Electronic device

Abstract

Disclosed is an electronic device including a display module having an active area including at least one pixel and a module hole, and a non-active area adjacent to the active area and not including the pixel. The window is disposed on the display module. The functional layer is disposed between the display module and the window. The functional layer includes a first opening defined therethrough overlapping the module aperture. The light blocking layer is disposed on at least one of the upper surface and the lower surface of the functional layer and positioned adjacent to the first opening. The electronic module is disposed in an opening formed by at least one of the module hole and the first opening.

Description

[0001] This application is a divisional application of application No. 202010087867.0 entitled “Electronic Device”, filed on February 12, 2020. Technical Field

[0002] This disclosure relates to an electronic device. More specifically, this disclosure relates to an electronic device for preventing light leakage. Background Technology

[0003] Portable electronic devices have become very popular in recent years, offering an increasingly diverse range of functions. Many users prefer electronic devices with relatively wide display areas and relatively narrow bezel areas.

[0004] Various types of electronic devices have been developed to reduce bezel areas. For example, some electronic devices omit the bezel area altogether. These devices may include cameras and sensors that are superimposed on the display area. The cameras and sensors superimposed on the display area may be housed in apertures provided within the device. However, these electronic devices frequently experience light leakage around the apertures, leading to a reduction in display quality. Summary of the Invention

[0005] This disclosure provides an electronic device capable of preventing light leakage around a hole defined in a display area.

[0006] An exemplary embodiment of the present invention provides an electronic device including a display module having an effective region and an ineffective region adjacent to the effective region. Pixels are disposed in the effective region but not in the ineffective region. The effective region includes a module aperture. A window is disposed on the display module. A functional layer is disposed between the display module and the window. The functional layer includes a first opening defined therethrough that overlaps with the module aperture. A light-blocking layer is disposed on at least one of the upper and lower surfaces of the functional layer and positioned adjacent to the first opening. An electronic module is disposed in the opening formed by at least one of the module aperture and the first opening.

[0007] An exemplary embodiment of the present invention also provides an electronic device including a display module having an effective region and an ineffective region adjacent to the effective region. Pixels are disposed in the effective region but not in the ineffective region. The effective region includes a module aperture. A window is disposed on the display module. A window black matrix is ​​disposed on the lower surface of the peripheral region of the window. The peripheral region overlaps with the region of the display module adjacent to the module aperture. A light-blocking layer is disposed between the display module and the window black matrix. An electronic module is disposed in the opening formed by the module aperture.

[0008] An exemplary embodiment of the present invention also provides an electronic device including a display module having an effective region and an ineffective region adjacent to the effective region. At least one pixel is disposed in the effective region but not in the ineffective region. The effective region includes a module aperture. The electronic module is disposed in an opening formed by the module aperture. A window is disposed on the display module. The effective region includes a first region defined adjacent to the module aperture and a second region surrounding the first region. The at least one pixel is not disposed in the first region and is disposed in the second region. The display module includes a lower display substrate comprising a substrate layer, a circuit device layer, and a display device layer. An encapsulation substrate faces the lower display substrate. A light-blocking sealing member is configured to bond the lower display substrate and the encapsulation substrate in the first region and includes a light-blocking material.

[0009] According to an exemplary embodiment, since the light-blocking layer and the peripheral area of ​​the module hole are stacked on a functional layer placed between the window and the display module, light leakage from the peripheral area of ​​the module hole can be prevented from being seen by the user from the outside. Attached Figure Description

[0010] The above and other advantages of this disclosure will become apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1A This is a perspective view showing an electronic device according to an exemplary embodiment of the present disclosure; Figure 1B This is an exploded perspective view showing an electronic device according to an exemplary embodiment of the present disclosure; Figure 2 This is a block diagram illustrating an electronic device according to exemplary embodiments of the present disclosure; Figure 3 This is a plan view showing a display panel according to an exemplary embodiment of the present disclosure; Figure 4 It is shown Figure 3 Enlarged plan view of region XX'; Figure 5 This is a plan view illustrating an input sensing layer according to an exemplary embodiment of the present disclosure; Figure 6 This is an exploded perspective view showing the module region and module holes of an electronic device according to an exemplary embodiment of the present disclosure; Figure 7 It is along Figure 6 A sectional view taken by line I-I'; Figure 8 This is a cross-sectional view showing the module region and module holes of an electronic device according to another exemplary embodiment of the present disclosure; Figure 9This is an exploded enlarged perspective view showing the module region and module holes of an electronic device according to another exemplary embodiment of the present disclosure; Figure 10 It is along Figure 9 A sectional view taken from line II-II'; Figure 11 This is an exploded enlarged perspective view showing a module region of an electronic device according to another exemplary embodiment of the present disclosure; Figure 12 It is along Figure 11 A sectional view taken from line III-III'; Figure 13 This is a cross-sectional view showing the effective area of ​​a display panel according to an exemplary embodiment of the present disclosure; Figure 14 This is a cross-sectional view showing a module region of an electronic device according to an exemplary embodiment of the present disclosure; and Figure 15 This is a cross-sectional view showing a module region of an electronic device according to another exemplary embodiment of the present disclosure. Detailed Implementation

[0011] In this disclosure, it will be understood that when an element or layer is referred to as being “on”, “connected to”, or “bonded to” another element or layer, the element or layer may be directly on, directly connected to, or directly bonded to the other element or layer, or there may be an intermediate element or layer.

[0012] The same markings always refer to the same components. In the accompanying drawings, the thickness, proportions, and dimensions of components may be exaggerated for the purpose of effective description of the technical content.

[0013] As used herein, the term “and / or” includes any and all combinations of one or more of the relevant listed items.

[0014] It will be understood that while the terms first, second, etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the teachings of this disclosure, the first element, first component, first region, first layer, or first part discussed below may be described as a second element, second component, second region, second layer, or second part. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are also intended to include the plural forms.

[0015] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” “up”, etc., may be used here to describe the relationship between one element or feature and another (other elements or features) as shown in the figure.

[0016] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0017] It will also be understood that when the term "comprising" and / or variations thereof are used in this specification, it indicates the presence of the stated features, integrals, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or groups thereof.

[0018] In this specification, the same reference numerals refer to the same elements. For example, in the following text, the central region CA of module region MA and the central region CA1 of module region MA1, which have the same reference numerals, can be the same element, and the peripheral region PA of module region MA and the peripheral region PA1 of module region MA1 can be the same element.

[0019] The present disclosure will be explained in detail below with reference to the accompanying drawings.

[0020] Figure 1A This is a perspective view showing an electronic device EA according to an exemplary embodiment of the present disclosure. Figure 1B This is an exploded perspective view showing an electronic device EA according to an exemplary embodiment of the present disclosure. Figure 2 This is a block diagram illustrating an electronic device EA according to an exemplary embodiment of the present disclosure.

[0021] Reference Figure 1A , Figure 1B and Figure 2 An electronic device EA can be activated in response to an electrical signal to display an image. In an exemplary embodiment, the electronic device EA may be a smartphone, tablet computer, laptop computer, television set, etc. In this exemplary embodiment, a smartphone will be described as a representative example of an electronic device EA.

[0022] An electronic device EA can display an image IM on a third-direction DR3 facing the user via a display surface FS defined in a first direction DR1 and a second direction DR2. The display surface FS displaying the image IM can correspond to the front surface of the electronic device EA (e.g., the top surface of the electronic device EA on the third-direction DR3) and the front surface of the window WM (e.g., the top surface of the window WM on the third-direction DR3). Hereinafter, the display surface FS and the front surface of the electronic device EA, as well as the front surface of the window WM, are given the same reference numerals. The image IM can include one or more still images, full-motion video, and combinations thereof. Figure 1A The clock window and application icons are shown as representative examples of image-based instant messaging (IM). However, image-based IM displayed on electronic devices (EAs) are not limited to these representative examples.

[0023] In this exemplary embodiment, the front (or upper) surface and rear (or lower) surface of each component are defined relative to the direction along which the displayed image IM is traversed. The front and rear surfaces are opposite to each other on a third direction DR3, and the normal direction of each of the front and rear surfaces is substantially parallel to the third direction DR3. The directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are opposite to each other. Therefore, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can be changed to directions other than those shown in the exemplary embodiment.

[0024] like Figure 1B As shown, the electronic device EA includes a window WM, a display module 200, a drive circuit unit 300, a housing 400, and an electronic module 500. In this exemplary embodiment, the window WM and the housing 400 are combined with each other to define the interior and exterior of the electronic device EA.

[0025] The window WM comprises an optically transparent insulating material. For example, in an exemplary embodiment, the window WM may comprise glass, plastic, or a combination thereof. The window WM has a single-layer or multi-layer structure. For example, a multi-layer window WM comprises a plurality of plastic films attached to each other by an adhesive, or comprises a glass substrate and a plastic film attached to the glass substrate by an adhesive.

[0026] When viewed in a plan view, the window WM can be divided into a transmission region TA and a border region BZA. In this disclosure, the phrase "when viewed in a plan view" can refer to the state viewed in the third-party direction DR3. Furthermore, the phrase "thickness direction" can refer to the third-party direction DR3.

[0027] The transmission region TA can be an optically transparent region. The border region BZA can be a region with a relatively lower transmittance than the transmission region TA. The border region BZA can be positioned adjacent to the transmission region TA and can surround the transmission region TA. The border region BZA can define the shape of the transmission region TA.

[0028] The border area BZA may have a predetermined color. The border area BZA may cover the inactive area NAA of the display module 200 to prevent the inactive area NAA from being viewed by the user from the outside. However, in other exemplary embodiments of this disclosure, the border area BZA may be omitted from the window WM.

[0029] In an exemplary embodiment of this disclosure, the window WM includes a module region MA. The module region MA may be superimposed on the electronic module 500, described later (e.g., superimposed on a third-party DR3). An electronic device EA may receive external signals input to the electronic module 500 via the module region MA, or may transmit signals output from the electronic module 500 to the outside (e.g., to an external device). According to an exemplary embodiment of this disclosure, the module region MA may be disposed within the transmission region TA. Therefore, since the module region MA moves from the border region BZA to the transmission region TA, the width of the border region BZA can be reduced.

[0030] Figure 1B A module region MA is shown. However, exemplary embodiments of this disclosure are not limited thereto. For example, an electronic device EA may include multiple module regions MA. Additionally, in Figure 1B In the exemplary embodiment shown, the module region MA is located in the upper left end of the transmission region TA. However, the exemplary embodiments of this disclosure are not limited thereto. For example, the module region MA may be located in various other regions of the transmission region TA (such as the upper right end of the transmission region TA, the center of the transmission region TA, the lower left end of the transmission region TA, the lower right end of the transmission region TA, etc.).

[0031] like Figure 1B As shown, the display module 200 may be disposed below the window WM. In this disclosure, the term "below" may refer to a direction opposite to the direction along which the display module 200 displays the image IM (e.g., third-direction DR3). The display module 200 can display the image IM and can sense external input TC. The display module 200 may include a front surface IS (e.g., the top surface of the display module 200 on the third-direction DR3), the front surface IS including an active area AA and an inactive area NAA. The active area AA may be activated in response to an electrical signal.

[0032] In this disclosure, the effective area AA of the display module 200 can be the area in which the image IM is displayed and the external input TC is sensed. The transmissive area TA of the window WM can be superimposed on the effective area AA (e.g., superimposed on a third-party DR3). For example, the transmissive area TA can be superimposed on at least a portion or the entire surface of the effective area AA. Therefore, a user can view the image IM through the transmissive area TA, or input the external input TC through the transmissive area TA.

[0033] The border area BZA of the window WM can be superimposed on the inactive area NAA of the display module 200 (e.g., superimposed on the third-direction DR3). Therefore, the inactive area NAA can be covered by the border area BZA. The inactive area NAA can be positioned adjacent to the active area AA. For example, the inactive area NAA can be positioned around the periphery of the active area AA. The inactive area NAA can surround the active area AA and define the shape of the active area AA. A drive circuit unit 300 or drive line can be provided in the inactive area NAA to drive the active area AA.

[0034] In this exemplary embodiment, the display module 200 has a flat shape in the effective region AA and the ineffective region NAA. However, the exemplary embodiments of this disclosure are not limited thereto. For example, the display module 200 may be partially curved in the ineffective region NAA. In this embodiment, the display module 200 may be curved toward the rear surface of the electronic device EA in the ineffective region NAA. The curved portion of the display module 200 may overlap with the effective region AA (e.g., on the third direction DR3) and may be disposed below the effective region AA. In this embodiment, the border region BZA of the window WM may not overlap with the curved portion of the display module 200, and the area of ​​the border region BZA may be reduced in the display surface FS of the electronic device EA. In another exemplary embodiment, the display module 200 may have a partially curved shape in the effective region AA. In another exemplary embodiment, the display module 200 may omit the ineffective region NAA.

[0035] The display module 200 includes a display panel 210 and an input sensing layer 220.

[0036] Display panel 210 can be configured to generate an image IM. The generated image IM can be displayed on the front surface IS of display panel 210. The user can view the image IM from the outside through the transmissive area TA of window WM.

[0037] Input sensing layer 220 senses external input TC provided from the outside. For example, input sensing layer 220 can sense external input TC provided through window WM. External input TC can be user input. User input can include various forms of external input, such as a part of the user's body, light, heat, pen, pressure, etc. Figure 1A In the exemplary embodiments shown, the external input TC is illustrated as a touch operation applied by a user's hand via the display surface FS of the electronic device EA. However, the exemplary embodiments of this disclosure are not limited thereto. As described above, the external input TC can be provided in various forms, and the electronic device EA can sense the external input TC applied to the electronic device EA according to the structure of the electronic device EA.

[0038] The driving circuit unit 300 can be electrically connected to the display panel 210 and the input sensing layer 220. The driving circuit unit 300 may include a main circuit board MB, a first flexible film CF1, and a second flexible film CF2.

[0039] The first flexible film CF1 is electrically connected to the display panel 210. The first flexible film CF1 connects the display panel 210 and the main circuit board MB. The first flexible film CF1 is connected to pads (or "soldering pads") (e.g., display pads) arranged in the non-active area NAA of the display panel 210. The first flexible film CF1 provides electrical signals to the display panel 210 to drive the display panel 210. These electrical signals are generated by the first flexible film CF1 or the main circuit board MB.

[0040] The second flexible film CF2 is electrically connected to the input sensing layer 220. The second flexible film CF2 connects the input sensing layer 220 and the main circuit board MB. The second flexible film CF2 is connected to a pad (e.g., a sensing pad) disposed in the non-active area NAA of the input sensing layer 220. The second flexible film CF2 provides an electrical signal to the input sensing layer 220 to drive the input sensing layer 220. The electrical signal is generated by the second flexible film CF2 or the main circuit board MB.

[0041] The main circuit board MB may include various driving circuits for driving the display module 200. The main circuit board MB may also include connectors for power supply. The first flexible film CF1 and the second flexible film CF2 may be connected to the main circuit board MB. According to an exemplary embodiment of this disclosure, the display module 200 can be controlled using a single main circuit board MB. However, in other exemplary embodiments, the main circuit board MB may include multiple circuit boards. For example, the display panel 210 and the input sensing layer 220 may be connected to different main circuit boards, and one of the first flexible film CF1 and the second flexible film CF2 may not be connected to the main circuit board MB.

[0042] In exemplary embodiments of this disclosure, the region of the display module 200 that is superimposed on the module region MA of the window WM (e.g., superimposed on the third-direction DR3) can have a relatively higher transmittance than the effective region AA that is not superimposed on the module region MA. For example, at least some of the components of the display panel 210 and the components of the input sensing layer 220 can be omitted in this region. Therefore, the electronic module 500 configured to be superimposed on the module region MA can easily transmit and / or receive signals through the module region MA.

[0043] Figure 1B The diagram illustrates a structure in which a predetermined aperture MH (hereinafter referred to as a "module aperture") is defined in a region of the display module 200 that is superimposed on the module region MA (e.g., superimposed on the third-direction DR3). The module aperture MH is defined in the effective region AA to penetrate the display module 200. The module aperture MH penetrates the display panel 210 and the input sensing layer 220. The module aperture MH can be defined by the absence of components of the display panel 210 and the input sensing layer 220 in the region superimposed on the module region MA (e.g., superimposed on the third-direction DR3). Since the module aperture MH is defined in the effective region AA of the display module 200, the module region MA of the window WM can be disposed in the transmissive region TA.

[0044] When viewed in a plan view, the electronic module 500 can be stacked with the module aperture MH and the module area MA. The electronic module 500 can be positioned below the display module 200, and at least a portion of the electronic module 500 can be accommodated within the module aperture MH. The electronic module 500 can receive external input TC provided through the module area MA or can provide output through the module area MA.

[0045] The housing 400 is attached to the window WM. The housing 400 is attached to the window WM to form the outer surface of the defined internal space of the electronic device EA. The display module 200 and the electronic module 500 can be positioned within the internal space.

[0046] The housing 400 may include a material with relatively high rigidity. For example, in an exemplary embodiment, the housing 400 may include multiple frames and / or plates comprising glass, plastic, metal, or combinations thereof. The housing 400 can stably protect the components of the electronic device EA located within its internal space from external impacts.

[0047] Reference Figure 2 The electronic device EA includes a display module 200, a power module PM, a first electronic module EM1, and a second electronic module EM2. The display module 200, the power module PM, the first electronic module EM1, and the second electronic module EM2 are electrically connected to each other.

[0048] The power module PM supplies sufficient power for the overall operation of the electronic device EA. The power module PM includes a conventional battery module.

[0049] The first electronic module EM1 and the second electronic module EM2 include various functional modules to operate the electronic device EA.

[0050] The first electronic module EM1 is either directly mounted on the motherboard that is electrically connected to the display module 200, or electrically connected to the motherboard via a connector (not shown) after being mounted on a separate board.

[0051] The first electronic module EM1 includes a control module CM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM, and an external interface IF. Some modules are electrically connected to the motherboard via flexible printed circuit boards, rather than being mounted on the motherboard.

[0052] The control module CM controls the overall operation of the electronic device EA. In an exemplary embodiment, the control module CM may be a microprocessor. However, the exemplary embodiment is not limited thereto. For example, the control module CM activates or deactivates the display module 200. The control module CM controls other modules, such as the image input module IIM or the audio input module AIM, based on touch signals provided from the display module 200.

[0053] The wireless communication module TM can transmit wireless signals to / receive wireless signals from another terminal using Bluetooth or Wi-Fi lines. The wireless communication module TM can also transmit / receive voice signals using conventional communication lines. The wireless communication module TM may include a transmitter TM1 that modulates and transmits the signal to be transmitted, and a receiver TM2 that demodulates the signal applied to it.

[0054] The image input module (IIM) processes image signals and converts them into image data that can be displayed by the display module (200). The audio input module (AIM) receives external audio signals through a microphone in recording mode and voice recognition mode, and converts the audio signals into electronic voice data.

[0055] The external interface IF serves as the interface between the control module CM and external devices such as external chargers, wired / wireless data ports, and card slots (e.g., slots for memory cards and SIM / UIM cards).

[0056] The second electronic module EM2 includes an audio output module AOM, an optical transmitter module LM, an optical receiver module LRM, and a camera module CMM. The components of the second electronic module EM2 are directly mounted on the motherboard and, after being mounted on a separate substrate, are electrically connected to the display module 200 or to the first electronic module EM1 via connectors.

[0057] The audio output module AOM converts audio data provided by the wireless communication module TM or audio data stored in the memory MM and outputs it to a speaker or external device.

[0058] A light emitting module (LM) can generate and emit light. For example, in an exemplary embodiment, the light emitting module (LM) can emit infrared light. The light emitting module (LM) may include a light-emitting diode (LED) device. A light receiving module (LRM) can sense the infrared light. The light receiving module (LRM) can be activated when it senses infrared light equal to or greater than a predetermined level. The light receiving module (LRM) may include a complementary metal-oxide-semiconductor (CMOS) sensor. The infrared light generated by the light emitting module (LM) can be output from the light emitting module (LM) and reflected by an external object (such as a user's finger or face) before entering the light receiving module (LRM). A camera module (CMM) can capture external images.

[0059] In an exemplary embodiment, electronic module 500 may include at least one component of a first electronic module EM1 and a second electronic module EM2. For example, electronic module 500 may include at least one of an audio output module AOM, a light emitting module LM, a light receiving module LRM, a camera module CMM, and a thermal sensing module. Electronic module 500 may sense external objects provided through module region MA, or may provide sound signals such as voice or light such as infrared light to the outside. Furthermore, electronic module 500 may include multiple modules; however, it should not be limited to the specific embodiment.

[0060] Figure 3 This is a plan view showing a display panel 210 according to an exemplary embodiment of the present disclosure. Figure 4 It is shown Figure 3 The enlarged plan view of region XX' shown in the figure.

[0061] Reference Figure 3 and Figure 4 The display panel 210 includes a substrate layer BL, multiple pixels PX, multiple signal lines GL, DL and PL, and multiple display pads PDD.

[0062] The active area AA of the display panel 210 is the area where the image IM is displayed, and the inactive area NAA is the area where the drive circuit unit 300 or drive line is set. Figure 3 The effective area AA and ineffective area NAA of the display panel 210 are shown. Pixel PX is set in the effective area AA.

[0063] The substrate layer BL can be a stacked structure. For example, the substrate layer BL may include a silicon substrate, a plastic substrate, a glass substrate, an insulating film, or multiple insulating layers.

[0064] The effective region AA can include a first region AR1 and a second region AR2. When viewed in a planar view, the second region AR2 can surround the first region AR1. The second region AR2 can be the display area in which the image IM is displayed, and can be surrounded by the ineffective region NAA. Pixel PX can be set on the substrate layer BL to correspond to the second region AR2.

[0065] When viewed in a plan view, at least a portion of the first region AR1 may be superimposed on the module region MA of the window WM. The module aperture MH may be defined within the first region AR1. For example, the module aperture MH may be defined by partially or completely removing components of the display panel 210, and may be configured to superimpose on the module region MA of the window WM. When viewed in a plan view, the first region AR1 may also include the portion of the effective region AA directly surrounding the module aperture MH.

[0066] The pixel PX providing the image may not be set on the first region AR1 of the substrate layer BL. Therefore, the first region AR1 can be defined as a non-display area within the effective region AA. The pixel PX may be set on the second region AR2 of the substrate layer BL. Therefore, the second region AR2 can be defined as a display area within the effective region AA.

[0067] According to this disclosure, when viewed in a plan view, the non-display area AR1 can be configured to be surrounded by the display area AR2. For example... Figure 1B As shown, the non-display area AR1 can be overlaid with the module area MA of the window WM. Therefore, the first area AR1 can eliminate the need for a separate area outside the effective area AA for providing the module area. Thus, the area outside the effective area AA for the module can be omitted in the electronic device EA, and the size of the ineffective area NAA and the border area BZA can be reduced.

[0068] Various signal lines are connected to pixel PX to apply electrical signals to pixel PX. For example, in Figure 3 In the exemplary embodiments shown, the signal lines included in the display panel 210 are scan lines GL, data lines DL, and power lines PL. However, the exemplary embodiments of this disclosure are not limited thereto. In other exemplary embodiments, the signal lines may also include at least one of initialization voltage lines, light emission control lines, etc. The signal lines GL, DL, and PL may be disposed on the second region AR2 of the substrate layer BL.

[0069] exist Figure 3In the exemplary embodiment shown, an equivalent circuit diagram of one of the pixels PX is enlarged and shown as a representative example. Pixel PX may include a first transistor TR1, a capacitor CP, a second transistor TR2, and a light-emitting device OLED. The first transistor TR1 may be a switching device that controls the on / off state of pixel PX. The first transistor TR1 may transmit or block data signals applied to it via data lines DL in response to a scan signal applied to it via scan line GL.

[0070] A capacitor CP is connected to a first transistor TR1 and a power line PL. The capacitor CP is charged with a charge corresponding to the potential difference between the data signal provided from the first transistor TR1 and the power signal applied to the power line PL (hereinafter referred to as the "first power signal").

[0071] A second transistor TR2 is connected to a first transistor TR1, a capacitor CP, and a light-emitting device (OLED). The second transistor TR2 controls the driving current flowing through the OLED in response to the amount of charge charged into the capacitor CP. The on-time of the second transistor TR2 is determined by the amount of charge charged into the capacitor CP. During its on-time, the second transistor TR2 applies a first power signal provided via the power line PL to the OLED.

[0072] An OLED (Optical Display Panel) can generate light in response to an electrical signal or the amount of light generated can be controlled. In an exemplary embodiment, the OLED may include an organic light-emitting device or a quantum dot light-emitting device.

[0073] The light-emitting device (OLED) is connected to the power terminal VSS to receive a power signal (hereinafter referred to as the "second power signal") that is different from the first power signal provided through the power line PL. A drive current corresponding to the difference between the electrical signal provided from the second transistor TR2 and the second power signal flows through the OLED. The OLED generates light corresponding to the drive current. However, the OLED described above is merely exemplary. The pixel PX may include electronics with various different constructions and arrangements compared to the described exemplary embodiments and should not be particularly limited.

[0074] The display pad PDD may include a first pad D1 and a second pad D2. The first pad D1 may include multiple first pads, and the first pad D1 may be connected to a data line DL. The second pad D2 may be electrically connected to a power line PL. The display panel 210 can apply externally supplied electrical signals to the pixel PX through the display pad PDD. The display pad PDD may also include additional pads for receiving other electrical signals besides the first pads D1 and the second pads D2, and the display pad PDD should not be limited to... Figure 3 The exemplary embodiments shown are illustrated below.

[0075] Figure 5 This is a plan view illustrating the input sensing layer 220 according to an exemplary embodiment of the present disclosure.

[0076] Reference Figure 5 The input sensing layer 220 can be disposed on the display panel 210. For example, in an exemplary embodiment, the input sensing layer 220 can be directly disposed on the display panel 210, or it can be bonded to the display panel 210 by an adhesive member. The input sensing layer 220 can be formed on the display panel 210 by a continuous process after the display panel 210 is formed.

[0077] In an exemplary embodiment, the input sensing layer 220 may include a first sensing electrode TE1, a second sensing electrode TE2, multiple sensing lines TL1, TL2 and TL3, and multiple sensing pads PDT. However, other exemplary embodiments may have different numbers and arrangements of sensing electrodes TE1 and TE2, sensing lines TL1 and TL2, and sensing pads PDT. Therefore, the exemplary embodiments of this disclosure are not limited thereto.

[0078] The first sensing electrode TE1 and the second sensing electrode TE2 are disposed in the effective area AA. For example, as Figure 5 In the exemplary embodiment shown, the first sensing electrode TE1 and the second sensing electrode TE2 are arranged in an array of rows and columns, with the first sensing electrode TE1 and the second sensing electrode TE2 alternating in adjacent columns. The input sensing layer 220 can obtain information about the external input TC (refer to) based on the change in capacitance between the first sensing electrode TE1 and the second sensing electrode TE2. Figure 1A (information).

[0079] The first sensing electrode TE1 includes a first sensing pattern SP1 and a first connection pattern BP1. At least one first connection pattern BP1 is connected to two first sensing patterns SP1 positioned adjacent to each other. The second sensing electrode TE2 includes a second sensing pattern SP2 and a second connection pattern BP2. At least one second connection pattern BP2 is connected to two second sensing patterns SP2 positioned adjacent to each other.

[0080] The sensing lines are primarily positioned within the non-active area (NAA). Figure 5 In the exemplary embodiment shown, the sensing lines include a first sensing line TL1, a second sensing line TL2, and a third sensing line TL3.

[0081] A first sensing line TL1 is connected to a first sensing electrode TE1. A second sensing line TL2 is connected to a first end of a second sensing electrode TE2. A third sensing line TL3 is connected to a second end of a second sensing electrode TE2. The first end of the second sensing electrode TE2 is opposite to the second end of the second sensing electrode TE2. For example, the first end of the second sensing electrode TE2 may be spaced apart from the second end of the second sensing electrode TE2 in the second direction DR2.

[0082] According to this disclosure, the second sensing electrode TE2 is connected to the second sensing line TL2 and the third sensing line TL3. Therefore, sensitivity to the region of the second sensing electrode TE2, which has a length longer than the first sensing electrode TE1, can be maintained uniformly. However, exemplary embodiments of the inventive concept are not limited to this particular configuration. For example, in other exemplary embodiments, the third sensing line TL3 may be omitted.

[0083] The sensing pad PDT is set in the non-active area NAA. Figure 5 In the exemplary embodiment shown, the sensing pad PDT includes a first sensing pad T1, a second sensing pad T2, and a third sensing pad T3. However, the exemplary embodiments of this disclosure are not limited thereto. The first sensing pad T1 is connected to a first sensing line TL1 and electrically connected to a first sensing electrode TE1. The second sensing pad T2 is connected to a second sensing line TL2, and the third sensing pad T3 is connected to a third sensing line TL3. Therefore, the second sensing pad T2 and the third sensing pad T3 are electrically connected to the second sensing electrode TE2.

[0084] Some components of the input sensing layer 220 can be removed from the region overlaid with the module region MA of window WM (e.g., overlaid on third-party DR3). For example, a portion of the first sensing electrode TE1 and a portion of the second sensing electrode TE2 may not be disposed in the region overlaid with the module region MA. In this exemplary embodiment, the first sensing electrode TE1 can remove the portion of the first sensing pattern SP1 overlaid with the module region MA, and the second sensing electrode TE2 can remove the portion of the second sensing pattern SP2 overlaid with the module region MA.

[0085] According to this disclosure, since the sensing electrodes TE1 and TE2 are removed in the area overlapping with the module region MA, the electronic module 500 (refer to...) can be prevented from... Figure 1B The sensor is covered by either the first sensing electrode TE1 or the second sensing electrode TE2. Therefore, the sensing sensitivity of the electronic module 500 can be improved.

[0086] Figure 6 This is an exploded perspective view showing the module region MA and module hole MH of an electronic device EA according to an exemplary embodiment of the present disclosure. Figure 7 It is along Figure 6 The cross-sectional view shown is taken along line I-I'.

[0087] Reference Figure 6 and Figure 7 The window WM provides the front surface of the electronic device EA (e.g., the top surface of the electronic device EA on a third direction DR3). The window WM is disposed on the entire surface of the display module 200 (e.g., disposed in a plane defined by a first direction DR1 and a second direction DR2) to protect the display module 200. In an exemplary embodiment, the window WM may include a glass substrate, a sapphire substrate, a plastic film, etc.

[0088] The window WM may include a transparent material and provides a transmissive area TA and a bezel area BZA for the electronic device EA. According to this exemplary embodiment, the transmissive area TA of the window WM may be an area superimposed on the effective area AA of the display panel 210. For example, the transmissive area TA may partially superimpose on the effective area AA or superimpose on the entire effective area AA. A user can view the image IM displayed through the effective area AA of the display panel 210 from the outside through the transmissive area TA.

[0089] The window WM may also include a border layer BZ. The border layer BZ may define a border region BZA. For example, in this exemplary embodiment, the area on the window WM where the border layer BZ is disposed may be defined as the border region BZA, and the exposed area not covered by the border layer BZ may be a transmissive region TA. The border layer BZ may include a colorless (non-colored) layer and a pattern layer providing a predetermined pattern. The pattern layer may provide a pattern called a hairline. The colorless layer may include an organic mixture containing black pigment or dye. In an exemplary embodiment, the border layer BZ may be formed by deposition, printing, or coating methods.

[0090] The window WM may also include a window black matrix WBM. In an exemplary embodiment, the window black matrix WBM may be printed on the back surface of the window WM (e.g., the bottom surface of the window WM on a third-party DR3). The window black matrix WBM may be printed in a color with high light-blocking properties. In an exemplary embodiment, the window black matrix WBM may include an organic mixture containing black pigment or dye. However, the window black matrix WBM may be any material with high light-blocking properties.

[0091] The window black matrix WBM can be positioned within the module region MA of the window WM and can be independent of the module aperture MH (e.g., superimposed on a third-party DR3). For example, the window black matrix WBM can be positioned within the peripheral region PA of the module region MA, which is superimposed on the portion of the display module 200 surrounding the module aperture MH. The window black matrix WBM prevents light passing through the module aperture MH from leaking in the peripheral region of the module aperture MH and prevents light passing through the module aperture MH from passing through the transmission region TA of the window WM and being viewed by the user.

[0092] According to an exemplary embodiment of this disclosure, the module region MA of the window WM may include a peripheral region PA and a central region CA superimposed on the module aperture MH (e.g., superimposed on a third-party DR3). A window black matrix WBM is disposed in the peripheral region PA. The window black matrix WBM may be disposed in the peripheral region PA to prevent light leakage from the peripheral region PA.

[0093] An anti-glare layer can be further provided between the window black matrix WBM and the window WM, or between the window black matrix WBM and the display module 200. The anti-glare layer can be provided in the outer area PA of the module area MA or in the area overlapping with the outer area PA, to prevent glare caused by light leakage from the outer area PA.

[0094] The electronic device EA may include one or more functional layers FL disposed between the window WM and the display module 200. For example, in Figure 7 In an exemplary embodiment, the functional layer FL may be an anti-reflective layer that blocks external light reflection. The anti-reflective layer prevents external light incident through the display surface FS of the electronic device EA from being viewed by the user from the outside after being reflected by the elements of the display module 200. The anti-reflective layer may include a polarizing film and / or a retardation film. The number of retardation films and the phase retardation length of the retardation films (e.g., λ / 4 or λ / 2) may vary. For example, the number of retardation films and the phase retardation length can be determined according to the operating principle of the anti-reflective layer.

[0095] The window WM and the functional layer FL can be attached to each other via a first adhesive layer AL1. The first adhesive layer AL1 can be optically transparent. The first adhesive layer AL1 can be an adhesive layer manufactured by coating a liquid adhesive material and allowing the liquid adhesive material to cure, or a separately manufactured adhesive sheet. For example, the first adhesive layer AL1 can be a pressure-sensitive adhesive (PSA), an optically transparent adhesive (OCA), or an optically transparent resin (OCR).

[0096] The first opening OP1 can be defined to extend through the first adhesive layer AL1 to overlap with the module aperture MH (e.g., overlap on the third direction DR3). For example, the first opening OP1 can be formed through the first adhesive layer AL1 and can overlap with the center region CA of the module region MA. The first opening OP1 can have a size substantially the same as the size of the module aperture MH of the display module 200. As an example, the diameter of the first opening OP1 can be substantially the same as the diameter of the module aperture MH. The electronic module 500 can be disposed within the space provided by the first opening OP1 together with the space provided by the module aperture MH of the display module 200.

[0097] The functional layer FL can be fixed to the rear surface of the window WM via the first adhesive layer AL1. The second opening OP2 can be defined to extend through the functional layer FL to overlap with the module aperture MH (e.g., on a third direction DR3). The second opening OP2 can be formed through the functional layer FL and can overlap with the central region CA of the module region MA. The second opening OP2 can have substantially the same dimensions as the module aperture MH. As an example, the diameter of the second opening OP2 can be substantially the same as the diameter of the module aperture MH. The electronic module 500 can be disposed within the space provided by the second opening OP2, together with the space provided by the first opening OP1 and the module aperture MH of the display module 200.

[0098] The functional layer FL can be attached to the upper surface of the display module 200 (e.g., the upper surface on the third-party DR3) via a second adhesive layer AL2 disposed on the upper surface of the display module 200. The second adhesive layer AL2 can be optically transparent. The second adhesive layer AL2 can be an adhesive layer manufactured by coating a liquid adhesive material and curing the liquid adhesive material, or a separately manufactured adhesive sheet. For example, in an exemplary embodiment, the second adhesive layer AL2 can be a pressure-sensitive adhesive (PSA), an optically transparent adhesive (OCA), or an optically transparent resin (OCR).

[0099] The third opening OP3 can be defined to extend through the second adhesive layer AL2 to overlap with the module aperture MH (e.g., overlapped on the third direction DR3). The third opening OP3 can be formed through the second adhesive layer AL2 and can overlap with the center region CA of the module region MA. The third opening OP3 can have a size substantially the same as the size of the module aperture MH of the display module 200. As an example, the diameter of the third opening OP3 can be substantially the same as the diameter of the module aperture MH. The electronic module 500 can be disposed within the space provided by the third opening OP3, together with the space provided by the first opening OP1, the second opening OP2, and the module aperture MH of the display module 200.

[0100] A module aperture MH can be formed through the display module 200. The module aperture MH can be superimposed on the first opening OP1 to the third opening OP3 (e.g., superimposed on the third direction DR3) and on the center region CA of the module region MA (e.g., superimposed on the third direction DR3). The module aperture MH, together with the first opening OP1 to the third opening OP3, can provide a space in which the electronic module 500 is disposed. Therefore, the electronic module 500 can be inserted into this space and can be stably fixed therein.

[0101] exist Figure 7 In this embodiment, the first opening OP1 to the third opening OP3 and the module hole MH have substantially the same dimensions as each other. However, the exemplary embodiments of this disclosure are not limited thereto. For example, the first opening OP1 to the third opening OP3 may have dimensions larger than the module hole MH (such as diameters defined in the first direction DR1 and / or the second direction DR2). In an exemplary embodiment, the diameters of the first opening OP1 to the third opening OP3 may be designed to increase as the distance from the respective opening to the module hole MH increases in the third direction DR3. However, in another exemplary embodiment, the diameters of the first opening OP1 to the third opening OP3 may decrease as the distance from the respective opening to the module hole MH increases in the third direction DR3.

[0102] Figure 8 This is a cross-sectional view showing the module region MA and module hole MH of an electronic device EA according to another exemplary embodiment of the present disclosure.

[0103] Reference Figure 8 The second opening OP2 can be defined to extend through the functional layer FL and overlap with the module aperture MH (e.g., overlapped on the third-direction DR3). A first light-blocking layer LBL1 and a second light-blocking layer LBL2 can be disposed in the peripheral region adjacent to the second opening OP2. The first light-blocking layer LBL1 can be disposed on the upper surface of the functional layer FL (e.g., the upper surface on the third-direction DR3) and can overlap with the peripheral region PA of the module region MA (e.g., overlapped on the third-direction DR3). The second light-blocking layer LBL2 can be disposed on the lower surface of the functional layer FL (e.g., the lower surface on the third-direction DR3) and can overlap with the peripheral region PA of the module region MA (e.g., overlapped on the third-direction DR3).

[0104] As an example, the first light-blocking layer LBL1 and the second light-blocking layer LBL2 can be black matrix layers formed on the upper and lower surfaces of the functional layer FL, respectively. In an exemplary embodiment, the first light-blocking layer LBL1 and the second light-blocking layer LBL2 can be formed on the upper and lower surfaces of the functional layer FL by printing, deposition, or coating methods. The first light-blocking layer LBL1 and the second light-blocking layer LBL2 can include organic or metallic materials with light-blocking properties. The first light-blocking layer LBL1 and the second light-blocking layer LBL2 can have annular shapes and can have dimensions smaller than the size of the window black matrix WBM (e.g., the diameter in the first direction DR1 and / or the second direction DR2). For example, as... Figure 8 As shown, the first light-blocking layer LBL1 and the second light-blocking layer LBL2 have a width W1 (e.g., a length in the second direction DR2) that is smaller than the width W2 (e.g., the length in the second direction DR2) of the window black matrix WBM.

[0105] In this exemplary embodiment, the first light-blocking layer LBL1 and the second light-blocking layer LBL2 have dimensions smaller than the size of the windowed black matrix WBM; however, they should not be limited to or restricted by this. For example, the first light-blocking layer LBL1 and the second light-blocking layer LBL2 may have dimensions substantially the same as the size of the windowed black matrix WBM. In another exemplary embodiment, one of the first light-blocking layer LBL1 and the second light-blocking layer LBL2 may have dimensions substantially the same as the size of the windowed black matrix WBM, and the other of the first light-blocking layer LBL1 and the second light-blocking layer LBL2 may have dimensions smaller than the size of the windowed black matrix WBM.

[0106] In an exemplary embodiment, the anti-glare layer may be configured to be adjacent to one of the first light-blocking layer LBL1 and the second light-blocking layer LBL2.

[0107] In another exemplary embodiment, the electronic device EA may include an anti-glare layer on the lower surface of the functional layer FL.

[0108] Figure 9 This is an exploded perspective view showing the module region MA and module hole MH of an electronic device EA according to another exemplary embodiment of the present disclosure. Figure 10 It is along Figure 9 The cross-sectional view shown is taken along line II-II'.

[0109] Reference Figure 9 and Figure 10The window WM may also include a window black matrix WBM disposed in the module area MA. The window black matrix WBM may be printed in the peripheral area PA on the back surface of the window WM (e.g., the bottom surface on the third-direction DR3). The window black matrix WBM may be printed in a color with high light-blocking properties. The window black matrix WBM may be any material with high light-blocking properties.

[0110] The second adhesive layer AL2, the functional layer FL, and the first adhesive layer AL1 can be sequentially stacked on a third direction DR3 between the window WM and the display module 200. A first opening OP1 is defined to pass through the first adhesive layer AL1 to overlap with the module aperture MH, a second opening OP2 is defined to pass through the functional layer FL, and a third opening OP3 is defined to pass through the second adhesive layer AL2. The first opening OP1 to the third opening OP3 have dimensions larger than the module aperture MH (e.g., length in the first direction DR1 and / or the second direction DR2). For example, the diameter of the first opening OP1 to the third opening OP3 is larger than the diameter of the module aperture MH. The first opening OP1 to the third opening OP3 overlap with the peripheral region PA of the module region MA (e.g., overlap on the third direction DR3). The first opening OP1 to the third opening OP3, together with the module aperture MH of the display module 200, provide space in which the electronic module 500 is disposed.

[0111] A light-blocking layer (BIL) may be disposed within the first opening OP1 to the third opening OP3. The light-blocking layer BIL may be superimposed on the peripheral region PA of the module region MA (e.g., superimposed on the third direction DR3). As an example, in an exemplary embodiment, the light-blocking layer BIL may be formed on the upper surface of the display module 200 exposed through the first opening OP1 to the third opening OP3 by an inkjet printing method. The light-blocking layer BIL may include an organic mixture containing black dye or pigment. The light-blocking layer BIL and the window black matrix WBM may have an annular shape, and the light-blocking layer BIL may have a size smaller than that of the window black matrix WBM. For example, the width W4 of the light-blocking layer BIL in the second direction DR2 may be smaller than the width W3 of the window black matrix WBM in the second direction DR2.

[0112] exist Figure 9 and Figure 10 In the exemplary embodiments shown, the light-blocking layer BIL has a size smaller than the window black matrix WBM (e.g., its diameter in the first direction DR1 and / or the second direction DR2). However, exemplary embodiments of this disclosure are not limited thereto. For example, the light-blocking layer BIL may have a size substantially the same as the window black matrix WBM. In some embodiments, the light-blocking layer BIL may have a size larger than the window black matrix WBM.

[0113] A light-blocking layer (BIL) can be formed on a first region AR1 defined around the module aperture MH of the display module 200. In an exemplary embodiment, with the functional layer FL attached to the upper surface of the display module 200 via a second adhesive layer AL2, the light-blocking layer BIL can be formed by spraying ink onto the upper surface of the display module 200. In another exemplary embodiment, the light-blocking layer BIL can be formed by spraying ink onto the upper surface of the display module 200 corresponding to the first region AR1 of the display module 200, and then the functional layer FL can be subsequently attached to the display module 200 via the second adhesive layer AL2.

[0114] The light-blocking layer (BIL) is disposed within the first opening OP1 to the third opening OP3, and is located between the window black matrix (WBM) and the display module 200. For example... Figure 9 As shown, the light-blocking layer BIL is formed to be superimposed on the peripheral region PA of the module region MA (e.g., superimposed on the third direction DR3). For example, the light-blocking layer BIL can be superimposed on the first region AR1 of the display module 200. Therefore, light leakage phenomenon in which light leaks from the first region AR1 can be prevented. Since the light-blocking layer BIL extends within the inner region from the first opening OP1 to the third opening OP3, the light-blocking layer BIL has a greater than 0.5 g / cm³ on the third direction DR3. Figure 8 The thicknesses of the light-blocking layers LBL1 and LBL2 are shown in the diagram. Therefore, compared to... Figure 8 The light-blocking layers LBL1 and LBL2 shown in the figure have higher light-blocking performance, resulting in a greater reduction in light leakage.

[0115] Figure 11 This is an exploded perspective view showing the module regions MA1 and MA2 of the electronic device EA2 according to another exemplary embodiment of the present disclosure. Figure 12 It is along Figure 11 The cross-sectional view shown is taken from line III-III'.

[0116] Reference Figure 11 and Figure 12 In another exemplary embodiment of the electronic device EA2 according to the present disclosure, the window WM may include a first module region MA1 and a second module region MA2. The first module region MA1 of the electronic device EA2 has a... Figures 6 to 10 The structure of the module region MA shown in the figure is basically the same, so its details will be omitted.

[0117] The electronic device EA2 may also include a second window black matrix WBM2 disposed in a second module region MA2. The second module region MA2 may include a peripheral region PA2 and a window module hole WMH superimposed (e.g., superimposed on a third-direction DR3) with a second module hole MH2 disposed in the display module 200. The second window black matrix WBM2 may be printed in the peripheral region PA2 on the rear surface of the window WM (e.g., the bottom surface of the window WM on the third-direction DR3). The second window black matrix WBM2 may be printed in a color with high light-blocking properties. For example, the second window black matrix WBM2 may include an organic mixture containing black pigment or dye. However, the second window black matrix WBM2 may be any material with high light-blocking properties.

[0118] The second adhesive layer AL2, the functional layer FL, and the first adhesive layer AL1 can be sequentially stacked on a third direction DR3 between the window WM and the display module 200. A fourth opening OP4 is defined to pass through the first adhesive layer AL1, a fifth opening OP5 is defined to pass through the functional layer FL, and a sixth opening OP6 is defined to pass through the second adhesive layer AL2. The fourth to sixth openings OP4 can be stacked with the second module aperture MH2 (e.g., on the third direction DR3). The fourth to sixth openings OP6 have substantially the same dimensions as the second module aperture MH2 and the window module aperture WMH. For example, the diameter of the fourth to sixth openings OP6 (e.g., the diameter in the plane defined on the first direction DR1 and / or the second direction DR2) is substantially the same as the diameter of the second module aperture MH2. The fourth to sixth openings OP4, together with the second module aperture MH2 and the window module aperture WMH, provide space in which the electronic module 600 is disposed. In this exemplary embodiment, the electronic module 600 disposed in the second module region MA2 is a different type of electronic module from the electronic module 500 disposed in the first module region MA1. For example, the electronic module 600 may be an audio output module AOM (refer to) that needs to be exposed to the outside through a window module hole WMH. Figure 2 However, exemplary embodiments of this disclosure are not limited thereto.

[0119] A third light-blocking layer LBL3 may be disposed around the fourth opening OP4. The third light-blocking layer LBL3 may be superimposed on the peripheral region PA2 of the second module region MA2 (e.g., superimposed on the third direction DR3). As an example, the third light-blocking layer LBL3 may be a black matrix layer formed on the upper surface of the functional layer FL by printing, deposition, or coating methods. The third light-blocking layer LBL3 may comprise an organic or metallic material with light-blocking properties. The third light-blocking layer LBL3 and the second window black matrix WBM2 may have an annular shape, and the third light-blocking layer LBL3 may have a size smaller than that of the second window black matrix WBM2 (e.g., the diameter in the first direction DR1 and / or the second direction DR2). For example, the width W5 of the third light-blocking layer LBL3 in the second direction DR2 may be smaller than the width W6 of the second window black matrix WBM2 in the second direction DR2.

[0120] In this disclosure, a structure in which the third light-blocking layer LBL3 has a size smaller than that of the second window black matrix WBM2 is shown as a representative example. However, exemplary embodiments of this disclosure are not limited thereto. For example, the third light-blocking layer LBL3 may have a size substantially the same as that of the second window black matrix WBM2, or it may have a size larger than that of the second window black matrix WBM2.

[0121] The second module hole MH2 can be formed through the display module 200. The second module hole MH2 can be superimposed on the fourth opening OP4 to the sixth opening OP6 (e.g., superimposed on the third direction DR3), and can also be superimposed on the window module hole WMH of the second module region MA2. The electronic module 600 can be disposed in the space formed by the second module hole MH2, the fourth opening OP4 to the sixth opening OP6, and the window module hole WMH. Therefore, the electronic module 600 can be inserted into this space and stably fixed therein.

[0122] In another exemplary embodiment, the fourth opening OP4 to the sixth opening OP6 may have a diameter for accommodating a light-blocking layer (e.g., an annular light-blocking layer). The light-blocking layer is disposed within the interior space of the fourth opening OP4 to the sixth opening OP6 and extends from the fourth opening OP4 to the sixth opening OP6 in a third-direction DR3. The electronic module 600 is disposed within the interior space defined by the light-blocking layer.

[0123] Figure 13 This is a cross-sectional view showing the effective area AA of a display panel 210 according to an exemplary embodiment of the present disclosure. Figure 14 This is a cross-sectional view showing the module region MA of an electronic device EA according to an exemplary embodiment of the present disclosure.

[0124] Reference Figure 13 and Figure 14The display panel 210 includes a substrate layer BL, a circuit device layer DP-CL disposed on the substrate layer BL, a display device layer DP-OLED disposed on the circuit device layer DP-CL, an encapsulation substrate EC, and a sealing member SM.

[0125] The substrate layer BL may include a glass substrate. The substrate layer BL may include a substrate having a constant refractive index in the visible light wavelength range.

[0126] The circuit device layer DP-CL may include a buffer layer BFL as an inorganic layer, a first intermediate inorganic layer CL1 and a second intermediate inorganic layer CL2, and an intermediate organic layer CL3 as an organic layer. Figure 13 The arrangement of the semiconductor pattern OSP, control electrode GE, input electrode DE, and output electrode SE forming the first transistor TR1 is shown. The circuit device layer DP-CL may also include at least one contact hole. For example, in Figure 13 A representative example shows the first contact hole CH1 and the second contact hole CH2.

[0127] The DP-OLED display device layer includes an OLED light-emitting device. The DP-OLED display device layer includes an organic light-emitting diode (OLED) as the light-emitting device. The DP-OLED display device layer includes a pixel-defining layer (PDL) (e.g., an organic material).

[0128] A first electrode AE ​​is disposed on an intermediate organic layer CL3. The first electrode AE ​​is connected to an output electrode SE through a third contact hole CH3 defined by the intermediate organic layer CL3. An opening OP is defined by a pixel defining layer PDL. At least a portion of the first electrode AE ​​is exposed through the opening OP of the pixel defining layer PDL. The opening OP of the pixel defining layer PDL is referred to as a "light-emitting opening" to distinguish it from other openings.

[0129] The display area AR2 of the display panel 210 may include a light-emitting area PXA and a non-light-emitting area NPXA defined adjacent to the light-emitting area PXA. The non-light-emitting area NPXA may surround the light-emitting area PXA. In this exemplary embodiment, the light-emitting area PXA is defined to correspond to the portion of the first electrode AE ​​exposed through the light-emitting opening OP.

[0130] A hole control layer (HCL) can be commonly disposed in the emitting region (PXA) and the non-emitting region (NPXA). The HCL may include a hole transport layer and may also include a hole injection layer. An emissive layer (EML) can be disposed on the HCL. The EML can be disposed in the region corresponding to the emitting aperture (OP). The EML can be formed in each pixel after being divided into multiple parts. The EML may include organic and / or inorganic materials. The EML can generate light of a predetermined color.

[0131] An electronic control layer (ECL) can be disposed on the light-emitting layer (EML). The ECL may include an electron transport layer and may also include an electron injection layer. An aperture mask can be used to jointly form a hole control layer (HCL) and an electronic control layer (ECL) in multiple pixels. A second electrode (CE) can be disposed on the ECL. The second electrode (CE) can be commonly disposed in multiple pixels.

[0132] A protective layer (PIL) can be further disposed on the display device layer (DP-OLED). The protective layer (PIL) protects the second electrode (CE) of the OLED. The protective layer (PIL) may include inorganic materials such as silicon oxide, silicon nitride, and silicon oxynitride.

[0133] The encapsulation substrate EC can be disposed on the second electrode CE. The encapsulation substrate EC and the second electrode CE can be spaced apart from each other (e.g., spaced apart from each other on a third-direction DR3). The gap GP between the encapsulation substrate EC and the second electrode CE can be filled with air or an inert gas. Alternatively, the gap GP can be filled with a filler, such as a silicone polymer, epoxy resin, acrylic resin, etc.

[0134] The encapsulation substrate EC can be transparent. The encapsulation substrate EC can include a glass substrate. The encapsulation substrate EC can include a substrate with a constant refractive index in the visible light wavelength range.

[0135] The stacked structure of the substrate layer BL, the circuit device layer DP-CL, and the display device layer DP-OLED can be defined as the lower display substrate. A sealing member SM can bond the lower display substrate and the encapsulation substrate EC. The sealing member SM can extend along the edge of the encapsulation substrate EC. The sealing member SM can be connected to the non-active area NAA of the display panel 210 (see reference). Figure 3 Overlay (e.g., overlay on a third party onto DR3).

[0136] like Figure 14 As shown, the sealing member SM can be stacked with the non-display area AR1 of the display panel 210. Pixels are not formed in the non-display area AR1 of the display panel 210. The non-display area AR1 of the display panel 210 can be stacked with... Figure 1A The module area MA of the electronic device EA shown in the figure is stacked.

[0137] The encapsulation substrate EC and the sealing member SM can prevent moisture from entering the lower display substrate. In an exemplary embodiment of this disclosure, the sealing member SM can bond the upper surface of the substrate layer BL (e.g., the upper surface on the third-direction DR3) and the lower surface of the encapsulation substrate EC to each other.

[0138] In an exemplary embodiment, the sealing member SM may include an inorganic adhesive member such as a glass frit. However, in other exemplary embodiments, the sealing member SM may include an organic adhesive member. In this exemplary embodiment, since the display panel 210 is completely sealed from the outside, the strength of the display panel 210 can be improved, and defects in the light-emitting device OLED can be prevented.

[0139] The display module 200 may further include a fourth light-blocking layer LBL4 disposed on the upper surface of the display panel 210 corresponding to a first region AR1 defined around the module aperture MH. For example, the fourth light-blocking layer LBL4 may be disposed on the upper surface of the encapsulation substrate EC. As an example, the fourth light-blocking layer LBL4 may be a black matrix layer formed on the upper surface of the encapsulation substrate EC by printing, deposition, or coating methods. The fourth light-blocking layer LBL4 may include an organic or metallic material with light-blocking properties. The fourth light-blocking layer LBL4 and the window black matrix WBM may have an annular shape, and the fourth light-blocking layer LBL4 may have a size smaller than the size of the window black matrix WBM (e.g., the diameter in the first direction DR1 and / or the second direction DR2). For example, the width W7 of the fourth light-blocking layer LBL4 in the second direction DR2 may be smaller than the width W8 of the window black matrix WBM in the second direction DR2.

[0140] In this exemplary embodiment, the fourth light-blocking layer LBL4 has a size smaller than that of the window black matrix WBM. However, exemplary embodiments of this disclosure are not limited thereto. For example, the fourth light-blocking layer LBL4 may have a size substantially the same as that of the window black matrix WBM.

[0141] like Figure 14 As shown, when the display module 200 includes a fourth light-blocking layer LBL4, light-blocking layers LBL1 and LBL2 (refer to...) Figure 8 The light-blocking layer may not be disposed on at least one of the upper and lower surfaces of the functional layer FL. However, in another exemplary embodiment, the electronic device may include a fourth light-blocking layer LBL4 and at least one of light-blocking layers LBL1 and LBL2.

[0142] The fourth light-blocking layer LBL4 can be formed to overlap with the peripheral area of ​​the module aperture MH (such as the first area AR1) to prevent light from leaking from the first area AR1.

[0143] Figure 15 This is a cross-sectional view showing the module region MA of an electronic device EA according to another exemplary embodiment of the present disclosure.

[0144] Reference Figure 15The display panel 210 may include a light-blocking sealing member BSM superimposed on the non-display area AR1 of the display panel 210 (e.g., superimposed on the third-party DR3). The light-blocking sealing member BSM may be a sealing member with light-blocking properties. The light-blocking sealing member BSM may include an adhesive member and an organic mixture containing a black dye or pigment.

[0145] In an exemplary embodiment, the light-blocking sealing member BSM can be connected to the ineffective area NAA of the display panel 210 (see reference). Figure 3 The light-blocking sealing member BSM can extend from the upper surface of the substrate layer BL to the lower surface of the encapsulation substrate EC. However, in another exemplary embodiment, the light-blocking sealing member BSM can be disposed in the non-display area AR1 of the display panel 210, and Figure 14 The sealing member SM shown can be installed in the non-effective area NAA.

[0146] like Figure 15 As shown, the light-blocking layer LBL can be disposed on the upper surface of the functional layer FL. However, exemplary embodiments of this disclosure are not limited thereto. For example, in an exemplary embodiment in which the light-blocking sealing member BSM is included in the display panel 210, the electronic device EA may include a first light-blocking layer LBL1 and a second light-blocking layer LBL2 disposed on the upper and lower surfaces of the functional layer FL, respectively (see reference). Figure 8 ) and the light-blocking layer BIL sprayed on the upper surface of the display module 200 (see reference) Figure 9 and Figure 10 ).

[0147] Therefore, the light-blocking sealing member BSM can prevent light passing through the module aperture MH from leaking out from the first region AR1 defined around the module aperture MH. In addition, since the leaked light is blocked again by the window black matrix WBM and the light-blocking layer LBL, the phenomenon that the light leaking from the first region AR1 of the module aperture MH can be seen by the user from the outside can be prevented.

[0148] Although exemplary embodiments of this disclosure have been described, it is understood that this disclosure should not be limited to these exemplary embodiments, but rather that various changes and modifications can be made by those skilled in the art within the spirit and scope of this disclosure as claimed. Therefore, the subject matter disclosed should not be limited to any single embodiment described herein.

Claims

1.An electronic device comprising: a display module having an active area in which pixels are disposed and a non-active area in which pixels are not disposed and adjacent to the active area, the active area including a module hole; a window disposed on the display module; a functional layer disposed between the display module and the window, the functional layer including a first opening defined therethrough, the first opening overlapping the module hole; a light-blocking layer disposed on at least one of an upper surface and a lower surface of the functional layer and positioned adjacent to the first opening; and an electronic module disposed in an opening formed by at least one of the module hole and the first opening, wherein the light-blocking layer includes a first light-blocking layer disposed on the upper surface of the functional layer and positioned adjacent to the first opening, and a second light-blocking layer disposed on the lower surface of the functional layer and positioned adjacent to the first opening, wherein the lower surface of the functional layer faces the display module. 2.The electronic device of claim 1, further comprising: an adhesive layer disposed between the upper surface of the functional layer and the window, the adhesive layer including a second opening defined therethrough, the second opening overlapping the module hole; wherein the electronic module is disposed in an opening formed by at least one of the module hole, the first opening, and the second opening. the window includes a window module hole overlapping the module hole, 3.The electronic device of claim 1, wherein wherein the electronic module is exposed to the outside through the window module hole. the active area includes: 4.The electronic device of claim 1, wherein a first area defined adjacent to the module hole; and a second area surrounding the first area, wherein the at least one pixel is not disposed in the first area, and the at least one pixel is disposed in the second area. the light-blocking layer overlaps the first area. 5.The electronic device of claim 4, wherein the light-blocking layer includes an organic mixture including a black dye or pigment. 6.The electronic device of claim 1, wherein the electronic module includes at least one of an audio output module, a light emission module, a light reception module, and a camera module. 7.The electronic device of claim 1, wherein 8.An electronic device comprising: a display module having an active area in which pixels are disposed and a non-active area in which pixels are not disposed and adjacent to the active area, the active area including a module hole; a window disposed on the display module; a functional layer disposed between the display module and the window, the functional layer including a first opening defined therethrough, the first opening overlapping the module hole; a light-blocking layer disposed on at least one of an upper surface and a lower surface of the functional layer and positioned adjacent to the first opening; an electronic module disposed in an opening formed by at least one of the module hole and the first opening; and a window black matrix disposed on an upper surface or a lower surface of the window, the window black matrix positioned to overlap the light-blocking layer, wherein the window includes a window module hole overlapping the module hole, wherein the window black matrix is disposed around the window module hole. ​ ​ 9.The electronic device of claim 8, wherein The window black matrix has a width greater than a width of the light blocking layer. 10.The electronic device of claim 8, wherein The electronic module is exposed to the outside through the window module aperture.

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