Semiconductor processing device and process and semiconductor equipment

Abstract

The invention belongs to the technical field of semiconductor processing, and discloses a semiconductor processing device and process and semiconductor equipment. The semiconductor processing device comprises a processing cavity, a sealing cover, a connecting mechanism and a horizontal adjusting piece. The sealing cover can be butted and sealed with the processing cavity; the connecting mechanism and the sealing cover are connected up and down through a connecting column, and a moving space allowing the sealing cover to move horizontally and vertically is constructed between the connecting mechanism and the sealing cover through the connecting column; the horizontal adjusting piece is used for horizontally adjusting the horizontal moving distance of the sealing cover in the horizontal transverse direction or / and the horizontal longitudinal direction. Therefore, when the semiconductor processing device is used, not only can the position of the sealing cover be adjusted in a large range through the horizontal adjusting piece, but also a moving space can be formed on the sealing cover, so that the sealing cover can form a corresponding inclination amplitude along with the position change in the lifting process of the processing cavity; therefore, the sealing cover and the processing cavity can form better sealing butt joint, and the possibility of air leakage or liquid leakage at the butt joint of the sealing cover and the processing cavity is effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more particularly to semiconductor processing apparatus, processes and equipment. Background Technology

[0002] With the trend of semiconductor manufacturing moving towards higher precision and higher integration, cleaning processes, as a critical step, aim to thoroughly remove micron-level contaminants from the surface of wafers or packages while avoiding mechanical or chemical damage to the products. Closed-loop spray cleaning technology, with its controllable cleaning environment and high liquid utilization rate, has become the mainstream solution for advanced processes (such as 5nm and below).

[0003] In the prior art, spray cleaning equipment consists of a support structure, spray components, a treatment chamber and a sealing cover: the product is fixed on the support structure (such as a vacuum adsorption chuck), the spray components are adjusted to a position relative to the product surface by the spray arm or fixed bracket, and then the sealing cover is closed with the treatment chamber under the action of the drive mechanism (such as a cylinder) to form a closed space for spray cleaning.

[0004] The equipment achieves functional integration through step-by-step operation, but the mechanism of independent positioning of each link leads to the accumulation of mechanical tolerances. For example, the positioning error of the load-bearing structure, the adjustment deviation of the spray component and the closing deviation of the sealing cover may be superimposed on each other, ultimately affecting the overall docking accuracy. When the processing chamber and the sealing cover deviate from each other, local air or liquid leakage will occur at the docking point. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor processing apparatus, process, and semiconductor equipment to solve the problem that in the prior art, when cleaning equipment cleans products, the accumulation of mechanical tolerances due to the independent positioning mechanism of each environment can easily lead to misalignment between the processing chamber and the sealing cover, as well as between the spray assembly and the product, resulting in poor sealing effect and leakage of air or liquid during the processing.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, this application provides a semiconductor processing apparatus, comprising:

[0008] The processing chamber can move up and down under the drive of external forces;

[0009] A sealing cap is positioned directly above the processing chamber. When the processing chamber moves upward toward the sealing cap, the lower annular part of the sealing cap can mate and seal with the annular opening of the processing chamber.

[0010] A connecting mechanism is disposed above the sealing cover and is vertically connected to the sealing cover via a connecting post disposed below the connecting mechanism. A moving space is constructed between the connecting mechanism and the sealing cover via the connecting post, allowing the sealing cover to move horizontally and vertically. The vertical distance between the connecting mechanism and the sealing cover defined by the moving space is greater than the maximum distance that the sealing cover can move in the vertical direction, so that the sealing cover will not collide with the connecting mechanism when it moves vertically.

[0011] A horizontal adjustment component is disposed above the connecting mechanism for horizontally adjusting the horizontal movement distance of the sealing cover in the horizontal transverse direction and / or horizontal longitudinal direction;

[0012] Specifically, when the processing chamber moves upward toward the sealing cover and mates with the sealing cover to seal, the sealing cover achieves a mating seal between the annular lower part of the sealing cover and the annular opening of the processing chamber through adaptive adjustment of horizontal and vertical movement.

[0013] Optionally, the sealing cap has an injection port that communicates with the injection system, through which external gas can enter the processing chamber to regulate the gas pressure inside the processing chamber.

[0014] Optionally, the semiconductor processing apparatus further includes:

[0015] A first driving member is connected to the processing cavity to drive at least one of the processing cavities to move up and down and mate with the corresponding sealing cover for sealing.

[0016] Optionally, the leveling member includes:

[0017] A crossbeam is disposed on the side of the connecting mechanism away from the sealing cover. The connecting mechanism has a plurality of first adjustment holes extending along a first direction. A first adjustment member is movably connected in each of the first adjustment holes. The first adjustment member is connected to the crossbeam and can be engaged with the connecting mechanism.

[0018] A longitudinal beam is fixedly connected to the cross beam and extends along a second direction. The longitudinal beam has multiple second adjustment holes extending along the second direction. A second adjustment component is inserted into each second adjustment hole. The second adjustment component is connected to the fixed platform.

[0019] Wherein, the first direction intersects with the second direction.

[0020] Optionally, there are multiple connecting posts, the connecting mechanism is connected above the connecting posts, the connecting posts have a vertical protrusion below, the vertical protrusion has the same vertical center line as the connecting posts, and the area of ​​the horizontal cross-section of the vertical protrusion is smaller than the area of ​​the horizontal cross-section of the connecting posts above the vertical protrusion.

[0021] The vertical protrusion passes through the elastic element in the connection hole provided on the sealing cover, so that the entire vertical protrusion and part of the connecting post above the vertical protrusion pass through the connection hole, and the connecting post above the vertical protrusion and the sealing cover are elastically connected through the elastic element between them. The elastic connection allows the sealing cover to move vertically between the longest deformation and the shortest deformation caused by the compression of the elastic element between the connecting post and the sealing cover.

[0022] The size of the connecting hole matches the size of the connecting post above the vertical protrusion. The elastic element is used to deform by the extrusion force transmitted by the sealing cover when the processing cavity moves upward toward the sealing cover and connects with the sealing cover to adjust the vertical movement distance of the sealing cover, so that the lower annular part of the sealing cover can connect and seal with the annular opening of the processing cavity.

[0023] Optionally, the semiconductor processing apparatus further includes: a spray assembly, the spray assembly comprising:

[0024] A second driving component is disposed on the sealing cover;

[0025] A spray arm is disposed at the output end of the second drive member. The spray arm has a water channel and a plurality of spaced nozzles communicating with the water channel. The plurality of nozzles include a first nozzle corresponding to the center of the product and a second nozzle corresponding to the edge of the product.

[0026] Optionally, the spray assembly further includes:

[0027] A connecting seat is disposed inside the sealing cover and fixedly connected to the second driving component. The spray arm is rotatably connected to the connecting seat via a connecting shaft. A first sealing element is disposed on the inner side of the connecting seat and sealed to the connecting shaft, and a second sealing element is disposed on the outer side of the connecting seat and sealed to the sealing cover.

[0028] Optionally, a sealing end cap is provided on the side of the connecting seat near the spray arm, and the sealing end cap is sealed and fitted to the connecting shaft.

[0029] In a second aspect, the present invention provides a semiconductor processing technology applied to a semiconductor processing apparatus as described in any one of the first aspects, comprising:

[0030] After placing the product into the processing chamber, the processing chamber is moved upward and tilted to connect and seal with the sealing cover;

[0031] The sealed processing chamber is then evacuated and the air pressure is regulated.

[0032] The product is driven to rotate and processed within the sealed processing chamber;

[0033] Once the product processing is complete and the air pressure inside and outside the processing chamber is balanced, the product is removed from the processing chamber.

[0034] Thirdly, this application also provides a semiconductor device, characterized in that the semiconductor device includes a semiconductor processing apparatus as described in any one of the first aspects.

[0035] Optionally, the semiconductor device includes at least an electroplating device, and correspondingly, the semiconductor processing apparatus includes a pretreatment device before performing the electroplating process or a cleaning device after performing the electroplating process.

[0036] The beneficial effects of this invention are:

[0037] Firstly, before processing the product, the sealing cap is moved horizontally within the horizontal plane by a leveling device to align with the processing chamber. During processing, the product is placed inside the processing chamber, and an external force moves the processing chamber closer to the sealing cap. When the processing chamber and the sealing cap align, the sealing cap moves within the movable space created by the connecting mechanism and connecting column, allowing it to tilt according to the position of the processing chamber. Once they are pressed together, the lower annular part of the sealing cap aligns and seals with the annular opening of the processing chamber, thus enclosing the product within the processing chamber for processing. Therefore, this semiconductor processing device, in use, not only allows for wide-range adjustment of the sealing cap's position via the leveling device but also creates a movable space on the sealing cap, enabling it to tilt according to the position changes during the raising and lowering of the processing chamber. This ensures a good seal between the sealing cap and the processing chamber, effectively reducing the possibility of air or liquid leakage at the connection point and thus significantly improving the processing effect on the product.

[0038] Secondly, after the product is placed, the processing chamber is sealed by tilting the sealing cover and the processing chamber. The product is then processed inside the sealed processing chamber, such as by spray cleaning. After the processing is completed, the air pressure inside and outside the processing chamber is balanced so that the sealing cover can be easily opened and the processed product can be taken out. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the structure of the semiconductor processing device when the sealing cover is separated from the processing cavity in an embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of the structure of the semiconductor processing device when the sealing cover and the processing cavity are connected and sealed in an embodiment of the present invention;

[0041] Figure 3 This is a schematic diagram of the internal structure of the sealing cover of the semiconductor processing device in an embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of the structure of the top side of the sealing cover of the semiconductor processing device in an embodiment of the present invention;

[0043] Figure 5 This is a structural cross-sectional view of the sealing cover and connecting mechanism of the semiconductor processing device in an embodiment of the present invention;

[0044] Figure 6 This is a schematic diagram of the connection mechanism of the semiconductor processing device in an embodiment of the present invention;

[0045] Figure 7 This is a schematic diagram of the structure of the horizontal adjustment component of the semiconductor processing device in an embodiment of the present invention;

[0046] Figure 8 This is a schematic diagram of the structure of the spray assembly of the semiconductor processing device in an embodiment of the present invention;

[0047] Figure 9 This is a cross-sectional view of the spray assembly of the semiconductor processing device in an embodiment of the present invention;

[0048] Figure 10 This is a cross-sectional view of the sealing cover of the semiconductor processing device in an embodiment of the present invention;

[0049] Figure 11 This is a schematic diagram of the sealing cover and flow guiding cavity of the semiconductor processing device in an embodiment of the present invention;

[0050] Figure 12 This is a schematic diagram of the structure of the carrier component of the semiconductor processing device in an embodiment of the present invention;

[0051] Figure 13 This is a cross-sectional view of the support cylinder of the support component of the semiconductor processing device in an embodiment of the present invention;

[0052] Figure 14 This is a structural cross-sectional view of the carrier cylinder, carrier frame, and rotary drive component of the carrier assembly of the semiconductor processing device in an embodiment of the present invention.

[0053] Figure 15 This is a schematic diagram of the structure of the support frame of the semiconductor processing device in an embodiment of the present invention;

[0054] Figure 16 This is a schematic flowchart of the semiconductor processing technology in an embodiment of the present invention.

[0055] In the picture:

[0056] 10. Base;

[0057] 1. Processing chamber; 11. Drive frame;

[0058] 2. Sealing cap; 21. Air injection port; 22. Sealing ring; 23. Flow guide cavity; 24. Flow guide slope; 25. Connecting hole; 26. Elastic element;

[0059] 3. First driving component;

[0060] 4. Bearing assembly; 41. Bearing cylinder; 411. Exhaust channel; 412. Flange; 413. Cylinder body; 414. Main body; 415. Mounting sleeve; 42. Bearing frame; 421. Mounting part; 422. Bearing rod; 423. Bearing block; 43. Rotary drive component; 44. Sealing expansion sleeve; 441. Pressure ring; 442. Fixing cover;

[0061] 5. Spray assembly; 51. Second drive unit; 52. Spray arm; 521. Connector; 53. First nozzle; 54. Second nozzle; 55. Third nozzle; 56. Connecting shaft; 57. Connector; 58. Connecting seat; 581. First seal; 582. Second seal; 59. Sealing end cap;

[0062] 6. Connecting mechanism; 61. First adjusting hole; 611. Mounting protrusion; 612. Third adjusting component;

[0063] 7. Horizontal adjustment component; 71. Crossbeam; 72. Longitudinal beam; 73. Second adjustment hole;

[0064] 8. Connecting post; 81. Vertical protrusion;

[0065] X, first direction;

[0066] Y, the second direction. Detailed Implementation

[0067] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0068] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0069] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0070] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0071] like Figures 1 to 16 As shown, the present invention provides a semiconductor processing apparatus, process, and semiconductor equipment.

[0072] Reference Figures 1 to 3 The semiconductor processing device includes a processing chamber 1, a sealing cover 2, a connecting mechanism 6, and a horizontal adjustment component 7. The processing chamber 1 can move up and down under the drive of an external force; the sealing cover 2 is correspondingly located above the processing chamber 1. When the processing chamber 1 moves upward toward the sealing cover 2, the lower annular part of the sealing cover 2 can be abutted and sealed with the annular opening of the processing chamber 1; the connecting mechanism 6 is located above the sealing cover 2 and is vertically connected to the sealing cover 2 through the connecting post 8 located below the connecting mechanism 6. The connecting mechanism 6 and the sealing cover 2 are connected by the connecting post 8 to form a moving space that allows the sealing cover 2 to move horizontally and vertically. The vertical distance between the connecting mechanism 6 and the sealing cover 2 defined by the moving space is greater than the maximum distance that the sealing cover 2 can move in the vertical direction, so that the sealing cover 2 will not collide with the connecting mechanism 6 when it moves vertically; the horizontal adjustment component 7 is located above the connecting mechanism 6 and is used to horizontally adjust the horizontal moving distance of the sealing cover 2 in the horizontal lateral direction and / or the horizontal longitudinal direction; wherein, when the processing chamber 1 moves upward toward the sealing cover 2 and abuts and seals with the sealing cover 2, the sealing cover 2 achieves the abutment and seal between the lower annular part of the sealing cover 2 and the annular opening of the processing chamber 1 through adaptive adjustment of horizontal and vertical movement.

[0073] Before processing the product, the sealing cover 2 is moved horizontally in the horizontal plane by the horizontal adjustment component 7 so that the sealing cover 2 corresponds to the processing chamber 1. During product processing, the product is placed in the processing chamber 1, and an external force moves the processing chamber 1 closer to the sealing cover 2. When the processing chamber 1 and the sealing cover 2 are aligned, the sealing cover 2 can move within the moving space constructed by the connecting mechanism 6 and the connecting column 8, allowing the sealing cover 2 to tilt according to the different positions of the processing chamber 1. When the two are pressed together, the lower annular part of the sealing cover 2 can align and seal with the annular opening of the processing chamber 1, thereby enclosing the product within the processing chamber 1 for processing. Therefore, when using this semiconductor processing device, not only can the position of the sealing cover 2 be adjusted within a wide range by the horizontal adjustment component 7, but a moving space can also be formed on the sealing cover 2, allowing the sealing cover 2 to tilt according to the position changes during the lifting and lowering of the processing chamber 1. This ensures a good sealing connection between the sealing cover 2 and the processing chamber 1, effectively reducing the possibility of air or liquid leakage at the connection point, thereby effectively improving the processing effect of the product.

[0074] Specifically, the processing chamber 1 is cylindrical and can be slidably connected to the base 10 and move vertically. A first driving member 3 is provided on the base 10, located on one side of the processing chamber 1. This first driving member 3 can be a cylinder or a motor working in conjunction with a transmission rod to achieve the lifting drive; this invention does not limit the specific type. To improve processing efficiency, multiple processing chambers 1 can be spaced apart. Each processing chamber 1 is equipped with a driving frame 11, and multiple driving frames 11 are connected to the first driving member 3. This allows the first driving member 3 to synchronously drive multiple processing chambers 1 to move up and down and dock with the corresponding sealing caps 2 for sealing. This allows for simultaneous processing of multiple products. The first driving member 3 can also sequentially drive each processing chamber 1 to move up and down and dock with the corresponding sealing cap 2 for sealing. The specific driving sequence can be designed according to the actual process requirements. In this embodiment, two processing chambers 1 are spaced apart.

[0075] A sealing cover 2 is installed above the processing chamber 1. After the first driving member 3 drives the processing chamber 1 to rise and dock with the sealing cover 2, the sealing cover 2 can press against the cavity wall of the processing chamber 1 to seal the processing chamber 1. In order to improve the sealing performance, a sealing ring 22 is provided around the lower end of the sealing cover 2, and a protrusion or groove structure that can be inserted and mated with the sealing ring 22 is provided at the upper end of the processing chamber 1, so that the sealing cover 2 can smoothly seal the processing chamber 1 after docking with the processing chamber 1. The processing chamber 1 may have a slight positional shift during the lifting and lowering process. The sealing cover 2 is installed on the corresponding fixed platform through the connecting mechanism 6 and the horizontal adjustment member 7. The connecting mechanism 6 and the sealing cover 2 are spaced apart in the vertical direction, and the connecting column 8 and the sealing cover 2 maintain a moving interval in the horizontal direction. Thus, the components form a corresponding moving space, so that the sealing cover 2 can move vertically and horizontally, and its movement range is adapted to the positional changes of the processing chamber 1 during the lifting and lowering process.

[0076] Reference Figures 4 to 7 Optionally, multiple connecting posts 8 are provided. A connecting mechanism 6 is connected above the connecting post 8. The connecting post 8 has a vertical protrusion 81 below it. The vertical protrusion 81 has the same vertical centerline as the connecting post 8, and the area of ​​its horizontal cross-section is smaller than the area of ​​the horizontal cross-section of the connecting post 8 above it. The vertical protrusion 81 passes through an elastic element 26 in a connecting hole 25 on the sealing cover 2, such that the entire vertical protrusion 81 and a portion of the connecting post 8 above it pass through the connecting hole 25. The connecting post 8 above the vertical protrusion 81 and the sealing cover 2 are connected by the […]. The elastic element 26 forms an elastic connection, which allows the sealing cap 2 to move vertically between the longest and shortest deformations caused by the compression between the elastic element 26 and the connecting post 8. The size of the connecting hole 25 matches the size of the connecting post 8 above the vertical protrusion 81. The elastic element 26 is used to deform by the extrusion force transmitted by the sealing cap 2 when the processing chamber 1 moves upward toward the sealing cap 2 and seals with the sealing cap 2, so as to adjust the vertical movement distance of the sealing cap 2, so that the lower annular part of the sealing cap 2 can be sealed with the annular opening of the processing chamber 1.

[0077] Specifically, the connecting mechanism 6 is plate-shaped, with mounting protrusions 611 provided at its edge. Each mounting protrusion 611 houses a connecting post 8. The connecting post 8 and the mounting protrusion 611 can be integrally formed or fixedly connected by fasteners or other structures. The end of the connecting post 8 furthest from the mounting protrusion 611 is connected to the sealing cover 2, allowing the sealing cover 2 to move synchronously with the connecting mechanism 6.

[0078] To adjust the flatness of the sealing cover 2, a third adjusting member 612 is installed downwards on the top wall of the mounting protrusion 611. The third adjusting member 612 can be a bolt or a screw, etc. It can be rotatably connected to the mounting protrusion 611 and threadedly connected to the connecting post 8, or rotatably connected to the connecting post 8 and threadedly connected to the mounting protrusion 611. Thus, by rotating the third adjusting member 612, the length of the connecting post 8 inserted into the mounting protrusion 611 can be adjusted, thereby adjusting the connection length between the connecting post 8 and the connecting mechanism 6. Adjusting any one or several of the connecting posts 8 can adjust the flatness of the sealing cover 2. In this embodiment, the connecting mechanism 6 is rectangular, with a connecting post 8 at each of the four corners of the connecting mechanism 6 to facilitate understanding the relative positions of the connecting posts 8 during adjustment and simplify the adjustment operation.

[0079] A vertical protrusion 81 is provided at the end of the connecting post 8 away from the mounting protrusion 611. The vertical protrusion 81 can be inserted into the connecting hole 25 on the sealing cover 2. The diameter of the connecting hole 25 is larger than the diameter of the connecting post 8, so that a gap is formed between the connecting post 8 and the connecting hole 25, thereby allowing the sealing cover 2 to be raised or lowered locally. An elastic element 26 is provided in the connecting hole 25. The vertical protrusion 81 is inserted into the elastic element 26 and connected to the elastic element 26. The elastic element 26 has an elastic tendency to restrict the movement of the sealing cover 2 relative to the connecting post 8. The elastic element 26 can be a butterfly spring or other elastic structure.

[0080] When the sealing cover 2 separates from the processing chamber 1, the elastic element 26 can automatically reset the sealing cover 2. When the processing chamber 1 and the sealing cover 2 are connected, the sealing cover 2 can not only tilt synchronously with the processing chamber 1, but also slide a certain distance along the axial direction of the connecting column 8. When the processing chamber 1 and the sealing cover 2 are connected, a certain buffer is formed. At the same time, the sealing cover 2 will also compress the elastic element 26 when sliding. When the sealing cover 2 and the processing chamber 1 are closed, the elastic tendency generated by the elastic element 26 can press the sealing cover 2 tightly onto the processing chamber 1, thereby improving the sealing performance. A pressure gauge can also be installed on the top wall of the sealing cover 2. The pressure gauge can detect the pressure inside the processing chamber 1 in real time during the vacuuming process and can generate a signal to stop vacuuming when the expected pressure is reached.

[0081] To ensure that the sealing cover 2 remains aligned with the processing chamber 1, the sealing cover 2 can be adjusted to a greater extent in the plane using the horizontal adjustment member 7. Optionally, the horizontal adjustment member 7 includes a crossbeam 71 and a longitudinal beam 72. The crossbeam 71 is located on the side of the connecting mechanism 6 away from the sealing cover 2. The connecting mechanism 6 has multiple first adjustment holes 61 extending along the first direction X. Each first adjustment hole 61 is movably connected to a first adjustment member. The first adjustment member is connected to the crossbeam 71 and can engage with the connecting mechanism 6. The longitudinal beam 72 is fixedly connected to the crossbeam 71 and extends along the second direction Y. The longitudinal beam 72 has multiple second adjustment holes 73 extending along the second direction Y. Each second adjustment hole 73 has a second adjustment member passing through it. The second adjustment member is connected to the fixed platform.

[0082] Specifically, multiple through holes are formed in the connecting mechanism 6 as first adjustment holes 61. A first adjustment member, such as a bolt or a pin, is inserted into the first adjustment hole 61. The first adjustment member can be fixedly connected to the crossbeam 71 and can slide within the first adjustment hole 61, allowing the connecting mechanism 6 to move along the first direction X. After moving a specified distance, it can engage with the connecting mechanism 6 to lock it in place. To ensure stability during adjustment, multiple first adjustment holes 61 are distributed on both sides of the connecting mechanism 6 along the second direction Y. In this embodiment, two first adjustment holes 61 are provided on each side of the connecting mechanism 6 along the second direction Y. To reduce the weight of the connecting mechanism 6, multiple through holes are provided to form a hollow structure. To improve the load-bearing capacity of the connecting mechanism 6, a reinforcing rib is provided on the side of the connecting mechanism 6 near the sealing cover 2. The reinforcing rib can be welded or bonded to the connecting mechanism 6.

[0083] The crossbeam 71 extends along the first direction X, and its bottom wall can be welded or bonded to the top wall of the connecting mechanism 6. Multiple crossbeams 71 can be distributed at intervals along the second direction Y. Connecting ears corresponding to the first adjustment hole 61 are provided on the side wall of the crossbeam 71. The first adjusting member passes through the first adjustment hole 61 and is fixedly connected to the connecting ear.

[0084] The longitudinal beams 72 are welded or bonded to the transverse beams 71, and multiple longitudinal beams 72 are distributed at intervals along the first direction X. In this embodiment, two transverse beams 71 and two longitudinal beams 72 are provided to enclose and form a rectangular frame. In other embodiments, one transverse beam 71 and one longitudinal beam 72 may also be provided, in which case they are arranged in a cross pattern. Three or more transverse beams 71 and three or more longitudinal beams 72 may also be provided, depending on the actual installation strength.

[0085] A through hole is formed in the longitudinal beam 72 as a second adjustment hole 73. The second adjustment hole 73 extends along the second direction Y and is fitted with a second adjustment member. The second adjustment member can be a bolt or a pin, etc., and can be connected to a corresponding fixed platform. The fixed platform can be the inner wall of the roof or a specially designed platform structure; this application does not limit this. The second adjustment member can slide within the second adjustment hole 73 and can be locked to the longitudinal beam 72 at any position. To facilitate the installation of the second adjustment member, the connecting mechanism 6 has a clearance notch at the position corresponding to the second adjustment member.

[0086] By using the connecting mechanism 6 and the horizontal adjustment component 7, when it is necessary to adjust the position of the sealing cover 2, the connecting mechanism 6 can be moved along the first direction X, and the connecting mechanism 6 will synchronously drive the sealing cover 2 to move in the first direction X. The horizontal adjustment component 7 can also be moved along the second direction Y, and the horizontal adjustment component 7 can drive the connecting mechanism 6 and the sealing cover 2 to move synchronously along the second direction Y. Thus, the position of the sealing cover 2 can be adjusted in the first direction X and the second direction Y respectively, ensuring that the sealing cover 2 is aligned with the processing cavity 1, so that the two can effectively seal the processing cavity 1 after docking.

[0087] Once the sealing cap 2 is connected and sealed with the processing chamber 1, the product can be processed using the spray assembly 5. The spray assembly 5 can use liquids such as ultrapure water to clean the product.

[0088] Reference Figure 8 and Figure 9 Optionally, the semiconductor processing apparatus further includes a spray assembly 5. The spray assembly 5 includes a second drive member 51 and a spray arm 52. The second drive member 51 is disposed on the sealing cover 2; the spray arm 52 is disposed at the output end of the second drive member 51, and the spray arm 52 has a water channel and a plurality of spaced nozzles communicating with the water channel. The plurality of nozzles includes a first nozzle 53 corresponding to the center of the product and a second nozzle 54 corresponding to the edge of the product.

[0089] Specifically, the spray arm 52 is elongated and can extend in an arc shape to cover a larger area. Water channels are pre-embedded inside the spray arm 52, and a connector 521 communicating with these channels is located on the top wall of the spray arm 52. The connector 521 connects to a liquid injection system via a hose, which continuously supplies the water channels with liquid for cleaning the product, such as ultrapure water. Multiple nozzles are spaced apart on the bottom wall of the spray arm 52. These nozzles compress the liquid into a high-speed spray, which can be conical or fan-shaped. The nozzles are distributed along the length of the spray arm 52, and since the length of the spray arm 52 is close to the diameter of the product, some nozzles correspond to the center area of ​​the product, while others correspond to the edge area. In this embodiment, a first nozzle 53 is provided in the middle of the spray arm 52, and a second nozzle 54 is provided at the end. When the length of the spray arm 52 is close to the diameter of the product, the first nozzle 53 can correspond to the center of the product, and the second nozzle 54 can correspond to the edge of the product. Thus, during the cleaning process, the first nozzle 53 cleans the center of the product, and the second nozzle 54 cleans the edge of the product.

[0090] Optionally, the nozzle also includes a third nozzle 55, with the first nozzle 53 located between the third nozzle 55 and the second nozzle 54, so that the third nozzle 55 can also clean the edges of the product. The third nozzle 55 further increases the cleaning coverage area, ensuring that there are no cleaning blind spots between the multiple nozzles. It should be understood that the specific number of nozzles can be designed according to the actual product size; only the first nozzle 53 and the second nozzle 54 may be provided, or a fourth nozzle may be added, etc. The present invention does not impose a specific limitation in this regard, and the cleaning areas between the multiple nozzles may or may not overlap.

[0091] The second drive unit 51 can be connected to the spray arm 52 using a servo motor and transmission rod, or it can be connected to the spray arm 52 using a cylinder. When cleaning the product, the second drive unit 51 drives the spray arm 52 to swing back and forth. The spray arm 52 synchronously drives multiple nozzles to swing back and forth, so that multiple nozzles can clean the center and edges of the product at the same time, reducing the occurrence of "blind spots in edge cleaning", effectively improving the cleaning effect, and ensuring that the expected requirements are met after cleaning the product.

[0092] In order to improve the flexibility of the spray arm 52, the distance between the spray arm 52 and the second drive component 51 can be adjusted, so as to facilitate the adjustment of the distance between the spray arm 52 and the product.

[0093] Optionally, the spray assembly 5 further includes a connecting shaft 56 and a connector 57. One end of the connecting shaft 56 is connected to the second drive member 51, and the other end is slidably connected to the spray arm 52; the connector 57 is connected to the connecting shaft 56 and can be locked with the spray arm 52, and the connector 57 is used to adjust the height of the spray arm 52.

[0094] Specifically, the second driving component 51 is a swing cylinder, which is fixed inside the sealing cover 2. The upper end of the connecting shaft 56 is fixedly connected to the output end of the second driving component 51 so that the connecting shaft 56 and the output end of the second driving component 51 rotate synchronously, while the lower end of the connecting shaft 56 passes through one end of the spray arm 52, and the two can slide along the axial direction of the connecting shaft 56.

[0095] The connector 57 can be a pin or a threaded sleeve. When a pin is used, it can be inserted into the spray arm 52 and the connecting shaft 56 in sequence to lock them together. When a threaded sleeve is used, it can engage with the spray arm 52 and be threadedly connected to the connecting shaft 56, thus locking the spray arm 52 to the connecting shaft 56. In this embodiment, to further simplify the structure, the connector 57 is threadedly connected to the connecting shaft 56, and two connectors 57 are spaced apart, distributed at the upper and lower ends of the spray arm 52. This allows adjustment of the height of the spray arm 52, facilitating adjustment of the distance between the nozzle and the product to ensure optimal cleaning effect.

[0096] To ensure airtightness during product processing and prevent possible air leakage at the connection between the connecting shaft 56 and the second drive component 51, a sealing structure is provided at the connection between the connecting shaft 56 and the second drive component 51.

[0097] Optionally, the spray assembly 5 further includes a connecting seat 58 and a sealing end cap 59. One end of the connecting seat 58 is fixedly connected to the second drive member 51, and the end of the connecting shaft 56 away from the spray arm 52 extends into the connecting seat 58 and is rotatably connected to the connecting seat 58; the sealing end cap 59 is disposed at the end of the connecting seat 58 near the spray arm 52 and is sealed and fitted to the connecting shaft 56.

[0098] Specifically, the connecting seat 58 is fixedly connected to the second driving member 51. The upper end of the connecting shaft 56 extends into the connecting seat 58. A sealing end cap 59 is provided at the lower opening of the connecting seat 58. The sealing end cap 59 is sleeved and slidably fitted with the connecting shaft 56, thereby sealing the connection between the connecting shaft 56 and the second driving member 51 inside the connecting seat 58 to ensure airtightness between the second driving member 51 and the connecting shaft 56. A first sealing member 581 is provided on the inner wall of the connecting seat 58. The first sealing member 581 is sealed and fitted with the connecting shaft 56, thereby further sealing the gap between the connecting shaft 56 and the connecting seat 58.

[0099] Optionally, the spray assembly 5 further includes a second seal 582. The second seal 582 is disposed outside the connector 58 and is in sealing contact with the wall of the mounting hole of the connector 58.

[0100] Specifically, when the second driving component 51 is installed inside the sealing cover 2, the connecting seat 58 is correspondingly installed in the mounting hole. A mounting groove is formed on the outer wall of the connecting seat 58, and a second sealing component 582 is embedded in the mounting groove. The second sealing component 582 fits against the wall of the mounting hole, thereby sealing the gap between the connecting seat 58 and the mounting hole, further improving airtightness. Both the first sealing component 581 and the second sealing component 582 can be O-rings or X-rings. The specific sealing structure can be designed according to the actual airtightness requirements, and this invention does not impose any limitations.

[0101] Reference Figure 10 and Figure 11 During product processing, droplets may splash onto the side of the sealing cap 2 facing the processing chamber 1. To prevent droplets from adhering to the lower side of the sealing cap 2, a recessed guide cavity 23 is provided in the middle of the lower end face of the sealing cap 2. The cavity wall of the guide cavity 23 can be inclined, or it can be provided with an inclined extending plate-like structure to guide the liquid to the edge of the guide cavity 23. The edge of the guide cavity 23 can correspond to the inner wall of the processing chamber 1, so that the droplets can flow down the inner wall of the processing chamber 1. It should be noted that the inner wall of the processing chamber 1 here is not the innermost wall, but rather a channel for liquid to flow down is opened on the side wall of the processing chamber 1, and this inner wall is the inner wall of the channel.

[0102] Optionally, a guide slope 24 is provided on the cavity wall of the guide cavity 23. The guide slope 24 is in a regular or irregular arc shape from one side to the other, and the inner curved surface of the arc faces the processing cavity 1.

[0103] Specifically, the sidewalls and bottomwalls of the flow guiding cavity 23 are both inclined to form a flow guiding slope 24. A hydrophobic coating is provided on the surface of the flow guiding slope 24. This hydrophobic coating allows for more secure fixation of the collected droplets during collection and also improves the flow guidance of the collected droplets.

[0104] Optionally, the sealing cap 2 has an injection port 21 that communicates with the injection system, through which external gas can enter the processing chamber 1 to regulate the gas pressure inside the processing chamber 1.

[0105] Specifically, the air injection port 21 is located within the flow guiding cavity 23. The air injection port 21 connects to an air blowing system to blow air onto the cavity wall of the flow guiding cavity 23, thereby driving liquid flow. An air passage communicating with the air injection port 21 is provided within the sealing cover 2. This air passage is connected to the air blowing system via a pipeline, which can be a nitrogen delivery system, etc., to facilitate the injection of air into the sealed processing cavity 1 and adjust the air pressure. The flow guiding slope 24 has a first side and a second side. The distance between the first side and the processing cavity 1 is less than the distance between the second side and the processing cavity 1. The air injection port 21 is located close to the second side, and multiple air injection ports 21 are spaced apart, meaning that the air injection port 21 is located at the highest point of the flow guiding slope 24. Simultaneously, the outlets of the air injection ports 21 all face the flow guiding slope 24. Therefore, after the product processing is completed, gas can be quickly introduced through the air injection port 21, thereby rapidly driving the droplets from a high position to a low position, accelerating the droplet flow rate on the flow guiding slope 24, and further reducing the possibility of droplet fall.

[0106] Reference Figures 12 to 15 Optionally, a support assembly 4 is provided on the base 10. The support assembly 4 includes a support cylinder 41, a support frame 42, and a rotation drive 43. The support cylinder 41 has an air extraction channel 411 communicating with an air pump; the support frame 42 is rotatably connected to the top of the support cylinder 41 and is used to support the product; the rotation drive 43 is disposed inside the support cylinder 41 and connected to the support frame 42 to drive the support frame 42 to rotate.

[0107] Specifically, the support cylinder 41 is mounted on the base 10, with its upper end passing through the bottom wall of the processing chamber 1 and slidingly engaging with it. The support cylinder 41 can be formed by splicing multiple structural sections or as a complete cylindrical structure. In this embodiment, to facilitate the opening of the air extraction channel 411 inside the support cylinder 41, the support cylinder 41 is divided into multiple sections, including a flange 412, a cylinder body 413, and a main body 414. These three sections abut against each other in the vertical direction and are fixedly connected together by a locking element, such as a long bolt. They can also be bonded or welded together sequentially. Through holes are opened through the side walls of the cylinder body 413 and the main body 414, and two through holes are connected to each other to form the air extraction channel 411. An air extraction hole communicating with the above-mentioned through hole is opened on the flange 412. The port of the air extraction hole can be threaded to connect to an air extraction interface, which is connected to an air extraction pump.

[0108] The support frame 42 is rotatably connected to the top of the support cylinder 41. It includes a mounting part 421 and multiple support rods 422. The mounting part 421 is rotatably connected to the top wall of the support cylinder 41. The multiple support rods 422 are distributed at equal angular intervals around the circumference of the mounting part 421. A support block 423 is provided at the end of the support rod 422 away from the mounting part 421. An adsorption structure can be provided on the support block 423 to adsorb the bottom wall of the product and thus adsorb and fix the product on the support frame 42. The rotation drive 43 is set inside the support cylinder 41 and can be a servo motor, a rotary cylinder, etc. The present invention is not limited to this, as long as it can smoothly drive the support frame 42 to rotate.

[0109] In order to improve the sealing performance of the processing chamber 1 and ensure that the vacuum level can be maintained after the processing chamber 1 is evacuated, multiple layers of seals can be arranged between the carrier cylinder 41 and the processing chamber 1, as well as inside the carrier cylinder 41.

[0110] Optionally, the bearing cylinder 41 is slidably connected to the processing chamber 1, and a sealing telescopic sleeve 44 is sleeved around the bearing cylinder 41. One end of the sealing telescopic sleeve 44 is fixedly connected to the inner wall of the processing chamber 1, and the other end is fixedly connected to the top wall of the bearing cylinder 41.

[0111] Specifically, the sealing telescopic sleeve 44 can be a bellows, with its lower end fixed to the inner bottom wall of the processing chamber 1 by a pressure ring 441. A sealing ring 22 is provided between the pressure ring 441 and the inner wall of the processing chamber 1. The upper end of the sealing telescopic sleeve 44 is fixed to the top wall of the bearing cylinder 41 by a fixing cover 442. A sealing ring 22 is also provided between the fixing cover and the bearing cylinder 41, thereby sealing the gap between the bearing cylinder 41 and the processing chamber 1 within the sealing telescopic sleeve 44. The sealing telescopic sleeve 44 can also be implemented using other telescopic structures, such as a sleeve, etc. This invention does not limit this.

[0112] To improve the sealing performance inside the bearing cylinder 41, multiple sealing structures are distributed at intervals between the bearing frame 42 and the bearing cylinder 41.

[0113] Specifically, a mounting sleeve 415 is inserted inside the bearing cylinder 41, and a mounting part 421 is inserted inside the mounting sleeve 415 and rotatably connected to the mounting sleeve 415 via a bearing. One end of the mounting part 421 passing through the mounting sleeve 415 is fixedly connected to the output end of the rotary drive component 43 via a coupling. Multiple sealing structures, such as sealing rings 22, can be provided on both the outer and inner sides of the mounting sleeve 415 to ensure good airtightness inside the bearing cylinder 41 and to ensure that the vacuum level in the processing chamber 1 meets the cleaning requirements.

[0114] Reference Figure 16 The semiconductor processing technology is applied to the semiconductor processing apparatus described above, which includes:

[0115] Step S1: After placing the product into the processing chamber, move the processing chamber upwards and tilt it to connect and seal it with the sealing cap.

[0116] Step S2: Vacuum the sealed processing chamber and regulate the air pressure.

[0117] Step S3: Drive the product to rotate and perform process treatment on the product inside the sealed processing chamber.

[0118] Step S4: After the product processing is completed, remove the product from the processing chamber when the air pressure inside and outside the processing chamber is balanced.

[0119] Through steps S1 to S3 above, after the product is placed, the processing chamber is sealed by tilting the sealing cover and the processing chamber. The product is then processed inside the sealed processing chamber, such as by spray cleaning. After the processing is completed, the air pressure inside and outside the processing chamber is balanced so that the sealing cover can be easily opened and the processed product can be taken out.

[0120] Optionally, after the process of processing the product is stopped and before the product is removed, the semiconductor processing process further includes:

[0121] The product is driven to rotate so that the position angle interval of the product before and after the process is 0° or a second angle, so as to grasp the designated part of the product when it is taken out.

[0122] During the processing, the product is placed on a carrier frame, which rotates at high speed. After processing, the positions of the carrier frame and the product have changed. When the product is picked up by a robotic arm, the robotic arm may interfere with the carrier frame and collide. Therefore, after processing, the carrier frame continues to rotate so that the position of the product after processing coincides with its position before processing, i.e., the angle interval is 0° or the angle interval is a second angle. The size of the second angle can be designed according to the structure of the carrier frame. For example, when the carrier frame has a three-claw structure, the second angle is 120°. In this way, when the product is picked up, the robotic arm can grasp the designated part of the product, thereby ensuring that no collision or interference occurs during the removal process.

[0123] The angle range that a specific product needs to rotate after processing can be determined by sensor detection. For example, a detector is placed at a specific location, and the carrier supports the product when it corresponds to the detector. After the processing is completed, the carrier will continue to rotate until it corresponds to the detector and triggers the detector. At this time, the carrier can stop rotating, so that the position angle interval of the product before and after the processing is kept at 0° or the second angle.

[0124] The products involved in this embodiment include common names such as wafer, substrate, and substrate. It can be understood that the processing cavity 1 and sealing cover 2 involved in this embodiment can be components in different semiconductor processing devices. Specifically, they can be components in semiconductor processing devices or cleaning components in electroplating equipment.

[0125] The semiconductor equipment includes the semiconductor processing apparatus described above. The semiconductor equipment includes at least an electroplating apparatus, and correspondingly, the semiconductor processing apparatus includes a pretreatment apparatus before performing the electroplating process or a cleaning apparatus after performing the electroplating process.

[0126] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A semiconductor processing apparatus, characterized in that, include: The processing chamber (1) can move up and down under the drive of external force; The sealing cover (2) is positioned directly above the processing chamber (1). When the processing chamber (1) moves upward toward the sealing cover (2), the lower annular part of the sealing cover (2) can be connected and sealed with the annular opening of the processing chamber (1). A connecting mechanism (6) is disposed above the sealing cover (2) and is connected to the sealing cover (2) vertically via a connecting post (8) disposed below the connecting mechanism (6). The connecting mechanism (6) and the sealing cover (2) are connected by the connecting post (8) to form a moving space that allows the sealing cover (2) to move horizontally and vertically. The vertical distance between the connecting mechanism (6) and the sealing cover (2) defined by the moving space is greater than the maximum distance that the sealing cover (2) can move vertically, so that the sealing cover (2) will not collide with the connecting mechanism (6) when it moves vertically. A horizontal adjustment component (7) is disposed above the connecting mechanism (6) for horizontally adjusting the horizontal movement distance of the sealing cover (2) in the horizontal transverse direction and / or horizontal longitudinal direction; When the processing chamber (1) moves upward toward the sealing cover (2) and connects and seals with the sealing cover (2), the sealing cover (2) achieves the connection and sealing between the lower annular part of the sealing cover (2) and the annular opening of the processing chamber (1) through adaptive adjustment of horizontal and vertical movement.

2. The semiconductor processing apparatus according to claim 1, characterized in that, The sealing cap (2) has an injection hole (21) that communicates with the injection system, through which external gas can enter the processing chamber (1) to regulate the gas pressure inside the processing chamber (1).

3. The semiconductor processing apparatus according to claim 1, characterized in that, The semiconductor processing apparatus further includes: The first driving member (3) is connected to the processing chamber (1) to drive at least one of the processing chambers (1) to move up and down and to dock and seal with the corresponding sealing cover (2).

4. The semiconductor processing apparatus according to claim 1, characterized in that, The leveling element (7) includes: A crossbeam (71) is disposed on the side of the connecting mechanism (6) away from the sealing cover (2). The connecting mechanism (6) has a plurality of first adjustment holes (61) extending along a first direction (X). Each first adjustment hole (61) is movably connected to a first adjustment member. The first adjustment member is connected to the crossbeam (71) and can be engaged with the connecting mechanism (6). The longitudinal beam (72) is fixedly connected to the cross beam (71) and extends along the second direction (Y). The longitudinal beam (72) has a plurality of second adjustment holes (73) extending along the second direction (Y). A second adjustment member is inserted into each second adjustment hole (73). The second adjustment member is connected to the fixed platform. Wherein, the first direction (X) intersects with the second direction (Y).

5. The semiconductor processing apparatus according to claim 1, characterized in that, The connecting column (8) has multiple components. The connecting mechanism (6) is connected above the connecting column (8). The connecting column (8) has a vertical protrusion (81) below. The vertical protrusion (81) has the same vertical center line as the connecting column (8). The area of ​​the horizontal cross-section of the vertical protrusion (81) is smaller than the area of ​​the horizontal cross-section of the connecting column (8) above the vertical protrusion (81). The vertical protrusion (81) passes through the elastic element (26) in the connecting hole (25) provided on the sealing cover (2), so that the entire vertical protrusion (81) and part of the connecting post (8) above the vertical protrusion (81) pass through the connecting hole (25), and the connecting post (8) above the vertical protrusion (81) and the sealing cover (2) form an elastic connection through the elastic element (26) between them. The elastic connection allows the sealing cover (2) to move vertically between the longest deformation and the shortest deformation generated by the compression of the elastic element (26) between the connecting post (8) and the sealing cover (2). The size of the connecting hole (25) is matched with the size of the connecting post (8) above the vertical protrusion (81). The elastic element (26) is used to deform by the extrusion force between the sealing cover (2) and the connecting post when the processing chamber (1) moves upward toward the sealing cover (2) and connects with the sealing cover (2) to adjust the vertical movement distance of the sealing cover (2), so that the lower annular part of the sealing cover (2) can connect and seal with the annular opening of the processing chamber (1).

6. The semiconductor processing apparatus according to claim 1, characterized in that, The semiconductor processing apparatus further includes: a spray assembly (5), the spray assembly (5) comprising: The second driving component (51) is disposed on the sealing cover (2); A spray arm (52) is disposed at the output end of the second drive member (51). The spray arm (52) has a water channel and a plurality of spaced nozzles communicating with the water channel. The plurality of nozzles include a first nozzle (53) corresponding to the center of the product and a second nozzle (54) corresponding to the edge of the product.

7. The semiconductor processing apparatus according to claim 6, characterized in that, The spray assembly (5) also includes: A connecting seat (58) is disposed inside the sealing cover (2) and fixedly connected to the second driving member (51). The spray arm (52) is rotatably connected to the connecting seat (58) through a connecting shaft (56). A first sealing member (581) is provided on the inner side of the connecting seat (58) and sealed to the connecting shaft (56). A second sealing member (582) is provided on the outer side of the connecting seat (58) and sealed to the sealing cover (2).

8. The semiconductor processing apparatus according to claim 7, characterized in that, A sealing end cap (59) is provided on the side of the connecting seat (58) near the spray arm (52), and the sealing end cap (59) is sealed and fitted with the connecting shaft (56).

9. A semiconductor processing technology, characterized in that, The semiconductor processing apparatus as described in any one of claims 1 to 8 comprises: After placing the product into the processing chamber, the processing chamber is moved upward and tilted to connect and seal with the sealing cover; The sealed processing chamber is then evacuated and the air pressure is regulated. The product is driven to rotate and processed within the sealed processing chamber; Once the product processing is complete and the air pressure inside and outside the processing chamber is balanced, the product is removed from the processing chamber.

10. A semiconductor device, characterized in that, The semiconductor device includes a semiconductor processing apparatus as described in any one of claims 1 to 8.

11. The semiconductor device according to claim 10, characterized in that, The semiconductor equipment includes at least electroplating equipment, and correspondingly, the semiconductor processing apparatus includes a pretreatment device before performing the electroplating process or a cleaning device after performing the electroplating process.

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