Memory heat dissipation device and electronic equipment

Abstract

The invention provides a memory heat dissipation device and electronic equipment. The memory heat dissipation device comprises a locking piece, an unlocking piece, a fixing piece and a plurality of heat dissipation assemblies, the plurality of heat dissipation assemblies are arranged at intervals; each heat dissipation assembly comprises two heat dissipation pieces; the two heat dissipation pieces are respectively arranged on two opposite sides of a memory which is arranged on a mainboard in a contact manner; the locking piece is movably connected with the unlocking piece, and the unlocking piece is movably connected with the fixing piece; the fixing pieces are fixedly connected to the mainboard and located at the two opposite ends of the memory. The unlocking piece can be located at a first position or a second position; the unlocking piece is located at the first position in the mounting state, and the unlocking piece is located at the second position in the dismounting state. According to the embodiment of the invention, the mounting and dismounting convenience of the heat dissipation piece can be improved.

Description

Technical Field

[0001] This application belongs to the field of computer component technology, and more specifically, relates to a memory heat dissipation device and an electronic device. Background Technology

[0002] Currently, due to limited internal space, the memory modules in servers / network machines are generally arranged in a dense, side-by-side configuration on the motherboard. When the server operates at high speed, the memory modules generate heat rapidly, and this dense arrangement further complicates heat dissipation. Related technologies employ cooling devices to cool the memory modules. However, these devices require individual installation or removal of heatsinks from each memory module, hindering rapid installation, replacement, and maintenance. Summary of the Invention

[0003] To improve or solve the technical problem of inconvenient installation or disassembly of heat sinks in related technologies, this application provides a memory heat sink device and an electronic device.

[0004] In a first aspect, embodiments of this application provide a memory heat dissipation device, including: a locking component, an unlocking component, a fixing component, and a plurality of heat dissipation components; the plurality of heat dissipation components are spaced apart, and each heat dissipation component includes two heat dissipation elements; the two heat dissipation elements are respectively used to contact the opposite sides of a memory mounted on a motherboard; The locking component is movably connected to the unlocking component, and the unlocking component is movably connected to the fixing component; The fastener is fixedly connected to the motherboard and is located at opposite ends of the memory. The unlocking component can be located in either a first position or a second position; In the installed state, the unlocking component is located in the first position, the unlocking component is engaged with the locking component, and the locking component is at least partially located between and abutting against the two adjacent heat dissipation components, so that the two heat dissipation components of each heat dissipation component contact the opposite sides of the memory; the unlocking component is also engaged with the fixing component. In the disassembled state, the unlocking component is located in the second position, the unlocking component is separated from the locking component, and the locking component is separated from the two adjacent heat dissipation components, so that the two heat dissipation components of each heat dissipation component are separated from the opposite sides of the memory; the unlocking component is separated from the fixing component.

[0005] The above technical solution employs a locking component, an unlocking component, a fixing component, and multiple heat dissipation components. When disassembly is required, the unlocking component is in a second position when it separates from the fixing component. At this time, the locking component separates from the two adjacent heat dissipation components, and consequently, the two heat sinks of each of the two adjacent heat dissipation components separate from the memory. When installation is required, the unlocking component moves to a first position, causing the two heat sinks of each of the two adjacent heat dissipation components to contact the memory and fix its position. At this time, the unlocking component engages with the fixing component, thereby enabling quick installation and removal of the heat sinks of each memory module, improving the convenience of installing and removing heat sinks.

[0006] Furthermore, the unlocking component and the fixing component are snap-fitted together in a first direction; the locking component and the unlocking component are movably connected in a second direction, the first position and the second position are in a third direction, and the first direction intersects with the second direction and the third direction respectively.

[0007] The above technical solution uses unlocking and fixing components connected in different directions, which can improve the tightness and stability of the connection.

[0008] Furthermore, a first telescopic member is provided between the two heat dissipation components of each heat dissipation assembly; When the unlocking member is in the first position, the first telescopic member is in the first state, so that the two heat dissipation members of each of the two adjacent heat dissipation assemblies contact the memory to fix the position of the memory; With the unlocking member in the second position, the first telescopic member is in the second state, so that the two heat sinks of each of the two adjacent heat sink assemblies are separated from the memory.

[0009] The above technical solution uses a first telescopic component placed between the two heat sinks to provide elasticity to the two heat sinks. This allows the two heat sinks to exert a stronger force on the memory when they come into contact with it, making the memory more stable. When the two heat sinks are separated from the memory, the first telescopic component can provide sufficient force between the two heat sinks to prevent them from coming into contact with the memory.

[0010] Furthermore, the locking element includes: Locking component body; Multiple first parts; the multiple first parts are connected to the locking body, and when the unlocking member is in the first position, at least one first part is located between and in contact with two adjacent heat dissipation components; when the unlocking member is in the second position, each first part is separated from the two adjacent heat dissipation components, so that the two heat dissipation components of each of the two adjacent heat dissipation components are separated from the memory.

[0011] The above technical solution employs multiple first parts to separate adjacent heat dissipation components when the unlocking component is in the first position, and employs multiple first parts to extract each first part from the adjacent heat dissipation component when the unlocking component is in the second position, thereby achieving the separation of two heat dissipation components from the memory in each heat dissipation component, which facilitates the installation and removal of the memory.

[0012] Furthermore, the unlocking component includes: The second part; the two ends of the second part are respectively provided with first inclined surfaces; Two pressing parts; each pressing part has a second inclined surface at one end opposite to the first inclined surface; when the second inclined surface slides in contact with the first inclined surface along the second direction, each first part contacts or separates from the two adjacent heat dissipation components; Two third parts; each of the third parts is connected to one of the pressing parts; the third part is used for snap-fit ​​connection with the fastener; The locking component body is provided with a slot; the second part is provided with a locking block, and when the unlocking component is in the first position, the locking block is engaged with the slot.

[0013] The above technical solution uses a second part, a third part, a pressing part, a card block, and a card slot design for the unlocking component. This allows the position of the locking component to be changed by using the unlocking component in either the first or second position, and simultaneously changes the relative position of the third part and the fixing component. This enables the locking component to be simultaneously pulled out of or into the heat dissipation component, and the unlocking component to be separated from or snapped into the fixing component, thereby further facilitating disassembly and installation.

[0014] Furthermore, the unlocking component also includes: Second telescopic component; The fourth part; the fourth part is connected to the body of the second part via the second telescopic member; the opposite ends of the fourth part are respectively connected to the pressing part via the third telescopic member; And / or, the unlocking component further includes: Fourth telescopic component; The body of the third part abuts against the fourth telescopic member, and the end of the third part is used to be fastened to the fixing member.

[0015] The above technical solution provides a recovery effect for the corresponding components by setting the second, third, fourth and fifth telescopic components, which allows the corresponding components to return to another state after performing the corresponding actions. This makes it easier to install and disassemble repeatedly without affecting the convenience of installation and disassembly.

[0016] Furthermore, the memory heat dissipation device also includes a housing and a fixing rod; each heat dissipation component is disposed within the housing; the fixing rod is provided with multiple limiting members, and each heat dissipation component in each heat dissipation assembly has two heat dissipation components with mounting holes; the fixing rod passes through the mounting holes to slide each heat dissipation component in each heat dissipation assembly between two adjacent limiting members; And / or, the memory heat dissipation device further includes a housing; each heat dissipation component is disposed within the housing; the locking member further includes a fifth telescopic member; the locking member body is connected to the housing via the fifth telescopic member.

[0017] The above technical solution, by setting up a housing, a fixing rod and a limiting member, ensures that each heat dissipation component is located between two limiting members. This avoids the situation where, after the locking member is pulled out from between two adjacent heat dissipation components, the two adjacent heat dissipation components are too tightly connected due to the lack of limiting members, which would affect the next insertion of the locking member between two adjacent heat dissipation components and thus affect the installation.

[0018] Furthermore, the memory heat dissipation device also includes a cooling fan disposed on the housing; an air inlet and an air outlet are provided on the side of the housing facing the second direction; the air inlet and the air outlet are located on the same side of the housing; The air inlet of the cooling fan is oriented towards the air inlet window, and the air outlet of the cooling fan is oriented towards a second direction. There is a space between the air outlet of the cooling fan and the same side of each of the heat dissipation components. The air outlet of the cooling fan is connected to the air outlet window through the space and the gap between each heat dissipation component.

[0019] The above technical solution optimizes the air intake and exhaust effects of the cooling fan, enabling the heat generated by each memory module to exchange heat with the cool air from the cooling fan and exhaust the hot air from the exhaust vent, thereby achieving a better heat dissipation effect on the memory.

[0020] Furthermore, the memory heat dissipation device includes at least one of the following: a. Each heat sink in the heat dissipation assembly is provided with multiple arc-shaped protrusions; the arc-shaped protrusions are used to fix the position of the memory. b. The cooling fan is a turbine fan; c. The memory heat dissipation device further includes a housing; each heat dissipation component is disposed within the housing; the locking member further includes a sixth telescopic member; the sixth telescopic member includes a fixing block, a spring, and a base; the fixing block is fixed to the housing; the fixing block is provided with a mounting rod, and the spring is sleeved on the mounting rod; the mounting rod is slidably connected to the base; the spring abuts against one end of the base; the other end of the base is used to contact the third part along a first direction; d. Each heat sink has a thermal pad on the side facing the memory; one side of the thermal pad is fixedly connected to the corresponding heat sink, and the other side of the thermal pad is removably connected to the memory, so that when the unlocking member is in the first position, the other side of the thermal pad is in contact with the memory, and when the unlocking member is in the second position, the other side of the thermal pad is separated from the memory.

[0021] The above solution improves the heat dissipation effect of the heat dissipation device by optimizing the cooling fan; enhances the stability of the heat dissipation device in fixing the memory by setting arc-shaped protrusions on the heat dissipation component; optimizes the fourth telescopic component so that when the third part squeezes the base, the base can provide the third part with a force to return to its original position; the thermal pad can improve the heat dissipation effect of each heat dissipation component; by setting one side of the thermal pad as a fixed connection and the other side as a removable connection to the memory, it is easy to keep the thermal pad constantly fixed to the heat dissipation component during installation and disassembly, avoiding the impact of the installation and disassembly process on the memory.

[0022] Secondly, embodiments of this application provide an electronic device, including the aforementioned memory heat dissipation device.

[0023] This application discloses a memory heat dissipation device and electronic device, which employs a locking component, an unlocking component, a fixing component, and multiple heat dissipation components. When disassembly is required, the unlocking component is in a second position when it separates from the fixing component. At this time, the locking component separates from the two adjacent heat dissipation components, and consequently, the two heat dissipation components of each of the two adjacent heat dissipation components separate from the memory. When installation is required, the unlocking component is in a first position, causing the two heat dissipation components of each of the two adjacent heat dissipation components to contact the memory and fix its position. At this time, the unlocking component engages with the fixing component, thereby enabling quick installation and removal of the heat dissipation components of each memory module, improving the convenience of installing and removing the heat dissipation components. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall structure of the memory heat dissipation device.

[0026] Figure 2 This is a top view of the memory heat dissipation device.

[0027] Figure 3 for Figure 2 A cross-sectional view of the middle AA after removing the shell. Figure 3 (a) is a cross-sectional view of AA with the housing removed when the unlocking component is in the first position; Figure 3 (b) is a cross-sectional view of AA after removing the housing when the unlocking component is in the transition position between the first and second positions; Figure 3 (c) is a cross-sectional view of AA with the shell removed when the unlocking component is in the second position.

[0028] Figure 4 for Figure 3 A schematic diagram of the three-dimensional structure of (b).

[0029] Figure 5 This is a front view schematic diagram of the memory heat dissipation device.

[0030] Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure of BB.

[0031] Figure 7 As one embodiment Figure 6 A magnified view of A in the middle.

[0032] Figure 8 For another embodiment Figure 6 A magnified view of A in the middle.

[0033] Figure 9 This is a three-dimensional structural diagram of a locking component according to one embodiment.

[0034] Figure 10 This is a structural diagram of the shell, the fifth telescopic component, the sliding hole, and the sliding component.

[0035] Figure 11 This is a schematic diagram of the internal structure of the shell.

[0036] Figure 12This is a schematic diagram of the memory heat dissipation device after the casing has been removed.

[0037] Figure 13 This is a schematic diagram of the heat sink.

[0038] The attached figures are labeled as follows: 1-Locking component, 2-Housing shell, 3-Air outlet, 4-Air inlet, 5-Unlocking component, 6-Locking component body, 7-Clocking block, 8-Second part, 9-Pressing part, 10-Third part, 11-Fixing component, 12-Fourth part, 13-Third telescopic component, 14-Second telescopic component, 15-Second inclined surface, 16-First inclined surface, 17-Card slot, 18-First locking component, 19-End, 20-Mounting rod, 21-Base, 22-Spring, 23-Fixing block, 24-Cooling fan, 25-First heat sink 26-Memory, 27-Second heatsink, 28-First telescopic component, 29-Limiting component, 30-Fifth telescopic component, 31-First part, 32-Locking position, 33-Unlocking position, 34-Edge, 35-Fourth telescopic component, 36-Heat dissipation assembly, 37-Thermal pad, 38-Fixing rod, 39-Mounting hole, 41-Arched protrusion, 42-Heat dissipation component, 43-Upper side, 44-Second bend, 45-First bend, 46-Insert port, 47-Sliding component, 48-Sliding hole, 49-Slide groove. Detailed Implementation

[0039] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0040] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0041] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0043] To improve or solve the technical problem of inconvenient installation or removal of heat sinks in related technologies, this application provides a memory heat sink device, see reference. Figures 1-13 As shown, it includes: a locking component 1, an unlocking component 5, a fixing component 11, and multiple heat dissipation components 36; the multiple heat dissipation components 36 are spaced apart, and each heat dissipation component 36 includes two heat dissipation elements 42; the two heat dissipation elements 42 are respectively used to contact the opposite sides of the memory 26 mounted on the motherboard; the locking component 1 is movably connected to the unlocking component 5, and the unlocking component 5 is movably connected to the fixing component 11; the fixing component 11 is fixedly connected to the motherboard and located at opposite ends of the memory 26; the unlocking component 5 can be located in a first position or a second position.

[0044] In the installed state, the unlocking component 5 is in the first position, and the unlocking component 5 is engaged with the locking component 1. The locking component 1 is at least partially located between two adjacent heat dissipation components 36 and abuts against the two adjacent heat dissipation components 36, so that the two heat dissipation components 42 in each heat dissipation component 36 contact the opposite sides of the memory 26; the unlocking component 5 is also engaged with the fixing component 11.

[0045] In the disassembled state, the unlocking component 5 is in the second position, the unlocking component 5 is separated from the locking component 1, and the locking component 1 is separated from the two adjacent heat dissipation components 36, so that the two heat dissipation components 42 in each heat dissipation component 36 are separated from the opposite sides of the memory 26; the unlocking component 5 is separated from the fixing component 11.

[0046] It is understood that the first position is the position of the unlocking component 5 when it is engaged with both the unlocking component 5 and the locking component 1, and also when the unlocking component 5 is engaged with the fixing component 11. For example, see [reference needed]. Figure 3 As shown in (a), the unlocking element 5 is in the first position at this time. The second position is the position of the unlocking element 5 when it is separated from the locking element 1 and the fixing element 11. For example, see [reference needed]. Figure 3 As shown in (c), at this time, the unlocking component 5 is in the second position.

[0047] See Figure 1 and Figures 6-8 As shown, when the unlocking component 5 is in the first position, the locking component 1 can be in the locked position 32; when the unlocking component 5 is in the second position, the locking component 1 can be in the unlocked position 33.

[0048] When the locking member 1 is in the locked position 32, the locking member 1 is at least partially located between and in contact with the two adjacent heat dissipation assemblies 36, so that the two heat sinks 42 in each of the two adjacent heat dissipation assemblies 36 contact the memory 26 to fix the position of the memory 26; when the locking member 1 is in the unlocked position 33, the locking member 1 is separated from the two adjacent heat dissipation assemblies 36, so that the two heat sinks 42 in each of the two adjacent heat dissipation assemblies 36 are separated from the memory 26; the unlocking member 5 is used for snap-fit ​​connection with the fixing member 11; the locking member 1 and the unlocking member 5 are movably connected so that when the unlocking member 5 is separated from the fixing member 11, the locking member 1 is in the unlocked position 33.

[0049] It is understandable that the upper side 43 of the locking element 1 can be used as an indicator of the position change of the locking element 1. (See reference...) Figure 1 As shown, when the upper side 43 is flush with the locked position 32, it can be considered that the locking element 1 is in the locked position 32; when the upper side 43 is flush with the unlocked position 33, it can be considered that the locking element 1 is in the unlocked position 33.

[0050] For example, see Figure 1 As shown, when the locking element 1 is in the locked position 32, the state of the locking element 1 can be found in the diagram. Figure 7 As shown, at this time, both adjacent heat dissipation components 36 are in contact with the locking member 1, and the memory 26 in each heat dissipation component 36 is clamped and fixed by the two heat sinks in the heat dissipation component 36; when the locking member 1 is in the unlocked position 33, the state of the locking member 1 can be seen in the following figure. Figure 8 As shown, at this time, the two adjacent heat dissipation components 36 are separated from the locking member 1, and the memory 26 in each heat dissipation component 36 is separated from the two heat sinks in that heat dissipation component 36.

[0051] The unlocking component 5 can switch the locking component 1 between locked position 32 and unlocked position 33. When it is necessary to remove the memory heatsink, the locking component 1 needs to be adjusted to the unlocked position 33. (See also...) Figure 3 As shown, the unlocking component 5 is snapped together with the fixing component 11, and the unlocking component 5 is movably connected to the locking component 1. When the unlocking component 5 is separated from the fixing component 11, the unlocking component 5 drives the locking component 1 back to the locked position 32, thereby causing the unlocking component 5 and the locking component 1 to separate simultaneously.

[0052] When installing or removing the memory cooling device, the locking element 1 needs to be adjusted to the locked position 32. (See also...) Figure 3As shown, the unlocking component 5 is snapped together with the fixing component 11, and the unlocking component 5 is movably connected with the locking component 1. When the locking component 1 returns to the unlocked position 33, it causes the unlocking component 5 to snap together with the fixing component 11. Thus, while the unlocking component 5 is connected to the fixing component 11, the locking component 1 contacts the two adjacent heat dissipation components 36, thereby locking the memory 26.

[0053] Therefore, the above technical solution employs a locking component 1, an unlocking component 5, a fixing component 11, and multiple heat dissipation components 36. When disassembly is required, the unlocking component 5 is in the second position when it separates from the fixing component 11, so that the locking component 1 is in the unlocked position 33. At this time, the locking component 1 separates from the two adjacent heat dissipation components 36, and then the two heat sinks 42 in each of the two adjacent heat dissipation components 36 separate from the memory 26. When installation is required, the unlocking component 5 is in the second position so that the locking component 1 is in the locked position 32, so that the two heat sinks 42 in each of the two adjacent heat dissipation components 36 contact the memory 26 and fix the position of the memory 26. At this time, the unlocking component 5 and the fixing component 11 are snapped together, thereby enabling quick installation and removal of the heat sinks 42 of each memory 26, improving the convenience of installing and removing the heat sinks 42.

[0054] Furthermore, the unlocking component 5 and the fixing component 11 are snap-fitted together in the first direction; the locking component 1 and the unlocking component 5 are movably connected in the second direction (i.e., the Z direction), with the first position and the second position in a third direction (i.e., the X direction), and the first direction intersects with the second direction and the third direction respectively. Optionally, the X, Y, and Z directions are perpendicular to each other.

[0055] For example, see Figure 1 As shown, multiple heat dissipation components 36 are stacked in the X direction. The unlocking component 5 and the locking component 1 are movably connected in the Z direction.

[0056] The above technical solution uses the unlocking component 5 and the fixing component 11 to connect in different directions, which can improve the tightness and stability of the connection.

[0057] Furthermore, a first telescopic member 28 is provided between the two heat sinks 42 in each heat dissipation assembly 36; when the unlocking member 5 is in the first position, the first telescopic member 28 is in the first state, so that the two heat sinks 42 in each of the two adjacent heat dissipation assemblies 36 contact the memory 26 to fix the position of the memory 26; when the unlocking member 5 is in the second position, the first telescopic member 28 is in the second state, so that the two heat sinks 42 in each of the two adjacent heat dissipation assemblies 36 are separated from the memory 26.

[0058] For example, see Figure 7As shown, the two heat sinks 42 include a first heat sink 25 and a second heat sink 27. A first telescopic member 28 is provided between the first heat sink 25 and the second heat sink 27 along the X direction; when the first heat sink 25 and the second heat sink 27 are engaged with the memory 26, the first telescopic member 28 is in a compressed state; see reference Figure 8 As shown, when the first heat sink 25 and the second heat sink 27 are separated from the memory 26, the first telescopic member 28 is in a natural or slightly compressed state.

[0059] The above technical solution employs a first telescopic member 28 positioned between the two heat sinks 42, which provides elasticity to the two heat sinks 42. This allows the two heat sinks 42 to exert a stronger force on the memory 26 when they come into contact with it, resulting in a more stable fixation of the memory 26. When the two heat sinks 42 are separated from the memory 26, the first telescopic member 28 ensures sufficient force between the two heat sinks 42 to prevent them from contacting the memory 26.

[0060] Furthermore, the locking member 1 includes a locking member body 6 and a plurality of first parts 31; the plurality of first parts 31 are connected to the locking member body 6, and when the unlocking member 5 is in the first position, each first part 31 is located between and in contact with two adjacent heat dissipation components 36; when the unlocking member 5 is in the second position, each first part 31 is separated from the two adjacent heat dissipation components 36, so that the two heat dissipation elements 42 in each of the two adjacent heat dissipation components 36 are separated from the memory 26.

[0061] See Figures 7-9 As shown, the locking member 1 includes a locking member body 6 and a plurality of first parts 31 arranged side by side. When the unlocking member 5 is in the first position, the locking member 1 is in the locked position 32, and each first part 31 is inserted between adjacent heat dissipation components 36, thereby clamping the memory 26 between the two heat dissipation components 42 in each heat dissipation component 36. When the unlocking member 5 is in the second position, the locking member 1 is in the unlocked position 33, and each first part 31 is pulled out from between adjacent heat dissipation components 36, thereby separating the two heat dissipation components 42 in each heat dissipation component 36 from the memory 26.

[0062] The above technical solution employs multiple first parts 31, which can separate adjacent heat dissipation components 36 and clamp the two heat dissipation components 42 in each heat dissipation component 36 when the unlocking component 5 is in the first position and the locking component 1 is in the locked position 32. When the locking component 1 is in the unlocked position 33, each first part 31 can be pulled out from the adjacent heat dissipation component 36, thereby separating the two heat dissipation components 42 in each heat dissipation component 36 from the memory 26, which facilitates the installation and removal of the memory 26.

[0063] Furthermore, the unlocking component 5 includes: a second part 8, two pressing parts 9, and two third parts 10; the two ends of the second part 8 are respectively provided with first inclined surfaces 16; each pressing part 9 has a second inclined surface 15 at the end opposite to the first inclined surface 16; when the second inclined surface 15 slides in contact with the first inclined surface 16 along the second direction, each first part 31 contacts or separates from two adjacent heat dissipation components 36; each third part 10 is connected to one pressing part 9; the third part 10 is used to snap-fit ​​with the fixing component 11; the locking component body 6 is provided with a slot 17; the second part 8 is provided with a locking block 7, and when the unlocking component 5 is in the first position, the locking block 7 snaps-fit with the slot 17.

[0064] See Figure 3 (a) and Figure 4 As shown, the second part 8 has a locking block 7 in the middle and a locking groove 17 in the corresponding position of the locking body 6; when the unlocking part 5 is in the first position, the locking block 7 is engaged in the locking groove 17, thereby fixing the position of the locking part 1.

[0065] For example, see Figure 10 As shown, the housing 2 is provided with a sliding hole 48 extending along the Y direction, and a sliding member 47 is provided below the locking member body 6. The sliding member 47 can slide along the Y direction within the sliding hole 48. When the sliding hole 48 slides to the leftmost end along the Y direction, the locking member body 6 is in the unlocked position 33. When the sliding hole 48 slides to the rightmost end along the Y direction, the locking member body 6 is in the locked position 32. At this time, the corresponding unlocking member 5 is in the first position, so that the card block 7 is inserted into the card slot 17, thereby fixing the position of the locking member 1.

[0066] The second part 8 has a first inclined surface 16 at both its left and right ends, and a pressing part 9 has a second inclined surface 15. When the two pressing parts 9 move towards each other in the X direction, the first inclined surface 16 and the second inclined surface 15 come into contact, thereby causing the second part 8 to move upward or downward. Optionally, when the second inclined surface 15 presses against the first inclined surface 16, the second part 8 moves downward. At this time, the locking block 7 disengages from the slot 17, causing the position of the locking member 1 to change, such as the locking member 1 moving from the locked position 32 to the unlocked position 33, thereby separating the heat sink 42 from the memory 26.

[0067] Simultaneously, as the pressing part 9 moves towards each other in the X direction, the two third parts 10 also move towards each other, causing the third parts 10 to separate from the fixing member 11. Thus, when disassembly is required, the separation of the heat sink 42 from the memory 26 and the separation of the third parts 10 from the fixing member 11 are achieved simultaneously. The installation process is the reverse, and will not be described in detail here.

[0068] The above technical solution uses a design of a second part 8, a third part 10, a pressing part 9, a card block 7, and a card slot 17 for the unlocking component 5. This design allows the unlocking component 5 to be positioned in the first or second position, thereby driving the locking component 1 to the locked position 32 or the unlocked position 33. It also simultaneously controls the positions of the third part 10 and the fixing component 11. This allows the locking component 1 to be simultaneously pulled out of or into the heat dissipation component 36, and the unlocking component 5 to be separated from or snapped together with the fixing component 11. This further facilitates disassembly and installation.

[0069] Furthermore, the unlocking component 5 also includes: a second telescopic component 14 and a fourth part 12; the fourth part 12 is connected to the body of the second part 8 via the second telescopic component 14; the opposite ends of the fourth part 12 are respectively connected to the pressing part 9 via the third telescopic component 13; the unlocking component 5 also includes a fourth telescopic component 35; the body of the third part 10 abuts against the fourth telescopic component 35, and the end 19 of the third part 10 is used for snap-fit ​​connection with the fixing component 11.

[0070] See Figure 3 and Figure 4 As shown, the fourth part 12 is connected to the second part 8 via the second telescopic member 14, which provides elasticity for the locking block 7 to engage with the slot 17. The left and right ends of the fourth part 12 are connected to the pressing part 9 via the third telescopic member 13, which provides springback to the pressing part 9 to restore it to its natural position. The fourth telescopic member 35 abuts against the body of the third part 10. When the third part 10 presses the fourth telescopic member 35 along the X direction, the fourth telescopic member 35 provides elasticity to restore the third part 10 to its original position. The end 19 of the third part 10 is snapped together with the fixing member 11.

[0071] Optionally, the fixing member 11 is provided with a first locking member 18, the first locking member 18 having a downwardly bent first locking slot; the end 19 having an upwardly bent second locking slot, the contact surfaces of the first locking slot and the second locking slot being parallel to the X direction, so that the first locking member 18 and the end 19 can be engaged and disengaged when moving in the X direction.

[0072] For example, see Figure 3 As shown in (a). At this time, the unlocking member 5 is in the first position. At this time, the second inclined surface 15 of the pressing part 9 is in contact with the first inclined surface 16 of the second part 8. For example, the first inclined surface 16 is at a higher position in the Z-direction than the second inclined surface 15 is at a higher position in the Z-direction.

[0073] See Figure 3 As shown in (b), at this time, the unlocking element 5 is located in the transition position between the first position and the second position. For example, Figure 3 (b) Figure 3The two pressing parts in (a) are pressed towards each other along the X direction to half the stroke of the pressing parts. For example, the first inclined surface 16 is flush with the second inclined surface 15 in the Z direction. At this time, the unlocking member 5 is in the first position, that is, only the locking member body 6 is separated from the locking block 7, while the third part 10 and the fixing member 11 are still in the latching state.

[0074] exist Figure 3 Based on (b), continue pressing the two pressing parts towards each other along the X direction, so that the pressing parts are in the second position. Figure 3 As shown in (c). Exemplarily, the first inclined plane 16 is positioned lower in the Z-direction than the second inclined plane 15. At this time, the unlocking member 5 is in the second position, that is, the locking member body 6 is separated from the locking block 7, and the third part 10 is separated from the fixing member 11.

[0075] It is understandable that the first position of the unlocking component 5 can be that the first inclined surface 16 is higher, lower, or level with the second inclined surface 15 in the Z-direction direction, as long as the locking block 7 is engaged with the locking component body 6 and the third part 10 is engaged with the fixing component 11 at this time.

[0076] Similarly, the transition position of the unlocking component 5 can be that the first inclined surface 16 is higher, lower, or flush with the second inclined surface 15 in the Z-direction, as long as the locking block 7 is separated from the locking component body 6 and the third part 10 is engaged with the fixing component 11 at this time.

[0077] Similarly, the second position of the unlocking component 5 can be that the position of the first inclined surface 16 in the Z direction is higher, lower, or level with the position of the second inclined surface 15 in the Z direction, as long as the locking block 7 is separated from the locking component body 6 and the third part 10 is separated from the fixing component 11 at this time.

[0078] The memory heat dissipation device also includes a housing 2; each heat dissipation component 36 is disposed inside the housing 2; the locking member 1 also includes a fifth telescopic member 30; the locking member body 6 is connected to the housing 2 through the fifth telescopic member 30.

[0079] See Figure 9 As shown, the locking body 6 is slidably connected to the housing 2 along the Y direction via the ridge 34, thereby enabling switching between the locked position 32 and the unlocked position 33. For example, see [reference needed]. Figure 11 As shown, the wall of the memory 26 of the housing 2 is provided with a groove 49 extending in the Y direction; the edge 34 can slide in the groove 49 in the Y direction, thereby realizing a sliding connection with the housing 2 in the Y direction.

[0080] See Figure 1 , Figure 7 and Figure 8As shown, the locking body 6 is connected to the housing 2 via the fifth telescopic member 30. Thus, the fifth telescopic member 30 can provide elastic force for the locking body 6 to return to the unlocked position 33. For example, when the card block 7 is pulled out from the card slot 17, the locking body 6 moves from the locked position 32 to the unlocked position 33, so that the locking body 6 can return to the unlocked position 33 under the action of the fifth telescopic member 30.

[0081] The above technical solution provides a recovery effect for the corresponding components by setting the second telescopic component 14, the third telescopic component 13, the fourth telescopic component 35 and the fifth telescopic component 30. This allows the corresponding components to return to another state after performing the corresponding actions, thus making it easier to install and disassemble repeatedly without affecting the convenience of installation and disassembly.

[0082] Furthermore, the memory heat dissipation device also includes a housing 2 and a fixing rod 38; each heat dissipation component 36 is disposed inside the housing 2; the fixing rod 38 is provided with multiple limiting members 29, and each heat dissipation component 42 in each heat dissipation component 36 is provided with mounting holes 39; the fixing rod 38 passes through the mounting holes 39 to slide each heat dissipation component 42 in each heat dissipation component 36 between two adjacent limiting members 29.

[0083] See Figure 7 and Figure 8 As shown, the fixing rod 38 connects multiple stacked heat dissipation components 36 together through mounting holes 39 on their heat dissipation parts 42, and adjacent heat dissipation components 36 are separated by limiting members 29. Thus, even without contacting the locking member 1, adjacent heat dissipation components 36 can still be separated by limiting members 29.

[0084] Optionally, the left end of the first heat sink 25 has a first bend 45, and the left end of the second heat sink 27 has a second bend 44. The first bend 45 and the second bend 44 in each heat dissipation assembly 36 bend towards each other, such that the first bend 45 bends downwards and the second bend 44 bends upwards; see reference. Figure 7 As shown, in two adjacent heat dissipation components 36, an insertion port 46 is formed between the second bend 44 of the upper heat dissipation component 36 and the first bend 45 of the lower heat dissipation component 36. The insertion port 46 facilitates the insertion of the first part 31 of the locking member 1 between the two heat dissipation components 36.

[0085] The above technical solution, by setting the housing 2, the fixing rod 38 and the limiting member 29, ensures that each heat dissipation component 36 is located between two limiting members 29. This avoids the situation where, after the locking member 1 is pulled out from between two adjacent heat dissipation components 36, the two adjacent heat dissipation components 36 are too tightly in contact due to the lack of limiting, which would affect the next insertion of the locking member 1 between two adjacent heat dissipation components 36 and thus affect the installation.

[0086] Furthermore, the memory heat dissipation device also includes a cooling fan 24 disposed on the housing 2; an air inlet 4 and an air outlet 3 are provided on the side of the housing 2 facing the second direction; the air inlet 4 and the air outlet 3 are located on the same side of the housing 2. The air inlet of the cooling fan 24 is set towards the air inlet window 4, and the air outlet of the cooling fan 24 is set towards the second direction. There is a space between the air outlet of the cooling fan 24 and the same side of each heat dissipation component 36. The air outlet of the cooling fan 24 is connected to the air outlet window 3 through the space and the gap between each heat dissipation component 36.

[0087] See Figure 12 As shown, the top of the housing 2 is equipped with two cooling fans 24, which can optionally be turbine fans. This design improves the heat dissipation effect of the cooling device by optimizing the cooling fans 24. The cooling fans 24 draw air from the Z-direction into the housing 2 and transfer it along the Y-direction until it is exhausted from the air outlet 3 at the top of the housing 2. During this process, the hot air generated by the memory 26 is transferred from bottom to top until it exchanges heat with the air from the cooling fans 24, thereby reducing the heat inside the housing 2.

[0088] The above technical solution optimizes the air intake and exhaust effects of the cooling fan 24, enabling the heat generated by each memory module 26 to exchange heat with the cool air from the cooling fan 24 and exhaust the hot air from the exhaust window 3, thereby producing a better heat dissipation effect for the memory module 26.

[0089] Furthermore, each heat sink 42 in the heat dissipation assembly 36 is provided with multiple arc-shaped protrusions 41; the arc-shaped protrusions 41 are used to fix the position of the memory 26; optionally, the first heat sink 25 and the second heat sink 27 are heat sinks 42, and the upper side of the heat sink 42 is provided with multiple arc-shaped protrusions 41. The arc-shaped protrusions 41 can increase the heat dissipation area and improve the bonding force between the heat sink and the memory 26, making the fixation of the memory 26 more stable. By providing arc-shaped protrusions 41 on the heat sink 42, the stability of the heat sink 42 in fixing the memory 26 is improved.

[0090] Optionally, the memory heat dissipation device also includes a housing 2; each heat dissipation component 36 is disposed inside the housing 2; the fourth telescopic member 35 includes a fixing block 23, a spring 22 and a base 21; the fixing block 23 is fixed to the housing 2; the fixing block 23 is provided with a mounting rod 20, and the spring 22 is sleeved on the mounting rod 20; the mounting rod 20 is slidably connected to the base 21; the spring 22 abuts against one end of the base 21; the other end of the base 21 is used to contact the third part 10 along the first direction.

[0091] See Figure 4As shown, the fixing block 23 is provided with two mounting rods 20, each mounting rod 20 is fitted with a spring 22, and the left end of the mounting rod 20 is fitted with a base 21. The base 21 abuts against the left end of the spring 22, and the right end of the spring 22 abuts against the fixing block 23. When the third part 10 moves along the X direction and presses the base 21, the end 19 of the third part 10 is snapped into place with the first locking member 18; under the elastic force of the spring 22, the snap-fit ​​connection between the end 19 and the first locking member 18 is more stable. In the above scheme, through the optimization of the fourth telescopic member 35, when the third part 10 presses the base 21, the base 21 can provide the third part 10 with a force to return to its original position.

[0092] Optionally, the locking body 6 is provided with a ridge 34, and the locking body 6 is slidably connected to the housing 2 along the Y direction through the ridge 34.

[0093] Optionally, see Figure 13 As shown, each heat sink 42 has a thermal pad 37 on the side facing the memory 26; one side of the thermal pad 37 is fixedly connected to the corresponding heat sink 42, and the other side of the thermal pad 37 is removably connected to the memory 26, so that when the unlocking member 5 is in the first position, the other side of the thermal pad 37 is in contact with the memory 26, and when the unlocking member 5 is in the second position, the other side of the thermal pad 37 is separated from the memory 26.

[0094] The above technical solution can improve the heat dissipation effect of each heat sink 42 by using the thermal pad 37; by setting one side of the thermal pad 37 as a fixed connection and the other side as a removable connection to the memory 26, it is easy to keep the thermal pad 37 constantly fixed on the heat sink 42 during installation and disassembly, avoiding the impact of the installation and disassembly process on the memory 26.

[0095] Secondly, embodiments of this application provide an electronic device, including a memory heat dissipation device.

[0096] The functions and effects of the technical features in this technical solution that are similar to or related to the aforementioned technical solution are similar to those in the aforementioned technical solution, and the inventive concept and beneficial effects of this technical solution are similar to those in the aforementioned technical solution, so they will not be repeated here.

[0097] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A memory heat dissipation device, characterized in that, include: The system includes a locking component, an unlocking component, a fixing component, and multiple heat dissipation components; the multiple heat dissipation components are spaced apart, and each heat dissipation component includes two heat dissipation elements; the two heat dissipation elements are respectively used to contact the opposite sides of the memory installed on the motherboard; The locking component is movably connected to the unlocking component, and the unlocking component is movably connected to the fixing component; The fastener is fixedly connected to the motherboard and is located at opposite ends of the memory. The unlocking component can be located in either a first position or a second position; In the installed state, the unlocking component is located in the first position, the unlocking component is engaged with the locking component, and the locking component is at least partially located between and abutting against the two adjacent heat dissipation components, so that the two heat dissipation components of each heat dissipation component contact the opposite sides of the memory; the unlocking component is also engaged with the fixing component. In the disassembled state, the unlocking component is located in the second position, the unlocking component is separated from the locking component, and the locking component is separated from the two adjacent heat dissipation components, so that the two heat dissipation components of each heat dissipation component are separated from the opposite sides of the memory; the unlocking component is separated from the fixing component.

2. The memory heat dissipation device as described in claim 1, characterized in that, The unlocking component and the fixing component are snapped together in a first direction; the locking component and the unlocking component are movably connected in a second direction, the first position and the second position are in a third direction, and the first direction intersects the second direction and the third direction respectively.

3. The memory heat dissipation device as described in claim 1, characterized in that, A first telescopic member is provided between the two heat dissipation components of each heat dissipation assembly; When the unlocking member is in the first position, the first telescopic member is in the first state, so that the two heat dissipation members of each of the two adjacent heat dissipation assemblies contact the memory to fix the position of the memory; With the unlocking member in the second position, the first telescopic member is in the second state, so that the two heat sinks of each of the two adjacent heat sink assemblies are separated from the memory.

4. The memory heat dissipation device as described in any one of claims 1-3, characterized in that, The locking element includes: Locking component body; Multiple first parts; the multiple first parts are connected to the locking body, and when the unlocking member is in the first position, at least one first part is located between and in contact with two adjacent heat dissipation components; when the unlocking member is in the second position, each first part is separated from the two adjacent heat dissipation components, so that the two heat dissipation components of each of the two adjacent heat dissipation components are separated from the memory.

5. The memory heat dissipation device as described in claim 4, characterized in that, The unlocking component includes: The second part; the two ends of the second part are respectively provided with first inclined surfaces; Two pressing parts; each pressing part has a second inclined surface at one end opposite to the first inclined surface; when the second inclined surface slides in contact with the first inclined surface along the second direction, each first part contacts or separates from the two adjacent heat dissipation components; Two third parts; each of the third parts is connected to one of the pressing parts; the third parts are used for snap-fit ​​connection with the fastener; The locking component body is provided with a slot; the second part is provided with a locking block, and when the unlocking component is in the first position, the locking block is engaged with the slot.

6. The memory heat dissipation device as described in claim 5, characterized in that, The unlocking device also includes: Second telescopic component; The fourth part; the fourth part is connected to the body of the second part via the second telescopic member; the opposite ends of the fourth part are respectively connected to the pressing part via the third telescopic member; And / or, the unlocking component further includes: Fourth telescopic component; The body of the third part abuts against the fourth telescopic member, and the end of the third part is used to be fastened to the fixing member.

7. The memory heat dissipation device as described in claim 6, characterized in that, The memory heat dissipation device further includes a housing and a fixing rod; each heat dissipation component is disposed inside the housing; the fixing rod is provided with multiple limiting members, and each heat dissipation component in each heat dissipation component has two heat dissipation components with mounting holes; the fixing rod passes through the mounting holes to slide each heat dissipation component in each heat dissipation component between two adjacent limiting members; And / or, the memory heat dissipation device further includes a housing; each heat dissipation component is disposed within the housing; the locking member further includes a fifth telescopic member; the locking member body is connected to the housing via the fifth telescopic member.

8. The memory heat dissipation device as described in claim 7, characterized in that, It also includes a cooling fan disposed on the housing; the housing has an air inlet and an air outlet on the side facing the second direction; the air inlet and the air outlet are located on the same side of the housing; The air inlet of the cooling fan is oriented towards the air inlet window, and the air outlet of the cooling fan is oriented towards a second direction. There is a space between the air outlet of the cooling fan and the same side of each of the heat dissipation components. The air outlet of the cooling fan is connected to the air outlet window through the space and the gap between each heat dissipation component.

9. The memory heat dissipation device as described in claim 8, characterized in that, It has at least one of the following: a. Each heat sink in the heat dissipation assembly is provided with multiple arc-shaped protrusions; the arc-shaped protrusions are used to fix the position of the memory. b. The cooling fan is a turbine fan; c. The memory heat dissipation device further includes a housing; each heat dissipation component is disposed within the housing; the locking member further includes a fourth telescopic member; the fourth telescopic member includes a fixing block, a spring, and a base; the fixing block is fixed to the housing; the fixing block is provided with a mounting rod, and the spring is sleeved on the mounting rod; the mounting rod is slidably connected to the base; the spring abuts against one end of the base; the other end of the base is used to contact the third part along a first direction; d. Each heat sink has a thermal pad on the side facing the memory; one side of the thermal pad is fixedly connected to the corresponding heat sink, and the other side of the thermal pad is removably connected to the memory, so that when the unlocking member is in the first position, the other side of the thermal pad is in contact with the memory, and when the unlocking member is in the second position, the other side of the thermal pad is separated from the memory.

10. An electronic device, characterized in that, Includes the memory heat dissipation device according to any one of claims 1-9.

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