Electronic device

Abstract

The invention relates to the technical field of electronic equipment, in particular to electronic equipment which comprises a heating part, a middle frame, a first heat dissipation part and a second heat dissipation part, and the middle frame is provided with a connecting plate; the first heat dissipation piece is arranged on the connecting plate, the first heat dissipation piece is a semiconductor refrigerator and is provided with a cold end and a hot end, and the cold end of the first heat dissipation piece is in thermal conduction with the heating piece; and the hot ends of the second heat dissipation piece and the first heat dissipation piece are thermally conducted so as to dissipate heat of the first heat dissipation piece. The heat dissipation efficiency of the electronic equipment can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and more specifically, to an electronic device. Background Technology

[0002] With the development and advancement of technology, mobile phones and other electronic devices have become necessities in people's lives. These devices often contain heat-generating components such as processors. When in use, these components generate heat, which can lead to excessively high temperatures and consequently affect the performance of the electronic device.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this disclosure is to provide an electronic device that improves the heat dissipation efficiency of the electronic device to at least some extent.

[0005] According to a first aspect of the present disclosure, an electronic device is provided, the electronic device comprising:

[0006] Heating element;

[0007] Mid-frame, the mid-frame having a connecting plate;

[0008] A first heat sink is disposed on the connecting plate. The first heat sink is a semiconductor cooler. The first heat sink has a cold end and a hot end. The cold end of the semiconductor cooler is thermally connected to the heat sink.

[0009] The second heat sink is thermally connected to the hot end of the first heat sink to dissipate heat from the hot end of the first heat sink.

[0010] In some embodiments of this disclosure, the orthographic projection of the first heat sink on the connecting plate at least partially covers the orthographic projection of the heat-generating element on the connecting plate.

[0011] In some embodiments of this disclosure, the heating element and the second heat dissipation element are respectively disposed on both sides of the connecting plate, and the connecting plate is provided with a first through hole, through which the first heat dissipation element passes.

[0012] In some embodiments of this disclosure, the first heat sink includes a first cold end electrode, a first hot end electrode, a first N-type semiconductor, and a first P-type semiconductor. The first cold end electrode and the heat sink are thermally connected. The first hot end electrode is disposed on the side of the first cold end electrode away from the heat sink, and the first hot end electrode and the second heat sink are thermally connected. The first N-type semiconductor and the first P-type semiconductor are disposed between the first cold end electrode and the first hot end electrode.

[0013] In some embodiments of this disclosure, the connecting plate has a thinning portion on the side opposite to the heating element, and the second heat sink is at least partially embedded in the thinning portion.

[0014] In some embodiments of this disclosure, the electronic device further includes:

[0015] The display device is located on the side of the connecting plate away from the heat-generating element, and the second heat sink is located between the display device and the connecting plate.

[0016] In some embodiments of this disclosure, the second heat sink is a semiconductor cooler, the second heat sink includes a cold part and a hot part, the cold part and the first heat sink are thermally connected, and the hot part and the cold part are connected;

[0017] The cold part has a second cold end electrode on the side facing the first heat sink, and the hot part has a second hot end electrode on the side facing the display device. A second N-type semiconductor and a second P-type semiconductor are disposed between the second cold end electrode and the second hot end electrode.

[0018] In some embodiments of this disclosure, the cold and hot portions of the second heat sink are arranged along a first direction, which is parallel to the display surface of the electronic device.

[0019] In some embodiments of this disclosure, the electronic device further includes:

[0020] A first circuit board is disposed on the side of the connecting plate opposite to the second heat sink, and the heat sink is disposed on the first circuit board.

[0021] In some embodiments of this disclosure, the heating element includes:

[0022] chip;

[0023] A shielding cover is disposed on the first circuit board, and a shielding space is formed between the shielding cover and the first circuit board. The chip is disposed in the shielding space, and the end of the chip facing away from the first circuit board is thermally connected to the shielding cover. The cold end of the first heat sink is thermally connected to the shielding cover.

[0024] In some embodiments of this disclosure, the first heat sink and the circuit board are electrically connected to provide drive current to the first heat sink.

[0025] In some embodiments of this disclosure, the electronic device further includes:

[0026] The first conductive element is electrically connected to the first circuit board and the first heat sink, respectively.

[0027] In some embodiments of this disclosure, the second heat sink and the circuit board are electrically connected to provide drive current to the second heat sink.

[0028] In some embodiments of this disclosure, the electronic device further includes:

[0029] The second conductive element passes through the connecting plate and is electrically connected to the first circuit board and the second heat sink, respectively.

[0030] In some embodiments of this disclosure, the electronic device further includes:

[0031] A temperature detection module, used to detect the temperature inside the electronic device;

[0032] A heat dissipation control module is electrically connected to the temperature detection module and the first heat sink respectively. The heat dissipation control module controls the first heat sink in response to the temperature detected by the temperature detection module.

[0033] In some embodiments of this disclosure, the temperature detection module includes:

[0034] A first temperature detection element is used to detect the temperature of the heating element;

[0035] The second temperature sensing element is used to detect the temperature of the second heat sink.

[0036] The heat dissipation control module responds to the temperatures detected by the first temperature sensor and the second temperature sensor, and controls the first heat sink and the second heat sink.

[0037] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0038] The electronic device provided in this embodiment includes a heating element, a mid-frame, a first heat sink, and a second heat sink. The first heat sink and the heating element are thermally connected, and the second heat sink and the first heat sink are thermally connected. The first heat sink is a semiconductor cooler. The heat generated by the heating element is actively transferred to the second heat sink through the first heat sink, thereby realizing active heat dissipation of the heating element in the electronic device, improving the heat dissipation efficiency of the electronic device, and solving the problem that the temperature of the heating element is too high and affects the performance of the electronic device.

[0039] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0040] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0041] Figure 1 An exploded view of an electronic device provided as an exemplary embodiment of this disclosure;

[0042] Figure 2 A schematic diagram of the partitioning of an electronic device provided for an exemplary embodiment of this disclosure;

[0043] Figure 3 A schematic cross-sectional view of a first electronic device provided as an exemplary embodiment of this disclosure;

[0044] Figure 4 A schematic diagram of a first heat dissipation unit provided for an exemplary embodiment of this disclosure;

[0045] Figure 5 A schematic diagram of a second heat dissipation unit provided for an exemplary embodiment of this disclosure;

[0046] Figure 6 A cross-sectional schematic diagram of a second electronic device provided as an exemplary embodiment of this disclosure;

[0047] Figure 7 A cross-sectional schematic diagram of a third electronic device provided as an exemplary embodiment of this disclosure;

[0048] Figure 8 A cross-sectional schematic diagram of a fourth electronic device provided as an exemplary embodiment of this disclosure;

[0049] Figure 9 A cross-sectional schematic diagram of a fifth electronic device provided for an exemplary embodiment of this disclosure;

[0050] Figure 10 A block diagram of an electronic device provided for an exemplary embodiment of this disclosure.

[0051] Explanation of reference numerals in the attached figures:

[0052] 10. Mid-frame; 11. Connecting plate; 12. Frame; 121. Air inlet; 122. Exhaust outlet; 110. First zone; 120. Second zone; 130. Third zone; 101. First through hole; 102. Thinned section; 20. Heating element; 21. Chip; 22. Shielding cover; 23. Thermally conductive adhesive layer; 241. First conductive element; 242. Second conductive element; 31. First heat sink; 32. Second heat sink; 301. Cold zone; 302. Transition zone; 303. Hot zone; 3111. First cold end electrode; 3112. First hot end electrode. Terminal electrode; 3113, first N-type semiconductor; 3114, first P-type semiconductor; 3211, second cold-end electrode; 3212, second hot-end electrode; 3213, second N-type semiconductor; 3214, second P-type semiconductor; 40, first circuit board; 50, display device; 501, heat dissipation channel; 60, battery; 70, second circuit board; 80, back cover; 90, air-cooling module; 1010, heat dissipation control module; 1020, temperature detection module; 1021, first temperature detection element; 1022, second temperature detection element. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0054] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined. Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by those skilled in the art. To make the technical solutions and advantages of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0055] In related technologies, passive cooling devices, such as graphite heat sinks or metal heat sinks, are often installed in electronic devices like mobile terminals to prevent overheating during use. These passive cooling devices passively transfer heat from the heat-generating parts of the electronic device to cooler parts, and ultimately to the outside of the device. However, passive cooling is inefficient and cannot dissipate heat effectively.

[0056] This disclosure provides an exemplary embodiment of an electronic device, such as... Figure 1 As shown, the electronic device includes: a middle frame 10, a heating element 20, a first heat sink 31, and a second heat sink 32. The middle frame 10 has a connecting plate 11. The first heat sink 31 is disposed on the connecting plate 11 and is a semiconductor cooler. The first heat sink 31 has a cold end and a hot end, and the cold end of the first heat sink 31 is thermally connected to the heating element 20. The second heat sink 32 is thermally connected to the hot end of the first heat sink 31 to dissipate heat from the first heat sink 31.

[0057] The electronic device provided in this embodiment includes a heating element 20, a middle frame 10, a first heat sink 31, and a second heat sink 32. The first heat sink 31 and the heating element 20 are thermally connected, and the second heat sink 32 and the first heat sink 31 are thermally connected. The first heat sink 31 is a semiconductor cooler. The heat generated by the heating element 20 is actively transferred to the second heat sink 32 through the first heat sink 31, thereby realizing active heat dissipation of the heating element 20 in the electronic device, improving the heat dissipation efficiency of the electronic device, and solving the problem that the temperature of the heating element is too high and affects the performance of the electronic device.

[0058] The electronic devices provided in the embodiments of this disclosure are described below using multiple examples:

[0059] In this embodiment of the disclosure, the electronic device may be a mobile phone, tablet computer, e-reader, MP3 player, MP4 player, laptop computer, in-vehicle system or desktop computer, portable terminal, laptop terminal, desktop terminal or similar product.

[0060] The middle frame 10 may include a connecting plate 11 and a frame 12, with the frame 12 surrounding the connecting plate 11. The thickness of the frame 12 is greater than the thickness of the connecting plate 11. At least one side of the connecting plate 11 in the middle frame 10 has a receiving space for accommodating electronic components. For example, a first receiving space is formed on one side of the connecting plate 11, and a second receiving space is formed on the other side of the connecting plate 11. Some components in the electronic device are disposed in the first receiving space, and some components in the electronic device are disposed in the second receiving space.

[0061] The connecting plate 11 divides the space inside the electronic device into at least two spaces, which is beneficial for placing different devices in different spaces and avoiding mechanical interference or electromagnetic interference between multiple devices. In addition, the connecting plate 11 is also used to fix the components inside the electronic device.

[0062] The connecting plate 11 can be a flat plate or a near-flat plate structure, such as a metal plate, a plastic plate, or a resin plate. To connect electrical components to the connecting plate 11, through holes or recesses can be provided on the connecting plate 11.

[0063] In an exemplary embodiment, the frame 12 forms the outer edge of the electronic device. For example, the frame 12, together with the display device 50 and the back cover 80, can form the outer contour of the electronic device. The frame 12 can be a metal frame or a non-metal frame. When the frame 12 is a metal frame, it can be used as an antenna radiator. Furthermore, the frame 12 can be divided into multiple metal segments, with an insulating layer filling the gaps between the metal segments.

[0064] The connecting plate 11 and the frame 12 can be integrally formed. For example, the connecting plate 11 and the middle frame 10 can be formed by stamping or machining. Alternatively, the connecting plate 11 and the frame 12 can also be separate structures. For example, the connecting plate 11 and the frame 12 can be connected by adhesive, snap-fit, or screw.

[0065] It is understood that in some embodiments, the mid-frame 10 is not limited to a structure of connecting plate 11 and frame 12. The mid-frame 10 may also be formed by connecting plate 11, and the frame 12 of the electronic device may be formed by a bent edge on the curved display device 50 or the back cover 80.

[0066] For example, the connecting plate 11 includes a first region 110 and a second region 120. The orthographic projection of the heating element 20 on the connecting plate 11 is located in the first region 110. The cold end of the first heat sink 31 is thermally connected to the heating element 20. The second heat sink 32 extends at least partially into the second region 120. By using the first heat sink 31 and the second heat sink 32 in conjunction, heat is transferred to the second region 120, which is outside the first region 110 where the heating element 20 is located, thus improving heat dissipation efficiency.

[0067] The first heat sink 31 is a thermoelectric cooler (TEC), which is a device that generates cooling by utilizing the thermoelectric effect of semiconductors. The cold end of the first heat sink 31 can actively conduct heat to the hot end under the drive of current. That is, the first heat sink 31 is an active heat dissipation device, which can actively transfer the heat generated by the heat-generating element 20 to the second heat sink 32.

[0068] The orthographic projection of the first heat sink 31 on the connecting plate 11 at least partially covers the orthographic projection of the heat-generating component 20 on the connecting plate 11. For example, the orthographic projection of the first heat sink 31 on the connecting plate 11 and the orthographic projection of the heat-generating component 20 on the connecting plate 11 coincide.

[0069] The structure of the first heat sink 31 matches the structure of the heat-generating element 20. For example, the cross-sectional area of ​​the first heat sink 31 is the same as the cross-sectional area of ​​the heat-generating element 20, and the cross-sectional shape of the first heat sink 31 is the same as the cross-sectional shape of the heat-generating element 20. The cross-section is a surface parallel to the connecting plate 11.

[0070] The first heat dissipation element 31 includes a first cold end electrode 3111, a first hot end electrode 3112, a first N-type semiconductor 3113, and a first P-type semiconductor 3114. The first cold end electrode 3111 and the heat dissipation element 20 are thermally connected. The first hot end electrode 3112 is disposed on the side of the first cold end electrode 3111 away from the heat dissipation element 20, and the first hot end electrode 3112 and the second heat dissipation element 32 are thermally connected. The first N-type semiconductor 3113 and the first P-type semiconductor 3114 are disposed between the first cold end electrode 3111 and the first hot end electrode 3112.

[0071] In one embodiment, the first cold end electrode 3111, the first hot end electrode 3112, the first N-type semiconductor 3113 and the first P-type semiconductor 3114 can be integrated into a first heat dissipation unit, and a plurality of first heat dissipation units can be provided in the first heat dissipation component.

[0072] When the first heat sink 31 includes multiple first heat sink units, the multiple first heat sink units can be arranged in an array. That is, the first hot end electrodes 3112 of the multiple first heat sink units are aligned, and the first cold end electrodes 3111 of the multiple first heat sink units are aligned. Alternatively, the multiple first heat sink units can be stacked, that is, the multiple first heat sink units are arranged in sequence, and the first cold end electrode 3111 of one first heat sink unit and the first hot end electrode 3112 of the other first heat sink unit are connected in two adjacent first heat sink units.

[0073] The heating element 20 and the second heat dissipation element 32 are respectively disposed on both sides of the connecting plate 11. The connecting plate 11 is provided with a first through hole 101, and the first heat dissipation element 31 passes through the first through hole 101. The first heat dissipation element 31 actively transfers the heat generated by the heating element 20 to the second heat dissipation element 32, and then transfers it to a position away from the heating element 20 through the second heat dissipation element 32.

[0074] The second heat sink 32 can be an active heat sink, such as a thermoelectric cooler, a vapor chamber (VC), or a loop heat pipe (LHP). Alternatively, the second heat sink 32 can also be a passive heat sink, such as a graphite thermal conductive component or a metal thermal conductive component.

[0075] A thinning portion 102 is provided on the side of the connecting plate 11 opposite to the heat-generating element 20, and the second heat sink 32 is at least partially embedded in the thinning portion 102. Embedding the second heat sink 32 in the thinning portion 102 on the connecting plate 11 can reduce the size of the electronic device in the thickness direction, which is beneficial to the thinning and lightening of the electronic device. Furthermore, the heat can be dissipated from the second heat sink 32 by utilizing the heat conduction of the middle frame 10.

[0076] The thinning portion 102 can be a groove provided on the connecting plate 11. For example, the groove-shaped thinning portion 102 can be formed on the connecting plate 11 by means of stamping or cutting.

[0077] like Figure 3 As shown, taking the second heat sink 32 as an example of a semiconductor cooler, the second heat sink includes a second cold end electrode 3211, a second hot end electrode 3212, a second N-type semiconductor 3213 and a second P-type semiconductor 3214. The second cold end electrode 3211 and the first hot end electrode 3212 are thermally connected. The second N-type semiconductor 3213 and the second P-type semiconductor 3214 are disposed between the second cold end electrode 3211 and the second hot end electrode 3212.

[0078] In one embodiment, the second cold end electrode 3211, the second hot end electrode 3212, the second N-type semiconductor 3213, and the second P-type semiconductor 3214 can be integrated into a second heat dissipation unit, and multiple second heat dissipation units can be provided in the second heat dissipation component 32.

[0079] When the second heat sink 32 includes multiple second heat sink units, the multiple second heat sink units can be arranged in an array. That is, the second cold end electrodes 3211 of the multiple second heat sink units are aligned, and the second hot end electrodes 3212 of the multiple second heat sink units are aligned. Alternatively, the multiple second heat sink units can be stacked, that is, the multiple second heat sink units are arranged sequentially, and the second cold end electrode 3211 of one of the two adjacent second heat sink units is connected to the second hot end electrode 3212 of the other second heat sink unit.

[0080] In this embodiment of the disclosure, the electronic device may have one or more heat-generating components 20. When the electronic device has one heat-generating component 20, the heat-generating component 20 can be cooled by a combination of a first heat sink 31 and a second heat sink 32.

[0081] When an electronic device contains multiple heat-generating components 20, and when these components are relatively concentrated within the device, the device may include a second heat sink 32 and multiple first heat sinks 31. In this case, the connecting plate 11 has multiple first through holes 101, and the multiple first heat sinks 31 are respectively inserted into corresponding first through holes 101, with the hot ends of the multiple first heat sinks 31 all thermally connected to the second heat sink 32. Alternatively, each of the multiple heat-generating components 20 may be cooled by a combination including a first heat sink 31 and a second heat sink 32.

[0082] In some embodiments, the heat-generating element 20 may pass through the first through-hole 101 of the connecting plate 11. Based on this, the first heat sink 31 may partially pass through the first through-hole 101 and abut against the heat-generating element 20. Alternatively, the first heat sink 31 may be located on the side of the connecting plate 11 opposite to the first circuit board 40. By at least partially embedding the heat-generating element 20 in the first through-hole 101, the space occupied by the heat-generating element 20 in the thickness direction of the electronic device is saved, and the number of semiconductor heat sinks is reduced, saving space and cost.

[0083] When the electronic device contains multiple heating elements 20, the connecting plate 11 has multiple first through holes 101, and the multiple heating elements 20 are respectively disposed in the corresponding first through holes 101, and all the multiple heating elements 20 are thermally connected to the first heat sink. Alternatively, the electronic device may include multiple first heat sinks 31, with one heating element 20 and one first heat sink 31 corresponding to each other, and the corresponding heating element 20 passes through the first through hole 101 and is thermally connected to the corresponding first heat sink 31.

[0084] In some embodiments, the electronic device may further include a display device 50, a battery 60, a first circuit board 40, and a second circuit board 70. The display device 50 and the first circuit board 40 are respectively disposed on opposite sides of the connecting plate 11, and the heating element 20 is disposed on the first circuit board 40. The battery 60 is disposed on the side of the connecting plate 11 opposite to the display device 50. The first circuit board 40 is at least partially located in a first region 110, and the battery 60 is at least partially located in a second region 120. For example, the circuit board is located in the first region 110, and a battery compartment is formed in the second region 120, where the battery 60 is disposed. The second circuit board 70 is disposed in a third region 130, and the second circuit board 70 and the battery 60 are electrically connected.

[0085] For example, the first circuit board 40 can be the motherboard of an electronic device, and the second circuit board 70 can be a smaller board of the electronic device. The first circuit board 40 is used to install components such as the processor chip 21, and the second circuit board 70 is used to install charger components, and the battery 60 is charged through the assembly of the second circuit board 70.

[0086] The display device 50 forms the display surface of the electronic device, used to display images, text, and other information. The display device 50 can be a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display, etc. The display device 50 can include a display area and a non-display area. The display area performs the display function of the display device 50, used to display images, text, and other information. The non-display area does not display information. The non-display area can be used to house functional modules such as cameras, receivers, and proximity sensors. In some embodiments, the non-display area can include at least one area located above and below the display area. The display device 50 can be a full-screen display. In this case, the display device 50 can display information in full screen, thus giving the electronic device a large screen-to-body ratio. The display device 50 may only include the display area and not the non-display area. Alternatively, the display device 50 can also be a foldable display device 50, in which case the electronic device can be a foldable electronic device.

[0087] like Figure 9 As shown, the display device 50 is located on the side of the connecting plate 11 opposite to the heat-generating element 20, and the second heat sink 32 is located between the display device 50 and the connecting plate 11. For example, an air gap is provided between the display device 50 and the second heat sink 32, forming a heat dissipation channel 501, through which at least part of the heat from the second heat sink 32 is dissipated. The heat from the heat-generating element 20 is transferred to the heat dissipation channel 501 through the first heat sink 31 and the second heat sink 32, and the heat is conducted to the outside of the electronic device using the air gap within the heat dissipation channel 501.

[0088] like Figure 6 As shown, when the second heat sink 32 is a semiconductor cooler, the second heat sink 32 includes a cold part 321 and a hot part 322. The cold part 321 is thermally connected to the first heat sink 31, and the hot part 322 is connected to the cold part 321. A second cold end electrode 3211 is provided on the side of the cold part 321 facing the first heat sink 31, and a second hot end electrode 3212 is provided on the side of the hot part 322 facing the display device 50. A second N-type semiconductor 3213 and a second P-type semiconductor 3214 are disposed between the second cold end electrode 3211 and the second hot end electrode 3222.

[0089] In this embodiment, the cold part 321 and the hot part 322 of the second heat sink 32 are arranged along a first direction, which is parallel to the display surface of the electronic device. For example, the first direction can be the length direction of the electronic device.

[0090] By providing a second cold-end electrode 3211 on the side of the cold part 321 facing the first heat sink 31, and a second hot-end electrode 3212 on the side of the hot part 322 facing the display device 50, the cold and hot ends of the second heat sink 32 are staggered. The staggered cold and hot ends in the second heat sink 32 can conduct heat from the heat sink 20 to a location away from the heat sink 20, preventing heat from flowing back to the heat sink 20 and thus reducing the heat dissipation efficiency of the heat sink 20.

[0091] For example, when the second heat sink 32 is embedded in the thinned portion 102 on the connecting plate 11, the cold end of the second heat sink is in contact with the hot end of the first heat sink 31, and the hot end of the second heat sink 32 can be flush with the side of the connecting plate 11 that is away from the first circuit board 40.

[0092] In the second heat sink 32, a cold zone 301 is formed at the end near the heat sink 20, and a hot zone 303 is formed at the end near the battery compartment. A transition zone 302 is formed between the cold zone 301 and the hot zone 303. The cold zone 301 absorbs heat from the first heat sink and transfers the heat to the hot zone 303 through the transition zone 302.

[0093] To avoid the influence of ambient temperature, a heat insulation layer can be provided in the cold zone 301 of the second heat sink 32. The heat insulation layer can prevent ambient heat from affecting the cold end and also prevent temperature from dissipating in the area near the heat sink 20. A heat-conducting layer is provided in the hot zone 303 of the second heat sink 32, and the heat in the hot zone 303 can be transferred to areas such as the middle frame 10 through the heat-conducting layer.

[0094] The heat generated by the heat-generating component 20 is conducted to the heat dissipation channel 501 through the first heat sink 31 and the second heat sink 32. If the heat in the heat dissipation channel 501 cannot be dissipated in time, it will also cause the internal temperature of the electronic device to be too high. In order to solve this problem, the electronic device provided in this embodiment may further include an air-cooling module 90, which is disposed in the heat dissipation channel 501 to promote the air flow in the heat dissipation channel 501.

[0095] Among them, the air-cooled module 90 can be a miniature fan. The miniature fan is located in the heat dissipation channel 501. When the miniature fan is working, it promotes the airflow in the heat dissipation channel 501, thereby accelerating the temperature reduction in the heat dissipation channel 501.

[0096] A miniature fan has an air outlet and an air inlet, which are positioned opposite each other. To ensure sufficient airflow, the air outlet and air inlet are the two large surfaces of the miniature fan. For example, a miniature fan can have a cuboid or near-cuboid structure, with two opposing first surfaces and multiple second surfaces located between them. The area of ​​the first surfaces is larger than the area of ​​the second surfaces. The air outlet and air inlet are each a first surface.

[0097] In electronic devices, where the thickness dimension has limited space, a miniature fan can be tilted within the heat dissipation channel 501 to save space. For example, the exhaust surface of the miniature fan can be tilted at a 45-degree angle to the connecting plate 11.

[0098] Electronic devices typically house numerous delicate components. To protect these components, the cavities containing them are usually sealed. However, installing a heat dissipation channel 501 with an air-cooled module 90 could compromise the device's seal, potentially allowing dust or moisture to contaminate the interior. To address this, a sealing layer can be installed within the device, surrounding the heat dissipation channel 501. This creates an independent heat dissipation channel 501 within the device, preventing dust and moisture from entering the cavities housing the electrical components.

[0099] An opening may be provided on the sealing layer, through which the second heat sink 32 is exposed to the heat dissipation channel 501. When the air-cooled module 90 is working, the air-cooled module 90 promotes air circulation in the heat dissipation channel 501. The airflow in the heat dissipation channel 501 passes through the second heat sink 32, and the heat of the second heat sink 32 is dissipated to the outside of the electronic device through the airflow.

[0100] Furthermore, the frame 12 is provided with an air inlet 121 and an exhaust 122. The air inlet 121 is connected to the heat dissipation channel 501 and is used to allow air to enter when the air-cooled module 90 is working. The exhaust 122 is connected to the heat dissipation channel 501 and is used to exhaust air when the air-cooled module 90 is working.

[0101] Based on this, the electronic device may also include a first one-way valve and a second one-way valve. The first one-way valve is located at the air inlet 121 and is opened in response to the operation of the air-cooling module 90 so that air can enter the heat dissipation channel 501. The second one-way valve is located at the exhaust port 122 and is opened in response to the operation of the air-cooling module 90 so that air can be discharged from the heat dissipation channel 501.

[0102] The heat dissipation channel 501 can extend along the length of the electronic device or along the width of the electronic device. When the heat dissipation channel 501 extends along the length of the electronic device, the air inlet 121 and the exhaust 122 are respectively located on the sidewalls at both ends of the frame 12 along the length direction. When the heat dissipation channel 501 extends along the width of the electronic device, the air inlet 121 and the exhaust 122 are respectively located on the sidewalls at both ends of the frame 12 along the width direction.

[0103] The heat-generating component 20 in the electronic device can be a processor or similar device. Processors may include application processors (APs), modem processors, graphics processing units (GPUs), image signal processors (ISPs), controllers, video codecs, digital signal processors (DSPs), baseband processors, and / or neural network processing units (NPUs). Different processing units can be independent devices or integrated into one or more processors.

[0104] For example, such as Figure 7 As shown, the heating element 20 may include a chip 21 and a shielding cover 22. The shielding cover 22 is disposed on the first circuit board 40, and a shielding space is formed between the shielding cover 22 and the first circuit board 40. The chip 21 is disposed in the shielding space, and the end of the chip 21 facing away from the first circuit board 40 is thermally connected to the shielding cover 22. The first heat sink 31 is thermally connected to the shielding cover 22.

[0105] The shielding cover 22 can be a metal shielding cover 22, used to shield electromagnetic signals. On the one hand, the shielding cover 22 can prevent external radiation signals from interfering with the chip 21, and on the other hand, the shielding cover 22 can also prevent the chip 21 from radiating outwards, thereby reducing the radiation power of the electronic device.

[0106] A thermally conductive adhesive layer 23 is disposed between the chip 21 and the shield 22, and the cold end of the first heat sink 31 is attached to the shield 22. This attachment can be understood as thermal conductivity; for example, the cold end of the first heat sink 31 is in direct contact with the shield 22, or the cold end of the first heat sink 31 is connected to the shield 22 through the thermally conductive adhesive.

[0107] Semiconductor devices require a power supply to operate. When the semiconductor device is powered on, a thermoelectric cooler transfers heat from the cold end to the hot end. A first heat sink 31 is electrically connected to a first circuit board 40 to provide drive current to the first heat sink 31. A second heat sink 32 is electrically connected to the first circuit board 40 to provide drive current to the second heat sink 32.

[0108] To supply power to the semiconductor cooler, such as Figure 8 As shown, the electronic device also includes a first conductive element 241 and a second conductive element 242. The first conductive element 241 is electrically connected to the first circuit board 40 and the first heat sink 31, respectively, and the second conductive element 242 is electrically connected to the first circuit board 40 and the second heat sink 32, respectively.

[0109] The first circuit board 40 is located on the side of the connecting plate away from the second heat sink 32. That is, the second heat sink 32 and the first circuit board 40 are respectively located on both sides of the connecting plate 11. In order to connect the second heat sink 32 and the first circuit board 40, a through hole is provided on the connecting plate 11, through which the second conductive element 242 passes.

[0110] For example, a power management circuit connected to the battery 60 is provided on the first circuit board 40. A first conductive element 241 connects the power management circuit and the first heat sink 31, and a second conductive element 242 connects the power management circuit and the second heat sink 32.

[0111] The first conductive element 241 may include a first flexible circuit board, and the second conductive element 242 may include a second flexible circuit board. The first flexible circuit board is connected to the first heat sink and the first circuit board 40 to provide drive current to the first heat sink, and the second flexible circuit board is connected to the second heat sink and the first circuit board 40 to provide drive current to the second heat sink.

[0112] In order to precisely control the temperature inside electronic devices, such as Figure 10 As shown, the electronic device also includes a temperature detection module 1020 and a heat dissipation control module 1010. The temperature detection module 1020 is used to detect the temperature inside the electronic device. The heat dissipation control module 1010 is electrically connected to the temperature detection module 1020 and the first heat sink 31 respectively. The heat dissipation control module 1010 controls the first heat sink in response to the temperature detected by the temperature detection module 1020.

[0113] The temperature detection module 1020 can detect the temperature of the heating element 20. When the temperature detection module 1020 detects that the temperature of the heating element 20 is greater than a first preset threshold, the heat dissipation control module 1010 controls the first heat dissipation element 31 to work. The current input to the first heat dissipation element 31 can be positively correlated with the temperature of the heating element 20, that is, the current input to the first heat dissipation element 31 increases as the temperature of the heating element 20 increases.

[0114] When the second heat sink 32 is an active heat sink, it is connected to the heat dissipation control module 1010. The temperature detection module 1020 may include a first temperature detection element 1021 and a second temperature detection element 1022. The first temperature detection element 1021 is used to detect the temperature of the heat-generating element 20; the second temperature detection element 1022 is used to detect the temperature of the second heat sink 32; the heat dissipation control module 1010 controls the first heat sink 31 and the second heat sink 32 in response to the temperatures detected by the first temperature detection element 1021 and the second temperature detection element 1022.

[0115] It is understood that the temperature detection module 1020 in this embodiment may also include more temperature detection elements. For example, the temperature detection module 1020 may also include a third temperature detection element and a fourth temperature detection element. The third temperature detection element may be located at the hot end of the first heat sink 31, the fourth temperature detection element may be located at the cold end of the second heat sink 32, and the second temperature detection element 1022 may be located at the hot end of the second heat sink 32. By detecting the temperature of various parts of the electronic device with multiple temperature detection elements, it is beneficial to further control the heat dissipation power of the first heat sink 31 and / or the second heat sink 32, thereby achieving precise temperature control.

[0116] For example, when the temperature detected by the third temperature sensor is greater than the temperature detected by the fourth temperature sensor, and the difference between the temperatures detected by the third and fourth temperature sensors is greater than a preset difference, the control power management circuit increases the current input to the second heat sink, thereby improving the heat transfer capability of the second heat sink.

[0117] When the electronic device includes an air-cooled module 90, a fifth temperature sensor can be installed in the heat dissipation channel 501 to detect the temperature within the heat dissipation channel 501. When the temperature within the heat dissipation channel 501 exceeds a preset temperature threshold, the heat dissipation control module 1010 controls the air-cooled module 90 to operate.

[0118] The temperature sensing element can be an NTC (Negative Temperature Coefficient thermistor), but in some embodiments, it can also be other temperature sensors, and this disclosure is not limited thereto. For example, the temperature sensing element can also be a thermocouple temperature sensor, etc.

[0119] It should be noted that, in the embodiments of this disclosure, thermal conductivity refers to the ability to conduct heat between two thermally conductive devices. The two thermally conductive devices are in direct contact, or a thermally conductive adhesive is provided between them. For example, the cold end of the first heat sink 31 and the heat sink 20 are thermally conductive, which can be achieved by connecting the cold end of the first heat sink 31 and the heat sink 20 through thermally conductive adhesive.

[0120] The electronic device provided in this embodiment includes a heating element 20, a middle frame 10, a first heat sink 31, and a second heat sink 32. The first heat sink 31 and the heating element 20 are thermally connected, and the second heat sink 32 and the first heat sink 31 are thermally connected. The first heat sink 31 is a semiconductor cooler. The heat generated by the heating element 20 is actively transferred to the second heat sink 32 through the first heat sink 31, thereby realizing active heat dissipation of the heating element 20 in the electronic device, improving the heat dissipation efficiency of the electronic device, and solving the problem that the temperature of the heating element is too high and affects the performance of the electronic device.

[0121] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. An electronic device, characterized in that, The electronic device includes: Heating element; Mid-frame, the mid-frame having a connecting plate; A first heat sink is disposed on the connecting plate. The first heat sink is a semiconductor cooler. The first heat sink has a cold end and a hot end. The cold end of the first heat sink is thermally connected to the heat sink. The second heat sink is thermally connected to the hot end of the first heat sink to dissipate heat from the first heat sink.

2. The electronic device as claimed in claim 1, characterized in that, The orthographic projection of the first heat sink on the connecting plate at least partially covers the orthographic projection of the heat-generating element on the connecting plate.

3. The electronic device as claimed in claim 1, characterized in that, The first heat sink includes a first cold end electrode, a first hot end electrode, a first N-type semiconductor, and a first P-type semiconductor. The first cold end electrode and the heat sink are thermally connected. The first hot end electrode is located on the side of the first cold end electrode away from the heat sink, and the first hot end electrode and the second heat sink are thermally connected. The first N-type semiconductor and the first P-type semiconductor are located between the first cold end electrode and the first hot end electrode.

4. The electronic device as claimed in claim 1, characterized in that, The heating element and the second heat dissipation element are respectively disposed on both sides of the connecting plate. The connecting plate is provided with a first through hole, and the first heat dissipation element passes through the first through hole.

5. The electronic device as claimed in claim 4, characterized in that, The connecting plate has a thinning portion on the side opposite to the heating element, and the second heat dissipation element is at least partially embedded in the thinning portion.

6. The electronic device as claimed in claim 4, characterized in that, The electronic device also includes: The display device is located on the side of the connecting plate away from the heat-generating element, and the second heat sink is located between the display device and the connecting plate.

7. The electronic device as claimed in claim 6, characterized in that, The second heat sink is a semiconductor cooler, which includes a cold part and a hot part. The cold part is thermally connected to the first heat sink, and the hot part is connected to the cold part. The cold part has a second cold end electrode on the side facing the first heat sink, and the hot part has a second hot end electrode on the side facing the display device. A second N-type semiconductor and a second P-type semiconductor are disposed between the second cold end electrode and the second hot end electrode.

8. The electronic device as claimed in claim 7, characterized in that, The cold and hot parts of the second heat sink are arranged along a first direction, which is parallel to the display surface of the electronic device.

9. The electronic device as claimed in claim 1, characterized in that, The electronic device also includes: A first circuit board is disposed on the side of the connecting plate opposite to the second heat sink, and the heat sink is disposed on the first circuit board.

10. The electronic device as claimed in claim 9, characterized in that, The heating element includes: chip; A shielding cover is disposed on the first circuit board, and a shielding space is formed between the shielding cover and the first circuit board. The chip is disposed in the shielding space, and the end of the chip facing away from the first circuit board is thermally connected to the shielding cover. The cold end of the first heat sink is thermally connected to the shielding cover.

11. The electronic device as claimed in claim 9, characterized in that, The first heat sink and the first circuit board are electrically connected to provide drive current to the first heat sink.

12. The electronic device as claimed in claim 11, characterized in that, The electronic device also includes: The first conductive element is electrically connected to the first circuit board and the first heat sink, respectively.

13. The electronic device as claimed in claim 9, characterized in that, The second heat sink is electrically connected to the first circuit board to provide drive current to the second heat sink.

14. The electronic device as claimed in claim 13, characterized in that, The electronic device also includes: The second conductive element passes through the connecting plate and is electrically connected to the first circuit board and the second heat sink, respectively.

15. The electronic device as described in any one of claims 1-14, characterized in that, The electronic device also includes: A temperature detection module, used to detect the temperature inside the electronic device; A heat dissipation control module is electrically connected to the temperature detection module and the first heat sink respectively. The heat dissipation control module controls the first heat sink in response to the temperature detected by the temperature detection module.

16. The electronic device as claimed in claim 15, characterized in that, The temperature detection module includes: A first temperature detection element is used to detect the temperature of the heating element; The second temperature sensing element is used to detect the temperature of the second heat sink. The heat dissipation control module responds to the temperatures detected by the first temperature sensor and the second temperature sensor, and controls the first heat sink and the second heat sink.

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