Method of manufacturing covering film, covering film, and electronic device including the same

Abstract

A method of manufacturing a cover film, a cover film, and an electronic device including the cover film are disclosed. The method for manufacturing the cover film includes: sequentially arranging an adhesive layer and first release paper in a third direction intersecting with a first direction and a second direction on a protective film parallel to a plane defined by the first direction and the second direction; one part of the first release paper is osculated along the first cutting line; disposing a second release paper on a portion of the adhesive layer exposed by removing the portion of the first release paper; and completely cutting the protective film and the adhesive layer along a third cutting line spaced apart from the first cutting line in an outer edge shape of the protection target.

Description

Technical Field

[0001] One or more embodiments relate to cover films. For example, this disclosure relates to a cover film for protecting cover glass, a method of manufacturing a cover film, and an electronic device including a cover film. Background Technology

[0002] Covering films can be introduced (e.g., applied) to the surface or interior of a variety of protected objects. Protected objects can take many forms, including finished products, consumer-ready products, and / or aftermarket products.

[0003] The covering film can be attached to the surface or interior of the protected object. This attachment can prevent or reduce damage to the protected object from various environmental conditions. For example, the metal contained in the protected object may be corroded by water, moisture, etc., causing malfunctions in the protected object. In addition, physical impacts can cause defects such as cracks in the protected object. Summary of the Invention

[0004] One or more aspects of the embodiments relate to a cover film having enhanced or improved reliability.

[0005] One or more aspects of the embodiments relate to a method of manufacturing a covering film.

[0006] One or more aspects of the embodiments relate to a method for manufacturing an electronic device including a covering film.

[0007] Additional aspects of one or more embodiments of this disclosure will be set forth in the following description, and will be apparent in part from the description or may be learned by practice of this disclosure.

[0008] A method of manufacturing a cover film according to one or more embodiments of the present disclosure includes: sequentially arranging an adhesive layer and a first release substrate in a third direction intersecting the first and second directions on a protective film parallel to a plane defined by a first direction and a second direction intersecting the first direction; cutting a portion of the first release substrate along a first cut line and removing the portion of the first release substrate along the first cut line to expose a portion of the adhesive layer; arranging a second release substrate on the portion of the adhesive layer; and completely cutting the protective film and the adhesive layer along a third cut line spaced apart and / or separated (e.g., spaced apart or separated) from the first cut line to protect the outer edge shape of the target. For example, the method involves sequentially arranging an adhesive layer and a first release substrate on a protective film parallel to a plane defined by a first direction and a second direction intersecting the first direction. This arrangement is performed in a third direction intersecting both the first and second directions. The method includes cutting a portion of the first release substrate along the first cut line and removing that portion to expose a portion of the adhesive layer. The second release substrate is then arranged on the exposed adhesive layer. Finally, the protective film and adhesive layer are completely cut along a third cutting line spaced apart from the first cutting line to protect the outer edge shape of the target. This method is used to manufacture cover films.

[0009] In one or more embodiments, after the protective film and the adhesive layer are completely cut along the third cutting line, in a plan view, the cover film may include: a protective portion that overlaps with the outer edge shape of the protected target; a pull tab portion that protrudes from at least one side of the protective portion; and a stress concentration portion, wherein the stress concentration portion may be a portion where the protective portion and the pull tab portion are connected to each other, and peel stress may be concentrated if (e.g., when) the first release substrate is peeled from the protective film.

[0010] In one or more embodiments, the first cutting line may be spaced apart from and / or separated from the stress concentration portion (e.g., spaced apart or separated).

[0011] In one or more embodiments, the method may further include: after the second release substrate is disposed on the portion of the adhesive layer, cutting a portion of the second release substrate along a second cutting line.

[0012] In one or more embodiments, the second cutting line may be spaced apart from both the first cutting line and the third cutting line (e.g., simultaneously) and / or separated (e.g., spaced apart or separated).

[0013] In one or more embodiments, the second cutting line may be spaced apart from and / or separated from the first cutting line (e.g., spaced apart or separated) by an amount greater than the machining tolerance.

[0014] In one or more embodiments, after the portion of the first release substrate is cut, a first groove may be formed in the protective film in the third-party orientation; after the portion of the second release substrate is cut, a second groove may be formed in the protective film in the third-party orientation; and in a cross-sectional view, the first groove and the second groove may be spaced apart and / or separated from each other (e.g., spaced apart or separated). For example, after the first release substrate is cut, the first groove is formed on the protective film in the third-party orientation. Similarly, after the second release substrate is cut, the second groove is formed in the third-party orientation. In a cross-sectional view, the first groove and the second groove are spaced apart from each other.

[0015] In one or more embodiments, after the protective film and the adhesive layer are completely cut along the third cutting line, in a plan view, the cover film may include a protective portion overlapping the outer edge shape of the protected target and a pull tab portion protruding from at least one side of the protective portion, and the first cutting line may be spaced apart and / or separated from the protective portion (e.g., spaced apart or separated) while overlapping the pull tab portion. For example, after the protective film and the adhesive layer are completely cut along the third cutting line, when viewed in a plan view, the cover film includes a protective portion overlapping the outer edge shape of the protected target and a pull tab portion protruding from at least one side of the protective portion. The first cutting line is spaced apart from the protective portion while overlapping the pull tab portion.

[0016] In one or more embodiments, after the protective film and the adhesive layer are completely cut along the third cutting line, in a plan view, the covering film may include a protective portion that overlaps with the outer edge shape of the protected target and a pull tab portion that protrudes from at least one side of the protective portion, and a portion of the first cutting line may overlap with the protective portion.

[0017] In one or more embodiments, the first release substrate and the second release substrate may be formed of different colors.

[0018] In one or more embodiments, the kissing cut can be performed by a stamping process.

[0019] A cover film according to one or more embodiments of the present disclosure includes: a first release substrate having a surface parallel to a plane defined by a first direction and a second direction intersecting the first direction; an adhesive layer on the first release substrate; and a protective film on the adhesive layer, including a first groove and a second groove formed in a thickness direction parallel to a third direction intersecting the first and second directions, the first groove and the second groove being spaced apart and / or separated from each other (e.g., spaced apart or separated), and being a surface deformation produced by a manufacturing process. For example, the cover film includes a first release substrate having a surface parallel to a plane defined by a first direction and a second direction intersecting the first direction. The adhesive layer is disposed on the first release substrate, and the protective film is disposed on the adhesive layer. The protective film includes a first groove and a second groove, both extending in a thickness direction parallel to a third direction intersecting the first and second directions. The first groove and the second groove are spaced apart from each other and are a surface deformation produced by a manufacturing process.

[0020] In one or more embodiments, in a plan view, the cover film may include: a protective portion that overlaps with the outer edge shape of the protected target; a pull tab portion that protrudes from at least one side of the protective portion; and a stress concentration portion that may be a portion where the protective portion and the pull tab portion are connected to each other, and a peel stress concentration occurs if (e.g., when) the first release substrate is peeled off from the protective film, and the first groove may be spaced apart from and / or separated from the stress concentration portion (e.g., spaced apart or separated).

[0021] In one or more embodiments, in a cross-sectional view, each of the first and second grooves may have a pointed shape in a direction away from the adhesive layer.

[0022] In one or more embodiments, in the cross-sectional view, each of the first groove and the second groove may have a smooth surface.

[0023] An electronic device according to one or more embodiments of the present disclosure includes: a protective target; and a cover film on the protective target, the cover film comprising: a protective film on the protective target, and parallel to a plane defined by a first direction and a second direction intersecting the first direction, and including a first groove and a second groove, the first groove and the second groove being formed in a thickness direction, the first groove and the second groove being spaced apart and / or separated from each other (e.g., spaced apart or separated), and being a surface deformation produced by a manufacturing process; and an adhesive layer for adhering the protective film to the protective target. For example, the electronic device includes a protective target and a cover film on the protective target. The cover film includes a protective film disposed on the protective target, and the protective film includes a first groove and a second groove. The two grooves extend in a thickness direction parallel to a third direction intersecting the first and second directions. The first groove and the second groove are spaced apart from each other and are a surface deformation produced by a manufacturing process. Additionally, the cover film includes an adhesive layer that allows the protective film to adhere to the protective target.

[0024] In one or more embodiments, the cover film may further include: a first release substrate on the adhesive layer, the first release substrate being peeled off before the cover film is adhered to the protected target; in a plan view, the cover film may include: a protective portion overlapping the outer edge shape of the protected target; a pull tab portion protruding from at least one side of the protective portion; and a stress concentration portion, the stress concentration portion being a portion where the protective portion and the pull tab portion are connected to each other, and peeling stress may be concentrated if (e.g., when) the first release substrate is peeled off from the protective film, and the first groove may be spaced apart and / or separated from the stress concentration portion (e.g., spaced apart or separated).

[0025] In one or more embodiments, in a cross-sectional view, each of the first and second grooves may have a pointed shape in a direction away from the adhesive layer.

[0026] In one or more embodiments, in the cross-sectional view, each of the first groove and the second groove may have a smooth surface.

[0027] In one or more embodiments, the protected object includes: a display module including a plurality of pixels; and a housing for housing the display module, and the protected object may be selected from electronic devices for displaying images, wearable electronic devices, and electronic devices for vehicles, each including the display module.

[0028] A cover film according to one or more embodiments of the present disclosure can prevent, minimize, or reduce stress concentration by cutting a substrate (e.g., a first release substrate) at a distance from the outer edge shape of the protected target. Accordingly, a cover film with improved reliability can be provided.

[0029] Alternatively, a cover film can be formed by cutting a shielding element (e.g., a second release substrate) at a certain distance from the cutting position of the substrate. Accordingly, a more reliable cover film can be provided by preventing or reducing the overlap of the cutting lines of the cut.

[0030] Furthermore, the cutting position of the shielding component can be designed by taking into account machining tolerances. Accordingly, it can prevent, minimize, or reduce the shielding component from being cut or cut in the wrong place.

[0031] In addition, the cover film does not require replacement of the substrate and can reduce costs.

[0032] For example, the cover film of this disclosure can prevent or reduce stress concentration by kissing the substrate (e.g., a first release substrate) at a distance from the outer edge shape of the protected object. This technique ensures that stress does not concentrate at the edges, where stress concentration can cause potential damage or failure. By strategically placing the kiss away from critical areas, the reliability of the cover film is significantly enhanced, providing better protection for the object underneath.

[0033] Alternatively, a cover film can be formed by cutting a shielding element (e.g., a second release substrate) at a certain distance from the cut position on the substrate. This method prevents or protects against overlapping cut lines, which would weaken the structure of the cover film. By maintaining a significant distance between cuts, the integrity of the cover film is preserved, resulting in a more durable and reliable product. This method also takes into account manufacturing tolerances to ensure that the cuts are precise and do not unintentionally damage the shielding element.

[0034] Furthermore, the cutting position of the shielding component should be considered in the design of machining tolerances. This consideration helps prevent the shielding component from being cut incorrectly or in unintended locations, which could compromise the effectiveness of the cover film. By carefully planning the cutting position, the manufacturing process becomes more efficient, reduces the likelihood of errors, and improves the overall quality of the cover film.

[0035] Furthermore, cover films do not require substrate replacement, leading to cost savings. By improving manufacturing processes and reducing material waste, cover film production has become more economical. This cost-effective approach benefits both manufacturers and consumers, making high-quality protective films more readily available.

[0036] It should be understood that the foregoing general description and the following detailed description are illustrative and intended to provide further explanation of this disclosure, the scope of which is defined by the appended claims and their equivalents. Attached Figure Description

[0037] The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and form part of this specification, illustrate embodiments of the disclosure and, together with the specification, serve to illustrate the disclosure.

[0038] Figure 1 A block diagram of an electronic device according to one or more embodiments is shown.

[0039] Figure 2 This is a schematic diagram of an electronic device according to one or more embodiments.

[0040] Figure 3 This is a schematic diagram of an electronic device according to one or more embodiments of the present disclosure.

[0041] Figure 4 This is an exploded view used to describe an electronic device according to one or more embodiments of the present disclosure.

[0042] Figure 5 This is a perspective view used to describe the stacked structure of the pre-coated membrane.

[0043] Figure 6 To show from Figure 5 A cross-sectional view of the pre-film with the adhesive layer omitted.

[0044] Figure 7 and Figure 8 A perspective view of a covering film according to one or more embodiments of the present disclosure is provided.

[0045] Figure 9 A plan view of a covering film according to one or more embodiments of the present disclosure is provided.

[0046] Figure 10 For along Figure 9 The cross-sectional view taken from line I-I'.

[0047] Figure 11 A plan view of a covering film according to one or more embodiments of the present disclosure is provided.

[0048] Figure 12 For along Figure 11 The cross-sectional view taken from line II-II'.

[0049] Figure 13 A plan view of a covering film according to one or more embodiments of the present disclosure is provided.

[0050] Figure 14 For along Figure 13 The cross-sectional view taken from line III-III'.

[0051] Figure 15 A plan view illustrating the final shape of a cover film according to one or more embodiments of the present disclosure.

[0052] Figure 16 For along Figure 15 A cross-sectional view taken from line IV-IV'.

[0053] Figure 17 For use in describing Figure 15 A magnified plan view of part A.

[0054] Figure 18 To show the corresponding Figure 17 A magnified plan view of the covering film of the comparative example, part A.

[0055] Figure 19 For along Figure 18 A cross-sectional view taken from line V-V'.

[0056] Figure 20 This is a plan view used to describe a covering film according to one or more embodiments of the present disclosure.

[0057] Figure 21 To show Figure 20 A magnified plan view of part B.

[0058] Figure 22 , Figure 23 , Figure 24 and Figure 25 For use in describing manufacturing Figure 20 A diagram illustrating the method of covering with a membrane. Detailed Implementation

[0059] In the following, embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. The same reference numerals will be used for the same parts in the drawings, and repeated descriptions of the same parts will not be provided.

[0060] The display device according to one or more embodiments can be applied to various electronic devices. The electronic device according to one or more embodiments includes the aforementioned display device and may include modules or devices with other additional functions besides the display device.

[0061] Figure 1 A block diagram of an electronic device according to one or more embodiments is shown.

[0062] refer to Figure 1 An electronic device EA according to one or more embodiments may include a display module 11, a processor 12, a memory 13, and a power module 14.

[0063] The processor 12 may include a central processing unit (“CPU”), an application processor (“AP”), a graphics processing unit (“GPU”), a communication processor (“CP”), an image signal processor (“ISP”), and / or a controller.

[0064] The data required for the operation of the processor 12 or the display module 11 can be stored in the memory 13. When the processor 12 executes the application stored in the memory 13, image data signals and / or input control signals are transmitted to the display module 11, and the display module 11 can process the received signals and output image information through the display screen.

[0065] The power module 14 may include a power supply module such as a power adapter and / or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power expected or required for the operation of the electronic device EA.

[0066] At least one of the components of the electronic device EA described above may be included in the display device according to the above embodiments. Additionally, some of the individual modules functionally included in a single module may be included in the display device, and other modules may be provided separately from the display device. For example, the display device may include display module 11, and processor 12, memory 13, and power module 14 may be provided as another device in the electronic device EA besides the display device.

[0067] Figure 2 This is a schematic diagram of an electronic device according to one or more embodiments.

[0068] refer to Figure 2 The display device according to one or more embodiments is applied to one or more suitable electronic devices, including not only electronic devices for image display such as smartphones 10_1a, tablet PCs 10_1b, laptops 10_1c, televisions 10_1d, and desktop monitors 10_1e, but also wearable electronic devices including display modules such as smart glasses 10_2a, head-mounted displays 10_2b, and smartwatches 10_2c, as well as vehicle electronic devices 10_3 including display modules such as vehicle instrument panels, central dashboards, central information displays (“CID”) located on the dashboard, and interior mirror displays.

[0069] Figure 3 and Figure 4 A diagram is provided for illustrating an electronic device according to one or more embodiments of the present disclosure.

[0070] refer to Figure 3 and Figure 4 According to one or more embodiments, the electronic device EA may include a housing EDC. A mounting slot may be defined (e.g., formed) within the housing EDC. A protected object (e.g., a display device DD) may be accommodated within the space defined by the mounting slot (e.g., inside the housing EDC). For example, the protected object may be a display device DD including a display module DM. The protected object may be one or more suitable electronic devices including a display device DD. Although Figure 3 Electronic device 10_1a is illustrated, but this disclosure is not limited thereto. As described above, electronic device EA can be implemented in one or more suitable forms.

[0071] According to one or more embodiments, the protective film PF can be adhered to the protected target. According to one or more embodiments, the cover film for removing the release paper may include the protective film PF disposed on the protected target and an adhesive layer for allowing the protective film PF to adhere to the protected target. As will be described in more detail below, the protective film PF may include a first groove and a second groove formed in the thickness direction, spaced apart and / or separated from each other (e.g., spaced apart or separated), and is a surface deformation caused by the manufacturing process.

[0072] Reference Figure 5 and Figure 5 The following figures describe the covering membrane in more detail.

[0073] The protective film PF may include a shape that corresponds to the outer edge of the protected target (e.g., see [reference]). Figure 13 The protective portion overlaps with the ED. For example, the display device DD may include a window module WM and a display module DM.

[0074] The display module DM may include a display area DA and a peripheral area BZA.

[0075] Multiple pixels PX may be arranged in the display area DA. The front surface may refer to the surface on which light emitted from the pixels PX displays an image. The front surface may be defined by a first direction DR1 and a second direction DR2. The rear surface may be closer to the housing EDC than the front surface. The front and rear surfaces may be spaced apart and / or separated from each other in a third direction DR3 (e.g., spaced apart or separated).

[0076] In the following text, for ease of description, the third direction DR3 will also be referred to as the thickness direction. For example, the first direction DR1, the second direction DR2, and the third direction DR3 may intersect or cross each other. For example, the first direction DR1, the second direction DR2, and the third direction DR3 may be orthogonal to each other (e.g., perpendicular).

[0077] However, this disclosure is not limited thereto. For example, images may also be displayed on the rear surface. In this case, the housing EDC may be formed of a transparent material.

[0078] The peripheral area BZA may be around the display area DA (e.g., surrounding the display area DA). For example, the shape of the display area DA may be substantially defined by the peripheral area BZA.

[0079] A window module (WM) may include multiple layers. For example, a window module (WM) may include a substrate, a light-blocking pattern, a window protective layer, an adhesive layer, etc.

[0080] For example, the substrate may include a material with high light transmittance. For example, the substrate may include glass.

[0081] A window protective layer may be disposed on the substrate. An adhesive layer may be disposed between the window protective layer and the substrate. The adhesive layer allows the window protective layer to adhere to the substrate.

[0082] A light-blocking pattern may be disposed under the substrate. The light-blocking pattern may include dyes, pigments, etc. The light-blocking pattern may be formed by a coating scheme (e.g., a method). The light-blocking pattern may overlap with the surrounding area BZA. However, this disclosure is not limited thereto. For example, the light-blocking pattern may include other materials. Additionally, the light-blocking pattern may be formed (e.g., using) other suitable schemes (e.g., methods). The light-blocking pattern may overlap with a portion of the display area DA. Alternatively, the light-blocking pattern may be disposed on the substrate.

[0083] The window module (WM) can minimize or reduce the stress applied to the display module (DM). Additionally, the window module (WM) can prevent or substantially prevent external moisture from penetrating into the display module (DM).

[0084] Descriptions of display devices and electronic devices have been provided for illustrative purposes. The protective target to which the cover film adheres may be a display device and / or one or more suitable electronic devices including the display device.

[0085] The following will primarily describe a method for forming a cover film including an adhesive layer and a window protective layer contained in a window module WM, the cover film, and an electronic device including the cover film.

[0086] Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 and Figure 17 A diagram illustrating a method for manufacturing a covering film according to one or more embodiments of the present disclosure.

[0087] refer to Figure 5 and Figure 6 According to one or more embodiments, a preparative film CFO (S100) can be formed by sequentially arranging an adhesive layer AL and a first release paper (e.g., a release substrate or release film) LI1 on a protective film PF.

[0088] For example, Figure 5 This is a perspective view used to describe the stacked structure of the pre-membrane CF0, and Figure 6 To show from Figure 5The cross-sectional view of the pre-film CF0 omits the adhesive layer AL. For ease of description, the adhesive layer AL may also be omitted from the cross-sectional view below.

[0089] According to one or more embodiments, the protective film PF, the adhesive layer AL, and the first release paper LI1 may be parallel to the plane defined by the first direction DR1 and the second direction DR2. The protective film PF, the adhesive layer AL, and the first release paper LI1 may be arranged sequentially on the third direction DR3. According to one or more embodiments, the first release paper LI1 may have a surface parallel to the plane defined by the first direction DR1 and the second direction DR2.

[0090] According to one or more embodiments, a protective film PF may be disposed on a protected target. According to one or more embodiments, the protective film PF may comprise transparent glass or plastic. For example, the protective film PF may comprise ultrathin tempered glass (“UTG”), polyethylene terephthalate (“PET”), polyimide (“PI”), polyethersulfone (“PS”), polyacrylate (“PAR”), polyetherimide (“PEI”), polyethylene naphthalate (“PEN”), polyphenylene sulfide (“PPS”), polyacrylate, polycarbonate (“PC”), polyarylethersulfone, etc. However, this disclosure is not limited thereto. For example, the protective film PF may comprise a variety of suitable materials, including thermoplastics or curable (e.g., curable or cured) materials (e.g., thermosetting materials, room temperature curing materials, radiation-curable (e.g., radiation-curable or cured) materials, etc.). Additionally, for example, the PET included in the protective film PF may be recycled material.

[0091] The adhesive layer AL allows the first release paper LI1 to adhere to the protective film PF. After the first release paper LI1 is removed, the adhesive layer AL allows the protective film PF to adhere to the protected target. According to one or more embodiments, the adhesive layer AL may include an adhesive material. For example, the adhesive layer AL may include an optically clear adhesive (“OCA”), an optically clear adhesive resin (“OCR”), a pressure-sensitive adhesive (“PSA”), etc. For example, the adhesive layer AL may include an adhesive composition, a photoinitiator, a curing agent, other additives, etc. However, this disclosure is not limited thereto.

[0092] According to one or more embodiments, a first release paper LI1 can be removed (e.g., peeled off) before the protective film PF adheres to the protected target. For example, the first release paper LI1 may comprise a material formed by performing a release treatment on one surface of a plastic film. For example, the release agent used for the release treatment may include alkyd release agents, silicone release agents, fluorinated release agents, unsaturated ester release agents, polyolefin release agents, wax release agents, etc. However, this disclosure is not limited thereto.

[0093] For example, the protected object may be a glass type (or type) window module WM used in display devices such as mobile phones and tablet computers. However, this disclosure is not limited to this. For example, the protected object may be a window module WM, which includes tempered glass (e.g., ultra-thin tempered glass (“UTG”)), polyethylene terephthalate (“PET”) (e.g., hard-coated PET, non-hard-coated PET, or recycled PET), polyimide (“PI”), polyethersulfone (“PS”), polyacrylate (“PAR”), polyetherimide (“PEI”), polyethylene naphthalate (“PEN”), polyphenylene sulfide (“PPS”), polyarylate, polycarbonate (“PC”), polyarylethersulfone, thermoplastic, cured material, etc. For example, Figure 5 and Figure 6 The preparatory film CF0 may be illustrative (e.g., shown as an example). The preparatory film CF0 may comprise two or more layers from a variety of suitable layers, or some of the aforementioned components may be omitted or replaced. For example, the preparatory film CF0 may comprise various additional layers, such as a waterproof coating, an antistatic layer, and a hard coating (e.g., anti-fingerprint, shockproof, etc.).

[0094] In addition, although Figure 5 A protective film PF, an adhesive layer AL, and a first release paper LI1 are shown, but this disclosure is not limited thereto. For example, the protective film PF, the adhesive layer AL, and / or the first release paper LI1 may comprise multiple layers. For example, the pre-film CF0 may have a structure in which the protective film PF and the adhesive layer AL are alternately stacked as multiple layers. In one or more embodiments, an additional release paper may be disposed on the first release paper LI1.

[0095] refer to Figure 7 , Figure 8 , Figure 9 and Figure 10 According to one or more embodiments, a portion of the first release paper LI1 (e.g., the first removal area RP1 and the second removal area RP2) may be cut and removed along the first cutting line CL1 (S200). Therefore, the first portion PA1 of the adhesive layer overlapping the first removal area RP1 and the second removal area RP2 may be exposed to the outside.

[0096] For example, Figure 7 and Figure 8 To show in Figure 9 The plan view includes a portion of the second removal area RP2 (see...). Figure 9 A perspective view of (dotted lines). Figure 10 For along Figure 9 The cross-sectional view taken from line I-I'.

[0097] For example, although Figure 9The illustration shows two removal region RPs, but this disclosure is not limited thereto. For example, one removal region RP or three or more removal region RPs may be provided.

[0098] A kissing cut (also known as a half-cut) refers to a process that cuts only one of two or more layers. A kissing cut can be distinguished from a full cut that cuts all two or more layers.

[0099] The kiss-cut process can also be distinguished from the half-cut process, which removes only a portion of a layer (e.g., if (e.g., when) viewed in cross-section, only a portion (e.g., half) of the first release paper LI1 in the thickness direction is removed).

[0100] According to one or more embodiments, the kiss-cutting process can be performed by a stamping process. The kiss-cutting process can be a process of stamping a first release paper LI1 disposed on a protective film PF to facilitate the peeling of the first release paper LI1 (the first release paper LI1 may also be referred to as a substrate).

[0101] For example, a processing procedure (e.g., a stamping process) can be performed by a press PR and a retainer. The press PR can apply pressure (e.g., stamping) to the pre-film CF0 to remove a portion of the first release paper LI1. In this case, the retainer can hold the pre-film CF0 in place so that the pre-film CF0 is not shaken (or moved, for example, during the stamping process).

[0102] The precision of the kissing process can vary depending on the shape of the extrusion surface of the press PR, the distribution of forces caused by stress concentration during the processing (e.g., stamping process), and the precision of the upward and downward movement of the press PR (i.e., movement in the third direction DR3 and in the direction opposite to the third direction DR3).

[0103] For example, such as Figure 10 As shown, the press PR can apply pressure (e.g., stamping) to the pre-film CF0 (e.g., the first release paper LI1) to remove the pressure-applied portion of the first release paper LI1. Subsequently, surface deformation caused by the manufacturing process (i.e., the processing process (e.g., the stamping process)) can be generated on the protective film PF.

[0104] For example, according to one or more embodiments, after a portion of the first release paper LI1 is cut, a surface deformation (e.g., a first groove KC1) may be formed in the protective film PF in a direction opposite to the third direction DR3. The first groove KC1 may be a groove formed by a press PR applying a force in a direction opposite to the third direction DR3. Accordingly, the first groove KC1 may have a pointed shape in a direction away from the adhesive layer (i.e., in a direction opposite to the third direction DR3).

[0105] According to one or more embodiments, the surface of the first groove KC1 formed in the protective film PF can be smooth. For example, if processing is performed using a laser, carbonized foreign matter or the like can be found on the processed surface. Additionally, the processed surface may be uneven due to the heat generated by the laser. However, carbonized foreign matter or the like is not found on the processed surface of the first groove KC1 formed by extrusion using a mold or die (i.e., formed by a processing technology (e.g., stamping process)), and the processed surface can be smooth. That is, compared to related technical processes using a laser to form the first groove, the first groove formed using a press (e.g., by a stamping process) according to one or more embodiments of this disclosure has a smooth surface and no carbonized foreign matter or the like and / or uneven surface.

[0106] However, this disclosure is not limited thereto. For example, the cross-sectional shape of the first groove KC1 may vary depending on the shape of the extrusion surface of the press PR, etc.

[0107] The pressure used to form the first groove KC1 can be appropriately selected according to the desired depth of the first groove KC1. For example, if (e.g., when) the pressure is too high compared to the set or design value (e.g., excessive cutting), the depth of the first groove KC1 (e.g., the length on the third-direction DR3) can be increased. Accordingly, the protective film PF may be easily torn.

[0108] When the pressure is set to be less than the set or design value to minimize or reduce the depth of the first groove KC1, the first release paper LI1 may not be peeled off (e.g., without cutting).

[0109] An additional kissing-cutting process can be performed on the pre-prepared membrane CF0 that has been determined to be uncut (e.g., with insufficient cut depth). Therefore, a first groove KC1 can be found in the pre-prepared membrane CF0 that has already undergone (e.g., experienced) a kissing-cutting process at the location overlapping with the press PR. For example, the first groove KC1 can be found (e.g., detected) by the eye (e.g., visually), a camera, etc.

[0110] refer to Figure 8 , Figure 9 , Figure 11 and Figure 12 According to one or more embodiments, a second release paper LI2 (e.g., release substrate or release film) may be disposed on the adhesive layer AL (S300).

[0111] For example, Figure 12 For along Figure 11 A cross-sectional view taken from line II-II'. After the first release paper LI1 is cut, the first portion of the adhesive layer AL (e.g., Figure 8The first portion PA1 may be exposed to the outside. The second release paper LI2 may overlap the first portion PA1. For example, the second release paper LI2 may cover the first portion PA1 exposed to the outside of the adhesive layer AL.

[0112] For example, the second release paper LI2 can be used to fix the pull tab portion, which will be described in more detail, so that the pull tab portion will not easily separate (e.g., from the second release paper LI2).

[0113] According to one or more embodiments, the first release paper LI1 and the second release paper LI2 can be formed in different colors. For example, the first release paper LI1 can be transparent, and the second release paper LI2 can be black (the second release paper LI2 can also be referred to as a blocking element). Accordingly, the distinction of the second release paper LI2 can be enhanced. However, this disclosure is not limited thereto. The second release paper LI2 can be transparent or translucent. In addition, the second-first release paper LI21 and the second-second release paper LI22 can also be formed in different colors, or they can be formed in substantially the same color.

[0114] For example, if (e.g., when) the primary processing cover film CF11 includes two removal regions RP1 and RP2, then the primary processing cover film CF11 may include two second release papers LI21 and LI22. The second-first release paper LI21 may be arranged in the first removal region RP1. The second-second release paper LI22 may be arranged in the second removal region RP2. However, this disclosure is not limited thereto. The number of second release papers LI2 may vary depending on the number of removal regions RP.

[0115] refer to Figure 9 , Figure 13 and Figure 14 According to one or more embodiments, a portion of the second release paper LI2 may be cut along the second cutting line CL2 (S400).

[0116] For example, Figure 14 For along Figure 13 The cross-sectional view taken from line III-III'.

[0117] As mentioned above, the kiss-cutting process can be the process of cutting the second release paper LI2 (i.e., only one layer).

[0118] For example, a press PR can apply pressure (e.g., punching) to remove the pressure-applied portion of the second release paper LI2. According to one or more embodiments, after this portion of the second release paper LI2 is removed, a second groove KC2 can be formed in a protective film PF.

[0119] According to one or more embodiments, the press PR can apply force in a direction opposite to the third direction DR3, such that the second groove KC2 can have a pointed shape in the direction opposite to the third direction DR3. For example, if (e.g., when) viewed in cross-section, the second groove KC2 can have a pointed shape in a direction away from the adhesive layer AL when the press PR applies force to the second release paper LI2. The processed surface of the second groove KC2 formed by a processing process (e.g., stamping process) can be smooth.

[0120] The pressure used to form the second groove KC2 can be appropriately selected according to the desired depth of the second groove KC2. For example, if (e.g., when) the pressure is too high compared to a set or design value (e.g., overcutting), the depth of the second groove KC2 can be increased. Accordingly, the protective film PF may be easily torn. When the pressure is set to be less than the set or design value (e.g., no cutting) to minimize or reduce the depth of the second groove KC2, a portion of the second release paper LI2 may not be removed (e.g., it may be difficult to remove a portion of the second release paper LI2). An additional kiss-cutting process can be performed on the secondary processing cover film CF12 that is determined to be uncut (e.g., insufficient cutting depth). Therefore, the first groove KC1 and the second groove KC2 can be found in the secondary processing cover film CF12 that has already undergone (e.g., experienced) the kiss-cutting process.

[0121] According to one or more embodiments, the second cutting line CL2 may be connected to the first cutting line, which will be described in more detail (see [link to documentation]). Figure 9 CL1) and the third cutting line (see CL1) and the third cutting line (see CL1) Figure 15 The first groove KC1 and the second groove KC2 may be spaced apart and / or separated (e.g., spaced apart or separated) when viewed in cross-section, for example, according to one or more embodiments.

[0122] According to one or more embodiments, the second cutting line CL2 may be spaced apart from and / or separated from the first cutting line CL1 by an amount greater than the machining tolerance. The first groove KC1 and the second groove KC2 may have a third gap G3. For this purpose, the press PR may be arranged such that... Figure 10 The first cutting line CL1 of the first kiss-cutting process S200 and Figure 14 The second cutting line CL2 of the second kissing process S400 may have a set or predetermined interval (i.e., a third gap G3) and may perform a processing process (e.g., a stamping process).

[0123] For example, the set or predetermined interval (i.e., the third gap G3) can be designed to reflect the machining tolerance of the press PR. For example, slight errors may occur in the machining process (e.g., stamping). Machining tolerance can refer to the range of fluctuations (e.g., errors) that may occur in the manufacturing process. For example, if (e.g., when) machining tolerances are not considered, the accuracy of the machining (e.g., stamping) may be reduced. Accordingly, the second release paper LI2 may not be able to be cut, or may be cut in the wrong position.

[0124] As mentioned above, if (for example, when) a portion of the second release paper LI2 is not removed, an additional kiss-cutting process may be performed, which may increase the production time per unit (e.g., processing time).

[0125] If processing (e.g., stamping) is performed in the wrong location, the protective film PF may be torn if (e.g., when) the second release paper LI2 is peeled off.

[0126] A third gap G3 between the first groove KC1 and the second groove KC2 (e.g., a set or predetermined interval between the first cutting line CL1 and the second cutting line CL2) can be considered (or selected) to uniformly (e.g., substantially uniformly) and accurately remove a portion of the second release paper LI2. The third gap G3 between the first groove KC1 and the second groove KC2 can be set in various ways, taking into account the tolerances of the press PR and the thickness and characteristics of the processing target.

[0127] For example, if (e.g., when) the machining tolerance of the press PR is about 0.1 mm, then the first cutting line CL1 and the second cutting line CL2 can be set to have a set or predetermined interval of more than about 0.1 mm. For example, this set or predetermined interval can be set to about 0.2 mm. Accordingly, even if (e.g., when) machining tolerances (e.g., fluctuations) occur, a portion of the second release paper LI2 can be removed more stably. However, this disclosure is not limited thereto. For example, the values ​​can vary depending on the size of the protected target, the physical properties of the processed target, etc.

[0128] For example, pre-testing can be performed to set settings or predetermined intervals. However, this disclosure is not limited to this. For example, settings or predetermined intervals can be modified in real time.

[0129] refer to Figure 9 , Figure 13 , Figure 15 , Figure 16 and Figure 17According to one or more embodiments, the protective film PF and the adhesive layer AL may be completely cut along a third cutting line CL3, which is spaced apart from and / or separated (e.g., spaced apart or separated) from the first cutting line CL1, to protect the outer edge shape ED of the target (S500). Accordingly, a cover film CFA according to one or more embodiments may be completed.

[0130] For example, Figure 15 A plan view showing the final shape of the covering membrane. Figure 16 For along Figure 15 A cross-sectional view taken from line IV-IV'. Figure 17 For use in describing Figure 15 A magnified plan view of part A.

[0131] According to one or more embodiments, after the protective film PF and the adhesive layer AL are completely cut along the third cutting line CL3, if (e.g., when) viewed in a plane (e.g., in a plan view), the cover film CFA may include a protective portion PP that overlaps with the outer edge shape ED of the protected target, a pull tab portion TP (e.g., in which a portion of a second release paper LI2 including a second-1 release paper LI21 and a second-2 release paper LI22) protruding from at least one side of the protective portion PP, and a stress concentration portion SC.

[0132] For example, the outer edge shape ED of the protected target (i.e., the final shape of the cover membrane CFA) may include a portion with rapidly changing curvature. Hereinafter, for ease of description, the portion with rapidly changing curvature will also be referred to as the stress concentration section SC.

[0133] According to one or more embodiments, the stress concentration section SC may be the portion where the protective portion PP and the pull tab portion TP are connected to each other. The stress concentration section SC may have geometric discontinuities. Accordingly, if (e.g., when) the first release paper LI1 is peeled from the protective film PF, the peeling stress may be concentrated at the stress concentration section SC. For example, the final shape of the cover film CFA can be formed by performing a processing process (e.g., a stamping process) on the protective film PF on the third-direction DR3. An additional groove can be formed by a processing process (e.g., a stamping process). The additional groove may have a pointed shape on the third-direction DR3. To minimize or reduce stress concentration, according to one or more embodiments, the first cutting line CL1 may be spaced apart and / or separated from the protective portion PP (e.g., spaced apart or separated) while overlapping with the pull tab portion TP. For example, the stress concentration section SC and the first groove KC1 (or the first cutting line CL1) may be spaced apart and / or separated from each other (e.g., spaced apart or separated). For example, the processing steps (e.g., stamping) used to form the first groove KC1 can be performed at a location that is spaced apart from and / or separated from (e.g., spaced apart or separated from) the first gap G1 by the outer edge shape ED. Because the stress concentration portion SC and the first groove KC1 are spaced apart from and / or separated from each other (e.g., spaced apart or separated from each other), the weakening of tensile strength can be prevented or minimized or reduced if (e.g., when) the first release paper LI1 is peeled off.

[0134] According to one or more embodiments, both the first groove KC1 and the second groove KC2 may extend in a thickness direction parallel to the third direction DR3. According to one or more embodiments, the first groove KC1 and the second groove KC2 may be spaced apart from each other and / or separated (e.g., spaced apart or separated). For example, the processing technology (e.g., stamping process) for forming the second groove KC2 may be performed at a location spaced apart from and / or separated from the first groove KC1 (e.g., spaced apart or separated) by the third gap G3. Because the first groove KC1 and the second groove KC2 are spaced apart from each other and / or separated (e.g., spaced apart or separated), tearing of the pull portion TP can be prevented or minimized or reduced if (e.g., when) the first release paper LI1 is peeled off. For example, the second groove KC2 may also be spaced apart from and / or separated from the stress concentration portion SC (e.g., spaced apart or separated) by the second gap G2, thereby preventing or minimizing or reducing the weakening of tensile strength if (e.g., when) the first release paper LI1 is peeled off.

[0135] When viewed in a plane (e.g., in a plan view), the pull tab portion TP may protrude from at least one side of the protective portion PP. For example, although the figures (e.g., Figure 17 The diagram shows that the pull tab portion TP is formed only on one side, but a cover film CF1 may include multiple pull tab portions TP.

[0136] Figure 18 and Figure 19This is a diagram used to illustrate the effects of this disclosure.

[0137] For example, Figure 18 To show the corresponding Figure 17 A magnified plan view of part A of the covering film CF' according to the comparative example. Figure 19 For along Figure 18 A cross-sectional view taken from line V-V'.

[0138] For example, in the case of the cover film according to the comparative example, the kiss-cutting process can be provided without replacing the release paper (e.g., the first release paper LI1). In this case, the cost of replacing the release paper and the time and additional resources required for compatibility testing with existing films can be incurred.

[0139] refer to Figure 18 and Figure 19 For example, in the case of the cover film CF' according to the comparative example, the first cut line CL1' and the third cut line CL3' may overlap each other. For example, release paper (e.g., Figure 16 The first release paper LI1 can be stamped to overlap with the stress concentration portion SC of the outer edge shape ED of the protected target. Accordingly, the stress concentration portion SC and the first groove KC1 can overlap each other.

[0140] For example, if the stress concentration area SC and the first groove KC1 overlap, the uniformity of the overlapping surfaces may be reduced. Consequently, the strength of the protective film PF may be weakened (e.g., in the overlapping area). Consequently, if the release paper is peeled off, the force may not be dispersed, and the tensile strength (e.g., in the overlapping area) may be weaker than in other areas, making the protective film PF easily torn.

[0141] Tensile strength can refer to the strength of an object under tensile force if (e.g., when) it is pulled. For example, the tensile strength of the protective film PF can be defined by measuring how much tensile force the protective film PF can withstand before it is torn, when (e.g., when) a clamp included in a peeling device pulls the release liner. For example, as the tensile strength of the protective film PF decreases (e.g., becomes lower), the protective film PF can be more easily torn in the peel direction PD.

[0142] If the protective film (PF) is torn, and if (for example, when) the torn portion is caught in the equipment, the torn portion may damage the equipment. Consequently, production efficiency may decrease, and additional costs may be incurred. Furthermore, if (for example, when) the torn portion is visually identified, the product's appearance may be compromised, potentially reducing user satisfaction. Moreover, the torn portion may fail to protect the target (e.g., a protective film with a torn portion may not effectively protect the target).

[0143] Additionally, if a processing procedure (e.g., a stamping process) is performed without setting the degree to which the first cutting line CL1 and the second cutting line CL2 are spaced apart and / or separated from each other (e.g., spaced apart or separated), the stamping may be performed at a location not designed according to processing tolerances.

[0144] Furthermore, if the processing technology (e.g., stamping) is performed without setting a degree to which the first cutting line CL1 and the second cutting line CL2 are spaced apart and / or separated (e.g., spaced apart or separated), the first cutting line CL1 and the second cutting line CL2 may overlap each other. In this case, the first groove KC1 created by the first cutting line CL1 and the second groove KC2 created by the second cutting line CL2 may overlap each other. As mentioned above, if (e.g., when) the first groove KC1 and the second groove KC2 overlap each other, the strength of the protective film PF may be weakened. Accordingly, if (e.g., when) the release paper (e.g., the first release paper LI1) is peeled off, the force may not be dispersed, and the tensile strength may be weaker than the tensile strength of other areas, making the protective film PF and / or the pull tab TP prone to tearing. For example, if (e.g., when) a cut is performed along the first cut line CL1', a tear CR may occur in the protective portion PP or a tear ER may occur in the pull portion TP during the stamping process for attaching the second release paper (e.g., the shield).

[0145] However, as Figure 16 and Figure 17 As shown, in one or more embodiments of the covering film according to this disclosure (e.g., Figure 16 In the case of a cover film (CFA), the first release paper LI1 does not need to be replaced. Accordingly, the cost of replacing the release paper and the time and additional resources required for compatibility testing with existing films can be saved.

[0146] According to one or more embodiments, the first cutting line CL1, the second cutting line CL2 and the third cutting line CL3 may be spaced apart and / or separated from each other (e.g., spaced apart or separated).

[0147] The first release paper LI1 can be stamped to not overlap with the stress concentration portion SC of the outer edge shape ED of the protected target. Accordingly, the stress concentration portion SC and the first groove KC1 can be spaced apart and / or separated (e.g., spaced apart or separated) from each other in the first gap G1. For example, because the stress concentration portion SC and the first groove KC1 are spaced apart and / or separated (e.g., spaced apart or separated), the strength and durability of the protective film PF can be increased. Accordingly, a cover film CFA with improved reliability can be provided, which is prevented or substantially prevented from tearing, etc.

[0148] Additionally, the degree to which the first cutting line CL1 and the second cutting line CL2 are spaced apart and / or separated from each other (e.g., spaced apart or separated) can be set. For example, the first groove KC1 created by the first cutting line CL1 and the second groove KC2 created by the second cutting line CL2 can be spaced apart and / or separated from each other (e.g., spaced apart or separated) by a third gap G3. As described above, the third gap G3 can be set to be greater than the processing tolerance. Accordingly, the accuracy of the processing technology (e.g., stamping process) can be further improved. Furthermore, since the first cutting line CL1 and the second cutting line CL2 are spaced apart and / or separated from each other (e.g., spaced apart or separated), tearing of the protective film PF and / or the pull tab TP can be prevented, minimized, or reduced if (e.g., when) the release paper (e.g., the first release paper LI1) is peeled off.

[0149] Additionally, the second cutting line CL2 and the third cutting line CL3 may also be spaced apart and / or separated from each other (e.g., spaced apart or separated). For example, the second groove KC2 may be spaced apart and / or separated from the stress concentration portion SC (e.g., spaced apart or separated) from the second gap G2. Accordingly, tearing of the protective film PF can be further prevented or reduced.

[0150] Figure 20 This is a plan view used to describe a covering film according to one or more embodiments of the present disclosure. Figure 21 To show Figure 20 A magnified plan view of part B. Figure 22 , Figure 23 , Figure 24 and Figure 25 For use in describing manufacturing Figure 20 A diagram illustrating the method of covering with a membrane. Figure 25 For along Figure 20 The cross-sectional view taken from line VI-VI'.

[0151] For ease of description, the references above will be omitted or simplified in the following text. Figures 1 to 19 The redundant description of the CFA covering membrane is described.

[0152] For example, Figures 5 to 17 CFA and the covering film Figures 20 to 25 The difference between the cover film CFB and the first cut line CL1 is that the first cut line CL1 is different from the first cut line CL1. Figures 5 to 17 The protective portion PP in the cover film CFA does not overlap, while a portion of the first cut line CL11 is with Figures 20 to 25 The protective portion PP' in the cover film CFB overlaps. Correspondingly, although the kiss line (corresponding to the first groove KC1) caused by the first cutting line CL1 and... Figure 16 The protective parts PP in the middle do not overlap, but Figure 20 A portion of the tangent line may overlap with the protective portion PP'. However, Figures 20 to 25 The CFB covering film can be combined with Figures 5 to 17 The CFA covering film is basically the same / similar, and the similarities are as follows: Figures 20 to 25 In the cover film CFB, the kissing lines (e.g., the first groove KC1 and the second groove KC2) do not overlap each other, and complete cuts (e.g., the third cut line CL3 and the stress concentration portion SC defined by the third cut line CL3) are performed, while being spaced apart from and / or separated from the kissing lines (e.g., spaced apart or separated).

[0153] refer to Figure 5 , Figure 6 , Figure 7 , Figure 20 and Figure 21 According to one or more embodiments, the cover film CFB may include a protective film PF, an adhesive layer AL, and a first release paper LI1.

[0154] According to one or more embodiments, the protective film PF, the adhesive layer AL, and the first release paper LI1 may be parallel to the plane defined by the first direction DR1 and the second direction DR2. The protective film PF, the adhesive layer AL, and the first release paper LI1 may be arranged sequentially on the third direction DR3.

[0155] A protective film PF can be disposed on the protected target. An adhesive layer AL allows a first release paper LI1 to adhere to the protective film PF. After the first release paper LI1 is removed, the adhesive layer AL allows the protective film PF to adhere to the protected target. However, since the above configuration is provided for illustrative purposes, the cover film CFB may further include one or more suitable layers, or some of the components may not be provided / replaced.

[0156] and Figure 5 and Figure 6 Similarly, a preparative film CF0 (S100) can be formed by sequentially arranging an adhesive layer AL and a first release paper LI1 on a protective film PF.

[0157] refer to Figure 21 and Figure 22 According to one or more embodiments, a portion of the first release paper LI1 may be cut along the first cutting line CL11 (S200'). Accordingly, the adhesive layer (e.g., Figure 5 The portion of the adhesive layer AL that overlaps with the removed portion of the first release paper LI1 may be exposed to the outside. According to one or more embodiments, a portion of the first cutting line CL11 may overlap with the protective portion PP'.

[0158] According to one or more embodiments, the kissing cut can be performed by a stamping process. The kissing cut process can be a process of stamping a first release paper LI1 disposed on a protective film PF to facilitate the peeling of the first release paper LI1.

[0159] According to one or more embodiments, after a portion of the first release paper LI1 is cut, a surface deformation (e.g., a first groove KC1) may be formed in the protective film PF in a direction opposite to the third direction DR3. The first groove KC1 may be a groove formed by a press PR applying a force in a direction opposite to the third direction DR3. Accordingly, the first groove KC1 may have a pointed shape in a direction away from the adhesive layer (i.e., in a direction opposite to the third direction DR3).

[0160] According to one or more embodiments, the surface of the first groove KC1 formed in the protective film PF can be smooth. For example, if processing is performed using a laser, carbonized foreign matter or the like can be found on the processed surface. Additionally, the processed surface may be uneven due to the heat generated by the laser. However, carbonized foreign matter or the like may not be found on the processed surface of the first groove KC1 formed by extrusion using a mold or die (i.e., formed by a processing technology (e.g., stamping process)), and the processed surface can be smooth. That is, compared to related technical processes that use a laser to form the first groove, the first groove formed using a press (e.g., by a stamping process) according to one or more embodiments of this disclosure has a smooth surface and no carbonized foreign matter or the like and / or uneven surface.

[0161] The first groove KC1 can be found in the cover film that has undergone (e.g., experienced) a kissing process at the location where it overlaps with the press PR. For example, the first groove KC1 can be found (e.g., detected) by the eye (e.g., visually), a camera, etc.

[0162] refer to Figure 20 , Figure 21 and Figure 23 According to one or more embodiments, the second release paper (e.g., release substrate or release film) Figure 20 LI2 and Figure 23 LI22) can be arranged in the first exposed portion PA1 of the adhesive layer AL (see example). Figure 8 (S300')

[0163] For example, the second release paper LI2 may cover the exposed first portion PA1 of the adhesive layer AL. According to one or more embodiments, the first release paper LI1 and the second release paper LI2 may be formed of different colors. For example, the first release paper LI1 may be transparent, and the second release paper LI2 may be black. However, this disclosure is not limited thereto.

[0164] refer to Figure 20 , Figure 21 and Figure 24According to one or more embodiments, a portion of the second release paper LI2 may be cut along the second cutting line CL2 (S400').

[0165] For example, similar to the first groove KC1, the second groove KC2 may also have a pointed shape in the direction opposite to the third direction DR3 if (e.g., when) the press PR applies force in the direction opposite to the third direction DR3. For example, according to one or more embodiments, the second groove KC2 may be formed in the protective film PF in the direction opposite to the third direction DR3 after a portion of the second release paper LI2 has been cut.

[0166] The pressure used to form the second groove KC2 can be appropriately selected according to the desired depth of the second groove KC2. For example, if (e.g., when) the pressure is too high compared to the set or design value (e.g., overcutting), the depth of the second groove KC2 can be increased. Accordingly, the protective film PF may be easily torn. If (e.g., when) the pressure is set to be less than the set or design value (e.g., no cutting) to minimize or reduce the depth of the second groove KC2, a portion of the second release paper LI2 may not be removed (e.g., it may be difficult to remove a portion of the second release paper LI2). An additional kiss-cutting process can be performed on processing targets determined to be uncut (e.g., insufficient cutting depth). Therefore, the first groove KC1 and the second groove KC2 can be found in the cover film that has undergone the kiss-cutting process.

[0167] According to one or more embodiments, the second cutting line CL2 may be spaced apart from both the first cutting line CL11 and the third cutting line CL3 (e.g., simultaneously) and / or separated (e.g., spaced apart or separated). For example, according to one or more embodiments, if (e.g., when) viewed in cross-section, the first groove KC1 and the second groove KC2 may be spaced apart from each other and / or separated (e.g., spaced apart or separated).

[0168] According to one or more embodiments, the second cutting line CL2 may be spaced apart from and / or separated from the first cutting line CL11 by an amount greater than the machining tolerance. The first groove KC1 and the second groove KC2 may have a third gap G3'. For this purpose, the press PR may be arranged such that... Figure 22 The first cutting line CL11 (corresponding to the first groove KC1) of the first kiss-cutting process S200' and Figure 24 The second cutting line CL2 (corresponding to the second groove KC2) of the second kissing process S400' may have a set or predetermined interval (i.e., a third gap G3') and may perform a processing process (e.g., a stamping process).

[0169] For example, the set or predetermined interval (i.e., the third gap G3') can be designed to reflect the machining tolerance of the press PR. For example, slight errors may occur in the machining process (e.g., stamping process). Machining tolerance can refer to the range of fluctuations (e.g., errors) that may occur in the manufacturing process. For example, if (e.g., when) machining tolerances are not considered, the accuracy of the machining (e.g., stamping) may be reduced. Accordingly, the second release paper LI2 may not be cut, or may be cut in the wrong position. As mentioned above, if (e.g., when) a portion of the second release paper LI2 is not removed, an additional kiss-cutting process may be performed, which may increase the production time per unit (e.g., machining time). In the case of machining (e.g., stamping) being performed in the wrong position, if (e.g., when) the second release paper LI2 is peeled off, the protective film PF may be torn.

[0170] A third gap G3' between the first groove KC1 and the second groove KC2 (e.g., a set or predetermined interval between the first cutting line CL11 and the second cutting line CL2) can be considered to uniformly (e.g., substantially uniformly) and accurately remove a portion of the second release paper LI2. The third gap G3' between the first groove KC1 and the second groove KC2 can be set in various ways, taking into account the tolerances of the press PR and the thickness and characteristics of the processing target.

[0171] Similar to Figure 13 , Figure 14 and Figure 15 ,refer to Figure 20 , Figure 21 and Figure 25 According to one or more embodiments, the protective film PF and the adhesive layer AL may be completely cut along a third cutting line CL3, which is spaced apart from and / or separated (e.g., spaced apart or separated) from the first cutting line CL11, to protect the outer edge shape ED of the target (S500'). Accordingly, it is possible to complete Figure 20 The covering film CFB.

[0172] According to one or more embodiments, after the protective film PF and the adhesive layer AL are completely cut along the third cutting line CL3, the cover film CFB may include a protective portion PP' that overlaps with the outer edge shape ED of the protected target, a pull tab portion TP that protrudes from at least one side of the protective portion PP', and a stress concentration portion SC.

[0173] For example, the outer edge shape ED of the protected target may include a portion with rapidly changing curvature. This rapidly changing curvature portion may also be referred to as a stress concentration point SC. According to one or more embodiments, the stress concentration point SC may be the portion where the protective portion PP' and the pull tab portion TP are connected to each other. The stress concentration point SC may have geometric discontinuities. Accordingly, if (e.g., when) the first release paper LI1 is peeled from the protective film PF, the peeling stress may be concentrated at the stress concentration point SC.

[0174] To minimize or reduce stress concentration, according to one or more embodiments, the first cutting line CL11 may be spaced apart and / or separated from the protective portion PP' (e.g., spaced apart or separated) while overlapping with the pull tab portion TP. For example, the stress concentration portion SC and the first groove KC1 may be spaced apart and / or separated from each other (e.g., spaced apart or separated). For example, the processing technology (e.g., stamping process) for forming the first groove KC1 may be performed at a location spaced apart and / or separated from the outer edge shape ED (e.g., spaced apart or separated) by the first gap G1'. Because the stress concentration portion SC and the first groove KC1 are spaced apart and / or separated from each other (e.g., spaced apart or separated), the weakening of tensile strength can be prevented or minimized or reduced if (e.g., when) the first release paper LI1 is peeled off.

[0175] According to one or more embodiments, the first groove KC1 and the second groove KC2 may be spaced apart and / or separated from each other (e.g., spaced apart or separated). For example, the processing technology (e.g., stamping process) for forming the second groove KC2 may be performed at a position spaced apart and / or separated from the first groove KC1 (e.g., spaced apart or separated) by a third gap G3'. Because the first groove KC1 and the second groove KC2 are spaced apart and / or separated from each other (e.g., spaced apart or separated), tearing of the pull tab TP, etc., can be prevented, minimized, or reduced if (e.g., when) the first release paper LI1 is peeled off.

[0176] According to one or more embodiments, the first release paper LI1 can be cut while being separated from and / or separated (e.g., spaced apart or separated) from the portions (i.e., stress concentration portions SC) that are connected to each other, such as the protective portion PP' and the pull portion TP. According to one or more embodiments, the first cutting line CL11 can partially overlap with the protective portion PP'.

[0177] In one or more embodiments of the present disclosure, the covering film (e.g., Figure 15 CFA or covering film Figure 20 In the case of a cover film (CFB), the first release paper LI1 does not need to be replaced. Accordingly, the cost of replacing the release paper and the time and additional resources required for compatibility testing with existing films can be saved.

[0178] According to one or more embodiments, the first cutting line CL11, the second cutting line CL2 and the third cutting line CL3 may be spaced apart and / or separated from each other (e.g., spaced apart or separated).

[0179] The first release paper LI1 can be stamped to prevent overlap with the stress concentration portion SC of the outer edge shape ED of the protected target. Accordingly, the stress concentration portion SC and the first groove KC1 can be spaced apart and / or separated from each other (e.g., spaced apart or separated). For example, because the stress concentration portion SC and the first groove KC1 are spaced apart and / or separated from each other (e.g., spaced apart or separated), the strength and durability of the protective film PF can be increased. Accordingly, a cover film CFB with improved reliability can be provided, which is prevented or substantially prevented from tearing, etc.

[0180] Additionally, the degree to which the first cutting line CL11 and the second cutting line CL2 are spaced apart and / or separated from each other (e.g., spaced apart or separated) can be set. For example, the first groove KC1 created by the first cutting line CL11 and the second groove KC2 created by the second cutting line CL2 can be spaced apart and / or separated from each other (e.g., spaced apart or separated) by a third gap G3'. As mentioned above, the third gap G3' can be set to be greater than the processing tolerance. Accordingly, the accuracy of the processing technology (e.g., stamping process) can be further improved. Furthermore, because the first cutting line CL11 and the second cutting line CL2 are spaced apart and / or separated from each other (e.g., spaced apart or separated), tearing of the protective film PF and / or the pull tab TP can be prevented, minimized, or reduced if (e.g., when) the release paper (e.g., the first release paper LI1) is peeled off.

[0181] Additionally, the second cutting line CL2 and the third cutting line CL3 may also be spaced apart and / or separated from each other (e.g., spaced apart or separated). For example, the second groove KC2 may be spaced apart and / or separated from the stress concentration portion SC (e.g., spaced apart or separated) from the second gap G2'. Accordingly, tearing of the protective film PF can be further prevented or reduced.

[0182] Additionally, the first cutting line CL11 and the third cutting line CL3 may be spaced apart and / or separated from each other (e.g., spaced apart or separated). For example, the stress concentration portion SC may be spaced apart and / or separated from the first groove KC1 (e.g., spaced apart or separated) from the first gap G1'. Accordingly, tearing of the protective film PF can be further prevented or reduced.

[0183] When a covering film is formed ( Figure 15 CFA and Figure 20 When finalizing the CFB (Cover Film), additional grooves with pointed shapes can be formed on the third-direction DR3. The first groove KC1 and the second groove KC2 can be spaced apart and / or separated from the additional grooves (e.g., spaced apart or separated), thereby providing a cover film with improved reliability. Figure 15CFA and Figure 20 (CFB).

[0184] The cover film and method of manufacturing the cover film according to the exemplary embodiments of this disclosure can be applied to the manufacturing process of display devices included in computers (e.g., laptop computers), mobile phones, smartphones, smart tablets, PMPs, PDAs, MP3 players, etc.

[0185] In the accompanying drawings, the dimensions of each structure may be enlarged for clarity of this disclosure. It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various components, these components should not be limited by these terms. These terms are used only to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of the exemplary embodiments of this disclosure. As used herein, the singular forms “a” and “described” are intended to also include the plural forms, unless the context clearly indicates otherwise.

[0186] In this application, it will be understood that the terms "comprising," "having," etc., specify the presence of features, quantities, steps, operations, components, parts, or combinations thereof disclosed in the specification, but do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, parts, or combinations thereof.

[0187] Additionally, it will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it may be directly on the other element, or an intervening element may be present.

[0188] When describing embodiments of this disclosure, the word "may" refers to "one or more embodiments of this disclosure". As used herein, the term "and / or" includes any and all combinations of one or more of the associated enumerated items.

[0189] As used herein, the terms “substantially,” “about,” and similar terms are used as approximations, not as terms of degree, and are intended to take into account the inherent biases of measured or calculated values ​​that would be recognized by one of ordinary skill in the art. As used herein, “about” or “approximation” includes the stated value and means within an acceptable range of deviation for a particular value, determined by one of ordinary skill in the art considering the measurement in question and the errors associated with the measurement of that particular quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within ±30%, 20%, 10%, or 5% of the stated value.

[0190] Any numerical ranges listed herein are intended to include all subranges with the same numerical precision contained within the listed range. For example, the range “1.0 to 10.0” is intended to include all subranges between the listed minimum value 1.0 and the listed maximum value 10.0 (and including both the listed minimum value 1.0 and the listed maximum value 10.0), i.e., a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as 2.4 to 7.6. Any maximum numerical limit listed herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit listed in this specification is intended to include all higher numerical limits contained therein. Accordingly, the applicant reserves the right to amend the specification (including the claims) to expressly list any subranges contained within the ranges expressly listed herein.

[0191] Electronic devices, display devices, manufacturing apparatuses for electronic devices and / or display devices, and / or any other related devices or components according to embodiments of the invention described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, various components of the device may be formed on an integrated circuit (IC) chip or on a separate IC chip. Furthermore, various components of the device may be implemented on a flexible printed circuit film, a tape-on-a-chip (TCP), a printed circuit board (PCB), or formed on a substrate. Furthermore, various components of the device may be processes or threads that run on one or more processors in one or more computing devices, execute computer program instructions, and interact with other system components to perform the various functions described herein. The computer program instructions are stored in memory, which may be implemented in the computing device using standard memory devices, such as random access memory (RAM). The computer program instructions may also be stored in other non-transitory computer-readable media, such as CD-ROMs, flash drives, etc. Moreover, those skilled in the art will recognize that the functions of various computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed across one or more other computing devices without departing from the scope of embodiments of this disclosure.

[0192] Although the foregoing description has been made with reference to one or more embodiments of the present disclosure, it will be understood that those skilled in the art can modify and alter the present disclosure in one or more suitable ways within the scope of the spirit and field of the present disclosure as defined by the claims and their equivalents.

Claims

1. A method of manufacturing a cover film, comprising: arranging, on a protective film in parallel with a plane defined by a first direction and a second direction intersecting the first direction, in a third direction intersecting the first direction and the second direction, a first release substrate and an adhesive layer in this order; kiss-cutting a portion of the first release substrate along a first cutting line, and removing the portion of the first release substrate along the first cutting line to expose a portion of the adhesive layer; arranging a second release substrate on the portion of the adhesive layer; and completely cutting the protective film and the adhesive layer in an outer edge shape of a protection target along a third cutting line spaced apart from the first cutting line. after the completely cutting the protective film and the adhesive layer along the third cutting line, in a plan view, 2. The method of claim 1, wherein, the cover film includes: a protective portion overlapping the outer edge shape of the protection target; a tab portion protruding from at least one side of the protective portion; and a stress concentration portion, wherein the stress concentration portion is a portion where the protective portion and the tab portion are connected to each other, and wherein, when the first release substrate is peeled from the protective film, a peeling stress is concentrated in the stress concentration portion.

3. The method according to claim 2, wherein the first cutting line is spaced apart from the stress concentration portion.

4. The method according to claim 1, further comprising: after the arranging the second release substrate on the portion of the adhesive layer, kiss-cutting a portion of the second release substrate along a second cutting line.

5. The method according to claim 4, wherein the second cutting line is spaced apart from both the first cutting line and the third cutting line.

6. The method according to claim 5, wherein the second cutting line is spaced apart from the first cutting line by an amount greater than a processing tolerance. after the kiss-cutting the portion of the first release substrate, a first groove is formed in the protective film in the third direction, 7. The method of claim 4, wherein, after the kiss-cutting the portion of the second release substrate, a second groove is formed in the protective film in the third direction, and, in a cross-sectional view, the first groove and the second groove are spaced apart from each other. after the completely cutting the protective film and the adhesive layer, in a plan view, the cover film includes a protective portion overlapping the outer edge shape of the protection target and a tab portion protruding from at least one side of the protective portion, and 8. The method of claim 1, wherein, a portion of the first cutting line overlaps the protective portion while overlapping the tab portion. after the completely cutting the protective film and the adhesive layer, in a plan view, the cover film includes a protective portion overlapping the outer edge shape of the protection target and a tab portion protruding from at least one side of the protective portion, and 9. The method of claim 1, wherein, a portion of the first cutting line overlaps the protective portion.

10. The method according to claim 1, wherein the first release substrate and the second release substrate are formed in different colors.

11. The method according to any one of claims 1 to 10, wherein the kiss-cutting is performed by a punching process.

12. A cover film, comprising: ​ a first release substrate having a surface parallel to a plane defined by a first direction and a second direction intersecting the first direction; an adhesive layer on the first release substrate; and a protective film on the adhesive layer, the protective film including a first groove and a second groove, both of the first groove and the second groove extending in a thickness direction parallel to a third direction intersecting the first direction and the second direction, wherein the first groove and the second groove are spaced apart from each other and are surface deformations resulting from a manufacturing process.

13. The cover film of claim 12, wherein, In a plan view, the cover film includes: a protection portion overlapping an outer edge shape of the protection target; a pull tab portion protruding from at least one side of the protection portion; and a stress concentration portion at which the protection portion and the pull tab portion are connected, wherein when the first release substrate is peeled from the protective film, a peeling stress is concentrated at the stress concentration portion, and the first groove is spaced apart from the stress concentration portion.

14. The cover film of claim 12, wherein, In a cross-sectional view, each of the first groove and the second groove has a sharp shape in a direction away from the adhesive layer.

15. The cover film of claim 14, wherein, In the cross-sectional view, each of the first groove and the second groove has a smooth surface.

16. An electronic device comprising: a protection target; and a cover film on the protection target, the cover film including: a protective film on the protection target and parallel to a plane defined by a first direction and a second direction intersecting the first direction, the protective film including a first groove and a second groove, both of the first groove and the second groove extending in a thickness direction parallel to a third direction intersecting the first direction and the second direction, wherein the first groove and the second groove are spaced apart from each other and are surface deformations resulting from a manufacturing process; and an adhesive layer for adhering the protective film to the protection target.

17. The electronic device according to claim 16, wherein the cover film further includes: a first release substrate on the adhesive layer, the first release substrate being peeled off before adhering the cover film to the protection target, wherein, in a plan view, the cover film includes: a protection portion overlapping an outer edge shape of the protection target; a pull tab portion protruding from at least one side of the protection portion; and a stress concentration portion at which the protection portion and the pull tab portion are connected, and wherein when the first release substrate is peeled from the protective film, a peeling stress is concentrated at the stress concentration portion, and the first groove is spaced apart from the stress concentration portion. 18.The electronic device of claim 16, wherein, In a cross-sectional view, each of the first groove and the second groove has a sharp shape in a direction away from the adhesive layer. 19.The electronic device of claim 18, wherein, In the cross-sectional view, each of the first groove and the second groove has a smooth surface.

20. The electronic device according to any one of claims 16 to 19, wherein the protection target includes: a display module including a plurality of pixels; and a housing accommodating the display module, and wherein the protection target is selected from among an electronic device for displaying an image, a wearable electronic device, and an electronic device for a vehicle each including the display module.

Images