Surface-mounted quartz crystal resonator

Abstract

The utility model relates to the technical field of resonators, and discloses a surface-mounted quartz crystal resonator, which is characterized in that a sleeve shell is sleeved outside a mounting sleeve block, a splicing type movable groove is formed in the outer wall of the middle part of the bottom surface of the sleeve shell, and inward-retracting abutting blocks are fixedly connected in grooves in the upper side and the lower side of the sleeve shell; a clamping block is fixedly connected to a groove in the top of the end, close to the mounting sleeve block, of the sleeve shell, and one end of the clamping block is bent downwards into a second clamping groove of the mounting sleeve block. According to the utility model, through the arrangement of the inclined plane abutting block, the inward-retracting abutting block and the mounting sleeve block, the inclined plane abutting block abuts against the top of the overlapped part of the mounting sleeve block and the chip, the structural stability and the contact reliability are enhanced, the inward-retracting abutting block and the clamping block are matched with the clamping groove of the mounting sleeve block, and the insertion block is inserted into the circuit board slot, so that rapid assembly is realized, and the connection is firm; the stability of the device in work is ensured, and reliable signal conduction is ensured.

Description

Technical Field

[0001] This utility model relates to the field of resonator technology, specifically to a surface-mount quartz crystal resonator. Background Technology

[0002] A quartz crystal resonator is an electronic component that uses the piezoelectric effect of a quartz crystal to generate a high-precision oscillation frequency. It mainly consists of a quartz crystal wafer, a base, and a housing. Based on the lead configuration, quartz crystal resonators can be divided into two types: through-hole (with leads) and surface mount (without leads).

[0003] Application number CN202122659412.4 discloses a small surface-mount quartz crystal resonator, comprising: an insulating base, a quartz crystal, a housing, and an insert. The quartz crystal is disposed within the insulating base. A retaining ring extending upwards and located outside the quartz crystal is provided on the top edge of the insulating base. The housing is disposed on the insulating base and located outside the retaining ring. An embedding groove is recessed on the outer side of the insulating base and located at the bottom of the housing. The insert is disposed in the embedding groove and welded to the housing. This small surface-mount quartz crystal resonator improves structural strength by wrapping the retaining ring with the housing, and enhances the ease of welding the insert to the housing and improves structural stability by using the embedding groove to limit the insert's position.

[0004] In daily use, the connection of this structure relies on welding points. With long-term use or vibration, the welding points may crack, causing the connection between the shell and the base to loosen and reducing the reliability of the resonator. In addition, the shell covering the outside of the retaining ring may hinder the dissipation of internal heat. Heat accumulation will affect the performance and service life of the device. Finally, the welding fixing method makes it difficult to disassemble and repair when the component is damaged, often requiring the whole replacement, which increases the cost of use. Utility Model Content

[0005] The purpose of this invention is to provide a surface-mount quartz crystal resonator that solves the problem of difficult maintenance and replacement of such resonators.

[0006] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0007] This utility model relates to a surface-mount quartz crystal resonator, comprising a chip assembly and a fixing assembly. The fixing assembly is installed outside the chip assembly. The chip assembly includes a mounting sleeve. The upper and lower outer walls of the mounting sleeve are respectively provided with a first slot and a second slot. A housing is fitted over the mounting sleeve. A splicing movable groove is provided on the middle outer wall of the bottom surface of the housing. An inward abutment is fixedly connected to the grooves on the upper and lower sides of the housing. The protrusion of the inward abutment extends into the first slot of the mounting sleeve. A locking block is fixedly connected to the top groove of the end of the housing near the mounting sleeve. One end of the locking block is bent downward into the second slot of the mounting sleeve. The purpose of this setup is that, during the use of the resonator, the chip is inserted into the inner wall of one side of the mounting sleeve, and the conductive copper wire is installed on the bottom inner wall of the mounting sleeve, extending to the top inner wall of the circuit board to establish a signal transmission path. The housing is fitted onto the outside of the mounting sleeve, and the inward-facing abutment is embedded in the first slot of the mounting sleeve. The abutment is bent downward to the second slot to achieve a snap-fit ​​fixation between the housing and the mounting sleeve. The insert at the bottom of the housing is inserted into the slot of the circuit board, and the limiting groove assists in positioning, ensuring that the resonator is firmly mounted on the surface of the circuit board. When the chip operates, it generates a resonant signal, which is transmitted to the circuit board via the conductive copper wire. The heat dissipation groove on the housing dissipates the operating heat, and the inclined abutment presses against the top of the overlapping area between the mounting sleeve and the chip, enhancing structural stability and contact reliability. The slotted engagement of the retaining block, locking block, and mounting sleeve, along with the insertion block's connection to the circuit board slot, enables rapid assembly and a secure connection, ensuring device stability during operation. The casing encloses the chip assembly, isolating it from external physical impacts and dust, preventing damage to the chip and conductive copper wires. It also provides electromagnetic shielding, reducing external interference and improving signal stability. The heat sink increases the heat dissipation area, preventing performance degradation due to overheating. The beveled retaining block reinforces the pressure and fixation between the chip and the mounting sleeve, ensuring reliable signal transmission. The overall structural design maintains mechanical stability and electrical connection stability during mounting and operation, extending service life and ensuring accurate resonant function. It is suitable for electronic devices with high requirements for stability and reliability.

[0008] Furthermore, a chip is inserted into the inner wall of one side of the mounting sleeve, and a conductive copper wire is installed on the inner wall of the bottom of the tail end of the mounting sleeve. The purpose of this arrangement is that, during the use of the resonator, the chip is inserted into the inner wall of one side of the mounting sleeve, and the conductive copper wire is installed on the inner wall of the bottom of the tail end of the mounting sleeve, extending to the inner wall of the top of the circuit board. When the chip operates, it generates a resonant signal, which is transmitted to the circuit board through the conductive copper wire, thus establishing a path for signal transmission.

[0009] Furthermore, a sloping abutment is fixedly connected to the top groove of the housing near the connection between the mounting block and the chip. The bottom end of the sloping abutment presses downwards against the top of the overlapping area between the mounting block and the chip. The purpose of this design is to strengthen the pressure and fixation between the chip and the mounting block during the use of the resonator, ensuring reliable signal transmission. The overall structural design ensures that the resonator maintains mechanical stability and electrical connection stability during mounting and operation.

[0010] Furthermore, a circuit board is located directly below the housing, with the housing situated on the upper surface of the circuit board, and the conductive copper wire extending to the top inner wall of the circuit board. The purpose of this arrangement is that, during the use of the resonator, the housing fixes the mounting block and chip above the circuit board. When the chip operates, it generates a resonant signal, which is transmitted to the circuit board via the conductive copper wire, thus establishing a signal transmission path.

[0011] Furthermore, limiting grooves are respectively formed on the outer walls of both sides of the circuit board, and slots are respectively formed around the upper surface of the circuit board. The purpose of this arrangement is that during the use of the resonator, the insert at the bottom of the housing is inserted into the slot of the circuit board, and the limiting grooves assist in positioning, so that the resonator is firmly attached to the surface of the circuit board.

[0012] Furthermore, heat dissipation grooves are respectively formed on the outer walls of the bottom two sides of the housing, and insertion blocks are fixed on the outer walls of the two sides of the housing. One end of the insertion block extends downward and is inserted into the inner wall of the slot. The purpose of this arrangement is to enable quick assembly and a firm connection when the insertion block is inserted into the circuit board slot during the use of the resonator, ensuring the stability of the device during operation. The housing also encloses the chip assembly, isolating it from external physical impacts, dust, etc.

[0013] This utility model has the following beneficial effects:

[0014] (1) This utility model uses a sloped abutment block, an inward abutment block and a mounting sleeve block. The sloped abutment block presses against the top of the mounting sleeve block and the chip overlap, which enhances the structural stability and contact reliability. The inward abutment block, the card block and the mounting sleeve block are matched with the card slots. The plug block is inserted into the circuit board slot, which realizes quick assembly and a firm connection, ensuring the stability of the device during operation and ensuring reliable signal transmission.

[0015] (2) This utility model uses a housing, inserts and a circuit board. The housing fixes the mounting block and the chip on the circuit board through the inserts, which enables quick assembly and a firm connection, ensuring the stability of the device during operation. The chip generates a resonant signal during operation, which is transmitted to the circuit board through the conductive copper wire, thus establishing a path for signal transmission.

[0016] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the main structure of the present utility model;

[0019] Figure 2 This is a schematic diagram of the disassembled structure of the chip assembly of this utility model;

[0020] Figure 3 This is a schematic diagram of the bottom structure of the fixing component of this utility model;

[0021] Figure 4 This is a cross-sectional schematic diagram of the internal structure of the fixing component of this utility model;

[0022] The attached diagram lists the components represented by each number as follows:

[0023] In the diagram: 1. Chip assembly; 101. Circuit board; 102. Limiting groove; 103. Slot; 105. Mounting sleeve; 106. Conductive copper wire; 107. Chip; 108. Slot 1; 109. Slot 2; 2. Fixing assembly; 201. Housing; 202. Splicing movable slot; 203. Insert block; 204. Locking block; 205. Retractable abutment block; 206. Angled abutment block; 207. Heat dissipation groove. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1-4As shown, this utility model is a surface-mount quartz crystal resonator, including a chip assembly 1 and a fixing assembly 2. The fixing assembly 2 is installed on the outside of the chip assembly 1. The chip assembly 1 includes a mounting sleeve 105. The upper and lower outer walls of the mounting sleeve 105 are respectively provided with a first slot 108 and a second slot 109. A housing 201 is fitted on the outside of the mounting sleeve 105. A splicing movable groove 202 is provided on the middle outer wall of the bottom surface of the housing 201. An inward abutment block 205 is fixedly connected in the grooves on the upper and lower sides of the housing 201. The protrusion of the inward abutment block 205 extends into the first slot 108 of the mounting sleeve 105. A locking block 204 is fixedly connected to the top groove of the housing 201 near the mounting sleeve 105. One end of the locking block 204 is bent downward into the second slot 109 of the mounting sleeve 105. The purpose of this arrangement is that, during the use of the resonator, the chip 107 is inserted into the inner wall of one side of the mounting sleeve 105, and the conductive copper wire 106 is installed on the inner wall of the bottom of the tail end of the mounting sleeve 105, extending to the inner wall of the top of the circuit board 101 to establish a path for signal transmission. The housing 201 is fitted onto the outside of the mounting sleeve 105, and the inward abutment 205 is embedded in the slot 108 of the mounting sleeve 105. The snap-fit ​​block 204 is bent downward to the slot 109 to achieve the snap-fit ​​fixation between the housing 201 and the mounting sleeve 105. The insert block 203 at the bottom of the housing 201 is inserted into the slot 103 of the circuit board 101, and the limiting groove 102 assists in positioning, so that the resonator is firmly attached to the surface of the circuit board 101. When the chip 107 works, it generates a resonant signal, which is transmitted to the circuit board 101 through the conductive copper wire 106. The heat dissipation groove 207 on the housing 201 dissipates the working heat, and the inclined abutment block 206 presses against the mounting sleeve 105 and the chip. At the top of the overlapping section 107, structural stability and contact reliability are enhanced. The recessed abutment block 205, the locking block 204, and the mounting sleeve block 105 engage with each other in their respective slots. The insertion block 203 is inserted into the slot of the circuit board 101, enabling rapid assembly and a firm connection, ensuring the stability of the device during operation. The housing 201 encloses the chip assembly 1, isolating it from external physical impacts, dust, etc., preventing damage to the chip 107 and the conductive copper wire 106. It also provides electromagnetic shielding, reducing external interference and improving signal stability. The heat sink 207 increases the heat dissipation area, preventing the device's performance from degrading due to overheating. The inclined abutment block 206 strengthens the pressure and fixation of the chip 107 and the mounting sleeve block 105, ensuring reliable signal transmission. The overall structural design ensures that the resonator maintains mechanical stability and electrical connection stability during mounting and operation, extending its service life and ensuring the accurate realization of the resonance function. It is suitable for electronic equipment with high requirements for stability and reliability.

[0026] A chip 107 is inserted into the inner wall of one side of the mounting sleeve 105, and a conductive copper wire 106 is installed on the inner wall of the bottom of the tail end of the mounting sleeve 105. The purpose of this arrangement is that, during the use of the resonator, the chip 107 is inserted into the inner wall of one side of the mounting sleeve 105, and the conductive copper wire 106 is installed on the inner wall of the bottom of the tail end of the mounting sleeve 105, extending to the inner wall of the top of the circuit board 101. When the chip 107 operates, it generates a resonant signal, which is transmitted to the circuit board 101 through the conductive copper wire 106, thus establishing a path for signal transmission.

[0027] A beveled abutment 206 is fixedly connected to the top groove of the housing 201 near the connection between the mounting sleeve 105 and the chip 107. The bottom end of the beveled abutment 206 presses downward against the top of the overlapping area between the mounting sleeve 105 and the chip 107. The purpose of this arrangement is to strengthen the pressing and fixing of the chip 107 and the mounting sleeve 105 during the use of the resonator, ensuring reliable signal transmission. The overall structural design ensures that the resonator maintains mechanical stability and electrical connection stability during mounting and operation.

[0028] A circuit board 101 is located directly below the housing 201, with the housing 201 situated on the upper surface of the circuit board 101. A conductive copper wire 106 extends to the inner top wall of the circuit board 101. This arrangement ensures that during the resonator's operation, the housing 201 secures the mounting block 105 and the chip 107 above the circuit board 101. The chip 107 generates a resonant signal, which is transmitted to the circuit board 101 via the conductive copper wire 106, thus establishing a signal transmission path.

[0029] Limiting grooves 102 are respectively provided on the outer walls of both sides of the circuit board 101, and slots 103 are respectively provided around the upper surface of the circuit board 101. The purpose of this arrangement is that during the use of the resonator, the insert 203 at the bottom of the housing 201 is inserted into the slot 103 of the circuit board 101, and the limiting grooves 102 assist in positioning, so that the resonator is firmly attached to the surface of the circuit board 101.

[0030] Heat dissipation grooves 207 are respectively provided on the outer walls of the bottom two sides of the housing 201. Insert blocks 203 are fixed on the outer walls of the two sides of the housing 201. One end of the insert block 203 extends downward and is inserted into the inner wall of the slot 103. The purpose of this arrangement is to enable the insert block 203 to be inserted into the slot of the circuit board 101 during the use of the resonator, so as to achieve quick assembly and a firm connection, ensuring the stability of the device during operation. The housing (201) encloses the chip assembly (1) and isolates it from external physical impacts, dust, etc.

[0031] In use, during the operation of this resonator, chip 107 is inserted into the inner wall of one side of mounting sleeve 105, and conductive copper wire 106 is installed on the bottom inner wall of the tail end of mounting sleeve 105, extending to the top inner wall of circuit board 101 to build a path for signal transmission. Sleeve 201 is fitted onto the outside of mounting sleeve 105, and inner retaining block 205 is embedded in slot 108 of mounting sleeve 105. Card block 204 is bent downward to slot 109 to achieve snap-fit ​​fixation between sleeve 201 and mounting sleeve 105. Insertion block 203 at the bottom of sleeve 201 is inserted into slot 103 of circuit board 101, and limiting groove 102 assists in positioning so that the resonator is firmly attached to the surface of circuit board 101. Chip 107 works to generate a resonant signal, which is transmitted to circuit board 101 through conductive copper wire 106.

[0032] The heat dissipation grooves 207 on the housing 201 dissipate working heat. The inclined abutment block 206 presses against the top of the overlapping part of the mounting sleeve block 105 and the chip 107, enhancing structural stability and contact reliability. The recessed abutment block 205 and the locking block 204 cooperate with the locking groove of the mounting sleeve block 105. The insertion block 203 is inserted into the slot of the circuit board 101, realizing quick assembly and a firm connection, ensuring the stability of the device during operation. The housing 201 wraps around the chip assembly 1, isolating it from external physical impacts, dust, etc., preventing damage to the chip 107 and the conductive copper wire 106. At the same time, it provides electromagnetic shielding, reduces external interference, and improves signal stability. The heat dissipation grooves 207 increase the heat dissipation area and prevent the device from degrading due to overheating. The inclined abutment block 206 strengthens the pressing and fixing of the chip 107 and the mounting sleeve block 105, ensuring reliable signal transmission. The overall structural design keeps the resonator mechanically stable and electrically connected during mounting and operation, extending its service life and ensuring the accurate realization of the resonance function. It is suitable for electronic devices with high requirements for stability and reliability.

[0033] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A surface-mounted quartz crystal resonator comprising a chip assembly (1) and a fixing assembly (2), characterized in that: The fixed assembly (2) is installed outside the chip assembly (1), the chip assembly (1) comprises a mounting sleeve block (105), the upper and lower sides of the mounting sleeve block (105) are respectively provided with a clamping groove one (108) and a clamping groove two (109), the outside of the mounting sleeve block (105) is provided with a sleeve shell (201), the bottom surface of the sleeve shell (201) is provided with a spliced movable groove (202), the upper and lower sides of the sleeve shell (201) are respectively provided with an inwardly extending block (205), the protruding block of the inwardly extending block (205) extends into the clamping groove one (108) of the mounting sleeve block (105), the end of the sleeve shell (201) is provided with a clamping block (204), and the clamping block (204) is bent downward to the clamping groove two (109) of the mounting sleeve block (105).

2. The surface-mounted quartz crystal resonator according to claim 1, wherein: The mounting sleeve block (105) is provided with a chip (107) on one side, and the tail end of the mounting sleeve block (105) is provided with a conductive copper wire (106).

3. The surface-mounted quartz crystal resonator according to claim 2, wherein: The sleeve shell (201) is provided with an inclined block (206) at the top of the connection between the mounting sleeve block (105) and the chip (107), and the bottom end of the inclined block (206) is downwardly arranged on the top of the overlapping part of the mounting sleeve block (105) and the chip (107).

4. The surface-mounted quartz crystal resonator of claim 2, wherein: The sleeve shell (201) is provided with a circuit board (101) below, the sleeve shell (201) is arranged on the upper surface of the circuit board (101), and the conductive copper wire (106) extends to the top inner wall of the circuit board (101).

5. The surface-mounted quartz crystal resonator of claim 4, wherein: The circuit board (101) is provided with a limiting groove (102) on the outer wall of the two sides, and the upper surface of the circuit board (101) is provided with an insertion slot (103).

6. The surface-mounted quartz crystal resonator of claim 5, wherein: The bottom of the sleeve shell (201) is provided with a heat dissipation groove (207) on the outer wall of the two sides, and the two sides of the sleeve shell (201) are provided with an insertion block (203), one end of the insertion block (203) extends downward and is inserted into the inner wall of the insertion slot (103).

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