Graphene reinforced copper and preparation method thereof
By fusing graphene and copper powder in a mixer, and then combining it with extrusion molding and additive manufacturing, the problem of uniform dispersion of graphene in copper-based composite materials was solved, enabling the preparation of complex structures with high performance and low cost, and improving the overall performance of copper-based materials.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-25
- Publication Date
- 2026-03-13
AI Technical Summary
Existing technologies make it difficult to achieve uniform dispersion of graphene in copper-based composites, resulting in decreased conductivity and plasticity of the composites, and there is a lack of low-cost methods for preparing complex structures.
The graphene was mixed with a binder and then fused with copper powder in a preheated internal mixer. Through extrusion molding and additive manufacturing, combined with debinding and high-temperature sintering, the graphene was uniformly dispersed in a copper matrix and complex structures were prepared.
It improves the strength, electrical conductivity, and thermal conductivity of copper-based composite materials, while reducing costs and increasing manufacturing efficiency, enabling the fabrication of parts with complex shapes.
Smart Images
Figure CN121649415A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of copper-based composite materials technology, and in particular to a graphene-reinforced copper and its preparation method. Background Technology
[0002] Copper and its alloys are widely used in electrical, electronic, and thermal management fields due to their excellent electrical and thermal conductivity. While currently widely used pure copper and traditional copper alloys possess good electrical conductivity, their mechanical strength is relatively low, and their performance deteriorates significantly at high temperatures. The tensile strength of pure copper is typically only 200-250 MPa, which is insufficient to meet the comprehensive performance requirements of modern high-power equipment. Graphene, as a two-dimensional carbon nanomaterial, possesses excellent intrinsic electrical conductivity (approximately 100 MS / m) and extremely high theoretical strength (130 GPa), making it an ideal reinforcing phase for copper-based composites. Current methods for preparing graphene-reinforced copper have shortcomings in terms of uniformity and cost control. Methods such as mechanical mixing and ball milling suffer from poor interfacial compatibility between graphene and copper, leading to graphene agglomeration and difficulty in achieving uniform dispersion in the copper matrix, potentially resulting in decreased conductivity and plasticity of the composite material. Chemical vapor deposition (CVD) offers relatively uniformity, but the process is complex and costly. Furthermore, there is currently a lack of low-cost methods for directly forming complex graphene-reinforced copper structures. Summary of the Invention
[0003] This application provides a graphene-reinforced copper and its preparation method to solve the problems in the background art mentioned above.
[0004] In a first aspect, this application provides a method for preparing graphene-reinforced copper, comprising: After mixing graphene with a binder, it is added to copper powder in a preheated internal mixer. After complete mixing, it is extruded and granulated to obtain graphene-reinforced copper granules. Graphene-reinforced copper granules are added to a screw extrusion additive manufacturing equipment for extrusion additive manufacturing, and graphene-reinforced copper green blanks are obtained by digital model printing. The graphene-reinforced copper green blank was degreased using a degreasing solvent. After degreasing, it was soaked in kerosene, then air-dried naturally, and then placed in a constant temperature drying oven for drying. The degreased graphene-reinforced copper green blank was sintered at high temperature to obtain graphene-reinforced copper.
[0005] Furthermore, the graphene has 1-10 layers, a sheet diameter of 0.5-5 μm, and a purity of ≥99%.
[0006] Furthermore, the binder includes paraffin wax, polypropylene, dioctyl phthalate, and stearic acid.
[0007] Furthermore, the copper powder has an average particle size of 10 μm and a sphericity greater than 95%.
[0008] Furthermore, the volume ratio of the copper powder to the binder is 6:4.
[0009] Furthermore, the cone of the internal mixer is preheated to 180°C.
[0010] Furthermore, the parameters of the extrusion additive manufacturing include: extrusion temperature of 220~250℃, moving speed of 60~100mm / s, line width of 0.4~0.8mm, and filling angle of ±45°.
[0011] Furthermore, the degreasing solvent is n-heptane, the degreasing temperature is 40~60℃, and the time is 12~36h. After degreasing, the sample is soaked in kerosene for 30min, then air-dried for 2h, then placed in a 50℃ constant temperature drying oven for 2h, and finally dried in an 80℃ constant temperature drying oven for 8h.
[0012] Furthermore, the high-temperature sintering temperature is 750~950℃, the heating rate is 5~10℃ / min, the holding time is 2~4h, and the sintering atmosphere is hydrogen.
[0013] Secondly, this application provides a graphene-reinforced copper, which is obtained based on the preparation method of graphene-reinforced copper described above.
[0014] The above-mentioned technical solution of this application has the following advantages: The method for preparing graphene-reinforced copper provided in the first aspect of this application achieves uniform dispersion of graphene by incorporating it into a binder without affecting the original binder system for extruded copper additive manufacturing. Compared to traditional methods such as powder metallurgy and hot pressing sintering, the preparation of complex graphene-reinforced copper structures using extrusion molding offers significant advantages in material utilization, cost, manufacturing efficiency, and the achievable complexity of parts. Through unique process design, uniform dispersion of graphene in copper and its alloy matrix is achieved, effectively improving the comprehensive properties of copper and its alloys, such as strength, electrical conductivity, and thermal conductivity. Simultaneously, extrusion molding additive manufacturing enables the fabrication of various complex shapes and structures.
[0015] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0017] Figure 1 A flowchart illustrating the preparation method of graphene-reinforced copper provided in this application. Detailed Implementation
[0018] To make the technical problems, technical solutions, and beneficial effects of this application clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0019] In this application, "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, "at least one of a, b, or c", or "at least one of a, b, and c", can both mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or multiple.
[0020] It should be understood that in the various embodiments of this application, the order of the above processes does not imply the order of execution. Some or all steps may be executed in parallel or sequentially. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.
[0021] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.
[0022] The weights of the relevant components mentioned in the embodiments of this application can refer not only to the specific content of each component, but also to the proportional relationship between the weights of the components. Therefore, any scaling up or down of the content of the relevant components according to the embodiments of this application is within the scope disclosed in the embodiments of this application. Specifically, the mass described in the embodiments of this application can be a well-known unit of mass in the chemical industry, such as µg, mg, g, or kg.
[0023] The terms "first" and "second" are used for descriptive purposes only, to distinguish objects, such as substances, from one another, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. For example, without departing from the scope of the embodiments of this application, "first XX" may also be referred to as "second XX," and similarly, "second XX" may also be referred to as "first XX." Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature.
[0024] The purpose of this application is to provide a graphene-reinforced copper and its preparation method. Through a unique process design, graphene is uniformly dispersed in copper and its alloy matrix, effectively improving the comprehensive properties of copper and its alloys, such as strength, electrical conductivity and thermal conductivity. At the same time, various complex shape structures can be prepared by using extrusion molding additive manufacturing.
[0025] The specific embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but are not intended to limit the scope of this application.
[0026] like Figure 1 As shown in the embodiments of this application, a method for preparing graphene-reinforced copper is provided, comprising: 1. Prepare copper powder (average particle size 10μm, sphericity greater than 95%) and graphene (1-10 layers, sheet size 0.5-5μm, purity ≥99%). The binder should consist of paraffin wax (filler), polypropylene (skeletal polymer), dioctyl phthalate (plasticizer), and stearic acid (surfactant). Mix the graphene with the binder. The volume ratio of copper to binder is 6:4.
[0027] 2. After preheating the mixer cone to 180°C, copper powder and graphene-infused binder are added to the mixer in sequence. After the two are completely mixed, extrusion and granulation are started to obtain graphene-reinforced copper granules.
[0028] 3. Extrusion additive manufacturing is carried out in a screw extrusion additive manufacturing equipment with an extrusion temperature of 220~250℃, a moving speed of 60~100mm / s, a line width of 0.4~0.8mm, and a filling angle of ±45° to obtain a green body.
[0029] 4. Degrease the obtained green body using n-heptane as the solvent at a temperature of 40-60°C for 12-36 hours. After degreasing, immerse the sample in kerosene for 30 minutes, then air dry for 2 hours, followed by drying in a 50°C oven for 2 hours, and finally drying in an 80°C oven for 8 hours.
[0030] 5. The degreased sample is subjected to high-temperature sintering at a temperature of 750~950℃, a heating rate of 5~10℃ / min, a holding time of 2~4h, and a sintering atmosphere of hydrogen.
[0031] The method for preparing graphene-reinforced copper proposed in this application involves uniformly dispersing graphene in the gaps between copper powders using a liquid-phase method, then obtaining graphene-doped copper particles through intensive mixing, and finally forming a green blank using an extrusion additive manufacturing equipment. After degreasing and sintering, the binder is removed and the structure is densified, thereby obtaining a material and structure that has both strength and thermal conductivity.
[0032] To further understand this application, the following detailed description is provided in conjunction with specific embodiments.
[0033] Example This embodiment is an extrusion molding additive manufacturing method for graphene-reinforced pure copper heat dissipation structures. Specific examples are as follows: (I) Process Forming Implementation Steps 1. Thoroughly mix 10g graphene, 192g paraffin, 112g polypropylene, 7g dioctyl phthalate and 10g stearic acid.
[0034] 2. After preheating the mixer cone to 180°C, copper powder and graphene-infused binder are added to the mixer in sequence. After the two are completely mixed, extrusion and granulation are started to obtain graphene-reinforced copper granules.
[0035] 3. Extrusion additive manufacturing is carried out in a screw extrusion additive manufacturing equipment with an extrusion temperature of 240℃, a moving speed of 80mm / s, a line width of 0.6mm, and a filling angle of ±45°. The radiator blank is obtained by printing according to the digital model.
[0036] 4. Degrease the obtained green body using n-heptane as the solvent at 60℃ for 36 hours. After degreasing, immerse the sample in kerosene for 30 minutes, then air dry for 2 hours, followed by drying in a 50℃ constant temperature drying oven for 2 hours, and finally drying in an 80℃ constant temperature drying oven for 8 hours.
[0037] 5. The degreased sample was sintered at high temperature in a hydrogen atmosphere at a temperature of 950℃, with a heating rate of 5℃ / min and a holding time of 2h to obtain a heat dissipation structure.
[0038] This application also provides a graphene-reinforced copper, which is obtained based on the preparation method of graphene-reinforced copper described above.
[0039] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. This application is not limited to the specific methods described above and shown in the figures. Furthermore, for the sake of brevity, detailed descriptions of known methods and techniques are omitted here.
[0040] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.
Claims
1. A method for preparing graphene-reinforced copper, characterized in that, include: After mixing graphene with a binder, it is added to copper powder in a preheated internal mixer. After complete mixing, it is extruded and granulated to obtain graphene-reinforced copper granules. Graphene-reinforced copper granules are added to a screw extrusion additive manufacturing equipment for extrusion additive manufacturing, and graphene-reinforced copper green blanks are obtained by digital model printing. The graphene-reinforced copper green blank was degreased using a degreasing solvent. After degreasing, it was soaked in kerosene, then air-dried naturally, and then placed in a constant temperature drying oven for drying. The degreased graphene-reinforced copper green blank was sintered at high temperature to obtain graphene-reinforced copper.
2. The method for preparing graphene-reinforced copper as described in claim 1, characterized in that, The graphene has 1-10 layers, a sheet diameter of 0.5-5 μm, and a purity of ≥99%.
3. The method for preparing graphene-reinforced copper as described in claim 1, characterized in that, The binder includes paraffin wax, polypropylene, dioctyl phthalate, and stearic acid.
4. The method for preparing graphene-reinforced copper as described in claim 1, characterized in that, The copper powder has an average particle size of 10 μm and a sphericity greater than 95%.
5. The method for preparing graphene-reinforced copper as described in claim 1, characterized in that, The volume ratio of the copper powder to the binder is 6:
4.
6. The method for preparing graphene-reinforced copper as described in claim 1, characterized in that, The cone of the internal mixer is preheated to 180°C.
7. The method for preparing graphene-reinforced copper as described in claim 1, characterized in that, The parameters for the extrusion additive manufacturing include: extrusion temperature of 220~250℃, moving speed of 60~100mm / s, line width of 0.4~0.8mm, and filling angle of ±45°.
8. The method for preparing graphene-reinforced copper as described in claim 1, characterized in that, The degreasing solvent is n-heptane, the degreasing temperature is 40~60℃, and the time is 12~36h. After degreasing, the sample is soaked in kerosene for 30min, then air-dried for 2h, then placed in a 50℃ constant temperature drying oven for 2h, and finally dried in an 80℃ constant temperature drying oven for 8h.
9. The method for preparing graphene-reinforced copper as described in claim 1, characterized in that, The high-temperature sintering temperature is 750~950℃, the heating rate is 5~10℃ / min, the holding time is 2~4h, and the sintering atmosphere is hydrogen.
10. A graphene-reinforced copper, characterized in that, It is obtained based on the preparation method of graphene-reinforced copper as described in any one of claims 1 to 9.