Electronic device and method for predicting dust accumulation at heat dissipation port thereof

Abstract

The invention discloses an electronic device and a method for predicting dust accumulation at a heat dissipation port thereof. The electronic device comprises a shell, a power supply board, an environment temperature sensing module, a working area temperature sensing module, a memory and a processor, the power supply board is used for outputting load current and is provided with a working area. The ambient temperature sensing module measures the ambient temperature inside the housing. The working area temperature sensing module measures the working temperature of the working area. The processor calculates an average ambient temperature and an average working temperature according to the ambient temperatures and the working temperatures during the analysis period, and estimates a dust accumulation estimation value of the heat dissipation port according to the average ambient temperature and the average working temperature. When the dust accumulation estimated value is larger than or equal to the dust accumulation warning value, the processor sends out a warning signal.

Description

Technical Field

[0001] This invention relates to an electronic device and a method for predicting dust accumulation at its heat sink, particularly to an electronic device and a method for predicting dust accumulation at its heat sink based on an estimated value of dust accumulation at the heat sink to prevent thermal overload. Background Technology

[0002] Currently, electronic devices (such as power supplies) generate heat on their circuit boards due to power output or the operation of electronic components. If this heat is not dissipated from the device's casing, it can lead to thermal overload, causing malfunctions or errors. Therefore, electronic devices typically have ventilation holes in their casings to expel this heat. However, over time, dust and dirt can accumulate at these ventilation holes, reducing their cooling efficiency. Ultimately, thermal overload can still occur in the electronic device. Summary of the Invention

[0003] In some embodiments, an electronic device includes a housing, a power supply board, an ambient temperature sensing module, a working area temperature sensing module, a memory, and a processor. The housing includes a heat sink. The power supply board is located within the housing and is used to output load current and has a working area. The ambient temperature sensing module is located within the housing to measure the ambient temperature inside the housing. The working area temperature sensing module is disposed in the working area to measure the operating temperature of the working area. The memory stores the ambient temperature and the operating temperature when the load current is stable. The processor calculates the average ambient temperature and the average operating temperature based on multiple ambient temperature and multiple operating temperature readings stored in the memory during the analysis period, and estimates a dust accumulation estimate for the heat sink based on the average ambient temperature and the average operating temperature. When the dust accumulation estimate is greater than or equal to a dust accumulation warning value, the processor issues a warning signal.

[0004] In some embodiments, a method for predicting dust accumulation at the heat sink of an electronic device is provided, comprising: measuring ambient temperature and operating temperature; storing ambient temperature and operating temperature under stable load current conditions; retrieving multiple stored ambient temperature and multiple operating temperature data according to a data extraction period, and calculating average ambient temperature and average operating temperature respectively; estimating a dust accumulation estimate for the heat sink based on the average ambient temperature and average operating temperature; and issuing a warning signal when the dust accumulation estimate is greater than or equal to a dust accumulation warning value.

[0005] In summary, based on some embodiments, the dust accumulation prediction method for electronic devices and their heat dissipation vents estimates the degree of dust accumulation at the heat dissipation vents and prompts users in advance to clean the heat dissipation vents of electronic devices, so as to ensure that the heat dissipation vents maintain good heat dissipation capabilities.

[0006] The following detailed description of the features and advantages of the present invention is sufficient to enable anyone skilled in the art to understand the technical content of the present invention and implement it accordingly. Based on the content disclosed in this specification, the scope of the claims, and the drawings, anyone skilled in the art can easily understand the related objectives and advantages of the present invention. Attached Figure Description

[0007] Figure 1 This is a three-dimensional schematic diagram of an electronic device in some embodiments of the present invention.

[0008] Figure 2 This is a block diagram of an electronic device in some embodiments of the present invention.

[0009] Figure 3 This is a flowchart of a method for predicting dust accumulation at the heat dissipation vents of an electronic device in some embodiments of the present invention.

[0010] Figure 4 This is a flowchart of a method for predicting dust accumulation at the heat sink of an electronic device in some other embodiments of the present invention.

[0011] In the attached figures, the following labels are used:

[0012] 100: Electronic devices

[0013] 102: Shell

[0014] 104: Power Supply Board

[0015] 106: Ambient temperature sensing module

[0016] 108: Working area temperature sensing module

[0017] 110: Storage

[0018] 112: Processor

[0019] 114: Heat dissipation vent

[0020] 116: Circuit Module

[0021] 116a: First circuit module

[0022] 116b: Second circuit module

[0023] 116c: Third Circuit Module

[0024] 118: Temperature sensor

[0025] 118a: First temperature sensor

[0026] 118b: Second temperature sensor

[0027] 118c: Third temperature sensor

[0028] A1: Work Area

[0029] S: Method for predicting dust accumulation at the heat sink of electronic devices

[0030] S1, S11, S12, S2, S21, S22, S3, S4, S5: Steps Detailed Implementation

[0031] Please see Figure 1 and Figure 2 . Figure 1 This is a three-dimensional schematic diagram of an electronic device in some embodiments of the present invention. Figure 2 This is a block diagram of an electronic device in some embodiments of the present invention. In some embodiments, such as Figure 1 and Figure 2 As shown, the electronic device 100 includes a housing 102, a power supply board 104, an ambient temperature sensing module 106, a working area temperature sensing module 108, a memory 110, and a processor 112. The housing 102 includes a heat dissipation vent 114. The power supply board 104 is located within the housing 102 and is used to output a load current and has a working area A1. The ambient temperature sensing module 106 is located within the housing 102 to measure an ambient temperature inside the housing 102. The working area temperature sensing module 108 is disposed in the working area A1 to measure a working temperature in the working area A1. The memory 110 stores the ambient temperature and working temperature under a stable load current condition. The processor 112 retrieves multiple ambient temperature and multiple working temperature data stored in the memory 110 according to a data retrieval cycle, calculates an average ambient temperature and an average working temperature, and estimates a dust accumulation value related to the heat dissipation vent 114 based on the average ambient temperature and average working temperature. When the estimated dust accumulation value is greater than or equal to a dust accumulation warning value, the processor 112 issues a warning signal.

[0032] The heat dissipation vent 114 of the housing 102 can refer to at least one opening provided in the housing 102 for heat dissipation of the power supply board 104 (e.g., the heat dissipation vent 114 is a combination of at least one air inlet and at least one air outlet). In some embodiments, the heat dissipation vent 114 may be configured with a dust blocking structure (e.g., a filter) to prevent dust from entering the housing 102. Here, the dust accumulation estimate can refer to the degree to which the heat dissipation vent 114 is hindered by dust. When the dust accumulation estimate is less than the dust accumulation warning value, it indicates that the heat dissipation vent 114 has not yet reached the level of being hindered by dust. Conversely, when the dust accumulation estimate is greater than or equal to the dust accumulation warning value, it indicates that dust has hindered the heat dissipation vent 114, and the power supply board 104 may not be able to dissipate heat properly, resulting in thermal overload.

[0033] Power supply board 104 is a circuit board configured to supply power. When a load is connected, power supply board 104 can output load current to the load.

[0034] The ambient temperature sensing module 106 and the working area temperature sensing module 108 may be, for example, thermocouples, resistance temperature detectors, semiconductor temperature sensors, or infrared temperature sensors. The ambient temperature sensing module 106 may be disposed on any inner wall surface of the housing 102 to measure the temperature of the internal space of the housing 102 (this temperature is referred to as the ambient temperature). The working area temperature sensing module 108 may be disposed on the power supply board 104 (e.g., the working area temperature sensing module 108 may be integrated into the circuitry of the working area A1, or disposed on the working area A1) to measure the temperature of the working area A1 on the power supply board 104 (this temperature is referred to as the operating temperature). In some embodiments, the ambient temperature sensing module 106 and the working area temperature sensing module 108 may perform a measurement task based on a first drive signal. In some examples, the ambient temperature sensing module 106 and the working area temperature sensing module 108 are communicatively connected to the processor 112 to receive a second drive signal or to transmit the operating temperature and the ambient temperature. The ambient temperature sensing module 106 and the working area temperature sensing module 108 can also be electrically connected to the power supply board 104, and receive commands and send the working temperature and ambient temperature through the power supply board 104.

[0035] The storage device 110 may be, for example, one or a combination of two or more of the following: non-volatile memory, flash memory, solid-state drive (SSD), read-only memory (ROM), hard disk drive (HDD), or network hard drive. In some embodiments, the storage device 110 may perform a storage task based on a second drive signal. In some embodiments, the storage device 110 may be configured outside the housing 102, and the storage device 110 may be communicatively connected to the ambient temperature sensing module 106, the operating area temperature sensing module 108, and the processor 112 to receive the second drive signal, the operating temperature, and the ambient temperature, or to transmit the operating temperature and ambient temperature stored in the storage device 110. In some embodiments, the storage device 110 may be configured on the power supply board 104, and receive the second drive signal, the operating temperature, and the ambient temperature through the power supply board 104, or to transmit the operating temperature and ambient temperature stored in the storage device 110. In some examples, the storage device 110 stores a data storage time in addition to storing each operating temperature and ambient temperature.

[0036] Processor 112 estimates the dust accumulation at heat sink 114 and sends a warning signal based on a comparison between the estimated dust accumulation and a dust accumulation warning value. Processor 112 may be, for example, a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), or a field-programmable gate array (FPGA). In some examples, processor 112 sends a first drive signal when the load current is in a stable state. A stable state may mean that the load current is substantially equal to the maximum load current and maintained for a preset load time. The error range between the load current and the maximum load current may be ±2%, and the preset load time may be one minute. For example, processor 112 may begin calculating whether this state has been maintained for one minute when the load current reaches ±2% of the maximum load current. If the load current reaches the maximum load current but less than one minute has elapsed, processor 112 waits for the next time the load current reaches the maximum load current before resuming the count. It should be noted that when the measured load current is the maximum load current, the load current is more stable than when the power supply board 104 is initially connected. In some examples, the processor 112 is used to send a second drive signal when the load current is in a stable state and a measurement evaluation time has been reached. This measurement evaluation time can be twenty minutes. If the load current remains stable for longer than the measurement evaluation time, the load current reaches a stable load state, and the operating temperature and ambient temperature also stabilize, allowing the estimated dust accumulation value to closely approximate the actual dust accumulation situation (improving estimation accuracy). In some examples, the processor 112 can be configured on the power supply board 104 to receive load current, operating temperature, and ambient temperature, or to send a first drive signal, a second drive signal, and a warning signal through the power supply board 104. In some examples, the processor 112 may be configured outside the housing 102 and communicatively connected to the power board 104, the memory 110, the ambient temperature sensing module 106 and the working area temperature sensing module 108 to remotely receive load current, operating temperature and ambient temperature, or remotely send a first drive signal, a second drive signal and a warning signal.

[0037] The processor 112 can retrieve data stored in the memory 110 according to a data retrieval cycle. The data retrieval cycle can be in days or weeks; however, the length of the data retrieval cycle can be adjusted according to the level of dirt in the environment where the electronic device 100 is set. For example, in a low-level contamination environment, the data retrieval cycle can be set to "one week" or "more than one week." In a high-level contamination environment, the data retrieval cycle can be set to "three days." After retrieving multiple operating temperatures and multiple ambient temperatures for the current data retrieval cycle, the processor 112 can calculate the average ambient temperature and average operating temperature within the current data retrieval cycle, and based on this, calculate the estimated dust accumulation value corresponding to the current data retrieval cycle. In other words, the processor 112 can periodically calculate the estimated dust accumulation value and determine whether the heat sink 114 needs cleaning, thereby reducing the amount of dust accumulation on the heat sink 114 to ensure the electronic device 100 maintains normal operation. In some examples, the processor 112 can retrieve temperature data for the current data retrieval cycle based on the data storage time. The processor 112 can also clear the data stored in the memory 110 after retrieving the data for the current data retrieval cycle, so as to ensure that the latest data is retrieved in each cycle.

[0038] In some embodiments, the processor 112 obtains a dust accumulation estimate based on a multiple linear regression model. As shown in Equation 1 below, the multiple linear regression model includes two independent variables, namely, the average ambient temperature and the average operating temperature. Here, the processor 112 executes the multiple linear regression model and substitutes the average ambient temperature and the average operating temperature of the current period into the multiple linear regression model to calculate the dust accumulation estimate.

[0039] Estimated dust accumulation value = a1T + a2T env +a3(Equation 1)

[0040] a1, a2, a3: regression coefficients;

[0041] T: Operating temperature;

[0042] T env Ambient temperature.

[0043] In some embodiments, the working area A1 has multiple circuit modules 116, and the working area temperature sensing module 108 has multiple temperature sensors 118, each temperature sensor 118 measuring the temperature of a module of each circuit module 116. The average of these module temperatures is the operating temperature of the working area A1. Figure 2For example, circuit module 116 includes a first circuit module 116a, a second circuit module 116b, and a third circuit module 116c. Temperature sensor 118 includes a first temperature sensor 118a, a second temperature sensor 118b, and a third temperature sensor 118c. The first temperature sensor 118a measures the module temperature of the first circuit module 116a (hereinafter referred to as the first module temperature). The second temperature sensor 118b measures the module temperature of the second circuit module 116b (hereinafter referred to as the second module temperature). The third temperature sensor 118c measures the module temperature of the third circuit module 116c (hereinafter referred to as the third module temperature). Here, processor 112 can use the average of the first module temperature, the second module temperature, and the third module temperature as the operating temperature of operating area A1.

[0044] In some embodiments, the plurality of circuit modules 116 each have an independent function. For example, Figure 2 The electronic device 100 is a power supply. The first circuit module 116a, the second circuit module 116b, and the third circuit module 116c are DC-DC converters, sequentially coupled, each converting the output voltage of the preceding stage to the voltage required by the subsequent stage. Finally, the output of the third circuit module 116c serves as the power supply, providing power to the device under test (DUT).

[0045] In some embodiments, the multiple linear regression model includes multiple regression coefficients, which are calculated using a linear least squares method based on a set of regression coefficients for each of the multiple multiple linear regression sub-models. Each multiple linear regression sub-model corresponds to a specific circuit module 116. In other words, after collecting data from each circuit module 116 (average ambient temperature and average operating temperature under different dust accumulation levels), regression coefficients of Equation 1 are obtained through regression analysis to obtain multiple linear regression sub-models corresponding to each circuit module 116. For example, a first multiple linear regression sub-model is established based on regression analysis of data from the first circuit module 116a; a second multiple linear regression sub-model is established based on regression analysis of data from the second circuit module 116b; and a third multiple linear regression sub-model is established based on regression analysis of data from the third circuit module 116c. The regression coefficients of the first multiple linear regression sub-model constitute a first set of regression coefficients. The regression coefficients of the second multiple linear regression sub-model constitute a second set of regression coefficients. The regression coefficients of the third multiple linear regression sub-model constitute a third set of regression coefficients. Based on this set of regression coefficients, an optimal set of regression coefficients (i.e., the regression coefficients of the multiple linear regression model) is obtained by fitting the model using the linear least squares method.

[0046] The aforementioned "average ambient temperature and average operating temperature under different dust accumulation levels" can refer to the air intake volume under different dust accumulation levels (dust accumulation levels) of the heat dissipation vent 114 by setting one or more baffles. Specifically, as the number of baffles increases, the amount of air intake of the heat dissipation vent 114 decreases to simulate the air intake volume under dust accumulation conditions. In other words, the more baffles there are, the higher the dust accumulation level. For example, one baffle can be defined as the first dust accumulation level (light dust accumulation), two baffles can be defined as the second dust accumulation level (moderate dust accumulation), and three baffles can be defined as the third dust accumulation level (heavy dust accumulation). Therefore, the operating temperature of each circuit module (116a, 116b, 116c) will vary according to different dust accumulation levels. Specifically, the operating temperature measured under the first dust accumulation level is lower than that measured under the second dust accumulation level, and the operating temperature measured under the second dust accumulation level is lower than that measured under the third dust accumulation level. Therefore, by varying the number of shielding plates, the operating temperature of each circuit module (116a, 116b, 116c) can be measured, and the optimal set of regression coefficients can be obtained through linear least squares fitting.

[0047] In some examples, the dust accumulation warning value is negatively correlated with ambient temperature. In other words, the higher the average ambient temperature, the lower the dust accumulation warning value.

[0048] like Figure 3 As shown, in some embodiments, the dust accumulation prediction method S for the heat dissipation port of the electronic device 100 includes the following steps: measuring the ambient temperature and operating temperature (step S1); storing the ambient temperature and operating temperature under stable load current conditions (step S2); retrieving multiple stored ambient temperatures and multiple operating temperatures according to the data extraction cycle, and calculating the average ambient temperature and average operating temperature respectively (step S3); estimating the dust accumulation estimate for the heat dissipation port based on the average ambient temperature and average operating temperature (step S4); and issuing a warning signal when the dust accumulation estimate is greater than or equal to the dust accumulation warning value (step S5).

[0049] In some embodiments, the processor 112 of the electronic device 100 executes a dust accumulation prediction method S for the heat sink of the electronic device. Specifically, in step S1, the processor 112 drives the ambient temperature sensing module 106 and the operating area temperature sensing module 108 to measure the ambient temperature and the operating temperature. In step S2, the processor 112 stores the ambient temperature and the operating temperature based on the load current meeting the steady-state condition. In step S3, the processor 112 calculates the average ambient temperature and the average operating temperature based on multiple ambient temperature and multiple operating temperature readings. In step S4, the processor 112 estimates a dust accumulation estimate based on the average ambient temperature and the average operating temperature. In step S5, the processor 112 issues a warning signal when the dust accumulation estimate is greater than or equal to a dust accumulation warning value.

[0050] In some embodiments, step S4 further includes: obtaining the dust accumulation estimate based on a multiple linear regression model, wherein the multiple linear regression model includes two independent variables, namely the average ambient temperature and the average operating temperature.

[0051] In some embodiments, such as Figure 4 As shown, step S1 further includes: determining whether the load current is substantially equal to the maximum load current and maintaining it for a preset load time (step S11); and actuating the ambient temperature sensing module 106 and the operating area temperature sensing module 108 to measure the ambient temperature and operating temperature (step S12). Step S11 can serve as a prerequisite for determining whether to measure the ambient temperature and operating temperature. For example, when the processor 112 determines that the load current is substantially equal to the maximum load current (with an error of ±2%), it starts counting whether the time this state is maintained reaches the preset load time. If the condition is met, the processor 112 actuates the ambient temperature sensing module 106 and the operating area temperature sensing module 108 (step S12). If the condition is not met, it waits until the next time the load current reaches the maximum load current before resuming the counting.

[0052] In some embodiments, such as Figure 4 As shown, step S2 further includes: determining whether the load current is in a stable state and whether the measurement evaluation time has been reached (step S21); and actuating the memory 110 to store the ambient temperature and operating temperature (step S22). Step S21 can serve as a prerequisite for determining whether to store the ambient temperature and operating temperature. For example, the processor 112 can start counting when the load current reaches a stable state and determine whether this state has been maintained for the required time and whether the measurement evaluation time has been reached. If the condition is met, the processor 112 drives the memory 110 to store the ambient temperature and operating temperature data (step S22). If the condition is not met, the processor 112 continues counting until the measurement evaluation time is reached.

[0053] In summary, according to some embodiments, the electronic device 100 and its heat dissipation port dust accumulation prediction method S estimate the degree of dust accumulation on the heat dissipation port 114 and remind the user in advance to clean the heat dissipation port 114 of the electronic device 100, so as to ensure that the heat dissipation port 114 maintains good heat dissipation capacity.

[0054] The embodiments described above are only for illustrating the technical ideas and features of this case. Their purpose is to enable those skilled in the art to understand the content of this case and implement it accordingly. They should not be used to limit the scope of the patent in this case. That is, all equivalent changes or modifications made in accordance with the spirit disclosed in this case should still be covered within the scope of the patent application in this case.

[0055] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the claims of the present invention.

Claims

1. An electronic device, characterized by comprising: A housing comprising a heat dissipation port; A power supply board located in the housing for outputting a load current and having an operating area; An ambient temperature sensing module located in the housing for measuring an ambient temperature inside the housing; An operating area temperature sensing module arranged in the operating area for measuring an operating temperature of the operating area; A storage for storing the ambient temperature and the operating temperature under a stable state of the load current; and A processor for extracting a plurality of the ambient temperatures and a plurality of the operating temperatures stored in the storage according to a data extraction period, calculating an average ambient temperature and an average operating temperature respectively, and estimating a dust accumulation estimation value about the heat dissipation port according to the average ambient temperature and the average operating temperature; Wherein, when the dust accumulation estimation value is greater than or equal to a dust accumulation warning value, the processor sends a warning signal. The processor obtains the dust accumulation estimation value according to a multiple linear regression model, and the multiple linear regression model includes two independent variables, which are the average ambient temperature and the average operating temperature respectively. The operating area has a plurality of circuit modules, and the operating area temperature sensing module has a plurality of temperature sensors, each of which measures a module temperature of each of the circuit modules, and the average of the module temperatures is the operating temperature of the operating area. 2.The electronic device of claim 1, wherein, The multiple linear regression model includes a plurality of regression coefficients, which are calculated by a linear least square method according to a regression coefficient set of each of a plurality of multiple linear regression sub-models, and each of the multiple linear regression sub-models corresponds to each of the circuit modules. 3.The electronic device of claim 2, wherein, The dust accumulation warning value is negatively correlated with the ambient temperature. 4.The electronic device of claim 3, wherein, Measuring an ambient temperature and an operating temperature; 5.The electronic device of claim 1, wherein, Storing the ambient temperature and the operating temperature under a stable state of a load current; 6.A method for predicting dust accumulation in a heat dissipation port of an electronic device, the method comprising: Extracting a plurality of the ambient temperatures and a plurality of the operating temperatures stored according to a data extraction period, calculating an average ambient temperature and an average operating temperature respectively; Estimating a dust accumulation estimation value about a heat dissipation port according to the average ambient temperature and the average operating temperature; and When the dust accumulation estimation value is greater than or equal to a dust accumulation warning value, sending a warning signal. The step of estimating the dust accumulation estimation value about the heat dissipation port according to the average ambient temperature and the average operating temperature further comprises: Obtaining the dust accumulation estimation value according to a multiple linear regression model, and the multiple linear regression model includes two independent variables, which are the average ambient temperature and the average operating temperature respectively. The multiple linear regression model includes a plurality of regression coefficients, which are calculated by a linear least square method according to a regression coefficient set of each of a plurality of multiple linear regression sub-models. 7.The electronic device's vent dust accumulation prediction method of claim 6, wherein, The dust accumulation warning value is negatively correlated with the ambient temperature. The step of measuring the ambient temperature and the operating temperature further comprises judging whether the load current is substantially equal to a maximum load current and maintaining a preset load time; and the step of storing the ambient temperature and the operating temperature under the stable state of the load current further comprises judging whether the load current is in the stable state and whether a measurement evaluation time is reached. 8.The electronic device's vent dust accumulation prediction method of claim 7, wherein, ​ 9.The electronic device's vent dust accumulation prediction method of claim 6, wherein, ​ 10.The electronic device's vent dust accumulation prediction method of claim 6, wherein, ​

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