Chip, flexible circuit board and processing method of flexible circuit board

Abstract

The invention relates to the technical field of chips, and discloses a chip, a flexible circuit board and a processing method of the flexible circuit board. Comprising a dielectric plate, a first metal plate, a second metal plate, a third metal plate and a fourth metal plate, the dielectric plate is provided with a first area and a second area at intervals in the first direction, and a buffer area is formed between the first area and the second area. The buffer area is provided with a first buffer groove penetrating through the dielectric plate in the third direction, the first buffer groove extends in the second direction, the second direction is perpendicular to the first direction and the third direction, and the first circuit and the second circuit on the buffer area are arranged away from the first buffer groove. The first buffer groove is formed in the dielectric plate, so that when the flexible circuit board is subjected to tensile force in the first direction, the part, located near the first buffer groove, of the dielectric plate can be deformed, tearing of the tensile force to the connecting position and the interior of the dielectric plate is reduced, and the risks of tearing breakage and connection failure of the connecting position of the flexible circuit board and the outside are reduced.

Description

Technical Field

[0001] This invention relates to the field of chip technology, and in particular to a chip, a flexible circuit board, and a method for processing the flexible circuit board. Background Technology

[0002] Connecting high-power chips using flexible printed circuits (FPCs) can reduce the current density of the core board, increase the load capacity of the carrier board, and reduce parasitic inductance. FPCs are typically connected to the carrier board or core board via silver sintering. Due to the difference in thermal expansion coefficients between the FPC and the carrier / core board, the shrinkage of the FPC during sintering and cooling is greater than that of the carrier / core board, generating contraction forces. This can easily lead to tensile stress between the FPC and the carrier / core board, causing the connection to break or even the FPC to fracture. Summary of the Invention

[0003] The technical problem to be solved by the present invention is that during the sintering and cooling process of flexible circuit boards, due to the difference in shrinkage between the flexible circuit board and the carrier board and the core board, the flexible circuit board is prone to being pulled apart with the carrier board or the core board, which may lead to the connection breaking or even the flexible circuit board breaking.

[0004] To address the aforementioned technical problems, the present invention provides a flexible circuit board, comprising: A dielectric substrate has a first side and a second side along a third direction. The dielectric substrate has a first region and a second region spaced apart in a first direction, the first direction being perpendicular to the third direction. A buffer region is formed between the first region and the second region. The buffer region has a first circuit on the first side and a second circuit on the second side. A first metal plate, the first metal plate being located on the first side and disposed on the first region; The second metal plate is located on the first side and disposed on the second region. The second metal plate is connected to the first metal plate through the first circuit. A third metal plate, the third metal plate being located on the second side and disposed on the first region; A fourth metal plate is located on the second side and disposed on the fourth region. The fourth metal plate is connected to the third metal plate through the second circuit. The buffer area is provided with a first buffer groove that penetrates the medium plate along a third direction. The first buffer groove extends along a second direction, which is perpendicular to both the first direction and the third direction. The first circuit and the second circuit are both arranged to avoid the first buffer groove.

[0005] According to one embodiment of the present invention, the inner wall of at least one end of the first buffer groove is an arc-shaped surface.

[0006] According to one embodiment of the present invention, in the second direction, the length of the first buffer groove is L. 12 The length of the buffer region is L 22 L 12 ≤9 / 10×L 22 .

[0007] According to one embodiment of the present invention, in the first direction, a first sub-region, a second sub-region, and a third sub-region are formed on the second region in sequence, the first sub-region is connected to the buffer region, the first metal plate is located on the first sub-region, the second sub-region, and the third sub-region, and the fourth metal plate is located on the third sub-region. A second buffer groove is provided on the second sub-region, penetrating the second metal plate and the medium plate, and the second buffer groove extends along the second direction.

[0008] According to one embodiment of the present invention, the portion of the flexible circuit board located in the second region has an axisymmetric structure, and the axis of symmetry extends along a first direction.

[0009] According to one embodiment of the present invention, the linewidth of the portion of the second metal plate located on the first sub-region is W. 31 The line width of the portion located on the second sub-region is W. 32 1 / 3×W 31 ≤W 32 ≤1 / 2×W 31 ; And / or, the linewidth of the portion of the second metal plate located on the third sub-region is W. 33 W 33 =W 31 .

[0010] According to one embodiment of the present invention, a through hole extending along the third direction is provided on the third sub-region. The through hole is a blind hole. The opening of the through hole is located on the side of the second metal plate away from the dielectric plate. The bottom of the through hole is located on the fourth metal plate. A conductive layer is provided on the inner wall of the through hole. The conductive layer is in contact with both the second metal plate and the fourth metal plate.

[0011] According to one embodiment of the present invention, the through hole is filled with a protective paste.

[0012] The present invention also provides a chip, comprising: Carrier plate; The first core board is connected to the carrier board; The second core board is connected to the carrier board and is distributed on the same side of the carrier board at intervals from the first core board; As described above, in the first region, the first metal plate, the dielectric plate, and the third metal plate constitute a connection body; in the second region, the second metal plate, the dielectric plate, and the fourth metal plate constitute connection pins; the connection body is connected to the first core board, and the connection pins are connected to the second core board.

[0013] The present invention also provides a processing method based on the flexible circuit board described above, comprising: The second metal plate is subjected to photolithography to form a first through hole extending to the dielectric plate on the second metal plate; Laser drilling is performed on the portion of the dielectric plate located in the second region to form a second through hole that extends through to the fourth metal plate on the dielectric plate, and the second through hole communicates with the first through hole to form the through hole; The inner wall of the through hole is electroplated to form the conductive layer.

[0014] Compared with the prior art, the present invention provides a chip, a flexible circuit board, and a method for processing the flexible circuit board, the advantages of which are as follows: The flexible circuit board of this invention provides a first buffer groove on the dielectric board. The first buffer groove penetrates the dielectric board along a third direction and extends along a second direction. When the flexible circuit board is subjected to tensile force in the first direction, the portion of the dielectric board near the first buffer groove can deform, reducing the tearing of the tensile force on the connection position and the interior of the dielectric board, and reducing the risk of tearing and breakage or connection failure at the connection position between the flexible circuit board and external components. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the chip structure provided in an embodiment of the present invention.

[0016] Figure 2 This is one of the structural schematic diagrams of the flexible circuit board provided in the embodiments of the present invention.

[0017] Figure 3 This is the second schematic diagram of the flexible circuit board provided in the embodiment of the present invention.

[0018] Figure 4 This is one of the partial structural schematic diagrams of the flexible circuit board provided in the embodiments of the present invention.

[0019] Figure 5 This is a second partial structural schematic diagram of the flexible circuit board provided in an embodiment of the present invention.

[0020] Figure 6 This is the third partial structural schematic diagram of the flexible circuit board provided in the embodiment of the present invention.

[0021] Figure 7 This is a schematic diagram of the structure of the dielectric substrate provided in an embodiment of the present invention.

[0022] Figure 8 This is a cross-sectional view of a partial structure of the flexible circuit board provided in an embodiment of the present invention.

[0023] Figure 9 This is one of the schematic diagrams illustrating the processing of the flexible circuit board provided in the embodiments of the present invention.

[0024] Figure 10 This is a second schematic diagram of the processing of the flexible circuit board provided in this embodiment of the invention.

[0025] Figure 11 This is the third schematic diagram of the processing of the flexible circuit board provided in the embodiment of the present invention.

[0026] Figure label: 100. Flexible circuit board; 101. Connecting body; 102. Connecting pins; 110. Medium plate; 111. First buffer groove; 112. Second buffer groove; 113. Through hole; 114. Conductive layer; 115. Protective paste; 121. First metal plate; 122. Second metal plate; 123. Third metal plate; 1231. Connecting plate; 124. Fourth metal plate; 210. Carrier board; 220. First core board; 230. Second core board; A. First region; B. Buffer region; C. Second region; C1. First sub-region; C2. Second sub-region; C3. Third sub-region; X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0027] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0028] In the description of the embodiments of the present invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of the embodiments of the present invention, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0030] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0031] like Figure 1 As shown, the chip of this embodiment includes a carrier board 210, a first core board 220, a second core board 230, and a flexible circuit board 100 as described below. The first core board 220 is connected to the carrier board 210, and the second core board 230 is connected to the carrier board 210 and is distributed on the same side of the carrier board 210 at intervals from the first core board 220. The flexible circuit board 100 is provided with a connection body 101 and connection pins 102. The connection body 101 is connected to the first core board 220, and the connection pins 102 are connected to the second core board 230. Specifically, the connection body 101 and the first core board 220 can be soldered or sintered together, and the connection pins 102 and the second core board 230 can be soldered or sintered together.

[0032] like Figure 1 and Figure 2 As shown, a flexible circuit board 100 according to an embodiment of the present invention includes a dielectric board 110, a first metal plate 121, a second metal plate 122, a third metal plate 123 and a fourth metal plate 124.

[0033] Specifically, the dielectric substrate 110 has a first side and a second side along a third direction Z. A first region A and a second region C are spaced apart along a first direction X, perpendicular to the third direction Z. A buffer region B is formed between the first region A and the second region C. A first circuit is provided on the first side of the buffer region B, and a second circuit is provided on the second side. A first metal plate 121 is located on the first side and is disposed on the first region A. A second metal plate 122 is located on the first side and is disposed on the second region C. The second metal plate 122 is connected to the first metal plate 121 through the first circuit. A third metal plate 123 is located on the second side and is disposed on the first region A. A fourth metal plate 124 is located on the second side and is disposed on the fourth region. The fourth metal plate 124 is connected to the third metal plate 123 through the second circuit. The first metal plate 121, the second metal plate 122, the third metal plate 123, and the fourth metal plate 124 are all connected to the dielectric substrate 110. The first metal plate 121, the second metal plate 122 and the first circuit can be made from the same metal plate by cutting and etching. The third metal plate 123, the fourth metal plate 124 and the second circuit can be made from the same metal plate by cutting and etching. The first metal plate 121, the second metal plate 122, the third metal plate 123 and the fourth metal plate 124 can all be copper plates.

[0034] In the first region A, the first metal plate 121, the dielectric plate 110 and the third metal plate 123 constitute a connection body 101, which is connected to the first core board 220 of the chip; in the second region C, the second metal plate 122, the dielectric plate 110 and the fourth metal plate 124 constitute a connection pin 102, which is used to connect to the second core board 230 of the chip.

[0035] A first buffer groove 111 is provided on the buffer area B, extending through the dielectric substrate 110 along the third direction Z. The first buffer groove 111 extends along the second direction Y, which is perpendicular to both the first direction X and the third direction Z. It is understood that the connecting body 101 and the connecting pin 102 are connected to the first core board 220 and the second core board 230 by welding or sintering. During cooling, because the shrinkage of the flexible circuit board 100 differs from that of the first core board 220, the second core board 230, and the carrier board 210, a tensile force is generated along the first direction X, causing the connection to tear and fail, or the flexible circuit board 100 to break. By providing the first buffer groove 111, when a tensile force is generated along the first direction X during cooling, the portion of the dielectric substrate 110 near the first buffer groove 111 can undergo a certain deformation, allowing the portions of the dielectric substrate 110 on both sides of the first buffer groove 111 in the first direction X to move away from each other. This reduces the tearing effect of the tensile force on the connection and the interior of the dielectric substrate 110, preventing breakage of the connection or the dielectric substrate 110. Both the first circuit and the second circuit are disposed away from the first buffer groove 111 to avoid the first circuit or the second circuit being torn off when the first buffer groove 111 deforms. In some embodiments, the inner wall of at least one end of the first buffer groove 111 in the second direction Y is an arc-shaped surface, so that the end of that end is arc-shaped, and the arc transition reduces the risk of the sidewall of the first buffer groove 111 being torn.

[0036] According to an embodiment of the present invention, the flexible circuit board 100 has a first buffer groove 111 provided on the dielectric board 110. The first buffer groove 111 penetrates the dielectric board 110 along the third direction Z groove and extends along the second direction Y. Therefore, when the flexible circuit board 100 is subjected to a tensile force in the first direction X, the portion of the dielectric board 110 near the first buffer groove 111 can deform, thereby reducing the tearing of the tensile force on the connection position and the interior of the dielectric board 110, and reducing the risk of tearing and breakage or connection failure at the connection position between the flexible circuit board 100 and external components (such as the flexible circuit board 100 and the second core board 230).

[0037] like Figure 5 As shown, according to some embodiments of the present invention, in the first direction X, the width of the first buffer groove 111 is W. 11 The width of buffer region B is W. 21 W 11 ≤1 / 3×W 21 That is, the width W of the first buffer groove 111 11 The width W of the buffer region B is less than or equal to the width of the buffer region B. 21 One-third of the space is allocated to ensure sufficient space is left on both sides of the first buffer groove 111 in the first direction X for the arrangement of the first and second circuits. For example, W 11 It can be equal to 1 / 6 × W21 .

[0038] like Figure 5 As shown, according to some embodiments of the present invention, in the second direction, the length of the first buffer groove 111 is L. 12 The length of buffer region B is L. 22 L 12 ≤9 / 10×L 22 That is, the length L of the first buffer groove 111 12 The length L of the buffer region B is less than or equal to the length of the buffer region B. 22 Nine-tenths. This ensures that, on the one hand, sufficient space is left on both sides of the first buffer groove 111 in the second direction Y for the arrangement of the first and second circuits; on the other hand, it avoids the first buffer groove 111 being too long, which could easily cause the dielectric board 110 to tear. In some embodiments, in the second direction Y, the distance between the end of the first buffer groove 111 and the nearest edge of the dielectric board 110 is L. 42 L 42 ≥1 / 6×L 22 .

[0039] In some embodiments, the first metal plate 121, the second metal plate 122, the third metal plate 123, and the fourth metal plate 124 are made of the same material, and their average Young's modulus is E. metal The thickness is the same in the third direction, both being T. sub In the first direction X, the width of the portion of the dielectric plate 110 located between the first buffer groove 111 and the second region C is W. 51 L 12 and W 51 satisfy: Where E sub T is the average Young's modulus of dielectric plate 110. sub Let F be the thickness of the dielectric substrate in the third direction Z, F be the average tensile force on the flexible circuit board 100 during the cooling process, and x be the average shrinkage of the flexible circuit board 100 after cooling. Both F and x are obtained from experimental measurements.

[0040] like Figure 4As shown, according to some embodiments of the present invention, in the first direction X, a first sub-region C1, a second sub-region C2, and a third sub-region C3 are formed in the second region C in sequence. The first sub-region C1 is connected to the buffer region B. A first metal plate 121 is located on the first sub-region C1, the second sub-region C2, and the third sub-region C3, and a fourth metal plate 124 is located on the third sub-region C3. A second buffer groove 112 is provided in the second sub-region C2, penetrating the second metal plate 122 and the dielectric plate 110, and the second buffer groove 112 extends along the second direction Y. When the flexible circuit board 100 is subjected to a tensile force in the first direction X, the portion of the dielectric plate 110 located near the second buffer groove 112 can undergo a certain deformation, so that the portions of the dielectric plate 110 located on both sides of the second buffer groove 112 in the first direction X can move away from each other, thereby reducing the tearing effect of the tensile force on the connection position and the interior of the dielectric plate 110, and preventing the connection position or the dielectric plate 110 from breaking. Furthermore, the second buffer groove 112 and the first buffer groove 111 work together to have an effect similar to a series spring, improving the toughness of the flexible circuit board 100 and further reducing the probability of the flexible circuit board 100 breaking or failing due to tensile force. Figure 4 and Figure 6 As shown, the second metal plate 122, the portion of the dielectric plate 110 located in the second region C, and the fourth metal plate 124 constitute the connection pin 102. On the second sub-region C2, the dielectric plate 110 extends along the second direction Y to protrude beyond its portion located in the first sub-region C1 and the third sub-region C3; the second metal plate 122 is disposed along the dielectric plate 110, extending along the second direction Y to protrude beyond its portion located in the first sub-region C1 and the third sub-region C3, such that the portion of the connection pin 102 located in the second sub-region C2 extends along the second direction Y. A second buffer groove 112 is disposed on the portion of the connection pin 102 located within the second sub-region C2, such that the portion of the second buffer groove 112 located in the second sub-region C2 forms a "U"-shaped structure to increase the deformable range of the connection pin 102 along the first direction X. In some embodiments, the portion of the flexible circuit board 100 located within the second region C has an axisymmetric structure, and the axis of symmetry extends along the first direction X, that is, the connection pin 102 has an axisymmetric structure, and its axis of symmetry extends along the first direction X. When the flexible circuit board 100 undergoes torsional deformation around the first direction X, the degree of torsion of the connection pin 102 can be reduced, and the toughness of the connection pin 102 can be improved.

[0041] In some embodiments, a connecting plate 1231 is provided at one end of the second metal plate 122 near the buffer region B. The connecting section extends into the buffer region B and extends along the second direction Y to increase the length of the edge connecting the second metal plate 122 with the first circuit. Similarly, a connecting plate 1231 can also be provided at one end of the fourth metal plate 124 near the buffer region B to increase the length of the edge connecting the fourth metal plate 124 with the third circuit.

[0042] like Figure 6 As shown, according to some embodiments of the present invention, the linewidth of the portion of the second metal plate 122 located within the first sub-region C1 is W. 31 The line width of the portion located within the second sub-region C2 is W. 32 1 / 3×W 31 ≤W 32 ≤1 / 2×W 31 The linewidth W of the portion within the second sub-region C2 of the second metal plate 122 32 The linewidth W of the portion located within the first sub-region C1 31 The linewidth is between one-third and one-half of the original value to avoid a decrease in the current load capacity of the portion of the second metal plate 122 located within the second sub-region C2. In some embodiments, the linewidth of the portion of the second metal plate 122 located within the third sub-region C3 is W. 33 W 33 =W 31 The linewidth of the portion of dielectric substrate 110 located within the first sub-region C1 is W. 41 The line width of the portion located within the second sub-region C2 is W. 42 The line width of the portion located within the third sub-region C3 is W. 43 Among them, W 43 =W 41 1 / 3×W 41 ≤W 42 ≤1 / 2×W 41 W 41 ≥W 31 W 42 ≥W 32 W 43 ≥W 33 .

[0043] In some embodiments, the first metal plate 121, the second metal plate 122, the third metal plate 123, and the fourth metal plate 124 are made of the same material, and their average Young's modulus is E. metal Furthermore, the thickness in the third direction Z is the same, both being T. sub The length of the second buffer groove 112 along the second direction Y is L. 32 Then L 12 L 32 W 32 W 42 and W 51 satisfy: Where E sub T is the average Young's modulus of the dielectric substrate. subLet F be the thickness of the dielectric substrate in the third direction, F be the average tensile force on the flexible circuit board during the cooling process, and x be the average shrinkage of the flexible circuit board after cooling. Both F and x are obtained from experimental measurements.

[0044] like Figure 3 and Figure 8 As shown, according to some embodiments of the present invention, a through-hole 113 extending in the third direction Z is provided on the third sub-region C3. The through-hole 113 is a blind hole. The opening of the through-hole 113 is located on the side of the second metal plate 122 away from the dielectric plate 110. The bottom of the through-hole 113 is located on the fourth metal plate 124. A conductive layer 114 is provided on the inner wall of the through-hole 113, and the conductive layer 114 is in contact with both the second metal plate 122 and the fourth metal plate 124. Specifically, the portion of the fourth metal plate 124 located on the third sub-region C3 is used to connect with the second core board 230. By providing the through-hole 113 on the third sub-region C3 and providing the conductive layer 114 on the inner wall of the third through-hole 113, which is connected to both the second metal plate 122 and the fourth metal plate 124, the second metal plate 122 and the fourth metal plate 124 are made conductive. The conductive layer 114 can be a copper plating layer. Figure 8 In this example, the top of the conductive layer 114 may extend beyond the via 113 and adhere to the side of the second metal plate 122 opposite to the dielectric substrate 110. The via 113 is a blind via to increase the contact area between the fourth metal plate 124 and the second core board 230, and to keep the side where the fourth metal plate 124 is connected to the second core board 230 flat, reducing the risk of stress concentration causing tearing at the connection between the flexible circuit board 100 and the second core board 230. In some embodiments, the via 113 is filled with a protective paste 115 for protection; the via 113 may be filled with resin or copper paste.

[0045] like Figures 9 to 11 As shown, a processing method based on the above-described flexible circuit board 100 according to an embodiment of the present invention includes the following steps: S1: Perform photolithography on the second metal plate 122 to form a first through-hole extending to the dielectric plate 110 on the second metal plate 122. For example... Figure 9 As shown, photolithography is performed on the second metal plate 122 along the third direction Z to form a first through hole that penetrates the second metal plate 122. Photolithography is used to improve the processing accuracy and wall flatness of the first through hole so that the wall of the first through hole is in close contact with the conductive layer 114.

[0046] S2: Laser drilling is performed on the portion of the dielectric substrate 110 located in the second region C to form a second through hole extending to the fourth metal plate 124 on the dielectric substrate 110, and the second through hole communicates with the first through hole to form a through hole 113. Figure 10 As shown, within the first through hole, the dielectric substrate 110 on the bottom side of the second through hole is subjected to laser drilling to form a second through hole that penetrates the dielectric substrate 110. The first through hole and the second through hole are combined to form a through hole 113.

[0047] S3: Electroplating is performed on the inner wall of the via 113 to form a conductive layer 114 on the inner wall of the via 113. For example... Figure 11 As shown, the inner wall of the via hole 113 can be electroplated with copper to form a conductive layer 114 on the inner wall of the via hole 113, and the bottom of the conductive layer 114 is attached to the fourth metal plate 124 and the top is attached to the second metal plate 122.

[0048] In some embodiments, the processing method of the flexible circuit board 100 further includes the following steps: S4: The through hole 113 is plugged with protective paste 115.

[0049] In summary, the embodiments of the present invention provide a chip, a flexible circuit board 100, and a method for processing the flexible circuit board 100, which has at least the following beneficial effects: 1. During the sintering and cooling process, the deformation of the first buffer groove 111 and the second buffer groove 112 allows the flexible circuit board 100 to deform within a certain range along the first direction X, reducing the risk of tearing and breakage or connection failure at the connection point between the flexible circuit board 100 and external components. 2. By using the symmetrical structure of the connection pin 102 and the "U"-shaped structure design, the probability of the connection pin 102 being twisted and damaged is reduced; 3. By designing the through hole 113 on the connection pin 102 as a blind hole, the contact area between the fourth metal plate 124 and the second core board 230 is increased, and the side where the fourth metal plate 124 and the second core board 230 are connected is kept flat, reducing the risk of stress concentration causing the connection between the flexible circuit board 100 and the second core board 230 to be torn.

[0050] Finally, it should be noted that the above embodiments are only for illustrating the present invention and are not intended to limit the present invention. It should be pointed out that those skilled in the art can make several improvements and substitutions without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A flexible wiring board (100) characterized by, The application relates to a flexible circuit board (100), comprising: a medium plate (110) having a first side and a second side along a third direction (Z), the medium plate (110) being provided with a first region (A) and a second region (C) at intervals along a first direction (X) perpendicular to the third direction (Z), a buffer region (B) being formed between the first region (A) and the second region (C), the buffer region (B) being provided with a first circuit on the first side and a second circuit on the second side; a first metal plate (121) located on the first side and arranged on the first region (A); a second metal plate (122) located on the first side and arranged on the second region (C), the second metal plate (122) being connected with the first metal plate (121) through the first circuit; a third metal plate (123) located on the second side and arranged on the first region (A); a fourth metal plate (124) located on the second side and arranged on the fourth region, the fourth metal plate (124) being connected with the third metal plate (123) through the second circuit; the buffer region (B) being provided with a first buffer groove (111) penetrating through the medium plate (110) along the third direction (Z), the first buffer groove (111) extending along a second direction (Y) perpendicular to the first direction (X) and the third direction (Z), and the first circuit and the second circuit being arranged away from the first buffer groove (111).

2. The flexible wiring board (100) according to claim 1, characterized by, At least one inner wall of an end of the first buffer groove (111) is an arc surface.

3. The flexible wiring board (100) according to claim 1, characterized by, In the second direction (Y), the length of the first buffer groove (111) is L 12 , the length of the buffer region (B) is L 22 , L 12 ≤ 9 / 10 × L 22 .

4. The flexible wiring board (100) according to claim 1, characterized by, In the first direction (X), the second region (C) is provided with a first sub-region (C1), a second sub-region (C2) and a third sub-region (C3) connected in sequence, the first sub-region (C1) being connected with the buffer region (B), the first metal plate (121) being located on the first sub-region (C1), the second sub-region (C2) and the third sub-region (C3), and the fourth metal plate (124) being located on the third sub-region (C3), the second sub-region (C2) being provided with a second buffer groove (112) penetrating through the second metal plate (122) and the medium plate (110), the second buffer groove (112) extending along the second direction (Y).

5. The flexible circuit board (100) according to claim 4, characterized in that The part of the flexible circuit board (100) located in the second region (C) is an axisymmetric structure, and the axis of symmetry extends along the first direction (X).

6. The flexible circuit board (100) according to claim 4, characterized in that The line width of the portion of the second metal plate (122) on the first sub-region (C1) is W 31 , the line width of the portion on the second sub-region (C2) is W 32 , 1 / 3×W 31 ≤W 32 ≤1 / 2×W 31 ; And / or, the line width of the portion of the second metal plate located on the third sub-region is W 33 , W 33 = W 31 .

7. The flexible circuit board (100) according to claim 4, characterized in that A through hole (113) extending along the third direction (Z) is arranged on the third sub-region (C3), the through hole (113) is a blind hole, the opening of the through hole (113) is located on the side of the second metal plate (122) away from the dielectric plate (110), the bottom of the through hole (113) is located on the fourth metal plate (124), and the inner wall of the through hole (113) is provided with a conductive layer (114), and the conductive layer (114) is in contact with the second metal plate (122) and the fourth metal plate (124).

8. The flexible circuit board (100) according to claim 7, characterized in that The through hole (113) is filled with a protective paste (115).

9. A chip, characterized by The application relates to a flexible circuit board (100) comprising: a carrier plate (210); a first core plate (220) connected with the carrier plate (210); a second core plate (230) connected with the carrier plate (210) and spacedly distributed on the same side of the carrier plate (210) as the first core plate (220); The flexible circuit board (100) as claimed in any one of claims 1 to 8, wherein the first metal plate (121), the dielectric plate (110) and the third metal plate (123) constitute a connecting main body (101) on the first region (A), and the second metal plate (122), the dielectric plate (110) and the fourth metal plate (124) constitute a connecting pin (102) on the second region (C), the connecting main body (101) is connected with the first core plate (220), and the connecting pin (102) is connected with the second core plate (230).

10. A method of processing the flexible wiring board according to claim 7 or 8, characterized by, The application relates to a flexible circuit board (100) comprising: performing photoetching treatment on the second metal plate (122) to form a first through hole penetrating through the dielectric plate (110) on the second metal plate (122); performing laser drilling treatment on the part of the dielectric plate (110) on the second region (C) to form a second through hole penetrating through the fourth metal plate (124) on the dielectric plate (110), and the second through hole is in communication with the first through hole to form the through hole (113); performing electroplating treatment on the inner wall of the through hole (113) to form the conductive layer (114) on the inner wall of the through hole (113).

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