Phase shift circuit and chip

Abstract

The invention relates to the technical field of integrated circuits, and discloses a phase shift circuit and a chip. According to the invention, when the phase shift circuit in the phase shifter chip is manufactured, at least one bonding wire connection position needs to be preset in the phase shift circuit, and when a user needs to use a complete phase shift circuit function, the user can connect a bonding wire at the at least one bonding wire connection position to form the complete phase shift circuit. The complete phase shift circuit at least comprises a first signal end, a second signal end and a first switch. Moreover, at least one end of the first switch is provided with a bonding wire connecting end, and the bonding wire connecting end is used for connecting a bonding wire, so that the bonding wire and the first switch are connected in series or in parallel. Therefore, a phase shifter chip prepared based on the phase shift circuit can have a smaller layout area and lower insertion loss.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, and in particular to a phase-shifting circuit and chip. Background Technology

[0002] In the fields of mobile communications, satellite, and aerospace, phase shifters are an important component of equipment, used to achieve functions such as beamforming, signal filtering, and signal modulation. For example, in communication equipment such as base stations, phase shifters can adjust the phase of the signals transmitted by each antenna, enabling the signals transmitted by each antenna to work together to form a concentrated signal beam pointing in a specific direction, thereby achieving the technical effect of beamforming.

[0003] With the development of circuit integration technology, microwave monolithic integrated circuit (MMIC) phase shifters are widely used. An MMIC phase shifter is a highly integrated chip-based phase shifter module (which can be described as a "phase shifter chip"). In fabricating a phase shifter chip, planar transmission lines, on-chip inductors, on-chip capacitors, and other components can be fabricated on a semiconductor plane using photolithography, thereby integrating the phase shifting circuit onto the semiconductor plane and achieving the integration and miniaturization of the phase shifter.

[0004] In fabricating on-chip inductors for phase shifter chips, metal is deposited on a semiconductor plane, and then photolithography is used to etch the deposited metal layer to form a coil pattern, thus etching the metal layer into an inductor coil. However, the on-chip inductors obtained through this fabrication process have a large physical size, requiring a large layout area within the phase shifter chip, resulting in a large overall layout area for the phase shifter chip. Furthermore, the quality factor (Q) of the on-chip inductors obtained through this fabrication process is also relatively low. Moreover, the lower the Q value of the on-chip inductor, the greater the signal loss, leading to greater signal loss (which can be described as "insertion loss") during signal transmission in the phase shifter chip.

[0005] Therefore, how to reduce the layout area of ​​phase shifter chips and reduce insertion loss are urgent problems to be solved when manufacturing phase shifter chips. Summary of the Invention

[0006] This application provides a phase shifting circuit and chip, which can reduce the layout area of ​​the phase shifter chip and reduce the insertion loss of the phase shifter chip.

[0007] In a first aspect, this application provides a phase-shifting circuit, characterized in that it includes a first signal terminal, a second signal terminal, a first phase-shifting module, and a second phase-shifting module; wherein the first phase-shifting module includes a first bonding wire, and a first switch is connected to the first bonding wire; and, when the first switch is in a first state, the first bonding wire is connected to a first phase-shifting path, the first phase-shifting path further includes a first signal terminal and a second signal terminal, wherein the absolute difference between the phase of the first signal transmitted by the first signal terminal and the phase of the second signal transmitted by the second signal terminal is a first phase shift amount; and when the first switch is in a second state, the second phase-shifting module is connected to a second phase-shifting path, the second phase-shifting path further includes a first signal terminal and a second signal terminal, wherein the absolute difference between the phase of the third signal transmitted by the first signal terminal and the phase of the fourth signal transmitted by the second signal terminal is a second phase shift amount; and, the signal transmitted by the first signal terminal is an input signal, and the signal transmitted by the second signal terminal is an output signal, or the signal transmitted by the second signal terminal is an input signal, and the signal transmitted by the first signal terminal is an output signal.

[0008] In the above embodiments, the first bonding wire being connected to the first phase shifting path means that the first bonding wire is not short-circuited or open-circuited, and current can flow through the first bonding wire; the second phase shifting module being connected to the second phase shifting path means that the second phase shifting module is not short-circuited or open-circuited, and current can flow through the second phase shifting module.

[0009] Based on the above implementation, when fabricating the phase-shifting circuit in a phase-shifter chip, one or more bonding wires can be used to replace one or more on-chip inductors in the phase-shifting circuit, thereby enabling the phase-shifter chip to have a smaller layout area and lower insertion loss. Furthermore, when fabricating the phase-shifter chip, an incomplete phase-shifting circuit can be fabricated using existing fabrication processes according to existing phase-shifting circuit topologies, and the fabricated incomplete phase-shifting circuit must have at least one bonding wire connection location. Next, after obtaining the incomplete phase-shifter chip with the incomplete phase-shifting circuit, if the user needs to use the complete phase-shifting circuit function, the user can connect bonding wires at the bonding wire connection locations to form a complete phase-shifting circuit. Specifically, when connecting the bonding wires, the user can connect thicker or shorter bonding wires (which can then act as conductors) to the pads, solely for connecting the disconnected circuit into a complete circuit; or, the user can connect thinner or longer bonding wires (which can then act as inductors) to the pads, that is, while connecting the disconnected circuit into a complete circuit, it also indicates the addition of an inductor element to the circuit. This reduces the overall layout area of ​​the phase shifter chip and lowers the insertion loss of the phase shifter chip.

[0010] In one possible implementation of the first aspect described above, the first phase shift amount is related to the diameter and length of the first bonding wire.

[0011] Based on the above implementation method, since different thicknesses or lengths of bonding wires correspond to different inductance values, bonding wires of different sizes can be connected at the bonding wire connection positions to obtain phase shift circuits with different phase shift amounts, thereby meeting different user needs.

[0012] In one possible implementation of the first aspect described above, the first switch is connected in series with the first bonding wire, and the first state of the first switch is a closed state and the second state is an open state.

[0013] In one possible implementation of the first aspect described above, the second phase-shifting module includes a first capacitor, and the circuit further includes a second capacitor, a second bonding wire, and a second switch; wherein, a first terminal of the first capacitor is connected to a first signal terminal, and a second terminal of the first capacitor is connected to a second terminal of the second capacitor, a first terminal of the second bonding wire, and a first terminal of the second switch; a first terminal of the second capacitor is connected to a second signal terminal; a second terminal of the second capacitor is connected to a first terminal of the second bonding wire and a first terminal of the second switch; a first terminal of the second switch is connected to a first terminal of the second bonding wire, and a second terminal of the second switch is connected to a second terminal of the second bonding wire, and the second terminal of the second switch is grounded; a second terminal of the second bonding wire is grounded; a first terminal of the first bonding wire is connected to the first signal terminal, and a second terminal of the first bonding wire is connected to the first terminal of the first switch; a second terminal of the first switch is connected to the second signal terminal.

[0014] In the above implementation, the first signal terminal can be as described below. Figure 7A Node 61 in the phase shift circuit 700 shown Figure 8A Node 61 in the phase-shifting circuit 800 shown; the second signal terminal can be described later. Figure 7A Node 62 in the phase shift circuit 700 shown Figure 8A Node 62 in the phase-shifting circuit 800 shown; the first bonding wire can be described later. Figure 7A The bonding wire 701 in the phase shift circuit 700 shown or Figure 8A The bonding wire 801 in the phase shifting circuit 800 shown; the second bonding wire can be described later. Figure 7A The bonding wire 703 in the phase shift circuit 700 shown or Figure 8A The bonding wire 802 in the phase-shifting circuit 800 shown; the first switch can be described later. Figure 7A The switch S62 in the phase shift circuit 700 shown is or Figure 8A The phase-shifting circuit 800 shown includes switch S62; the second switch can be described later. Figure 7A The switch S61 in the phase shift circuit 700 shown is or Figure 8A The switch S61 in the phase-shifting circuit 800 shown; the first capacitor can be described later. Figure 7A The capacitor C61 in the phase shift circuit 700 shown is or Figure 8A The phase-shifting circuit 800 shown includes capacitor C61; the second capacitor can be described later. Figure 7A The capacitor C62 in the phase shift circuit 700 shown is or Figure 8A The capacitor C62 in the phase shift circuit 800 shown.

[0015] In one possible implementation of the first aspect above, when the first switch is closed and the second switch is closed, the first phase shifting path further includes the first switch; when the first switch is open and the second switch is open, the second phase shifting path further includes the first capacitor, the second capacitor, and the second bonding wire.

[0016] In one possible implementation of the first aspect described above, the circuit further includes a third bonding wire; wherein a first end of the third bonding wire is connected to a first signal terminal, and a second end of the third bonding wire is connected to a second signal terminal.

[0017] In the above embodiments, the third bonding wire can be Figure 7A The bonding wire 702 in the phase shifting circuit 700 shown.

[0018] In one possible implementation of the first aspect described above, when the first switch is in the closed state and the second switch is in the closed state, the first phase-shifting path further includes a third bonding wire.

[0019] Based on the above implementation, it is evident that multiple bonding wire connection positions can be configured in the phase shifter chip. When connecting the bonding wires, the user can connect them at some of these positions, or at all of them. It is understood that reserving redundant bonding wire connection positions provides greater flexibility in reconfiguring a single phase shifter chip into multiple phase shifting circuits.

[0020] In one possible implementation of the first aspect described above, the second phase-shifting module includes a tenth capacitor and an eleventh capacitor, and the circuit further includes a twelfth bonding wire and a ninth switch; wherein, the first end of the tenth capacitor is connected to a first signal terminal, and the second end of the tenth capacitor is connected to the second end of the eleventh capacitor and the first end of the first bonding wire; the first end of the eleventh capacitor is connected to a second signal terminal, and the second end of the eleventh capacitor is connected to the first end of the first bonding wire; the first end of the first switch is connected to the second end of the first bonding wire and the first end of the twelfth bonding wire, and the second end of the first switch is connected to the second end of the twelfth bonding wire, and the second end of the first switch is grounded; the first end of the ninth switch is connected to the first signal terminal, and the second end of the ninth switch is connected to the second signal terminal.

[0021] In the above implementation, the first signal terminal can be as described below. Figure 21ANode 211 in the phase-shifting circuit 2100 shown; the second signal terminal can be described later. Figure 21A Node 212 in the phase-shifting circuit 2100 shown; the first switch can be described later. Figure 21A The phase-shifting circuit 2100 shown includes switch S212; the ninth switch can be described later. Figure 21A The switch S211 in the phase-shifting circuit 2100 shown; the first bonding wire can be described later. Figure 21A The bonding wire 2101 in the phase shift circuit 2100 shown; the twelfth bonding wire can be described later. Figure 21A The bonding wire 2102 in the phase-shifting circuit 2100 shown; the tenth capacitor can be described later. Figure 21A The phase-shifting circuit 2100 shown includes capacitor C211; the eleventh capacitor can be described later. Figure 21A The capacitor C212 in the phase shift circuit 2100 shown.

[0022] In one possible implementation of the first aspect above, when the first switch is in the closed state and the ninth switch is in the open state, the first phase shifting path further includes a tenth capacitor and an eleventh capacitor; when the first switch is in the open state and the ninth switch is in the open state, the first phase shifting path further includes a tenth capacitor, an eleventh capacitor, and a twelfth bonding wire.

[0023] In one possible implementation of the first aspect described above, the first switch may also be connected in parallel with the first bonding wire, and the first state of the first switch is the open state, and the second state of the first switch is the closed state.

[0024] In one possible implementation of the first aspect described above, the second phase-shifting module includes a third capacitor, and the circuit further includes a fourth capacitor and a third switch; wherein, the first terminal of the third capacitor is connected to a first signal terminal, and the second terminal of the third capacitor is connected to the second terminal of the fourth capacitor and the first terminal of the third switch; the first terminal of the fourth capacitor is connected to a second signal terminal, and the second terminal of the fourth capacitor is connected to the first terminal of the third switch; the first terminal of the first switch is connected to the first signal terminal and the first terminal of the first bonding wire, and the second terminal of the first switch is connected to the second signal terminal and the second terminal of the first bonding wire; the second terminal of the third switch is grounded; the first terminal of the first bonding wire is connected to the first signal terminal, and the second terminal of the first bonding wire is connected to the second signal terminal.

[0025] In one possible implementation of the first aspect above, the circuit further includes a fourth bonding wire; wherein the first end of the fourth bonding wire is connected to the second end of the third capacitor, the second end of the fourth capacitor, and the first end of the third switch, respectively; the second end of the fourth bonding wire is connected to the second end of the third switch; and the second end of the fourth bonding wire is grounded.

[0026] In the above implementation, the first signal terminal can be as described below. Figure 11A Node 101 in the phase-shifting circuit 1100 shown; the second signal terminal can be described later. Figure 11A Node 102 in the phase-shifting circuit 1100 shown; the first bonding wire can be described later. Figure 11A The bonding wire 1101 in the phase shift circuit 1100 shown; the fourth bonding wire can be described later. Figure 11A The bonding wire 1100 in the phase-shifting circuit 1100 shown; the first switch can be described later. Figure 11A The phase-shifting circuit 1100 shown includes switch S101; the third switch can be described later. Figure 11A The switch S102 in the phase-shifting circuit 1100 shown; the third capacitor can be described later. Figure 11A The capacitor C101 in the phase-shifting circuit 1100 shown; the fourth capacitor can be described later. Figure 11A The capacitor C102 in the phase shift circuit 1100 shown.

[0027] In one possible implementation of the first aspect above, the circuit further includes a first inductor; wherein the first end of the first inductor is connected to the second end of the third capacitor, the second end of the fourth capacitor, and the first end of the third switch, the second end of the first inductor is connected to the second end of the third switch, and the second end of the first inductor is grounded.

[0028] In the above implementation, the first signal terminal can be as described below. Figure 15B Node 151 in the phase-shifting circuit 1510 shown; the second signal terminal can be described later. Figure 15B Node 152 in the phase-shifting circuit 1510 shown; the first bonding wire can be described later. Figure 15B The bonding wire 1503 in the phase-shifting circuit 1510 shown; the first switch can be described later. Figure 15B The phase-shifting circuit 1510 shown includes switch S151; the third switch can be described later. Figure 15B The switch S152 in the phase-shifting circuit 1510 shown; the third capacitor can be described later. Figure 15B The capacitor C151 in the phase-shifting circuit 1510 shown; the fourth capacitor can be described later. Figure 15B The capacitor C152 in the phase shift circuit 1510 shown.

[0029] Based on the above embodiments, it can be seen that an incomplete phase-shifting circuit may not contain inductors, allowing the reconstructed complete phase-shifting circuit to replace all on-chip inductors with bonding wires; alternatively, an incomplete phase-shifting circuit may contain one or more on-chip inductors, allowing the reconstructed complete phase-shifting circuit to replace some on-chip inductors with bonding wires. It is understood that this application does not limit the presence or number of inductors in the incomplete phase-shifting circuit.

[0030] In one possible implementation of the first aspect described above, the first phase-shifting module further includes a fifth bonding wire, the second phase-shifting module further includes a fifth capacitor, and the first bonding wire is connected to the fifth bonding wire, and the fifth capacitor is connected to the first signal terminal.

[0031] In one possible implementation of the first aspect described above, the circuit further includes a sixth bonding wire and a fourth switch; wherein, the first end of the first switch is connected to the second end of the first bonding wire, the second end of the fifth bonding wire, and the first end of the sixth bonding wire, respectively; the second end of the first switch is connected to the second end of the sixth bonding wire, and the second end of the first switch is grounded; the first end of the fourth switch is connected to a first signal terminal, and the second end of the fourth switch is connected to a second signal terminal; the first end of the fifth capacitor is connected to the first signal terminal, and the second end of the fifth capacitor is connected to the second signal terminal; the first end of the first bonding wire is connected to the first signal terminal, and the second end of the first bonding wire is connected to the second end of the fifth bonding wire and the first end of the sixth bonding wire, respectively; the first end of the fifth bonding wire is connected to the second signal terminal, and the second end of the fifth bonding wire is connected to the first end of the sixth bonding wire; the second end of the sixth bonding wire is grounded.

[0032] In the above implementation, the first signal terminal can be as described below. Figure 16A Node 161 in the phase-shifting circuit 1600 shown; the second signal terminal can be described later. Figure 16A Node 162 in the phase-shifting circuit 1600 shown; the first bonding wire can be described later. Figure 16A The bonding wire 1601 in the phase shifting circuit 1600 shown; the fifth bonding wire can be described later. Figure 16A The bonding wire 1602 in the phase shifting circuit 1600 shown; the sixth bonding wire can be Figure 16A The bonding wire 1603 in the phase-shifting circuit 1600 shown; the first switch can be described later. Figure 16A The fourth switch can be the switch S162 in the phase shift circuit 1600 shown; the fourth switch can be described later. Figure 16A The switch S161 in the phase-shifting circuit 1600 shown; the fifth capacitor can be described later. Figure 16A The capacitor C161 in the phase shift circuit 1600 shown.

[0033] In one possible implementation of the first aspect described above, the first phase-shifting module further includes a fifth bonding wire, the second phase-shifting module includes a fifth capacitor, and the circuit further includes a seventh capacitor and a seventh switch; wherein, the first end of the fifth capacitor is connected to a first signal terminal, and the second end of the fifth capacitor is connected to the first end of the seventh switch; the first end of the seventh capacitor is connected to the second end of the first bonding wire, the second end of the fifth bonding wire, and the first end of the first switch, respectively, the second end of the seventh capacitor is connected to the second end of the first switch, and the second end of the seventh capacitor is grounded; the first end of the first switch is connected to the second end of the first bonding wire and the second end of the fifth bonding wire, respectively, and the second end of the first switch is grounded; the second end of the seventh switch is connected to a second signal terminal; the first end of the first bonding wire is connected to the first signal terminal, the second end of the first bonding wire is connected to the second end of the fifth bonding wire; and the first end of the fifth bonding wire is connected to the second signal terminal.

[0034] In the above implementation, the first signal terminal can be as described below. Figure 18A Node 181 in the phase-shifting circuit 1800 shown; the second signal terminal can be described later. Figure 18A Node 182 in the phase-shifting circuit 1800 shown; the first bonding wire can be described later. Figure 18A The bonding wire 1801 in the phase shift circuit 1800 shown; the fifth bonding wire can be described later. Figure 18A The bonding wire 1802 in the phase-shifting circuit 1800 shown; the first switch can be described later. Figure 18A The phase-shifting circuit 1800 shown includes switch S182; the seventh switch can be described later. Figure 18A The switch S181 in the phase-shifting circuit 1800 shown; the fifth capacitor can be described later. Figure 18A The capacitor C181 in the phase-shifting circuit 1800 shown; the seventh capacitor can be described later. Figure 18A The capacitor C182 in the phase shift circuit 1800 shown.

[0035] In one possible implementation of the first aspect described above, the circuit further includes an eleventh bonding wire, an eighth switch, and a ninth capacitor; wherein, the first terminal of the fifth capacitor is connected to a first signal terminal, and the second terminal of the fifth capacitor is connected to a second signal terminal; the first terminal of the ninth capacitor is connected to the second terminal of the first bonding wire, the second terminal of the fifth bonding wire, the first terminal of the first switch, and the first terminal of the eleventh bonding wire, respectively; the second terminal of the ninth capacitor is connected to the second terminal of the first switch and the second terminal of the eleventh bonding wire, respectively, and the second terminal of the ninth capacitor is grounded; the first terminal of the first switch is connected to the second terminal of the first bonding wire, the second terminal of the fifth bonding wire, the second terminal of the fifth bonding wire, and the second terminal of the eleventh bonding wire, respectively. The second end of the fifth bonding wire and the first end of the eleventh bonding wire are connected. The second end of the first switch is connected to the second end of the eleventh bonding wire, and the second end of the first switch is grounded. The first end of the eighth switch is connected to the first signal terminal, and the second end of the eighth switch is connected to the second signal terminal. The first end of the first bonding wire is connected to the first signal terminal, and the second end of the first bonding wire is connected to the second end of the fifth bonding wire and the first end of the eleventh bonding wire, respectively. The first end of the fifth bonding wire is connected to the second signal terminal, and the second end of the fifth bonding wire is connected to the first end of the eleventh bonding wire. The second end of the eleventh bonding wire is grounded.

[0036] In the above implementation, the first signal terminal can be as described below. Figure 19A Node 191 in the phase-shifting circuit 1900 shown; the second signal terminal can be described later. Figure 19A Node 192 in the phase-shifting circuit 1900 shown; the first switch can be described later. Figure 19A The phase-shifting circuit 1900 shown includes switch S192; the eighth switch can be described later. Figure 19A The switch S191 in the phase-shifting circuit 1900 shown; the first bonding wire can be described later. Figure 19A The bonding wire 1901 in the phase shift circuit 1900 shown; the fifth bonding wire can be described later. Figure 19A The bonding wire 1902 in the phase-shifting circuit 1900 shown; the eleventh bonding wire can be described later. Figure 19A The bonding wire 1903 in the phase-shifting circuit 1900 shown; the fifth capacitor can be described later. Figure 19A The capacitor C191 in the phase-shifting circuit 1900 shown; the ninth capacitor can be described later. Figure 19A The capacitor C192 in the phase shift circuit 1900 shown.

[0037] In one possible implementation of the first aspect described above, the first state of the first switch in each of the above embodiments is an open state, and the second state of the first switch is a closed state; furthermore, when the first switch is in the open state, the first phase shifting path further includes a fifth bonding wire; and when the first switch is in the closed state, the second phase shifting path further includes a fifth capacitor.

[0038] In one possible implementation of the first aspect described above, the first phase-shifting module further includes a seventh bonding wire, the second phase-shifting module includes a fifth switch, and the circuit further includes a sixth switch and an eighth bonding wire; wherein, the first end of the first switch is connected to the second end of the first bonding wire and the second end of the seventh bonding wire, respectively, and the second end of the first switch is connected to the first end of the sixth switch and the first end of the eighth bonding wire, respectively; the first end of the fifth switch is connected to a first signal terminal, and the second end of the fifth switch is connected to a second signal terminal; the first end of the sixth switch is connected to the first end of the eighth bonding wire, and the second end of the sixth switch is connected to the second end of the eighth bonding wire, and the second end of the sixth switch is grounded; the first end of the first bonding wire is connected to the first signal terminal, and the second end of the first bonding wire is connected to the second end of the seventh bonding wire; the first end of the seventh bonding wire is connected to the second signal terminal; and the second end of the eighth bonding wire is grounded.

[0039] In the above implementation, the first signal terminal can be as described below. Figure 17A Node 171 in the phase-shifting circuit 1700 shown; the second signal terminal can be described later. Figure 17A Node 172 in the phase-shifting circuit 1700 shown; the first bonding wire can be described later. Figure 17A The bonding wire 1701 in the phase shift circuit 1700 shown; the seventh bonding wire can be described later. Figure 17A The bonding wire 1702 in the phase shift circuit 1700 shown; the eighth bonding wire can be described later. Figure 17A The bonding wire 1703 in the phase-shifting circuit 1700 shown; the first switch can be described later. Figure 17A The phase-shifting circuit 1700 shown includes switch S172; the fifth switch can be described later. Figure 17A The phase-shifting circuit 1700 shown includes switch S171; the sixth switch can be described later. Figure 17A The switch S173 in the phase-shifting circuit 1700 shown.

[0040] Based on the above embodiments, it can be seen that the phase shifting circuit may include one or more capacitors, or may not include capacitors. The number of capacitors in this application is not limited.

[0041] Based on the above embodiments, inductance loading can be achieved using bonding wires, and the inductance value can be continuously adjusted by changing the length and diameter of the bonding wires. Furthermore, the phase-shifting circuit provided in this application can also improve the Q value of the phase-shifting circuit and reduce insertion loss.

[0042] Secondly, this application provides a phase shifter chip, wherein the chip includes any of the possible phase shifting circuits in the above embodiments.

[0043] Based on the above embodiments, the phase-shifting circuit in the phase shifter chip can be set to any of the phase-shifting circuits mentioned in this application, thereby enabling the phase shifter chip to have a smaller layout area and lower insertion loss. Furthermore, it also allows for reconfigurable design and normalized layout design of the phase shifter chip. For example, only one incomplete phase shifter chip layout can be designed. After obtaining this incomplete phase shifter chip, different complete phase shifter chips can be obtained through different bonding wire connection methods. This method avoids the need for multiple phase shifter chip layout designs. In addition, the phase shifter chip fabricated using the phase-shifting circuit provided in this application can eliminate all or part of the large-area inductors, reducing the layout area of ​​the phase shifter chip, thereby achieving a small-area, low-cost design of the phase shifter chip.

[0044] In one possible implementation of the second aspect above, the chip may further include N phase shift circuits, wherein the first signal terminal of the k-th phase shift circuit is connected to the second signal terminal of the (k-1)-th phase shift circuit, the second signal terminal of the k-th phase shift circuit is connected to the first signal terminal of the (k+1)-th phase shift circuit, 1 < k ≤ N-1, and k and N are both positive integers.

[0045] In the above embodiments, multiple phase shifting circuits can be set in the phase shifter chip, and each phase shifting circuit is connected in sequence. The user can control the phase shifter chip to have different phase shifting effects by controlling the switching state of each phase shifting circuit.

[0046] In one possible implementation of the second aspect described above, the chip includes at least two pads for connecting the two ends of the bonding wire.

[0047] In the above embodiments, multiple pads can be pre-set in the phase shifter chip so that the two ends of the bonding wire can be connected to the two pads.

[0048] In one possible implementation of the second aspect described above, the number of bonding wire connection positions formed between the pads in the chip is greater than or equal to the number of bonding wires in the N phase shift circuits.

[0049] In the above embodiments, if multiple bonding wire connection positions are pre-defined in the incomplete phase-shifting circuit, the user can connect bonding wires at all bonding wire connection positions. Alternatively, if multiple bonding wire connection positions are pre-defined in the incomplete phase-shifting circuit, the user can connect bonding wires only at some of the bonding wire connection positions, without needing to connect bonding wires at every bonding wire connection position. In this way, different bonding wire connection schemes can be used to obtain complete phase-shifting circuits with different phase-shifting effects to meet the user's different phase-shifting requirements. Attached Figure Description

[0050] Figure 1AAccording to some embodiments of this application, a schematic diagram of the circuit topology of a phase-shifting circuit is shown;

[0051] Figure 1B According to some embodiments of this application, an equivalent structural schematic diagram of a first phase-shifting circuit is shown;

[0052] Figure 1C According to some embodiments of this application, an equivalent structural schematic diagram of a second phase-shifting circuit is shown;

[0053] Figure 2 According to some embodiments of this application, a schematic diagram of an on-chip inductor is shown;

[0054] Figure 3A According to some embodiments of this application, a schematic diagram of a first bonding wire connection method is shown;

[0055] Figure 3B According to some embodiments of this application, a schematic diagram of a second bonding wire connection method is shown;

[0056] Figure 3C According to some embodiments of this application, a schematic diagram of a third bonding wire connection method is shown;

[0057] Figure 3D According to some embodiments of this application, a schematic diagram of a fourth bonding wire connection method is shown;

[0058] Figure 4 According to some embodiments of this application, a schematic flowchart of a phase-shifting circuit fabrication method is shown;

[0059] Figure 5 According to some embodiments of this application, a schematic flowchart is shown for reconstructing different phase-shifting circuits based on a bonding wire scheme and a non-complete phase-shifting circuit.

[0060] Figure 6 According to some embodiments of this application, a schematic diagram of a first incomplete bridge-type phase-shifting circuit is shown;

[0061] Figure 7A According to some embodiments of this application, a schematic diagram of the topology of the reconstructed first complete bridge phase-shifting circuit is shown;

[0062] Figure 7B According to some embodiments of this application, a schematic diagram of the equivalent circuit structure corresponding to the first complete bridge phase-shifting circuit is shown;

[0063] Figure 7C According to some embodiments of this application, an equivalent circuit diagram corresponding to a switch in different states is shown;

[0064] Figure 8A According to some embodiments of this application, a schematic diagram of the topology of the reconstructed second complete bridge phase-shifting circuit is shown;

[0065] Figure 8B According to some embodiments of this application, a schematic diagram of the equivalent circuit structure corresponding to the second complete bridge phase-shifting circuit is shown;

[0066] Figure 9A According to some embodiments of this application, a simulation schematic diagram corresponding to the first complete bridge-type phase-shifting circuit is shown;

[0067] Figure 9B According to some embodiments of this application, a simulation schematic diagram corresponding to the second complete bridge phase shift circuit is shown;

[0068] Figure 10 According to some embodiments of this application, a schematic diagram of a second incomplete bridge-type phase-shifting circuit is shown;

[0069] Figure 11A According to some embodiments of this application, a schematic diagram of the topology of the reconstructed third complete bridge phase-shifting circuit is shown;

[0070] Figure 11B According to some embodiments of this application, a simulation schematic diagram corresponding to a third complete bridge-type phase-shifting circuit is shown;

[0071] Figure 11C According to some embodiments of this application, a simulation schematic diagram of a bridge-type phase-shifting circuit constructed from on-chip inductors is shown;

[0072] Figure 12 According to some embodiments of this application, a simulation diagram is shown corresponding to different bonding wire lengths or diameters in the same complete bridge phase-shifting circuit;

[0073] Figure 13 According to some embodiments of this application, a simulation schematic diagram corresponding to the first type of multi-bit phase shift circuit is shown;

[0074] Figure 14 According to some embodiments of this application, a simulation schematic diagram corresponding to the second type of multi-bit phase shift circuit is shown;

[0075] Figure 15A According to some embodiments of this application, a schematic diagram of a third type of non-complete bridge phase-shifting circuit is shown;

[0076] Figure 15B According to some embodiments of this application, a schematic diagram of the topology of the reconstructed fourth complete bridge phase-shifting circuit is shown;

[0077] Figure 15C According to some embodiments of this application, a simulation schematic diagram corresponding to a fourth complete bridge-type phase-shifting circuit is shown;

[0078] Figure 16A According to some embodiments of this application, a schematic diagram of the topology of the reconstructed fifth complete bridge phase-shifting circuit is shown;

[0079] Figure 16B According to some embodiments of this application, a schematic diagram of the equivalent circuit structure corresponding to the fifth complete bridge phase-shifting circuit is shown;

[0080] Figure 16C According to some embodiments of this application, a simulation schematic diagram corresponding to the fifth complete bridge phase-shifting circuit is shown;

[0081] Figure 17A According to some embodiments of this application, a schematic diagram of the topology of the reconstructed sixth complete bridge phase-shifting circuit is shown;

[0082] Figure 17B According to some embodiments of this application, a schematic diagram of the equivalent circuit structure corresponding to the sixth complete bridge phase-shifting circuit is shown;

[0083] Figure 17C According to some embodiments of this application, a simulation schematic diagram corresponding to the sixth complete bridge phase-shifting circuit is shown;

[0084] Figure 18A According to some embodiments of this application, a schematic diagram of the topology of the reconstructed seventh complete bridge phase-shifting circuit is shown;

[0085] Figure 18B According to some embodiments of this application, a schematic diagram of the equivalent circuit structure corresponding to the seventh complete bridge phase-shifting circuit is shown;

[0086] Figure 18C According to some embodiments of this application, a simulation schematic diagram corresponding to the seventh complete bridge phase-shifting circuit is shown;

[0087] Figure 19A According to some embodiments of this application, a schematic diagram of the topology of the reconstructed eighth complete bridge phase-shifting circuit is shown;

[0088] Figure 19B According to some embodiments of this application, a schematic diagram of the equivalent circuit structure corresponding to the eighth complete bridge phase-shifting circuit is shown;

[0089] Figure 19C According to some embodiments of this application, a simulation schematic diagram corresponding to the eighth complete bridge phase-shifting circuit is shown;

[0090] Figure 20 According to some embodiments of this application, a schematic diagram of a fourth incomplete bridge-type phase-shifting circuit is shown;

[0091] Figure 21A According to some embodiments of this application, a schematic diagram of the topology of the reconstructed ninth complete bridge phase-shifting circuit is shown;

[0092] Figure 21B According to some embodiments of this application, a schematic diagram of the equivalent circuit structure corresponding to the ninth complete bridge phase-shifting circuit is shown;

[0093] Figure 21C According to some embodiments of this application, a simulation schematic diagram corresponding to the ninth complete bridge phase-shifting circuit is shown. Detailed Implementation

[0094] The illustrative embodiments of this application include, but are not limited to, a phase-shifting circuit and a chip.

[0095] To better understand the solution of this application, the relevant terms in the field will be explained first.

[0096] (1) Q value: It is an important parameter for measuring the performance of an inductor. The higher the Q value, the less signal loss the inductor causes; the lower the Q value, the greater signal loss the inductor causes.

[0097] (2) Phase shift: This refers to the phase difference between the input and output states of a signal in a phase-shifting circuit. Furthermore, phase shifts can be divided into positive and negative phase shifts. A positive phase shift indicates that the signal will be in a phase-leading state after processing by the phase-shifting circuit. A negative phase shift indicates that the signal will be in a phase-lagging state after processing by the phase-shifting circuit.

[0098] (3) Phase shifting circuit: This can be the circuit topology in the phase shifter chip, including on-chip inductors, on-chip capacitors, switches, and other components. The phase change between the signal input state and the output state is achieved through on-chip inductors and / or on-chip capacitors. In the phase shifting circuit, the amount of phase shift of the signal can be controlled by properly configuring the on-chip inductors and on-chip capacitors to achieve the desired phase shift effect.

[0099] (4) Bonding wire: a type of fine metal wire lead. The material can be any metal such as gold, silver, copper, aluminum, or aluminum alloy. It is often used to connect chips to circuit boards and other external components to realize signal transmission between chips and circuit boards.

[0100] (5) Pad: refers to the connection point in a chip or circuit board. The two ends of the bonding wire can be connected to the two pads respectively to realize the circuit connection between the two pads.

[0101] The background of the phase-shifting circuit provided in the embodiments of this application is briefly described below.

[0102] As mentioned earlier, when manufacturing a phase shifter, the components of the phase shifting circuit can be integrated onto a semiconductor plane to form a chip-based phase shifter module (which can be described as a "phase shifter chip"), thereby achieving the integration and miniaturization of the phase shifter. The phase shifting effect achieved after the signal is processed by the phase shifting circuit can be either a phase-leading state or a phase-lagging state. The desired phase shifting effect can be achieved by appropriately configuring on-chip inductors and on-chip capacitors in the phase shifting circuit. The following will combine... Figure 1A The schematic diagram of the topology of the phase shift circuit 100 shown provides a brief introduction to the phase shifting effect that the phase shift circuit can achieve.

[0103] like Figure 1A As shown, the phase-shifting circuit 100 may include inductors L11 and L12, capacitors C11 and C12, and switches S11 and S12. One end of inductor L11 is connected to both capacitor C11 and node 11, and the other end is connected to switch S11. One end of inductor L12 is connected to both capacitors C11 and C12, and the other end is grounded. One end of capacitor C11 is connected to node 11, and the other end is connected to switch S12. One end of capacitor C12 is connected to both switch S11 and node 12, and the other end is connected to switch S12. Switch S11 is connected to node 12, and switch S12 is grounded. Node 11 can be the input terminal of the phase-shifting circuit 100, and node 12 can be the output terminal of the phase-shifting circuit 100. Alternatively, node 12 can be the input terminal of the phase-shifting circuit 100, and node 11 can be the output terminal of the phase-shifting circuit 100.

[0104] Among them, when Figure 1A When both switches S11 and S12 of the phase-shifting circuit 100 are in the open state Figure 1A The phase-shifting circuit 100 shown can be equivalent to: Figure 1B The T-type high-pass filter phase-shifting circuit 101 is shown. In... Figure 1B In the circuit 101, one end of capacitor C11 is connected to node 11, and the other end is connected to inductor L12 and capacitor C12. One end of capacitor C12 is connected to node 12, and the other end is connected to one end of inductor L12. The other end of inductor L12 is grounded. When the signal flows from node 11 to node 12 in circuit 101, the phase shift amount corresponding to the signal phase shift effect can be calculated using the following formula (I).

[0105]

[0106] in, yes Figure 1BThe phase shift amount of the phase shift circuit 101 shown indicates that the phase of the signal will lead after being processed by the phase shift circuit 101. Angle. X is the reactance value corresponding to the capacitor, and the reactance values ​​corresponding to capacitors C11 and C12 are the same, both being X. B is the reactance value corresponding to the inductor L12.

[0107] Therefore, when Figure 1A When both switches S11 and S12 of the phase-shifting circuit 100 are in the open state, the signal will lead after being processed by the phase-shifting circuit 101. The angle is adjusted to achieve phase shifting of the input signal.

[0108] In addition, when Figure 1A When both switches S11 and S12 of the phase-shifting circuit 100 are closed... Figure 1A The phase-shifting circuit 100 shown can be equivalent to: Figure 1C The π-type low-pass filter phase-shifting circuit 102 shown is illustrated. Figure 1C In circuit 102, one end of inductor L11 is connected to one end of capacitor C11 and node 11, and the other end of inductor L11 is connected to one end of capacitor C12 and node 12. The other end of capacitor C11 is grounded, and the other end of capacitor C12 is grounded. When the signal flows from node 11 to node 12 of circuit 102, the phase shift corresponding to the signal phase shift effect can be calculated with reference to the following formula (II).

[0109]

[0110] in, yes Figure 1C The phase shift amount of the phase shift circuit 102 shown indicates that the phase of the signal will be delayed after being processed by the phase shift circuit 102. Angle. x is the reactance value corresponding to the capacitor, and the reactance values ​​corresponding to capacitors C11 and C12 are the same, both being x. b is the reactance value corresponding to the inductor L11.

[0111] Therefore, when Figure 1A When both switches S11 and S12 of the phase-shifting circuit 100 are closed, the phase of the signal will be delayed after processing by the phase-shifting circuit 102. The angle is adjusted to achieve phase shifting of the input signal.

[0112] Therefore, referring to the above Figure 1B and Figure 1C The phase shift circuit shown, and the phase shift calculation formulas shown in Formula (I) and Formula (II), demonstrate that by rationally designing the topological connection of on-chip inductors and on-chip capacitors in the phase shift circuits of different phase shifter chips, different phase shift circuits can achieve different phase shift amounts, thereby enabling different phase shifter chips to achieve their respective desired phase shift effects.

[0113] However, the physical size of on-chip inductors fabricated using current processes is relatively large, requiring them to occupy a significant area within the phase shifter chip. This results in a larger overall layout area and higher manufacturing costs for the phase shifter chip. Furthermore, due to limitations in semiconductor processes and materials, on-chip inductors fabricated using current processes exhibit significant on-chip parasitic effects, substantial additional losses, and low Q-values.

[0114] Therefore, how to reduce the layout area of ​​phase shifter chips and reduce insertion loss are urgent problems to be solved when manufacturing phase shifter chips.

[0115] Among these, there exists a type of fine metal wire lead (which can be described as a "bonding wire"), commonly used to connect chips to circuit boards and other external components, serving both conductive and fixing functions. It can be understood that a bonding wire is a metal wire with conductive properties; and, when current flows through it, the smaller the cross-sectional area (i.e., the thinner the bonding wire), the greater the impedance, and the greater the change in current flowing through the bonding wire, resulting in a larger inductance value. Therefore, shorter or thicker bonding wires can be used as conductors, while longer or thinner bonding wires can be used as inductors. Furthermore, when using bonding wires as inductors, due to their low parasitic resistance, thin linewidth, and the fact that the surrounding medium is air, the Q value of the bonding wire is relatively high, and the signal loss is also smaller. In addition, compared to on-chip inductors composed of multilayer coils, bonding wires do not need to be fabricated on the phase shifter chip using semiconductor processes, thus eliminating the need for additional layout area. For example, Figure 2 A schematic diagram of the on-chip inductor 201 is shown. It can be understood that the layout area of ​​the phase shifter chip corresponding to connecting the on-chip inductor 201 between nodes 21 and 22 is much larger than the layout area of ​​the phase shifter chip corresponding to connecting a fine metal wire (bonding wire) between nodes 21 and 22.

[0116] Therefore, this application provides a phase-shifting circuit. In this application, when fabricating the phase-shifting circuit in a phase shifter chip, one or more inductors in the phase-shifting circuit can be replaced by one or more bonding wires, thereby enabling the phase shifter chip to have a smaller layout area and lower insertion loss. The phase-shifting circuit includes at least a first signal terminal, a second signal terminal, a first phase-shifting module, and a second phase-shifting module. The first phase-shifting module includes a first bonding wire, and a first switch is connected to the first bonding wire. When the first switch is in a first state (open or closed), the first bonding wire is connected to a first phase-shifting path. The first phase-shifting path also includes a first signal terminal and a second signal terminal. The absolute difference between the phase of the first signal transmitted at the first signal terminal and the phase of the second signal transmitted at the second signal terminal is the first phase shift amount. When the first switch is in a second state (open or closed), the second phase-shifting module is connected to a second phase-shifting path. The second phase-shifting path also includes a first signal terminal and a second signal terminal. The absolute difference between the phase of the third signal transmitted at the first signal terminal and the phase of the fourth signal transmitted at the second signal terminal is the second phase shift amount. The signal transmitted at the first signal terminal is an input signal, and the signal transmitted at the second signal terminal is an output signal, or the signal transmitted at the second signal terminal is an input signal, and the signal transmitted at the first signal terminal is an output signal.

[0117] Thus, the phase shifting circuit in the phase shifter chip can be any of the phase shifting circuits mentioned in this application, thereby enabling the phase shifter chip to have a smaller layout area and lower insertion loss.

[0118] In the embodiments of this application, each component / module being connected to the first phase-shifting path means that the component / module is not short-circuited or open-circuited, and current can flow through the component / module. Similarly, a component / module being connected to the second phase-shifting path means that the component / module is not short-circuited or open-circuited, and current can flow through the component / module. Furthermore, the equivalent circuit formed when the first bonding wire is turned on is the first phase-shifting path; the equivalent circuit formed when the second phase-shifting module is turned on is the second phase-shifting path.

[0119] In some embodiments, when fabricating a phase shifter chip, a non-complete phase shifting circuit is first fabricated on a semiconductor plane to form a non-complete phase shifter chip. That is, the non-complete phase shifting circuit is fabricated using existing fabrication processes according to existing phase shifting circuit topologies, and the fabricated non-complete phase shifting circuit needs to have at least one bonding wire connection position. Next, after obtaining the non-complete phase shifter chip with the non-complete phase shifting circuit, if the user needs to use the complete phase shifting circuit function, the user can connect bonding wires at the bonding wire connection positions to form a complete phase shifting circuit. When connecting the bonding wires, the user can connect thicker or shorter bonding wires (which can act as conductors) to the pads, solely for connecting the broken circuit into a complete circuit; or, the user can connect thinner or longer bonding wires (which can act as inductors) to the pads, meaning that while connecting the broken circuit into a complete circuit, an inductor element is also added to the circuit. As can be seen, after obtaining an incomplete phase shifter chip, users can use different bonding wire connection methods to form different complete phase shifter circuits for the same incomplete phase shifter circuit, thereby meeting different user needs.

[0120] In other embodiments, the bonding wires have different inductance values ​​due to variations in their thickness or length. Therefore, when connecting the bonding wires, users can use different bonding wires (of varying thickness or length) based on phase shift requirements to obtain complete phase-shifting circuits with different phase-shifting effects. Furthermore, users can connect the bonding wires at different connection locations to obtain different complete phase-shifting circuits.

[0121] In other embodiments, after obtaining a non-complete phase shifter chip with a non-complete phase shifting circuit, the user can connect bonding wires at any preset bonding wire connection position to reconstruct the non-complete phase shifting circuit into a complete phase shifting circuit. The following can be combined with... Figures 3A to 3D The diagram shown illustrates the bonding wire connection method and describes the process of connecting bonding wires at different bonding wire connection positions.

[0122] For example, refer to Figure 3AAs shown in Figure (a), in the incomplete phase-shifting circuit, components 1, 2...N can form a series circuit, and pads 301 and 302 can also exist in the incomplete phase-shifting circuit. Each component can be any on-chip switch, on-chip capacitor, on-chip inductor, on-chip resistor, etc., and this application does not limit this. After obtaining the incomplete phase-shifting circuit, a bonding wire 303 can be connected between pads 301 and 302 to form a complete phase-shifting circuit. Users can connect thinner or longer bonding wires 303 to make them equivalent to inductors 303'. At this time, the phase-shifting circuit reconstructed based on the bonding wires and the incomplete phase-shifting circuit can be equivalent to... Figure 3A The equivalent circuit shown in Figure (b) is in [the diagram]. Figure 3A In Figure (b), components 1, 2...N are connected in sequence to form a series circuit, and inductor 303' is connected in parallel across the two ends of the series circuit. In this way, the loading of the parallel inductor can be achieved.

[0123] For example, refer to Figure 3B As shown in Figure (a), in the incomplete phase-shifting circuit, component 1 and component 2 are connected, with a pad 304 between them and a pad 305 at the connection point of the ground lead. Each component can be any on-chip switch, on-chip capacitor, on-chip inductor, on-chip resistor, etc., and this application does not limit this. After obtaining the incomplete phase-shifting circuit, a bonding wire 306 can be connected between pads 304 and 305 to form a complete phase-shifting circuit. If the bonding wire 306 is thin or long, it can be equivalent to an inductor 306'. In this case, the phase-shifting circuit reconstructed based on the bonding wire and the incomplete phase-shifting circuit can be equivalent to... Figure 3B The equivalent circuit shown in Figure (b) is in [the diagram]. Figure 3B In Figure (b), component 1 and component 2 are connected, and a grounding inductor 306' is connected in the middle of the line connecting component 1 and component 2. In this way, the grounding inductor can be loaded.

[0124] For example, refer to Figure 3C As shown in Figure (a), in the incomplete phase-shifting circuit, components 1, 2, and 3 form a T-shaped topology, with components 1 and 2 connected. A pad 307 is provided in the middle of the connection between components 1 and 2, and a pad 308 is provided at one end of component 3. Each component can be any on-chip switch, on-chip capacitor, on-chip inductor, on-chip resistor, etc., and this application does not limit this. After obtaining the incomplete phase-shifting circuit, a bonding wire 309 can be connected between pads 307 and 308 to form a complete phase-shifting circuit. At this time, the phase-shifting circuit reconstructed based on the bonding wire and the incomplete phase-shifting circuit can be equivalent to... Figure 3C The equivalent circuit shown in Figure (b) is in [the diagram]. Figure 3C In Figure (b), one end of component 1 is connected to both component 2 and component 3, and one end of component 2 is connected to component 3. In this way, components 1, 2, and 3 can be connected using a T-shaped circuit.

[0125] For example, refer to Figure 3D As shown in Figure (a), the incomplete phase-shifting circuit contains component 1, with pads 310 and 311 respectively at its two ends. Component 1 can be any component such as an on-chip switch, on-chip capacitor, on-chip inductor, or on-chip resistor; this application does not limit its application in this regard. After obtaining this incomplete phase-shifting circuit, a bonding wire 312 can be connected between pads 310 and 311 to form a complete phase-shifting circuit. At this time, the phase-shifting circuit reconstructed based on the bonding wire and the incomplete phase-shifting circuit can be equivalently represented as follows: Figure 3D The equivalent circuit shown in Figure (b) is in [the diagram]. Figure 3D In Figure (b), component 1 is short-circuited by the wire. In this way, a short-circuit connection of the circuit components can be achieved.

[0126] Thus, based on the above Figures 3A to 3D As shown in the schematic diagrams, the pads can be located at any position in the incomplete phase-shifting circuit and are connected to at least one end of a circuit element. Users can connect bonding wires between specific pads at any position. Furthermore, users can use the bonding wires as conductors or inductors to form different phase-shifting circuits, thereby meeting different user needs. It should be understood that the pads can also be located in other positions within the incomplete phase-shifting circuit, and this application does not limit this.

[0127] The following is a combination of... Figure 4 The flowchart shown describes the process of fabricating the phase-shifting circuit mentioned in this application. Specifically, the method includes the following steps:

[0128] S401: Obtain an incomplete phase shifter chip, wherein the incomplete phase shifter chip has an incomplete phase shifting circuit, and the incomplete phase shifting circuit has at least one bonding wire connection position.

[0129] In some embodiments, when fabricating the phase shifter circuit of a phase shifter chip, some circuit components may be omitted, thereby forming an incomplete phase shifter circuit in an incomplete phase shifter chip. At least two pads may be pre-set in the phase shifter chip, and these pre-set pads are used to connect the two ends of a bonding wire. For example, pads may be pre-set at both ends of the missing component to form bonding wire connection positions. Furthermore, the number of bonding wire connection positions may be greater than or equal to the number of missing components. The pad area can be arbitrarily set, and the metal material used for the pads can be any metal material such as gold, aluminum, copper, or tungsten; this application does not limit this.

[0130] Furthermore, it should be understood that the bonding wire connection locations (pads for connecting the bonding wires) mentioned in this application are located on the phase shifter chip and are different from the pads used when packaging the phase shifter chip. Also, the bonding wire connection locations mentioned in this application do not include / do not involve pads at I / O interfaces.

[0131] It is understood that incomplete phase shifter chips can be fabricated using current chip manufacturing processes, such as silicon-on-insulator (SOI), gallium nitride (GaN), and gallium arsenide (GaAs) processes. Incomplete phase shifters can also include multiple phase-shifting circuits. These circuits can be fabricated using current integrated circuit manufacturing processes. The components in the incomplete phase-shifting circuits are all commonly used on-chip components in integrated circuits. This application does not impose any limitations on this.

[0132] S402: Connect a bonding wire at at least one bonding wire connection position in a non-complete phase shift circuit to obtain a complete phase shift circuit and a complete phase shifter chip with complete phase shift effect, wherein the two ends of a bonding wire are respectively connected to the two pads corresponding to the bonding wire connection position.

[0133] In some embodiments, after obtaining an incomplete phase shifter chip, if a user needs to use the complete phase shifting function, the user can connect bonding wires at at least one bonding wire connection position of the incomplete phase shifter circuit to obtain a complete phase shifter circuit and a complete phase shifter chip.

[0134] In some embodiments, when connecting the bonding wire, the user can connect a thicker or shorter bonding wire to the pad. In this case, the bonding wire can be used as a conductor, solely for connecting an incomplete phase-shifting circuit into a complete phase-shifting circuit. For example, as described above. Figure 3C As shown in Figure (a), the user can connect thicker or shorter bonding wires 309 between pads 307 and 308 of the incomplete phase-shifting circuit to obtain, as shown in Figure (a). Figure 3C The complete phase-shifting circuit is shown in Figure (b).

[0135] In other embodiments, when connecting the bonding wire, the user can also connect thinner or longer bonding wires to the pads. In this case, the bonding wire can be used as an inductor, representing the addition of an inductive element to the circuit while simultaneously connecting the incomplete phase-shifting circuit into a complete phase-shifting circuit. For example, as described above. Figure 3A As shown in Figure (a), the user can connect longer or thinner bonding wires 303 between pads 301 and 302 of the incomplete phase-shifting circuit to obtain, as shown in Figure (a). Figure 3A The complete phase-shifting circuit is shown in Figure (b).

[0136] In other embodiments, the bonding wires have different inductance values ​​due to variations in their thickness or length. Therefore, when connecting the bonding wires, users can use different bonding wires (of different thicknesses or lengths) based on phase-shifting requirements to obtain complete phase-shifting circuits with different phase-shifting effects. Furthermore, users can connect the bonding wires at different connection locations to obtain different complete phase-shifting circuits. For example, as... Figure 5 As shown, for the same incomplete phase-shifting circuit A, various on-chip bonding wire schemes can be used for reconstruction to obtain complete phase-shifting circuits with different phase shift amounts. For example, if on-chip bonding wire scheme 1 is used to reconstruct the incomplete phase-shifting circuit A, a complete phase-shifting circuit A1 can be obtained, in which case the phase shift amount corresponding to the complete phase-shifting circuit A1 is m1. As another example, if on-chip bonding wire scheme 2 is used to reconstruct the incomplete phase-shifting circuit A, a complete phase-shifting circuit A2 can be obtained, in which case the phase shift amount corresponding to the complete phase-shifting circuit A2 is m2. As yet another example, if on-chip bonding wire scheme n is used to reconstruct the incomplete phase-shifting circuit A, a complete phase-shifting circuit An can be obtained, in which case the phase shift amount corresponding to the complete phase-shifting circuit An is mn. Similarly, various on-chip bonding wire schemes can be used to reconstruct the incomplete phase-shifting circuit A to obtain complete phase-shifting circuits with different phase shift amounts. It should be understood that this application does not limit the thickness, length, material, etc., of the bonding wires.

[0137] Thus, based on the above-described phase-shifting circuit fabrication method, the overall layout area of ​​the phase shifter chip can be reduced, and the insertion loss of the phase shifter chip can be decreased. Furthermore, for the same incomplete phase shifter chip, different complete phase-shifting circuits can be formed using different bonding wire connection methods to obtain different phase shift amounts, thereby meeting different user needs.

[0138] It is understood that the phase-shifting circuit designed based on the phase-shifting circuit fabrication method provided in this application can have various product forms. For example, the product forms may include, but are not limited to: a non-complete phase shifter chip with an incomplete phase-shifting circuit; a complete phase shifter chip formed by using bonding wires as conductors or inductors to constitute a complete phase-shifting circuit; an integrated module formed by multiple complete phase shifter chips and / or incomplete phase shifter chips; and a complete phase-shifting circuit based on bonding wires can also serve as a functional module of systems such as communication systems. This application does not limit the product form corresponding to the phase-shifting circuit.

[0139] It can also be understood that the phase-shifting circuit provided in this application can be any form of phase-shifting circuit. For example, it can be a switch-bridge type phase-shifting circuit, with bonding wires replacing one or more inductors in the switch-bridge type phase-shifting circuit. Here, a switch-bridge type phase-shifting circuit refers to a circuit in which a phase shifter network is embedded within the switch, and the switch in the circuit is equivalent to a resistor or capacitor when it is in a closed or open state, thus constructing different circuit topologies. For example, the above... Figure 1A The circuit 100 shown is a switch-bridge phase-shifting circuit. When both switches S11 and S12 in the switch-bridge phase-shifting circuit 100 are open, it can be equivalent to... Figure 1B The circuit 101 shown can be equivalent to the following when both switches S11 and S12 in the switch bridge phase shift circuit 100 are closed: Figure 1C The circuit 102 shown is an example. Furthermore, the phase-shifting circuit provided in this application can also be a switch-line phase-shifting circuit, where one or more inductors in the switch-line phase-shifting circuit are replaced by bonding wires. Specifically, a switch-line phase-shifting circuit means that when the switch in the circuit is in a closed or open state, the topology of the phase-shifting circuit remains unchanged, and the switch is only used to select the phase-shifting path.

[0140] It should be understood that this application does not limit the topological connection method of the phase-shifting circuit. For ease of description, the following embodiments all use a switch bridge phase-shifting circuit as an example to introduce the phase-shifting circuit mentioned in this application. In addition, for ease of description, the switch bridge phase-shifting circuit can also be described as a bridge phase-shifting circuit in the following embodiments.

[0141] In some embodiments, one or more components may be missing in an incomplete bridge phase-shifting circuit, preventing it from performing the full bridge phase-shifting circuit function. Furthermore, in addition to providing pads to form bonding wire connection positions at the component missing locations, pads can also be provided at other locations in the incomplete bridge phase-shifting circuit. That is, the number of pre-set bonding wire connection positions in the incomplete bridge phase-shifting circuit is greater than or equal to the number of missing components.

[0142] For example, Figure 6A schematic diagram of a non-complete bridge phase-shifting circuit 600 with three pre-set bonding wire connection positions is shown. The non-complete bridge phase-shifting circuit 600 may include capacitors C61 and C62, switches S61 and S62, pads 601, 602, 603, 604, and 605. In the non-complete bridge phase-shifting circuit 600, the first terminal of capacitor C61 is connected to node 61 and pad 602, and the second terminal of capacitor C61 is connected to the second terminal of capacitor C62, the first terminal of switch S61, and pad 604. The first terminal of capacitor C62 is connected to node 62 and pad 603, and the second terminal of capacitor C62 is connected to the first terminal of switch S61 and pad 604. The first terminal of switch S61 is connected to pad 604, and the second terminal is connected to pad 605; the second terminal of switch S61 is grounded. The first end of switch S62 is connected to pad 601, and the second end is connected to node 62 and pad 603 respectively.

[0143] Among them, Figure 6 In the non-complete bridge phase-shifting circuit 600 shown, node 61 can be a signal input terminal and node 62 a signal output terminal; alternatively, node 62 can be a signal input terminal and node 61 a signal output terminal. Nodes 61 and 62 can be directly connected to the input or output pads of the phase shifter chip, or they can be connected to other external circuit boards or other modules to realize signal input and output. Furthermore, in the non-complete bridge phase-shifting circuit 600, capacitors C61 and C62 can be common on-chip capacitors, such as metal-insulator-metal (MIM) capacitors, capacitors composed of off-state transistors, and junction capacitors, etc., which are not limited in this application. Switches S61 and S62 can be transistors, positive intrinsic negative (PIN) diodes, Schottky diodes, or other components with switching properties, and the materials can be silicon (Si), gallium nitride (GaN), gallium arsenide (GaAs), and silicon germanium (SiGe), etc. Furthermore, switches S61 and S62 can also be switches composed of multiple switching elements connected in series, parallel, or other configurations; this application does not limit this.

[0144] In some embodiments, after obtaining a non-complete bridge phase shifter chip with a non-complete bridge phase shifter circuit 600, the user can use different on-chip bonding wire schemes to connect the bonding wires at preset bonding wire connection positions, such as between pads 601 and 602, between pads 602 and 603, and between pads 604 and 605, thereby obtaining a complete bridge phase shifter circuit with different phase shift amounts. For example, the following can be combined with... Figure 7A The complete bridge phase-shifting circuit 700 corresponding to the first on-chip bonding wire scheme shown, and the combination of Figure 8A The process of reconstructing the incomplete bridge phase shift circuit 600 to obtain the complete bridge phase shift circuit is described in the second on-chip bonding wire scheme shown in the complete bridge phase shift circuit 800.

[0145] In some embodiments, after obtaining a non-complete phase shifter chip with a non-complete bridge phase shifter circuit 600, the user can connect bonding wires at each bonding wire connection position to obtain a complete bridge phase shifter circuit and phase shifter chip. For example, as Figure 7A The bridge-type phase-shifting circuit 700 shown allows users to connect bonding wire 701 (an example of a first bonding wire and a first phase-shifting module in this application) between pads 601 and 602, bonding wire 702 (an example of a third bonding wire in this application) between pads 602 and 603, and bonding wire 703 (an example of a second bonding wire in this application) between pads 604 and 605. Furthermore, the bridge-type phase-shifting circuit 700 also includes capacitor C61 (an example of a first capacitor and a second phase-shifting module in this application), capacitor C62 (an example of a second capacitor in this application), switch S61 (an example of a second switch in this application), and switch S62 (an example of a first switch in this application).

[0146] Among them, Figure 7AIn the bridge-type phase-shifting circuit 700 shown, the first end of capacitor C61 is connected to node 61, and the second end of capacitor C61 is connected to the second end of capacitor C62, the first end of switch S61, and the first end of bonding wire 703. The first end of capacitor C62 is connected to node 62, and the second end of capacitor C62 is connected to the first end of switch S61 and the first end of bonding wire 703. The first end of switch S61 is connected to the first end of bonding wire 703, and the second end of switch S61 is connected to the second end of bonding wire 703, and the second end of switch S61 is grounded. The second end of bonding wire 703 is grounded. The first end of bonding wire 701 is connected to node 61 (an example of the first signal terminal of this application), and the second end of bonding wire 701 is connected to the first end of switch S62; the second end of switch S62 is connected to node 62 (an example of the second signal terminal of this application). The first end of bonding wire 702 is connected to node 61, and the second end of bonding wire 702 is connected to node 62.

[0147] It should be noted that, in Figure 7A In the bridge-type phase-shifting circuit 700 shown, when switch S62 is closed, it indicates that switch S62 is in the first state. At this time, if switch S61 is also closed, then bonding wire 701, switch S62, and bonding wire 702 are connected to the first phase-shifting path, that is, current can flow through bonding wire 701, switch S62, and bonding wire 702. At this time, the absolute difference between the phase of the signal transmitted by the first signal terminal and the phase of the signal transmitted by the second signal terminal is the first phase shift amount. When switch S62 is open, it indicates that switch S62 is in the second state. If switch S61 is also open, then capacitor C61, capacitor C62, and bonding wire 703 are connected to the second phase-shifting path, that is, current can flow through capacitor C61, capacitor C62, and bonding wire 703. The absolute difference between the phase of the signal transmitted by the first signal terminal and the phase of the signal transmitted by the second signal terminal is the second phase shift amount.

[0148] Furthermore, when switch S62 is closed, if switch S61 is open, the first phase-shifting path may also include bonding wire 701, switch S62, bonding wire 702, capacitor C61, capacitor C62, and bonding wire 703. When switch S62 is open, if switch S61 is closed, the second phase-shifting path may also include bonding wire 702, switch S61, and capacitor C61.

[0149] Furthermore, in some embodiments, in Figure 7AIn the bridge-type phase-shifting circuit 700 shown, when connecting bonding wires 701, 702, and 703, the user can consider each bonding wire as a different component (inductor or wire) based on the different inductance values ​​resulting from the different parameters such as the diameter and length of the bonding wires. For example, the user can use a thicker or shorter bonding wire 701 to connect the circuit; in this case, bonding wire 701 can be considered equivalent to a wire. Thinner or longer bonding wires 702 and 703 can be used to load inductance; in this case, bonding wire 702 can be considered equivalent to inductor L71, and bonding wire 703 can be considered equivalent to inductor L72. Furthermore, the bridge-type phase-shifting circuit 700 can be equivalent to... Figure 7B The equivalent circuit 710 is shown.

[0150] exist Figure 7B In the equivalent circuit 710 shown, the first end of capacitor C61 is connected to node 61, and the other end is connected to the second end of capacitor C62, the first end of switch S61, and the first end of inductor L72. The first end of capacitor C62 is connected to node 62, and the second end is connected to the first end of switch S61 and the first end of inductor L72. The first end of switch S61 is connected to the first end of inductor L72, and the second end of switch S61 is connected to the second end of inductor L72, with the second end of switch S61 grounded. The first end of switch S62 is connected to node 61, and the second end is connected to node 62. The two ends of inductor L71 are connected to nodes 61 and 62, respectively, and the second end of inductor L72 is grounded.

[0151] In circuit 710, when switch S62 is closed, it can be equivalent to a resistor R1; when switch S61 is open, it can be equivalent to a capacitor. Furthermore, the capacitor represented by switch S61 and the inductor L72 form a parallel resonance, which is equivalent to an open circuit. Therefore, when switch S62 is closed and switch S61 is open, circuit 710 can be equivalent to... Figure 7C The circuit 720 is shown. In circuit 720, between node 61 and node 62, resistor R1 is connected in parallel with inductor L71.

[0152] Furthermore, when switch S62 in circuit 710 is in the open state and switch S61 is in the closed state, circuit 710 can be equivalent to... Figure 1C The π-type bridge phase shift circuit 102 is shown. Therefore, by connecting bonding wires at the bonding wire connection positions of the incomplete bridge phase shift circuit 600, a complete bridge phase shift circuit 710 with phase shifting function can be obtained.

[0153] In other embodiments, if multiple bonding wire connection positions are pre-defined in a non-complete bridge-type phase-shifting circuit, the user can connect bonding wires at each bonding wire connection position. For example, the above... Figure 7AThe connection diagram of circuit 700 shown shows that bonding wires are connected at each bonding wire connection position in the incomplete bridge phase shifting circuit 600.

[0154] However, in other embodiments, if multiple bonding wire connection positions are pre-set in the non-complete bridge phase shifter circuit, the user can connect bonding wires only at some of these positions, without needing to connect bonding wires at every single connection position. It can be understood that the setting of redundant bonding wire connection positions provides greater design freedom for the same non-complete phase shifter chip to be reconfigured into multiple complete phase shifter chips. That is, the number of bonding wire connection positions formed between pre-set pads in the phase shifter chip can be greater than or equal to the number of bonding wires connected in each bridge phase shifter circuit of the phase shifter chip. For example, if the user obtains the above... Figure 6 After obtaining the incomplete bridge phase shifter chip corresponding to the incomplete bridge phase shifter circuit 600 shown, the user can connect bonding wires at some of the bonding wire connection positions to obtain a complete bridge phase shifter circuit and phase shifter chip. For example, as shown... Figure 8A The bridge-type phase-shifting circuit 800 shown allows users to connect bonding wire 801 (an example of the first bonding wire and the first phase-shifting module of this application) between pads 601 and 602, and bonding wire 802 (an example of the second bonding wire of this application) between pads 604 and 605, while keeping pads 602 and 603 in a non-connected state. Furthermore, the bridge-type phase-shifting circuit 700 also includes capacitor C61 (an example of the first capacitor and the second phase-shifting module of this application), capacitor C62 (an example of the second capacitor of this application), switch S61 (an example of the second switch of this application), and switch S62 (an example of the first switch of this application).

[0155] Among them, Figure 8A In the bridge-type phase-shifting circuit 800 shown, the first terminal of capacitor C61 is connected to node 61 (an example of the first signal terminal in this application), and the second terminal of capacitor C61 is connected to the second terminal of capacitor C62, the first terminal of switch S61, and the first terminal of bonding wire 802. The first terminal of capacitor C62 is connected to node 62 (an example of the second signal terminal in this application), and the second terminal is connected to the first terminal of switch S61 and the first terminal of bonding wire 802. The first terminal of switch S61 is connected to the first terminal of bonding wire 802, and the second terminal of switch S61 is connected to the second terminal of bonding wire 802, and the second terminal of switch S61 is grounded. The second terminal of bonding wire 802 is grounded. The first terminal of bonding wire 801 is connected to node 61, and the second terminal of bonding wire 801 is connected to the first terminal of switch S62. The second terminal of switch S62 is connected to node 62.

[0156] It should be noted that, in Figure 8AIn the bridge-type phase-shifting circuit 800 shown, when switch S62 is closed, it indicates that switch S62 is in the first state. If switch S61 is also closed, then bonding wire 801 and switch S62 are connected to the first phase-shifting path, that is, current can flow through bonding wire 801 and switch S62. The absolute value of the phase difference between the signal transmitted at the first signal terminal and the signal transmitted at the second signal terminal is the first phase shift amount. When switch S62 is open, it indicates that switch S62 is in the second state. If switch S61 is also open, then capacitors C61 and C62, and bonding wire 802 are connected to the second phase-shifting path, that is, current can flow through capacitors C61 and C62, and bonding wire 802. The absolute value of the phase difference between the signal transmitted at the first signal terminal and the signal transmitted at the second signal terminal is the second phase shift amount.

[0157] Furthermore, when switch S62 is closed, if switch S61 is open, the first phase-shifting path may also include bonding wire 801, switch S62, capacitor C61, capacitor C62, and bonding wire 703. When switch S62 is open, if switch S61 is closed, the second phase-shifting path may also include switch S61 and capacitor C61.

[0158] Furthermore, in some embodiments, in Figure 8A In the bridge-type phase-shifting circuit 800 shown, when connecting bonding wires 801 and 802, the user can consider each bonding wire as a different component (inductor or wire) based on the different inductance values ​​resulting from the different parameters such as the diameter and length of the bonding wires. For example, the user can use thinner or longer bonding wires 801 and 802 to load inductance. In this case, bonding wire 801 can be equivalent to inductor L81, and bonding wire 802 can be equivalent to inductor L82. Furthermore, the bridge-type phase-shifting circuit 800 can be equivalent to... Figure 8B The equivalent circuit shown is 810.

[0159] exist Figure 8B In the equivalent circuit 810 shown, the first end of capacitor C61 is connected to node 61, and its second end is connected to the second end of capacitor C62, the first end of switch S61, and the first end of inductor L82. The first end of capacitor C62 is connected to node 62, and its second end is connected to the first end of switch S61 and the first end of inductor L82. The first end of switch S61 is connected to the first end of inductor L82, and the second end of switch S61 is connected to the second end of inductor L82, with the second end of switch S61 grounded. The first end of switch S62 is connected to the second end of inductor L81, and the second end of switch S62 is connected to node 62. The first end of inductor L81 is connected to node 61, and the second end of inductor L82 is grounded.

[0160] When both switches S61 and S62 in circuit 810 are closed, circuit 810 can be equivalent to... Figure 1C The π-type bridge phase-shifting circuit 102 is shown. Furthermore, when both switches S61 and S62 in circuit 810 are in the open state, circuit 810 can be equivalent to... Figure 1B The T-type bridge phase shift circuit 101 is shown. It can be seen that the complete bridge phase shift circuit 810 reconstructed based on the bonding wire scheme and the incomplete bridge phase shift circuit 600 can achieve the same phase shifting function as the bridge phase shift circuit 100 shown in Figure 1 above.

[0161] Thus, by referring to the above Figure 6 The incomplete bridge phase-shifting circuit shown Figure 7A The circuit structure diagram shown, and Figure 8A As shown in the circuit structure, users can use different bonding wire connection schemes for the same incomplete bridge phase shifting circuit to obtain complete bridge phase shifting circuits with different phase shifting effects, thereby meeting different phase shifting requirements of users.

[0162] Furthermore, since the bonding wire has a high inductance Q value when it is equivalent to an inductor, therefore, Figure 7A The bridge-type phase-shifting circuit 700 shown and Figure 8A The bridge-type phase-shifting circuits 800 shown all have low insertion loss. Furthermore, the bridge-type phase-shifting circuits 700 or 800 can have different phase shift amounts depending on the length or diameter of each bonding wire.

[0163] For example, the above can be applied to Figure 7A The bridge-type phase-shifting circuit 700 shown was simulated, and the simulation results confirmed that the bridge-type phase-shifting circuit 700 reconstructed based on the bonding wire scheme has a small insertion loss. Figure 9A As shown, by adjusting the length or diameter of each bonding wire in the bridge phase shift circuit 700, a phase shifter chip with a phase shift of -34° in the 6GHz-7GHz frequency band can be reconstructed, for example, A1 (6.8GHz, -34°). The simulation results for this bridge phase shift circuit 700 are as follows: the average system insertion loss can be less than 0.3dB, for example, A2 (6.8GHz, -0.196dB) and A3 (6.8GHz, 0.227dB); the average system return loss can be greater than 19dB, for example, A4 (6.8GHz, -19.5dB) and A5 (6.8GHz, -18.3dB).

[0164] For example, one could also refer to the above... Figure 8A The bridge-type phase-shifting circuit 800 shown was simulated, and the simulation results confirmed that the bridge-type phase-shifting circuit 800 reconstructed based on the bonding wire scheme has low insertion loss. Figure 9B As shown, by adjusting the length or diameter of each bonding wire in the bridge phase shift circuit 800, a phase shifter chip with a phase shift of 114° in the 6.5GHz-7GHz frequency band can be reconstructed, for example, A6 (6.9GHz, 114°). In this case, the simulation results corresponding to the bridge phase shift circuit 800 are: the average system insertion loss is less than 0.3dB, for example, A7 (6.85GHz, -0.307dB) and A8 (6.8GHz, -0.252dB); the average system return loss is greater than 30dB, for example, A9 (6.85GHz, -32.4dB) and A10 (6.85GHz, -30.9dB). Thus, through the above... Figure 9A and Figure 9B The simulation diagram shown demonstrates that the phase shifter chip fabricated using the bridge-type phase shifter circuit fabrication method provided in this application can achieve phase shifting functionality with minimal insertion loss. Furthermore, for the same incomplete bridge-type phase shifter circuit 600, users can reconstruct it using different on-chip bonding wire schemes to obtain different bridge-type phase shifter circuits with varying phase shift amounts, thus meeting different user needs.

[0165] In other embodiments, when fabricating a non-complete phase shifter chip and a non-complete bridge phase shifter circuit, any N (N is a positive integer) bonding wire connection positions can be set in the non-complete bridge phase shifter circuit. For example, the above... Figure 6 The illustrated incomplete bridge phase-shifting circuit has three pre-defined bonding wire connection locations: between pads 601 and 602, between pads 602 and 603, and between pads 604 and 605. It is understood that in other embodiments, the incomplete bridge phase-shifting circuit may include more or fewer bonding wire connection locations. For example, Figure 10 A non-complete bridge phase shift circuit 1000 with two bonding wire connection positions is illustrated.

[0166] in, Figure 10The non-complete bridge phase-shifting circuit 1000 shown may include capacitors C101 and C102, switches S101 and S102, pads 1001, 1002, 1003, and 1004. In the non-complete bridge phase-shifting circuit 1000, the first terminal of capacitor C101 is connected to node 101 and pad 1001, and the second terminal is connected to the second terminal of capacitor C102, the first terminal of switch S102, and pad 1003. The first terminal of capacitor C102 is connected to node 102 and pad 1002, and the second terminal is connected to the first terminal of switch S102 and pad 1003. The first terminal of switch S101 is connected to node 101 and pad 1001, and the second terminal is connected to pad 1002 and node 102. The first terminal of switch S102 is connected to pad 1003, the second terminal of switch S102 is connected to pad 1004, and the second terminal of switch S102 is grounded.

[0167] In some embodiments, after obtaining a non-complete bridge phase shifter chip with a non-complete bridge phase shifter circuit 1000, the user can use different on-chip bonding wire schemes to connect the bonding wires at the bonding wire connection locations, such as between pads 1001 and 1002, and between pads 1003 and 1004, thereby obtaining a complete bridge phase shifter circuit with different phase shift amounts. For example, the following can be combined with... Figure 11A The process of reconstructing the incomplete bridge phase shift circuit 1000 to obtain the complete bridge phase shift circuit corresponding to the on-chip bonding wire scheme is described.

[0168] In some embodiments, after obtaining a non-complete bridge phase shifter chip with a non-complete bridge phase shifter circuit 1000, the user can connect bonding wires at each bonding wire connection position to obtain a complete bridge phase shifter circuit and a bridge phase shifter chip. For example, as Figure 11A The bridge-type phase-shifting circuit 1100 shown allows users to connect bonding wire 1101 (an example of the first phase-shifting module and the first bonding wire of this application) between pads 1001 and 1002, and bonding wire 1102 (an example of the fourth bonding wire of this application) between pads 1003 and 1004. Furthermore, the bridge-type phase-shifting circuit 1100 also includes capacitor C101 (an example of the third capacitor and the second phase-shifting module of this application), capacitor C102 (an example of the fourth capacitor of this application), switch S101 (an example of the first switch of this application), and switch S102 (an example of the third switch of this application).

[0169] Among them, Figure 11AIn the bridge-type phase-shifting circuit 1100 shown, the first end of capacitor C101 is connected to node 101 (an example of the first switch in this application), and the second end of capacitor C101 is connected to the second end of capacitor C102, the first end of switch S102, and the first end of bonding wire 1102. The first end of capacitor C102 is connected to node 102, and the second end is connected to the first end of switch S102 and the first end of bonding wire 1102. The first end of switch S101 is connected to node 101 and the first end of bonding wire 1101, and the second end of switch S101 is connected to node 102 (an example of the second switch in this application) and the second end of bonding wire 1101. The first end of switch S102 is connected to the first end of bonding wire 1102, and the second end of switch S102 is connected to the second end of bonding wire 1102, and the second end of switch S102 is grounded. The second end of bonding wire 1102 is grounded. The first end of the bonding wire 1101 is connected to the node 101, and the second end of the bonding wire 1101 is connected to the node 102.

[0170] It should be noted that, in Figure 11A In the bridge-type phase-shifting circuit 1100 shown, when switch S101 is open, it indicates that switch S101 is in the first state. At this time, the bonding wire 1101 is connected to the first phase-shifting path, that is, current can flow through the bonding wire 1101. The absolute value of the difference between the phase of the signal transmitted at the first signal terminal and the phase of the signal transmitted at the second signal terminal is the first phase shift amount. When switch S101 is closed, it indicates that switch S101 is in the second state. Since switch S101 can be equivalent to a small resistor when closed, capacitor C101 can also be connected to the second phase-shifting path, that is, current can flow through capacitor C101. The absolute value of the difference between the phase of the signal transmitted at the first signal terminal and the phase of the signal transmitted at the second signal terminal is the second phase shift amount.

[0171] Furthermore, in some embodiments, bridge phase-shifting circuits with different phase-shifting amounts can be obtained by adjusting the length or diameter of each bonding wire in the bridge phase-shifting circuit 1100. For example, as Figure 11B As shown, by adjusting the length or diameter of each bonding wire in the bridge phase shift circuit 1100, a phase shifter chip with a phase shift of -50° in the 6GHz-7GHz frequency band can be reconstructed, for example, A11 (6.8GHz, -49.8°). The simulation results for this bridge phase shift circuit 1100 are as follows: the average system insertion loss is less than 0.2dB, for example, A12 (6.8GHz, -0.139dB) and A13 (6.8GHz, -0.197dB); the average system return loss is greater than 30dB, for example, A14 (6.8GHz, -33.1dB) and A15 (6.8GHz, -43.2dB).

[0172] It is understandable that, compared to directly fabricating a bridge phase-shifting circuit using inductors, the bridge phase-shifting circuit 1100 reconstructed based on bonding wires described above has lower insertion loss. For example, as... Figure 11C As shown, if the bonding wires in the bridge-type phase shift circuit 1100 are replaced with inductors, a phase shifter chip with a phase shift of -50° in the 6GHz-7GHz frequency band is obtained, for example, A16 (6.8GHz, -49.8°). In this case, the simulation results corresponding to the phase shifter chip formed by the inductor are: the average system insertion loss is greater than 0.4dB, for example, A17 (6.8GHz, -0.279dB) and A18 (6.8GHz, -0.428dB); the average system return loss is greater than 20dB, for example, A19 (6.8GHz, -29.7dB) and A20 (6.8GHz, -46.2dB). It can be seen that... Figure 11B Compared to the simulation diagram of insertion loss shown, the phase shifter chip built based on inductors has a larger insertion loss, approximately twice that of the bridge phase shifter circuit 1100.

[0173] Therefore, the phase shifter chip and bridge phase shifter circuit fabricated by the bridge phase shifter circuit fabrication method mentioned in this application can achieve the phase shifting effect while also having lower insertion loss.

[0174] In some embodiments, the user can adjust the length of the bonding wire to create different phase shift amounts in the reconstructed complete bridge phase-shifting circuit. For example, the user can adjust the length of the bonding wire as described above. Figure 11A The lengths of the bonding wires 1101 and 1102 in the bridge-type phase-shifting circuit 1100 allow the bridge-type phase-shifting circuit 1100 to have different phase shift amounts. For example, Figure 12 The simulation diagrams show the bridge phase shifting circuit 1100 when connected to bonding wires of three different lengths.

[0175] in, Figure 12 The circuit connection structures of the simulation circuits shown in Figures (a), (b), and (c) are the same as those described above. Figure 11A The circuit connection structure of the bridge-type phase-shifting circuit 1100 is the same, and will not be described again here. Furthermore, Figure 12 The capacitance value C of each simulation circuit is set to C1. Figure 12 In the simulation circuit shown in Figure (a), the length l of the bonding wire 1101 can be set to k1 mm and the diameter d can be set to d1 μm; the length l of the bonding wire 1102 can be set to k2 mm and the diameter d can be set to d2 μm. Figure 12In the simulation circuit shown in Figure (b), the length l of the bonding wire 1101 can be set to k3mm and the diameter d can be set to d3μm; the length l of the bonding wire 1102 can be set to k4mm and the diameter d can be set to d4μm. Figure 12 In the simulation circuit shown in Figure (c), the length l of bonding wire 1101 can be set to k5mm and the diameter d can be set to d5μm; the length l of bonding wire 1102 can be set to k6mm and the diameter d can be set to d6μm.

[0176] in, Figure 12 Figure (d) shows a simulation diagram of the phase shift corresponding to each simulation circuit. It can be seen that by changing the length of each bonding wire, a continuously adjustable phase shift from -30° to -60° can be achieved, approaching a 30° control range. For example, A21 (6.8GHz, -60.5°), A22 (6.8GHz, -45.2°), and A23 (6.8GHz, -31.9°).

[0177] Therefore, for the same incomplete bridge phase-shifting circuit, users can obtain complete bridge phase-shifting circuits with different phase-shifting effects by adjusting the length or diameter of the bonding wire when connecting the bonding wire.

[0178] In some embodiments, the phase shifter chip may include one or more bridge-type phase shifting circuits. For example, each complete phase shifter chip shown in the above embodiments contains only one complete bridge-type phase shifting circuit, that is, each corresponding incomplete phase shifter chip contains only one incomplete bridge-type phase shifting circuit.

[0179] However, in other embodiments, a complete phase shifter chip may also include multiple complete phase shifter circuits, that is, each corresponding incomplete phase shifter chip may include one incomplete bridge phase shifter circuit and other complete bridge phase shifter circuits, or each corresponding incomplete phase shifter chip may also include multiple incomplete bridge phase shifter circuits.

[0180] In this process, after obtaining a non-complete phase shifter chip, the user can connect bonding wires at partial bonding wire connection positions in multiple non-complete bridge phase shifter circuits to obtain a complete phase shifter chip with multiple complete bridge phase shifter circuits (i.e., multi-bit bridge phase shifter circuits). For example, the following uses the above... Figure 10 The reconstructed multi-bit bridge phase shift circuit is briefly described using the incomplete bridge phase shift circuit 1000 shown as an example.

[0181] In some embodiments, N incomplete bridge phase shift circuits 1000 can be sequentially connected to form an N-bit incomplete bridge phase shift circuit. When a user obtains this N-bit incomplete bridge phase shift circuit, they can connect bonding wires to some or all of the bonding wire connection positions to obtain an N-bit complete bridge phase shift circuit. For example... Figure 13 A simulation diagram of a 3-bit complete bridge phase-shifting circuit is shown.

[0182] in, Figure 13 The connection structure of each bit of the bridge phase shift circuit in the 3-bit complete bridge phase shift circuit shown in Figure (a) is similar to that described above. Figure 11A The connection method of the bridge phase shift circuits 1100 shown is the same, and will not be repeated here. Furthermore, the nodes in the three bridge phase shift circuits 1100 are connected sequentially. For example, node 102 of the first bridge phase shift circuit 1100 is connected to node 101 of the second bridge phase shift circuit 1100, and node 102 of the second bridge phase shift circuit 1100 is connected to node 101 of the third bridge phase shift circuit 1100, thus forming a complete 3-bit bridge phase shift circuit. In this 3-bit bridge phase shift circuit, the length and diameter of each bonding wire in each bit of the bridge phase shift circuit can be different. Furthermore, it can be understood that after removing the bonding wires from this complete 3-bit bridge phase shift circuit, the corresponding circuit topology is the corresponding incomplete 3-bit bridge phase shift circuit, which will not be described further here.

[0183] Among them, through design Figure 13 The switching states of each switch in the simulation circuit shown in Figure (a) allow the 3-bit bridge phase-shift circuit to have different phase shift values. For example, as... Figure 13 As shown in Figure (b), a phase shift of up to 140° can be achieved in the 6GHz-7GHz frequency band, with an average system insertion loss of 0.7dB.

[0184] It is understandable that when connecting multiple bridge phase-shifting circuits to form a multi-bit bridge phase-shifting circuit, the connected circuits can be the same or different. For example, the above... Figure 13 The 3-bit complete bridge phase shift circuit shown is constructed by sequentially connecting three identical bridge phase shift circuits 1100. In other embodiments, the connection circuits in a multi-bit bridge phase shift circuit can also be different. For example, the following uses... Figure 14 Taking the 3-bit bridge phase shift circuit composed of different bridge phase shift circuits as an example, this paper introduces the implementation method of constructing a multi-bit bridge phase shift circuit based on different bridge phase shift circuits.

[0185] in, Figure 14The circuit connection structure of the first circuit in the 3-bit bridge phase-shifting circuit shown in Figure (a) is the same as described above. Figure 8A The circuit connection structure of the bridge phase shifter circuit 800 is the same as that described below, and will not be repeated here; the circuit connection structure of the second circuit in the 3-bit bridge phase shifter circuit is the same as that described later. Figure 16A The circuit connection structure of the bridge phase shifter circuit 1600 is the same as described above, and will not be described here; the circuit connection structure of the third circuit in the 3-bit bridge phase shifter circuit is the same as described above. Figure 11A The circuit connection structure of the bridge phase shift circuit 1100 is the same as that described above, and will not be repeated here. In this 3-bit bridge phase shift circuit, the nodes of each bridge phase shift circuit are connected sequentially. For example, node 62 of the first bridge phase shift circuit 800 is connected to node 161 of the second bridge phase shift circuit 1600, and node 162 of the second bridge phase shift circuit 1600 is connected to node 101 of the third bridge phase shift circuit 1100, thus forming a complete 3-bit bridge phase shift circuit. In this 3-bit bridge phase shift circuit, the length and diameter of each bonding wire in each bit of the bridge phase shift circuit can be different. Furthermore, it can be understood that after removing the bonding wires from this complete 3-bit bridge phase shift circuit, the corresponding circuit topology is the corresponding incomplete 3-bit bridge phase shift circuit, which will not be repeated here.

[0186] Among them, through design Figure 14 The switching states of each switch in the simulation circuit shown in Figure (a) allow the 3-bit bridge phase-shift circuit to have different phase shift values. For example... Figure 14 As shown in Figure (b), a phase shift effect of up to 250° can be achieved in the 6GHz-7GHz frequency band, and the average system insertion loss is less than 0.8dB.

[0187] Thus, based on Figure 13 as well as Figure 14 The simulation diagram corresponding to the multi-bit bridge phase shifter circuit shown illustrates that a complete phase shifter chip can include N interconnected complete bridge phase shifter circuits. Furthermore, the first signal terminal of the k-th complete bridge phase shifter circuit is connected to the second signal terminal of the (k-1)-th complete bridge phase shifter circuit, and the second signal terminal of the k-th complete bridge phase shifter circuit is connected to the first signal terminal of the (k+1)-th complete bridge phase shifter circuit (1 < k ≤ N-1, and k and N are both positive integers). In addition, the corresponding incomplete phase shifter chip includes incomplete bridge phase shifter circuits, which can be formed by connecting one incomplete bridge phase shifter circuit with other complete bridge phase shifter circuits, or by connecting multiple incomplete bridge phase shifter circuits.

[0188] In some embodiments, the incomplete bridge phase-shifting circuit may also be devoid of inductors. For example, the incomplete bridge phase-shifting circuits shown in the above embodiments do not include inductors. In this case, all inductors in the reconstructed complete bridge phase-shifting circuit can be replaced by bonding wires.

[0189] However, in other embodiments, the incomplete bridge phase-shifting circuit may also include one or more inductors. That is, in the reconstructed complete bridge phase-shifting circuit, the bonding wire only replaces part of the inductance, not all of it. For example, Figure 15A The non-complete bridge phase shift circuit 1500 shown is similar to the one described above. Figure 10 Compared to the incomplete bridge phase shift circuit 1000 shown, the incomplete bridge phase shift circuit 1500 has an inductor L151. That is, when the incomplete bridge phase shift circuit 1500 is made, the inductor L151 is not missing, and the pads 1003 and 1004 are not set at the connection point of the inductor L151.

[0190] Among them, Figure 15A The non-complete bridge phase-shifting circuit 1500 shown may include capacitors C151 and C152, switches S151 and S152, inductor L151, pad 1501, and pad 1502. In the non-complete bridge phase-shifting circuit 1500, the first terminal of capacitor C151 is connected to node 151 and pad 1501, and the second terminal is connected to the second terminal of capacitor C152, the first terminal of switch S152, and the first terminal of inductor L151. The first terminal of capacitor C152 is connected to node 152 and pad 1502, and the second terminal is connected to the first terminal of switch S152 and the first terminal of inductor L151. The first terminal of switch S151 is connected to node 151 and pad 1501, and the second terminal is connected to pad 1502 and node 152. The two ends of switch S152 are connected to the two ends of inductor L151 respectively, and both switch S152 and inductor L151 are grounded.

[0191] In some embodiments, after obtaining a non-complete bridge phase shifter chip with a non-complete bridge phase shifter circuit 1500, the user can use different on-chip bonding wire schemes at preset bonding wire connection positions to obtain complete bridge phase shifter circuits with different phase shift amounts. For example, as Figure 15BThe bridge-type phase-shifting circuit 1510 shown allows users to connect a bonding wire 1503 (an example of the first phase-shifting module and the first bonding wire of this application) between pads 1501 and 1502. Furthermore, the bridge-type phase-shifting circuit 1510 also includes an inductor L151 (an example of the first inductor of this application), a capacitor C151 (an example of the third capacitor and the second phase-shifting module of this application), a capacitor C152 (an example of the fourth capacitor of this application), a switch S151 (an example of the first switch of this application), and a switch S152 (an example of the third switch of this application).

[0192] Among them, Figure 15B In the bridge-type phase-shifting circuit 1510 shown, the first terminal of capacitor C151 is connected to node 151 (an example of the first signal terminal in this application), and the second terminal of capacitor C151 is connected to the second terminal of capacitor C152, the first terminal of switch S152, and the first terminal of inductor L151. The first terminal of capacitor C152 is connected to node 152 (an example of the second signal terminal in this application), and the second terminal is connected to the first terminal of switch S152 and the first terminal of inductor L151. The first terminal of switch S151 is connected to node 151 and the first terminal of bonding wire 1503, and the second terminal of switch S151 is connected to node 152 and the second terminal of bonding wire 1503. The first terminal of switch S152 is connected to the first terminal of inductor L151, and the second terminal of switch S152 is connected to the second terminal of inductor L151. Both the second terminals of switch S152 and inductor L151 are grounded. The first end of the bonding wire 1503 is connected to node 151, and the second end is connected to node 152.

[0193] It should be noted that, in Figure 15B In the bridge-type phase-shifting circuit 1510 shown, when switch S151 is open, it indicates that switch S151 is in the first state. The bonding wire 1503 is connected to the first phase-shifting path, meaning current can flow through the bonding wire 1503. The absolute difference between the phase of the signal input to the first signal terminal and the phase of the signal output from the second signal terminal is the first phase shift amount. When switch S151 is closed, it indicates that switch S151 is in the second state. At this time, switch S151 can be equivalent to a small resistor, and capacitor C151 can still be connected to the second phase-shifting path. That is, current can flow through capacitor C151, and the absolute difference between the phase of the signal input to the first signal terminal and the phase of the signal output from the second signal terminal is the second phase shift amount.

[0194] Furthermore, in some embodiments, in Figure 15B In the bridge-type phase-shifting circuit 1510 shown, when connecting the bonding wire 1503, the user can reconstruct complete bridge-type phase-shifting circuits with different phase shift amounts based on different parameters such as the diameter and length of the bonding wire. For example, as Figure 15CAs shown, by adjusting the length or diameter of the bonding wire 1503 in the bridge phase shift circuit 1510, a phase shifter chip with a phase shift of -45° in the 5GHz-7GHz frequency band can be reconstructed. The simulation results for this bridge phase shift circuit 1510 are as follows: average insertion loss is less than 0.2dB; average return loss is greater than 20dB.

[0195] Understandable, compared to Figure 11C The diagram shown is a simulation diagram of a bridge phase-shifting circuit (without bonding wires) constructed based on inductors. In this bridge phase-shifting circuit 1510, some of the inductors are replaced by bonding wires, which can reduce insertion loss.

[0196] Thus, by referring to the above Figures 10 to 11B The circuit topology and simulation diagram shown above, as well as the circuit topology and simulation diagram shown above, are illustrated by referring to the above. Figures 15A to 15C The circuit topology and simulation diagram shown demonstrate that an incomplete bridge phase-shifting circuit may lack inductors, allowing the reconstructed complete bridge phase-shifting circuit to replace all inductors with bonding wires; alternatively, an incomplete bridge phase-shifting circuit may contain one or more inductors, allowing the reconstructed complete bridge phase-shifting circuit to replace some inductors with bonding wires. It is understood that this application does not limit the presence or number of inductors in the incomplete bridge phase-shifting circuit.

[0197] In some embodiments, this application does not limit the number of on-chip capacitors included in the bridge phase-shifting circuit. For example, the bridge phase-shifting circuits shown in the above embodiments all include two on-chip capacitors. However, in practice, the bridge phase-shifting circuit may include more or fewer on-chip capacitors. For example, Figure 16A The complete bridge phase shifter circuit 1600 shown may include only one on-chip capacitor.

[0198] in, Figure 16A The complete bridge-type phase-shifting circuit 1600 shown may include capacitor C161 (an example of the second phase-shifting module and the fifth capacitor of this application), switch S161 (an example of the fourth switch of this application), switch S162 (an example of the first switch of this application), bonding wire 1601 (an example of the first bonding wire of this application), bonding wire 1602 (an example of the fifth bonding wire of this application), bonding wire 1603 (an example of the sixth bonding wire of this application), pads 16001, 16002, 16003, 16004, 1605, and 16006.

[0199] Among them, Figure 16AIn the bridge-type phase-shifting circuit 1600 shown, the first terminal of capacitor C161 is connected to node 161 (an example of the first signal terminal in this application), and the second terminal is connected to node 162. The first terminal of switch S162 is connected to the second terminals of bonding wires 1601, 1602, and 1603, respectively. The second terminal of switch S162 is connected to the second terminal of bonding wire 1603, and the second terminal of switch S162 is grounded. The first terminal of switch S161 is connected to node 161, and the second terminal is connected to node 162 (an example of the second signal terminal in this application). Bonding wire 1601 is located between pads 16001 and 16002, and its first end is connected to node 161. The second end of bonding wire 1601 is connected to the second end of bonding wire 1602 (bonding wires 1601 and 1602 are examples of circuit elements in the first phase-shifting module of this application) and the first end of bonding wire 1603. Bonding wire 1602 is located between pads 16003 and 16004, and its first end is connected to node 162. The second end of bonding wire 1602 is connected to the first end of bonding wire 1603. Bonding wire 1603 is located between pads 16005 and 16006, and its second end is grounded. It can be understood that removing each bonding wire from the complete bridge phase shift circuit 1600 results in the non-complete bridge phase shift circuit corresponding to the complete bridge phase shift circuit 1600, which will not be elaborated here.

[0200] It should be noted that, in Figure 16A In the bridge-type phase-shifting circuit 1600 shown, when switch S162 is open, it indicates that switch S162 is in the first state. If switch S161 is open, bonding wires 1601 and 1602 are connected to the first phase-shifting path, that is, current can flow through bonding wires 1601 and 1602. The absolute value of the difference between the phase of the signal input to the first signal terminal and the phase of the signal output from the second signal terminal is the first phase shift amount. When switch S162 is closed, it indicates that switch S162 is in the second state. If switch S161 is open, capacitor C161 is connected to the second phase-shifting path, that is, current can flow through capacitor C161. The absolute value of the difference between the phase of the signal input to the first signal terminal and the phase of the signal output from the second signal terminal is the second phase shift amount.

[0201] Furthermore, in some embodiments, in Figure 16AIn the bridge-type phase-shifting circuit 1600 shown, when connecting bonding wires 1601, 1602, and 1603, the user can consider each bonding wire as a different component (inductor or wire) based on the different inductance values ​​resulting from the different parameters such as the diameter and length of the bonding wires. For example, the user can use thinner bonding wires 1601, 1602, and 1603 to load inductance. In this case, bonding wire 1601 can be equivalent to inductor L161, bonding wire 1602 to inductor L162, and bonding wire 1603 to inductor L163. Furthermore, the bridge-type phase-shifting circuit 1600 can be equivalent to... Figure 16B The equivalent circuit shown is 1610.

[0202] exist Figure 16B In the equivalent circuit 1610 shown, the first terminal of capacitor C161 is connected to node 161, and the second terminal is connected to node 162. The first terminal of switch S161 is connected to node 161, and the second terminal is connected to node 162. The first terminal of switch S162 is connected to the second terminals of inductors L161, L162, and L163, respectively. The second terminal of switch S162 is connected to the second terminal of inductor L163, and the second terminal of switch S162 is grounded. The first terminal of inductor L161 is connected to node 161, and the second terminal is connected to the second terminals of inductors L162 and L163, respectively. The first terminal of inductor L162 is connected to node 162, and the second terminal is connected to the first terminal of inductor L163. The second terminal of inductor L163 is grounded. In this way, the incomplete bridge phase shift circuit 1600 can be reconstructed into a complete bridge phase shift circuit 1610 based on the bonding wire, so that the user can achieve the desired phase shift effect based on the phase shift amount of the bridge phase shift circuit 1610.

[0203] Furthermore, since the bonding wire has a high inductance Q value when it is equivalent to an inductor, therefore, Figure 16B The bridge-type phase-shifting circuit 1610 shown has low insertion loss. Furthermore, the bridge-type phase-shifting circuit 1610 can have different phase shift amounts depending on the length or diameter of each bonding wire. For example, as... Figure 16C As shown, in the 6GHz-7GHz frequency band, continuous phase control from -40° to -100° can be achieved by adjusting the length and diameter of each bonding wire in the bridge phase shift circuit 1610. Furthermore, when adjusting the length or diameter of each bonding wire to achieve different phase shift amounts in the bridge phase shift circuit 1610, the average system insertion loss is less than 0.3dB, and the average return loss is greater than 20dB.

[0204] Thus, by referring to the above Figures 15A to 15C The circuit topology and simulation diagram shown above, as well as the circuit topology and simulation diagram shown above, are illustrated by referring to the above. Figures 16A to 16CThe circuit topology and simulation diagram shown demonstrate that an arbitrary number of on-chip capacitors can exist in a non-complete bridge phase-shifting circuit, resulting in an arbitrary number of on-chip capacitors in the reconstructed complete bridge phase-shifting circuit. It is understood that this application does not limit the number of on-chip capacitors present in the non-complete bridge phase-shifting circuit.

[0205] In some embodiments, this application does not limit the presence or absence of capacitors in the bridge phase-shifting circuit. For example, the bridge phase-shifting circuits shown in the above embodiments all have on-chip capacitors. However, in practice, the bridge phase-shifting circuit may not have on-chip capacitors. For example, Figure 17A A complete bridge phase-shifting circuit 1700 without on-chip capacitors is shown.

[0206] Among them, Figure 17A The complete bridge-type phase-shifting circuit 1700 shown includes switches S171 (an example of the second phase-shifting module and the fifth switch of this application), S172 (an example of the first switch of this application), S173 (an example of the sixth switch of this application), bonding wires 1701 (an example of the first bonding wire of this application), 1702 (an example of the seventh bonding wire of this application), 1703 (an example of the eighth bonding wire of this application), pads 17001, 17002, 17003, 17004, 17005, and 17006.

[0207] In this application, the first end of switch S171 is connected to node 171 (an example of the first signal terminal of this application), and the second end is connected to node 172 (an example of the second signal terminal of this application). The first end of switch S172 is connected to the second ends of bonding wires 1701 and 1702, respectively. The second end of switch S172 is connected to the first ends of switch S173 and 1703, respectively. The first end of switch S173 is connected to the first end of bonding wire 1703, and the second end of switch S173 is connected to the second end of bonding wire 1703, and the second end of switch S173 is grounded. Bonding wire 1701 is located between pads 17001 and 17002, and the first end of bonding wire 1701 is connected to node 171, and the second end of bonding wire 1701 is connected to the second end of bonding wire 1702 (bonding wires 1701 and 1702 are an example of the first phase-shifting module of this application). Bonding wire 1702 is located between pads 17003 and 17004, and its first end is connected to node 172. Bonding wire 1703 is located between pads 17005 and 17006, and its second end is grounded. It can be understood that removing each bonding wire from the complete bridge phase-shifting circuit 1700 results in the non-complete bridge phase-shifting circuit corresponding to the complete bridge phase-shifting circuit 1700; this will not be elaborated further here.

[0208] It should be noted that, in Figure 17A In the bridge-type phase-shifting circuit 1700 shown, when switch S172 is open, it indicates that switch S172 is in the first state. If switch S171 is open, bonding wires 1701 and 1702 are connected to the first phase-shifting path, that is, current can flow through bonding wires 1701 and 1702. The absolute value of the difference between the phase of the signal input to the first signal terminal and the phase of the signal output from the second signal terminal is the first phase shift amount. When switch S172 is closed, it indicates that switch S172 is in the second state. If switch S171 is closed, switch S171 is connected to the second phase-shifting path, that is, current can flow through switch S171. The absolute value of the difference between the phase of the signal input to the first signal terminal and the phase of the signal output from the second signal terminal is the second phase shift amount.

[0209] Furthermore, in some embodiments, in Figure 17AIn the bridge-type phase-shifting circuit 1700 shown, when connecting bonding wires 1701, 1702, and 1703, the user can consider each bonding wire as a different component (inductor or wire) based on the different inductance values ​​resulting from the different parameters such as the diameter and length of the bonding wires. For example, the user can use thinner bonding wires 1701, 1702, and 1703 to load inductance. In this case, bonding wire 1701 can be equivalent to inductor L171, bonding wire 1702 to inductor L172, and bonding wire 1703 to inductor L173. Furthermore, the bridge-type phase-shifting circuit 1700 can be equivalent to... Figure 17B The equivalent circuit shown is 1710.

[0210] exist Figure 17B In the equivalent circuit 1710 shown, the first terminal of switch S171 is connected to node 171, and the second terminal is connected to node 172. The first terminal of switch S172 is connected to the second terminals of inductors L171 and L172, respectively. The second terminal of switch S172 is connected to the first terminal of switch S173 and the first terminal of inductor L173, respectively. The two terminals of switch S173 are connected to the two terminals of inductor L173, and both switch S173 and inductor L173 are grounded. The first terminal of inductor L171 is connected to node 171, and the second terminal of inductor L172 is connected to node 172.

[0211] In addition, Figure 17A In the bridge-type phase-shifting circuit 1700 shown, when the user connects bonding wires 1701, 1702, and 1703, the reconstructed bridge-type phase-shifting circuit can have different phase shift amounts based on different parameters such as the diameter and length of the bonding wires. For example, as Figure 17C As shown, in the 6GHz-7GHz frequency band, a phase adjustment of -40° to 10°, approaching a 50° control range, can be achieved by adjusting the length and diameter of each bonding wire in the bridge phase shift circuit 1700. Furthermore, when adjusting the length of each bonding wire to achieve different phase shifts, the average insertion loss of the bridge phase shift circuit 1710 remains less than 0.3dB, and the average return loss remains greater than 20dB.

[0212] Thus, by referring to the above Figures 15A to 17C The circuit topology and simulation diagram shown demonstrate that a non-complete bridge phase-shifting circuit may lack on-chip capacitors, resulting in a reconstructed complete bridge phase-shifting circuit also lacking on-chip capacitors; alternatively, a non-complete bridge phase-shifting circuit may contain one or more on-chip capacitors, resulting in a reconstructed complete bridge phase-shifting circuit also containing one or more on-chip capacitors. It is understood that this application does not limit the presence or number of on-chip capacitors in a non-complete bridge phase-shifting circuit.

[0213] It is understood that the bridge phase shift circuit provided in this application can be a bridge phase shift circuit with any topology. For example, Figure 18 shows a schematic diagram of the topology of another complete bridge phase shift circuit 1800 reconstructed based on a non-complete bridge phase shift circuit and a bonding wire scheme.

[0214] exist Figure 18A The complete bridge phase-shifting circuit 1800 shown may include capacitor C181 (an example of the second phase-shifting module and the fifth capacitor of this application), capacitor C182 (an example of the seventh capacitor of this application), switch S181 (an example of the seventh switch of this application), switch S182 (an example of the first switch of this application), bonding wire 1801 (an example of the first bonding wire of this application), bonding wire 1802 (an example of the fifth bonding wire of this application), pads 18001, 18002, 18003, and 18004.

[0215] In this configuration, the first terminal of capacitor C181 is connected to node 181 (an example of the first signal terminal in this application), and the second terminal of capacitor C181 is connected to the first terminal of switch S181. The first terminal of capacitor C182 is connected to the second terminals of bonding wires 1801 and 1802, as well as the first terminal of switch S182. The second terminal of capacitor C182 is connected to the second terminal of switch S182 and is grounded. The second terminal of switch S181 is connected to node 182. The first terminal of switch S182 is connected to the second terminals of both bonding wires 1801 and 1802 and is grounded. Bond wire 1801 is located between pads 18001 and 18002, and its first end is connected to node 181, while its second end is connected to the second end of bond wire 1802 (bonding wires 1801 and 1802 are examples of circuit elements in the first phase-shifting module of this application). Bond wire 1802 is located between pads 18003 and 18004, and its first end is connected to node 182 (an example of the second signal terminal of this application). It can be understood that removing each bonding wire from the complete bridge phase-shifting circuit 1800 results in a non-complete bridge phase-shifting circuit corresponding to the complete bridge phase-shifting circuit 1800, which will not be elaborated here.

[0216] It should be noted that, in Figure 18AIn the bridge-type phase-shifting circuit 1800 shown, when switch S182 is open, it indicates that switch S182 is in the first state. Bonding wires 1801 and 1802 are connected to the first phase-shifting module, meaning current can flow through them. The absolute value of the phase difference between the signal transmitted at the first signal terminal and the signal transmitted at the second signal terminal is the first phase shift amount. When switch S182 is closed, it indicates that switch S182 is in the second state. If switch S181 is also closed, capacitor C181 is connected to the second phase-shifting module, meaning current can flow through capacitor C181. The absolute value of the phase difference between the signal transmitted at the first signal terminal and the signal transmitted at the second signal terminal is the second phase shift amount.

[0217] Furthermore, in some embodiments, in Figure 18A In the bridge-type phase-shifting circuit 1800 shown, when connecting bonding wires 1801 and 1802, the user can consider each bonding wire as a different component (inductor or wire) based on the different inductance values ​​resulting from the different parameters such as the diameter and length of the bonding wires. For example, the user can use thinner bonding wires 1801 and 1802 to load inductance; in this case, bonding wire 1801 can be equivalent to inductor L181, and bonding wire 1802 can be equivalent to inductor L182. Furthermore, the bridge-type phase-shifting circuit 1800 can be equivalent to... Figure 18B The equivalent circuit shown is 1810.

[0218] exist Figure 18B In the equivalent circuit 1810 shown, the first terminal of capacitor C181 is connected to node 181, and the second terminal is connected to the first terminal of switch S181. The first terminal of capacitor C182 is connected to the second terminals of inductors L181, L182, and S182, respectively. The second terminal of capacitor C182 is connected to the second terminal of switch S182, and is grounded. The second terminal of switch S181 is connected to node 182. The first terminal of switch S182 is connected to the second terminals of inductors L181 and L182, respectively, and is grounded. The first terminal of inductors L181 and L182 is connected to node 182.

[0219] In addition, Figure 18A In the bridge-type phase-shifting circuit 1800 shown, when the user connects the bonding wires 1801 and 1802, the reconstructed bridge-type phase-shifting circuit can have different phase shifts based on different parameters such as the diameter and length of the bonding wires. For example, as Figure 18CAs shown, by adjusting the length or diameter of each bonding wire in the bridge phase shift circuit 1800, a phase shifter chip with a phase shift of 30° in the 6GHz-6.5GHz frequency band can be reconstructed. The simulation results for this bridge phase shift circuit 1800 are as follows: the average system insertion loss is less than 0.2dB; the average system return loss is greater than 30dB.

[0220] Thus, by referring to the above-mentioned bridge-type phase-shifting circuits and their corresponding equivalent circuit diagrams and simulation schematics, it can be seen that in the bridge-type phase-shifting circuit, the bonding wire can be connected to ground in parallel with the switch, for example, in... Figure 16A In the complete bridge-type phase-shifting circuit 1600 shown, the bonding wire 1603 can be connected in parallel with the switch S162, and both the bonding wire 1603 and the switch S162 are grounded. Furthermore, in the bridge-type phase-shifting circuit, the capacitor can also be connected in parallel with the switch and grounded, for example, in... Figure 18A In the complete bridge phase-shifting circuit 1800 shown, capacitor C182 and switch S182 can be connected in parallel, and both capacitor C182 and switch S182 are grounded.

[0221] In other embodiments, the capacitor, bonding wire, and switch can be connected in parallel to ground. For example, in Figure 19A The complete bridge phase-shifting circuit 1900 shown is achieved by connecting the capacitor C192, the switch S192, and the bonding wire 1903 in parallel.

[0222] Among them, Figure 19A The complete bridge-type phase-shifting circuit 1900 shown may include capacitor C191 (an example of the second phase-shifting module and the fifth capacitor of this application), capacitor C192 (an example of the ninth capacitor of this application), switch S191 (an example of the eighth switch of this application), switch S192 (an example of the first switch of this application), bonding wire 1901 (an example of the first bonding wire of this application), bonding wire 1902 (an example of the fifth bonding wire of this application), bonding wire 1903 (an example of the eleventh bonding wire of this application), pads 19001, 19002, 19003, 19004, 19005, and 19006.

[0223] In this configuration, the first terminal of capacitor C191 is connected to node 191 (an example of the first signal terminal of this application), and the second terminal is connected to node 192 (an example of the second signal terminal of this application). The first terminal of capacitor C192 is connected to the second terminals of bonding wires 1901, 1902, and 1903, as well as the first terminal of switch S192. The second terminal of capacitor C192 is connected to the second terminal of switch S192 and the second terminal of bonding wire 1903, and is grounded. The first terminal of switch S191 is connected to node 191, and the second terminal is connected to node 192. The first terminal of switch S192 is connected to the second terminals of bonding wires 1901, 1902, and 1903, as well as the second terminal of switch S192 is connected to the second terminal of bonding wire 1903, and is grounded. Bond wire 1901 is located between pads 19001 and 19002, and its first end is connected to node 191. The second end of bond wire 1901 is connected to the second end of bond wire 1902 (bonding wires 1901 and 1902 are an example of a circuit element structure for the first phase-shifting module of this application) and the first end of bond wire 1903. Bond wire 1902 is located between pads 19003 and 19004, and its first end is connected to node 192, while its second end is connected to the first end of bond wire 1903. Bond wire 1903 is located between pads 19005 and 19006, and its second end is grounded. It can be understood that removing each bonding wire from the complete bridge phase shift circuit 1900 results in the non-complete bridge phase shift circuit corresponding to the complete bridge phase shift circuit 1900, which will not be elaborated here.

[0224] It should be noted that, in Figure 19A In the bridge-type phase-shifting circuit 1900 shown, when switch S192 is open, it indicates that switch S192 is in the first state. If switch S191 is also open, bonding wires 1901 and 1902 are connected to the first phase-shifting circuit, meaning that current can flow through bonding wires 1901 and 1902. The absolute value of the difference between the phase of the signal input to the bridge-type phase-shifting circuit 1900 and the phase of the signal output by the bridge-type phase-shifting circuit 1900 is the first phase shift amount. When switch S192 is closed, it indicates that switch S192 is in the second state. If switch S191 is open, capacitor C191 is connected to the second phase-shifting circuit, meaning that current can flow through capacitor C191. The absolute value of the difference between the phase of the signal input to the bridge-type phase-shifting circuit 1900 and the phase of the signal output by the bridge-type phase-shifting circuit 1900 is the second phase shift amount.

[0225] Furthermore, in some embodiments, in Figure 19AIn the bridge-type phase-shifting circuit 1900 shown, when connecting bonding wires 1901, 1902, and 1903, the user can consider each bonding wire as a different component (inductor or wire) based on the different inductance values ​​resulting from the different parameters such as the diameter and length of the bonding wires. For example, the user can use thinner bonding wires 1901, 1902, and 1903 to load inductance. In this case, bonding wire 1901 can be equivalent to inductor L191, bonding wire 1902 to inductor L192, and bonding wire 1903 to inductor L193. Furthermore, the bridge-type phase-shifting circuit 1900 can be equivalent to... Figure 19B The equivalent circuit shown is 1910.

[0226] exist Figure 19B In the equivalent circuit 1910 shown, the first terminal of capacitor C191 is connected to node 191, and the second terminal is connected to node 192. The first terminal of capacitor C192 is connected to the second terminals of inductors L191, L192, and L193, as well as the first terminal of switch S192. The second terminal of capacitor C192 is connected to the second terminal of switch S192 and the second terminal of inductor L193, and is grounded. The first terminal of switch S191 is connected to node 191, and the second terminal is connected to node 192. The first terminal of switch S192 is connected to the second terminals of inductors L191, L192, and L193, as well as the second terminal of switch S192 is connected to the second terminal of inductor L193, and is grounded. The first terminal of inductor L191 is connected to node 191, and the second terminal is connected to the second terminals of inductors L192 and L193. The first terminal of inductor L192 is connected to node 192, and the second terminal is connected to the first terminal of inductor L193. The second terminal of inductor L193 is grounded.

[0227] In addition, Figure 19A In the bridge-type phase-shifting circuit 1900 shown, when the user connects bonding wires 1901, 1902, and 1903, the reconstructed bridge-type phase-shifting circuit can have different phase shifts based on different parameters such as the diameter and length of the bonding wires. For example, as Figure 19C As shown, by adjusting the length or diameter of each bonding wire in the bridge phase shift circuit 1900, a phase shifter chip with a phase shift of -110° in the 6.5GHz-7GHz frequency band can be reconstructed. The simulation results for this bridge phase shift circuit 1900 are as follows: the average system insertion loss is less than 0.3dB; the average system return loss is greater than 20dB.

[0228] Thus, by referring to the bridge-type phase-shifting circuits and simulation diagrams shown above, it can be seen that there are no restrictions on the connection method of capacitors in the bridge-type phase-shifting circuit.

[0229] In some embodiments, when fabricating a non-complete bridge phase-shifting circuit, the pads in the non-complete bridge phase-shifting circuit can be configured using various bridge phase-shifting circuit topologies. Once the user obtains the non-complete bridge phase-shifting circuit, different bonding wire connection methods can be used to obtain different bridge phase-shifting circuits with the functions of a complete bridge phase-shifting circuit. For example, Figure 20 The incomplete bridge phase-shifting circuit 2000 shown is a combination of the above. Figure 18A The non-complete bridge phase shift circuit corresponding to the bridge phase shift circuit 1800 shown, and Figure 19A The bridge phase shift circuit 1900 shown corresponds to an incomplete bridge phase shift circuit. After obtaining the incomplete bridge phase shift circuit 2000, the user can obtain the bridge phase shift circuit 1800 or the bridge phase shift circuit 1900 through different bonding wire connection methods.

[0230] Among them, Figure 20 The non-complete bridge phase-shifting circuit 2000 shown may include capacitors C201 and C202, switches S201 and S202, pads 2001, 2002, 2003, 2004, 2005, 2006, 2007, and 2008. The first terminal of capacitor C201 is connected to node 201 and pad 2001, and the second terminal is connected to pad 2005. The first terminal of capacitor C202 is connected to pads 2002, 2004, 2007, and the first terminal of switch S202, and the second terminal of capacitor C202 is connected to the second terminal of switch S202 and pad 2008, and the second terminal of capacitor C202 is grounded. The first terminal of switch S201 is connected to pad 2006, and the second terminal is connected to node 202 and pad 2003. The first terminal of switch S202 is connected to pads 2002, 2004, and 2007, respectively, and the second terminal is connected to pad 2008. The second terminal of switch S202 is grounded. Pad 2001 is connected to node 201, pad 2003 is connected to node 202, and pad 2008 is grounded.

[0231] Among them, when the user obtains the above Figure 20 After the incomplete bridge phase-shifting circuit 2000 shown, if the user connects a bonding wire between pads 2001 and 2002, a bonding wire between pads 2003 and 2004, and a thicker bonding wire (equivalent to a wire) between pads 2005 and 2006, the circuit as described above can be obtained. Figure 18AThe bridge phase shifter circuit 1800 shown has the function of a complete bridge phase shifter circuit.

[0232] Or, when the user obtains the above Figure 20 After the non-complete bridge phase-shifting circuit 2000 shown, if the user connects a bonding wire between pads 2001 and 2002, a bonding wire between pads 2003 and 2004, a bonding wire between pads 2007 and 2008, a thicker bonding wire (equivalent to a wire) between pads 2001 and 2006, and a thicker bonding wire (equivalent to a wire) between pads 2005 and 2003, then the circuit as described above can be obtained. Figure 19A The bridge phase shift circuit 1900 shown has the function of a complete bridge phase shift circuit.

[0233] Thus, by referring to the above Figure 20 The incomplete bridge phase-shifting circuit 2000 shown demonstrates that, during its fabrication, the pads in the incomplete bridge phase-shifting circuit can be configured using various bridge phase-shifting circuit topologies. Once the user obtains the incomplete bridge phase-shifting circuit, different bonding wire connection methods can be used to obtain different bridge phase-shifting circuits with the functions of a complete bridge phase-shifting circuit.

[0234] In some embodiments, multiple bonding wires may be connected in series or parallel in a complete bridge phase-shifting circuit. For example, in Figure 21A In the complete bridge phase-shifting circuit 2100 shown, when switch S212 is in the open state, bonding wires 2101 and 2102 can be in series.

[0235] Among them, Figure 21A The complete bridge-type phase-shifting circuit 2100 shown may include capacitor C211 (an example of the tenth capacitor in this application), capacitor C212 (an example of the eleventh capacitor in this application), switch S211 (an example of the ninth switch in this application), switch S212 (an example of the first switch in this application), bonding wire 2101 (an example of the first bonding wire and the first phase-shifting module in this application), bonding wire 2102 (an example of the twelfth bonding wire in this application), pads 21001, 21002, 21003, and 21004.

[0236] In this circuit, the first terminal of capacitor C211 is connected to node 211 (an example of the first signal terminal of this application), and the second terminal of capacitor C211 is connected to the second terminal of capacitor C212 (capacitors C211 and C212 are examples of circuit elements in the second phase-shifting module of this application) and the first terminal of bonding wire 2101. The first terminal of capacitor C212 is connected to node 212, and the second terminal is connected to the first terminal of bonding wire 2101. The first terminal of switch S211 is connected to node 211, and the second terminal of switch S211 is connected to node 212 (an example of the second signal terminal of this application). The first terminal of switch S212 is connected to the second terminals of bonding wire 2101 and bonding wire 2102, and the second terminal of switch S212 is connected to the second terminal of bonding wire 2102, and the second terminal of switch S212 is grounded. Bonding wire 2101 is located between pad 21001 and pad 21002. Bond wire 2102 is located between pads 21003 and 21004, and the second end of bond wire 2102 is grounded. It can be understood that removing each bond wire in the complete bridge phase shift circuit 2100 results in the non-complete bridge phase shift circuit corresponding to the complete bridge phase shift circuit 2100, which will not be elaborated here.

[0237] It should be noted that, in Figure 21A In the bridge-type phase-shifting circuit 2100 shown, when switch S212 is closed, it indicates that switch S212 is in the first state. If switch S211 is open, then bonding wire 2101, switch S212, and capacitor C211 are connected to the first phase-shifting path. That is, current can flow through bonding wire 2101, switch S212, and capacitor C211. The absolute value of the difference between the phase of the signal input to the first signal terminal and the phase of the signal output from the second signal terminal is the first phase shift amount. When switch S212 is open, it indicates that switch S212 is in the second state. If switch S211 is open, then capacitor C211, capacitor C212, and bonding wire S212 are connected to the second phase-shifting path. That is, current can flow through capacitor C211, capacitor C212, and bonding wire S212. The absolute value of the difference between the phase of the signal input to the first signal terminal and the phase of the signal output from the second signal terminal is the second phase shift amount.

[0238] Furthermore, in some embodiments, in Figure 21A In the bridge-type phase-shifting circuit 2100 shown, when connecting the bonding wires 2101 and 2102, the user can consider each bonding wire as a different component (inductor or wire) based on the different inductance values ​​resulting from the different parameters such as the diameter and length of the bonding wires. For example, the user can use thinner bonding wires 2101 and 2102 to load inductance; in this case, bonding wire 2101 is equivalent to inductor L211, and bonding wire 2102 can be equivalent to inductor L212. Furthermore, the bridge-type phase-shifting circuit 2100 can be equivalent to... Figure 21B The equivalent circuit shown is 2110.

[0239] exist Figure 21B In the equivalent circuit 2110 shown, the first end of capacitor C211 is connected to node 211, and the second end is connected to the first end of inductor L211 and the second end of capacitor C212. The first end of capacitor C212 is connected to node 212, and the second end is connected to the first end of inductor L211. The first end of switch S211 is connected to node 211, and the second end is connected to node 212. The first end of switch S212 is connected to the second end of inductor L211 and the first end of inductor L212, and the second end of switch S212 is connected to the second end of inductor L212, and the second end of switch S212 is grounded. The second end of inductor L212 is grounded.

[0240] Furthermore, since the bonding wire has a high inductance Q value when it is equivalent to an inductor, therefore, Figure 21A The bridge-type phase-shifting circuit 2100 shown has low insertion loss. Furthermore, the bridge-type phase-shifting circuit 2100 can have different phase shift amounts depending on the length or diameter of each bonding wire. For example, as... Figure 21C As shown, in the 6GHz-7GHz frequency band, phase adjustment from -45° to 70°, approaching a control range of 115°, can be achieved by adjusting the length and diameter of each bonding wire in the bridge phase shift circuit 2100. Furthermore, when adjusting the length of each bonding wire to achieve different phase shifts in the bridge phase shift circuit 2100, the average system insertion loss of the bridge phase shift circuit 2100 remains less than 0.4dB, and the average return loss remains greater than 20dB.

[0241] Thus, by referring to the above Figures 21A to 21C The circuit topology and simulation diagram shown demonstrate that multiple bonding wires can be connected in series or parallel in a complete bridge phase-shifting circuit. This application does not limit the number of bonding wires connected in series or parallel.

[0242] It is understood that the phase-shifting circuit provided in this application allows for inductor loading using bonding wires, and the inductance value can be continuously adjusted by changing the length and diameter of the bonding wires. Furthermore, the phase-shifting circuit provided in this application can improve the Q value of the inductor and reduce the insertion loss of the phase shifter chip. In addition, by reconfiguring the incomplete phase-shifting circuit using different bonding wire connection methods, complete phase-shifting circuits with different circuit topologies can be obtained. Moreover, reconfigurable design and layout normalization design of the phase shifter chip can be achieved. For example, only one layout of an incomplete phase shifter chip can be designed. After obtaining this incomplete phase shifter chip, different complete phase shifter chips can be obtained through different bonding wire connection methods. This method avoids the need for layout design of multiple phase shifter chips. Furthermore, the phase shifter chip fabricated using the phase-shifting circuit provided in this application can eliminate all or part of the large-area inductors, reducing the layout area of ​​the phase shifter chip, thereby achieving a small-area, low-cost design of the phase shifter chip.

[0243] It is understood that some structural or methodological features may be shown in a specific arrangement and / or order in the accompanying drawings. However, it should be understood that such a specific arrangement and / or order may not be necessary. Rather, in some embodiments, these features may be arranged in a manner and / or order different from that shown in the illustrative drawings. Furthermore, the inclusion of structural or methodological features in a particular figure does not imply that such features are required in all embodiments, and in some embodiments, these features may be omitted or may be combined with other features.

[0244] It should be noted that all units / modules mentioned in the embodiments of this application are logical units / modules. Physically, a logical unit / module can be a physical unit / module, a part of a physical unit / module, or a combination of multiple physical units / modules. The physical implementation of these logical units / modules is not the most important factor; the combination of functions implemented by these logical units / modules is the key to solving the technical problem proposed in this application. Furthermore, to highlight the innovative aspects of this application, the above embodiments of this application have not introduced units / modules that are not closely related to solving the technical problem proposed in this application. This does not mean that other units / modules do not exist in the above embodiments.

[0245] It should be noted that in the examples and description of this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one" does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0246] Although this application has been illustrated and described with reference to certain preferred embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made thereto without departing from the scope of this application.

Claims

1. A phase shifting circuit, characterized by, The circuit comprises a first signal terminal, a second signal terminal, a first switch, a first phase-shifting module and a second phase-shifting module; wherein The first phase-shifting module comprises a first bonding wire, and the first switch is connected with the first bonding wire; and When the first switch is in a first state, the first bonding wire is connected to a first phase-shifting path, and the first phase-shifting path further comprises the first signal terminal and the second signal terminal, wherein the absolute value of the difference between the phase of a first signal transmitted by the first signal terminal and the phase of a second signal transmitted by the second signal terminal is a first phase-shifting amount; When the first switch is in a second state, the second phase-shifting module is connected to a second phase-shifting path, and the second phase-shifting path further comprises the first signal terminal and the second signal terminal, wherein the absolute value of the difference between the phase of a third signal transmitted by the first signal terminal and the phase of a fourth signal transmitted by the second signal terminal is a second phase-shifting amount; and The signal transmitted by the first signal terminal is an input signal, and the signal transmitted by the second signal terminal is an output signal, or The signal transmitted by the second signal terminal is an input signal, and the signal transmitted by the first signal terminal is an output signal.

2. The circuit of claim 1, wherein, The circuit comprises: The first phase-shifting amount is related to the diameter and length of the first bonding wire.

3. The circuit of claim 1 or 2, characterized in that, The first switch is connected in series with the first bonding wire, the first state of the first switch is a closed state, and the second state is an open state.

4. The circuit of claim 3, wherein, The second phase-shifting module comprises a first capacitor, and the circuit further comprises a second switch, a second capacitor and a second bonding wire; wherein The first end of the first capacitor is connected with the first signal terminal, the second end of the first capacitor is connected with the second end of the second capacitor, the first end of the second bonding wire and the first end of the second switch respectively; The first end of the second capacitor is connected with the second signal terminal, and the second end of the second capacitor is connected with the first end of the second bonding wire and the first end of the second switch respectively; The first end of the second switch is connected with the first end of the second bonding wire, the second end of the second switch is connected with the second end of the second bonding wire, and the second end of the second switch is grounded; The second end of the second bonding wire is grounded; The first end of the first bonding wire is connected with the first signal terminal, and the second end of the first bonding wire is connected with the first end of the first switch; The second end of the first switch is connected with the second signal terminal.

5. The circuit according to claim 4, wherein When the first switch is in the closed state and the second switch is in the closed state, the first phase-shifting path further comprises the first switch; When the first switch is in the open state and the second switch is in the open state, the second phase-shifting path further comprises the first capacitor, the second capacitor and the second bonding wire.

6. The circuit of claim 5, wherein, The circuit further comprises a third bonding wire; wherein The first end of the third bonding wire is connected with the first signal terminal, and the second end of the third bonding wire is connected with the second signal terminal.

7. The circuit according to claim 6, wherein The first phase-shifting path further comprises the third bonding wire when the first switch is in the closed state and the second switch is in the closed state.

8. The circuit of claim 3, wherein, The second phase-shifting module comprises a tenth capacitor and an eleventh capacitor, and the circuit further comprises a twelfth bonding wire and a ninth switch; wherein, a first end of the tenth capacitor is connected with the first signal end, and a second end of the tenth capacitor is connected with a second end of the eleventh capacitor and a first end of the first bonding wire respectively; a first end of the eleventh capacitor is connected with the second signal end, and a second end of the eleventh capacitor is connected with the first end of the first bonding wire; a first end of the first switch is connected with the second end of the first bonding wire and a first end of the twelfth bonding wire respectively, a second end of the first switch is connected with a second end of the twelfth bonding wire, and the second end of the first switch is grounded; a first end of the ninth switch is connected with the first signal end, and a second end of the ninth switch is connected with the second signal end; a second end of the twelfth bonding wire is grounded.

9. The circuit according to claim 8, wherein, the first phase-shifting path further comprises the tenth capacitor and the eleventh capacitor when the first switch is in the closed state and the ninth switch is in the open state; the first phase-shifting path further comprises the tenth capacitor, the eleventh capacitor and the twelfth bonding wire when the first switch is in the open state and the ninth switch is in the open state.

10. The circuit of claim 1 or 2, wherein, The first switch is in parallel with the first bonding wire, and the first switch has a first state of open state and a second state of closed state.

11. The circuit of claim 9, wherein, The second phase-shifting module comprises a third capacitor, and the circuit further comprises a fourth capacitor and a third switch; wherein, a first end of the third capacitor is connected with the first signal end, and a second end of the third capacitor is connected with a second end of the fourth capacitor and a first end of the third switch respectively; a first end of the fourth capacitor is connected with the second signal end, and a second end of the fourth capacitor is connected with the first end of the third switch; a first end of the first switch is connected with the first signal end and a first end of the first bonding wire respectively, and a second end of the first switch is connected with the second signal end and a second end of the first bonding wire respectively; a second end of the third switch is grounded; a first end of the first bonding wire is connected with the first signal end, and a second end of the first bonding wire is connected with the second signal end.

12. The circuit of claim 11, wherein, The circuit further comprises a fourth bonding wire; wherein, a first end of the fourth bonding wire is connected with the second end of the third capacitor, the second end of the fourth capacitor and the first end of the third switch respectively, a second end of the fourth bonding wire is connected with a second end of the third switch, and the second end of the fourth bonding wire is grounded.

13. The circuit of claim 11, wherein, The circuit further comprises a first inductor; wherein, The first end of the first inductor is connected with the second end of the third capacitor, the second end of the fourth capacitor and the first end of the third switch respectively, the second end of the first inductor is connected with the second end of the third switch, and the second end of the first inductor is grounded.

14. The circuit of claim 2, wherein, The first phase shift module further comprises a fifth bonding wire, the second phase shift module further comprises a fifth capacitor, and the first bonding wire is connected with the fifth bonding wire, and the fifth capacitor is connected with the first signal end.

15. The circuit of claim 14, wherein, The circuit further comprises a sixth bonding wire and a fourth switch; wherein The first end of the first switch is connected with the second end of the first bonding wire, the second end of the fifth bonding wire and the first end of the sixth bonding wire respectively, the second end of the first switch is connected with the second end of the sixth bonding wire, and the second end of the first switch is grounded; The first end of the fourth switch is connected with the first signal end, and the second end of the fourth switch is connected with the second signal end; The first end of the fifth capacitor is connected with the first signal end, and the second end of the fifth capacitor is connected with the second signal end; The first end of the first bonding wire is connected with the first signal end, and the second end of the first bonding wire is connected with the second end of the fifth bonding wire and the first end of the sixth bonding wire respectively; The first end of the fifth bonding wire is connected with the second signal end, and the second end of the fifth bonding wire is connected with the first end of the sixth bonding wire; The second end of the sixth bonding wire is grounded.

16. The circuit of claim 14, wherein, The circuit further comprises a seventh capacitor and a seventh switch; wherein The first end of the fifth capacitor is connected with the first signal end, and the second end of the fifth capacitor is connected with the first end of the seventh switch; The first end of the seventh capacitor is connected with the second end of the first bonding wire, the second end of the fifth bonding wire and the first end of the first switch respectively, the second end of the seventh capacitor is connected with the second end of the first switch, and the second end of the seventh capacitor is grounded; The first end of the first switch is connected with the second end of the first bonding wire and the second end of the fifth bonding wire respectively, and the second end of the first switch is grounded; The second end of the seventh switch is connected with the second signal end; The first end of the first bonding wire is connected with the first signal end, and the second end of the first bonding wire is connected with the second end of the fifth bonding wire; The first end of the fifth bonding wire is connected with the second signal end.

17. The circuit of claim 14, wherein, The circuit further comprises an eleventh bonding wire, an eighth switch and a ninth capacitor; wherein The first end of the fifth capacitor is connected with the first signal end, and the second end of the fifth capacitor is connected with the second signal end; The first end of the ninth capacitor is connected with the second end of the first bonding wire, the second end of the fifth bonding wire, the first end of the first switch and the first end of the eleventh bonding wire respectively, the second end of the ninth capacitor is connected with the second end of the first switch and the second end of the eleventh bonding wire respectively, and the second end of the ninth capacitor is grounded; a first end of the first switch is connected with a second end of the first bonding wire, a second end of the fifth bonding wire, and a first end of the eleventh bonding wire respectively, a second end of the first switch is connected with a second end of the eleventh bonding wire, and the second end of the first switch is grounded; a first end of the eighth switch is connected with the first signal end, and a second end of the eighth switch is connected with the second signal end; a first end of the first bonding wire is connected with the first signal end, and a second end of the first bonding wire is connected with a second end of the fifth bonding wire and a first end of the eleventh bonding wire respectively; a first end of the fifth bonding wire is connected with the second signal end, and a second end of the fifth bonding wire is connected with a first end of the eleventh bonding wire; a second end of the eleventh bonding wire is grounded.

18. The circuit of any of claims 14-17, wherein, a first state of the first switch is an open state, and a second state of the first switch is a closed state; and when the first switch is in the open state, the first phase shifting path further comprises the fifth bonding wire; when the first switch is in the closed state, the second phase shifting path further comprises the fifth capacitor.

19. The circuit of claim 1 or 2, wherein, the first phase shifting module further comprises a seventh bonding wire, the second phase shifting module comprises a fifth switch, and the circuit further comprises a sixth switch and an eighth bonding wire; wherein a first end of the first switch is connected with a second end of the first bonding wire and a second end of the seventh bonding wire respectively, and a second end of the first switch is connected with a first end of the sixth switch and a first end of the eighth bonding wire respectively; a first end of the fifth switch is connected with the first signal end, and a second end of the fifth switch is connected with the second signal end; a first end of the sixth switch is connected with the first end of the eighth bonding wire, a second end of the sixth switch is connected with the second end of the eighth bonding wire, and the second end of the sixth switch is grounded; a first end of the first bonding wire is connected with the first signal end, and a second end of the first bonding wire is connected with the second end of the seventh bonding wire; a first end of the seventh bonding wire is connected with the second signal end; a second end of the eighth bonding wire is grounded.

20. The circuit of claim 19, wherein, a first state of the first switch is an open state, and a second state of the first switch is a closed state; and when the first switch is in the open state and the fifth switch is in the open state, the first phase shifting path further comprises the seventh bonding wire; when the first switch is in the closed state and the fifth switch is in the closed state, the second phase shifting path further comprises the fifth switch.

21. A phase shifter chip, characterized by The chip comprises the phase shifting circuit according to any one of claims 1 to 20.

22. The chip of claim 21, wherein, The chip comprises N phase shifting circuits, wherein a first signal end of a kth phase shifting circuit is connected with a second signal end of a (k-1) th phase shifting circuit, a second signal end of the kth phase shifting circuit is connected with a first signal end of a (k+1) th phase shifting circuit, 1 23. The chip of claim 22, wherein, The chip comprises at least two pads for connecting two ends of a bonding wire.

24. The chip of claim 23, wherein, The number of wire bonding connection locations formed between the pads in the chip is greater than or equal to the number of wires in the N phase shift circuits. The number of wire bonding connection locations formed between the pads in the chip is greater than or equal to the number of wires in the N phase shift circuits.

Images