Substrate repairing method, system and equipment and computer readable storage medium

Abstract

The invention discloses a substrate repairing method, system and device and a computer readable storage medium. The repairing method comprises the steps that position information and defect types of target elements with defects on a to-be-repaired target substrate are obtained; according to the defect type, determining a repair parameter matched with the target element; positioning the target element on the target substrate according to the position information; and after positioning, repairing the target element according to the repairing parameters. According to the method and the device, the defect type of the target element with the defect is acquired, and the repairing parameter matched with the defect type of the target element is utilized for repairing, so that the repairing accuracy can be ensured, the position information of the target element with the defect is acquired, and the target element is positioned according to the position information; and compared with a mode of manually searching and positioning defects on the target substrate, the efficiency of positioning the position of the target element can be improved, so that the repair efficiency is further improved.

Description

Technical Field

[0001] This invention relates to the field of substrate repair technology, and in particular to a method, system, device, and computer-readable storage medium for repairing substrates. Background Technology

[0002] Micro-LED display panels are considered to be the next generation of display technology in the consumer electronics field due to their high brightness, low power consumption, and long lifespan. Micro-LEDs are smaller than 100um in size. Defects introduced by such tiny chips in the mass transfer process can affect the display effect of the display device. Although process optimization can reduce defects to some extent, it cannot completely eliminate them. Therefore, repair processes are needed to improve product yield and enhance display effect. Summary of the Invention

[0003] The main technical problem addressed by this application is to provide a method, system, device, and computer-readable storage medium for repairing a substrate, which can improve repair efficiency.

[0004] To solve the above-mentioned technical problems, this application adopts a technical solution: providing a method for repairing a substrate, the repair method comprising:

[0005] Obtain the location information and defect type of the target component with defects on the target substrate to be repaired;

[0006] Based on the type of defect, determine the repair parameters that match the target component;

[0007] Based on the location information, the target element is positioned on the target substrate;

[0008] After positioning, the target component is repaired according to the repair parameters.

[0009] To address the aforementioned technical problems, this application also provides a technical solution: a repair system comprising:

[0010] The acquisition module is used to acquire the location information and defect type of the target component with defects on the target substrate to be repaired.

[0011] A matching module is used to determine repair parameters that match the target component based on the type of defect.

[0012] A positioning module is used to position the target element on the target substrate according to the position information;

[0013] The repair module is used to repair the target component according to the repair parameters after positioning.

[0014] To address the aforementioned technical problems, this application also provides a technical solution: providing an electronic device, including a processor and a memory, wherein the processor is coupled to the memory, the memory stores program data, and the processor executes the program data in the memory to implement the steps in any of the methods described above.

[0015] To address the aforementioned technical problems, this application also provides a technical solution: a computer-readable storage medium storing a computer program that can be executed by a processor to implement the steps in any of the methods described above.

[0016] Beneficial effects: This application obtains the defect type of the target component with defects and repairs it using repair parameters that match the defect type of the target component, which can ensure the accuracy of the repair. At the same time, it obtains the location information of the target component with defects and locates the target component based on the location information. Compared with the method of manually searching and locating defects on the target substrate, it can improve the efficiency of locating the target component and thus further improve the repair efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0018] Figure 1 A top view of a target substrate with a detection element provided in an embodiment of this application;

[0019] Figure 2 A schematic flowchart illustrating a repair method provided in an embodiment of this application;

[0020] Figure 3 For this application Figure 2 A flowchart illustrating step S100;

[0021] Figure 4 This is a schematic diagram of the structure of a repair system provided in an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0023] Figure 6 This is a schematic diagram of the structure of a computer-readable storage medium provided in an embodiment of this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0025] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] Please see Figure 1 Ideally, the multiple detection elements 20 transferred to the target substrate 10 are arranged in an array along the row direction X and column direction Y, with each detection element 20 in its corresponding standard position. However, since the size of the detection elements 20 is on the order of micrometers, in the actual transfer process, such as... Figure 1 As shown, the component to be tested 20 may have various defects such as offset, rotation, lateral crystallization, vertical crystallization, or flipping. In this application, the component to be tested 20 with defects is defined as the target component 30. The purpose of this application is to repair the target component 30.

[0028] Please refer to the following: Figure 1 and Figure 2In one embodiment of this application, a method for repairing a substrate is provided for repairing target components 30 located on a target substrate 10, thereby improving the yield of multiple target components 30 on the target substrate 10. This method can be executed by a CIM system, which stands for Computer Integrated Manufacturing, referring to a system that integrates electronic data processing across all production-related business departments. The target substrate 10 can be a temporary substrate or an array substrate; in other embodiments, the target substrate 10 can also be a substrate made of other materials.

[0029] For details, please continue reading Figure 1 and Figure 2 The substrate repair method includes the following steps:

[0030] S100: Obtain the location information and defect type of the target element 30 with defects on the target substrate 10 to be repaired.

[0031] The position information of the target element 30 refers to its location on the target substrate 10. Based on this position information, the target element 30 can be located on the target substrate 10. In one embodiment, the position information of the target element 30 includes its coordinates in a coordinate system established based on the target substrate 10. In another embodiment, the position information of the target element 30 includes its relative position to a fixed point on the target substrate 10. In summary, this application does not limit the specific content of the position information, as long as the target element 30 can be located on the target substrate 10 using its position information.

[0032] The defects in the target component 30 include one or more of several defects such as misalignment, rotation, vertical crystal formation, or flipping. For example... Figure 1 Offset refers to the position of the target element 30 deviating from its corresponding standard position; rotation refers to the position of the target element 30 being rotated relative to the standard position; vertical crystal refers to the functional surface of the target element 30 being perpendicular to the substrate (ideally, the functional surface of the target element 30 is parallel to the target substrate 10 and faces the target substrate 10); flip crystal refers to the functional surface of the target element 30 being away from the target substrate 10.

[0033] S110: Determine the repair parameters that match the target component 30 based on the type of defect.

[0034] Different types of defects correspond to different repair parameters. By using repair parameters that match the target component 30 to repair the target component 30, the repair can be carried out according to the type of defect of the target component 30, which can improve the repair success rate.

[0035] In one embodiment, each defect type corresponds to a repair procedure, and the repair procedure corresponding to the defect type carries repair parameters corresponding to the defect type. Step S110 specifically includes: determining the repair procedure that matches the target component 30 according to the defect type, and further reading the repair parameters carried in the repair procedure. The repair procedure can be set within the CIM system.

[0036] S120: Position the target element 30 on the target substrate 10 according to the position information.

[0037] Specifically, based on the location information, the corresponding position is found on the target substrate 10, and the found position is considered to be the position of the target element 30.

[0038] S130: After positioning, the target component 30 is repaired according to the repair parameters.

[0039] After locating the target component 30, the repair parameters are used to repair the target component 30 in a targeted manner, thereby improving the success rate of the repair.

[0040] In the above-mentioned substrate repair method, by obtaining the defect type of the target element 30 with defects and using repair parameters that match the defect type of the target element 30 for repair, the repair accuracy can be guaranteed. At the same time, the location information of the target element 30 with defects is obtained and the target element 30 is located according to the location information. Compared with the method of manually searching and locating defects on the target substrate 10, the efficiency of locating the target element 30 can be improved, thereby further improving the repair efficiency.

[0041] Please continue reading. Figure 1 and Figure 2 In one embodiment, step S100 includes:

[0042] S101: Obtain the target file sent by the appearance inspection equipment.

[0043] Specifically, appearance inspection equipment is usually used to inspect the substrate for defects. Appearance inspection equipment includes automated optical inspection equipment (AOI equipment). Based on optical principles, automated optical inspection equipment can inspect all the components 20 to be inspected on the target substrate 10, thereby selecting the target components 30 with defects and confirming the location and type of defects of the target components 30.

[0044] In one embodiment, when the appearance inspection device detects defects on the target substrate 10, it can compare a target image captured on the target substrate 10 with a standard image. The image area where the target image and the standard image are inconsistent is the area where the defect of the target substrate 10 is located. At this time, the appearance inspection device can extract the defect image according to the image processing algorithm. The defect image can intuitively display the shape and size of the target element 30 with the defect, thereby judging and identifying the type of defect of the target element 30. At the same time, it can also locate the position of the defect image in the target image, thereby obtaining the position information of the target element 30.

[0045] The location information and defect type of the target component 30 obtained by the aforementioned appearance inspection equipment can be uploaded to the CIM system as a target file, so that subsequent repair equipment can locate the corresponding target component 30 based on the target file, and at the same time confirm the defect type of the corresponding target component 30. In one embodiment, one target file corresponds to one defective target component 30.

[0046] S102: Extract the location information and defect type of target component 30 from the target file.

[0047] In practical applications, the CIM system, as a centralized information management platform, is responsible for collecting, storing, and processing data from various sources. The repair equipment can communicate with the CIM system, enabling it to download target files uploaded to the system, obtain location information and defect types from these files, and then locate the target component 30 based on the location information. According to the defect type, the repair equipment can then call the matching repair parameters to repair the target component 30, thereby further improving repair efficiency and effectiveness.

[0048] Please continue reading. Figure 1 and Figure 2 In one embodiment, the position information of the target element 30 includes the standard coordinates of the target element 30 in the target coordinate system and the offset of the target element 30. Specifically, the appearance inspection device can establish a target coordinate system on the target substrate 10, where the row direction in the target coordinate system corresponds to... Figure 1 The corresponding X-axis direction and column direction Figure 1 In the Y-axis direction.

[0049] Here, the standard coordinates refer to the correct coordinates of the target element 30 if it is free of defects. The offset refers to the distance between the actual coordinates of the target element 30 in the target coordinate system and the standard coordinates. Specifically, the offset includes a first offset distance of the target element 30 in the X-axis direction and a second offset distance in the Y-axis direction. Based on the standard coordinates, the first offset distance, and the second offset distance, the actual coordinates of the defective target element 30 in the target coordinate system can be calculated, thereby achieving the purpose of quickly locating the position of the target element 30 on the target substrate 10.

[0050] It should be noted that in this embodiment, the offset is a vector.

[0051] In one embodiment, the standard coordinates and actual coordinates of the target element 30 in the target coordinate system both refer to the coordinate values ​​of the center of the target element 30 in the target coordinate system. In other embodiments, the standard coordinates and actual coordinates of the target element 30 in the target coordinate system may also refer to the coordinate values ​​of a preset point of the target element 30 in the target coordinate system.

[0052] Please continue reading. Figure 1 and Figure 2 In one embodiment, step S120 includes:

[0053] S121: After establishing a target coordinate system on the target substrate 10, the target element 30 is positioned on the target substrate 10 according to the standard coordinates and offset.

[0054] Specifically, after the repair equipment extracts the position information of the target component 30, it establishes a target coordinate system on the target substrate 10. This target coordinate system is consistent with the target coordinate system established by the appearance inspection equipment when inspecting all the components 20 to be inspected on the target substrate 10, and their origins coincide.

[0055] Specifically, the coordinate value of the standard coordinate system is set to (X... 标准 Y 标准 The offset includes a first offset distance of the target element 30 in the X-axis direction and a second offset distance in the Y-axis direction, that is, the offset is (X... 偏移 Y 偏移 Therefore, the actual coordinates (X, Y) of the target element 30 in the target coordinate system are... 目标 Y 目标 )=(X 标准 +X 偏移 Y 标准 +Y 偏移 Based on the standard coordinates, the first offset distance, and the second offset distance, the actual coordinates of the defective target element 30 in the target coordinate system can be calculated, thereby quickly locating the position of the target element 30 on the target substrate 10.

[0056] Please continue reading. Figure 1 and Figure 2 In one embodiment, step S130 includes:

[0057] S131: Adjust the laser beam according to the repair parameters.

[0058] In this embodiment, a laser is used to repair the target component. Furthermore, the repair parameters are also related to laser repair; therefore, the laser beam is adjusted according to the repair parameters.

[0059] S132: Repair the target component 30 using a laser beam.

[0060] The target component 30 is repaired using a laser in the repair equipment, wherein the repair process includes removing the target component 30 or returning the target component 30 to the standard coordinates.

[0061] In one embodiment, the repair parameters include at least one of the following: laser wavelength, laser energy, laser spot shape, and laser spot size, which match the target element 30. In another embodiment, after obtaining the repair parameters, the laser wavelength, laser energy, laser spot shape, and laser spot size are adjusted to match the target element 30.

[0062] In other embodiments, the repair parameters also include a laser duration that matches the target element 30, so that when the target element 30 is subsequently repaired using laser repair, the target element 30 is repaired according to the matching laser duration.

[0063] In one embodiment, the characteristics of the laser emitted from the repair device can be changed by setting a frequency divider in the laser optical path of the repair device to achieve the laser wavelength required to repair the target component 30.

[0064] In one embodiment, the characteristics of the laser emitted from the repair device can be changed by setting an attenuator in the laser optical path of the repair device, so as to achieve the laser energy required to repair the target component 30.

[0065] In one embodiment, a grating can be provided in the laser optical path of the repair device to change the characteristics of the laser emitted from the repair device, thereby achieving the laser spot shape and size required for repairing the target component 30. Specifically, the laser spot shape in the laser passage area formed by the grating includes at least one of a square, rectangle, triangle, trapezoid, polygon, or multi-aperture. Of course, the laser spot shape is not limited to the above-mentioned shapes and is not restricted here.

[0066] Please refer to the following: Figure 1 , Figure 2 and Figure 3 In one embodiment, in step S100, the location information and defect type of the target element 30 with defects on the target substrate 10 to be repaired can be directly obtained by the repair device, specifically including the following:

[0067] S103: Acquire a target image, wherein the target image includes a target substrate 10 and various detection elements 20 located on the target substrate 10.

[0068] The repair equipment directly scans the target substrate 10 and can quickly obtain a view of the target substrate 10 and each component 20 to be tested on the target substrate 10 by automatically capturing the target image.

[0069] S104: Generate a detection box 40 for each element 20 to be detected in the target image.

[0070] In this embodiment, a detection frame 40 is generated with the center point of each element 20 to be detected as the center. In other embodiments, the detection frame 40 may also be generated with other points in the element 20 to be detected as the center, and there is no limitation here.

[0071] S105: For each element to be tested 20, determine the position information of the element to be tested 20 based on the position information of the detection frame 40 of the element to be tested 20.

[0072] After generating multiple detection boxes 40, for each detection box 40, the offset of the center point coordinates of each detection box 40 in the target coordinate system relative to the standard coordinates is obtained. Since the center point of the detection box 40 has been set as the center point of the element to be detected 20, step S105 actually determines the offset of the center point coordinates of the element to be detected 20 relative to the standard coordinates. Therefore, the center point of the element to be detected 20 can be calculated based on the standard coordinates and the offset of the center point coordinates of the detection box 40 in the target coordinate system relative to the standard coordinates, thus determining the position information of the element to be detected 20.

[0073] S106: For each element to be inspected 20, in response to the fact that the position of the detection frame 40 of the element to be inspected 20, the size of the detection frame 40, or the image within the detection frame 40 does not meet the preset conditions, it is determined that the element to be inspected 20 is a target element 30 with defects, and further, the type of defect of the target element 30 is determined according to at least one of the position of the detection frame 40, the size of the detection frame 40, or the image within the detection frame 40.

[0074] The preset conditions include the position of the element to be tested 20, the size of the element to be tested 20, and the image features of the element to be tested 20 when it is located on the target substrate 10. The information of the element to be tested 20 is compared with that of the element to be tested 20 without defects, so as to determine whether the element to be tested 20 is the target element 30 with defects.

[0075] Specifically, the steps for determining whether the component to be tested 20 is a target component 30 with defects include:

[0076] Obtain the position of the detection box 40 and determine whether the coordinates of the center point of the detection box 40 in the target coordinate system are consistent with the standard coordinates.

[0077] Obtain the size of the detection frame 40 and determine whether the size of the detection frame 40 is consistent with the size of the detection frame 40 generated on the defect-free element 20.

[0078] The image within the detection frame 40 is acquired, and it is determined whether the image within the detection frame 40 is consistent with the image when the defect-free test element 20 is located on the target substrate 10.

[0079] If at least one of the above-mentioned conditions—the position of the detection frame 40, the size of the detection frame 40, and the image within the detection frame 40—is inconsistent with the preset conditions, then the element to be detected 20 is determined to be a target element 30 with a defect.

[0080] In one embodiment, the type of defect in the target element 30 can be determined based on at least one of the position of the detection frame 40, the size of the detection frame 40, or the image within the detection frame 40.

[0081] Please refer to the following: Figure 1 and Figure 3 In one embodiment, step S106 includes:

[0082] S1061: In response to the offset of the center point of the detection frame 40 relative to the standard center, it is determined that the element to be detected 20 is a target element 30 with a defect, and further determined that the type of defect of the target element 30 includes offset.

[0083] If the offset of the center point of the detection frame 40 relative to the standard center point of the defect-free component 20 is not zero, then the target component 30 is determined to be in an offset state on the target substrate 10. If the absolute value of the offset of the target component 30 is greater than or equal to a preset threshold, then the target component 30 is determined to have a high degree of offset, and the laser device can perform laser removal repair processing on the target component 30. If the absolute value of the offset of the target component 30 is less than the preset threshold, then the target component 30 is determined to have a low degree of offset, and the laser device can perform laser repositioning repair processing on the target component 30.

[0084] S1062: In response to the ratio of the length L to the width D of the detection frame 40 being less than a first threshold, it is determined that the element to be detected 20 is a target element 30 with a defect, and the defect type of the target element 30 is further determined to include rotation.

[0085] In this design, the length L of the longer side of the detection frame 40 is defined as the length L of the detection frame 40, and the length L of the shorter side of the detection frame 40 is defined as the width D of the detection frame 40. Due to varying requirements for process precision, some defective target components 30 may fall within the acceptable range for good products under different circumstances. Therefore, a first threshold is set, which is the lower limit of the ratio of the length L to the width D of a defect-free component 20 when it is located on the target substrate 10. When the ratio of the length L to the width D of the detection frame 40 is less than the first threshold, i.e., the value of the length L of the detection frame 40 is close to the value of the width D, it can be determined that the target component 30 is in a rotated state on the target substrate 10.

[0086] S1063: In response to the area of ​​the detection frame 40 being less than the area threshold, and in response to the ratio of the length L to the width D of the detection frame 40 being greater than the second threshold, it is determined that the element to be detected 20 is a target element 30 with defects, and further determined that the defect type of the target element 30 includes vertical crystal.

[0087] The second threshold is the upper limit of the ratio of the length L to the width D of the test element 20 without defects when it is located on the target substrate 10. When the ratio of the length L to the width D of the test frame 40 is greater than the second threshold, that is, when the length L of the test frame 40 is much greater than the width D, it can be determined that the state of the target element 30 on the target substrate 10 is a vertical crystal state.

[0088] S1064: In response to the area of ​​the detection frame 40 being less than the area threshold, and in response to the length L direction of the detection frame 40 not being a preset first direction and the width D direction of the detection frame 40 not being a preset second direction, it is determined that the element to be detected 20 is a target element 30 with defects, and the defect type is further determined to include transverse vertical crystal.

[0089] Specifically, the first direction is defined as the Y-axis direction in the target coordinate system, and the second direction is defined as the X-axis direction in the target coordinate system. Simultaneously, the long side extension direction (i.e., the length L direction) of the detection frame 40 is set to be parallel to the first direction, and the short side extension direction (i.e., the width D direction) of the detection frame 40 is set to be parallel to the second direction. When it is detected that the length L direction is not parallel to the first direction or the width D direction is not parallel to the second direction, it can be determined that the target element 30 is in a lateral vertical crystal state on the target substrate 10.

[0090] S1065: For each element to be tested 20, in response to the presence of an electrode in the image within the detection frame 40 of the element to be tested 20, it is determined that the element to be tested 20 is a target element 30 with a defect, and the defect type is further determined to include flipping.

[0091] Specifically, in an ideal state, the functional surface of the element to be tested 20 should face the target substrate 10. Therefore, in an ideal state, there should be no electrodes in the image within the detection frame 40 of the element to be tested 20. If there are electrodes in the image within the detection frame 40 of the element to be tested 20, it indicates that the element to be tested 20 has a defect, and the defect includes flipping.

[0092] In one embodiment, the defect type of the component 20 to be detected can be determined by the defect detection model of the target component 30. The defect detection model of the target component 30 can be trained by a large amount of real data, so the defect type of the component 20 to be detected obtained by using the target defect model is more accurate. Furthermore, the defect information of the component 20 to be detected (e.g., the position of the detection box 40, the size of the detection box 40, or the image within the detection box 40) is input for comparison. Based on the comparison rules and the defect information of the component 20 to be detected, the defect detection result of the component 20 to be detected is obtained, which can distinguish the defect types corresponding to different components 20 to be detected, thereby improving the accuracy of defect detection of the component 20 to be detected.

[0093] Please see Figure 4 , Figure 4 This is a schematic diagram of one embodiment of the repair system of this application. The repair system 200 includes an acquisition module 210, a matching module 220, a positioning module 230, and a repair module 240 connected in sequence.

[0094] The acquisition module 210 is used to acquire the location information and defect type of the target element 30 with defects on the target substrate 10 to be repaired;

[0095] Matching module 220 is used to determine repair parameters that match the target component 30 based on the type of defect;

[0096] The positioning module 230 is used to position the target element 30 on the target substrate 10 according to the position information.

[0097] Repair module 240 is used to repair the target component 30 according to the repair parameters after positioning.

[0098] The repair system 200 implements the method steps in any of the above embodiments when it is working. For detailed steps, please refer to the above embodiments, which will not be repeated here.

[0099] Please see Figure 5 , Figure 5This is a schematic diagram of one embodiment of the electronic device of this application. The electronic device 300 includes a processor 310, a memory 320, and a communication circuit 330. The processor 310 is coupled to the memory 320 and the communication circuit 330 respectively. The memory 320 stores program data. The processor 310 executes the program data in the memory 320 to implement the steps in any of the above-described embodiments. The detailed steps can be found in the above embodiments and will not be repeated here.

[0100] Among them, electronic device 300 can be any device with algorithm processing capabilities, such as a computer or mobile phone, without any restrictions.

[0101] Please see Figure 6 , Figure 6 This is a schematic diagram of one embodiment of the computer-readable storage medium of this application. The computer-readable storage medium 400 stores a computer program 410, which can be executed by a processor to implement the steps in any of the above methods.

[0102] Specifically, the computer-readable storage medium 400 can be a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, or a device that can store the computer program 410. Alternatively, it can be a server that stores the computer program 410, which can send the stored computer program 410 to other devices for execution, or it can run the stored computer program 410 itself.

[0103] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A method for repairing a substrate, characterized in that, The repair method includes: Obtain the location information and defect type of the target component with defects on the target substrate to be repaired; Based on the type of defect, determine the repair parameters that match the target component; Based on the location information, the target element is positioned on the target substrate; After positioning, the target component is repaired according to the repair parameters.

2. The repair method according to claim 1, characterized in that, The step of repairing the target component according to the repair parameters includes: Adjust the laser beam according to the repair parameters; The target component is repaired using the laser beam. Preferably, the repair parameters include at least one of the following: laser wavelength, laser energy, laser spot shape, and laser spot size that match the target element.

3. The repair method according to claim 1, characterized in that, The step of obtaining the location information and defect type of the target component with defects on the target substrate to be repaired includes: Obtain the target file sent by the appearance inspection equipment; Extract the location information of the target element and the type of defect from the target file.

4. The repair method according to claim 3, characterized in that, The position information of the target element includes the standard coordinates of the target element in the target coordinate system and the offset of the target element; The step of positioning the target element on the target substrate based on the position information includes: After establishing the target coordinate system on the target substrate, the target element is positioned on the target substrate according to the standard coordinates and the offset.

5. The repair method according to claim 1, characterized in that, The step of obtaining the location information and defect type of the target component with defects on the target substrate to be repaired includes: Acquire a target image, wherein the target image includes the target substrate and various components to be detected located on the target substrate; A detection box is generated for each of the elements to be detected in the target image; For each of the elements to be detected, the position information of the element to be detected is determined based on the position information of the detection frame of the element to be detected; For each of the elements to be detected, in response to the fact that the position of the detection frame of the element to be detected, the size of the detection frame, or the image within the detection frame does not meet the preset conditions, it is determined that the element to be detected is a target element with defects, and further, the type of defect of the target element is determined based on at least one of the position of the detection frame, the size of the detection frame, or the image within the detection frame.

6. The repair method according to claim 5, characterized in that, The step of determining that the target element is defective in response to the position of the detection frame of the element to be detected, the size of the detection frame, or the image within the detection frame not meeting preset requirements, and further determining the type of defect of the target element based on at least one of the position of the detection frame, the size of the detection frame, and the image within the detection frame, includes: In response to the offset of the center point of the detection frame relative to the standard center, it is determined that the element to be detected is the target element with a defect, and further determined that the type of defect of the target element includes offset; In response to the ratio of the length to the width of the detection frame being less than a first threshold, it is determined that the element to be detected is the target element with a defect, and the defect type of the target element is further determined to include rotation; In response to the detection frame having an area less than an area threshold and a length-to-width ratio greater than a second threshold, the element to be detected is determined to be a defective target element, and the defect type of the target element is further determined to include vertical crystal. In response to the detection frame having an area less than an area threshold, and the length direction of the detection frame not being a preset first direction and the width direction of the detection frame not being a preset second direction, it is determined that the element to be detected is the target element with a defect, and the defect type is further determined to include transverse vertical crystal.

7. The repair method according to claim 5, characterized in that, The step of determining that the target element is defective in response to the position of the detection frame of the element to be detected, the size of the detection frame, or the image within the detection frame not meeting preset requirements, and further determining the type of defect of the target element based on at least one of the position of the detection frame, the size of the detection frame, and the image within the detection frame, includes: For each of the elements to be tested, in response to the presence of an electrode in the image within the detection frame of the element to be tested, it is determined that the element to be tested is the target element with a defect, and the defect type is further determined to include crystal flipping.

8. A repair system, characterized in that, The repair system includes: The acquisition module is used to acquire the location information and defect type of the target component with defects on the target substrate to be repaired. A matching module is used to determine repair parameters that match the target component based on the type of defect. A positioning module is used to position the target element on the target substrate according to the position information; The repair module is used to repair the target component according to the repair parameters after positioning.

9. An electronic device, characterized in that, The method includes a processor and a memory, the processor being coupled to the memory, the memory storing program data, and the processor executing the program data in the memory to implement the steps of the method as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that can be executed by a processor to implement the steps of the method as described in any one of claims 1-7.

Images