Preparation method of display module, display module, display screen and electronic equipment

Abstract

The embodiment of the invention belongs to the technical field of display screens, and provides a preparation method of a display module, the display module, a display screen and electronic equipment. The preparation method of the display module comprises the steps that isolation columns are formed on a substrate, the substrate is limited into a plurality of pixel areas through the isolation columns, and the pixel areas comprise the first pixel area, the second pixel area and the third pixel area; forming an electroluminescent unit in the plurality of pixel regions; forming a first light-emitting layer in the plurality of pixel regions, and removing the first light-emitting layer on the second pixel region and the third pixel region; forming a second light-emitting layer in the plurality of pixel regions, and removing the second light-emitting layer on the first pixel region and the third pixel region; and forming a light-transmitting layer on the plurality of pixel regions, and removing the light-transmitting layer on the first pixel region and the second pixel region. The display module prepared by the preparation method of the display module provided by the embodiment of the invention has a relatively good display effect.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for manufacturing a display module, a display module, a display screen, and an electronic device. Background Technology

[0002] Organic light-emitting diode (OLED) display modules have advantages such as high image quality, energy saving and thin body, and are widely used in various consumer electronics products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, and desktop computers.

[0003] OLED display modules comprise multiple pixels, each containing multiple pixel devices. Each pixel device has an anode, an emissive layer, and a cathode. The emissive layer includes a hole injection layer, a pixel layer, and an electron injection layer. The hole injection layers and electron injection layers within the emissive layer of each pixel device are interconnected. When one pixel device emits light, leakage due to interconnection in either the hole or electron injection layer can cause nearby pixels to also emit light, affecting the display quality. Isolation pillars can be placed between adjacent pixel devices to separate their hole or electron injection layers. Then, the emissive layer is formed layer by layer, and multiple pixel devices are formed through multiple etching processes to prevent leakage due to interconnection in the electron or hole injection layers. However, each etching process etches part of the isolation pillars, preventing effective contact between the isolation pillars and the cathode. This can result in weak or no light emission from certain pixel devices within a pixel, leading to a poor display quality for the entire module.

[0004] The display modules prepared by the methods in related technologies have poor display performance. Summary of the Invention

[0005] This application provides a method for manufacturing a display module, a display module, a display screen, and an electronic device. The display module manufactured using this method has a better display effect.

[0006] The first aspect of this application provides a method for manufacturing a display module, including forming isolation pillars on a substrate, wherein the isolation pillars define a plurality of pixel regions on the substrate, and the pixel regions include a first pixel region, a second pixel region and a third pixel region;

[0007] Electroluminescent units are formed in multiple pixel regions;

[0008] A first light-emitting layer is formed in multiple pixel regions, and the first light-emitting layer on the second and third pixel regions is removed;

[0009] A second light-emitting layer is formed in multiple pixel regions, and the second light-emitting layer on the first pixel region and the third pixel region is removed;

[0010] A light-transmitting layer is formed on multiple pixel areas, and the light-transmitting layer on the first pixel area and the second pixel area is removed.

[0011] The method for fabricating a display module according to embodiments of this application includes the following steps: First, isolation pillars are formed on a substrate, defining multiple pixel regions, including a first pixel region, a second pixel region, and a third pixel region. These isolation pillars isolate the subsequent light-emitting layer, preventing interference between light emitted from different pixel regions and resulting in a better display effect. Then, electroluminescent units are formed in the multiple pixel regions. The electrical connection between the electroluminescent units and the isolation pillars is unaffected by the subsequently fabricated light-emitting layer, allowing for better electrical connection between the electroluminescent units and the isolation pillars, thus improving the display effect of the display module. Next, a first light-emitting layer is formed in the multiple pixel regions, and the first light-emitting layer on the second and third pixel regions is removed. Then, a second light-emitting layer is formed in the multiple pixel regions, and the second light-emitting layer on the first and third pixel regions is removed. Finally, a light-transmitting layer is formed on the multiple pixel regions, and the light-transmitting layer on the first and second pixel regions is removed. Since only the electroluminescent units need to be electrically connected to the isolation pillars, even if the isolation pillars are damaged when the unnecessary light-emitting layers on the second and third pixel areas are removed, the light-emitting effect of the subsequent light-emitting layers will not be affected, thus ensuring a better display effect for the display module.

[0012] In some possible implementations, before forming the first light-emitting layer in multiple pixel regions, a protective layer is further formed on the electroluminescent unit. Preparing a protective layer on the electroluminescent unit in each pixel region can prevent moisture, oxygen, or corrosive gases from entering the electroluminescent unit during subsequent processes, thereby preventing corrosion of the electroluminescent unit.

[0013] In some possible implementations, the first light-emitting layer on the second and third pixel regions is removed by exposure and development; the second light-emitting layer on the first and third pixel regions is removed by exposure and development; and the light-transmitting layer on the first and second pixel regions is removed by exposure and development. Compared to dry or wet etching, the cross-linking decomposition reaction during exposure and the development process do not etch the connection between the isolation pillars and the electroluminescent units, thus not affecting the conductivity of the isolation pillars and the electroluminescent units.

[0014] In some possible implementations, after forming a light-transmitting layer on multiple pixel regions and removing the light-transmitting layers on the first and second pixel regions, the method further includes: forming a first light-emitting layer on the first light-emitting layer of the first pixel region; forming a second light-emitting layer on the second light-emitting layer of the second pixel region; and forming a third light-transmitting layer on the light-transmitting layer of the third pixel region. The first light-emitting layer can block light of colors other than the first light-emitting layer, the second light-emitting layer can block light of colors other than the second light-emitting layer, and the third light-transmitting layer can block light of colors other than the light-transmitting layers, thereby expanding the color gamut of the colors composed of the light emitted by the first pixel device, the second pixel device, and the third pixel device.

[0015] In some possible implementations, a first filter layer is fabricated on a first light-emitting layer in a first pixel region, including: forming the first filter layer in multiple pixel regions and removing the first filter layer on the second and third pixel regions. This fabrication method, which involves forming the first filter layer as a whole and then removing it from the second and third pixel regions, is less costly than using a high-precision mask to deposit the first filter layer only in the first pixel region.

[0016] In some possible implementations, a second filter layer is fabricated on the second light-emitting layer in the second pixel region, including: forming the second filter layer in multiple pixel regions and removing the second filter layer on the first pixel region and the third pixel region. This fabrication method, which involves first forming the second filter layer as a whole and then removing it from the first and third pixel regions, is less costly than using a high-precision mask to deposit the second filter layer only in the second pixel region.

[0017] In some possible implementations, the third filter layer is fabricated on the light-transmitting layer in the third pixel region, including: forming the third filter layer in multiple pixel regions and removing the third filter layer on the first pixel region and the second pixel region. This fabrication method, which involves first forming the third filter layer as a whole and then removing it from the first and second pixel regions, is less costly than using a high-precision mask to deposit the third filter layer only in the third pixel region.

[0018] In some possible implementations, electroluminescent units are formed in multiple pixel regions, including: sequentially forming a first electrode layer, a first transport layer, an electroluminescent layer, a second transport layer, and a second electrode layer on a substrate.

[0019] A second aspect of this application provides a display module, which is fabricated using the above-described method. The display module includes a substrate and isolation pillars. The isolation pillars are disposed on the substrate and define a plurality of pixel regions on the substrate. The pixel regions include a first pixel region, a second pixel region, and a third pixel region. The first pixel region includes an electroluminescent unit and a first light-emitting layer stacked sequentially. The second pixel region includes an electroluminescent unit and a second light-emitting layer stacked sequentially. The third pixel region includes an electroluminescent unit and a light-transmitting layer stacked sequentially. The electroluminescent unit overlaps with the isolation pillars.

[0020] The display module provided in this application embodiment uses a substrate and isolation pillars. The isolation pillars are disposed on the substrate and define multiple pixel areas on the substrate. This prevents light emitted from one pixel area from interfering with other pixel areas, resulting in a better display effect. The pixel areas include a first pixel area, a second pixel area, and a third pixel area. The first pixel area includes an electroluminescent unit and a first light-emitting layer stacked sequentially. The first light-emitting layer is used to convert the light emitted by the electroluminescent unit into the desired color. The second pixel area includes an electroluminescent unit and a second light-emitting layer stacked sequentially. The second light-emitting layer is used to convert the light emitted by the electroluminescent unit into the desired color. The third pixel area includes an electroluminescent unit and a light-transmitting layer stacked sequentially. The light-transmitting layer allows the electroluminescent unit to pass through, and the electroluminescent unit overlaps with the isolation pillars. Therefore, only the electroluminescent unit needs to be electrically connected to the isolation pillar and actively emit light through the power supply of the isolation pillar. The first and second light-emitting layers only need to convert the light emitted by the electroluminescent unit into the colors required by the layers. Therefore, whether the first and second light-emitting layers overlap with the isolation pillar does not affect the display effect of the second and third pixel areas, thereby further improving the display effect of the display module.

[0021] In some possible implementations, the display module further includes protective layers: a protective layer is disposed between the electroluminescent unit and the first light-emitting layer, a protective layer is disposed between the electroluminescent unit and the second light-emitting layer, and a protective layer is disposed between the electroluminescent unit and the light-transmitting layer. The protective layers can block moisture, oxygen, or other gases that corrode the electroluminescent unit, thereby protecting it.

[0022] In some possible implementations, the thickness of the protective layer is 0.5 μm-4 μm. When the protective layer is too thin, the protective effect on the electroluminescent unit is limited; when the protective layer is too thick, the thickness of the first or second light-emitting layer becomes too small, resulting in a lower light conversion efficiency of the first or second light-emitting layer. Therefore, the thickness of the protective layer 170 can be set in the range of 0.5 μm-4 μm.

[0023] In some possible implementations, the protective layer is formed of acrylic organic resin, silicone resin, or epoxy organic resin. Acrylic organic resin, silicone resin, or epoxy organic resin are all transparent organic resins that, in addition to blocking water vapor, oxygen, or other corrosive gases, also have high transmittance for the light emitted by the electroluminescent unit. Therefore, the brightness of the electroluminescent unit is not reduced.

[0024] In some possible implementations, the first and second light-emitting layers are quantum dot light-emitting layers. By adjusting the size of the quantum dots, the light emitted from different light-emitting layers can be controlled, making the color selection in the first and second light-emitting layers more flexible.

[0025] In some possible implementations, a first filter layer is disposed on the first light-emitting layer, a second filter layer is disposed on the second light-emitting layer, and a third filter layer is disposed on the light-transmitting layer. The first filter layer can block light of colors other than those emitted by the first light-emitting layer, the second filter layer can block light of colors other than those emitted by the second light-emitting layer, and the third filter layer can block light of colors other than those emitted by the light-transmitting layer, thereby expanding the color gamut of the colors composed of the light emitted by the first pixel device, the second pixel device, and the third pixel device.

[0026] In some possible implementations, the electroluminescent unit includes a first electrode layer, a first transport layer, an electroluminescent layer, a second transport layer, and a second electrode layer, with the second electrode layer overlapping with an isolation pillar. This overlap between the second electrode layer and the isolation pillar allows for electrical connection between the electroluminescent unit and the isolation pillar.

[0027] In some possible implementations, the distances from the first transport layer, the electroluminescent layer, and the second transport layer to the isolation pillar are all 0.05µm-2µm. This avoids electrical connection between the first transport layer, the electroluminescent layer, and the second transport layer and the isolation pillar.

[0028] In some possible implementations, the projections of the first transport layer, the electroluminescent layer, and the second transport layer onto the substrate are all within the range of the projection of the second electrode layer onto the substrate. This prevents particles in the first transport layer, the electroluminescent layer, and the second transport layer from migrating toward the isolation pillars. It also more reliably prevents the first transport layer, the electroluminescent layer, and the second transport layer from becoming electrically connected to the isolation pillars.

[0029] In some possible implementations, the electroluminescent layer includes multiple sub-emitting layers and an electron injection layer located between adjacent sub-emitting layers. The electron injection layer can also inject additional electrons into the sub-emitting layers, thereby improving the luminous efficiency and stability of the display module.

[0030] A third aspect of this application provides a display screen, including a cover plate and a display module. The cover plate covers the display module, and the display module is manufactured using the above-described method for manufacturing a display module, or the display module is the above-described display module.

[0031] A fourth aspect of this application provides an electronic device, including a housing and the aforementioned display screen, wherein the display screen is mounted on the housing. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0033] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0034] Figure 3 A cross-sectional schematic diagram of the display screen provided in an embodiment of this application;

[0035] Figure 4 This is a schematic diagram of the display module structure in related technology 2;

[0036] Figure 5a This is a schematic diagram of the manufacturing process of the display module in related technology 2. Figure 1 ;

[0037] Figure 5b This is a schematic diagram of the manufacturing process of the display module in related technology 2. Figure 2 ;

[0038] Figure 5c This is a schematic diagram of the manufacturing process of the display module in related technology 2. Figure 3 ;

[0039] Figure 5d This is a schematic diagram of the manufacturing process of the display module in related technology 2. Figure 4 ;

[0040] Figure 5e This is Schematic diagram five of the manufacturing process of the display module in related technology two;

[0041] Figure 5f This is a schematic diagram of the manufacturing process of the display module in related technology 2. Figure 6 ;

[0042] Figure 6 This is a schematic diagram of a first structure of a display module provided in an embodiment of this application;

[0043] Figure 7 This is a schematic diagram of a second structure of the display module provided in an embodiment of this application;

[0044] Figure 8This is a schematic diagram of a third structure of the display module provided in the embodiments of this application;

[0045] Figure 9 This is a schematic diagram of a fourth structure of the display module provided in the embodiments of this application;

[0046] Figure 10 This is a schematic diagram of a fifth structure of the display module provided in the embodiments of this application;

[0047] Figure 11 The process flow of the manufacturing method of the display module provided in the embodiments of this application Figure 1 ;

[0048] Figure 12a A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 1 ;

[0049] Figure 12b A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 2 ;

[0050] Figure 12c A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 3 ;

[0051] Figure 12d A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 4 ;

[0052] Figure 12e Schematic diagram five illustrating the process of manufacturing the display module provided in this application embodiment;

[0053] Figure 13 The process flow of the manufacturing method of the display module provided in the embodiments of this application Figure 2 ;

[0054] Figure 14 A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 6 ;

[0055] Figure 15 A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 7 ;

[0056] Figure 16 The process flow of the manufacturing method of the display module provided in the embodiments of this application Figure 3 .

[0057] Figure label:

[0058] 100n - Display module; 110n - Pixel device; 111n - First pixel device; 1111n - First anode; 1112n - First light-emitting layer; 1113n - First cathode; 112n - Second pixel device; 1121n - Second anode; 1122n - Second light-emitting layer; 1123n - Second cathode; 113n - Third pixel device; 1131n - Third anode; 1132n - Third light-emitting layer; 1133n - Third cathode; 120n - Isolation pillar; 130n - Substrate; 140n - Pixel area; 141n - First pixel area; 142n - Second pixel area; 143n - Third pixel area; 150n - Encapsulation layer;

[0059] 10 - Display screen;

[0060] 100 - Display Module;

[0061] 110 - Substrate; 111 - Driving layer;

[0062] 120 - Isolation column;

[0063] 130 - Pixel region; 131 - First pixel region; 131a - First pixel device; 132 - Second pixel region; 132a - Second pixel device; 133 - Third pixel region; 133a - Third pixel device;

[0064] 140 - Electroluminescent unit; 141 - First electrode layer; 142 - First transport layer; 143 - Electroluminescent layer; 1431 - Sub-emission layer; 1432 - Electron injection layer; 144 - Second transport layer; 145 - Second electrode layer;

[0065] 151 - First light-emitting layer; 152 - Second light-emitting layer; 153 - Light-transmitting layer;

[0066] 160 - Pixel definition layer; 161 - Spacing section;

[0067] 170 - Protective layer;

[0068] 181 - First filter layer; 182 - Second filter layer; 183 - Third filter layer;

[0069] 200-cover plate;

[0070] 20 - Shell; 21 - Middle plate; 22 - Frame;

[0071] 30 - Back cover;

[0072] 40 - Circuit board;

[0073] 1000 - Electronic devices;

[0074] P - Mask;

[0075] H - Light-transmitting aperture;

[0076] S-gap. Detailed Implementation

[0077] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0078] This application provides an electronic device. The electronic device can be referred to as a user equipment (UE) or terminal, etc. For example, the electronic device can be a portable Android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication capabilities, a computing device, an in-vehicle device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical care, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, etc. This application does not specifically limit the form of the electronic device.

[0079] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0080] See Figure 1 As shown, the example given is an electronic device 1000 that is a handheld device with wireless communication capabilities. For example, a handheld device with wireless communication capabilities could be a mobile phone.

[0081] Please continue reading Figure 1As shown in the figure, the electronic device 1000 includes a display screen 10 and a housing 20. The housing 20 is the main support structure of the electronic device 1000. The display screen 10 is mounted on the housing 20. The display screen 10 provides a display interface and an interactive interface with the user for the electronic device 1000. The display screen 10 can be an organic light-emitting diode (OLED) display screen. The display screen 10 can also be a micro organic light-emitting diode (micro organic light-emitting diode) display screen, a micro organic light-emitting diode (micro organic light-emitting diode) display screen, etc. In this embodiment, an OLED display screen is used as an example for explanation.

[0082] Figure 2 This is an exploded view of an electronic device provided in an embodiment of this application.

[0083] See Figure 2 As shown, the housing 20 can be the mid-frame of an electronic device 1000 (e.g., a mobile phone). The housing 20 includes a mid-plate 21 and a frame 22 that are interconnected. The frame 22 can be a rectangular frame that surrounds and connects to the peripheral edge of the mid-plate 21. The display screen 10 can be mounted on the frame 22 and form a cavity with the housing 20. The cavity between the display screen 10 and the housing 20 can be used to install other components of the electronic device 1000, such as a camera module.

[0084] See also Figure 2 The electronic device 1000 may also include a back cover 30. The back cover 30 is disposed on the side of the housing 20 away from the display screen 10 and is connected to the frame 22. The back cover 30 may also form another cavity within the electronic device 1000 with the housing 20, in which components such as a circuit board 40 or a battery may be disposed.

[0085] See also Figure 2 Electronic devices can be mounted on the circuit board 40. For example, electronic devices may include processor modules, system-on-chip (SoC), storage modules, communication modules, radio frequency modules, charging management modules, power management ICs (PMICs), etc.

[0086] Figure 3 A cross-sectional schematic diagram of the display screen provided in an embodiment of this application.

[0087] See Figure 3As shown, the display screen 10 includes a display module 100 and a cover plate 200. The display module 100 is the unit in the display screen 10 that performs the display function. The cover plate 200 is placed on the display module 100 to protect it. When the cover plate 200 is placed on the display module 100, it can be connected to the display module 100 by means of adhesive bonding, hot pressing, etc., to achieve the fixation of the cover plate 200 on the display module 100. The cover plate 200 can be a light-transmitting plate structure to facilitate the display of the display module 100. For example, the cover plate 200 can be a transparent glass plate.

[0088] The processor module on circuit board 40 can be connected to display module 100 to control the display brightness of display module 100, reducing power consumption. It can also adjust the display brightness of display module 100 according to the intensity of ambient light outside electronic device 1000, enabling display screen 10 to achieve better display effects and improve user experience. A battery is used to power the display module.

[0089] The display module comprises multiple pixels, each consisting of three pixel devices. These three pixel devices emit red, green, and blue light respectively, and the red, green, and blue light emitted by the three pixel devices can be combined under the control of the processor module to emit different colors of light. This allows each pixel to emit different colors of light. Each pixel device includes an anode, a light-emitting layer, and a cathode. The light-emitting layer includes a hole injection layer, a pixel layer, and an electron injection layer. The hole injection layers and electron injection layers within the light-emitting layers of each pixel device are interconnected. When one pixel device is controlled to emit light, leakage current in the hole injection layer or electron injection layer due to interconnection can cause nearby pixels to also emit light, thus affecting the display effect.

[0090] Figure 4 This is a schematic diagram of the display module in related technology 2. The display module in the related technology is indicated by "100n", and all components in display module 100n are suffixed with "n" to distinguish it from the display module provided in the embodiments of this application.

[0091] See Figure 4As shown, a pixel in the display module 100n includes three pixel devices 110n, namely a first pixel device 111n, a second pixel device 112n, and a third pixel device 113n. The first pixel device 111n includes a first anode 1111n, a first light-emitting layer 1112n, and a first cathode 1113n; the second pixel device 112n includes a second anode 1121n, a second light-emitting layer 1122n, and a second cathode 1123n; the third pixel device 113n includes a third anode 1131n, a third light-emitting layer 1132n, and a third cathode 1133n. The display module 100n also includes a substrate 130n. Isolation pillars 120n are disposed between adjacent pixel devices 110n. The isolation pillars 120n can separate the light-emitting layers in adjacent pixel devices 110n, thereby preventing mutual interference between pixel devices 110n. The isolation pillars 120n are also electrically connected to the cathodes of the pixel devices to electrically connect the cathodes of each pixel device to a battery. The display module 100n also includes an encapsulation layer 150n.

[0092] The following describes the preparation process of the display module in related technology two.

[0093] Figure 5a This is a schematic diagram of the manufacturing process of the display module in related technology 2. Figure 1 , Figure 5b This is a schematic diagram of the manufacturing process of the display module in related technology 2. Figure 2 , Figure 5c This is a schematic diagram of the manufacturing process of the display module in related technology 2. Figure 3 , Figure 5d This is a schematic diagram of the manufacturing process of the display module in related technology 2. Figure 4 , Figure 5e This is Schematic diagram five of the manufacturing process of the display module in related technology two. Figure 5f This is a schematic diagram of the manufacturing process of the display module in related technology 2. Figure 6 .

[0094] See Figure 5a As shown, three pixel regions 140n are defined on the substrate 130n by isolation pillars 120n. The three pixel regions 140n are a first pixel region 141n, a second pixel region 142n, and a third pixel region 143n, respectively. A first anode 1111n, a second anode 1121n, and a third anode 1131n are formed on the three pixel regions 140n, respectively. See also Figure 5b As shown, a first light-emitting layer 1112n and a first cathode 1113n are fabricated in the first anode 1111n, the second anode 1121n, and the third anode 1131n. See also Figure 5cAs shown, the first light-emitting layer 1112n and the first cathode 1113n on the second pixel region 142n and the third pixel region 143n are removed by etching. The etching can be dry etching or wet etching. Since both dry and wet etching are isotropic etching, the isolation pillars 120n on the second pixel region 142n and the third pixel region 143n will be etched during the etching process. Figure 5c In the second pixel region 142n and the third pixel region 143n, the isolation pillars 120n are etched to varying degrees, resulting in notches of different shapes on the isolation pillars 120. See also Figure 5d As shown, a second light-emitting layer 1122n and a second cathode 1123n are fabricated on each of the three pixel regions 140n (the second light-emitting layer 1122n and the second cathode 1123n are not shown on the first pixel region 141n). Because the isolation pillar 120n is etched, the second cathode 1123n and the isolation pillar 120n cannot overlap well. Figure 5d In the second pixel region 142n, due to the notch on the isolation pillar 120n, a gap S exists between the second cathode 1123n and the isolation pillar 120n. This gap S affects the bonding effect between the second cathode 1123n and the isolation pillar 120n, and in severe cases, it can prevent the second cathode 1123n from conducting with the isolation pillar 120n, thus preventing the second light-emitting layer 1122n from being lit. (See also...) Figure 5e As shown, the second light-emitting layer 1122n and the second cathode 1123n on the first pixel region 141n and the third pixel region 143n are removed by etching. During the etching process, the isolation pillars 120n in the third pixel region 143n are etched again, increasing the notch on the isolation pillars 120n in the third pixel region 143n. See also Figure 5f As shown, a third light-emitting layer 1132n and a third cathode 1133n are fabricated on each of the three pixel regions 140n (the third light-emitting layer 1132n and the third cathode 1133n are not shown on the first pixel region 141n and the second pixel region 142n). Since the isolation pillar 120n on the third pixel region 143n has been etched twice, the gap S between the third cathode 1133n and the isolation pillar 120n is larger. This gap S will affect the bonding effect between the third cathode 1133n and the isolation pillar 120n. In severe cases, it may prevent the third cathode 1133n and the isolation pillar 120n from conducting. In other words, during the multiple etching processes, the isolation pillar 120 will also be etched, affecting the bonding effect between the isolation pillar 120n and the subsequently deposited cathode. The more times it is etched, the worse the bonding effect between the isolation pillar 120n and the subsequently deposited cathode becomes, thus affecting the conductivity between the isolation pillar 120n and the cathode. Poor conductivity between the isolation pillar 120n and the cathode causes a certain pixel device in the pixel to emit light weakly or not at all, and the pixel device cannot combine to produce the color required by the pixel, thus resulting in a poor display effect of the display module.

[0095] The display modules prepared by the methods in related technologies have poor display performance.

[0096] Based on this, the present application provides a method for preparing a display module, a display module, a display screen, and an electronic device. The display module prepared using this method has a better display effect.

[0097] First, the structure of the display module provided in the embodiments of this application will be described.

[0098] Figure 6 This is a schematic diagram of a first structure of a display module provided in an embodiment of this application.

[0099] See Figure 6 As shown, the display module 100 includes a substrate 110 and an isolation pillar 120. The isolation pillar 120 is disposed on the substrate 110 and defines a plurality of pixel regions 130 on the substrate 110. The pixel regions 130 include a first pixel region 131, a second pixel region 132 and a third pixel region 133. The first pixel region 131 includes an electroluminescent unit 140 and a first light-emitting layer 151 stacked in sequence. The second pixel region 132 includes an electroluminescent unit 140 and a second light-emitting layer 152 stacked in sequence. The third pixel region 133 includes an electroluminescent unit 140 and a light-transmitting layer 153 stacked in sequence. The electroluminescent unit 140 overlaps with the isolation pillar 120.

[0100] The substrate 110 can provide support and protection for the display module 100. The substrate 110 can include a glass substrate, a silicon substrate, or a flexible substrate. A driving layer 111 is disposed on the substrate 110. The driving layer 111 can be a thin film transistor driving layer. The driving layer 111 can control the current of each pixel in the display module 100 to adjust the brightness and color of the pixel.

[0101] The display module 100 includes multiple pixels, and each pixel includes multiple pixel devices. For example, a pixel may include three pixel devices, which emit red, green, and blue light respectively. The brightness and color of each pixel device are controlled by the driving layer 111, so that the pixel can emit the desired color. Pixels may also be based on other color bases; for example, a pixel may include four or more pixel devices. In this embodiment, a pixel including three pixel devices is used as an example for illustration.

[0102] A pixel definition layer 160 is also disposed above the substrate 110. The pixel definition layer 160 includes a plurality of spacers 161, and isolation pillars 120 are disposed on the spacers 161. The area between adjacent isolation pillars 120 is the pixel area 130.Figure 6 The diagram shows three pixel regions 130, namely a first pixel region 131, a second pixel region 132, and a third pixel region 133. Three pixel devices are formed in each of the three pixel regions 130. These three pixel devices can be designated as first pixel device 131a, second pixel device 132a, and third pixel device 133a.

[0103] Electroluminescent units 140 are each disposed on the first pixel region 131, the second pixel region 132, and the third pixel region 133. The electroluminescent units 140 overlap with the isolation pillar 120, thereby electrically connecting the electroluminescent units 140 and the isolation pillar 120. The isolation pillar 120 can serve as a cathode, and the side of the electroluminescent unit 140 facing away from the isolation pillar 120 forms the anode. Power is supplied to the electroluminescent unit 140 through the surfaces of the isolation pillar 120 and the electroluminescent unit 140, enabling the electroluminescent unit 140 to emit light, for example, blue light.

[0104] In the first pixel region 131, a first light-emitting layer 151 is disposed above the electroluminescent unit 140. The first light-emitting layer 151 can convert the light emitted by the electroluminescent unit 140 into the desired color. For example, the first light-emitting layer 151 can convert the blue light emitted by the electroluminescent unit 140 into red light. That is, the light emitted in the first pixel region 131 is red. The electroluminescent unit 140 and the first light-emitting layer 151 in the first pixel region 131 form the first pixel device 131a.

[0105] In the second pixel region 132, a second light-emitting layer 152 is disposed above the electroluminescent unit 140. The second light-emitting layer 152 can convert the light emitted by the electroluminescent unit 140 into the desired color. For example, the second light-emitting layer 152 can convert the blue light emitted by the electroluminescent unit 140 into blue light. That is, the light emitted in the second pixel region 132 is green. The electroluminescent unit 140 and the second light-emitting layer 152 in the second pixel region 132 form the second pixel device 132a.

[0106] In the third pixel region 133, a light-transmitting layer 153 is disposed above the electroluminescent unit 140. Light emitted by the electroluminescent unit 140 can pass through the light-transmitting layer 153. For example, blue light emitted by the electroluminescent unit 140 can pass through the light-transmitting layer. That is, the light emitted in the third pixel region 133 is blue. The electroluminescent unit 140 and the light-transmitting layer 153 in the third pixel region 133 form the third pixel device 133a.

[0107] Therefore, only the electroluminescent unit 140 needs to be electrically connected to the isolation pillar 120 and actively emit light through the power supply of the isolation pillar 120. The first light-emitting layer 151 and the second light-emitting layer 152 only need to convert the light emitted by the electroluminescent unit 140 into the desired color. Therefore, whether the first light-emitting layer 151 and the second light-emitting layer 152 are connected to the isolation pillar 120 does not affect the conductivity between the second pixel area 132 and the third pixel area 133 and the external circuit.

[0108] The display module 100 provided in this application embodiment provides a substrate 110 and an isolation pillar 120. The isolation pillar 120 is disposed on the substrate 110 and defines multiple pixel regions 130 on the substrate 110. This can prevent light emitted from one pixel region 130 from interfering with other pixel regions 130, so that the display module 100 has a better display effect. Pixel region 130 includes a first pixel region 131, a second pixel region 132, and a third pixel region 133. The first pixel region 131 includes an electroluminescent unit 140 and a first light-emitting layer 151 stacked sequentially. The first light-emitting layer 151 is used to convert the light emitted by the electroluminescent unit 140 into the desired color. The second pixel region 132 includes an electroluminescent unit 140 and a second light-emitting layer 152 stacked sequentially. The second light-emitting layer 152 is used to convert the light emitted by the electroluminescent unit 140 into the desired color. The third pixel region 133 includes an electroluminescent unit 140 and a light-transmitting layer 153 stacked sequentially. The light-transmitting layer 153 is used to allow the electroluminescent unit 140 to pass through. The electroluminescent unit 140 overlaps with the isolation post 120. Therefore, only the electroluminescent unit 140 needs to be electrically connected to the isolation pillar 120 and actively emit light through the power supply of the isolation pillar 120. The first light-emitting layer 151 and the second light-emitting layer 152 only need to convert the light emitted by the electroluminescent unit 140 into the color required by the layer. Therefore, whether the first light-emitting layer 151 and the second light-emitting layer 152 are connected to the isolation pillar 120 does not affect the display effect of the second pixel area 132 and the third pixel area 133, thereby further improving the display effect of the display module 100.

[0109] Figure 7 This is a schematic diagram of a second structure of the display module provided in an embodiment of this application.

[0110] See Figure 7 As shown, the display module 100 also includes a protective layer 170. The protective layer 170 is disposed between the electroluminescent unit 140 and the first light-emitting layer 151, between the electroluminescent unit 140 and the second light-emitting layer 152, and between the electroluminescent unit 140 and the light-transmitting layer 153.

[0111] The protective layer 170 can block water vapor, oxygen, or gases that corrode other electroluminescent units 140, thereby protecting the electroluminescent units 140.

[0112] In one possible implementation, the thickness of the protective layer 170 is 0.5 μm to 4 μm.

[0113] When the thickness of the protective layer 170 is too small, its protective effect on the electroluminescent unit 140 is limited. When the thickness of the protective layer 170 is too large, it will result in a smaller thickness of the first light-emitting layer 151 or the second light-emitting layer 152, thereby reducing the light conversion efficiency of the first light-emitting layer 151 or the second light-emitting layer 152. Therefore, the thickness of the protective layer 170 can be set in the range of 0.5μm-4μm.

[0114] In one possible implementation, the protective layer 170 is a protective layer 170 formed of acrylic organic resin, silicone resin or epoxy organic resin.

[0115] Acrylic resins, silicone resins, or epoxy resins are all transparent organic resins. Besides blocking water vapor, oxygen, and other corrosive gases, they also have high transmittance of light emitted by the electroluminescent unit 140, thus not reducing the brightness of the electroluminescent unit 140. Furthermore, the material of the light-transmitting layer 153 can be the same as that of the protective layer 170, thereby ensuring that the light transmittance is the same in both the protective layer 170 and the light-transmitting layer 153.

[0116] In one possible implementation, the first light-emitting layer 151 and the second light-emitting layer 152 are quantum dot light-emitting layers.

[0117] The quantum dot emitting layer comprises uniformly distributed quantum dots, with quantum dots of different sizes emitting different colors of light when illuminated. For example, the quantum dots in the first emitting layer 151 are 6-8 nm in size, while those in the second emitting layer 152 are 2-4 nm in size. Therefore, by adjusting the size of the quantum dots, the light emitted from different emitting layers can be controlled, allowing for more flexible color selection in both the first and second emitting layers 151 and 152.

[0118] Figure 8 This is a schematic diagram of a third structure of the display module provided in an embodiment of this application.

[0119] See Figure 8 As shown, a first light-emitting layer 151 is provided with a first light-filtering layer 181, a second light-emitting layer 152 is provided with a second light-filtering layer 182, and a third light-transmitting layer 153 is provided with a third light-filtering layer 183.

[0120] The first filter layer 181 can block light of other colors besides the first light-emitting layer 151. For example, when the first light-emitting layer 151 emits red light, the first filter layer 181 can block light of other colors besides red light, making the red light emitted by the first pixel device 131a purer.

[0121] The second filter layer 182 can block light of other colors besides the second light-emitting layer 152. For example, when the second light-emitting layer 152 emits green light, the second filter layer 182 can block light of other colors besides green light, making the green light emitted by the second pixel device 132a purer.

[0122] The third filter layer 183 can block light of other colors besides the light-transmitting layer 153. For example, when the light-transmitting layer 153 emits blue light, the third filter layer 183 can block light of other colors besides blue light, making the green light emitted by the third pixel device 133a purer.

[0123] As a result, the color gamut of the colors formed by the light emitted by the first pixel device 131a, the second pixel device 132a, and the third pixel device 133a is wider.

[0124] Figure 9 This is a schematic diagram of a fourth structure of the display module provided in an embodiment of this application. Figure 9 Only the structure at the first pixel region 131 is shown in the image to clearly illustrate the structure of the electroluminescent unit 140.

[0125] See Figure 9 As shown, the electroluminescent unit 140 includes a first electrode layer 141, a first transport layer 142, an electroluminescent layer 143, a second transport layer 144, and a second electrode layer 145, with the second electrode layer 145 overlapping with the isolation pillar 120.

[0126] The first electrode layer 141 can be an anode, the first transport layer 142 can be a hole transport layer, the electroluminescent layer 143 can be a blue pixel layer, the second transport layer 144 is an electron transport layer, and the second electrode layer 145 is a cathode. The second electrode layer 145 overlaps with the isolation pillar 120, thereby being electrically connected to the negative terminal of the external circuit through the isolation pillar 120. The first electrode layer 141 is electrically connected to the positive terminal of the external circuit. The external circuit applies a voltage to the first electrode layer 141 and the second electrode layer 145. Holes in the first electrode layer 141 pass through the first transport layer 142 to reach the electroluminescent layer 143, and electrons in the second electrode layer 145 pass through the second transport layer 144 to reach the electroluminescent layer 143. Holes and electrons recombine in the electroluminescent layer 143, exciting light radiation, causing the electroluminescent layer 143 to emit light. By overlapping the second electrode layer 145 with the isolation pillar 120, the electroluminescent unit 140 can be electrically connected to the isolation pillar 120.

[0127] Please continue reading Figure 9 As shown, the distances from the first transmission layer 142, the electroluminescent layer 143, and the second transmission layer 144 to the isolation pillar 120 are all 0.05um-2um.

[0128] The first electrode layer 141, the first transport layer 142, the electroluminescent layer 143, the second transport layer 144, and the second electrode layer 145 can all be prepared by vapor deposition. The isolation pillar 120 has an "eaves-type" structure. When vapor-depositing the first transport layer 142, the electroluminescent layer 143, and the second transport layer 144, the vapor deposition angle is controlled so that the sides of the first transport layer 142, the electroluminescent layer 143, and the second transport layer 144 are spaced 0.05µm-2µm from the isolation pillar. This prevents the first transport layer 142, the electroluminescent layer 143, and the second transport layer 144 from being electrically connected to the isolation pillar 120.

[0129] Please continue reading Figure 9 As shown, the projections of the first transport layer 142, the electroluminescent layer 143, and the second transport layer 144 onto the substrate 110 are all within the range of the projection of the second electrode layer 145 onto the substrate 110.

[0130] In other words, during the deposition of the second electrode layer 145, the second electrode layer 145 completely covers the sides of the first transport layer 142, the electroluminescent layer 143, and the second transport layer 144, as well as the side of the second transport layer 144 facing away from the substrate 110. This prevents particles in the first transport layer 142, the electroluminescent layer 143, and the second transport layer 144 from migrating towards the isolation pillar 120. This more reliably prevents the first transport layer 142, the electroluminescent layer 143, and the second transport layer 144 from electrically connecting with the isolation pillar 120.

[0131] Figure 10 This is a schematic diagram of the fifth structure of the display module provided in the embodiments of this application.

[0132] See Figure 10 As shown, in Figure 10 Based on the embodiment shown, the electroluminescent layer 143 includes multiple sub-emitting layers 1431 and an electron injection layer 1432 located between adjacent sub-emitting layers 1431.

[0133] exist Figure 10 In the illustrated embodiment, two sub-light-emitting layers 1431 and an electron injection layer 1432 located between the two sub-light-emitting layers 1431 are shown. The electron injection layer 1432 can further inject electrons into the sub-light-emitting layers 1431, thereby improving the luminous efficiency and stability of the display module 100. The sub-light-emitting layers 1431 can be formed of fluorescent luminescent materials, phosphorescent luminescent materials, or a mixture of fluorescent and phosphorescent luminescent materials.

[0134] Figure 11 The process flow of the manufacturing method of the display module provided in the embodiments of this application Figure 1 .

[0135] See Figure 11 As shown in the embodiments of this application, a method for manufacturing a display module is also provided, including:

[0136] S101. An isolation pillar 120 is formed on the substrate 110. The isolation pillar 120 defines a plurality of pixel regions 130 on the substrate 110. The pixel regions 130 include a first pixel region 131, a second pixel region 132 and a third pixel region 133.

[0137] Figure 12a A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 1 .

[0138] See Figure 12a As shown, a driving layer 111 needs to be formed on the substrate 110 first. A thin film can be prepared on the substrate 110 first, and then the circuit pattern in the driving layer 111 can be formed using photolithography and etching. Then, a pixel definition layer 160 is formed on the driving layer 111, and the pixel definition layer 160 includes multiple spacers 161. Then, isolation pillars 120 are formed on the spacers 161. The isolation pillars 120 can also be prepared using deposition, photolithography, and etching. The isolation pillars 120 can define multiple pixel regions 130 on the substrate 110. Figure 12a The diagram schematically illustrates the first pixel region 131, the second pixel region 132, and the third pixel region 133. In fabricating the display module 100, an isolation pillar 120 is first fabricated. The isolation pillar 120 can isolate the subsequent light-emitting layer, preventing interference between light emitted from different pixel regions 130, thus enabling the display module 100 to have a better display effect.

[0139] S102, forming electroluminescent units 140 in multiple pixel regions 130.

[0140] Figure 12b A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 2 .

[0141] See Figure 12bAs shown, the electroluminescent unit 140 can be formed by vapor deposition. During the vapor deposition of the electroluminescent unit 140, the cathode of the electroluminescent unit 140 is made to overlap with the isolation pillar 120. Since the electroluminescent unit 140 is vapor-deposited in each pixel area 130, no mask is required during the vapor deposition process, which can reduce the cost of vapor deposition. It should be noted that the material of the electroluminescent unit is also vapor-deposited on the end face of the isolation pillar 120, and the material on the isolation pillar 120 can be removed after the display module 100 is fabricated. The electroluminescent unit 140 can emit light when powered on, and the light emitted by the electroluminescent unit 140 can be used as the backlight of the display module 100. For example, the electroluminescent unit 140 can emit blue light or white light when powered on. The following description will use the example of the electroluminescent unit 140 emitting blue light. The electroluminescent unit 140 needs to be electrically connected to the isolation pillar 120. The electroluminescent unit 140 is prepared before the light-emitting layer of each pixel area 130 is prepared, so that the electrical connection effect between the electroluminescent unit 140 and the isolation pillar 120 is not affected by the light-emitting layer prepared later. This allows the electroluminescent unit 140 to be better electrically connected to the isolation pillar 120, which can improve the display effect of the display module 100.

[0142] S103, A first light-emitting layer 151 is formed in multiple pixel regions 130, and the first light-emitting layer 151 on the second pixel region 132 and the third pixel region 133 is removed.

[0143] Figure 12c A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 3 .

[0144] See Figure 12c As shown, a first light-emitting layer 151 is coated on the electroluminescent unit 140 in each pixel region 130. The first light-emitting layer 151 converts the light emitted by the electroluminescent unit 140 into the desired color. For example, the first light-emitting layer 151 can convert the light emitted by the electroluminescent unit 140 into red.

[0145] The second pixel region 132 and the third pixel region 133 need to emit light of other colors, therefore, the first light-emitting layer 151 on the second pixel region 132 and the third pixel region 133 needs to be removed. Since only the electroluminescent unit 140 needs to be electrically connected to the isolation pillar 120, even if the isolation pillar 120 is damaged when removing the first light-emitting layer 151 on the second pixel region 132 and the third pixel region 133, it will not affect the light-emitting effect of the subsequent light-emitting layer. In addition, the fabrication method of forming the first light-emitting layer 151 on multiple pixel regions 130 and then removing the first light-emitting layer 151 on the second pixel region 132 and the third pixel region 133 is less expensive than using a high-precision mask to deposit the first light-emitting layer 151 only on the first pixel region 131.

[0146] S104. A second light-emitting layer 152 is formed in multiple pixel regions 130, and the second light-emitting layer 152 on the first pixel region 131 and the third pixel region 133 is removed.

[0147] Figure 12d A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 4 .

[0148] See Figure 12d As shown, a second light-emitting layer 152 is coated on each pixel region 130. Since the first light-emitting layer 151 is already disposed on the electroluminescent unit 140 of the first pixel region 131, the second light-emitting layer 152 is coated on top of the first light-emitting layer 151 in the first pixel region 131. In the second pixel region 132 and the third pixel region 133, the second light-emitting layer 152 is coated on the electroluminescent unit 140. The second light-emitting layer 152 can convert the light emitted by the electroluminescent unit 140 into green.

[0149] The second light-emitting layer 152 on the first pixel region 131 and the third pixel region 133 is removed. Since only the electroluminescent unit 140 needs to be electrically connected to the isolation pillar 120, the removal of the second light-emitting layer 151 on the third pixel region 133 will not affect the light-emitting effect of the subsequent light-emitting layers, even if the isolation pillar 120 is damaged.

[0150] S105, A light-transmitting layer 153 is formed on multiple pixel regions 130, and the light-transmitting layer 153 on the first pixel region 131 and the second pixel region 132 is removed.

[0151] Figure 12e The fifth diagram illustrates the process of fabricating the display module provided in the embodiments of this application.

[0152] See Figure 12eAs shown, a light-transmitting layer 153 is coated on each pixel region 130. The first light-emitting layer 151 is already disposed on the electroluminescent unit 140 of the first pixel region 131; therefore, in the first pixel region 131, the light-transmitting layer 153 is coated above the first light-emitting layer 151. The second light-emitting layer 152 is already disposed on the electroluminescent unit 140 of the second pixel region 132; therefore, in the second pixel region 132, the light-transmitting layer 153 is coated above the second light-emitting layer 152.

[0153] In the third pixel region 133, a light-transmitting layer 153 is coated on the electroluminescent unit 140. Since the third pixel region 133 needs to emit green light, only a transparent organic material needs to be coated in the third pixel region 133 to allow the light emitted by the electroluminescent unit 140 to pass through. The light-transmitting layer 153 also protects the electroluminescent unit 140.

[0154] A first light-emitting layer 151 has been coated on the first pixel area 131, and a second light-emitting layer 152 has been coated on the second pixel area 132. Therefore, when removing the light-transmitting layer 153 on the first pixel area 131 and the second pixel area 132, damage to the isolation pillar 120 can be reduced.

[0155] The method for fabricating a display module provided in this application includes the following steps: S101, forming isolation pillars on a substrate, the isolation pillars defining multiple pixel regions, including a first pixel region, a second pixel region, and a third pixel region. First, isolation pillars 120 are fabricated. These isolation pillars 120 can isolate subsequent light-emitting layers, preventing interference between light emitted from different pixel regions 130, thus improving the display effect of the display module 100. S102, forming electroluminescent units 140 in the multiple pixel regions 130. The electrical connection between the electroluminescent units 140 and the isolation pillars 120 is not affected by the subsequently fabricated light-emitting layers, allowing the electroluminescent units 140 to be better electrically connected to the isolation pillars 120, thereby improving the display effect of the display module 100. S103, forming a first light-emitting layer 151 in the multiple pixel regions 130, and removing the first light-emitting layer 151 from the second pixel region 132 and the third pixel region 133. S104. A second light-emitting layer 152 is formed in the plurality of pixel regions 130, and the second light-emitting layer 152 on the first pixel region 131 and the third pixel region 133 is removed. S105. A light-transmitting layer 153 is formed on the plurality of pixel regions 130, and the light-transmitting layer 153 on the first pixel region 131 and the second pixel region 132 is removed. Since only the electroluminescent unit 140 needs to be electrically connected to the isolation pillar 120, even if the isolation pillar 120 is damaged during the subsequent removal of the unnecessary light-emitting layer on the second pixel region 132 and the third pixel region 133, the light-emitting effect of the subsequent light-emitting layer is not affected, ensuring a better display effect for the display module 100.

[0156] Figure 13 The process flow of the manufacturing method of the display module provided in the embodiments of this application Figure 2 .

[0157] See Figure 13 As shown, in one possible implementation, before forming the first light-emitting layer 151 in the plurality of pixel regions 130, the method further includes: S106, forming a protective layer 170 on the electroluminescent unit 140.

[0158] Figure 14 A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 6 .

[0159] See Figure 14As shown, after forming the electroluminescent unit 140, at least three more steps are required to complete the fabrication of the display module. The subsequent light-emitting layer may be fabricated using various methods such as photolithography, dry etching, or wet etching. The materials used in these fabrication processes may corrode the electroluminescent unit 140. Therefore, fabricating a protective layer 170 on the electroluminescent unit 140 in each pixel region 130 can prevent moisture, oxygen, or corrosive gases from entering the electroluminescent unit 140 during subsequent processes, thereby preventing corrosion of the electroluminescent unit 140.

[0160] In one possible implementation, the first light-emitting layer 151 on the second pixel region 132 and the third pixel region 133 is removed by exposure and development; the second light-emitting layer 152 on the first pixel region 131 and the third pixel region 133 is removed by exposure and development; and the light-transmitting layer 153 on the first pixel region 131 and the second pixel region 132 is removed by exposure and development.

[0161] Photolithography includes two steps: exposure and development. Photolithography is further divided into forward photolithography and reverse photolithography. In this application, forward photolithography is used as an example for illustration.

[0162] Figure 15 A schematic diagram of the process for manufacturing the display module provided in the embodiments of this application. Figure 7 .

[0163] See Figure 15 As shown, after depositing the first light-emitting layer 151 on the electroluminescent unit 140, a mask P is placed above the first light-emitting layer 151. The mask P has a light-transmitting hole H, which is aligned with the second pixel region 132 and the third pixel region 133. Ultraviolet light passes through the light-transmitting hole H, and under the irradiation of the ultraviolet light, the first light-emitting layer 151 in the second pixel region 132 and the third pixel region 133 undergoes a cross-linking decomposition reaction. Then, the first light-emitting layer 151 in the second pixel region 132 and the third pixel region 133 is dissolved in the developer solution, thereby removing the first light-emitting layer 151 in the second pixel region 132 and the third pixel region 133. Compared with dry etching or wet etching, the cross-linking decomposition reaction during the exposure process and the development process do not etch the connection between the isolation pillar 120 and the electroluminescent unit 140, thus not affecting the conductivity of the isolation pillar 120 and the electroluminescent unit 140.

[0164] The two steps of removing the second light-emitting layer 152 on the first pixel region 131 and the third pixel region 133 by exposure and development, and removing the light-transmitting layer 153 on the first pixel region 131 and the second pixel region 132 by exposure and development, are the same as the process of removing the first light-emitting layer 151 in the second pixel region 132 and the third pixel region 133 by exposure and development, and will not be described in detail here.

[0165] Figure 16 The process flow of the manufacturing method of the display module provided in the embodiments of this application Figure 3 .

[0166] See Figure 16 As shown, in one possible implementation, after forming a light-transmitting layer 153 on multiple pixel regions 130 and removing the light-transmitting layer 153 on the first pixel region 131 and the second pixel region 132, the method further includes:

[0167] S107. A first filter layer 181 is formed on the first light-emitting layer 151 of the first pixel region 131; a second filter layer 182 is formed on the second light-emitting layer 152 of the second pixel region 132; and a third filter layer 183 is formed on the light-transmitting layer 153 of the third pixel region 133.

[0168] The effects of the first filter layer 181, the second filter layer 182, and the third filter layer 183 have been described in detail in the above embodiments, and will not be repeated here.

[0169] The preparation methods of the first filter layer 181, the second filter layer 182, and the third filter layer 183 will be described in detail below.

[0170] The first filter layer 181 is prepared on the first light-emitting layer 151 of the first pixel region 131, including: forming the first filter layer 181 in multiple pixel regions 130, and removing the first filter layer 181 on the second pixel region 132 and the third pixel region 133.

[0171] The first filter layer 181 can be formed on multiple pixel regions 130 firstly, and then the first filter layer 181 on the second pixel region 132 and the third pixel region 133 can be removed. For example, the first filter layer 181 on the second pixel region 132 and the third pixel region 133 can be removed by exposure and development (wherein, the method of removing the first filter layer 181 on the second pixel region 132 and the third pixel region 133 by exposure and development is the same as the exposure and development process described above, and will not be repeated here). The preparation method of forming the first filter layer 181 as a whole firstly and then removing the first filter layer 181 on the second pixel region 132 and the third pixel region 133 is less expensive than using a high-precision mask to evaporate the first filter layer 181 only on the first pixel region 131.

[0172] Similarly, the second filter layer 182 and the third filter layer 183 are formed in the same manner as the first filter layer 181, further reducing the manufacturing cost of the display module 100. Specifically, the second filter layer 182 is formed on the second light-emitting layer 152 of the second pixel region 132, including: forming the second filter layer 182 in each of the multiple pixel regions 130, and removing the second filter layer 182 on the first pixel region 131 and the third pixel region 133. The third filter layer 183 is formed on the light-transmitting layer 153 of the third pixel region 133, including: forming the third filter layer 183 in each of the multiple pixel regions 130, and removing the third filter layer 183 on the first pixel region 131 and the second pixel region 132.

[0173] The specific fabrication process of the electroluminescent unit 140 will be described below.

[0174] Forming electroluminescent units 140 in multiple pixel regions 130 includes: sequentially forming a first electrode layer 141, a first transport layer 142, an electroluminescent layer 143, a second transport layer 144, and a second electrode layer 145 on a substrate 110.

[0175] The first electrode layer 141, the first transport layer 142, the electroluminescent layer 143, the second transport layer 144, and the second electrode layer 145 can be formed by layer-by-layer vapor deposition. It should be noted that when depositing the first transport layer 142, the electroluminescent layer 143, and the second transport layer 144, the vapor deposition angle needs to be adjusted using the eaves structure of the isolation pillar 120 to ensure a gap of 0.05µm-2µm between the first transport layer 142, the electroluminescent layer 143, and the second transport layer 144 and the isolation pillar 120. When depositing the second electrode layer 145, the vapor deposition angle also needs to be adjusted using the eaves structure of the isolation pillar 120 to ensure that the second electrode layer 145 overlaps with the isolation pillar 120.

[0176] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0177] In the description of this application, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, display structure, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are expressly listed, but may include other steps or units that are not expressly listed or that are inherent to such process, method, product, or device.

[0178] The term "and / or" used in this application is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0179] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection via an intermediate medium, or the internal connection or interaction between two components. Those skilled in the art can understand the specific meaning of these terms in the embodiments of this application based on the specific circumstances.

[0180] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. A method for manufacturing a display module, characterized by, The method comprises: forming an isolation column on a substrate, the isolation column defining a plurality of pixel regions on the substrate, the pixel regions comprising a first pixel region, a second pixel region, and a third pixel region; forming an electroluminescent unit in the plurality of pixel regions; forming a first light-emitting layer in the plurality of pixel regions, and removing the first light-emitting layer on the second pixel region and the third pixel region; forming a second light-emitting layer in the plurality of pixel regions, and removing the second light-emitting layer on the first pixel region and the third pixel region; forming a light-transmitting layer on the plurality of pixel regions, and removing the light-transmitting layer on the first pixel region and the second pixel region.

2. The method of claim 1, wherein the display module is prepared by the steps of: Before forming the first light-emitting layer in the plurality of pixel regions, the method further comprises: ​ forming a protective layer on the electroluminescent unit.

3. The method of claim 1 or 2, wherein the display module is prepared by the steps of: The first light-emitting layer on the second pixel region and the third pixel region is removed by an exposure and development method; ​ The second light-emitting layer on the first pixel region and the third pixel region is removed by an exposure and development method; The light-transmitting layer on the first pixel region and the second pixel region is removed by an exposure and development method.

4. The method for preparing a display module according to claim 3, characterized in that, After forming the light-transmitting layer on the plurality of pixel regions, and removing the light-transmitting layer on the first pixel region and the second pixel region, the method further comprises: preparing a first filter layer on the first light-emitting layer of the first pixel region; preparing a second filter layer on the second light-emitting layer of the second pixel region; preparing a third filter layer on the light-transmitting layer of the third pixel region.

5. The method for preparing a display module according to claim 4, characterized in that, The preparing of the first filter layer on the first light-emitting layer of the first pixel region comprises: forming a first filter layer in the plurality of pixel regions, and removing the first filter layer on the second pixel region and the third pixel region.

6. The method for preparing a display module according to claim 4, characterized in that, The preparing of the second filter layer on the second light-emitting layer of the second pixel region comprises: forming a second filter layer in the plurality of pixel regions, and removing the second filter layer on the first pixel region and the third pixel region.

7. The method for preparing a display module according to claim 4, characterized in that, The preparing of the third filter layer on the light-transmitting layer of the third pixel region comprises: forming a third filter layer in the plurality of pixel regions, and removing the third filter layer on the first pixel region and the second pixel region.

8. The method of claim 1 or 2, wherein the display module is prepared by the steps of: The forming of the electroluminescent unit in the plurality of pixel regions comprises: ​ forming a first electrode layer, a first transport layer, an electroluminescent layer, a second transport layer, and a second electrode layer on the substrate in sequence.

9. A display module, characterized by The display module is prepared by the preparation method of the display module according to any one of claims 1 to 8, and the display module comprises: a substrate, an isolation column disposed on the substrate and defining a plurality of pixel regions on the substrate, the pixel regions comprising a first pixel region, a second pixel region, and a third pixel region; the first pixel region comprising an electroluminescent unit and a first light-emitting layer arranged in sequence; the second pixel region comprising an electroluminescent unit and a second light-emitting layer arranged in sequence; The third pixel region comprises an electroluminescent unit and a light-transmitting layer arranged in sequence. The electroluminescent unit is overlapped with the isolation column.

10. The display module of claim 9, wherein, A protective layer is further included, which is arranged between the electroluminescent unit and the first light-emitting layer, between the electroluminescent unit and the second light-emitting layer, and between the electroluminescent unit and the light-transmitting layer.

11. The display module of claim 10, wherein, The thickness of the protective layer is 0.5-4 μm.

12. The display module of claim 11, wherein, The protective layer is formed of acrylic organic resin, silicone resin or epoxy organic resin.

13. The display module of claim 9, wherein, The first light-emitting layer and the second light-emitting layer are quantum dot light-emitting layers.

14. The display module of claim 9, wherein, A first filter layer is arranged on the first light-emitting layer, a second filter layer is arranged on the second light-emitting layer, and a third filter layer is arranged on the light-transmitting layer.

15. The display module of any one of claims 9 to 14, wherein, The electroluminescent unit comprises a first electrode layer, a first transport layer, an electroluminescent layer, a second transport layer, and a second electrode layer, and the second electrode layer is overlapped with the isolation column.

16. The display module of claim 15, wherein, The distance between the first transport layer, the electroluminescent layer, and the second transport layer and the isolation column is 0.05-2 μm.

17. The display module of claim 16, wherein, The projection of the first transport layer, the electroluminescent layer, and the second transport layer on the substrate is within the projection range of the second electrode layer on the substrate.

18. The display module of claim 15, wherein, The electroluminescent layer comprises multiple sub-light-emitting layers and electron injection layers arranged between adjacent sub-light-emitting layers.

19. A display screen, characterized by A cover plate and a display module are included, the cover plate is arranged on the display module, the display module is prepared by the preparation method of the display module according to any one of claims 1-8, or the display module is the display module according to any one of claims 9-18.

20. An electronic device, comprising: A shell and a display screen according to claim 19 are included, and the display screen is mounted on the shell.

Images