Passive assembly; 21-Bearing liner; 22-Gear outer sleeve; 30-Storage basket assembly ; 31-Chip storage box; 32-Box back plate; 320-Second airflow slot; 33-Box side plate; 330-Through hole; 35-Chip storage carrier plate; 351-Back carrier plate; 352-Side carrier plate; 353-Bridge section; 36-Limiting component; 361-Supporting protrusion; 362-Side baffle; 363-Guiding ramp; 365-Stop block; 366-Guiding ramp; 50-Anti-vibration device; 51 - Pressing module; 52- Guide seat; 53- Guide seat; 54- Guide post; 55- Wing assembly; 56- Sleeve; 57- Wing; 58- Restriction protrusion; 60- Anti-vibration trigger module; 61- Drive element; 62- Actuating rod; 63- Fixed seat; 64- Pressure ring; 65- Linking plate; 650- Protruding pressing plate; 66- Elastic pressure element; 671- Upper buffer element; 672- Lower buffer element. Detailed Implementation

[0043] This invention provides a rotary semiconductor device storage structure. In the accompanying drawings, specific embodiments and components of this rotary semiconductor device storage structure are illustrated. All references to front and back, left and right, top and bottom, upper and lower parts, and horizontal and vertical directions are for descriptive convenience only and are not intended to limit the invention or restrict the components to any position or spatial orientation. The dimensions specified in the drawings and specification may be varied according to the design and requirements of specific embodiments of the invention without departing from its scope, and are therefore not limited to this structure for patent purposes.

[0044] Please refer to Figure 1 , Figure 2 and Figure 3As shown, the rotary semiconductor device storage structure of the present invention consists of a storage turret 100, which can be applied to a storage chamber 800 to store multiple semiconductor devices 900. The semiconductor devices 900 can be photomask dies. The storage chamber 800 has a selectively enclosed hollow structure and multiple partitions to selectively isolate at least one storage space 801 and a maintenance area. The top and bottom of the storage space 801 are respectively provided with an upper convex shaft 802 and a lower convex shaft 803. The storage turret 100 is pivotally mounted between the upper convex shaft 802 and the lower convex shaft 803 in the storage space 801, so that the storage turret 100 can be rotated by a driving device 500. The storage turret 100 consists of a cage 10, a passive assembly 20, multiple longitudinally arranged storage baskets 30, and a shockproof device 50.

[0045] like Figure 2 , Figure 3 and Figures 4-5 As shown, the cage 10 is composed of at least a bottom frame 11, a top frame 12, and a plurality of basket plates 15 disposed between the outer contours of the bottom frame 11 and the top frame 12 (e.g., Figure 3 As shown in the figure, the bottom frame 11 can be pivotally mounted on the lower convex shaft 803 via the passive assembly 20, and the bottom frame 11 has a plurality of first mounting portions 110 at equal angles and intervals (as shown in the figure). Figure 5 As shown, the top frame 12 is for mounting the aforementioned basket plate 15, and has a bearing 122 supported by a plurality of radial ribs 121, and the bearing 122 has a stepped shaft hole 123 corresponding to the aforementioned upper convex shaft 802. Figure 6 As shown], the top frame 12 has multiple second mounting portions 120 corresponding to the first mounting portion 110 of the aforementioned bottom frame 11, for the multiple basket plates 15 to be longitudinally locked between the corresponding first and second mounting portions 110 and 120 of the bottom frame 11 and the top frame 12 [as shown]. Figure 3 [As shown]. Furthermore, according to some embodiments, the plurality of basket plates 15 can be a segmented structure, such as... Figure 3 , Figure 7 As shown, the cage body 10 has at least one middle section ring frame 16 between the bottom frame 11 and the top frame 12, and the middle section ring frame 16 has multiple first and second locking parts 161 and 162 corresponding to the first and second mounting parts 110 and 120 of the bottom frame 11 and the top frame 12, respectively, so that the aforementioned segmented basket plate 15 can be locked between the first mounting part 110 of the bottom frame 11 and the lower first locking part 161 of the middle section ring frame 16, and the upper second locking part 162 of the middle section ring frame 16 and the second mounting part 120 of the top frame 12 (e.g., Figure 3As shown in the figure, this improves the structural strength of the cage 10 and the plurality of basket plates 15. Furthermore, according to some embodiments, the middle ring frame 16 may also be located on the inner edge of the plurality of basket plates 15 (not shown in the figure). The outer surfaces of the plurality of basket plates 15 can be respectively locked with the aforementioned chip storage basket group 30. Additionally, the plurality of basket plates 15 have a plurality of first airflow slots 18 formed on them, and these first airflow slots 18 can correspond to the surfaces of each semiconductor element 900 in the flat storage position on the aforementioned chip storage basket group 30 (e.g., ...). Figure 11 As shown, airflow is directed toward the surfaces of the multiple exposed semiconductor elements 900, effectively reducing particle adhesion to the surfaces of the multiple exposed semiconductor elements 900. Furthermore, the top surface of the aforementioned top frame 12 is provided with multiple hanging rings 19 (as shown). Figure 2 , Figure 6 As shown, the cage 10 is suspended upwards to facilitate the assembly or maintenance of the passive assembly 20 at the bottom of the cage 10.

[0046] The composition of passive group 20 is as follows Figure 3 , Figure 4 and Figure 5 As shown, the passive assembly 20 has a bearing liner 21 between the lower convex shaft 803 and the bottom frame 11, and the passive assembly 20 has a gear sleeve 22 locked around the bottom frame 11 of the cage 10, so that when the aforementioned drive device 500 engages and drives the gear sleeve 22 of the bottom frame 11 of the cage 10 (as shown in the image), the gear sleeve 22 is engaged and drives the gear sleeve 22 of the bottom frame 11 of the cage 10. Figure 8 As shown, it can synchronously drive the upper and lower convex shafts 802 and 803 of the cage 10 relative to the storage compartment 800 to rotate in place (e.g., Figure 1 , Figure 2 As shown in the image.

[0047] The drive device 500 also includes a motor element 510, such as... Figure 8As shown, the motor element 510 can actuate a drive gear 530 via a reduction gear 520. The drive gear 530 can mesh with the gear sleeve 22 of the driven assembly 20, so that the driven assembly 20 of the cage 10 can be driven by the motor element 510 of the drive device 500. Furthermore, according to some embodiments, the drive device 500 further includes a manual crank 550, which can drive the drive gear 530 via a manual wheel 540 that meshes with the reduction gear 520. This allows the cage 10 to be driven by manually operating the manual crank 550 to actuate the manual wheel 540 and the reduction gear 520 even if the motor element 510 of the drive device 500 fails. In a preferred embodiment, the interior of the storage compartment 800 is further separated by multiple partitions, with a maintenance area adjacent to and selectively spatially isolated from or connected to the aforementioned storage space 801. The motor component 510 of the drive unit 500 is located in the maintenance area and is spatially independent from the storage turret 100 inside the storage space 801. This allows maintenance personnel to maintain the drive unit 500 from outside the storage space 801, reducing the chance of externally deposited particles and other contaminants polluting the inside of the storage space 801.

[0048] The storage basket assembly 30 is mounted on the basket plate 15 of the cage body 10, such as... Figure 9 , Figure 10 As shown, each chip storage basket group 30 is composed of multiple chip storage boxes 31 arranged vertically and locked to the opposite basket plate 15. Each chip storage box 31 includes a box back plate 32 and two box side plates 33 respectively disposed on both sides of the box back plate 32. The box back plate 32 has multiple second airflow slots 320 corresponding to the first airflow slots 18 of the aforementioned basket plate 15. Furthermore, the box side plates 33 on both sides are respectively formed with multiple through holes 330, allowing the aforementioned shockproof device 50 to extend into the interior from the outside of the multiple chip storage boxes 31. The multiple chip storage boxes 31 are layered and fixed with multiple equidistant chip carrier plates 35 between the box back plate 32 and the box side plates 33 on both sides to form multiple flat storage positions for selective placement of multiple exposed semiconductor devices. Furthermore, each of the multiple chip carrier plates 35 has a back carrier plate 351 and side carrier plates 352 on both sides. The side carrier plates 352 have a bridge section 353 bent in the middle to improve the strength of both sides of the chip carrier plate 35. Each side carrier plate 35 has a limiting member 36 at both ends of the bridge section 353 on its side carrier plates 35. Each limiting member 36 has at least one support protrusion 361 that can support the bottom surface of the aforementioned semiconductor element 900. The outer edge of the limiting member 36 has at least one side baffle 362 for the side edge of the aforementioned semiconductor element 900 to abut against, thereby limiting the left and right positions of the plurality of semiconductor elements 900. The ends of the plurality of limiting members 36 each have a stop block 365 for the front and rear rear edges of the aforementioned semiconductor element 900 to abut against, thereby limiting the front and rear positions of the plurality of semiconductor elements 900. Furthermore, the inner surfaces of the side baffle 362 and the stop block 365 respectively form a guiding inclined surface 363, 366 (e.g., ...). Figure 11 , Figure 12 As shown, the semiconductor elements 900 are positioned so that they can be guided, and the semiconductor elements 900 can be supported by the support protrusions 361 of the multiple limiting members 36, so that the semiconductor elements 900 can be stably placed on any of the multiple chip carriers 35 of the multiple chip cassettes 31. The multiple chip carriers 35, wherein the multiple limiting members 36 can be selected from materials such as PEEK or PEI to reduce wear and provide conductivity.

[0049] Furthermore, the shock-absorbing device 50 is located between the lower convex shaft 803 of the cabin 800 and the cage 10, such as Figure 13 , Figure 14 and Figure 15 As shown, the shockproof device 50 includes a tablet compression module 51 that can selectively restrict the semiconductor elements 900 on the tablet storage basket assembly 30 (e.g., Figure 9 , Figure 10 [As shown] and an anti-vibration trigger module 60 of an operable pressing module 51 [as shown] Figure 13 , Figure 14 As shown in the figure, the pressing module 51 has opposing guide seats 52 and 53 between the first and second mounting portions 110 and 120 of the bottom and top frames 11 and 12 of the cage 10, respectively. A guide post 54 is slidably mounted between the opposing guide seats 52 and 53 on the bottom and top frames 11 and 12, for the aforementioned shock-absorbing actuation module 60 to actuate the guide post 54 for partial upper and lower displacement, thereby selectively restricting the exposed semiconductor components within the flat storage space. Furthermore, according to certain embodiments, such as... Figure 7 As shown, when the cage body 10 has a middle ring frame 16, the middle ring frame 16 is provided with a plurality of middle guide seats 163 corresponding to the multi-guide seats 52, 53, for the guide post 54 to slide through. Furthermore, the guide post 54 is provided with at least one wing assembly 55 corresponding to the two side storage basket groups 30. The present invention primarily uses a plurality of wing assemblies 55 corresponding to the two side storage basket groups 30 and their corresponding storage boxes 31 as its main embodiment, and as... Figure 10 As shown, the plurality of winglet assemblies 55 have a sleeve 56 that can be locked to the guide post 54, and the sleeve 56 has a plurality of winglets 57 on both sides of its periphery that can extend into the chip cassette 31. The ends of the winglets 57 are positioned above the edges of the semiconductor elements 900 on the chip carrier plate 35. Furthermore, each end of the winglet 57 has a limiting protrusion 58 corresponding to the plurality of semiconductor elements 900 (e.g., ...). Figure 9 As shown, when the plurality of vane groups 55 are driven by the guide post 54, the vanes 57 of the plurality of vane groups 55 can be in a release position relative to the upper surface of the semiconductor element 900 (e.g., Figure 16 [As shown] and a limiting position [such as] Figure 17The semiconductor element 900 can be moved between the wafer carrier 35 at the restricted position, while the release position allows the semiconductor element 900 to be removed from the wafer carrier 35. Additionally, the fin assembly 55 or the restricting protrusion 58 can be selected from materials such as PEEK or PEI.

[0050] According to some embodiments, the aforementioned shock-absorbing trigger module 60 is provided with a plurality of equiangular driving elements 61 on the bottom surface of the cabin 800 or the lower convex shaft 803 relative to the periphery of the cage 10, such as... Figure 13 , Figure 14 and Figure 15 As shown, the present invention uses six sets of driving elements 61 as the main embodiment. These driving elements 61 are fixed on a fixed base 63, and each driving element 61 has an actuating rod 62 that can extend and retract relative to the fixed base 63. Furthermore, the actuating rods 62 of the driving elements 61 collectively form a pressure ring 64 surrounding the periphery of the cage 10. Additionally, the shock-absorbing actuation module 60 has a connecting plate 65 spanning the bottom ends of at least two adjacent guide posts 54. The present invention uses a connecting plate 65 locked between every three guide posts 54 as the main embodiment, resulting in six sets of connecting plates 65 to drive the multiple guide posts 54 respectively, thereby reducing the occurrence of jamming. Furthermore, at least one convex pressure plate 650 is formed on the outer edge of the connecting plate 65, which overlaps with the pressure ring 64. An elastic clamping member 66 is provided between the convex pressure plate 650 and the pressure ring 64 at their relative positions, so that when the actuating rod 62 of the driving element 61 retracts and drives the pressure ring 64, the pressure ring 64 can press the connecting plate 65 downward through the elastic clamping member 66 (e.g., Figure 17 As shown in the figure, the linkage plate 65 can synchronously drive the corresponding guide post 54 to move downward, thereby actuating the blade assembly 55 of the aforementioned pressing module 51 to move downward through the moving guide post 54 (as shown in the figure). Figure 16 , Figure 17 As shown], this allows the vanes 57 of the vane assembly 55 to confine the opposing semiconductor element 900 [e.g., Figure 17 [As shown]. Additionally, the linkage plate 65 is provided with an upper buffer 671 and a lower buffer 672 respectively between each guide post 54 and the upper bottom frame 11 guide seat 52 and the lower gear sleeve 22 [as shown]. Figure 15 , Figure 16 and Figure 17 As shown, the blades 57 of the blade assembly 55 are arranged to reduce the impact force on the semiconductor element 900, thereby forming a rotary semiconductor element storage structure that can increase storage capacity and has shockproof function.

[0051] Through the aforementioned structural design, such as Figure 1 , Figure 2As shown, in operation, when a robotic arm (not shown) with a transfer module is needed to place or pick up an exposed semiconductor element 900 on the wafer storage turret 100, the motor element 510 of the drive unit 500 is activated, and the drive gear 530 is rotated through the reduction gear 520 (e.g., ...). Figure 8 As shown, since the active gear 530 can mesh with the gear sleeve 22 of the passive assembly 20 at the bottom of the cage 10 of the chip storage turret 100, the cage 10 of the chip storage turret 100 can be driven by the motor element 510 of the drive device 500. This allows the cage 10 of the chip storage turret 100 to rotate coaxially between the upper and lower convex shafts 802 and 803 of the compartment 800, so that the designated chip storage basket group 30 on the cage 10, which holds the aforementioned semiconductor element 900, can rotate to the position of the corresponding robotic arm. This allows the robotic arm to move up and down to the height of the chip storage carrier plate 35 corresponding to the chip storage box 31 containing the aforementioned semiconductor element 900 in the chip storage basket group 30, so that the robotic arm can place or grasp the semiconductor element 900 relative to the chip storage carrier plate 35.

[0052] Taking the placement of a semiconductor element 900 on a flat storage position of the wafer carrier 35 in the wafer cassette 31 as an example, such as Figures 9-12 As shown, when the semiconductor element 900 is placed from top to bottom on the wafer carrier plate 35 of the corresponding wafer cassette 31, the side baffle 362 of the upper limit member 36 of the wafer carrier plate 35 and the guiding inclined surfaces 363 and 366 of the stop block 365 can be used to effectively guide the placement position of the semiconductor element 900, and allow the lower surface of the semiconductor element 900 to be supported by the support protrusion 361 of the limit member 36, so that the semiconductor element 900 can be stably placed in the corresponding wafer carrier plate 35. Since the cage plate 15 of the cage body 10 and the back plate 32 of the wafer cassette 31 have corresponding first and second airflow slots 18 and 320 (as shown in the figure), the semiconductor element 900 can be effectively guided by the side baffle 362 of the upper limit member 36 of the wafer carrier plate 35 and the guiding inclined surfaces 363 and 366 of the stop block 365. Figure 12 As shown, the first and second airflow slots 18 and 320 correspond to the upper surface of the semiconductor element 900 on the chip carrier plate 35 of the chip storage box 31, so that when the gas passes through the aforementioned first and second airflow slots 18 and 320, it can generate a blowing airflow relative to the upper surface of the semiconductor element 900, which can effectively reduce the adhesion of particles to the semiconductor element 900 during the storage process.

[0053] Furthermore, such as Figures 13-17As shown, if an earthquake occurs during the storage of semiconductor element 900 in the wafer turret 100, and the earthquake intensity exceeds the system set value, the anti-vibration device 50 can activate the drive element 61 of the wafer pressing module 51 to drive the pressure ring 64 downward through the actuating rod 62. This allows the pressure ring 64 to simultaneously press against the elastic clamping member 66 on the convex pressure plate 650 of the connecting plate 65, so that the connecting plate 65 can simultaneously drive the opposite guide post 54 to slide downward. When the guide post 54 moves downward, it can simultaneously actuate the wing assembly 55 locked on it to move downward. Since the wing assembly 55 has multiple equidistant wings 57 on both sides, and these multiple wings 57 can be positioned relative to each other above the semiconductor element 900 on the wafer carrier plate 35 opposite to the wafer cassette 31 (e.g., ...). Figure 16 As shown, the vanes 57 of the vane assembly 55 can restrict the opposing semiconductor element 900. Furthermore, since the multiple linkage plates 65 are respectively provided with upper buffer 671 and lower buffer 672 above and below (as shown), Figure 15 As shown, this can reduce the impact force of the vanes 57 of the multiple vane groups 55 relative to the multiple semiconductor elements 900, so that when the seismic intensity exceeds the set value, the anti-vibration device 50 can activate the pressing module 51 to actuate the anti-vibration trigger module 60 to restrict the semiconductor elements 900 (e.g., ...). Figure 16 , Figure 17 [As shown], to prevent the semiconductor element 900 from detaching from the wafer turret 100.

[0054] As described above, the rotary semiconductor element storage structure of the present invention utilizes the storage turret 100, which can be rotated in place by the drive device 500, so that the storage basket group 30 on the cage 10 of the storage turret 100 can correspond to the robotic arm, allowing the robotic arm to move up and down to grasp the semiconductor element 900 of the storage box 31 relative to the storage carrier plate 35. This not only simplifies the structure but also facilitates the placement and grasping of the semiconductor element 900, and further significantly increases the storage capacity of the storage turret 100.

[0055] Meanwhile, because the cage body 10 has a basket plate 15 and the plurality of storage boxes 31 with opposing first and second airflow slots 18 and 320 (e.g.) Figure 12As shown, the first and second airflow channels 18 and 320 can correspond to the surface of the semiconductor element 900 on the wafer carrier 35, so that gas can be blown toward the semiconductor element 900 through the first and second airflow channels 18 and 320, which can effectively reduce the adhesion of particles to the semiconductor elements 900. At the same time, by utilizing the design of the upper limit member 36 of the wafer carrier 35 of the multiple wafer cassettes 31, the multiple limit members 36 can use the side baffles 362 and the baffles 365 to guide the position of the semiconductor element 900, and use the support protrusions 361 of the multiple limit members 36 to reduce the contact area with the multiple semiconductor elements 900, effectively reducing the friction between the semiconductor elements 900 and effectively improving the cleanliness of the multiple semiconductor elements 900 during the storage process.

[0056] Furthermore, the wafer storage turret 100 is also equipped with an anti-vibration device 50, so that when the earthquake intensity exceeds the set value, the anti-vibration trigger module 60 can activate the wafer pressing module 51, so that the vanes 57 of the vane group 55 on the guide post 54 of the wafer pressing module 51 can relatively restrict the semiconductor elements 900 on the multiple wafer carrier plates 35, so as to prevent the multiple semiconductor elements 900 from falling out of the wafer storage turret 100 during an earthquake, effectively improving the safety of the multiple semiconductor elements 900 during the storage process.

[0057] The above embodiments are merely preferred embodiments of the present invention and should not be used to limit the scope of protection of the present invention. Any modifications or refinements made to the main design concept and spirit of the present invention that are not of substantial significance, but solve technical problems that are still consistent with the present invention, should be included within the scope of protection of the present invention.

[0058] In summary, it can be understood that this invention is an invention with excellent creativity. In addition to effectively solving the problems faced by the prior art, it greatly improves the efficacy. Moreover, no identical or similar products or public uses have been found in the same technical field, and it also has the effect of improving efficacy.

Claims

1. A rotating semiconductor device storage structure for storing multiple exposed semiconductor devices, characterized in that, The rotating semiconductor device storage structure includes: A cabin is a hollow structure that can be selectively enclosed, with multiple partitions to selectively separate a storage space and a maintenance area; A wafer storage turret is pivotally mounted within the storage space and has multiple horizontally arranged storage positions for selective placement of the multiple exposed semiconductor devices. and A drive unit, located within the maintenance area, drives the wafer turret, enabling the wafer turret, which holds the plurality of exposed semiconductor components, to rotate in place relative to the compartment.

2. The rotating semiconductor device storage structure according to claim 1, characterized in that, The storage turret also has multiple storage baskets arranged vertically. Each storage basket has a back plate, two side plates located on both sides of the back plate, and multiple equidistant storage plates. The multiple storage plates are fixed in layers between the back plate and the two side plates to form multiple flat storage positions.

3. The rotating semiconductor device storage structure according to claim 2, characterized in that, The multiple chip carriers have a back carrier and two side carriers disposed on both sides of the back carrier. Each side carrier has a limiting member at both ends. Each limiting member has at least one supporting protrusion to support the bottom surface of the multiple exposed semiconductor elements. Each limiting member has at least one side baffle on its outer edge for the side edges of the multiple exposed semiconductor elements to abut against, thereby limiting the left and right positions of the multiple exposed semiconductor elements. Each limiting member also has a stop block at its end for the front and rear rear edges of the multiple exposed semiconductor elements to abut against, so that the multiple exposed semiconductor elements can be stably placed on the multiple chip carriers.

4. The rotating semiconductor element storage structure according to claim 3, characterized in that, The side baffles and the block of the multiple chip carriers each have a guiding slope on their inner surfaces, which provides a guiding effect when the multiple exposed semiconductor elements are placed.

5. The rotating semiconductor device storage structure according to claim 2, characterized in that, Each of the backplates has multiple airflow slots corresponding to the multiple flat storage positions to guide airflow toward the multiple exposed semiconductor device surfaces, effectively reducing particle adhesion to the multiple exposed semiconductor device surfaces.

6. The rotating semiconductor device storage structure according to claim 2, characterized in that, The wafer storage turret also has a shock-absorbing device, which includes a wafer pressing module and a shock-absorbing trigger module. The shock-absorbing trigger module can actuate the wafer pressing module to move up and down, so as to selectively restrict the multiple exposed semiconductor elements in the multiple horizontal storage positions.

7. The rotating semiconductor device storage structure according to claim 6, characterized in that, The pressing module includes a guide post and multiple blades. The multiple blades are locked on both sides of the guide post. When the guide post slides up and down, each blade can move between a release position and a restriction position relative to the upper surface of each exposed semiconductor element. The release position allows the multiple exposed semiconductor elements to be removed from the wafer carrier, and the restriction position prevents the multiple exposed semiconductor elements from being removed from the wafer carrier.

8. The rotating semiconductor device storage structure according to claim 7, characterized in that, Each of the blades has a limiting protrusion located at the end of each blade, and the limiting protrusion is made of PEEK or PEI material.

9. The rotating semiconductor device storage structure according to claim 1, characterized in that, The drive unit has a motor element and a manual crank. The motor element can drive the turret to rotate in place relative to the compartment. The manual crank can indirectly drive the turret to rotate manually when the motor element fails.

10. The rotating semiconductor device storage structure according to claim 9, characterized in that, It also includes a robotic arm that can move up and down. When the drive device rotates the chip storage turret to the position corresponding to the robotic arm, the robotic arm can move up and down to place or grab one of the plurality of exposed semiconductor components at one of the designated flat storage positions.

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