Processing jig and processing method of forbidden ring for etching equipment

Abstract

The invention relates to the technical field of etching equipment, and discloses a processing jig of a forbidden ring for the etching equipment, and the processing jig of the forbidden ring for the etching equipment comprises a first baffle plate, the first baffle plate is of an annular structure, the first baffle plate is located in a containing cavity, the first baffle plate abuts against a first abutting surface, the first baffle plate abuts against a first side plate, and the first side plate abuts against a second abutting surface; a first distance is formed between the first baffle and the second side plate, a first groove body is formed in the second side plate in a penetrating mode in the first direction, and the projection, located on the first baffle, of the first groove body in the first direction is completely within the range of the first baffle; and the second connecting plate is of an annular structure, the second connecting plate is located at the end, in the first direction, of the first baffle, the second connecting plate is connected with the first baffle, and the second connecting plate shields the first abutting face. The processing jig and the processing method of the forbidden ring for the etching equipment, which are provided by the invention, can prevent the forbidden ring from being damaged during water cutting.

Description

Technical Field

[0001] This application relates to the field of etching equipment technology, and in particular to machining fixtures and machining methods for closed loops in etching equipment. Background Technology

[0002] The containment ring, a crucial component of etching equipment, is used to confine plasma and ensure the stability of the etching process. The containment ring also incorporates a first groove, which further removes byproducts generated during the etching reaction. Currently, the first groove is typically machined using water jet cutting. However, water jet cutting can easily damage other parts of the containment ring, further reducing its processing quality and potentially resulting in scrapped parts. Summary of the Invention

[0003] This application primarily addresses the technical problem that existing locking rings are prone to damage to other parts of the locking ring during waterjet cutting. It provides a machining tool and method for a locking ring used in etching equipment to prevent damage to the locking ring during waterjet cutting.

[0004] To address the aforementioned technical problems, this application provides a machining fixture for a locking ring used in etching equipment. The machining fixture is used to machine the locking ring, which has a cylindrical structure and includes a central position and a circumferential position. The central position is located in the middle of the locking ring, and the circumferential position encloses the central position. A first through hole is provided through the central position along a first direction. A receiving cavity is circumferentially arranged within the circumferential position, and a first side plate and a second side plate are formed at both ends of the receiving cavity along the first direction. A first abutment surface is provided within the receiving cavity between the first and second side plates, and the first abutment surface is arranged along the first direction. The receiving cavity communicates with the first through hole. The machining device for the locking ring used in etching equipment includes... The first baffle is a circular structure and is located in the receiving cavity. The first baffle abuts against the first contact surface and the first side plate. There is a first gap between the first baffle and the second side plate. A first groove is provided through the second side plate along the first direction. The projection of the first groove along the first direction on the first baffle is completely within the range of the first baffle. The second connecting plate has a ring structure and is located at one end of the first baffle along the first direction. The second connecting plate is connected to the first baffle and forms a shield for the first contact surface.

[0005] In one embodiment, the first baffle and the second connecting plate together form a baffle body, the baffle body is circumferentially divided into a plurality of baffle sub-plates, each of the baffle sub-plates includes the first baffle and the second connecting plate, and the baffle sub-plates are connected by a first connecting member.

[0006] In one embodiment, the baffle body is composed of at least three baffle plates.

[0007] In one embodiment, the baffle body is composed of six baffle plates.

[0008] In one embodiment, two adjacent baffle plates within the baffle body form a baffle assembly, and the two baffle plates in the baffle assembly are assembled by splicing structure.

[0009] In one embodiment, the splicing structure includes a splicing protrusion and a splicing groove, the splicing protrusion being located within the splicing groove to form a splicing of two baffle plates, the splicing protrusion being located on one of the baffle plates in the baffle assembly, and the splicing groove being located on the other baffle plate in the baffle assembly.

[0010] In one embodiment, the first connector passes sequentially through the splicing protrusion and the splicing groove to form a connection between the two baffle plates.

[0011] In one possible implementation, the first connector consists of a bolt and a nut.

[0012] This application also provides a method for processing a locking ring for an etching apparatus, wherein the processing is performed using the machining tool for the locking ring of the etching apparatus described in Example 1, and the processing method includes... The first through hole is formed by using a first cutting tool that moves along a first direction and acts on the center position of the closed loop to form the first through hole. The cavity is formed by using a second tool that moves along a second direction and acts on the circumferential position of the closed loop to form the cavity. The processing tool is placed by placing the baffle plates one by one into the receiving cavity, and splicing them together in the receiving cavity using the first connector to form the baffle body located in the receiving cavity. The baffle body abuts against the first contact surface and the first side plate. The first groove is formed by processing the second side plate using water jet cutting, and the first groove is located on the second side plate. The baffle body blocks the cutting liquid in the water jet cutting to protect the first side plate.

[0013] In one possible implementation, the second tool is a T-shaped tool.

[0014] Compared to existing technologies, the etching equipment of this application uses a locking ring to place the machining tool into the receiving cavity during processing and to protect the first side plate and the first contact surface, so as to avoid the cutting liquid from causing processing damage to the first side plate. Attached Figure Description

[0015] Appendix Figure 1 This is a schematic diagram of a closed loop for etching equipment according to this application; Appendix Figure 2 This is a schematic diagram of a structure between the closed-loop device for etching equipment and the machining tool in this application; Appendix Figure 3 This is another structural diagram of the closed-loop device for etching equipment and the machining tool in this application; Appendix Figure 4 This is a schematic diagram of a machining tool used in this application; Appendix Figure 5 This is a schematic diagram of one structure of the baffle plate in this application; Appendix Figure 6 This is a schematic diagram of another structure of the baffle plate in this application.

[0016] Explanation of the labels in the diagram: X, first direction; Y, second direction; 10. Closed loop; 11. First through hole; 12. Receiving cavity; 13. First side plate; 14. Second side plate; 15. First abutment surface; 16. First groove; 20. Processing tools; 100. Main body of the baffle; 110. Baffle plate; 111. First baffle; 112. Second connecting plate; 200. Splicing structure; 210. Splicing protrusion; 220. Splicing groove; 300. First connector; 30. Cutting liquids. Detailed Implementation

[0017] To make the objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] The existing technology has a technical problem that the locked loop is prone to damage to other parts of the locked loop during water jet cutting.

[0019] To address this, this application provides a machining fixture for a locking ring used in etching equipment. The machining fixture is used to machine the locking ring, which has a cylindrical structure and includes a central position and a circumferential position. The central position is located in the middle of the locking ring, and the circumferential position encloses the central position. A first through hole is provided through the central position along a first direction. A receiving cavity is circumferentially arranged within the circumferential position, and a first side plate and a second side plate are formed at both ends of the receiving cavity along the first direction. A first abutment surface is provided within the receiving cavity between the first and second side plates, and the first abutment surface is arranged along the first direction. The receiving cavity communicates with the first through hole. The machining apparatus for the locking ring used in etching equipment includes... The first baffle is a circular structure and is located in the receiving cavity. The first baffle abuts against the first contact surface and the first side plate. There is a first gap between the first baffle and the second side plate. A first groove is provided through the second side plate along the first direction. The projection of the first groove along the first direction on the first baffle is completely within the range of the first baffle. The second connecting plate has a ring structure and is located at one end of the first baffle along the first direction. The second connecting plate is connected to the first baffle and forms a shield for the first contact surface.

[0020] This application also provides a method for processing a locking ring for an etching apparatus, wherein the processing is performed using the machining tool for the locking ring of the etching apparatus described in Example 1, and the processing method includes... The first through hole is formed by using a first cutting tool that moves along a first direction and acts on the center position of the closed loop to form the first through hole. The cavity is formed by using a second tool that moves along a second direction and acts on the circumferential position of the closed loop to form the cavity. The processing tool is placed by placing the baffle plates one by one into the receiving cavity, and splicing them together in the receiving cavity using the first connector to form the baffle body located in the receiving cavity. The baffle body abuts against the first contact surface and the first side plate. The first groove is formed by processing the second side plate using water jet cutting, and the first groove is located on the second side plate. The baffle body blocks the cutting liquid in the water jet cutting to protect the first side plate.

[0021] Example 1: In existing technology, the confinement ring 10, as a crucial component in etching equipment, is used to confine the plasma and ensure the stability of the etching process. (Appendix) Figure 1 This is a schematic diagram of a possible structure of the locking ring 10 for the etching equipment in this application. Please refer to the attached diagram. Figure 1As shown, the locking ring 10 in this embodiment has a cylindrical structure. The locking ring 10 includes a central position and a circumferential position. The central position is the middle of the locking ring 10, and the circumferential position is the outer edge of the locking ring 10. The circumferential position encompasses the central position, and the blank used to manufacture the locking ring 10 is a solid cylindrical structure. A first through hole 11 is provided through the central position along the first direction X. A receiving cavity 12 is provided circumferentially within the circumferential position. Circumferential arrangement means that the receiving cavity 12 surrounds the first through hole 11. The receiving cavity 12 is located at the middle position of the locking ring 10 along the first direction X. The receiving cavity 12 has an opening facing the first through hole 11, and the receiving cavity 12 communicates with the first through hole 11. Due to the arrangement of the receiving cavity 12, the locking ring 10 is further divided into a first side plate 13, a second side plate 14, and a first connecting plate. The first side plate 13 and the second side plate 14 are located on both sides of the receiving cavity 12 along the first direction X. The first connecting plate is located between the first side plate 13 and the second side plate 14, and the first connecting plate has a ring structure. The first connecting plate is connected to the first side plate 13 and the second side plate 14 respectively. The first connecting plate has a first abutting surface 15 on the side facing the receiving cavity 12. That is, the first abutting surface 15 is provided in the receiving cavity 12 between the first side plate 13 and the second side plate 14. The first abutting surface 15 is also arranged along the first direction X. A first groove 16 is provided through the second side plate 14 along the first direction X. The first groove 16 is connected to the receiving cavity 12. The arrangement of the first groove 16 can further discharge the by-products formed by the etching reaction. In the prior art, the processing of the first groove 16 is generally carried out by water cutting. During water cutting, the cutting liquid 30 first contacts the second side plate 14 to form the first groove 16, and then further contacts the first side plate 13 through the receiving cavity 12, thereby damaging the first side plate 13, reducing the processing quality of the closed loop 10, and even resulting in scrapped parts.

[0022] Please refer to the attached document. Figure 1 To be continued Figure 6 As shown, in this embodiment, the first direction XX refers to the height direction of the locking ring 10, that is, the direction of the locking ring 10 from top to bottom or from bottom to top. In this application, the first side plate 13 is disposed lower than the second side plate 14, and the second side plate 14 is disposed higher than the first side plate 13. In this embodiment, the second direction Y refers to the width direction of the locking ring 10. When the locking ring 10 is a cylindrical structure, the second direction Y is the diameter direction of the locking ring 10.

[0023] Appendix Figure 2 This is a schematic diagram of a structure between the isolation ring 10 of the etching equipment and the machining fixture 20 of this application. Figure 3 This is another structural schematic diagram of the relationship between the locking ring 10 of the etching equipment and the machining fixture 20 in this application. Please refer to the attached diagram. Figure 2 and appendix Figure 3The diagram shows the assembly schematic of the locking ring 10 for the etching equipment and the processing fixture 20 in this embodiment. The processing fixture 20 serves as a protective device for the locking ring 10 during processing. In actual use, the processing fixture 20 is placed in the receiving cavity 12 through the first through hole 11. The processing fixture 20 abuts against the first contact surface 15 to maintain the relative position of the processing fixture 20 and the locking ring 10 in the first direction X. The processing fixture 20 abuts against the first side plate 13 to avoid the formation of a gap between the processing fixture 20 and the first side plate 13. The projection of the first groove 16 along the first direction X and located on the processing fixture 20 is completely located on the processing fixture 20. In practical use, the cutting liquid 30 interacts with the second side plate 14 along the first direction X to form a first groove 16 located within the second side plate 14. The first groove 16 penetrates the second side plate 14 along the first direction X and is connected to the receiving cavity 12. After passing through the first groove 16 and the receiving cavity 12 in sequence, the cutting liquid 30 strikes the processing tool 20, which protects the second side plate 14. Because the processing tool 20 abuts against the first side plate 13, the processing tool 20 will not bounce within the receiving cavity 12 when the cutting liquid 30 strikes it.

[0024] Appendix Figure 4 This is a schematic diagram of one type of machining tool 20 according to this application. Please refer to the attached diagram. Figure 4 As shown, the processing fixture 20 of this application includes a first baffle 111, which is the main body of the processing fixture 20. The first baffle 111 has a circular structure and a certain thickness in the first direction X. A through hole is provided in the first baffle 111 along the first direction X. The through hole of the first baffle 111 corresponds to the first through hole 11 of the locking ring 10. In specific use, the first baffle 111 is located in the receiving cavity 12. The first baffle 111 abuts against the first contact surface 15 and also abuts against the first side plate 13. There is a first gap between the first baffle 111 and the side plate. The projection of the first groove 16 along the first direction X and located on the first baffle 111 completely covers the area of ​​the first baffle 111.

[0025] Please refer to the attached document. Figure 4 As shown, the machining tool 20 of this application includes a second connecting plate 112, which has an annular structure. The second connecting plate 112 is located at one end of the first baffle 111 along the first direction X. The second connecting plate 112 is connected to the first baffle 111, and the connection point between the first baffle 111 and the second connecting plate 112 is the outer edge of the first baffle 111. In specific use, the second connecting plate 112 partially blocks the first contact surface 15, thereby preventing the cutting liquid 30 from damaging the first contact surface 15. Figure 4It can be seen that the height of the second connecting plate 112 in the first direction X is less than the height of the first abutting surface 15 in the first direction X, while the attached... Figure 4 The first contact surface 15 is the first contact surface 15 after the locking ring 10 is processed. When the locking ring 10 is cutting the first groove 16, the height of the first contact surface 15 is less than the height of the first contact surface 15 after the locking ring 10 is processed.

[0026] Furthermore, the first baffle 111 and the second connecting plate 112 together form the baffle body 100. The baffle body 100 is circumferentially divided into several baffle segments 110. The dividing lines of the baffle body 100 are arranged radially along the baffle body 100. Each baffle segment 110 includes the first baffle 111 and the second connecting plate 112. The segmentation of the baffle body 100 is designed to allow the baffle body 100 to be better placed into the receiving cavity 12 and assembled within the receiving cavity 12, thereby protecting the first side plate 13.

[0027] In one embodiment, the baffle body 100 is composed of at least three baffle plates 110. Further, the baffle body 100 is composed of six baffle plates 110.

[0028] Appendix Figure 5 This is a schematic diagram of one structure of the baffle plate 110 of this application, attached. Figure 6 This is another structural schematic diagram of the baffle plate 110 of this application. Please refer to the attached diagram. Figure 5 and appendix Figure 6 As shown, two adjacent baffle plates 110 within the baffle body 100 form a baffle assembly. The two baffle plates 110 in the baffle assembly are assembled through a splicing structure 200. The splicing structure 200 is set to achieve the positioning connection of the two baffle plates 110 in the baffle assembly.

[0029] In one embodiment, the splicing structure 200 includes a splicing protrusion 210 and a splicing groove 220. The splicing protrusion 210 is located within the splicing groove 220 to form a splice of two baffle plates 110. The splicing protrusion 210 is located on one baffle plate 110 of the baffle assembly, and the splicing groove 220 is located on the other baffle plate 110 of the baffle assembly. Through holes are provided along the first direction X on both the plate containing the splicing groove 220 and the splicing protrusion 210. The first connector 300 consists of a bolt and a nut. The bolt passes through the through holes on the plate containing the splicing groove 220 and the splicing protrusion 210, and the connection of the two baffle plates 110 is achieved through the nut.

[0030] Implementation 2: This embodiment discloses a method for processing a locking ring 10 for an etching apparatus. The processing method of this embodiment utilizes the machining fixture 20 for the locking ring 10 for the etching apparatus described in Embodiment 1. The processing method of this embodiment includes the following steps: The first through hole 11 is formed by using a first tool that moves along the first direction X and acts on the center position of the closed ring 10 to form the first through hole 11. The cavity 12 is formed by the second tool moving along the second direction Y and acting on the circumferential position of the closed ring 10 to form the cavity 12. The processing tool 20 is placed by placing the baffle plates 110 one by one into the receiving cavity 12 and splicing them in the receiving cavity 12 using the first connector 300 to form the baffle body 100 located in the receiving cavity 12. The baffle body 100 abuts against the first contact surface 15 and the first side plate 13. The first groove 16 is formed by processing the second side plate 14 using water cutting, and the first groove 16 is located on the second side plate 14. The baffle body 100 blocks the cutting liquid 30 in the water cutting to protect the first side plate 13.

[0031] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A machining jig for a confinement ring of an etching apparatus, the machining jig being used to implement machining of a confinement ring, the confinement ring being a cylindrical structure, the confinement ring comprising a central position and a circumferential position, the central position being located in the middle of the confinement ring, the circumferential position being wrapped around the central position, the central position being provided with a first through hole penetrating in a first direction, the circumferential position being provided with a receiving cavity in a ring direction, and forming a first side plate and a second side plate located at both ends of the receiving cavity in the first direction, a first abutting surface being provided in the receiving cavity between the first side plate and the second side plate, the first abutting surface being provided in the first direction, the receiving cavity being in communication with the first through hole, characterized in that, The machining device for the confinement ring of the etching equipment comprises, The first baffle is in circular annular structure, is located in the accommodating cavity, abuts against the first abutting surface, abuts against the first side plate, and has a first spacing with the second side plate. A first groove is provided through the second side plate in the first direction. The projection of the first groove on the first baffle in the first direction is completely within the range of the first baffle. The second connecting plate is in annular structure, is located at one end of the first baffle in the first direction, is connected with the first baffle, and forms a shielding for the first abutting surface.

2. The processing tool for confinement rings of claim 1, wherein: The first baffle and the second connecting plate jointly form a baffle main body, which is circumferentially divided into a plurality of baffle sub-plates. Each baffle sub-plate comprises the first baffle and the second connecting plate, and each baffle sub-plate is connected through a first connecting piece.

3. The machining fixture for the etching equipment with a locked loop according to claim 2, characterized in that, The baffle main body is composed of at least three baffle sub-plates.

4. The machining fixture for the etching equipment with a locked loop according to claim 3, characterized in that, The baffle main body is composed of six baffle sub-plates.

5. The machining fixture for the etching equipment with a locked loop according to claim 2, characterized in that, Two adjacent baffle sub-plates in the baffle main body form a baffle assembly, and the two baffle sub-plates in the baffle assembly are assembled through a splicing structure.

6. The processing tool for confinement rings of claim 5, wherein: The splicing structure comprises a splicing protrusion and a splicing groove. The splicing protrusion is located in the splicing groove to form the splicing of the two baffle sub-plates. The splicing protrusion is located on one of the baffle sub-plates in the baffle assembly, and the splicing groove is located on the other baffle sub-plate in the baffle assembly.

7. The processing tool for confinement rings of claim 6, wherein: The first connecting piece passes through the splicing protrusion and the splicing groove in sequence to form the connection of the two baffle sub-plates.

8. The processing tool for confinement rings of claim 7, wherein: The first connecting piece is composed of a bolt and a nut.

9. A method for processing a confinement ring for an etching apparatus, characterized by, The machining method using the machining device for the confinement ring of the etching equipment according to any one of claims 1 to 8 comprises, The formation of the first through hole is formed by moving a first cutter in a first direction and acting on the center position of the confinement ring to form the first through hole; The formation of the accommodating cavity is formed by moving a second cutter in a second direction and acting on the circumferential position of the confinement ring to form the accommodating cavity; The placement of the machining jig is to place the baffle sub-plates into the accommodating cavity one by one and splice them in the accommodating cavity by using the first connecting piece to form the baffle main body in the accommodating cavity, which abuts against the first abutting surface and the first side plate; The formation of the first groove is formed by machining the second side plate by using water cutting to form the first groove on the second side plate, and the baffle main body blocks the cutting liquid in the water cutting to protect the first side plate.

10. The method for processing a locked-loop etching device according to claim 9, characterized in that, The second cutter is a T-shaped cutter.

Images