Sensor module

Abstract

The invention provides a sensor module comprising a plurality of sensors including a first sensor and one or more second sensors, the first sensor being a pressure sensor; the main body part comprises a first cavity and a second cavity, one end of the first cavity is configured to allow liquid to flow in, and the other end of the first cavity is configured to be provided with the one or more second sensors; the second cavity is located near the other end of the first cavity and intersects with the first cavity, a hole is formed in the side edge of the second cavity, the hole is configured to contain a part of the pressure sensor, a baffle is arranged in the second cavity, and the baffle is arranged in the extending direction of the second cavity and is close to the hole; the circuit board is configured to be connected with the plurality of sensors; and a housing configured to cover the circuit board.

Description

Technical Field

[0001] This application relates to the field of sensing technology, and in particular to a sensor module. Background Technology

[0002] In intelligent cleaning equipment, multiple sensors are required to detect parameters such as liquid level, conductivity, turbidity, and temperature. Typically, level sensors, conductivity sensors, turbidity sensors, and temperature sensors can be independently installed in different locations within the intelligent cleaning equipment. These multiple sensors require different wiring to connect to the control system. This method results in complex wiring and structure, and occupies considerable space.

[0003] In some examples, multiple sensors can be integrated into a single all-in-one sensor module to detect various parameters. However, this type of sensor module requires placing different sensors in different cavities. Consequently, the integrated structure is relatively complex, and the product size is also relatively large. Summary of the Invention

[0004] One objective of this application is to address at least one aspect of the aforementioned problems and deficiencies existing in the prior art.

[0005] To address the aforementioned issues, a first aspect of this application discloses a sensor module, comprising: multiple sensors, including a first sensor and one or more second sensors, wherein the first sensor is a pressure sensor; a main body comprising a first cavity and a second cavity, one end of the first cavity being configured for liquid inflow, and the other end of the first cavity being configured to mount the one or more second sensors; the second cavity being located near and intersecting the other end of the first cavity, a hole being provided on the side of the second cavity, the hole being configured to accommodate a portion of the pressure sensor, and a baffle being provided in the second cavity, the baffle being disposed along the extending direction of the second cavity and close to the hole; and a circuit board configured to connect with the multiple sensors TE-06755(I). Connection; and housing configured to cover the circuit board.

[0006] According to an exemplary embodiment of this application, the pressure sensor and the main body are integrally formed.

[0007] According to an exemplary embodiment of this application, the main body further includes a sealing gasket and a sealing cap, the sealing gasket and the sealing cap being configured to seal the end of the second cavity.

[0008] According to an exemplary embodiment of this application, the one or more second sensors include a turbidity sensor, the turbidity sensor including a light emitting unit and a light receiving unit; and a pair of protrusions arranged opposite to each other are provided on the other end of the first cavity, the pair of protrusions protruding into the interior of the first cavity, the one or more protrusions being configured to accommodate the light emitting unit and the light receiving unit.

[0009] According to an exemplary embodiment of this application, the pair of protrusions are transparent.

[0010] According to an exemplary embodiment of this application, the one or more second sensors include a conductivity sensor comprising a pair of conductive metal blocks.

[0011] According to an exemplary embodiment of this application, the one or more second sensors include one or more of a temperature sensor, an acceleration sensor, and a microphone.

[0012] According to an exemplary embodiment of this application, the pressure sensor is a MEMS sensor.

[0013] According to an exemplary embodiment of this application, the bottom of the first cavity includes an inclined portion, which is flat and slopes downward toward the outside of the sensor module.

[0014] According to an exemplary embodiment of this application, a sealing ring is also included, the sealing ring being disposed around the outside of one end of the second cavity.

[0015] According to an exemplary embodiment of this application, a plurality of fasteners are also included, the plurality of fasteners being disposed on the outer side of the main body portion, the fasteners being configured to fix the sensor module to an external device.

[0016] In the foregoing exemplary embodiments of this application, compared with the prior art, multiple sensors in the sensor module are integrated into a single, interconnected cavity on the same body, wherein the pressure sensor is adjacent to the second cavity, and the other sensors are located in the first cavity. This integrated structure can reduce the structural complexity of the sensor module and reduce the product size. Attached Figure Description

[0017] The features, advantages, and other aspects of the various embodiments of this application will become more apparent from the accompanying drawings and the following detailed description. Several embodiments of this application are illustrated herein by way of example and not limitation, in the accompanying drawings:

[0018] Figure 1 This is an exploded view of a sensor module 10 according to an embodiment of this application;

[0019] Figure 2 This is a cross-sectional view of a sensor module 10 according to an embodiment of this application;

[0020] Figure 3 This is a cross-sectional view of a sensor module 10 according to an embodiment of this application;

[0021] Figure 4 This is a perspective view of a sensor module 10 according to an embodiment of this application;

[0022] Figure 5 This is a perspective view of a sensor module 10 according to an embodiment of this application. Detailed Implementation

[0023] The technical solution of this application will be further described in detail below through embodiments and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of this application with reference to the accompanying drawings is intended to explain the overall inventive concept of this application and should not be construed as a limitation thereof.

[0024] The terms “comprising,” “including,” and similar terms as used herein should be understood as open-ended terms, meaning “including / including but not limited to,” implying that other content may also be included. The term “based on” means “at least partially based on.” The term “one embodiment” means “at least one embodiment”; the term “another embodiment” means “at least one additional embodiment,” and so on.

[0025] In intelligent cleaning equipment, multiple sensors are typically used to test various parameters to suit different operating modes. Intelligent cleaning equipment can be washing machines, dishwashers, or floor scrubbers, among others. Different sensors can be installed independently in different locations. For example, a liquid level sensor can be fixed near the liquid flow path, and the liquid pressure is transmitted to the sensor's air passage via an air tube to detect the liquid level. The measuring part of a turbidity sensor can be inserted into the liquid flow path to detect the turbidity of the liquid. Similarly, a temperature sensor can be fixed in the liquid flow path to detect the liquid temperature.

[0026] In some examples, each sensor can be installed independently in different locations. In other examples, multiple sensors can be integrated into one unit, specifically by setting different cavities on the same sensor module to accommodate different sensors. These methods involve more complex wiring and consume more space.

[0027] To address the aforementioned problems, according to a general concept of this application, a sensor module is provided, comprising: a plurality of sensors, including a first sensor and one or more second sensors, wherein the first sensor is a pressure sensor; a main body including a first cavity and a second cavity, one end of the first cavity being configured for liquid inflow, and the other end of the first cavity being configured to mount the one or more second sensors; the second cavity being located near the other end of the first cavity and intersecting with the first cavity, the second cavity having a hole on its side configured to accommodate a portion of the pressure sensor, and a baffle being provided in the second cavity, the baffle being disposed along the extending direction of the second cavity and close to the hole; a circuit board configured to connect to the plurality of sensors; and a housing configured to cover the circuit board.

[0028] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Figure 1 An exploded view of a sensor module 10 according to one embodiment of this application is shown. Figure 2-3 The following are two cross-sectional views of a sensor module 10 according to an embodiment of this application. Figure 4-5 A perspective view of a sensor module 10 according to an embodiment of this application is shown from different angles.

[0029] The sensor module 10 includes multiple sensors 111 and 112, a main body 12, a circuit board 13, and a housing 14. The multiple sensors include a first sensor 111 and one or more second sensors 112. The first sensor 111 is a pressure sensor and does not require contact with the liquid. The one or more second sensors 112 can be used to detect parameters such as turbidity, conductivity, temperature, pH, and vibration of the liquid.

[0030] according to Figure 1-3 The main body 12 includes a first cavity 121 and a second cavity 122. One end of the first cavity 121 is for liquid inflow, and the other end of the first cavity 121 is closed and has one or more protrusions 123. The other end of the first cavity 121 is used to contact a circuit board for coupling a sensor to the circuit board. One or more protrusions 123 protrude into the interior of the first cavity 121. These one or more protrusions are used to accommodate a second sensor 112. In some examples, the first cavity 121 can be cylindrical. The internal diameter of the first cavity 121 is between 20mm and 30mm, which is sufficient to accommodate multiple sensors. In other examples, the first cavity 121 can be other shapes, such as cubic.

[0031] The second cavity 122 is located near the other end of the first cavity 121 and intersects with it. A hole 124 is provided on the side of the second cavity 122 for accommodating a portion of the pressure sensor 111, such as the pressure chamber of the pressure sensor. Figure 2-3 In the example, hole 124 is a cylindrical channel. Pressure sensor 111 can be embedded into the main body 12 through hole 124, and the end of the body portion of the pressure sensor can be flush with the end of the main body 12. When liquid flows into the first chamber 121, it forces the air in the first chamber 121 into the second chamber 122. Pressure sensor 112 obtains the liquid level by detecting the pressure difference. TE-06755(I)

[0032] Additionally, a baffle 125 is provided in the second cavity 122. The baffle 125 is located within the second cavity 122, extending along the extension direction of the second cavity 122 and close to the hole 124. The baffle 125 is spaced apart from the hole 124, for example, by a distance of a few millimeters. The baffle 125 does not contact the probe of the pressure sensor. The baffle prevents liquid flowing into the sensor module from contacting the pressure sensor, thereby ensuring the reliability of the pressure sensor.

[0033] exist Figure 2-5 In the example, the second cavity 122 is cubic in shape. It is understood that in other examples, the second cavity 122 may also be other shapes, such as cylindrical.

[0034] Circuit board 13 can be connected to the pins of multiple sensors. For example, a printed circuit board (PCB) can be coupled to multiple sensors via pin signals. Figure 1 In the example, multiple second sensors 112 are mounted on a circuit board 13. A housing 14 is used to cover the circuit board 13.

[0035] The assembled sensor module can be installed near the water outlet of the intelligent cleaning equipment. In the assembled state, the first chamber 121 is horizontally positioned, and the second chamber 122 is vertically positioned. When liquid flows into the first chamber 121, the first sensor 111 and the second sensor 112 can detect various parameters of the liquid. The first sensor 111 does not contact the liquid, while the second sensor 112 can contact the liquid.

[0036] Sensor module 10 integrates multiple sensors into a single, interconnected cavity. The pressure sensor is located adjacent to the second cavity, while the other sensors are situated in the first cavity. This integrated design reduces the structural complexity of the sensor module, allowing for smaller product size and thus lower costs. Furthermore, the sensor module's structure facilitates modular design and assembly, enabling the detection of various parameters.

[0037] In some embodiments, the pressure sensor 111 and the main body 12 are integrally formed. Specifically, see [reference needed]. Figure 2-3 The probe portion of the pressure sensor is inserted into the hole 124 of the main body 12. During the fabrication of the main body 12, the pressure sensor 111 can be embedded into the hole 124, and during assembly, the sensor's pins can be inserted and soldered to the circuit board. The integral molding of the pressure sensor 111 and the hole 124 of the main body 12 ensures the airtightness of the pressure sensor.

[0038] Now for reference Figure 1 The main body 12 includes a sealing gasket 126 and a sealing cap 127. One end of the second cavity 122 opens into the first cavity, and the other end of the second cavity is sealed by the sealing gasket 126 and the sealing cap 127. The sealing gasket 126 surrounds the other end of the second cavity, and the sealing cap 127 covers the second cavity. In some examples, when the main body 12 and the pressure sensor 111 are integrally molded, the sealing gasket 126 and the sealing cap 127 are used because the demolding directions of the first and second cavities are different. (TE-06755(I)) This arrangement facilitates demolding.

[0039] In some examples, pressure sensor 111 is a MEMS (Micro-Electromechanical System) sensor.

[0040] In some examples, the second sensor 112 includes a turbidity sensor, which comprises a light emitting unit and a light receiving unit. Correspondingly, see [reference needed]. Figure 2-3 The main body 12 includes a pair of protrusions 123 spaced apart from each other and arranged opposite each other on both sides of the second cavity. The pair of protrusions 123 are used to accommodate the light emitting unit and the light receiving unit of the turbidity sensor, respectively. During assembly of the main body 12 and the circuit board 13, the light emitting unit and the light receiving unit can be inserted into the pair of protrusions 123. In some examples, the pair of protrusions are transparent. In some examples, the main body 12 is made of a transparent material, such as PVC, PE, PET, or PMMA.

[0041] In some examples, the second sensor 112 includes a conductivity sensor comprising a pair of conductive metal blocks 112a that can be coupled to a circuit board through one side of the body 12. When liquid flows into the first cavity and submerges the conductive metal blocks 112a, it can sense the conductivity information of the liquid.

[0042] Figure 1-3The sensor 112 in the example is merely an example; in other examples, the second sensor 112 may also include other types of sensors, such as one or more of a temperature sensor, an accelerometer, and a microphone. Figure 1 In one example, sensors 112a and 112b can be connected to circuit board 13 via pins, and their respective probe portions can extend into the main body 12. In other examples, the second sensor is a semiconductor sensor that is directly attached to the surface of circuit board 13.

[0043] In some embodiments, the bottom of the second cavity may include a sloped portion. For example, see reference... Figure 2-3 and Figure 5 The inclined portion 128 is flat and slopes downwards towards the outside of the sensor module. When the flowing liquid is turbid, the inclined slope can reduce the accumulation of sediment in the sensor module.

[0044] In some embodiments, the sensor module 10 may further include a sealing ring 15, which surrounds the exterior of one end of the second cavity 121 of the main body 12. The sealing ring 15 can increase the sealing performance when the sensor module 10 is mounted on an external device. The sensor module 10 may also include multiple fasteners. For example, in... Figure 4-5 In the main body 12, three fasteners 16 are evenly spaced around its outer periphery. The fasteners 16 can fix the sensor module 10 to an external device. The fixing method can be various, such as threaded connection or riveting.

[0045] The above description is merely an optional embodiment of this application and is not intended to limit the scope of this application. TE-06755(I) For example, those skilled in the art will recognize that the embodiments of this application can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included in the protection of the embodiments of this application.

[0046] While embodiments of this application have been described with reference to several specific examples, it should be understood that the embodiments of this application are not limited to the specific embodiments disclosed. The embodiments of this application are intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. The scope of the appended claims is to be interpreted in the broadest possible sense, thereby encompassing all such modifications and equivalent structures and functions.

Claims

1. A sensor module, characterized in that, include: Multiple sensors, including a first sensor and one or more second sensors, wherein the first sensor is a pressure sensor; The main body includes a first cavity and a second cavity. One end of the first cavity is configured to allow liquid to flow in, and the other end of the first cavity is configured to mount one or more second sensors. The second cavity is located near the other end of the first cavity and intersects with the first cavity. A hole is provided on the side of the second cavity, which is configured to accommodate a portion of the pressure sensor. A baffle is provided in the second cavity, which is disposed along the extending direction of the second cavity and close to the hole. A circuit board configured to be connected to the plurality of sensors; as well as A housing configured to cover the circuit board.

2. The sensor module according to claim 1, characterized in that, The pressure sensor and the main body are integrally formed.

3. The sensor module according to claim 1, characterized in that, The main body also includes a sealing gasket and a sealing cap, the sealing gasket and the sealing cap being configured to seal the end of the second cavity.

4. The sensor module according to claim 1, characterized in that, The one or more second sensors include a turbidity sensor, which includes a light emitting unit and a light receiving unit; and a pair of protrusions arranged opposite each other are provided on the other end of the first cavity, the pair of protrusions protruding into the interior of the first cavity, the one or more protrusions being configured to accommodate the light emitting unit and the light receiving unit.

5. The sensor module according to claim 4, characterized in that, The pair of protrusions are transparent.

6. The sensor module according to claim 1, characterized in that, The one or more second sensors include a conductivity sensor, which comprises a pair of conductive metal blocks.

7. The sensor module according to any one of claims 1 to 6, characterized in that, The one or more second sensors include one or more of a temperature sensor, an acceleration sensor, and a microphone.

8. The sensor module according to claim 1, characterized in that, The pressure sensor is a MEMS sensor.

9. The sensor module according to claim 1, characterized in that, The bottom of the first cavity includes an inclined portion, which is flat and slopes downward toward the outside of the sensor module.

10. The sensor module according to claim 1, characterized in that, It also includes a sealing ring, which is disposed around the outside of one end of the second cavity.

11. The sensor module according to claim 1, characterized in that, It also includes multiple fasteners located on the outside of the main body, the fasteners being configured to fix the sensor module to an external device.

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