Circuit board testing device and testing method thereof

Abstract

The invention relates to a circuit board testing device and a testing method thereof, and relates to the technical field of electronic testing, the circuit board testing device comprises a cabinet body, a frame body fixed in the cabinet body and a testing unit installed on an adjusting plate of the frame body, the testing unit comprises a base, the base is provided with a testing table and a testing interface, and the base is further provided with a hinged cover plate; a wire groove is formed in the inner side of the cover plate, when the cover plate is closed, the wire groove accommodates and fixes a test cable to prevent the test cable from loosening in a long-term test, and in addition, a miniature digital temperature sensor, a miniature fan and a miniature semiconductor chilling plate are integrated on the base to be used for constructing an independent microclimate control environment. According to the invention, the physical locking of the cable is realized through the cooperation of the cover plate and the wire duct, the problem of poor interface contact caused by vibration or touch in a long-term test is solved, and the connection stability is remarkably improved; and meanwhile, single-board-level accurate environmental stress reproduction is realized by utilizing microclimate control, and the reliability of test data and the aging test efficiency are improved.

Description

Technical Field

[0001] This application relates to the field of electronic testing technology, and in particular to a circuit board testing device and its testing method. Background Technology

[0002] With the rapid development of electronic technology, circuit boards, as core components of electronic devices, directly determine the reliability of the entire system through their quality and performance. Especially in fields such as communications, servers, and automotive electronics, circuit boards typically undergo extensive power-on aging tests and performance monitoring before leaving the factory to screen out potentially early-failure products. Therefore, a circuit board testing device capable of meeting long-term, batch testing requirements is a key piece of equipment in electronic manufacturing processes.

[0003] Currently, batch testing of circuit boards mainly relies on aging cabinets or shelf structures. During testing, the circuit board under test is placed on a fixture or tray, and external test cables are directly inserted into the corresponding interfaces on the circuit board. Continuous operation and monitoring are then performed while the circuit is powered on. This method mainly relies on the insertion and removal damping of the interfaces themselves to maintain the connection. Due to its simple structure and high versatility, it is widely used in the industry.

[0004] However, the above testing method suffers from insufficient connection stability during long-term operation. Because the connection between the test cable and the interface is typically suspended and lacks external mechanical restraint, over a long aging period, factors such as equipment vibration, cable sag due to its own weight, or accidental contact during operation can easily cause relative displacement, loosening, or even detachment between the test cable plug and the circuit board interface. This poor contact not only leads to test interruptions but may also cause faulty products to be misidentified as defective products due to abnormal signal transmission, severely impacting the accuracy of test data and testing efficiency. Summary of the Invention

[0005] The purpose of this application is to provide a circuit board testing device and its testing method, which solves the problems of loose interfaces, poor contact, and misjudgments caused by environmental vibration, cable weight, or accidental contact during long-term aging tests.

[0006] By adopting the above technical solution, including a cabinet, a cabinet door is hinged to the front side of the cabinet, and a frame is fixedly connected inside the cabinet. The frame includes vertically arranged uprights and horizontally connected crossbars between the uprights. The uprights and crossbars together form a multi-layer frame structure. An adjustment plate is installed on the frame, and a test unit is provided on the adjustment plate. The test unit includes a base, and the base is fixed to the surface of the adjustment plate as the basic support component of the test unit.

[0007] Preferably, the testing unit further includes a testing platform disposed on the upper surface of the base, the testing platform being used to stably place the circuit board under test and provide a testing station.

[0008] Preferably, the base is also provided with a test interface, which is located on the side of the test bench and is used to connect test cables to realize signal transmission between the circuit board under test and the external test system.

[0009] Preferably, the base is further provided with a cover plate, which is hinged to the side of the base near the test interface by a hinge; the inner surface of the cover plate is recessed and a wire groove is formed. When the cover plate is in the closed state, the cover plate covers the test interface. The wire groove is used to accommodate and fix the test cable passing through it to prevent the cable from loosening during long-term testing and improve the connection stability.

[0010] Preferably, a number of miniature digital temperature sensors are arranged on the base corresponding to the heat-generating area of ​​the circuit board under test. The miniature digital temperature sensors are used to collect microclimate temperature data around the circuit board under test in real time.

[0011] Preferably, a micro fan is integrated inside or on the side of the base, and a micro semiconductor cooling chip is embedded between the base and the test bench or close to the bottom of the test bench. The micro fan is used to adjust the local airflow speed on the surface of the circuit board under test, and the micro semiconductor cooling chip is used to precisely heat or cool the circuit board under test according to the data fed back by the micro digital temperature sensor, so as to simulate a dynamic microclimate environment.

[0012] Preferably, the upper surface of the base is further provided with a protrusion for a positioning platform. The positioning platform is located on one side of the test platform and is used to limit the edge of the circuit board to be tested, so as to ensure the accuracy of the test position.

[0013] Preferably, the test platform is provided with several bolts around its perimeter. The bolts are used to lock and fix the circuit board under test within the area defined by the test platform and the positioning platform to prevent vibration displacement.

[0014] Preferably, both ends of the adjustment plate are connected to the adjustment holes on the upright or horizontal frame rod by fasteners, thereby realizing the height adjustment of the adjustment plate on the frame.

[0015] Preferably, a testing method for a circuit board testing device includes the following steps: S1. First, open the cabinet door and adjust the adjustment plate to the appropriate height of the frame. Fix the circuit board to be tested to the test platform on the base with bolts and align it with the positioning platform. S2. Next, insert the test cable into the test interface and connect it to the circuit board. Then flip the cover to close it, so that the test cable is locked into the wire slot for physical locking. S3. Next, start the test system, and the miniature digital temperature sensor monitors the local micro-environment temperature of the circuit board in real time. S4. Then, the control system drives the micro-semiconductor cooling chip and micro-fan to work together according to the preset stress curve to create a precise dynamic temperature and humidity microclimate around the circuit board. S5. Finally, conduct long-term electrical performance tests under microclimate conditions and record the data to determine the pass rate.

[0016] In summary, this application includes at least one of the following beneficial technical effects: 1. This application uses a cover plate on the base and a cable tray structure to physically limit and lock the test cables inserted into the test interface, effectively preventing the cables from loosening or falling off due to equipment vibration, cable weight, or external interference during long-term testing. This ensures the continuity of signal transmission, significantly improves the accuracy of test data and the durability of the connection, and through the several test spaces set in the frame, it is possible to conduct long-term testing on a large number of circuit boards to verify the performance and stability of the circuit boards. 2. This application integrates a miniature digital temperature sensor, a miniature fan, and a miniature semiconductor cooling chip on the base to construct an independent microclimate control module, which can accurately collect and dynamically adjust the local ambient temperature and airflow around the circuit board under test, making it highly consistent with the preset complex stress curve. This breaks through the limitations of macroscopic temperature control in traditional aging chambers, realizes precise environmental stress application at the single test unit level, and effectively improves the correlation between aging test results and failure modes in actual application scenarios. 3. This application realizes a distributed architecture for the test system by sinking the data acquisition, timing control and microclimate control functions to each base. Each test unit can independently execute test tasks and local control, eliminating the risk of the entire system stopping due to a single point of failure in the traditional centralized architecture, and greatly improving the fault tolerance and reliability of the system. At the same time, the modular design allows the test rack's hierarchy and number of units to be flexibly configured according to needs, and has good scalability. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a circuit board testing device according to an embodiment of this application; Figure 2 This is a schematic diagram of the combined structure of the test bench of a circuit board testing device according to an embodiment of this application; Figure 3 This is a schematic diagram of the test platform cover structure of a circuit board testing device according to an embodiment of this application when the test platform cover is open; Figure 4 yes Figure 1 Enlarged view of point A in the middle; Figure 5This is a schematic diagram of the internal hardware integration structure of the base of a circuit board testing device according to an embodiment of this application; Figure 6 This is a microclimate control system architecture diagram of a circuit board testing device according to an embodiment of this application; Figure 7 This is a flowchart of a test method for a circuit board test device according to an embodiment of this application.

[0018] Explanation of reference numerals in the attached drawings: 1. Cabinet; 2. Cabinet door; 3. Frame; 301. Upright pole; 302. Horizontal pole; 4. Adjustment plate; 5. Base; 6. Test platform; 7. Positioning platform; 8. Test interface; 9. Cover plate; 10. Cable tray; 11. Hinge; 12. Bolt; 13. Miniature digital temperature sensor; 14. Miniature fan; 15. Miniature semiconductor refrigeration chip. Detailed Implementation

[0019] The following is in conjunction with the appendix Figure 1 -Appendix Figure 7 This application will be described in further detail below.

[0020] Reference Figures 1-4 The system includes a cabinet body 1, with a cabinet door 2 hinged to the front side of the cabinet body 1. A frame body 3 is fixedly connected inside the cabinet body 1. The frame body 3 includes vertically arranged uprights 301 and horizontally connected crossbars 302 between the uprights 301. The uprights 301 and the crossbars 302 together form a multi-layer frame structure. An adjustment plate 4 is installed on the frame body 3. A test unit is set on the adjustment plate 4. The test unit includes a base 5, which serves as the basic support component of the test unit and is fixed to the surface of the adjustment plate 4. The two ends of the adjustment plate 4 are connected to the adjustment holes on the uprights 301 or the crossbars 302 through fasteners, thereby realizing the height adjustment of the adjustment plate 4 on the frame body 3. The cabinet 1, with its internal space and hinged front door 2, provides a closed, clean, and interference-resistant external environment for circuit board testing, preventing dust accumulation or airflow fluctuations from affecting the accuracy of precision test data. The internal surface of cabinet 1 can be coated with an electromagnetic shielding layer to effectively block external electromagnetic interference from interfering with precision circuit board test signals, further enhancing the test environment's anti-interference capabilities. The frame 3 serves as the overall skeletal support structure, with uprights 301 and crossbars 302 forming a high-strength multi-layered frame structure. High-rigidity fastening at the joints ensures sufficient shock resistance to withstand low-frequency vibrations from the micro-fan 14 or the external environment during testing. The frame 3 provides stable support for the multi-layered adjustment plate 4, enabling three-dimensional batch testing of a large number of circuit boards within a limited space, significantly improving testing efficiency. The two ends of the adjustment plate 4 are connected via fasteners to pre-set adjustment holes on the uprights 301 or crossbars 302, preferably arranged in an equidistant array. This connection method enables the height adjustment of the adjustment plate 4 on the frame 3, allowing the testing device to flexibly adapt to circuit boards or testing fixtures of different sizes and heights. This improves the versatility and space utilization of the device, achieving simultaneous compatibility for different batches and specifications of circuit boards within the same cabinet 1. The base 5, fixed on the base, serves as a basic support component, supporting subsequent testing components and ensuring the independence and stability of the testing units. The base 5 is preferably made of engineering materials with good heat dissipation or insulation properties to assist in local temperature control or prevent interference. The base 5 also integrates a power management module and signal preprocessing circuitry, converting the bus power and signals provided by the side panel of the cabinet 1 into a stable operating voltage and standard test interface 8 signals suitable for the circuit board under test. This achieves localized power and signal distribution and effective filtering, reducing losses and noise caused by long-distance transmission.

[0021] The testing unit also includes a testing platform 6 set on the upper surface of the base 5. The testing platform 6 is used to stably place the circuit board to be tested and provide a testing station. The upper surface of the base 5 is also provided with a positioning platform 7. The positioning platform 7 is located on one side of the testing platform 6 and is used to limit the edge of the circuit board to be tested to ensure the accuracy of the testing position. Several bolts 12 are provided around the periphery of the testing platform 6. The bolts 12 are used to lock and fix the circuit board to be tested in the area defined by the testing platform 6 and the positioning platform 7 to prevent vibration displacement. The test bench 6 is used to stably place the circuit board under test and provide a testing station. Its surface flatness must meet high-level requirements to ensure uniform force distribution on the bottom of the circuit board and avoid stress concentration. The positioning table 7 is used to limit the edges of the circuit board under test, ensuring the accuracy of the test position. The positioning table 7 is designed with replaceable or adjustable limit blocks. For example, by setting grooves or threaded holes on the base 5, it can precisely adjust the distance from the test bench 6 to quickly position the edges of the circuit board under test, ensuring that the interface positions of each circuit board are accurately aligned when placed, improving operational convenience. Dry bolts 12 are provided around the periphery of the test bench 6 to lock and fix the circuit board under test within the area defined by the test bench 6 and the positioning table 7. The bolts 12 are preferably limit bolts 12 with torque control function, which can apply a stable and preset locking force, reliably fixing the circuit board to prevent vibration displacement, and avoiding mechanical damage or stress deformation to the circuit board due to over-tightening, thus ensuring the integrity of the circuit board. Bolt 12, in conjunction with the test stand 6 and positioning stand 7, prevents minor displacement of the circuit board during long-term power-on testing or thermal expansion and contraction, thus preventing connection interruptions or poor contact caused by vibration and ensuring the continuity of the testing process. This fixing method also facilitates quick replacement of the circuit board under test by the operator.

[0022] The base 5 is also provided with a test interface 8, which is located on the side of the test bench 6. It is used to connect test cables to realize signal transmission between the circuit board under test and the external test system. The base 5 is also provided with a cover plate 9, which is hinged to the side of the base 5 near the test interface 8 by a hinge 11. The inner surface of the cover plate 9 is recessed with a wire groove 10. When the cover plate 9 is in the closed state, the cover plate 9 covers the test interface 8. The wire groove 10 is used to accommodate and fix the test cables passing through it to prevent the cables from loosening during long-term testing and improve connection stability.

[0023] Test interface 8 is used to connect test cables to enable signal transmission between the circuit board under test (DUT) and an external test system. The interface type can be flexibly configured according to the requirements of the DUT, and a highly reliable connector should be used. The hinge 11 should be designed with self-lubricating and fatigue-resistant properties. The cover plate 9 is preferably made of insulating engineering plastic with certain strength and toughness. When the cover plate 9 is closed, it covers the test interface 8, and the cable groove 10 accommodates and tightly fits the test cables passing through it, effectively accommodating and tightly fitting the cables. This structure, through the cover plate 9 and the cable groove 10, applies a stable clamping force to the cable root, forming a reliable mechanical constraint. This effectively prevents the test cables from loosening or falling off due to gravity, thermal stress, or accidental contact during long-term testing, significantly improving the stability of the signal connection and the reliability of the test data. Furthermore, the closure of the cover plate 9 also provides dust protection and operational safety protection for the area of ​​the test interface 8.

[0024] refer to Figures 2-3 and Figures 5-6 Several miniature digital temperature sensors 13 are arranged on the base 5 corresponding to the heating area of ​​the circuit board under test. The miniature digital temperature sensors 13 are used to collect microclimate temperature data around the circuit board under test in real time. A miniature fan 14 is integrated inside or on the side of the base 5. A miniature semiconductor cooling chip 15 is embedded between the base 5 and the test platform 6 or close to the bottom of the test platform 6. The miniature fan 14 is used to adjust the local airflow speed on the surface of the circuit board under test. The miniature semiconductor cooling chip 15 is used to accurately heat or cool the circuit board under test according to the data fed back by the miniature digital temperature sensors 13, so as to simulate the dynamic microclimate environment.

[0025] A miniature digital temperature sensor 13 is used to collect real-time and accurate temperature changes in a small area around the circuit board under test. The number and location of the sensors can be flexibly adjusted according to the thermal characteristics of the circuit board under test, and the sampling frequency should be high enough to capture dynamic temperature changes. A miniature thermoelectric cooler 15 achieves precise heating and cooling control through the Peltier effect, and its operating current is precisely controlled bidirectionally by the TEC drive module integrated in the base 5. A miniature fan 14 is used to adjust the local airflow speed and direction on the surface of the circuit board under test to enhance heat exchange efficiency. The thermal management system reads the feedback data from the miniature digital temperature sensor 13 in real time and executes a high-precision PID closed-loop control algorithm on the embedded control unit inside the base 5. The ECU dynamically adjusts the current output of the miniature thermoelectric cooler 15 and the speed of the miniature fan 14 according to the preset temperature and humidity stress curve, real-time sensor data, and TEC drive characteristic model to achieve precise adjustment of the local temperature of the test bench 6. The control accuracy can reach ±0.1°C or higher, realizing precise environmental stress application at the single test unit level. This distributed microclimate control design ensures that the environmental stress of each test unit is independent and does not interfere with each other. This effectively overcomes the limitations of traditional integrated aging chambers, which can only provide a macroscopically constant environment. It can simulate the complex thermodynamic environments of circuit boards under actual working conditions, such as high altitude and sudden thermal shock, greatly improving the effectiveness of aging tests. Simultaneously, heat insulation layers are installed between the bases 5 or between the base 5 and the test platform 6 to ensure that thermal crosstalk does not occur between adjacent test units when performing tests under different stresses, guaranteeing the independence and reliability of test data. The ECU embedded in the base 5, as the edge intelligent unit of the system, is responsible not only for local temperature control closed-loop but also for managing signal acquisition, data preprocessing, and status monitoring of the test interface 8, and uploading the processed data to the central control system via a high-speed bus. This distributed architecture allows each test unit to independently complete most of the test tasks. When the central system or a certain unit fails, other test units can continue to operate, significantly improving the fault tolerance and operational reliability of the entire test system.

[0026] refer to Figure 7 A test method for a circuit board testing device includes the following steps: S1. First, open the cabinet door 2 and adjust the adjustment plate 4 to the appropriate height of the frame 3. Fix the circuit board to be tested onto the test platform 6 of the base 5 with the bolts 12, and align it with the positioning platform 7. S2. Next, insert the test cable into the test interface 8 and connect it to the circuit board. Then flip the cover plate 9 to close it, so that the test cable is locked into the wire groove 10 for physical locking. S3. Next, start the test system, and the miniature digital temperature sensor 13 monitors the local micro-environment temperature of the circuit board in real time. S4. Then, the control system drives the micro-semiconductor cooling chip 15 and the micro-fan 14 to work together according to the preset stress curve to create a precise dynamic temperature and humidity microclimate around the circuit board. S5. Finally, conduct long-term electrical performance tests under microclimate conditions and record the data to determine the pass rate.

Claims

1. A circuit board testing apparatus comprising a cabinet (1), characterized in that, The front side of the cabinet body (1) is hingedly mounted with a cabinet door (2), and the inside of the cabinet body (1) is fixedly connected with a frame body (3), the frame body (3) comprises vertically arranged vertical frame rods (301) and horizontally connected horizontal frame rods (302) between the vertical frame rods (301), and the vertical frame rods (301) and the horizontal frame rods (302) jointly constitute a multi-layer frame structure, and an adjusting plate (4) is mounted on the frame body (3), and a test unit is arranged on the adjusting plate (4), and the test unit comprises a base (5) which is fixed to the surface of the adjusting plate (4) as a basic supporting part of the test unit.

2. The circuit board testing apparatus according to claim 1, wherein The test unit further comprises a test table (6) arranged on the upper surface of the base (5), which is used for stably placing the circuit board to be tested and providing a test station.

3. A circuit board testing apparatus according to claim 2, wherein The base (5) is further provided with a test interface (8) located on the side of the test table (6), which is used for connecting test cables to realize signal transmission between the circuit board to be tested and an external test system.

4. The circuit board testing apparatus of claim 3, wherein The base (5) is further provided with a cover plate (9) hingedly connected to one side of the base (5) near the test interface (8) through a hinge (11); the inner surface of the cover plate (9) is recessed to form a wire slot (10), when the cover plate (9) is in a closed state, the cover plate (9) covers the test interface (8) above, and the wire slot (10) is used for accommodating and fixing the test cable passing therethrough, so as to prevent the cable from loosening in long-time test, and improve the connection stability.

5. The circuit board testing apparatus of claim 2, wherein A plurality of micro digital temperature sensors (13) are arranged on the base (5) corresponding to the heating area of the circuit board to be tested, and the micro digital temperature sensors (13) are used for collecting microclimate temperature data around the circuit board to be tested in real time.

6. A circuit board testing apparatus according to claim 5, wherein The base (5) is internally or laterally integrated with a micro fan (14), and the base (5) is embedded with a micro semiconductor refrigeration sheet (15) between or closely adjacent to the bottom of the test table (6), the micro fan (14) is used for adjusting the local airflow speed of the surface of the circuit board to be tested, and the micro semiconductor refrigeration sheet (15) is used for accurately heating or cooling the circuit board to be tested according to the data fed back by the micro digital temperature sensor (13), so as to simulate a dynamic microclimate environment.

7. The circuit board testing apparatus of claim 2, wherein The upper surface of the base (5) is further provided with a positioning table (7) located on one side of the test table (6), which is used for limiting the edge of the circuit board to be tested, and ensuring the accuracy of the test position.

8. A circuit board testing apparatus according to claim 7, wherein The periphery of the test table (6) is provided with a plurality of bolts (12), which are used for locking and fixing the circuit board to be tested in the area defined by the test table (6) and the positioning table (7), so as to prevent vibration displacement.

9. The circuit board testing apparatus of claim 1, wherein The two ends of the adjusting plate (4) are connected with the adjusting holes on the vertical frame rods (301) or the horizontal frame rods (302) through fasteners, so as to realize the height level adjustment of the adjusting plate (4) on the frame body (3).

10. A test method of a circuit board testing device, according to any one of claims 1-9, comprising the following steps: S1, first, open the cabinet door (2) to adjust the plate (4) to the appropriate height of the frame (3), through the bolt (12) to be measured on the base (5) of the test board (6) and the use of positioning table (7) alignment; S2, then, the test cable is inserted into the test interface (8) and connected to the circuit board, and then the cover plate (9) is turned over to close it, so that the test cable is clamped into the wire slot (10) for physical locking; S3, secondly, start the test system, the micro digital temperature sensor (13) real-time monitoring of local micro-environment temperature of circuit board; S4, then, the control system according to the preset stress curve, drive micro semiconductor refrigeration piece (15) and micro fan (14) work together, in the circuit board around the construction of accurate dynamic temperature and humidity micro climate; S5, finally, in the micro climate environment for a long time electrical performance test, and record the data to determine the eligibility.

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