Packaging structure and electronic component

Abstract

The invention relates to a packaging structure and an electronic component, the packaging structure comprises a base, a functional member, a protruding structure and retention glue, the base comprises a supporting part and a frame part located on one side of the supporting part, and the frame part and the supporting part define a cavity; the functional part is mounted in the cavity; the protruding structure is located on at least one side wall, facing the cavity, of the frame part. The retention glue covers the side, away from the supporting part, of the functional part and covers the side, away from the supporting part, of the protruding structure. According to the packaging structure and the electronic component, the spreading path of the retention glue on the functional part and the frame part is shortened, reliable fixation of the functional part is realized, meanwhile, the dispensing frequency is reduced, and the packaging efficiency and consistency are improved.

Description

Technical Field

[0001] This application relates to the field of electronic packaging technology, and in particular to a packaging structure and electronic component. Background Technology

[0002] In the field of electronic packaging, wafers are typically fixed and sealed to the substrate or frame using a dispensing process. Existing dispensing equipment is limited by the small size of the dispensing pinholes, making it difficult to simultaneously cover the wafer edge and the substrate frame during the dispensing process, usually requiring multiple dispensing operations to complete the fixation.

[0003] The aforementioned multiple dispensing methods not only increase the number of process steps and production cycle time, but also easily lead to problems such as uneven adhesive distribution and insufficient corner coverage, affecting the consistency and reliability of the encapsulation. Furthermore, simply replacing the dispensing equipment or increasing the pinhole size to solve these problems often results in increased equipment costs or decreased process compatibility.

[0004] Therefore, there is an urgent need for a new internal cavity structure for electronic packaging components that can effectively cover the wafer and substrate frame with adhesive during the dispensing process without changing the existing dispensing equipment, thereby improving packaging efficiency and reliability. Summary of the Invention

[0005] Therefore, it is necessary to provide a packaging structure and electronic component to address the problems of small dispensing pinholes in existing technologies, which make it difficult to simultaneously cover the wafer and substrate frame during the dispensing process and result in low dispensing efficiency.

[0006] To achieve the above objectives, this application provides an encapsulation structure, including:

[0007] The base includes a support portion and a frame portion located on one side of the support portion, the frame portion and the support portion forming a cavity;

[0008] Functional components are installed within the cavity;

[0009] A protruding structure is located on at least one side wall of the frame portion facing the cavity;

[0010] The retaining adhesive covers the side of the functional component away from the support portion and also covers the side of the protruding structure away from the support portion.

[0011] In one embodiment, the protrusion structure is located on the sidewalls of two adjacent frame portions facing the cavity.

[0012] In one embodiment, the protrusions are respectively provided on two adjacent sidewalls.

[0013] In one embodiment, the protruding structure extends from one of two adjacent frame portions toward the sidewall of the cavity to the other sidewall of the cavity.

[0014] In one embodiment, the protrusion structure has at least one groove facing the cavity, and the retaining adhesive at least partially fills the groove.

[0015] In one embodiment, the protrusion structure includes a plurality of stepped portions arranged sequentially in a direction away from the support portion, and the retaining adhesive is located on the side surface of any of the stepped portions away from the support portion.

[0016] In one embodiment, the protrusion structure includes a main body portion and at least one protrusion located on the main body portion away from the support portion.

[0017] In one embodiment, the surface of the protrusion structure away from the support is flush or nearly flush with the surface of the functional member away from the support.

[0018] In one embodiment, the protruding structure and the frame portion are integrally formed.

[0019] In one embodiment, the frame portion and the support portion are located in different film layers, or the support portion and the frame portion are located in the same film layer.

[0020] In one embodiment, the distance between the sidewall of the protrusion structure facing the cavity and the functional component is not greater than a preset safety distance, which is 0.005 mm to 0.03 mm.

[0021] In one embodiment, the encapsulation structure further includes a metal frame located on the side of the frame portion away from the support portion, the sidewall of the metal frame facing the cavity being spaced apart from the sidewall of the frame portion facing the cavity, and the retaining adhesive on the frame portion being spaced apart from the metal frame.

[0022] This application also provides an electronic component, including the packaging structure described in any of the above embodiments.

[0023] The aforementioned packaging structure and electronic components, by providing a protruding structure on at least one side wall of the frame portion facing the cavity, allow the retaining adhesive to simultaneously cover the side surface of the functional component away from the support portion and the side surface of the protruding structure away from the support portion. This shortens the spreading path of the retaining adhesive on the functional component and the frame portion, achieving reliable fixation of the functional component, while reducing the number of dispensing operations and improving packaging efficiency and consistency. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a top view of the packaging structure provided in one embodiment;

[0026] Figure 2 This is a schematic cross-sectional view of the packaging structure provided in one embodiment;

[0027] Figure 3 This is a top view of the base of the packaging structure provided in one embodiment;

[0028] Figure 4 This is a top view of the base and protrusion structure of the encapsulation structure provided in one embodiment.

[0029] Figure 5 This is a top view schematic diagram of another structure of the base and protrusion structure of the encapsulation structure provided in one embodiment;

[0030] Figure 6 This is a top view schematic diagram of a third type of packaging structure, including the base and protrusion structure, provided in one embodiment.

[0031] Figure 7 This is a top view schematic diagram of a fourth type of encapsulation structure base and protrusion structure provided in one embodiment;

[0032] Figure 8 This is a top view schematic diagram of the fifth type of base and protrusion structure of the encapsulation structure provided in one embodiment;

[0033] Figure 9 This is a top view schematic diagram of the sixth type of the base and protrusion structure of the encapsulation structure provided in one embodiment;

[0034] Figure 10 This is a top view schematic diagram of the seventh type of packaging structure, including the base and protrusion structure, provided in one embodiment.

[0035] Figure 11 This is a top view schematic diagram of the eighth type of encapsulation structure, including the base and protrusion structure, provided in one embodiment.

[0036] Figure 12 This is a top view schematic diagram of the ninth type of packaging structure base and protrusion structure provided in one embodiment;

[0037] Figure 13This is a top view schematic diagram of the tenth type of base and protrusion structure of the encapsulation structure provided in one embodiment;

[0038] Figure 14 This is a top view of the eleventh type of the base and protrusion structure of the encapsulation structure provided in one embodiment.

[0039] Figure 15 This is a top view schematic diagram of the twelfth type of base and protrusion structure of the encapsulation structure provided in one embodiment;

[0040] Figure 16 This is a top view schematic diagram of the thirteenth structure of the base and protrusion structure of the encapsulation structure provided in one embodiment.

[0041] Explanation of reference numerals in the attached figures:

[0042] 1-Base, 11-Support, 111-Electrode pad, 112-Conductive solder pad, 12-Frame, 13-Cavity, 2-Functional component, 3-Protruding structure, 31-Groove, 32-Stepped section, 33-Main body, 34-Protrusion, 4-Fixing adhesive, 5-Conductive connecting adhesive, 6-Metal frame. Detailed Implementation

[0043] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0045] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, regions, layers, doping types, and / or portions, these elements, components, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, doping type, or portion from another element, component, region, layer, doping type, or portion. Therefore, without departing from the teachings of this invention, the first element, component, region, layer, doping type, or portion discussed below may be referred to as a second element, component, region, layer, or portion.

[0046] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0047] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0048] Please see Figures 1 to 2This application provides a packaging structure, including: a base 1, a functional component 2, a raised structure 3, and a retaining adhesive 4. The base 1 includes a support portion 11 and a frame portion 12 located on one side of the support portion 11. The frame portion 12 and the support portion 11 enclose a cavity 13. The functional component 2 is installed in the cavity 13. The raised structure 3 is located on at least one side wall of the frame portion 12 facing the cavity 13. The retaining adhesive 4 covers the side of the functional component 2 away from the support portion 11 and covers the side of the raised structure 3 away from the support portion 11.

[0049] In the above example, by providing a protruding structure 3 on at least one side wall of the frame portion 12 facing the cavity 13, the retaining adhesive 4 simultaneously covers the side surface of the functional component 2 away from the support portion 11 and the side surface of the protruding structure 3 away from the support portion 11, shortening the spreading path of the retaining adhesive 4 on the functional component 2 and the frame portion 12, achieving reliable fixation of the functional component 2, while reducing the number of dispensing times, and improving encapsulation efficiency and consistency.

[0050] In one embodiment, the base 1 is made of ceramic, such as alumina ceramic, aluminum nitride ceramic, or other ceramic materials. Ceramic materials possess excellent high-temperature resistance, insulation properties, and structural stability, enabling them to withstand the localized high-temperature environments generated during long-term operation of electronic devices. Simultaneously, they avoid the risk of short circuits caused by the conductivity of the base 1, making them suitable for various electronic packaging applications. The size of the base 1 can be selected according to actual application requirements and is not limited herein.

[0051] In one embodiment, such as Figure 3 As shown, the base 1 includes a support portion 11 and a frame portion 12 located on one side of the support portion 11. The frame portion 12 and the support portion 11 enclose a cavity 13. The support portion 11 supports the functional component 2 and plays a role in dispersing heat and mechanical loads during the operation of the functional component 2, thereby ensuring the structural stability and operational reliability of the functional component 2. The cavity 13 formed by the frame portion 12 and the support portion 11 provides an independent installation space for the functional component 2, avoiding interference between the functional component 2 and external structures during assembly or operation, thereby improving the overall stability of the packaging structure.

[0052] In one embodiment, functional component 2 includes a quartz crystal. The quartz crystal, as a functional element in the packaging structure, can be used to implement functions such as frequency control, timing, or signal filtering. The shape of the quartz crystal can be circular, square, or rectangular, and its size can be set according to actual application requirements, provided it can be installed within the cavity 13. This embodiment does not limit this.

[0053] In one embodiment, the retaining adhesive 4 includes a conductive adhesive or an insulating adhesive. When the retaining adhesive 4 is a conductive adhesive, it can provide an electrical connection function while fixing the functional component 2. The conductive adhesive can be conductive silver paste or other adhesive materials with conductive properties. When the retaining adhesive 4 is an insulating adhesive, it is used to prevent electrical short circuits between the functional component 2 and the base 1. The insulating adhesive can be epoxy resin or other insulating adhesive materials suitable for electronic packaging to adapt to the electrical performance requirements of different electronic devices.

[0054] In one embodiment, the functional component 2 includes an oscillation zone and a surrounding zone. A retaining adhesive 4 is disposed on the surrounding zone of the functional component 2 to fix the functional component 2 and prevent interference with the normal operation of the oscillation zone, thereby ensuring the functional performance of the functional component 2. The specific extent of the surrounding zone can be set according to packaging requirements and bonding strength requirements.

[0055] In one embodiment, the frame portion 12 and the support portion 11 are located in different film layer structures. Specifically, the support portion 11 can be formed by pressing and pre-sintering ceramic green bodies, and the frame portion 12 can be formed by stacking multiple layers of ceramic green body films on one side of the support portion 11 and co-firing them with the support portion 11 after precise alignment, thereby forming an integrated base structure.

[0056] In another embodiment, the frame portion 12 and the support portion 11 are located in the same film layer structure. Specifically, the support portion 11 and the frame portion 12 can be integrally formed from the same ceramic blank, wherein the cavity 13 is obtained by a groove formed on one side of the support portion 11, and the portion that is not removed by processing constitutes the frame portion 12, thereby forming an integrated structure between the frame portion 12 and the support portion 11.

[0057] In one embodiment, such as Figures 4 to 6 As shown, a plurality of protruding structures 3 are provided on the same side wall of the frame portion 12 facing the cavity 13, so as to form a plurality of bearing and contact positions of the retaining adhesive 4 between the side wall and the functional component 2, thereby improving the fixation stability and vibration resistance of the functional component 2 in the cavity 13.

[0058] In one embodiment, the shape of the protrusion structure 3 includes at least one of a rectangle, an ellipse, or a trapezoid. By using protrusion structures 3 of different shapes, the spreading path and adhesion form of the retaining adhesive 4 can be flexibly adjusted according to the dispensing process and structural layout requirements to adapt to different encapsulation scenarios.

[0059] In one embodiment, the material of the protrusion structure 3 is the same as that of the base 1 to ensure that the protrusion structure 3 and the frame portion 12 are consistent in terms of thermal expansion coefficient, mechanical strength and process compatibility, thereby reducing the internal stress caused by material mismatch during device operation and improving the overall reliability of the packaging structure.

[0060] In one embodiment, the protruding structure 3 and the frame portion 12 are integrally molded. By using an integral molding method for the protruding structure 3 and the frame portion 12, assembly steps can be reduced, and structural misalignment or reliability degradation caused by additional connections or adhesives can be avoided, thereby improving the overall strength and stability of the packaging structure. Simultaneously, the integral molding structure helps ensure dimensional consistency and positional accuracy between the protruding structure 3 and the frame portion 12, improves the uniformity of the adhesive 4's coverage on the surface of the protruding structure 3, and further enhances the fixing effect of the adhesive 4 on the functional component 2. Furthermore, the integral molding method can reduce the number of parts, simplify the manufacturing process, and help reduce production costs and improve the consistency of mass production.

[0061] It should be noted that the protruding structure 3 in this embodiment is not limited to being integrally formed with the frame portion 12. In other embodiments, the protruding structure 3 can also be disposed separately as an independent structure on the side wall of the frame portion 12 facing the cavity 13, for example, by bonding, welding, fitting or other fixing methods. Using a separately designed protruding structure 3 can improve the flexibility of structural design, making it easy to adjust the shape, size and position of the protruding structure 3 according to different package sizes or different functional component 2 installation requirements, thereby adapting to diverse packaging application scenarios.

[0062] In one embodiment, to ensure the vibration or working space of the functional component 2, the protruding structure 3 is spaced apart from the frame portion 12. Specifically, the distance between the sidewall of the protruding structure 3 facing the cavity 13 and the functional component 2 is no greater than a preset safety distance, which is 0.005mm to 0.03mm. This further shortens the gap that the retaining adhesive 4 needs to cross during dispensing, effectively reducing the number of dispensing operations and improving encapsulation efficiency, while ensuring that the protruding structure 3 does not interfere with the normal operation of the functional component 2. The preset safety distance is the minimum distance threshold required to meet the vibration, thermal expansion, or displacement space needed by the functional component 2 in its working state, to avoid adverse effects of the protruding structure 3 on the normal operation of the functional component 2. The specific value of the safety distance can be set according to the type of the functional component 2, its operating frequency, and encapsulation requirements, and is not limited to the above range.

[0063] In one embodiment, the protruding structure 3 is located on the sidewalls of two adjacent frame portions 12 facing the cavity 13, so that the retaining adhesive 4 is located in the corner area of ​​the cavity 13. While shortening the distance between the functional component 2 and the frame portion 12, it further increases the contact area between the retaining adhesive 4 and the protruding structure 3, and makes full use of the corner space of the cavity 13, thereby improving the coverage integrity and bonding reliability of the retaining adhesive 4.

[0064] In one embodiment, such as Figure 7As shown, protruding structures 3 are respectively provided on two adjacent sidewalls. That is, each protruding structure 3 is separately provided to form multiple attachment positions for the retaining adhesive 4 in the corner area of ​​the cavity 13.

[0065] In another embodiment, such as Figure 8 and Figure 9 As shown, the protruding structure 3 extends from one of the two adjacent frame portions 12 towards the sidewall of the cavity 13 to the other sidewall of the cavity 13, so that the protruding structure 3 is continuously arranged across the corner area of ​​the cavity 13. Furthermore, the protruding structure 3 can adopt different connection methods at the corner, such as partially covering the corner area or completely covering the corner area, so that the protruding structure 3 can selectively cover the corner space according to the actual dispensing process and encapsulation requirements, and prevent the retaining adhesive 4 from flowing into the uncovered area at the corner.

[0066] In addition, the protruding structure 3 located on one of the side walls can be spaced apart from the side wall, thereby improving the structural design flexibility of the protruding structure 3 and reducing the amount of material used while ensuring the covering effect of the retaining adhesive 4.

[0067] In another embodiment, such as Figures 10 to 11 As shown, the protruding structure 3 has at least one groove 31 facing the cavity 13. The retaining adhesive 4 is at least partially filled in the groove 31. That is, the groove 31 is located on the side wall of the protruding structure 3 near the functional component 2. The groove 31 is positioned close to the functional component 2, which helps guide the retaining adhesive 4 to flow preferentially towards the area close to the functional component 2 and the protruding structure 3 during the dispensing process, thereby improving dispensing efficiency. The number of grooves 31 can be one or more, and their shape includes at least one of elliptical, rectangular, or trapezoidal shapes. The size of the groove 31 can be set according to the actual packaging requirements and is not limited here.

[0068] It should be noted that the specific location of the groove 31 is not limited to the above embodiment. In other embodiments, the groove 31 may also be located at other positions of the protruding structure 3 according to the dispensing process or structural design requirements.

[0069] In another embodiment, such as Figures 12 to 15 As shown, the raised structure 3 includes multiple stepped portions 32, with the retaining adhesive 4 located on the surface of any stepped portion 32 away from the support portion 11, to form a multi-level adhesive interface. The number of stepped portions 32 can be flexibly set according to requirements, for example, 2 to 4, and the dimensions of the multiple stepped portions 32 can be the same or different. For example, the orthographic projection of the stepped portion 32 away from the support portion 11 can be set to be within the orthographic projection range of the stepped portion 32 close to the support portion 11, thereby forming a stepped structure that gradually shrinks in the direction away from the support portion 11, to further guide the spreading direction of the retaining adhesive 4 and improve the adhesion stability of the retaining adhesive 4 on the stepped structure.

[0070] In another embodiment, such as Figure 16 As shown, the protruding structure 3 includes a main body 33 and a plurality of protrusions 34 located on the side of the main body 33 away from the support 11, to further increase the contact area between the retaining adhesive 4 and the protruding structure 3. The number of protrusions 34 can be one or more, and their shape includes at least one of elliptical, rectangular or trapezoidal shapes. The size of the protrusions 34 can be set according to the actual situation.

[0071] In one embodiment, the protruding structure 3 and the sidewall on which the protruding structure 3 is provided are partially connected, that is, the protruding structure 3 is only connected to the sidewall in a local area. This improves the structural design flexibility of the protruding structure 3, reduces material usage, and helps to reduce manufacturing costs while meeting the requirements for covering, guiding and bonding the adhesive 4.

[0072] In another embodiment, the protruding structure 3 and the sidewall on which the protruding structure 3 is provided are fully connected, that is, the protruding structure 3 is attached to the sidewall along the entire area in contact with the sidewall, so as to further improve the overall structural strength and stability of the protruding structure 3 and reduce the manufacturing difficulty.

[0073] In one embodiment, the surface of the protruding structure 3 away from the support portion 11 is flush or nearly flush with the surface of the functional component 2 away from the support portion 11. This ensures that when the retaining adhesive 4 simultaneously covers the surfaces of both the protruding structure 3 and the functional component 2, no adhesion blind spots are created due to the height difference, thereby improving the coverage integrity and adhesion reliability of the retaining adhesive 4. A flat surface also facilitates the application of the retaining adhesive 4, effectively reducing defects such as adhesive bubbles or buildup, and helps to form a uniform and stable retaining adhesive 4, ensuring the consistency and reliability of the encapsulation structure. It should be noted that "nearly flush" means that a slight height difference is permissible, but it does not affect the complete coverage of the retaining adhesive 4 or the fixing effect of the functional component 2.

[0074] In one embodiment, the retaining adhesive 4 also covers the sidewall of the protruding structure 3 facing the cavity 13. In another embodiment, the retaining adhesive 4 also covers the side surface of the frame portion 12 away from the support portion 11 to further enhance the fixing strength of the functional member 2.

[0075] By providing a protruding structure 3 on at least one side wall of the frame portion 12 facing the cavity 13, the retaining adhesive 4 simultaneously covers the side surface of the functional component 2 away from the support portion 11 and the side surface of the protruding structure 3 away from the support portion 11. This shortens the spreading path of the retaining adhesive 4 on the functional component 2 and the frame portion 12, achieving reliable fixation of the functional component 2, while reducing the number of dispensing operations and improving encapsulation efficiency and consistency.

[0076] In one embodiment, please refer to... Figure 2The encapsulation structure also includes conductive adhesive 5, through which the functional component 2 is mounted on the support portion 11. The conductive adhesive 5 may include conductive silver paste to provide electrical connection between the functional component 2 and the support portion 11.

[0077] In one embodiment, an electrode pad 111 is disposed on the surface of the exposed support portion 11 within the cavity 13, and conductive adhesive 5 is located between the electrode pad 111 and the functional component 2. Simultaneously, the orthographic projection of the conductive adhesive 5 on the support portion 11 lies within the orthographic projection range of the electrode pad 111, ensuring conductivity while preventing adhesive overflow. Specifically, after the functional component 2 is disposed on the conductive adhesive 5, the orthographic projection of the conductive adhesive 5 remains within the orthographic projection range of the electrode pad 111, thereby ensuring reliable electrical connection.

[0078] In one embodiment, a conductive pad 112 is provided on the side of the support portion 11 away from the frame portion 12, which is electrically connected to the conductive post inside the support portion 11, thereby achieving electrical connection with an external circuit. This structure ensures stable conductivity of the functional component 2. This embodiment does not limit the power supply method and can be adjusted according to specific packaging requirements.

[0079] In one embodiment, the number of retaining adhesives 4 in the encapsulation structure includes at least two, such as three, four, or six. Multiple retaining adhesives 4 can be disposed on the same frame portion 12 or different frame portions 12 to flexibly adapt to different encapsulation strength requirements and can be arranged in conjunction with the positions of conductive connecting adhesives 5 and electrode pads 111. In the direction away from the support portion 11, conductive connecting adhesives 5 can be disposed correspondingly to retaining adhesives 4 or not, that is, retaining adhesives 4 and conductive connecting adhesives 5 can act separately or together. Furthermore, the number of protruding structures 3 corresponds to the number of retaining adhesives 4. When multiple protruding structures 3 are disposed at multiple sidewalls or corner positions, retaining adhesives 4 can be disposed at each corresponding position to achieve multi-point fixation of the functional component 2 and improve the fixation stability and vibration resistance of the functional component 2 within the cavity 13.

[0080] In one embodiment, the encapsulation structure further includes a metal frame 6, located on the side of the frame portion 12 away from the support portion 11. The sidewall of the metal frame 6 facing the cavity 13 is spaced apart from the sidewall of the frame portion 12 facing the cavity 13, and the retaining adhesive 4 is also spaced apart from the metal frame 6 to prevent direct contact. The metal frame 6 has an annular structure, fitting against the top surface of the frame portion 12 with an annular gap to avoid interference with the inner structure of the frame portion 12. When the retaining adhesive 4 is conductive, maintaining a distance from the metal frame 6 effectively prevents conductivity, ensuring the electrical performance of the encapsulation structure. The metal frame 6 can be made of Kovar alloy material, such as Fe-Ni-Co alloy or other suitable materials, whose coefficient of thermal expansion matches well with the base 1 and the cover, serving as a transition structure between the cover and the base 1, achieving sealing and ensuring the cleanliness of the working environment for the functional components.

[0081] It should be noted that the metal frame 6 is only one sealing method for achieving a sealed encapsulation structure. In other embodiments, different encapsulation forms can be adopted according to encapsulation requirements. For example, without the metal frame 6, the cavity can be encapsulated by directly welding, bonding, or using other sealing processes to the cover and base 1.

[0082] In one embodiment, the encapsulation structure further includes a cover (not shown) for sealing the cavity 13. The cover may be made of metal, glass, or other materials suitable for encapsulation; the cover may be planar, raised, or have a special shape to meet different encapsulation design requirements. In one embodiment, the functional component 2 is spaced apart from the frame portion 12, and the bottom of the cover is also spaced apart from the top of the conductive adhesive 5 to ensure vibration space for the functional component 2, thereby not affecting the normal operation of the functional component 2. The specific spacing distance can be set according to actual encapsulation requirements, and this embodiment does not limit it.

[0083] In one embodiment, this application also provides an electronic component comprising the packaging structure described in any of the above embodiments. Exemplarily, the electronic component includes a crystal resonator. Exemplarily, the electronic component includes a crystal oscillator.

[0084] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0085] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A package structure, characterized by, The package structure comprises: a base, comprising a support part and a frame part located at one side of the support part, the frame part and the support part enclosing a cavity; a functional component installed in the cavity; a protruding structure located at at least one side wall of the frame part facing the cavity; a retaining adhesive covering one side of the functional component away from the support part and covering one side of the protruding structure away from the support part.

2. The package structure of claim 1, wherein, The protruding structure is located at the side walls of two adjacent frame parts facing the cavity.

3. The package structure of claim 2, wherein, The protruding structures located at two adjacent side walls are respectively arranged.

4. The package structure of claim 2, wherein, The protruding structure extends from one side wall of one of the two adjacent frame parts facing the cavity to the other side wall facing the cavity.

5. The package structure of claim 1, wherein, The protruding structure is provided with at least one groove facing the cavity, and the retaining adhesive is at least partially filled in the groove.

6. The package structure of claim 1, wherein, The protruding structure comprises a plurality of stepped parts arranged in sequence in a direction away from the support part, and the retaining adhesive is located at a side surface of any of the stepped parts away from the support part.

7. The package structure of claim 1, wherein, The protruding structure comprises a main body part and at least one protruding part located away from the support part.

8. The package structure of claim 1, wherein, A side surface of the protruding structure away from the support part is flush or close to flush with a side surface of the functional component away from the support part.

9. The package structure of claim 1, wherein, The protruding structure and the frame part are integrally formed.

10. The package structure of claim 1, wherein, The frame part and the support part are located in different film layers, or the support part and the frame part are located in the same film layer.

11. The package structure of claim 1, wherein, A distance between a side wall of the protruding structure facing the cavity and the functional component is not greater than a preset safety distance, and the preset safety distance is 0.005 mm to 0.03 mm.

12. The package structure of claim 1, wherein, The package structure further comprises a metal frame located at one side of the frame part away from the support part, a side wall of the metal frame facing the cavity is arranged in a spaced manner with a side wall of the frame part facing the cavity, and the retaining adhesive on the frame part is arranged in a spaced manner between the metal frame.

13. An electronic component, characterized by comprising: The package structure comprises the package structure according to any one of claims 1 to 12. The package structure comprises the package structure according to any one of claims 1 to 12.

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