Cable module for endoscope

By using a copper ring and aluminum shell design, the protrusions on the outer surface of the copper ring offset the injection molding pressure, solving the problem of PCB board damage during the injection molding process of the endoscope cable module, improving yield and production efficiency, and meeting the stability requirements of high-definition endoscopes.

CN121618236APending Publication Date: 2026-03-06SHENYU COMM TECH
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Patent Information

Application Number
CN202511429019.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-10-07
Publication Date
2026-03-06

AI Technical Summary

Technical Problem

Existing endoscope cable modules are prone to PCB board damage during injection molding, resulting in low yield and difficulty in meeting the processing stability requirements of high-definition products.

Method used

It adopts a copper ring and aluminum shell structure. The outer surface of the copper ring has radial bosses, which are fixed to the aluminum shell by interference fit. Combined with the injection molding process, it protects the PCB board. The bosses of the copper ring offset the injection molding pressure and prevent displacement, while the aluminum shell fixes the cable.

Benefits of technology

This improved the yield rate of cable modules, protected the PCB board, enhanced production efficiency and processing stability, and ensured the service life of the high-definition endoscope.

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Abstract

The invention provides a cable module for an endoscope. The cable module comprises a cable, a copper ring, an aluminum shell, a PCB and a rubber coating layer. One end of the copper ring is sleeved on the outer surface of the cable; the copper ring comprises a main body and at least one circle of annular boss which is arranged on the outer surface of the main body and protrudes in the radial direction of the main body. According to the invention, the copper ring can be effectively prevented from displacing and damaging the PCB during preparation.
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Description

Technical Field

[0001] This application relates to the field of medical devices, and more particularly to the field of manufacturing cable modules for endoscopes. Background Technology

[0002] The market for reusable rigid endoscopes is currently developing rapidly, with products increasingly moving towards high definition.

[0003] As lens module resolution upgrades from 2K to 4K, and then expands to 8K, increasingly stringent requirements are placed on the processing stability of cable modules. Furthermore, rigid endoscope products have a service life of over three years, necessitating stringent standards in design and manufacturing. Currently, the yield rate of cable modules used in endoscope cables is low and urgently needs improvement. Particularly during the injection molding process, the PCB board is easily damaged.

[0004] In view of this, the present invention is proposed.

[0005] Application content

[0006] This invention provides an endoscope that can effectively improve the yield of cable modules and avoid damage to PCB boards.

[0007] A cable module for an endoscope includes a cable, a copper ring, an aluminum shell, and an adhesive layer; one end of the copper ring is sleeved on the outer surface of the cable; the copper ring includes a body and an outer surface of which at least one annular boss protruding radially from the body is provided.

[0008] The aluminum shell includes a first end and a second end; the first end is sleeved on the outer surface of the other end of the copper ring and abuts against the boss; the second end is fixed with a PCB board; the inner wall of the aluminum shell and the outer wall of the copper ring are fixed by an interference fit; when the copper ring is assembled to a predetermined position inside the aluminum shell, the end face of the boss forms an axial limiting fit with the first end of the aluminum shell; the PCB board is fixed to the second end of the aluminum shell and electrically connected to the cable; the encapsulation layer covers at least a portion of the outer surface of the aluminum shell, at least a portion of the outer surface of the copper ring, and at least a portion of the outer surface of the cable through an injection molding process.

[0009] Furthermore, the aluminum shell is made of aluminum alloy.

[0010] Furthermore, the copper ring is made of a copper alloy.

[0011] Furthermore, the boss and the copper ring are integrally formed.

[0012] Furthermore, the interference fit between the copper ring and the aluminum shell is 0.02-0.05 mm.

[0013] Furthermore, the height H of the boss is 0.5-1mm.

[0014] Furthermore, the cable passes through the copper ring and the aluminum shell in sequence, and one end is soldered to the PCB board.

[0015] Furthermore, the outer surface of the aluminum shell also has a raised ring with a groove for installing a sealing ring.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1) This invention protects the PCB board and cables during injection molding by using a copper ring and an aluminum shell. At the same time, the copper ring fixes the cables and the aluminum shell protects them. In addition, the protrusions on the copper ring effectively suppress the displacement of the copper ring during injection molding, preventing damage to the PCB board and ultimately improving production efficiency.

[0018] 2) Due to the presence of the boss, the present invention effectively suppresses assembly errors. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the existing cable module used for endoscopes;

[0021] Figure 2 This is a schematic diagram of the cable module of the endoscope in this embodiment;

[0022] Figure 3 This is a schematic diagram of the copper ring structure in this embodiment. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] Figure 1 This is a schematic diagram of an existing cable module used in endoscopes. Figure 1As shown, the existing endoscope includes a cable 10, a copper ring 20, an aluminum shell 30, and an adhesive layer 50. The copper ring 20 is a hollow cylindrical shape used to fix the cable 10. One end of the copper ring 20 is fitted onto the outer surface of the cable 10. The aluminum shell 30 protects the cable 10 and includes a first end 301 and a second end 302. The first end 301 is fitted onto the outer surface of the copper ring 20 (partially overlapping) for fixation via an interference fit. A PCB board 40 is arranged on the second end 302 of the aluminum shell 30. The cable 10 passes through the copper ring 20 and the aluminum shell 30 sequentially and is electrically connected to the PCB board 40. Optionally, the aluminum shell 30 is annular.

[0025] Preferably, the copper ring 20 and the cable 10 are connected by a crimping process.

[0026] After the cable 10, copper ring 20, aluminum shell 30, and PCB board 40 are assembled in sequence, the next step is injection molding, which involves covering part of the outer surface of the cable 10, part of the outer surface of the copper ring 20, and part of the outer surface of the aluminum shell 30 with an adhesive layer 50 (e.g., ...). Figure 2 (As shown). In this injection molding process, the liquid overmolding solution flows from the copper ring 20 to the PCB board 40. The flowing overmolding solution exerts an axial force on the copper ring 20. The injection pressure is approximately 30 tons. Under this injection pressure, the friction between the first end of the aluminum shell 30 and the overlapping part of the copper ring 20 is insufficient to completely offset the injection pressure, causing the copper ring 20 to move and lift the PCB board 40, resulting in partial or complete failure of the function.

[0027] In this embodiment, a radial boss is provided on the outer surface of the copper ring 20 to counteract the injection pressure.

[0028] Figure 2 A partial structural schematic diagram of the endoscope in this embodiment is shown. Figure 3 A structural schematic diagram of this embodiment is shown. Figure 2-3 As shown, the copper ring 20 includes a main body 201, and a boss 202 is provided radially on the outer surface of the main body 201. The boss 202 abuts against the first end 301 of the aluminum shell 30. Due to the physical restriction of the boss 202, the axial force brought by the injection molding pressure can be effectively offset, thereby ensuring that the copper ring 20 does not shift during the injection molding process.

[0029] Preferably, the boss 202 is a continuous annular structure.

[0030] Preferably, the boss 202 is composed of multiple spaced flanges, forming an overall annular structure.

[0031] There is a gap between each pair of adjacent flanges, the gap being 0.1-1mm wide. This gap helps the overmolding solution to release air during injection molding. At the same time, the overmolding solution will eventually remain in the gap, thereby ensuring the firm fixation of the overmolding layer 50 after injection molding and improving durability.

[0032] Furthermore, the presence of the boss 202 further standardizes the assembly of the aluminum shell 30 and copper ring 20, which can effectively ensure the area of ​​the overlapping part of the aluminum shell 30 and copper ring 20 between all batches.

[0033] Preferably, the aluminum shell 30 is made of aluminum alloy.

[0034] Preferably, the material of copper ring 20 is copper alloy.

[0035] Preferably, the boss 202 and the body 201 of the copper ring 20 are integrally formed.

[0036] Preferably, the interference fit between the copper ring 20 and the aluminum shell 30 is 0.02-0.05mm.

[0037] Preferably, the height H of the boss 202 is 0.5-1mm.

[0038] Preferably, the height of the boss 202 is the same as the thickness of the aluminum shell 30, which facilitates injection molding.

[0039] Preferably, the outer peripheral surface of the boss 202 has an uneven textured pattern to provide sufficient friction to prevent the overlay layer 50 from peeling off.

[0040] Preferably, the outer surface of the aluminum shell also has a raised ring with a groove for installing a sealing ring for waterproofing.

[0041] The terms "equal," "identical," or "equal to" disclosed in this application must take into account the parameter distribution of the engineering process, with an error distribution within ±30%. "Parallel" two line segments or lines are defined as having an included angle of less than or equal to 45 degrees. "Perpendicular" two line segments or lines are defined as having an included angle within the range of [60, 120] degrees. The definition of "phase misalignment" also takes into account the parameter distribution of the engineering process, with an error distribution of the phase misalignment degree within ±30%. Furthermore, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. In the absence of further restrictions, an element defined by the phrase "comprising a..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0042] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0043] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cable module for an endoscope, characterized by, The cable, the copper ring, the aluminum shell and the encapsulation layer; one end of the copper ring is sleeved on the outer surface of the cable; the copper ring comprises a main body and at least one annular boss protruding radially on the outer surface of the main body; The aluminum shell comprises a first end and a second end; the first end is sleeved on the outer surface of the other end of the copper ring and abuts against the boss; the second end is fixed with the PCB board; the inner wall of the aluminum shell is fixed with the outer wall of the copper ring through interference fit; when the copper ring is assembled to the predetermined position in the aluminum shell, the end surface of the boss forms axial limiting fit with the first end of the aluminum shell; the PCB board is fixed on the second end of the aluminum shell and electrically connected with the cable; the encapsulation layer covers at least part of the outer surface of the aluminum shell, at least part of the outer surface of the copper ring and at least part of the outer surface of the cable through injection molding process.

2. The cable module for an endoscope of claim 1, wherein, The material of the aluminum shell is aluminum alloy.

3. The cable module for an endoscope of claim 1, wherein, The material of the copper ring is copper alloy.

4. The cable module for an endoscope of claim 1, wherein, The boss and the copper ring are integrally formed.

5. The cable module for an endoscope of claim 1, wherein, The interference amount between the copper ring and the aluminum shell is 0.02-0.05mm.

6. The cable module for an endoscope of claim 1, wherein, The height H of the boss is 0.5-1mm.

7. The cable module for an endoscope of claim 1, wherein, The cable passes through the copper ring and the aluminum shell in sequence and is welded to one end of the PCB board.

8. The cable module for an endoscope of claim 1, wherein, The outer surface of the aluminum shell further has a convex ring with a groove for installing a sealing ring.

9. The cable module for an endoscope of claim 1, wherein, The surface of the boss has uneven texture pattern.