Electronic component detection equipment with fastening type pressing mechanism and method thereof

Abstract

The invention discloses electronic component detection equipment with a fastening type downward pressing mechanism. The electronic component detection equipment comprises a bearing table, a supporting frame, the downward pressing mechanism, a displacement adjusting module and a testing seat. The supporting frame is assembled on the bearing table. The pressing mechanism is connected to the supporting frame and comprises a lifting module, a pressing head and a fastening module. The lower pressing head is connected to the lifting module, and the lifting module drives the lower pressing head to approach or leave the bearing table. The fastening module is used for fastening the lifting module. The displacement adjusting module is arranged above the bearing platform. The test seat comprises a slot used for accommodating an electronic component. The testing seat is connected to the displacement adjusting module. The displacement adjusting module is used for adjusting the displacement of the testing seat in at least one axial direction.

Description

Technical Field

[0001] This invention relates to an electronic component testing device and method, particularly a pressure-testing type testing device and method. Background Technology

[0002] In today's society, with the continuous evolution of technology, chips are becoming increasingly powerful in terms of functionality and computing capabilities. Simultaneously, chip designs must incorporate a greater number of contacts or pins to cope with this increased performance. When testing chips, sufficient downward pressure must be applied to ensure accurate inspection and complete contact between the chip and the spring probes, guaranteeing that all contacts or pins on the chip make contact with their corresponding spring probes. However, excessive downward pressure often leads to equipment instability and material fatigue. Furthermore, if the pressure head fails to precisely adhere to the chip during testing, it not only results in inaccurate testing but can also easily damage the chip or spring probes. Summary of the Invention

[0003] In view of this, based on some embodiments, an electronic component testing device with a fastening pressing mechanism is proposed, comprising a support platform, a support frame, a pressing mechanism, a displacement adjustment module, and a test seat. The support frame is assembled on the support platform. The pressing mechanism is connected to the support frame and includes a lifting module, a pressing head, and a fastening module. The pressing head is connected to the lifting module, and the lifting module drives the pressing head toward or away from the support platform. The fastening module is used to fasten the lifting module. The displacement adjustment module is disposed on the support platform. The test seat includes a slot for accommodating electronic components. The test seat is disposed above the displacement adjustment module. The displacement adjustment module is used to adjust the displacement of the test seat in at least one axial direction.

[0004] According to some embodiments, a method for testing electronic components with a fastening pressing mechanism is further proposed, comprising the following steps: providing a control module to control the fastening module to release the lifting module; the control module and the lifting module to drive the pressing head to contact the electronic component in the test holder; the control module controlling the fastening module to fasten the lifting module; using a displacement adjustment module to make the electronic component in the test holder fit against the pressing head; the control module controlling a pressure generating device to apply downward pressure to the electronic component; and the control module testing the electronic component.

[0005] The following detailed description of the features and advantages of the present invention in the embodiments is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly. Based on the content disclosed in this specification, the scope of the claims and the drawings, those skilled in the art can easily understand the related objects and advantages of the present invention. Attached Figure Description

[0006] Figure 1 This is a perspective view of an electronic component testing device based on some embodiments.

[0007] Figure 2 This is a schematic diagram of an electronic component testing device based on some embodiments.

[0008] Figure 3 The following is a block diagram of the pressing mechanism and control module based on some embodiments.

[0009] Figure 4 The following is a cross-sectional view of the adjustment component based on some embodiments.

[0010] Figure 5 According to some embodiments, Figure 1 Cross-sectional view of the fastening module at position AA.

[0011] Figure 6 This is a perspective view of another embodiment of an electronic component testing device, based on some embodiments.

[0012] Figure 7 This is a perspective view of yet another embodiment of an electronic component testing device, based on some embodiments.

[0013] Figure 8 Here is a flowchart of an electronic component testing method based on some embodiments.

[0014] In the attached figures, the following labels are used:

[0015] 10: Supporting platform

[0016] 20: Support frame

[0017] 21: First support

[0018] 22: Second stent

[0019] 23: Top support

[0020] 30: Pressing mechanism

[0021] 31: Lifting Module

[0022] 311: Driver

[0023] 312: Lifting shaft

[0024] 32: Downward pressure head

[0025] 33: Fastening Module

[0026] 33a: Air intake port

[0027] 33b: Through hole

[0028] 331: Clamp

[0029] 332: Spring

[0030] 333: Piston block

[0031] 331a: Open end

[0032] 34: Downward pressure generating device

[0033] 40: Displacement Adjustment Module

[0034] 41: First substrate

[0035] 42: Second substrate

[0036] 43: Adjustment parts

[0037] 431: Adjusting bolt

[0038] 431a: Adjustment Section

[0039] 431b: Ontology part

[0040] 432: Fixing bolt

[0041] 432a: Head

[0042] 432b: Penetration Department

[0043] 433: Adjusting nut

[0044] 434: Washer

[0045] 50: Test socket

[0046] 51: Slot

[0047] 60: Control Module

[0048] 70: Panel rack

[0049] 70a: Space

[0050] S100: Provides a control module to control the release of the fastening module and the lifting module, and controls the lifting module to drive the lower pressure head to contact the electronic components of the test socket.

[0051] S200: Control module controls fastening module and fastening lifting module

[0052] S300: Uses a displacement adjustment module to ensure that the electronic components inside the test socket are in contact with the pressure head.

[0053] S400: The control module controls the pressure generating device to apply downward pressure to the electronic components.

[0054] S500: The control module detects electronic components. Detailed Implementation

[0055] Please see Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a perspective view of an electronic component testing device based on some embodiments. Figure 2 This is a schematic diagram of an electronic component testing device based on some embodiments. Figure 3 The following is a block diagram of the pressing mechanism and control module according to some embodiments. The electronic component testing equipment includes a support platform 10, a support frame 20, a pressing mechanism 30, a displacement adjustment module 40, and a test stand 50.

[0056] The support platform 10 is preferably a platform or plate capable of bearing weight. Accordingly, the support frame 20 can be assembled on the support platform 10. In some embodiments, the support frame 20 includes a first bracket 21, a second bracket 22, and a top bracket 23. Figure 1 As shown, the first bracket 21, the second bracket 22 and the top bracket 23 are rectangular plates, and preferably made of metal.

[0057] Here, one end of the first support 21 is connected to one side of the support platform 10; one end of the second support 22 is connected to the other side of the support platform 10, corresponding to the first support 21. The two ends of the top support 23 are respectively connected to the other ends of the first support 21 and the second support 22, and are located between the first support 21 and the second support 22. Furthermore, the top support 23 is located between the first support 21 and the second support 22, so that the first support 21, the second support 22, and the top support 23 as a whole generally form a U-shaped structure. Here, the pressing mechanism 30 (described in detail later) is provided on the top support 23, located between the first support 21 and the second support 22.

[0058] The pressing mechanism 30 is connected to the support frame 20. In some embodiments, the pressing mechanism 30 includes a lifting module 31, a pressing head 32, and a fastening module 33. The lifting module 31 includes a driver 311 and a lifting shaft 312; in some embodiments, the driver 311 may be a lifting slider assembly consisting of a motor, a screw, and a slider; in other embodiments, it may be a lifting slider assembly consisting of a motor, a gear, and a rack. The driver 311 may also be a hydraulic rod, a pneumatic cylinder, or an electric cylinder. Accordingly, the pressing head 32 is connected to one end of the lifting shaft 312, and the lifting module 31 can drive the pressing head 32 toward or away from the support platform 10.

[0059] The fastening module 33 is used to fasten the lifting shaft 312. In one embodiment, the fastening module 33 is disposed on the top bracket 23 and located below the center of the top bracket 23. The fastening module 33 further includes a through hole 33b and an air inlet 33a, through which the lifting shaft 312 passes, and the air inlet 33a is used to connect to an air pressure source. Furthermore, the lifting shaft 312 can be displaced back and forth on the fastening module 33 via the through hole 33b of the fastening module 33; while the air inlet 33a is used to control the fastening or release of the lifting module 312.

[0060] Please see Figure 5 , Figure 5 According to some embodiments, Figure 1 A cross-sectional view of the fastening module at position AA. In some embodiments, the fastening module 33 may be a pneumatic clamping mechanism, which may have a clamping block 331 and a spring 332 inside, wherein the spring 332 drives the clamping block 331 to clamp the lifting shaft 312, so that the lifting shaft 312 can be fastened at all times.

[0061] Further explanation: As shown in the figure, the clamping block 331 is a V-shaped clamping block, including an open end 331a. The spring 332 constantly opens the open end 331a of the clamping block 331, thereby securing the other end of the clamping block 331 to the lifting shaft 312. On the other hand, when the air inlet 33a is connected to high-pressure gas, the piston block 333 is driven by the air pressure to push the open end 331a of the clamping block 331, overcoming the tension of the spring 332, causing the open ends 331a to move closer together, bringing one end of the clamping block 331 tightly together. At this time, the other end of the clamping block 331 releases the lifting shaft 312, thereby releasing the lifting shaft 312, and the lifting module 31 can then drive the lower pressure head 32 to move closer to or away from the support platform 10.

[0062] However, in other embodiments, the fastening module 33 is not limited to a pneumatic clamping mechanism, but may also be an electromagnetic clamping mechanism, a mechanical clamping mechanism, a hydraulic clamp, an electric clamp, a pneumatic clamp, or other equivalent devices or mechanisms that can fasten the shaft.

[0063] For example Figure 1 and Figure 2 As shown, the displacement adjustment module 40 is disposed above the support platform 10. In some embodiments, the displacement adjustment module 40 is capable of displacement in three axes. The test holder 50 includes a slot 51 for accommodating electronic components. In some embodiments, the test holder 50 is connected to the displacement adjustment module 40; in another embodiment, the test holder 50 is connected above the displacement adjustment module 40. Accordingly, the displacement adjustment module 40 can be used to adjust the displacement of the test holder 50 in at least one axis.

[0064] In some embodiments, the slot 51 of the test socket 50 includes an electrical interface, which allows an electronic component to be electrically connected to the electronic component for testing when the component is placed in the slot 51. In one embodiment, the electrical interface includes probes (not shown) for electrically contacting contacts on the bottom surface of the electronic component.

[0065] In some embodiments, the electronic component testing equipment further includes a control module 60 (such as...). Figure 3 As shown, it is electrically connected to the pressing mechanism 30. The control module 60 controls the fastening module 33 of the pressing mechanism 30 to release the lifting shaft 312, and controls the driver 311 to drive the pressing head 32 to contact the electronic components inside the test seat 50. In addition, the displacement adjustment module 40 can selectively adjust the displacement of the test seat 50 in at least one axial direction. In some embodiments, the displacement adjustment module 40 can electrically adjust the displacement of the test seat 50 in at least one axial direction by means of a servo motor or the like.

[0066] In other embodiments, the control module 60 may also implement various operational functions via hardware circuitry, examples including but not limited to: workstations, laptop computers, client terminals, servers, distributed computing systems, handheld devices, or any other computing system or device. In its most basic configuration, the control module 60 may include at least one processor and system memory.

[0067] Furthermore, when electronic component testing equipment attempts to test electronic components, especially during initial installation, when changing the device under test, or after maintenance, errors or tolerances during component assembly or disassembly may cause the position (or orientation) of the pressure head 32 to not perfectly align with the test socket 50. Therefore, forcibly forcing the pressure head 32 to contact the electronic component within the test socket 50 could damage the component or the pressure head 32. Even if the testing is completed without damaging the component or the pressure head 32, the incomplete alignment of the pressure head 32 with the test socket 50 or its failure to fully contact the component may cause the component to overheat, resulting in distorted test results or, in severe cases, burnt-out of the component. Figure 2 As shown, the position (orientation) of the pressure head 32 does not completely correspond to the position (orientation) of the test seat 50, and the pressure head 32 is slightly tilted.

[0068] Therefore, the displacement adjustment module 40 can selectively adjust the displacement of the test seat 50 in at least one axial direction; in some embodiments, the displacement adjustment module 40 can also provide adjustment in six axes (X, Y, Z, U, V, W); this allows the position of the test seat 50 to completely correspond to the position of the pressure head 32, and the lower surface of the pressure head 32 to completely fit against the upper surface of the electronic component. Here, without needing to adjust the pressure mechanism 30, the test seat 50 can be adjusted solely by the displacement adjustment module 40. Moreover, this adjustment is usually only required during the initial installation; subsequent adjustments and calibrations are unnecessary for the same electronic component under test.

[0069] In some embodiments, the displacement adjustment module 40 includes a first substrate 41 and a second substrate 42. The first substrate 41 is disposed on the support stage 10, and the second substrate 42 is disposed on the first substrate 41. The first substrate 41 is used to adjust the position of the test seat 50 along the X-axis and Y-axis directions. The second substrate 42 is used to adjust the position of the test seat 50 along the Z-axis direction.

[0070] In some embodiments, the first substrate 41 and the second substrate 42 are, for example, but not limited to, square metal carrier plates. The first substrate 41 is disposed above the support stage 10, and the second substrate 42 is disposed above the first substrate 41. In one embodiment, the area of ​​the second substrate 42 is smaller than the area of ​​the first substrate 41. When the second substrate 42 is disposed above the first substrate 41, when viewed from above, it can be clearly seen that the outer edge of the first substrate 41 significantly extends beyond the outer edge of the first substrate 41.

[0071] In some embodiments, the displacement adjustment module 40 further includes a plurality of adjustment members 43, which are respectively disposed through the first substrate 41 and the second substrate 42, thereby placing the first substrate 41 on the support platform 10 and the second substrate 42 on the first substrate 41. Further, the adjustment members 43 can pass through the first substrate 41, and the first substrate 41 is then assembled on the support platform 10 by locking. Similarly, the second substrate 42 is disposed on the first substrate 41 by the adjustment members 43 passing through it. In one embodiment, since the area of ​​the second substrate 42 is smaller than the area of ​​the first substrate 41, when the adjustment members 43 pass through the second substrate 42 and the second substrate 42 is positioned above the first substrate 41, the second substrate 42 will not affect the adjustment members 43 passing through the first substrate 41.

[0072] Please see Figure 4 , Figure 4The following is a cross-sectional view of the adjusting member according to some embodiments. In some embodiments, the adjusting member 43 includes an adjusting bolt 431, a fixing bolt 432, an adjusting nut 433, and a washer 434. The adjusting bolt 431 includes an adjusting portion 431a and a body portion 431b. In some embodiments, the adjusting portion 431a is connected to the body portion 431b, and the adjusting portion 431a and the body portion 431b are integrally formed and include a connecting channel inside. Furthermore, the outer diameter of the adjusting portion 431a is larger than that of the body portion 431b, and the adjusting bolt 431 has a generally T-shaped structure when viewed from the front.

[0073] The fixing bolt 432 includes a head 432a and a through portion 432b. In some embodiments, the head 432a is connected to the through portion 432b, and the head 432a and the through portion 432b are integrally formed. Furthermore, the head 432a and the through portion 432b are preferably solid. Moreover, the through portion 432b is a long column, and the head 432a is a short column; the length of the through portion 432b is greater than the length of the head 432a, and the outer diameter of the head 432a is greater than the outer diameter of the through portion 432b. Furthermore, the outer diameter of the through portion 432b is slightly smaller than the connecting channel of the adjusting bolt 431. In one embodiment, the length of the through portion 432b is greater than that of the adjusting bolt 431, and the fixing bolt 432 can pass through the adjusting bolt 431a and engage with the first substrate 41 or the second substrate 42.

[0074] In some embodiments, the adjusting nut 433 is fitted onto the body portion 431b, and the inner diameter of the adjusting nut 433 is slightly larger than the outer diameter of the body portion 431b. In another embodiment, the washer 434 is fitted onto the through portion 432b and located between the adjusting portion 431a and the head 432a to increase the friction between the adjusting portion 431a and the head 432a.

[0075] In one embodiment, the adjusting member 43 is respectively disposed on the first substrate 41 and the second substrate 42, so that the first substrate 41 is disposed on the support platform 10 and the second substrate 42 is disposed on the first substrate 41. Taking the adjusting member 43 being disposed on the second substrate 42 and the second substrate 42 being disposed on the first substrate 41 as an example, when it is necessary to adjust the displacement of the second substrate 42 in the Z-axis, the fixing bolt 432 can be loosened first, and then the adjusting bolt 431 can be rotated by hand, wrench or other tools to adjust the displacement of the second substrate 42 in the Z-axis. After the position of the second substrate 42 in the Z-axis is determined, the fixing bolt 432 is tightened again, and then the adjusting nut 433 is tightened to prevent the second substrate 42 from rotating and to fix the position of the second substrate 42.

[0076] Please see again Figure 1In some embodiments, the pressing mechanism 30 further includes a pressure generating device 34 for applying pressure to the electronic components within the test socket 50. Here, the pressure generating device 34 is preferably positioned between the pressing head 32 and the fastening module 33. During electronic component testing, the pressure generated by the pressure generating device 34 ensures that the contacts below the electronic component make more complete contact with the probes within the test socket 50.

[0077] Please see again Figure 6 and Figure 7 , Figure 6 This is a perspective view of another embodiment of an electronic component testing device, based on some embodiments. Figure 7 This is a perspective view of yet another embodiment of an electronic component testing apparatus, based on some embodiments. Here, Figure 6 and Figure 7 Two embodiments, whose appearance and structure are similar to Figure 1 The embodiments differ slightly. For example... Figure 6 and Figure 7 As shown, the top support 23 is vertically arranged; furthermore, Figure 1 In this embodiment, the top support 23 is parallel to the support platform 10. Figure 6 and Figure 7 In both embodiments, the top support 23 is perpendicular to the support platform 10. Accordingly, the pressing mechanism 30 is disposed on the side of the top support 23. Furthermore, by... Figure 1 Viewed, most of the pressing mechanism 30 is located below the top support 23, while... Figure 6 and Figure 7 Upon inspection, the pressing mechanism 30 is located on the side of the top support 23.

[0078] also, Figure 7 The embodiments are the same as those described above. Figure 1 and Figure 6 The difference in the embodiments lies in, Figure 7 The embodiment further includes a plate frame 70, which is disposed below the displacement adjustment module 40 and on the support platform 10, and is separated from the displacement adjustment module 40 and the support platform 10 by a space 70a. Accordingly, when the test seat 50 is disposed above the displacement adjustment module 40, part of its structure can be extended into the space 70a.

[0079] This invention further proposes a method for testing electronic components with a clamping pressing mechanism. Please also refer to... Figure 3 and Figure 8 , Figure 8 This is a flowchart illustrating an electronic component testing method according to some embodiments. In some embodiments, the electronic component testing method includes the following steps:

[0080] Step S100: Provide control module 60, control module 60 controls fastening module 33 to release lifting module 31, control module 60 and control lifting module 31 to drive pressing head 32 to contact electronic components of test seat 50;

[0081] Step S200: Control module 60 controls fastening module 33 to fasten lifting module 31. Before this step, when control module 60 controls lifting module 31 to drive pressing head 32 to contact electronic components in test seat 50, it means that pressing head 32 has reached the positioning point. At this time, control module 60 will control fastening module 33 to fasten lifting module 31, so that lifting module 31 cannot move.

[0082] Step S300: Use the displacement adjustment module 40 to make the electronic components inside the test holder 50 fit against the pressure head 32 (see also). Figure 1 In this step, when the control module 60 controls the lifting module 31 to drive the lower pressure head 32 to contact the electronic components inside the test seat 50, the position of the lower pressure head 32 may not completely correspond to the test seat 50. Therefore, the displacement adjustment module 40 can be used to adjust the displacement of the test seat 50 in at least one axial direction, so that the position of the test seat 50 can completely correspond to the position of the lower pressure head 32, and so that the electronic components inside the test seat 50 are in contact with the lower pressure head 32.

[0083] Step S400: The control module 60 controls the pressure generating device 34 to apply downward pressure to the electronic components (see also...). Figure 1 In this step, the control module 60 can further control the downward pressure generating device 34 to apply downward pressure so that the contacts below the electronic components can make more complete contact with the probes inside the test socket 50; and

[0084] Step S500: The control module 60 performs testing on the electronic components. In this step, testing can begin once the contacts below the electronic components have fully contacted the probes inside the test socket 50. Therefore, the control module 60 performs the electronic component testing.

[0085] In summary, in some embodiments, the support frame 20 and the support platform 10 form a frame structure, and the lifting module 31 is mounted on the top bracket 23 of the support frame 20. The lifting module 31 uses a fastening module 33 to fasten the lifting shaft 312. With this configuration, when the lifting module 31 applies downward pressure to the electronic components using the pressing head 32, the entire frame structure will exhibit internal force balance, significantly reducing the impact of the large downward pressure on other mechanisms or components of the entire testing equipment; and even under considerable downward pressure, the deformation is also quite small.

[0086] In addition, in some embodiments, the fastening module 33 can directly lock or release the lifting shaft 312. Since the fastening module 33 and the downward pressure generating device 34 are coaxially configured and the fastening module 33 is located in the center of the top bracket 23, the resulting overall structure has high strength, high reliability, long service life, and the mechanism is quite simple and occupies a small volume, especially in the height direction.

[0087] Furthermore, in some embodiments, a displacement adjustment module 40 is used to adjust the position and orientation of the test seat 50 to fit the pressure head 32, thereby providing convenience for calibration and ensuring the integrity of the contact between the pressure head 32 and the electronic component under test.

[0088] Although the technical content of the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention should be included within the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the appended claims.

[0089] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the claims of the present invention.

Claims

1. An electronic component testing device with a fastening pressing mechanism, characterized in that, Include: One support platform; A support frame is assembled on the support platform: A pressing mechanism, connected to the support frame, includes: One lifting module; A lower pressure head is connected to the lifting module, which drives the lower pressure head to move closer to or away from the support platform; and A fastening module is used to secure the lifting module; A displacement adjustment module is installed above the support platform; and A test socket includes a slot for accommodating an electronic component; the test socket is connected to a displacement adjustment module; wherein the displacement adjustment module is used to adjust the displacement of the test socket in at least one axial direction.

2. The electronic component testing equipment with a fastening pressing mechanism according to claim 1, characterized in that, The fastening module is a clamping mechanism. The lifting module of the pressing mechanism includes a lifting shaft, and the pressing head is assembled at one end of the lifting shaft. The clamping mechanism constantly clamps the lifting shaft, and the clamping mechanism can release the lifting shaft under control.

3. The electronic component testing equipment with a fastening pressing mechanism according to claim 2, characterized in that, The clamping mechanism includes a clamping block, a spring, and a piston block. The spring normally drives the clamping block to fasten the lifting shaft. In response to the piston block being driven by a pneumatic pressure, the piston block drives the clamping block to overcome the elastic force of the spring, and the clamping block releases the lifting shaft.

4. The electronic component testing equipment with a fastening pressing mechanism according to claim 1, characterized in that, It further includes a control module electrically connected to the pressing mechanism; the control module controls the fastening module of the pressing mechanism to release a lifting shaft, and controls the lifting module to drive the pressing head to contact the electronic component in the test seat. After that, the displacement adjustment module can selectively adjust the displacement of the test seat in at least one axial direction.

5. The electronic component testing equipment with a fastening pressing mechanism according to claim 1, characterized in that, The displacement adjustment module includes a first substrate and a second substrate. The first substrate is disposed on the support platform, and the second substrate is disposed on the first substrate. The first substrate is used to adjust the position of the test base along an X-axis and a Y-axis, and the second substrate is used to adjust the position of the test base along a Z-axis.

6. The electronic component testing equipment with a fastening pressing mechanism according to claim 5, characterized in that, The displacement adjustment module further includes multiple adjustment components, which are respectively disposed on the first substrate and the second substrate, thereby enabling the first substrate to be placed on the support platform and the second substrate to be placed on the first substrate.

7. The electronic component testing equipment with a fastening pressing mechanism according to claim 6, characterized in that, This adjustment component includes: An adjusting bolt includes an adjusting part and a body part; A fixing bolt includes a head and a through portion, the fixing bolt being engaged with the first substrate or the second substrate by passing through the adjusting portion and adjusting the adjusting bolt. An adjusting nut is fitted onto the main body; and A washer is fitted onto the through part and located between the adjustment part and the head.

8. The electronic component testing equipment with a fastening pressing mechanism according to claim 1, characterized in that, The support frame includes: A first support, one end of which is connected to one side of the support platform; A second support, one end of which is connected to the other side of the support platform and corresponds to the first support; and A top bracket, the two ends of which are respectively connected to the other end of the first bracket and the other end of the second bracket and are located between the first bracket and the second bracket; The pressing mechanism is located on the top support.

9. The electronic component testing equipment with a fastening pressing mechanism according to claim 1, characterized in that, The pressing mechanism further includes a pressure generating device for applying pressure to the electronic component within the test socket.

10. A method for testing electronic components with a fastening pressing mechanism, characterized in that, Includes the following steps: A control module is provided, which controls a fastening module to release a lifting module and controls the lifting module to drive a pressure head to contact an electronic component of a test socket. The control module controls the fastening module to fasten the lifting module; A displacement adjustment module is used to make the electronic component in the test socket fit against the pressure head; The control module controls a pressure generating device to apply pressure to the electronic component; and The control module detects the electronic component.

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