Film tension control method for imprint device, imprint method, and imprint device

Abstract

The invention discloses a film tension control method of an imprint device, an imprint method and an imprint device. An embodiment of the present invention provides a film tension control method for an imprint apparatus, comprising: (A) a step of disposing a film capable of forming a mold on a stage; (B) measuring the tension (T) of the film; (C) a step in which the film is disposed parallel to the upper surface of the stage; and (D) a step in which, while the film is disposed parallel to the upper surface of the stage, a second roller supporting the film is raised to control the tension of the film, the tension of the film being the tension T in the step (C) and the step (D).

Description

TECHNICAL FIELD

[0001] The present invention relates to a film tension control method for surely controlling tension of a film to prevent deformation of the film in an imprint apparatus using the film, an imprint method and apparatus in which a process of forming a working mold and a process of forming a pattern on a substrate are performed as a series of processes. BACKGROUND

[0002] Methods of forming a circuit pattern in a semiconductor, an LCD, a biochip, a printed circuit board, etc. include photo lithography and an imprint method. The imprint method is a method of transferring a pattern by pressing a mold having a concave-convex structure against a liquid resin or the like on a substrate, and is classified into a photo-imprint and a thermal-imprint, etc. If the imprint method is used, a fine pattern of nanometers (nm) to micrometers (μm) can be realized, and a pattern can be formed on a substrate of various sizes from 4 inches to 12 inches, etc. and various materials such as metal, silicon, sapphire, glass, etc.

[0003] As one of methods of performing the imprint method, a working mold can be formed on a polymer film to be transferred to a substrate as a continuous process. As such an apparatus, there are an imprint apparatus for forming a working mold on a film using a master mold and an imprint apparatus for transferring a pattern to a substrate using a working mold formed on a film.

[0004] When a working mold is formed on a film or a working mold formed on a film is transferred to a substrate in the imprint apparatus, it is necessary to align the working mold and the substrate at a predetermined position and press them against each other. However, in a process of moving the working mold or the substrate to be set in a transfer apparatus or to be pressed against each other, the working mold and the substrate can not be located at an accurate position due to various factors.

[0005] In particular, a film can be deformed by applying tension to the film during the imprint process. In this case, when the film is deformed, a position of the working mold formed on the film is deformed to make it difficult to align the working mold and the substrate.

[0006] In addition, when the imprint apparatus for forming a working mold on a film using a master mold and the imprint apparatus for transferring a pattern to a substrate using a working mold formed on a film are configured as separate apparatuses, alignment of the working mold and the substrate becomes difficult or it is necessary to perform an alignment step separately in the separate imprint apparatuses.

[0007] In this case, if the mold and the substrate are pressed against each other in a state of not being aligned at an accurate position, a defect occurs in which a pattern is not transferred to a predetermined accurate position of the resin. SUMMARY

[0008] An object of embodiments of the present invention is to surely control tension of a film in an imprint apparatus and prevent deformation of the film.

[0009] Further, an object of embodiments of the present invention is to form a work mold by a series of processes and form a pattern on a substrate.

[0010] An object of embodiments of the present invention is to surely control tension of a film in an imprint apparatus and prevent deformation of the film.

[0011] An object of embodiments of the present invention is to surely control tension of a film in an imprint apparatus and prevent deformation of the film.

[0012] An object of embodiments of the present invention is to surely control tension of a film in an imprint apparatus and prevent deformation of the film.

[0013] An object of embodiments of the present invention is to surely control tension of a film in an imprint apparatus and prevent deformation of the film.

[0014] An object of embodiments of the present invention is to surely control tension of a film in an imprint apparatus and prevent deformation of the film.

[0015] An object of embodiments of the present invention is to surely control tension of a film in an imprint apparatus and prevent deformation of the film.

[0016] An object of embodiments of the present invention is to surely control tension of a film in an imprint apparatus and prevent deformation of the film.

[0017] An object of embodiments of the present invention is to surely control tension of a film in an imprint apparatus and prevent deformation of the film.

[0018] An embodiment of the present application provides a film tension control method of an imprint apparatus, the resin cured being a work mold having the pattern.

[0019] An embodiment of the present application provides a film tension control method of an imprint apparatus, the resin cured being a work mold having the pattern.

[0020] An embodiment of the present application provides a film tension control method of an imprint apparatus, the resin cured being a work mold having the pattern.

[0021] An embodiment of the present application provides a film tension control method of an imprint apparatus, the tension of the film in the (J) step being the tension T.

[0022] An embodiment of the present application provides a film tension control method of an imprint apparatus, further comprising a step of aligning positions of the work mold and the substrate between the (D) step and the (H) step.

[0023] An embodiment of the present application provides a film tension control method of an imprint apparatus, the tension T being 1 kgf to 10 kgf.

[0024] An embodiment of the present application provides a film tension control method of an imprint apparatus, further comprising a step of (K) pressing the film against the stage to transfer a pattern to a resin coated on a coated material after the (D) step, the first roller being raised and the film being disposed above the stage to be inclined at a predetermined angle with respect to the top surface of the stage after the (K) step.

[0025] An embodiment of the present application provides a film tension control method of an imprint apparatus, the second roller being a float roller.

[0026] An embodiment of the present application provides a film tension control method of an imprint apparatus, comprising: (A) a step of disposing a film having a tension T on a stage to be inclined with respect to the top surface of the stage; (B) a step of disposing the film to be parallel with the top surface of the stage; and (C) a step of controlling the tension of the film while the film is disposed to be parallel with the top surface of the stage, the tension of the film in the (B) step and the (C) step being substantially the same as the tension T.

[0027] An embodiment of the present invention provides an imprint method, comprising: (A') a step of arranging a film attached with a first mold having a predetermined pattern on a stage at a predetermined distance from the stage; (B') a step of placing a first substrate coated with a resin on the stage; (C') a step of moving a first roller and a second roller arranged along a moving path of the film in opposite directions to each other to arrange the film adjacent to and parallel with the upper surface of the stage; (D') a step of pressing the film arranged parallel with the upper surface of the stage against the resin to transfer the pattern of the first mold to the resin; (E') a step of curing the resin to which the pattern is transferred; (F') a step of separating the first mold from the cured resin by moving the first roller and the second roller in opposite directions to each other to separate the film from the stage at a predetermined distance; (G') a step of discharging the first substrate separated from the first mold from the stage; (H') a step of placing a second substrate coated with a resin on the stage from which the first substrate is discharged; and (I') a step of repeating the steps (C') to (F') for the second substrate.

[0028] An embodiment of the present invention provides an imprint method, in the step (C'), the first roller is lowered to arrange the film adjacent to and parallel with the upper surface of the stage, and the second roller is raised to control the tension of the film, in the step (F'), the first roller is raised to separate the film from the stage at a predetermined distance, and the second roller is lowered to control the tension of the film.

[0029] An embodiment of the present invention provides an imprint method, in the step (A'), the film is arranged on the stage at a predetermined angle α with respect to the upper surface of the stage, in the step (C'), the first roller is lowered to lower a predetermined position of the film toward the stage, so that the angle α is reduced, and in the step (F'), the first roller is raised to raise the predetermined position of the film from the stage, so that the angle α is increased.

[0030] An embodiment of the present invention provides an imprint method, the first roller is a film angle adjusting roller, and the second roller is a floating roller.

[0031] An embodiment of the present invention provides an imprint method, the imprint method further comprises a step of recognizing and aligning the position of the first mold by using a first camera arranged on one side of the stage.

[0032] An embodiment of the present invention provides an imprint method, the imprint method further comprises a step of recognizing and aligning the position of the first substrate placed on the stage by using a second camera arranged on the other side of the stage.

[0033] An embodiment of the present application provides an imprint method, wherein the second camera recognizes the position of the first substrate during the first camera recognizes the position of the first mold.

[0034] An embodiment of the present application provides an imprint method, wherein the film is moved by a predetermined distance along the movement path, and the first mold is separated from the stage, and after the first mold is separated from the stage, a second mold is attached to the film disposed on the stage, between the (G') step and the (H') step.

[0035] An embodiment of the present application provides an imprint method, wherein the film is moved along the movement path while the second roller is fixed at a predetermined position.

[0036] An embodiment of the present application provides an imprint method, wherein the third roller presses the film while moving at a level of rolling contact, in the (D') step.

[0037] An embodiment of the present application provides an imprint apparatus, comprising: a film supply portion that can supply a film; a film recovery portion that can recover the film supplied from the film supply portion; a transfer portion that is disposed between the film supply portion and the film recovery portion on a movement path of the film; and a control portion that can control driving of the transfer portion, the transfer portion including: a stage that can accommodate a master mold and a substrate; a pressurizing member that is disposed on the stage and can press the film on the stage; a resin curing portion that is disposed on the stage and can cure resin applied to the master mold and the substrate; a first roller that is disposed on the movement path of the film and can move up and down to dispose the film adjacent to and parallel with an upper surface of the stage; a second roller that can move in a direction opposite to the first roller in correspondence with movement of the first roller so that tension of the film can be controlled; and a sensor that can measure the tension of the film.

[0038] An embodiment of the present application provides an imprint apparatus, wherein the second roller can be moved so that the tension of the film is maintained at a predetermined value.

[0039] An embodiment of the present application provides an imprint apparatus, wherein the second roller can be raised to control the tension of the film during the first roller is lowered to dispose the film adjacent to and parallel with an upper surface of the stage, and the second roller can be lowered to control the tension of the film during the first roller is raised to separate the film from the stage by a predetermined distance.

[0040] An embodiment of the present invention provides an imprinting apparatus that can form a job mold in which a pattern of a master mold is transferred when the master mold is placed on a stage, attached to a film when the film is placed on the stage, and can transfer the pattern of the job mold to a resin coated on a substrate when the substrate is placed on the stage.

[0041] An embodiment of the present invention provides an imprinting apparatus in which the second roller is a floating roller.

[0042] An embodiment of the present invention provides an imprinting apparatus in which the sensor is a load cell disposed between the first roller and the second roller on a moving path of the film.

[0043] An embodiment of the present invention provides an imprinting apparatus further comprising a first pinch roller disposed between the sensor and the second roller on a moving path of the film, and a second pinch roller disposed between the second roller and a film recovery unit on the moving path of the film.

[0044] An embodiment of the present invention provides an imprinting apparatus in which the film can be disposed on the stage to be inclined by a predetermined angle a with respect to an upper surface of the stage, the first roller is lowered and a predetermined position of the film is lowered toward the stage, so that the angle a can be decreased, and the first roller is raised and the predetermined position of the film is raised from the stage, so that the angle a can be increased.

[0045] An embodiment of the present invention provides an imprinting apparatus in which the pressure applying unit can apply pressure to the film while moving horizontally in a rolling contact.

[0046] An embodiment of the present invention provides an imprinting apparatus in which the transfer unit further comprises a first camera disposed on one side of the stage and recognizing a position of a job mold attached to the film.

[0047] An embodiment of the present invention provides an imprinting apparatus in which the transfer unit further comprises a second camera disposed on the other side of the stage and recognizing a position of a substrate placed on the stage.

[0048] An embodiment of the present invention provides an imprinting apparatus in which the second camera can recognize the position of the substrate during the first camera recognizes the position of the job mold.

[0049] According to an embodiment of the present invention, it is possible to certainly control tension of a film in an imprinting apparatus and prevent deformation of the film.

[0050] In addition, according to an embodiment of the present invention, it is possible to prevent deformation of the film, thereby preventing deformation of a job mold formed on the film.

[0051] Furthermore, according to embodiments of the present invention, film deformation can be prevented, thereby increasing transfer precision and efficiency and shortening operation time.

[0052] Furthermore, according to embodiments of the present invention, the roll-to-roll film forming die can be reused, thereby improving the die's reusability.

[0053] Furthermore, according to embodiments of the present invention, the roll-to-plate process is used under atmospheric conditions, thus eliminating the need for a vacuum environment, simplifying the structure of the device, and reducing the device size.

[0054] In addition, according to embodiments of the present invention, deformation of the working mold can be prevented in the mold forming process and the pattern forming process, thereby executing the mold forming process and the pattern forming process as a series of processes.

[0055] Furthermore, according to embodiments of the present invention, an integrated apparatus is realized that can perform mold forming process and pattern forming process in a series of processes, thereby improving the precision of the transfer process.

[0056] In addition, according to embodiments of the present invention, by using a camera to align with the material to be coated, the precision of the process can be improved and the defect rate reduced. Attached Figure Description

[0057] Figure 1 This is a diagram that briefly illustrates an embossing apparatus according to an embodiment of the present invention.

[0058] Figure 2 This is a diagram that briefly illustrates the preparation state of the mold forming process of the embossing apparatus according to an embodiment of the present invention.

[0059] Figure 3 Yes Figure 2 A magnified view of part A.

[0060] Figure 4 This is a diagram that briefly illustrates the transfer steps of the mold forming process of the embossing apparatus according to an embodiment of the present invention.

[0061] Figure 5 Yes Figure 4 A magnified view of part B.

[0062] Figure 6 This is a diagram that briefly illustrates the demolding steps of the mold forming process of the embossing apparatus according to an embodiment of the present invention.

[0063] Figure 7 Yes Figure 6 A magnified view of part C.

[0064] Figure 8 This is a diagram that briefly illustrates the preparation state of the pattern forming process of the embossing apparatus according to an embodiment of the present invention.

[0065] Figure 9 Yes Figure 8 A magnified view of part D.

[0066] Figure 10 This is a diagram that briefly illustrates the transfer steps of a pattern forming process in an embossing apparatus according to an embodiment of the present invention.

[0067] Figure 11 Yes Figure 10 A magnified view of part E.

[0068] Figure 12 This is a simplified cross-sectional view of the stage with the lower camera mounted on it.

[0069] Figure 13 This is a diagram that briefly illustrates the demolding steps of the pattern forming process of the embossing apparatus according to an embodiment of the present invention.

[0070] Figure 14 Yes Figure 13 A magnified view of part of F.

[0071] Figure 15 This is a diagram that briefly illustrates the film recycling step of the pattern forming process of the embossing apparatus according to an embodiment of the present invention.

[0072] Figure 16 This is a flowchart of a membrane tension control method according to an embodiment of the present invention.

[0073] Figure 17 This is a flowchart of an embossing method for pattern formation according to an embodiment of the present invention.

[0074] (Explanation of reference numerals in the attached diagram)

[0075] 100: Imprinting device

[0076] 102: Membrane Supply Department

[0077] 104: Transfer Printing Department

[0078] 106: Membrane Recycling Department

[0079] 108: Stage

[0080] 110: Impression Roller

[0081] 111: Membrane clamp

[0082] 112: Resin Curing Section

[0083] 114: Up with a camera

[0084] 115: Lower camera

[0085] 116: Force sensor

[0086] 118: Membrane angle adjustment roller

[0087] 119: Demolding roller

[0088] 120: Floating roller

[0089] 122-1, 122-2, 122-3, 122-4, 122-5: Guide rollers

[0090] 124: Membrane recycling pinch roller

[0091] 130: Filming route

[0092] 131: Pallet

[0093] 132: Filming Guidance Department

[0094] 134: Reflector Detailed Implementation

[0095] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the accompanying drawings. Identical or similar components will be given the same reference numerals, and repeated descriptions thereof will be omitted. In the following description of embodiments according to the present invention, when referring to layers (films), regions, patterns, or structures formed "on" or "under" the layers (films), regions, patterns, or structures, both "on" and "under" include formation "directly" or "indirectly" involving other layers.

[0096] Furthermore, the references for each layer—above / below, below / below, left / right, right / right, vertical (vertical), and horizontal (horizontal)—are explained based on the accompanying drawings. For ease of explanation and clarity, the thickness or dimensions of each layer in the drawings are exaggerated, omitted, or simplified. Additionally, the dimensions of each component do not fully reflect the actual dimensions.

[0097] In this description, expressions such as “including,” “possessing,” or “constituting” are used to refer to a characteristic, number, step, work, element, part or combination thereof, and shall not be construed as the existence or possibility of one or more other characteristics, numbers, steps, work, elements, part or combination thereof, other than those described.

[0098] Furthermore, terms such as "first" and "second" can be used to describe various constituent elements, but the aforementioned constituent elements are not limited by these terms. These terms are used only for the purpose of distinguishing one constituent element from others.

[0099] Additionally, the term "about" indicates the typical error range of various values ​​that is readily known to those skilled in the art. Alternatively, "about" may indicate within ±0.5% or a maximum of 1% of the indicated value. Or, "about" may indicate measurement error due to limitations of the measurement method.

[0100] Furthermore, when describing the embodiments disclosed in this specification, detailed descriptions of related well-known technologies are omitted if they are deemed to obscure the gist of the embodiments disclosed in this specification.

[0101] The accompanying drawings are provided only to facilitate an understanding of the embodiments disclosed in this specification. The technical concepts disclosed in this specification are not limited by the accompanying drawings and should be understood to include all modifications, equivalents, and substitutions contained within the concept and scope of this invention.

[0102] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0103] Figure 1 This is a diagram that briefly illustrates an embossing apparatus according to an embodiment of the present invention.

[0104] Reference Figure 1 According to an embodiment of the present invention, the imprinting apparatus 100 includes a control unit 101, a film supply unit 102, a transfer unit 104, and a film recycling unit 106.

[0105] Imprinting is a process that uses a mold to form fine patterns of nanometer to micrometer size on the surface of a substrate. Imprinting can use a master mold to form patterns on the substrate surface. Alternatively, a replica mold can be created from the master mold and used to form patterns on the substrate surface. Or, a working mold can be created from the replica mold and used to form patterns on the substrate surface. In embodiments of the present invention, the term "mold" can be used to refer to a master mold, a replica mold, and a working mold. Furthermore, master molds, replica molds, and working molds can be used interchangeably.

[0106] To perform a continuous embossing process, the embossing apparatus 100 according to an embodiment of the present invention may be an apparatus that forms a working mold on roll-to-roll film. The roll-to-roll film, as a flexible film having a predetermined width and length wound around a rotating roller, may have one end in the longitudinal direction wound to a rewinder and the other end in the longitudinal direction wound to an unwinder. The roll-to-roll film may be a continuous film moving from the unwinder to the rewinder.

[0107] The imprinting apparatus 100 according to an embodiment of the present invention may be an imprinting apparatus (die-forming apparatus) that uses a master mold in a film-forming working die (die-forming process) or an imprinting apparatus (pattern-forming apparatus) that uses a working die formed on a film to transfer a pattern onto a substrate (pattern-forming process). Alternatively, the imprinting apparatus 100 may be an imprinting apparatus that performs both the die-forming process and the pattern-forming process in one apparatus. When the imprinting apparatus performs both the die-forming process and the pattern-forming process in one apparatus, separate components for die loading and unloading are not required. Furthermore, a robot for handling the die is not required, thus automation can be easily achieved.

[0108] The membrane according to embodiments of the present invention can be a polymer membrane such as PC (polycarbonate), PET (polyethylene terephthalate), PEN (polyethylenenaphthalene), or PI (polyimide). Alternatively, the membrane can be a transparent material that transmits light (e.g., visible light and / or ultraviolet light).

[0109] The control unit 101 controls the driving of each component of the printing apparatus 100, such as the film supply unit 102, the transfer unit 104, and the film recycling unit 106.

[0110] A film supply unit 102 is disposed at one end of the film and functions to unwind the film. The film supply unit 102 supplies film for processes involving forming a working die on the film (die-forming process) or for transferring a pattern onto a substrate using a working die formed on the film (pattern-forming process). The film wound around the film supply unit 102 is a film without a working die. The film supply unit 102 supplies film to the transfer unit 104. The film supply unit 102 may also include a protective film winding unit (not shown). The protective film winding unit removes the protective film attached to the film to rewind it.

[0111] A film recycling section 106 is disposed at the other end of the film and serves to recycle the film by winding it up. If multiple pattern forming processes are performed using a working die, the working die reaches its service life limit. The film wound around the film recycling section 106 is the film with the working die having reached the end of its service life attached. The film recycling section 106 recycles the film from the transfer section 104. In embodiments of the present invention, the film is wound clockwise in the order of film supply section 102, transfer section 104, and film recycling section 106. Figure 1 The membrane can be supplied in a standard manner, but the positions of the membrane supply section 102 and the membrane recycling section 106 can be changed to supply the membrane in a counterclockwise direction.

[0112] The transfer unit 104 consists of a stage 105, a stage 108, an imprint roll 110, a resin curing unit 112, an upper camera 114, and a lower camera. Figure 12 It consists of 115), a load cell 116, and multiple rollers 118, 119, 120, 122-1 to 122-5, 124 for membrane drive.

[0113] The various components of the transfer section 104, such as the device platform 105, the support platform 108, and the impression roller 110, are described later.

[0114] A master mold (in the case of a mold forming apparatus) or a substrate (in the case of a pattern forming apparatus) is placed on the stage 108. The master mold and substrate are materials to be coated with resin. The stage 108 can be an XYθ stage or a UVW stage for aligning the master mold or substrate. The XYθ stage 108 can be moved by multiple modules that operate individually. That is, by moving individual modules in the x-axis, y-axis, and θ-axis directions respectively, the stage 108 can move in the x-axis, y-axis, and θ-axis directions. The UVW stage 108 can be moved by supplying multiple mutually influencing modules. That is, by combining modules that move along the u-axis, v-axis, and w-axis, the stage 108 can move in the x-axis, y-axis, and θ-axis directions.

[0115] The impression roller (third roller) 110 applies pressure to the film for performing the transfer process. The impression roller 110 moves horizontally while applying pressure to the film in a rolling contact. The impression roller 110 can be disposed between the resin curing section 112 and the upper camera 114.

[0116] The resin curing section 112 can be constructed from a light irradiation section for curing the photocurable resin. The photocurable resin can be, for example, an ultraviolet-curable resin. In this case, the light irradiation section can be an ultraviolet lamp. When the film is a thermocurable resin, the resin curing section 112 can be constructed from a heating section. In the embodiments of the present invention, the resin curing section 112 is exemplified as a light irradiation section, but the present invention is not limited to a light irradiation section. The resin curing section 112 and the upper camera 114 can be arranged spaced apart in the horizontal direction.

[0117] Upper camera 114 and lower camera ( Figure 12 (115) To align the position of the master mold or substrate, identify the alignment mark and alignment key. The upper camera 114 may be located above the stage 108, and the lower camera 115 may be located inside or below the stage 108.

[0118] Force sensor 116 is an electromechanical sensor used to measure force or weight. Force sensor 116 can measure the tension of a membrane.

[0119] Rollers 118, 119, 120, 122-1 to 122-5, 124 include a membrane angle adjustment roller (first roller) 118, a demold nip roll (first clamping roller) 119, a floating roller (second roller) 120, multiple guide rolls 122-1, 122-2, 122-3, 122-4, 122-5, and a membrane recycling roller (second clamping roller) 124.

[0120] The film angle adjustment roller 118 adjusts the angle formed by the film and the stage, ensuring that the film remains horizontal to the stage during the transfer process. The film angle adjustment roller 118 can move up and down.

[0121] The clamping rollers 119 and 124 are devices that clamp the resin film between a pair of rollers while applying pressure and conveying it. The tension applied to the film is controlled by adjusting the rotational speed of the roller 119. Specific details are as follows.

[0122] When the film angle adjusting roller 118 moves up and down, the demolding clamping roller 119 remains in the open state (the state where the film is not pressed and fixed). At this time, the film between the film angle adjusting roller 118 and the floating roller 120 is not fixed by the demolding clamping roller 119, so the position of the floating roller 120 changes in conjunction with the movement of the film angle adjusting roller 118.

[0123] To maintain the membrane tension measured by the force sensor 116, the release roller 119 can be rotated to control the membrane tension. In the release process described later, the release roller 119 can pull the membrane to a taut state, allowing the membrane to form an angle α with the stage surface. At this time, the drive of the release roller 119 can be controlled to maintain the tension measured by the force sensor 116. When the membrane is wound and recycled in the membrane recycling section 106, the membrane recycling roller 124 moves the membrane.

[0124] The floating roller 120 is configured to apply a force of a certain magnitude in a certain direction via a spring, air pressure, pendulum, etc., thereby applying a certain tension to the membrane regardless of positional changes. The floating roller 120 can absorb tension variations applied to the membrane. The floating roller 120 can control the tension while moving up and down. In this case, the weight of the floating roller 120 can be the tension applied to the membrane.

[0125] Guide rolls 122-1, 122-2, 122-3, 122-4, and 122-5 guide or change the path of the film. Guide rolls 122-1, 122-2, 122-3, 122-4, and 122-5 are positioned on the path of the supplied and recycled film, supporting the film while rotating without power at their respective positions. For guiding the movement of the film, guide rolls 122-1, 122-2, 122-3, 122-4, and 122-5 can be positioned between the film supply unit 102 and the transfer unit 104, and between the transfer unit 104 and the film recycling unit 106.

[0126] The film clamp 111 can be configured between the impression roller 110 and the film supply section 102 and can move up and down.

[0127] In the imprinting apparatus 100, the imprinting can be performed sequentially in a clockwise direction ( Figure 1 The membrane supply unit 102, membrane clamp 111, stage 108, membrane angle adjustment roller 118, force sensor 116, demolding clamp roller 119, floating roller 120, membrane recycling clamp roller 124, and membrane recycling unit 106 are configured on the reference (base). Multiple guide rollers 122-1, 122-2, 122-3, 122-4, and 122-5 can be arranged between each component. That is, the stage 108, membrane angle adjustment roller 118, force sensor 116, demolding clamp roller 119, floating roller 120, and membrane recycling clamp roller 124 can be sequentially arranged along the path the membrane travels.

[0128] Therefore, the film supplied from the film supply unit 102 passes over the stage 108, under the film angle adjustment roller 118, and is positioned above the force sensor 116. Then, the film passes between the demolding rollers 119, over the first guide roller 122-1, and is wound onto the floating roller 120. The film passing through the floating roller 120 passes through multiple guide rollers 122-2, 122-3, 122-4, and the film recovery roller 124 before being wound onto the film recovery unit 106.

[0129] An impression roller 110, a resin curing unit 112, and an upper camera 114 are arranged on a stage 108. A film clamp 111 can be arranged between the impression roller 110 and the film supply unit 102, adjacent to the stage 108. Guide rollers 122-5 can be arranged between the film clamp 111 and the film supply unit 102. The film clamp 111 serves to fix the film 126 in place during mold forming or pattern forming processes. Furthermore, the film clamp 111 can move up and down while fixing the film 126, thereby being configured to be adjusted together with the film angle adjustment roller 118 to make the film 126 parallel.

[0130] The imprinting apparatus 100 according to an embodiment of the present invention is a roll-to-plate type apparatus. While prior art plate-to-plate methods operate under vacuum conditions, the imprinting apparatus 100 according to an embodiment of the present invention can operate under atmospheric conditions. In prior art plate-to-plate methods, pressure is applied by simultaneous contact between the mold surface and the substrate surface. In this case, air bubbles may form between the mold surface and the substrate surface, thus requiring the process to be performed under vacuum conditions. However, in the roll-to-plate method according to an embodiment of the present invention, the mold surface attached to the film contacts the substrate surface sequentially. Here, "sequentially" can mean contacting the film along a moving path while the imprinting roller 110 applies pressure to the film. Therefore, the imprinting apparatus 100 according to an embodiment of the present invention can prevent air bubbles from forming between the mold surface and the substrate surface even under atmospheric conditions.

[0131] The film supply unit 102, the transfer unit 104, and the film recycling unit 106 can be configured as an integrated printing apparatus 100. Alternatively, the film supply unit 102 and the film recycling unit 106 can be configured as separate devices from the transfer unit 104, and such separate devices can be assembled with the transfer unit 104.

[0132] The imprinting apparatus 100 may include a drive unit (not shown) for driving the film supply unit 102, the transfer unit 104, and the film recycling unit 106. The drive unit may be an actuator, such as a stepper motor or a servo motor. In addition, the imprinting apparatus 100 may also include a receiving unit for accommodating a master mold or substrate, and a spin coater for coating resin on the surface of the master mold or substrate to a predetermined thickness.

[0133] [Mold Forming Process]

[0134] Figure 2 This is a diagram that briefly illustrates the preparation state of the die-forming process of the embossing apparatus according to an embodiment of the present invention. Figure 3 Yes Figure 2 A magnified view of part A.

[0135] Film 126 is supplied from film supply unit 102 to the upper side of stage 108. Transfer unit 104 can form a copy mold or working mold W on the lower side of film 126. This will be explained in detail below.

[0136] Reference Figure 2 as well as Figure 3 The embossing apparatus 100 supplies film 126, preparing it for the process of manufacturing the working mold W. First, the master mold M is placed on the stage 108. A relief or intaglio pattern is formed on the master mold M. Resin R is coated on the pattern of the master mold M. Before the master mold M is placed on the stage 108, the resin R can be coated by spin coating.

[0137] Resin R can be a photocurable resin that cures upon reaction with ultraviolet light. For example, it can be a resin containing oligomers, monomers, photopolymerization initiators, etc. Alternatively, it can be an acrylic-based curing resin or a resin containing silicone. Resin R can be a transparent material that transmits light or an opaque material that does not transmit light.

[0138] The female mold M is positioned on the stage 109 between the stage 108 and the membrane 126. The female mold M can be positioned on a tray 131 located at the center of the stage 108. Multiple vacuum suction holes can be formed in the tray 131. These vacuum suction holes can be connected to a vacuum pump, thereby vacuum-adhesive fixing of the female mold M. Alternatively, the female mold M can be fixed by electrostatic force.

[0139] The resin top 133 can be at the same height as the stage top 109, or the master mold M can be configured such that the resin top 133 is at a slightly higher height than the stage top 109 by a predetermined distance. The height of the master mold M can be adjusted by raising and lowering the tray 131 via the cylinder 128. Additionally, the stage 108 can be driven to adjust the gap between the impression roller 110 and the master mold M. In this case, the stage 108 can be driven by a drive unit such as a servo motor or a stepper motor. During the transfer step, the heights of the resin top 133 and the stage top 109 can be adjusted so that the impression roller 110 can apply pressure to the film 126 to transfer the pattern of the master mold M onto the resin R.

[0140] The impression roller 110 is disposed at one end of the stage 108 (in Figure 2 as well as Figure 3 The preparation position of the right side of the stage ( Figure 5 (110a). The impression roller 110 is disposed on the upper side of the film 126, and can apply pressure to the film 126 in the direction of the upper surface 109 of the stage.

[0141] The load cell 116 can be positioned higher than the stage top 109 and the impression roller 110 (based on the stage top). Through the impression roller 110 and the load cell 116, the film 126 is tilted at a predetermined angle α relative to the stage top 109. α can be, for example, 10 degrees. ° ) to 20 degrees ( °At this time, the membrane 126 applies a force to the force sensor 116 due to its tension. The force sensor 116 can then measure the tension of the membrane 126. In embodiments of the invention, the tension T1 of the membrane 126 can be controlled by the floating roller 120 to be maintained at a predetermined value. The tension T1 can vary within an error range readily known to those skilled in the art. The tension T1 of the membrane 126 can be set to a predetermined value between 1 kgf and 10 kgf. The force sensor 116 can be positioned on both sides of the membrane 126 in the width direction (the direction perpendicular to the length direction of the membrane) to measure the tension of the membrane 126.

[0142] When the tension of the membrane 126 is less than 1 kgf, membrane sagging may occur due to the load on the membrane 126. In this case, the membrane 126 and the material to be coated (mother mold M or substrate S described later) may be misaligned, or the membrane 126 and the material to be coated may not come into contact sequentially.

[0143] When the tension of the film 126 exceeds 10 kgf, deformation may occur in the film 126. When the film 126 deforms, the positions of the film 126 and the coated material may become misaligned. In addition, the pressure applied to the drive unit that drives the impression roller 110 may be weakened, resulting in poor contact between the film 126 and the coated material.

[0144] To withstand the aforementioned tension and ensure transparency for photocuring, the thickness of film 126 can be greater than 100 μm and less than 500 μm.

[0145] A film angle adjustment roller 118 is disposed between the impression roller 110 and the force sensor 116. Specifically, the film angle adjustment roller 118 is disposed at the arrival position of the impression roller ( Figure 5 Between 110b) and force sensor 116. The arrival position of the impression roller will be described later. The film angle adjustment roller 118 may be located above the film 126. For example, the film angle adjustment roller 118 may be spaced apart from the film 126 and located on the upper side of the film 126 without contacting it.

[0146] Figure 4 This is a diagram that briefly illustrates the transfer steps of the mold forming process of the embossing apparatus according to an embodiment of the present invention. Figure 5 Yes Figure 4 A magnified view of part B.

[0147] According to an embodiment of the present invention, the imprinting apparatus 100 can press the master mold M and the film 126 together to produce a working mold W, and attach the produced working mold W to the film 126.

[0148] If the master mold M is placed on the stage 108, the film angle adjusting roller 118 descends. If the film angle adjusting roller 118 descends and presses the film 126 downwards, the angle α between the film 126 and the upper surface 109 of the stage decreases. The film angle adjusting roller 118 descends until the film 126 becomes parallel to the upper surface 109 of the stage. At this time, the film clamp 111 can move up and down to adjust the height of one side of the film 126.

[0149] The membrane 126 and the upper surface 109 of the stage can be spaced apart by a predetermined distance while remaining parallel. For example, the membrane 126 and the upper surface 109 of the stage can be spaced apart by an interval of approximately 100 μm to 500 μm. Due to the load on the membrane 126 itself and the tension conditions applied to the membrane 126, the membrane 126 may sag downwards. In this case, when the interval between the membrane 126 and the upper surface 109 of the stage is less than 100 μm, the membrane 126 can pre-contact the resin-coated material. However, when the interval exceeds 500 μm, the alignment error may increase during the alignment process described later.

[0150] If the film angle adjusting roller 118 descends, the tension T1 of the film 126 is maintained constant while the floating roller 120 rises. The floating roller 120 rises so that the tension T1 of the film 126 measured in the force sensor 116 remains unchanged and is maintained. The tension T1 of the film 126 is maintained constant, so the film 126 does not deform when the imprinting device 100 is driven.

[0151] In embodiments of the present invention, tension can be controlled while the membrane angle adjusting roller 118 and the floating roller 120 move up and down. When the membrane angle adjusting roller 118 moves up and down, the position and length of the membrane 126 change. As a result, the tension applied to the membrane 126 changes. At this time, the tension can be controlled by adjusting the position energy of the floating roller 118 according to the degree of increase or decrease in the tension of the membrane 126. In this way, the tension applied to the membrane 126 itself can be maintained to a certain extent. However, the present invention is not limited to the up and down movement of the membrane angle adjusting roller 118 and the floating roller 120. In addition, the membrane angle adjusting roller 118 and the floating roller 120 can also move in the same direction.

[0152] If the membrane 126 and the upper part 109 of the stage are adjusted to be parallel, the position of the female mold will be aligned. The alignment of the female mold will be described later.

[0153] Impression roller 110 moves from ready position 110a to arrival position 110b while applying pressure to film 126 with rolling contact. Figure 5 (The arrow direction). While the impression roller 110 moves horizontally on the upper side of the film 126, pressure is applied to the film 126, thereby pressing the resin R located on the lower side of the film 126 onto the film 126. Through the pressure of the impression roller 110, the pattern of the master mold M is transferred onto the resin R.

[0154] The pressure applied by the impression roller 110 to the film 126 can be from 10 kgf to 200 kgf. When the pressure is less than 10 kgf, the contact between the film 126 and the resin R coated on the master mold M may be insufficient. In this case, the contact between the resin R and the patterned areas of the master mold M, or between the entire surface or a portion of the master mold M, may become poor, thus the pattern transfer may not be smooth. When the pressure exceeds 200 kgf, deformation of the film 126 or damage to the master mold M may occur due to the pressure.

[0155] The moving speed of the impression roller 110 can be from 1 mm / sec to 100 mm / sec. When the moving speed is less than 1 mm / sec, the processing time becomes longer and the process efficiency may decrease. When the moving speed exceeds 100 mm / sec, the film 126 and the master mold M cannot make sufficient contact, and the quality of the transferred pattern may decrease. In addition, the mechanical and physical impact caused by high-speed movement is continuously applied to the transfer section 104, making it difficult to maintain the stable performance of the impression apparatus 100.

[0156] After the impression roller 110 moves from the ready position 110a to the arrival position 110b, during the period when the impression roller 110 moves from the ready position 110a to the arrival position 110b or during the period when the impression roller 110 returns from the arrival position 110b to the ready position 110a, the light irradiation section 112 irradiates the resin R with light in order to cure the pressurized resin R. The light can be, for example, ultraviolet light.

[0157] Preferably, the light irradiation section 112 can cure the resin R while moving together with the impression roller 110. For example, the light irradiation section 112 can be configured to immediately irradiate the resin R with ultraviolet light while the impression roller 110 is applying pressure. For example, the light irradiation section 112 can be configured to have a certain slope relative to the film 126 (e.g., a slope of 10° to 80°). Alternatively, the light irradiation section 112 may also include a reflector or prism to irradiate light perpendicularly to the film 126.

[0158] The ultraviolet-transmitting film 126, irradiated by the light irradiation section 112, cures the resin R. At this time, the resin R, which is pressed against the film 126 by the impression roller 110, is cured by ultraviolet light. The cured resin R adheres to the underside of the film 126. If the curing of the resin R is complete, the impression roller 110 returns from the arrival position 110b to the preparation position 110a.

[0159] Position confirmation marks or alignment marks are formed on the female mold M placed on the stage 108. The alignment marks can be formed on the top or bottom of the female mold M.

[0160] As the initial step in the process, after the master mold M is placed on the stage 108, its vertical or horizontal position is adjusted so that the camera can be mounted on it. Figure 1 (114) or the camera ( Figure 12 The viewing angle of the XYθ stage 108 (or UVW stage 108) is directed towards the position where the alignment mark is formed. During the mold-forming process, the XYθ stage 108 or UVW stage 108 is not used; instead, an imprinting process is performed to transfer the mold pattern onto the empty film. Subsequently, in the repeated mold-forming process, the position of the master mold M placed on the stage 108 can be aligned using the upper camera 114. The upper camera 114 can be configured to adjust one or more of its horizontal, vertical, and angle positions so that the camera's shooting angle is directed towards the position where the alignment mark is formed. If the upper camera 114 recognizes the alignment mark, the XYθ stage 108 or UVW stage 108 moves to align the master mold M to a predetermined position.

[0161] Figure 6 This is a diagram that briefly illustrates the demolding steps of the mold forming process of the embossing apparatus according to an embodiment of the present invention. Figure 7 Yes Figure 6 A magnified view of part C.

[0162] Once the resin R has cured, the cured resin R is separated from the master mold M (demolded). The separated resin R adheres to the underside of the film 126 and is used as the working mold W. Specific details are as follows.

[0163] A film 126 is disposed between a pair of rollers constituting the release roller 119. Once the resin R has cured, the pair of rollers constituting the release roller 119 move in the direction of applying pressure to the film 126. The film 126 located between the release rollers 119 is secured by the release rollers 119. Alternatively, after the film 126 is secured by the release rollers 119, the impression roller 110 returns from the arrival position 110b to the preparation position 110a.

[0164] Additionally, the film angle adjusting roller 118 rises upwards and returns to its original position. If the film angle adjusting roller 118 rises upwards, due to the tension in the film 126 generated by the rotation of the demolding roller 119, one side of the film 126 (the position where the impression roller reaches) rises away from the stage 108 (towards the stage). This causes the film 126 and the stage surface 109 to tilt again at a predetermined angle (e.g., α).

[0165] Therefore, if the film angle adjusting roller 118 returns, the working mold W separates from the master mold M (demolding) due to the tension of the film 126. At this time, the demolding clamping roller 119 rotates corresponding to the rising speed of the film angle adjusting roller 118. Specifically, in order to control the demolding speed during demolding, the rotational speed of the demolding clamping roller 119 can be varied. For example, when it is necessary to separate the film 126 and the master mold M at a fast speed, the demolding clamping roller 119 can be driven to rotate at a high speed. The film angle adjusting roller 118 is precisely driven for angle α adjustment, so driving the film angle adjusting roller 118 at a high speed for fast demolding may not be preferred.

[0166] While the demolding roller 119 rotates, the film 126 moves towards the floating roller 120. At this time, due to the descent of the floating roller 120, the tension of the film 126 remains constant. Therefore, the tension of the film 126 remains constant during the demolding process, and thus the film 126 does not deform. Alternatively, the demolding process can be performed without driving the demolding roller 119, solely through tension control of the floating roller 120 and the rising of the film angle adjustment roller 118. Alternatively, the demolding process can be performed by returning the impression roller 110 to the ready position 110a while the film angle adjustment roller 118 is rising. In this case, the floating roller 120 can control the tension of the film 126 to perform demolding. At this time, the demolding roller 119 can also be driven to ensure the angle between the film 126 used for demolding and the stage surface 109. The demolding methods described above can be selectively used depending on the release force between the demolded film 126 and the master mold M, and the required separation conditions.

[0167] like Figure 7 As shown, the working mold W is attached to the underside of the membrane 126. In this embodiment of the invention, the working mold W is formed on the membrane 126, thus making it easier to separate. The resin R can be a material that easily adheres to the membrane 126 and is easily separated from the master mold M. If the working mold W separates from the master mold M, the demolding roller 119 releases the membrane 126 from its fixation. Then, the master mold M is unloaded from the stage 108. Afterwards, the stage 108 returns to its original position (origin). The unloaded master mold M can be transferred to the receiving section for storage.

[0168] If a working mold W is manufactured and attached to the film 126, a pattern forming process can be performed using the working mold W as described below.

[0169] [Pattern Forming Process]

[0170] Figure 8 This is a diagram that briefly illustrates the preparation state of the pattern forming process of the embossing apparatus according to an embodiment of the present invention. Figure 9 Yes Figure 8 A magnified view of part D.

[0171] A working mold W is attached to the underside of the film 126. A positive or negative pattern is formed on the underside of the working mold W. A substrate S is placed into the stage 108, which has already had the master mold M removed. Resin R' is coated onto the substrate S. Before the substrate S is placed into the stage 108, resin R' can be coated by spin coating.

[0172] Resin R' can be a photocurable resin that cures upon reaction with ultraviolet light. For example, it can be a resin composed of oligomers, monomers, photopolymerization initiators, etc. Resin R' can be the same material as resin R or a different material. Resin R' can be a transparent material that transmits light or an opaque material that does not transmit light.

[0173] The substrate S is disposed on the stage 109 between the stage 108 and the film 126. The substrate S can be disposed on a tray 131 provided at the center of the stage 108. A plurality of vacuum adsorption holes can be formed in the tray 131. The vacuum adsorption holes can be connected to a vacuum pump to vacuum adsorb and fix the substrate S. Alternatively, the substrate S can be fixed by electrostatic force.

[0174] The resin top surface 133 can be at the same height as the stage top surface 109, or the substrate S can be configured such that the resin top surface 133 is at a slightly higher height than the stage top surface 109 by a predetermined distance. The tray 131 can be raised and lowered by the cylinder 128 to adjust the height of the substrate S. Additionally, the stage 108 can be driven to adjust the gap between the impression roller 110 and the substrate S. In this case, the stage 108 can be driven by a drive unit such as a servo motor or a stepper motor. During the transfer step, the heights of the resin top surface 133 and the stage top surface 109 can be adjusted so that the impression roller 110 can apply pressure to the film 126 to transfer the pattern of the working mold W onto the resin R'.

[0175] The impression roller 110 is disposed at one end of the stage 108 (in Figure 8 as well as Figure 9 The preparation position of the right side of the stage ( Figure 11 (110a). The impression roller 110 is disposed on the upper side of the film 126, and can apply pressure to the film 126 in the direction of the upper surface 109 of the stage.

[0176] The load cell 116 can be positioned higher than the stage top 109 and the impression roller 110 (based on the stage top). Through the impression roller 110 and the load cell 116, the film 126 is tilted at a predetermined angle α relative to the stage top 109. α can be, for example, 10 degrees. ° ) to 20 degrees ( °At this time, the tension of the membrane 126 applies a force to the force sensor 116. The force sensor 116 can then measure the tension of the membrane 126. In embodiments of the present invention, the tension T2 of the membrane 126 can be controlled to be maintained at a predetermined value. The tension T2 of the membrane 126 can be the same as or substantially the same as T1. "T2 and T1 are substantially the same" means that the difference between T2 and T1 is so small that even if a force is applied to the membrane 126 during the patterning process, causing deformation of the membrane 126 and thus the working mold W, the deformation of the working mold W is within the range of design or manufacturing errors of the pattern (the pattern formed on the working mold or the pattern transferred to the resin on the substrate). That is, it means that the pattern transferred to the substrate S by the working mold W deformed by tension T2 is within the range of design or manufacturing errors of the pattern transferred by the undeformed working mold W.

[0177] A film angle adjustment roller 118 is disposed between the impression roller 110 and the force sensor 116. Specifically, the film angle adjustment roller 118 is disposed at the arrival position of the impression roller ( Figure 11 Between 110b) and force sensor 116. The arrival position of the impression roller will be described later. The film angle adjustment roller 118 may be located above the film 126. For example, the film angle adjustment roller 118 may be spaced apart from the film 126 and thus located on the upper side of the film 126.

[0178] The substrate S can be a transparent material that transmits light or an opaque material that does not transmit light. For example, the substrate can be a silicon wafer, a metal vapor-deposited wafer, etc. Additionally, a resin R' to which the transfer pattern will be applied is coated on the substrate S.

[0179] Figure 10 This is a diagram that briefly illustrates the transfer steps of the pattern forming process of the embossing apparatus according to an embodiment of the present invention. Figure 11 Yes Figure 10 A magnified view of part E.

[0180] According to an embodiment of the present invention, the embossing apparatus 100 can press the working mold W and the substrate S together, thereby transferring the pattern of the working mold W onto the resin R' coated on the substrate.

[0181] If the substrate S is placed on the stage 108, the film angle adjustment roller 118 descends. As the film angle adjustment roller 118 descends and presses the film 126 downwards, the angle α between the film 126 and the upper surface 109 of the stage decreases. The film angle adjustment roller 118 descends until the film 126 becomes parallel to the upper surface 109 of the stage. The film 126 and the upper surface 109 of the stage can be spaced apart by a predetermined distance while parallel. For example, the film 126 and the upper surface 109 of the stage can be spaced apart by approximately 100 μm to 500 μm. Due to the load on the film 126 itself and the tension applied to the film 126, the film 126 may sag downwards. In this case, when the distance between the film 126 and the upper surface 109 of the stage is less than 100 μm, the film 126 can pre-contact the resin-coated substrate S. However, when the distance exceeds 500 μm, the alignment error may increase during the alignment process described later. At this time, the membrane clamp 111 can move up and down to adjust the height of one side of the membrane 126.

[0182] If the film angle adjusting roller 118 descends, the control is such that the tension T2 of the film 126 is maintained constant while the floating roller 120 rises. The floating roller 120 rises so that the tension T2 of the film 126 measured in the force sensor 116 remains unchanged and is maintained. The tension T2 of the film 126 is maintained constant, so the film 126 does not deform when the imprinting device 100 is driven.

[0183] In embodiments of the present invention, tension can be controlled while the membrane angle adjusting roller 118 and the floating roller 120 move up and down. When the membrane angle adjusting roller 118 moves up and down, the position and length of the membrane 126 change. As a result, the tension applied to the membrane 126 changes. At this time, the tension can be controlled by adjusting the position energy of the floating roller 118 according to the degree of increase or decrease in the tension of the membrane 126. In this way, the tension applied to the membrane 126 itself can be maintained to a certain extent. However, the present invention is not limited to the up and down movement of the membrane angle adjusting roller 118 and the floating roller 120. In addition, the membrane angle adjusting roller 118 and the floating roller 120 can also move in the same direction.

[0184] If the membrane 126 and the upper part 109 of the stage are aligned parallel to each other, the positions of the working mold W and the substrate S will be aligned. The alignment of the working mold W and the substrate S will be described later.

[0185] Impression roller 110 moves from ready position 110a to arrival position 110b while applying pressure to film 126 with rolling contact. Figure 11 (The arrow direction). While the impression roller 110 moves horizontally above the film 126, it applies pressure to the film 126, thereby pressing the working die W onto the resin R'. Through the pressure of the impression roller 110, the pattern of the working die W is transferred onto the resin R'.

[0186] The pressure applied by the impression roller 110 to the film 126 can be from 10 kgf to 200 kgf. When the pressure is less than 10 kgf, the contact between the working die W and the resin R' coated on the substrate S may be insufficient. In this case, the contact between the resin R' and the patterned areas of the working die W, or between the entire surface or a portion of the working die W, may become poor, thus the pattern transfer may not be smooth. When the pressure exceeds 200 kgf, deformation of the film 126 or damage to the working die W may occur due to the pressure.

[0187] The moving speed of the impression roller 110 can be from 1 mm / sec to 100 mm / sec. When the moving speed is less than 1 mm / sec, the processing time becomes longer and the process efficiency may decrease. When the moving speed exceeds 100 mm / sec, the working die W and the resin R' cannot make sufficient contact, and the quality of the transferred pattern may decrease. In addition, the mechanical and physical impact caused by high-speed movement is continuously applied to the transfer section 104, making it difficult to maintain the stable performance of the impression apparatus 100.

[0188] After the impression roller 110 moves from the ready position 110a to the arrival position 110b, during the period when the impression roller 110 moves from the ready position 110a to the arrival position 110b or during the period when the impression roller 110 returns from the arrival position 110b to the ready position 110a, the light irradiation section 112 irradiates the resin R' with light in order to cure the pressurized resin R'. The light can be, for example, ultraviolet light.

[0189] Preferably, the light irradiation section 112 can cure the resin R' while moving together with the impression roller 110. For example, the light irradiation section 112 can be configured to immediately irradiate the passing resin R' with ultraviolet light while the impression roller 110 is applying pressure. For example, the light irradiation section 112 can be configured to have a certain slope relative to the film 126 (e.g., a slope of 10° to 80°). Alternatively, the light irradiation section 112 may also include a reflector or prism to irradiate light perpendicularly to the film 126.

[0190] The ultraviolet transmission film 126 irradiated by the light irradiation section 112 cures the resin R'. Once the resin R' has cured, the impression roller 110 returns from the arrival position 110b to the preparation position 110a.

[0191] Figure 12 This is a simplified cross-sectional view of the stage with the lower camera mounted on it.

[0192] Before transferring the pattern of the working mold W onto the resin R', the horizontal position is adjusted so that the working mold W and the substrate S are aligned at a predetermined position. In embodiments of the present invention, a camera can be used to align the working mold W and the substrate S.

[0193] To confirm the transfer position, a position confirmation mark or alignment mark can be formed on the working die W, and a position confirmation key or alignment key can be formed on the substrate S. The alignment mark and alignment key can be embossed pattern marks, metal or metal oxide pattern marks, ink marks, or laser marks.

[0194] Alignment marks can be formed on one or more of the working die W, either on the underside or on the topside. Alignment marks can be positioned in areas on the underside or topside of the working die W where no pattern is formed. Multiple alignment marks can be formed on the working die W. That is, alignment marks can include a first alignment mark and a second alignment mark. The second alignment mark can be spaced apart from the first alignment mark.

[0195] Alignment keys are configured on substrate S at positions corresponding to alignment marks. Alignment keys can be formed on one or more of the top or bottom surfaces of the substrate.

[0196] Multiple alignment keys can be formed on the substrate S. That is, the alignment keys may include a first alignment key and a second alignment key. The first alignment key is disposed at a position corresponding to a first alignment mark, and the second alignment key is disposed at a position corresponding to a second alignment mark.

[0197] Alignment marks and alignment keys can be formed into corresponding shapes. For example, alignment marks can be formed into a cross shape. Alignment keys can be formed into a shape of four quadrilaterals spaced apart, configured to form a space where alignment marks can be set when viewed from the lower camera 115.

[0198] If the alignment mark partially overlaps with the alignment key, or if the alignment mark and the alignment key do not overlap, it is determined that the working mold W and the substrate S are not aligned in the correct position. If the alignment mark is located between the four quadrilaterals of the alignment key, it is determined that the working mold W and the substrate S are aligned in the correct position. In this case, the alignment mark and the alignment key can overlap to form a square or a rectangle.

[0199] In embodiments of the present invention, the upper camera 114 can be used to identify alignment marks and alignment keys, or the upper camera 114 and the lower camera 115 can be used to identify alignment marks and alignment keys.

[0200] The following explanation addresses the case where the upper camera 114 is used to identify the alignment marks of the work mold W and the alignment keys of the substrate S.

[0201] The upper camera 114 can be configured to adjust one or more of its horizontal, vertical, and angle positions so that the camera's viewing angle is directed towards the position where the alignment mark and alignment key are formed. The upper camera 114 can be configured to change its focal distance to a first focal distance or a second focal distance. The first focal distance may be used to identify the alignment mark, and the second focal distance may be used to identify the alignment key. For example, to identify the alignment key after the upper camera 114 identifies the alignment mark, the focal distance of the upper camera 114 can be changed from the first focal distance to the second focal distance. The focal distance can be a focal distance in the vertical direction relative to the top of the stage 109.

[0202] If the upper camera 114 recognizes the alignment mark and alignment key, the XYθ stage 108 or the UVW stage 108 moves to align with the working mold W and the substrate S. Specific details are as follows.

[0203] First, the upper camera 114 identifies the alignment mark of the working mold W at a first focal distance and obtains the coordinates of the alignment mark. Then, the upper camera 114 descends towards the stage 108. The descending upper camera 114 identifies the alignment key of the substrate S at a second focal distance and obtains the coordinates of the alignment key.

[0204] To align the working mold W and the substrate S, the stage 108 is driven using the coordinates of the alignment marks and alignment keys. Then, the upper camera 114 rises away from the stage 108 to reconfirm the alignment mark coordinates of the working mold W at a first focal distance. The upper camera 114 then descends to reconfirm the alignment key coordinates of the substrate S at a second focal distance. Using the reconfirmed coordinates of the alignment marks and alignment keys, the working mold W and the substrate S are aligned again. This realignment process can be repeated until the positions of the working mold W and the substrate S are within tolerance.

[0205] Preferably, embodiments of the present invention can use an upper camera 114 to identify the position of the working mold W and a lower camera 115 to identify the position of the substrate S. When the upper camera 114 and the lower camera 115 are aligned with the positions of the working mold W and the substrate S, alignment can be performed simultaneously by controlling the positions of the working mold W and the substrate S. This will be described in detail below.

[0206] For example, when the working mold W is formed of an opaque material, the upper camera 114 identifies alignment marks, and the lower camera 115 identifies alignment keys. The upper camera 114 and the lower camera 115 can simultaneously identify the alignment marks and alignment keys, or identify either one first and then the other. The relative positions between the first alignment mark and the first alignment key, as well as the relative positions between the second alignment mark and the second alignment key, can be identified to confirm the positional error between the working mold W and the substrate S.

[0207] The configuration can be adjusted by changing one or more of the horizontal position, vertical position, and angle of the upper camera 114 and the lower camera 115, so that the camera's viewing angle is oriented towards the position where the alignment mark and alignment key are formed. One upper camera 114 and multiple lower cameras 115 can be configured. For example, when there are two lower cameras 115, one lower camera 115 recognizes the first alignment key, and the other lower cameras 115 recognize the second alignment key.

[0208] The lower camera 115 can be configured inside or below the stage 108. (See reference...) Figure 12 The lower camera 115 is positioned below the stage 108. During substrate alignment, the lower camera 115, the imaging guide 132, and the reflector 134 can identify the alignment key of the substrate in a fixed position regardless of the movement of the stage 108.

[0209] A shooting path 130 is formed in the stage 108, extending vertically through it. Therefore, the lower camera 115 can identify the alignment key of the substrate S through the shooting path 130. One side of the shooting guide 132 communicates with the shooting path 130, and the opposite side is connected to the lower camera 115. The shooting guide 132 can be formed in a direction perpendicular to the direction in which the shooting path 130 is formed.

[0210] The lower camera 115 can capture images of the underside of the substrate S through the image guide 132 and the image path 130. As shown in the figure, when the image guide 132 is horizontally positioned, the installation space for the lower camera 115 can be reduced. Furthermore, the degree of freedom in positioning the lower camera 115 can be increased. Specific details are as follows.

[0211] A prism or a reflector 134 may be provided inside the shooting guide 132. The reflector 134 may be disposed between the shooting guide 132 and the shooting path 130, so that light traveling along the shooting path 130 is reflected and travels along the shooting guide 132. The reflector 134 reflects the image of the alignment key and incident on the lower camera 115, so that the lower camera 115 can identify the alignment key.

[0212] As described above, the upper camera 114 and lower camera 115 are used to confirm the coordinates of the alignment marks and alignment keys, and the stage 108 is driven to align the working mold W and the substrate S. If the alignment marks and alignment keys are identified by the upper camera 114 and / or the lower camera 115, the control unit 101 adjusts the horizontal position of the stage 108. For example, the XYθ stage 108 or the UVW stage 108 can be moved or rotated horizontally in the X and Y directions. The position of the stage 108 on which the substrate S is placed can be adjusted to align the working mold W and the substrate S in an accurate position. The alignment process can be repeated until the position of the working mold W and the substrate S is within the tolerance range.

[0213] Figure 13 This is a diagram that briefly illustrates the demolding steps of the pattern forming process of the embossing apparatus according to an embodiment of the present invention. Figure 14 Yes Figure 13 A magnified view of part of F.

[0214] Once the resin R' has cured completely, the cured resin R' is separated from the working mold W (demolded). The pattern transferred from the working mold W is formed on the separated resin R'. Specific details are as follows.

[0215] A film 126 is disposed between a pair of rollers constituting the release roller 119. Once the resin R' has cured, the pair of rollers constituting the release roller 119 move in the direction of applying pressure to the film 126. The film 126 located between the release rollers 119 is secured by the release rollers 119. Alternatively, after the film 126 is secured by the release rollers 119, the impression roller 110 returns from the arrival position 110b to the preparation position 110a.

[0216] Additionally, the film angle adjusting roller 118 rises upwards and returns to its original position. If the film angle adjusting roller 118 rises upwards, due to the tension in the film 126 generated by the rotation of the demolding clamping roller 119, one side of the film 126 (the position where the impression roller reaches) rises away from the stage 108 (upper part of the stage). In this way, the film 126 and the stage surface 109 are tilted again at a predetermined angle (e.g., α).

[0217] Therefore, if the film angle adjusting roller 118 returns, the working mold W separates from the resin R' (demolding) due to the tension of the film 126. At this time, the demolding clamping roller 119 rotates corresponding to the rising speed of the film angle adjusting roller 118. Specifically, in order to control the demolding speed during demolding, the rotational speed of the demolding clamping roller 119 can be varied. For example, when it is necessary to separate the working mold W and the resin R' at a fast speed, the demolding clamping roller 119 can be driven to rotate at a high speed. The film angle adjusting roller 118 is precisely driven for angle α adjustment, so driving the film angle adjusting roller 118 at a high speed for fast demolding may not be preferred.

[0218] While the release roller 119 rotates, the film 126 moves toward the floating roller 120. At this time, due to the descent of the floating roller 120, the tension of the film 126 remains constant. Therefore, the tension of the film 126 remains constant during the demolding process, and thus the film 126 does not deform. Alternatively, the demolding process can be performed without driving the release roller 119, solely through tension control of the floating roller 120 and the rising of the film angle adjustment roller 118. Alternatively, the demolding process can be performed by returning the impression roller 110 to the ready position 110a while the film angle adjustment roller 118 is rising. In this case, the floating roller 120 can control the tension of the film 126 to perform demolding. At this time, the release roller 119 can also be driven to ensure the angle between the film 126 used for demolding and the stage 109. The demolding methods described above can be selectively used depending on the release force between the mold W and the resin R' used for demolding and the required separation conditions.

[0219] like Figure 14 As shown, a pattern is formed on the cured resin R'. In an embodiment of the invention, the working mold W is formed on the film 126 and the cured resin R' is attached to the substrate S, thus making it easier to separate the working mold W. The resin R' can be a material that easily adheres to the substrate S and is easily separated from the working mold W. If the working mold W separates from the resin R', the demolding roller 119 releases the film 126 from its fixation. Afterward, the substrate S is discharged from the stage 108, and the stage 108 returns to its original position (origin).

[0220] A new substrate S is inserted into the stage 108, which has returned to its original position. The above description can be repeated. Figure 8 to Figure 14 The process involves transferring the pattern onto a new substrate S. At this point, the mold W can be reused without changing it.

[0221] [Mold Replacement Process]

[0222] Figure 15 This is a diagram that briefly illustrates the film recycling step of the pattern forming process of the embossing apparatus according to an embodiment of the present invention.

[0223] If the working die W reaches the end of its service life, a new working die W is formed. To wind the film 126 with the working die W having reached the end of its service life attached, the film recycling unit 106 is rotated under the control of the control unit 101. The film recycling unit 106 can be rotated by, for example, a servo motor. Specific details are as follows.

[0224] First, the floating roller 120 is fixed in place. The floating roller 120 can be fixed in the position described above as the ready state. At this time, the demolding clamping roller 119 can be in a state where the film 126 is released from fixation. In addition, the film angle adjusting roller 118 can be spaced apart from the film 126 and located on the upper side of the film 126 without contacting it.

[0225] Subsequently, the membrane recovery roller 124 is driven, causing the membrane 126 to move toward the membrane recovery section 106. The membrane recovery section 106 is driven to wind the membrane 126 by a predetermined amount of rotation. At this time, the membrane 126 moves a predetermined distance from the membrane supply section 102 toward the membrane recovery section 106. The membrane 126 can move toward the membrane recovery section 106 by a distance (1 foot) equivalent to the distance the working die W, which has reached the end of its service life, is detached from the platform 108. Through this movement of the membrane 126, an empty membrane 126 without the working die W is placed above the platform 108.

[0226] Next, place the master mold M onto the stage 108 and repeat the above instructions. Figure 2 to Figure 7 The process forms a new working mold W in the empty membrane 126. If a new working mold W is formed, the mother mold M is discharged from the stage 108.

[0227] Figure 16 This is a flowchart of a membrane tension control method according to an embodiment of the present invention.

[0228] The membrane tension control method according to an embodiment of the present invention includes (A) a step of placing a membrane capable of forming a mold on a stage (S100); (B) a step of measuring the tension T of the membrane (S102); (C) a step of placing the membrane parallel to the surface of the stage (S104); and (D) a step of controlling the tension of the membrane by raising a second roller supporting the membrane while the membrane is placed parallel to the surface of the stage (S106). Additionally, it may include a step of pressing the membrane onto the stage, transferring a pattern onto a resin coated on a material to be coated (a master mold or substrate), and a step of separating the material to be coated and the membrane after transferring the pattern onto the resin (S108). In this case, the tension of the membrane in steps S104, S106, and S108 is the same as or substantially the same as the tension T measured in step S102.

[0229] Figure 17 This is a flowchart of an embossing method for pattern formation according to an embodiment of the present invention.

[0230] The pattern forming process according to an embodiment of the present invention includes (A) a step of positioning a film on a stage with a first mold having a predetermined pattern attached thereon at a predetermined distance from the stage (S200); (B) a step of placing a first substrate coated with resin on the stage (S202); (C) a step of positioning the film adjacent to and parallel to the surface of the stage by moving a first roller and a second roller arranged along the moving path of the film in opposite directions (S204); and (D) a step of transferring the pattern of the first mold onto the resin by pressing the film positioned parallel to the surface of the stage onto the resin (S206). (E) Step of curing the resin on which the pattern is transferred (S208); (F) Step of separating the first mold from the cured resin by moving the first roller and the second roller in opposite directions and separating the film from the stage by a predetermined distance due to the tension of the film (S210); (G) Step of discharging the first substrate separated from the first mold from the stage (S212); (H) Step of placing the second substrate coated with resin on the stage where the first substrate is discharged (S214); and (I) Step of repeating steps (C) to (F) on the second substrate (S216).

[0231] As described above in this invention through specific components and limited embodiments, along with accompanying drawings, this is merely provided to aid in a more comprehensive understanding of the invention. The invention is not limited to the above embodiments, and various modifications and variations can be made by those skilled in the art without departing from the essential characteristics of the invention. Furthermore, those skilled in the art can appropriately modify the positional relationships (including vertical, horizontal, and vertical) and movement directions of the components such as the stage 108 and the impression roller 110 according to the embodiments of the invention within the scope of the invention's concept. Therefore, the concept of the invention is not limited to the described embodiments but should be interpreted as encompassing not only the appended patent claims, but also all technical concepts having equivalent or related variations to those claims. Additionally, the various embodiments described above can be combined and used in combination as needed.

Claims

1. A film tension control method of an imprint apparatus, comprising: (A) a step of arranging a film capable of forming a mold on a stage; (B) a step of measuring a tension T of the film; (C) a step of arranging the film to be parallel to an upper surface of the stage; (D) a step of raising a second roller supporting the film to control the tension of the film during the step of arranging the film to be parallel to the upper surface of the stage, the tension of the film in the step (C) and the step (D) is the tension T.

2. The film tension control method of an imprint apparatus according to claim 1, wherein in the step (A), the film is arranged on the stage to be inclined at a predetermined angle a with respect to the upper surface of the stage.

3. The film tension control method of an imprint apparatus according to claim 2, wherein in the step (C), a first roller is moved and a predetermined position of the film is moved toward the stage, so that the angle a is reduced.

4. The film tension control method of an imprint apparatus according to claim 1, wherein in the step (B), the tension is measured by a force sensor arranged at a position higher than the upper surface of the stage and separated from the stage.

5. The film tension control method of an imprint apparatus according to claim 1, wherein the stage is capable of arranging a master mold and a substrate.

6. The film tension control method of an imprint apparatus according to claim 5, wherein when the master mold coated with a resin is arranged on the stage, the step (D) is further followed by: (E) a step of pressing the film against the resin of the master mold to transfer a pattern of the master mold to the resin; (F) a step of curing the resin to which the pattern is transferred; and (G) a step of separating the cured resin from the master mold with the film attached to the cured resin.

7. The film tension control method of an imprint apparatus according to claim 6, wherein the tension of the film in the step (G) is the tension T.

8. The film tension control method of an imprint apparatus according to claim 6, wherein between the step (D) and the step (E) is further included: a step of aligning a position of the master mold.

9. The film tension control method of an imprint apparatus according to claim 6, wherein the cured resin is a working mold having the pattern.

10. The film tension control method of an imprint apparatus according to claim 5, wherein when the substrate is arranged on the stage, the film has a working mold having a predetermined pattern attached thereto.

11. The film tension control method of an imprint apparatus according to claim 10, wherein when the substrate coated with a resin is arranged on the stage, the step (D) is further followed by: (H) a step of pressing the film against the resin of the substrate to transfer a pattern of the working mold to the resin; (I) a step of curing the resin to which the pattern is transferred; and (J) a step of separating the cured resin from the working mold.

12. The film tension control method of an imprint apparatus according to claim 11, wherein ​ The tension of the film in the (J) step is the tension T.

13. The film tension control method of the imprint apparatus according to claim 11, wherein, between the (D) step and the (H) step further comprises: a step of aligning the position of the work mold and the substrate.

14. The film tension control method of the imprint apparatus according to claim 1, wherein, the tension T is 1 kgf to 10 kgf.

15. The film tension control method of the imprint apparatus according to claim 3, wherein, after the (D) step further comprises: (K) a step of pressurizing the film on the stage to transfer a pattern to a resin coated on a coated material, after the (K) step, the first roller is raised and the film is disposed above the stage to be inclined at a predetermined angle with respect to the upper surface of the stage.

16. The film tension control method of the imprint apparatus according to claim 1, wherein, the second roller is a floating roller.

17. A film tension control method of an imprint apparatus, comprising: (A) a step of disposing a film having a tension T on a stage to be inclined from the upper surface of the stage; (B) a step of disposing the film to be parallel to the upper surface of the stage; and (C) a step of controlling the tension of the film during the film is disposed to be parallel to the upper surface of the stage, the tension of the film in the (B) step and the (C) step is the same as the tension T.

18. An imprint method, comprising: (A) a step of disposing a film to which a first mold having a predetermined pattern is attached on a stage to be separated by a predetermined distance from the stage; (B) a step of placing a first substrate coated with a resin on the stage; (C) a step of moving first and second rollers disposed along the moving path of the film in opposite directions to each other to dispose the film adjacent to and parallel to the upper surface of the stage; (D) a step of pressurizing the film disposed to be parallel to the upper surface of the stage on the resin to transfer the pattern of the first mold to the resin; (E) a step of curing the resin to which the pattern is transferred; (F) a step of separating the first mold from the cured resin by moving the first and second rollers in opposite directions to each other to separate the film from the stage by a predetermined distance from the stage by the tension of the film; (G) a step of discharging the first substrate separated from the first mold from the stage; (H) a step of placing a second substrate coated with a resin on the stage from which the first substrate is discharged; and (I) a step of repeating the (C) step to the (F) step for the second substrate.

19. The imprint method according to claim 18, wherein, in the (C) step, the first roller is lowered to dispose the film adjacent to and parallel to the upper surface of the stage, and the second roller is raised to control the tension of the film, in the (F) step, the first roller is raised to separate the film from the stage by a predetermined distance, and the second roller is lowered to control the tension of the film.

20. The imprint method according to claim 19, wherein, In the (A) step, the film is disposed on the stage so as to be inclined by a predetermined angle a with respect to the upper surface of the stage, In the (C) step, the first roller is lowered and the predetermined position of the film is lowered toward the stage, so that the angle a is decreased, In the (F) step, the first roller is raised and the predetermined position of the film is raised from the stage, so that the angle a is increased.

21. The imprinting method according to claim 19, wherein the first roller is a film angle adjusting roller, and the second roller is a float roller.

22. The imprinting method according to claim 18, wherein the imprinting method further comprises: a step of recognizing and aligning the position of the first mold using a first camera disposed on one side of the stage.

23. The imprinting method according to claim 22, wherein the imprinting method further comprises: a step of recognizing and aligning the position of the first substrate placed on the stage using a second camera disposed on the other side of the stage.

24. The imprinting method according to claim 23, wherein the second camera recognizes the position of the first substrate during the step in which the first camera recognizes the position of the first mold.

25. The imprinting method according to claim 18, wherein between the (G) step and the (H) step, further comprising: a step in which the film is moved along the movement path by a predetermined distance, and the first mold is separated from the stage; and a step in which, after the first mold is separated from the stage, a second mold is attached to the film disposed on the stage.

26. The imprinting method according to claim 25, wherein the film is moved along the movement path while the second roller is fixed at a predetermined position.

27. The imprinting method according to claim 18, wherein in the (D) step, a third roller presses the film while moving in a horizontal rolling contact.

28. An imprinting apparatus comprising: a film supply section capable of supplying a film; a film recovery section capable of recovering the film supplied from the film supply section; a transfer section disposed between the film supply section and the film recovery section on a movement path of the film; and a control section capable of controlling driving of the transfer section, the transfer section includes: a stage capable of placing a master mold and a substrate on the stage; a pressing member disposed on the stage and capable of pressing the film on the stage; a resin curing section disposed on the stage and capable of curing resin applied to the master mold and the substrate; a first roller disposed on the movement path of the film and capable of moving up and down to dispose the film adjacent to and parallel with the upper surface of the stage; a second roller capable of moving in a direction opposite to the first roller in correspondence with the movement of the first roller to enable control of the tension of the film; and a sensor capable of measuring the tension of the film.

29. The imprinting apparatus according to claim 28, wherein the second roller is capable of moving so that the tension of the film is maintained at a predetermined value.

30. The imprinting apparatus according to claim 29, wherein ​ the second roller can be raised to control the tension of the film during the first roller is raised to separate the film from the stage by a predetermined distance. the second roller can be raised to control the tension of the film during the first roller is raised to separate the film from the stage by a predetermined distance.

31. The imprinting apparatus according to claim 29, wherein when the master mold is placed on the stage, a job mold having a pattern of the master mold transferred thereon can be attached to the film, when the substrate is placed on the stage, the pattern of the job mold can be transferred to a resin coated on the substrate.

32. The imprinting apparatus according to claim 29, wherein the second roller is a floating roller.

33. The imprinting apparatus according to claim 28, wherein the sensor is a load cell disposed between the first roller and the second roller on a moving path of the film.

34. The imprinting apparatus according to claim 28, wherein the imprinting apparatus further comprises: a first pinch roller disposed between the sensor and the second roller on a moving path of the film; and a second pinch roller disposed between the second roller and the film recovery section on the moving path of the film.

35. The imprinting apparatus according to claim 28, wherein the film can be disposed on the stage to be inclined by a predetermined angle a with respect to an upper surface of the stage, the first roller is lowered and a predetermined position of the film is lowered toward the stage, so that the angle a can be decreased, the first roller is raised and the predetermined position of the film is raised from the stage, so that the angle a can be increased.

36. The imprinting apparatus according to claim 28, wherein the pressurizing member can pressurize the film while moving horizontally in a rolling contact.

37. The imprinting apparatus according to claim 28, wherein the transferring section further comprises: a first camera disposed on one side of the stage and recognizing a position of the job mold attached to the film.

38. The imprinting apparatus according to claim 37, wherein the transferring section further comprises: a second camera disposed on the other side of the stage and recognizing a position of the substrate placed on the stage.

39. The imprinting apparatus according to claim 38, wherein the second camera can recognize the position of the substrate during the first camera recognizes the position of the job mold.

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