Quartz crystal oscillator frequency sweep electricity test cleaning system and method and storage medium

Abstract

The invention relates to the technical field of quartz crystal resonators, and discloses a frequency sweep electricity test cleaning system and method for a quartz crystal oscillator and a storage medium, and the system comprises a control module which stores control parameters related to frequency and power; the translation module is used for receiving the control parameters sent by the control module, translating the control parameters into instructions and outputting the instructions; the frequency generation module is used for receiving the instruction and generating high-voltage frequency; the high-voltage amplification module is used for amplifying the high-voltage frequency; the channel switching module is in communication connection with the control module and is used for switching the amplified frequency to a specified path so as to perform quartz crystal measurement; the demodulation module receives the feedback signal sent by the crystal, demodulates the feedback signal and sends the feedback signal to the translation module, and the translation module processes the demodulated feedback signal and sends the demodulated feedback signal to the control module; the problems that a traditional cleaning technology is narrow in frequency range, poor in adaptability and lagged in parameter adjustment are solved, and the method has the advantages that the cleaning efficiency is improved, crystal oscillator damage is avoided, and precise frequency sweeping control and dynamic adjustment are achieved.

Description

Technical Field

[0001] This invention relates to the field of quartz crystal resonator technology, specifically to a quartz crystal oscillator sweep frequency testing and cleaning system, method, and storage medium. Background Technology

[0002] Quartz crystal resonators are core frequency control components in communication equipment, precision instruments, and other fields. The surface cleanliness of these resonators directly determines key performance indicators such as impedance characteristics, frequency stability, and excitation power correlation. With the increasing demands for device precision from technologies like 5G communication and the Internet of Things, surface nanoscale particulate contaminants such as metal shavings, grinding residues, and organic impurities have become major factors leading to decreased product yield. Particularly in high-frequency crystal oscillator applications, frequency drift caused by incomplete cleaning is particularly prominent, severely impacting product reliability and consistency.

[0003] Current mainstream cleaning technologies are mainly divided into two categories: physical cleaning and electro-cleaning, but both have significant technical limitations. In terms of physical cleaning, while ultrasonic cleaning technology is widely used, its high-frequency vibrations can easily cause structural damage to miniaturized packaged crystal oscillators, such as wafer breakage or electrode detachment. Furthermore, ultrasonic cleaning is ineffective in cleaning dead zones formed at the points where wafers are stacked and adhered. Although low-temperature plasma cleaning technology can avoid mechanical damage, it suffers from high equipment costs and low processing efficiency, making it difficult to meet the needs of large-scale mass production.

[0004] In the field of electrical cleaning technology, while high-frequency voltage-driven cleaning methods based on the piezoelectric effect can achieve wafer vibration desorption of impurities, traditional devices using transistor oscillator circuits suffer from technical bottlenecks such as fixed excitation voltage and narrow frequency range. This fixed-parameter cleaning method results in poor cleaning performance with low-frequency crystal oscillators, while high-frequency crystal oscillators are prone to severe frequency deviation due to over-excitation. Although existing frequency-sweeping electrical cleaning technologies attempt to overcome these limitations by using DDS digital synthesizers to achieve wide-band excitation, several key problems remain: First, insufficient electrical contact reliability and poor compatibility between the cleaning head and general-purpose material boards lead to a high rate of missed cleaning; second, the cleaning process is disconnected from performance verification, lacking a real-time correlation mechanism between excitation parameters and contaminant desorption effects, making it impossible to dynamically adjust the frequency sweep range and voltage intensity based on actual cleaning results. Summary of the Invention In view of the shortcomings of the existing technology, the purpose of this invention is to provide a quartz crystal oscillator sweep frequency test cleaning system, method and storage medium.

[0005] To achieve the above objectives, the present invention provides the following technical solution: Quartz crystal oscillator sweep frequency testing and cleaning system, including: The control module stores frequency and power-related control parameters; The translation module receives control parameters sent by the control module and translates them into instructions for output. The frequency generation module receives the instruction and generates a high-voltage frequency; A high-voltage amplification module amplifies the high-voltage frequency; The channel switching module communicates with the control module to switch the amplified frequency to a designated path for quartz crystal measurement. The demodulation module receives the feedback signal sent by the crystal, demodulates it, and sends it to the translation module. The translation module processes the demodulated feedback signal and sends it to the control module.

[0006] In this invention, preferably, a signal interaction module is provided between the control module and the translation module.

[0007] In this invention, preferably, the signal interaction module uses a PCI high-speed interface or a PCI high-speed interface. The PCI high-speed interface receives control commands from the control module through the PEROP and PERON pins and transmits them to the translation module. The processing results of the translation module are then transmitted back to the host computer control module through the PETOP and PETON pins.

[0008] In this invention, preferably, the control module is provided with an arithmetic logic unit. The arithmetic logic unit receives the feedback signal, calculates and analyzes the feedback signal, finds each harmonic frequency region of the quartz crystal, determines the corresponding electro-cleaning control command for the quartz crystal based on the harmonic frequency region, and sends the electro-cleaning control command to the translation module.

[0009] In this invention, preferably, the arithmetic logic unit extracts the amplitude of the feedback signal, compares the amplitudes of the same quartz crystal before and after, and obtains the amplitude change. When the amplitude change is greater than a threshold, the frequency corresponding to the feedback signal is a harmonic frequency, and the position of the harmonic frequency is the resonant frequency region.

[0010] In this invention, preferably, the frequency generation module includes a DDS chip and peripheral circuitry connected to the DDS chip. The DDS chip is an AD9912 with an internal clock speed of at least 1GHz, integrating a 1GSPS 14-bit DAC and a 48-bit frequency control word, a frequency resolution of at least 4µHz, and an output frequency range of 1kHz-400MHz. The peripheral circuitry includes a loop filter and a frequency adjustment resistor. The loop filter consists of capacitor C35, resistor R20, and resistor R36, used to filter the internal VCO of the DDS chip. The frequency adjustment resistor consists of resistors R19 and R21, used to adjust the default output frequency upon power-on.

[0011] In this invention, preferably, the translation module includes an FPGA chip, which is used to translate the control commands sent by the control module into drive signals of the frequency generation module, and simultaneously digitize the analog signals sent by the demodulation module and send them back to the control module.

[0012] In this invention, preferably, the frequency generation module includes a frequency and power adjustment circuit, which amplifies the frequency output by the DDS chip through a preamplifier, then performs impedance matching amplification, and outputs a signal with stable power.

[0013] In this invention, preferably, the high-voltage amplification module includes an impedance matching circuit, a preamplifier circuit, a filter circuit, and a power amplification circuit connected in sequence. The impedance matching circuit consists of resistors R7, R9, and R10. The preamplifier circuit includes transistor Q2, which performs a first-stage amplification. The filter circuit includes capacitor C9, resistor R2, and capacitor C12 to filter the power supply. The power amplification circuit includes transistor Q1 and bias resistor R3. The bias resistor R3 is used to adjust the DC bias voltage of Q1 to ensure that transistor Q1 operates at its optimal operating point. Finally, the power is amplified through Q1, so that the output frequency of the high-voltage amplification module meets the requirements of high-voltage excitation for the electro-cleaning function of the crystal.

[0014] In this invention, preferably, the channel switching module includes a switching control chip. This switching control chip receives channel switching commands via pins A1, A2, and A3, enabling flexible switching of multiple channels. The switching control chip U5 employs a 0.01uF power supply filter to ensure cleaner power. RFA_OUT is the amplifier output and also the input frequency of the HMC253AQS24. FO1-FO8 are frequency outputs. Flexible switching of eight channels can be achieved through switching, thus ensuring compatibility with different reels.

[0015] The quartz crystal oscillator sweep frequency testing and cleaning method includes the following steps: Set the center frequency, scanning bandwidth, and number of scanning points; calculate the starting frequency, ending frequency, and increment frequency. Based on the starting and ending frequencies, several frequency values ​​and corresponding power values ​​to be measured are obtained cyclically according to the number of measurement points. A corresponding frequency signal is generated based on the frequency value and power value, and the frequency signal is adjusted and amplified. According to the channel switching command, the amplified frequency signal is switched to the target channel and applied to the quartz crystal oscillator to be cleaned; The feedback signal from the quartz crystal oscillator is collected, processed, and then sent back to the control module, which identifies the resonant frequency. Based on the identification results, the control module issues an electrical cleaning command with a specified frequency, power and cleaning time to perform oscillation cleaning on the quartz crystal oscillator; Once the cleaning time is reached, the output signal is turned off, completing a single cleaning operation.

[0016] In this invention, preferably, the control module identifies the resonant frequency by including the following steps: Compare the amplitude of the feedback signal at the current frequency with the amplitude of the feedback signal at the previous frequency, and calculate the change in amplitude. When the amplitude change reaches the threshold, the frequency position is marked as a suspected resonant frequency region; Adjacent suspected resonant frequency regions are merged to form candidate resonant frequency regions; The frequency with the largest signal quantity is extracted from the candidate resonant frequency region and used as the resonant frequency of the quartz crystal oscillator.

[0017] In this invention, preferably, the frequency adjustment specifically includes the following steps: Connect the output of the frequency generation module to the power measurement instrument, adjust the power control analog quantity through the control module, record the actual output power corresponding to different analog quantities, and establish a correspondence table between the power control analog quantity and the actual output power. During cleaning, the power control analog quantity corresponding to the target power is called by looking up a table to achieve precise control of the output power.

[0018] In this invention, preferably, the frequency of the oscillation cleaning includes the main harmonic frequency, the subharmonic frequency, and the noise frequency, thereby exciting different vibration modes of the quartz crystal oscillator through multiple frequency modes.

[0019] Compared with the prior art, the beneficial effects of the present invention are: This invention discloses a quartz crystal oscillator sweep frequency testing and cleaning system, method, and storage medium. Through the coordinated operation of a control module, a translation module, a frequency generation module, a high-voltage amplification module, a channel switching module, and a demodulation module, it achieves wideband excitation signal generation, flexible multi-channel switching, and real-time feedback processing. It solves the problems of narrow frequency range, poor adaptability, and lag in parameter adjustment in traditional cleaning technologies, and has the advantages of improving cleaning efficiency, avoiding crystal oscillator damage, and achieving precise sweep frequency control and dynamic adjustment. Attached Figure Description

[0020] Figure 1 This is a structural block diagram of a quartz crystal oscillator sweep frequency testing and cleaning system according to the present invention.

[0021] Figure 2This is a high-speed PCIE interface circuit diagram of a quartz crystal oscillator sweep frequency testing and cleaning system according to the present invention.

[0022] Figure 3 This is a circuit diagram of the translation module of a quartz crystal oscillator sweep frequency testing and cleaning system according to the present invention.

[0023] Figure 4 This is a circuit diagram of the frequency generation module of a quartz crystal oscillator sweep frequency testing and cleaning system according to the present invention.

[0024] Figure 5 This is a circuit diagram of the high-voltage amplification module of a quartz crystal oscillator sweep frequency test cleaning system according to the present invention.

[0025] Figure 6 This is a circuit diagram of the channel switching module of a quartz crystal oscillator sweep frequency testing and cleaning system according to the present invention.

[0026] Figure 7 This is a circuit diagram of the demodulation module of a quartz crystal oscillator sweep frequency testing and cleaning system according to the present invention.

[0027] Figure 8 This is a circuit diagram showing the frequency and power adjustment of a quartz crystal oscillator sweep frequency testing and cleaning system according to the present invention. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] Please also see Figures 1 to 8A preferred embodiment of the present invention provides a quartz crystal oscillator sweep frequency testing and cleaning system, including a control module, a translation module, a frequency generation module, a high-voltage amplification module, a channel switching module, and a demodulation module. The control module stores frequency and power parameters; the translation module converts the parameters into instructions; the frequency generation module generates a high-voltage frequency signal according to the instructions; the high-voltage amplification module enhances the signal strength; the channel switching module distributes the signal to the target path; and the demodulation module acquires the crystal oscillator feedback signal and transmits it back to the control module to form a closed-loop control.

[0031] The system comprises several modules: a control module for storing preset frequency ranges and power parameters (implemented using an embedded processor), and a translation module for converting protocols (e.g., using an FPGA chip to convert digital control signals into drive commands recognizable by the frequency generation module); a frequency generation module for generating adjustable high-frequency signals (e.g., using a DDS chip with external filtering circuitry to achieve wideband output); a high-voltage amplification module for boosting signal power through multi-stage amplification (e.g., using transistor amplifiers with impedance matching networks); a channel switching module for receiving channel commands from the control module and allocating multiple signals (e.g., using a multiplexer chip to switch output paths according to commands); and a demodulation module for extracting the amplitude-frequency characteristics of the crystal oscillator feedback signal (e.g., using a lock-in amplifier for weak signal detection).

[0032] Specifically, the control module first calls the pre-stored frequency scanning parameters and converts them into drive instructions for the frequency generation module through the translation module. The frequency generation module outputs an initial signal at the specified frequency, which is then boosted to the target power by the high-voltage amplification module and allocated to the corresponding cleaning path by the channel switching module. The high-voltage signal applied to the crystal oscillator excites its piezoelectric effect, causing surface contaminants to detach. The demodulation module acquires the impedance response signal of the crystal oscillator in real time, processes it digitally, and feeds it back to the control module. The control module identifies the resonant frequency region based on the changes in the amplitude of the feedback signal and dynamically adjusts the subsequent frequency sweep range and power parameters to form an adaptive cleaning strategy.

[0033] Furthermore, a signal interaction module is proposed to connect the control module and the translation module. This signal interaction module is a hardware interface that enables bidirectional communication between the control module and the translation module. Specifically, it can be implemented using a high-speed PCIe interface. It receives control commands from the control module via the PEROP and PERON pins and transmits them to the translation module. Conversely, it sends the processing results from the translation module back to the control module via the PETOP and PETON pins. This module ensures real-time interaction between control parameters and feedback signals through a high-speed data transmission mechanism, resolving the issue of asynchronous command and execution caused by communication delays in traditional systems.

[0034] The frequency and power parameters generated by the control module are transmitted to the translation module via the signal interaction module. The translation module converts the parameters into drive signals and sends them to the frequency generation module. Simultaneously, the crystal feedback signal acquired by the demodulation module is processed by the translation module and then transmitted back to the control module via the signal interaction module. The signal interaction module employs differential signal transmission, establishing physical layer isolation between the control module and the translation module to avoid high-frequency signal interference. For example, the differential signal lines of the PCIe interface reduce signal reflection through impedance matching design. Its high-speed transmission characteristics allow control commands and feedback data to interact within microseconds, ensuring strict timing matching between frequency switching and signal acquisition during frequency sweeping.

[0035] Furthermore, it is proposed that the signal interaction module adopts either a PCIe high-speed interface or a PCIe high-speed interface. The PCIe high-speed interface receives control commands from the control module through the PEROP and PERON pins and transmits them to the translation module. The PETOP and PETON pins then transmit the processing results from the translation module back to the host computer control module. The PCIe high-speed interface refers to a data transmission interface conforming to the PCI Express standard, specifically implemented using a differential signal transmission structure. It possesses high bandwidth and low latency physical layer characteristics, capable of supporting bidirectional transmission of control commands and feedback signals. The PEROP and PERON pins refer to the differential signal transmission channels in the PCIe interface used to receive control commands, specifically implemented using impedance-matched differential pairs, which ensure the integrity of control command transmission by eliminating common-mode noise. The PETOP and PETON pins refer to the differential signal transmission channels in the PCIe interface used to transmit processing results, specifically implemented using an independently shielded twisted-pair structure, which avoids crosstalk between uplink and downlink signals through physical isolation. Control commands generated by the control module are transmitted to the translation module via the PER0P and PER0N differential signal channels of the PCIe high-speed interface. This transmission process utilizes the anti-interference characteristics of differential signals to eliminate the impact of external electromagnetic noise on command integrity. Feedback data processed by the translation module is transmitted back to the control module via the PER0P and PER0N differential channels. These two channels employ independent shielding structures to prevent signal crosstalk. The physical layer protocol of the PCIe interface ensures the timing synchronization of data transmission, enabling the control commands and feedback signals to interact within microsecond-level delays, achieving real-time matching of sweep parameters and cleaning status.

[0036] A quartz crystal oscillator frequency sweep test electrical cleaning system is further proposed, including an arithmetic logic unit set in the control module. The arithmetic logic unit receives feedback signals, calculates and analyzes the feedback signals to find the various harmonic frequency regions of the quartz crystal, determines the corresponding electrical cleaning control command for the quartz crystal based on the harmonic frequency region, and sends the electrical cleaning control command to the translation module.

[0037] The operational logic unit (ALU) refers to an integrated circuit with signal processing capabilities, specifically implemented using a digital signal processor (DSP) or programmable logic device (PLD). It is used for spectral analysis and harmonic feature extraction of the feedback signal. The harmonic frequency region refers to the resonant response range generated by the quartz crystal within a specific frequency range. This can be achieved by performing frequency domain decomposition of the feedback signal using a fast Fourier transform algorithm, used to locate the vibration-sensitive region corresponding to contaminants on the crystal surface. The electro-cleaning control command is a set of parameters including frequency, power, and duration. It can be generated using preset harmonic matching rules, used to drive subsequent modules to output excitation signals that match the contaminant desorption requirements.

[0038] Specifically, after receiving the feedback signal from the demodulation module, the arithmetic logic unit first performs time-frequency conversion on the signal, extracting the amplitude features corresponding to different frequency components. A sliding window algorithm is used to compare the amplitude changes of adjacent frequency points in real time. When a sudden amplitude change exceeds a preset threshold, the frequency range is marked as a harmonic candidate region. Furthermore, a region merging algorithm is used to integrate adjacent candidate regions into a complete harmonic frequency range, and the main resonant frequency is determined based on the amplitude peak position. Finally, an electro-cleaning command containing multi-band excitation parameters is generated based on the harmonic distribution characteristics, realizing a dynamic cleaning strategy for different contaminant residue states. Furthermore, the arithmetic logic unit extracts the amplitude of the feedback signal, compares the amplitudes of the same quartz crystal before and after, and obtains the amplitude change. When the amplitude change is greater than a threshold, the frequency corresponding to the feedback signal is the harmonic frequency, and the position of the harmonic frequency is the resonant frequency region.

[0039] The amplitude variation refers to the difference in the amplitude of the feedback signal from the same quartz crystal in two consecutive measurements. This can be achieved using a differential amplifier or digital signal processing algorithm, and is used to characterize the response differences of the quartz crystal under different frequency excitations. The threshold is a pre-set critical value for amplitude variation, which can be dynamically adjusted through experimental data calibration or adaptive algorithms, and is used to determine whether the quartz crystal resonates at that frequency point. The harmonic frequency region refers to a continuous frequency band containing multiple harmonic frequencies. This can be achieved by clustering frequency points where the amplitude variation exceeds the threshold using frequency domain analysis algorithms, and is used to identify resonant regions that require focused cleaning.

[0040] Specifically, after receiving the feedback signal from the demodulation module, the arithmetic logic unit first extracts the signal amplitude corresponding to the current frequency and performs a differential calculation with the amplitude value of the previous frequency point. When the differential result exceeds a preset threshold, the frequency point is marked as a candidate harmonic frequency. Subsequently, adjacent candidate points are merged in the frequency domain to form a continuous resonant frequency region. In this process, by dynamically comparing amplitude changes rather than static amplitude values, environmental noise interference can be effectively eliminated, and the actual resonant frequency band of the quartz crystal can be accurately located.

[0041] The proposed frequency generation module includes a DDS chip and peripheral circuitry connected to it. The DDS chip is a direct digital frequency synthesizer, specifically implemented using the AD9912 chip. Its internal clock speed is no less than 1 GHz, integrating a 1 GSPS 14-bit DAC and a 48-bit frequency control word, with a frequency resolution of no less than 4 µHz, capable of generating high-precision frequency signals in the range of 1 kHz to 400 MHz. The peripheral circuitry includes a loop filter and a frequency adjustment resistor. The loop filter consists of capacitor C35, resistor R20, and resistor R36, used to filter the VCO inside the DDS chip. The frequency adjustment resistor consists of resistors R19 and R21, used to adjust the default output frequency upon power-on.

[0042] Specifically, the AD9912 chip achieves 4µHz resolution through a 48-bit frequency control word, combined with a 14-bit DAC outputting a wideband signal at a 1GSPS sampling rate. A loop filter suppresses high-frequency noise in the VCO output signal, ensuring frequency purity. A frequency adjustment resistor uses a voltage divider network to set the chip's default startup frequency, avoiding the need for parameter reconfiguration each time it powers on. This module, through high-precision frequency synthesis and noise suppression technology, can cover the full-band cleaning requirements from the main harmonics of the quartz crystal oscillator to noise.

[0043] Furthermore, a translation module including an FPGA chip is proposed. The FPGA chip is used to translate the control commands sent by the control module into drive signals of the frequency generation module, and at the same time, it digitizes the analog signals sent by the demodulation module and sends them back to the control module.

[0044] In this context, FPGA chips refer to Field-Programmable Gate Array chips, specifically Xilinx Spartan-6 series chips, which possess high parallel processing capabilities and reconfigurability, enabling synchronous processing of multiple signals. Drive signals refer to the timing and logic levels required to control the frequency generation module, specifically outputting LVDS differential signals, achieving precise control by adjusting the duty cycle and frequency parameters. Digital processing refers to the process of converting analog feedback signals into digital signals, specifically implemented using ADC chips in conjunction with the FPGA's internal logic units, eliminating noise interference through sample-and-hold circuits and digital filtering algorithms.

[0045] Specifically, the control commands output by the control module are transmitted to the FPGA chip via the SPI interface. The FPGA parses the command content according to a preset protocol and generates corresponding drive signals. These drive signals are transmitted to the frequency generation module via a high-speed differential line, triggering the DDS chip to output the target frequency signal. Simultaneously, the analog feedback signal acquired by the demodulation module is converted by an ADC and input to the FPGA. The FPGA uses a digital filtering algorithm to remove high-frequency noise and then sends the processed digital signal back to the control module via the PCIe interface. During this process, the FPGA's parallel architecture can process multiple signals simultaneously, ensuring the synchronization of drive signal generation and feedback signal processing.

[0046] Furthermore, a frequency generation module is proposed, which includes frequency and power adjustment circuits. The frequency and power adjustment circuits amplify the frequency output by the DDS chip through a preamplifier, and then perform impedance matching amplification to output a stable power signal.

[0047] The frequency and power adjustment circuit refers to the circuit structure used to adjust the power and optimize the signal of the initial frequency signal generated by the DDS chip. Specifically, it can be implemented by combining a preamplifier and an impedance matching network. The preamplifier is used to initially amplify the low-power signal, and the impedance matching amplification is used to eliminate signal reflection and improve transmission efficiency.

[0048] The preamplifier is a circuit unit that performs primary amplification of the low-power signal output by the DDS chip. It can be constructed using transistors or operational amplifiers, and the signal is amplified to a preset amplitude range by adjusting the bias voltage.

[0049] Impedance matching amplification refers to an amplification method that optimizes signal transmission by adjusting the consistency between the circuit impedance and the load impedance. Specifically, it can be implemented using a resistor-capacitor network or a transformer coupling circuit to reduce signal reflection loss and ensure stable power output.

[0050] Specifically, the frequency signal output by the DDS chip first enters the preamplifier for primary amplification, increasing the signal power to a preset range; then, the signal undergoes secondary processing through an impedance matching amplifier circuit, where the impedance matching network dynamically adjusts the circuit parameters according to the load characteristics to maximize signal transmission efficiency; the final output signal has stable power characteristics, which can adapt to the electrical requirements of different cleaning channels, ensuring that the quartz crystal oscillator obtains uniform excitation intensity during frequency sweep.

[0051] The proposed high-voltage amplification module comprises an impedance matching circuit, a preamplifier circuit, a filter circuit, and a power amplifier circuit connected in sequence. The impedance matching circuit consists of resistors R7, R9, and R10. The preamplifier circuit includes transistor Q2 for primary amplification. The filter circuit includes capacitor C9, resistor R2, and capacitor C12 for power supply filtering. The power amplifier circuit includes transistor Q1 and bias resistor R3. Bias resistor R3 is used to adjust the DC bias voltage of Q1 to ensure it operates at its optimal operating point. Finally, the amplification by Q1 achieves the output power of the high-voltage amplification module to meet the high-voltage excitation requirements.

[0052] Impedance matching circuitry involves adjusting the impedance relationship between the input signal and the amplifier circuit using a resistor network. Specifically, it can be implemented using a T-type network composed of resistors R7, R9, and R10. Its function is to improve energy transfer efficiency by reducing signal reflection. Preamplifier circuitry is the circuit unit that initially amplifies the signal. Specifically, it can be implemented using a common-emitter amplifier circuit constructed with transistor Q2. Its function is to amplify the low-power signal output from the DDS to a level suitable for subsequent power amplification. Filter circuitry eliminates power supply interference. Specifically, it can be implemented using an RC low-pass filter network composed of capacitors C9 and C12 and resistor R2. Its function is to ensure the purity of the amplified signal by suppressing high-frequency noise. Power amplifier circuitry boosts the signal power to the level required to drive the load. Specifically, it can be implemented using a Class A amplifier composed of transistor Q1 and bias resistor R3. Its function is to adjust the bias voltage to ensure the transistor operates in its optimal linear region, avoiding signal distortion.

[0053] Specifically, when the signal output from the frequency generation module enters the high-voltage amplification module, it first passes through an impedance matching circuit composed of R7, R9, and R10 to reduce signal reflection loss. The matched signal is then amplified by transistor Q2, still operating at low power. The amplified signal then enters a filter circuit composed of C9, R2, and C12 to filter out ripple interference introduced by the power supply. The filtered, clean signal is input to the power amplification stage composed of Q1. By adjusting the resistance of R3, the quiescent operating point of Q1 is stabilized in the linear segment of the amplification region, ultimately outputting a power signal that meets the high-voltage excitation requirements. This multi-stage amplification structure optimizes signal quality and power levels at each stage, ensuring that the output signal possesses both high-voltage driving capability and waveform integrity.

[0054] A quartz crystal oscillator sweep frequency testing and cleaning system is further proposed, including a channel switching module. This module contains a switching control chip, which receives channel switching commands through pins A1, A2, and A3, enabling flexible switching of multiple channels. The switching control chip uses a 0.01uF power supply filter to ensure clean power. RFA_OUT, as the amplifier output, is connected to the input frequency terminal of the HMC253AQS24, while FO1-FO8 are the frequency output terminals. Flexible switching of eight channels is achieved through switching control, thus ensuring compatibility with different trays.

[0055] The switching control chip is an integrated circuit used to receive external commands and control the circuit's on / off state. Specifically, it can be implemented using the HMC253AQS24 chip. This chip receives binary encoded signals through pins A1, A2, and A3, and after parsing, drives the internal switch array to complete channel switching. The power supply filter circuit consists of 0.01uF capacitors to filter out high-frequency noise interference and ensure stable power supply to the chip. The multi-channel switching function connects to external tray contacts through the FO1-FO8 outputs, dynamically selecting the target path according to commands to avoid contact problems caused by manual operation.

[0056] Specifically, the channel switching module receives channel selection commands from the host computer via a switching control chip. For example, when switching to the third channel is required, the A1, A2, and A3 pins input a binary encoded signal "011". The chip's internal logic circuit drives the corresponding switch to close, transmitting the high-voltage frequency signal from the RFA_OUT terminal to the FO3 output terminal. A power supply filter circuit suppresses external power supply noise from interfering with the chip's operation, ensuring the reliability of the switching action. With eight independent output channels, the system can adapt to different sized trays; for example, an eight-column universal tray can complete the cleaning of all crystal oscillators without flipping.

[0057] Another preferred embodiment of the present invention provides a method for cleaning a quartz crystal oscillator by sweeping frequency and electrical testing, comprising the following steps: The system sets the center frequency, scanning bandwidth, and number of scanning points; calculates the starting frequency, ending frequency, and incremental frequency; based on the starting and ending frequencies and the number of measurement points, it iteratively obtains several frequency values ​​to be measured and their corresponding power values; generates corresponding frequency signals based on the frequency and power values; adjusts and amplifies the frequency signals; switches the amplified frequency signals to the target channel according to the channel switching command and applies them to the quartz crystal oscillator to be cleaned; collects the feedback signal from the quartz crystal oscillator, processes it, and sends it back to the control module, which identifies the resonant frequency; based on the identification result, the control module issues an electrical cleaning command with a specified frequency, power, and cleaning time to perform oscillation cleaning on the quartz crystal oscillator; after the cleaning time is reached, the output signal is turned off, completing a single cleaning operation.

[0058] The formulas for calculating the starting frequency and the ending frequency are as follows: Starting frequency = Center frequency - Scan bandwidth * 0.5; End frequency = Center frequency + Scan bandwidth * 0.5; Based on the starting frequency, ending frequency, and number of scan points, calculate the increment value between each measured frequency and the next frequency: Increment frequency = (End frequency - Start frequency) / (Number of scan points - 1); Specifically, the frequency signal generation and processing are achieved through the collaboration of a DDS chip and a high-voltage amplifier circuit: the DDS chip receives the frequency control word from the control module, generates an initial sine wave signal through an internal phase accumulator and DAC conversion, and then filters and shapes it through a signal conditioning circuit, for example, using an 8th-order Butterworth low-pass filter with a cutoff frequency of 450MHz, before sending it to the high-voltage amplifier module after removing spurious harmonics. The amplifier circuit adopts a two-stage amplification structure. The preamplifier stage uses an OPA695 high-speed operational amplifier to achieve a 10x gain, and the power stage uses an AD8318 RF amplifier to boost the signal power to 5W-30W to meet the excitation requirements of crystal oscillators of different specifications.

[0059] In the signal application and feedback stage, the channel switching module, according to control commands (such as binary code "101" corresponding to channel 5), precisely connects the amplified frequency signal to the electrode pins of the target crystal oscillator. Simultaneously, the detection circuit, through a directional coupler, acquires the reflected and transmitted signals from the crystal oscillator in real time. These signals are then converted into DC voltage signals by the AD8302 detector and sent to the FPGA for digital processing. The control module compares the amplitude of the feedback signals at different frequency points. When the signal amplitude suddenly increases and exceeds a threshold, the frequency point is marked as the resonant frequency, and the corresponding power response curve is recorded.

[0060] The oscillation cleaning phase employs a dynamic parameter adjustment strategy: the control module uses the identified resonant frequency as a benchmark and selects the main resonant frequency, the second harmonic frequency, and the third harmonic frequency to form a composite cleaning frequency group. The main resonant frequency accounts for 60% of the cleaning time, and the harmonic frequencies together account for 40%. Power output is dynamically adjusted based on the resonant intensity. When the feedback signal amplitude is stable, the current power is maintained; if the amplitude drops by more than 15%, the power is automatically increased by 5% to compensate for energy loss. Cleaning timing uses a dual verification mechanism: a software timer records the duration, and a hardware counter accumulates the number of excitation pulses. When the deviation between the two is less than 0.1%, the cleaning time is considered to have met the standard, ensuring consistent cleaning results.

[0061] After cleaning, the control module first cuts off the high-voltage output, then uses the channel switching module to place all channels in a high-impedance state to avoid the influence of residual charge on crystal oscillator performance. Finally, a cleaning report is generated, including cleaning frequency, power, duration, and resonant frequency offset, providing data support for subsequent quality inspection. This method automates the entire process from parameter setting, frequency scanning, and resonance identification to precise cleaning, significantly improving cleaning efficiency and crystal oscillator performance consistency.

[0062] Furthermore, the control module identifies the resonant frequency by including the following steps: The amplitude of the feedback signal at the current frequency is compared with the amplitude of the feedback signal at the previous frequency to calculate the amplitude change. When the amplitude change reaches a threshold, the frequency position is marked as a suspected resonant frequency region. Adjacent suspected resonant frequency regions are merged to form a candidate resonant frequency region. The frequency with the largest signal intensity within the candidate resonant frequency region is extracted as the resonant frequency or harmonic frequency of the quartz crystal oscillator. After obtaining the resonant frequency or harmonic frequency, it can be translated by the translation module and then output by the frequency generation module with the specified frequency, power, and output time. This allows the crystal to oscillate fully, realizing the electro-cleaning process of the crystal.

[0063] The amplitude change is calculated using a dynamic differential algorithm, specifically by subtracting the amplitude of the previous frequency from the amplitude of the feedback signal at the current frequency. Normalization is then applied to eliminate the influence of differences in initial signal strength between different crystal oscillators. The threshold setting employs an adaptive mechanism: the system first collects the average amplitude of 10 frequency points during the initial frequency sweep and automatically sets the threshold to this average amplitude. This avoids noise-induced false triggering while ensuring that weak resonant signals are not missed.

[0064] Specifically, the process of marking suspected resonant regions incorporates frequency interval characteristics: when the mean of two or more consecutive frequency points exceeds a threshold, the frequency range is marked as a suspected region, and the starting frequency, ending frequency, and maximum amplitude value within the region are recorded. For adjacent suspected regions (interval ≤ 2 frequency points), automatic merging is performed. The starting frequency of the merged candidate region is the starting frequency of the first region, and the ending frequency is the ending frequency of the last region. The signal quantity within the region is quantified and evaluated by calculating the average power density.

[0065] In the resonant frequency extraction stage, a weighted peak search algorithm is used: Each frequency point within the candidate region is assigned a weight, with higher weights closer to the region center. The weight coefficient increases linearly from 1.0 to 1.5. The frequency corresponding to the maximum weighted amplitude is then used as the final resonant frequency. If multiple peaks exist within a region, they are identified as harmonic frequency groups, labeled as the fundamental frequency, second harmonic, third harmonic, etc., and the amplitude percentage of each harmonic is recorded.

[0066] After obtaining the resonant frequency parameters, the control module sends control commands to the translation module through the PCIe high-speed interface. The commands contain three core parameters: frequency parameters, power parameters, and time parameters. After translation, the translation module sends the commands to the frequency generation module, which generates the specified frequency signal. The signal is then amplified by the high-voltage amplification module and finally applied precisely to the target quartz crystal oscillator through the channel switching module to excite it to generate mechanical resonance. The high-frequency mechanical vibration at resonance causes the contaminants attached to the surface to detach due to inertial force, while avoiding the ineffective energy loss in the non-resonant state.

[0067] During the cleaning process, the demodulation module receives feedback signals and sends them to the control module via the translation module and the PCIe high-speed interface. This allows the control module to monitor the amplitude change rate of the feedback signals in real time. When the amplitude change rate is less than a set value and remains so for a certain period, it is determined that the contaminants have been largely desorbed. The cleaning at the current frequency can then be terminated early, and the system can switch to the next frequency point, thus improving cleaning efficiency through dynamic adjustment. The final generated resonant frequency identification report includes: the fundamental frequency and all harmonic frequency values, corresponding amplitude values, cleaning parameter combinations, and actual cleaning time, providing data support for process optimization.

[0068] Furthermore, frequency adjustment specifically includes the following steps: Connect the output of the frequency generation module to a power measurement instrument. Adjust the power control analog quantity through the control module, record the actual output power corresponding to different analog quantities, and establish a correspondence table between the power control analog quantity and the actual output power. During cleaning, use a lookup table to call the power control analog quantity corresponding to the target power to achieve precise control of the output power. Through precise power control, the excitation power can be dynamically matched according to the crystal oscillator resonance intensity, avoiding the problems of excessive stress and latent damage to the crystal due to excessive power or incomplete cleaning due to insufficient power in traditional fixed-power cleaning. During calibration, the correspondence between power and frequency is recorded simultaneously to ensure that the power output at each harmonic frequency matches the crystal's tolerance, reduce performance degradation, and ensure product lifespan.

[0069] Furthermore, the frequency of the oscillation cleaning includes the main harmonic frequency, the subharmonic frequency, and the noise frequency. By exciting different vibration modes of the quartz crystal oscillator through multiple frequency modes, potential, insensitive defects are stimulated, thus preventing products from being missed.

[0070] In some other preferred embodiments of the present invention, a computer-readable storage medium is provided storing a computer program that, when executed by a processor, causes the processor to perform the steps of the method as described in the above embodiments.

[0071] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, essentially, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0072] The above description is a detailed description of the preferred embodiments of the present invention. However, the embodiments are not intended to limit the scope of the patent application of the present invention. All equivalent changes or modifications made under the technical spirit of the present invention should fall within the patent scope covered by the present invention.

Claims

1. A quartz crystal oscillator sweep frequency electrical cleaning system characterized by, The application relates to a quartz crystal oscillator cleaning system, which comprises the following parts: a control module, a translation module, a frequency generation module, a high-voltage amplification module, a channel switching module and a demodulation module. The control module is used for storing frequency and power related control parameters. The translation module is used for receiving the control parameters sent by the control module and translating the control parameters into instruction outputs. The frequency generation module is used for receiving the instructions and generating high-voltage frequencies. The high-voltage amplification module is used for amplifying the high-voltage frequencies. The channel switching module is used for switching the amplified frequencies to specified channels for quartz crystal measurement. The demodulation module is used for receiving feedback signals sent by the quartz crystal and sending the demodulated feedback signals to the translation module.

2. The quartz crystal sweep frequency electrical cleaning system of claim 1, wherein, The control module and the translation module are connected through a signal interaction module.

3. The quartz crystal sweep frequency electrical cleaning system of claim 2, wherein, The signal interaction module adopts a PCIE high-speed interface.

4. The quartz crystal sweep frequency electrical cleaning system of claim 2, wherein, An arithmetic logic unit is arranged in the control module, the arithmetic logic unit receives the feedback signals, calculates and analyzes the feedback signals, finds the harmonic frequency region of the quartz crystal, determines the electric cleaning control instruction of the corresponding quartz crystal according to the harmonic frequency region, and sends the electric cleaning control instruction to the translation module.

5. The quartz crystal sweep frequency electrical cleaning system of claim 4, wherein, The arithmetic logic unit extracts the amplitude of the feedback signals, compares the amplitudes of the same quartz crystal before and after, obtains the amplitude variation, and when the amplitude variation is greater than a threshold value, the frequency corresponding to the feedback signal is a harmonic frequency, and the harmonic frequency position is a resonance frequency region.

6. The quartz crystal sweep frequency electrical cleaning system of claim 4, wherein, The frequency generation module comprises a DDS chip and a peripheral circuit connected with the DDS chip.

7. The quartz crystal sweep frequency electrical cleaning system of claim 1, wherein, The translation module comprises an FPGA chip, which is used for translating the control instructions sent by the control module into driving signals of the frequency generation module, and simultaneously performing digital processing on the analog signals sent by the demodulation module and feeding the analog signals back to the control module.

8. The quartz crystal sweep frequency electrical cleaning system of claim 6, wherein, The frequency generation module comprises a frequency and power adjustment circuit, which amplifies the frequency output by the DDS chip through a preamplifier, then performs impedance matching amplification, and outputs a signal with stable power.

9. The quartz crystal sweep frequency electrical cleaning system of claim 1, wherein, The high-voltage amplification module comprises an impedance matching circuit, a preamplification circuit, a filter circuit and a power amplification circuit connected in sequence.

10. The quartz crystal sweep frequency electrical cleaning system of claim 1, wherein, The channel switching module comprises a switching control chip, which receives channel switching instructions through A1, A2 and A3 pins and realizes flexible switching of multiple channels.

11. A method of electrical cleaning by quartz crystal sweep, characterized by, The application further discloses a quartz crystal oscillator cleaning method. The method comprises the following steps: setting a center frequency, a scanning bandwidth and a scanning point number, calculating a starting frequency, an ending frequency and an increment frequency; according to the starting frequency and the ending frequency, a plurality of frequency values and corresponding power values required to be measured are obtained through a cycle according to the measurement point number; a corresponding frequency signal is generated according to the frequency values and the power values, the frequency signal is subjected to frequency adjustment and amplification; the amplified frequency signal is switched to a target channel according to a channel switching instruction and is applied to a quartz crystal oscillator to be cleaned; a feedback signal of the quartz crystal oscillator is collected and is fed back to the control module after processing, and the control module identifies a resonance frequency; according to the identification result, an electric cleaning instruction of a specified frequency, power and cleaning time is sent by the control module, and the quartz crystal oscillator is subjected to oscillation cleaning; after the cleaning time is reached, the output signal is turned off, and a single cleaning operation is completed. ​ ​ ​ ​ ​ ​ 12. The quartz crystal sweep frequency electrical cleaning method according to claim 11, wherein, The control module identifying the resonant frequency specifically comprises the following steps: comparing the feedback signal amplitude of the current frequency with the feedback signal amplitude of the previous frequency, and calculating the amplitude variation; when the amplitude variation reaches a threshold, marking the frequency position as a suspected resonant frequency region; merging adjacent suspected resonant frequency regions to form a resonant frequency candidate region; extracting the frequency with the largest signal quantity in the resonant frequency candidate region as the resonant frequency of the quartz crystal oscillator.

13. The quartz crystal sweep frequency electrocleaning method according to claim 11, wherein The frequency adjustment specifically comprises the following steps: connecting the output end of the frequency generation module to a power measuring instrument, adjusting the power control analog quantity through the control module, recording the actual output power corresponding to different analog quantities, and establishing a corresponding relationship table of the power control analog quantity and the actual output power; when cleaning, the power control analog quantity corresponding to the target power is called through the table lookup method to realize precise control of the output power.

14. The quartz crystal sweep frequency electrocleaning method according to claim 11, wherein The frequency of the oscillation cleaning includes a main harmonic frequency, a sub-harmonic frequency and a miscellaneous wave frequency, and different vibration modes of the quartz crystal oscillator are excited through a multi-frequency mode.

15. A storage medium, characterized by The computer program is stored, and the computer program is executed by the processor to make the processor execute the steps of the quartz crystal oscillator sweep frequency test electric cleaning method according to any one of claims 11-14.

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