Multifunctional solder paste printing device for ball grid array packaging device

Abstract

The invention provides a multifunctional ball grid array packaging device soldering paste printing device which comprises a device positioning assembly, the device positioning assembly is installed on a base, the positioning assembly comprises a device tray, a positioning push plate and a driving module, the positioning push plate and the driving module are arranged on the device tray, and the device tray is provided with a plurality of device grooves; the positioning push plate is provided with a plurality of device grooves, the plurality of device grooves and the plurality of device grooves are arranged in a one-to-one correspondence manner, preset points are arranged on the edges of the device grooves, and the driving module drives the positioning push plate to move so as to drive the ball grid array packaging device to move and enable the ball grid array packaging device to be in contact with the preset points; the steel mesh assembly is arranged above the device positioning assembly, the steel mesh assembly comprises a steel mesh frame and a steel mesh installed in the steel mesh frame, and the steel mesh is selected from one of a printing steel mesh and a ball mounting steel mesh; the demolding assembly is installed on the base and used for driving the steel mesh assembly to be away from or close to the positioning assembly; and a base.

Description

Technical Field

[0001] This invention relates to the field of electronic assembly tooling technology, and more specifically to a solder paste printing apparatus for multifunctional ball grid array packaged devices. Background Technology

[0002] Ball grid array (BGA) packages are a common packaging form in electronic assembly and are widely used in electronic products. Assembly involves processes such as solder paste printing, ball placement, surface mounting, and soldering on the device's pads. In high-reliability fields such as aerospace and military, there are strict standards for the assembly quality of these devices.

[0003] With the development of the aerospace and military industries, the output of electronic products has been increasing year by year, resulting in a huge number of ball grid array (BGA) packaged devices that need to be assembled. As a result, the equipment for assembling these devices is also constantly evolving. The equipment on the market is often designed for a single process. Solder paste printing, ball placement, soldering, and surface mounting of devices each rely on different process equipment. Moreover, the tooling is often designed for a single specific device, with a set of tooling for each size of device. This lacks versatility and makes it inefficient for batch assembly processes. Summary of the Invention

[0004] To address the problems existing in the prior art, the present invention provides a multifunctional ball grid array packaging device solder paste printing apparatus.

[0005] This application provides a multifunctional solder paste printing apparatus for ball grid array (BGA) packaged devices, comprising: a device positioning component mounted on a base, the positioning component including a device tray, a positioning push plate disposed on the device tray, and a driving module; the device tray having multiple device grooves, the positioning push plate having multiple device slots, the multiple device grooves and multiple device slots being configured one-to-one; preset points being provided on the edges of the device grooves; the driving module driving the positioning push plate to move, thereby moving the BGA packaged device and bringing the BGA packaged device into contact with the preset points; a stencil assembly disposed above the device positioning component, the stencil assembly including a stencil frame and a stencil installed in the stencil frame, the stencil being selected from printed stencils and ball-embedded stencils; a demolding component mounted on the base, used to drive the stencil assembly away from or towards the positioning component; and the base.

[0006] Furthermore, the aforementioned drive module includes a push plate magnet, a support column, a rack and pinion slider, a slide rail, and a slider gear. The push plate magnet is installed at one end of the support column, and the other end of the support column is installed on the rack and pinion slider. The rack and pinion slider is installed on the slide rail, and the rack and pinion slider cooperates with the slider gear. The device tray is provided with a mounting slot, and the projection of the slide rail on the device tray falls into the mounting slot. The mounting column passes through the mounting slot. The side of the positioning push plate near the device tray is provided with a positioning groove, and the push plate magnet is embedded into the positioning groove to magnetically fix the positioning push plate above the positioning push plate. The slider gear drives the rack and pinion slider to slide on the slide rail, thereby driving the positioning push plate to move synchronously in the direction of the slide rail.

[0007] Furthermore, the aforementioned multiple device grooves are obtained by translating and expanding the same rectangle on the device tray, with the preset point set at one corner of the rectangle. The multiple device slots are obtained by translating and expanding the same rectangle on the positioning push plate, and the directions of the slots and slide rails are the same as the diagonal direction drawn from the corner where the preset point is located.

[0008] Furthermore, the aforementioned push plate magnet is mounted on the support column by magnetic screws, and the support column is mounted on the rack slider by slider mounting screws. The slider gear and the knob gear are engaged, and the keyway of the knob gear is engaged with the key of the knob. By rotating the knob, the rack slider can be driven to slide on the slide rail.

[0009] Furthermore, the aforementioned device tray is mounted on the base using tray mounting screws, and the slider gear and knob gear are respectively mounted on the shaft of the base via gear bearings. The device tray is made of high-temperature resistant and anti-static non-metallic material, which is selected from one or more of reinforced substrates and high-temperature resistant resin composite materials.

[0010] Furthermore, the aforementioned steel mesh assembly includes a first direction adjustment block and a second direction adjustment block, the first direction and the second direction being perpendicular to each other. The first direction adjustment block moves the steel mesh synchronously by rotating the first direction adjustment screw away from or towards the inner edge of the steel mesh frame. The second direction adjustment block moves the steel mesh synchronously by rotating the second direction adjustment screw away from or towards the inner edge of the steel mesh frame.

[0011] Furthermore, the aforementioned first and second direction adjustment blocks are mounted on the steel mesh frame using adjustment block screws.

[0012] Furthermore, the aforementioned demolding assembly includes a lifting knob, a belt stud, a lifting stud, a transmission device, and a lifting assembly bearing. The lifting knob and the transmission stud are respectively mounted on the base via the lifting component bearing. The transmission device connects the lifting knob and the transmission stud. The transmission stud has an internal thread that mates with the external thread of the lifting stud. One end of the lifting stud is connected to the steel mesh frame. By driving the lifting knob to rotate, the transmission device drives the transmission stud to rotate synchronously, causing the lifting stud to perform lifting and lowering movements, which in turn drives the steel mesh frame to perform lifting and lowering movements. The transmission device is selected from either a transmission belt or a transmission chain.

[0013] Furthermore, the aforementioned steel mesh assembly includes a lifting locking screw, which is used to detachably fix the lifting stud to the steel mesh frame.

[0014] Furthermore, the depth of the groove in the aforementioned device is less than the thickness of the ball grid array device but greater than half the thickness of the ball grid array device, and the sum of the thickness of the positioning push plate and the depth of the device groove is less than two-thirds of the thickness of the ball grid array device.

[0015] The multifunctional ball grid array (BGA) packaging device solder paste printing apparatus of the present invention is compatible with array devices of different sizes through a universal base; it adopts a reference point setting method and uses pushers to position the device at the reference point, achieving the effect of simultaneously positioning and fixing the position of one or more devices; the printing stencil or ball-planting stencil adopts a replaceable design and is designed with a position adjustment device, reducing the processing accuracy requirements of the parts; by lifting the stencil assembly, it ensures that the printing stencil or ball-planting stencil is aligned with the reference of the device and can be stably demolded after solder paste printing or ball planting, ensuring that there is no deviation between the solder paste and the solder balls during demolding. Attached Figure Description

[0016] The following description, in conjunction with the accompanying drawings, will further illustrate the above-mentioned features, technical characteristics, advantages, and implementation methods of this application in a clear and understandable manner. The accompanying drawings are for illustrative and explanatory purposes only and do not limit the scope of this application. Wherein:

[0017] Figure 1 This is an exploded view of the solder paste printing apparatus for a multifunctional ball grid array packaging device according to an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the solder paste printing device for a multifunctional ball grid array packaging device in use according to an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the demolding component structure according to an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of a steel mesh frame structure according to an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of a device tray structure according to an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of a positioning push plate structure according to an embodiment of the present invention. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0024] This invention provides a multifunctional solder paste printing device for ball grid array (BGA) packaged devices, comprising: a device positioning component mounted on a base 1, the positioning component including a device tray 2, a positioning push plate 4 disposed on the device tray, and a driving module; the device tray 2 having multiple device grooves, the positioning push plate 4 having multiple device slots, the multiple device grooves and multiple device slots being arranged in a one-to-one correspondence, and preset points (also called reference points) being provided on the edges of the device grooves; the driving module driving the positioning push plate 4 to move, thereby moving the BGA packaged device and making the BGA packaged device contact the preset points; a stencil assembly disposed above the device positioning component, the stencil assembly including a stencil frame 19 and a stencil installed in the stencil frame 19, the stencil being selected from one of a printed stencil 17 and a ball-embedded stencil 18; a demolding component mounted on the base, used to drive the stencil assembly away from or towards the positioning component; and the base 1.

[0025] The multifunctional ball grid array (BGA) packaged device solder paste printing apparatus of this application is compatible with array devices of different sizes through a universal base; it adopts a reference point setting method and uses pushers to position the device at the reference point, achieving the effect of simultaneously positioning and fixing the position of one or more devices; the printing stencil or ball-planting stencil adopts a replaceable design and is designed with a position adjustment device to reduce the processing accuracy requirements of the parts; by lifting the stencil assembly, it ensures that the printing stencil or ball-planting stencil is aligned with the reference of the device and can be stably demolded after printing solder paste or planting balls, ensuring that there is no deviation between the solder paste and the solder balls during demolding.

[0026] In one embodiment, to better fix the device tray 2 and the positioning push plate 4, and to more precisely control the translational movement of the positioning push plate 4, so as to control the stable movement of the ball grid array packaged device and finally fix it at a preset point, the drive module includes a push plate magnet 6, a support column 8, a rack and pinion slider 9, a slide rail 11, and a slider gear 13. The push plate magnet 6 is installed on one end of the support column 8, and the other end of the support column 8 is installed on the rack and pinion slider 9. The rack and pinion slider 9 is installed on the slide rail 11, and the rack and pinion slider 9 cooperates with the slider gear 13. The device tray 2 is provided with a mounting slot, and the projection of the slide rail 11 on the device tray 2 falls into the mounting slot. The mounting column passes through the mounting slot. The side of the positioning push plate 4 near the device tray 2 is provided with a positioning groove. The push plate magnet 6 is embedded into the positioning groove, magnetically fixing the positioning push plate 4 above the positioning push plate 4. The slider gear 13 drives the rack and pinion slider 9 to slide on the slide rail 11, so as to drive the positioning push plate to move synchronously in the slide rail direction. The slide rail 11 is fixed to the base 1 by slide rail mounting screws 12.

[0027] In one embodiment, the multiple device grooves are obtained by translating and expanding the same rectangle on the device tray 2. A preset point is set at one corner of the rectangle. The multiple device slots are obtained by translating and expanding the same rectangle on the positioning push plate 4. The directions of the mounting slots and the slide rail 11 are the same as the diagonal direction drawn from the corner where the preset point is located. Setting the device slots as rectangles of the same size and with the same axial direction, setting the device grooves as rectangles of the same size and with the same axial direction, and setting the corners of the device grooves with the same orientation as the preset point (reference point) can better synchronize the movement of the ball grid array packaged devices and use the right angle of the rectangle to hold them in place, making subsequent solder paste printing and other steps more stable, with lower errors and better quality.

[0028] In one embodiment, in order to better fix and drive the positioning push plate 4, the push plate magnet 6 is mounted on the support column 8 by magnetic screw 7. The support column 8 is mounted on the rack slider 9 by slider mounting screw 10. The slider gear 13 cooperates with the knob gear 14. The keyway of the knob gear 14 cooperates with the key of the knob 15. By rotating the knob 15, the rack slider 9 can be driven to slide on the slide rail 11.

[0029] In one embodiment, the device tray 2 is mounted on the base 1 using tray mounting screws 3. The slider gear 13 and the knob gear 14 are respectively mounted on the shaft of the base 1 via gear bearings 16. The device tray is made of a high-temperature resistant and anti-static non-metallic material, selected from one or more of reinforcing substrates and high-temperature resistant resin composite materials. The high-temperature resistant and anti-static non-metallic device tray can be removed from the device and used with surface mount equipment and reflow soldering equipment to perform solder ball welding and device welding. It can also be directly placed in an X-ray inspection instrument for inspecting the solder joint quality.

[0030] In one embodiment, the stencil assembly preferably includes a first direction adjustment block 20 and a second direction adjustment block 22, with the first and second directions perpendicular to each other. The first direction adjustment block 20 moves the stencil synchronously by rotating the first direction adjustment screw 21 away from or towards the inner edge of the stencil frame 19. Similarly, the second direction adjustment block 22 moves the stencil synchronously by rotating the second direction adjustment screw 23 away from or towards the inner edge of the stencil frame 19. Through the first direction adjustment block 20 and the first direction adjustment screw 21, and the second direction adjustment block 22 and the second direction adjustment screw 23, the position of the stencil can be precisely adjusted for better alignment with the ball grid array packaging device.

[0031] In one embodiment, the first direction adjustment block 20 and the second direction adjustment block 22 are mounted on the steel mesh frame 19 by adjustment block screws 24.

[0032] In one embodiment, the demolding assembly preferably includes a lifting knob 26, a belt stud 27, a lifting stud 28, a transmission device 29, and a lifting assembly bearing 30. The lifting knob 26 and the transmission stud 27 are respectively mounted on the base 1 via the lifting assembly bearing 30. The transmission device 29 connects the lifting knob 26 and the transmission stud 27. The transmission stud 27 is provided with an internal thread that mates with the external thread of the lifting stud 28. One end of the lifting stud 28 is connected to the steel mesh frame 19. By driving the lifting knob 26 to rotate, the transmission device 29 drives the transmission stud 27 to rotate synchronously, so that the lifting stud 28 performs lifting and lowering movements, which in turn drives the steel mesh frame 19 to perform lifting and lowering movements. The transmission device is selected from a transmission belt or a transmission chain.

[0033] In one embodiment, the steel mesh assembly includes a lifting locking screw 25, which is used to detachably fix the lifting stud 28 to the steel mesh frame 19.

[0034] In one embodiment, in order to better improve the pushing effect of the positioning push plate 4 on the ball grid array device and to make the ball grid array device stably fixed at the preset point, the depth of the device groove is less than the thickness of the ball grid array device and greater than half of the thickness of the ball grid array device, and the sum of the thickness of the positioning push plate 4 and the depth of the device groove is less than two-thirds of the thickness of the ball grid array device.

[0035] The beneficial effects of this application will be further illustrated below with reference to specific embodiments.

[0036] The user places one or more ball grid array packaged devices into the device groove of the device tray (2) at any angle, passes the mounting slot in the middle of the device tray (2) through the support post (8), aligns the groove at the bottom of the device tray (2) with the boss of the base (1), and installs the tray mounting screws (3).

[0037] The user aligns the positioning groove at the bottom of the positioning push plate (4) with the push plate magnet (6), magnetically attaches the positioning push plate (4) above the device tray (2), rotates the knob (15), pushes the positioning push plate (4), and pushes one corner of all ball grid array packaged devices to the reference point (i.e., the preset point) of the device tray (2) in sync. After checking that the position of the ball grid array packaged devices is stable, the user stops rotating the knob (15).

[0038] The user aligns the positioning holes of the steel mesh frame (19) with the steel mesh guide pins (5) of the device tray (2), installs the steel mesh frame (19) above the device tray (2), and pushes the first direction adjustment block (20) and the second direction adjustment block (22) to the inner edge of the steel mesh frame (19).

[0039] The user selects the appropriate printed stencil (17) according to the model of the ball grid array packaged device, places it on the raised edge of the stencil frame (19), tightens the lifting locking screws (25) on both sides to ensure that the lifting locking screws (25) are locked to the lifting studs (28), and rotates the lifting knob (26) to lower the stencil assembly as a whole, so that the printed stencil (17) contacts the ball grid array packaged device.

[0040] The user looks down from the top of the device to see if the opening of the printed stencil (17) corresponds to the pin of the ball grid array package device. If there is a deviation, the user can adjust the position of the printed stencil (17) by rotating the first direction adjustment screw (22) and the second direction adjustment screw (23) until the opening of the printed stencil (17) corresponds to the pin of the ball grid array package device.

[0041] The user applies solder paste to the printing stencil (17) and uses a scraper to brush the solder paste onto the area where it needs to be printed at a uniform speed.

[0042] After the solder paste printing is completed, the user slowly reverses the lifting knob (26) to make the stencil assembly leave the surface of the ball grid array package device and make the solder paste come out of the opening of the printed stencil (17). Loosen the lifting locking screw (25), remove the stencil assembly, take out the printed stencil (17), and check the solder paste printing quality of the ball grid array package device pins.

[0043] The user installs the steel mesh frame (19) on the device tray (2) in the same way, pushes the first direction adjustment block (20) and the second direction adjustment block (22) to the edge of the steel mesh frame (19), tightens the lifting locking screw (25), puts in the ball grid array packaged device corresponding to the ball mesh (18), and adjusts the position of the ball mesh (18) by rotating the first direction adjustment screw (22) and the second direction adjustment screw (23) until the opening of the ball mesh (18) corresponds to the pin of the ball grid array packaged device.

[0044] The user places solder balls corresponding to the model of the ball grid array packaged device on the ball-mounted steel mesh (18), pushes the solder balls into the opening of the ball-mounted steel mesh (18) with a scraper, and removes the excess solder balls from the slots on the side of the steel mesh frame (19).

[0045] The user loosens the lifting locking screw (25), removes the steel mesh assembly, takes out the ball-mounted steel mesh (18), and checks the ball-mounted quality of the ball grid array package device pins.

[0046] The user rotates the knob (15) in the opposite direction until the positioning push plate (4) is separated from the ball grid array packaged device. The positioning push plate (4) is then removed to complete the solder paste printing and ball placement process of the ball grid array packaged device.

[0047] Users can unscrew the tray mounting screws (3) to remove the ball grid array packaged device and device tray (2) after the solder paste printing and ball placement are completed, and then perform other processes such as reflow soldering and X-ray inspection.

[0048] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Additionally, the terms "front," "back," "left," "right," "upper," and "lower" in this document refer to the placement shown in the accompanying drawings.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multifunctional ball grid array package device solder paste printing device, comprising: a device positioning assembly mounted on a base (1), the positioning assembly comprising a device tray (2), a positioning push plate (4) disposed on the device tray, and a driving module, the device tray (2) is provided with a plurality of device grooves, the positioning push plate (4) is provided with a plurality of device slots, the plurality of device grooves and the plurality of device slots are arranged one by one, a preset point is arranged on the edge of the device groove, and the driving module drives the positioning push plate (4) to move, so as to drive the ball grid array package device to move and make the ball grid array package device contact with the preset point; a steel mesh assembly disposed above the device positioning assembly, the steel mesh assembly comprising a steel mesh frame (19) and a steel mesh mounted in the steel mesh frame (19), the steel mesh being selected from one of a printing steel mesh (17) and a ball planting steel mesh (18); a demolding assembly mounted on the base, used for driving the steel mesh assembly to move away from or close to the positioning assembly; the base (1).

2. The apparatus of claim 1, wherein, The driving module comprises a push plate magnet (6), a support column (8), a rack slider (9), a slide rail (11), and a slider gear (13), the push plate magnet (6) is mounted on one end of the support column (8), the other end of the support column (8) is mounted on the rack slider (9), the rack slider (9) is mounted on the slide rail (11), and the rack slider (9) is matched with the slider gear (13). The device tray (2) is provided with a mounting slot, a projection of the slide rail (11) on the device tray (2) falls into the mounting slot, and the mounting column passes through the mounting slot. One side of the positioning push plate (4) close to the device tray (2) is provided with a positioning groove, the push plate magnet (6) is embedded into the positioning groove, and the positioning push plate (4) is magnetically fixed above the positioning push plate (4); The slider gear (13) drives the rack slider (9) to slide on the slide rail (11), so as to drive the positioning push plate to move synchronously in the slide rail direction.

3. The apparatus of claim 2, wherein, The plurality of device grooves are obtained by translational extension of a same rectangle on the device tray (2), the preset point is arranged at one corner of the rectangle, the plurality of device slots are obtained by translational extension of a same rectangle on the positioning push plate (4), and the directions of the mounting slot and the slide rail (11) are the same as the direction of a diagonal line drawn from the corner where the preset point is located.

4. The apparatus of claim 2, wherein, The push plate magnet (6) is mounted on the support column (8) through a magnet screw (7), the support column (8) is mounted on the rack slider (9) through a slider mounting screw (10), the slider gear (13) is matched with a knob gear (14), a key groove of the knob gear (14) is matched with a key of a knob (15), and by rotating the knob (15), the rack slider (9) can be driven to slide on the slide rail (11).

5. The apparatus of claim 1, wherein, The device tray (2) is installed on the base (1) through tray mounting screws (3), the slider gear (13) and the knob gear (14) are respectively installed on the shaft of the base (1) through gear bearings (16), the device tray (2) is made of high-temperature-resistant and anti-static non-metal, and the high-temperature-resistant and anti-static non-metal is selected from one or more of reinforced substrates and high-temperature-resistant resin composites.

6. The apparatus of claim 1, wherein, The steel mesh assembly comprises a first direction adjusting block (20) and a second direction adjusting block (22), the first direction and the second direction are perpendicular to each other, the first direction adjusting block (20) moves the steel mesh synchronously by rotating a first direction adjusting screw (21) away from or close to the inner side of the steel mesh frame (19), and the second direction adjusting block (22) moves the steel mesh synchronously by rotating a second direction adjusting screw (23) away from or close to the inner side of the steel mesh frame (19).

7. The apparatus of claim 6, wherein, The first direction adjusting block (20) and the second direction adjusting block (22) are installed on the steel mesh frame (19) through the adjusting block screw (24).

8. The apparatus of claim 1, wherein, The demolding assembly comprises a lifting knob (26), a belt stud (27), a lifting stud (28), a transmission device (29) and a lifting assembly bearing (30), the lifting knob (26) and the transmission stud (27) are respectively installed on the base (1) through the lifting part bearing (30), the transmission device (29) connects the lifting knob (26) and the transmission stud (27), the transmission stud (27) is provided with an internal thread matched with an external thread of the lifting stud (28), and one end of the lifting stud (28) is connected with the steel mesh frame (19). By driving the lifting knob (26) to rotate, the transmission device (29) drives the transmission stud (27) to rotate synchronously, so that the lifting stud (28) performs lifting movement, and the steel mesh frame (19) further performs lifting movement. The transmission device is selected from one of a transmission belt and a transmission chain.

9. The apparatus of claim 1, wherein, The steel mesh assembly comprises a lifting locking screw (25) for detachably fixing the lifting stud (28) on the steel mesh frame (19).

10. The apparatus of claim 1, wherein, The depth of the device groove is less than the thickness of the ball grid array device and greater than half of the thickness of the ball grid array device, and the sum of the thickness of the positioning push plate (4) and the depth of the device groove is less than two-thirds of the thickness of the ball grid array device.

Images