Wafer cutting edge searching and positioning device and wafer cutting equipment
By using polarized light technology in the wafer dicing apparatus to filter out the polarized light of the adhesive film layer and retain only the diffuse reflected light from the wafer edge, the problem of identification difficulties caused by the deep color and large thickness of the adhesive film in the existing technology is solved, thereby improving dicing accuracy and yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-03
- Publication Date
- 2026-03-10
AI Technical Summary
Existing wafer dicing equipment has difficulty accurately identifying wafer edges, especially when the film is dark in color or thick in thickness, leading to edge detection anomaly alarms and reduced dicing accuracy.
Using polarized light technology, an illumination lamp strip and lens assembly are used. By combining a first polarizer and a second polarizer, the polarized light of the film layer is filtered out, and only the diffuse reflected light from the wafer edge is retained, so as to accurately identify the wafer edge.
It improved edge finding pass rate, reduced abnormal alarms, enhanced cutting accuracy and yield, and ensured the accuracy of wafer cutting.
Smart Images
Figure CN121625318A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer dicing technology, and more specifically, to a wafer dicing edge-finding and positioning device and a wafer dicing equipment. Background Technology
[0002] A wafer dicing stage (or dicing saw) is a key piece of equipment in semiconductor back-end packaging processes, used to dice a whole wafer that has completed front-end processes into individual chips (dies). Edge detection is required during wafer dicing, the core purpose of which is to accurately locate the wafer's dicing reference point, ensuring that the dicing path is perfectly aligned with the chip's dicing street, avoiding damage to usable chips, and guaranteeing dicing accuracy and yield.
[0003] Slight dimensional deviations or warping may occur in wafers during early processes such as photolithography and etching. Edge detection can detect these errors in real time, dynamically adjust the dicing path, ensure the accuracy of each dicing line, and reduce chip breakage caused by wafer deformation. However, existing edge detection functions use a ring light on the imaging lens to illuminate from the side, using side lighting and shadows to highlight the outline. This is suitable for wafers with a certain thickness and where the adhesion to the adhesive film is not tight. Whether it can be used normally is also greatly related to the adhesive film material. When the adhesive film is dark in color, thick, or similar in color to the wafer, the lens cannot accurately identify the wafer edge, which may lead to misidentification and abnormal wafer dicing. Summary of the Invention
[0004] The purpose of this invention is to provide a wafer dicing edge-finding and positioning device and a wafer dicing equipment, which can accurately identify wafer edges, reduce edge-finding abnormal alarms, increase edge-finding pass rate, and improve dicing accuracy and yield.
[0005] In a first aspect, the present invention provides a wafer dicing edge-finding and positioning device, comprising: A wafer dicing stage for placing a wafer with an adhesive film layer, wherein the back side of the wafer is disposed at the center of the adhesive film layer, and the adhesive film layer is placed on the wafer dicing stage; An irradiation light strip is disposed on the edge of the wafer dicing stage, and a first polarizer is disposed on the light-emitting side of the irradiation light strip so that the irradiation light strip emits polarized light toward the adhesive film layer and the edge of the wafer; A lens assembly is disposed above the wafer dicing stage, and a second polarizer is disposed on the light-incident side of the lens assembly. The polarization direction of the second polarizer is perpendicular to the polarization direction of the first polarizer. The lens assembly is used to collect the light reflected from the edge of the wafer and filter the polarized light of the film layer to determine the position of the wafer edge.
[0006] In an optional embodiment, the illumination light strips include a plurality of strips, which are evenly distributed along the edge of the wafer dicing stage, and each strip is used to emit light upward.
[0007] In an optional embodiment, the edge of the wafer dicing stage is provided with a metal edge, the metal edge being flush with the table surface of the wafer dicing stage, and a plurality of illumination lamp strips are uniformly embedded in the metal edge, wherein the diameter of the metal edge is larger than the diameter of the wafer.
[0008] In an optional embodiment, the first polarizer includes a plurality of first polarizers, which are correspondingly covered on the plurality of illumination lamp strips, and the first polarizers are flush with the metal edge.
[0009] In an optional embodiment, the first polarizer is annular and embedded in the metal edge, and the first polarizer simultaneously covers multiple of the illumination lamp strips.
[0010] In an optional embodiment, the lens assembly includes an edge-finding bracket, a CCD module, and an angle adjustment module. The CCD module is mounted on the edge-finding bracket, and the angle adjustment module is disposed on the CCD module and is connected to the second polarizer for driving the second polarizer to rotate.
[0011] In an optional embodiment, the lens assembly further includes an edge-finding drive, an annular track is provided on the edge-finding bracket, the annular track corresponds to the edge of the wafer dicing stage, the CCD module is movably mounted on the annular track, the edge-finding drive is disposed on the edge-finding bracket and is drively connected to the CCD module to drive the CCD module to move along the annular track.
[0012] In an optional embodiment, the lens assembly further includes a control unit integrated on the CCD module and communicating with the illumination light strip. The control unit is used to control the lens assembly to perform edge-finding operations, and the illumination light strip is used to turn on or off under the control of the control unit.
[0013] In an optional embodiment, the wafer dicing edge-finding and positioning device further includes a metal ring, which is detachably arranged around the wafer dicing stage to fix the edge of the adhesive film layer. A light guide is provided on the metal ring, which passes through the metal ring and corresponds to the illumination lamp strip.
[0014] In a second aspect, the present invention provides a wafer dicing apparatus, including a machine base, a dicing device, and a wafer dicing edge-finding and positioning device as described in any of the foregoing embodiments. The wafer dicing table is disposed on the machine base, and the dicing device is mounted on the machine base and located above the wafer dicing table for dicing the wafer and the adhesive film layer.
[0015] The beneficial effects of the embodiments of the present invention include: The wafer dicing edge-finding and positioning device and wafer dicing equipment provided in this invention utilize a wafer dicing stage to place a wafer with an adhesive film layer. An illumination strip is provided at the edge of the wafer dicing stage, and a first polarizer is provided on the light-emitting side of the illumination strip so that the illumination strip emits polarized light towards the adhesive film layer and the wafer edge. A lens assembly is positioned above the wafer dicing stage, and a second polarizer is provided on the light-incident side of the lens assembly. The polarization direction of the second polarizer is perpendicular to the polarization direction of the first polarizer. The lens assembly can collect the light reflected from the wafer edge and filter the polarized light from the adhesive film layer, thereby determining the edge position of the wafer and completing the edge-finding and positioning.
[0016] Compared to existing technologies, the wafer dicing edge-finding and positioning device and wafer dicing equipment provided in this invention utilize an illumination lamp strip and a first polarizer to emit polarized light. After passing through the adhesive film layer, the polarization direction of the polarized light remains unchanged and is projected onto the edge of the wafer. However, the solid wafer edge will produce diffuse reflection, disrupting the polarization direction. The second polarizer can filter out the light emitted from the adhesive film, retaining only the reflected light from the wafer edge. This allows for clear identification of the wafer outline, accurate identification of the wafer edge, reduced edge-finding anomaly alarms, increased edge-finding throughput, and improved subsequent dicing accuracy and yield. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is an exploded structural diagram of the first wafer dicing edge-finding and positioning device provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the overall structure of the first wafer dicing edge-finding and positioning device provided in an embodiment of the present invention; Figure 3 for Figure 2 A magnified view of a section at point II; Figure 4 This is an exploded structural diagram of the second wafer dicing edge-finding and positioning device provided in an embodiment of the present invention; Figure 5 for Figure 1 A schematic diagram of the middle lens assembly; Figure 6 This is a schematic diagram of the lens assembly of the third wafer dicing edge-finding and positioning device provided in an embodiment of the present invention; Figure 7 A schematic diagram of the assembly structure of the wafer dicing stage of the fourth wafer dicing edge-finding and positioning device provided in an embodiment of the present invention; Figure 8 for Figure 7 A magnified view of a portion of section VIII.
[0019] Icons: 100-Wafer dicing edge-finding positioning device; 110-Wafer dicing stage; 111-Metal edge; 120-Illumination light strip; 130-First polarizer; 140-Lens assembly; 141-Edge-finding bracket; 142-CCD module; 143-Angle adjustment module; 144-Edge-finding drive component; 145-Circular track; 150-Second polarizer; 160-Metal ring; 161-Light guide component; 200-Wafer; 210-Coating layer. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0021] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.
[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0023] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.
[0024] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0025] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.
[0026] See Figures 1 to 3 This invention provides a wafer dicing edge-finding and positioning device 100, which can accurately identify the edge of the wafer 200, reduce edge-finding abnormal alarms, increase edge-finding pass rate, and improve dicing accuracy and yield.
[0027] The wafer dicing edge-finding and positioning device 100 provided in this embodiment of the invention includes a wafer dicing stage 110, an illumination strip 120, and a lens assembly 140. The wafer dicing stage 110 is used to place a wafer 200 with an adhesive film layer 210, wherein the back side of the wafer 200 is disposed at the center of the adhesive film layer 210, and the adhesive film layer 210 is placed on the wafer dicing stage 110. The illumination strip 120 is disposed at the edge of the wafer dicing stage 110, and the light-emitting side of the illumination strip 120 is provided with a first polarization. A first polarizer 130 is used to collect light reflected from the edge of the wafer 200 and filter the polarized light from the film layer 210 and the edge of the wafer 200. A second polarizer 150 is provided on the light-incident side of the lens assembly 140. The polarization direction of the second polarizer 150 is perpendicular to the polarization direction of the first polarizer 130. The lens assembly 140 is used to collect light reflected from the edge of the wafer 200 and filter the polarized light from the film layer 210 to determine the edge position of the wafer 200.
[0028] In actual operation, since the illumination strip 120 is located below the adhesive film layer 210, polarized light can be emitted using the illumination strip 120 and the first polarizer 130. After passing through the adhesive film layer 210, the polarization direction of the polarized light remains unchanged and is projected onto the edge of the wafer 200. However, the solid edge of the wafer 200 will produce diffuse reflection, disrupting the polarization direction. The second polarizer 150 can filter out the light emitted from the adhesive film, retaining only the reflected light from the edge of the wafer 200. This allows for clear identification of the wafer 200 outline, accurate identification of the wafer 200 edge, reduction of edge-finding anomaly alarms, increase edge-finding pass rate, and improvement of subsequent cutting accuracy and yield.
[0029] It should be noted that the "polarization direction" mentioned in this embodiment refers to the filtering direction of the first polarizer 130 and the second polarizer 150, that is, the vibration direction of linearly polarized light that the polarizer allows to pass through. The light emitted from the illuminating lamp strip 120 is filtered by the first polarizer 130 and then emitted along the polarization direction. The polarization direction of the second polarizer 150 is perpendicular to that of the first polarizer 130, thus completely filtering out the emitted light in the original polarization direction and retaining only the reflection from the edge of the wafer 200 after diffuse reflection. At this time, the first polarizer 130 acts as a polarizer, while the second polarizer 150 acts as an analyzer, which can fully retain the reflection from the edge of the wafer 200 and determine the edge position of the wafer 200.
[0030] In some embodiments, the illumination strips 120 include multiple strips, which are evenly distributed along the edge of the wafer dicing stage 110, and each strip 120 emits light upwards. Specifically, the illumination strips 120 can be high color rendering LED strips, and there can be four strips 120 positioned at four points on the wafer dicing stage 110 (top, bottom, left, and right). The illumination strips 120 emit light upwards and are covered with a first polarizer 130. The light emitted by the four LED strips first passes through the first polarizer 130 and becomes unidirectional polarized light. The polarized light illuminates the adhesive film and the edge of the wafer 200. The light passing through the adhesive film maintains its polarization direction, while the diffuse reflection at the edge of the wafer 200 disrupts the polarization direction.
[0031] In some embodiments, the edge of the wafer dicing stage 110 is provided with a metal edge 111, which is flush with the table surface of the wafer dicing stage 110. Multiple illumination lamp strips 120 are uniformly embedded within the metal edge 111, wherein the diameter of the metal edge 111 is larger than the diameter of the wafer 200. Specifically, the metal edge 111 is annular in shape and has upward-facing grooves at four positions: top, bottom, left, and right. The illumination lamp strips 120 are placed into these grooves, ensuring that the illumination lamp strips 120 emit light only upwards. The diameter of the metal edge 111 is larger than the diameter of the wafer 200 and corresponds to the outer region of the adhesive film layer 210, allowing the illumination lamp strips 120 to also correspond to the outer region of the adhesive film layer 210 and emit light through the adhesive film layer 210.
[0032] In some embodiments, a plurality of first polarizers 130 are included, and the plurality of first polarizers 130 are correspondingly covered on the plurality of illumination lamp strips 120, and the first polarizers 130 are flush with the metal edge 111. Specifically, there may also be four first polarizers 130, with the four first polarizers 130 respectively covering the four illumination lamp strips 120, and the first polarizers 130 are also placed in the groove of the metal edge 111 and kept flush with the metal edge 111, which can effectively avoid interference with the adhesive film layer 210 and the wafer 200.
[0033] It should be noted that in this embodiment, the size of the first polarizer 130 is adapted to the size of the groove on the metal edge 111, so that the first polarizer 130 can just seal the groove and ensure the overall surface flatness.
[0034] See Figure 4 In other preferred embodiments of the present invention, the first polarizer 130 is annular and embedded in the metal edge 111, and the first polarizer 130 simultaneously covers multiple illumination strips 120. Specifically, the first polarizer 130 can be designed in an annular shape, which can simultaneously cover 4 illumination strips 120, with lower installation requirements, as it does not require separate alignment of the 4 illumination strips 120.
[0035] See Figure 5 In some embodiments, the lens assembly 140 includes an edge-finding bracket 141, a CCD module 142, and an angle adjustment module 143. The CCD module 142 is mounted on the edge-finding bracket 141, and the angle adjustment module 143 is disposed on the CCD module 142 and is connected to the second polarizer 150 via a transmission rod, thereby driving the second polarizer 150 to rotate. Specifically, the edge-finding bracket 141 is externally connected to the machine tool, the CCD module 142 is a CCD camera (Charge-Coupled Device) capable of acquiring high-definition images of the wafer 200, and the angle adjustment module 143 can be an adjustment motor connected to the second polarizer 150 via a transmission rod, thereby driving the second polarizer 150 to rotate. By adjusting the rotation of the second polarizer 150, the polarization direction of the second polarizer 150 can be ensured to be perpendicular to the polarization direction of the first polarizer 130, and the contrast between black and white can be adjusted by adjusting the angle.
[0036] Furthermore, the size of the second polarizer 150 needs to be larger than the size of the CCD module 142, so that even after the angle of the second polarizer 150 is adjusted, it can still cover the light-incident side of the CCD module 142, ensuring the filtering effect. The adjusting motor is located at the edge of the CCD module 142 and is connected to the edge of the second polarizer 150 through a transmission rod. The angle of the second polarizer 150 can be adjusted by adjusting the motor.
[0037] It should be noted that in this embodiment, the CCD module 142 can move in the Y direction following the spindle of the cutting equipment, while the wafer cutting stage 110 moves in the X direction. That is, the CCD module 142 can move in the horizontal direction relative to the wafer cutting stage 110, thereby moving the view acquisition range of the CCD module 142 and better acquiring the edge reflection of the wafer. The X and Y directions are mutually perpendicular horizontal directions.
[0038] After edge finding is completed, relevant calibrations are performed based on the product pattern on the wafer surface and the cutting steps to finally confirm the position of the required cutting path.
[0039] See Figure 6 In some other preferred embodiments, the lens assembly 140 further includes an edge-finding drive 144. An annular track 145 is provided on the edge-finding bracket 141, corresponding to the edge of the wafer dicing stage 110. The CCD module 142 is movably mounted on the annular track 145. The edge-finding drive 144 is disposed on the edge-finding bracket 141 and is drively connected to the CCD module 142, used to drive the CCD module 142 to move along the annular track 145. Specifically, when the CCD module 142 is relatively small and has insufficient viewing angle, it may affect the image collection of reflections from the edge of the wafer 200. Therefore, by adding the annular track 145, the CCD module 142 can slide along the annular track 145, thereby enabling edge-finding along the edge of the wafer 200. Multiple images are then captured and stitched together to ensure imaging quality.
[0040] In some embodiments, the lens assembly 140 further includes a control unit (not shown), which is integrated on the CCD module 142 and communicates with the illumination strip 120. The control unit controls the lens assembly 140 to perform edge-finding operations, and the illumination strip 120 is turned on or off under the control of the control unit. The control unit can be a processor such as an MCU (Microcontroller Unit), MPU (Microprocessing Unit), or PLC (Programmable Logic Controller). The control unit can be electrically connected to the CCD module 142, the edge-finding driver 144, and the illumination strip 120 via wires, enabling the illumination strip 120 to be linked with the CCD module 142. Specifically, the illumination strip 120 can be switched on and off via the empty box unit, so that the illumination strip 120 is turned on when the edge-finding operation begins and turned off after the edge-finding is completed, avoiding energy waste and interference with other processes.
[0041] See Figure 7 and Figure 8In some embodiments, the wafer dicing edge-finding and positioning device 100 further includes a metal ring 160, which is detachably disposed around the wafer dicing stage 110 to fix the edge of the adhesive film layer 210. A light guide 161 is disposed on the metal ring 160, passing through the metal ring 160 and corresponding to the illumination lamp strip 120. Specifically, the metal ring 160 is an auxiliary frame structure of the wafer dicing stage 110. Before dicing, the wafer 200 is bonded to the adhesive film layer 210, and the adhesive film layer 210 can be tautly fixed to the metal ring 160. Installing and fixing the metal ring 160 around the wafer dicing stage 110 ensures that the adhesive film layer 210 is placed on the wafer dicing stage 110. The light guide 161 can be made of acrylic material with good light transmittance. It extends downward to the surface of the first polarizer 130 of the irradiation light strip 120, so that part of the light emitted from the irradiation light strip 120 after passing through the first polarizer 130 can be directly guided along the light guide 161 to the front of the metal ring 160 and directly irradiate the edge of the adhesive film layer 210 and the wafer 200. This allows the edge of the wafer 200 to receive more reflected light and avoids the situation where the edge of the wafer 200 has insufficient reflectivity due to the adhesive film layer 210 being too dark and having too low light transmittance.
[0042] Furthermore, there can be four light guides 161. The four light guides 161 are respectively set at four points on the top, bottom, left and right of the metal ring 160 and penetrate through the metal ring 160 to the surface of the first polarizer 130. At the same time, the top of the light guide 161 protrudes slightly from the metal ring 160 to ensure its side illumination effect. In this way, even if the film is dark, the outline of the wafer 200 can be identified.
[0043] This invention also provides a wafer dicing apparatus, including a machine base, a dicing device, and the aforementioned wafer dicing edge-finding and positioning device 100. The wafer dicing edge-finding and positioning device 100 includes a wafer dicing stage 110, an illumination strip 120, and a lens assembly 140. The wafer dicing stage 110 is used to place a wafer 200 with an adhesive film layer 210, wherein the back side of the wafer 200 is located at the center of the adhesive film layer 210, and the adhesive film layer 210 is placed on the wafer dicing stage 110. The illumination strip 120 is located at the edge of the wafer dicing stage 110. A first polarizer 130 is provided on the light-emitting side of the irradiation strip 120 so that the irradiation strip 120 emits polarized light toward the edge of the film layer 210 and the wafer 200. A lens assembly 140 is disposed above the wafer dicing stage 110, and a second polarizer 150 is provided on the light-incident side of the lens assembly 140. The polarization direction of the second polarizer 150 is perpendicular to the polarization direction of the first polarizer 130. The lens assembly 140 is used to collect light reflected from the edge of the wafer 200 and filter the polarized light from the film layer 210 to determine the edge position of the wafer 200. The wafer dicing stage 110 is disposed on the machine platform, and a dicing device is mounted on the machine platform and located above the wafer dicing stage 110 for dicing the wafer 200 and the film layer 210.
[0044] It should be noted that the specific structure and working principle of the cutting device and machine base can be referred to the existing dicing machine, and will not be described in detail here.
[0045] In summary, the wafer dicing edge-finding and positioning device 100 and the wafer dicing equipment 200 provided in this embodiment of the invention utilize a wafer dicing stage 110 to place a wafer 200 with an adhesive film layer 210. An illumination strip 120 is also provided at the edge of the wafer dicing stage 110, and a first polarizer 130 is provided on the light-emitting side of the illumination strip 120 so that the illumination strip 120 emits polarized light towards the adhesive film layer 210 and the edge of the wafer 200. A lens assembly 140 is positioned above the wafer dicing stage 110, and a second polarizer 150 is provided on the light-incident side of the lens assembly 140. The polarization direction of the second polarizer 150 is perpendicular to the polarization direction of the first polarizer 130. The lens assembly 140 can collect the light reflected from the edge of the wafer 200 and filter the polarized light from the adhesive film layer 210, thereby determining the edge position of the wafer 200 and completing the edge-finding and positioning. Compared to existing technologies, this invention utilizes the "directional selectivity" of polarized light to filter out light emitted from the surface of the adhesive film, retaining only diffuse reflection from the edge of the wafer 200, thereby highlighting its outline. Specifically, the provided wafer dicing edge-finding positioning device 100 and wafer 200 dicing equipment utilize an illumination strip 120 and a first polarizer 130 to emit polarized light. After passing through the adhesive film layer 210, the polarization direction of the polarized light remains unchanged and is projected onto the edge of the wafer 200. The solid edge of the wafer 200 will generate diffuse reflection, disrupting the polarization direction. The second polarizer 150 can filter out the light emitted from the adhesive film, retaining only the reflected light from the edge of the wafer 200. Currently, the surface process of the wafer 200 is complex, and the edges may be made smooth, resulting in reflection. The first polarizer 130 can purify the light, and the second polarizer 150 can eliminate reflection and environmental interference, mainly to eliminate the light emitted from the adhesive film, making the outline of the wafer 200 clear and the black-and-white contrast obvious. This allows for clear identification of the wafer 200 outline and accurate identification of the wafer 200 edge, reducing edge-finding anomaly alarms, increasing edge-finding pass rate, and improving subsequent cutting accuracy and yield.
[0046] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. A wafer dicing edge finding positioning apparatus, characterized by, The wafer cutting edge positioning device comprises a wafer cutting table for placing a wafer with a film layer, wherein the back surface of the wafer is arranged at the center of the film layer, and the film layer is placed on the wafer cutting table; a light-emitting lamp strip is arranged at the edge of the wafer cutting table, and the light-emitting side of the light-emitting lamp strip is provided with a first polarizer to make the light-emitting lamp strip emit polarized light towards the film layer and the wafer edge; a lens assembly is arranged above the wafer cutting table, and the light-entering side of the lens assembly is provided with a second polarizer, the polarization direction of the second polarizer is perpendicular to the polarization direction of the first polarizer, and the lens assembly is used to collect the light reflected by the wafer edge and filter the polarized light of the film layer to determine the wafer edge position. The light-emitting lamp strip comprises a plurality of light-emitting lamp strips, and the plurality of light-emitting lamp strips are uniformly distributed at the edge of the wafer cutting table, and each light-emitting lamp strip is used to emit light upwards. The edge of the wafer cutting table is provided with a metal edge which is flush with the table top of the wafer cutting table, and the plurality of light-emitting lamp strips are uniformly embedded in the metal edge, wherein the diameter of the metal edge is greater than the diameter of the wafer. The first polarizer comprises a plurality of first polarizers, and the plurality of first polarizers are correspondingly arranged on the plurality of light-emitting lamp strips, and the first polarizer is flush with the metal edge.
2. The wafer dicing edge finding positioning apparatus of claim 1, wherein, The first polarizer is annular and embedded in the metal edge, and the first polarizer covers the plurality of light-emitting lamp strips at the same time.
3. The wafer dicing edge finding positioning apparatus of claim 2, wherein, The lens assembly comprises an edge searching support, a CCD module and an angle adjusting module, the CCD module is installed on the edge searching support, the angle adjusting module is arranged on the CCD module and is in transmission connection with the second polarizer to drive the second polarizer to rotate.
4. The wafer dicing edge finding positioning apparatus of claim 3, wherein, The lens assembly further comprises an edge searching driving member, the edge searching support is provided with an annular track corresponding to the edge of the wafer cutting table, the CCD module is movably installed on the annular track, and the edge searching driving member is arranged on the edge searching support and is in transmission connection with the CCD module to drive the CCD module to move along the annular track.
5. The wafer dicing edge finding positioning apparatus of claim 3, wherein, The lens assembly further comprises a control unit, the control unit is integrated on the CCD module and is in communication with the light-emitting lamp strip, the control unit is used to control the lens assembly to perform edge searching action, and the light-emitting lamp strip is used to be turned on or turned off under the control of the control unit.
6. The wafer dicing edge finding positioning apparatus of claim 1, wherein, The wafer cutting edge positioning device further comprises a metal ring which is detachably arranged around the wafer cutting table to fix the edge of the film layer, and the metal ring is provided with a light guide member which penetrates through the metal ring and corresponds to the light-emitting lamp strip.
7. The wafer dicing edge finding positioning apparatus of claim 6, wherein, The wafer cutting edge positioning device is arranged on the machine table, the cutting device is installed on the machine table and is located above the wafer cutting table to cut the wafer and the film layer.
8. The wafer dicing edge finding positioning apparatus of claim 6, wherein, 9. The wafer dicing edge finding positioning apparatus of claim 1, wherein, 10. A wafer cutting apparatus characterized by comprising: