Substrate transfer apparatus, substrate processing system including the same, and substrate processing apparatus

Abstract

The invention relates to a substrate transfer apparatus, a substrate processing system including the same, and a substrate processing apparatus. This hand for drying a substrate is provided with: a first branch blade; a pair of base end guides which are provided at the base end of the first branch blade and which are in contact with the substrate end; and a pair of tip guides provided at the tip of the first branch blade and in contact with the substrate tip. The hand for wetting the substrate is provided with: a second branch blade; a pair of base end protrusions provided on the base end portion of the second branch blade, the base end protrusions being in contact with the lower surface of the substrate to support the substrate; and a pair of tip protrusions provided at the tip of the second branch blade and supporting the substrate by being in contact with the lower surface of the substrate.

Description

[0001] This application claims priority to Japanese Patent Application No. 2024-138961, filed on August 20, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates to a substrate processing system and a substrate processing apparatus capable of performing a prescribed liquid treatment on a substrate, and more particularly to a substrate conveying apparatus for conveying a substrate in a substrate processing system or a substrate processing apparatus. Background Technology

[0003] Patent Document 1 describes a substrate transport device that reliably prevents liquid spillage when transporting a substrate containing liquid. Specifically, this substrate transport device includes a hand that holds the substrate and a cover that houses the hand within a defined internal space. Liquid on the substrate held by the hand will not spill outside the cover.

[0004] <List of Background Technology Documents>

[0005] Japanese Patent Application Publication No. 2020-188228 Summary of the Invention

[0006] However, the aforementioned configuration does not adequately address the transport of the dry substrate. The substrate transport apparatus of Patent Document 1 is specifically designed for transporting substrates containing liquid. In cases where a dry substrate needs to be transported in addition to a substrate containing liquid, a substrate transport apparatus that only has a hand for transporting a wetted substrate may result in the liquid adhering to the hand wetting the dry substrate.

[0007] The present invention was made in view of such matters, and its object is to provide a substrate conveying apparatus capable of reliably conveying dry and wet substrates, a substrate processing system having the same, and a substrate processing apparatus.

[0008] To solve the aforementioned problem, the present invention employs the following configuration. That is, the substrate conveying apparatus of the present invention is characterized in that it is a substrate conveying apparatus for conveying substrates, and comprises:

[0009] At least one dry substrate is held in a horizontal position by hand;

[0010] The wet substrate hand is positioned below the dry substrate hand and is used to support the substrate containing the liquid.

[0011] The first moving mechanism supports the drying substrate in a way that allows it to be moved by hand;

[0012] The second moving mechanism supports the wetted substrate in a manner movable by hand; and

[0013] The base component supports the first moving mechanism and the second moving mechanism; and

[0014] The drying substrate is provided by hand:

[0015] First blade;

[0016] A pair of base end guides are disposed at the base end of the first blade and contact the end of the substrate;

[0017] A pair of end guides are disposed at the end of the first blade and contact the end of the substrate; and

[0018] A substrate holder pusher, located at the base end of the first blade and positioned between a pair of first base end guides, can press the substrate against the end guides by contacting the end edge of the substrate, thus cooperatively holding the substrate in place with the end guides; and

[0019] The wetted substrate is provided by hand:

[0020] Second blade;

[0021] A pair of base-end protrusions are disposed at the base end of the second blade, contacting the lower surface of the substrate to support the substrate; and

[0022] A pair of end protrusions are disposed at the end of the second blade and contact the lower surface of the substrate to support the substrate.

[0023] [Function and Effect] According to the above configuration, since a drying substrate hand and a wetting substrate hand are separately provided, the drying substrate will not be wetted by an external liquid. Furthermore, the drying substrate hand and the wetting substrate hand each have separate substrate support structures corresponding to their respective applications, thus allowing for reliable transport of the drying substrate and the wetting substrate respectively. Specifically, the drying substrate hand includes: a first blade; a pair of base end guides disposed at the base end of the first blade and in contact with the substrate end; a pair of end guides disposed at the end of the first blade and in contact with the substrate end; and a substrate holding pusher located at the base end of the first blade, positioned between the pair of first base end guides, capable of pressing the substrate against the end guides by contacting the substrate edge, and cooperatively holding the substrate with the end guides. With this configuration, a substrate transport device capable of high-speed transport while reliably holding the drying substrate can be provided.

[0024] Furthermore, the substrate wetting hand includes: a second blade; a pair of base-end protrusions disposed at the base end of the second blade, contacting the lower surface of the substrate to support the substrate; and a pair of end protrusions disposed at the end of the second blade, contacting the lower surface of the substrate to support the substrate. Since the base-end protrusions and end protrusions do not contact the ends of the substrate, the liquid contained on the substrate will not drip down the base-end protrusions or end protrusions. However, if the hand is pressed against the end of the substrate using a component such as a substrate holder pusher provided on the substrate drying hand, the liquid contained on the substrate will drip down the component, which would be undesirable.

[0025] Furthermore, according to the aforementioned configuration, the drying substrate hand is provided separately from the hand used for wetting the substrate. Thus, by configuring the hand to be separate depending on the substrate's wetness, the drying substrate is not handled with a wet hand. According to the configuration of the present invention, substrate handling can be performed while reliably maintaining the substrate's dryness.

[0026] According to the configuration, the wet substrate hand is positioned below the dry substrate hand. With this configuration, liquid dripping from the wet substrate hand will not transfer to the dry substrate hand. This is because the dry substrate hand is positioned above the wet substrate hand.

[0027] Furthermore, the substrate conveying device preferably includes:

[0028] A fixed flat disk, supported by the base component below the hand holding the wetted substrate, is used to recover liquid dropped from the hand holding the wetted substrate.

[0029] A movable flat disk is positioned between the wetted substrate hand and the fixed flat disk to catch liquid dripping from the wetted substrate hand and guide it to the fixed flat disk; and

[0030] The moving flat disk advance and retreat mechanism causes the moving flat disk to move forward and backward relative to the base component in the horizontal direction.

[0031] [Function and Effect] According to the above configuration, the device includes: a fixed flat disk supported by a base member below the hand used to wet the substrate, for collecting liquid dripping from the hand used to wet the substrate; and a movable flat disk disposed between the hand used to wet the substrate and the fixed flat disk, for catching liquid dripping from the hand used to wet the substrate and guiding it to the fixed flat disk. With this configuration, liquid dripping from the hand used to wet the substrate is collected in the fixed flat disk. If the movable flat disk follows the forward and backward movement of the hand used to wet the substrate, the movable flat disk can catch the liquid placed on the substrate regardless of the position of the hand used to wet the substrate. Therefore, according to the above configuration, a substrate conveying device that can suppress liquid spillage can be provided.

[0032] Furthermore, the substrate conveying device preferably includes:

[0033] The tray handle is positioned below the wetted substrate handle; and

[0034] The third moving mechanism supports the tray movably by hand, and is supported by the base component; and

[0035] The tray hand has a tray for catching liquid dropped from the wetted substrate by hand.

[0036] [Function and Effect] According to the above configuration, the device includes: a tray hand disposed below the substrate-wetting hand; and a third moving mechanism that movably supports the tray hand by means of a base member; and the tray hand has a tray for catching liquid dripping from the substrate-wetting hand. With this configuration, a tray can be constructed that faithfully follows the substrate-wetting hand, thus enabling the tray to catch liquid placed on the substrate. Therefore, according to this configuration, a substrate transport device capable of suppressing liquid spillage can be provided.

[0037] Furthermore, in the substrate conveying device, preferably...

[0038] The drying substrate handpiece consists of two hands arranged vertically, namely an upper handpiece and a lower handpiece.

[0039] The upper hand and the lower hand are supported by a separately provided first moving mechanism so that they can move independently.

[0040] [Function and Effect] According to the above configuration, the drying substrate hand consists of two hands arranged vertically, namely an upper hand and a lower hand, which are supported by a separately provided first moving mechanism so that they can move independently. With this configuration, the transport of the dried substrate before substrate processing and the transport of the dried substrate after substrate processing can be performed using different hands. Therefore, it is possible to prevent the situation where a clean dried substrate after substrate processing is held in place by a hand contaminated by the dried substrate before substrate processing. According to this configuration, a substrate transport device that improves the reliability of substrate processing in a substrate processing apparatus can be provided.

[0041] This specification describes an invention of a substrate processing system equipped with the aforementioned substrate conveying device.

[0042] The substrate processing system is characterized by having:

[0043] A batch processing device for uniformly processing multiple substrates in batches;

[0044] The relay device receives multiple batch-processed substrates from the batch processing device, converts each substrate into a horizontal position, fills the horizontally positioned substrates with liquid, and transports them.

[0045] A single-wafer processing device receives the liquid-filled substrate transported to the relay device and performs single-wafer processing on each substrate; and

[0046] The control unit controls the batch processing device, the single-chip processing device, and the relay device; and

[0047] The single-chip processing device includes:

[0048] The drying chamber allows the substrates to be dried one by one;

[0049] The substrate conveying device; and

[0050] The transfer robot returns the dried substrate to the carrier;

[0051] The control unit

[0052] Control the substrate conveying device so that the wetted substrate is received by hand with liquid and conveyed to the drying chamber;

[0053] The drying chamber is controlled to perform the substrate drying process;

[0054] The substrate conveying device is controlled to receive the dried substrate, which has been dried in the drying chamber, by hand and transfer it to the transfer robot; and

[0055] The transfer robot is controlled to return the dried substrate to the carrier.

[0056] [Function and Effect] According to the above configuration, the control unit controls the substrate conveying device to receive the substrate containing liquid with a wetted substrate hand and convey it to the drying chamber; controls the drying chamber to perform substrate drying treatment; and controls the substrate conveying device to receive the dried substrate in the drying chamber with a dry substrate hand and convey it to the transfer robot. Thus, by configuring the device to have separate hands depending on the substrate's wetness state, the dried substrate is not conveyed with a wet hand. According to the configuration of the present invention, substrate conveying can be performed while reliably maintaining the substrate's dryness state.

[0057] Similarly, this specification describes an invention of a substrate processing apparatus equipped with the aforementioned substrate conveying device.

[0058] The substrate processing apparatus is characterized in that it is a substrate processing apparatus that includes a substrate conveying device for processing substrates one by one, and further includes:

[0059] The device includes a transfer robot for transporting substrates, a processing block for substrate processing, and a control unit for controlling the devices.

[0060] The processing block has:

[0061] The liquid supply chamber holds the liquid in the substrate;

[0062] A drying chamber that receives and dries a substrate containing liquid; and

[0063] The substrate conveying device; and

[0064] The control unit

[0065] Control the transfer robot to remove the substrate from the carrier;

[0066] Control the substrate conveying device to receive the substrate taken out by the transfer robot by hand and move it to the liquid supply chamber;

[0067] Control the liquid supply chamber to fill the substrate with liquid;

[0068] Control the substrate conveying device so that the wetted substrate is received by hand in the liquid supply chamber and transported to the drying chamber;

[0069] The drying chamber is controlled to perform the substrate drying process;

[0070] The substrate conveying device is controlled to receive the dried substrate, which has been dried in the drying chamber, by hand and transfer it to the transfer robot; and

[0071] The transfer robot is controlled to return the dried substrate to the carrier.

[0072] [Function and Effect] According to the above configuration, the control unit controls the substrate conveying device to receive the substrate taken out by the transfer robot by hand and move it to the liquid supply chamber; controls the liquid supply chamber to fill the substrate with liquid; controls the substrate conveying device to receive the substrate filled with liquid in the liquid supply chamber by hand and move it to the drying chamber; controls the drying chamber to perform the substrate drying process; and controls the substrate conveying device to receive the substrate dried in the drying chamber by hand and move it to the transfer robot. Thus, by configuring the device to have separate hands depending on the substrate's wetness state, the dried substrate is not moved by wet hands. According to the configuration of the present invention, substrate conveying can be performed while reliably maintaining the substrate's dryness state.

[0073] [The effects of the invention]

[0074] According to the present invention, a substrate conveying apparatus capable of reliably conveying dry and wet substrates, a substrate processing system having the same, and a substrate processing apparatus are provided. Attached Figure Description

[0075] Figure 1 This is a top view illustrating the overall configuration of the substrate processing system of Example 1.

[0076] Figure 2 This is a top view illustrating the overall configuration of the batch processing apparatus of Embodiment 1.

[0077] Figure 3 This is a cross-sectional view illustrating the structure of the carrier in Example 1.

[0078] Figure 4 This is a perspective view illustrating the transfer block of Embodiment 1.

[0079] Figure 5 This is a cross-sectional view illustrating the operation of the reverse clamping disc in Embodiment 1.

[0080] Figure 6 This is a cross-sectional view illustrating the operation of the reverse clamping disc in Embodiment 1.

[0081] Figure 7 This is a cross-sectional view illustrating the operation of the reverse clamping disc in Embodiment 1.

[0082] Figure 8 This is a cross-sectional view illustrating the operation of the reverse clamping disc in Embodiment 1.

[0083] Figure 9 This is a cross-sectional view illustrating the operation of the reverse clamping disc in Embodiment 1.

[0084] Figure 10 This is a cross-sectional view illustrating the operation of the reverse clamping disc in Embodiment 1.

[0085] Figure 11 This is a cross-sectional view illustrating the operation of the relay conveying mechanism in Embodiment 1.

[0086] Figure 12 This is a cross-sectional view illustrating the operation of the relay conveying mechanism in Embodiment 1.

[0087] Figure 13 This is a cross-sectional view illustrating the operation of the relay conveying mechanism in Embodiment 1.

[0088] Figure 14 This is a cross-sectional view illustrating the operation of the relay conveying mechanism in Embodiment 1.

[0089] Figure 15 This is a cross-sectional view illustrating the opening and closing action of the reverse clamping disc in Embodiment 1.

[0090] Figure 16 This is a cross-sectional view illustrating the opening and closing action of the reverse clamping disc in Embodiment 1.

[0091] Figure 17 This is a cross-sectional view illustrating the opening and closing action of the reverse clamping disc in Embodiment 1.

[0092] Figure 18 This is a cross-sectional view illustrating the opening and closing action of the reverse clamping disc in Embodiment 1.

[0093] Figure 19 This is a cross-sectional view illustrating the liquid supply system of the substrate in Example 1.

[0094] Figure 20 This is a cross-sectional view illustrating the condition of the substrate being placed in the delivery path in Example 1.

[0095] Figure 21 This is a cross-sectional view illustrating the condition of the substrate being placed in the transport passage of Example 1.

[0096] Figure 22 This is a cross-sectional view illustrating the condition of the substrate being placed in the transport passage of Example 1.

[0097] Figure 23 This is a cross-sectional view illustrating the condition of the substrate being placed in the delivery path in Example 1.

[0098] Figure 24 This is a cross-sectional view illustrating the condition of the substrate being placed in the transport passage of Example 1.

[0099] Figure 25 This is a top view illustrating the overall configuration of the single-chip processing device of Embodiment 1.

[0100] Figure 26 This is a side view illustrating the overall configuration of the single-chip processing device of Embodiment 1.

[0101] Figure 27 This is a top view illustrating the configuration of the central robot in Embodiment 1.

[0102] Figure 28 This is a perspective view illustrating the configuration of the central robot in Embodiment 1.

[0103] Figure 29A This is a cross-sectional view illustrating the structure of the hand in Embodiment 1.

[0104] Figure 29B This is a cross-sectional view illustrating the structure of the hand in Embodiment 1.

[0105] Figure 30 This is a top view illustrating the structure of the hand in Embodiment 1.

[0106] Figure 31This is a top view illustrating the structure of the hand in Embodiment 1.

[0107] Figure 32 This is a perspective view illustrating the structure of the flat disk in Example 1.

[0108] Figure 33 This is a perspective view illustrating the operation of the flat disk in Embodiment 1.

[0109] Figure 34 This is a perspective view illustrating the operation of the flat disk in Embodiment 1.

[0110] Figure 35 This is a perspective view illustrating the operation of the flat disk in Embodiment 1.

[0111] Figure 36 This is a perspective view illustrating the operation of the flat disk in Embodiment 1.

[0112] Figure 37 This is a perspective view illustrating the operation of the flat disk in Embodiment 1.

[0113] Figure 38 This is a flowchart illustrating the substrate processing procedure of Example 1.

[0114] Figure 39 This is a top view illustrating the substrate transport path in the substrate processing of Example 1.

[0115] Figure 40 This is a top view illustrating the substrate transport path in the substrate processing of Example 1.

[0116] Figure 41 This is a top view illustrating the substrate transport path in the substrate processing of Example 1.

[0117] Figure 42 This is a cross-sectional view illustrating the method of transporting a wetted substrate in the substrate processing of Example 1.

[0118] Figure 43 This is a top view illustrating the substrate transport path in the substrate processing of Example 1.

[0119] Figure 44 This is a cross-sectional view illustrating the method of transporting a dry substrate in the substrate processing of Example 1.

[0120] Figure 45 This is a top view illustrating the substrate processing apparatus of Example 2.

[0121] Figure 46 This is a flowchart illustrating the substrate processing procedure of Example 2.

[0122] Figure 47This is a top view illustrating the substrate transport path in the substrate processing of Example 2.

[0123] Figure 48 This is a top view illustrating the substrate transport path in the substrate processing of Example 2.

[0124] Figure 49 This is a top view illustrating the substrate transport path in the substrate processing of Example 2.

[0125] Figure 50 This is a cross-sectional view illustrating the device configuration of a variation of the present invention.

[0126] Figure 51 This is a perspective view illustrating the device configuration of a variation of the present invention.

[0127] Figure 52 This is a perspective view illustrating the device configuration of a variation of the present invention.

[0128] Figure 53 This is a cross-sectional view illustrating the device configuration of a variation of the present invention. Detailed Implementation

[0129] Hereinafter, the substrate processing system and substrate processing apparatus of the present invention will be described with reference to the accompanying drawings. The substrate processing system of Embodiment 1 is a system that continuously performs batch processing of multiple substrates W in a unified manner and single-wafer processing of substrates W one by one. It is composed of a relay device connecting the batch processing apparatus for batch processing and the single-wafer processing apparatus for single-wafer processing.

[0130] The substrate processing system of Example 1 performs various processes on substrate W, such as chemical treatment, washing, and drying. The substrate processing system employs a hybrid processing method that combines batch processing of multiple substrates W and single-wafer processing of substrates W one by one. The batch processing method is a method for processing multiple substrates W arranged vertically in a unified manner. The single-wafer processing method is a method for processing substrates W arranged horizontally one by one. The substrate processing system of the present invention continuously performs both batch processing of multiple substrates and single-wafer processing of substrates one by one. The substrate processing system of the present invention includes a batch processing device and a single-wafer processing device. The batch processing device performs batch processing of substrates in a unified manner. The single-wafer processing device performs single-wafer processing of substrates one by one.

[0131] In other words, the substrate processing system of the present invention comprises: a batch processing device 1 for uniformly processing multiple substrates W; a relay device 6 for receiving the batch-processed multiple substrates W from the batch processing device 1 and converting each substrate into a horizontal position, filling the horizontally positioned substrates W with liquid and transporting them; and a single-piece processing device 2 for receiving the liquid-filled substrates W transported to the relay device 6 and performing single-piece processing on each substrate W.

[0132] The substrate processing apparatus of Example 2 is a substrate processing apparatus for performing a prescribed process on a horizontally oriented substrate. The substrate processing apparatus of Example 2 does not need to be capable of batch processing.

[0133] Example 1

[0134] <1. Overall Composition>

[0135] like Figure 1 As shown, the substrate processing system includes a separate batch processing unit 1 and a single-wafer processing unit 2, and a relay unit 6 connecting the two units 1 and 2. The batch processing unit 1 is responsible for batch processing of multiple substrates in a unified manner, while the single-wafer processing unit 2 is responsible for single-wafer processing of substrates one by one. The relay unit 6 is configured to transfer the batch-processed substrates from the batch processing unit 1 to the single-wafer processing unit 2, and is a bridging structure located between the batch processing unit 1 and the single-wafer processing unit 2.

[0136] like Figure 1 As shown, the batch processing device 1 and the single-piece processing device 2 each have blocks divided by partitions. That is, the batch processing device 1 has a stacking block 3, a transfer block 5 adjacent to the stacking block 3, and a batch processing block 7 adjacent to the transfer block 5. Figure 2 The specific configuration of the batch processing block 7 in the batch processing device 1 is shown. On the other hand, the single-chip processing device 2 includes a transfer block 4 and a single-chip processing block 8 adjacent to the transfer block 4.

[0137] The batch processing apparatus 1 is configured to perform batch processing and has a first housing 1A for housing each block constituting the batch processing apparatus 1. The single-wafer processing apparatus 2 is configured to perform single-wafer processing on the batch-processed substrate W and has a second housing 2A for housing each block constituting the single-wafer processing apparatus 2. The first housing 1A has a first loading port 9 protruding from a wall surface constituting the first housing in a Y-direction orthogonal to the Y-direction from the batch processing block 7 toward the transfer block 5. The second housing 2A has a second loading port 10 protruding from a wall surface constituting the second housing 2A in a Y-direction orthogonal to the Y-direction, and the second loading port 10 is located at the same position as the first loading port 9 in the Y-direction. The second loading port 10 can hold a carrier C.

[0138] In this specification, for convenience, the direction in which the stacking block 3, transfer block 5, and batch processing block 7 are arranged in the batch processing device 1 is referred to as the "front-back direction X". The front-back direction X is also the direction in which the transfer block 4 and single-piece processing block 8 are arranged in the single-piece processing device 2. The front-back direction X extends horizontally. The direction in the front-back direction X from the transfer block 5 in the batch processing device 1 toward the stacking block 3 is referred to as the "front". The front is also the direction from the single-piece processing block 8 in the single-piece processing device 2 toward the transfer block 4. The direction opposite to the front is referred to as the "rear". The horizontally extending direction orthogonal to the front-back direction X is referred to as the "width direction Y". For convenience, one direction of the "width direction Y" is referred to as the "right", and the other direction is referred to as the "left". For convenience, the direction orthogonal to the front-back direction X and the width direction Y (height direction) is referred to as the "vertical direction Z". In the figures, for reference, front, rear, right, left, up, and down are appropriately indicated.

[0139] The substrate processing system of the present invention first performs a first batch processing of substrate W in batch processing apparatus 1, and the batch-processed substrate W is transferred to single-wafer processing apparatus 2 by relay device 6. Then, substrate W undergoes drying treatment in single-wafer processing apparatus 2. Afterwards, substrate W undergoes a second batch processing in batch processing apparatus 1. The batch-processed substrate W is again transferred to single-wafer processing apparatus 2 by relay device 6. Then, substrate W undergoes drying treatment in single-wafer processing apparatus 2. Afterwards, substrate W is housed in carrier C placed at the second loading port 10. Thus, the substrate processing system completes all substrate processing processes. Hereinafter, the specific configuration of each apparatus in the substrate processing system of the present invention will be described in the order of batch processing apparatus 1, relay device 6, and single-wafer processing apparatus 2.

[0140] <2. Batch processing device: stockpile>

[0141] The stack block 3 has an inlet, namely the first loading port 9, into which multiple substrates W are placed horizontally at predetermined intervals in the vertical direction. The first loading port 9 is formed by protruding from the outer wall of the stack block 3, which extends in the width direction (Y direction).

[0142] Figure 3The structure of the carrier C of the present invention is described below. The carrier C forms a plurality of slots S that hold the substrate W in a horizontally extending manner with their surfaces separated from each other. The slots S are arranged vertically at a specific spacing (e.g., 10 mm), and each slot S houses the substrate W. Twenty-five slots S are provided in one carrier C. Therefore, in the carrier C, the substrate rows are arranged vertically at a specific spacing. A mounting plate Cb is located at the position dividing each slot S and, together with pairs of mounting plates Cb, supports both ends of the substrate W. Therefore, one mounting plate Cb is arranged on each side of the carrier C and on a surface parallel to its side. For example, a closed-type FOUP (FrontOpening Unify Pod) can be used as the carrier C. In the present invention, an open-type container can also be used as the carrier C.

[0143] The internal structure of the stack block 3 is described below. The stack block 3 has a transport and storage unit ACB for storing and managing carriers C. The transport and storage unit ACB has a carrier transport mechanism 11 for transporting carriers C and a shelf 13 for placing carriers C. The stack block 3 can store one or more carriers C.

[0144] The stack block 3 has multiple racks 13 for holding the carrier C. The racks 13 are arranged in a partition that separates the stack block 3 from the transfer block 5. Among the racks 13, there is a storage rack 13b for temporarily holding the carrier C, and a carrier holding rack 13a for removing the substrate for the processing robot HTR of the transfer block 5.

[0145] The carrier placement rack 13a is configured to hold a carrier C that holds multiple horizontally oriented substrates spaced apart vertically. The carrier placement rack 13a is configured to hold the carrier C for removing substrates W. In this embodiment, one carrier placement rack 13a is provided, but multiple carrier placement racks 13a may also be provided. The carrier conveying mechanism 11 takes the carrier C containing the unprocessed substrate W from the first loading port 9 and places it on the carrier placement rack 13a for substrate removal. At this time, the carrier conveying mechanism 11 can also temporarily place the carrier C on a storage rack 13b before placing it on the carrier placement rack 13a. The stack block 3 has one or more carrier placement racks 13a.

[0146] <3. Batch processing device: transfer block>

[0147] The transfer block 5 is adjacent to the carrier placement frame 13a. The transfer block 5 is arranged adjacent to the rear of the stack block 3. The transfer block 5 includes a processing robot HTR capable of receiving the carrier C placed on the carrier placement frame 13a for substrate removal, an HVC posture conversion unit 23 for uniformly converting multiple substrates W from a horizontal posture to a vertical posture, and a pusher mechanism 25. The HVC posture conversion unit 23 uniformly converts multiple substrates W from a horizontal posture to a vertical posture. In addition, the transfer block 5 is provided with a substrate transfer position PP for transferring multiple substrates W to the substrate transfer mechanism WTR located in the uniform transfer area R2.

[0148] like Figure 4 As shown, the processing robot HTR, HVC posture conversion unit 23, and pusher mechanism 25 are arranged sequentially in the Y direction. The processing robot HTR has a hand 211 capable of holding a substrate W in a horizontal posture. The hand 211 can hold one substrate W. The processing robot HTR arranges the hand 211 in the vertical direction. By holding the substrate with each hand 211, the processing robot HTR can transport multiple substrates W at once. The moving support mechanism 213 is a mechanism constituting the processing robot HTR, and is configured to rotate the hand 211 about the vertical axis, or raise or lower the hand 211, or move the hand 211 forward or backward in the X direction, or move it laterally in the Y direction.

[0149] The processing robot HTR has 25 hands 211. The processing robot HTR uses the hands 211 to uniformly transport and store 25 substrates on the carrier C.

[0150] The HVC posture conversion unit 23 is configured to convert the substrate W, which is removed from the carrier C by the processing robot HTR, from a horizontal posture to a vertical posture. The HVC posture conversion unit 23 includes a pair of mounting rods 231 and a pair of clamping rods 232 extending in the longitudinal direction (Z direction). The support platform 237 has a support surface extending in the XY plane that supports the mounting rods 231 and clamping rods 232. The rotation drive mechanism 238 is configured to rotate the mounting rods 231 and clamping rods 232, together with the support platform 237, by 90°. Through this rotation, the mounting rods 231 and clamping rods 232 are configured to extend in the left-right direction (Y direction).

[0151] The pusher mechanism 25 includes a pusher 251 that aligns a vertically oriented substrate W in a horizontal direction. The pusher 251 is a semi-tubular shape that follows the curve of the bottom of the substrate W. In its initial state, the pusher 251 extends the U-groove 251a forming the semi-tubular shape in the left-right direction Y. The pusher 251 in this state can receive the substrate W from the HVC posture conversion unit 23.

[0152] The pusher shifting mechanism 254 enables the pusher 251 in its initial state to reciprocate in the left-right direction Y. The pusher shifting mechanism 254 can bring the pusher 251 close to the HVC posture conversion unit 23, and also bring the pusher 251 close to the substrate transfer mechanism WTR.

[0153] The pusher lifting mechanism 255 can raise the pusher 251 from its initial position to an overhead position. Additionally, the pusher lifting mechanism 255 can also return the pusher 251 from its overhead position to its initial position.

[0154] This describes the process by which the processing robot HTR transfers a horizontally oriented substrate W from the carrier C to the pusher 251. First, the processing robot HTR moves its hand 211 forward to uniformly acquire a horizontally oriented array of substrates from the carrier C. Then, the processing robot HTR rotates its hand 211 about a vertically extending axis of rotation, as follows: Figure 4 As shown, the hand 211 is oriented towards the HVC posture conversion unit 23. Additionally, in Figure 4 In the figure, the substrate W held on the hand 211 is omitted.

[0155] Then, the hand part 211 transfers the substrate array to the HVC posture conversion part 23. At this time, the substrate W is held by a pair of mounting rods 231.

[0156] After obtaining the substrate array, the HVC posture conversion unit 23 causes the rotary drive mechanism 238 to... Figure 4 As indicated by the arrow, the orientation of the substrates W constituting the substrate row is changed from a horizontal to a vertical orientation. Thus, the substrates W, which were initially horizontally aligned in the vertical direction, become vertically aligned in the left-right direction Y (horizontal direction). At this point, the substrates W are no longer supported by a pair of mounting rods 231 but by a pair of clamping rods 232.

[0157] The pusher mechanism 25 stands still before the rotational movement of the HVC posture conversion unit 23, until... Figure 4 The pusher 251 is moved downwards until the substrate column arrives. Afterwards, the pusher mechanism 25 moves the pusher 251 as shown... Figure 4 As shown by the arrow, it rises towards the substrate W supported by the clamping rod 232. The substrate W is then pushed up by the pusher 251 and moves away from the clamping rod 232, ultimately remaining only on the pusher 251. In this way, the pusher mechanism 25 retrieves the substrate W from the HVC posture conversion unit 23.

[0158] The pusher mechanism 25 can form a batch of 50 substrates arranged horizontally by repeating the acquisition of this substrate column twice. The batch consists of two quantities. Figure 3The substrate W of the carrier C described herein is configured such that the spacing between the substrates W in the batch is half (5 mm) of the spacing between the substrates W in the carrier C. Furthermore, in the substrate processing apparatus of the present invention, an action of rotating the pusher 251 180° around the vertical axis can be added between the first substrate row acquisition operation and the second substrate row acquisition operation. This batch is one type of substrate row in the present invention.

[0159] The substrate support 33 is configured to temporarily store a substrate column consisting of a dry substrate. In the event of obstruction of the substrate column during subsequent chemical treatment, the substrate transport mechanism WTR can keep the substrate column in standby in the substrate support 33 before chemical treatment.

[0160] <4. Batch Processing Device: Batch Processing Block>

[0161] Batch processing block 7 is adjacent to transfer block 5. Batch processing block 7 performs batch processing on the batches. Batch processing block 7 is divided into batch processing area R1 arranged in the width direction (Y direction) and unified transfer area R2. Each area extends in the front-back direction (X direction). Specifically, batch processing area R1 is located inside batch processing block 7. Unified transfer area R2 is adjacent to batch processing area R1 and is located at the leftmost position of batch processing block 7 (see reference). Figure 2 ).

[0162] <5. Batch Processing Block: Batch Processing Area>

[0163] The batch processing region R1 in the batch processing block 7 is a rectangular region extending in the front-back direction (X direction). One end of the batch processing region R1 (front side) is adjacent to the relay device 6. The other end of the batch processing region R1 extends away from the transfer block 5 and the relay device 6 (rear side). Therefore, the relay device 6 is a device inserted at the position where the batch processing device 1 is interrupted. When transferring a substrate column from the batch processing device 1 to the relay device 6, the second substrate transfer mechanism WTR of the batch processing device 1 is used.

[0164] The second substrate transfer mechanism WTR uniformly transfers multiple substrates W in a vertical orientation between the transfer block 5, batch processing units BPU1 to BPU6, and the transfer position IP of the relay device 6. Therefore, the area that the second substrate transfer mechanism WTR can move, i.e., the uniform transfer area R2, is not interrupted by the relay device 6, but extends in the Y direction along the left end of the relay device 6. The relay device 6 is embedded inside the batch processing unit 1, but does not reach the left end of the batch processing unit 1. This is because the uniform transfer area R2 is located at the left end of the batch processing unit 1.

[0165] The batch processing area R1 mainly comprises a batch processing unit for performing batch processing. Specifically, multiple batch processing units BPU1 to BPU6 are arranged in the batch processing area R1, uniformly impregnating multiple substrates W in the direction extending from the batch processing area R1. Batch processing units BPU1 to BPU6 uniformly impregnate multiple substrates in a vertical orientation. The configuration of batch processing units BPU1 to BPU6 will be described in detail below. The first batch processing unit BPU1 is adjacent to the relay device 6 from the rear. The second batch processing unit BPU2 is adjacent to the first batch processing unit BPU1 from the rear. The third batch processing unit BPU3 is adjacent to the second batch processing unit BPU2 from the rear. The fourth batch processing unit BPU4 is adjacent to the third batch processing unit BPU3 from the rear. The fifth batch processing unit BPU5 is adjacent to the fourth batch processing unit BPU4 from the rear. The sixth batch processing unit BPU6 is adjacent to the fifth batch processing unit BPU5 from the rear. Therefore, the first batch processing unit BPU1, the second batch processing unit BPU2, the third batch processing unit BPU3, the fourth batch processing unit BPU4, the fifth batch processing unit BPU5, and the sixth batch processing unit BPU6 are configured to leave the relay device 6 in sequence. Figure 1 For ease of diagramming, batch processing units BPU2 through BPU6 are omitted. The configuration can be found by referring to [reference needed]. Figure 2 To understand.

[0166] Batch processing units BPU1 to BPU6 are equipped with the batch processing tanks of this invention. The batch processing tank is a liquid tank that holds a pharmaceutical solution or pure water. The pharmaceutical solution can be an acidic aqueous solution, such as a phosphoric acid aqueous solution. In this specification, the mixture of pharmaceutical solution and pure water is referred to as a processing solution. The batch processing tank holding the pharmaceutical solution is referred to as batch pharmaceutical solution processing tanks CHB2 to CHB6, and the batch processing tank holding pure water is referred to as batch cleaning processing tank ONB.

[0167] Specifically, the second batch processing unit BPU2 includes a batch chemical treatment tank CHB2 for uniformly processing the substrate array, and a lifting unit LF2 for raising and lowering the substrate array between the substrate junction position and the chemical treatment position (see reference). Figure 2 The substrate transfer position is a position set above the batch chemical treatment tank CHB2 that the second substrate transport mechanism WTR can pick up. The chemical treatment position is a position set inside the batch chemical treatment tank CHB2 where the substrate array can be immersed in the chemical solution. The batch chemical treatment tank CHB2 performs acid treatment on the substrate array. The acid treatment can be phosphoric acid treatment, but other acids can also be used. The phosphoric acid treatment etches the multiple substrates W constituting the substrate array. The etching treatment, for example, is chemical etching of the nitride film on the surface of the substrate W.

[0168] The batch processing tank CHB2 contains acidic solutions such as phosphoric acid solution. A lifting unit LF2 is attached to the batch processing tank CHB2 to move a substrate array vertically. The lifting unit LF2 moves vertically (Z-direction). Specifically, the lifting unit LF2 moves between a processing position corresponding to the interior of the batch processing tank CHB2 and a junction position corresponding to the top of the batch processing tank CHB2. The lifting unit LF2 maintains a substrate array composed of substrates W in a vertical orientation. At the junction position, the lifting unit LF2 transfers the substrate array between itself and the second substrate transport mechanism WTR. When the lifting unit LF2 descends from the junction position to the processing position while maintaining the substrate array, the entire surface of the substrates W is below the liquid surface of the solution. When the lifting unit LF2 rises from the processing position to the junction position while maintaining the substrate array, the entire surface of the substrates W is above the liquid surface of the solution. The lifting unit LF2 allows multiple substrates W in a vertical orientation, after being repositioned by the HVC orientation conversion unit 23, to be uniformly immersed in the batch processing tank. At this point, the lifting unit LF2 descends from the handover position to the processing position.

[0169] Specifically, the third batch processing unit BPU3 includes a batch chemical treatment tank CHB3 and a lifting unit LF3 that moves the substrate array between the substrate junction position and the chemical treatment position. The batch chemical treatment tank CHB3 has the same configuration as the batch chemical treatment tank CHB2. That is, the chemical solution is contained in the batch chemical treatment tank CHB3, and the lifting unit LF3 is attached thereto. The batch chemical treatment tank CHB3 performs the same treatment on the substrate array as the batch chemical treatment tank CHB2. The batch processing apparatus 1 in this example has multiple treatment tanks capable of performing the same chemical treatment. This is because phosphoric acid treatment requires more time than other treatments. Phosphoric acid treatment requires a long time (e.g., 60 minutes). Therefore, the apparatus in this example can perform acid treatment in parallel by multiple batch chemical treatment tanks.

[0170] Batch processing units BPU4 through BPU6 have the same configuration as batch processing units BPU2 and BPU3. Specifically, batch processing unit BPU4 includes a batch chemical treatment tank CHB4 and a lifting section LF4 that moves the substrate array between the substrate junction position and the chemical treatment position. Similarly, batch processing unit BPU5 includes a batch chemical treatment tank CHB5 and a lifting section LF5 that moves the substrate array between the substrate junction position and the chemical treatment position. Furthermore, batch processing unit BPU6 includes a batch chemical treatment tank CHB6 and a lifting section LF6 that moves the substrate array between the substrate junction position and the chemical treatment position. Therefore, the substrate array is acid-treated by any one of the batch chemical treatment tanks CHB2 through CHB6. If chemical treatment is performed in parallel by these five processing units, the equipment's throughput will be increased.

[0171] Specifically, the first batch processing unit BPU1 includes a batch cleaning tank ONB that contains cleaning fluid, and a lifting unit LF1 that moves the substrate array between a substrate transfer position and a cleaning position. The substrate transfer position is a position set above the batch cleaning tank ONB that can be picked up by the second substrate transport mechanism WTR. The cleaning position is a position set inside the batch cleaning tank ONB where the substrate array can be immersed in the cleaning fluid. The batch cleaning tank ONB has the same configuration as the batch chemical solution processing tank CHB2. That is, the batch cleaning tank ONB contains cleaning fluid and is equipped with the lifting unit LF1. Unlike other processing tanks, the batch cleaning tank ONB contains pure water, which is for the purpose of washing away the chemical solution adhering to multiple substrates W. In the batch cleaning tank ONB, the washing process ends when the resistivity of the pure water in the tank rises to a predetermined value.

[0172] Thus, in this embodiment, the batch cleaning tank ONB is located closer to the relay device 6 than the batch chemical treatment tanks CHB2 to CHB6. This configuration separates the components of the relay device 6 as much as possible from the batch chemical treatment tanks CHB2 to CHB6, preventing adverse effects on the relay device 6 from acids such as phosphoric acid. Furthermore, by arranging the relay device 6 close to the batch cleaning tank ONB, the substrates after cleaning are transported only a short distance before being immediately transferred to the relay device 6. Therefore, according to this embodiment, the transfer of the substrate W can be completed quickly while maintaining its wetted state.

[0173] <6. Batch Processing Block: Unified Transfer Area>

[0174] The unified transport area R2 in the batch processing block 7 is a rectangular area extending in the front-to-back direction (X direction). The unified transport area R2 is set along the outer edge of the batch processing area R1, with one end extending to the transfer block 5 and the other end extending away from the transfer block 5. Therefore, the unified transport area R2 also follows the configuration of the relay device 6 located between the transfer block 5 and the batch processing block 7.

[0175] In the unified transport area R2, a second substrate transport mechanism WTR is provided for the unified transport of multiple substrates W. The second substrate transport mechanism WTR uniformly transports substrate rows between the substrate transfer position PP defined in the transfer block 5, the substrate row support 33, each batch processing unit BPU1 to BPU6, and the transport entry position IP in the relay device 6 (described later). The second substrate transport mechanism WTR is configured to reciprocate in the front-back direction (X direction) across the transfer block 5, the relay device 6, and the batch processing block 7. In addition to the unified transport area R2 in the batch processing block 7, the second substrate transport mechanism WTR can also move to the substrate transfer position PP in the transfer block 5, the substrate row support 33, and the transport entry position IP in the relay device 6.

[0176] The second substrate transport mechanism WTR includes a pair of clamps 29 for transporting substrate rows. The pair of clamps 29 can be changed to a closed state where they are close to each other and an open state where they are far apart. The clamps 29 are components extending in the Y direction with grooves for holding substrates W arranged at full spacing (the same spacing as the substrate row). When the pair of clamps 29 are in the closed state, they receive multiple substrates W constituting the substrate row. When the pair of clamps 29 are in the open state, they transfer the multiple substrates W constituting the substrate row to other components (such as lifting units FL1). The second substrate transport mechanism WTR transfers substrate rows between the substrate transfer position PP in the transfer block 5 and the substrate row support 33, and between the impregnation tank 73 provided at the transfer position IP in the relay device 6. In addition to the above, the second substrate transport mechanism WTR also transfers substrate rows between the lifting units LF1 to LF6 belonging to the batch processing units BPU1 to BPU6 in the batch processing block 7.

[0177] In the unified transport area R2, a guide rail 31X extending in the X direction is provided to guide the second substrate transport mechanism WTR. The second substrate transport mechanism WTR can move forward and backward in the X direction along the guide rail 31X. Therefore, the guide rail 31X extends from the batch processing block 7 to the transfer block 5 via the relay device 6. More specifically, the guide rail 31X faces the substrate transfer position PP in the transfer block 5 from the Y direction, and faces the sixth batch processing unit BPU6 in the batch processing block 7 from the Y direction. In addition, the guide rail 31X also faces the substrate row support 33 in the transfer block 5, the impregnation tank 73 in the relay device 6, and the first batch processing units BPU1 to the sixth batch processing units BPU6 in the batch processing block 7 from the Y direction.

[0178] <7. Relay Device>

[0179] The relay device 6 is a structure that bridges the batch processing device 1 and the single-wafer processing device 2. Its left end is embedded inside the batch processing device 1, and its right end is embedded inside the single-wafer processing device 2. The relay device 6 has a transport path extending in the Y direction connecting the unified transport area R2 of the batch processing device 1 to the single-wafer processing area R3 of the single-wafer processing device 2. This transport path transports the substrate W in the Y direction (horizontally) without changing its Z-direction position. Therefore, the insertion position of the relay device 6 in the batch processing device 1 and the insertion position of the relay device 6 in the single-wafer processing device 2 are the same in the Z-direction.

[0180] The relay device 6 is configured to transfer the batch-processed substrates W from the batch processing unit 1 to the single-wafer processing unit 2. The relay device 6 is located in the middle layer between the batch processing unit 1 and the single-wafer processing unit 2 (see reference). Figure 26 Therefore, the relay device 6 bridges the batch processing device 1 and the single-chip processing device 2 in an air-filled position away from the bottom surface where the batch processing device 1 and the single-chip processing device 2 are located. The specific location of the relay device 6 is related to the structure of the single-chip processing device 2, and will be explained in detail in conjunction with the description of the single-chip processing device 2.

[0181] The relay device 6 includes: a reversing chuck 71 that receives multiple substrates W arranged in the Y direction, causing the received substrates W to rotate uniformly by 90° in water, thereby changing the orientation of the multiple substrates W from a vertical orientation to a horizontal orientation; a relay conveying mechanism OTR that conveys the horizontally oriented substrates W one by one to the delivery position OP; and a passageway that maintains the horizontal orientation of the substrates W. The reversing chuck 71, the relay conveying mechanism OTR, and the passageway are arranged sequentially from the left side of the batch processing device 1 to the right. In the impregnation tank 73, a delivery position IP is set for the substrates to be moved into the batch processing device 1. Therefore, in the relay device 6, the delivery position IP and the delivery position OP, which is provided with the passageway, are arranged in a left-right direction orthogonal to the front-back direction. Each part will be described in detail below.

[0182] <8. Relay device: Underwater conversion unit>

[0183] The reverse chuck 71 converts the substrate column received from the batch processing unit 1 from a vertical position to a horizontal position. The loading position IP includes: an immersion tank 73 filled with pure water; a reverse chuck 71 positioned above the immersion tank 73; and a pair of chuck support mechanisms 72, each holding a reverse chuck 71 and allowing it to be raised, lowered, and rotated. The reverse chuck 71 can be raised and lowered from its substrate contact position with the substrate transfer mechanism WTR, set on the liquid surface of the immersion tank 73, into the liquid of the immersion tank 73. The reverse chuck 71 allows the substrate column received from the substrate transfer mechanism WTR to be immersed in the immersion tank 73 and rotated 90° in one or the opposite direction in this state. The orientation of the multiple substrates W, which were in a vertical position, is converted to a horizontal position by rotating the pair of reverse chucks 71.

[0184] The reversing chuck 71 can change state between a closed state that holds multiple substrates W and an open state that releases the held multiple substrates W, through the operation of a pair of chuck support mechanisms 72. Furthermore, the reversing chuck 71 can rotate 90° in one direction and 90° in the opposite direction while maintaining its relative position, through the operation of the pair of chuck support mechanisms 72. Moreover, the reversing chuck 71 can be raised and lowered from above the impregnation tank 73 into the liquid in the impregnation tank 73 while maintaining its relative position, through the operation of the pair of chuck support mechanisms 72.

[0185] The reversing chucks 71 are comb-shaped with multiple V-grooves spaced out at full intervals. A pair of reversing chucks 71 hold multiple substrates W from both sides by embedding them into the V-grooves. When the reversing chucks 71 are in the closed state, the ends of each substrate abut against the deepest part of the V-groove, and even if the reversing chucks 71 are rotated in this state, the substrates W will not slip off. When the reversing chucks 71 are in the open state, the substrates W can be received from the substrate transport mechanism WTR, which holds multiple substrates W above the impregnation tank 73 and is in standby mode. Alternatively, the reversing chucks 71 can also be configured in a state between the closed and open states (a half-open state), which will be described later.

[0186] <9. Relay Device: Relay Conveying Mechanism>

[0187] The relay conveyor mechanism (OTR) is located between the infeed position (IP) and the outfeed position (OP), and it can transport substrates W, which have been repositioned by the reversing chuck 71, one by one to the single-wafer processing device 2. For example... Figure 1As shown, the relay conveyor OTR is guided by a relay track 32Y extending in the Y direction and can move along the Y direction from the impregnation tank 73 (inlet position IP) to the outlet position OP (described later). The relay conveyor OTR has a hand 103b that can support a horizontally oriented substrate W. The substrate W supported by the hand 103b is in a liquid-covered state (liquid-filled state) of pure water. The relay conveyor OTR can receive horizontally oriented substrates W one by one from the reversing chuck 71 by positioning the hand 103b toward the impregnation tank 73 side. In addition, the relay conveyor OTR can transport the substrate to the outlet position OP.

[0188] Specifically, the hand part 103b has the same configuration as the hand part 82 described later for wetting the substrate. (One side mainly refers to...) Figure 31 The specific structure of the hand part 82 for wetting the substrate is explained.

[0189] <10. Operation of the relay device>

[0190] Next, the relay device 6 will describe the situation in which it transports the substrate column obtained at the loading position IP to the unloading position OP. Figure 5 This illustrates the state when the substrate transport mechanism WTR transports multiple substrates W to the top of the impregnation tank 73. At this time, a pair of reverse chucks 71 are located above the substrate transport mechanism WTR, with a rotation angle of 0° as in the initial state. In the initial state, the reverse chucks 71 extend horizontally and can receive multiple substrates W in a vertical position.

[0191] Figure 6 This indicates the state after which the reversing chuck 71 descends to the substrate transport mechanism WTR. The movement of the reversing chuck 71 is achieved by the chuck support mechanism 72. Figure 6 This illustrates the transfer of the substrate column from the chuck 29 of the substrate transport mechanism WTR to the reversing chuck 71. Specifically, the pair of reversing chucks 71 remain open and descend to the substrate transport mechanism WTR, then close. Because the pair of open reversing chucks 71 are positioned a distance away from the substrate W, they can approach chuck 29 without contacting the substrate W. Then, the reversing chucks 71 close via the action of the chuck support mechanism 72, securing the substrate column. At this point, the substrate column is secured in both chuck 29 and the reversing chuck 71. Afterward, chuck 29 opens and retracts in the Y direction (leftward). This completes the transfer of the substrate W from chuck 29 to the reversing chuck 71. Figure 7 This indicates the state of the substrate column being transferred to the reversing chuck 71. For example... Figure 7 As indicated by the arrow, the reverse clamp 71 descends below the liquid surface of the immersion tank 73, immersing the substrate row in the pure water held in the immersion tank 73.

[0192] Figure 8This illustrates the state where the reverse chuck 71 gradually rotates 90° while the substrate array is immersed in pure water. The operation of the reverse chuck 71 is achieved by the chuck support mechanism 72. Figure 9 This shows the state after the reverse chuck 71 has completed a 90° rotation. In this way, the device face of the substrate row immersed in the impregnation tank 73 and facing the Y direction (left direction) is rotated 90° to face upwards. If the substrate W is tilted in this way, its orientation can be set to horizontal with the device face upwards. Then, the horizontally oriented substrate W is transported with its device face upwards.

[0193] Figure 10 This illustrates the state when the reversing chuck 71 moves one substrate from the substrate row to the liquid surface of the impregnation tank 73. The operation of the reversing chuck 71 is achieved by the chuck support mechanism 72. According to... Figure 10 Only one substrate W is positioned above the liquid surface, while the remaining 24 substrates W are submerged in the immersion tank 73. This configuration prevents the 24 substrates W from drying out during the standby period of transport. The substrate W above the liquid surface is transported to the exit position OP by the relay transport mechanism OTR while maintaining a horizontal orientation. Subsequently, the chuck support mechanism 72 raises a pair of reversing chucks 71 by the full spacing height each time a substrate W is transported by the relay transport mechanism OTR. If this operation is repeated, the entire substrate column is transported to the exit position OP by the relay transport mechanism OTR.

[0194] right Figures 5-10 The opening and closing actions of the reverse clamp 71 in various states will be explained. As described above, Figure 5 In this state, the pair of reversing clamps 71 are in an open state, not a state capable of holding the substrate W. Because the substrate W can pass through the open reversing clamps 71, the reversing clamps 71 can move without colliding with the substrate W. Figure 6 The location shown. In Figure 6 In this process, a pair of reversing chucks 71 switch from the open state to the closed state. At this time, the V-grooves of the pair of reversing chucks 71 allow the ends of the substrate rows to enter and abut. Figure 15 The text details the situation where the substrate W falls into each V trench. Figures 7-9 The pair of reversing chucks 71 are in the closed state and are holding the substrate W in place. In this state, even if the reversing chucks 71 are rotated, the held substrate W will not fall off.

[0195] In order to achieve Figure 10 The state requires careful consideration to allow the relay conveyor OTR to transport the substrate W and to prevent the substrate W waiting in the impregnation tank 73 from falling off. Therefore, according to this embodiment, in Figure 10In this state, the pair of reversing clamps 71 are set to a half-open state. This achieves a supported state where the substrate W can be removed. Regarding the half-open state, in... Figure 17 , Figure 18 Detailed explanation follows.

[0196] Next, it was explained that the relay transfer mechanism OTR... Figure 10 The reverse clamp 71 in the middle is used to transport the substrate W in a horizontal orientation. Figure 11 This illustrates the state of the relay conveyor OTR when it moves to the vicinity of the impregnation tank 73 to transport the substrate W. For example... Figure 11 As shown, the hand 103b of the relay conveying mechanism OTR includes a sliding mechanism 102 for moving the hand 103b forward and backward, and a support mechanism 101 for supporting the sliding mechanism 102. The sliding mechanism 102 supports the base of the hand 103b, enabling the hand 103b to move forward and backward as shown. Figure 12 Moving forward as shown will also allow the hand to move 103b. Figure 14 It moves backward as shown. The support mechanism 101 enables the sliding mechanism 102 and the hand 103b to reciprocate in the Y direction. In addition, the support mechanism 101 rotates the hand 103b 180°, thereby allowing the hand 103b to face either the immersion tank 73 side or the removal position OP side.

[0197] Figure 12 This illustrates the state between the hand 103b, inserted into the substrate W above the liquid surface via the sliding mechanism 102, and the substrate W below the liquid surface. The hand 103b becomes... Figure 12 The state is thus prepared to obtain a substrate W in a horizontal orientation. At this time, the sliding mechanism 102 moves from the initial position to the forward position.

[0198] Figure 13 This illustrates a pair of reversing chucks 71 descending while maintaining their relative positions, causing the substrate W on the liquid surface to come into contact with the upper surface of the hand 103b. Thus, by lowering the reversing chucks 71 to allow the hand 103b to acquire the substrate W, the configuration requiring vertical movement of the hand 103b can be eliminated, thus eliminating the need for an OTR (overhead transfer) mechanism. This provides a substrate handling system with a simple configuration and fewer malfunctions.

[0199] Figure 14 This indicates the state when the hand 103b, having acquired the substrate W, retracts via the sliding mechanism 102 to the support mechanism 101 of the relay transport mechanism OTR. Since the pair of reversing chucks 71 are in a half-open state, the hand 103b is allowed to pull out the substrate W, which is then supported and held in the liquid. At this point, the sliding mechanism 102 moves from the forward position to the initial position.

[0200] The half-open state of a pair of reversing clamps 71 is explained. Figure 15This is to explain how Figure 9 The diagram shows a cross-sectional view of the substrate array after it has been rotated 90°. At this point, the pair of reversing clamps 71 are in the closed state, and both ends of the substrate W reach the deepest part of the V-groove. If the substrate W is fixed in place by holding down both ends of the substrate W with the pair of reversing clamps 71, then the substrate array will not slip off the pair of reversing clamps 71.

[0201] Figure 16 It corresponds to the above Figure 12 A cross-sectional view. The pair of inverted clamps 71 are in the closed state, and the hand 103b is inserted between the substrates W. Additionally, in Figure 16 and afterwards Figure 17 , Figure 18 The liquid level in the immersion tank 73 is omitted in the text.

[0202] Figure 17 This illustrates the state when the pair of reverse clamps 71, initially in the closed state, are slightly separated, resulting in a half-open state. When the pair of reverse clamps 71 are half-open, the two ends of the substrate W move from the deepest part of the V-groove and abut against the wall forming the V-groove. This state is such that the substrate W will not slip off the reverse clamps 71 without rotation, and the substrate W itself is not fixed to the reverse clamps 71. Therefore, when the pair of reverse clamps 71 are in the half-open state, the substrate W can be held in place in the liquid, and one substrate W can be transferred to the hand 103b on the liquid surface. However, in Figure 17 In this state, since the hand part 103b has not yet come into contact with the substrate W, in order to transfer the substrate W to the hand part 103b, the substrate W needs to be lowered relative to the hand part 103b.

[0203] Figure 18 It corresponds to the above Figure 13 A sectional view. Figure 18 In the middle, a pair of reversing clamps 71 from Figure 17 The state of the substrate decreases slightly, causing the substrate W to come into contact with the hand portion 103b. Figure 18 In this state, the substrate W is placed on the hand portion 103b, located away from the wall of the V-groove of the reversing chuck 71. That is to say, Figure 18 In this state, the substrate W is not in contact with the reversing chuck 71. Therefore, if the sliding mechanism 102 is activated in this state to move the hand 103b, the substrate W will not come into contact with the reversing chuck 71 and will not be pulled out.

[0204] Figure 1 The liquid supply nozzle 41 described herein supplies pure water to the substrate W pulled out by the hand part 103b, thus making the substrate W liquid-covered. In this example, the relay device 6 is configured to move the liquid-covered substrate W to the move-out position OP via the hand part 103b.

[0205] Figure 19 This shows the state of the substrate W in a horizontal position obtained from a pair of reversing chucks 71. The substrate processing system of this embodiment has a configuration that stores water in the substrate W midway through the substrate transport path of the relay device 6. A spray head 69 supplies a mist of pure water to the substrate W. Regarding the spray head 69, in... Figure 1 It has already been described in the text, so it can also be used as a reference. Figure 1 To understand this, the tray 105 is a square, disc-shaped component inserted into the gap between the hand part 103b and the support mechanism 101, holding pure water supplied from the spray head 69 and dripping from the substrate W. Since the tray 105 obstructs the movement of the sliding mechanism 102, the sliding mechanism 102... Figure 12 , Figure 13 When that action is performed, the tray 105 moves in the X direction to avoid the sliding mechanism 102. The tray moving mechanism 108 is a component that enables the action of the tray 105.

[0206] Figure 20 This illustrates the state when the relay conveyor OTR transports the substrate W in the Y direction and moves it to the vicinity of the delivery position OP. At this time, the hand 103b is facing the impregnation tank 73 and the reversing chuck 71 while supporting the substrate W.

[0207] Figure 21 This shows the state when the support mechanism 101 of the subsequent relay conveying mechanism OTR rotates 180° around the rotating axis 104 extending in the Z direction. With the movement of this support mechanism 101, the hand 103b facing the impregnation tank 73 moves towards the take-out position OP.

[0208] Figure 22 This shows the state when the sliding mechanism 102 slides, causing the hand 103b supporting the substrate W to move to the take-out position OP. At this time, the substrate W is located at the take-out position OP defined within the substrate processing system. Additionally, the sliding mechanism 102 moves from the initial position to the forward position.

[0209] Both the relay transport mechanism OTR and the central robot CR (described later) can receive the substrate W at the transfer position OP. The relay transport mechanism OTR transfers the substrate W to the central robot CR of the monolithic processing device 2 via the transfer position OP. The transfer position OP has a passage with multiple (e.g., three) support pins 111 extending in the Z direction. The support pins 111 are retractable in the Z direction. Each support pin 111 retracts and extends synchronously with its ends at the same height. The base plate 110 is configured to support the base ends of the support pins 111. Figure 22 In the middle, the end of the support pin 111 is located at the lower part of the pull-out position OP.

[0210] Figure 23This illustrates the situation when the support pin 111 extends, moving the substrate W, supported by the hand 103b, above the removal position OP. In this way, the substrate W is transferred from the hand 103b to the support pin 111.

[0211] Figure 24 This shows the state after the sliding mechanism 102 returns from the forward position to the initial position, and the hand 103b retracts from the take-out position OP. The substrate W is supported by the support pin 111 in the take-out position OP. Thus, the substrate W is ready to be received by the central robot CR of the monolithic processing device 2.

[0212] <11. Single-chip processing device: Transport block>

[0213] Next, refer to Figure 25 The configuration of the single-chip processing device 2 in this example will be described. The transfer block 4 has an entrance, namely the second loading port 10, into which multiple substrates W are placed with carriers C spaced apart in the vertical direction in a horizontal orientation. The second loading port 10 protrudes from the outer wall of the transfer block 4, which extends in the width direction (Y direction).

[0214] The internal structure of the transfer block 4 will be described. The transfer block 4 includes a transfer robot IR, which transfers horizontally oriented substrates W one by one between the carrier C and the single-wafer processing block 8 (described later) via a passage 24 located on the side of the transfer block 4. The passage 24 is configured to hold the horizontally oriented substrates W. The transfer robot IR can pick up and drop substrates between the passage 24 and the carrier C located at the second loading port 10.

[0215] The transfer robot IR houses the monolithically processed substrate W in an empty carrier C placed in the second loading port 10. The transfer robot IR has a hand consisting of a pair of holding bodies that hold the substrate W in a horizontal position at its end, and an arm supporting the hand. The arm has multiple joints, with its end connected to the hand and its base connected to a base provided on the arm in the transfer block 4. In this embodiment, the transfer robot IR receives the monolithically processed substrate W from the passage 24 and houses it in the carrier C outside the transfer block 4.

[0216] The transfer robot IR is configured to return the dried substrate W to the carrier C in the second loading port 10.

[0217] <12. Single-chip processing device: Single-chip processing block>

[0218] The monolithic processing block 8 is adjacent to the transfer block 4. At the center of the monolithic processing block 8 in the Y direction, there is a passageway 24 accessible by a transfer robot IR, and a central robot CR capable of placing monolithically processed substrates W onto the passageway 24. The central robot CR is configured to access the substrates at the transfer position OP of the relay device 6, the monolithic processing chamber 48, and the passageway 24. The central robot CR receives batch-processed horizontally oriented substrates W one by one from the transfer position OP of the relay device 6 and transfers them to the monolithic processing chamber 48. The central robot CR is a substrate transfer robot that transfers horizontally oriented substrates W one by one and can reciprocate in the Z direction. Therefore, as described later, the central robot CR can also access either the monolithic processing chamber 48 constituting the laminate or the transfer position OP.

[0219] The single-wafer processing chamber 48 is a drying chamber primarily used for drying the substrate. In this embodiment, the single-wafer processing chamber 48 is a drying chamber utilizing a supercritical fluid. For example, carbon dioxide can be used as the supercritical fluid. Furthermore, the invention is not limited to this configuration; the single-wafer processing chamber 48 may also be configured to dry the substrate W by rotational drying. The drying chamber dries the substrate W one wafer at a time.

[0220] Furthermore, as one type of single-wafer processing chamber 48, the apparatus in this example includes a liquid supply chamber for placing liquid on the upper surface of the substrate W to establish a liquid-coated state. In this case, the liquid placed on the substrate W can be, for example, IPA (Isopropyl Alcohol). The liquid supply chamber receives the substrate W, which has been liquid-coated by passing pure water, and removes the substrate W, which has been liquid-coated by passing IPA. The removed liquid-coated substrate W is then dried by a drying chamber.

[0221] Figure 26 This is a side view of the single-chip processing unit 2 as seen from the batch processing unit 1. As shown in the figure, single-chip processing chambers 47, 48, and 49 are stacked in the Z direction to form a laminate. That is, the single-chip processing block 8 has a lower section, a middle section, and an upper section. The single-chip processing chamber 47 is located in the lower section. The single-chip processing chamber 48 is located in the middle section. The single-chip processing chamber 49 is located in the upper section.

[0222] The moveout position OP is located in the middle section of the single-chip processing block 8. Below the moveout position OP, the lower section single-chip processing chamber 47 is provided. Above the moveout position OP, the upper section single-chip processing chamber 49 is provided. Therefore, the moveout position OP is configured to replace the middle section single-chip processing chamber 48 in a laminate formed by arranging single-chip processing chambers 47, 48, and 49 in the Z direction.

[0223] Figure 25 The middle section of the single-chip processing block 8 is described. Three single-chip processing chambers 48 are provided in the middle section. Therefore, the single-chip processing block 8 includes a first stacked body belonging to the first single-chip processing chamber 48, a second stacked body belonging to the second single-chip processing chamber 48, and a third stacked body belonging to the third single-chip processing chamber 48. Additionally, single-chip processing chambers 49 and 47 are provided above and below the take-out position OP. Therefore, a total of 11 single-chip processing chambers are provided in the single-chip processing block 8.

[0224] like Figure 26 As shown, the shielding plate 16 is part of the wall of the monolithic processing device 2. The shielding plate 16 is located in the middle region of the monolithic processing block 8, closing the opening between the take-out position OP and the transfer block 4. If the shielding plate 16 is positioned adjacent to the transfer block 4, the relay device 6 can be positioned close to the central robot CR. In this case, the central robot CR does not need to move significantly in the front-back direction when obtaining the substrate W at the take-out position OP.

[0225] Furthermore, the central robot CR's hand can move in the Z-direction while maintaining the posture of the substrate W. With this configuration, the central robot CR can move the substrate W from the removal position OP to the monolithic processing chamber 49 in the upper region and the monolithic processing chamber 47 in the lower region. By setting the removal position OP in the middle region of the monolithic processing block 8, the removal position OP can be positioned near the upper region. Similarly, the removal position OP is positioned near the lower region. Therefore, the Z-direction movement distance of the substrate W at the removal position OP is shorter, both relative to the upper and lower regions.

[0226] <13. Single-chip processing device: Central robot>

[0227] Figure 27 The specific configuration of the central robot CR is described below. In this example, the central robot CR has two hands and independent drive mechanisms for each hand. The two hands are arranged vertically; the upper hand is used to transport a dry substrate, and the lower hand is used to transport a wetted substrate in a liquid-coated state. Because... Figure 27 This is a top-down view of the central robot CR, so you can only see the upper hand. (For reference...) Figure 28 A 3D diagram can help explain the situation where the robot CR in the center has two hands.

[0228] The hand that transports the drying substrate is referred to as the drying substrate hand 81. The drying substrate hand 81 can hold the drying substrate in a horizontal position. The drying substrate hand 81 is designed as a flat shape extending in the horizontal plane, and has a first branch blade 81b (reference) consisting of a base and two flat rods 831, 832 extending from the base. Figure 27 , Figure 30 The first branch blade 81b corresponds to the first blade of the present invention. A pair of end guides 811 are provided at the end of the first branch blade 81b, and a pair of base end guides 812 are provided at the base of the first branch blade 81b. The end guides 811 and the base end guides 812 are provided on the upper surface of the first branch blade 81b. Each of the flat rods 831 and 832 of the first branch blade 81b is configured to have one end guide 811 and one base end guide 812.

[0229] A pair of end guides 811 are provided at the end of the first branch blade 81b, and are configured to contact the end of the substrate. In addition, a pair of base guides 812 are provided at the base end of the first branch blade 81b, and are configured to contact the end of the substrate.

[0230] At the base of the first branch blade 81b, a hand pusher 83 capable of abutting against the side of the substrate W is provided (see reference). Figure 27 , Figure 30 The hand pusher 83 corresponds to the pusher of the present invention. The hand pusher 83 has a driving part at its base and moves forward and backward in the extending direction (extending direction B) of the first branch blade 81b. When the hand pusher 83 is in an extended state with the substrate W placed on the hand part 81 while the drying substrate is in a dry substrate state, the substrate W is fixed on the hand part 81. When the hand pusher 83 is in a retracted state from the above state, the fixed state of the drying substrate on the hand part 81 is released. The hand pusher 83 is located at the base end of the first branch blade 81b and is positioned between a pair of base end guides 812. By pressing the end of the substrate W, it can cooperate with the end guides 811 to fix the substrate W.

[0231] The hand that supports the substrate W in its liquid-covered state is called the substrate wetting hand 82. The substrate wetting hand 82 supports the liquid-filled substrate and is positioned below the substrate drying hand 81. Like the substrate drying hand 81, the substrate wetting hand 82 is a flat shape extending horizontally, and has a second branch blade 82b (see reference) consisting of a base and two flat rods 841 and 842 extending from the base. Figure 31A pair of end protrusions 821 are provided at the end of the second branch blade 82b, and a pair of base protrusions 822 are provided at the base of the first branch blade 81b. The end protrusions 821 and base protrusions 822 are provided on the upper surface of the second branch blade 82b. Each of the flat rods 841 and 842 of the second branch blade 82b is configured to have one end protrusion 821 and one base protrusion 822.

[0232] The substrate W, in its liquid-covered state, can be supported by the hand part 82 with four protrusions located on the upper surface of the second branch blade 82b. An end protrusion 821 is provided at the end of the second branch blade 82b and abuts against a predetermined portion of the lower surface of the liquid-filled substrate W, excluding the substrate end. A base end protrusion 822 is provided at the base end of the second branch blade 82b and abuts against the predetermined portion of the lower surface of the liquid-filled substrate W. The predetermined portion will be described later.

[0233] The drive mechanism that drives the drying substrate horizontally using the hand part 81 will be described. For example... Figure 27 As shown, the drying substrate is connected by hand 81 to a first end arm 91 extending in the extension direction B. The first end arm 91 is connected to a first base arm 94 via a first relay arm 92. The first relay arm 92 intersects the extension direction B and extends in a direction parallel to the horizontal plane. The first base arm 94 also intersects the extension direction B and extends in a direction parallel to the horizontal plane.

[0234] The first distal arm 91 is freely rotatable relative to the first relay arm 92. That is, the first distal arm 91 and the first relay arm 92 form a joint with a vertical axis of rotation. Similarly, the first relay arm 92 is freely rotatable relative to the first base arm 94. That is, the first relay arm 92 and the first base arm 94 form a joint with a vertical axis of rotation.

[0235] The first endarm 94 is connected to the robot base 301. The first endarm 94 can rotate freely relative to the robot base 301. That is, the first endarm 94 and the robot base 301 form a joint with the vertical axis as the axis of rotation.

[0236] The first end arm 91, the first relay arm 92, and the first base arm 94 rotate synchronously via interlocking joints, thereby enabling the drying substrate hand part 81 to move forward and backward relative to the robot base 301 in the extension direction B. In other words, the first end arm 91, the first relay arm 92, and the first base arm 94 constitute the first moving mechanism of the present invention, which movably supports the drying substrate with the hand part 81.

[0237] The drive mechanism that drives the wetted substrate by hand 82 in the horizontal direction will be described. For example... Figure 28As shown, the wetted substrate is connected by hand 82 to the second end arm 96 extending in the extension direction B. The second end arm 96 is connected via the second relay arm 97 (reference). Figure 27 ) Connected to the second base arm 98 (reference) Figure 27 , Figure 28 The second relay arm 97 extends in a direction parallel to the horizontal plane. The second base arm 98 also extends in a direction parallel to the horizontal plane.

[0238] The second end arm 96 is freely rotatable relative to the second relay arm 97. That is, the second end arm 96 and the second relay arm 97 form a joint with the vertical axis as the axis of rotation. Similarly, the second relay arm 97 is freely rotatable relative to the second base arm 98. That is, the second relay arm 97 and the second base arm 98 form a joint with the vertical axis as the axis of rotation.

[0239] Like the first endarm 94, the second endarm 98 is connected to the robot base 301. The second endarm 98 can rotate freely relative to the robot base 301. That is, the second endarm 98 and the robot base 301 form a joint with the vertical axis as the axis of rotation.

[0240] The second end arm 96, the second relay arm 97, and the second base arm 98 rotate synchronously via interlocking joints, thereby enabling the wetted substrate hand 82 to move forward and backward relative to the robot base 301 in the extension direction B. In other words, the second end arm 96, the second relay arm 97, and the second base arm 98 constitute the second movement mechanism of the present invention, which movably supports the wetted substrate hand 82.

[0241] The robot base 301 corresponds to the base component of the present invention. The robot base 301 supports the first moving mechanism of the present invention, which is composed of the first end arm 91, the first relay arm 92 and the first base arm 94, and supports the second moving mechanism of the present invention, which is composed of the second end arm 96, the second relay arm 97 and the second base arm 98.

[0242] Figure 28 The lifting and rotating mechanism 302 shown supports the robot base 301, enabling it to move up and down and rotate around a vertical axis. The lifting and rotating mechanism 302 is configured to allow the drying substrate hand 81 to move up and down and rotate. Additionally, the lifting and rotating mechanism 302 can also allow the wetting substrate hand 82 to move up and down and rotate. Therefore, in this example, the drying substrate hand 81 and the wetting substrate hand 82 move up and down and rotate while maintaining their relative positional relationship.

[0243] Figure 25The diagram shows the sliding mechanism 303 supporting the lifting and rotating mechanism 302. The sliding mechanism 303 has a track extending in the front-rear direction X, and is configured to allow the lifting and rotating mechanism 302 to move forward and backward in the front-rear direction X. The central robot CR has the sliding mechanism 303, thereby enabling the drying substrate hand 81 and the wetting substrate hand 82 to move forward and backward in the front-rear direction X.

[0244] Figure 28 The two flat disks of the central robot CR will also be described. Specifically, imagine liquid splashing from a substrate W in a liquid-covered state, and the central robot CR has a fixed flat disk 316 and a movable flat disk 311. The fixed flat disk 316 is fixed to the robot base 301. Therefore, the fixed flat disk 316 shifts according to the lifting and lowering movement and forward and backward movement of the robot base 301. The fixed flat disk 316 is designed as a flat shape extending in the horizontal plane, having a wall portion 317 for attaching an end edge. The wall portion 317 prevents liquid accumulation generated when the fixed flat disk 316 receives liquid from falling below the fixed flat disk 316. The fixed flat disk 316 is positioned below the substrate-wetting hand 82 and is configured to collect liquid falling from the substrate-wetting hand 82.

[0245] The fixed flat disk 316 is located below the wetted substrate hand part 82 and is supported by the robot base 301. It is configured to recover the liquid that falls from the wetted substrate hand part 82.

[0246] The movable flat disk 311 has a top plate portion 312, a base 314, and a connecting portion 313 connecting the top plate portion 312 and the base 314. The top plate portion 312 is configured as a flat shape extending in a horizontal plane, and has wall portions 318 at both ends. The wall portions 318 prevent liquid accumulation generated when the top plate portion 312 of the movable flat disk 311 receives liquid from falling below the top plate portion 312. The two ends of the top plate portion 312 in the extension direction B of the hand do not have wall portions. With this configuration, the hand 82 for wetting the substrate and the top plate portion 312 will not interfere with each other. The wall portions 318 are provided at the two ends of the top plate portion 312 in the width direction orthogonal to the extension direction B of the hand and the vertical direction.

[0247] The movable flat disk 311 is disposed between the substrate-wetting hand part 82 and the fixed flat disk 316, and is configured to catch the liquid falling from the substrate-wetting hand part 82 and guide it to the fixed flat disk 316. The movable flat disk 311 corresponds to the second flat disk of the present invention.

[0248] The base 314 of the movable flat disk 311 is supported on the fixed flat disk 316. The base 314 forms the bottom surface of the movable flat disk 311 and can move forward and backward relative to the fixed flat disk 316 in the extension direction B of the hand. Therefore, the movable flat disk 311 is configured to move forward and backward relative to the fixed flat disk 316 in the extension direction B of the hand.

[0249] The forward / reverse mechanism 315 is a drive mechanism disposed on the upper surface of the fixed flat disk 316, and has a track extending in the extension direction B of the hand. The base 314 is connected to the forward / reverse mechanism 315, thereby allowing the moving flat disk 311 to move as... Figure 28 Move forward and backward in the direction B of the hand's extension, as shown by the arrow.

[0250] The forward / backward mechanism 315 is configured to move the movable flat disk 311 forward and backward relative to the fixed flat disk 316 and the robot base 301 in the horizontal direction. The forward / backward mechanism 315 is equivalent to the second flat disk forward / backward mechanism.

[0251] The top plate portion 312 of the movable flat disk 311 is disposed below the substrate wetting hand portion 82 and is configured to receive liquid falling from the substrate wetting hand portion 82. The liquid accumulated at the top plate portion 312 is guided by the wall portion 318 and drips onto the fixed flat disk 316.

[0252] Figure 29A The diagram shows cross-sections of the substrate drying hand part 81 and the substrate wetting hand part 82. The substrate drying hand part 81 has an end guide 811 at its end and a base guide 812 at its base end. When the substrate drying hand part 81 is in the open state, the hand pusher 83 is in the retracted state, and the substrate drying hand part 81 is in a position to receive the substrate W. The hand pusher drive mechanism 83a is configured to move the hand pusher 83 forward and backward in the extension direction B of the hand.

[0253] On the other hand, the wet substrate hand part 82 has an end protrusion 821 at the end and a base protrusion 822 at the base end. Figure 29A In the middle, the hand part 82, which is used to wet the substrate, is in a position to receive the substrate W because the substrate W is not supported.

[0254] Figure 29B Although it is with Figure 29A The same figure, but showing the state where the drying substrate is received by the hand part 81. The hand part 81 presses the hand pusher 83 against the end edge of the substrate W, thus pressing the substrate W against the end guide 811. In this way, the substrate W is held and secured by the hand pusher 83 and the end guide 811 in the closed state.

[0255] On the other hand, the wetted substrate hand 82 can support the substrate W containing liquid. The wetted substrate hand 82 supports the substrate W from the lower surface via the end protrusion 821 and the base protrusion 822. At this time, the wetted substrate hand 82 does not have a component that abuts against the edge of the substrate W, so the liquid L contained on the substrate W cannot drip down the wetted substrate hand 82.

[0256] Figure 30 This is a top view of the drying substrate hand 81 in the fixed state (closed state). The drying substrate hand 81 presses one end edge of the substrate W through the hand pusher 83, while pressing the other end edge of the substrate W against the end guide 811. The end guide 812 is configured to support the end edge of the substrate W together with the end guide 811 when the hand pusher 83 is in the retracted state and the drying substrate hand 81 is in the open state.

[0257] Figure 31 This is a top view of the wetted substrate hand part 82 supporting the substrate W containing liquid. At this time, the end protrusion 821 and the base protrusion 822 of the wetted substrate hand part 82 abut against the substrate W at a predetermined portion LP that avoids the end edge.

[0258] Next, the operation of the moving flat disk 311 will be explained. Figure 32 This illustrates a situation where the liquid-filled substrate W, supported by the hand 82 and placed above the top plate 312 of the movable flat disk 311, is positioned. At this point, even if the liquid L on the substrate W falls from the substrate W, the liquid L is reliably caught by the movable flat disk 311. Figure 32 In the process, the hand part 82 is used to wet the substrate and faces the inlet 481 of the substrate W in the monolithic processing chamber 48. Figure 32 In this process, the wetted substrate is moved into the monolithic processing chamber 48 through the inlet 481 by hand 82. The monolithic processing chamber 48 can be either a drying chamber or a liquid supply chamber, and the liquid placed on the substrate W can be either pure water or IPA.

[0259] Figure 33 This illustrates the movement of the movable flat disk 311 in the extending direction B of the wetted substrate hand 82 before the wetted substrate hand 82 is inserted into the loading port 481. Through this movement, the top plate portion 312 of the movable flat disk 311 extends from the fixed flat disk 316. The end of the top plate portion 312 then enters the loading port 481 of the monolithic processing chamber 48. This movement of the movable flat disk 311 is achieved by a forward / backward mechanism 315 mounted on the fixed flat disk 316. At this point, even if the liquid L contained on the substrate W falls from the substrate W, the liquid L is reliably caught by either the movable flat disk 311 or the fixed flat disk 316.

[0260] Figure 34 This illustrates the process where the substrate W, filled with liquid, is introduced into the monolithic processing chamber 48 via the inlet 481 using the substrate wetting hand 82. The substrate wetting hand 82 moves the liquid-filled substrate W deeper into the monolithic processing chamber 48, past the movable flat disk 311 protruding towards the inlet 481. Afterward, the substrate W is transferred to a support member of the monolithic processing chamber 48, such as a pin or clamp. At this point, even if the liquid L on the substrate W falls from the substrate W, the liquid L is reliably caught by the movable flat disk 311 or the interior of the monolithic processing chamber 48.

[0261] Thus, when the liquid-filled substrate W is introduced into the monolithic processing chamber 48, the liquid L on the substrate W cannot escape from the gap between the fixed flat disk 316 and the inlet 481 because the end of the movable flat disk 311 is located inside the inlet 481. This is because the movable flat disk 311 is positioned to bridge the interior of the monolithic processing chamber 48 with the fixed flat disk 316, thereby catching the liquid L.

[0262] After the monolithic processing chamber 48 receives the substrate W containing liquid, the movable flat disk 311 and the substrate wetting hand 82 withdraw from the monolithic processing chamber 48. If the substrate wetting hand 82 withdraws before the movable flat disk 311, the liquid L adhering to the substrate wetting hand 82 will not be able to escape from the gap between the fixed flat disk 316 and the inlet 481. This is because the movable flat disk 311 is positioned to bridge the interior of the monolithic processing chamber 48 with the fixed flat disk 316, thereby catching the liquid L.

[0263] Figure 35 This illustrates the situation when a substrate W containing liquid is removed from one of the single-wafer processing chambers 48, namely the liquid supply chamber. At this time, the liquid contained on the substrate is IPA. Figure 35 In the process, the hand part 82 is used to wet the substrate and faces the inlet 481 of the substrate W in the monolithic processing chamber 48.

[0264] Figure 36 This illustrates the state in which the movable flat disk 311 moves in the extending direction B of the wet substrate hand 82 before the wet substrate is inserted into the transfer inlet 481. Through this movement, the top plate portion 312 of the movable flat disk 311 extends from the fixed flat disk 316. Then, the end of the top plate portion 312 enters the transfer inlet 481 of the monolithic processing chamber 48.

[0265] Figure 37This indicates the subsequent situation. The wetted substrate is received by hand 82 across the movable flat disk 311 protruding toward the loading port 481, with the substrate W containing liquid located deeper in the monolithic processing chamber 48.

[0266] After the substrate W containing liquid is received by the substrate wetting hand 82, the moving flat disk 311 and the substrate wetting hand 82 withdraw from the monolithic processing chamber 48. If the substrate wetting hand 82 withdraws before the moving flat disk 311, the liquid L on the substrate W cannot escape from the gap between the fixed flat disk 316 and the inlet 481. This is because the moving flat disk 311 is positioned to bridge the interior of the monolithic processing chamber 48 with the fixed flat disk 316, thereby catching the liquid L.

[0267] <14. Other Components>

[0268] The substrate processing system includes a control unit 131 for controlling the batch processing device 1, a control unit 132 for controlling the single-wafer processing device 2, and a control unit 136 for controlling the relay device 6. For details regarding each control unit, please refer to... Figure 1 In addition, although Figure 1 Although not illustrated, the storage units corresponding to each control unit are housed in the substrate processing system. Control units 131, 132, and 136 are, for example, composed of a CPU (Central Processing Unit). The specific configuration of each control unit is not limited; for example, each control unit may be composed of a single processor or a separate processor. Furthermore, multiple processors may be used to control the batch processing device 1, as is the case in the single-chip processing device 2 and the relay device 6.

[0269] Controls relating to control unit 131 include, for example, controls to carrier transport mechanism 11, processing robot HTR, HVC posture conversion unit 23, pusher mechanism 25, substrate transport mechanism WTR, and batch processing units BPU1 to BPU6. Controls relating to control unit 132 include, for example, controls to central robot CR, single-wafer processing chamber 48, and transfer robot IR. Furthermore, controls relating to third control unit 136 include, for example, controls to reverse chuck 71, relay transport mechanism OTR, and pure water supply device connected to spray head 69.

[0270] In other words, the control unit 132 controls the central robot CR, which uses the wetted substrate hand 82 to receive the substrate W containing liquid and transfer it to the drying chamber. The control unit 132 controls the drying chamber to perform the drying process on the substrate W. The control unit 132 then controls the central robot CR, which uses the drying substrate hand 81 to receive the dried substrate in the drying chamber and transfer it to the transfer robot IR. Finally, the control unit 132 controls the transfer robot IR to return the dried substrate W to the carrier C.

[0271] The storage unit stores programs or parameters related to control. The storage unit can be a single device or a separate device corresponding to each control unit. Furthermore, the substrate processing system of this embodiment does not particularly limit the configuration of the device implementing the storage unit.

[0272] <15. Substrate processing flow>

[0273] Next, the substrate processing procedure using the substrate processing system in this example will be described. Figure 38 This is a flowchart illustrating the operation of the substrate processing system in this example.

[0274] Step S11: The carrier C containing the untreated substrate W is placed in the loading port 9. The carrier C is transported to the carrier placement rack 13a by the carrier transfer mechanism 11. The processing robot HTR removes the substrate column from the carrier C and transports it to the HVC posture conversion unit 23.

[0275] Step S12: The HVC orientation conversion unit 23 tilts the substrate column composed of horizontally oriented substrates W by 90°. This changes the orientation of the substrates W constituting the substrate column from horizontal to vertical. The pusher mechanism 25 receives the orientation-converted substrate column from the HVC orientation conversion unit 23 and transfers it to the substrate transport mechanism WTR. The substrate transport mechanism WTR transfers the received substrate column, for example, to the lifting unit LF6 of the batch processing unit BPU6.

[0276] Step S13: The batch processing unit BPU6 lowers the lifting section LF6 to begin batch chemical treatment. After batch processing, the substrate column is transported by the substrate transfer mechanism WTR to the lifting section LF1 of the batch processing unit BPU1. The batch processing unit BPU1 lowers the lifting section LF1 to begin batch cleaning. After batch processing, the substrate column is transported by the substrate transfer mechanism WTR to the impregnation tank 73. At this time, the substrate column consists of vertically aligned substrates W, held on a pair of reverse clamps 71.

[0277] Step S14: A pair of inverting chucks 71 tilt the substrate column by 90° in the impregnation tank 73. As a result, the orientation of the substrate W constituting the substrate column changes from a vertical orientation to a horizontal orientation. Figure 39The diagram illustrates the transport path of the substrate column from step S11 to step S14. These steps involve transporting multiple substrates W as a single substrate column.

[0278] Step S15: The substrates W, now in a horizontal position, are transferred one by one from the impregnation tank 73 to the removal position OP by the relay conveyor OTR. At this time, the substrates W are filled with pure water and move from the impregnation tank 73 toward the removal position OP while maintaining the liquid coating state. Figure 40 The diagram illustrates the transport path of substrate W in this step. Thus, substrate W is transported from batch processing unit 1 to single-wafer processing unit 2 via relay unit 6.

[0279] Step S16: The substrate W, now in a liquid-coated state with pure water, is transported from the transport position OP to the monolithic processing chamber 48 by the central robot CR. Specifically, the central robot CR receives the substrate W containing pure water from the transport position OP and transports it to one type of monolithic processing chamber 48, namely the liquid supply chamber. Then, the central robot CR receives the substrate W containing IPA in the liquid supply chamber from the liquid supply chamber and transports it to one type of monolithic processing chamber 48, namely the drying chamber. Figure 41 The transport path of substrate W in this step is shown.

[0280] In this step, the substrate transfer is performed using the wet substrate handpiece 82 within the central robot CR. For example... Figure 42 As shown, the wet substrate can be supported and transported by the hand part 82 through the end protrusion 821 and the base protrusion 822 provided at the position away from the end edge of the substrate W.

[0281] Step S17: The substrate W, which is transferred to the single-wafer processing chamber 48, undergoes substrate drying treatment.

[0282] Step S18: The substrate W, after being dried in the single-wafer processing chamber 48, is transferred to the passageway 24 by the central robot CR. The transfer robot IR receives the substrate W transferred to the passageway 24 and places the substrate W in the carrier C placed in the second loading port 10. Thus, the substrate processing in this example is completed. Figure 43 The transport path of substrate W in this step is shown.

[0283] In this step, the central robot CR uses a dried substrate and hand 81 to transfer the substrate from the monolithic processing chamber 48 to the passageway 24. For example... Figure 44 As shown, the dried substrate is transported by hand 81 while the substrate W is held in place by end guide 811 and hand pusher 83. At this time, since the substrate W is securely held by the dried substrate hand 81, high-speed substrate transport can be performed.

[0284] <16. Effects of the Invention>

[0285] As described above, according to the configuration of the present invention, the drying substrate hand part 81 includes: a first branch blade 81b; a pair of base end guides 812 disposed at the base end of the first branch blade 81b and in contact with the end of the substrate; a pair of end guides 811 disposed at the end of the first branch blade 81b and in contact with the end of the substrate; and a substrate holding hand pusher 83 located at the base end of the first branch blade 81b, positioned between the pair of first base end guides 812, capable of pressing the substrate W against the end guides 811 by contacting the end edge of the substrate W, and cooperating with the end guides 811 to hold the substrate W. With this configuration, a substrate transport device capable of high-speed transport while reliably holding the substrate W can be provided.

[0286] Furthermore, according to the aforementioned configuration, the substrate wetting hand 82 includes: a second branch blade 82b; a pair of base end protrusions 822 disposed at the base end of the second branch blade 82b, contacting the lower surface of the substrate W and supporting the substrate W; and a pair of end protrusions 821 disposed at the end of the second branch blade 82b, contacting the lower surface of the substrate W and supporting the substrate W. With this configuration, by pressing the component against the edge of the substrate W, the liquid contained on the substrate will not drip down the component.

[0287] Furthermore, according to the aforementioned configuration, the drying substrate hand 81 is provided separately from the wet substrate hand 82. Thus, by configuring it to have a separate hand depending on the wet state of the substrate W, the drying substrate is not handled with a wet hand. According to the configuration of the present invention, substrate handling can be performed while reliably maintaining the dry state of the substrate W.

[0288] According to the configuration, the substrate wetting hand 82 is positioned below the substrate drying hand 81. With this configuration, liquid dripping from the substrate wetting hand 82 will not transfer to the substrate drying hand 81. This is because the substrate drying hand 81 is positioned above the substrate wetting hand 82.

[0289] According to the configuration described above, the device includes: a fixed flat disk 316 supported by a robot base 301 below the substrate-wetting hand 82, for collecting liquid dripping from the substrate-wetting hand 82; and a movable flat disk 311 disposed between the substrate-wetting hand 82 and the fixed flat disk 316, for catching liquid dripping from the substrate-wetting hand 82 and guiding it to the fixed flat disk 316. With this configuration, liquid dripping from the substrate-wetting hand 82 is collected in the fixed flat disk 316. If the movable flat disk 311 follows the forward and backward movement of the substrate-wetting hand 82, it can catch liquid placed on the substrate W regardless of the position of the substrate-wetting hand 82. Therefore, according to this configuration, a substrate transport device capable of suppressing liquid spillage can be provided.

[0290] According to the configuration described above, the control unit 132 controls the central robot CR to receive the substrate W containing liquid using the substrate-wetting hand 82 and transfer it to the drying chamber; it controls the drying chamber to perform the drying process on the substrate W; and the control unit CR to receive the substrate W that has been dried in the drying chamber using the substrate-drying hand 81 and transfer it to the transfer robot IR. Thus, by configuring the hand to be separate depending on the wetness state of the substrate W, the dried substrate is not transported using a wet hand. According to the configuration of the present invention, substrate transport can be performed while reliably maintaining the dryness state of the substrate.

[0291] Example 2

[0292] <17. Overall Composition>

[0293] Next, the substrate processing apparatus 2a of Example 2 will be described. The substrate processing apparatus 2a of Example 2 is a monolithic substrate processing apparatus for processing a horizontally oriented substrate W. Figure 45 The substrate processing apparatus 2a in this example is described below. The substrate processing apparatus 2a has the same configuration as the monolithic processing apparatus 2 in the substrate processing system of Example 1.

[0294] In other words, the substrate processing apparatus 2a in this example includes: a transfer block 4, equipped with a transfer robot IR for acquiring unprocessed substrate W from carrier C or returning processed substrate W to carrier C; and a single-piece processing block 8, equipped with a single-piece processing chamber 48. The second loading port 10 is a rack-like structure protruding from the transfer block 4, capable of holding carrier C.

[0295] In detail, the second loading port 10, the transfer block 4, and the single-chip processing block 8 are the same as those in the single-chip processing device 2 of Embodiment 1.

[0296] In the substrate processing apparatus 2a of this example, the transfer robot IR transports the unprocessed substrates W stored in the carrier C at the second loading port 10 to the passageway 24 one by one. The central robot CR in this example retrieves the unprocessed substrates W from the passageway 24 and, in its place, transports the processed substrates W to the passageway 24. Furthermore, the transfer robot IR returns the processed substrates W placed in the passageway 24 to the carrier C. Thus, the substrate processing apparatus 2a of this example transports the substrates W in a manner different from the monolithic processing apparatus 2 of Embodiment 1.

[0297] <18. Single-chip processing block>

[0298] The substrate processing apparatus 2a in this example may not be configured to have the take-out position OP as in Embodiment 1. Since the substrate processing apparatus 2a in this example may not have the take-out position OP, a new single-wafer processing chamber 48 is provided at the location of the take-out position OP in the single-wafer processing apparatus 2 of Embodiment 1.

[0299] As described in Example 1, the monolithic processing chamber 48 includes multiple drying chambers for substrate drying. The drying chambers may be chambers using supercritical fluids or rotary drying chambers.

[0300] Additionally, as a single-wafer processing chamber in this example, there is a chemical treatment chamber for treating the substrate W. The chemical treatment performed in the chemical treatment chamber includes, for example, hydrofluoric acid treatment to remove the natural oxide film grown on the upper surface of the substrate W, but is not limited to this. The chemical treatment chamber is configured to obtain a dry substrate from the central robot CR, perform a prescribed chemical treatment on the substrate W, fill the substrate W with liquid, and transfer it to the central robot CR. The liquid filled on the substrate W is, for example, pure water or IPA.

[0301] <19. Control Department>

[0302] In this example, the control unit 132 controls the transfer robot IR to remove the substrate W from the carrier C; the control center robot CR uses the substrate drying hand 81 to receive the substrate W removed by the transfer robot IR and transport it to the liquid supply chamber. Then, the control unit 132 controls the liquid supply chamber to fill the substrate W with liquid; the control center robot CR uses the substrate wetting hand 82 to receive the substrate W filled with liquid in the liquid supply chamber and transport it to the drying chamber; the control unit controls the drying chamber to perform the substrate drying process. Furthermore, the control unit 132 controls the control center robot CR to receive the substrate W that has been dried in the drying chamber using the substrate drying hand 81 and transport it to the transfer robot IR; the control unit controls the transfer robot IR to return the dried substrate W to the carrier C.

[0303] <20. Substrate processing flow>

[0304] Figure 46 This is a flowchart illustrating the operation of the substrate processing apparatus 2a in this example. The following will refer to the described flowchart. Figure 1 The process of substrate processing will be explained.

[0305] Step S31: Place the carrier C containing the untreated substrate W into the second loading port 10.

[0306] Step S32: The transfer robot IR removes the untreated dry substrate from the carrier C in the second loading port 10 and places it in the passage 24. The central robot CR receives the dry substrate placed in the passage 24 and transports it to one of the monolithic processing chambers 48, namely the liquid treatment chamber. Figure 47 The figure illustrates the transport path of substrate W in steps S31 and S32.

[0307] In this step, the central robot CR uses a dry substrate and hand 81 to transport the substrate from passage 24 to one of the monolithic processing chambers 48, namely the liquid treatment chamber. Figure 44 As shown, the dried substrate is transported by hand 81 while the substrate W is held in place by end guide 811 and hand pusher 83. At this time, since the substrate W is securely held by the dried substrate hand 81, high-speed substrate transport can be performed.

[0308] Step S33: One type of single-wafer processing chamber 48, namely the chemical treatment chamber, completes chemical treatment by supplying a specified chemical solution to the substrate W. After chemical treatment, the substrate W becomes liquid-coated by supplying a specified liquid to its upper surface. The specified liquid could be, for example, pure water or IPA.

[0309] Step S34: The central robot CR receives the substrate W in a liquid-coated state from the liquid treatment chamber and moves it to one of the monolithic processing chambers 48, namely the drying processing chamber. Figure 48 The diagram illustrates the transport path of substrate W in this step.

[0310] In this step, the substrate transfer is performed using the wet substrate handpiece 82 within the central robot CR. For example... Figure 42 As shown, the wet substrate can be supported and transported by the hand part 82 through the end protrusion 821 and the base protrusion 822 provided at the position away from the end edge of the substrate W.

[0311] Step S35: The wetted substrate W, which is transferred to the drying chamber, undergoes drying treatment in the drying chamber.

[0312] Step S36: When the drying process of substrate W is completed, the central robot CR receives the substrate from the drying chamber and transfers it to passage 24. The central robot CR uses the dried substrate hand 81 to perform the transfer. The substrate W transferred to passage 24 is returned to the carrier C in the second loading port 10 by the transfer robot IR. Thus, the substrate processing in this example is completed. Figure 49 The diagram illustrates the transport path of substrate W in this step.

[0313] <21. Effects of the Invention>

[0314] According to the configuration of this example, the control unit 132 controls the central robot CR, which uses a drying substrate hand 81 to receive the substrate W taken from the carrier C by the transfer robot IR and transport it to the liquid treatment chamber; controls the liquid treatment chamber to fill the substrate W with liquid; the control unit CR uses a wet substrate hand 82 to receive the substrate W filled with liquid in the liquid treatment chamber and transport it to the drying chamber; controls the drying chamber to perform the substrate drying process; and the control unit CR uses a drying substrate hand 81 to receive the substrate W that has been dried in the drying chamber and transport it to the transfer robot IR. Thus, by configuring a separate hand according to the wet state of the substrate W, the dried substrate is not transported using a wet hand. According to the configuration of this example, the substrate W can be transported while reliably maintaining its dry state.

[0315] <22. Variation Example>

[0316] The present invention is not limited to the embodiments described herein, and can be implemented in the following variations.

[0317] <Example 1 of the variation>

[0318] The central robot CR in the embodiment has a fixed flat disk 316 fixed to the robot base 301 and a movable flat disk 311 disposed on the fixed flat disk 316, but the present invention is not limited to this configuration. Figure 50 As shown, it can also be configured such that a tray hand 85 is provided below the substrate wetting hand 82 to catch the liquid flowing down from the substrate W containing the liquid. In this variation, it is not necessary to fix the flat disk 316 and move the flat disk 311.

[0319] The configuration of the tray handle 85 will be described. The tray handle 85 is disposed below the substrate-wetting handle 82. The tray handle 85 includes a plate-shaped blade 85b extending in a horizontal plane, and a hand tray 851 disposed on the upper surface of the blade 85b. Figure 51As shown, the hand tray 851 is disc-shaped with walls attached to its edges. These walls prevent liquid accumulation on the upper surface of the hand tray 851 from flowing down to the bottom of the hand tray 851. The size of the hand tray 851 is greater than or equal to the substrate W supported by the hand 82 when the substrate is wetted. Thus, liquid flowing down from the substrate W containing liquid is reliably caught by the hand tray 851. The hand tray 851 corresponds to the tray of the present invention. The hand tray 851 is configured to catch liquid falling from the wetted substrate using the hand 82.

[0320] The hand tray moving mechanism 852 is configured to move the tray hand 85 forward and backward in the extending direction B of the hand, and to move the hand tray 851 forward and backward in sync with the substrate wetting hand 82. In other words, the hand tray moving mechanism 852 corresponds to the third moving mechanism of the present invention, and is configured to movably support the tray hand 85 and be supported by the robot base 301. With the hand tray moving mechanism 852, the center of the hand tray 851 is substantially aligned with the center of the liquid-filled substrate W supported by the substrate wetting hand 82. However, in order to guide the substrate W into the interior of the monolithic processing chamber 48, when the substrate wetting hand 82 is located deep within the monolithic processing chamber 48, the hand tray moving mechanism 852 keeps the tray hand 85 idle outside the monolithic processing chamber 48. With this configuration, the area below the substrate wetting hand 82 inside the monolithic processing chamber 48 is left empty. This configuration is advantageous when transferring the substrate W to the pins or chucks inside the monolithic processing chamber 48.

[0321] In practice, the hand tray moving mechanism 852 can move until half of the hand tray 851 is introduced into the loading inlet 481 of the monolithic processing chamber 48. That is, the hand tray 851 moves synchronously with the wetted substrate hand 82, and stops at the point when half of the substrate W is introduced into the loading inlet 481 (see reference). Figure 52 Then, the wet substrate is further inserted into the monolithic processing chamber 48 by the hand 82 while keeping the hand tray 851 unchanged. While the hand tray 851 is held and the wet substrate is moved by the hand 82, even if liquid flows down from the substrate W containing liquid, the liquid is caught by the hand tray 851 or the interior of the monolithic processing chamber 48. In this way, the liquid flowing down from the substrate W containing liquid will not leave the central robot CR and scatter.

[0322] According to the above configuration, the device includes: a tray hand 85 disposed below the substrate-wetting hand 82; and a hand tray moving mechanism 852 that movably supports the tray hand 85 and is supported by a robot base 301; and the tray hand 85 has a hand tray 851 for catching liquid falling from the substrate-wetting hand 82. With this configuration, a hand tray 851 that faithfully follows the substrate-wetting hand 82 can be formed, thus enabling the hand tray 851 to catch liquid placed on the substrate W. Therefore, according to this configuration, a substrate transport device capable of suppressing liquid spillage can be provided. The tray hand 85 corresponds to the third hand of the present invention, and the hand tray moving mechanism 852 corresponds to the third moving mechanism of the present invention. The hand tray 851 corresponds to the third flat tray of the present invention.

[0323] <Example 2>

[0324] In particular, this variation is a variation related to the substrate processing apparatus of Embodiment 2. The central robot CR of Embodiment 2 has a single substrate drying hand 81, but multiple substrate drying hands 81 may also be provided. In particular, this variation relates to a central robot CR that prepares two substrate drying hands 81.

[0325] Figure 53 This variation describes the hand-like feature of the central robot CR. For example... Figure 53 As shown, the central robot CR in this variation has an upper hand 87, which is configured in the same way as the drying substrate hand 81 described in the embodiment, and a lower hand 88, which is configured in the same way as the drying substrate hand 81. The wetting substrate hand 82 described in the embodiment is located below the lower hand 88.

[0326] In this variation, the drying substrate hand is composed of two hands arranged vertically, namely the upper hand 87 and the lower hand 88.

[0327] The lower part 88 is a substrate holding mechanism for conveying and drying substrates, and it is used for... Figure 47 The substrate transport described herein refers to the mechanism for transporting the unprocessed substrate from passage 24 to the monolithic processing chamber 48. The lower hand portion 88 includes a flattened branch blade 88b extending in a horizontal plane, an end guide 881 disposed at the end of the branch blade 88b, and a base end guide 882 disposed at the base end of the branch blade 88b. Furthermore, the lower hand portion 88 includes a hand pusher 883 that presses the end edge of the substrate W at the base end of the branch blade 88b, and a hand pusher drive mechanism 88a that drives the hand pusher 883.

[0328] If you look down at the hand (88), then... Figure 30 That is to say, the lower part 88 is in the branch blade 88b ( Figure 30The end of the symbol 81b has a pair of end guides 881 ( Figure 30 The symbol in the text is 811), and in addition, in the branch blade 88b ( Figure 30 The base of symbol 81b has a pair of base end guides 882. Figure 30 The symbol in the text is 812). When the lower hand 88 is in the open state, it can support the substrate W through the end guide 881 and the base guide 882; when in the closed state, it can support the substrate W through the end guide 881 and the hand pusher 883. Figure 30 The symbol 83 in the middle is used to hold the substrate W.

[0329] The upper part 87 is a substrate holding mechanism for conveying and drying substrates, and is used for... Figure 49 The substrate transport described herein refers to the mechanism for transporting the processed substrate from the monolithic processing chamber 48 to the passage 24. The upper handle 87 includes a flattened branch blade 87b extending horizontally, an end guide 871 disposed at the end of the branch blade 87b, and a base end guide 872 disposed at the base end of the branch blade 87b. Furthermore, the upper handle 87 includes a hand pusher 873 that presses the edge of the substrate W at the base end of the branch blade 87b, and a hand pusher drive mechanism 87a that drives the hand pusher 873.

[0330] If you look down at the upper hand (87), it's still like... Figure 30 That is to say, the upper part 87 is in the branch blade 87b ( Figure 30 The end of the symbol 81b has a pair of end guides 871. Figure 30 The symbol in the text is 811), and in addition, in the branch blade 87b ( Figure 30 The base of symbol 81b has a pair of base end guides 872. Figure 30 The symbol in the text is 812). When the upper part 87 is in the open state, it can support the substrate W through the end guide 871 and the base guide 872; when in the closed state, it can support the substrate W through the end guide 871 and the hand pusher 873. Figure 30 The symbol 83 in the middle is used to hold the substrate W.

[0331] The upper hand portion 87 and the lower hand portion 88 can move freely in and out of the hand's extension direction B, and each portion can move independently. This configuration allows either the upper hand portion 87 or the lower hand portion 88 to be inserted into the monolithic processing chamber 48 for substrate W transfer, or only the lower hand portion 88 can be inserted into the monolithic processing chamber 48 for substrate W transfer. A first end arm 91 supports the upper hand portion 87 and the lower hand portion 88. The first end arm 91 is separately provided in the upper hand portion 87 and the lower hand portion 88, and can extend and retract independently in the hand's extension direction B.

[0332] Thus, the upper hand part 87 and the lower hand part 88 are supported by a separately provided first end arm 91 so that they can move independently.

[0333] Furthermore, since the upper handle 87 for handling substrate transfer is located above the lower handle 88 for handling unprocessed substrate transfer, particles and the like will not fall from the less clean substrate W held in the lower handle 88 to the more clean substrate W held in the upper handle 87. Based on the tendency of particles to fall from top to bottom, it can be said that the configuration of this variation is optimized in terms of maintaining the cleanliness of the substrate W.

[0334] According to the above configuration, the drying substrate hand has two hands, an upper hand 87 and a lower hand 88, arranged vertically, and the upper hand 87 and lower hand 88 are supported by a separately provided first end arm 91 so that they can move independently. With this configuration, the transport of the dried substrate before substrate processing and the transport of the dried substrate after substrate processing can be performed using different hands. Therefore, it is possible to prevent the situation where a clean dried substrate after substrate processing is held in place by a hand contaminated with the dried substrate before substrate processing. According to this configuration, a substrate transport device that improves the reliability of substrate processing in a substrate processing apparatus can be provided.

Claims

1. A substrate conveyance device characterized by comprising: A substrate conveying device that conveys a substrate, and includes: at least one dry substrate hand for holding a dry substrate in a horizontal posture; a wet substrate hand disposed below the dry substrate hand for supporting a substrate immersed in a liquid; a first moving mechanism that movably supports the dry substrate hand; a second moving mechanism that movably supports the wet substrate hand; and a base member that supports the first moving mechanism and the second moving mechanism; and the dry substrate hand includes: a first blade; a pair of base end guides disposed at base end portions of the first blade to contact end portions of the substrate; a pair of tip end guides disposed at tip end portions of the first blade to contact the end portions of the substrate; and a pusher for holding the substrate, disposed at the base end portions of the first blade and positioned between the pair of first base end guides, capable of pushing the substrate toward the tip end guides by contacting the end edges of the substrate to hold the substrate in cooperation with the tip end guides; and the wet substrate hand includes: a second blade; a pair of base end protrusions disposed at base end portions of the second blade to contact a lower surface of the substrate to support the substrate; and a pair of tip end protrusions disposed at tip end portions of the second blade to contact the lower surface of the substrate to support the substrate. includes:

2. The substrate conveyance device according to claim 1, characterized by a fixed flat plate supported by the base member below the wet substrate hand to recover liquid dropped from the wet substrate hand; a moving flat plate disposed between the wet substrate hand and the fixed flat plate to catch liquid dropped from the wet substrate hand and guide it to the fixed flat plate; and a moving flat plate advancing and retreating mechanism that moves the moving flat plate in the horizontal direction relative to the base member. includes:

3. The substrate conveyance device according to claim 1, characterized by a tray hand disposed below the wet substrate hand; and a third moving mechanism that movably supports the tray hand and is supported by the base member; and the tray hand includes a tray that catches liquid dropped from the wet substrate hand.

4. The substrate conveying device according to claim 1, wherein the dry substrate hand is composed of two hands, an upper hand and a lower hand, disposed above and below each other, and the upper hand and the lower hand are supported to be movable independently by the first moving mechanism. A substrate processing system including the substrate conveying device according to claim 1, and 5. A substrate processing system, characterized in that... the substrate processing system includes: a batch processing device that performs batch processing of uniformly processing a plurality of substrates; a relay device that receives the plurality of substrates that have been batch-processed from the batch processing device, converts each substrate to a horizontal posture, performs immersion of the substrate in a liquid, and conveys the substrate; a single processing device that receives the immersed substrate conveyed to the relay device, performs single processing of processing each substrate one by one; and a control section that controls the batch processing device, the single processing device, and the relay device; and the single processing device includes: a dry chamber that can dry the substrate one by one; the substrate conveying device; and a carrier robot that returns the substrate that has been dried to a carrier; the control section ​ ​ ​ the substrate conveying device is controlled to receive the substrate filled with the liquid by the wet substrate hand and convey it to the drying chamber; the drying chamber is controlled to perform the drying process of the substrate; the substrate conveying device is controlled to receive the substrate subjected to the drying process in the drying chamber by the dry substrate hand and convey it to the transfer robot; and the transfer robot is controlled to return the substrate subjected to the drying process to the carrier.

6. A substrate processing apparatus characterized by comprising: It is a substrate processing device that performs single processing of a substrate subjected to piece processing, provided with the substrate conveying device according to claim 1, and provided with: a transfer robot that conveys the substrate within the device; a processing block that performs processing of the substrate; and a control section that controls the device; and the processing block is provided with: a liquid supply chamber that performs liquid filling of the substrate; a drying chamber that receives the substrate filled with the liquid and performs a drying process; and the substrate conveying device; and the control section controls the transfer robot to take out the substrate from the carrier; controls the substrate conveying device to receive the substrate taken out by the transfer robot by the wet substrate hand and convey it to the liquid supply chamber; controls the liquid supply chamber to perform the liquid filling of the substrate; controls the substrate conveying device to receive the substrate filled with the liquid in the liquid supply chamber by the wet substrate hand and convey it to the drying chamber; controls the drying chamber to perform the drying process of the substrate; controls the substrate conveying device to receive the substrate subjected to the drying process in the drying chamber by the dry substrate hand and convey it to the transfer robot; and controls the transfer robot to return the substrate subjected to the drying process to the carrier.

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